WO2022198482A1 - 用于半导体制造的辅助工装 - Google Patents

用于半导体制造的辅助工装 Download PDF

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Publication number
WO2022198482A1
WO2022198482A1 PCT/CN2021/082620 CN2021082620W WO2022198482A1 WO 2022198482 A1 WO2022198482 A1 WO 2022198482A1 CN 2021082620 W CN2021082620 W CN 2021082620W WO 2022198482 A1 WO2022198482 A1 WO 2022198482A1
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WIPO (PCT)
Prior art keywords
clamping
guide rail
transmission member
pair
target object
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PCT/CN2021/082620
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English (en)
French (fr)
Inventor
肖颂峰
施炜
张子豪
Original Assignee
台湾积体电路制造股份有限公司
台积电(中国)有限公司
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Publication of WO2022198482A1 publication Critical patent/WO2022198482A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Definitions

  • the present application relates to the technical field of semiconductors, and in particular, to an auxiliary tool for semiconductor manufacturing.
  • lithography is a very critical process.
  • the general lithography process needs to go through the steps of cleaning and drying the surface of the silicon wafer, priming, spin-coating photoresist, soft baking, alignment exposure, post-baking, developing, hard baking, and etching.
  • various equipment is usually designed to carry the wafers. When these devices fail and need to be repaired, manual disassembly is usually time-consuming and labor-intensive, which increases the workload of maintenance personnel and reduces the work efficiency of maintenance personnel.
  • the purpose of the present application is to provide an auxiliary tool for semiconductor manufacturing, which can quickly disassemble and replace a target object in a time-saving and labor-saving manner, thereby improving work efficiency.
  • an embodiment of the present application proposes an auxiliary tool for semiconductor manufacturing, comprising: a base, including a bottom plate, a side plate connected to the bottom plate, and a top plate connected to the top of the side plate, the bottom plate and the top plate being parallel to a horizontal plane set, the side plate extends along the vertical direction; the lifting mechanism is arranged between the top plate and the bottom plate, the lifting mechanism includes a bearing member that can be lifted and lowered along the vertical direction, a first guide rail extending along the vertical direction and sliding connection with the first guide rail The first slider; the clamping mechanism is connected with the bearing member and the first slider, and the clamping mechanism includes a clamping assembly for clamping the target object, so as to drive the target object to rise or fall.
  • the lifting mechanism further includes a first transmission member and a second transmission member that are staggered in space, the first transmission member is rotatably connected to the top plate, and the second transmission member further includes an axial extension of itself.
  • the connecting shaft, the bearing member is screwed with the connecting shaft.
  • the first transmission member is a worm gear
  • the second transmission member is a worm
  • the connecting shaft is coaxially connected to the worm; or, the first transmission member and the second transmission member are a pair of bevel gears, and the connecting shafts Coaxially with one of the bevel gears.
  • the number of the first guide rail and the first sliding block is two, which are respectively disposed on both sides of the bearing member, and the first guide rail is connected to the side plate.
  • the base further includes a pair of frames, the pair of frames are disposed on both sides of the side plate and connected to the bottom plate, and the auxiliary tooling further includes a positioning pin, one end of the positioning pin is screwed with the frame, and the other end against the first slider.
  • the clamping mechanism further includes a second guide rail and a second sliding block slidably connected to the second guide rail, the clamping mechanism is connected to the bearing member through the second guide rail, and the clamping assembly is connected to the second sliding block. connect.
  • the clamping assembly includes a pair of clamping members, the second guide rail extends in a horizontal direction, the number of second sliding blocks is two, and one end of each clamping member is connected to the second sliding block .
  • the clamping mechanism further includes a pair of adjustment mechanisms, one end of each adjustment mechanism is rotatably connected to the second guide rail, and the other end is connected to the clamping member, so as to adjust the pair of clamping members to each other near or far away.
  • the outer surface of the clamping member is covered with a protective layer, and a wear-resistant layer is further provided on the side of the contact surface of the protective layer and the target object.
  • the base further includes a connecting rod, the connecting rod is located at the top of the pair of frames and is connected with the pair of frames, and the auxiliary tooling further includes an image acquisition device, and the image acquisition device is fixed on the connecting rod, and is connected with the pair of frames. to acquire and hold an image of one side of the assembly.
  • An auxiliary tooling for semiconductor manufacturing provided by an embodiment of the present application includes a base, a lifting mechanism and a clamping mechanism.
  • the lifting mechanism is connected to the base, and the lifting mechanism includes a bearing member that can be lifted and lowered in a vertical direction. a first guide rail extending in the direction and a first sliding block slidably connected with the first guide rail; the clamping mechanism is connected with the bearing member and the first sliding block, and the clamping mechanism includes a clamping assembly for clamping the target object, so as to drive the target object The object rises or falls.
  • the auxiliary tooling can quickly disassemble or replace the target object in a labor-saving manner, which is beneficial to improve work efficiency.
  • FIG. 1 shows a schematic structural diagram of a wafer carrier
  • FIG. 2 shows an application scenario diagram of an auxiliary tool for semiconductor manufacturing to disassemble a target object according to an embodiment of the present application
  • FIG. 3 shows a schematic structural diagram of an auxiliary tool for semiconductor manufacturing along an angle according to an embodiment of the present application
  • FIG. 4 shows a schematic structural diagram of an auxiliary tool for semiconductor manufacturing along another angle according to an embodiment of the present application
  • FIG. 5 shows a schematic structural diagram of the clamping assembly of the auxiliary tooling shown in FIG. 3 .
  • P1-support seat P2-support thimble; P3-carrying platform; H-through hole; W-wafer;
  • 2-lifting mechanism 21-first transmission part; 22-second transmission part; 23-connecting shaft; 24-bearing member; 25-first guide rail; 26-first sliding block;
  • 3-clamping mechanism 31-clamping assembly; 311-clamping member; 32-second guide rail; 33-second slider; 34-adjustment mechanism;
  • FIG. 1 shows a schematic structural diagram of a wafer carrier device.
  • the wafer carrier device includes a support base P1, a plurality of support pins P2 and a carrier platform P3, the carrier platform P3 has a plurality of through holes H corresponding to the plurality of support pins P2, and one end of the support pins P2 is fixed In the support seat P1, the other end supports the wafer W through the carrying platform P3.
  • the supporting thimble P2 is generally made of steel, with a sharp flat mouth and a diameter of about 5mm, while the hole diameter of the through hole H is only 6.4mm, and the gap is small.
  • the carrying platform P3 is made of brittle material super-crystalline glass (eg, yttrium trioxide), which is expensive, heavy in weight, and has high disassembly and assembly accuracy. For example, when disassembling, the inclination of the plane on which the bearing platform P3 is located cannot be greater than 0.5°, and the bearing platform P3 cannot be offset by 0.7 mm in the horizontal direction, otherwise the bearing platform P3 is easily damaged.
  • yttrium trioxide brittle material super-crystalline glass
  • embodiments of the present application provide an auxiliary tool for semiconductor manufacturing, which can quickly disassemble and replace a target object such as a carrier platform in a labor-saving manner, thereby improving work efficiency.
  • FIG. 2 shows an application scenario diagram of an auxiliary tool for semiconductor manufacturing to disassemble a target object according to an embodiment of the present application.
  • an embodiment of the present application provides an auxiliary tool for semiconductor manufacturing, including a base 1 , a lifting mechanism 2 and a clamping mechanism 3 .
  • the base 1 includes a bottom plate 11 , a side plate 12 connected to the bottom plate 11 , and a top plate 14 connected to the top of the side plate 12 .
  • the lifting mechanism 2 is arranged between the top plate 14 and the bottom plate 11 , and the lifting mechanism 2 includes a bearing member 24 that can be lifted and lowered in the vertical direction, a first guide rail 25 extending in the vertical direction, and a first slider slidably connected with the first guide rail 25 .
  • the clamping mechanism 3 is connected with the bearing member 24 and the first sliding block 26 , and the clamping mechanism 3 includes a clamping assembly 31 for clamping the target object O, so as to drive the target object O to ascend or descend.
  • the clamping mechanism 3 is connected with the bearing member 24 and the first sliding block 26 , wherein the bearing member 24 can be raised and lowered along the vertical direction, the first guide rail 25 extends along the vertical direction, and the first sliding block 26 is slidably connected with the first guide rail 25 , so that the first sliding block 26 is slidable in the vertical direction.
  • the bearing member 24 is the main driving member, and the first sliding block 26 is an auxiliary member. Especially when the size of the clamping mechanism 3 is large, the first sliding block 26 can assist the bearing member 24 to improve the stability of the lifting process and prevent the clamping mechanism 3 And the target object O shakes and deflects.
  • the number of the first guide rails 25 and the first sliding blocks 26 is two, which are respectively disposed on both sides of the bearing member 24 .
  • the clamping mechanism 3 can be connected with the bearing member 24 and the two first sliding blocks 26 respectively, the bearing member 24 provides the power to drive the clamping mechanism 3 and the target object O to rise or fall, and the two first sliding blocks 26 drive the clamping mechanism 3 and the target object O to rise or fall.
  • the holding mechanism 3 moves along the first guide rail 25 to prevent deviation during the movement and further improve the stability and reliability of the lifting process.
  • the base 1 includes a bottom plate 11, a side plate 12 connected to the bottom plate 11, and a top plate 14 connected to the top of the side plate 12.
  • the bottom plate 11 and the top plate 14 are arranged parallel to the horizontal plane, and the side plate 12 extends in the vertical direction.
  • the lifting mechanism 2 is arranged between the top plate 14 and the bottom plate 11 , and the lifting mechanism 2 includes a bearing member 24 that can be lifted and lowered in the vertical direction, a first guide rail 25 extending in the vertical direction, and a first slider slidably connected with the first guide rail 25 .
  • Block 26 There are two first guide rails 25 and two first sliding blocks 26 , which are respectively disposed on both sides of the bearing member 24 .
  • the target object O is placed on the bottom plate 11 , the clamping component 31 of the clamping mechanism 3 can clamp the target object O, and the clamping mechanism 3 is connected to the bearing member 24 of the lifting mechanism 2 and the first slider 26 .
  • the lifting mechanism 2 drives the bearing member 24 to move back and forth in the vertical direction, the target object O can be driven to ascend or descend along the first guide rail 25 .
  • the wafer carrier device can be placed on the bottom plate 11 of the base 1 of the auxiliary tooling.
  • the wafer carrier device includes three support pins P2, and the carrier platform P3 has three through holes corresponding to the three support pins P2. Operate the lifting mechanism 2 to lower the bearing member 24 to the bearing platform P3, then operate the clamping assembly 31 of the clamping mechanism 3 to make it approach and clamp the bearing platform P3, and then operate the lifting mechanism 2 to make the bearing member 24 and the first
  • the slider 26 drives the clamping mechanism 3 to rise, so that the carrying platform P3 can be detached from the wafer carrying device with less effort. After the support pin P2 is replaced, the lifting mechanism 2 is operated, so that the bearing member 24 and the first sliding block 26 drive the clamping mechanism 3 to descend, so as to assemble the bearing platform P3 to the original position.
  • auxiliary tooling disassembly and mounting platform P3 for semiconductor manufacturing provided by the embodiment of the present application to replace the support thimble P2 requires only two senior engineers of more than two years to operate, and one engineer is responsible for the clamping action of the auxiliary tooling , Another engineer is responsible for the lifting action of auxiliary tooling. It takes only 1 hour to complete the replacement operation, which can save 660,000 RMB per year.
  • the auxiliary tooling can replace the manual handling of the carrying platform P3, which reduces the interference of unstable factors such as human fatigue, reduces the probability of friction or collision between the carrying platform P3 and the supporting thimble P2, reduces maintenance costs, and improves replacement efficiency.
  • An auxiliary tooling for semiconductor manufacturing includes a base 1, a lifting mechanism 2 and a clamping mechanism 3.
  • the lifting mechanism 2 is connected to the base 1, and the lifting mechanism 2 includes a lifting mechanism that can be lifted and lowered in a vertical direction.
  • the bearing member 24, the first guide rail 25 extending in the vertical direction, and the first sliding block 26 slidably connected with the first guide rail 25;
  • the clamping mechanism 3 is connected with the bearing member 24 and the first sliding block 26, and the clamping mechanism 3 includes The clamping assembly 31 for clamping the target object O, so as to drive the target object O to rise or fall.
  • the auxiliary tooling can quickly disassemble or replace the target object O in a time-saving and labor-saving manner, thereby improving work efficiency.
  • FIG. 2 shows a schematic structural diagram of an auxiliary tooling according to an embodiment of the present application along an angle
  • FIG. 3 shows a structural schematic diagram of an auxiliary tooling according to an embodiment of the present application along another angle.
  • the lifting mechanism 2 further includes a first transmission member 21 and a second transmission member 22 that are staggered in space.
  • the first transmission member 21 is rotatably connected to the top plate 14
  • the second transmission member 22 also Including a connecting shaft 23 extending along its own axial direction, the bearing member 24 is screwed with the connecting shaft 23 .
  • the first transmission member 21 and the second transmission member 22 are “staggered in space”, that is, the axial direction of the first transmission member 21 and the axial direction of the second transmission member 22 are arranged in a spatially staggered manner.
  • the axis intersection angle between the first transmission member 21 and the second transmission member 22 is 90°, so as to meet the space arrangement requirements and transmit motion and power therebetween. Since the bearing member 24 is screwed with the connecting shaft 23 to convert the rotational motion into a linear motion that can be lifted and lowered in the vertical direction, the axial directions of the second transmission member 22 and the connecting shaft 23 extend in the vertical direction.
  • the first transmission member 21 is a worm gear
  • the second transmission member 22 is a worm
  • the connecting shaft 23 is coaxially connected to the worm.
  • the worm wheel is located on the top plate 14, and its axial direction extends in the horizontal direction, and the axial direction of the worm shaft extends in the vertical direction.
  • One end of the worm is engaged with the worm wheel, and the other end is coaxially disposed with the connecting shaft 23, and one end of the connecting shaft 23 away from the worm is rotatably connected to the bottom plate 11 through a bearing.
  • the worm wheel can be driven to rotate by a motor, or it can be driven to rotate manually to drive the worm to rotate. Since the connecting shaft 23 coaxially connected with the worm is connected with the bearing member 24 in a thread, when the worm rotates around the vertical axis, the bearing member 24 can be driven to ascend or descend in the vertical direction.
  • the worm gear and worm drive can self-lock, thereby preventing the target object from reversing in the process of lifting the target object O, causing the target object O to be bruised and improving the lifting process. stability and reliability.
  • the first transmission member 21 and the second transmission member 22 are a pair of bevel gears, and the connecting shaft 23 is coaxially connected to one of the bevel gears.
  • the first transmission member 21 is a driving bevel gear, located on the top plate 14, and its axial direction extends in a horizontal direction
  • the second transmission member 22 is a driven bevel gear, and its axial direction extends in a vertical direction.
  • One end of the second transmission member 22 is engaged with the first transmission member 21 , and the other end is coaxially disposed with the connecting shaft 23 .
  • the first transmission member 21 can be driven to rotate by a motor, or manually driven to rotate, so as to drive the second transmission member 22 to rotate. Since the connecting shaft 23 coaxially connected with the second transmission member 22 is threadedly connected with the bearing member 24, when the second transmission member 22 rotates around the vertical axis, the bearing member 24 can be driven to ascend or descend in the vertical direction.
  • the base 1 further includes a pair of frames 13 , and the pair of frames 13 are disposed on both sides of the side plate 12 and connected to the bottom plate 11 .
  • the auxiliary tool provided in the embodiment of the present application further includes a positioning pin 4 , one end of the positioning pin 4 is threadedly connected with the frame 13 , and the other end abuts against the first sliding block 26 .
  • the positioning pin 4 can prevent the target object O from swinging and tilting due to the offset of the center of gravity, further improving the stability and reliability of the auxiliary tooling.
  • the first transmission member 21 and the second transmission member 22 are worm gear transmissions and have a self-locking function.
  • the bearing member 24 drives the clamping mechanism 3 and the target object O to rise to a predetermined position along the connecting shaft 23 , the worm gear stops rotating, and the clamping mechanism 3 and the target object O stop moving. Since the two first guide rails 25 and the first slider 26 may shake or tilt the clamping mechanism 3 due to various reasons such as installation errors and manufacturing errors, the pair of frames 13 of the base 1 corresponds to the predetermined position.
  • Positioning pins 4 are respectively provided, one end of the positioning pins 4 is threadedly connected with the frame 13, and the other end is abutted against the first sliding block 26, which can fix the first sliding block 26 to a predetermined position, further improving the process of disassembling the target object O. reliability.
  • the positioning pin 4 can be used as an anti-reverse device to be disposed at the predetermined position of the side plate 12 and the pair of frames 13 , and one end of one positioning pin 4 is connected with The side plate 12 is screwed, and the other end abuts against the bearing member 24 .
  • One ends of the other two positioning pins 4 are respectively screwed with the frame 13 , and the other ends are respectively abutted against the first sliding block 26 .
  • the clamping mechanism 3 further includes a second guide rail 32 and a second sliding block 33 slidably connected to the second guide rail 32 , the clamping mechanism 3 is connected to the bearing member 24 through the second guide rail 32 , and the clamping assembly 31 is connected to the second guide rail 32 .
  • Slider 33 is connected.
  • the extension direction and the number of the second guide rails 32 are related to the shape of the target object O to be clamped.
  • the target object O is spherical.
  • the second guide rails 32 may include a section of guide rails extending in the vertical direction and two sections extending in the horizontal direction.
  • the guide rail, the four second sliders 33 drive the clamping assembly 31 to clamp the target object O.
  • the second guide rail 32 may include a section of guide rail extending in the horizontal direction, and the two second sliding blocks 33 drive the clamping assembly 31 to clamp the target object O.
  • FIG. 5 shows a schematic structural diagram of the clamping assembly of the auxiliary tooling shown in FIG. 3 .
  • the clamping assembly 31 includes a pair of clamping members 311 , the second guide rail 32 extends in the horizontal direction, the number of the second sliding blocks 33 is two, and one end of each clamping member 311 is connected to the second sliding block 33 .
  • Block 33 is connected.
  • the shape of the clamping member 311 is related to the shape of the target object O to be clamped.
  • the carrying platform P3 is a rectangular block
  • the clamping member 311 is a bar-shaped right-angle frame in contact with the edge of the carrying platform P3.
  • the clamping assembly 31 may be various components capable of clamping various target objects O, which is not limited here.
  • the clamping mechanism 3 further includes a pair of adjustment mechanisms 34, one end of each adjustment mechanism 34 is rotatably connected with the second guide rail 32, and the other end is connected with the clamping member 311 to adjust The pair of clamping members 311 are close to or away from each other.
  • the adjusting mechanism 34 is a ball screw, which is a transmission mechanism with balls as intermediate transmission elements disposed between the screw and the nut, which can realize mutual conversion between linear motion and rotational motion.
  • the nut is sleeved on the outer peripheral side of the lead screw, and the nut is connected with the clamping member 311 .
  • the lead screw rotates
  • the ball rotates in the raceway and rotates cyclically along the raceway, and forces the nut to move axially, thereby driving the clamping member 311 to move linearly.
  • the transmission accuracy of the ball screw is high, for example, the transmission error of a 300mm long screw is less than 0.1mm.
  • the auxiliary tooling provided in the embodiment of the present application further includes a support seat, a bearing and a thrust ring (not shown in the figure), wherein the support seat is fixedly connected with the second guide rail 32, and after one end of the lead screw is inserted into the bearing, it is stopped with a stopper. The push ring is fixed, and then the bearing is inserted into the support seat, so that one end of the lead screw is rotatably connected with the second guide rail 32 .
  • the end of the lead screw inserted into the bearing is also provided with an operating handle, and by rotating the operating handle to adjust the displacement of the clamping member 311, the rotational movement of the lead screw can be converted into a linear movement of the clamping member 311 along the second guide rail 32, Thus, by rotating the operating handle forward or reverse, the pair of clamping members 311 can be pushed toward or away from each other.
  • the lead screw can be driven by a motor, and the displacement of the clamping members 311 can be adjusted by controlling the number of rotations or steps of the motor, so that a pair of clamping members 311 can be automatically pushed toward or away from each other.
  • the clamping member 311 In order to carry the target object O, the clamping member 311 needs to have a certain structural strength.
  • the clamping member 311 is a structural member made of stainless steel.
  • the outer surface of the clamping member 311 is covered with a protective layer.
  • the protective layer is polytetrafluoroethylene (polytetrafluoroethylene, PTFE).
  • PTFE polytetrafluoroethylene
  • PTFE has excellent wear resistance under high load, and has a low friction coefficient, which can prevent the clamping member 311 from scratching the surface of the target object O.
  • a wear-resistant layer is also provided on one side of the contact surface of the protective layer and the target object O.
  • the material of the wear-resistant layer can be polyurethane rubber, which is made of polyester (or polyether) and diisocyanate compound polymerized, and has the advantages of high hardness, good strength, high elasticity, high wear resistance, etc.
  • the clamping member 311 has the characteristics of small deformation and large friction coefficient, and can clamp the heavier target object O without slipping, thereby further improving the reliability of the auxiliary tooling.
  • the finite element analysis may also be performed on the clamping member 311 to theoretically simulate and calculate the mechanical properties of the clamping member 311 . Then, it is verified by the actual product to improve the safety factor of the clamping member 311 .
  • the base 1 further includes a connecting rod 15 , and the connecting rod 15 is located at the top of the pair of frames 13 and connected with the pair of frames 13 .
  • the auxiliary tooling also includes an image acquisition device 5 , and the image acquisition device 5 is fixed on the connecting rod 15 for acquiring an image on one side of the clamping assembly 31 .
  • the image acquisition device 5 can be linked with the industrial computer to monitor the process of disassembling and assembling the target object O in real time, and perform intelligent risk prediction. For example, in the process of using the auxiliary tooling to disassemble and assemble the carrying platform P3, the operator monitors the relative positional relationship between the through hole of the carrying platform P3 and the supporting thimble P2 in real time. When it is monitored that the gap between the two is too small, an alarm sound is sent to remind the operator to take relevant measures, such as reducing the lifting speed of the lifting mechanism 2 or adjusting the position of the wafer carrier.
  • auxiliary tooling for semiconductor manufacturing provided by the embodiment of the present application has the characteristics of strong reproducibility, and can be applied to the disassembly and assembly of various parts, and is not limited to the carrying of the wafer carrier described in the embodiment of the present application. platform.

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Abstract

本申请涉及一种用于半导体制造的辅助工装，包括：基座，包括底板、与底板连接的侧板，以及与侧板的顶部连接的顶板，底板和顶板平行于水平面设置，侧板沿竖直方向延伸；升降机构，设置于顶板与底板之间，升降机构包括沿竖直方向可升降的承载构件；夹持机构，与承载构件连接，夹持机构包括用于夹持目标物体的夹持组件，以带动目标物体上升或者下降。该辅助工装能够以省时省力的方式快速拆卸或者更换目标物体，提高了工作效率。

Description

用于半导体制造的辅助工装
相关申请的交叉引用
本申请要求享有于2021年03月22日提交的名称为“用于半导体制造的辅助工装”的中国专利申请202120576274.0的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及半导体技术领域，具体涉及一种用于半导体制造的辅助工装。
背景技术
在半导体器件生产制造领域，光刻是非常关键的工艺。一般的光刻工艺要经历硅片表面清洗烘干、涂底、旋涂光刻胶、软烘、对准曝光、后烘、显影、硬烘、刻蚀等工序。为了完成这些工序，通常会设计各种设备来承载晶圆。当这些设备发生故障需要维修时，如果手动拆卸通常会比较费时费力，增加维修人员的工作量，降低了维修人员的工作效率。
发明内容
本申请的目的是提供一种用于半导体制造的辅助工装，该辅助工装以省时省力的方式快速拆卸与更换目标物体，提高工作效率。
为此，本申请实施例提出了一种用于半导体制造的辅助工装，包括：基座，包括底板、与底板连接的侧板，以及与侧板的顶部连接的顶板，底板和顶板平行于水平面设置，侧板沿竖直方向延伸；升降机构，设置于顶板与底板之间，升降机构包括沿竖直方向可升降的承载构件、沿竖直方向延伸的第一导轨和与第一导轨滑动连接的第一滑块；夹持机构，与承载构件和第一滑块连接，夹持机构包括用于夹持目标物体的夹持组件，以带动 目标物体上升或者下降。
根据本申请实施例的一个方面，升降机构还包括在空间上交错传动的第一传动件和第二传动件，第一传动件与顶板可转动连接，第二传动件还包括沿自身轴向延伸的连接轴，承载构件与连接轴螺纹连接。
根据本申请实施例的一个方面，第一传动件为蜗轮，第二传动件为蜗杆，连接轴与蜗杆同轴连接；或者，第一传动件和第二传动件为一对锥齿轮，连接轴与其中一个锥齿轮同轴连接。
根据本申请实施例的一个方面，第一导轨和第一滑块的数量为两个，分别设置于承载构件的两侧，第一导轨与侧板连接。
根据本申请实施例的一个方面，基座还包括一对框架，一对框架设置于侧板的两侧并与底板连接，辅助工装还包括定位销，定位销的一端与框架螺纹连接，另一端抵靠至第一滑块。
根据本申请实施例的一个方面，夹持机构还包括第二导轨和与第二导轨滑动连接的第二滑块，夹持机构通过第二导轨与承载构件连接，夹持组件与第二滑块连接。
根据本申请实施例的一个方面，夹持组件包括一对夹持构件，第二导轨沿水平方向延伸，第二滑块的数量为两个，每个夹持构件的一端与第二滑块连接。
根据本申请实施例的一个方面，夹持机构还包括一对调节机构，每个调节机构的一端与第二导轨可转动连接，另一端与夹持构件连接，以调节一对夹持构件彼此相互靠近或者远离。
根据本申请实施例的一个方面，夹持构件的外表面包覆有防护层，防护层与目标物体的接触面一侧还设置有耐磨层。
根据本申请实施例的一个方面，基座还包括连接杆，连接杆位于一对框架的顶部，并与一对框架连接，辅助工装还包括图像获取装置，图像获取装置固定于连接杆上，用于获取并夹持组件一侧的图像。
本申请实施例提供的一种用于半导体制造的辅助工装，包括基座、升降机构和夹持机构，升降机构与基座连接，升降机构包括沿竖直方向可升降的承载构件、沿竖直方向延伸的第一导轨和与第一导轨滑动连接的第一 滑块；夹持机构与承载构件和第一滑块连接，夹持机构包括用于夹持目标物体的夹持组件，以带动目标物体上升或者下降。该辅助工装能够以省力的方式快速拆卸或者更换目标物体，有利于提高工作效率。
附图说明
从下面结合附图对本申请的具体实施方式的描述中可以更好地理解本申请，其中，通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，相同或相似的附图标记表示相同或相似的特征。
图1示出一种晶圆承载装置的结构示意图；
图2示出根据本申请实施例的用于半导体制造的辅助工装拆卸目标物体的应用场景图；
图3示出根据本申请实施例的用于半导体制造的辅助工装沿一种角度的结构示意图；
图4示出根据本申请实施例的用于半导体制造的辅助工装沿另一种角度的结构示意图；
图5示出图3所示的辅助工装的夹持组件的结构示意图。
附图标记说明：
P1-支撑座；P2-支撑顶针；P3-承载平台；H-通孔；W-晶圆；
1-基座；11-底板；12-侧板；13-框架；14-顶板；15-连接杆；O-目标物体；
2-升降机构；21-第一传动件；22-第二传动件；23-连接轴；24-承载构件；25-第一导轨；26-第一滑块；
3-夹持机构；31-夹持组件；311-夹持构件；32-第二导轨；33-第二滑块；34-调节机构；
4-定位销；5-图像获取装置。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例。下面的详 细描述中公开了许多具体细节，以便全面理解本申请。但是，对于本领域技术人员来说，很明显的是，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请的更好的理解。本申请决不限于下面所提出的任何具体配置和算法，而是在不脱离本申请的精神的前提下覆盖了元素、部件和算法的任何修改、替换和改进。在附图和下面的描述中，没有示出公知的结构和技术，以便避免对本申请造成不必要的模糊。
光刻是半导体器件生产制造中的重要工艺，光刻工艺所用的设备称为曝光机。曝光机通常包括曝光光路系统和晶圆承载装置。图1示出一种晶圆承载装置的结构示意图。如图1所示，晶圆承载装置包括支撑座P1、多个支撑顶针P2和承载平台P3，承载平台P3具有与多个支撑顶针P2对应设置的多个通孔H，支撑顶针P2的一端固定于支撑座P1，另一端穿过承载平台P3支撑晶圆W。支撑顶针P2材质一般为钢，平口锋利，直径为5mm左右，而通孔H的孔径仅有6.4mm，间隙较小。
由于支撑顶针P2在使用过程中极易损坏，经常需要手动将承载平台P3拆下来更换支撑顶针P2。而承载平台P3采用脆性材料超晶玻璃(例如三氧化二钇)制作，价格昂贵、重量较重，拆装精度高。例如，拆卸时承载平台P3所在平面的倾斜度不能大于0.5°，承载平台P3在水平方向上不能偏移0.7mm，否则极易损坏承载平台P3。
鉴于此，本申请实施例提供了一种用于半导体制造的辅助工装，该辅助工装能够以省力的方式快速拆卸与更换如承载平台的目标物体，提高工作效率。
图2示出根据本申请实施例的用于半导体制造的辅助工装拆卸目标物体的应用场景图。
参阅图2，本申请实施例提供了一种用于半导体制造的辅助工装，包括基座1、升降机构2和夹持机构3。
基座1包括底板11、与底板11连接的侧板12，以及与侧板12的顶部连接的顶板14，底板11和顶板14平行于水平面设置，侧板12沿竖直方向延伸。
升降机构2设置于顶板14与底板11之间，升降机构2包括沿竖直方向可升降的承载构件24、沿竖直方向延伸的第一导轨25和与第一导轨25滑动连接的第一滑块26。夹持机构3与承载构件24和第一滑块26连接，夹持机构3包括用于夹持目标物体O的夹持组件31，以带动目标物体O上升或者下降。
夹持机构3与承载构件24和第一滑块26连接，其中，承载构件24沿竖直方向可升降，第一导轨25沿竖直方向延伸，第一滑块26与第一导轨25滑动连接，使得第一滑块26沿竖直方向可滑动。承载构件24为主要驱动件，第一滑块26为辅助件，尤其当夹持机构3尺寸较大时，第一滑块26可以辅助承载构件24提高升降过程的稳定性，防止夹持机构3及目标物体O发生晃动而偏转。
可选地，第一导轨25及第一滑块26的数量为两个，分别设置于承载构件24的两侧。这样，夹持机构3可以与承载构件24和两个第一滑块26分别连接，承载构件24提供带动夹持机构3及目标物体O上升或者下降的动力，两个第一滑块26带动夹持机构3沿第一导轨25运动，防止运动过程中发生偏移，进一步提高升降过程的稳定性和可靠性。
下面以辅助工装拆卸晶圆承载装置的承载平台P3为例进行说明。
如图2所示，基座1包括底板11、与底板11连接的侧板12和与侧板12顶部连接的顶板14，底板11和顶板14平行于水平面设置，侧板12沿竖直方向延伸。升降机构2设置于顶板14与底板11之间，升降机构2包括沿竖直方向可升降的承载构件24、沿竖直方向延伸的第一导轨25和与第一导轨25滑动连接的第一滑块26。第一导轨25及第一滑块26的数量为两个，分别设置于承载构件24的两侧。目标物体O放置于底板11上，夹持机构3的夹持组件31可以夹持目标物体O，同时夹持机构3与升降机构2的承载构件24和第一滑块26连接。当升降机构2驱动承载构件24在竖直方向上来回运动时，可以带动目标物体O沿第一导轨25上升或者下降。
当目标物体O为晶圆承载装置中的承载平台P3时，可以将晶圆承载装置放入辅助工装的基座1的底板11上。该晶圆承载装置包括三个支撑顶针P2，承载平台P3具有与三个支撑顶针P2对应设置的三个通孔。操作升 降机构2，使承载构件24下降至承载平台P3，再操作夹持机构3的夹持组件31，使之靠近并夹持承载平台P3，然后操作升降机构2，使承载构件24和第一滑块26带动夹持机构3上升，从而可以省力地将承载平台P3从晶圆承载装置中拆卸下来。更换完支撑顶针P2后，操作升降机构2，使承载构件24和第一滑块26带动夹持机构3下降，以将承载平台P3组装至原位。
由于传统上人工拆装承载平台P3更换支撑顶针P2，需要四名五年以上的资深工程师来操作，每次拆装需要耗时120小时，拆卸过程容易损坏或者污染承载平台P3，维修成本较高。而采用本申请实施例提供的用于半导体制造的辅助工装拆装承载平台P3以更换支撑顶针P2，仅需要两名两年以上的资深工程师来操作，其中一名工程师负责辅助工装的夹持动作，另一名工程师负责辅助工装的升降动作，耗时仅需1小时即可完成更换作业，每年可以节约成本66万RMB。辅助工装可以代替人力搬运承载平台P3，减少了人力疲劳等不稳定因素的干扰，可以降低承载平台P3与支撑顶针P2发生摩擦或者碰撞的概率，降低了维修成本，提高了更换效率。
本申请实施例提供的一种用于半导体制造的辅助工装，包括基座1、升降机构2和夹持机构3，升降机构2与基座1连接，升降机构2包括沿竖直方向可升降的承载构件24、沿竖直方向延伸的第一导轨25和与第一导轨25滑动连接的第一滑块26；夹持机构3与承载构件24和第一滑块26连接，夹持机构3包括用于夹持目标物体O的夹持组件31，以带动目标物体O上升或者下降。该辅助工装能够以省时省力的方式快速拆卸或者更换目标物体O，提高了工作效率。
下面结合附图进一步详细描述本申请实施例提供的辅助工装的具体结构。
图2示出根据本申请实施例的辅助工装沿一种角度的结构示意图，图3示出根据本申请实施例的辅助工装沿另一种角度的结构示意图。
如图3和图4所示，升降机构2还包括在空间上交错传动的第一传动件21和第二传动件22，第一传动件21与顶板14可转动连接，第二传动件22还包括沿自身轴向延伸的连接轴23，承载构件24与连接轴23螺纹连接。
本申请中，第一传动件21和第二传动件22在“空间上交错传动”，即第一传动件21的轴向和第二传动件22的轴向在空间上交错设置，例如，第一传动件21和第二传动件22的轴交角为90°，以满足空间布置需求，并传递二者之间的运动与动力。由于承载构件24与连接轴23螺纹连接，以将旋转运动转化为沿竖直方向可升降的直线运动，故第二传动件22及连接轴23的轴向沿竖直方向延伸。
在一些实施例中，第一传动件21为蜗轮，第二传动件22为蜗杆，连接轴23与蜗杆同轴连接。蜗轮位于顶板14，其轴向沿水平方向延伸，蜗杆的轴向沿竖直方向延伸。蜗杆的一端与蜗轮啮合，另一端与连接轴23同轴设置，且连接轴23远离蜗杆的一端通过轴承与底板11可转动连接。
蜗轮可以由电机驱动转动，也可以手动驱动转动，以带动蜗杆转动。由于与蜗杆同轴连接的连接轴23与承载构件24螺纹连接，当蜗杆绕竖直轴转动时，可以带动承载构件24沿竖直方向上升或者下降。
另外，当蜗杆的展开螺旋角小于蜗轮蜗杆的接触摩擦角时，蜗轮蜗杆传动可以发生自锁，从而防止在举升目标物体O的过程中反转，导致目标物体O被碰伤，提高升降过程的稳定性和可靠性。
在一些实施例中，第一传动件21和第二传动件22为一对锥齿轮，连接轴23与其中一个锥齿轮同轴连接。例如，第一传动件21为主动锥齿轮，位于顶板14，其轴向沿水平方向延伸，第二传动件22为被动锥齿轮，其轴向沿竖直方向延伸。第二传动件22的一端与第一传动件21啮合，另一端与连接轴23同轴设置，且连接轴23远离第二传动件22的一端通过轴承与底板11可转动连接。
第一传动件21可以由电机驱动转动，也可以手动驱动转动，以带动第二传动件22转动。由于与第二传动件22同轴连接的连接轴23与承载构件24螺纹连接，当第二传动件22绕竖直轴转动时，可以带动承载构件24沿竖直方向上升或者下降。
由于锥齿轮传动不具备自锁功能，通常需要另外配备防反转装置。
另外，基座1还包括一对框架13，一对框架13设置于侧板12的两侧并与底板11连接。可选地，本申请实施例提供的辅助工装还包括定位销4， 定位销4的一端与框架13螺纹连接，另一端抵靠至第一滑块26。当夹持机构3带动目标物体O上升到预定位置时，定位销4可以防止目标物体O因重心偏移发生摆动倾斜，进一步提高辅助工装的稳定性和可靠性。
如图3和图4所示，第一传动件21和第二传动件22为蜗轮蜗杆传动，具有自锁功能。承载构件24带动夹持机构3及目标物体O沿连接轴23上升到预定位置时，蜗轮停止转动，夹持机构3及目标物体O停止移动。由于两个第一导轨25及第一滑块26因安装误差、制造误差等各种原因可能会使夹持机构3发生晃动或者倾斜，在基座1的一对框架13上对应于该预定位置分别设置有定位销4，定位销4的一端与框架13螺纹连接，另一端抵靠至第一滑块26，可以将第一滑块26固定至预定位置，进一步提高拆卸目标物体O过程中的可靠性。
当第一传动件21和第二传动件22为锥齿轮传动时，定位销4可以作为防反转装置设置于侧板12和一对框架13的预定位置处，其中一个定位销4的一端与侧板12螺纹连接，另一端抵靠至承载构件24。另外两个定位销4的一端分别与框架13螺纹连接，另一端分别抵靠至第一滑块26。
进一步地，夹持机构3还包括第二导轨32和与第二导轨32滑动连接的第二滑块33，夹持机构3通过第二导轨32与承载构件24连接，夹持组件31与第二滑块33连接。第二导轨32的延伸方向及数量与被夹持的目标物体O的形状有关，例如目标物体O为球形，第二导轨32可以包括沿竖直方向延伸的一段导轨和沿水平方向延伸的两段导轨，四个第二滑块33带动夹持组件31夹持目标物体O。或者，第二导轨32可以包括沿水平方向延伸的一段导轨，两个第二滑块33带动夹持组件31夹持目标物体O。
图5示出图3所示的辅助工装的夹持组件的结构示意图。
在一些实施例中，夹持组件31包括一对夹持构件311，第二导轨32沿水平方向延伸，第二滑块33的数量为两个，每个夹持构件311的一端与第二滑块33连接。夹持构件311的形状与被夹持的目标物体O的形状有关，例如，承载平台P3为矩形块，夹持构件311为与承载平台P3的边缘接触的条形直角架。为了提高辅助工装的通用性，夹持组件31可以为能够夹持多种目标物体O的多种构件，此处不作限制。
为了实现夹持组件31的夹持功能，夹持机构3还包括一对调节机构34，每个调节机构34的一端与第二导轨32可转动连接，另一端与夹持构件311连接，以调节一对夹持构件311彼此相互靠近或者远离。
可选地，调节机构34为滚珠丝杠，滚珠丝杠是一种在丝杠与螺母之间设置有滚珠作为中间传动元件的传动机构，可以实现直线运动与旋转运动的相互转化。螺母套设于丝杠的外周侧，且螺母与夹持构件311连接。当丝杠旋转时，滚珠在滚道内既自转又沿滚道循环转动，并迫使螺母轴向移动，从而带动夹持构件311作直线运动。滚珠丝杠的传动精度较高，例如，300mm长的丝杠，传动误差小于0.1mm。
另外，本申请实施例提供的辅助工装还包括支撑座、轴承和止推环(图中未示出)，其中，支撑座与第二导轨32固定连接，丝杠的一端插入轴承后，用止推环固定，然后将轴承插入支撑座内，以使丝杠的一端与第二导轨32可转动连接。可选地，丝杠插入轴承的一端还设置有操作手柄，转动操作手柄以调整夹持构件311的位移，可以将丝杠的旋转运动转化为夹持构件311沿第二导轨32的直线运动，从而通过正向或者反向转动操作手柄，可以推动一对夹持构件311彼此相互靠近或者远离。可选地，丝杠可以由电机驱动，通过控制电机的转动圈数或者步数调整夹持构件311的位移，从而可以自动推动一对夹持构件311彼此相互靠近或者远离。
为了承载目标物体O，夹持构件311需要具有一定的结构强度。可选地，夹持构件311为不锈钢制成的结构件。另外，为了防止夹持构件311在夹持过程中损伤目标物体O，夹持构件311的外表面包覆有防护层。可选地，该防护层为聚四氟乙烯(Polytetrafluoroethylene，PTFE)，PTFE在高负载下具有优良的耐磨性能，摩擦系数低，可以防止夹持构件311划伤目标物体O的表面。
进一步可选地，防护层与目标物体O的接触面一侧还设置有耐磨层。该耐磨层的材质可以为聚氨酯橡胶，聚氨酯橡胶由聚酯(或聚醚)与二异氰酸脂类化合物聚合而成，具有硬度高、强度好、高弹性、高耐磨性等优点，使得夹持构件311具有形变量小、摩擦系数大的特点，可以夹持较重的目标物体O而不会打滑，进一步提高辅助工装的可靠性。
另外，在实际制作夹持构件311之前，还可以对夹持构件311进行有限元分析，从理论上进行模拟演算夹持构件311的力学性能。然后再通过实际产品进行验证，提高夹持构件311的安全系数。
在一些实施例中，基座1还包括连接杆15，连接杆15位于一对框架13的顶部，并与一对框架13连接。该辅助工装还包括图像获取装置5，图像获取装置5固定于连接杆15上，用于获取夹持组件31一侧的图像。图像获取装置5可以与工控机联动，实时监控拆装目标物体O的过程，并进行风险智能预测。例如，在使用辅助工装拆装承载平台P3的过程中，操作人员实时监控承载平台P3的通孔与支撑顶针P2之间的相对位置关系。当监控到二者之间的间隙过小时，发送报警声提醒操作人员采取相关措施，例如降低升降机构2的升降速度，或者调整晶圆承载装置的位置等。
另外，本申请实施例提供的用于半导体制造的辅助工装具有可复制性强的特点，可以适用于各种零部件的拆装，而不限于本申请实施例所述的晶圆承载装置的承载平台。
本领域技术人员应能理解，上述实施例均是示例性而非限制性的。在不同实施例中出现的不同技术特征可以进行组合，以取得有益效果。本领域技术人员在研究附图、说明书及权利要求书的基础上，应能理解并实现所揭示的实施例的其他变化的实施例。在权利要求书中，术语“包括”并不排除其他装置或步骤；物品没有使用数量词修饰时旨在包括一个/种或多个/种物品，并可以与“一个/种或多个/种物品”互换使用”；术语“第一”、“第二”用于标示名称而非用于表示任何特定的顺序。权利要求中的任何附图标记均不应被理解为对保护范围的限制。权利要求中出现的多个部分的功能可以由一个单独的硬件或软件模块来实现。某些技术特征出现在不同的从属权利要求中并不意味着不能将这些技术特征进行组合以取得有益效果。

Claims (10)

  1. 一种用于半导体制造的辅助工装，包括：
    基座，包括底板、与所述底板连接的侧板，以及与所述侧板的顶部连接的顶板，所述底板和所述顶板平行于水平面设置，所述侧板沿竖直方向延伸；
    升降机构，设置于所述顶板与所述底板之间，所述升降机构包括沿竖直方向可升降的承载构件、沿竖直方向延伸的第一导轨和与所述第一导轨滑动连接的第一滑块；
    夹持机构，与所述承载构件和所述第一滑块连接，所述夹持机构包括用于夹持目标物体的夹持组件，以带动所述目标物体上升或者下降。
  2. 根据权利要求1所述的辅助工装，其中，所述升降机构还包括在空间上交错传动的第一传动件和第二传动件，所述第一传动件与所述顶板可转动连接，所述第二传动件还包括沿自身轴向延伸的连接轴，所述承载构件与所述连接轴螺纹连接。
  3. 根据权利要求2所述的辅助工装，其中，所述第一传动件为蜗轮，所述第二传动件为蜗杆，所述连接轴与所述蜗杆同轴连接；
    或者，所述第一传动件和所述第二传动件为一对锥齿轮，所述连接轴与其中一个锥齿轮同轴连接。
  4. 根据权利要求1所述的辅助工装，其中，所述第一导轨和所述第一滑块的数量为两个，分别设置于所述承载构件的两侧，所述第一导轨与所述侧板连接。
  5. 根据权利要求1所述的辅助工装，其中，所述基座还包括一对框架，所述一对框架设置于所述侧板的两侧并与所述底板连接；
    所述辅助工装还包括定位销，所述定位销的一端与所述框架螺纹连接，另一端抵靠至所述第一滑块。
  6. 根据权利要求1所述的辅助工装，其中，所述夹持机构还包括第二导轨和与所述第二导轨滑动连接的第二滑块，所述夹持机构通过所述第二导轨与所述承载构件连接，所述夹持组件与所述第二滑块连接。
  7. 根据权利要求6所述的辅助工装，其中，所述夹持组件包括一对夹持构件，所述第二导轨沿水平方向延伸，所述第二滑块的数量为两个，每个所述夹持构件的一端与所述第二滑块连接。
  8. 根据权利要求7所述的辅助工装，其中，所述夹持机构还包括一对调节机构，每个所述调节机构的一端与所述第二导轨可转动连接，另一端与所述夹持构件连接，以调节所述一对夹持构件彼此相互靠近或者远离。
  9. 根据权利要求7所述的辅助工装，其中，所述夹持构件的外表面包覆有防护层，所述防护层与所述目标物体的接触面一侧还设置有耐磨层。
  10. 根据权利要求5所述的辅助工装，其中，所述基座还包括连接杆，所述连接杆位于所述一对框架的顶部，并与所述一对框架连接；
    所述辅助工装还包括图像获取装置，所述图像获取装置固定于所述连接杆上，用于获取所述夹持组件一侧的图像。
PCT/CN2021/082620 2021-03-22 2021-03-24 用于半导体制造的辅助工装 WO2022198482A1 (zh)

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