WO2022206063A1

WO2022206063A1 - Temperature control apparatus and method in semiconductor process device

Info

Publication number: WO2022206063A1
Application number: PCT/CN2021/142223
Authority: WO
Inventors: 徐晶晶
Original assignee: 北京北方华创微电子装备有限公司
Priority date: 2021-03-31
Filing date: 2021-12-28
Publication date: 2022-10-06
Also published as: TW202240765A; CN113013071B; CN113013071A; TWI815264B

Abstract

The present application provides a temperature control apparatus and method in a semiconductor process device. The temperature control apparatus comprises a first temperature control source, a second temperature control source, a first output pipe, a second output pipe, a first return pipe, a second return pipe, a first short-circuit pipe, a second short-circuit pipe and a controller. Output ports of the two temperature control sources respectively communicate with inlets of chucks by means of the two output pipes, and return ports of the two temperature control sources respectively communicate with outlets of the chucks by means of the two return pipes; the output ports of the two temperature control sources also communicate with respective return ports thereof by means of the two short-circuit pipes; each pipe is provided with an on-off switch; and the controller is used to sequentially communicate or disconnect a plurality of on-off switches in chronological order, and to switch the communication between the chuck and the two temperature control sources, and the temperature of temperature control mediums in the two temperature control sources is different. Applying the present application may improve the temperature control range, shorten the temperature control time, and effectively solve the problem of fluid cross-mixing in two temperature control sources.

Description

Temperature control device and method in semiconductor process equipment

technical field

The present invention relates to the technical field of semiconductors, and in particular, to a temperature control device and method in a semiconductor process equipment.

Background technique

The ESC (Electrostatic Adsorption Chuck) in the etching machine is mainly used for the adsorption and fixation of the wafer (wafer) and the precise temperature required for the process. The interior of the ESC is usually provided with a heat exchange channel, and cooling/heating liquid or gas is introduced into the heat exchange channel through a temperature control device to precisely adjust the temperature of the ESC, thereby realizing the temperature control of the wafer.

However, with the continuous development of the semiconductor industry and etching process, during the etching process of the wafer, different process steps may need to use different temperatures, and the temperature difference is large, and the existing single-channel ESC temperature adjustment method is difficult to guarantee. Uniformity and timeliness of temperature switching. However, the existing dual-channel ESC temperature adjustment method is prone to the problem of liquid string.

SUMMARY OF THE INVENTION

The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a temperature control device and method in a semiconductor process equipment, which can improve the temperature control range, shorten the temperature control time, and effectively solve the two temperature control The problem of fluid cross-mixing in the source.

In order to achieve the purpose of the present invention, a first aspect provides a temperature control device in a semiconductor process equipment for controlling the temperature of a chuck in the semiconductor process equipment, which includes a first temperature control source, a second temperature control source, a first output pipeline, a second output pipeline, a first return pipeline, a second return pipeline, a first short-circuit pipeline, a second short-circuit pipeline, and a controller, wherein;

The output port of the first temperature control source is communicated with the inlet of the chuck through the first output pipe, and the return port of the first temperature control source is connected with the outlet of the chuck through the first return pipe connected;

The output port of the second temperature control source is communicated with the inlet of the chuck through the second output pipe, and the return port of the second temperature control source is connected with the outlet of the chuck through the second return pipe connected;

The output port of the first temperature control source communicates with the return port of the first temperature control source through the first short-circuit pipe, and the output port of the second temperature control source communicates with the second temperature control source through the second short-circuit pipe. The return port of the second temperature control source is connected;

The first output pipeline, the second output pipeline, the first return pipeline, the second return pipeline, the first short-circuit pipeline, and the second short-circuit pipeline are all provided with on-off switches;

The controller is used for connecting or disconnecting a plurality of the on-off switches in chronological order, and switching the chuck from being connected to the first temperature control source to being connected to the second temperature control source, or The chuck is switched from being communicated with the second temperature control source to being communicated with the first temperature control source, and the temperature of the temperature control medium in the first temperature control source is the same as the temperature in the second temperature control source. The temperature of the control medium is different.

Optionally, the temperature control device further includes a chuck inlet pipe and a chuck outlet pipe, and both the first output pipe and the second output pipe are connected to the chuck through the chuck inlet pipe. The inlet of the disc is communicated, a flow meter is provided on the pipeline at the inlet end of the chuck, and both the first return pipeline and the second return pipeline are communicated with the outlet of the chuck through the pipeline at the outlet end of the chuck.

Optionally, the first output pipe is provided with a first on-off switch, the first return pipe is provided with a second on-off switch, and the second output pipe is provided with a third on-off switch, so A fourth on-off switch is arranged on the second return pipeline, a fifth on-off switch is arranged on the first short-circuit pipeline, and a sixth on-off switch is arranged on the second short-circuit pipeline;

The first on-off switch, the second on-off switch, and the sixth on-off switch are connected, and the third on-off switch, the fourth on-off switch, and the fifth on-off switch are off When turned on, the chuck communicates with the first temperature control source;

The first on-off switch, the second on-off switch, and the sixth on-off switch are off, and the third on-off switch, the fourth on-off switch, and the fifth on-off switch When connected, the chuck communicates with the second temperature control source.

Optionally, the first on-off switch, the second on-off switch and the sixth on-off switch are normally open switches, the third on-off switch, the fourth on-off switch and the The fifth on-off switch is a normally closed switch.

Optionally, the controller is configured to turn the fifth on and off in chronological order when switching the chuck from being connected to the first temperature control source to being connected to the second temperature control source. The switch is connected, the first on-off switch is disconnected, the third on-off switch is connected, the sixth on-off switch is disconnected, the fourth on-off switch is connected, and the third on-off switch is connected. Two on-off switches are disconnected.

Optionally, the controller is configured to turn on and off the sixth temperature control source in chronological order when switching the chuck from being connected to the second temperature control source to being connected to the first temperature control source. The switch is connected, the third on-off switch is disconnected, the first on-off switch is connected, the fifth on-off switch is disconnected, the second on-off switch is connected, and the first on-off switch is connected. The four-way switch is disconnected.

In order to achieve the object of the present invention, another aspect provides a temperature control method in a semiconductor process equipment, which is applied to the temperature control device of the first aspect, and the method includes:

When the chuck is switched from being communicated with the first temperature control source to being communicated with the second temperature control source, or the chuck is switched from being communicated with the second temperature control source to being communicated with the first temperature control source. When a temperature control source is connected, a plurality of the on-off switches are connected or disconnected in chronological order.

The switching of the chuck from being communicated with the first temperature control source to being communicated with the second temperature control source includes:

In chronological order, the fifth on-off switch is connected, the first on-off switch is disconnected, the third on-off switch is connected, the sixth on-off switch is disconnected, and the The fourth on-off switch is connected, and the second on-off switch is disconnected.

The switching of the chuck from being communicated with the second temperature control source to being communicated with the first temperature control source includes:

In chronological order, the sixth on-off switch is connected, the third on-off switch is disconnected, the first on-off switch is connected, the fifth on-off switch is disconnected, and the The second on-off switch is connected, and the fourth on-off switch is disconnected.

Optionally, when connecting or disconnecting a plurality of the on-off switches in sequence, the time interval between two adjacent connecting or disconnecting operations is 0-2 seconds.

The present invention has the following beneficial effects:

In the technical scheme of the temperature control device and method in the semiconductor process equipment provided by the present invention, the temperature control device includes a first temperature control source and a second temperature control source, and by making the temperature of the temperature control medium of the two temperature control sources different, Different temperature control functions can be realized (one heating and one cooling, or the degree of heating or cooling is different, etc.), so that the temperature control time can be shortened, the temperature control range can be expanded, and the controller of the temperature control device can control multiple on-off The switches are connected or disconnected in chronological order, so as to switch the chuck from being connected to the first temperature control source to being connected to the second temperature control source, or to switch the chuck from being connected to the second temperature control source to being connected to the first temperature control source. The temperature control source is connected, that is, the switching of two temperature control sources is realized, so that different wafer temperature control requirements of different processes or steps can be realized. At the same time, because multiple on-off switches are connected or disconnected in chronological order. , Compared with the simultaneous operation of multiple on-off switches, it can not only avoid the serial mixing of temperature control media with different temperatures and affect the temperature of the temperature control medium, thereby ensuring the temperature control accuracy, but also avoid the serial mixing of temperature control media. As a result, the liquid level in the pipeline is abnormal, which in turn causes the phenomenon of shutdown, thereby ensuring the normal and stable operation of the temperature control device.

Description of drawings

FIG. 1 is a schematic structural diagram of a temperature control device in a semiconductor process equipment provided in this embodiment;

2 is a block flow diagram of switching from a low temperature cooling source to a high temperature cooling source adopted by the temperature control method in the semiconductor process equipment provided by the present embodiment;

FIG. 3 is a block flow diagram of switching from a high temperature cooling source to a low temperature cooling source used in the temperature control method in the semiconductor process equipment provided in this embodiment.

Detailed ways

The application is described in detail below, and examples of embodiments of the application are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies are omitted if they are not necessary for illustrating features of the present application. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but not to be construed as a limitation on the present application.

It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in a general dictionary, should be understood to have meanings consistent with their meanings in the context of the prior art and, unless specifically defined as herein, should not be interpreted in idealistic or overly formal meaning to explain.

It will be understood by those skilled in the art that the singular forms "a," "an," and "the" as used herein can include the plural forms as well, unless expressly stated otherwise. It will be understood that when we refer to an element as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Furthermore, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combination of one or more of the associated listed items.

The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems will be described in detail below with reference to the accompanying drawings with specific embodiments.

Referring to FIG. 1 , the present embodiment provides a temperature control device in a semiconductor process equipment for controlling the temperature of a chuck 40 in the semiconductor process equipment, thereby indirectly controlling the temperature of the wafer carried by the chuck 40 . For example, electrostatic chucks. The temperature control device includes a first temperature control source 11, a second temperature control source 12, a first output pipeline 21, a second output pipeline 23, a first return pipeline 22, a second return pipeline 24, a first short-circuit pipeline 25, and a first Two short-circuit pipes 26 and a controller (not shown in the figure).

The output port of the first temperature control source 11 is communicated with the inlet of the chuck 40 through the first output pipe 21 , and the return port of the first temperature control source 11 is communicated with the outlet of the chuck 40 through the first return pipe 22 . The output port of the first temperature control source 11 is also communicated with the return port of the first temperature control source 11 through the first short-circuit pipe 25 .

The output port of the second temperature control source 12 is communicated with the inlet of the chuck 40 through the second output pipe 23 , and the return port of the second temperature control source 12 is communicated with the outlet of the chuck 40 through the second return pipe 24 . The output port of the second temperature control source 12 is also communicated with the return port of the second temperature control source 12 through the second short-circuit pipe 26 .

The first output pipeline 21 , the second output pipeline 23 , the first return pipeline 22 , the second return pipeline 24 , the first short-circuit pipeline 25 , and the second short-circuit pipeline 26 are all provided with on-off switches.

The controller is used to connect or disconnect a plurality of on-off switches in chronological order, to switch the chuck 40 from being connected to the first temperature control source 11 to being connected to the second temperature control source 12, or to connect the chuck 40 from the first temperature control source 11 to the second temperature control source 12. The second temperature control source 12 is switched to communicate with the first temperature control source 11 , and the temperature of the temperature control medium in the first temperature control source 11 is different from the temperature of the temperature control medium in the second temperature control source 12 .

The so-called connecting or disconnecting multiple on-off switches in chronological order means that the operations of connecting or disconnecting the multiple on-off switches are performed sequentially in chronological order, not simultaneously.

The above-mentioned chuck 40 is provided with a heat exchange channel (not shown in the figure), and both ends of the heat exchange channel are the inlet and the outlet of the chuck 40 .

Wherein, the first temperature control source 11 and the second temperature control source 12 can be both heating sources and cooling sources. The ranges are different to be able to meet different wafer temperature control needs for different processes or steps. Alternatively, one of the first temperature control source 11 and the second temperature control source 12 may be a heating source, and the other may be a cooling source. The first temperature control source 11 and the second temperature control source 12 may be a liquid phase temperature control source or a gas phase temperature control source, that is, the temperature control medium may be a liquid or a gas, which are not specifically limited in this embodiment. .

By making the temperature of the temperature control medium of the two temperature control sources different, different temperature control functions (one for heating and one for cooling, or different degrees of heating or cooling, etc.) can be used to shorten the temperature control time and expand the temperature control range. Moreover, the controller of the temperature control device can control a plurality of on-off switches to be connected or disconnected in chronological order, so as to realize that the chuck is switched from being connected with the first temperature control source 11 to being connected with the second temperature control source 12, or The chuck 40 is switched from being communicated with the second temperature control source 12 to being communicated with the first temperature control source 11, that is, switching between the two temperature control sources is realized, so that different wafer temperature control requirements for different processes or steps can be realized, and at the same time Since multiple on-off switches are connected or disconnected in chronological order, compared with the simultaneous operation of multiple on-off switches, it can not only avoid the serial mixing of temperature control media with different temperatures, but also affect the temperature control media. This ensures the accuracy of temperature control, and can also avoid abnormal liquid level in the pipeline caused by the mixing of temperature control media, which will cause shutdowns, thus ensuring the normal and stable operation of the temperature control device.

Wherein, the first temperature control source 11, the first output pipe 21, the first return pipe 22 and the chuck 40 can form a first loop, and the first loop can make the temperature control medium of the first temperature control source 11 at the first temperature Circulating flow between the control source 11 and the chuck 40; the second temperature control source 12, the second output pipe 23, the second return pipe 24 and the chuck 40 can form a second loop, which can make the second temperature control The temperature control medium of the source 12 circulates between the second temperature control source 12 and the chuck 40, and the first circuit and the second circuit are arranged in parallel. The first short-circuit pipe 25 and the first temperature control source 11 form a third circuit, and the third circuit can make the temperature control medium of the first temperature control source 11 directly return to the first temperature control source 11 without passing through the chuck 40 , and the third circuit The loop is arranged in parallel with the first loop; the second short-circuit pipe 26 and the second temperature control source 12 form a fourth loop, and the fourth loop can make the temperature control medium of the second temperature control source 12 directly return to the first loop without passing through the chuck 40 Two temperature control sources 12, the fourth loop and the second loop are arranged in parallel. By connecting or disconnecting multiple on-off switches in sequence in time, the controller can selectively connect or disconnect the above four loops to switch two temperature control sources, so that different crystals in different processes or steps can be realized. Therefore, the temperature adjustment range of the chuck 40 can be increased and the temperature adjustment accuracy can be improved.

In some optional embodiments, the temperature control device may further include a chuck inlet pipe 27 and a chuck outlet pipe 28, and both the first output pipe 21 and the second output pipe 23 pass through the chuck inlet pipe The pipeline 27 is communicated with the inlet of the chuck 40, a flow meter 50 is provided on the pipeline 27 at the inlet end of the chuck, and the first return pipeline 22 and the second return pipeline 24 pass through the pipeline 28 at the outlet end of the chuck and the outlet of the chuck 40. Connected. Since the temperature control medium in the first output pipe 21 and the second output pipe 23 needs to enter the chuck 40 through the chuck inlet pipe 27 , the flow rate of the temperature control medium in the chuck inlet pipe 27 is limited. It can reflect whether the flow state of the temperature control medium is abnormal. Therefore, by setting the flow meter 50 on the pipeline 27 at the inlet end of the chuck, it can be used to detect the flow state of the temperature control medium in the pipeline 27 at the inlet end of the chuck, so that the flow state of the temperature control medium in the pipeline 27 at the inlet end of the chuck can be detected in time It is possible to know whether the flow state of the temperature control medium is abnormal, so as to prevent the chuck 40 from burning out due to no liquid flowing through it for a long time, and to prevent the temperature control medium flow in the chuck inlet pipe 27 and the chuck outlet pipe 28 from being too large. , causing safety hazards, etc.

In a specific implementation of this embodiment, the first output pipe 21 is provided with a first on-off switch 31 , the first return pipe 22 is provided with a second on-off switch 32 , and the second output pipe 23 is provided with a third on-off switch 32 . The on-off switch 33 , the fourth on-off switch 34 is provided on the second return pipe 24 , the fifth on-off switch 35 is provided on the first short-circuit pipe 25 , and the sixth on-off switch 36 is provided on the second short-circuit pipe 26 . In this way, the connection and disconnection of each pipeline can be controlled by controlling the on-off switch of the above-mentioned on-off switch, so as to improve the safety, stability and automation degree of the temperature control device. Wherein, each on-off switch can be, but is not limited to, a solenoid valve (as long as it can be controlled by a controller), so that the on-off switch can be precisely controlled by the controller.

The controller can respectively control the first on-off switch 31 , the second on-off switch 32 , the second on-off switch 32 , the The third on-off switch 33 , the fourth on-off switch 34 , the fifth on-off switch 35 and the sixth on-off switch 36 are connected and disconnected. The above-mentioned first control signal, second control signal, third control signal, fourth control signal, fifth control signal and sixth control signal can all be digital signals, such as 0 and 1. When the control signal is 0, it is the same as the The on-off switch corresponding to the control signal is turned off; when the control signal is 1, the on-off switch corresponding to the control signal is connected, so that the above-mentioned first control signal, second control signal, third control signal, and fourth control signal Any one of the control signal, the fifth control signal, and the sixth control signal can be switched between 0 and 1 to realize the switching of the corresponding on-off switch between off and on.

In addition, some of the above six on-off switches may be normally open switches (that is, the initial state is the off state), and some may be normally closed switches (that is, the initial state is the on-state), for example, the first on-off switch 31. The second on-off switch 32 and the sixth on-off switch 36 are normally open switches, and the third on-off switch 33, the fourth on-off switch 34 and the fifth on-off switch 35 are normally closed switches. In this case, for the normally closed switch, the normally closed switch can be controlled to switch to the off state by making the control signal 0; for the normally open switch, the normally open switch can be controlled to switch to the ON state by making the control signal 1 state.

In a specific implementation of this embodiment, when the first temperature control source 11 needs to be used to control the temperature of the chuck 40, that is, the above-mentioned first loop and fourth loop need to be connected, and the second loop and the first loop need to be disconnected. Three loops, in this case, the controller controls the first on-off switch 31, the second on-off switch 32 and the sixth on-off switch 36 to connect, the third on-off switch 33, the fourth on-off switch 33 and the fourth on-off switch 33 respectively through corresponding control signals. The off switch 34 and the fifth on-off switch 35 are turned off, so that the first temperature control source 11 is communicated with the chuck 40 . When the second temperature control source 12 needs to be used to control the temperature of the chuck 40, that is, the above-mentioned second loop and third loop need to be turned on, and the first loop and the fourth loop need to be turned off. In this case, the control The controller controls the first on-off switch 31, the second on-off switch 32 and the sixth on-off switch 36 to turn off, the third on-off switch 33, the fourth on-off switch 34 and the fifth on-off switch respectively through the corresponding control signal 35 is connected to make the second temperature control source 12 communicate with the chuck 40 .

When switching from using the first temperature control source 11 to control the temperature of the chuck 40 to using the second temperature control source 12 to control the temperature of the chuck 40, the controller can sequentially control the fifth on-off switch 35 to connect, connect, and connect in a chronological order. The first on-off switch 31 is controlled to be off, the third on-off switch 33 is controlled to be connected, the sixth on-off switch 36 is controlled to be off, the fourth on-off switch 34 is controlled to be connected and the second on-off switch 32 is controlled to be off.

When switching from using the second temperature control source 12 to cool the chuck 40 to using the first temperature control source 11 to cool the chuck 40 , the sixth on-off switch 36 is controlled to be connected and the third on-off switch is controlled in chronological order. The switch 33 turns off, controls the first on-off switch 31 to turn on, controls the fifth on-off switch 35 to turn off, controls the second on-off switch 32 to turn on, and controls the fourth on-off switch 34 to turn off.

Further, the controller controls the first on-off switch 31 , the second on-off switch 32 , the third on-off switch 33 , the fourth on-off switch 34 , the fifth on-off switch 35 and the sixth on-off switch 35 based on the above time sequence. When the switch 36 is connected or disconnected, there is a delay interval between the operations of connecting or disconnecting any two adjacent on-off switches in the time sequence, and the delay interval is 0-2 seconds. The delay interval between the operations of connecting or disconnecting two adjacent on-off switches may be different or the same. By setting the above delay interval, on the one hand, it can ensure that the temperature control medium in the chuck 40 flows continuously when the two temperature control sources are switched, thereby protecting the chuck 40 from being burned out. On the other hand, it can ensure that the residual temperature control medium currently circulating in the pipeline can be completely returned to avoid the mixing of the temperature control medium residual with the newly inflowing temperature control medium, causing the temperature control medium of different temperatures to mix; at the same time, it can also avoid Since the on-off switch is turned on at the same time, the flow rates of the two temperature control media with different temperatures entering the chuck 40 at the same time are relatively large, thereby effectively preventing the temperature control media with different temperatures from being mixed together.

During the semiconductor process, when other heat sources are used to heat the chuck, the chuck may be locally heated (or the locally heated temperature needs to be controlled at a lower temperature). The temperature control device in the semiconductor process equipment provided by the embodiment controls the temperature of the chuck. For example, the first temperature control source 11 may be a low temperature cooling source, the second temperature control source 12 may be a high temperature cooling source, and the low temperature cooling source provides The temperature of the cooling medium is lower than the temperature of the cooling medium provided by the high-temperature cooling source, so as to reduce the temperature of the part of the chuck that is heated more locally, so that the overall heating of the chuck can be more uniform.

In this embodiment, the first on-off switch 31 , the second on-off switch 32 and the sixth on-off switch 36 are all normally open switches (eg, normally open two-position two-way valve), and the third on-off switch 33 , The fourth on-off switch 34 and the fifth on-off switch 35 are both normally closed switches (eg, normally closed two-position two-way valve). The first control signal, the second control signal and the sixth control signal corresponding to the first on-off switch 31 , the second on-off switch 32 and the sixth on-off switch 36 respectively are configured as: when all are 0, the first on-off switch The switch 31 , the second on-off switch 32 and the sixth on-off switch 36 are all connected, and the third on-off switch 33 , the fourth on-off switch 34 and the fifth on-off switch 35 are all off; The on-off switch 31 , the second on-off switch 32 and the sixth on-off switch 36 are all off, and the third on-off switch 33 , the fourth on-off switch 34 and the fifth on-off switch 35 are all connected.

Based on the same concept of the temperature control device in the above-mentioned semiconductor process equipment, the present embodiment also provides a temperature control method in the semiconductor process equipment, which is applied to the temperature control device in any of the above embodiments, and the method includes:

When the chuck 40 is switched from being communicated with the first temperature control source 11 to being communicated with the second temperature control source 12, or when the chuck 40 is being switched from being communicated with the second temperature control source 12 to being communicated with the first temperature control source 11 , connect or disconnect a plurality of on-off switches in chronological order.

In the specific implementation of this embodiment, the first output pipe 21 is provided with a first on-off switch 31 , the first return pipe 22 is provided with a second on-off switch 32 , and the second output pipe 23 is provided with a third on-off switch 32 . The on-off switch 33 , the fourth on-off switch 34 is provided on the second return pipe 24 , the fifth on-off switch 35 is provided on the first short-circuit pipe 25 , and the sixth on-off switch 36 is provided on the second short-circuit pipe 26 .

Switching the chuck 40 from being connected with the first temperature control source 11 to being connected with the second temperature control source 12 includes: sequentially connecting the fifth on-off switch 35 , disconnecting the first on-off switch 31 , and connecting the third on-off switch 31 . The off switch 33 is turned on, the sixth on-off switch 36 is turned off, the fourth on-off switch 34 is turned on, and the second on-off switch 32 is turned off.

Switching the chuck 40 from being connected to the second temperature control source 12 to being connected to the first temperature control source 11 includes: sequentially connecting the sixth on-off switch 36 and disconnecting the third on-off switch 33 in chronological order, The first on-off switch 31 is turned on, the fifth on-off switch 35 is turned off, the second on-off switch 32 is turned on, and the fourth on-off switch 34 is turned off.

In another specific implementation of this embodiment, there is a delay interval between the operations of connecting or disconnecting any two adjacent on-off switches in the above-mentioned time sequence, and the delay interval is 0-2 seconds.

The specific control process and principle will be described below through a specific embodiment.

1. Common state (using a low temperature cooling source (ie, the first temperature control source 11) to cool the chuck 40):

At this time, the control signals of all the on-off switches are 0, the first on-off switch 31, the second on-off switch 32 and the sixth on-off switch 36 are all connected, the first loop and the fourth loop are in the path, and the third on-off switch 31 is connected. The off switch 33 , the fourth on-off switch 34 and the fifth on-off switch 35 are off, the second circuit and the third circuit are off, and the low-temperature cooling medium passes through the first on-off switch 31 and flows through the flowmeter in sequence along the corresponding pipeline 50 and chuck 40, and then return to the low temperature cooling source through the second on-off switch 32. That is, at this time, the low-temperature cooling medium circulates and cools between the chuck and the low-temperature cooling source, while the high-temperature cooling medium forms self-circulation through the sixth on-off switch 36 (the chuck is not cooled).

2. The process of switching from a low temperature cooling source to a high temperature cooling source (on the basis of the above common state), as shown in Figure 2:

In the first step S1, the fifth control signal is set to 1, and the other control signals are kept as 0. At this time, the fifth on-off switch 35 is connected, and the third loop is connected. That is, the first on-off switch 31 , the second on-off switch 32 , the fifth on-off switch 35 and the sixth on-off switch 36 are all connected, and the first loop, the third loop and the fourth loop are all connected; The disconnect switch 33 and the fourth on-off switch 34 are disconnected, and the second circuit is disconnected. In this case, a part of the low-temperature cooling medium forms a self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located, and the other part of the low-temperature cooling medium forms a self-circulation. The cooling medium enters the chuck 40 through the first output pipe 21 where the first on-off switch 31 is located, and the chuck inlet pipe 27 where the flow meter 50 is located, and then passes through the chuck outlet pipe 28 and the second on-off pipe in sequence. The first return line 22 where the switch 32 is located returns to the low-temperature cooling source (ie, the first temperature control source 11 ), and the low-temperature cooling medium circulates and cools between the chuck 40 and the low-temperature cooling source. At this time, the high-temperature cooling medium passes through the sixth passage. The second short-circuit pipe 26 where the disconnect switch 36 is located forms a self-circulation, and the high and low temperature cooling medium will not be mixed. Preferably, the second step can be performed after the first step with a delay of 0.5S, that is, after the fifth control signal is set to 1, the next control signal is set after a delay of 0.5S.

In the second step S2, the first control signal is set to 1, the fifth control signal is kept as 1, and the other control signals are kept as 0. At this time, the first on-off switch 31 is turned off, and the low-temperature cooling medium cannot be connected through the first output pipe 21. to the chuck 40, and the fifth on-off switch 35, the second on-off switch 32, and the sixth on-off switch 36 are all connected, and the third on-off switch 33 and the fourth on-off switch 34 are all off, in this case In the first step S1 Continue to flow on the basis of the flow meter 50, that is, after entering the chuck 40 through the chuck inlet pipe 27 where the flow meter 50 is located, it will pass through the chuck outlet pipe 28 and the first return pipe where the second on-off switch 32 is located. 22 returns to the low-temperature cooling source (ie, the first temperature control source 11), and this part of the low-temperature cooling medium continues to flow in the circulating cooling circuit between the chuck and the low-temperature cooling source. At this time, the high-temperature cooling medium still passes through the sixth on-off. The second short-circuit pipe 26 where the switch 36 is located forms a self-circulation, and the high and low temperature cooling medium will not be mixed. Preferably, the following third step can be performed after the second step with a delay of 0.4S, that is, after the first control signal is set to 1, the next control signal is set after a delay of 0.4S.

In the third step S3, the third control signal is set to 1, the fifth control signal and the first control signal are kept at 1, and the other control signals are kept at 0. At this time, the third on-off switch 33 is turned on, and the high-temperature cooling medium can be The second output pipe 23 leads to the chuck 40, and the fifth on-off switch 35, the second on-off switch 32 and the sixth on-off switch 36 are all connected, and the first on-off switch 31 and the fourth on-off switch 34 are off In this case, most of the low-temperature cooling medium forms self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located, and a small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 before the second step The medium continues to flow on the basis of the second step S2. At this time, most of the high-temperature cooling medium forms self-circulation through the second short-circuit pipe 26 where the sixth on-off switch 36 is located, and a small part of the high-temperature cooling medium sequentially passes through the third on-off switch 33. The second output pipeline 23 where the flowmeter 50 is located, and the inlet end pipeline 27 of the chuck where the flow meter 50 is located enter the chuck 40. Because this part of the pipeline is relatively long, and before the second step, it has flowed through the small hole of the first on-off switch 31. Part of the low-temperature cooling medium has flowed out of the chuck 40 and returned through the first return pipe 22 where the second on-off switch 32 is located, so the high- and low-temperature cooling medium will not be mixed. Preferably, the following fourth step can be performed after the third step with a delay of 0.4S, that is, after the third control signal is set to 1, the next control signal is set after a delay of 0.4S to ensure that the second step A small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 before has all flowed out of the chuck 40, so that the high- and low-temperature cooling medium will not be mixed.

In the fourth step S4, the sixth control signal is set to 1, the fifth control signal, the first control signal, and the third control signal are kept as 1, and the other control signals are kept as 0. At this time, the sixth on-off switch 36 is turned off, and The fifth on-off switch 35, the third on-off switch 33, and the second on-off switch 32 are all connected, and the first on-off switch 31 and the fourth on-off switch 34 are all off. In this case, most of the low-temperature cooling The medium forms self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located, and a small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 before the second step continues to flow on the basis of the second step S3, At this time, the second short-circuit pipe 26 where the sixth on-off switch 36 is located is cut off, and the high-temperature cooling medium enters the chuck through the second output pipe 23 where the third on-off switch 33 is located and the chuck inlet pipe 27 where the flow meter 50 is located. The flow rate of the disc 40 becomes larger, but similar to the third step S3, because this part of the pipeline is longer, and a small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 before the second step has flowed out of the chuck 40, and backflow through the first return pipe 22 where the second on-off switch 32 is located, so the high and low temperature cooling medium will not be mixed. Preferably, the following fifth step can be performed with a delay of 1.5S after the fourth step. The setting of the delay interval between the fourth step and the fifth step above should try to ensure that a small amount of low-temperature cooling medium remaining in the pipeline has entered the first return pipeline 22 where the second on-off switch 32 is located, and the high-temperature cooling medium still remains. The pipeline 28 at the outlet end of the chuck is not entered to ensure that the high and low temperature cooling media will not be mixed.

The fifth step S5 is to set the fourth control signal as 1, keep the fifth control signal, the first control signal, the third control signal, and the sixth control signal as 1, and keep the second control signal as 0, at this time, the fourth on-off The switch 34 is connected, and the fifth on-off switch 35, the third on-off switch 33, the second on-off switch 32 are all connected, the first on-off switch 31 and the sixth on-off switch 36 are all off, in this case , most of the low-temperature cooling medium forms self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located, and a small part of the low-temperature cooling medium remaining in the first return pipe 22 where the second on-off switch 32 is located passes through the second on-off switch The switch 32 returns to the low-temperature cooling source. At this time, the high-temperature cooling medium enters the chuck 40 through the second output pipe 23 where the third on-off switch 33 is located, and the chuck inlet pipe 27 where the flow meter 50 is located, and most of the high-temperature cooling medium is cooled. The medium returns to the high-temperature cooling source (ie, the second temperature control source 12 ) through the second return pipe 24 where the fourth on-off switch 34 is located, and a small portion of the high-temperature cooling medium enters the first return pipe 22 where the second on-off switch 32 is located , but not mixed with the low-temperature cooling medium for the time being, and the high-temperature cooling medium is circulated and cooled between the chuck and the high-temperature cooling source. Preferably, the following sixth step can be performed after the fifth step with a delay of 0.9S. The setting of the delay interval between the fifth step and the sixth step above should ensure that the residual low temperature cooling medium has all returned to the low temperature cooling source, and the high temperature cooling medium has not flowed back through the second on-off switch 32 .

In the sixth step S6, the second control signal is set to 1, and the fifth control signal, the first control signal, the third control signal, the sixth control signal and the fourth control signal are kept as 1. At this time, the second on-off switch 32 is turned off. On, and the fifth on-off switch 35, the third on-off switch 33 and the fourth on-off switch 34 are all connected, the first on-off switch 31 and the sixth on-off switch 36 are all off, in this case, the high temperature The cooling medium enters the chuck 40 through the second output pipe 23 where the third on-off switch 33 is located and the chuck inlet pipe 27 where the flow meter 50 is located, and then passes through the second return pipe 24 where the fourth on-off switch 34 is located. Return to the high-temperature cooling source, and the high-temperature cooling medium circulates and cools between the chuck and the high-temperature cooling source. At this time, the low-temperature cooling medium forms self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located. Thereby, the switching of the low-temperature cooling medium to the high-temperature cooling medium is completed.

3. The switching process from the high temperature cooling source to the low temperature cooling source (on the basis of completing the sixth step above), as shown in Figure 3:

In the seventh step S7, the sixth control signal is set to 0. At this time, the sixth on-off switch 36 is connected, and the other control signals are kept as 1, that is, the first on-off switch 31 and the second on-off switch 32 are both off, and the fifth on-off switch 36 is turned off. The on-off switch 35 , the fourth on-off switch 34 and the third on-off switch 33 are all connected. In this case, a part of the high-temperature cooling medium forms self-circulation through the second short-circuit pipe 26 where the sixth on-off switch 36 is located, and another A part of the high-temperature cooling medium enters the chuck 40 through the second output pipe 23 where the third on-off switch 33 is located, and the chuck inlet pipe 27 where the flowmeter 50 is located, and then passes through the second backflow where the fourth on-off switch 34 is located. The pipeline 24 returns to the high-temperature cooling source, and the high-temperature cooling medium circulates and cools between the chuck and the high-temperature cooling source. At this time, the low-temperature cooling medium forms a self-circulation through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located, and the high and low temperature are cooled. Media will not mix. Preferably, the following eighth step can be performed after the seventh step with a delay of 0.5S, that is, after the sixth control signal is set to 0, the next control signal is set after a delay of 0.5S.

In the eighth step S8, the third control signal is set to 0, the sixth control signal is kept as 0, and the other control signals are kept as 1. At this time, the third on-off switch 33 is turned off, and the fifth on-off switch 35 and the fourth on-off switch 35 are turned off. The off switch 34 and the sixth on-off switch 36 are both connected, the first on-off switch 31 and the second on-off switch 32 are both off, and most of the high-temperature cooling medium is formed by the second short-circuit pipe 26 where the sixth on-off switch 36 is located. Self-circulation, a small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 continues to flow on the basis of the seventh step S7, that is, it sequentially passes through the second output where the third on-off switch 33 is located. The pipeline 23 and the pipeline 27 at the inlet end of the chuck where the flow meter 50 is located enter the chuck 40, and then return to the high temperature cooling source through the second return pipeline 24 where the fourth on-off switch 34 is located, and the high temperature cooling medium is cooled between the chuck and the high temperature. Circulating cooling between the sources, at this time, the low-temperature cooling medium forms self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located, and the high- and low-temperature cooling medium will not be mixed. Preferably, the following ninth step can be performed after the eighth step with a delay of 0.4s, that is, after the third control signal is set to 0, the next control signal is set after a delay of 0.5s.

In the ninth step S9, the first control signal is set to 0, the sixth control signal and the third control signal are kept as 0, and the other control signals are kept as 1. At this time, the first on-off switch 31 is connected, and the fifth on-off switch 35 is connected. , the fourth on-off switch 34 and the sixth on-off switch 36 are all connected, and the third on-off switch 33 and the second on-off switch 32 are all off. In this case, most of the high-temperature cooling medium passes through the sixth on-off switch. The second short-circuit pipe 26 where the switch 36 is located forms a self-circulation, and a small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 continues to flow on the basis of the eighth step S8, and the high-temperature cooling medium is in the card. Circulating cooling between the disk and the high-temperature cooling source, at this time, most of the low-temperature cooling medium forms self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located, and a small part of the low-temperature cooling medium passes through the first on-off switch 31. An output pipe 21, the inlet pipe 27 of the chuck where the flow meter 50 is located enters the chuck 40, because this part of the pipe is relatively long, and before the seventh step S7, a small part of the high temperature of the third on-off switch 33 has flowed through The cooling medium has flowed out of the chuck 40 and has been returning to the high temperature cooling source through the second return pipe 24 where the fourth on-off switch 34 is located, so the high and low temperature cooling medium will not be mixed. Preferably, the following tenth step can be performed after the ninth step with a delay of 0.4S, that is, after the first control signal is set to 0, the next control signal is set after a delay of 0.4S.

In the tenth step S10, the fifth control signal is set to 0, the first control signal, the third control signal and the sixth control signal are kept as 0, and the other control signals are kept as 1. At this time, the fifth on-off switch 35 is turned off, and The fourth on-off switch 34, the first on-off switch 31, and the sixth on-off switch 36 are all connected, and the third on-off switch 33 and the second on-off switch 32 are all off. In this case, most of the high temperature cooling The medium forms self-circulation through the second short-circuit pipe 26 where the sixth on-off switch 36 is located, and a small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 continues to flow on the basis of the ninth step S9 At this time, the first short-circuit pipe 25 where the fifth on-off switch 35 is located is cut off, and the low-temperature cooling medium enters through the first output pipe 21 where the first on-off switch 31 is located and the chuck inlet pipe 27 where the flow meter 50 is located. The flow rate of the chuck 40 becomes larger, but similar to the ninth step S9, because the pipeline in this part is longer, and a small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 has flowed out The chuck 40 has been returning to the high-temperature cooling source through the second return pipe 24 where the fourth on-off switch 34 is located, and the high- and low-temperature cooling media will still not be mixed. Preferably, the following eleventh step can be performed with a delay of 1.5S after the tenth step. In the setting of the delay interval between the tenth step S10 and the eleventh step S11, it is necessary to ensure that a small amount of high-temperature cooling medium remaining in the pipeline has entered the pipeline 28 at the outlet end of the chuck, and the low-temperature cooling medium has not entered the chuck. Outlet end line 28.

The eleventh step S11, set the second control signal to 0, keep the fifth control signal, the first control signal, the third control signal and the sixth control signal as 0, and keep the other control signals as 1, at this time the second on-off The switch 32 is connected, and the fourth on-off switch 34, the first on-off switch 31, and the sixth on-off switch 36 are all connected, and the fifth on-off switch 35 and the third on-off switch 33 are all off. Most of the high-temperature cooling medium A self-circulation is formed through the second short-circuit pipe 26 where the sixth on-off switch 36 is located, and a small part of the high-temperature cooling medium remaining in the second return pipe 24 is returned to the high-temperature cooling source through the fourth on-off switch 34 . At this time, the low-temperature cooling medium enters the chuck 40 through the first output pipe 21 where the first on-off switch 31 is located and the chuck inlet pipe 27 where the flow meter 50 is located, and most of the low-temperature cooling medium passes through the second on-off switch 32 where the The first return line 22 of the first return line 22 is returned to the low-temperature cooling source, and a small part of the low-temperature cooling medium enters the pipeline 28 at the outlet end of the chuck, but temporarily does not flow to the second return line 24 where the fourth on-off switch 34 is located, so the low-temperature cooling medium Not mixed with the high temperature cooling medium, the low temperature cooling medium circulates and cools between the chuck and the low temperature cooling source. Preferably, the following twelfth step can be performed after the eleventh step with a delay of 0.9S. The setting of the delay interval between the eleventh step S11 and the twelfth step S12 should ensure that the remaining high temperature is as far as possible. The cooling medium has all returned to the high-temperature cooling source, and the low-temperature cooling medium has not flowed through the fourth on-off switch 34 .

The twelfth step S12, set the fourth control signal to 0, keep the fifth control signal, the first control signal, the second control signal, the third control signal and the sixth control signal as 0, at this time and the fourth on-off switch 34 is off, and the first on-off switch 31, the second on-off switch 32, the third on-off switch 33 and the sixth on-off switch 36 are all connected, and the fifth on-off switch 35 is off. In this case, The low-temperature cooling medium enters the chuck 40 through the first output pipe 21 where the first on-off switch 31 is located and the chuck inlet pipe 27 where the flow meter 50 is located, and then passes through the first return pipe 22 where the second on-off switch 32 is located. Return to the low temperature cooling source, and the low temperature cooling medium circulates and cools between the chuck and the low temperature cooling source. At this time, the high-temperature cooling medium forms self-circulation through the second short-circuit pipe 26 where the sixth on-off switch 36 is located. Thereby, the switching of the high-temperature cooling medium to the low-temperature cooling medium is completed.

It should be noted that the delay interval between the above two adjacent steps can be adjusted at any time according to the actual test results, so that the control process takes the shortest time when the control requirements are met, thereby further shortening the temperature control time.

To sum up, in the technical solution of the temperature control device and method in the semiconductor process equipment provided by the present invention, the temperature control device includes a first temperature control source and a second temperature control source, and by making the temperature control of the two temperature control sources The temperature of the medium is different, and different temperature control functions can be used (one for heating and one for cooling, or the degree of heating or cooling is different, etc.), so that the temperature control time can be shortened and the temperature control range can be expanded, and the controller of the temperature control device can control A plurality of on-off switches are connected or disconnected in chronological order, so that the chuck is switched from being connected with the first temperature control source to being connected with the second temperature control source, or the chuck is switched from being connected with the second temperature control source. To communicate with the first temperature control source, that is, to switch two temperature control sources, so that different wafer temperature control requirements for different processes or steps can be achieved. The disconnection operation, compared with the simultaneous operation of multiple on-off switches, can not only avoid the serial mixing of temperature control media with different temperatures, and affect the temperature of the temperature control medium, thereby ensuring the temperature control accuracy, but also avoid the temperature The abnormal liquid level in the pipeline caused by the serial mixing of the control medium will cause the shutdown phenomenon, thus ensuring the normal and stable operation of the temperature control device.

It should be understood that the above embodiments are only exemplary embodiments adopted to illustrate the principles of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present application, and these modifications and improvements are also regarded as the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying The referenced device or element must have, be constructed, and operate in a particular orientation, and therefore should not be construed as a limitation of the present application.

The terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

In the description of this specification, the particular features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above are only part of the embodiments of the present application. It should be pointed out that for those skilled in the art, some improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as The protection scope of this application.

Claims

A temperature control device in a semiconductor process equipment for controlling the temperature of a chuck in the semiconductor process equipment, characterized in that it comprises a first temperature control source, a second temperature control source, a first output pipeline, a second output A pipeline, a first return pipeline, a second return pipeline, a first short-circuit pipeline, a second short-circuit pipeline, and a controller, wherein;

The output port of the first temperature control source is communicated with the inlet of the chuck through the first output pipe, and the return port of the first temperature control source is connected with the outlet of the chuck through the first return pipe connected;

The output port of the second temperature control source is communicated with the inlet of the chuck through the second output pipe, and the return port of the second temperature control source is connected with the outlet of the chuck through the second return pipe connected;

The output port of the first temperature control source communicates with the return port of the first temperature control source through the first short-circuit pipe, and the output port of the second temperature control source communicates with the second temperature control source through the second short-circuit pipe. The return port of the second temperature control source is connected;

On-off switches are arranged on the first output pipeline, the second output pipeline, the first return pipeline, the second return pipeline, the first short-circuit pipeline, and the second short-circuit pipeline;

The controller is used for connecting or disconnecting a plurality of the on-off switches in chronological order, and switching the chuck from being connected to the first temperature control source to being connected to the second temperature control source, or The chuck is switched from being communicated with the second temperature control source to being communicated with the first temperature control source, and the temperature of the temperature control medium in the first temperature control source is the same as the temperature in the second temperature control source. The temperature of the control medium is different.
The temperature control device according to claim 1, further comprising a chuck inlet pipe and a chuck outlet pipe, the first output pipe and the second output pipe both passing through the chuck The pipeline at the inlet end communicates with the inlet of the chuck, a flow meter is arranged on the pipeline at the inlet end of the chuck, and both the first return pipeline and the second return pipeline pass through the outlet pipeline of the chuck and are connected with each other. The outlet of the chuck communicates.
The temperature control device according to claim 1, wherein the first output pipe is provided with a first on-off switch, the first return pipe is provided with a second on-off switch, and the second output pipe is provided with a second on-off switch. The pipeline is provided with a third on-off switch, the second return pipeline is provided with a fourth on-off switch, the first short-circuit pipeline is provided with a fifth on-off switch, and the second short-circuit pipeline is provided with a third on-off switch. Six on-off switches;

The first on-off switch, the second on-off switch, and the sixth on-off switch are connected, and the third on-off switch, the fourth on-off switch, and the fifth on-off switch are off When turned on, the chuck communicates with the first temperature control source;

The first on-off switch, the second on-off switch, and the sixth on-off switch are off, and the third on-off switch, the fourth on-off switch, and the fifth on-off switch When connected, the chuck communicates with the second temperature control source.
The temperature control device according to claim 3, wherein the first on-off switch, the second on-off switch and the sixth on-off switch are normally open switches, and the third on-off switch is a normally open switch. , the fourth on-off switch and the fifth on-off switch are normally closed switches.
The temperature control device according to claim 3, wherein the controller is configured to press the button when the chuck is switched from being communicated with the first temperature control source to being communicated with the second temperature control source. The fifth on-off switch is connected in sequence, the first on-off switch is disconnected, the third on-off switch is connected, the sixth on-off switch is disconnected, and the The fourth on-off switch is connected, and the second on-off switch is disconnected.
The temperature control device according to claim 3, wherein the controller is configured to press the button when the chuck is switched from being communicated with the second temperature control source to being communicated with the first temperature control source. The sixth on-off switch is connected in sequence, the third on-off switch is disconnected, the first on-off switch is connected, the fifth on-off switch is disconnected, and the The second on-off switch is connected, and the fourth on-off switch is disconnected.
A temperature control method in a semiconductor process equipment, characterized in that, applied to the temperature control device according to any one of claims 1-6, the method comprising:

When the chuck is switched from being communicated with the first temperature control source to being communicated with the second temperature control source, or the chuck is switched from being communicated with the second temperature control source to being communicated with the first temperature control source. When a temperature control source is connected, a plurality of the on-off switches are connected or disconnected in chronological order.
The temperature control method according to claim 7, wherein the first output pipe is provided with a first on-off switch, the first return pipe is provided with a second on-off switch, and the second output pipe is provided with a second on-off switch. A third on-off switch is arranged on the pipeline, a fourth on-off switch is arranged on the second return pipeline, a fifth on-off switch is arranged on the first short-circuit pipeline, and a third on-off switch is arranged on the second short-circuit pipeline. Six on-off switches;

The switching of the chuck from being communicated with the first temperature control source to being communicated with the second temperature control source includes:

In chronological order, the fifth on-off switch is connected, the first on-off switch is disconnected, the third on-off switch is connected, the sixth on-off switch is disconnected, and the The fourth on-off switch is connected, and the second on-off switch is disconnected.
The temperature control method according to claim 7, wherein the first output pipe is provided with a first on-off switch, the first return pipe is provided with a second on-off switch, and the second output pipe is provided with a second on-off switch. A third on-off switch is arranged on the pipeline, a fourth on-off switch is arranged on the second return pipeline, a fifth on-off switch is arranged on the first short-circuit pipeline, and a third on-off switch is arranged on the second short-circuit pipeline. Six on-off switches;

The switching of the chuck from being communicated with the second temperature control source to being communicated with the first temperature control source includes:

In chronological order, the sixth on-off switch is connected, the third on-off switch is disconnected, the first on-off switch is connected, the fifth on-off switch is disconnected, and the The second on-off switch is connected, and the fourth on-off switch is disconnected.
The temperature control method according to claim 8 or 9, characterized in that there is a time delay interval between any two adjacent on-off switches in the chronological order of connecting or disconnecting operations, and the The delay interval is 0 to 2 seconds.