WO2022200423A3 - Elektronisches bauteil, bauteilanordnung, funktionsschicht zum bilden eines elektronischen bauteils und verfahren zum herstellen eines elektronischen bauteils - Google Patents

Elektronisches bauteil, bauteilanordnung, funktionsschicht zum bilden eines elektronischen bauteils und verfahren zum herstellen eines elektronischen bauteils Download PDF

Info

Publication number
WO2022200423A3
WO2022200423A3 PCT/EP2022/057625 EP2022057625W WO2022200423A3 WO 2022200423 A3 WO2022200423 A3 WO 2022200423A3 EP 2022057625 W EP2022057625 W EP 2022057625W WO 2022200423 A3 WO2022200423 A3 WO 2022200423A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
functional layer
component
producing
forming
Prior art date
Application number
PCT/EP2022/057625
Other languages
English (en)
French (fr)
Other versions
WO2022200423A2 (de
Inventor
Stephan Krüger
Ilona Skorupa
Nan DU
Heidemarie Schmidt
Original Assignee
Helmholtz-Zentrum Dresden - Rossendorf E.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Helmholtz-Zentrum Dresden - Rossendorf E.V. filed Critical Helmholtz-Zentrum Dresden - Rossendorf E.V.
Publication of WO2022200423A2 publication Critical patent/WO2022200423A2/de
Publication of WO2022200423A3 publication Critical patent/WO2022200423A3/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/10Metal-oxide dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1272Semiconductive ceramic capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/38Multiple capacitors, i.e. structural combinations of fixed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • H01G7/06Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Offenbart wird ein elektronisches Bauteil (100) aufweisend eine Funktionsschicht (200), welche ein spontan polarisierbares Material und Pinzentren (240, 250) darin aufweist, wobei eine oder mehrere Eigenschaften von in dem spontan polarisierbaren Material ausgebildeten Domänenwänden (220) beeinflusst wird, und Elektroden (310, 320), welche die Funktionsschicht kontaktieren und eine kapazitive Struktur und/oder induktive Struktur bereitstellen, derart, dass zumindest eine elektrische Eigenschaft der kapazitiven und/oder induktiven Struktur durch die in dem spontan polarisierbaren Material ausgebildeten Domänenwände definiert ist.
PCT/EP2022/057625 2021-03-24 2022-03-23 Elektronisches bauteil, bauteilanordnung, funktionsschicht zum bilden eines elektronischen bauteils und verfahren zum herstellen eines elektronischen bauteils WO2022200423A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021107402.9 2021-03-24
DE102021107402.9A DE102021107402A1 (de) 2021-03-24 2021-03-24 Elektronisches Bauteil, Bauteilanordnung, Funktionsschicht zum Bilden eines elektronischen Bauteils und Verfahren zum Herstellen eines elektronischen Bauteils

Publications (2)

Publication Number Publication Date
WO2022200423A2 WO2022200423A2 (de) 2022-09-29
WO2022200423A3 true WO2022200423A3 (de) 2022-12-01

Family

ID=81346328

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/057625 WO2022200423A2 (de) 2021-03-24 2022-03-23 Elektronisches bauteil, bauteilanordnung, funktionsschicht zum bilden eines elektronischen bauteils und verfahren zum herstellen eines elektronischen bauteils

Country Status (2)

Country Link
DE (1) DE102021107402A1 (de)
WO (1) WO2022200423A2 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5280407A (en) * 1993-01-26 1994-01-18 Charles Stark Draper Laboratory, Inc. Linearized ferroelectric capacitor
US5790366A (en) * 1996-12-06 1998-08-04 Sharp Kabushiki Kaisha High temperature electrode-barriers for ferroelectric and other capacitor structures
DE102018112605A1 (de) * 2018-05-25 2019-11-28 Helmholtz-Zentrum Dresden - Rossendorf E.V. Verfahren zur Rekonfiguration einer Vortex-Dichte in einem Seltenen-Erd-Manganat, ein nichtflüchtiger Impedanzschalter und dessen Verwendung
DE102018125270A1 (de) * 2018-10-12 2020-04-16 Helmholtz-Zentrum Dresden - Rossendorf E.V. Verfahren zur Herstellung eines keramischen Materials mit lokal einstellbarem Permeabilitätsgradienten, dessen Anwendung in einem Beschichtungsverfahren sowie dessen Verwendung
US20200321344A1 (en) * 2019-04-08 2020-10-08 Kepler Computing Inc. Doped polar layers and semiconductor device incorporating same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10224475B2 (en) 2014-06-11 2019-03-05 The Regents Of The University Of California Method for fabricating superconducting devices using a focused ion beam

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5280407A (en) * 1993-01-26 1994-01-18 Charles Stark Draper Laboratory, Inc. Linearized ferroelectric capacitor
US5790366A (en) * 1996-12-06 1998-08-04 Sharp Kabushiki Kaisha High temperature electrode-barriers for ferroelectric and other capacitor structures
DE102018112605A1 (de) * 2018-05-25 2019-11-28 Helmholtz-Zentrum Dresden - Rossendorf E.V. Verfahren zur Rekonfiguration einer Vortex-Dichte in einem Seltenen-Erd-Manganat, ein nichtflüchtiger Impedanzschalter und dessen Verwendung
DE102018125270A1 (de) * 2018-10-12 2020-04-16 Helmholtz-Zentrum Dresden - Rossendorf E.V. Verfahren zur Herstellung eines keramischen Materials mit lokal einstellbarem Permeabilitätsgradienten, dessen Anwendung in einem Beschichtungsverfahren sowie dessen Verwendung
US20200321344A1 (en) * 2019-04-08 2020-10-08 Kepler Computing Inc. Doped polar layers and semiconductor device incorporating same

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
E. RUFF ET AL: "Conductivity Contrast and Tunneling Charge Transport in the Vortexlike Ferroelectric Domain Patterns of Multiferroic Hexagonal YMnO3", PHYSICAL REVIEW LETTERS, vol. 118, no. 3, 1 January 2017 (2017-01-01), US, XP055619153, ISSN: 0031-9007, DOI: 10.1103/PhysRevLett.118.036803 *
KIM YUNSEOK ET AL: "Origins of domain wall pinning in ferroelectric nanocapacitors", NANO CONVERGENCE, vol. 1, no. 1, 1 December 2014 (2014-12-01), XP055965216, Retrieved from the Internet <URL:https://iopscience.iop.org/article/10.1088/1361-648X/aa73c3/pdf> DOI: 10.1186/s40580-014-0024-4 *
PAVLO ZUBKO ET AL: "On the persistence of polar domains in ultrathin ferroelectric capacitors", JOURNAL OF PHYSICS: CONDENSED MATTER, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, vol. 29, no. 28, 9 June 2017 (2017-06-09), pages 284001, XP020317740, ISSN: 0953-8984, [retrieved on 20170609], DOI: 10.1088/1361-648X/AA73C3 *
ZHANG DAWEI ET AL: "Superior polarization retention through engineered domain wall pinning", NATURE COMMUNICATIONS, vol. 11, no. 1, 17 January 2020 (2020-01-17), XP055965218, Retrieved from the Internet <URL:http://www.nature.com/articles/s41467-019-14250-7> DOI: 10.1038/s41467-019-14250-7 *

Also Published As

Publication number Publication date
DE102021107402A1 (de) 2022-09-29
WO2022200423A2 (de) 2022-09-29

Similar Documents

Publication Publication Date Title
BRPI0411591A (pt) método e aparelho para fabricar componentes eletrÈnicos de filme fino, e, componente eletrÈnico de filme fino
TW200711221A (en) Artificial impedance structure
TW200505033A (en) Capacitor and method of fabricating the same
TW200623282A (en) Method of manufacturing an electronic circuit assembly
TW200705482A (en) Capacitor layer forming material and method for manufacturing the same
MXPA05010527A (es) Metodo para la elaboracion de un modulo electronico y un modulo electronico.
TW200703468A (en) Semiconductor device and method for manufacturing the same
WO2004055919A3 (en) Electronic devices
WO2008097724A3 (en) Passivation layer for a circuit device and method of manufacture
TW200607428A (en) PCB and its manufacturing method
TW200715327A (en) Solid electrolytic capacitor, distributed constant type noise filter, and method of producing the same
TW200629310A (en) High energy density capacitors
WO2007025521A3 (de) Verfahren zur herstellung eines halbleiterbauelements mit einer planaren kontaktierung und halbleiterbauelement
TW200644004A (en) Multilayer ceramic electronic device and method of production of the same
JP2018074134A5 (de)
DE502004004748D1 (de) Sicherheitselement zur rf-identifikation
DE102010039330A1 (de) Verfahren zum Herstellen einer elektrischen Durchkontaktierung in einem Substrat sowie Substrat mit einer elektrischen Durchkontaktierung
TW200704330A (en) Electronic board, method of manufacturing the same, and electronic device
TW200802800A (en) Method for fabricating a semiconductor component including a high capacitance per unit area capacitor
WO2022200423A3 (de) Elektronisches bauteil, bauteilanordnung, funktionsschicht zum bilden eines elektronischen bauteils und verfahren zum herstellen eines elektronischen bauteils
WO2004041712A3 (en) Method of making a nanoscale electronic device
EP1701597A4 (de) Plasmaerzeugungselektrode, herstellungsvrfahren dafür und plasmareaktor
GB2466163A (en) Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure
TW200505316A (en) Manufacturing method for an electronic component and an electronic component
MY192585A (en) Laminate for printed circuit board, method for manufacturing printed circuit board, and method for manufacturing electronic device

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22717782

Country of ref document: EP

Kind code of ref document: A2