WO2022203285A1 - 이미지 안정화 어셈블리를 포함하는 카메라 모듈 및 상기 카메라 모듈을 포함하는 전자 장치 - Google Patents
이미지 안정화 어셈블리를 포함하는 카메라 모듈 및 상기 카메라 모듈을 포함하는 전자 장치 Download PDFInfo
- Publication number
- WO2022203285A1 WO2022203285A1 PCT/KR2022/003768 KR2022003768W WO2022203285A1 WO 2022203285 A1 WO2022203285 A1 WO 2022203285A1 KR 2022003768 W KR2022003768 W KR 2022003768W WO 2022203285 A1 WO2022203285 A1 WO 2022203285A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- magnet
- coil
- axis direction
- optical axis
- substrate
- Prior art date
Links
- 230000006641 stabilisation Effects 0.000 title claims abstract description 82
- 238000011105 stabilization Methods 0.000 title claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 117
- 230000003287 optical effect Effects 0.000 claims abstract description 97
- 238000000034 method Methods 0.000 claims description 20
- 238000005096 rolling process Methods 0.000 claims description 5
- 238000004891 communication Methods 0.000 description 49
- 239000010410 layer Substances 0.000 description 35
- 230000006870 function Effects 0.000 description 24
- 238000012545 processing Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000013528 artificial neural network Methods 0.000 description 8
- 230000004044 response Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 239000003381 stabilizer Substances 0.000 description 6
- 230000000087 stabilizing effect Effects 0.000 description 6
- 238000013473 artificial intelligence Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004590 computer program Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003702 image correction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013527 convolutional neural network Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010801 machine learning Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000306 recurrent effect Effects 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000010267 cellular communication Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003155 kinesthetic effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000001537 neural effect Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/64—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
- G02B27/646—Imaging systems using optical elements for stabilisation of the lateral and angular position of the image compensating for small deviations, e.g. due to vibration or shake
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B5/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B5/04—Vertical adjustment of lens; Rising fronts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0007—Movement of one or more optical elements for control of motion blur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B2205/00—Adjustment of optical system relative to image or object surface other than for focusing
- G03B2205/0053—Driving means for the movement of one or more optical element
- G03B2205/0069—Driving means for the movement of one or more optical element using electromagnetic actuators, e.g. voice coils
Definitions
- the present disclosure relates to a camera module including an image stabilization assembly and an electronic device including the same.
- the electronic device may include one or more camera modules.
- the camera module may include an image stabilization assembly to compensate for shake of the camera module.
- the image stabilization assembly may be configured to change a position of light incident through a lens and formed on an image sensor for image correction when disturbance occurs.
- the camera module may include an image stabilization assembly for supporting functions related to image stabilization.
- the image stabilization assembly may perform an operation for image correction when a disturbance (eg, drop impact, hand shake, or vibration) is applied to the camera module and/or the electronic device.
- a disturbance eg, drop impact, hand shake, or vibration
- the image stabilization assembly may be configured to linearly move the image sensor in at least two axial directions perpendicular to the optical axis.
- Embodiments disclosed in this document provide an image stabilization assembly that moves an image sensor so that light reflected from a subject and passed through a lens assembly is focused on a designated position of the image sensor.
- the image stabilization assembly may include a guide structure, a coil, and a magnet.
- a camera module includes a lens assembly including a lens; and a moving member comprising a first substrate and an image sensor electrically coupled to the first substrate, the image stabilization assembly being mounted to the lens assembly such that an optical axis is at least partially aligned with the image sensor. connected; and wherein the image stabilization assembly may be configured to move the movable member in at least one direction perpendicular to the optical axis such that the optical axis is aligned with a designated position of the image sensor.
- an image correction function may be performed by moving an image sensor in response to a disturbance applied to a camera module and/or an electronic device. Thereby, image quality can be improved.
- FIG. 1 is a front perspective view of an electronic device according to an exemplary embodiment
- FIG. 2 is a rear perspective view of an electronic device according to an exemplary embodiment.
- FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
- FIG. 4 is a diagram illustrating a camera module according to an embodiment.
- FIG. 5 is a view illustrating a lens assembly and an image stabilization assembly of a camera module according to an exemplary embodiment.
- FIG. 6 is a view illustrating a moving member of an image stabilization assembly according to an exemplary embodiment.
- FIG. 7 is a view illustrating a moving member, a guide structure, and a driving unit of the image stabilization assembly according to an exemplary embodiment.
- FIG. 8 is a view illustrating a coupling of a guide structure and a fixing frame of an image stabilization assembly according to an exemplary embodiment.
- 9A and 9B are views illustrating a guide structure of an image stabilization assembly according to an exemplary embodiment.
- 10A and 10B are diagrams illustrating an arrangement of magnets and coils of an image stabilization assembly according to an exemplary embodiment.
- FIG. 11A and 11B are views illustrating operations of a moving member and a connecting member of the image stabilizing assembly according to an exemplary embodiment.
- FIGS. 12A and 12B are views illustrating operations of a moving member and a connecting member of an image stabilizing assembly according to an exemplary embodiment.
- FIG. 13 is a view illustrating an inside of a lens assembly of a camera module according to an exemplary embodiment.
- FIGS. 14A and 14B are views illustrating a camera module and an image stabilization assembly according to various embodiments of the present disclosure
- FIG. 15 is a diagram illustrating a camera module and an image stabilization assembly according to various embodiments of the present disclosure
- 16A and 16B are diagrams illustrating a camera module and an image stabilization assembly according to various embodiments of the present disclosure
- 17 is a view illustrating a connection member of a camera module according to various embodiments of the present disclosure.
- FIG. 18 is a block diagram illustrating an electronic device in a network environment, according to various embodiments of the present disclosure
- FIG. 19 is a block diagram illustrating a configuration of a camera module according to various embodiments of the present disclosure.
- 1 is a front perspective view of an electronic device according to an exemplary embodiment
- 2 is a rear perspective view of an electronic device according to an exemplary embodiment.
- the electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A and a second surface ( 110B) and may include a housing 110 including a side surface 110C surrounding the space therebetween.
- the housing 110 may refer to a structure forming a part of the first surface 110A, the second surface 110B, and the side surface 110C.
- the first surface 110A may be formed by the front plate 102 (eg, the front plate 120 of FIG. 3 ) at least a portion of which is substantially transparent.
- the front plate 102 may include a glass plate comprising various coating layers, or a polymer plate.
- the second surface 110B may be formed by a substantially opaque rear plate 111 (eg, the rear plate 180 of FIG. 3 ).
- the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
- the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or “frame structure”) 118 including a metal and/or a polymer.
- the back plate 111 and the side bezel structure 118 may be integrally formed and made of the same material (eg, a metal material such as aluminum). may include
- the front plate 102 may include two first regions 110D that extend seamlessly by bending in the direction of the rear plate 111 from a partial region of the first surface 110A. have.
- the first regions 110D may be positioned at both ends of a long edge of the front plate 102 .
- the rear plate 111 may include two second regions 110E that are curved and extend seamlessly in the direction of the front plate 102 from a partial region of the second surface 110B.
- the second regions 110E may be included at both ends of the long edge of the back plate 111 .
- the front plate 102 (or the back plate 111 ) may include only one of the first regions 110D (or the second regions 110E). Also, in another embodiment, the front plate 102 (or the rear plate 111 ) may not include some of the first regions 110D (or the second regions 110E).
- the first regions 110D or the second regions 110E are not included in the lateral direction (eg: short side) may have a first thickness (or width), and may have a second thickness thinner than the first thickness in a lateral direction (eg, a long side) including the first regions 110D or second regions 110E. have.
- the side bezel structure 118 may be integrally formed with the back plate 111 .
- the electronic device 100 includes a display 101 (eg, the display 130 of FIG. 3 , the display module 1860 of FIG. 18 ), the audio modules 103 , 104 , 107 , and a sensor module (eg, the display module 1860 of FIG. 18 ).
- the sensor module 1876 of FIG. 18 the sensor module 1876 of FIG. 18
- camera modules 105 and 112 eg, the camera module 1880 of FIG. 18
- a connector hole 108 may include at least one of.
- the electronic device 100 may omit at least one of the components (eg, the key input device 117 or a light emitting device (not shown)) or additionally include other components.
- the display 101 may be exposed through at least a portion of the front plate 102 .
- at least a portion of the display 101 may be exposed through the front plate 102 including the first surface 110A and the first areas 110D of the side surface 110C.
- the shape of the display 101 may be substantially the same as an adjacent outer shape of the front plate 102 .
- the distance between the periphery of the display 101 and the periphery of the front plate 102 may be substantially the same.
- the surface (or front plate 102 ) of the housing 110 may include a screen display area in which the display 101 is visually exposed (eg, visible) and content is displayed via pixels.
- the screen display area may include a first surface 110A and side first areas 110D.
- the display 101 may include a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen, or adjacent to the display 101 . can be placed.
- the screen display areas 110A and 110D may include a sensing area 110F and/or a camera area 110G.
- the sensing region 110F may be at least partially overlapped with the screen display regions 110A and 110D.
- the sensing area 110F may display content like other areas of the screen display areas 110A and 110D, and may additionally mean an area through which an input signal related to the second sensor module 106 passes.
- the second sensor module 106 is disposed below the screen display areas 110A and 110D, and the sensing area 110F may be formed in at least a portion of the screen display areas 110A and 110D. have.
- the second sensor module 106 may be configured to receive an input signal transmitted through the sensing region 110F and generate an electrical signal based on the received input signal.
- the input signal may have a specified physical quantity (eg, heat, light, temperature, sound, pressure, or ultrasound).
- the input signal may include a signal related to the user's biometric information (eg, fingerprint).
- the second sensor module 106 may include an optical fingerprint sensor configured to receive light.
- the second sensor module 106 is configured to receive an optical signal emitted from a pixel included in the display 101 , reflected by a fingerprint of a user's finger, and transmitted through the sensing region 110F. can be configured.
- the second sensor module 106 may include an ultrasonic fingerprint sensor configured to transmit and receive ultrasonic waves.
- the second sensor module 106 may be configured to transmit an ultrasonic wave toward a fingerprint of a user's finger and receive an ultrasonic wave reflected by the finger and transmitted through the sensing region 110F.
- the camera area may be at least partially overlapped with the screen display areas 110A and 110D.
- the camera area 110G may display content like other areas of the screen display areas 110A and 110D, and additionally means an area (eg, a transmission area) through which an optical signal related to the first camera module 105 is transmitted. can do.
- the camera area 110G may be configured to display content when the first camera module 105 does not operate, like other areas of the screen display areas 110A and 110D.
- the camera region 110G of the display 110 may be formed as a transmissive region having a specified transmittance, and the transmissive region may be formed to have a transmittance in a range of about 20% to about 40%.
- the transmission area includes an area overlapping an effective area (eg, field of view (FOV)) of the first camera module 105 through which light for generating an image by being imaged by an image sensor passes. can do.
- the transmissive area of the display 110 may include an area having a lower pixel density and/or wiring density than the surrounding area.
- the first camera module 105 may be disposed below the screen display areas 110A and 110D, and may be configured to receive light passing through the camera area 110G.
- the light received by the first camera module 105 may include light reflected by or emitted from the subject.
- the first camera module 105 may be configured to generate an electrical signal related to the image based on the received light.
- the first camera module 105 may not be exposed to the surface (eg, the front surface 110A) of the electronic device 100 .
- the first camera module 105 may be covered by content displayed in the camera area 110G.
- the optical axis of the lens included in the first camera module 105 may be disposed to pass through the camera area 110G included in the display 101 .
- the second camera module 112 may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).
- the second camera module 112 is not necessarily limited to including a plurality of camera modules, and may include one camera module.
- the first camera module 105 and/or the second camera module 112 may include one or more lenses, an image sensor, and/or an image signal processor.
- the flash 113 may include, for example, a light emitting diode or a xenon lamp.
- two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors are disposed inside the housing so that one side (eg, second side 110B) of the electronic device 100 faces. ) can be placed in
- the sensor module (eg, the sensor module 1876 of FIG. 18 ) and/or the second sensor module 106 may include electricity corresponding to an internal operating state of the electronic device 100 or an external environmental state. It can generate signals or data values.
- the sensor module (not shown) may include a first surface 110A, a second surface 110B, or a side surface 110C (eg, the first regions 110D and/or a side surface 110C) of the housing 110 . It may be disposed in at least a portion of the second regions 110E).
- a sensor module eg, sensor module 1876 of FIG. 18
- second sensor module 106 may include a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, and a magnetic sensor.
- an acceleration sensor e.g., a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and at least one of an illuminance sensor.
- the fingerprint sensor may be disposed on the second surface 110B.
- the audio module 103 , 104 , 107 may include a microphone hole 103 , 104 and a speaker hole 107 .
- the microphone holes 103 and 104 may include a first microphone hole 103 formed in a partial area of the side surface 110C and a microphone hole 104 formed in a partial area of the second surface 110B. have.
- a microphone for acquiring an external sound may be disposed inside the housing 110 .
- the microphone may include a plurality of microphones to detect the direction of sound.
- the second microphone hole 104 formed in a partial region of the second surface 110B may be disposed adjacent to the camera modules 105 and 112 .
- the second microphone hole 104 may acquire a sound when the camera modules 105 and 112 are executed or a sound when other functions are executed.
- the speaker hole 107 may include a receiver hole (not shown) for a call.
- the speaker hole 107 may be formed in a portion of the side surface 110C of the electronic device 100 .
- the speaker hole 107 may be implemented as a single hole with the microphone hole 103 .
- a receiver hole for a call may be formed in another part of the side surface 110C.
- the receiver hole for a call is a part of the side 110C on which the speaker hole 107 is formed (eg, a part facing the -Y-axis direction) and another part of the side 110C facing (eg: +Y-axis direction).
- the electronic device 100 may include a speaker fluidly connected to the speaker hole 107 so that a fluid flows.
- the speaker may include a piezo speaker in which the speaker hole 107 is omitted.
- the key input device 117 may be disposed on the side surface 110C of the housing 110 (eg, the first regions 110D and/or the second regions 110E).
- the electronic device 100 may not include some or all of the key input devices 117 , and the not included key input devices 117 may be in other forms such as soft keys on the display 101 .
- the key input device may include the second sensor module 106 forming the sensing area 110F included in the screen display areas 110A and 110D.
- the connector hole 108 may receive a connector.
- the connector hole 108 may be disposed on the side surface 110C of the housing 110 .
- the connector hole 108 may be disposed on the side surface 110C to be adjacent to at least a portion of the audio module (eg, the microphone hole 103 and the speaker hole 107 ).
- the electronic device 100 includes a first connector hole 108 and/or an external electronic device that can accommodate a connector (eg, a USB connector) for transmitting/receiving power and/or data with an external electronic device. It may include a second connector hole (not shown) capable of accommodating a connector (eg, an earphone jack) for transmitting/receiving a device and an audio signal.
- the electronic device 100 may include a light emitting device (not shown).
- the light emitting device (not shown) may be disposed on the first surface 110A of the housing 110 .
- the light emitting device (not shown) may provide state information of the electronic device 100 in the form of light.
- the light emitting device (not shown) may provide a light source that is interlocked with the operation of the first camera module 105 .
- the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.
- the electronic device 100 has a bar-type or plate-type appearance, but is not limited thereto.
- the illustrated electronic device 100 may include a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device ( rollable electronic device).
- the foldable electronic device, the slideable electronic device, the stretchable electronic device, and/or the rollable electronic device are configured to mechanically operate such that a screen display area is expanded or reduced according to a user's selection, and corresponds to the mechanical operation It may include a display configured to be deformed in shape.
- the display may include an area bendable to a flat or curved surface.
- the display may be formed to be foldable, unfolded, slidable, or rolled in response to a mechanical operation of the electronic device.
- FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
- the electronic device 100 includes a front plate 120 (eg, the front plate 102 of FIG. 1 ), a display 130 (eg, the display 101 of FIG. 1 ), and a first support.
- Member 140 eg, bracket
- printed circuit board 150 eg, printed circuit board (PCB), flexible PCB (FPCB) or rigid-flexible PCB (RFPCB)
- battery 152 eg, second support member 160 (eg, a rear case), an antenna 170 , a rear plate 180 (eg, the rear plate 111 of FIG. 2 ), a second sensor module 106 , a first camera module 105 , and A second camera module 112 may be included.
- the front plate 120 , the back plate 180 , and the side bezel structure 141 of the first support member 140 form a housing (eg, the housing 110 of FIGS. 1 and 2 ). can do.
- the electronic device 100 may omit at least one of the components (eg, the first support member 140 or the second support member 160 ) or additionally include other components. . At least one of the components of the electronic device 100 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.
- the display 130 may be coupled or positioned on one surface of the first support member 140 and the printed circuit board 150 may be coupled or positioned on the other surface.
- the first support member 140 may include a side bezel structure 141 (eg, the side bezel structure 118 of FIG. 1 ) and a plate structure 142 .
- the side bezel structure 141 may form at least a portion of a surface (eg, the side surface 110C) of the electronic device.
- the side bezel structure 141 may be formed to connect edges of the front plate 120 and the rear plate 180, respectively.
- the display 130 and the printed circuit board 150 may be coupled or positioned on the plate structure 142 .
- the plate structure 142 may be positioned in a space between the front plate 120 and the rear plate 180 .
- the plate structure 142 may at least partially face the display 130 .
- the first support member 140 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
- the side bezel structure 141 and the plate structure 142 may be integrally formed or may be detachably coupled.
- a processor, memory, and/or an interface may be disposed on the printed circuit board 150 .
- the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
- the memory may include, for example, volatile memory or non-volatile memory.
- the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
- HDMI high definition multimedia interface
- USB universal serial bus
- the interface may, for example, electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
- the battery 152 is a device for supplying power to at least one component of the electronic device 100 , for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. may include. At least a portion of the battery 152 may be disposed substantially coplanar with the printed circuit board 150 , for example. The battery 152 may be integrally disposed inside the electronic device 100 , or may be disposed detachably from the electronic device 100 .
- the antenna 170 may be disposed between the back plate 180 and the battery 152 .
- the antenna 170 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
- the antenna 170 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
- the antenna 170 may be provided by a portion of the first support member 140 .
- the antenna 170 may be provided by a portion or combination of each of a side bezel structure and/or a plate structure.
- the first camera module 105 (eg, an under display camera (UDC)) may be at least partially accommodated in the first recess 130a formed in the display 130 .
- the first recess 130a may include an opening passing through the rear panel.
- the opening or the first recess 130a may be formed in consideration of a field of view (FOV) of the first camera module 105 .
- the first camera module 105 may receive light passing through a partial area (eg, the camera area 110G) of the front panel of the display 130 .
- the first camera module 105 may be disposed such that the optical axis L passes through the camera area 110G.
- the first camera module 105 may be coupled to some layer of the display 130 or located in an internal structure (eg, the plate structure 142 ).
- the first camera module 105 may be attached to the rear surface of some layers of the display 130 .
- the second sensor module 106 may be at least partially received in the second recess 130b formed in the display 130 .
- the second recess 130b may include an opening passing through the rear panel.
- the second sensor module 106 may receive an input signal passing through a partial area (eg, the sensing area 110F) of the front panel of the display 130 .
- the second sensor module 106 may be disposed such that at least a portion thereof is located inside the second recess 130b.
- the second sensor module 106 may be attached to the rear surface of the front panel of the display 130 .
- the first camera module 105 is at least partially received in the first recess 130a and the second sensor module 106 is at least partially received in the second recess 130b, such that the electronic device A thickness of (100) (eg, a thickness in the Z-axis direction) may be reduced.
- the first camera module 105 may include a punch hole camera (not shown) at least partially accommodated in a punch hole formed in the display 130 .
- the punch hole may be understood as the illustrated first recess 130a extending to the display panel.
- the punch hole camera may receive light passing through a partial area (eg, the camera area 110G) of the front plate 120 .
- content may not be displayed in the camera area 110G.
- the second camera module 112 may be configured to receive light through the second camera area 184 formed on the rear plate 180 .
- the second camera area 184 may include a transparent area.
- the second camera module 112 may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).
- FIG. 4 is a diagram illustrating a camera module according to an embodiment.
- 5 is a view illustrating a lens assembly and an image stabilization assembly of a camera module according to an exemplary embodiment.
- 6 is a view illustrating a moving member of an image stabilization assembly according to an exemplary embodiment.
- the camera module 200 may include a lens assembly 210 and an image stabilization assembly 230 .
- the lens assembly 210 may include a camera housing 211 , a lens unit 212 , and a reflective member 214 .
- the lens unit 212 and the reflective member 214 may be disposed inside the camera housing 211 .
- the camera housing 211 may be connected to the cover 233 of the image stabilization assembly 230 .
- the camera housing 211 and the cover 233 may be integrally formed.
- a light receiving area 2111 exposing the reflective member 214 may be formed on the first surface of the camera housing 211 .
- the first surface may be parallel to a part of the surface (eg, the rear surface 110B) of the electronic device 100 or may form a part of the surface (eg, the rear surface 110B) of the electronic device.
- light reflected from the subject may pass through the light receiving area 2111 and proceed to the reflective member 214 .
- the light receiving area 2111 may include an opening area to which the reflective member 214 is directly exposed or may include a transparent area.
- the light receiving area 2111 of the camera housing 211 is at least partially with a transparent area (eg, the second camera area 184 ) of the surface (eg, the back side 110B) of the electronic device 100 . can be sorted.
- the lens unit 212 may be located inside the camera housing 211 .
- the lens unit 212 may include one or a plurality of lenses.
- the plurality of lenses may define an optical axis L.
- the optical axis L may extend substantially in the X-axis direction.
- the optical axis L may be refracted or reflected by the reflective member 214 .
- the refracted or reflected optical axis L may extend outside the camera housing 211 through the reflective member 214 .
- the lens unit 212 may be disposed between the reflective member 214 and the image stabilization assembly 230 when viewed in an optical axis direction (eg, an X-axis direction).
- the lens unit 212 may be disposed between the reflective member 214 and the image sensor 242 when viewed in the optical axis L direction.
- the reflective member 214 and the image sensor 242 of the image stabilization assembly 230 may be disposed at least partially on the optical axis L.
- the reflective member 214 is disposed in a first optical axis direction (eg, X-axis direction) of the lens unit 212 , and the image sensor 242 is disposed in a second optical axis direction (eg, -X direction) of the lens unit 212 . axial direction).
- the reflective member 214 may be located inside the camera housing 211 . In an embodiment, the reflective member 214 may be positioned in the first optical axis direction (eg, the X-axis direction) of the lens unit 212 when viewed in the optical axis L direction. The lens unit 212 and the image sensor 242 (eg, the image sensor 1930 of FIG. 19 ) may be positioned in the second optical axis direction (eg, -X-axis direction) of the reflective member 214 . In an embodiment, the reflective member 214 may be configured to reflect or refract light reflected from the subject.
- the first optical axis direction eg, the X-axis direction
- the lens unit 212 and the image sensor 242 eg, the image sensor 1930 of FIG. 19
- the reflective member 214 may be configured to reflect or refract light reflected from the subject.
- the reflective member 214 may include a prism, a periscope lens, or an inclined mirror.
- the lens assembly 210 may further include a focus driver configured to move at least a portion of the lens unit in the optical axis L direction.
- the focus driving unit may include a magnet disposed in any one of the lens unit 212 or the camera housing 211 , and a coil disposed in the other.
- the camera module 200 may be configured to perform a zoom function and/or an autofocus function by moving the lens unit 212 in an optical axis direction using a focus driver.
- the image stabilization assembly 230 may include a fixed frame 231 , a cover 233 , a moving member 240 , a guide structure 250 , and a connection member 280 .
- the cover 233 and/or the fixing frame 231 may be connected to the camera housing 211 or may be integrally formed.
- the cover 233 and the fixing frame 231 may be integrally formed or may be detachably coupled.
- the cover 233 and the fixed frame 231 may form a space in which the moving member 240 is disposed.
- the fixing frame 231 may include an extension portion 232 surrounding at least a portion of the connecting member 280 .
- the moving member 240 may be configured to move in a direction perpendicular to the optical axis L.
- the image stabilization assembly 230 may perform an image stabilization function in response to external noise applied to the camera module 200 .
- the image stabilization assembly 230 may perform an image stabilization function by moving the moving member 240 in a direction perpendicular to the optical axis L.
- light reflected from the subject may pass through the lens assembly 210 to form an image on the image sensor 242 .
- the image formed on the image sensor 242 may be shaken by external noise.
- the optical axis L may be misaligned with the center of the image sensor 242 .
- the image stabilization assembly 230 may compensate for image shake by moving the moving member 240 including the image sensor 242 in at least two directions substantially perpendicular to the optical axis L.
- the movable member 240 may include a holder 243 , a first substrate 241 , an image sensor 242 , and coils 271 , 272 , 273 , and 274 .
- the holder 243 may be coupled to move together with the first substrate 241 .
- a protrusion to be fitted into the hole of the first substrate 241 may be formed in the holder 243 , or a hole to be fitted with the protrusion formed in the first substrate 241 may be formed in the holder 243 .
- the holder 243 may move together with the image sensor 242 and the first substrate 241 when the image stabilization function is performed.
- the holder 243 may include a first surface 243a facing the lens assembly 210 and a second surface 243b facing the guide structure 250 .
- an opening region 244 may be formed in the holder 243 so that the image sensor 242 and the holder 243 face each other.
- the opening region 244 may pass through the first surface 243a and the second surface 243b.
- the guide structure 250 may be coupled to the second surface 243b of the holder 243 . Light passing through the lens assembly 210 through the aperture area 244 may be focused on the image sensor.
- the first substrate 241 may include a first surface 241a facing the lens assembly 210 and a second surface 241b facing the first surface 241a.
- the first surface 241a may be a surface facing the first optical axis direction (eg, the +X axis direction), and the second surface may be a surface facing the second optical axis direction (eg, the -X axis direction).
- the image sensor 242 may be disposed on the first surface 241a of the first substrate 241 and one or more coils may be disposed on the second surface 241b of the first substrate 241 .
- the first substrate 241 may be disposed such that the opening area 244 of the holder 243 and the image sensor 242 are aligned.
- the connecting member 280 may be connected to one edge of the first substrate 241 .
- the image sensor 242 may be at least partially aligned with the optical axis L.
- the image sensor 242 may be electrically connected to the first substrate 241 or disposed on the first surface 241a of the first substrate 241 .
- the image sensor 242 may be configured to receive light passing through the lens and generate an electrical signal based on the received light signal.
- the image sensor 242 may face the lens included in the lens unit 212 through the opening area 244 of the holder 243 .
- the image stabilization assembly 230 may be configured to move the image sensor 242 and the holder 243 in a direction in which the center of the image sensor 242 and the optical axis are aligned.
- the coil may be positioned on the second surface 241b of the first substrate 241 .
- the plurality of coils 271 , 272 , 273 , and 274 include the coils 271 and 272 related to the Y-axis movement of the image sensor 242 , and the Z-axis direction movement of the image sensor 242 , and Associated coils 273 and 274 may be included.
- the plurality of coils 271 , 272 , 273 , and 274 may include a first coil 271 and a second coil 272 associated with movement in the Y-axis direction of the image sensor 242 , and the image sensor 242 . It may include a third coil 273 and a fourth coil 274 associated with movement in the Z-axis direction.
- the image stabilization assembly 230 moves the image sensor 242 in a direction perpendicular to the optical axis L (eg, Y-axis and/or Z-axis) by applying an electrical signal to the coil.
- image stabilization function can be performed.
- the coils 271 , 272 , 273 , and 274 may electromagnetically interact with a magnet (not shown) disposed on the fixed frame 231 .
- a magnet not shown
- electromagnetic force may be generated between the coils 271 , 272 , 273 , and 274 and the magnet.
- the electromagnetic force may move the moving member 240 movably coupled to the lens assembly 210 and the fixed frame 231 .
- the guide structure 250 may be configured to support the movement of the movable member 240 .
- the guide structure 250 may be movably coupled to each of the holder 243 and the fixing frame 231 .
- the guide structure 250 may be movably coupled to the holder 243 in the Y-axis direction, and may be movably coupled to the fixed frame 231 in the Z-axis direction.
- the guide structure 250 may move or be fixed together with the moving member 240 when the image stabilization function is performed.
- the guide structure 250 may move together with the moving member 240 in the Z-axis direction.
- the guide structure 250 is fixed together with the fixed frame 231 when the moving member 240 moves in the Y-axis direction, and can support the movement of the moving member 240 moving in the Y-axis direction. have.
- a second opening region 253 that is at least partially aligned with the coils 271 , 272 , 273 , and 274 in the X-axis direction may be formed in the guide structure 250 .
- coils 271 , 272 , 273 , 274 may directly face magnets (eg, magnets 261 , 262 , 263 , 264 of FIG. 7 ) through second opening region 253 .
- connection member 280 is connected to the first substrate 241 and transmits an electrical signal related to an image generated by the image sensor to the processor of the electronic device (eg, the processor 1820 of FIG. 18 ).
- the connection member 280 may include a second substrate 281 and a third substrate 283 .
- the second substrate 281 may be positioned at least partially on a side surface of the camera housing 211 .
- the second substrate 281 may be flexibly connected from the first substrate 241 .
- a connector 285 may be disposed or the connector 285 may be connected to the third board 283 .
- the connecting member 280 may include a first connecting portion 282 connecting the first substrate 241 and the second substrate 281 .
- the connecting member 280 may include a second connecting portion 284 connecting the second substrate 281 and the third substrate 283 .
- the second substrate 281 moves together with the movement of the first substrate 241
- the first connection portion 282 moves with the first substrate 241 .
- the shape of the second connecting portion 284 may be deformed according to the movement of the second substrate 281 .
- the third substrate 283 may be fixedly disposed inside the housing (eg, the first support member 142 of FIG. 3 ) of the electronic device 100 .
- connection member 280 may be provided as one substrate, or two or more substrates may be connected to each other.
- the connection member 280 may include a rigid region (eg, the second substrate 281 , the third substrate 283 ) and a flexible region (eg, the first connection portion 282 , the second connection portion 284 ).
- RFPCB Rigid-Flexible Printed Circuit Board
- the first substrate 241 on which the image sensor 242 is disposed is integrally formed with at least a portion of the connecting member 280 (eg, the second substrate 281 and the first connecting portion 282 ).
- FIG. 7 is a view illustrating a moving member, a guide structure, and a driving unit of the image stabilization assembly according to an exemplary embodiment.
- 8 is a view illustrating a coupling of a guide structure and a fixing frame of an image stabilization assembly according to an exemplary embodiment.
- 9A and 9B are perspective views of a guide structure of an image stabilization assembly according to an embodiment.
- the moving member 240 may include a holder 243 , a first substrate 241 , an image sensor 242 , and coils 271 , 272 , 273 , and 274 .
- the moving member 240 may be configured to move in at least two directions substantially perpendicular to the optical axis direction (eg, the X-axis direction) when the image stabilization function is performed.
- the at least two directions may be perpendicular to each other.
- the moving member 240 may move in the Y-axis and/or Z-axis direction.
- the fixing frame 231 extends in a substantially vertical direction (eg, in the X-axis direction) from the sidewall 2311 and the sidewall 2311 on which the magnets 261 , 262 , 263 , and 264 are disposed. It may include a bottom surface 2312 that is. The bottom surface 2312 may support the guide structure 250 in the Z-axis direction. At least a portion of the camera housing (eg, the camera housing 211 of FIG. 5 ) of the lens assembly (eg, the lens assembly 210 of FIG. 5 ) may be positioned on the bottom surface 2312 .
- the image stabilization assembly 230 may include drivers 201 and 202 .
- the driving units 201 and 202 may include one or more coils 271 , 272 , 273 , 274 and one or more magnets 261 , 262 , 263 , and 264 .
- the one or more coils 271 , 272 , 273 , and 274 may be disposed on the first substrate 241 .
- the one or more magnets 261 , 262 , 263 , and 264 may be at least partially disposed on the sidewall 2311 of the fixing frame 231 .
- each coil and each magnet may be arranged to at least partially overlap each other when viewed in an optical axis direction (eg, an X-axis direction).
- the driving units 201 and 202 may include a first driving unit 201 associated with movement of the movable member 240 in the Y-axis direction and a second driving unit 202 associated with movement of the movable member in the Z-axis direction. have.
- the first driving unit 201 may include a first coil 271 , a second coil 272 , a first magnet 261 , and a second magnet 262 .
- the first coil 271 and the second coil 272 are disposed on the second surface 241b of the first substrate 241 , and the first magnet 261 and the second magnet 262 are fixed to the frame 231 .
- the first coil 271 and the first magnet 261 may be arranged to at least partially overlap when viewed in an optical axis direction (eg, an X-axis direction).
- the second coil 272 and the second magnet 262 may be disposed to at least partially overlap when viewed in an optical axis direction (eg, an X-axis direction).
- an electric signal may be applied to the first coil 271 and the second coil 272 .
- the electrical signal may be applied through the connection member 280 and the first substrate 241 .
- the first coil 271 and the second coil 272 may be respectively arranged in the Z-axis direction.
- the first coil 271 may be positioned in the +Z-axis direction compared to the second coil 272 .
- the first coil 271 and the second coil 272 may have a longer shape in the Y-axis direction than in the Z-axis direction.
- the first coil 271 and the second coil 272 include a wire surrounding any axis parallel to the optical axis (eg, an axis parallel to the X-axis direction), or to the optical axis.
- a conductive pattern formed in a direction surrounding an arbitrary parallel axis may be included.
- the length of the conductive wire or conductive pattern extending in the Y-axis direction may be longer than the length of the conductive wire or conductive pattern extending in the Z-axis direction.
- the first magnet 261 and the second magnet 262 may be arranged in the Z-axis direction, respectively.
- the first magnet 261 may be positioned in the +Z-axis direction compared to the second magnet 262 .
- the first magnet 261 may be formed such that the opposite surface facing the first coil 271 includes at least two polarities.
- the second magnet 262 may be formed such that the opposite surface facing the second coil 272 includes at least two polarities.
- opposite surfaces of each of the first magnet 261 and the second magnet 262 may include an N pole region and an S pole region.
- the first magnet 261 may be formed such that the N-pole region and the S-pole region are arranged in the Y-axis direction.
- the N-pole region of the first magnet 261 may be located in the Y-axis direction of the S-pole region.
- the second magnet 262 may be formed such that the N-pole region and the S-pole region are arranged in the Y-axis direction.
- the N-pole region of the second magnet 262 may be located in the Y-axis direction of the S-pole region.
- the first magnet 261 may be configured such that each of the N-pole region and the S-pole region at least partially overlaps the first coil 271 when viewed in the optical axis direction (eg, the X-axis direction). have.
- the second magnet 262 may be configured such that each of the N-pole region and the S-pole region at least partially overlaps the second coil 272 when viewed in the optical axis direction (eg, the X-axis direction). have.
- the guide structure 250 may be positioned between the holder 243 of the moving member 240 and the sidewall 2311 of the fixed frame 231 .
- the guide structure 250 may be movably coupled to each of the holder 243 and the sidewall 2311 .
- the guide structure 250 is movably coupled to the holder 243 in the Y-axis direction
- the guide structure 250 is movably coupled to the sidewall 2311 of the fixed frame 231 in the Z-axis direction.
- the image stabilization assembly 230 may further include a first ball guide structure and a second ball guide structure.
- the first ball guide structure may include one or more first balls 258 disposed between the guide structure 250 and the holder 243 of the movable member 240 .
- the first balls 258 may be formed in plurality.
- the holder 243 may include an opening region 244 in which the image sensor 242 is positioned and a peripheral region 245 of the opening region 244 .
- the plurality of first balls 258 may at least partially contact the peripheral region 245 .
- a first recess 247 in which at least a portion of the first ball 258 is accommodated may be formed in the peripheral region 245 of the holder 243 .
- the number of the first recesses 247 may correspond to the number of the first balls 258 .
- the first recess 247 may be formed to be elongated in the Y-axis direction.
- the second recess 255 overlapping the first recess 247 in the optical axis direction (eg, the X-axis direction) may be formed in the guide structure 250 .
- the second recess 255 may form a space in which the first ball 258 is accommodated together with the first recess 247 .
- the second recess 255 may be formed to be elongated in the Y-axis direction.
- the number of the second recesses 255 may correspond to the number of the first balls 258 .
- the first ball 258 may be configured to roll in the space between the first recess 247 and the second recess 255 .
- the first ball 258 may rotate at a designated position in the space or rotate while moving linearly. For example, when the holder 243 moves in the Y-axis direction, the first ball 258 rotates while linearly moving in the Y-axis direction in the space between the first recess 247 and the second recess 255 . Or, it can rotate in place.
- the second ball guide structure may include the guide structure 250 and one or more second balls 259 disposed on the sidewall 2311 of the fixing frame 231 .
- a plurality of second balls 259 may be formed.
- the guide structure 250 includes a second opening region 253 in which the coils 271 , 272 , 273 , 274 are positioned or the coils 271 , 272 , 273 , 274 are exposed and the second opening region 253 . ) of the second peripheral region 254 .
- the plurality of second balls 259 may at least partially contact the second peripheral region 254 .
- a third recess 256 in which at least a portion of the second ball 259 is accommodated may be formed in the second peripheral region 254 of the guide structure 250 .
- the third recess 256 may be formed in a number corresponding to the number of the second balls 259 .
- the third recess 256 may be formed to be elongated in the Z-axis direction.
- a fourth recess 235 overlapping the third recess 256 in the optical axis direction (eg, the X-axis direction) may be formed in the sidewall 2311 of the fixing frame 231 .
- the fourth recess 235 may form a space in which the second ball 259 is accommodated together with the third recess 256 .
- the fourth recess 235 may be formed to be elongated in the Z-axis direction.
- the fourth recess 235 may be formed in a number corresponding to the number of the second balls 259 .
- the second ball 259 may be configured to roll in the space between the third recess 256 and the fourth recess 235 .
- the second ball 259 may rotate at a designated position in the space or rotate while moving linearly. For example, when the guide structure 250 moves in the Z-axis direction together with the holder 243 , the second ball 259 moves Z in the space between the third recess 256 and the fourth recess 235 . It can rotate while moving linearly in the axial direction, or it can rotate in place.
- the guide structure 250 has a third face 250a at least partially in contact with the peripheral area 245 of the holder 243 via a first ball 258 , and A fourth surface 250b at least partially in contact with the sidewall 2311 through the second ball 259 may be included.
- a second opening region 253 exposing the second surface 241b of the first substrate 241 is formed in the guide structure 250 , and the second opening region 253 includes the third surface 250a and the second opening region 253 . It may have a shape penetrating through the four surfaces 250b.
- the coils 271 , 272 , 273 , and 274 positioned on the second surface 241b of the first substrate 241 are connected to the sidewall 2311 of the fixing frame 231 .
- the positioned magnets 261 , 262 , 263 , and 264 may face each other in the optical axis direction.
- 10A and 10B are diagrams illustrating an arrangement of magnets and coils of an image stabilization assembly according to an exemplary embodiment.
- the first driver 201 may be configured to move the first substrate 241 in the Y-axis direction.
- the first driving unit 201 may include a first coil 271 , a second coil 272 , a first magnet 261 , and a second magnet 262 .
- the first magnet 261 may at least partially face the first coil 271 when viewed in the optical axis direction.
- a first opposing surface facing the first coil 271 is defined on the first magnet 261 , and the first opposing surface may include one or more N-pole regions and one or more S-pole regions.
- the first magnet 261 may be formed such that the N-pole region and the S-pole region are arranged in the Y-axis direction.
- the first coil 271 may be formed such that a portion 271b extending in the Y-axis direction is longer than a portion 271a extending in the Z-axis direction.
- the first coil 271 may include a conducting wire wound around an axis parallel to the optical axis or a conductive pattern printed in a clockwise or counterclockwise direction about an axis parallel to the optical axis. For example, a clockwise or counterclockwise current may flow through the first coil 271 .
- the second magnet 262 may at least partially face the second coil 272 when viewed in the optical axis direction.
- a second opposing surface facing the second coil 272 is defined on the second magnet 262 , and the second opposing surface may include one or more N-pole regions and one or more S-pole regions.
- the second magnet 262 may be formed such that the N-pole region and the S-pole region are arranged in the Y-axis direction.
- the second coil 272 may be formed such that the portion 272b extending in the Y-axis direction is longer than the portion 272a extending in the Z-axis direction.
- the second coil 272 may include a conducting wire wound around an axis parallel to the optical axis or a conductive pattern printed in a clockwise or counterclockwise direction about an axis parallel to the optical axis. For example, a clockwise or counterclockwise current may flow through the second coil 272 .
- the second driver 202 may be configured to move the first substrate 241 in the Z-axis direction.
- the second driving unit 202 may include a third coil 273 , a fourth coil 274 , a third magnet 263 , and a fourth magnet 264 .
- the third magnet 263 may at least partially face the third coil 273 when viewed in the optical axis direction.
- a third opposing surface facing the third coil 273 is defined on the third magnet 263 , and the third opposing surface may include one or more N-pole regions and one or more S-pole regions.
- the third magnet 263 may be formed such that the N-pole region and the S-pole region are arranged in the Z-axis direction.
- the third coil 273 may be formed such that the portion 273a extending in the Z-axis direction is longer than the portion 273b extending in the Y-axis direction.
- the third coil 273 may include a conducting wire wound around an axis parallel to the optical axis or a conductive pattern printed in a clockwise or counterclockwise direction with respect to an axis parallel to the optical axis. For example, a clockwise or counterclockwise current may flow through the third coil 273 .
- the fourth magnet 264 may at least partially face the fourth coil when viewed in the optical axis direction.
- a fourth opposing surface facing the fourth coil 274 is defined on the fourth magnet 264 , and the fourth opposing surface may include one or more N-pole regions and one or more S-pole regions.
- the fourth magnet 264 may be formed such that the N-pole region and the S-pole region are arranged in the Z-axis direction.
- the fourth coil 274 may be formed such that the portion 274a extending in the Z-axis direction is longer than the portion 274b extending in the Y-axis direction.
- the fourth coil 274 may include a conducting wire wound around an axis parallel to the optical axis or a conductive pattern printed in a clockwise or counterclockwise direction about an axis parallel to the optical axis. For example, a clockwise or counterclockwise current may flow through the fourth coil 274 .
- the first substrate 241 may be formed in a rectangular shape having substantially different lengths in a horizontal direction and a vertical direction.
- the edge of the first substrate 241 extending in the Y-axis direction may be longer than the edge extending in the Z-axis direction.
- the coils 271 , 272 , 273 , and 274 are long coils 271 and 272 in the Y-axis direction are arranged in the Z-axis direction, and the long coils 273 and 274 in the Z-axis direction are formed. It may be arranged to be arranged in the Y-axis direction. Through the above structure, the coil mounting area of the first substrate 241 may be efficiently utilized.
- a first substrate may be required. This may increase the overall size of the image stabilization assembly 230 and the camera module 200 .
- coils 271 , 272 , 273 , and 274 are positioned on the first substrate 241 , and magnets 261 , 262 , 263 , and 264 are formed on the sidewall 2311 of the fixing frame 231 .
- coils are positioned on the sidewall 2311 of the fixed frame 231
- magnets are movable members (eg, the first substrate 241 and the holder 243). It may be configured to be located in In this case, the camera module 200 and/or the image stabilization assembly 230 may further include a separate additional connecting member for applying an electrical signal to the coils located on the sidewall 2311 of the fixed frame 231 . .
- 11A and 11B are diagrams illustrating exemplary operations of a moving member and a connecting member of an image stabilizing assembly according to an exemplary embodiment.
- 11A is a perspective view illustrating a movable member and a connecting member
- FIG. 11B is a cross-sectional view taken along line A-A' shown in FIG. 11A .
- 12A and 12B are diagrams illustrating exemplary operations of a moving member and a connecting member of an image stabilizing assembly according to an exemplary embodiment.
- Fig. 12(a) is a perspective view showing the movable member and the connecting member
- Fig. 12(b) is a cross-sectional view taken along line B-B' shown in Fig. 12(a).
- the image sensor 242 may be disposed on the first substrate 241 included in the moving member 240 , and the connecting member 280 may be connected to one side.
- the connection member 280 includes a connector 285 , and the connector 285 may be fixedly coupled to a printed circuit board (eg, the printed circuit board 150 of FIG. 3 ) of the electronic device 100 .
- a tension by the connecting member 280 may be applied to the first substrate 241 .
- the tension may prevent movement of the first substrate 241 and the movable member 240 .
- the connecting member 280 may include a first connecting portion 282 and a second connecting portion 284 capable of being deformed in shape.
- the shape of the first connecting portion 282 and the second connecting portion 284 of the connecting member 280 may be deformed in response to the movement of the first substrate 241 .
- connection member 280 may include a second substrate 281 , a third substrate 283 , a first connection portion 282 , and a second connection portion 284 .
- first connection portion 282 may flexibly connect the first substrate 241 and the second substrate 281 .
- the second connection portion 284 may flexibly connect the second substrate 281 and the third substrate 283 .
- the second substrate 281 may be disposed to form a substantially 90 degree angle with the first substrate 241 in a state in which the image stabilization operation is not performed.
- the third substrate 283 may be disposed to form a substantially 90 degree angle with each of the first substrate 241 and the second substrate 281 in a state in which the image stabilization operation is not performed.
- the second connection portion 284 may include a first layer 291 , a second layer 292 , and a third layer 293 .
- the third layer 293 may be bent such that a partial region at least partially faces the second substrate 281 and another partial region at least partially faces the third substrate 283 .
- the first layer 291 may contact the second substrate 281 and another portion may contact the third layer 293 .
- a partial region of the first layer 291 may be surface-mounted on the second substrate 281 , such that the first layer 291 and the second substrate 281 may be electrically connected to each other.
- the first layer 291 and the third layer 293 may be electrically connected through the first via region 294 in which one or more vias are formed.
- the second layer 292 may contact the third substrate 283 and another portion may contact the third layer 293 .
- a partial region of the second layer 292 may be surface-mounted on the third substrate 283 , such that the second layer 292 and the third substrate 283 may be electrically connected to each other.
- the second layer 292 and the third layer 293 may be electrically connected through the second via region 295 in which one or more vias are formed.
- the first layer 291 and the second layer 292 are at least partially spaced apart by a predetermined interval (or a specified interval) d1 when viewed in the Y-axis direction.
- the predetermined interval (or the specified interval) d1 may increase or decrease when the movable member moves in the Y-axis direction.
- the image stabilization assembly 230 may be configured to linearly move the moving member 240 in the Y-axis direction using the first coil 271 and the second coil 272 .
- the moving member 240 includes a holder 243 , a first substrate 241 , and an image sensor 242 , and the image stabilization assembly 230 moves the image sensor 242 , in FIG. 4 .
- the guide structure 250 is fixed at a designated position and includes the holder 243 , the first substrate 241 , and the first substrate ( The image sensor 242 disposed on the 241 may move in the Y-axis direction.
- the second substrate 281 connected to the first substrate 241 through the first connection portion 282 may move in the Y1 direction.
- the first layer 291 of the second connection portion 284 moves together with the second substrate 281 in the Y1 direction, and the gap between the first layer 291 and the third layer 293 ( d1) may increase.
- the second substrate 281 connected to the first substrate 241 through the first connection portion 282 may move in the Y2 direction.
- the first layer 291 of the second connection portion 284 moves together with the second substrate 281 in the Y2 direction, and the gap between the first layer 291 and the third layer 293 ( d1) may decrease.
- the second layer 292 and the third layer 293 are at least partially spaced apart by a predetermined interval (or a specified interval) d2 when viewed in the Z-axis direction.
- the predetermined interval (or the specified interval) d2 may increase or decrease when the moving member 240 moves in the Z-axis direction.
- the image stabilization assembly 230 may be configured to linearly move the moving member 240 in the Z-axis direction using the third coil 273 and the fourth coil 274 .
- the moving member 240 includes a holder 243 , a first substrate 241 , and an image sensor 242 , and the image stabilization assembly 230 moves the image sensor 242 , thereby causing the lens assembly
- the optical axis L of the 210 and the image sensor 242 may be aligned to a designated position.
- the moving member when the image stabilization assembly 230 performs the Z-axis image stabilization operation, the moving member (holder 243 , the first substrate 241 , and the image sensor ( 242)) may move together with the guide structure 250 in the Z-axis direction.
- the second substrate 281 connected to the first substrate 241 through the first connection portion 282 may move in the Z1 direction.
- the first layer 291 of the second connection portion 284 moves together with the second substrate 281 in the Z1 direction, and the gap between the second layer 292 and the third layer 293 ( d2) may increase.
- the second substrate 281 connected to the first substrate 241 through the first connection portion 282 may move in the Z2 direction.
- the first layer 291 of the second connection portion 284 moves together with the second substrate 281 in the Z2 direction, and the gap between the second layer 292 and the third layer 293 ( d2) may decrease.
- FIG. 13 is a perspective view of a lens assembly of a camera module according to an exemplary embodiment.
- the lens assembly 210 may include a lens unit 212 and a focus driver for moving the lens unit 212 in the optical axis L direction.
- the focus driving unit is configured to move the lens unit 212 in the optical axis direction (eg, the X-axis direction), and adjusts the distance between the image sensor (eg, the image sensor 242 of FIG. 5 ) and the lens unit 212 . You can adjust the focus by changing it.
- the focus driving unit may include a fifth magnet 215b , a sixth magnet 216b , a fifth coil 215a , and a sixth coil 216a .
- the fifth magnet 215b may be configured to electromagnetically interact with the fifth coil 215a to which a current is applied.
- the sixth magnet 216b may be configured to electromagnetically interact with the sixth coil 216a to which a current is applied.
- the fifth magnet 215b and the sixth magnet 216b may be disposed in the lens unit 212 .
- the fifth magnet 215b is disposed on one side (left side based on the drawing) with respect to the optical axis L
- the sixth magnet 216b is disposed on the other side (with reference to the optical axis L). It may be disposed on the right side of the drawing.
- the fifth coil 215a may be disposed on the first side surface of the camera housing 211 to at least partially face the fifth magnet 215b.
- the sixth coil 216a may be disposed on the second side surface of the camera housing 211 to at least partially face the sixth magnet 216b.
- the fifth coil 215a may be disposed in the first opening area formed on the first side surface of the camera housing 211 .
- the sixth coil 216a may be disposed in the second opening area formed on the second side surface of the camera housing 211 .
- the fifth coil 215a and the sixth coil 216a may receive power through the second connection member 218 .
- the second connection member 218 may be disposed on a side surface of the camera housing 211 .
- the second connection member 218 may be connected to a connection member (eg, the connection member 280 of FIG. 5 ) along a side surface of the camera housing 211 .
- a control circuit for controlling currents applied to the fifth coil 215a and the sixth coil 216a may be disposed on the second connection member 218 .
- FIGS. 14A and 14B are diagrams illustrating a camera module and an image stabilization assembly according to various embodiments of the present disclosure
- 15 is a perspective view of a camera module and an image stabilization assembly according to various embodiments of the present disclosure
- FIGS. 14A, 14B and 15 the same or similar contents to those described in FIGS. 4 to 13 will be omitted.
- the image stabilization assembly 330 includes a moving member 331 , a first driving unit 330a , a second driving unit 330b , a first connecting member 335 , and a second connecting member 336 . ) may be included.
- the moving member 331 may include an image sensor 334 and a substrate 333 on which the image sensor 334 is disposed or electrically connected.
- the moving member 331 and the lens assembly 210 may be arranged such that the optical axis is at least partially aligned with the image sensor 334 .
- the first driving unit 330a may be located in the Y-axis direction with respect to the moving member 331 .
- the first driving unit 330a may be configured to move the movable member 331 in the Y-axis direction and/or the Z-axis direction.
- the first driving unit 330a may include a first coil 351 , a second coil 352 , a first magnet 341 , and a second magnet 342 .
- the first magnet 341 and the second magnet 342 may be disposed on both surfaces of the first extension region of the movable member 331 .
- the first magnet 341 may be disposed on the +X-axis direction surface of the movable member 331
- the second magnet 342 may be disposed on the -X-axis direction surface of the movable member 331
- the first coil 351 and the second coil 352 may be disposed on the first connecting member 335 .
- the first coil 351 and the second coil 352 may be positioned in the first portion 231-1 of the fixing frame 231 while being mounted on the first connecting member 335 .
- the first coil 351 and the second coil 352 may be formed to surround any axis substantially parallel to the optical axis.
- the first magnet 341 may be configured such that a surface facing the first coil 351 includes an N-pole region and an S-pole region. At this time, the first coil 351 and the first magnet 341 are related to the movement of the movable member 331 in the Z-axis direction, and the N-pole region and the S-pole region of the first magnet 341 are in the Z-axis direction. can be arranged.
- the second magnet 342 may be configured such that a surface facing the second coil 352 includes an N pole region and an S pole region.
- the second coil 352 and the second magnet 342 may be related to the movement of the movable member in the Y-axis direction, and the N-pole region and the S-pole region of the second magnet 342 may be arranged in the Y-axis direction. have.
- the second driving unit 330b may be located in the -Y-axis direction with respect to the moving member 331 .
- the second driving unit 330b may be configured to move the moving member 331 in the Y-axis direction and/or the Z-axis direction.
- the second driving unit 330b may include a third coil 353 , a fourth coil 354 , a third magnet 343 , and a fourth magnet 344 .
- the third magnet 343 and the fourth magnet 344 may be disposed on both surfaces of the second extension region of the movable member 331 .
- the third magnet 343 may be disposed on the +X-axis direction surface of the movable member 331 and the fourth magnet 344 may be disposed on the -X-axis direction surface of the movable member 331 .
- the third coil 353 and the fourth coil 354 may be disposed on the second connecting member 336 .
- the third coil 353 and the fourth coil 354 may be positioned in the second portion 231 - 2 of the fixing frame 231 while being mounted on the second connecting member 336 .
- the third coil 353 and the fourth coil 354 may be formed to surround any axis substantially parallel to the optical axis.
- the third magnet 343 may be configured such that a surface facing the third coil 353 includes an N-pole region and an S-pole region. At this time, the third coil 353 and the third magnet 343 are related to the movement of the movable member 331 in the Z-axis direction, and the N-pole region and the S-pole region of the third magnet 343 are in the Z-axis direction. can be arranged.
- the fourth magnet 344 may be configured such that a surface facing the fourth coil 354 includes an N-pole region and an S-pole region.
- the fourth coil 354 and the fourth magnet 344 are related to the movement of the movable member 331 in the Y-axis direction, and the N-pole region and the S-pole region of the fourth magnet 344 are in the Y-axis direction. can be arranged.
- the first connection member 335 may surround at least a portion of the substrate 333 and may be electrically connected to the first coil 351 and the second coil 352 .
- the first connection member 335 may be configured to transmit an electrical signal applied to the first coil 351 and the second coil 352 and/or an image signal associated with the image sensor 334 .
- the first connection member 335 extends from the edge of the -Y-axis direction of the substrate 333 and extends to the first portion 231-1 of the fixing frame 231 along the edge in the +Z-axis direction. can
- the second connecting member 336 may surround at least a portion of the substrate 333 and may be electrically connected to the third coil 353 and the fourth coil 354 .
- the second connection member may be configured to transmit an electrical signal applied to the third coil 353 and the fourth coil 354 and/or an image signal associated with the image sensor 334 .
- the second connection member 336 may extend from an edge in the +Y-axis direction of the substrate and extend to the second portion 231-2 of the fixing frame 231 along the edge in the -Z-axis direction.
- the first connecting member 335 and the second connecting member 336 may be configured to be sufficiently long so as not to interfere with the movement of the moving member in the image stabilization operation.
- the tension acting on the moving member 331 and the substrate can be reduced. Accordingly, although the first connecting member 335 and the second connecting member 336 are physically connected to the substrate 333 included in the moving member 331 , the effect on the movement of the moving member 331 is minimized or reduced can provide smooth image stabilization operation
- the shapes of the first connecting member 335 and the second connecting member 336 are not necessarily limited to those shown in FIGS. 14A and 14B .
- each of the first connecting member 335 and the second connecting member 336 partially connects the substrate 333 and the image sensor 334 to each other. It may be arranged so as not to surround it.
- the first connecting member 335 may be connected to the first driving unit 330a
- the second connecting member 336 may be connected to the second driving unit 330b.
- the first connecting member 335 and the second connecting member 336 may be disposed in a form that does not overlap in the Z-axis direction.
- Each of the first connecting member 335 and the second connecting member 336 of the image stabilizing assembly 370 shown in FIG. 15 may have a relatively simplified shape and a short extension length.
- the first connecting member 335 and the second connecting member 336 may be formed to be relatively more flexible to compensate for the relatively increased tension according to the relatively short extension length.
- the driving units 330a and 330b for driving the image sensor 334 in the Z and Y axes include the image sensor 334 . By being disposed on both sides of the Y-axis direction, the size in the Z-axis direction can be reduced. Through this, a slimmed camera module and a slimmed electronic device may be provided.
- FIGS. 16A and 16B are perspective views of a camera module and an image stabilization assembly according to various embodiments of the present disclosure; In the description of FIGS. 16A and 16B , the same or similar contents to those described in FIGS. 4 to 15 will be omitted.
- the image stabilization assembly 430 includes a moving member 431 , a first connecting member 435 , a second connecting member 436 , a first driving unit 430a , and a second driving unit 430b . ) may be included.
- the moving member 431 , the first connecting member 435 , and the second connecting member 436 are the same as or similar to those described with reference to FIGS. 14B and 14B .
- the moving member 431 may include an image sensor 434 and a substrate 433 on which the image sensor 434 is disposed or electrically connected.
- the moving member 431 and the lens assembly 210 may be disposed such that the optical axis is at least partially aligned with the image sensor 434 .
- the first connecting member 435 may surround at least a portion of the substrate 433 and may be electrically connected to the first coil 451 and the second coil 452 .
- the first connection member 435 may be configured to transmit an electrical signal applied to the first coil 451 and the second coil 452 and/or an image signal associated with the image sensor 434 .
- the second connecting member 436 may surround at least a portion of the substrate 433 and may be electrically connected to the third coil 453 and the fourth coil 454 .
- the second connection member 436 may be configured to transmit an electrical signal applied to the third coil 453 and the fourth coil 454 and/or an image signal associated with the image sensor 434 .
- the first driving unit 430a may be located in the Y-axis direction with respect to the moving member 431 .
- the first driving unit 430a may be configured to move the movable member 431 in the Y-axis direction and/or the Z-axis direction.
- the first driving unit 430a may include a first coil 451 , a second coil 452 , and a first magnet 441 .
- the first coil 451 and the second coil 452 may be disposed on the first connecting member 435 .
- the first coil 451 and the second coil 452 may be formed to surround any axis parallel to the Y-axis.
- the first coil 451 may be associated with movement in the Z-axis direction
- the second coil 452 may be associated with movement in the Y-axis direction
- the first magnet 441 has a first surface 441a facing the first coil 451 including an N pole region and an S pole region, and a second surface 441a facing the second coil 452 .
- the surface 441b may be configured to have one polarity.
- the N-pole region and the S-pole region of the first surface 441a of the first magnet 441 may be arranged in the Z-axis direction.
- the moving member on which the first magnet 441 is disposed is a Y-axis direction can be moved.
- the first magnet 441 may be configured to move between the first coil 451 and the second coil 452 .
- the magnetic field formed by the second coil 452 and the first magnet 441 may form an attractive force or a repulsive force.
- the moving member 431 moves in the -Y-axis direction, and when forming the repulsive force, the moving member 431 moves in the Y-axis direction.
- the first coil 451 may be associated with movement in the Y-axis direction
- the second coil 452 may be associated with movement in the Z-axis direction
- the first surface 441a facing the first coil 451 has one polarity
- the second surface 441b facing the second coil 452 has one polarity. It may be configured to include an N-pole region and an S-pole region. In this case, the N-pole region and the S-pole region of the second surface 441b of the first magnet 441 may be arranged in the Z-axis direction.
- the second driving unit 430b may be located in the -Y-axis direction with respect to the moving member 431 .
- the second driving unit 430b may be configured to move the movable member 431 in the Y-axis direction and/or the Z-axis direction.
- the second driving unit 430b may include a third coil 453 , a fourth coil 454 , and a second magnet 442 .
- the third coil 453 and the fourth coil 454 may be disposed on the second connecting member 436 .
- the third coil 453 and the fourth coil 454 may be formed to surround any axis parallel to the Y-axis.
- the third coil 453 may be associated with movement in the Z-axis direction
- the fourth coil 454 may be associated with movement in the Y-axis direction
- the second magnet 442 has a third surface 442a facing the third coil 453 including an N pole region and an S pole region, and a fourth facing the fourth coil 454 .
- the surface 442b may be configured to have one polarity.
- the N-pole region and the S-pole region of the third surface 442a of the second magnet 442 may be arranged in the Z-axis direction.
- the moving member 431 on which the second magnet 442 is disposed. can move in the Y-axis direction.
- the second magnet 442 may be configured to move between the third coil 453 and the fourth coil 454 .
- the magnetic field formed by the fourth coil 454 and the second magnet 442 may form an attractive force or a repulsive force.
- the moving member 431 moves in the Y-axis direction, and when forming the repulsive force, the moving member 431 may move in the -Y-axis direction.
- the third coil 453 may be associated with movement in the Y-axis direction
- the fourth coil 454 may be associated with movement in the Z-axis direction.
- the third surface 442a facing the third coil 453 has one polarity
- the fourth surface 442b facing the fourth coil 454 has one polarity. It may be configured to include an N-pole region and an S-pole region. In this case, the N-pole region and the S-pole region of the fourth surface 442b of the second magnet 442 may be arranged in the Z-axis direction.
- connection member of a camera module is a perspective view of a connection member of a camera module according to various embodiments of the present disclosure.
- the connecting members 533 and 534 may extend from the moving member 532 of the image stabilizing assembly 530 .
- the connecting members 533 and 534 may extend long along the side surfaces 211c and 211d of the camera housing 211 .
- the connecting members 533 and 534 may prevent movement of the moving member 532 during the image stabilization operation.
- the camera module shown in FIG. 17 includes the connecting members 533 and 534 having an increased length, thereby enabling smooth movement of the movable member.
- connection members 533 and 534 include a first connection member 533 extending along the first side surface 211d of the camera housing 211 and a second connection member extending along the second side surface 211c of the camera housing 211 .
- member 534 may be included.
- the first connecting member 533 and/or the second connecting member 534 may include a connector 285 that is coupled to a printed circuit board of the electronic device 100 (eg, the printed circuit board 150 of FIG. 3 ).
- the connecting members 533 and 534 include a first region 534a and a second region 534b extending in an optical axis direction (eg, a +X-axis direction) from the moving member 532,
- the first region 534a and the second region 534b may combine to include a third region 534c extending in the -X-axis direction.
- the connecting members 533 and 534 are coupled to the moving member 532 by dividing the first region 534a and the second region 534b, which are connected to the moving member 532 by the connecting members 533 and 534. 532) can be reduced.
- FIG. 18 is a block diagram of an electronic device 1801 in a network environment 1800 according to various embodiments of the present disclosure.
- the electronic device 1801 communicates with the electronic device 1802 through a first network 1898 (eg, a short-range wireless communication network) or a second network 1899 . It may communicate with at least one of the electronic device 1804 and the server 1808 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1801 may communicate with the electronic device 1804 through the server 1808 .
- a first network 1898 eg, a short-range wireless communication network
- a second network 1899 e.g., a second network 1899
- the electronic device 1801 may communicate with the electronic device 1804 through the server 1808 .
- the electronic device 1801 includes a processor 1820 , a memory 1830 , an input module 1850 , a sound output module 1855 , a display module 1860 , an audio module 1870 , a sensor module ( 1876), interface 1877, connection terminal 1878, haptic module 1879, camera module 1880, power management module 1888, battery 1889, communication module 1890, subscriber identification module 1896 , or an antenna module 1897 .
- at least one of these components eg, the connection terminal 1878
- some of these components are integrated into one component (eg, display module 1860 ). can be
- the processor 1820 executes software (eg, a program 1840) to execute at least one other component (eg, a hardware or software component) of the electronic device 1801 connected to the processor 1820. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 1820 converts commands or data received from other components (eg, the sensor module 1876 or the communication module 1890 ) to the volatile memory 1832 . may store the command or data stored in the volatile memory 1832 , and store the resulting data in the non-volatile memory 1834 .
- software eg, a program 1840
- the processor 1820 converts commands or data received from other components (eg, the sensor module 1876 or the communication module 1890 ) to the volatile memory 1832 .
- the volatile memory 1832 may store the command or data stored in the volatile memory 1832 , and store the resulting data in the non-volatile memory 1834 .
- the processor 1820 is a main processor 1821 (eg, a central processing unit or an application processor) or a coprocessor 1823 (eg, a graphic processing unit, a neural network processing unit) NPU: neural processing unit), an image signal processor, a sensor hub processor, or a communication processor).
- a main processor 1821 eg, a central processing unit or an application processor
- a coprocessor 1823 eg, a graphic processing unit, a neural network processing unit
- NPU neural network processing unit
- an image signal processor e.g., a sensor hub processor, or a communication processor.
- the coprocessor 1823 may be implemented separately from or as part of the main processor 1821 .
- the coprocessor 1823 may, for example, act on behalf of the main processor 1821 while the main processor 1821 is in an inactive (eg, sleep) state, or when the main processor 1821 is active (eg, executing an application). ), together with the main processor 1821, at least one of the components of the electronic device 1801 (eg, the display module 1860, the sensor module 1876, or the communication module 1890) It is possible to control at least some of the related functions or states.
- the coprocessor 1823 eg, image signal processor or communication processor
- may be implemented as a part of other functionally related components eg, camera module 1880 or communication module 1890). have.
- the coprocessor 1823 may include a hardware structure specialized for processing an artificial intelligence model.
- Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 1801 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 1808).
- the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
- the artificial intelligence model may include a plurality of artificial neural network layers.
- Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
- the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
- the memory 1830 may store various data used by at least one component of the electronic device 1801 (eg, the processor 1820 or the sensor module 1876 ).
- the data may include, for example, input data or output data for software (eg, a program 1840 ) and commands related thereto.
- the memory 1830 may include a volatile memory 1832 or a non-volatile memory 1834 .
- the program 1840 may be stored as software in the memory 1830 , and may include, for example, an operating system 1842 , middleware 1844 , or an application 1846 .
- the input module 1850 may receive a command or data to be used in a component (eg, the processor 1820 ) of the electronic device 1801 from the outside (eg, a user) of the electronic device 1801 .
- the input module ( 1850 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
- the sound output module 1855 may output a sound signal to the outside of the electronic device 1801 .
- the sound output module 1855 may include, for example, a speaker or a receiver.
- the speaker can be used for general purposes such as multimedia playback or recording playback.
- the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.
- the display module 1860 may visually provide information to the outside (eg, a user) of the electronic device 1801 .
- the display module 1860 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
- the display module 1860 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
- the audio module 1870 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1870 acquires a sound through the input module 1850 or an external electronic device (eg, a sound output module 1855 ) directly or wirelessly connected to the electronic device 1801 .
- the electronic device 1802) eg, a speaker or headphones
- the sensor module 1876 detects an operating state (eg, power or temperature) of the electronic device 1801 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
- the sensor module 1876 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
- the interface 1877 may support one or more specified protocols that may be used for the electronic device 1801 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1802 ).
- the interface 1877 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
- HDMI high definition multimedia interface
- USB universal serial bus
- SD card interface Secure Digital Card
- connection terminal 1878 may include a connector through which the electronic device 1801 can be physically connected to an external electronic device (eg, the electronic device 1802).
- the connection terminal 1878 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
- the haptic module 1879 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can recognize through tactile or kinesthetic sense.
- the haptic module 1879 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
- the camera module 1880 may capture still images and moving images. According to an embodiment, the camera module 1880 may include one or more lenses, image sensors, image signal processors, or flashes.
- the power management module 1888 may manage power supplied to the electronic device 1801 .
- the power management module 1888 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
- PMIC power management integrated circuit
- the battery 1889 may supply power to at least one component of the electronic device 1801 .
- the battery 1889 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
- the communication module 1890 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1801 and an external electronic device (eg, the electronic device 1802, the electronic device 1804, or the server 1808). It can support establishment and communication performance through the established communication channel.
- the communication module 1890 may include one or more communication processors that operate independently of the processor 1820 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
- the communication module 1890 is a wireless communication module 1892 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1894 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
- a corresponding communication module among these communication modules is a first network 1898 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 1899 (eg, legacy).
- a first network 1898 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
- a second network 1899 eg, legacy
- the wireless communication module 1892 uses subscriber information stored in the subscriber identification module 1896 (eg, International Mobile Subscriber Identifier (IMSI)) within a communication network, such as the first network 1898 or the second network 1899 .
- the electronic device 1801 may be identified or authenticated.
- the wireless communication module 1892 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
- NR access technology is a high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low -latency communications)).
- eMBB enhanced mobile broadband
- mMTC massive machine type communications
- URLLC ultra-reliable and low -latency communications
- the wireless communication module 1892 may include a high-frequency Various techniques for securing performance in a band, for example, beamforming, massive multiple-input and multiple-output (MIMO), full dimensional multiple input/output (FD-MIMO) It may support technologies such as MIMO), an array antenna, analog beam-forming, or a large scale antenna.
- the wireless communication module 1892 includes the electronic device 1801, an external Various requirements specified in the electronic device (eg, the electronic device 1804) or the network system (eg, the second network 1899) may be supported. According to an embodiment, the wireless communication module 1892 realizes eMBB.
- Peak data rate e.g., 20Gbps or more
- loss coverage e.g., 164dB or less
- U-plane latency e.g., downlink (DL) and uplink (UL) of 0.5 each for realization of URLLC
- DL downlink
- UL uplink
- the antenna module 1897 may transmit or receive a signal or power to the outside (eg, an external electronic device).
- the antenna module 1897 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
- the antenna module 1897 may include a plurality of antennas (eg, an array antenna). In this case, it is used in a communication network such as the first network 1898 or the second network 1899 . At least one antenna suitable for a communication method may be selected from the plurality of antennas by, for example, the communication module 1890 .
- a signal or power may be transmitted or received between the communication module 1890 and an external electronic device through the selected at least one antenna.
- other components eg, a radio frequency integrated circuit (RFIC)
- RFIC radio frequency integrated circuit
- the antenna module 1897 may form a mmWave antenna module.
- the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
- peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
- GPIO general purpose input and output
- SPI serial peripheral interface
- MIPI mobile industry processor interface
- a command or data may be transmitted or received between the electronic device 1801 and the external electronic device 1804 through the server 1808 connected to the second network 1899 .
- Each of the external electronic devices 1802 or 1804 may be the same or a different type of the electronic device 1801 .
- all or a part of operations executed by the electronic device 1801 may be executed by one or more external electronic devices 1802 , 1804 , or 1808 .
- the electronic device 1801 may perform the function or service by itself instead of executing the function or service itself.
- one or more external electronic devices may be requested to perform at least a part of the function or the service.
- One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1801 .
- the electronic device 1801 may process the result as it is or additionally and provide it as at least a part of a response to the request.
- cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
- the electronic device 1801 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
- the external electronic device 1804 may include an Internet of Things (IoT) device.
- IoT Internet of Things
- the server 1808 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 1804 or the server 1808 may be included in the second network 1899.
- the electronic device 1801 provides an intelligent service (eg, 5G communication technology and IoT-related technology). : smart home, smart city, smart car, or health care).
- 19 is a block diagram 1900 illustrating a configuration of a camera module 1880 according to various embodiments of the present disclosure.
- the camera module 1880 includes a lens assembly 1910 , a flash 1920 , an image sensor 1930 , an image stabilizer 1940 , a memory 1950 (eg, a buffer memory), or an image signal processor. 1960.
- the lens assembly 1910 may collect light emitted from a subject, which is an image to be captured.
- the lens assembly 1910 may include one or more lenses.
- the camera module 1880 may include a plurality of lens assemblies 1910. In this case, the camera module 1880 may be, for example, a dual camera, a 360 degree camera, or a spherical camera.
- Some of the plurality of lens assemblies 1910 may have the same lens property (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one
- the lens assembly may have one or more lens properties that are different from lens properties of other lens assemblies.
- the lens assembly 1910 may include, for example, a wide-angle lens or a telephoto lens.
- the flash 1920 may emit light used to enhance light emitted or reflected from the subject.
- the flash 1920 may include one or more light emitting diodes (eg, a red-green-blue (RGB) LED, a white LED, an infrared LED, or an ultraviolet LED), or a xenon lamp.
- the image sensor 1930 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 1910 into an electrical signal.
- the image sensor 1930 is, for example, one image sensor selected from among image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, the same It may include a plurality of image sensors having properties, or a plurality of image sensors having different properties.
- Each image sensor included in the image sensor 1930 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.
- CCD charged coupled device
- CMOS complementary metal oxide semiconductor
- the image stabilizer 1940 moves at least one lens or the image sensor 1930 included in the lens assembly 1910 in a specific direction or Operation characteristics of the image sensor 1930 may be controlled (eg, read-out timing may be adjusted, etc.). This makes it possible to compensate for at least some of the negative effects of the movement on the image being taken.
- the image stabilizer 1940 according to an embodiment, the image stabilizer 1940 is a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 1880 Such a movement of the camera module 1880 or the electronic device 1801 may be detected using .
- the image stabilizer 1940 may be implemented as, for example, an optical image stabilizer.
- the memory 1950 may temporarily store at least a portion of the image acquired through the image sensor 1930 for the next image processing operation. For example, when image acquisition is delayed according to the shutter or a plurality of images are acquired at high speed, the acquired original image (eg, Bayer-patterned image or high-resolution image) is stored in the memory 1950 and , a copy image corresponding thereto (eg, a low-resolution image) may be previewed through the display module 1860 . Thereafter, when a specified condition is satisfied (eg, a user input or a system command), at least a portion of the original image stored in the memory 1950 may be obtained and processed by, for example, the image signal processor 1960 . According to an embodiment, the memory 1950 may be configured as at least a part of the memory 1830 or as a separate memory operated independently of the memory 1830 .
- a specified condition eg, a user input or a system command
- the image signal processor 1960 may perform one or more image processing on an image acquired through the image sensor 1930 or an image stored in the memory 1950 .
- the one or more image processes may include, for example, depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, or image compensation (eg, noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring, sharpening, or softening.
- the image signal processor 1960 may include at least one of components included in the camera module 1880 (eg, an image sensor). (1930)), for example, exposure time control, readout timing control, etc.
- the image processed by the image signal processor 1960 is stored back in the memory 1950 for further processing.
- the image signal processor 1960 may be configured as at least a part of the processor 1820 or as a separate processor operated independently of the processor 1820.
- the image signal processor 1960 is the processor 1820 and a separate processor, the at least one image processed by the image signal processor 1960 may be displayed through the display module 1860 as it is by the processor 1820 or after additional image processing.
- the electronic device 1801 may include a plurality of camera modules 1880 each having different properties or functions.
- at least one of the plurality of camera modules 1880 may be a wide-angle camera, and at least the other may be a telephoto camera.
- at least one of the plurality of camera modules 1880 may be a front camera, and at least the other may be a rear camera.
- a camera module may include a lens assembly including a lens; and a moving member comprising a first substrate and an image sensor electrically coupled to the first substrate, an optical axis coupled to the lens assembly to be at least partially aligned with the image sensor; and wherein the image stabilization assembly may be configured to move the movable member in at least one direction perpendicular to the optical axis such that the optical axis is aligned with a designated position of the image sensor.
- the image stabilization assembly further comprises a coil and a magnet configured to provide movement of the movable member, wherein one of the coil and the magnet is disposed on the movable member, wherein one of the coil and the magnet is disposed on the movable member.
- the other may be disposed on the fixed part.
- the coil and the magnet may be arranged to at least partially overlap each other when viewed in the optical axis direction.
- one surface of the magnet facing the coil may include at least two polarities.
- the coil may include a conductive wire wound around an arbitrary axis parallel to the optical axis, or may include a pattern formed in a direction surrounding an arbitrary axis parallel to the optical axis.
- the image sensor may be disposed on a first surface of the first substrate, and the coil may be disposed on a second surface of the first substrate opposite to the first surface.
- the lens assembly may further include a focus driver configured to move the lens in the optical axis direction.
- the image stabilization assembly may further include a fixed frame and a guide coupled to the fixed frame, and the guide structure may be movably coupled to each of the moving member and a sidewall of the fixed frame.
- the guide is movably coupled to the movable member in a first direction perpendicular to the optical axis, and is connected to the sidewall of the fixed frame in the first direction and in a second direction perpendicular to the optical axis, respectively can be movably coupled to
- the moving member may further include a holder to which the guide is movably coupled, and the holder may be fixedly coupled to the first substrate to move together with the first substrate.
- first ball disposed between the guide and the holder, and a second ball disposed between the guide and the sidewall of the fixed frame
- first ball is the movable member configured to provide a rolling friction force between the holder and the guide based on a first direction movement
- second ball is configured to provide a rolling friction force between the guide and the fixed frame based on the second direction movement of the moving member.
- each of the holder and the guide includes a first recess at least partially accommodating the first ball and elongated in the first direction
- each of the sidewalls of the guide and the fixing frame includes the A second recess may be formed that at least partially accommodates the second ball and extends elongated in the second direction.
- the first ball rotates while linearly moving in the first direction in the first recess based on the movement of the moving member, or rotates at a designated position inside the first recess configured
- the second ball is configured to rotate while moving linearly in the second direction inside the second recess, or to rotate at a designated position inside the second recess, based on the movement of the moving member.
- the guide may be fixed to a designated position when the moving member moves in the first direction, and move together with the moving member when the moving member moves in the second direction.
- the image stabilization assembly includes a first driving unit configured to move the moving member in the first direction and a second driving unit configured to move the moving member and the guide in the second direction.
- the first driving unit is at least partially with a first magnet, a first coil overlapping the first magnet and at least partially in the optical axis direction, a second magnet, and the second magnet and the optical axis direction a second coil that overlaps
- the second driving unit includes a third magnet, a third coil that at least partially overlaps with the third magnet in the optical axis direction, a fourth magnet, and the fourth magnet and the optical axis and a fourth coil that at least partially overlaps in the direction.
- a portion extending in the first direction is longer than a portion extending in the second direction, and each of the third coil and the fourth coil Silver, the portion extending in the first direction may be formed to be smaller than the portion extending in the second direction.
- the first magnet and the second magnet are configured such that an N-pole region and an S-pole region are arranged in the first direction, respectively, and the third magnet and the fourth magnet are respectively an N-pole region and S
- the pole region may be configured to be arranged in the second direction.
- the first magnet and the second magnet may be arranged in the second direction, and the third magnet and the fourth magnet may be arranged in the first direction.
- the lens assembly may further include a prism disposed on the optical axis.
- the display device further includes a connection member extending from the first board to a printed circuit board included in the electronic device and including a connector, wherein the connection member is flexible so that its shape is deformed in response to movement of the movable member. It can contain one area.
- Electronic devices may be devices of various types.
- the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
- a portable communication device eg, a smart phone
- a computer device e.g., a smart phone
- a portable multimedia device e.g., a portable medical device
- a camera e.g., a portable medical device
- a camera e.g., a portable medical device
- a camera e.g., a portable medical device
- a camera e.g., a camera
- a wearable device e.g., a smart bracelet
- a home appliance device e.g., a smart bracelet
- the electronic device according to the embodiment of the present document is not limited to the above-described devices.
- first, second, or first or second may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. Where mentioned, it is possible that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
- module used in various embodiments of the present document may include a unit implemented in hardware, software, firmware, or a combination thereof, for example, with terms such as logic, logic block, component, or circuit; They can be used interchangeably.
- a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
- the module may be implemented in the form of an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- one or more instructions stored in a storage medium may be implemented as software (eg, a program 1840) including
- a processor eg, processor 1820
- a device eg, electronic device 1801
- the one or more instructions may include code generated by a compiler or code executable by an interpreter.
- the device-readable storage medium may be provided in the form of a non-transitory storage medium.
- 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
- a signal eg, electromagnetic wave
- the method according to various embodiments disclosed in this document may be provided by being included in a computer program product.
- Computer program products may be traded between sellers and buyers as commodities.
- the computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play StoreTM) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
- a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
- each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components.
- one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
- a plurality of components eg, a module or a program
- the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
- operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.
Abstract
Description
Claims (15)
- 카메라 모듈에 있어서,렌즈를 포함하는 렌즈 어셈블리; 및제1 기판, 및 상기 제1 기판에 전기적으로 연결되는 이미지 센서를 포함하는 이동 부재를 포함하는 이미지 안정화 어셈블리, 광 축은 상기 이미지 센서와 적어도 부분적으로 정렬되도록 상기 렌즈 어셈블리에 연결됨; 을 포함하고,상기 이미지 안정화 어셈블리는 상기 광 축이 상기 이미지 센서의 지정된 위치에 정렬되도록, 상기 이동 부재를 상기 광 축에 수직한 적어도 하나의 방향으로 이동시키도록 구성되는 카메라 모듈.
- 청구항 1에 있어서,상기 이미지 안정화 어셈블리는 상기 이동 부재의 이동을 제공하도록 구성되는 코일 및 마그넷을 더 포함하고,상기 코일 및 상기 마그넷 중 어느 하나는 상기 이동 부재에 배치되고, 상기 코일 및 상기 마그넷 중 다른 하나는 고정 파트에 배치되는 카메라 모듈.
- 청구항 2에 있어서,상기 코일 및 상기 마그넷은 상기 광 축 방향으로 볼 때, 서로 적어도 부분적으로 중첩되는 카메라 모듈.
- 청구항 2에 있어서,상기 코일은 상기 광 축에 평행한 임의의 축을 중심으로 권취된 도선을 포함하거나, 또는 상기 광 축에 평행한 임의의 축을 둘러싸는 방향으로 형성된 패턴을 포함하는 카메라 모듈.
- 청구항 2에 있어서,상기 이미지 센서는 상기 제1 기판의 제1 면에 배치되고,상기 코일은 상기 제1 기판의 상기 제1 면에 대향하는 제2 면에 배치되는 카메라 모듈.
- 청구항 1에 있어서,상기 이미지 안정화 어셈블리는 고정 프레임, 및 상기 고정 프레임에 결합되는 가이드를 더 포함하고,상기 가이드는 상기 이동 부재 및 상기 고정 프레임의 측벽 각각에 이동 가능하게 결합되는 카메라 모듈.
- 청구항 6에 있어서,상기 가이드는상기 이동 부재에 상기 광 축에 수직한 제1 방향으로 이동 가능하게 결합되고, 상기 고정 프레임의 상기 측벽에 상기 제1 방향 및 상기 광 축 각각에 수직한 제2 방향으로 이동 가능하게 결합되는 카메라 모듈.
- 청구항 7에 있어서,상기 이동 부재는 상기 가이드가 이동 가능하게 결합되는 홀더를 더 포함하고,상기 홀더는 상기 제1 기판과 함께 움직이도록 상기 제1 기판에 고정 결합되는 카메라 모듈.
- 청구항 8에 있어서,상기 가이드 및 상기 홀더 사이에 배치되는 제1 볼, 및상기 가이드 및 상기 고정 프레임의 상기 측벽 사이에 배치되는 제2 볼을 더 포함하고,상기 제1 볼은 상기 이동 부재의 상기 제1 방향 이동에 기초하여, 상기 홀더와 상기 가이드 사이에 구름 마찰력을 제공하도록 구성되고,상기 제2 볼은 상기 이동 부재의 상기 제2 방향 이동에 기초하여, 상기 가이드와 상기 고정 프레임의 상기 측벽 사이에 구름 마찰력을 제공하도록 구성되는 카메라 모듈.
- 청구항 9에 있어서,상기 홀더 및 상기 가이드 각각은 상기 제1 볼이 적어도 부분적으로 수용되며 상기 제1 방향으로 길게 연장된 제1 리세스를 포함하고,상기 가이드 및 상기 고정 프레임의 상기 측벽 각각은 상기 제2 볼이 적어도 부분적으로 수용되며 상기 제2 방향으로 길게 연장된 제2 리세스를 포함하는 카메라 모듈.
- 청구항 7에 있어서,상기 가이드는상기 이동 부재가 상기 제1 방향으로 이동할 때 지정된 위치에 고정되고, 및 상기 이동 부재가 상기 제2 방향으로 이동할 때 상기 이동 부재와 함께 이동하도록 구성되는 카메라 모듈.
- 청구항 7에 있어서,상기 이미지 안정화 어셈블리는,상기 이동 부재를 상기 제1 방향으로 이동시키기 위한 제1 구동부 및상기 이동 부재와 상기 가이드를 상기 제2 방향으로 이동시키기 위한 제2 구동부를 더 포함하고,상기 제1 구동부는 제1 마그넷, 상기 제1 마그넷과 상기 광 축 방향으로 적어도 부분적으로 중첩되는 제1 코일, 제2 마그넷, 및 상기 제2 마그넷과 상기 광 축 방향으로 적어도 부분적으로 중첩되는 제2 코일을 포함하고,상기 제2 구동부는 제3 마그넷, 상기 제3 마그넷과 상기 광 축 방향으로 적어도 부분적으로 중첩되는 제3 코일, 제4 마그넷, 및 상기 제4 마그넷과 상기 광 축 방향으로 적어도 부분적으로 중첩되는 제4 코일을 포함하는 카메라 모듈.
- 청구항 12에 있어서,상기 제1 코일 및 상기 제2 코일 각각은, 상기 제1 방향으로 연장된 부분이 상기 제2 방향으로 연장된 부분에 비해 길게 형성되고,상기 제3 코일 및 상기 제4 코일 각각은, 상기 제1 방향으로 연장된 부분이 상기 제2 방향으로 연장된 부분에 비해 작게 형성되는 카메라 모듈.
- 청구항 12에 있어서,상기 제1 마그넷 및 상기 제2 마그넷은 각각 N극 영역 및 S극 영역이 상기 제1 방향으로 배열되도록 배치되고,상기 제3 마그넷 및 상기 제4 마그넷은 각각 N극 영역 및 S극 영역이 상기 제2 방향으로 배열되도록 배치되는 카메라 모듈.
- 청구항 12에 있어서,상기 제1 마그넷 및 상기 제2 마그넷은 상기 제2 방향으로 배열되고,상기 제3 마그넷 및 상기 제4 마그넷은 상기 제1 방향으로 배열되는 카메라 모듈.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP22775987.5A EP4274220A1 (en) | 2021-03-25 | 2022-03-17 | Camera module including image stabilization assembly, and electronic device including same |
CN202280022644.3A CN117136555A (zh) | 2021-03-25 | 2022-03-17 | 包括图像稳定组件的相机模块及包括相机模块的电子装置 |
US17/703,289 US20240111172A1 (en) | 2021-03-25 | 2022-03-17 | Camera module including image stabilization assembly and electronic device including the camera module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020210038740A KR20220133525A (ko) | 2021-03-25 | 2021-03-25 | 이미지 안정화 어셈블리를 포함하는 카메라 모듈 및 상기 카메라 모듈을 포함하는 전자 장치 |
KR10-2021-0038740 | 2021-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022203285A1 true WO2022203285A1 (ko) | 2022-09-29 |
Family
ID=83397621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2022/003768 WO2022203285A1 (ko) | 2021-03-25 | 2022-03-17 | 이미지 안정화 어셈블리를 포함하는 카메라 모듈 및 상기 카메라 모듈을 포함하는 전자 장치 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240111172A1 (ko) |
EP (1) | EP4274220A1 (ko) |
KR (1) | KR20220133525A (ko) |
CN (1) | CN117136555A (ko) |
WO (1) | WO2022203285A1 (ko) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060039808A (ko) * | 2004-11-03 | 2006-05-09 | 삼성전자주식회사 | 카메라 렌즈 어셈블리의 손떨림 보정 장치 |
JP2006349942A (ja) * | 2005-06-15 | 2006-12-28 | Tamron Co Ltd | 像振れ補正装置及びそれを備えた撮像装置 |
JP2008077047A (ja) * | 2006-08-23 | 2008-04-03 | Ricoh Co Ltd | 像振れ補正装置および撮像装置および電子機器 |
JP2011053241A (ja) * | 2009-08-31 | 2011-03-17 | Canon Inc | 振れ補正装置および撮像装置 |
JP2020160163A (ja) * | 2019-03-25 | 2020-10-01 | キヤノン株式会社 | 撮像装置およびその制御方法 |
-
2021
- 2021-03-25 KR KR1020210038740A patent/KR20220133525A/ko active Search and Examination
-
2022
- 2022-03-17 WO PCT/KR2022/003768 patent/WO2022203285A1/ko active Application Filing
- 2022-03-17 CN CN202280022644.3A patent/CN117136555A/zh active Pending
- 2022-03-17 US US17/703,289 patent/US20240111172A1/en active Pending
- 2022-03-17 EP EP22775987.5A patent/EP4274220A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060039808A (ko) * | 2004-11-03 | 2006-05-09 | 삼성전자주식회사 | 카메라 렌즈 어셈블리의 손떨림 보정 장치 |
JP2006349942A (ja) * | 2005-06-15 | 2006-12-28 | Tamron Co Ltd | 像振れ補正装置及びそれを備えた撮像装置 |
JP2008077047A (ja) * | 2006-08-23 | 2008-04-03 | Ricoh Co Ltd | 像振れ補正装置および撮像装置および電子機器 |
JP2011053241A (ja) * | 2009-08-31 | 2011-03-17 | Canon Inc | 振れ補正装置および撮像装置 |
JP2020160163A (ja) * | 2019-03-25 | 2020-10-01 | キヤノン株式会社 | 撮像装置およびその制御方法 |
Also Published As
Publication number | Publication date |
---|---|
CN117136555A (zh) | 2023-11-28 |
KR20220133525A (ko) | 2022-10-05 |
US20240111172A1 (en) | 2024-04-04 |
EP4274220A1 (en) | 2023-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2018135784A1 (en) | Camera module and camera device | |
WO2022065624A1 (en) | Electronic device including flexible display | |
WO2021141454A1 (en) | Camera module and electronic device including the same | |
WO2022019497A1 (ko) | 디스플레이 및 카메라 장치를 포함하는 전자 장치 | |
WO2021141450A1 (en) | Camera module and electronic device including the same | |
WO2022060126A1 (ko) | 카메라 모듈을 포함하는 전자 장치 | |
WO2022045702A1 (ko) | 이미지 안정화 어셈블리, 카메라 모듈 및 이를 포함하는 전자 장치 | |
WO2022149737A1 (ko) | 카메라 모듈 및 이를 포함하는 전자 장치 | |
WO2022215943A1 (ko) | 카메라를 포함하는 전자 장치 및 그 전자 장치의 동작 방법 | |
WO2022169332A1 (ko) | 렌즈 어셈블리 및 이를 포함한 전자 장치 | |
WO2022114619A1 (ko) | 렌즈 어셈블리를 포함하는 전자 장치 | |
WO2022203285A1 (ko) | 이미지 안정화 어셈블리를 포함하는 카메라 모듈 및 상기 카메라 모듈을 포함하는 전자 장치 | |
WO2022075797A1 (ko) | 카메라 모듈 및 이를 포함하는 전자 장치 | |
WO2023075347A1 (ko) | 카메라 모듈 및 이를 포함하는 전자 장치 | |
WO2023229439A1 (ko) | 카메라 모듈 및 이를 포함하는 모바일 전자 장치 | |
WO2022225250A1 (ko) | 카메라 모듈 및 이를 포함하는 전자 장치 | |
WO2024025148A1 (ko) | 카메라 모듈 및 이를 포함하는 전자 장치 | |
WO2023243861A1 (ko) | 렌즈 어셈블리 및 그를 포함하는 전자 장치 | |
WO2023101436A1 (ko) | 플렉서블 디스플레이를 포함하는 전자 장치 및 그 동작 방법 | |
WO2023018092A1 (ko) | 카메라 모듈을 포함하는 전자 장치 | |
WO2023090833A1 (ko) | 프리뷰 이미지를 제공하는 방법 및 그 전자 장치 | |
WO2022220572A1 (ko) | 카메라 모듈 및 이를 포함하는 전자 장치 | |
WO2024010231A1 (ko) | 커넥터 모듈을 포함하는 전자 장치 및 이의 동작 방법 | |
WO2024029732A1 (ko) | 시각적 왜곡 보정을 위한 전자 장치 및 방법 | |
WO2023068602A1 (ko) | 카메라 모듈 및 이를 포함하는 전자 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 17703289 Country of ref document: US |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22775987 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2022775987 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2022775987 Country of ref document: EP Effective date: 20230803 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |