TW202240765A - Temperature control apparatus and method in semiconductor process device - Google Patents

Abstract

The present application provides a temperature control apparatus and method in a semiconductor process device. The temperature control apparatus comprises a first temperature control source, a second temperature control source, a first output pipe, a second output pipe, a first return pipe, a second return pipe, a first short-circuit pipe, a second short-circuit pipe and a controller. Output ports of the two temperature control sources respectively communicate with inlets of chucks by means of the two output pipes, and return ports of the two temperature control sources respectively communicate with outlets of the chucks by means of the two return pipes; the output ports of the two temperature control sources also communicate with respective return ports thereof by means of the two short-circuit pipes; each pipe is provided with an on-off switch; and the controller is used to sequentially communicate or disconnect a plurality of on-off switches in chronological order, and to switch the communication between the chuck and the two temperature control sources, and the temperature of temperature control mediums in the two temperature control sources is different. Applying the present application may improve the temperature control range, shorten the temperature control time, and effectively solve the problem of fluid cross-mixing in two temperature control sources.

Description

Temperature control device and method in semiconductor process equipment

The present invention relates to the technical field of semiconductors, in particular to a temperature control device and method in semiconductor manufacturing equipment.

The ESC (Electrostatic Adsorption Chuck) in the etching machine is mainly used for the adsorption and fixation of the wafer (wafer) and the precise temperature required for the process. The inside of the ESC is usually equipped with a heat exchange channel, and a cooling/heating liquid or gas is passed into the heat exchange channel through a temperature control device to precisely adjust the temperature of the ESC, thereby realizing the temperature control of the wafer.

However, with the continuous development of the semiconductor industry and the etching process, during the etching process of the wafer, different process steps may need to use different temperatures, and the temperature difference is large. The existing single-channel ESC temperature adjustment method is difficult to ensure the temperature switching. uniformity and timeliness. However, the existing dual-channel ESC temperature adjustment method is prone to the problem of liquid leakage.

The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a temperature control device and method in semiconductor manufacturing equipment, which can increase the temperature control range, shorten the temperature control time, and effectively solve the problem of the two temperature control sources. problem of fluid cross-mixing.

In order to achieve the purpose of the present invention, the first aspect provides a temperature control device in semiconductor processing equipment, which is used to control the temperature of the chuck in the semiconductor processing equipment, which includes a first temperature control source, a second temperature control source, a first The output pipeline, the second output pipeline, the first return pipeline, the second return pipeline, the first short-circuit pipeline, the second short-circuit pipeline and the controller, wherein; The output port of the first temperature control source communicates with the inlet of the chuck through the first output pipe, and the return port of the first temperature control source communicates with the outlet of the chuck through the first return pipe; The output port of the second temperature control source communicates with the inlet of the chuck through the second output pipeline, and the return port of the second temperature control source communicates with the outlet of the chuck through the second return pipeline; The output port of the first temperature control source communicates with the return port of the first temperature control source through the first short-circuit pipe, and the output port of the second temperature control source communicates with the second temperature control source through the second short-circuit pipe. The return port of the source is connected; The first output pipeline, the second output pipeline, the first return pipeline, the second return pipeline, the first short-circuit pipeline, and the second short-circuit pipeline are all provided with on-off switches; The controller is used to sequentially connect or disconnect a plurality of the on-off switches in chronological order, switch the chuck from the first temperature control source to the second temperature control source, or switch the chuck from the first temperature control source to the second temperature control source. Switching from communicating with the second temperature control source to communicating with the first temperature control source, the temperature of the temperature control medium in the first temperature control source is different from the temperature of the temperature control medium in the second temperature control source.

Optionally, the temperature control device further includes a chuck inlet pipeline and a chuck outlet pipeline, and the first output pipeline and the second output pipeline are connected through the chuck inlet pipeline and the chuck inlet. A flow meter is arranged on the pipeline at the inlet end of the chuck, and both the first return pipeline and the second return pipeline communicate with the outlet of the chuck through the pipeline at the outlet end of the chuck.

Optionally, the first output pipeline is provided with a first on-off switch, the first return pipeline is provided with a second on-off switch, the second output pipeline is provided with a third on-off switch, and the second return pipeline is provided with a third on-off switch. The pipeline is provided with a fourth on-off switch, the first short-circuit pipeline is provided with a fifth on-off switch, and the second short-circuit pipeline is provided with a sixth on-off switch; When the first on-off switch, the second on-off switch and the sixth on-off switch are connected, and the third on-off switch, the fourth on-off switch and the fifth on-off switch are off, the card The disc communicates with the first temperature control source; When the first on-off switch, the second on-off switch and the sixth on-off switch are off, and the third on-off switch, the fourth on-off switch and the fifth on-off switch are on, the card The disk is in communication with the second temperature control source.

Optionally, the first on-off switch, the second on-off switch and the sixth on-off switch are normally open switches, and the third on-off switch, the fourth on-off switch and the fifth on-off switch are Normally closed switch.

Optionally, the controller is configured to connect the fifth on-off switch sequentially in chronological order when the chuck is switched from being connected to the first temperature control source to being connected to the second temperature control source, and the The first on-off switch is turned off, the third on-off switch is connected, the sixth on-off switch is turned off, the fourth on-off switch is connected, and the second on-off switch is turned off.

Optionally, the controller is used to connect the sixth on-off switch sequentially in chronological order when the chuck is switched from being connected to the second temperature control source to being connected to the first temperature control source, and the The third on-off switch is turned off, the first on-off switch is connected, the fifth on-off switch is turned off, the second on-off switch is connected, and the fourth on-off switch is turned off.

In order to achieve the purpose of the present invention, another aspect provides a temperature control method in semiconductor processing equipment, which is applied to the temperature control device of the first aspect, and the method includes: When switching the chuck from communicating with the first temperature control source to communicating with the second temperature control source, or switching the chuck from communicating with the second temperature control source to communicating with the first temperature control source , connecting or disconnecting a plurality of the on-off switches sequentially in chronological order.

Optionally, the first output pipeline is provided with a first on-off switch, the first return pipeline is provided with a second on-off switch, the second output pipeline is provided with a third on-off switch, and the second return pipeline is provided with a third on-off switch. The pipeline is provided with a fourth on-off switch, the first short-circuit pipeline is provided with a fifth on-off switch, and the second short-circuit pipeline is provided with a sixth on-off switch; Switching the chuck from communicating with the first temperature control source to communicating with the second temperature control source includes: The fifth on-off switch is connected sequentially in chronological order, the first on-off switch is turned off, the third on-off switch is connected, the sixth on-off switch is turned off, and the fourth on-off switch is turned off. The off switch is connected, and the second on-off switch is turned off.

Optionally, the first output pipeline is provided with a first on-off switch, the first return pipeline is provided with a second on-off switch, the second output pipeline is provided with a third on-off switch, and the second return pipeline is provided with a third on-off switch. The pipeline is provided with a fourth on-off switch, the first short-circuit pipeline is provided with a fifth on-off switch, and the second short-circuit pipeline is provided with a sixth on-off switch; Switching the chuck from communicating with the second temperature control source to communicating with the first temperature control source includes: In chronological order, the sixth on-off switch is connected, the third on-off switch is turned off, the first on-off switch is connected, the fifth on-off switch is turned off, and the second on-off switch is turned off. The off switch is connected, and the fourth on-off switch is turned off.

Optionally, when a plurality of on-off switches are connected or disconnected in sequence, the time interval between two adjacent connection or disconnection operations is 0-2 seconds. The present invention has the following beneficial effects:

In the technical solution of the temperature control device and method in the semiconductor process equipment provided by the present invention, the temperature control device includes a first temperature control source and a second temperature control source, and by making the temperatures of the temperature control media of the two temperature control sources different , can realize different temperature control functions (one heating and one cooling, or the degree of heating or cooling is different, etc.), so that the temperature control time can be shortened, the temperature control range can be expanded, and the controller of the temperature control device can control multiple channels The disconnect switch is sequentially connected or disconnected in chronological order, so as to switch the chuck from being connected to the first temperature control source to the second temperature control source, or to switch the chuck from being connected to the second temperature control source to being connected to the second temperature control source. One temperature control source is connected, that is, two temperature control sources can be switched, so that different wafer temperature control requirements for different processes or steps can be realized. At the same time, because multiple on-off switches are connected or disconnected in chronological order Compared with the simultaneous operation of multiple on-off switches, it can not only avoid the cross-mixing of temperature-control media at different temperatures and affect the temperature of the temperature-control media, thereby ensuring the accuracy of temperature control, but also avoiding the cross-mixing of temperature-control media The abnormal liquid level in the pipeline caused by mixing will cause shutdown, thus ensuring the normal and stable operation of the temperature control device.

The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and cannot be construed as limiting the present application.

Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be understood to have meanings consistent with their meaning in the context of the prior art, and are not to be used in idealized or overly formal terms unless specifically defined as herein meaning to explain.

Those skilled in the art will understand that the singular forms "a", "an" and "the" used herein may also include plural forms unless otherwise stated. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present. Additionally, "connected" or "coupled" as used herein may include wireless connection or wireless coupling. The expression "and/or" used herein includes all or any elements and all combinations of one or more associated listed items.

The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems will be described in detail below with specific embodiments in conjunction with the accompanying drawings.

Please refer to FIG. 1 , this embodiment provides a temperature control device in semiconductor processing equipment, which is used to control the temperature of the chuck 40 in the semiconductor processing equipment, thereby indirectly controlling the temperature of the wafer carried by the chuck 40. The chuck 40 is for example It is an electrostatic chuck. The temperature control device includes a first temperature control source 11, a second temperature control source 12, a first output pipeline 21, a second output pipeline 23, a first return pipeline 22, a second return pipeline 24, a first short circuit pipeline 25, a first Two short-circuit pipelines 26 and controllers (not shown in the figure).

Wherein, the output port of the first temperature control source 11 communicates with the inlet of the chuck 40 through the first output pipe 21 , and the return port of the first temperature control source 11 communicates with the outlet of the chuck 40 through the first return pipe 22 . The output port of the first temperature control source 11 is also communicated with the return port of the first temperature control source 11 through the first short-circuit pipe 25 .

The outlet of the second temperature control source 12 communicates with the inlet of the chuck 40 through the second output pipe 23 , and the return port of the second temperature control source 12 communicates with the outlet of the chuck 40 through the second return pipe 24 . The output port of the second temperature control source 12 is also communicated with the return port of the second temperature control source 12 through the second short circuit pipe 26 .

The first output pipeline 21 , the second output pipeline 23 , the first return pipeline 22 , the second return pipeline 24 , the first short-circuit pipeline 25 and the second short-circuit pipeline 26 are all provided with on-off switches.

The controller is used to sequentially connect or disconnect a plurality of on-off switches in chronological order, to switch the chuck 40 from being connected to the first temperature control source 11 to being connected to the second temperature control source 12, or to switch the chuck 40 from being connected to the second temperature control source 12. The second temperature control source 12 is switched to communicate with the first temperature control source 11 , and the temperature of the temperature control medium in the first temperature control source 11 is different from the temperature of the temperature control medium in the second temperature control source 12 .

The so-called sequential connection or disconnection of multiple on-off switches in chronological order means that the operations of connecting or disconnecting a plurality of on-off switches are performed in chronological order, not simultaneously.

The chuck 40 is provided with a heat exchange channel (not shown in the figure), and the two ends of the heat exchange channel are the inlet and outlet of the chuck 40 .

Wherein, the first temperature control source 11 and the second temperature control source 12 can be both heating sources and cooling sources. In this case, the two heat or cool the wafer respectively, so that the temperature reached by the wafer is The ranges are different to be able to meet the different wafer temperature control needs of different processes or steps. Alternatively, one of the first temperature control source 11 and the second temperature control source 12 may be a heating source, and the other may be a cooling source. The first temperature control source 11 and the second temperature control source 12 can be a liquid phase temperature control source or a gas phase temperature control source, that is, the temperature control medium can be a liquid or a gas, which is not specified in this embodiment. limited.

By making the temperature of the temperature control medium of the two temperature control sources different, different temperature control functions can be achieved (one heating and one cooling, or the degree of heating or cooling is different, etc.), so that the temperature control time can be shortened and the temperature control range can be expanded. , and the controller of the temperature control device can control a plurality of on-off switches to be connected or disconnected sequentially in order of time, so as to switch the chuck from being connected to the first temperature control source 11 to being connected to the second temperature control source 12, Alternatively, the chuck 40 is switched from being connected to the second temperature control source 12 to being connected to the first temperature control source 11, that is, switching between two temperature control sources is realized, so that different wafer temperature control requirements of different processes or steps can be realized, At the same time, since multiple on-off switches are connected or disconnected sequentially in chronological order, compared with simultaneous operation of multiple on-off switches, it can not only avoid the cross-mixing of temperature control media at different temperatures, and affect the temperature control media. The temperature can ensure the accuracy of temperature control, and it can also avoid the abnormal liquid level in the pipeline caused by the mixing of temperature control media, which will cause shutdown, thus ensuring the normal and stable operation of the temperature control device.

Wherein, the first temperature control source 11, the first output pipeline 21, the first return pipeline 22 and the chuck 40 can form a first loop, and the first loop can make the temperature control medium of the first temperature control source 11 be at the first temperature. Circulating flow between the control source 11 and the chuck 40; the second temperature control source 12, the second output pipeline 23 and the second return pipeline 24 and the chuck 40 can form a second loop, and the second loop can make the second temperature control The temperature control medium of the source 12 circulates between the second temperature control source 12 and the chuck 40, and the first loop and the second loop are arranged in parallel. The first short-circuit pipe 25 and the first temperature control source 11 form a third circuit, and the third circuit can make the temperature control medium of the first temperature control source 11 return directly to the first temperature control source 11 without passing through the chuck 40, and the third circuit The circuit is set in parallel with the first circuit; the second short-circuit pipe 26 and the second temperature control source 12 form a fourth circuit, and the fourth circuit can make the temperature control medium of the second temperature control source 12 return directly to the first circuit without passing through the chuck 40. Two temperature control sources 12, the fourth loop and the second loop are set in parallel. The controller can selectively connect or disconnect the above-mentioned four circuits by connecting or disconnecting multiple on-off switches in sequence in time, so as to realize the switching of two temperature control sources, so that different processes or steps can be realized. Wafer temperature control requirements can further increase the temperature adjustment range of the chuck 40 and improve the temperature adjustment accuracy.

In some optional embodiments, the temperature control device may also include a chuck inlet pipeline 27 and a chuck outlet pipeline 28, and both the first output pipeline 21 and the second output pipeline 23 pass through the chuck inlet The pipeline 27 communicates with the inlet of the chuck 40, the pipeline 27 at the inlet end of the chuck is provided with a flowmeter 50, and the first return pipeline 22 and the second return pipeline 24 are connected by the pipeline 28 at the outlet end of the chuck and the chuck 40. The export connection. Since the temperature control medium in the above-mentioned first output pipeline 21 and the second output pipeline 23 needs to enter the chuck 40 through the chuck inlet pipeline 27, this makes the flow rate of the temperature control medium in the chuck inlet pipeline 27 The situation can reflect whether the flow state of the temperature control medium is abnormal. Therefore, by arranging a flow meter 50 on the pipeline 27 at the inlet end of the chuck, it can be used to detect the flow state of the temperature control medium in the pipeline 27 at the inlet end of the chuck. It is possible to know in time whether the flow state of the temperature control medium is abnormal, to prevent the chuck 40 from being burned out due to no liquid flowing inside for a long time, and the flow rate of the temperature control medium in the chuck inlet pipe 27 and the chuck outlet pipe 28 If it is too large, it will cause safety hazards.

In a specific implementation of this embodiment, the first output pipeline 21 is provided with a first on-off switch 31, the first return pipeline 22 is provided with a second on-off switch 32, and the second output pipeline 23 is provided with a third The on-off switch 33 , the fourth on-off switch 34 is arranged on the second return pipe 24 , the fifth on-off switch 35 is arranged on the first short-circuit pipe 25 , and the sixth on-off switch 36 is arranged on the second short-circuit pipe 26 . In this way, the connection and disconnection of each pipeline can be controlled by controlling the on-off switch of the above-mentioned on-off switch, so as to improve the safety, stability and automation of the temperature control device. Wherein, each on-off switch can be, but not limited to, an electromagnetic valve (as long as it can be controlled by a controller), so that the on-off switch can be precisely controlled by the controller.

The controller can respectively control the first on-off switch 31 and the second on-off switch 32 through the first control signal, the second control signal, the third control signal, the fourth control signal, the fifth control signal and the sixth control signal , the connection and disconnection of the third on-off switch 33 , the fourth on-off switch 34 , the fifth on-off switch 35 and the sixth on-off switch 36 . The above-mentioned first control signal, second control signal, third control signal, fourth control signal, fifth control signal and sixth control signal can all be digital signals, such as 0, 1, when the control signal is 0, and the The on-off switch corresponding to the control signal is off; when the control signal is 1, the on-off switch corresponding to the control signal is connected, thus, the above-mentioned first control signal, second control signal, third control signal, fourth Any one of the control signal, the fifth control signal and the sixth control signal can be switched between 0 and 1 to realize the switching of the corresponding on-off switch between off and on.

In addition, some of the above six on-off switches may be normally open switches (that is, the initial state is off), and some may be normally closed switches (that is, the initial state is on), for example, the first on-off switch 31. The second on-off switch 32 and the sixth on-off switch 36 are normally open switches, and the third on-off switch 33 , the fourth on-off switch 34 and the fifth on-off switch 35 are normally closed switches. In this case, for a normally closed switch, you can control the normally closed switch to switch to the off state by making the control signal 0; for a normally open switch, you can control the normally open switch to switch to the open state by making the control signal 1 connected state.

In a specific implementation of this embodiment, when it is necessary to use the first temperature control source 11 to control the temperature of the chuck 40, that is, it is necessary to connect the above-mentioned first loop and the fourth loop, and disconnect the second loop and the fourth loop. Three loops, in this case, the controller controls the first on-off switch 31, the second on-off switch 32 and the sixth on-off switch 36 to connect respectively by corresponding control signals, the third on-off switch 33, the fourth on-off switch The on-off switch 34 and the fifth on-off switch 35 are turned off, so that the first temperature control source 11 communicates with the chuck 40 . When it is necessary to use the second temperature control source 12 to control the temperature of the chuck 40, that is, it is necessary to connect the above-mentioned second circuit and the third circuit, and to disconnect the first circuit and the fourth circuit. In this case, the control The device respectively controls the first on-off switch 31, the second on-off switch 32 and the sixth on-off switch 36 to turn off by corresponding control signals, and the third on-off switch 33, the fourth on-off switch 34 and the fifth on-off switch The switch 35 is connected to make the second temperature control source 12 communicate with the chuck 40 .

When switching from using the first temperature control source 11 for temperature control of the chuck 40 to using the second temperature control source 12 for temperature control of the chuck 40, the controller can sequentially control the fifth on-off switch 35 to connect, Control the first on-off switch 31 to turn off, control the third on-off switch 33 to connect, control the sixth on-off switch 36 to turn off, control the fourth on-off switch 34 to connect and control the second on-off switch 32 to turn off.

When the second temperature control source 12 is used to cool the chuck 40 and then the first temperature control source 11 is used to cool the chuck 40, the sixth on-off switch 36 is controlled sequentially in chronological order, and the third on-off switch is controlled. The switch 33 is turned off, the first on-off switch 31 is controlled to be connected, the fifth on-off switch 35 is controlled to be off, the second on-off switch 32 is controlled to be connected, and the fourth on-off switch 34 is controlled to be off.

Further, the controller controls the first on-off switch 31, the second on-off switch 32, the third on-off switch 33, the fourth on-off switch 34, the fifth on-off switch 35 and the sixth on-off switch based on the above time sequence. When the switch 36 is connected or disconnected, there is a delay interval between the operations of connecting or disconnecting any two adjacent on-off switches in time sequence, and the delay interval is 0-2 seconds. The delay intervals between the operations of connecting or disconnecting two adjacent on-off switches may be different or the same. By setting the above delay interval, on the one hand, it can ensure that the temperature control medium in the chuck 40 does not flow continuously when the two temperature control sources are switched, so as to protect the chuck 40 from being burned out. On the other hand, it can ensure that the residual temperature control medium that is currently circulating in the pipeline can be completely refluxed, preventing the residual temperature control medium from mixing with the newly inflowing temperature control medium, resulting in cross-mixing of temperature control media at different temperatures; at the same time, it can also avoid Since the on-off switches are turned on at the same time, the flow rates of two temperature-controlling media with different temperatures into the chuck 40 are relatively large, thereby effectively avoiding cross-mixing of temperature-controlling media at different temperatures.

In the process of semiconductor manufacturing process, when other heat sources are used to heat the chuck, the chuck may be locally heated (or the temperature of the local heating needs to be controlled at a lower temperature). The temperature control device in the semiconductor process equipment provided in the embodiment controls the temperature of the chuck. For example, the first temperature control source 11 can be a low-temperature cooling source, the second temperature control source 12 can be a high-temperature cooling source, and the low-temperature cooling source provides The temperature of the cooling medium is lower than the temperature of the cooling medium provided by the high-temperature cooling source, so as to cool down the part of the chuck that is locally heated, so that the overall heating of the chuck can be more uniform.

In this embodiment, the first on-off switch 31, the second on-off switch 32, and the sixth on-off switch 36 are all normally open switches (such as normally open two-position two-way valves), and the third on-off switch 33, Both the fourth on-off switch 34 and the fifth on-off switch 35 are normally closed switches (eg, normally closed two-position two-way valve). The first control signal, the second control signal and the sixth control signal corresponding to the first on-off switch 31, the second on-off switch 32 and the sixth on-off switch 36 are configured as follows: when they are all 0, the first on-off switch Switch 31, the second on-off switch 32 and the sixth on-off switch 36 are all connected, and the third on-off switch 33, the fourth on-off switch 34 and the fifth on-off switch 35 are all off; The on-off switch 31 , the second on-off switch 32 and the sixth on-off switch 36 are all off, and the third on-off switch 33 , the fourth on-off switch 34 and the fifth on-off switch 35 are all on.

Based on the same concept as the above-mentioned temperature control device in the semiconductor process equipment, this embodiment also provides a temperature control method in the semiconductor process equipment, which is applied to the temperature control device in any of the above-mentioned embodiments, and the method includes: When the chuck 40 is switched from being connected to the first temperature control source 11 to being connected to the second temperature control source 12, or when the chuck 40 is switched from being connected to the second temperature control source 12 to being connected to the first temperature control source 11 , connecting or disconnecting multiple on-off switches sequentially in chronological order.

In the specific implementation of this embodiment, the first on-off switch 31 is set on the first output pipeline 21, the second on-off switch 32 is set on the first return pipeline 22, and the third on-off switch 32 is set on the second output pipeline 23. The on-off switch 33 , the fourth on-off switch 34 is arranged on the second return pipe 24 , the fifth on-off switch 35 is arranged on the first short-circuit pipe 25 , and the sixth on-off switch 36 is arranged on the second short-circuit pipe 26 .

Switching the chuck 40 from communicating with the first temperature control source 11 to communicating with the second temperature control source 12 includes: sequentially connecting the fifth on-off switch 35, turning off the first on-off switch 31, and turning on the third on-off switch. When the on-off switch 33 is connected, the sixth on-off switch 36 is turned off, the fourth on-off switch 34 is connected, and the second on-off switch 32 is turned off.

Switching the chuck 40 from being connected to the second temperature control source 12 to being connected to the first temperature control source 11 includes: connecting the sixth on-off switch 36 sequentially in chronological order, turning off the third on-off switch 33, Connect the first on-off switch 31 , turn off the fifth on-off switch 35 , connect the second on-off switch 32 , and turn off the fourth on-off switch 34 .

In another specific implementation manner of this embodiment, there is a delay interval between the connection and disconnection operations of any two adjacent on-off switches in the above time sequence, and the delay interval is 0-2 seconds.

The specific control process and principle will be described below with a specific embodiment. 1. Common state (the chuck 40 is cooled by a low-temperature cooling source (ie, the first temperature control source 11 )):

Now the control signals of all on-off switches are 0, the first on-off switch 31, the second on-off switch 32 and the sixth on-off switch 36 are all connected, the first circuit and the fourth circuit are in the path, the third circuit is connected The off switch 33, the fourth on-off switch 34 and the fifth on-off switch 35 are off, the second loop and the third loop are in off-circuit, the low-temperature cooling medium passes through the first on-off switch 31, and flows through the flow meter sequentially along the corresponding pipes 50 and the chuck 40, and then flow back to the cryogenic cooling source through the second on-off switch 32. That is, at this time, the low-temperature cooling medium circulates and cools between the chuck and the low-temperature cooling source, while the high-temperature cooling medium forms a self-circulation through the sixth on-off switch 36 (the chuck is not cooled). 2. The process of switching from a low-temperature cooling source to a high-temperature cooling source (based on the above common state), as shown in Figure 2:

In the first step S1, the fifth control signal is set to 1, and the other control signals are kept to be 0. At this time, the fifth on-off switch 35 is connected, and the third circuit is connected. That is, the first on-off switch 31, the second on-off switch 32, the fifth on-off switch 35 and the sixth on-off switch 36 are all connected, and the first loop, the third loop and the fourth loop are all in the path; The off switch 33 and the fourth on-off switch 34 are disconnected, and the second circuit is in an off-circuit. In this case, a part of the low-temperature cooling medium forms a self-circulation through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located, and the other part The low-temperature cooling medium enters the chuck 40 sequentially through the first output pipeline 21 where the first on-off switch 31 is located, the chuck inlet pipeline 27 where the flowmeter 50 is located, and then passes through the chuck outlet pipeline 28 and the second pipeline in turn. The first return pipe 22 where the on-off switch 32 is located flows back to the low-temperature cooling source (that is, the first temperature control source 11), and the low-temperature cooling medium circulates and cools between the chuck 40 and the low-temperature cooling source. The second short-circuit pipeline 26 where the six on-off switches 36 are located forms a self-circulation, and the high-temperature and low-temperature cooling media will not mix. Preferably, it is possible to set a delay of 0.5S after the first step before performing the second step, that is, after setting the fifth control signal to 1, delay for 0.5S before setting the next control signal.

In the second step S2, set the first control signal to 1, keep the fifth control signal to 1, and keep the other control signals to 0. At this time, the first on-off switch 31 is turned off, and the low-temperature cooling medium cannot pass through the first output pipe 21 Lead to the chuck 40, and the fifth on-off switch 35, the second on-off switch 32, the sixth on-off switch 36 are all connected, the third on-off switch 33, the fourth on-off switch 34 are all off, in this Under normal circumstances, most of the low-temperature cooling medium forms self-circulation through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located, and the small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 before the second step is in the first step. On the basis of step S1, the flow continues, that is, after entering the chuck 40 through the chuck inlet pipeline 27 where the flowmeter 50 is located, it passes through the chuck outlet pipeline 28 and the second on-off switch 32 in turn. A return pipe 22 returns to the low-temperature cooling source (that is, the first temperature control source 11), and this part of the low-temperature cooling medium continues to flow in the circulating cooling circuit between the chuck and the low-temperature cooling source. At this time, the high-temperature cooling medium is still passed through The second short-circuit pipeline 26 where the sixth on-off switch 36 is located forms a self-circulation, and the high-temperature and low-temperature cooling media will not mix. Preferably, after the second step, a delay of 0.4S can be set before the following third step is performed, that is, after the first control signal is set to 1, the next control signal is set after a delay of 0.4S.

In the third step S3, the third control signal is set to 1, the fifth control signal and the first control signal are kept at 1, and the other control signals are kept at 0. At this time, the third on-off switch 33 is turned on, and the high-temperature cooling medium can be By the second output pipeline 23 leading to the chuck 40, and the fifth on-off switch 35, the second on-off switch 32 and the sixth on-off switch 36 are all connected, the first on-off switch 31 and the fourth on-off switch 34 In this case, most of the low-temperature cooling medium forms self-circulation through the first short-circuit pipe 25 where the fifth on-off switch 35 is located, and has flowed through a small part of the first on-off switch 31 before the second step The low-temperature cooling medium continues to flow on the basis of the second step S2. At this time, most of the high-temperature cooling medium forms a self-circulation through the second short-circuit pipeline 26 where the sixth on-off switch 36 is located, and a small part of the high-temperature cooling medium passes through the third channel in turn. The second output pipeline 23 where the disconnect switch 33 is located, and the chuck inlet pipeline 27 where the flowmeter 50 is located enter the chuck 40. Since this part of the pipeline is relatively long, it has flowed through the first on-off switch before the second step. A small part of the low-temperature cooling medium at 31 has flowed out of the chuck 40, and returns through the first return pipe 22 where the second on-off switch 32 is located, so the high-temperature and low-temperature cooling medium will not mix. Preferably, it is possible to set a delay of 0.4S after the third step before proceeding to the following fourth step, that is, after setting the third control signal to 1, delay 0.4S and then set the next control signal to ensure that before the second step A small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 has all flowed out of the chuck 40, so that the high-temperature and low-temperature cooling medium will not mix.

The fourth step S4 is to set the sixth control signal to be 1, keep the fifth control signal, the first control signal, and the third control signal to be 1, and keep other control signals to be 0. At this time, the sixth on-off switch 36 is disconnected, and The fifth on-off switch 35, the third on-off switch 33, and the second on-off switch 32 are all connected, and the first on-off switch 31 and the fourth on-off switch 34 are all off. In this case, most of the cryogenic cooling The medium forms self-circulation through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located, and a small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 before the second step continues to flow on the basis of the second step S3 At this time, the second short-circuit pipeline 26 where the sixth on-off switch 36 is located is cut off, and the high-temperature cooling medium passes through the second output pipeline 23 where the third on-off switch 33 is located, and the chuck inlet pipeline 27 where the flowmeter 50 is located. The flow that enters the chuck 40 becomes larger, but similar to the third step S3, because this part of the pipeline is longer, and a small part of the low-temperature cooling medium that has flowed through the first on-off switch 31 before the second step has flowed out Chuck 40, and return through the first return pipe 22 where the second on-off switch 32 is located, so the high and low temperature cooling medium will still not mix. Preferably, after the fourth step, a delay of 1.5 seconds can be set before the following fifth step is performed. The setting of the delay interval between the fourth step and the fifth step above needs to ensure that a small amount of low-temperature cooling medium remaining in the pipeline has entered the first return pipeline 22 where the second on-off switch 32 is located, while the high-temperature cooling medium is still there. The pipeline 28 at the outlet end of the chuck is not entered to ensure that the high and low temperature cooling medium will not mix.

The fifth step S5 is to set the fourth control signal to 1, keep the fifth control signal, the first control signal, the third control signal, and the sixth control signal at 1, and keep the second control signal at 0, and at this time the fourth on-off Switch 34 is connected, and the fifth on-off switch 35, the third on-off switch 33, the second on-off switch 32 are all connected, the first on-off switch 31 and the sixth on-off switch 36 are all off, in this case Most of the low-temperature cooling medium forms a self-circulation through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located, and a small part of the low-temperature cooling medium remaining in the first return pipeline 22 where the second on-off switch 32 is located passes through the second circuit. The off switch 32 flows back to the low-temperature cooling source. At this time, the high-temperature cooling medium enters the chuck 40 sequentially through the second output pipeline 23 where the third on-off switch 33 is located, and the chuck inlet pipeline 27 where the flowmeter 50 is located. The cooling medium returns to the high-temperature cooling source (that is, the second temperature control source 12 ) through the second return pipe 24 where the fourth on-off switch 34 is located, and a small part of the high-temperature cooling medium enters the first return flow where the second on-off switch 32 is located. The pipeline 22 is temporarily not mixed with the low-temperature cooling medium, and the high-temperature cooling medium is circulated and cooled between the chuck and the high-temperature cooling source. Preferably, after the fifth step, a delay of 0.9 seconds can be set before the following sixth step is performed. The setting of the delay interval between the fifth step and the sixth step above needs to ensure that the residual low-temperature cooling medium has completely flowed back to the low-temperature cooling source, and the high-temperature cooling medium does not flow back through the second on-off switch 32 .

In the sixth step S6, set the second control signal to 1, keep the fifth control signal, the first control signal, the third control signal, the sixth control signal and the fourth control signal at 1, and at this time the second on-off switch 32 is off open, and the fifth on-off switch 35, the third on-off switch 33 and the fourth on-off switch 34 are all connected, the first on-off switch 31 and the sixth on-off switch 36 are all off, in this case, the high temperature The cooling medium enters the chuck 40 sequentially through the second output pipeline 23 where the third on-off switch 33 is located, the chuck inlet pipeline 27 where the flowmeter 50 is located, and then passes through the second return pipeline where the fourth on-off switch 34 is located. 24 Return to the high-temperature cooling source, and the high-temperature cooling medium circulates and cools between the chuck and the high-temperature cooling source. At this time, the low-temperature cooling medium forms a self-circulation through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located. Thus, the switching from the low-temperature cooling medium to the high-temperature cooling medium is completed. 3. The switching process from high-temperature cooling source to low-temperature cooling source (on the basis of completing the sixth step above), as shown in Figure 3:

In the seventh step S7, the sixth control signal is set to 0, and the sixth on-off switch 36 is connected at this time, and other control signals are kept to be 1, that is, the first on-off switch 31 and the second on-off switch 32 are all off, and the fifth on-off switch 36 is connected. The on-off switch 35, the fourth on-off switch 34 and the third on-off switch 33 are all connected. In this case, a part of the high-temperature cooling medium forms a self-circulation through the second short-circuit pipeline 26 where the sixth on-off switch 36 is located. Another part of the high-temperature cooling medium enters the chuck 40 sequentially through the second output pipeline 23 where the third on-off switch 33 is located, and the chuck inlet pipeline 27 where the flowmeter 50 is located, and then passes through the second output pipe 23 where the fourth on-off switch 34 is located. The second return pipeline 24 returns to the high-temperature cooling source, and the high-temperature cooling medium circulates and cools between the chuck and the high-temperature cooling source. At this time, the low-temperature cooling medium forms self-circulation through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located, and the high-temperature cooling medium , Low temperature cooling media will not mix. Preferably, it is possible to set a delay of 0.5S after the seventh step before performing the following eighth step, that is, after setting the sixth control signal to 0, delay for 0.5S before setting the next control signal.

In the eighth step S8, the third control signal is set to 0, the sixth control signal is kept to be 0, and the other control signals are kept to be 1. At this time, the third on-off switch 33 is turned off, and the fifth on-off switch 35 and the fourth on-off switch are turned off. The off switch 34 and the sixth on-off switch 36 are all connected, the first on-off switch 31 and the second on-off switch 32 are all off, and most of the high-temperature cooling medium passes through the second short-circuit pipeline 26 where the sixth on-off switch 36 is located. A self-circulation is formed, and a small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 continues to flow on the basis of the seventh step S7, that is, passes through the second on-off switch 33 where the third on-off switch 33 is located in sequence. The output pipeline 23 and the chuck inlet pipeline 27 where the flowmeter 50 is located enter the chuck 40, and then flow back to the high-temperature cooling source through the second return pipeline 24 where the fourth on-off switch 34 is located, and the high-temperature cooling medium flows between the chuck and the The high-temperature cooling sources are circulated for cooling. At this time, the low-temperature cooling medium passes through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located to form a self-circulation, and the high-temperature and low-temperature cooling medium will not mix. Preferably, after the eighth step, a delay of 0.4S can be set before the following ninth step is performed, that is, after the third control signal is set to 0, the next control signal is set after a delay of 0.5S.

In the ninth step S9, the first control signal is set to 0, the sixth control signal and the third control signal are kept at 0, and the other control signals are kept at 1. At this time, the first on-off switch 31 is connected, and the fifth on-off switch 35 , the fourth on-off switch 34 and the sixth on-off switch 36 are all connected, and the third on-off switch 33 and the second on-off switch 32 are all off. The second short-circuit pipeline 26 where the disconnect switch 36 is located forms a self-circulation, and the small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 continues to flow on the basis of the eighth step S8, and the high-temperature cooling medium continues to flow in the eighth step S8. Circulating cooling between the chuck and the high-temperature cooling source. At this time, most of the low-temperature cooling medium passes through the first short-circuit pipeline 25 where the fifth on-off switch 35 is located to form a self-circulation, and a small part of the low-temperature cooling medium passes through the first short-circuit pipeline 25 where the first on-off switch 31 is located. The first output pipeline 21 and the chuck inlet pipeline 27 where the flowmeter 50 is located enter the chuck 40, because this part of the pipeline is relatively long, and has flowed through a small part of the third on-off switch 33 before the seventh step S7 The high-temperature cooling medium has flowed out of the chuck 40, and has been flowing back to the high-temperature cooling source through the second return pipe 24 where the fourth on-off switch 34 is located, so the high-temperature and low-temperature cooling medium will not mix. Preferably, it is possible to set a delay of 0.4S after the ninth step before performing the following tenth step, that is, after setting the first control signal to 0, delay 0.4S before setting the next control signal.

In the tenth step S10, the fifth control signal is set to 0, the first control signal, the third control signal and the sixth control signal are kept at 0, and the other control signals are kept at 1. At this time, the fifth on-off switch 35 is turned off, and The fourth on-off switch 34, the first on-off switch 31, and the sixth on-off switch 36 are all connected, and the third on-off switch 33 and the second on-off switch 32 are all off. In this case, most of the high-temperature cooling The medium forms self-circulation through the second short-circuit pipeline 26 where the sixth on-off switch 36 is located, and the small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 continues on the basis of the ninth step S9 At this time, the first short-circuit pipeline 25 where the fifth on-off switch 35 is located is cut off, and the low-temperature cooling medium passes through the first output pipeline 21 where the first on-off switch 31 is located, and the chuck inlet pipeline where the flowmeter 50 is located. 27 The flow rate entering the chuck 40 becomes larger, but similar to the ninth step S9, because this part of the pipeline is longer, and a small part of the high-temperature cooling medium that has flowed through the third on-off switch 33 before the seventh step S7 Has flowed out of the chuck 40, and has been returning to the high-temperature cooling source through the second return pipe 24 where the fourth on-off switch 34 is located, and the high-temperature and low-temperature cooling media will still not mix. Preferably, after the tenth step, a delay of 1.5 seconds can be set before the following eleventh step is performed. The setting of the delay interval between the tenth step S10 and the eleventh step S11 above needs to ensure that a small amount of high-temperature cooling medium remaining in the pipeline has entered the pipeline 28 at the outlet end of the chuck, while the low-temperature cooling medium has not entered the chuck. Outlet end pipeline 28.

In the eleventh step S11, set the second control signal to 0, keep the fifth control signal, the first control signal, the third control signal and the sixth control signal at 0, and keep the other control signals at 1, at this time the second on-off The switch 32 is connected, and the fourth on-off switch 34, the first on-off switch 31, and the sixth on-off switch 36 are all connected, the fifth on-off switch 35, and the third on-off switch 33 are all off, and most of the high-temperature cooling medium The second short-circuit pipe 26 where the sixth on-off switch 36 is located forms a self-circulation, and a small part of the high-temperature cooling medium remaining in the second return pipe 24 flows back to the high-temperature cooling source through the fourth on-off switch 34 . At this time, the low-temperature cooling medium enters the chuck 40 through the first output pipeline 21 where the first on-off switch 31 is located, and the chuck inlet pipeline 27 where the flowmeter 50 is located, and most of the low-temperature cooling medium passes through the second on-off switch 32 The first return pipe 22 where it is located returns to the low-temperature cooling source, and a small part of the low-temperature cooling medium enters the chuck outlet end pipeline 28, but it does not flow to the second return pipe 24 where the fourth on-off switch 34 is located temporarily, so the low-temperature cooling The medium is not mixed with the high-temperature cooling medium, and the low-temperature cooling medium is circulated and cooled between the chuck and the low-temperature cooling source. Preferably, after the eleventh step, a delay of 0.9S can be set before the following twelfth step is performed. The setting of the delay interval between the above eleventh step S11 and the twelfth step S12 needs to ensure the residual high temperature as much as possible. The cooling medium has all returned to the high-temperature cooling source, and the low-temperature cooling medium has not flowed through the fourth on-off switch 34 .

In the twelfth step S12, set the fourth control signal to 0, keep the fifth control signal, the first control signal, the second control signal, the third control signal and the sixth control signal at 0, and at this time connect with the fourth on-off switch 34 is off, and the first on-off switch 31, the second on-off switch 32, the third on-off switch 33 and the sixth on-off switch 36 are all connected, and the fifth on-off switch 35 is off. In this case, The low-temperature cooling medium enters the chuck 40 through the first output pipeline 21 where the first on-off switch 31 is located and the chuck inlet pipeline 27 where the flowmeter 50 is located, and then passes through the first return pipeline where the second on-off switch 32 is located. 22 Return to the low-temperature cooling source, and the low-temperature cooling medium circulates and cools between the chuck and the low-temperature cooling source. At this time, the high-temperature cooling medium forms a self-circulation through the second short-circuit pipeline 26 where the sixth on-off switch 36 is located. Thus, switching from the high-temperature cooling medium to the low-temperature cooling medium is completed.

It should be noted that the delay interval between the above two adjacent steps can be adjusted at any time according to the actual test results, so that the control process takes the shortest time while meeting the control requirements, thereby further shortening the temperature control time.

To sum up, in the technical solution of the temperature control device and method in the semiconductor manufacturing equipment provided by the present invention, the temperature control device includes a first temperature control source and a second temperature control source, by making the temperature of the two temperature control sources The temperature of the control medium is different, and different temperature control functions can be used (one heating and one cooling, or the degree of heating or cooling is different, etc.), so that the temperature control time can be shortened and the temperature control range can be expanded. Moreover, the controller of the temperature control device can Control a plurality of on-off switches to connect or disconnect sequentially in chronological order, so as to switch the chuck from connecting with the first temperature control source to connecting with the second temperature control source, or connect the chuck with the second temperature control source Switch to communicate with the first temperature control source, that is, realize the switching of two temperature control sources, so that different wafer temperature control requirements of different processes or steps can be realized, and at the same time, because multiple on-off switches are connected in sequence in chronological order Compared with the simultaneous operation of multiple on-off switches, it can not only avoid the cross-mixing of temperature-controlled media of different temperatures and affect the temperature of the temperature-controlled media, thereby ensuring the accuracy of temperature control, but also avoiding the The abnormal liquid level in the pipeline caused by the cross-mixing of the temperature control medium will cause shutdown, thus ensuring the normal and stable operation of the temperature control device.

It can be understood that the above implementations are only exemplary implementations adopted to illustrate the principles of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the application, and these modifications and improvements are also regarded as the protection scope of the application.

In the description of this application, it is to be understood that the terms "centre", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", " The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the application and simplifying the description, rather than indicating or implying the It should not be construed as limiting the application to indicate that a device or element must have a particular orientation, be constructed, and operate in a particular orientation.

The terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, unless otherwise specified, "plurality" means two or more.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.

In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

The above are only some implementations of the present application. It should be pointed out that for those of ordinary skill in the art, some improvements and modifications can be made without departing from the principle of the application, and these improvements and modifications should also be considered as For the scope of protection of this application.

11: The first temperature control source 12: Second temperature control source 21: The first output pipeline 22: The first return pipeline 23: Second output pipeline 24: Second return pipeline 25: The first short-circuit pipe 26: The second short-circuit pipeline 27: Chuck inlet pipe 28: Chuck outlet pipe 31: The first on-off switch 32: Second on-off switch 33: The third on-off switch 34: The fourth on-off switch 35: Fifth on-off switch 36: The sixth on-off switch 40: Chuck 50: flow meter S1, S2, S3, S4, S5, S6, S7, S8, S9, S10, S11, S12: steps

FIG. 1 is a schematic structural diagram of a temperature control device in semiconductor manufacturing equipment provided in this embodiment; FIG. 2 is a flow chart of switching from a low-temperature cooling source to a high-temperature cooling source adopted in the temperature control method in semiconductor manufacturing equipment provided by this embodiment; FIG. 3 is a flowchart of switching from a high-temperature cooling source to a low-temperature cooling source adopted in the temperature control method in the semiconductor manufacturing equipment provided by this embodiment.

11: The first temperature control source

12: Second temperature control source

21: The first output pipeline

22: The first return pipeline

23: Second output pipeline

24: Second return pipeline

25: The first short-circuit pipe

26: The second short-circuit pipeline

27: Chuck inlet pipe

28: Chuck outlet pipe

31: The first on-off switch

32: Second on-off switch

33: The third on-off switch

34: The fourth on-off switch

35: Fifth on-off switch

36: The sixth on-off switch

40: Chuck

50: flow meter

Claims (10)

A temperature control device in semiconductor process equipment, used to control the temperature of the chuck in the semiconductor process equipment, including a first temperature control source, a second temperature control source, a first output pipeline, a second output pipeline, a first return pipeline, a second return pipeline, a first short-circuit pipeline, a second short-circuit pipeline and a controller, wherein; The output port of the first temperature control source communicates with the inlet of the chuck through the first output pipe, and the return port of the first temperature control source communicates with the outlet of the chuck through the first return pipe; The output port of the second temperature control source communicates with the inlet of the chuck through the second output pipeline, and the return port of the second temperature control source communicates with the outlet of the chuck through the second return pipeline; The output port of the first temperature control source communicates with the return port of the first temperature control source through the first short-circuit pipe, and the output port of the second temperature control source communicates with the second temperature control source through the second short-circuit pipe. The return port of the source is connected; The first output pipeline, the second output pipeline, the first return pipeline, the second return pipeline, the first short-circuit pipeline, and the second short-circuit pipeline are all provided with an on-off switch; The controller is used to sequentially connect or disconnect a plurality of the on-off switches in chronological order, switch the chuck from the first temperature control source to the second temperature control source, or switch the chuck from the first temperature control source to the second temperature control source. Switching from communicating with the second temperature control source to communicating with the first temperature control source, the temperature of the temperature control medium in the first temperature control source is different from the temperature of the temperature control medium in the second temperature control source. The temperature control device as described in claim 1, further comprising a chuck inlet pipeline and a chuck outlet pipeline, the first output pipeline and the second output pipeline both pass through the chuck inlet The pipeline communicates with the inlet of the chuck, and a flowmeter is arranged on the pipeline at the inlet end of the chuck, and both the first return pipeline and the second return pipeline communicate with the outlet of the chuck through the pipeline at the outlet end of the chuck . The temperature control device as described in claim 1, wherein, the first output pipeline is provided with a first on-off switch, the first return pipeline is provided with a second on-off switch, and the second output pipeline is provided with a first Three on-off switches, the second return pipe is provided with a fourth on-off switch, the first short-circuit pipe is provided with a fifth on-off switch, and the second short-circuit pipe is provided with a sixth on-off switch; When the first on-off switch, the second on-off switch and the sixth on-off switch are connected, and the third on-off switch, the fourth on-off switch and the fifth on-off switch are off, the card The disc communicates with the first temperature control source; When the first on-off switch, the second on-off switch and the sixth on-off switch are off, and the third on-off switch, the fourth on-off switch and the fifth on-off switch are on, the card The disk is in communication with the second temperature control source. The temperature control device according to claim 3, wherein the first on-off switch, the second on-off switch and the sixth on-off switch are normally open switches, the third on-off switch, the fourth on-off switch The off switch and the fifth on-off switch are normally closed switches. The temperature control device according to claim 3, wherein the controller is configured to sequentially place the chuck in chronological order when switching the chuck from communicating with the first temperature control source to communicating with the second temperature control source The fifth on-off switch is connected, the first on-off switch is turned off, the third on-off switch is connected, the sixth on-off switch is turned off, the fourth on-off switch is connected, the The second on-off switch is turned off. The temperature control device according to claim 3, wherein the controller is configured to, when the chuck is switched from communicating with the second temperature control source to communicating with the first temperature control source, sequentially place the The sixth on-off switch is connected, the third on-off switch is turned off, the first on-off switch is connected, the fifth on-off switch is turned off, the second on-off switch is connected, the The fourth on-off switch is turned off. A temperature control method in semiconductor processing equipment, wherein it is applied to the temperature control device described in any one of claim 1 to claim 6, and the method includes: When switching the chuck from communicating with the first temperature control source to communicating with the second temperature control source, or switching the chuck from communicating with the second temperature control source to communicating with the first temperature control source , connecting or disconnecting a plurality of the on-off switches sequentially in chronological order. The temperature control method as described in claim item 7, wherein a first on-off switch is set on the first output pipeline, a second on-off switch is set on the first return pipeline, and a first on-off switch is set on the second output pipeline. Three on-off switches, the second return pipe is provided with a fourth on-off switch, the first short-circuit pipe is provided with a fifth on-off switch, and the second short-circuit pipe is provided with a sixth on-off switch; Switching the chuck from communicating with the first temperature control source to communicating with the second temperature control source includes: The fifth on-off switch is connected sequentially in chronological order, the first on-off switch is turned off, the third on-off switch is connected, the sixth on-off switch is turned off, and the fourth on-off switch is turned off. The off switch is connected, and the second on-off switch is turned off. The temperature control method as described in claim item 7, wherein a first on-off switch is set on the first output pipeline, a second on-off switch is set on the first return pipeline, and a first on-off switch is set on the second output pipeline. Three on-off switches, the second return pipe is provided with a fourth on-off switch, the first short-circuit pipe is provided with a fifth on-off switch, and the second short-circuit pipe is provided with a sixth on-off switch; Switching the chuck from communicating with the second temperature control source to communicating with the first temperature control source includes: In chronological order, the sixth on-off switch is connected, the third on-off switch is turned off, the first on-off switch is connected, the fifth on-off switch is turned off, and the second on-off switch is turned off. The off switch is connected, and the fourth on-off switch is turned off. The temperature control method as described in claim item 8 or claim item 9, wherein there is a delay interval between any two adjacent operations of the on-off switch being connected or disconnected in the time sequence, the delay The time interval is 0~2 seconds.

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