WO2022199254A1 - 环行滤波组件 - Google Patents

环行滤波组件 Download PDF

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Publication number
WO2022199254A1
WO2022199254A1 PCT/CN2022/074883 CN2022074883W WO2022199254A1 WO 2022199254 A1 WO2022199254 A1 WO 2022199254A1 CN 2022074883 W CN2022074883 W CN 2022074883W WO 2022199254 A1 WO2022199254 A1 WO 2022199254A1
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WIPO (PCT)
Prior art keywords
slot
dielectric
blind
filter assembly
loop filter
Prior art date
Application number
PCT/CN2022/074883
Other languages
English (en)
French (fr)
Inventor
蔡文新
曹煜
胡亚辉
Original Assignee
成都领益通信技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 成都领益通信技术有限公司 filed Critical 成都领益通信技术有限公司
Priority to SE2250447A priority Critical patent/SE2250447A1/en
Priority to US17/754,931 priority patent/US11962058B1/en
Publication of WO2022199254A1 publication Critical patent/WO2022199254A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/2002—Dielectric waveguide filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H01P1/2084—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure with dielectric resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H01P1/39—Hollow waveguide circulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/122—Dielectric loaded (not air)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/16—Dielectric waveguides, i.e. without a longitudinal conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/06—Cavity resonators
    • H01P7/065—Cavity resonators integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007—Manufacturing frequency-selective devices

Definitions

  • the present application relates to the field of wireless communication, and in particular, to a loop filter assembly.
  • Massive MIMO multiple antenna arrays
  • AAU Active Antenna Unit, active antenna unit, that is, the remote radio frequency unit and antenna Fusion devices
  • the general layout of the RF front-end is that the antenna array and filter array are arranged in sequence, and then each dielectric waveguide filter is connected to one port of the circulator through a connector, and the other two of the circulator are connected.
  • the port is connected to the transmitter and receiver, and the circulator is surface mounted on the board of the TR (radio frequency) component (as shown in Figure 1).
  • the dielectric waveguide filter and the circulator are interconnected by connectors to form a ring filter component, which increases the loss of the connector, which increases the insertion loss and power consumption of the ring filter component. Determinism has an impact on the performance of the loop filter assembly.
  • the present application aims to solve at least one of the technical problems existing in the prior art.
  • a loop filter component is proposed, which can reduce the insertion loss and power consumption of the loop filter component.
  • a dielectric waveguide circulator the dielectric waveguide circulator is provided with at least three ends, one end of the dielectric filter is connected to one of the ends, and the connection between the dielectric filter and the end is provided with A cascaded matching window is used to adjust the impedance of the loop filter assembly; the dielectric waveguide circulator is integrally formed with the dielectric filter.
  • the present application has at least the following beneficial effects: by integrally molding the dielectric waveguide circulator and the dielectric filter, the connection parts between the dielectric waveguide circulator and the dielectric filter can be reduced;
  • the standing wave index of the loop filter assembly obtained by integrating with the dielectric waveguide circulator does not meet the requirements. Therefore, a cascade matching window is added to adjust the impedance to meet the required standing wave index.
  • the circulator filter assembly of the present application has smaller insertion loss and lower power consumption.
  • the other two ends of the dielectric waveguide circulator are respectively provided with a first blind feeding hole, and the dielectric filter is provided with a second blind feeding hole;
  • the two first blind feeding holes and the second blind feeding holes are respectively located on the same side or on different sides of the loop filter assembly. Therefore, through the different setting methods of the first feeding blind hole and the second feeding blind hole, the loop filter assembly can be applied to the scene where one side is connected to the antenna and the other side is connected to the TR assembly, and it can also be applied to the direct welding of the entire loop filter assembly.
  • the scene on the TR component board ie the AAU scene).
  • the dielectric filter includes two first resonant cavities, two second resonant cavities, a first T-shaped through-slot, and a first coupling hole, and the two first resonators
  • the cavity and the two second resonance cavities are respectively located at two ends of the dielectric filter, and the two second resonance cavities are located at one end away from the cascaded matching window
  • the first T-shaped through-slot includes a first through slot and a second through slot, the second through slot separates the two first resonant cavities
  • the first through slot separates the first resonant cavity from the second resonant cavity one end of the second through slot is connected to the first through slot
  • the first coupling hole is located between the two second resonant cavities, each of the first resonant cavity, the second resonator
  • the same first surface of the cavity is provided with a tuning blind hole
  • the loop filter assembly is provided with a second surface relative to the first surface, and the second feeding blind hole is located on the second surface.
  • the dielectric filter is divided into several first resonant cavities and second resonant cavities through the first T-shaped through-slot and the first coupling hole to form a single-layer dielectric filter, which can keep the overall thickness of the loop filter assembly the same, which is more convenient Install.
  • the dielectric filter further includes a second T-shaped through-slot and two third resonant cavities; the second T-shaped through-slot is located in the first T-shaped through-slot, between the first coupling holes; the second T-shaped through-slot includes a third through-slot and a fourth through-slot; the third through-slot is arranged in parallel with the first through-slot; the fourth through-slot parallel to the second through-slot; the fourth through-slot is located between the two third resonant cavities; the third through-slot is located between the third resonant cavity and the second resonant cavity .
  • both ends of the third through slot of the second T-shaped through slot are provided with second coupling holes.
  • an electrode metal layer is provided on the outer edges of the first blind feeding hole and the second blind feeding hole; the electrode metal layer corresponds to the corresponding first The feed blind via or the metallized area of the second feed blind via is connected.
  • the electrode metal layer is connected to the metallized area of the feeding blind hole, so that when the pads on the PCB are connected through the electrode metal layer, the risk of contact between the metallized area of the dielectric filter or the dielectric waveguide circulator and the pad is reduced. At the same time, the pad can be connected to the feeding blind hole through the electrode.
  • the width of the electrode metal layer is set at 0.3 mm ⁇ 1 mm. Therefore, setting the electrode metal layer to a width of 0.3 mm to 1 mm can adapt to the pad size of most existing PCB boards.
  • the dielectric waveguide circulator is provided with a matching step and a blind mounting hole
  • the matching step is provided on the surface of the dielectric waveguide circulator
  • the matching step is provided with a number of matching steps with the dielectric
  • a corresponding groove is provided at the end of the waveguide circulator; the groove is circumferentially arranged around the installation blind hole; the installation blind hole is used for installing the magnetic component.
  • two adjacent grooves communicate with each other.
  • a matching step that matches the outer contour of the dielectric waveguide circulator can be formed first during processing, and then a blind hole is machined and installed in the matching step, thereby improving the convenience of manufacturing the circulator filter assembly.
  • the loop filter assembly further includes a magnetic assembly, and the magnetic assembly includes a ferrite substrate, a samarium cobalt magnet, and a cover plate arranged in sequence; the cover plate is opposite to the iron
  • the oxygen body substrate is far away from the bottom of the blind installation hole; the cover plate is detachably arranged on the blind installation hole.
  • the samarium cobalt magnet of the magnetic assembly can provide an external magnetic field, and the cover plate can provide a certain pressing force to the ferrite substrate and the samarium cobalt magnet, so that the magnetic assembly can be better fixed in the blind installation hole.
  • the dielectric waveguide circulator and the dielectric filter are integrally formed through a dry pressing process or an injection process and are obtained by metallization.
  • FIG. 1 is a schematic diagram of the connection of a loop filter assembly in the prior art
  • FIG. 2 is a schematic structural diagram of an embodiment of a loop filter assembly according to an embodiment of the application (without a magnetic assembly, and the first blind feeding hole and the second blind feeding hole are arranged on the same plane);
  • FIG. 3 is a top plan view of the lower surface of an embodiment of a loop filter assembly according to an embodiment of the present application
  • FIG. 4 is a schematic structural diagram of an embodiment of a loop filter assembly according to an embodiment of the application (the magnetic assembly is an exploded schematic diagram);
  • FIG. 5 is a schematic structural diagram of another embodiment of the loop filter assembly according to the embodiment of the present application (the first blind feeding hole and the second blind feeding hole are on different sides).
  • Dielectric waveguide circulator 200 end portion 210 , first feed blind hole 220 , electrode metal layer 230 , non-metallized region 240 , matching step 250 , mounting blind hole 260 ,
  • Magnetic assembly 400 ferrite substrate 410, samarium cobalt magnet 420, cover plate 430;
  • Antenna 510, circulator 520 Antenna 510, circulator 520.
  • orientation or positional relationship indicated in relation to orientation description is based on the orientation or positional relationship shown in the accompanying drawings, only For the convenience of describing the present application and simplifying the description, it is not indicated or implied that the referred device or element must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as a limitation of the present application.
  • the general layout of the RF front-end is to set up a filter array after the antenna 510 array, and then each dielectric waveguide filter 100 is connected to a circulator 520 through a connector.
  • the other two ports of the circulator 520 are connected to the transmitter and the receiver respectively, and the circulator 520 is attached to the board of the TR component.
  • the dielectric waveguide filter 100 and the circulator 520 are interconnected by connectors, the loss of the connector will increase, the insertion loss of the whole machine will increase, and the power consumption of the device will increase. At the same time, the connector will also filter the dielectric waveguide. The performance of the loop filter assembly formed by the circulator and circulator 520 is uncertain.
  • the present application proposes a loop filter assembly.
  • the purpose is to integrally form the dielectric filter 100 and the dielectric waveguide circulator 200, so that the circulatory filter assembly does not contain the insertion loss of the connector, thereby reducing the overall loss of the wireless device and optimizing the wireless system layout.
  • the loop filter assembly of the present application includes:
  • the dielectric waveguide circulator 200, the dielectric waveguide circulator 200 is provided with at least three ends 210, one end of the dielectric filter 100 is connected to one of the ends 210, and the connection between the dielectric filter 100 and the end 210 is provided with a cascade matching
  • the window 300, the cascade matching window 300 is used to adjust the impedance of the loop filter assembly; the dielectric waveguide circulator 200 and the dielectric filter 100 are integrally formed.
  • the connection parts between the dielectric waveguide circulator 200 and the dielectric filter 100 can be reduced, but the dielectric filter 100 and the dielectric waveguide circulator 200 are integrated
  • the obtained loop filter assembly; the standing wave index of the loop filter assembly does not meet the requirements; therefore, a cascade matching window 300 is added to perform impedance adjustment to obtain a standing wave index that meets the requirements.
  • the present application can satisfy the performance of the loop filter assembly, and at the same time, the loop filter assembly has lower insertion loss and lower power consumption.
  • the dielectric filter 100 and the dielectric waveguide circulator 200 are obtained by integrally molding a dielectric material (dielectric material such as ceramic powder) and then metallizing. It should be noted that, since the dielectric waveguide circulator 200 and the dielectric filter 100 are integrally formed, no device such as a connector is required to connect the dielectric waveguide circulator 200 and the dielectric filter 100, which can further reduce the cost of the circulating filter assembly.
  • the cascade matching window 300 is a groove, and impedance adjustment can be performed by adjusting the depth and width of the groove.
  • the waveguide circulator 200 and the dielectric filter 100 can be simulated separately first, and then one port of the two devices is integrated together for cascade simulation, and at the same time, by adjusting the cascade matching
  • the window 300 is used to improve the impedance change of the integrated loop filter assembly, so as to improve the standing wave index of the loop filter assembly, so as to obtain a loop filter assembly that meets the requirements.
  • the dielectric waveguide circulator 200 and the dielectric filter 100 are integrally formed and metallized by a dry pressing process or an injection process.
  • the other two ends 210 of the dielectric waveguide circulator 200 are respectively provided with first feeding blind holes 220
  • the dielectric filter 100 is provided with a second feeding hole Blind holes 110; the two first blind feeding holes 220 and the second blind feeding holes 110 are respectively located on the same side of the loop filter assembly (as shown in FIG. 2 and FIG. 3 ) or on different sides (as shown in FIG. the upper and lower surfaces of the filter assembly).
  • the loop filter assembly can be applied to the scene where one side is connected to the antenna 510 and the other side is connected to the TR assembly, and can also be applied to the entire loop The scene where the filter component is directly soldered to the TR component board (ie the AAU scene).
  • the entire AAU after assembly can be The thickness reduces the thickness of an interconnection mechanism.
  • the dielectric filter 100 includes two first resonant cavities, two second resonant cavities, a first T-shaped through-slot 120 and a first coupling hole 130 , two first resonant cavities,
  • the two second resonators are located at two ends of the dielectric filter 100 respectively, and the two second resonators are located at one end away from the cascade matching window 300 ;
  • the first T-shaped through slot 120 includes a first through slot 121 and a second through slot 121 .
  • the first coupling hole 130 is located between the two second resonant cavities, and the same first surface of each first resonant cavity and the second resonant cavity (that is, the upper surface of the loop filter assembly as shown in FIG. 2 ) is provided with Tuning blind hole 140 ; the loop filter assembly is provided with a second surface relative to the first surface (ie, the lower surface of the loop filter assembly as shown in FIG. 2 ), and the second feed blind hole 110 is located on the second surface.
  • the dielectric filter 100 is divided into several first resonant cavities and second resonant cavities by the first T-shaped through-slot 120 and the first coupling hole 130 to form a single-layer dielectric filter 100, which can keep the loop filter assembly as a whole The same thickness makes it easier to install.
  • the second feeding blind hole 110 is located on the lower surface of the second resonating cavity (that is, the second feeding blind hole). 110.
  • the first tuning blind hole 170 is respectively located on the lower surface and the upper surface of the second resonant cavity).
  • the second blind feeding hole 110 is located on the lower surface of the other resonant cavities adjacent to the first resonant cavity on the lower surface of the ring filter assembly.
  • the dielectric filter 100 in the present application is a single-layer dielectric filter 100 .
  • the size of the first through slot 121 and the distance between the two ends of the first through slot 121 and the connection between the second through slot 122 can be adjusted according to the simulation result of the dielectric filter 100 .
  • the dielectric filter 100 further includes a second T-shaped through-slot 150 and two third resonant cavities; the second T-shaped through-slot 150 is located between the first T-shaped through-slot 120 and the first coupling hole 130 ;
  • the two T-shaped through-slots 150 include a third through-slot 151 and a fourth through-slot 152; the third through-slot 151 is arranged in parallel with the first through-slot 121; the fourth through-slot 152 is arranged in parallel with the second through-slot 122;
  • the slot 152 is located between the two third resonant cavities; the third through slot 151 is located between the third resonant cavity and the second resonant cavity.
  • the second blind feeding hole 110 is located on the lower surface of the third resonant cavity.
  • multiple groups of the second T-shaped through-slot 150 and the two third resonant cavities may be provided, and the multiple groups of the second T-shaped through-slot 150 and the two third resonant cavities are both arranged in the first T-shaped through-slot 120 , between the first coupling holes 130 .
  • the second blind feeding hole 110 is located on the lower surface of the third resonant cavity closest to the first T-shaped through-slot 120 .
  • the third through grooves 151 separate two adjacent third resonance cavities.
  • the signal when the signal enters the second blind feeding hole 110 from the antenna, the signal goes as shown by the arrow in FIG. 2 , at this time.
  • the signal is input through the third resonant cavity where the first tuning blind hole 170 is located, passes through the second resonant cavity, another third resonant cavity, and the two first resonant cavities in sequence, and then is output to the dielectric waveguide circulator 200 .
  • the direction of the signal is opposite to the arrow in FIG. 2 , and the signal is output from the third resonant cavity where the first tuning blind hole 170 is located.
  • both ends of the third through slot 151 of the second T-shaped through slot 150 are provided with second coupling holes 160 .
  • the outer edges of the first blind feeding hole 220 and the second blind feeding hole 110 are provided with an electrode metal layer 230 ; and the electrode metal layer 230 and the corresponding first blind feeding hole 220 or the second feeding blind hole 220
  • the metallized areas of the blind vias 110 are connected.
  • the electrode metal layer 230 is connected to the metallized area of the feeding blind hole, so that when the pads on the PCB are connected through the electrode metal layer 230, the metallized area and the pads of the dielectric filter 100 or the dielectric waveguide circulator 200 are reduced. The risk of contact, while the pad can be conductive with the feeding blind via the electrode.
  • the width of the electrode metal layer 230 is set at 0.3 mm ⁇ 1 mm. Therefore, setting the width of the electrode metal layer 230 at 0.3 mm ⁇ 1 mm can be adapted to the pad size of most existing PCB boards.
  • 0.3 mm to 1 mm is a value including 0.3 mm, 1 mm, and 0.3 mm to 1 mm.
  • the second blind feeding hole 110 is a cylindrical groove body with one end open. Therefore, the metallized area of the second feeding blind hole 110 can be understood as the side surface and the bottom surface of the cylindrical groove body.
  • a non-metallized area 240 is also provided on the outer edge of the electrode metal layer 230, so as to further reduce the risk of the dielectric filter 100 or the dielectric waveguide circulator 200 contacting the PCB board.
  • the dielectric waveguide circulator 200 is provided with a matching step 250 and a blind mounting hole 260
  • the matching step 250 is provided on the surface of the dielectric waveguide circulator 200
  • the matching step 250 is provided with a number of corresponding to the end of the dielectric waveguide circulator 200 .
  • Grooves; the grooves are circumferentially arranged around the blind installation holes 260 ; the blind installation holes 260 are used to install the magnetic assembly 400 .
  • a matching step 250 matching the outer contour of the dielectric waveguide circulator 200 can be formed first, and then the blind hole 260 can be processed in the matching step 250, thereby improving the convenience of manufacturing the circulating filter assembly.
  • the magnetic assembly 400 has a conductive function, so the bottom and sides of the blind mounting hole 260 are insulated.
  • the depth of the matching steps 250 is shallower.
  • the circular filter assembly further includes a magnetic assembly 400
  • the magnetic assembly 400 includes a ferrite substrate 410, a samarium cobalt magnet 420 and a cover plate 430 arranged in sequence; the cover plate 430 is opposite to the ferrite substrate
  • the sheet 410 is far away from the bottom of the blind installation hole 260 ; the cover plate 430 is detachably arranged on the blind installation hole 260 .
  • the samarium cobalt magnet 420 of the magnetic assembly 400 can provide an external magnetic field, and the cover plate 430 can provide a certain pressing force to the ferrite substrate 410 and the samarium cobalt magnet 420, so that the magnetic assembly 400 can be better fixed in the installation blind inside hole 260.
  • the thickness of the ferrite substrate 410 needs to be thicker than when two matching steps 250 are provided.
  • the specific thickness and the depth of the matching step 250 can be set according to the simulation result.
  • cover plate 430 can be fixed on the blind installation hole 260 by means of clamping, and after fixing, the cover plate 430 and the blind installation hole 260 can be further fixed by glue or welding.
  • a loop filter assembly according to an embodiment of the present application is described in detail below with reference to FIG. 2 to FIG. 4 with a specific embodiment. It should be understood that the following descriptions are merely exemplary illustrations rather than specific limitations of the present application.
  • the loop filter assembly of the present application includes a dielectric filter 100; a dielectric waveguide circulator 200.
  • the dielectric waveguide circulator 200 is provided with three ends 210, and one end of the dielectric filter 100 is connected to one of the ends 210.
  • the connection between the dielectric filter 100 and the end portion 210 is provided with a cascaded matching window 300, which is used to adjust the impedance of the loop filter assembly; the dielectric waveguide circulator 200 and the dielectric filter 100 are integrally formed.
  • the dielectric filter 100 and the dielectric waveguide circulator 200 are integrally formed using dielectric materials obtained by metallizing ceramic powders in combination with an injection process.
  • the other two ends 210 of the dielectric waveguide circulator 200 are respectively provided with first feed blind holes 220
  • the dielectric filter 100 is provided with second feed blind holes 110 ;
  • a blind feeding hole 220 and a second blind feeding hole 110 are respectively located on the lower surface of the loop filter assembly.
  • the dielectric filter 100 includes two first resonant cavities, two second resonant cavities, a first T-shaped through-slot 120 and a first coupling hole 130, two first resonant cavities, two The second resonators are located at two ends of the dielectric filter 100 respectively, and the two second resonators are located at one end away from the cascaded matching window 300 ;
  • the first T-shaped through-slot 120 includes a first through-slot 121 and a second through-slot 122 , the second through slot 122 separates the two first resonant cavities;
  • the first through slot 121 separates the first resonant cavity from the second resonant cavity; one end of the second through slot 122 is connected with the first through slot 121;
  • a coupling hole 130 is located between the two second resonators, and a tuning blind hole 140 is provided on the same upper surface of each of the first and second resonators.
  • the dielectric filter 100 further includes a second T-shaped through-slot 150 and two third resonant cavities.
  • the second T-shaped through-slot 150 is located in the first T-shaped through-slot 120 and the first coupling Between the holes 130; the second T-shaped through slot 150 includes a third through slot 151 and a fourth through slot 152; the third through slot 151 and the first through slot 121 are arranged in parallel; the fourth through slot 152 and the second through slot 122 Set in parallel; the fourth through slot 152 is used to separate the two third resonant cavities, the third through slot 151 separates the third resonant cavity from the second resonant cavity; the second feeding blind hole 110 is located in the third resonant cavity on the lower surface.
  • the signal when a signal is input from one end 210 of the dielectric waveguide circulator 200 as shown in FIG. 2 , the signal goes in the opposite direction as shown by the arrow in FIG. 2 through the end 210 connected to the dielectric filter 100 . After passing through two first resonant cavities, one third resonant cavity, two second resonant cavities, and the third resonant cavity provided with the second feeding blind hole 110 in sequence, the output forms a ring shape. When the signal is input from the second feeding blind hole 110 , it is output from the dielectric filter 100 to the dielectric waveguide circulator 200 from the direction shown in FIG. 2 .
  • both ends of the third through slot 151 of the second T-shaped through slot 150 are provided with second coupling holes 160 .
  • first feeding blind hole 220 and the second feeding blind hole 110 are provided with an electrode metal layer 230;
  • the electrical blind vias 220 or the metallized regions of the second feed blind vias 110 are connected.
  • a non-metallized area 240 is also provided on the outer edge of the electrode metal layer 230, so as to further reduce the risk of the dielectric filter 100 or the dielectric waveguide circulator 200 contacting the PCB board.
  • the dielectric waveguide circulator 200 is provided with two matching steps 250 and blind mounting holes 260.
  • the two matching steps 250 are respectively provided on the upper surface and the lower surface of the dielectric waveguide circulator 200.
  • the matching steps 250 are provided with three matching steps 250 corresponding to the dielectric waveguide.
  • the grooves are correspondingly arranged at the end of the circulator 200; the grooves are circumferentially arranged around the installation blind hole 260; the two adjacent grooves are connected to each other to form a Y-shaped shape that is the same as the outer contour of the dielectric waveguide circulator 200; the installation blind hole 260 For mounting the magnetic assembly 400.
  • the circular filter assembly further includes a magnetic assembly 400
  • the magnetic assembly 400 includes a ferrite substrate 410 , a samarium cobalt magnet 420 and a cover plate 430 arranged in sequence; the cover plate 430 is opposite to the ferrite substrate 410 Away from the bottom of the blind installation hole 260 ; the cover plate 430 is detachably arranged on the blind installation hole 260 .

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Abstract

本申请公开了一种环行滤波组件，涉及无线通信领域。环行滤波组件包括介质滤波器；介质波导环行器，介质波导环行器设置有至少3个端部，介质滤波器的一端与其中一个端部连接，介质滤波器与端部的连接处设置有级联匹配窗口，级联匹配窗口用于调整环行滤波组件的阻抗；介质波导环行器与介质滤波器一体成型。通过将介质波导环行器与介质滤波器一体成型，可以减少介质波导环行器与介质滤波器之间的连接件；同时增加级联匹配窗口进行阻抗调整，以得到与传统采用连接器方式连接的相同的驻波指标。相对于传统通过连接器连接的方式，本申请可以减少插损以及功耗更低。

Description

环行滤波组件 技术领域
本申请涉及无线通信领域，特别是涉及一种环行滤波组件。
背景技术
随着全球5G基站如火如荼的建设，Massive MIMO(多天线阵列)和介质波导滤波器在5G基站中的应用逐渐普及，而AAU(Active Antenna Unit，有源天线单元，即把远端射频单元和天线融合在一起的设备)更是5G时代的显著特征。在这种极简天面的系统架构下，射频前端通用的布局形态是天线阵列、滤波器阵列依次排列，然后每个介质波导滤波器通过连接器与环行器一个端口连接，环行器其他两个端口则与发射机和接收机连接，而环行器则是表贴在TR(射频)组件的板子上(如图1所示)。
但是，这种架构下，介质波导滤波器和环行器采用连接器互连形成的环行滤波组件，增加了连接器的损耗，使得环行滤波组件插损增大且功耗增加，同时连接处的不确定性对环行滤波组件的性能产生一定影响。
发明内容
本申请旨在至少解决现有技术中存在的技术问题之一。为此，提出一种环行滤波组件，可以降低环行滤波组件的插损以及减少功耗。
根据本申请实施例的一种环行滤波组件，其特征在于，包括：
介质滤波器；
介质波导环行器，所述介质波导环行器设置有至少3个端部，所述介质滤波器的一端与其中一个所述端部连接，所述介质滤波器与所述端部的连接处设置有级联匹配窗口，所述级联匹配窗口用于调整所述环行滤波组件的阻抗；所述介质波导环行器与所述介质滤波器一体成型。
根据本申请上述实施例，本申请至少具有如下有益效果：通过将介质波导环行器与介质滤波器一体成型，可以减少介质波导环行器与介质滤波器之间的连接件；但是，将介质滤波器和介质波导环行器一体化得到的环行滤波组件，环行滤波组件的驻波指标存在不满足需求情况，因此，增加级联匹配窗口进行阻抗调整，以满足需求驻波指标。此时，相对于传统通过连接器连接环行器与介质滤波器得 到的滤波组件，本申请的环行滤波组件插损更小以及功耗更低。
根据本申请一些实施例的环行滤波组件，所述介质波导环行器的另外两个所述端部分别设置有第一馈电盲孔，所述介质滤波器上设置有第二馈电盲孔；两个所述第一馈电盲孔与所述第二馈电盲孔分别位于所述环行滤波组件的同一面或不同面。因此，通过第一馈电盲孔和第二馈电盲孔不同的设置方式，可以使得环行滤波组件即可以应用于一面接天线一面接TR组件的场景，又可以应用于整个环行滤波组件直接焊接在TR组件板的场景(即AAU场景)。
根据本申请一些实施例的环行滤波组件，所述介质滤波器包括两个第一谐振腔、两个第二谐振腔、第一T型通槽以及第一耦合孔，两个所述第一谐振腔、两个所述第二谐振腔分别位于所述介质滤波器的两端，且两个所述第二谐振腔位于远离所述级联匹配窗口的一端；所述第一T型通槽包括第一通槽以及第二通槽，所述第二通槽将两个所述第一谐振腔隔开；所述第一通槽将所述第一谐振腔和所述第二谐振腔隔开；所述第二通槽的一端与所述第一通槽连接；所述第一耦合孔位于两个所述第二谐振腔之间，每一所述第一谐振腔、所述第二谐振腔的同一第一表面均设置有调谐盲孔；所述环行滤波组件相对于所述第一表面设置有第二表面，所述第二馈电盲孔位于所述第二表面。通过第一T型通槽以及第一耦合孔将介质滤波器分割成若干第一谐振腔和第二谐振腔，以形成单层的介质滤波器，可以使得环行滤波组件保持整体厚度相同，更加便于安装。
根据本申请一些实施例的环行滤波组件，所述介质滤波器还包括第二T型通槽以及两个第三谐振腔；所述第二T型通槽位于所述第一T型通槽、所述第一耦合孔之间；所述第二T型通槽包括第三通槽和第四通槽；所述第三通槽与所述第一通槽平行设置；所述第四通槽与所述第二通槽平行设置；所述第四通槽位于两个所述第三谐振腔之间；所述第三通槽位于所述第三谐振腔和所述第二谐振腔之间。
根据本申请一些实施例的环行滤波组件，所述第二T型通槽的第三通槽的两端设置有第二耦合孔。
根据本申请一些实施例的环行滤波组件，所述第一馈电盲孔与所述第二馈电盲孔的外边缘均设置有电极金属层；所述电极金属层与对应的所述第一馈电盲孔或所述第二馈电盲孔的金属化区域连接。通过电极金属层与馈电盲孔的金属化区域连接，从而使得将PCB板上的焊盘通过电极金属层连接时，减少介质滤波器或 介质波导环行器金属化区域与焊盘接触的风险，同时焊盘可以通过电极与馈电盲孔导通。
根据本申请一些实施例的环行滤波组件，所述电极金属层的宽度设置在0.3mm～1mm。因此，将电极金属层设置在0.3mm～1mm的宽度，可以适配现有大多数的PCB板的焊盘尺寸。
根据本申请一些实施例的环行滤波组件，所述介质波导环行器设置有匹配台阶以及安装盲孔，所述匹配台阶设置在介质波导环行器的表面，所述匹配台阶设置有若干与所述介质波导环行器端部对应设置的凹槽；所述凹槽绕所述安装盲孔周向设置；所述安装盲孔用于安装磁性组件。
根据本申请一些实施例的环行滤波组件，相邻的两个所述凹槽相互连通。通过将凹槽相互连通，加工时可以先加工形成与介质波导环行器外轮廓匹配的匹配台阶，然后在匹配台阶中加工安装盲孔，从而可以提升环行滤波组件制作的便利性。
根据本申请一些实施例的环行滤波组件，所述环行滤波组件还包括磁性组件，所述磁性组件包括依次设置的铁氧体基片、钐钴磁铁以及盖板；所述盖板相对所述铁氧体基片远离所述安装盲孔的底部；所述盖板可拆卸设置在所述安装盲孔上。通过磁性组件的钐钴磁铁可以提供外部磁场，而盖板可以提供一定的压紧力给铁氧体基片、钐钴磁铁，以使磁性组件更好的固定在安装盲孔内。
根据本申请一些实施例的环行滤波组件，所述介质波导环行器与所述介质滤波器通过干压工艺或注射工艺一体成型经金属化处理得到。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1为现有技术的环行滤波组件连接示意图；
图2为本申请实施例的环行滤波组件一个实施例的结构示意图(不含磁性组件，第一馈电盲孔、第二馈电盲孔同面设置)；
图3为本申请实施例的环行滤波组件一个实施例的下表面俯视图；
图4为本申请实施例的环行滤波组件一个实施例的结构示意图(磁性组件为 爆炸示意图)；
图5为本申请实施例的环行滤波组件另一个实施例的结构示意图(第一馈电盲孔、第二馈电盲孔不同面)。
附图标记：
介质滤波器100、第二馈电盲孔110、第一T型通槽120、第一通槽121、第二通槽122、第一耦合孔130、调谐盲孔140、第二T型通槽150、第三通槽151、第四通槽152、第二耦合孔160、第一调谐盲孔170、
介质波导环行器200、端部210、第一馈电盲孔220、电极金属层230、非金属化区域240、匹配台阶250、安装盲孔260、
级联匹配窗口300、
磁性组件400、铁氧体基片410、钐钴磁铁420、盖板430；
天线510、环行器520。
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，涉及到方位描述，例如上、下、前、后、左、右等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
本申请的描述中，除非另有明确的限定，设置、安装、连接等词语应做广义理解，所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本申请中的具体含义。
随着全球5G基站如火如荼的建设，Massive MIMO和介质波导滤波器在5G基站中的应用逐渐普及，而AAU更是5G时代的显著特征。在这种极简天面的系统架构下，如图1所示，射频前端通用的布局形态是天线510阵列后设置滤波器阵列，然后每个介质波导滤波器100通过连接器与环行器520一个端口连接，环行器520其他两个端口则分别与发射机和接收机连接，而环行器520则是贴在TR组件的板子上。
这种架构下，由于介质波导滤波器100和环行器520采用连接器互连，会增加连接器的损耗，使得整机插损增大，设备功耗增加，同时连接器也会对介质波导滤波器和环行器520形成的环行滤波组件的性能造成不确定的影响。
因此，为解决上述问题，本申请提出了一种环行滤波组件。旨在将介质滤波器100和介质波导环行器200一体成型，使得环行滤波组件不含连接器的插损，从而降低无线设备整机损耗，优化无线系统布局。
如图2所示，本申请的环行滤波组件包括：
介质滤波器100；
介质波导环行器200，介质波导环行器200设置有至少3个端部210，介质滤波器100的一端与其中一个端部210连接，介质滤波器100与端部210的连接处设置有级联匹配窗口300，级联匹配窗口300用于调整环行滤波组件的阻抗；介质波导环行器200与介质滤波器100一体成型。
因此，通过将介质波导环行器200与介质滤波器100一体成型，可以减少介质波导环行器200与介质滤波器100之间的连接件，但是，将介质滤波器100和介质波导环行器200一体化得到的环行滤波组件；环行滤波组件的驻波指标存在不满足需求的情况；因此，增加级联匹配窗口300进行阻抗调整，以得到满足需求的驻波指标。此时，相对于传统通过连接器连接介质波导环行器200与环行器的方式，本申请在满足环行滤波组件性能的同时，其环行滤波组件插损更小以及功耗更低。
需说明的是，介质滤波器100、介质波导环行器200采用介质材料(介质材料如陶瓷粉料)一体成型后进行金属化后得到。需说明的是，由于介质波导环行器200与介质滤波器100一体成型，因此无需连接器这类的器件将介质波导环行器200、介质滤波器100连接，可以进一步降低环行滤波组件的成本。
需说明的是，级联匹配窗口300为凹槽，通过调整凹槽的深度以及宽度，可以进行阻抗调整。
需说明的是，在仿真设计时，可以先单独对波导环行器200和介质滤波器100进行仿真，然后再将两个器件的其中各一个端口集成在一起级联仿真，同时通过调整级联匹配窗口300来改善集成后的环行滤波组件的阻抗变化，以改善环行滤波组件驻波指标，从而得到满足需求的环行滤波组件。
此时，可理解为，介质波导环行器200与介质滤波器100通过干压工艺或注射 工艺一体成型经金属化处理得到。
可理解为，如图2、图3、图5所示，介质波导环行器200的另外两个端部210分别设置有第一馈电盲孔220，介质滤波器100上设置有第二馈电盲孔110；两个第一馈电盲孔220与第二馈电盲孔110分别位于环行滤波组件的同一面(如图2、图3)或不同面(如图5所示的分别位于环行滤波组件的上下两个表面)。因此，通过第一馈电盲孔220和第二馈电盲孔110的不同的设置方式，可以使得环行滤波组件即可以应用于一面接天线510一面接TR组件的场景，又可以应用于整个环行滤波组件直接焊接在TR组件板的场景(即AAU场景)。
需说明的是，如图2、图3所示，当第一馈电盲孔220和第二馈电盲孔110均设置在同一下表面时，在AAU场景，可以使得组装好后的整个AAU厚度减少一个互联机构的厚度。
可理解为，如图2所示，介质滤波器100包括两个第一谐振腔、两个第二谐振腔、第一T型通槽120以及第一耦合孔130，两个第一谐振腔、两个第二谐振腔分别位于介质滤波器100的两端，且两个第二谐振腔位于远离级联匹配窗口300的一端；第一T型通槽120包括第一通槽121以及第二通槽122，第二通槽122将两个第一谐振腔隔开；第一通槽121将第一谐振腔和第二谐振腔隔开；第二通槽122的一端与第一通槽121连接；第一耦合孔130位于两个第二谐振腔之间，每一第一谐振腔、第二谐振腔的同一第一表面(即如图2所示的环行滤波组件的上表面)均设置有调谐盲孔140；环行滤波组件相对于第一表面设置有第二表面(即如图2所示的环行滤波组件的下表面)，第二馈电盲孔110位于第二表面。通过第一T型通槽120以及第一耦合孔130将介质滤波器100分割成若干第一谐振腔和第二谐振腔，以形成的单层的介质滤波器100，可以使得环行滤波组件保持整体厚度相同，更加便于安装。
需说明的是，当介质滤波器仅且只有两个第二谐振腔、两个第一谐振腔时，第二馈电盲孔110位于第二谐振腔的下表面(即第二馈电盲孔110、第一调谐盲孔170分别位于第二谐振腔的下表面、上表面)。当介质滤波器100设置有其他谐振腔时，第二馈电盲孔110位于环行滤波组件的下表面上与第一谐振腔相邻的其他谐振腔的下表面。
需说明的是，所有的调谐盲孔140在介质滤波器100上均位于介质滤波器100的同一面设置，因此，本申请中介质滤波器100为单层的介质滤波器100。
需说明的是，可以根据介质滤波器100的仿真结果，调整第一通槽121的大小以及第一通槽121两端与第二通槽122连接处的距离。
可理解为，介质滤波器100还包括第二T型通槽150以及两个第三谐振腔；第二T型通槽150位于第一T型通槽120、第一耦合孔130之间；第二T型通槽150包括第三通槽151和第四通槽152；第三通槽151与第一通槽121平行设置；第四通槽152与第二通槽122平行设置；第四通槽152位于两个第三谐振腔之间；第三通槽151位于第三谐振腔和第二谐振腔之间。
需说明的是，如图2所示，此时，第二馈电盲孔110位于第三谐振腔的下表面。
需说明的是，第二T型通槽150以及两个第三谐振腔可以设置多组，多组第二T型通槽150以及两个第三谐振腔均设置在第一T型通槽120、第一耦合孔130之间。当设置多个第二T型通槽150时，第二馈电盲孔110位于最靠近第一T型通槽120的第三谐振腔的下表面。第三通槽151隔开两个相邻的第三谐振腔。
如图2所示，当信号从天线进入第二馈电盲孔110时，信号走向如图2的箭头所示，此时。信号经第一调谐盲孔170所在的第三谐振腔输入并依次经过第二谐振腔、另一个第三谐振腔、两个第一谐振腔后，输出至介质波导环行器200。当信号从介质波导环行器200到介质滤波器100时，此时信号走向与图2中的箭头相反，从第一调谐盲孔170所在的第三谐振腔输出。
可理解为，第二T型通槽150的第三通槽151的两端设置有第二耦合孔160。
可理解为，第一馈电盲孔220与第二馈电盲孔110的外边缘均设置有电极金属层230；且电极金属层230与对应的第一馈电盲孔220或第二馈电盲孔110的金属化区域连接。通过电极金属层230与馈电盲孔的金属化区域连接，从而使得将PCB板上的焊盘通过电极金属层230连接时，减少介质滤波器100或介质波导环行器200金属化区域与焊盘接触的风险，同时焊盘可以通过电极与馈电盲孔导通。
可理解为，电极金属层230的宽度设置在0.3mm～1mm，因此，将电极金属层230设置在0.3mm～1mm的宽度，可以适配现有大多数的PCB板的焊盘尺寸。
需说明的是，0.3mm～1mm为包含0.3mm、1mm，以及0.3mm～1mm之间的值。
需说明的是，第二馈电盲孔110为一端开口的圆柱槽体，因此，第二馈电盲孔110的金属化区域可理解为圆柱槽体的槽体侧面以及底面。
需说明的是，在电极金属层230外边缘还设置有非金属化区域240，从而进一步减少介质滤波器100或介质波导环行器200与PCB板接触的风险。
可理解为，介质波导环行器200设置有匹配台阶250以及安装盲孔260，匹配台阶250设置在介质波导环行器200的表面，匹配台阶250设置有若干与介质波导环行器200端部对应设置的凹槽；凹槽绕安装盲孔260周向设置；安装盲孔260用于安装磁性组件400。
可理解为，相邻的两个凹槽相互连通。通过将凹槽相互连通，加工时可以先加工形成与介质波导环行器200外轮廓匹配的匹配台阶250，然后在匹配台阶250中加工安装盲孔260，从而可以提升环行滤波组件制作的便利性。
需说明的是，磁性组件400具有导电作用，因此，安装盲孔260的底部和侧边均为绝缘的。
需说明的是，当介质波导环行器200的上下两个表面均设置有匹配台阶250时；相对于仅介质波导环行器200的一个表面设置匹配台阶250的场景，匹配台阶250的深度较浅。
可理解为，如图4所示，环行滤波组件还包括磁性组件400，磁性组件400包括依次设置的铁氧体基片410、钐钴磁铁420以及盖板430；盖板430相对铁氧体基片410远离安装盲孔260的底部；盖板430可拆卸设置在安装盲孔260上。通过磁性组件400的钐钴磁铁420可以提供外部磁场，而盖板430可以提供一定的压紧力给铁氧体基片410、钐钴磁铁420，以使磁性组件400更好的固定在安装盲孔260内。
需说明的是，当介质波导环行器200设置一个匹配台阶250时，铁氧体基片410厚度需要设置相对于设置两个匹配台阶250时更厚。具体的厚度以及匹配台阶250的深度，可以根据仿真的结果进行设置。
需说明的是，盖板430可以通过卡装方式固定在安装盲孔260上，当固定后，可以通过胶水或焊接方式进一步将盖板430与安装盲孔260固定。
下面参考图2至图4以一个具体的实施例详细描述本申请的实施例的一种环行滤波组件。值得理解的是，下述描述仅是示例性说明，而不是对本申请的具体限制。
如图2所示，本申请的环行滤波组件包括介质滤波器100；介质波导环行器200，介质波导环行器200设置有3个端部210，介质滤波器100的一端与其中一个端部210连接，介质滤波器100与端部210的连接处设置有级联匹配窗口300，级联匹配窗口用于调整环行滤波组件的阻抗；介质波导环行器200与介质滤波器100一体成型。
具体的，介质滤波器100、介质波导环行器200采用通过陶瓷粉料进行金属化后得到的介质材料结合注射工艺一体成型。
如图2、图3所示，介质波导环行器200的另外两个端部210分别设置有第一馈电盲孔220，介质滤波器100上设置有第二馈电盲孔110；两个第一馈电盲孔220与第二馈电盲孔110分别位于环行滤波组件的下表面。
进一步，如图2所示，介质滤波器100包括两个第一谐振腔、两个第二谐振腔、第一T型通槽120以及第一耦合孔130，两个第一谐振腔、两个第二谐振腔分别位于介质滤波器100的两端，且两个第二谐振腔位于远离级联匹配窗口300的一端；第一T型通槽120包括第一通槽121以及第二通槽122，第二通槽122将两个第一谐振腔隔开；第一通槽121将第一谐振腔和第二谐振腔隔开；第二通槽122的一端与第一通槽121连接；第一耦合孔130位于两个第二谐振腔之间，每一第一谐振腔、第二谐振腔的同一上表面均设置有调谐盲孔140。
进一步，如图2所示，介质滤波器100还包括1个第二T型通槽150以及2个第三谐振腔，第二T型通槽150位于第一T型通槽120、第一耦合孔130之间；第二T型通槽150包括第三通槽151和第四通槽152；第三通槽151与第一通槽121平行设置；第四通槽152与第二通槽122平行设置；第四通槽152用于将两个第三谐振腔隔开，第三通槽151将第三谐振腔与第二谐振腔隔开；第二馈电盲孔110位于第三谐振腔的下表面上。
具体的，当信号从如图2所示的介质波导环行器200的一个端部210输入时，信号经与介质滤波器100连接的那个端部210沿如图2的箭头所示走向相反的方向依次经过两个第一谐振腔、一个第三谐振腔、两个第二谐振腔以及设置有第二馈电盲孔110的第三谐振腔后输出，形成环形。当信号从第二馈电盲孔110输入时，从如图2所示的方向从介质滤波器100输出至介质波导环行器200。
进一步，第二T型通槽150的第三通槽151的两端设置有第二耦合孔160。
进一步，第一馈电盲孔220与第二馈电盲孔110的外边缘均设置有电极金属层230；电极金属层230的宽度设置在0.3mm，且电极金属层230与对应的第一馈电盲孔220或第二馈电盲孔110的金属化区域连接。
进一步，在电极金属层230外边缘还设置有非金属化区域240，从而进一步减少介质滤波器100或介质波导环行器200与PCB板接触的风险。
进一步，介质波导环行器200设置有两个匹配台阶250以及安装盲孔260，两 个匹配台阶250分别设置在介质波导环行器200的上表面和下表面，匹配台阶250设置有3个与介质波导环行器200端部对应设置的凹槽；凹槽绕安装盲孔260周向设置；相邻的两个凹槽相互连通形成与介质波导环行器200外轮廓相同的Y型形状；安装盲孔260用于安装磁性组件400。
进一步，如图4所示，环行滤波组件还包括磁性组件400，磁性组件400包括依次设置的铁氧体基片410、钐钴磁铁420以及盖板430；盖板430相对铁氧体基片410远离安装盲孔260的底部；盖板430可拆卸设置在安装盲孔260上。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。
上面结合附图对本申请实施例作了详细说明，但是本申请不限于上述实施例，在所述技术领域普通技术人员所具备的知识范围内，还可以在不脱离本申请宗旨的前提下做出各种变化。

Claims (10)

  1. 一种环行滤波组件，其特征在于，包括：
    介质滤波器；
    介质波导环行器，所述介质波导环行器设置有至少3个端部，所述介质滤波器的一端与其中一个所述端部连接，所述介质滤波器与所述端部的连接处设置有级联匹配窗口，所述级联匹配窗口用于调整所述环行滤波组件的阻抗；所述介质波导环行器与所述介质滤波器一体成型。
  2. 根据权利要求1所述的环行滤波组件，其特征在于，
    所述介质波导环行器的另外两个所述端部分别设置有第一馈电盲孔，所述介质滤波器上设置有第二馈电盲孔；两个所述第一馈电盲孔与所述第二馈电盲孔分别位于所述环行滤波组件的同一面或不同面。
  3. 根据权利要求2所述的环行滤波组件，其特征在于，
    所述介质滤波器包括两个第一谐振腔、两个第二谐振腔、第一T型通槽以及第一耦合孔，两个所述第一谐振腔、两个所述第二谐振腔分别位于所述介质滤波器的两端，且两个所述第二谐振腔位于远离所述级联匹配窗口的一端；所述第一T型通槽包括第一通槽以及第二通槽，所述第二通槽将两个所述第一谐振腔隔开；所述第一通槽将所述第一谐振腔和所述第二谐振腔隔开；所述第二通槽的一端与所述第一通槽连接；所述第一耦合孔位于两个所述第二谐振腔之间，每一所述第一谐振腔、所述第二谐振腔的同一第一表面均设置有调谐盲孔；所述环行滤波组件相对于所述第一表面设置有第二表面，所述第二馈电盲孔位于所述第二表面。
  4. 根据权利要求3所述的环行滤波组件，其特征在于，
    所述介质滤波器还包括第二T型通槽以及两个第三谐振腔；所述第二T型通槽位于所述第一T型通槽、所述第一耦合孔之间；所述第二T型通槽包括第三通槽和第四通槽；所述第三通槽与所述第一通槽平行设置；所述第四通槽与所述第二通槽平行设置；所述第四通槽位于两个所述第三谐振腔之间；所述第三通槽位于所述第三谐振腔和所述第二谐振腔之间。
  5. 根据权利要求4所述的环行滤波组件，其特征在于，
    所述第二T型通槽的第三通槽的两端设置有第二耦合孔。
  6. 根据权利要求5所述的环行滤波组件，其特征在于，
    所述第一馈电盲孔与所述第二馈电盲孔的外边缘均设置有电极金属层；且所述电极金属层与对应的所述第一馈电盲孔或所述第二馈电盲孔的金属化区域连接。
  7. 根据权利要求6所述的环行滤波组件，其特征在于，
    所述电极金属层的宽度设置在0.3mm～1mm。
  8. 根据权利要求1至7任一所述的环行滤波组件，其特征在于，
    所述介质波导环行器设置有匹配台阶以及安装盲孔，所述匹配台阶设置在介质波导环行器的表面，所述匹配台阶有设置若干与所述介质波导环行器端部对应设置的凹槽；所述凹槽绕所述安装盲孔周向设置；所述安装盲孔用于安装磁性组件。
  9. 根据权利要求8所述的环行滤波组件，其特征在于，
    相邻的两个所述凹槽相互连通。
  10. 环行滤波组件根据权利要求1至7任一所述的环行滤波组件，其特征在于，
    所述介质波导环行器与所述介质滤波器通过干压工艺或注射工艺一体成型经金属化处理得到。
PCT/CN2022/074883 2021-03-22 2022-01-29 环行滤波组件 WO2022199254A1 (zh)

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