WO2022211328A1 - Dispositif électronique comprenant un module de capteur - Google Patents

Dispositif électronique comprenant un module de capteur Download PDF

Info

Publication number
WO2022211328A1
WO2022211328A1 PCT/KR2022/003771 KR2022003771W WO2022211328A1 WO 2022211328 A1 WO2022211328 A1 WO 2022211328A1 KR 2022003771 W KR2022003771 W KR 2022003771W WO 2022211328 A1 WO2022211328 A1 WO 2022211328A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
window member
layer
sensor module
area
Prior art date
Application number
PCT/KR2022/003771
Other languages
English (en)
Korean (ko)
Inventor
조정규
윤희웅
조정호
정승재
김용화
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022211328A1 publication Critical patent/WO2022211328A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H05K5/0214—Venting apertures; Constructional details thereof with means preventing penetration of rain water or dust
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/22—Details of telephonic subscriber devices including a touch pad, a touch sensor or a touch detector

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a sensor module.
  • An electronic device may include a display and a sensor module (eg, an optical sensor).
  • the sensor module may sense an external environmental state by using the light transmitted through the display.
  • the display including the color filter blocks light in the infrared or visible ray band, and the recognition rate of the sensor module may be reduced.
  • the ratio of the screen display area of the electronic device may be reduced.
  • an electronic device including a window member and a sensor module capable of acquiring light passing through a printed layer may be provided.
  • an electronic device having an increased ratio of a screen display area of the electronic device may be provided.
  • an electronic device includes a housing, a display at least a portion of which is disposed on the housing, the display including a window member and a display panel disposed under the window member, below the window member and a sensor module disposed in the housing and a printed layer disposed in the housing, wherein the window member includes a first area for transmitting at least a portion of light external to the electronic device to the sensor module, and a first area extending from the first area a second region, the printed layer comprising: a first printed layer disposed under the first region and having a first UV transmittance; and a second disposed under the second region and lower than the first UV transmittance; A second printed layer having UV transmittance may be included.
  • an electronic device includes a housing, a display at least a portion of which is disposed on the housing, the display including a window member and a display panel disposed under the window member, below the window member and a sensor module disposed in the housing and a printed layer disposed in the housing, wherein the window member includes a first area for transmitting at least a portion of light external to the electronic device to the sensor module, and a first area extending from the first area a second region, wherein the printed layer is disposed under the first region and has a 1-1 UV transmittance; It may include a diffuser layer having a high first-two ultraviolet transmittance.
  • An electronic device may include a window member, a printed layer positioned under the window member, and a sensor module capable of receiving light passing through the window member and the printed layer.
  • the printed layer may scatter some of the light that has passed through the window member. By dispersing the light by the printed layer, the viewing angle and recognition rate of the sensor module can be improved.
  • the sensor module may be disposed in an accommodation space that is a non-waterproof area of the electronic device. By disposing the sensor module in the accommodation space, the ratio of the screen display area of the electronic device may be increased.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is a cross-sectional view of a display, in accordance with various embodiments of the present disclosure.
  • FIG. 6 is a schematic diagram of a sensor module, in accordance with various embodiments of the present disclosure.
  • FIG. 7 is a cross-sectional view of an electronic device including a sensor module, according to an embodiment of the present disclosure.
  • FIG 8 is a cross-sectional view of an electronic device including a sensor module according to another embodiment of the present disclosure.
  • FIG. 9 is a top view of an electronic device according to various embodiments of the present disclosure.
  • FIG. 10 is a cross-sectional view taken along line A-A' of FIG. 9 .
  • FIG. 11 is a cross-sectional view taken along the line B-B′ of FIG. 9 .
  • FIG. 12 is a view for explaining a laminated structure of a window member and a printed layer, according to an embodiment of the present disclosure.
  • FIG. 13 is a view for explaining a laminated structure of a window member and a printed layer, according to another embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • a processor 120 e.g, a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 .
  • the connection terminal 178 may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display module 160 ).
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that can be operated independently or together with the main processor 121 .
  • NPU neural processing unit
  • image signal processor sensor hub processor, or communication processor
  • the main processor 121 e.g., a central processing unit or an application processor
  • the secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • image signal processor e.g., image signal processor, sensor hub processor, or communication processor.
  • the main processor 121 and the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN).
  • a telecommunication network such as a computer network (eg, LAN
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • the server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.
  • FIG. 2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure
  • 3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure
  • the electronic device 200 has a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B.
  • a housing 210 including a may refer to a structure that forms part of the front surface 210A of FIG. 2 , the rear surface 210B of FIG. 3 , and the side surfaces 210C.
  • at least a portion of the front surface 210A may be formed by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate).
  • the rear surface 210B may be formed by the rear plate 211 .
  • the back plate 211 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 210C is coupled to the front plate 202 and the rear plate 211 and may be formed by a side bezel structure (or "side member") 218 including a metal and/or a polymer.
  • the back plate 211 and the side bezel structure 218 are integrally formed and may include the same material (eg, glass, a metallic material such as aluminum, or ceramic).
  • the front surface 210A and/or the front plate 202 may be interpreted as a part of the display 220 .
  • the electronic device 200 includes the display 220 , the audio modules 203 , 207 , and 214 (eg, the audio module 170 of FIG. 1 ), and a sensor module (eg, the sensor module of FIG. 1 ). 176 ), camera modules 205 and 206 (eg, camera module 180 of FIG. 1 ), key input device 217 (eg, input module 150 of FIG. 1 ), and connector holes 208 , 209) (eg, the connection terminal 178 of FIG. 1 ).
  • the electronic device 200 may omit at least one of the components (eg, the connector hole 209 ) or additionally include other components.
  • the display 220 may be visually exposed through, for example, a substantial portion of the front plate 202 .
  • the surface (or the front plate 202 ) of the housing 210 may include a screen display area formed as the display 220 is visually exposed.
  • the screen display area may include a front surface 210A.
  • the electronic device 200 includes a recess or opening formed in a portion of the screen display area (eg, the front surface 210A) of the display 220, and the recess or opening and may include at least one or more of an audio module 214, a sensor module (not shown), a light emitting device (not shown), and a camera module 205 aligned with At least one of an audio module 214, a sensor module (not shown), a camera module 205, a fingerprint sensor (not shown), and a light emitting device (not shown) on the rear surface of the screen display area of 220 .
  • an audio module 214 e.g, a sensor module (not shown), a light emitting device (not shown), and a camera module 205 aligned with At least one of an audio module 214, a sensor module (not shown), a camera module 205, a fingerprint sensor (not shown), and a light emitting device (not shown) on the rear surface of the screen display area of 220 .
  • the display 220 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.
  • At least a portion of the key input device 217 may be disposed on the side bezel structure 218 .
  • the audio modules 203 , 207 , and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for a call.
  • the speaker holes 207 and 214 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without the speaker holes 207 and 214 (eg, a piezo speaker).
  • the sensor module may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the sensor module includes, for example, a first sensor module (not shown) (eg, proximity sensor) and/or a second sensor module (not shown) disposed on the front surface 210A of the housing 210 ( e.g. fingerprint sensor).
  • a sensor module (not shown) includes a third sensor module (not shown) (eg, HRM sensor) and/or a fourth sensor module (not shown) (eg, fingerprint sensor) disposed on the rear surface 210B of the housing 210 . ) may be included.
  • the fingerprint sensor may be disposed on the back 210B as well as the front 210A (eg, the display 220 ) of the housing 210 .
  • the electronic device 200 may include a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor (not shown).
  • the camera modules 205 and 206 are, for example, a front camera module 205 disposed on the front side 210A of the electronic device 200 , and a rear camera module disposed on the back side 210B of the electronic device 200 . 206 , and/or a flash 204 .
  • the camera module 205, 206 may include one or more lenses, an image sensor, and/or an image signal processor.
  • Flash 204 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .
  • the key input device 217 may be disposed on the side surface 210C of the housing 210 .
  • the electronic device 200 may not include some or all of the key input devices 217 mentioned above and the not included key input devices 217 may be displayed on the display 220 , such as soft keys. It may be implemented in other forms.
  • a light emitting device may be disposed, for example, on the front surface 210A of the housing 210 .
  • the light emitting device (not shown) may provide, for example, state information of the electronic device 200 in the form of light.
  • the light emitting device may provide, for example, a light source linked to the operation of the front camera module 205 .
  • the light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.
  • the connector holes 208 and 209 are, for example, a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device or an audio signal to/from an external electronic device.
  • a first connector hole 208 that may receive a connector (eg, an earphone jack) for It may include a hole 209 .
  • the first connector hole 208 and/or the second connector hole 209 may be omitted.
  • FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • the electronic device 200 (eg, the electronic device 200 of FIGS. 2 to 3 ) includes a front plate 202 (eg, the front plate 202 of FIG. 2 ) and a display 220 . (eg, the display 220 of FIG. 2 ), a first supporting member 232 (eg, a bracket), a printed circuit board 240 , a battery 250 , and a second supporting member 260 (eg, a rear case) , at least one of the antenna 270 and the rear plate 280 (eg, the rear plate 211 of FIG. 3 ).
  • a front plate 202 eg, the front plate 202 of FIG. 2
  • a display 220 eg, the display 220 of FIG. 2
  • a first supporting member 232 eg, a bracket
  • a printed circuit board 240 e.g, a battery 250
  • a second supporting member 260 eg, a rear case
  • the electronic device 200 may omit at least one of the components (eg, the first support member 232 or the second support member 260 ) or additionally include other components. . At least one of the components of the electronic device 200 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.
  • the first support member 232 may be disposed inside the electronic device 200 and connected to the side bezel structure 231 or may be integrally formed with the side bezel structure 231 .
  • the first support member 232 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support member 232 may have a display 220 coupled to one surface and a printed circuit board 240 coupled to the other surface.
  • the printed circuit board 240 may be equipped with a processor, a memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, a volatile memory or a non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • the interface may, for example, electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 250 is a device for supplying power to at least one component (eg, the camera module 212) of the electronic device 200, for example, a non-rechargeable primary battery; or a rechargeable secondary cell, or a fuel cell.
  • At least a portion of the battery 250 may, for example, be disposed on a substantially same plane as the printed circuit board 240 .
  • the battery 250 may be integrally disposed inside the electronic device 200 , or may be disposed detachably from the electronic device 200 .
  • the second support member 260 (eg, a rear case) may be disposed between the printed circuit board 240 and the antenna 270 .
  • the second support member 260 may include one surface to which at least one of the printed circuit board 240 and the battery 250 is coupled, and the other surface to which the antenna 270 is coupled.
  • the antenna 270 may be disposed between the rear plate 280 and the battery 250 .
  • the antenna 270 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 270 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the antenna 270 may include a coil for wireless charging.
  • an antenna structure may be formed by a part of the side bezel structure 231 and/or the first support member 232 or a combination thereof.
  • the electronic device 200 may include a camera module 212 disposed in a housing (eg, the housing 210 of FIG. 2 ).
  • the camera module eg, the camera module 500 of FIG. 6
  • the camera module is disposed on the first support member 232 , and a subject located in the rear (eg, -Z direction) of the electronic device 200 .
  • It may be a rear camera module (eg, the camera module 212 of FIG. 3 ) capable of acquiring an image of .
  • at least a portion of the camera module 212 may be exposed to the outside of the electronic device 200 through the opening 282 formed in the rear plate 280 .
  • the electronic device 200 illustrated in FIGS. 2 to 4 has a bar type or plate type external appearance, but the present invention is not limited thereto.
  • the illustrated electronic device may be a rollable electronic device or a foldable electronic device.
  • the term "rollable electronic device” means that bending deformation of a display (eg, the display 220 of FIG. 4 ) is possible, so that at least a part is wound or rolled, or a housing (eg, of FIG. 2 ) It may refer to an electronic device that can be accommodated in the housing 210 . According to a user's need, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of the display to the outside.
  • a “foldable electronic device” may refer to an electronic device that can be folded to face two different areas of a display or to face each other or opposite to each other. In general, in a foldable electronic device in a portable state, the display is folded with two different areas facing each other or in opposite directions.
  • the electronic device 200 according to various embodiments disclosed in this document may be interpreted to include not only a portable electronic device such as a smart phone, but also various other electronic devices such as a notebook computer or a camera. .
  • FIG. 5 is a cross-sectional view of a display, in accordance with various embodiments of the present disclosure.
  • the display 220 may include a window member 222 and a display panel 224 .
  • the configuration of the display 220 and the window member 222 of FIG. 5 may be all or partly the same as the configuration of the display 220 and the front plate 202 of FIG. 2 .
  • the window member 222 may be formed to be substantially transparent.
  • an image generated by the display panel 224 or at least a part of the image may be transmitted to the outside of the electronic device 200 through the window member 222 .
  • the display panel 224 may be a liquid crystal display (LCD) or organic light emitting diode (OLED) display. According to an embodiment, the display panel 224 may be interpreted as an organic material layer.
  • the display panel 224 may include an anode 224a, a cathode 224d, an emission material layer (EML) 224b, at least a portion of which is positioned between the anode 224a and the cathode 224d, and a light emitting layer.
  • EML emission material layer
  • PDL pixel define layer
  • TFT thin film transistor
  • the light emitting layer 224b may generate light.
  • the emission layer 224b may be interpreted as an organic emission layer.
  • the pixel defining layer 224c may reduce or prevent an electrical short circuit between the subpixel electrodes of the emission layer 224b.
  • the thin film transistor 224e may adjust the brightness of each pixel.
  • the thin film transistor 224e may control the current transmitted to the pixel of the light emitting layer 224b.
  • the thin film transistor 224e may be interpreted as low temperature polysilicon.
  • the display 220 may include a color filter layer 226 .
  • the color filter layer 226 may be encapsulating with the display panel 224 .
  • the color filter layer 226 includes at least one color pattern 226a, 226b, and a black matrix (BM) region 226c positioned between the color patterns 226, 226b. can do.
  • the color patterns 226a and 226b may selectively transmit one of red, green, and blue light.
  • the black matrix region 226c may block or reduce light transmitted between the respective color patterns 226a and 226b.
  • the display 220 including the display panel 224 and the color filter layer 226 is a sensor module of external light of the electronic device 200 (eg, the sensor module 330 of FIG. 6 ). can be substantially blocked.
  • the color filter layer 226 may substantially prevent transmission of light (eg, visible or infrared light).
  • FIG. 6 is a schematic diagram of a sensor module, in accordance with various embodiments of the present disclosure.
  • the sensor module 330 may acquire external light of the electronic device (eg, the electronic device 200 of FIG. 2 ) using the light receiving unit 331 .
  • the configuration of the sensor module 330 of FIG. 7 may be all or partly the same as that of the sensor module 176 of FIG. 1 .
  • the sensor module 330 includes a light receiving unit 331, a sensor plate 335 (eg, a sensor die) supporting the light receiving unit 331, and the light receiving unit 331 and/or the sensor plate ( It may include a printed circuit board 333 on which the 335 is located, and a sensor housing 337 accommodating the light receiving unit 331 and/or the light emitting unit 339 .
  • a sensor plate 335 eg, a sensor die supporting the light receiving unit 331
  • the light receiving unit 331 and/or the sensor plate It may include a printed circuit board 333 on which the 335 is located, and a sensor housing 337 accommodating the light receiving unit 331 and/or the light emitting unit 339 .
  • the sensor module 330 may be an optical sensor. According to an embodiment, the sensor module 330 may be an illuminance sensor. For example, the sensor module 330 uses the light receiving unit 331 to transmit light passing through a window member (eg, the window member 222 of FIG. 5 ) of the display (eg, the display 220 of FIG. 5 ). At least a portion or at least a portion of the light passing between the window member 222 and the housing (eg, the housing 310 of FIG. 7 ) may be acquired. According to an embodiment, the light receiving unit 331 may be a photodiode or a camera.
  • the sensor module 330 may be a proximity sensor, an iris recognition sensor, or a heart rate measurement (HRM) sensor.
  • the sensor module 330 may include a light emitting unit (eg, an LED) 339 for emitting light to the outside of the electronic device 200 .
  • the light receiving unit 331 may acquire at least a portion of the light emitted from the light emitting unit 339 reflected from the object.
  • the sensor housing 337 and the sensor plate 335 may be coupled using a waterproof member (not shown).
  • FIG. 7 is a cross-sectional view of an electronic device including a sensor module, according to an embodiment of the present disclosure.
  • 8 is a cross-sectional view of an electronic device including a sensor module according to another embodiment of the present disclosure.
  • the electronic device 200 may include a housing 310 , a display 320 , and a sensor module 330 .
  • the configuration of the housing 310 of FIGS. 7 and 8 is all or part the same as the configuration of the housing 210 of FIG. 2
  • the configuration of the display 320 of FIGS. 7 and 8 is the display 220 of FIG. 5 .
  • All or part of the configuration of , the configuration of the sensor module 330 of FIGS. 7 and 8 may be all or partly the same as that of the sensor module 330 of FIG. 6 .
  • the electronic device 200 may include an accommodation space 302 .
  • the accommodation space 302 may be interpreted as an empty space partially surrounded by the housing 310 and the display 320 .
  • the accommodation space 302 may be formed in an open shape at one side.
  • at least a portion of the accommodation space 302 may be interpreted as a non-waterproof area exposed to the outside of the electronic device 200 and into which moisture may be introduced from the outside of the electronic device 200 .
  • the accommodation space 302 may accommodate the sensor module 330 .
  • a mounting space in which the electronic components of the electronic device 200 are disposed may be increased.
  • the housing 310 may include a side bezel structure 312 and a support member 314 capable of supporting the display 320 .
  • the side bezel structure 312 may surround at least a portion of the display 320 and form at least a portion of a side surface of the electronic device 200 (eg, the side surface 210C of FIG. 2 ).
  • the side bezel structure 312 may face a part of the window member 322 (eg, the third surface 322d of FIG. 12 ) in a spaced apart state.
  • the sensor module 330 may be disposed in the housing 310 .
  • the sensor module 330 may be disposed in the accommodation space 302 of the electronic device 200 .
  • the sensor module 330 may acquire external light of the electronic device 200 that has passed through the window member 322 .
  • the sensor module 330 may face at least a portion of the window member 322 .
  • the light receiving unit eg, the light receiving unit 331 of FIG. 6
  • the sensor module 330 may be located below the window member 322 (eg, in the second direction (-Z direction)).
  • the sensor module 330 may include a printed circuit board 333 and a flexible printed circuit board 334 connected to the printed circuit board 333 .
  • the sensor module 330 may be electrically connected to a processor (eg, the processor 120 of FIG. 1 ) through the printed circuit board 333 and/or the flexible printed circuit board 334 .
  • the electronic device 300 may include waterproof members 352 and 354 .
  • the waterproof members 352 and 354 may prevent or reduce moisture or foreign substances transferred from the outside of the electronic device 200 to the receiving space 302 from being transferred to the inside of the electronic device 200 .
  • the waterproof members 352 and 354 may be waterproof tapes or waterproof adhesives (bonding).
  • the sensor module 330 may be inserted into the housing 310 in a first direction (eg, a +Z direction).
  • a first direction eg, a +Z direction
  • the printed circuit board 333 of the sensor module 330 uses the waterproof member 352 (eg, waterproof tape) to the side bezel structure 312 and/or the support member 314 of the housing 310 .
  • the waterproof member 352 eg, waterproof tape
  • the sensor module 330 may be inserted into the housing 310 in the second direction (eg, -Z direction).
  • the sensor module 330 is coupled to the side bezel structure 312 , is positioned between the printed circuit board 333 of the sensor module 330 and the support member 314 , and the flexible printed circuit board 334 .
  • This empty space may be sealed by a waterproof adhesive 354 .
  • the window member 322 includes a central region 322-1 facing a portion of the display 320 (eg, the display panel 224 or the color filter layer 226 of FIG. 6 ) and the central region 322-1.
  • a border region 322 - 2 surrounding at least a portion of the region may be included.
  • at least a portion of the sensor module 330 may be disposed under the edge region 322 - 2 .
  • FIG. 9 is a top view of an electronic device according to various embodiments of the present disclosure
  • FIG. 10 is a cross-sectional view taken along line A-A' of FIG. 9
  • 11 is a cross-sectional view taken along the line B-B′ of FIG. 9 .
  • the electronic device 300 may include a housing 310 , a display 320 , and a window member 322 .
  • the configuration of the housing 310 , the display 320 , and the window member 322 of FIGS. 9 to 11 is the same as the configuration of the housing 310 , the display 320 and the window member 322 of FIGS. 7 and 8 . Or some may be the same.
  • the window member 322 may include a first area 321 and a second area 323 extending from the first area 321 .
  • the first region 321 may face at least a portion of a sensor module (eg, the sensor module 330 of FIG. 7 ).
  • light from the outside of the electronic device 200 may be transmitted to the sensor module 330 located in the accommodation space 302 through the first area 321 .
  • the second region 323 may surround at least a portion of the first region 321 .
  • the first area 321 may be located between the plurality of second areas 323 .
  • the first area 321 and the second area 323 may be interpreted as a part of an edge of the window member 322 facing the housing 310 .
  • the first area 321 and the second area 323 may be located in the edge area of the window member 322 (eg, the edge area 322 - 2 of FIG. 7 ).
  • the electronic device 200 may include printing layers 341 and 346 disposed under the window member 322 (eg, in the -Z direction).
  • the electronic device 200 may have a first printed layer 341 disposed under the first area 321 of the window member 322 , and disposed under the second area 323 of the window member 322 . a second printed layer 346 .
  • the second UV transmittance of the second printed layer 346 is the first UV transmittance (eg, 1-1 UV transmittance or 1-2 UV transmittance) of the first printed layer 341 .
  • the first printing layer 341 may transmit at least a portion of light in the visible ray band and the infrared ray band.
  • the first UV transmittance of the first printed layer 341 may be 5% to 10%.
  • the first printed layer 341 transmits the light that has passed through the first printed layer 341 to the sensor module 330 , and the sensor module 330 or a part of the first printed layer 341 . Visibility of (eg, the anti-view layer 323 of FIG.
  • the second printed layer 346 may reflect at least a portion of light in a visible ray band and an infrared ray band.
  • the second printed layer 346 may be interpreted as a black matrix (BM) coating.
  • the second UV transmittance of the second printed layer 346 may be less than 5%.
  • the second printed layer 346 may have a UV transmittance of substantially 0%.
  • the second printed layer 346 may include at least one printed layer.
  • the second printed layer 346 may include a second-first printed layer 347 disposed under the second region 323 of the window member 322 (eg, a second direction (-Z direction)) and It may include a 2-2 printing layer 348 disposed below the 2-1 printing layer 347 .
  • the first printed layer 341 may include a plurality of printed layers.
  • the first printed layer 341 may include an anti-view layer (eg, 1-1 printed layer) 342 disposed under the first region 321 of the window member 322 and the anti-view layer ( 342) disposed below the diffuser layer (eg, diffuser layer 343).
  • the anti-view layer 342 is a component inside the electronic device 200 (eg, the sensor module 330 or the light scattering layer 343 of FIG. 8 ) to the outside of the electronic device 200 . It may have a 1-1 ultraviolet transmittance for reducing or preventing visual exposure.
  • the 1-1 UV transmittance may be about 5%.
  • the light diffusion layer 343 may disperse or diffuse at least a portion of light transmitted from the outside of the electronic device 200 into the electronic device 200 .
  • the diffuser layer 343 functions as a diffuser, and the viewing angle ( A field of view (FOV) may be greater than a viewing angle of the sensor module 330 that does not include the light scattering layer 343 .
  • the light diffusing layer 343 may have a 1-2 th UV transmittance that is higher than the 1-1 th UV transmittance.
  • the first-second UV transmittance may be about 10%.
  • FIG. 12 is a view for explaining a laminated structure of a window member and a printed layer, according to an embodiment of the present disclosure.
  • 13 is a view for explaining a laminated structure of a window member and a printed layer, according to another embodiment of the present disclosure.
  • the electronic device 200 may include a printed layer 340 disposed on the window member 322 .
  • the configuration of the window member 322 and the printing layer 340 of FIGS. 12 and 13 may be all or partly the same as the configuration of the window member 322 and the printing layers 341 and 346 of FIGS. 9 to 11 . have.
  • the window member 322 may disperse at least a portion of light transmitted from the outside of the electronic device 200 .
  • the window member 322 may include a first surface 322a facing the outside of the electronic device 200 , a second surface 322b opposite to the first surface 322a , and a second surface 322b of the electronic device 200 .
  • the chamfer 322c may be a surface inclined by a specified angle x with respect to the second surface 322b.
  • the chamfer 322c may be interpreted as an inclined plane inclined by more than 0 degrees and less than 90 degrees with respect to the second surface 322b.
  • the window member 322 may include a third surface 322d (eg, a side surface) surrounding at least a portion between the first surface 322a and the second surface 322b. .
  • the third surface 322d may face the side bezel structure (eg, the side bezel structure 312 of FIG. 7 ) of the housing (eg, the housing 310 of FIG. 7 ).
  • the third surface 22d may be a side surface of the window member 322 extending from the chamfer 322c to the first surface 322a.
  • At least a portion of the external light of the electronic device 200 transmitted to the first surface 322a of the window member 322 may be the second surface 322b, the chamfer 322c, or the third surface. It may be transmitted to a sensor module (eg, the sensor module 330 of FIG. 6 ) through at least one of 322d.
  • a sensor module eg, the sensor module 330 of FIG. 6
  • the printing layer 340 may cover at least a portion of the window member 322 .
  • the anti-view layer 342 and the second-first printed layer 347 may be coated or printed on the second surface 322b of the window member 322 .
  • at least a portion of the external light of the electronic device 200 transmitted to the first area (eg, the first area 321 of FIG. 10 ) of the window member 322 may include the window member 322 .
  • the anti-view layer 342 , and the diffuse light layer 343 may be transmitted to a sensor module (eg, the sensor module 330 of FIG. 6 ).
  • the first printed layer 342 may be disposed on the second side 322b and the chamfer 322c.
  • the first printed layer 342 may be the second side It may extend from 322b past the chamfer 322c to an end (eg, third side 322d) of the window member 322.
  • the chamfer 322c of the first printed layer 342 is ), the anti-view layer 342 may reduce or prevent light leakage by reducing the amount of light reflected to the outside of the electronic device 200 .
  • the anti-view layer 342 may be disposed under the window member 322 (eg, in the second direction (-Z direction)).
  • the anti-view layer 342 may include a fourth surface 342a facing the second surface 322b of the window member 322 and a fifth surface 342b opposite to the fourth surface 342a. ) may be included.
  • the anti-view layer 342 may form a first chamfer region 342c extending from the fifth surface 342b and at least a portion between the fourth surface 342a and the fifth surface 342b. It may include an enclosing sixth surface 342d.
  • the first chamfer region 342c may be formed substantially parallel to the chamfer 322c of the window member 322 .
  • the anti-view layer 342 may extend to an end (eg, the third surface 322c) of the window member 322 .
  • the sixth surface 342d may form a substantially same plane as the third surface 322c of the window member 322 .
  • the light diffusing layer 343 may be disposed under the anti-view layer 342 (eg, in the second direction (-Z direction)).
  • the light diffusing layer 343 may include a seventh surface 343a facing the fifth surface 342b of the anti-view layer 342 , and an eighth surface 343b opposite to the seventh surface 343a . ) may be included.
  • the light diffusion layer 343 surrounds at least a portion of the second chamfered region 342c extending from the eighth surface 343b and between the seventh surface 343a and the eighth surface 343b. may include a ninth surface 343d.
  • the second chamfer region 343c may be formed substantially parallel to the chamfer 322c of the window member 322 and/or the first chamfer region 342c of the anti-view layer 342 .
  • the light scattering layer 343 is an end of the window member 322 (eg, the third side 322c) and/or an end of the anti-view layer 342 (eg, the sixth side 342d).
  • the ninth surface 343d may form substantially the same plane as the third surface 322c of the window member 322 and/or the sixth surface 342d of the anti-view layer 342 .
  • a portion of the first printed layer 341 may cover a portion of the second printed layer 346 .
  • the anti-view layer 342 may cover at least a portion of the second printed layer 346 .
  • the anti-view layer 342 may include a portion of the window member 322 (eg, the first area 321 of FIG. 10 ), the second-first printed layer 347 , and/or the second-second printed layer. It may be located below the layer 348 (eg, in the second direction (-Z direction)).
  • the first thickness d1 of the anti-view layer 342 may be thicker than the second thickness d2 of the light diffusion layer 343 .
  • an electronic device (eg, the electronic device 200 of FIG. 2 ) includes a housing (eg, the housing 210 of FIG. 2 ), at least a part of which is a display disposed on the housing. , a display including a window member (eg, the window member 222 of FIG. 5 ), and a display panel disposed below the window member (eg, the display panel 224 of FIG. 5 ) (eg, the display of FIG. 2 ) 220)), a printed layer disposed under the window member (eg, the printed layer 340 of FIG. 12), and a sensor module disposed within the housing (eg, the sensor module 330 of FIG.
  • the window member includes a first area (eg, the first area 321 of FIG. 9 ) for transmitting at least a portion of light external to the electronic device to the sensor module, and a second area extending from the first area ( Example: second area 323 of FIG. 9 ), wherein the printed layer is disposed below the first area and has a first UV transmittance (eg, the first printed layer of FIG. 10 ) 341)), and a second printed layer (eg, the second printed layer 346 of FIG. 10 ) disposed under the second region and having a second UV transmittance lower than the first UV transmittance. .
  • a first area eg, the first area 321 of FIG. 9
  • the window member includes a first area (eg, the first area 321 of FIG. 9 ) for transmitting at least a portion of light external to the electronic device to the sensor module, and a second area extending from the first area ( Example: second area 323 of FIG. 9 ), wherein the printed layer is disposed below the first area and
  • the first printed layer may include an anti-view layer (eg, the anti-view layer 342 of FIG. 10 ) disposed under the first region and having a 1-1 UV transmittance, and the It may include a light-diffusing layer (eg, the light-diffusing layer 343 of FIG. 10 ) disposed under the anti-visual layer and having a 1-2th UV transmittance higher than the 1-1 UV transmittance.
  • an anti-view layer eg, the anti-view layer 342 of FIG. 10
  • the light-diffusing layer eg, the light-diffusing layer 343 of FIG. 10
  • the anti-view layer may cover at least a portion of the second printed layer.
  • a first thickness of the anti-view layer may be thicker than a second thickness of the light diffusion layer.
  • At least a portion of the sensor module may face the first area.
  • an accommodation space partially surrounded by the display and the housing further includes an accommodation space configured to introduce moisture from the outside of the electronic device (eg, the accommodation space 302 of FIG. 6 ). and the sensor module may be disposed in the accommodation space.
  • the display may include a color filter layer (eg, the color filter layer 226 of FIG. 5 ) disposed between at least a portion of the window member and the display panel.
  • a color filter layer eg, the color filter layer 226 of FIG. 5
  • the window member includes a central region 322-1 facing the display panel, and an edge region 322-2 surrounding the central region, wherein the first region and the The second area may be located in the edge area.
  • the electronic device may further include a waterproof member (eg, the waterproof member 352 of FIG. 7 or the waterproof member 354 of FIG. 8 ) disposed between the sensor module and the housing. have.
  • a waterproof member eg, the waterproof member 352 of FIG. 7 or the waterproof member 354 of FIG. 8 .
  • the window member may include a first surface (eg, the first surface 322a of FIG. 12 ) facing the outside of the electronic device, and a second surface (eg, FIG. 12 ) opposite to the first surface. a second side 322b of 12), and a chamfer extending from the second side (eg, chamfer 322c of FIG. 12), wherein the first printed layer is on the second side and the first chamfer can be placed in
  • the housing includes a side bezel structure (eg, the side bezel structure 312 of FIG. 7 ) facing the window member in a spaced apart state, and a support member (eg, FIG. 7 ) supporting the display. 7 support members 314).
  • a side bezel structure eg, the side bezel structure 312 of FIG. 7
  • a support member eg, FIG. 7
  • the window member includes an end facing the side bezel structure (eg, the third side 322d of FIG. 13 ), and the first printed layer extends to the end of the window member can be extended
  • the second printed layer may include a second-first printed layer (eg, a second-first printed layer 347 of FIG. 11 ) disposed below the second region, and the second-second printed layer (347). It may include a 2-2 printing layer (eg, the 2-2 printing layer 348 of FIG. 11 ) disposed below the first printing layer.
  • a second-first printed layer eg, a second-first printed layer 347 of FIG. 11
  • the second-second printed layer 347
  • It may include a 2-2 printing layer (eg, the 2-2 printing layer 348 of FIG. 11 ) disposed below the first printing layer.
  • the sensor module includes a light receiving unit configured to receive external light of the electronic device through the first area (eg, the light receiving unit 331 of FIG. 6 ), and a printed circuit board accommodating the light receiving unit. (eg, the printed circuit board 333 of FIG. 6 ), and a flexible printed circuit board (eg, the flexible printed circuit board 334 of FIG. 7 ) connected to the printed circuit board and the processor of the electronic device.
  • a light receiving unit configured to receive external light of the electronic device through the first area
  • a printed circuit board accommodating the light receiving unit.
  • a flexible printed circuit board eg, the flexible printed circuit board 334 of FIG. 7
  • the sensor module may include at least one of an illuminance sensor, a proximity sensor, an iris recognition sensor, and a heart rate sensor.
  • the electronic device (eg, the electronic device 200 of FIG. 2 ) includes a housing (eg, the housing 210 of FIG. 2 ), at least a part of which is disposed on the housing, and includes a window A display (eg, display 220 of FIG. 5 ) comprising a member (eg, window member 222 of FIG. 5 ), and a display panel disposed below the window member (eg, display panel 224 of FIG. 5 ) ), a printed layer disposed below the window member (eg, the printed layer 340 of FIG. 12 ), and a sensor module disposed within the housing (eg, the sensor module 330 of FIG.
  • a window A display eg, display 220 of FIG. 5
  • a member eg, window member 222 of FIG. 5
  • a display panel disposed below the window member eg, display panel 224 of FIG. 5
  • a printed layer disposed below the window member
  • a sensor module disposed within the housing (eg, the sensor module 330 of
  • the window The member includes a first region (eg, a first region 321 in FIG. 9 ) for transmitting at least a portion of light external to the electronic device to the sensor module, and a second region extending from the first region (eg, a second region) : the second area 323 of FIG. 9 ), wherein the printed layer is disposed under the first area and has a 1-1 ultraviolet transmittance; )), and a diffusing layer (eg, the light diffusing layer 343 of FIG. 10 ) disposed under the anti-visual layer and having a 1-2 th UV transmittance higher than the 1-1 th UV transmittance.
  • a first region eg, a first region 321 in FIG. 9
  • a second region extending from the first region (eg, a second region) : the second area 323 of FIG. 9 ), wherein the printed layer is disposed under the first area and has a 1-1 ultraviolet transmittance; )
  • a diffusing layer eg, the light diffusing layer
  • the printed layer is a second printed layer (eg, the second printed layer of FIG. 11 ) disposed under the second region and having a second UV transmittance lower than the 1-1 UV transmittance. (346)).
  • At least a portion of the sensor module may face the first area.
  • the electronic device is an accommodating space partially surrounded by the display and the housing, and an accommodating space configured to introduce moisture from the outside of the electronic device (eg, the accommodating space 302 of FIG. 7 ). ), and the sensor module may be disposed in the accommodation space.
  • the electronic device may further include a waterproof member (eg, waterproof members 352 and 354 of FIG. 7 or 8 ) disposed between the sensor module and the housing.
  • a waterproof member eg, waterproof members 352 and 354 of FIG. 7 or 8
  • the electronic device including the sensor module described above is not limited by the above-described embodiments and drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications and changes are possible within the technical scope of the present disclosure. It will be clear to those who have knowledge.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Telephone Function (AREA)
  • Telephone Set Structure (AREA)

Abstract

Selon divers modes de réalisation de la présente invention, un dispositif électronique peut comprendre : un boîtier ; un écran, dont au moins une partie est disposée sur le boîtier, et qui comprend un élément de fenêtre et un panneau d'affichage disposé sous l'élément de fenêtre ; une couche d'impression disposée sous l'élément de fenêtre ; et un module de détection disposé dans le boîtier, l'élément de fenêtre comprenant une première zone pour transférer au moins une partie de la lumière à l'extérieur du dispositif électronique vers le module de détection et une seconde zone s'étendant depuis la première zone, et la couche d'impression comprenant une première couche d'impression disposée sous la première zone et ayant une première transmittance UV et une seconde couche d'impression disposée sous la seconde zone et ayant une seconde transmittance UV inférieure à la première transmittance UV.
PCT/KR2022/003771 2021-04-02 2022-03-17 Dispositif électronique comprenant un module de capteur WO2022211328A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210043484A KR20220137419A (ko) 2021-04-02 2021-04-02 센서 모듈을 포함하는 전자 장치
KR10-2021-0043484 2021-04-02

Publications (1)

Publication Number Publication Date
WO2022211328A1 true WO2022211328A1 (fr) 2022-10-06

Family

ID=83459260

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/003771 WO2022211328A1 (fr) 2021-04-02 2022-03-17 Dispositif électronique comprenant un module de capteur

Country Status (2)

Country Link
KR (1) KR20220137419A (fr)
WO (1) WO2022211328A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150043196A (ko) * 2013-10-14 2015-04-22 삼성전기주식회사 터치센서
KR20170105700A (ko) * 2016-03-09 2017-09-20 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
US20190196546A1 (en) * 2017-12-26 2019-06-27 Guangdong Oppo Mobile Telecommunications Corp Ltd. Electronic device
KR20190112223A (ko) * 2018-03-22 2019-10-04 삼성디스플레이 주식회사 표시 장치
KR20210012316A (ko) * 2019-07-24 2021-02-03 삼성전자주식회사 광학 센서 모듈을 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150043196A (ko) * 2013-10-14 2015-04-22 삼성전기주식회사 터치센서
KR20170105700A (ko) * 2016-03-09 2017-09-20 삼성디스플레이 주식회사 표시 장치 및 휴대용 단말기
US20190196546A1 (en) * 2017-12-26 2019-06-27 Guangdong Oppo Mobile Telecommunications Corp Ltd. Electronic device
KR20190112223A (ko) * 2018-03-22 2019-10-04 삼성디스플레이 주식회사 표시 장치
KR20210012316A (ko) * 2019-07-24 2021-02-03 삼성전자주식회사 광학 센서 모듈을 포함하는 전자 장치

Also Published As

Publication number Publication date
KR20220137419A (ko) 2022-10-12

Similar Documents

Publication Publication Date Title
WO2020171448A1 (fr) Structure d'agencement de composant électronique et dispositif électronique comprenant une telle structure
WO2022119164A1 (fr) Appareil électronique comprenant un évent
WO2022215904A1 (fr) Dispositif électronique comprenant un câblage en boucle
WO2022169163A1 (fr) Composant acoustique, et dispositif électronique le comprenant
WO2022154308A1 (fr) Dispositif électronique comportant un connecteur
WO2022211328A1 (fr) Dispositif électronique comprenant un module de capteur
WO2022203336A1 (fr) Dispositif électronique comprenant un trou de microphone ayant une forme de fente
WO2022075639A1 (fr) Dispositif électronique comprenant une antenne
WO2021010722A1 (fr) Dispositif électronique comprenant une antenne
WO2022149753A1 (fr) Dispositif électronique comprenant un module de microphone
WO2024063377A1 (fr) Dispositif électronique comprenant un écran d'affichage positionné sur une caméra
WO2022197155A1 (fr) Dispositif électronique comprenant une carte de circuit imprimé souple
WO2024029683A1 (fr) Dispositif électronique ayant une structure dans laquelle une caméra est placée sous un écran
WO2022119298A1 (fr) Couvercle arrière et dispositif électronique le comprenant
WO2024090886A1 (fr) Dispositif électronique comprenant un circuit de communication et un connecteur
WO2022080712A1 (fr) Module de haut-parleur et dispositif électronique comprenant un module de haut-parleur
WO2024048921A1 (fr) Dispositif électronique comprenant une carte de circuit imprimé souple à touche latérale
WO2024034964A1 (fr) Structure d'antenne et dispositif électronique comprenant une structure d'antenne
WO2022092754A1 (fr) Dispositif électronique comprenant une pluralité de caméras
WO2024085602A1 (fr) Carte de relais
WO2022203300A1 (fr) Boîtier ayant un élément de ventilation disposé à l'intérieur de celui-ci, et dispositif électronique le comprenant
WO2022231137A1 (fr) Dispositif électronique comportant une structure étanche à l'eau
WO2022203364A1 (fr) Dispositif électronique comprenant un boîtier comprenant une marque de repère et son procédé de fabrication
WO2023058977A1 (fr) Antenne et dispositif électronique la comprenant
WO2022025657A1 (fr) Plaque de couvercle pour dispositif électronique et son procédé de fabrication

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22781448

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22781448

Country of ref document: EP

Kind code of ref document: A1