WO2022213484A1 - Base having coil, and periscopic voice coil motor and manufacturing method therefor - Google Patents

Base having coil, and periscopic voice coil motor and manufacturing method therefor Download PDF

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Publication number
WO2022213484A1
WO2022213484A1 PCT/CN2021/102309 CN2021102309W WO2022213484A1 WO 2022213484 A1 WO2022213484 A1 WO 2022213484A1 CN 2021102309 W CN2021102309 W CN 2021102309W WO 2022213484 A1 WO2022213484 A1 WO 2022213484A1
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Prior art keywords
base
insulating base
coil
column
insulating
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PCT/CN2021/102309
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French (fr)
Chinese (zh)
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诸渊臻
胡炜
耿叶贝子
莫凑全
甘子明
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苏州昀冢电子科技股份有限公司
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Priority to KR1020237038127A priority Critical patent/KR20240001160A/en
Publication of WO2022213484A1 publication Critical patent/WO2022213484A1/en

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/46Fastening of windings on the stator or rotor structure
    • H02K3/47Air-gap windings, i.e. iron-free windings
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K15/00Methods or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/02Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices involving prisms or mirrors
    • G02B23/08Periscopes
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/04Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
    • H02K3/28Layout of windings or of connections between windings
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K33/00Motors with reciprocating, oscillating or vibrating magnet, armature or coil system
    • H02K33/18Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K41/00Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
    • H02K41/02Linear motors; Sectional motors
    • H02K41/035DC motors; Unipolar motors
    • H02K41/0352Unipolar motors
    • H02K41/0354Lorentz force motors, e.g. voice coil motors
    • H02K41/0356Lorentz force motors, e.g. voice coil motors moving along a straight path
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K2203/00Specific aspects not provided for in the other groups of this subclass relating to the windings
    • H02K2203/03Machines characterised by the wiring boards, i.e. printed circuit boards or similar structures for connecting the winding terminations
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K2203/00Specific aspects not provided for in the other groups of this subclass relating to the windings
    • H02K2203/06Machines characterised by the wiring leads, i.e. conducting wires for connecting the winding terminations

Abstract

The present invention provides a base having a coil, the base comprising: a rectangular insulating base; a metal circuit, which is embedded and formed in the insulating base; a coil, which is electrically connected to the metal circuit; and an electronic element, wherein the metal circuit is coated and formed on the insulating base by means of primary injection molding; the insulating base is horizontally arranged, and is provided with a peripheral side face which is arranged on a periphery, and an upper surface; the coil is arranged on the upper surface; the base comprises an insulating frame which coats the insulating base and the metal circuit by means of secondary injection molding; and the insulating frame is provided with a frame body portion which is integrally sealed and coated on the peripheral side face of the insulating base and is horizontally arranged, and vertical portions which vertically extend from the periphery of an upper surface of the frame body portion. The technical problem of horizontally mounting the coil and the electronic element on the basis of the metal circuit having perpendicular parts on the periphery of the base is solved, and the degree of freedom in the design of a periscopic voice coil motor is thus improved.

Description

一种具有线圈的基座、潜望式音圈马达及其制造方法A base with a coil, a periscope voice coil motor and a manufacturing method thereof
本申请要求了申请日为2021年04月07日,申请号为202110372672.5的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application with an application date of April 7, 2021 and an application number of 202110372672.5, the entire contents of which are incorporated into this application by reference.
技术领域technical field
本发明涉及一种具有线圈的基座、潜望式音圈马达及其制造方法的技术领域,尤其是涉及一种电子设备领域用基座、潜望式音圈马达及其制造方法。The invention relates to the technical field of a base with a coil, a periscope voice coil motor and a manufacturing method thereof, and in particular to a base for use in the field of electronic equipment, a periscope voice coil motor and a manufacturing method thereof.
背景技术Background technique
现有的具有线圈的基座及音圈马达,通常包括基座、注塑于基座内的金属线路、与金属线路焊接的电子元器件、绕线形成的或者贴装组装的线圈及与线圈相互作动的磁性结构等驱动组件。一般音圈马达的组装厂商需要将以上基础零部件进行电性装配,为了匹配各种零组件的布局和安装的需求,通常各零部件的布局难度较大,且需要预留一些额外的装配空间给转接零部件,例如需要集成IC或者线圈的柔性电路板(FPC,Flexible Printed circuit),则需要预留至少一部分安装空间,且需要设计集成IC或者线圈与FPC的组配空间。现有的具有线圈的基座及潜望式音圈马达,通常采用FPC表面组装工艺,达到线路连通作用。但由于组装工艺对部件本身形位公差的精度、重复定位精度等高要求限制,目前该组装整体不良率高,量产性不好。Existing bases and voice coil motors with coils usually include a base, a metal circuit injected into the base, an electronic component welded to the metal circuit, a coil formed by winding or mounted and assembled, and a coil connected to the coil. Actuated magnetic structures and other drive components. Generally, assemblers of voice coil motors need to electrically assemble the above basic components. In order to match the layout and installation requirements of various components, the layout of each component is usually difficult, and some additional assembly space needs to be reserved. For switching components, such as flexible printed circuit boards (FPC, Flexible Printed circuit) that need to integrate ICs or coils, at least part of the installation space needs to be reserved, and the assembly space for integrated ICs or coils and FPCs needs to be designed. Existing bases with coils and periscope voice coil motors usually use the FPC surface assembly process to achieve line connection. However, due to the high requirements of the assembly process on the accuracy of the shape and position tolerance of the component itself, the repeatability of positioning accuracy, etc., the overall defect rate of the assembly is currently high, and the mass production is not good.
具体例如,一种音圈马达,通常采用柔性电路板(FPC,Flexible Printed circuit)表面组装工艺,以将线圈设置于柔性电路板并与基座中的金属电路焊接以达到线路连通作用。如公告号为CN209134273U的实用新型专利,揭示了一种应用于音圈马达中的连接结构,包括注塑件和柔性电路板(FPC)。所述注塑件具有若干依次环绕连接形成所述中空腔体的侧壁,其中一个所述侧壁上开设有贯通于所述中空腔体的定位腔,所述柔性电路板FPC与具有所述定位腔的所述侧壁贴合,所述FPC贴装或者绕线集成有IC及线圈,以达到电路导通的作用。For example, for a voice coil motor, a flexible printed circuit (FPC, Flexible Printed circuit) surface assembly process is usually used, so that the coil is arranged on the flexible circuit board and welded with the metal circuit in the base to achieve circuit connection. For example, the utility model patent with the publication number CN209134273U discloses a connection structure applied in a voice coil motor, including an injection molded part and a flexible circuit board (FPC). The injection molded part has a plurality of side walls that are connected in sequence to form the hollow cavity. One of the side walls is provided with a positioning cavity that penetrates through the hollow cavity. The side walls of the cavity are attached, and the FPC is mounted or wound with integrated ICs and coils, so as to achieve the effect of circuit conduction.
又如公开号为CN108989511A的发明专利申请,一种具有电子元件的基座及音圈马达,所述电子元件是集成在塑胶的垂直面上,后续贴装的线圈亦是贴装在塑胶的垂直面上,后续需要经过SMT(Surface Mount Technology)贴装,又由于SMT贴装要求被贴装的面的一侧是开放式的,线圈绕线或者贴装难度比较大,对于线圈的位置设计要求非常高。故在垂直面上进行集成电子元件(IC,Integrated Circuit)或者线圈,很难自动化,需要进行繁琐的人工操作,效率低下,品质安定性差。而当IC或者线圈在位于水平面的底座上进行集成,也只能一个一个来做组装,组装的自动化效率非常低。并且现在市面上的SMT贴装设备全部都是单独处理底座的,没有批量性处理的。当在潜望式音圈马达中,进行水平面的线圈或电子元件的安装,在具有绝缘底座周侧设置的四个支柱的前提下,很难在四个支柱内部的空间进行组装线圈或电子元件,且自动化也很难实现。Another example is the invention patent application with publication number CN108989511A, a base with electronic components and a voice coil motor. On the surface, it needs to be mounted by SMT (Surface Mount Technology) in the future, and because the side of the surface to be mounted is open, the coil winding or mounting is difficult, and the position design requirements for the coil are very high. Therefore, it is difficult to automate the integrated electronic components (IC, Integrated Circuit) or coils on the vertical plane, requiring tedious manual operations, low efficiency, and poor quality stability. And when ICs or coils are integrated on a horizontal base, they can only be assembled one by one, and the automation efficiency of assembly is very low. And now the SMT placement equipment on the market all deal with the base separately, and there is no batch processing. When installing coils or electronic components on a horizontal plane in a periscope voice coil motor, it is difficult to assemble the coils or electronic components in the space inside the four columns on the premise that there are four columns provided on the peripheral side of the insulating base. , and automation is difficult to achieve.
以上问题集中发生于现有的音圈马达厂商生产音圈马达时,需要外购零部件,再对诸如柔性电路板/弹片等元器件进行定位组装,定位、加工及装配工序复杂,操作空间有限,容易造成零部件的不良,进而引起整体成本过高。同时,由于这些外购的零部件再生产时,并未考虑到其组合的情况,忽略组合空间设计的问题,那么在设计音圈马达的时候需要预留一些 安装位,造成了空间浪费,使得产品的结构无法紧凑及小型化。又由于原有的线圈一般需要通过集成在独立的FPC上进行与基座内的金属电路的集成,FPC本身厚度很薄,而且很脆弱,成本很高,要在FPC上面去绕线线圈或者贴装线圈,难度很大,容易引起不良,且可以绕线的圈数和线圈的厚度会受到FPC的厚度的影向,进而影向线圈通电电流的大小,增加了电路的损耗。此外,将线圈缠绕或贴装在独立的FPC上,由于FPC很柔软,在电子设备坠落时,具有固定于FPC的线圈的音圈马达很容易因为本身集成强度较弱,造成整体失效。The above problems mainly occur when the existing voice coil motor manufacturers produce voice coil motors, they need to purchase parts and then position and assemble components such as flexible circuit boards/shrapnel. The positioning, processing and assembly procedures are complicated and the operating space is limited. , it is easy to cause defective parts, and then cause the overall cost to be too high. At the same time, since these purchased parts are reproduced without considering their combination and ignoring the problem of combination space design, it is necessary to reserve some installation positions when designing the voice coil motor, resulting in a waste of space and making the product The structure cannot be compact and miniaturized. And because the original coil generally needs to be integrated with the metal circuit in the base by being integrated on an independent FPC, the FPC itself is very thin and fragile, and the cost is very high. It is very difficult to install the coil, which is easy to cause defects, and the number of coils that can be wound and the thickness of the coil will be affected by the thickness of the FPC, which in turn affects the size of the coil energized current, increasing the loss of the circuit. In addition, the coil is wound or mounted on an independent FPC. Since the FPC is very soft, when the electronic device falls, the voice coil motor with the coil fixed on the FPC is easy to cause overall failure due to its weak integration strength.
因此,确有必要提供一种新的具有线圈的基座及音圈马达及其制造方法,以克服上述缺陷。Therefore, it is necessary to provide a new base with a coil, a voice coil motor and a manufacturing method thereof to overcome the above-mentioned defects.
发明内容SUMMARY OF THE INVENTION
本发明的目的在于提供一种具有线圈的基座、潜望式音圈马达及其制造方法。An object of the present invention is to provide a base having a coil, a periscope voice coil motor, and a manufacturing method thereof.
本发明的目的通过以下技术方案一来实现:一种具有线圈的基座,包括:矩形设置的绝缘底座、镶埋成型于所述绝缘底座的金属电路、电性连接于所述金属电路的线圈及电子元件,所述绝缘底座通过一次注塑成型的方式包覆成型于所述金属电路,所述绝缘底座呈水平设置并具有设置于外周的外周侧面及上表面,所述线圈设置于所述绝缘底座的所述上表面,所述电子元件通过表面安装技术贴装于所述绝缘底座的所述上表面,所述基座包括通过二次注塑成型的方式包覆所述绝缘底座及所述金属电路的绝缘框,所述绝缘框设有整体封闭包覆在所述绝缘底座的所述外周侧面的且水平设置的框体部及自所述框体部上表面的四周竖直延伸的竖直部。The object of the present invention is achieved through the following technical solution: a base with a coil, comprising: a rectangular insulating base, a metal circuit embedded in the insulating base, and a coil electrically connected to the metal circuit and electronic components, the insulating base is overmolded on the metal circuit by one injection molding, the insulating base is arranged horizontally and has an outer peripheral side and an upper surface arranged on the outer periphery, and the coil is arranged on the insulating The upper surface of the base, the electronic components are mounted on the upper surface of the insulating base by surface mounting technology, and the base includes the insulating base and the metal covered by the secondary injection molding An insulating frame of a circuit, the insulating frame is provided with a frame body part that is integrally enclosed and covered on the outer peripheral side of the insulating base and is arranged horizontally, and a vertical frame body extending vertically from the periphery of the upper surface of the frame body part. department.
进一步,所述金属电路包括镶埋成型于所述绝缘底座的水平部分、镶埋成型于所述竖直部的垂直部分及连接于所述水平部分与所述垂直部分之间的折弯部,所述折弯部位于所述绝缘底座外且镶埋成型于所述框体部内。Further, the metal circuit includes a horizontal part embedded in the insulating base, a vertical part embedded in the vertical part, and a bending part connected between the horizontal part and the vertical part, The bending portion is located outside the insulating base and is embedded in the frame portion.
进一步,所述金属电路包括若干支路,若干所述支路包括至少两个立柱支路,每个所述立柱支路包括所述水平部分和所述垂直部分,两个所述立柱支路的所述垂直部分分布于所述绝缘底座的所述外周侧面的外周,所述电子元件和所述线圈设置于至少两个所述立柱支路的所述垂直部分之间。Further, the metal circuit includes a plurality of branches, the plurality of the branches include at least two column branches, each of the column branches includes the horizontal part and the vertical part, and the two column branches The vertical parts are distributed on the outer circumference of the outer peripheral side surface of the insulating base, and the electronic component and the coil are arranged between the vertical parts of at least two of the upright branches.
进一步,所述金属电路的若干所述支路包括镶埋成型于所述绝缘底座的水平支路及位于所述水平支路周侧的所述立柱支路,所述立柱支路的一端设有暴露于所述竖直部的顶表面的立柱引脚,所述立柱支路的另一端排布形成焊接至所述电子元件的立柱焊脚,所述立柱支路的所述立柱引脚与所述立柱焊脚之间形成有位于所述水平支路周侧的构成所述垂直部分的竖直立柱部的立柱连接部,所述竖直立柱部位于所述绝缘底座外且镶埋成型于所述竖直部。Further, a plurality of the branches of the metal circuit include a horizontal branch embedded in the insulating base and the column branch located on the peripheral side of the horizontal branch, and one end of the column branch is provided with A column pin exposed on the top surface of the vertical portion, the other end of the column branch is arranged to form a column solder foot welded to the electronic component, and the column pin of the column branch is connected to the A column connecting part is formed between the column welding legs and is located on the peripheral side of the horizontal branch and constitutes a vertical column part of the vertical part, and the vertical column part is located outside the insulating base and is embedded in the the vertical part.
进一步,若干所述水平支路的一端设有间隔排布形成的引脚,若干所述水平支路另一端设有平行排布形成的焊脚,所述引脚与所述焊脚之间形成连接部;所述焊脚及所述立柱焊脚暴露在所述绝缘底座的上表面,所述引脚暴露在所述框体部的所述上表面,所述立柱引脚暴露在所述竖直部的所述顶表面。Further, one end of several of the horizontal branches is provided with pins arranged at intervals, and the other ends of several of the horizontal branches are provided with solder pins arranged in parallel, and the pins and the solder pins are formed between the pins. a connecting part; the solder pins and the upright solder pins are exposed on the upper surface of the insulating base, the pins are exposed on the upper surface of the frame part, and the upright pins are exposed on the vertical the top surface of the straight portion.
进一步,所述绝缘框于所述绝缘底座的一侧设有一打薄部,所述引脚镶埋成型于所述绝缘框的所述打薄部内且暴露于所述打薄部的表面。Further, the insulating frame is provided with a thinned portion on one side of the insulating base, and the pins are embedded in the thinned portion of the insulating frame and exposed on the surface of the thinned portion.
进一步,所述支路设有暴露在所述绝缘底座的所述上表面并间隔设置的焊接位,所述线圈设置两个焊接引脚,两个所述焊接引脚分别对应焊接于所述焊接位。Further, the branch circuit is provided with welding positions exposed on the upper surface of the insulating base and arranged at intervals, the coil is provided with two welding pins, and the two welding pins are respectively welded to the welding positions. bit.
进一步,所述基座设置至少两个线圈,每一所述线圈对应所述支路中的所述焊接位焊接,每个所述支路与每个所述线圈焊接的一端侧被注塑成型于所述绝缘底座内。Further, the base is provided with at least two coils, each of the coils is welded corresponding to the welding position in the branch circuit, and one end side of each of the branch circuit and each of the coils is injection-molded on the inside the insulating base.
进一步,对应同一所述线圈的两个所述焊接引脚进行焊接的所述焊接位间隔形成在同一所述支路中的不同位置,所述绝缘底座设有焊接槽以暴露对应的所述焊接位。Further, the welding positions corresponding to the welding of the two welding pins of the same coil are formed at different positions in the same branch, and the insulating base is provided with welding grooves to expose the corresponding welding bit.
进一步,至少两个所述线圈分别位于所述绝缘底座的两相邻侧边内侧,且两个所述线圈的长边方向相互垂直。Further, at least two of the coils are respectively located inside two adjacent sides of the insulating base, and the longitudinal directions of the two coils are perpendicular to each other.
进一步,所述金属电路为在一第一方向上排列的双层金属电路,分别为上层金属电路及下层金属电路,所述立柱支路至少为所述上层金属电路及所述下层金属电路二者之一。Further, the metal circuits are double-layer metal circuits arranged in a first direction, which are an upper-layer metal circuit and a lower-layer metal circuit, respectively, and the column branches are at least both the upper-layer metal circuit and the lower-layer metal circuit one.
进一步,所述线圈通过绕线方式固定于所述绝缘底座,所述绝缘底座设置有一对间隔设置的绕线柱,所述线圈绕线固定于所述绕线柱。Further, the coil is fixed to the insulating base by means of wire winding, the insulating base is provided with a pair of winding posts arranged at intervals, and the coil wire is fixed to the winding posts.
进一步,所述绝缘底座设置有一对定位柱,所述线圈具有一对引线端,所述引线端固定于所述定位柱,所述焊接槽位于所述绕线柱和所述定位柱之间。Further, the insulating base is provided with a pair of positioning posts, the coil has a pair of lead ends, the lead ends are fixed on the positioning posts, and the welding slot is located between the winding posts and the positioning posts.
进一步,所述电子元件位于所述线圈绕设的区域内或位于所述线圈绕设的区域外。Further, the electronic component is located in the area where the coil is wound or is located outside the area where the coil is wound.
本发明的目的通过以下技术方案二来实现:一种潜望式音圈马达,包括上述的具有线圈的基座。The object of the present invention is achieved by the following technical solution 2: a periscope voice coil motor, comprising the above-mentioned base with a coil.
本发明的目的通过以下技术方案三来实现:一种制造上述的具有线圈的基座的制造方法,包括如下步骤:The object of the present invention is achieved through the following technical solution three: a manufacturing method for manufacturing the above-mentioned base with a coil, comprising the following steps:
第一步,在料带上冲压成型若干依次相连的金属电路;The first step is to stamp and form several metal circuits connected in sequence on the material strip;
第二步,在所述金属电路上进行一次注塑成型以形成矩形设置的绝缘底座,所述绝缘底座呈水平设置并具有设置于外周的外周侧面及上表面;In the second step, an injection molding is performed on the metal circuit to form a rectangular insulating base, the insulating base is arranged horizontally and has an outer peripheral side surface and an upper surface arranged on the outer periphery;
第三步,在所述绝缘底座的所述上表面电性连接一水平设置的线圈,通过表面安装技术将电子元件贴装于所述绝缘底座的所述上表面;The third step is to electrically connect a horizontally arranged coil on the upper surface of the insulating base, and mount electronic components on the upper surface of the insulating base through surface mounting technology;
第四步,在所述金属电路及所述绝缘底座的外围进行二次注塑成型以形成绝缘框,所述金属电路同时镶埋成型于所述绝缘底座及所述绝缘框,所述绝缘框设有整体封闭包覆在所述绝缘底座的所述外周侧面的且水平设置的框体部及自所述框体部的上表面的四周竖直延伸的竖直部;In the fourth step, secondary injection molding is performed on the periphery of the metal circuit and the insulating base to form an insulating frame, the metal circuit is embedded in the insulating base and the insulating frame at the same time, and the insulating frame is There is a frame body part that is integrally enclosed and covered on the outer peripheral side of the insulating base and is arranged horizontally, and a vertical part that extends vertically from the periphery of the upper surface of the frame body part;
第五步,对连接若干所述金属电路的料带进行裁切,进而形成若干独立完整的基座。The fifth step is to cut the material strips connecting a plurality of the metal circuits to form a plurality of independent and complete bases.
进一步,在第一步中,所述金属电路包括位于同一平面的水平部分及位于所述水平部分外周侧的垂直部分;在第二步中,所述绝缘底座注塑成型于所述水平部分,所述垂直部分位于所述绝缘底座外;在所述第三步与第四步之间增加一第六步,折弯位于所述绝缘底座外的所述金属电路的所述水平部分和所述垂直部分的连接处以形成一折弯部,所述折弯部被注塑成型于所述框体部内。Further, in the first step, the metal circuit includes a horizontal part located on the same plane and a vertical part located on the outer peripheral side of the horizontal part; in the second step, the insulating base is injection-molded on the horizontal part, so The vertical part is located outside the insulating base; a sixth step is added between the third step and the fourth step, and the horizontal part and the vertical part of the metal circuit located outside the insulating base are bent A part of the connection is formed to form a bending part, and the bending part is injection-molded in the frame part.
进一步,在第一步中,所述金属电路包括若干水平支路和位于所述水平支路外周的立柱支路,若干所述水平支路的一端平行且间隔排布以形成引脚,所述水平支路的另一端的末端排布形成焊脚,所述引脚与所述焊脚之间形成连接部,所述立柱支路的一端间隔排布形成呈矩形设置的立柱引脚,所述立柱支路的另一端排布形成与所述焊脚位于同一平面的立柱焊脚; 在所述第六步中,所述焊脚及所述立柱焊脚暴露在所述绝缘底座的上表面,所述引脚暴露在所述框体部的所述上表面,所述立柱引脚暴露在所述竖直部的顶表面。Further, in the first step, the metal circuit includes several horizontal branches and a column branch located on the outer periphery of the horizontal branch, one end of the several horizontal branches is arranged in parallel and at intervals to form pins, the The end of the other end of the horizontal branch is arranged to form a welding leg, a connection portion is formed between the lead and the welding leg, and one end of the column branch is arranged at intervals to form a rectangular column lead. The other end of the column branch is arranged to form a column welding leg located on the same plane as the welding leg; in the sixth step, the welding leg and the column welding leg are exposed on the upper surface of the insulating base, The pins are exposed on the upper surface of the frame portion, and the upright pins are exposed on the top surface of the vertical portion.
进一步,在第三步中,所述绝缘底座的上表面对应所述焊脚的位置处设置向下凹设的焊接凹槽,所述焊脚设置在所述焊接凹槽内。Further, in the third step, a downwardly concave welding groove is provided on the upper surface of the insulating base at a position corresponding to the welding leg, and the welding leg is disposed in the welding groove.
进一步,在第二步成型所述绝缘底座的过程中,所述绝缘底座上还形成有一对绕线柱和一对定位柱,在所述第三步中,所述线圈绕线于所述绕线柱并通过所述定位柱固定所述线圈具有的一对引线端。Further, in the process of forming the insulating base in the second step, a pair of winding posts and a pair of positioning posts are also formed on the insulating base. In the third step, the coil is wound around the winding. A pair of lead ends of the coil is fixed through the positioning post.
本发明的目的通过以下技术方案四来实现:一种潜望式音圈马达的制造方法,包括上述的制造具有线圈的基座的制造方法的步骤。The object of the present invention is achieved by the following technical solution 4: a manufacturing method of a periscope voice coil motor, comprising the steps of the above-mentioned manufacturing method of a base having a coil.
本发明中的具有线圈的基座,通过两次注塑成型有绝缘底座和位于所述绝缘底座周侧的绝缘框,并在绝缘框的四周成型有垂直于所述绝缘底座的竖直部,金属电路包括注塑成型于所述绝缘底座的水平部分和注塑成型于所述绝缘框的垂直部分,同时在一次注塑成型所述绝缘底座时定位线圈和电子元件,后再将本来位于水平面的垂直部分弯折成型为与水平部分垂直,无需在既定的设置在基座周侧的金属电路的垂直部分的基础上对线圈及电子产品进行有限地水平贴装,亦无需再进行柔性电路板的贴装,提高了潜望式音圈马达的设计的自由度,使得组装成本降低,良品率提高。且由于线圈及电子元件均集成在绝缘底座上,使得产品的结构更加紧凑小型化。在电子设备掉落时,也不会因为线圈附着的绕线柱太柔软进而造成失效的后果。并且由于基座是在同一平面进行注塑绝缘底座,且在线圈及电子元件贴装后再进行折弯,则位于同一料带上可以制造多个基座,可以实现批量性生产,实现自动化。In the base with coils in the present invention, an insulating base and an insulating frame located on the peripheral side of the insulating base are formed by injection molding twice, and a vertical portion perpendicular to the insulating base is formed around the insulating frame. The circuit includes a horizontal part that is injection-molded on the insulating base and a vertical part that is injection-molded on the insulating frame. At the same time, the coils and electronic components are positioned when the insulating base is injection-molded at one time, and then the vertical part that is originally located on the horizontal plane is bent. Folded to be perpendicular to the horizontal part, there is no need to carry out limited horizontal mounting of coils and electronic products on the basis of the predetermined vertical part of the metal circuit arranged on the peripheral side of the base, and there is no need to mount the flexible circuit board. The design freedom of the periscope voice coil motor is improved, the assembly cost is reduced, and the yield rate is improved. And because the coil and electronic components are integrated on the insulating base, the structure of the product is more compact and miniaturized. When the electronic device is dropped, it will not fail because the winding post attached to the coil is too soft. And since the base is an injection-molded insulating base on the same plane, and the coils and electronic components are mounted and then bent, multiple bases can be manufactured on the same tape, which can realize mass production and automation.
附图说明Description of drawings
图1为本发明的潜望式音圈马达的立体示意图。FIG. 1 is a schematic perspective view of a periscope voice coil motor of the present invention.
图2为本发明的基座带有贴片式柔性电路线圈的立体示意图。FIG. 2 is a three-dimensional schematic diagram of a base with a patch-type flexible circuit coil of the present invention.
图3为本发明的基座带有绕线式线圈的立体示意图。FIG. 3 is a perspective view of a base with a wound coil according to the present invention.
图4为图3所示的基座的立体分解图。FIG. 4 is an exploded perspective view of the base shown in FIG. 3 .
图5为在图4的进一步的立体分解图。FIG. 5 is a further exploded perspective view of FIG. 4 .
图6为图5中的线圈及绝缘底座的部分放大图。FIG. 6 is a partial enlarged view of the coil and the insulating base in FIG. 5 .
图7为基座中的金属电路未折弯之前的立体示意图。FIG. 7 is a three-dimensional schematic diagram of the metal circuit in the base before being bent.
图8为在图7中的金属电路一次注塑成型绝缘底座的立体示意图。FIG. 8 is a three-dimensional schematic view of the metal circuit in FIG. 7 by one-shot injection molding of the insulating base.
图9为金属电路的上层金属电路和下层金属电路的立体示意图。FIG. 9 is a three-dimensional schematic diagram of an upper-layer metal circuit and a lower-layer metal circuit of the metal circuit.
主要元件符号说明Description of main component symbols
请参考如下附图标号说明,潜望式音圈马达1000,感光组件1001,光学镜头1002,反射元件1003,基座100,金属电路1,引脚1a,焊脚1b,连接部1c,上层金属电路1d,下层金属电路1e,弯折部1f,焊接位1g,水平支路10,第一支路11,第一引脚11a,第一焊脚11b,第一连接部11c,第一弯折部11f,第二支路12,第二引脚12a,第二焊脚12b,第二连接部12c,第三支路13,第三引脚13a,第三焊脚13b,第三连接部13c,第四支路14,第四引脚14a,第四焊脚14b,第四连接部14c,第五支路15,第五引脚15a,第五焊脚15b,第五连接部15c,第五弯折部15f,第六支路16,第六引脚16a,第六焊脚16b,第六连接部16c,第七支路17,第七引脚17a,第七焊脚17b,第七连接部17c,第八支路18,第八引脚18a,第八焊脚18b,第八连接部18c,第八弯折部18f,立柱支路19,立柱引脚19a,立柱焊脚19b,立柱连接部19c,竖直立柱部19d,第一立柱支路191,第一立柱引脚 191a,第一立柱焊脚191b,第一立柱连接部191c,第一竖直立柱部191d,第二立柱支路192,第二立柱引脚192a,第二立柱连接部192c,第二竖直立柱部192d,第三立柱支路193,第三立柱引脚193a,第三立柱焊脚193b,第三立柱连接部193c,第三竖直立柱部193d,折弯部194,绝缘底座2,上表面20,第一侧边21,第二侧边22,第三侧边23,第四侧边24,焊接凹槽25,绕线柱26,定位柱27,焊接槽28,外周侧面29,绝缘框3,框体部30,竖直部31,第一竖直部311,第二竖直部312,第三竖直部313,第四竖直部314,顶表面32,打薄部33,线圈4,柔性电路线圈4’,焊接引脚41,引线端42,电子元件5,第一平面P1。Please refer to the following reference numerals, periscope voice coil motor 1000, photosensitive component 1001, optical lens 1002, reflective element 1003, base 100, metal circuit 1, pin 1a, solder pin 1b, connection portion 1c, upper metal Circuit 1d, lower metal circuit 1e, bent portion 1f, soldering position 1g, horizontal branch 10, first branch 11, first lead 11a, first solder pin 11b, first connection portion 11c, first bend part 11f, second branch 12, second lead 12a, second solder leg 12b, second connection part 12c, third branch 13, third lead 13a, third solder leg 13b, third connection part 13c , the fourth branch 14, the fourth pin 14a, the fourth solder pin 14b, the fourth connection part 14c, the fifth branch 15, the fifth pin 15a, the fifth solder pin 15b, the fifth connection part 15c, the first The fifth bent portion 15f, the sixth branch 16, the sixth lead 16a, the sixth welding leg 16b, the sixth connecting portion 16c, the seventh branch 17, the seventh lead 17a, the seventh welding leg 17b, the seventh The connecting part 17c, the eighth branch 18, the eighth pin 18a, the eighth welding leg 18b, the eighth connecting part 18c, the eighth bending part 18f, the column branch 19, the column pin 19a, the column welding leg 19b, Column connecting portion 19c, vertical column portion 19d, first column branch 191, first column pin 191a, first column solder leg 191b, first column connecting portion 191c, first vertical column portion 191d, second column Branch 192, second column pin 192a, second column connecting portion 192c, second vertical column portion 192d, third column branch 193, third column pin 193a, third column welding leg 193b, third column Connection part 193c, third vertical column part 193d, bending part 194, insulating base 2, upper surface 20, first side 21, second side 22, third side 23, fourth side 24, welding Groove 25, winding post 26, positioning post 27, welding slot 28, outer peripheral side 29, insulating frame 3, frame body 30, vertical part 31, first vertical part 311, second vertical part 312, Three vertical parts 313 , fourth vertical part 314 , top surface 32 , thinned part 33 , coil 4 , flexible circuit coil 4 ′, soldering pin 41 , lead terminal 42 , electronic component 5 , first plane P1 .
如下具体实施例将结合上述附图进一步说明本发明。The following specific embodiments will further illustrate the present invention in conjunction with the above drawings.
具体实施方式Detailed ways
在本发明的描述中,需要说明的是,术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或组件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the orientations or positional relationships shown in the accompanying drawings, only for the purpose of It is for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“连接”应做广义理解,对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be understood in a broad sense. For those of ordinary skill in the art, the above-mentioned term can be understood in the present invention under specific circumstances. specific meaning.
现有技术中的潜望式音圈马达,需要与线圈做后续的集成,一般需要额外设置贴装或者集成有线圈的柔性电路板(FPC),然后将柔性电路板再次相对基座定位以组装整体的音圈马达。本发明的集成有线圈的基座无需额外设置起到转接和定位作用的柔性电路板,而采用在注塑基座成型时同时绕线集成,节省后续组装厂商的组装和零组件设置空间。而且,现有技 术中,若需要后续于成型后的基座的上表面进行线圈绕线或者贴装,受限于基座内部有限的绕线空间或者操作空间,不利于基座与线圈的组装集成。具体地,集成线圈和电子元件在基座的水平面内,则需要在基座的四周具有竖直部的前提下,在竖直部内的绝缘底座内对线圈或电子元件进行绕线或者贴装,操作空间有限,且定位集成难度非常大,且加工集成仅限于单片基座和单个线圈或者电子元件,集成效率较低,不利于自动化批量生产的成本的降低和效率的提高。The periscope voice coil motor in the prior art requires subsequent integration with the coil. Generally, an additional flexible circuit board (FPC) that is mounted or integrated with the coil is required, and then the flexible circuit board is positioned relative to the base again for assembly. Integral voice coil motor. The coil-integrated base of the present invention does not need to additionally provide a flexible circuit board for switching and positioning, and adopts the simultaneous winding integration when the injection base is formed, which saves the assembly and component installation space of subsequent assemblers. Moreover, in the prior art, if it is necessary to subsequently perform coil winding or mounting on the upper surface of the formed base, it is limited by the limited winding space or operation space inside the base, which is not conducive to the assembly of the base and the coil. integrated. Specifically, if the integrated coil and electronic components are in the horizontal plane of the base, the coils or electronic components need to be wound or mounted in the insulating base in the vertical part under the premise that there are vertical parts around the base, The operation space is limited, the positioning integration is very difficult, and the processing integration is limited to a single base and a single coil or electronic component, and the integration efficiency is low, which is not conducive to the cost reduction and efficiency improvement of automated mass production.
本发明中通过先在与金属电路1所在的水平面一次注塑成型形成有绝缘底座2,再将电子元件5和线圈4电性组装或者贴装于所述绝缘底座2,再将绝缘底座2外的金属电路1的垂直部分(竖直立柱部19d)进行折弯,并在绝缘底座2的外周侧面29进行二次注塑成型以形成绝缘框3,并使得垂直部分(竖直立柱部19d)镶埋成型于所述绝缘框3内。本发明中的电子元件5与线圈4于成型绝缘框3的垂直部分之前,就完成了电子元件5、线圈4与金属电路1的电性焊接,无需采用柔性电路板(FPC)与线圈在完成注塑成型后的与基座的再次组装,使得组装成本降低,良品率提高;同时解决了绕制的空心线圈4及电子元件5在竖直部31存在的前提下贴装难度较高的技术难题(电性贴装仅适用于贴装表面垂直对应的空间为垂直开放的,才利于贴装,但若存在两个贴装面于垂直方向上间隔平行的时候,则不利于采用贴装方式电性组装,则被迫只能采用人工方式),有助于提高潜望式音圈马达1000的内部空间设计的自由度,潜望式音圈马达产品的内部结构也更加紧凑且小型化。以下,将结合图1至图9介绍本发明的基座100及具有所述基座100的潜望式音圈马达1000及其制造方法。In the present invention, the insulating base 2 is formed by one-time injection molding on the horizontal plane where the metal circuit 1 is located, and then the electronic component 5 and the coil 4 are electrically assembled or mounted on the insulating base 2 , and then the insulating base 2 is placed outside the insulating base 2 . The vertical portion (vertical column portion 19d ) of the metal circuit 1 is bent, and over-injection molding is performed on the outer peripheral side surface 29 of the insulating base 2 to form the insulating frame 3, and the vertical portion (the vertical column portion 19d ) is embedded It is formed in the insulating frame 3 . The electronic component 5 and the coil 4 in the present invention are electrically welded to the electronic component 5, the coil 4 and the metal circuit 1 before the vertical part of the insulating frame 3 is formed, and there is no need to use a flexible circuit board (FPC) and the coil to complete the The reassembly with the base after injection molding reduces the assembly cost and improves the yield rate; at the same time, it solves the technical problem that the wound hollow coil 4 and the electronic component 5 are difficult to mount under the premise of the existence of the vertical part 31. (Electrical mounting is only suitable for the vertical opening of the mounting surface, which is suitable for mounting. However, if there are two mounting surfaces that are parallel to each other in the vertical direction, it is unfavorable to use the mounting method. It is forced to use manual method only), which helps to improve the degree of freedom in the design of the internal space of the periscope voice coil motor 1000, and the internal structure of the periscope voice coil motor product is also more compact and miniaturized. Hereinafter, the base 100 of the present invention, the periscope voice coil motor 1000 having the base 100 and the manufacturing method thereof will be described with reference to FIGS. 1 to 9 .
在本发明中,所述基座100及潜望式音圈马达1000可应用于手机中的潜望式摄像模组。由于手机厚度的限制,采用常规竖向放置(即在手机表面上朝向外部),由于手机摄像头焦距较小,光学变焦能力有限,而在本发 明中,区别于传统镜头的竖向排列方式,该潜望式音圈马达1000在手机内横向放置,如图1所示。一种潜望式音圈马达1000包括一感光组件1001、一光学镜头1002、固持于所述光学镜头1002的磁性元件(未图示)、一反射元件1003及一集成有与所述磁性元件相互作用的线圈4的基座100以及由所述金属电路1、线圈4和磁性元件控制移动的镜头支架(未图示)。其中所述光学镜头1002位于所述感光组件1001和所述反射元件1003之间,以使环境光线先经由所述反射元件1003反射以改变环境光线的传播方向(射入手机摄像头垂直方向的光线改变为横向方向的光线),并在穿过所述光学镜头1002之后,再被所述感光组件1001接收而采集图像。所述反射元件1003可以是棱镜也可以是透镜,具体不限定。所述金属电路1通电后可以与所述磁性元件相互作用以带动所述镜头支架移动,以辅助所述光学镜头1002进行对焦。以下,将作详细说明。In the present invention, the base 100 and the periscope voice coil motor 1000 can be applied to a periscope camera module in a mobile phone. Due to the limitation of the thickness of the mobile phone, the conventional vertical placement (that is, facing the outside on the surface of the mobile phone) is adopted. Due to the small focal length of the mobile phone camera, the optical zoom capability is limited. In the present invention, different from the vertical arrangement of the traditional lens, the The periscope voice coil motor 1000 is placed laterally in the mobile phone, as shown in FIG. 1 . A periscope voice coil motor 1000 includes a photosensitive element 1001, an optical lens 1002, a magnetic element (not shown) fixed on the optical lens 1002, a reflective element 1003, and a reflection element 1003 integrated with the magnetic element. The base 100 of the active coil 4 and the lens holder (not shown) whose movement is controlled by the metal circuit 1 , the coil 4 and the magnetic element. The optical lens 1002 is located between the photosensitive component 1001 and the reflective element 1003, so that the ambient light is first reflected by the reflective element 1003 to change the propagation direction of the ambient light (the light entering the vertical direction of the mobile phone camera changes light in the lateral direction), and after passing through the optical lens 1002, it is received by the photosensitive component 1001 to capture an image. The reflecting element 1003 may be a prism or a lens, which is not specifically limited. After the metal circuit 1 is powered on, it can interact with the magnetic element to drive the lens holder to move, so as to assist the optical lens 1002 in focusing. Hereinafter, a detailed description will be given.
在现有技术中的音圈马达中,承载所述光学镜头1002的所述基座100的一侧设置具有绕设于柔性电路板上的空心线圈,进而与磁性元件相互作用,以对光学镜头进行调节。在本发明中,将所述线圈4集成在所述基座100上。同时本发明中的磁性元件可以与线圈4相互作用实现水平面(X轴或者Y轴方向)的移动或者竖直方向(Z轴方向)的移动,在此处并不限制。所述线圈的形式可以采用绕线式的中空线圈4或者贴片式的柔性电路线圈(FP Coil)4’等,具体线圈的形式本发明内不做限定,但本发明最优方式中采用绕线式或者贴片式柔性电路线圈。如图2所示为贴片式柔性电路线圈4’,如图3所示为绕线式电路线圈4。In the voice coil motor in the prior art, the side of the base 100 carrying the optical lens 1002 is provided with an air-core coil wound on a flexible circuit board, and then interacts with a magnetic element to adjust the optical lens. Make adjustments. In the present invention, the coil 4 is integrated on the base 100 . At the same time, the magnetic element in the present invention can interact with the coil 4 to realize the movement in the horizontal plane (X-axis or Y-axis direction) or the vertical direction (Z-axis direction), which is not limited here. The form of the coil can be a wire-wound hollow coil 4 or a patch-type flexible circuit coil (FP Coil) 4', etc. The specific coil form is not limited in the present invention, but in the best mode of the present invention, a wound coil is used. Wire or SMD flexible circuit coils. As shown in FIG. 2 , the patch-type flexible circuit coil 4 ′ is shown, and as shown in FIG. 3 , the wire-wound circuit coil 4 is shown.
请参照图1至图9,所述基座100包括矩形设置的绝缘底座2、镶埋成型于所述绝缘底座2的金属电路1、电性连接于所述金属电路1的电子元件5及线圈4(柔性电路线圈4’)及镶埋成型于所述绝缘底座2外的绝缘框3。所述绝缘底座2呈水平设置并具有设置于外周的外周侧面29及上表面20。 所述绝缘框3位于所述绝缘底座2的所述外周侧面29外。所述绝缘底座2位于一第一平面P1。所述绝缘底座2通过一次注塑成型的方式包覆成型于所述金属电路1,所述线圈4设置于所述绝缘底座2的所述上表面20,所述基座100包括通过二次注塑成型的方式包覆所述绝缘底座2及金属电路1的绝缘框3,所述绝缘框3设有整体封闭包裹在所述绝缘底座2的所述外周侧面29的且水平设置的框体部30及自所述框体部30的上表面的四周竖直延伸的竖直部31。所述绝缘底座2与所述绝缘框3通过二次注塑成型的方式连接为一体。所述金属电路1通过一次注塑成型镶埋成型于所述绝缘底座2内。在本发明中,第一平面P1即为水平面。Referring to FIGS. 1 to 9 , the base 100 includes a rectangular insulating base 2 , a metal circuit 1 embedded in the insulating base 2 , an electronic component 5 and a coil electrically connected to the metal circuit 1 . 4 (flexible circuit coil 4 ′) and the insulating frame 3 embedded and molded outside the insulating base 2 . The insulating base 2 is arranged horizontally and has an outer peripheral side surface 29 and an upper surface 20 arranged on the outer periphery. The insulating frame 3 is located outside the outer peripheral side surface 29 of the insulating base 2 . The insulating base 2 is located on a first plane P1. The insulating base 2 is overmolded on the metal circuit 1 by one-shot injection molding, the coil 4 is disposed on the upper surface 20 of the insulating base 2 , and the base 100 includes a secondary injection molding. The insulating frame 3 of the insulating base 2 and the metal circuit 1 is covered by the insulating frame 3, and the insulating frame 3 is provided with a frame portion 30 and a horizontally arranged frame portion 30 that is integrally enclosed and wrapped on the outer peripheral side surface 29 of the insulating base 2. The vertical portion 31 extends vertically from the periphery of the upper surface of the frame portion 30 . The insulating base 2 and the insulating frame 3 are integrally connected by means of secondary injection molding. The metal circuit 1 is embedded in the insulating base 2 by one injection molding. In the present invention, the first plane P1 is the horizontal plane.
请参考图5,所述绝缘底座2为矩形设置,具有相对设置的第一侧边21及第三侧边23及连接所述第一侧边21及所述第三侧边23的第二侧边22及第四侧边24。所述绝缘底座2具有位于其外周设置的所述外周侧面29及暴露于所述绝缘框3外的一表面。在本发明中所述外周侧面29即为第一侧边21、第二侧边22、第三侧边23及第四侧边24对应的侧面,在其他实施方式中,所述外周侧面29即为与绝缘框3接触的侧面。在本发明中,所述表面为所述绝缘底座2的上表面20,在其他实施方式中,所述表面也可为暴露于所述绝缘框3的其他表面。所述线圈4定位于所述绝缘底座2上,且通过绕线方式固定于所述绝缘底座2。在本发明中,所述基座100设置有两个所述线圈4,用于与所述磁性元件相互作用实现自动对焦,且两个所述线圈4分别靠近所述第一侧边21及所述第二侧边22设置,且两个所述线圈4的长边方向相互垂直。所述绝缘底座2包括分别沿第一侧边21及所述第二侧边22的延伸方向间隔设置的一对绕线柱26、位于所述两绕线柱26内侧的一对定位柱27及位于每一绕线柱26与同侧的对应定位柱27之间的焊接槽28。所述绝缘底座2上还设置有若干焊接凹槽25用于暴露所述金属 电路1的焊脚1b以使其与电子元件5实现焊接。在本发明中,基座100具有三个所述电子元件5。Please refer to FIG. 5 , the insulating base 2 is in a rectangular shape, having oppositely disposed first side 21 and third side 23 and a second side connecting the first side 21 and the third side 23 side 22 and fourth side 24 . The insulating base 2 has the outer peripheral side surface 29 disposed on the outer periphery thereof and a surface exposed to the outside of the insulating frame 3 . In the present invention, the outer peripheral side 29 is the side corresponding to the first side 21 , the second side 22 , the third side 23 and the fourth side 24 . In other embodiments, the outer peripheral side 29 is It is the side that is in contact with the insulating frame 3 . In the present invention, the surface is the upper surface 20 of the insulating base 2 , and in other embodiments, the surface can also be another surface exposed to the insulating frame 3 . The coil 4 is positioned on the insulating base 2 and fixed to the insulating base 2 by means of winding. In the present invention, the base 100 is provided with two coils 4 for interacting with the magnetic element to realize automatic focusing, and the two coils 4 are respectively close to the first side 21 and the The second side 22 is provided, and the longitudinal directions of the two coils 4 are perpendicular to each other. The insulating base 2 includes a pair of winding posts 26 spaced apart along the extending direction of the first side 21 and the second side 22 , a pair of positioning posts 27 located inside the two winding posts 26 , and A welding slot 28 is located between each winding post 26 and the corresponding positioning post 27 on the same side. The insulating base 2 is also provided with a number of soldering grooves 25 for exposing the soldering feet 1b of the metal circuit 1 so as to realize soldering with the electronic components 5 . In the present invention, the base 100 has three of the electronic components 5 .
所述绝缘框3为二次注塑形成于所述绝缘底座2以与所述绝缘底座2一体连接。所述绝缘框3包括水平设置的所述框体部30、垂直于所述第一平面P1设置的自所述框体部30上表面的四周竖直延伸的竖直部31及位于所述竖直部31表面的顶表面32。所述绝缘框3整体封闭包裹形成,并具有一打薄部33。所述打薄部33形成于所述框体部30的一侧,在本发明中,所述打薄部33对应所述第一侧边21设置。下文所述引脚1a暴露于所述打薄部33的表面。由于所述绝缘框3整体封闭包裹形成,注塑成型后的所述基座100结构强度更好。并且所述打薄部33打薄之后,更易于安装于一外部电路板(未图示),且安装后不会增加其厚度空间。所述竖直部31包括位于所述第一侧边21与所述第二侧边22交汇处设置的第一竖直部311、位于所述第一侧边21及所述第四侧边24交汇处设置的第二竖直部312、位于所述第四侧边24及所述第三侧边23交汇处设置的第三竖直部313及位于所述第二侧边22及所述第三侧边23交汇处设置的第四竖直部314。The insulating frame 3 is formed on the insulating base 2 by secondary injection molding so as to be integrally connected with the insulating base 2 . The insulating frame 3 includes the frame body portion 30 disposed horizontally, a vertical portion 31 disposed perpendicular to the first plane P1 and extending vertically from the periphery of the upper surface of the frame body portion 30 , and a vertical portion 31 located in the vertical direction. The top surface 32 of the surface of the straight portion 31 . The insulating frame 3 is integrally closed and wrapped, and has a thinned portion 33 . The thinned portion 33 is formed on one side of the frame portion 30 . In the present invention, the thinned portion 33 is disposed corresponding to the first side edge 21 . The pins 1 a described below are exposed on the surface of the thinned portion 33 . Since the insulating frame 3 is integrally closed and wrapped, the structural strength of the base 100 after injection molding is better. In addition, after the thinned portion 33 is thinned, it is easier to be installed on an external circuit board (not shown), and the thickness of the thinned portion 33 will not be increased after installation. The vertical portion 31 includes a first vertical portion 311 located at the intersection of the first side 21 and the second side 22 , the first side 21 and the fourth side 24 The second vertical portion 312 disposed at the intersection, the third vertical portion 313 disposed at the intersection of the fourth side 24 and the third side 23, and the second side 22 and the first The fourth vertical portion 314 is provided at the intersection of the three side edges 23 .
所述金属电路1为沿一第一方向的双层设置的金属电路,分别为上层金属电路1d及下层金属电路1e,请参考图9。在本发明中,所述第一方向即为垂直于所述第一平面P1的竖直方向。在其他实施方式中,也可以为其他方向。所述金属电路1包括镶埋成型于所述绝缘底座2内的水平部分及镶埋成型于所述绝缘框3内的垂直部分,所述水平部分与所述垂直部分之间被弯折形成折弯部194,所述折弯部194收容于所述绝缘框3内。所述金属电路1的垂直部分被镶埋成型于所述绝缘框3内。The metal circuit 1 is a double-layered metal circuit along a first direction, which is an upper-layer metal circuit 1d and a lower-layer metal circuit 1e respectively, please refer to FIG. 9 . In the present invention, the first direction is a vertical direction perpendicular to the first plane P1. In other embodiments, other directions are also possible. The metal circuit 1 includes a horizontal part embedded in the insulating base 2 and a vertical part embedded in the insulating frame 3, and the horizontal part and the vertical part are bent to form a fold. The bent portion 194 is accommodated in the insulating frame 3 . The vertical portion of the metal circuit 1 is embedded in the insulating frame 3 .
所述金属电路1包括多个支路,多个所述支路包括位于所述第一平面P1的多个水平支路10及位于多个所述水平支路10周侧的至少两个立柱支路19。多个所述水平支路10的一端平行间隔排布以形成暴露于所述绝缘底 座2外的引脚1a,所述水平支路10的另一端排布形成电性连接至所述电子元件5的引脚的所述焊脚1b,每一所述水平支路10的所述焊脚1b及所述引脚1a之间形成有连接部1c。所述水平支路10包括自右向左排布的第一支路11、第二支路12、第三支路13、第四支路14、第五支路15、第六支路16、第七支路17及第八支路18。所述第一支路11、第五支路15及第八支路18构成了位于上层的所述上层金属电路1d,所述第二支路12、第三支路13、第四支路14、第六支路16、第七支路17及所述立柱支路19构成了位于下层的所述下层金属电路1e。所述上层金属电路1d的所述焊脚1b与所述连接部1c之间均设置有弯折部1f,使得所述上层金属电路1d的焊脚1b与下层金属电路1e的焊脚1b位于同一平面以焊接于同一电子元件5。在本发明中,所述水平支路10形成所述金属电路1的所述水平部分的一部分。The metal circuit 1 includes a plurality of branches, and the plurality of the branches include a plurality of horizontal branches 10 located on the first plane P1 and at least two pillar supports located on the peripheral side of the plurality of horizontal branches 10 Road 19. One ends of the plurality of horizontal branches 10 are arranged in parallel and spaced apart to form pins 1a exposed to the outside of the insulating base 2 , and the other ends of the horizontal branches 10 are arranged to be electrically connected to the electronic components 5 . A connecting portion 1c is formed between the soldering pin 1b of each of the horizontal branches 10 and the pin 1a. The horizontal branch 10 includes a first branch 11, a second branch 12, a third branch 13, a fourth branch 14, a fifth branch 15, a sixth branch 16, The seventh branch 17 and the eighth branch 18. The first branch 11 , the fifth branch 15 and the eighth branch 18 constitute the upper metal circuit 1d located on the upper layer, the second branch 12 , the third branch 13 and the fourth branch 14 , the sixth branch 16 , the seventh branch 17 and the column branch 19 constitute the lower metal circuit 1e located in the lower layer. Bending portions 1f are provided between the soldering legs 1b of the upper metal circuit 1d and the connecting portion 1c, so that the soldering legs 1b of the upper metal circuit 1d and the soldering legs 1b of the lower metal circuit 1e are located at the same position. The plane can be soldered to the same electronic component 5 . In the present invention, the horizontal branch 10 forms part of the horizontal portion of the metal circuit 1 .
在本发明中,所述基座100具有三个所述立柱支路19。所述每个立柱支路19包括所述水平部分和所述垂直部分,所述立柱支路19的所述垂直部分分布于所述绝缘底座2的一侧面的外周,且所述电子元件5与线圈4设置于至少两个所述立柱支路19的所述垂直部分之间的水平部分。具体地,所述立柱支路19的一端设有暴露于所述绝缘框3的所述顶表面32的立柱引脚19a,另一端排布形成焊接至所述电子元件5的立柱焊脚19b,所述立柱引脚19a与所述立柱焊脚19b之间形成位于所述水平支路10周侧的具有所述竖直立柱部19d的立柱连接部19c。所述竖直立柱部19d垂直于所述第一平面P1并位于所述绝缘底座2外且位于所述绝缘框3内,所述竖直立柱部19d与位于所述第一平面P1的所述立柱连接部19c的连接处折弯形成所述折弯部194。所述立柱支路19包括位于所述第一侧边21及所述第二侧边22交汇处设置的第一立柱支路191、位于所述第四侧边24设置的第二立柱支路192及位于所述第二侧边22及第三侧边23交汇处设置的第三立柱支 路193。此时,所述竖直立柱部19d位于所述绝缘底座2外且位于所述绝缘框3的所述竖直部31内。In the present invention, the base 100 has three of the column branches 19 . Each column branch 19 includes the horizontal part and the vertical part, the vertical part of the column branch 19 is distributed on the outer circumference of one side surface of the insulating base 2, and the electronic component 5 is connected to the The coil 4 is arranged in the horizontal portion between the vertical portions of at least two of the upright legs 19 . Specifically, one end of the column branch 19 is provided with a column pin 19a exposed to the top surface 32 of the insulating frame 3, and the other end is arranged to form a column solder pin 19b welded to the electronic component 5, A column connecting portion 19c with the vertical column portion 19d is formed between the column lead 19a and the column welding leg 19b on the peripheral side of the horizontal branch 10 . The vertical column portion 19d is perpendicular to the first plane P1 and is located outside the insulating base 2 and inside the insulating frame 3. The vertical column portion 19d is connected to the first plane P1. The connecting portion of the column connecting portion 19c is bent to form the bent portion 194 . The column branch 19 includes a first column branch 191 located at the intersection of the first side 21 and the second side 22 , and a second column branch 192 located at the fourth side 24 . and a third column branch 193 disposed at the intersection of the second side 22 and the third side 23 . At this time, the vertical column portion 19d is located outside the insulating base 2 and inside the vertical portion 31 of the insulating frame 3 .
具体地,所述金属电路1的水平部分为所述水平支路10及所述立柱支路19的所述立柱焊脚19b及位于所述第一平面P1内的一部分所述立柱连接部19c构成,所述金属电路1的垂直部分为所述立柱支路19的所述竖直立柱部19d及所述立柱引脚19a构成。所述水平部分镶埋成型于所述绝缘底座2,所述垂直部分镶埋成型于所述绝缘框3,所述垂直部分与所述水平部分之间的折弯部194位于所述绝缘底座2外并镶埋成型于所述绝缘框3内。Specifically, the horizontal part of the metal circuit 1 is constituted by the column welding legs 19b of the horizontal branch 10 and the column branch 19 and a part of the column connecting portion 19c located in the first plane P1 , the vertical part of the metal circuit 1 is constituted by the vertical column portion 19d of the column branch 19 and the column pin 19a. The horizontal portion is embedded in the insulating base 2 , the vertical portion is embedded in the insulating frame 3 , and the bent portion 194 between the vertical portion and the horizontal portion is located on the insulating base 2 Outer and embedded in the insulating frame 3 .
所述立柱支路19被包括于上层金属电路1d及下层金属电路1e二者之一内,在本发明中,所述立柱支路19为所述下层金属电路1e的一部分,在其他实施方式中,所述立柱支路19也可为所述上层金属电路1d的一部分,亦可由所述上层金属电路1d和下层金属电路1e的一部分共同构成。The column branch 19 is included in either the upper metal circuit 1d and the lower metal circuit 1e. In the present invention, the column branch 19 is a part of the lower metal circuit 1e. In other embodiments , the column branch 19 may also be a part of the upper metal circuit 1d, and may also be formed by a part of the upper metal circuit 1d and the lower metal circuit 1e.
所述第一支路11包括位于所述绝缘底座2的所述第一侧边21及所述第四侧边24的两个第一引脚11a、与所述电子元件5焊接的第一焊脚11b、连接所述第一焊脚11b与所述第一引脚11a的第一连接部11c及位于所述第一焊脚11b内侧的连接于所述第一连接部11c的第一弯折部11f。The first branch 11 includes two first pins 11 a located on the first side 21 and the fourth side 24 of the insulating base 2 , and a first solder joint for soldering with the electronic component 5 . The pin 11b, the first connection portion 11c connecting the first solder pin 11b and the first pin 11a, and the first bend located inside the first solder pin 11b and connected to the first connection portion 11c Section 11f.
所述第二支路12包括位于所述第一侧边21的第二引脚12a、与所述第一焊脚11b焊接于同一电子元件5的且与其位于同一平面的第二焊脚12b及连接所述第二引脚12a与所述第二焊脚12b的第二连接部12c。所述第一焊脚11b与所述第二焊脚12b位于不同的两排但共同焊接于同一电子元件5。The second branch 12 includes a second pin 12a located on the first side 21, a second solder pin 12b soldered to the same electronic component 5 as the first solder pin 11b and located on the same plane therewith, and The second connecting portion 12c connecting the second pin 12a and the second solder leg 12b. The first solder pins 11b and the second solder pins 12b are located in two different rows but are soldered to the same electronic component 5 together.
所述第三支路13包括位于所述第一侧边21的第三引脚13a、与所述第一焊脚11b焊接于同一电子元件5的且与其位于同一平面的第三焊脚13b 及连接于所述第三引脚13a与所述第三焊脚13b之间的第三连接部13c。所述第三焊脚13b位于所述第二焊脚12b的右侧的同一排且与所述第一焊脚11b相对设置。The third branch 13 includes a third pin 13a located on the first side 21, a third solder pin 13b soldered to the same electronic component 5 as the first solder pin 11b and located on the same plane therewith, and The third connecting portion 13c is connected between the third pin 13a and the third soldering pin 13b. The third welding leg 13b is located in the same row on the right side of the second welding leg 12b and is opposite to the first welding leg 11b.
所述第四支路14包括位于所述第一侧边21的第四引脚14a、与所述第一焊脚11b焊接于同一电子元件5的且与其位于同一平面的第四焊脚14b及连接于所述第四引脚14a与所述第四焊脚14b之间的第四连接部14c。所述第四焊脚14b位于所述第一焊脚11b的左边的同一排并与所述第二焊脚12b相对设置。The fourth branch 14 includes a fourth pin 14a located on the first side 21, a fourth solder pin 14b soldered to the same electronic component 5 as the first solder pin 11b and located on the same plane therewith, and The fourth connection portion 14c is connected between the fourth pin 14a and the fourth solder pin 14b. The fourth welding leg 14b is located in the same row to the left of the first welding leg 11b and is opposite to the second welding leg 12b.
其中一个所述电子元件5具有四个引脚,并与所述第一焊脚11b、第二焊脚12b、第三焊脚13b及第四焊脚14b焊接。所述第一弯折部11f使得所述第一焊脚11b与所述第二焊脚12b、第三焊脚13b及第四焊脚14b位于同一平面。One of the electronic components 5 has four pins, and is welded with the first solder pins 11b, the second solder pins 12b, the third solder pins 13b and the fourth solder pins 14b. The first bending portion 11f makes the first solder leg 11b, the second solder leg 12b, the third solder leg 13b and the fourth solder leg 14b lie on the same plane.
所述第五支路15包括位于所述绝缘底座2的所述第一侧边21及所述第四侧边24的两个第五引脚15a、与所述第一焊脚11b焊接于不同的电子元件5的第五焊脚15b、连接于所述第五焊脚15b与所述第五引脚15a之间的第五连接部15c及位于所述第五焊脚15b内侧的连接于所述第五连接部15c的第五弯折部15f。The fifth branch 15 includes two fifth pins 15 a located on the first side 21 and the fourth side 24 of the insulating base 2 , and the first solder pins 11 b are soldered in different places. The fifth solder pin 15b of the electronic component 5, the fifth connection portion 15c connected between the fifth solder pin 15b and the fifth pin 15a, and the inner side of the fifth solder pin 15b connected to the The fifth bending portion 15f of the fifth connecting portion 15c is described.
所述第六支路16包括位于所述绝缘底座2的所述第一侧边21及所述第三侧边23的两个第六引脚16a、与所述第五焊脚15b焊接于同一电子元件5的第六焊脚16b及连接于所述第六焊脚16b与所述第六引脚16a之间的第六连接部16c。所述第六焊脚16b与所述第五焊脚15b相对设置。The sixth branch 16 includes two sixth pins 16 a located on the first side 21 and the third side 23 of the insulating base 2 , and the fifth solder pins 15 b are soldered on the same side. The sixth soldering pin 16b of the electronic component 5 and the sixth connecting portion 16c connected between the sixth soldering pin 16b and the sixth lead 16a. The sixth welding leg 16b is disposed opposite to the fifth welding leg 15b.
所述第七支路17包括位于所述绝缘底座2的所述第一侧边21的第七引脚17a、与所述第五焊脚15b焊接于同一电子元件5的位于所述第五焊脚15b右侧的第七焊脚17b、与所述第一焊脚11b和所述第五焊脚15b焊接的 所述电子元件5均不同的另外一个电子元件5焊接的另一第七焊脚17b及连接所述第七焊脚17b与所述第七引脚17a的第七连接部17c。The seventh branch 17 includes a seventh pin 17a located on the first side 21 of the insulating base 2, and a seventh pin 17a located on the fifth solder pin 15b soldered to the same electronic component 5 as the fifth solder pin 15b. The seventh solder pin 17b on the right side of the pin 15b, and another seventh solder pin soldered to another electronic component 5 that is different from the electronic component 5 soldered to the first solder pin 11b and the fifth solder pin 15b 17b and a seventh connection portion 17c connecting the seventh solder pin 17b and the seventh pin 17a.
所述第八支路18包括位于所述绝缘底座2的所述第一侧边21的一个、第二侧边22的两个、第三侧边23的一个及第四侧边24的一共五个第八引脚18a、与所述第五焊脚15b焊接于同一电子元件5的位于所述第七焊脚17b对面的第八焊脚18b、与所述另一第七焊脚17b焊接于同一电子元件5的另一第八焊脚18b、连接所述第八焊脚18b与所述第八引脚18a的第八连接部18c及位于所述第八焊脚18b内侧的连接于所述第八连接部18c的第八弯折部18f。所述第七支路17具有两个所述第七焊脚17b,所述第八支路18具有两个所述第八焊脚18b。所述第八支路18具有两个所述第八弯折部18f使得所述第八焊脚18b与所述第五焊脚15b及另一所述第七焊脚17b位于同一平面,以焊接于同一电子元件5。所述第五弯折部15f的设置亦是为了使得所述第五焊脚15b与其焊接于同一电子元件5的其他焊脚位于同一平面。The eighth branch 18 includes one of the first sides 21 , two of the second sides 22 , one of the third sides 23 , and five of the fourth sides 24 located on the insulating base 2 . The eighth pins 18a, the eighth solder pins 18b located opposite the seventh solder pins 17b are soldered to the same electronic component 5 as the fifth solder pins 15b, and the other seventh solder pins 17b are soldered to Another eighth solder pin 18b of the same electronic component 5, an eighth connection portion 18c connecting the eighth solder pin 18b and the eighth pin 18a, and the inner side of the eighth solder pin 18b are connected to the eighth solder pin 18b. The eighth bent portion 18f of the eighth connection portion 18c. The seventh branch 17 has two of the seventh solder legs 17b, and the eighth branch 18 has two of the eighth solder legs 18b. The eighth branch 18 has two eighth bent portions 18f so that the eighth solder leg 18b is located on the same plane as the fifth solder leg 15b and the other seventh solder leg 17b for welding in the same electronic component 5. The fifth bending portion 15f is also arranged so that the fifth soldering leg 15b and other soldering legs soldered to the same electronic component 5 are located on the same plane.
焊接于所述第五焊脚15b的电子元件5具有六个引脚,与其焊接的焊脚1b分别为第五焊脚15b、第六焊脚16b、第七焊脚17b及第八焊脚18b,另外两个焊脚1b分别为所述的第一立柱支路191的第一立柱焊脚191b及第三立柱支路193的与所述第一立柱焊脚191b相对设置的第三立柱焊脚193b。The electronic component 5 soldered to the fifth soldering pin 15b has six pins, and the soldering pins 1b are respectively the fifth soldering pin 15b, the sixth soldering pin 16b, the seventh soldering pin 17b and the eighth soldering pin 18b. , the other two welding legs 1b are respectively the first column welding leg 191b of the first column branch 191 and the third column welding leg 191b of the third column branch 193 disposed opposite to the first column welding leg 191b 193b.
第三个电子元件5具有两个引脚,分别与另一所述第七焊脚17b及另一所述第八焊脚18b焊接。每一个电子元件5焊接所述焊脚的位置处在于所述绝缘底座2处均设置一个焊接凹槽25。The third electronic component 5 has two leads, which are respectively welded with the other seventh soldering pin 17b and the other eighth soldering pin 18b. A welding groove 25 is provided at the insulating base 2 at the position where each electronic component 5 is to be welded with the solder pins.
在本实施方式中,具有三个电子元件5。电子元件5的数量会影向所述水平支路10和立柱支路19的数量和排布。所述第一引脚11a、第二引脚 12a、第三引脚13a、第四引脚14a、第五引脚15a、第六引脚16a、第七引脚17a、第八引脚18a均称为引脚1a。In this embodiment, there are three electronic components 5 . The number of electronic components 5 affects the number and arrangement of the horizontal branches 10 and the column branches 19 . The first lead 11a, the second lead 12a, the third lead 13a, the fourth lead 14a, the fifth lead 15a, the sixth lead 16a, the seventh lead 17a, and the eighth lead 18a are all Called pin 1a.
所述第一焊脚11b、第二焊脚12b、第三焊脚13b、第四焊脚14b、第五焊脚15b、第六焊脚16b、第七焊脚17b及第八焊脚18b均称为焊脚1b。The first welding leg 11b, the second welding leg 12b, the third welding leg 13b, the fourth welding leg 14b, the fifth welding leg 15b, the sixth welding leg 16b, the seventh welding leg 17b and the eighth welding leg 18b are all It is called solder foot 1b.
所述第一连接部11c、第二连接部12c、第三连接部13c、第四连接部14c、第五连接部15c、第六连接部16c、第七连接部17c及第八连接部18c均称为连接部1c。The first connecting portion 11c, the second connecting portion 12c, the third connecting portion 13c, the fourth connecting portion 14c, the fifth connecting portion 15c, the sixth connecting portion 16c, the seventh connecting portion 17c and the eighth connecting portion 18c are all It is called the connection part 1c.
第一弯折部11f、第五弯折部15f、第八弯折部18f均称为弯折部1f。The first bent portion 11f, the fifth bent portion 15f, and the eighth bent portion 18f are all referred to as the bent portion 1f.
所述第一立柱支路191包括镶埋成型于所述第一竖直部311内的第一竖直立柱部191d、自所述第一竖直立柱部191d末端向上延伸的暴露于所述第一竖直部311的所述顶表面32的第一立柱引脚191a、与所述第五焊脚15b焊接于同一电子元件5的所述第一立柱焊脚191b及连接于所述第一立柱引脚191a及所述第一立柱焊脚191b之间的第一立柱连接部191c。所述第一竖直立柱部191d于垂直于所述第一平面P1处设置有折弯部194。所述第一竖直立柱部191d自位于所述第一平面P1内的所述第一立柱连接部191c垂直弯折形成,并具有所述折弯部194。所述折弯部194位于所述绝缘底座2外并位于所述绝缘框3内。在本发明中,所述第一立柱连接部191c至少位于所述绝缘底座2和所述绝缘框3二者之一内,在其他实施方式中,只需要将所述竖直立柱部19d及折弯部194置于所述绝缘底座2外并位于所述绝缘框3内即可,所述立柱连接部19c也可以位于所述绝缘底座2内位于所述绝缘框3外,此处不限制。在本发明中,所述第一立柱连接部191c位于所述绝缘底座2外并位于所述绝缘框3内。The first column branch 191 includes a first vertical column portion 191 d embedded in the first vertical portion 311 , a first vertical column portion 191 d extending upward from the end of the first vertical column portion 191 d and exposed to the first vertical column portion 191 d. The first column lead 191a of the top surface 32 of a vertical portion 311, the first column lead 191b welded to the same electronic component 5 as the fifth lead 15b, and connected to the first column The first column connecting portion 191c between the pins 191a and the first column soldering legs 191b. The first vertical column portion 191d is provided with a bending portion 194 perpendicular to the first plane P1. The first vertical column portion 191 d is formed by vertically bending the first column connecting portion 191 c located in the first plane P1 , and has the bending portion 194 . The bent portion 194 is located outside the insulating base 2 and inside the insulating frame 3 . In the present invention, the first column connecting portion 191c is located at least in one of the insulating base 2 and the insulating frame 3. In other embodiments, only the vertical column portion 19d and the folding The bent portion 194 may be located outside the insulating base 2 and inside the insulating frame 3 , and the column connecting portion 19c may also be located inside the insulating base 2 and outside the insulating frame 3 , which is not limited here. In the present invention, the first column connecting portion 191c is located outside the insulating base 2 and inside the insulating frame 3 .
所述第二立柱支路192包括固持于所述第二竖直部312及所述第三竖直部313内的两个第二竖直立柱部192d、自所述第二竖直立柱部192d末端 向上延伸的暴露于所述第二竖直部312及第三竖直部313的所述顶表面32的两个第二立柱引脚192a及连接两个所述第二竖直立柱部192d之间的第二立柱连接部192c。此时,所述第二立柱连接部192c位于所述绝缘底座2外且位于所述绝缘框3内。所述第二竖直立柱部192d自位于所述第一平面P1内的所述第二立柱连接部192c垂直弯折形成,并具有所述折弯部194。所述折弯部194位于所述绝缘底座2外并位于所述绝缘框3内。The second column branch 192 includes two second vertical column portions 192d fixed in the second vertical portion 312 and the third vertical portion 313, and two second vertical column portions 192d from the second vertical column portion 192d. The two second upright pins 192a of the top surfaces 32 of the second upright portion 312 and the third upright portion 313 whose ends extend upwardly and are connected to the two second upright upright portions 192d The second column connecting portion 192c between them. At this time, the second column connecting portion 192c is located outside the insulating base 2 and inside the insulating frame 3 . The second vertical column portion 192d is formed by being vertically bent from the second column connecting portion 192c located in the first plane P1 and has the bending portion 194 . The bent portion 194 is located outside the insulating base 2 and inside the insulating frame 3 .
所述第三立柱支路193包括固持于所述第四竖直部314内的第三竖直立柱部193d、自所述第三竖直立柱部193d末端向上延伸的暴露于所述第四竖直部314的所述顶表面32的第三立柱引脚193a、与所述第五焊脚15b焊接于同一电子元件5的所述第三立柱焊脚193b及连接于所述第三立柱引脚193a及所述第三立柱焊脚193b之间的第三立柱连接部193c。所述第三竖直立柱部193d于垂直于所述第一平面P1处设置有折弯部194。所述第三竖直立柱部193d自位于所述第一平面P1内的所述第三立柱连接部193c垂直弯折形成,并具有所述折弯部194。所述折弯部194位于所述绝缘底座2外并位于所述绝缘框3内。在本发明中,所述第三立柱连接部193c位于所述绝缘底座2外并位于所述绝缘框3内。The third upright branch 193 includes a third upright upright portion 193d fixed in the fourth upright portion 314, and a third upright upright portion 193d extending upward from the end of the third upright upright portion 193d and exposed to the fourth upright portion. The third upright pin 193a of the top surface 32 of the straight portion 314, the third upright pin 193b soldered to the same electronic component 5 as the fifth solder pin 15b, and connected to the third upright pin 193a and the third column connecting portion 193c between the third column welding legs 193b. The third vertical column portion 193d is provided with a bending portion 194 perpendicular to the first plane P1. The third vertical column portion 193 d is formed by being vertically bent from the third column connecting portion 193 c located in the first plane P1 , and has the bending portion 194 . The bent portion 194 is located outside the insulating base 2 and inside the insulating frame 3 . In the present invention, the third column connecting portion 193c is located outside the insulating base 2 and inside the insulating frame 3 .
所述第一竖直立柱部191d、第二竖直立柱部192d及第三竖直立柱部193d均称为竖直立柱部19d。The first vertical column portion 191d, the second vertical column portion 192d and the third vertical column portion 193d are all referred to as the vertical column portion 19d.
所述第一立柱引脚191a、第二立柱引脚192a及第三立柱引脚193a均称为立柱引脚19a。The first upright pin 191a, the second upright pin 192a and the third upright pin 193a are all called upright pins 19a.
所述第一立柱焊脚191b及所述第三立柱焊脚193b均称为立柱焊脚19b。The first column welding leg 191b and the third column welding leg 193b are both referred to as the column welding leg 19b.
所述第一立柱连接部191c、第二立柱连接部192c及第三立柱连接部193c均称为立柱连接部19c。The first column connecting portion 191c, the second column connecting portion 192c and the third column connecting portion 193c are all referred to as the column connecting portion 19c.
所述绝缘底座2的所述第一侧边21及所述第二侧边22均间隔设置两所述焊接槽28以暴露所述支路上的两个间隔的焊接位1g,所述线圈4设置两个焊接引脚41,两个所述焊接引脚41分别对应所述绝缘底座2的两个所述焊接槽28以焊接于所述支路。所述焊接位1g可以设置于同一支路也可设置于不同支路,在本发明中,一对所述焊接位1g设置于不同支路,另外一对所述焊接位1g设置于同一支路。具体地,在对应位于所述第一侧边21的线圈4的焊接位1g位于所述第二支路12的第二连接部12c及第六支路16的第六连接部16c上。对应所述第二侧边22的线圈4的焊接位1g位于所述第一立柱支路191的所述第一立柱连接部191c上。在其他实施方式中,对应两个焊接引脚41的焊接位1g也可以凸伸出所述绝缘底座2而直接暴露在绝缘底座2的表面,即不需要设置所述焊接槽28。The first side 21 and the second side 22 of the insulating base 2 are provided with two welding grooves 28 at intervals to expose two spaced welding positions 1g on the branch, and the coil 4 is provided with Two welding pins 41 , the two welding pins 41 are respectively corresponding to the two welding grooves 28 of the insulating base 2 to be welded to the branch circuit. The welding positions 1g can be arranged in the same branch or in different branches. In the present invention, a pair of the welding positions 1g are arranged in different branches, and the other pair of the welding positions 1g are arranged in the same branch. . Specifically, the welding position 1g corresponding to the coil 4 located on the first side 21 is located on the second connection portion 12c of the second branch 12 and the sixth connection portion 16c of the sixth branch 16 . The welding position 1 g of the coil 4 corresponding to the second side 22 is located on the first column connecting portion 191 c of the first column branch 191 . In other embodiments, the welding positions 1g corresponding to the two welding pins 41 may also protrude out of the insulating base 2 and be directly exposed on the surface of the insulating base 2 , that is, the welding grooves 28 do not need to be provided.
在本发明中,所述线圈4固持于所述绝缘底座2的方式可以选择在绝缘底座2上实现线圈4的绕制或者选择采用SMT(Surface Mount Technology)方式贴装贴片式的线圈。选择第一种方式组装线圈,则所述焊接槽28需要在绝缘底座2上设置绕线柱26和定位柱27,但绕线柱26与定位柱27的设置数量不限制,根据产品的需要设置。若选择第二种方式,则无需设置绕线柱26和定位柱27。但在两种方式中均需要设置焊接位1g以使得所述线圈4与所述金属电路1实现焊接。在本实施例中,所述线圈4通过绕线方式固定于所述绝缘底座2,所述绝缘底座2的第一侧边21及第二侧边22均设置有一对间隔设置的绕线柱26及位于所述绕线柱26下方的定位柱27,且此处的所述焊接槽28设置于所述绕线柱26与定位柱27之间。所述线圈4绕线固定于一对所述绕线柱26,所述线圈4还设置有一对引线端42,所述引线端42固定于所述定位柱27。最终所述线圈4的引线端42内侧的焊接引脚41焊接于暴露于所述焊接槽28内的焊接位1g,且所述焊接引脚41外侧的部分会被裁切掉。In the present invention, the manner in which the coil 4 is held on the insulating base 2 can be selected to realize the winding of the coil 4 on the insulating base 2 or to use an SMT (Surface Mount Technology) method to mount a patch-type coil. If the first method is selected to assemble the coil, the welding slot 28 needs to be provided with a winding column 26 and a positioning column 27 on the insulating base 2, but the number of the winding column 26 and the positioning column 27 is not limited, and can be set according to the needs of the product . If the second method is selected, the winding posts 26 and the positioning posts 27 do not need to be provided. However, in both methods, it is necessary to set a welding position 1g so that the coil 4 and the metal circuit 1 can be welded. In this embodiment, the coil 4 is fixed to the insulating base 2 by means of wire winding, and a pair of spaced winding posts 26 are provided on both the first side 21 and the second side 22 of the insulating base 2 and the positioning column 27 located under the winding column 26 , and the welding slot 28 here is arranged between the winding column 26 and the positioning column 27 . The coil 4 is wound and fixed to a pair of the winding posts 26 , and the coil 4 is further provided with a pair of lead ends 42 , and the lead ends 42 are fixed to the positioning posts 27 . Finally, the welding pin 41 inside the lead end 42 of the coil 4 is welded to the welding position 1g exposed in the welding groove 28 , and the outer part of the welding pin 41 is cut off.
每个所述支路与所述线圈4焊接的一端侧被注塑成型于所述绝缘底座2内。至少两个所述线圈4均位于同一所述绝缘底座2,每个所述线圈4独立定位于所述绝缘底座2的表面。One end of each of the branches and the coil 4 welded is injection-molded into the insulating base 2 . At least two of the coils 4 are located on the same insulating base 2 , and each of the coils 4 is independently positioned on the surface of the insulating base 2 .
电子元件5与所述线圈4均位于同一所述绝缘底座2,所述电子元件5位于所述线圈4绕设的区域内或者位于所述线圈4绕设的区域外,此处并不限制,在本发明中,由于电子元件5具有三个且具有设置在线圈4绕设的区域内的也具有设置在线圈4绕设的区域外的。所述电子元件5通过表面安装技术(Surface Mount Technology,SMT)贴装于所述绝缘底座2的所述上表面20。此处所述表面安装技术(SMT)是将电子元件安装到印刷电路板上,并通过钎焊形成电气联结,此处的表面安装技术指的是将所述电子元件5贴装到所述绝缘底座2的所述上表面20。所述电子元件5位置的设置会影向水平支路10及立柱支路19的排布。The electronic component 5 and the coil 4 are both located on the same insulating base 2, and the electronic component 5 is located in the area where the coil 4 is wound or outside the area where the coil 4 is wound, which is not limited here. In the present invention, since there are three electronic components 5, there are those arranged in the area around which the coil 4 is wound, and there are also those arranged outside the area around which the coil 4 is wound. The electronic component 5 is mounted on the upper surface 20 of the insulating base 2 by surface mount technology (Surface Mount Technology, SMT). The surface mount technology (SMT) described here is to mount electronic components on a printed circuit board and form an electrical connection by soldering, and the surface mount technology here refers to attaching the electronic components 5 to the insulation. The upper surface 20 of the base 2 . The location of the electronic components 5 will affect the arrangement of the horizontal branch 10 and the column branch 19 .
本发明还涉及一种制造具有线圈4的基座100的制造方法,具体包括以下步骤:The present invention also relates to a manufacturing method for manufacturing the base 100 with the coil 4, which specifically includes the following steps:
在两个料带上分别冲压形成若干相连的上层金属电路1d及若干相连的下层金属电路1e,将上层金属电路1d及下层金属电路1e上下堆叠形成若干相连的金属电路1,所述金属电路1包括位于水平面的水平部分及位于所述水平部分外周侧的垂直部分,此时的水平面即为所述第一平面P1,且所述金属电路1的水平部分为所述水平支路10及所述立柱支路19的所述立柱焊脚19b及位于所述第一平面P1内的一部分所述立柱连接部19c构成,所述金属电路1的垂直部分为所述立柱支路19的所述竖直立柱部19d及所述立柱引脚19a构成。所述金属电路1包括若干水平支路10和位于所述水平支路10外周的立柱支路19,此时所述立柱支路19与所述水平支路10位于同一平面,所述若干水平支路10的一端平行且间隔排布以形成引脚1a,所述支路的另一端排布形成焊脚1b,所述引脚1a与所述焊脚1b之间形成 连接部1c,所述第二连接部12c及所述第六连接部16c上设置有间隔设置的焊接位1g;所述立柱支路19的一端形成位于所述水平支路10外周的立柱引脚19a,另一端排布形成与所述焊脚1b位于同一平面的立柱焊脚19b,所述立柱支路19的所述立柱引脚19a与所述立柱焊脚19b之间形成有立柱连接部19c。另一对所述焊接位1g形成于位于水平面的所述第一立柱连接部191c上。A plurality of connected upper-layer metal circuits 1d and a plurality of connected lower-layer metal circuits 1e are formed by stamping on the two material strips, respectively, and the upper-layer metal circuits 1d and the lower-layer metal circuits 1e are stacked up and down to form a plurality of connected metal circuits 1. The metal circuits 1 It includes a horizontal part located on the horizontal plane and a vertical part located on the outer peripheral side of the horizontal part, the horizontal plane at this time is the first plane P1, and the horizontal part of the metal circuit 1 is the horizontal branch 10 and the The upright leg 19b of the upright branch 19 and a part of the upright connecting portion 19c located in the first plane P1 are formed. The vertical part of the metal circuit 1 is the vertical portion of the upright branch 19 . The upright portion 19d and the upright pin 19a are constituted. The metal circuit 1 includes several horizontal branches 10 and a column branch 19 located on the outer periphery of the horizontal branch 10. At this time, the vertical branch 19 and the horizontal branch 10 are located on the same plane, and the several horizontal branches One end of the circuit 10 is arranged in parallel and at intervals to form a pin 1a, the other end of the branch circuit is arranged to form a solder pin 1b, and a connection portion 1c is formed between the pin 1a and the solder pin 1b, and the first The two connecting parts 12c and the sixth connecting part 16c are provided with welding positions 1g arranged at intervals; one end of the column branch 19 forms a column pin 19a located on the outer periphery of the horizontal branch 10, and the other end is arranged to form A column connecting portion 19c is formed between the column pin 19a of the column branch 19 and the column welding leg 19b, which is located on the same plane as the welding leg 1b. Another pair of the welding positions 1g is formed on the first column connecting portion 191c located on the horizontal plane.
于所述金属电路1的所述水平部分进行一次注塑成型以形成矩形设置的绝缘底座2,此时所述绝缘底座2呈水平设置并具有设置于外周的外周侧面29及上表面20,此时所述垂直部分位于所述绝缘底座2外,此时所述立柱连接部19c位于所述绝缘底座2外,所述焊接位1g暴露在所述绝缘底座2的所述上表面20,所述绝缘底座2对应所述焊脚1b的位置处设置焊接凹槽25,同时在所述绝缘底座2上设置绕线柱26和定位柱27及位于所述绕线柱26及所述定位柱27之间的暴露所述焊接位1g的焊接槽28。于所述焊接凹槽25内通过表面安装技术(SMT)将所述电子元件5贴装于所述绝缘底座2的所述上表面20并与焊脚1b及立柱焊脚19b进行焊接贴装。One injection molding is performed on the horizontal portion of the metal circuit 1 to form a rectangular insulating base 2. At this time, the insulating base 2 is arranged horizontally and has an outer peripheral side 29 and an upper surface 20 arranged on the outer periphery. The vertical portion is located outside the insulating base 2, and the column connecting portion 19c is located outside the insulating base 2. The welding position 1g is exposed on the upper surface 20 of the insulating base 2, and the insulating The base 2 is provided with a welding groove 25 at the position corresponding to the welding leg 1b. At the same time, a winding post 26 and a positioning post 27 are arranged on the insulating base 2 and located between the winding post 26 and the positioning post 27. The welding groove 28 of the welding position 1g is exposed. The electronic component 5 is mounted on the upper surface 20 of the insulating base 2 by surface mount technology (SMT) in the soldering groove 25 , and is soldered and mounted with the solder pins 1b and the column solder pins 19b.
于所述绝缘底座2绕设并定位水平设置的线圈4或者贴装柔性电路线圈4’,所述线圈4包括两个焊接引脚41,两个所述焊接引脚41分别对应所述绝缘底座2的所述焊接槽28设置,以与暴露于所述焊接槽28内的所述焊接位1g对应设置。A coil 4 or a flexible circuit coil 4' mounted horizontally is wound around and positioned on the insulating base 2, the coil 4 includes two welding pins 41, and the two welding pins 41 correspond to the insulating base respectively. The welding groove 28 of 2 is provided to correspond to the welding position 1g exposed in the welding groove 28 .
弯折所述绝缘底座2外的所述金属电路1的水平部分和垂直部分的连接处以形成一折弯部194及垂直所述水平部分设置的垂直部分,所述垂直部分为所述竖直立柱部19d及所述立柱引脚19a,进而形成第一半成品。此时所述折弯部194及所述竖直立柱部19d连同所述立柱引脚19a位于所述绝缘底座2外。Bend the connection between the horizontal part and the vertical part of the metal circuit 1 outside the insulating base 2 to form a bending part 194 and a vertical part arranged perpendicular to the horizontal part, and the vertical part is the vertical column The portion 19d and the post pin 19a are formed, thereby forming a first semi-finished product. At this time, the bent portion 194 and the vertical column portion 19d together with the column pins 19a are located outside the insulating base 2 .
在第一半成品上进行二次注塑成型以形成绝缘框3,进而形成基座100。即在所述金属电路1及绝缘底座2的外围进行二次注塑成型以形成绝缘框3,所述金属电路1同时镶埋成型于所述绝缘底座2及绝缘框3,所述绝缘框3设有整体封闭包覆在所述绝缘底座2的所述外周侧面29的且水平设置的框体部30及自所述框体部30的上表面四周竖直延伸的竖直部31。所述绝缘框3包覆所述立柱连接部19c并具有竖直设置的竖直部31以嵌入所述竖直立柱部19d,且所述竖直立柱部19d的所述立柱引脚19a位于所述竖直部31的顶表面32。所述绝缘框3整体封闭包裹,并在对应所述第一侧边21具有一打薄部33,所述水平支路10的伸出所述第一侧边21的所述焊脚1b呈一排平行设置于所述打薄部33之外,对应所述打薄部33可以更易于安装一外部电路板。Over-injection molding is performed on the first semi-finished product to form the insulating frame 3 , and then the base 100 is formed. That is, secondary injection molding is performed on the periphery of the metal circuit 1 and the insulating base 2 to form an insulating frame 3, and the metal circuit 1 is embedded and molded on the insulating base 2 and the insulating frame 3 at the same time. There is a frame portion 30 that is integrally enclosed and covered on the outer peripheral side surface 29 of the insulating base 2 and is arranged horizontally, and a vertical portion 31 that extends vertically from the upper surface of the frame portion 30 around. The insulating frame 3 covers the column connecting portion 19c and has a vertically arranged vertical portion 31 to be embedded in the vertical column portion 19d, and the column pins 19a of the vertical column portion 19d are located at the The top surface 32 of the vertical portion 31 is described. The insulating frame 3 is completely enclosed and wrapped, and has a thinned portion 33 corresponding to the first side edge 21 . The rows are arranged in parallel outside the thinned portion 33 , and an external circuit board can be more easily installed corresponding to the thinned portion 33 .
裁切连接若干所述基座100的料带及金属电路1中的水平支路10及立柱支路19的连接处的料带,以形成若干独立完整的基座100。The material strips connecting several of the bases 100 and the material strips at the connection between the horizontal branches 10 and the column branches 19 in the metal circuit 1 are cut to form several independent and complete bases 100 .
一种潜望式音圈马达1000的制作方法,包括上述制造基座100的步骤。A manufacturing method of a periscope voice coil motor 1000 includes the above steps of manufacturing the base 100 .
在本发明中,通过两次注塑成型,将绝缘底座2和绝缘框3注塑为一体,同时在矩形设置的绝缘底座2上先电性集成所述线圈4(柔性电路线圈4’)和电子元件5,再对金属电路1的立柱支路19的位于所述绝缘底座2外部的立柱连接部19c的部分进行弯折,形成垂直于水平面的竖直立柱部19d(垂直部分),再经过二次注塑成型绝缘框3,所述绝缘框3镶埋成型有所述金属电路1的位于所述绝缘底座2外的部分并定位所述绝缘底座2,以实现在形成潜望式音圈马达1000中的基座100的竖直设置的竖直部31之前,先进行线圈4和电子元件5的电性集成(表面安装或者绕设),无需再进行单个基座单独操作的柔性电路板(FPC)和柔性线圈的贴装组装,使得组装成本降低,良品率提高。同时解决了所述线圈4及所述电子元件5在潜望式音圈马达1000的基座100具有竖直部31的基础上无法水平贴装的 技术难题,有助于提高潜望式音圈马达1000的设计的自由度。且由于线圈4及电子元件5均集成在绝缘底座2上,使得产品的结构更加紧凑小型化。更为重要的是,由于基座100是在水平面进行注塑绝缘底座2,且在线圈及电子元件贴装后再进行金属电路1的折弯,则位于同一料带上可以制造若干基座100,可以实现批量性生产,实现自动化。更进一步地,一次注塑成型的绝缘底座2将若干所述支路的一端即所述焊脚1b及立柱焊脚19b固定并暴露在其上表面20,而二次注塑成型的绝缘框3则将若干所述支路的另一端即引脚1a及立柱引脚19a固定并暴露在其上表面,更具体地说是引脚1a暴露在所述绝缘框3的框体部30的上表面,立柱引脚19a则暴露在所述绝缘框3的竖直部31的所述顶表面32,如此可提升基座100的制造精度,并降低注塑成型的制造难度。In the present invention, the insulating base 2 and the insulating frame 3 are injected into one body by two injection molding, and the coil 4 (flexible circuit coil 4') and electronic components are first electrically integrated on the insulating base 2 arranged in a rectangular shape. 5. Bend the part of the column connecting part 19c outside the insulating base 2 of the column branch 19 of the metal circuit 1 to form a vertical column part 19d (vertical part) perpendicular to the horizontal plane, and then go through the second time. The insulating frame 3 is injection-molded, the insulating frame 3 is embedded with the part of the metal circuit 1 outside the insulating base 2 and the insulating base 2 is positioned, so as to realize the formation of the periscope voice coil motor 1000 Before the vertically arranged vertical portion 31 of the base 100, the electrical integration (surface mounting or winding) of the coil 4 and the electronic component 5 is performed first, and there is no need to carry out a flexible circuit board (FPC) operated by a single base. And flexible coil mounting assembly, which reduces the assembly cost and improves the yield. At the same time, the technical problem that the coil 4 and the electronic component 5 cannot be mounted horizontally on the basis that the base 100 of the periscope voice coil motor 1000 has the vertical portion 31 is solved, which is helpful to improve the periscope voice coil. The degree of freedom in the design of the motor 1000 . And because the coil 4 and the electronic components 5 are integrated on the insulating base 2, the structure of the product is more compact and miniaturized. More importantly, since the base 100 is injection-molded with the insulating base 2 on a horizontal plane, and the metal circuit 1 is bent after the coils and electronic components are mounted, several bases 100 can be manufactured on the same tape. It can realize mass production and realize automation. Further, the insulating base 2 which is injection-molded once fixes and exposes one end of the plurality of branches, namely the welding legs 1b and the column welding legs 19b, on the upper surface 20, while the insulating frame 3 which is injection-molded by the second injection The other ends of the plurality of branches, that is, the pins 1a and the upright pins 19a are fixed and exposed on the upper surface thereof. More specifically, the pins 1a are exposed on the upper surface of the frame body 30 of the insulating frame 3. The pins 19a are exposed on the top surface 32 of the vertical portion 31 of the insulating frame 3, so that the manufacturing precision of the base 100 can be improved, and the manufacturing difficulty of injection molding can be reduced.
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be The technical solutions described in the foregoing embodiments are modified, or some or all of the technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
以上所述仅为本发明的部分实施方式,不是全部的实施方式,本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变化,均为本发明的权利要求所涵盖。The above descriptions are only part of the embodiments of the present invention, not all of the embodiments. Any equivalent changes to the technical solutions of the present invention taken by those of ordinary skill in the art by reading the description of the present invention are covered by the claims of the present invention. .

Claims (21)

  1. 一种具有线圈的基座,包括:矩形设置的绝缘底座(2)、镶埋成型于所述绝缘底座(2)的金属电路(1)、电性连接于所述金属电路(1)的线圈(4)及电子元件(5),其特征在于:所述绝缘底座(2)通过一次注塑成型的方式包覆成型于所述金属电路(1),所述绝缘底座(2)呈水平设置并具有设置于外周的外周侧面(29)及上表面(20),所述线圈(4)设置于所述绝缘底座(2)的所述上表面(20),所述电子元件(5)通过表面安装技术贴装于所述绝缘底座(2)的所述上表面(20),所述基座(100)包括通过二次注塑成型的方式包覆所述绝缘底座(2)及所述金属电路(1)的绝缘框(3),所述绝缘框(3)设有整体封闭包覆在所述绝缘底座(2)的所述外周侧面(29)的且水平设置的框体部(30)及自所述框体部(30)上表面的四周竖直延伸的竖直部(31)。A base with a coil, comprising: a rectangular insulating base (2), a metal circuit (1) embedded and formed on the insulating base (2), and a coil electrically connected to the metal circuit (1) (4) and the electronic component (5), characterized in that: the insulating base (2) is overmolded on the metal circuit (1) by one-shot injection molding, and the insulating base (2) is arranged horizontally and It has an outer peripheral side surface (29) and an upper surface (20) arranged on the outer periphery, the coil (4) is arranged on the upper surface (20) of the insulating base (2), and the electronic component (5) passes through the surface The mounting technology is mounted on the upper surface (20) of the insulating base (2), and the base (100) includes covering the insulating base (2) and the metal circuit by means of secondary injection molding The insulating frame (3) of (1), wherein the insulating frame (3) is provided with a horizontally arranged frame portion (30) integrally enclosing and covering the outer peripheral side surface (29) of the insulating base (2). and a vertical portion (31) vertically extending from the periphery of the upper surface of the frame body portion (30).
  2. 如权利要求1所述的具有线圈的基座,其特征在于:所述金属电路(1)包括镶埋成型于所述绝缘底座(2)的水平部分、镶埋成型于所述竖直部(31)的垂直部分及连接于所述水平部分与所述垂直部分之间的折弯部(194),所述折弯部(194)位于所述绝缘底座(2)外且镶埋成型于所述框体部(30)内。The base with coil according to claim 1, characterized in that: the metal circuit (1) comprises a horizontal part embedded in the insulating base (2), embedded in the vertical part ( 31) The vertical part and the bent part (194) connected between the horizontal part and the vertical part, the bent part (194) is located outside the insulating base (2) and is embedded in the inside the frame body (30).
  3. 如权利要求2所述的具有线圈的基座,其特征在于:所述金属电路(1)包括若干支路,若干所述支路包括至少两个立柱支路(19),每个所述立柱支路(19)包括所述水平部分和所述垂直部分,两个所述立柱支路(19)的所述垂直部分分布于所述绝缘底座(2)的所述外周侧面(29)的外周,所述电子元件(5)和所述线圈(4)设置于至少两个所述立柱支路(19)的所述垂直部分之间。The base with coil according to claim 2, characterized in that: the metal circuit (1) comprises several branches, and the several branches comprise at least two upright branches (19), each of the uprights The branch (19) includes the horizontal part and the vertical part, and the vertical parts of the two column branches (19) are distributed on the outer circumference of the outer peripheral side surface (29) of the insulating base (2). , the electronic component (5) and the coil (4) are arranged between the vertical parts of at least two of the column branches (19).
  4. 如权利要求3所述的具有线圈的基座,其特征在于:所述金属电路(1)的若干所述支路包括镶埋成型于所述绝缘底座(2)的水平支路(10)及位于所述水平支路(10)周侧的所述立柱支路(19),所述立柱支路(19)的一端设有暴露于所述竖直部(31)的顶表面(32)的立柱引脚(19a),所述立柱支路(19)的另一端排布形成焊接至所述电子元件(5)的立柱焊脚(19b),所述立柱支路(19)的所述立柱引脚(19a)与所述立柱焊脚(19b)之间形成有位于所述水平支路(10)周侧的构成所述垂直部分的竖直立柱部(19d)的立柱连接部(19c),所述竖直立柱部(19d)位于所述绝缘底座(2)外且镶埋成型于所述竖直部(31)。The base with coils according to claim 3, characterized in that: a plurality of the branches of the metal circuit (1) comprise horizontal branches (10) embedded in the insulating base (2) and The column branch (19) located on the peripheral side of the horizontal branch (10), one end of the column branch (19) is provided with a top surface (32) exposed to the vertical portion (31) A column pin (19a), the other end of the column branch (19) is arranged to form a column solder leg (19b) welded to the electronic component (5), the column of the column branch (19) A column connecting portion (19c) that constitutes a vertical column portion (19d) of the vertical portion and is located on the peripheral side of the horizontal branch (10) is formed between the lead (19a) and the column welding leg (19b) , the vertical column portion (19d) is located outside the insulating base (2) and is embedded in the vertical portion (31).
  5. 如权利要求4所述的具有线圈的基座,其特征在于:若干所述水平支路(10)的一端设有间隔排布形成的引脚(1a),若干所述水平支路(10)另一端设有平行排布形成的焊脚(1b),所述引脚(1a)与所述焊脚(1b)之间形成连接部(1c);所述焊脚(1b)及所述立柱焊脚(19b)暴露在所述绝缘底座(2)的上表面,所述引脚(1a)暴露在所述框体部(30)的所述上表面(20),所述立柱引脚(19a)暴露在所述竖直部(31)的所述顶表面(32)。The base with coils according to claim 4, characterized in that: one end of a plurality of the horizontal branches (10) is provided with pins (1a) arranged at intervals, and a plurality of the horizontal branches (10) The other end is provided with solder pins (1b) arranged in parallel, and a connecting portion (1c) is formed between the pins (1a) and the solder pins (1b); the solder pins (1b) and the upright column Soldering legs (19b) are exposed on the upper surface of the insulating base (2), the pins (1a) are exposed on the upper surface (20) of the frame body (30), and the upright pins ( 19a) is exposed on the top surface (32) of the vertical portion (31).
  6. 如权利要求5所述的具有线圈的基座,其特征在于:所述绝缘框(3)于所述绝缘底座(2)的一侧设有一打薄部(33),所述引脚(1a)镶埋成型于所述绝缘框(3)的所述打薄部(33)内且暴露于所述打薄部(33)的表面。The base with coils according to claim 5, characterized in that: the insulating frame (3) is provided with a thinned portion (33) on one side of the insulating base (2), and the pins (1a) ) is embedded in the thinned portion (33) of the insulating frame (3) and exposed on the surface of the thinned portion (33).
  7. 如权利要求5所述的具有线圈的基座,其特征在于:所述支路设有暴露在所述绝缘底座(2)的所述上表面(20)并间隔设置的焊接位(1g),所述线圈(4)设置两个焊接引脚(41),两个所述焊接引脚(41)分别对应焊接于所述焊接位(1g)。The base with coil according to claim 5, characterized in that: the branch circuit is provided with welding positions (1g) exposed on the upper surface (20) of the insulating base (2) and arranged at intervals, The coil (4) is provided with two welding pins (41), and the two welding pins (41) are respectively welded to the welding positions (1g).
  8. 如权利要求7所述的具有线圈的基座,其特征在于:所述基座(100)设置至少两个线圈(4),每一所述线圈(4)对应所述支路中的所述焊接位(1g)焊接,每个所述支路与每个所述线圈(4)焊接的一端侧被注塑成型于所述绝缘底座(2)内。The base with coils according to claim 7, characterized in that: the base (100) is provided with at least two coils (4), and each of the coils (4) corresponds to the one in the branch. The welding position (1g) is welded, and one end side of each branch circuit and each coil (4) welded is injection-molded into the insulating base (2).
  9. 如权利要求8所述的具有线圈的基座,其特征在于:对应同一所述线圈(4)的两个所述焊接引脚(41)进行焊接的所述焊接位(1g)间隔形成在同一所述支路中的不同位置,所述绝缘底座(2)设有焊接槽(28)以暴露对应的所述焊接位(1g)。The base with a coil according to claim 8, characterized in that: the welding positions (1g) corresponding to the two welding pins (41) of the same coil (4) for welding are formed at the same interval. At different positions in the branch, the insulating base (2) is provided with a welding groove (28) to expose the corresponding welding position (1g).
  10. 如权利要求9所述的具有线圈的基座,其特征在于:至少两个所述线圈(4)分别位于所述绝缘底座(2)的两相邻侧边内侧,且两个所述线圈的长边方向相互垂直。The base with coils according to claim 9, characterized in that: at least two of the coils (4) are respectively located inside two adjacent sides of the insulating base (2), and the two coils The longitudinal directions are perpendicular to each other.
  11. 如权利要求3所述的具有线圈的基座,其特征在于:所述金属电路(1)为在一第一方向上排列的双层金属电路,分别为上层金属电路(1d)及下层金属电路(1e),所述立柱支路(19)至少为所述上层金属电路(1d)及所述下层金属电路(1e)二者之一。The base with coil according to claim 3, characterized in that: the metal circuit (1) is a double-layer metal circuit arranged in a first direction, which are an upper-layer metal circuit (1d) and a lower-layer metal circuit respectively (1e), the column branch (19) is at least one of the upper metal circuit (1d) and the lower metal circuit (1e).
  12. 如权利要求9所述的具有线圈的基座,其特征在于:所述线圈(4)通过绕线方式固定于所述绝缘底座(2),所述绝缘底座(2)设置有一对间隔设置的绕线柱(26),所述线圈(4)绕线固定于所述绕线柱(26)。The base with coil according to claim 9, characterized in that: the coil (4) is fixed to the insulating base (2) by means of winding, and the insulating base (2) is provided with a pair of spaced apart A winding post (26), on which the coil (4) is wound and fixed.
  13. 如权利要求12所述的具有线圈的基座,其特征在于:所述绝缘底座(2)设置有一对定位柱(27),所述线圈(4)具有一对引线端(42),所述引线端(42)固定于所述定位柱(27),所述焊接槽(28)位于所述绕线柱(26)和所述定位柱(27)之间。The base with coil according to claim 12, characterized in that: the insulating base (2) is provided with a pair of positioning posts (27), the coil (4) has a pair of lead ends (42), the The lead end (42) is fixed on the positioning post (27), and the welding slot (28) is located between the winding post (26) and the positioning post (27).
  14. 如权利要求13所述的具有线圈的基座,其特征在于:所述电子元件(5)位于所述线圈(4)绕设的区域内或位于所述线圈(4)绕设的区域外。The base with coil according to claim 13, characterized in that: the electronic component (5) is located in the area where the coil (4) is wound or is located outside the area where the coil (4) is wound.
  15. 一种潜望式音圈马达,其特征在于:包括权利要求1-14任一项所述的具有线圈(4)的基座(100)。A periscope voice coil motor, characterized by comprising the base (100) with a coil (4) according to any one of claims 1-14.
  16. 一种制造如权利要求1-14任一项所述的具有线圈的基座的制造方法,其特征在于,包括如下步骤:A method of manufacturing a base with a coil as claimed in any one of claims 1-14, characterized in that it comprises the steps of:
    第一步,在料带上冲压成型若干依次相连的金属电路(1);In the first step, a plurality of metal circuits (1) connected in sequence are stamped and formed on the material tape;
    第二步,在所述金属电路(1)上进行一次注塑成型以形成矩形设置的绝缘底座(2),所述绝缘底座(2)呈水平设置并具有设置于外周的外周侧面(29)及上表面(20);In the second step, an injection molding is performed on the metal circuit (1) to form a rectangular insulating base (2), the insulating base (2) is arranged horizontally and has an outer peripheral side surface (29) arranged on the outer periphery and upper surface (20);
    第三步,在所述绝缘底座(2)的所述上表面(20)电性连接一水平设置的线圈(4),通过表面安装技术将电子元件(5)贴装于所述绝缘底座(2)的所述上表面(20);In the third step, a horizontally arranged coil (4) is electrically connected to the upper surface (20) of the insulating base (2), and electronic components (5) are mounted on the insulating base ( 2) the upper surface (20);
    第四步,在所述金属电路(1)及所述绝缘底座(2)的外围进行二次注塑成型以形成绝缘框(3),所述金属电路(1)同时镶埋成型于所述绝缘底座(2)及所述绝缘框(3),所述绝缘框(3)设有整体封闭包覆在所述绝缘底座(2)的所述外周侧面(29)的且水平设置的框体部(30)及自所述框体部(30)的上表面的四周竖直延伸的竖直部(31);In the fourth step, secondary injection molding is performed on the periphery of the metal circuit (1) and the insulating base (2) to form an insulating frame (3), and the metal circuit (1) is embedded in the insulating frame at the same time. The base (2) and the insulating frame (3), the insulating frame (3) is provided with a frame body part that is integrally enclosed and covered on the outer peripheral side surface (29) of the insulating base (2) and is arranged horizontally (30) and a vertical portion (31) vertically extending from the periphery of the upper surface of the frame portion (30);
    第五步,对连接若干所述金属电路(1)的料带进行裁切,进而形成若干独立完整的基座(100)。The fifth step is to cut the material strips connecting a plurality of the metal circuits (1), thereby forming a plurality of independent and complete bases (100).
  17. 如权利要求16所述的制造具有线圈的基座的制造方法,其特征在于:在第一步中,所述金属电路(1)包括位于同一平面的水平部分及位于所述水平部分外周侧的垂直部分;在第二步中,所述绝缘底座(2)注塑 成型于所述水平部分,所述垂直部分位于所述绝缘底座(2)外;在所述第三步与第四步之间增加一第六步,折弯位于所述绝缘底座(2)外的所述金属电路(1)的所述水平部分和所述垂直部分的连接处以形成一折弯部(194),所述折弯部(194)被注塑成型于所述框体部(30)内。The method for manufacturing a base with coils according to claim 16, characterized in that: in the first step, the metal circuit (1) includes a horizontal portion located on the same plane and a horizontal portion located on the outer peripheral side of the horizontal portion. vertical part; in the second step, the insulating base (2) is injection-molded on the horizontal part, and the vertical part is located outside the insulating base (2); between the third step and the fourth step A sixth step is added, bending the connection between the horizontal part and the vertical part of the metal circuit (1) outside the insulating base (2) to form a bending part (194), the folding The bent portion (194) is injection-molded into the frame portion (30).
  18. 如权利要求17所述的制造具有线圈的基座的制造方法,其特征在于:在第一步中,所述金属电路(1)包括若干水平支路(10)和位于所述水平支路(10)外周的立柱支路(19),若干所述水平支路(10)的一端平行且间隔排布以形成引脚(1a),所述水平支路(10)的另一端的末端排布形成焊脚(1b),所述引脚(1a)与所述焊脚(1b)之间形成连接部(1c),所述立柱支路(19)的一端间隔排布形成呈矩形设置的立柱引脚(19a),所述立柱支路(19)的另一端排布形成与所述焊脚(1b)位于同一平面的立柱焊脚(19b);在所述第六步中,所述焊脚(1b)及所述立柱焊脚(19b)暴露在所述绝缘底座(2)的上表面,所述引脚(1a)暴露在所述框体部(30)的所述上表面(20),所述立柱引脚(19a)暴露在所述竖直部(31)的顶表面(32)。The method for manufacturing a base with coils according to claim 17, characterized in that: in the first step, the metal circuit (1) comprises a number of horizontal branches (10) and a plurality of horizontal branches (10) located in the horizontal branches ( 10) A column branch (19) on the outer periphery, one end of a plurality of the horizontal branches (10) is arranged in parallel and at intervals to form a pin (1a), and the other end of the horizontal branch (10) is arranged at the end Soldering legs (1b) are formed, a connecting portion (1c) is formed between the pins (1a) and the welding legs (1b), and one end of the column branch (19) is arranged at intervals to form a rectangular column A pin (19a), the other end of the column branch (19) is arranged to form a column welding leg (19b) located on the same plane as the welding leg (1b); in the sixth step, the welding The feet (1b) and the post welding feet (19b) are exposed on the upper surface of the insulating base (2), and the pins (1a) are exposed on the upper surface (20) of the frame body (30). ), the upright pins (19a) are exposed on the top surface (32) of the vertical portion (31).
  19. 如权利要求18所述的制造具有线圈的基座的制造方法,其特征在于:在第三步中,所述绝缘底座(2)的上表面对应所述焊脚(1b)的位置处设置向下凹设的焊接凹槽(25),所述焊脚(1b)设置在所述焊接凹槽(25)内。The method for manufacturing a base with a coil according to claim 18, characterized in that: in the third step, the upper surface of the insulating base (2) is set to a position corresponding to the welding leg (1b). A welding groove (25) is provided concavely below, and the welding leg (1b) is arranged in the welding groove (25).
  20. 如权利要求19所述的制造具有线圈的基座的制造方法,其特征在于:在第二步成型所述绝缘底座(2)的过程中,所述绝缘底座(2)上还形成有一对绕线柱(26)和一对定位柱(27),在所述第三步中,所述线圈(4)绕线于所述绕线柱(26)并通过所述定位柱(27)固定所述线圈(4)具有的一对引线端(42)。The method for manufacturing a base with coils according to claim 19, characterized in that: in the process of forming the insulating base (2) in the second step, a pair of windings are further formed on the insulating base (2). A wire post (26) and a pair of positioning posts (27), in the third step, the coil (4) is wound on the wire winding post (26) and fixed to the position by the positioning post (27). The coil (4) has a pair of lead terminals (42).
  21. 一种潜望式音圈马达的制造方法,其特征在于:包括如权利要求16至20任一项中所述的制造具有线圈的基座的制造方法的步骤。A manufacturing method of a periscope voice coil motor, characterized by comprising the steps of manufacturing a base having a coil as described in any one of claims 16 to 20.
PCT/CN2021/102309 2021-04-07 2021-06-25 Base having coil, and periscopic voice coil motor and manufacturing method therefor WO2022213484A1 (en)

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CN113381565B (en) * 2021-06-24 2024-02-09 苏州昀冢电子科技股份有限公司 Base assembly and manufacturing method thereof
CN113394940B (en) * 2021-07-01 2022-04-29 苏州昀冢电子科技股份有限公司 Base assembly, voice coil motor and manufacturing method thereof
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