WO2022197306A1 - Couvercles pour dispositifs électroniques - Google Patents

Couvercles pour dispositifs électroniques Download PDF

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Publication number
WO2022197306A1
WO2022197306A1 PCT/US2021/023122 US2021023122W WO2022197306A1 WO 2022197306 A1 WO2022197306 A1 WO 2022197306A1 US 2021023122 W US2021023122 W US 2021023122W WO 2022197306 A1 WO2022197306 A1 WO 2022197306A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
layer
cover
acid
anodizing layer
Prior art date
Application number
PCT/US2021/023122
Other languages
English (en)
Inventor
Qingyong GUO
Ta-Ting YEH
Chi Hao Chang
Kuan-Ting Wu
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to US18/282,661 priority Critical patent/US20240158943A1/en
Priority to PCT/US2021/023122 priority patent/WO2022197306A1/fr
Priority to TW110145088A priority patent/TW202237900A/zh
Publication of WO2022197306A1 publication Critical patent/WO2022197306A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/12—Anodising more than once, e.g. in different baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/16—Pretreatment, e.g. desmutting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C25D11/243—Chemical after-treatment using organic dyestuffs
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • C25D11/24—Chemical after-treatment
    • C25D11/246—Chemical after-treatment for sealing layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/30—Anodisation of magnesium or alloys based thereon

Definitions

  • FIGS. 1 A-1 B are cross-sectional views illustrating example covers for electronic devices in accordance with examples of the present disclosure
  • FIGS. 2A-2B are cross-sectional views illustrating an example cover for an electronic device with a milled edge in accordance with examples of the present disclosure
  • FIG. 3 is a top down view and a partial cross-sectional view taken at 90 degrees of an example cover for an electronic device in accordance with the present disclosure
  • FIG. 4 is a cross-sectional view of an example electronic device with a cover in accordance with the present disclosure
  • FIG. 5 is a flowchart Illustrating an example method of making a cover for an electronic device in accordance with the present disclosure
  • FIGS. 6A-6H are cross-sectional views depicting an example method of making a cover for an electronic device in accordance with the present disclosure.
  • the present disclosure describes covers for electronic devices.
  • theover includes a substrate including a metal alloy.
  • the cover includes an acid anodizing layer on the substrate.
  • the cover includes a dye application on the acid anodizing layer.
  • the cover includes a first nickel-free sealing layer on the dye application.
  • the cover includes an alkaline anodizing layer on the first sealing layer.
  • the cover includes a second nickel-free sealing layer on the alkaline anodizing layer.
  • the metal alloy can be an aluminum alloy, a magnesium alloy, or hybrid where a first portion of the substrate is composed of an aluminum alloy and a second portion is composed of a magnesium alloy.
  • the cover can further include a milled edge formed along a corner of the substrate to expose a portion of the substrate after the first sealing layer is formed and before the alkaline anodizing layer is formed, wherein the alkaline anodizing layer covers the milled edge.
  • the milled edge can be a chamfered edge formed by computer numeric control, diamond cutting, or laser engraving.
  • the alkaline anodizing layer can be formed using about 3 wt% to about 10 wt% of borax and about 2 wt% to about 8 wt% of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent.
  • the first sealing layer and the second sealing layer can include aluminum fluoride, cerium fluoride, cerium acetate, chromium(lii) hydroxide, and/or aluminum acetate.
  • the dye application can include a dye selected from methylene blue, basic fuchsin, crystal violet, eosin, acid fuchsin, congo red, gentian violet, methyl violet, brilliant crystal glue, romanowsky dye, anthraquinone dyes, acridine orange, quinone-imine dyes, xanthene dyes, 2-amino-4-(azoyl)-azo-thiazoie, or a combination thereof.
  • the substrate can be degreased before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate.
  • the substrate can be neutralized before the acid anodizing layer is formed using a neutralization compound Including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.
  • an electronic device in another example, includes an electronic component.
  • the electronic device further includes a cover enclosing a portion or all of the electronic component.
  • the cover includes an acid anodizing layer on the substrate.
  • the cover includes a dye application on the acid anodizing layer.
  • the cover includes a first nickel-free sealing layer on the dye application.
  • the cover includes an alkaline anodizing layer on the first sealing layer.
  • the cover includes a second nickel-free sealing layer on the alkaline anodizing layer.
  • the electronic device can be a laptop, a desktop computer, a keyboard, a mouse, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a combination thereof, and wherein a milled edge is located at an edge of a touchpad, an edge of a fingerprint scanner, sidewall, or an edge of a logo.
  • a method of making a cover for an electronic device Includes, for example, forming an enclosure with a substrate. The method further Includes applying an acid anodizing layer on the substrate. The method further includes applying a dye application on the acid anodizing layer. The method further includes applying a first nickel-free sealing layer on the dye application. The method further includes applying an alkaline anodizing layer on the first sealing layer. The method further includes applying a second nickel-free sealing layer on the alkaline anodizing layer.
  • the method can further include milling an edge along a corner of the substrate to expose a portion of the substrate after the first sealing layer is applied and before the alkaline anodizing layer is applied, wherein the alkaline anodizing layer covers the milled edge.
  • the method can further include degreasing the substrate before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyl sulfate.
  • the method can further include neutralizing the substrate before the acid anodizing layer is formed using a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.
  • a neutralization compound including sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.
  • the present disclosure describes covers or enclosures for electronic devices that can apply an alkaline anodizing process in a secondary anodizing treatment to a cover.
  • a first acid anodizing treatment can be applied to a substrate.
  • the first acid anodizing treatment or layer can be subjected to a dyeing application.
  • a first nickel-free sealing process can then be applied to the dye application.
  • a corner of the cover can then be diamond cut or milled through the first acid anodizing layer, the dye application, and the first nickel-free sealing layer to form a chamfer and expose a portion of the substrate.
  • the secondary alkaline anodizing layer can then be applied to the exposed surface of the substrate and the remaining exposed surfaces of the first nickel-free sealing layer.
  • the secondary alkaline anodizing layer can then be covered with a second nickel-free sealing layer.
  • the secondary alkaline anodizing layer can resolve potential discoloration and dye migration issues after dyeing the first nickel-free seaiing layer and the diamond cutting on the substrate.
  • the secondary alkaline anodizing layer can be used to achieve a high glossy surface appearance and provide a stabilized color tone for the enclosure.
  • An enclosure of the present technology can be capable of passing a 96-hour salt fog test.
  • the substrate can be formed from an aluminum alloy, a magnesium alloy or a hybrid substrate that can be formed from a first portion of alkaline anodizing layer and a second portion of magnesium alloy.
  • a hybrid substrate with both a magnesium alloy portion and an aluminum alloy portion provides a solution that is lighter in weight compared to a solution that employs an aluminum alloy substrate without a magnesium alloy portion.
  • the aluminum alloy portion of the hybrid substrate also can provide more mechanical strength compared to a substrate that employs a magnesium alloy without an aluminum alloy.
  • FIG. 1A shows an example cover 100 for an electronic device.
  • the cover 100 includes a substrate composed of a metal alloy including a first portion 110.
  • the metal alloy can include an aluminum alloy, a magnesium alloy or a combination thereof.
  • the aluminum alloy can include any number or combinations of magnesium, lithium, zinc, titanium, niobium, stainless, copper, or alloys thereof.
  • the aluminum alloy includes more than about 50 wt% aluminum.
  • the aluminum alloy includes about 50 wt% to about 70 wt% of aluminum.
  • the magnesium alloy can include any number or combinations of aluminum, lithium, zinc, titanium, niobium, stainless, copper, or alloys thereof.
  • a magnesium alloy can include more than about 50 wt% magnesium.
  • a magnesium alloy includes a minimum of about 55 wt% of magnesium.
  • An acid anodizing layer 120 can be applied to a surface of the substrate.
  • one surface of the substrate can be anodized, in one example, ail exposed surfaces of the substrate can be anodized.
  • the acid anodizing layer can be performed in an acidic solution.
  • the acid solution may be composed of sulfuric acid or chromic acid, which can slowly dissolve a portion of the metal alloy
  • the substrate can be composed of an aluminum alloy and the acidic solution can dissolve aluminum oxide associated with the aluminum alloy.
  • the add anodizing layer can have a thickness of about 5 pm to about 15 pm.
  • a dye application 130 can be applied to a surface of the acid anodizing layer 120.
  • the dye application can be used to provide color to the cover or enclosure.
  • Dye materials can include methylene blue, basic fuchsin, crystal violet, eosin, acid fuchsin, congo red, gentian violet, methyl violet, brilliant crystal glue, romanowsky dye, anthraquinone dyes, acridine orange, quinone-imine dyes, xanthene dyes, and 2-amino-4-(azoyl)-azo-thiazole.
  • a first nickel-free sealing layer 140 can be applied onto the dye application 130.
  • the first nickel-free sealing layer can be composed of materials that seal the acid anodizing layer 120.
  • the first nickei-free sealing layer can be composed of material that does not include nickel.
  • a nickel-free sealing material may be selected for the environmental benefits of a sealant that is free of nickel.
  • the first nickel-free sealing layer can be composed of materials that are about 0.5 wt% to about 5.0 wt% and can include aluminum fluoride, cerium fluoride, cerium acetate, chromium(lll) hydroxide, and/or aluminum acetate.
  • the first nickel-free sealing layer can be applied or cured at a temperature of about 25 to about 100 degrees Celsius for a time period of about 15 to about 180 seconds.
  • the nickei-free sealing solution can contain about 0.3 wt% to about 2 wt% of surfactant in deionized water.
  • An alkaline anodizing layer 150 can be applied to the first nickel-free sealing layer 140.
  • the alkaline anodizing layer can be referred to as a secondary anodizing layer or process meaning secondary to the acid anodizing layer 120.
  • a solution for the alkaline anodizing layer can be formed of about 3 wt% to about 10 wt% of borax (sodium tetraborate) and about 2 wt% to about 8 wt% of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/ora complexing agent.
  • the alkaline anodizing layer can be applied at a voltage of about 100 to about 300 volts with a current of about 20 to about 40 amps with a frequency of about 30 to about 80 Hertz.
  • the solution of the alkaline anodizing layer can have a pH balance of about 9 to about 13.
  • the alkaline anodizing layer can be applied at a temperature of about 15 to about 50 degrees Celsius for a time period of about 20 to about 50 minutes.
  • a second nickel-free sealing layer 160 can be applied to the alkaline anodizing layer 150.
  • the second nickel-free sealing layer can have all of the same properties, techniques, processes, solutions, chemicals, and materials of the first nickel-free sealing layer 130.
  • a degreasing compound can have a pH control of about 9 to about 13 by sodium carbonate and NaOH.
  • the degreasing compound can include a surfactant of about 0.3 wt% to about 1.5 wt% sodium carbonate and NaOH, and the surfactant can include sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium iauryl sulphate, and/or sodium dodecyl sulfate.
  • the degreasing process can be performed at a temperature of about 25 to about 60 degrees Celsius for a time period of about 30 to about 180 seconds.
  • a neutralization compound for the neutralization process can include sulfuric acid, nitric acid, hydrophilic acid, and/or phosphate acid.
  • the neutralization process can have a pH control of about 3 to about 5.
  • the neutralization process can be performed with a bath temperature of about 25 to about 60 degrees Celsius for a time period of about 30 to about 120 seconds.
  • the enclosure may be subjected to washing or ultrasonic cleaning.
  • the washing or ultrasonic cleaning can be performed for a time period of about 30 to about 90 seconds.
  • the enclosure may be subjected to warm washing.
  • the warm washing may be performed at a temperature of about 60 to about 80 degrees Celsius for a time period of about 30 to about 60 seconds.
  • the enclosure can be subjected to a drying process.
  • the drying process can be performed at a temperature of about 70 to about 105 degrees Celsius for a time period of about 10 to about 15 minutes.
  • FIG. 1 B shows an example cover 170 for an electronic device.
  • the cover depicts a hybrid substrate including a first portion 110 and a second portion 115.
  • the first portion can be composed of an aluminum alloy and the second portion can be composed of a magnesium alloy.
  • the hybrid substrate can include about 55 wt% to about 90 wt% of the second portion 115 (the magnesium alloy) and about 10 wt% to about 45 wt% of the second portion 110 (the aluminum alloy), it is appreciated that the hybrid substrate can include more than two portions or regions including magnesium alloy and aluminum alloy.
  • corners or edges of the hybrid substrate can include aluminum alloy including openings such as openings in the cover for a track pad or a fingerprint scanner.
  • individual corners or edges of the hybrid substrate can include a portion or region of the aluminum alloy while portions between the corners and edges can include the magnesium alloy.
  • the portions of the hybrid substrate that include the aluminum alloy can provide additional strength to the resulting cover as compared to a cover including a substrate of only a magnesium alloy.
  • the hybrid substrate can be described as a light metal substrate.
  • light metals can include magnesium, aluminum, lithium, zinc, titanium, niobium, stainless, copper, or an alloy thereof.
  • the hybrid substrate can have a thickness of about 0.3 mm to about 2.0 mm.
  • the hybrid substrate can be formed by joining the first portion 110 to the second portion 115.
  • the aluminum alloy can be shaped using a process such as computer numeric control (CNC).
  • CNC computer numeric control
  • the aluminum alloy can then be welded to the magnesium alloy.
  • the magnesium alloy can be shaped using techniques such as forging orthixo-molding.
  • the magnesium alloy can be insert molded into a shaped aluminum alloy. The insert molding can be accomplished using thixo-molding. Once the second portion and the first portion are joined together, the joined first and second portion can be shaped using CNC and then polished to form the hybrid substrate.
  • the aluminum alloy portion may be sandblasted before being joined to the magnesium alloy portion using insert molding.
  • the hybrid substrate may be further shaped using a technique such as CNC.
  • the surfaces of the hybrid substrate can be polished prior to depositing the acid anodizing layer 120
  • FIG. 2A shows an example cover 200 for an electronic device with a substrate including a first portion 210.
  • the first portion can Include an aluminum alloy, a magnesium alloy, ora combination thereof.
  • the first portion is depicted as being a corner section of the substrate and the cover.
  • the depicted cross section of the first portion is depicted as an L shape.
  • the substrate can include any number of corners for edges of the cover or edges of features and components such as trackpads or fingerprint scanners.
  • the cover is depicted with an acid anodizing layer 220 over a surface of the first portion.
  • a dye application 230 is applied to the acid anodizing layer.
  • a first nickel-free sealing layer 240 is applied to the dye application.
  • the corner of the first portion can be milled along an edge of the corner to form a milled edge or chamfer.
  • the chamfer can remove a portion of the substrate, the acid anodizing layer, the dye application, and the first nickel-free sealing layer.
  • the chamfer can expose a surface of the substrate.
  • the remaining exposed portions of the substrate, the acid anodizing layer, the dye application, and the first nickel-free sealing layer can then be covered with an alkaline anodizing layer 250.
  • a second nickel-free sealing layer 260 can be applied to the alkaline anodizing layer.
  • the chamfer or milled edge can be formed using computer numeric control (CNC), diamond cutting, laser engraving, or a combination thereof.
  • FIG. 2B shows an example cover 270 for an electronic device with a hybrid substrate including a first portion 210 and a second portion 215.
  • the first portion can be composed of an aluminum alloy and the second portion can be composed of a magnesium alloy.
  • the first portion is depicted as being a corner section of the hybrid substrate and the cover.
  • the depicted cross section of the second portion is depicted as an L shape.
  • the first or second portion can also be formed into other shapes.
  • FIG. 3 shows another example cover 300 for an electronic device.
  • This example is a top cover for the keyboard portion of a laptop (sometimes referred to as a laptop cover C”).
  • the cover includes key openings 360 for the keyboard buttons (not shown) to be positioned therethrough, hinge recesses 362 to receive a hinge (not shown), a track pad opening 364 to receive a track pad (not shown), and a fingerprint scanner opening 366 to receive a fingerprint scanner (not shown).
  • the cover can be mostly made up of a substrate 310. Surfaces of the substrate can be covered with an acid anodizing layer 320.
  • the acid anodizing layer can be covered by a dye application 330.
  • the dye application can be covered by a first nickel-free sealing layer 340.
  • a milled edge can be formed that cuts through the substrate, the acid anodizing layer, the dye application, and the first nickel-free sealing layer to expose a portion of the substrate.
  • the exposed portion of the substrate and the first nickel-free sealing layer can then be covered with an alkaline anodizing layer 350.
  • the alkaline anodizing layer can be covered with a second nickel-free sealing layer 360,
  • a partial cross-sectional view is shown along plane “A” designated further by the dashed and dotted lines/arrows.
  • This cross-sectional view shows the chamfer 324 which is bordering the track pad opening 364 and forms the track pad milled edge 333.
  • the chamfer cuts through the acid anodizing layer 320, the dye application 330, and the first nickel-free sealing layer 340 as depicted.
  • the milled edge includes a sloping face that slopes downward toward the track pad opening.
  • this chamfered edge can provide a more comfortable edge around the track pad compared to a sharp 90° edge.
  • the milled edge around the fingerprint scanner can slope downward toward the fingerprint scanner in some examples.
  • cover refers to the exterior shell of an electronic device that includes or is in the form of an enclosure, and a portion thereof (or the structure thereof) includes a light metal substrate, in other words, the cover can be adapted to contain the internal electronic components of the electronic device.
  • the cover can be an integral part of the electronic device.
  • cover is not meant to refer to the type of removable protective cases that are often purchased separately for an electronic device (especially smart phones and tablets) and placed around the exterior of the electronic device.
  • Covers as described herein can be used on a variety of electronic devices, for example, a laptop, a desktop, a keyboard, a mouse, a printer, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a combination thereof.
  • the hybrid substrate for these covers can be formed by molding, casting, machining, bending, working, stamping, CNC, forging, or another process.
  • the cover can be made from multiple panels as depicted in FIG. 4.
  • laptop covers sometimes include four separate cover pieces forming the complete cover of the laptop.
  • cover A back cover of the monitor portion of the laptop
  • cover B front cover of the monitor portion
  • cover C top cover of the keyboard portion
  • cover D bottom cover of the keyboard portion
  • a layer that is referred to as being “on” a lower layer can be directly applied to the lower layer, or an intervening layer or multiple intervening layers located between the layer and the lower layer.
  • the covers described herein can include a substrate coated with an acid anodizing layer, a dye application, a first nickel-free sealing layer, an alkaline anodizing layer, and a second nickel-free sealing layer. Accordingly, a layer that is "on” a lower layer can be located further from the substrate. A “higher” layer applied “on” a “lower layer may be located farther from the substrate and closer to a viewer viewing the cover from the outside. Furthermore, a layer may include multiple layers.
  • a variety of electronic devices can be made with the covers described herein.
  • such electronic devices can include various electronic components enclosed by the cover.
  • “encloses” or “enclosed” when used with respect to the covers enclosing electronic components can include covers completely enclosing the electronic components or partially enclosing the electronic components.
  • Many electronic devices include openings for charging ports, input/output ports, headphone ports, and so on. Accordingly, in some examples the cover can include openings for these purposes.
  • Certain electronic components may be designed to be exposed through an opening in the cover, such as display screens, keyboard keys, buttons, track pads, fingerprint scanners, cameras, and so on. Accordingly, the covers described herein can include openings for these components.
  • a cover can be made up of two or more cover sections, and the cover sections can be assembled together with the electronic components to enclose the electronic components.
  • cover can refer to an individual cover section or panel, or collectively to the cover sections or panels that can be assembled together with electronic components to make the complete electronic device.
  • FIG. 4 shows a cross-sectional schematic view of an example electronic device 400 in accordance with examples of the present disclosure.
  • This example includes a top cover 402 and a bottom cover 404 enclosing an electronic component 412.
  • the top cover includes a substrate 410 and the bottom cover includes a substrate 414.
  • the substrates 410 and 414 can be composed of an aluminum alloy, a magnesium alloy, a combination thereof, or a hybrid substrate.
  • the substrate 410 is depicted as having corner or L shaped pieces.
  • the substrates of the top and bottom covers are covered with an acid anodizing layer 420.
  • the acid anodizing layer is covered with a dye application 430.
  • the dye application is covered with a first nickel-free sealing layer 440.
  • the corners of the substrate 410 are milled along two edges to form chamfer 470 and chamfer 480 to expose two surfaces of the substrate 410.
  • the chamfers also cut through portions of the acid anodizing layer, the dye application, and the first nickel-free sealing layer.
  • the exposed surfaces of the substrate and the first nickel-free sealing layer are then covered with an alkaline anodizing layer 450.
  • the alkaline anodizing layer is then covered with a second nickel-free sealing layer 460.
  • the electronic device can be a laptop, a desktop, a keyboard, a mouse, a printer, a smart phone, a tablet, a monitor, a television, a speaker, a game console, a video player, an audio player, or a variety of other types of electronic devices.
  • the chamfered edge or edges can be located in decorative locations on the cover. Some examples include chamfered edges around track pads, around fingerprint scanners, around an edge of a logo, and so on. in further detail, there may be outer periphery locations of the hybrid substrate that can be similarly chamfered.
  • the covers described herein can be made from an aluminum alloy, a magnesium alloy, a combination thereof, or a hybrid substrate with a first portion of aluminum alloy and a second portion of magnesium alloy. This can be accomplished using a variety of processes, including CNC milled, molding, insert molding, forging, casting, machining, stamping, bending, working, and so on.
  • An aluminum alloy portion can then be joined to a magnesium alloy portion to form a hybrid substrate for the cover, it should be appreciated that a cover or a panel for a cover may include a plurality of aluminum alloy portions and a plurality of magnesium alloy portions meaning that the hybrid substrate could have more than one portion including aluminum alloy and more than one portion including magnesium alloy.
  • the aluminum alloy portion is joined to the magnesium alloy portion by welding the aluminum alloy portion onto an extrusion of magnesium alloy.
  • the hybrid substrate can then be further shaped using CNC milling.
  • the hybrid substrate can then be polished, [0040]
  • the aluminum alloy portion is first formed using
  • the magnesium alloy portion is insert molded onto the aluminum alloy portion using thixo-molding to form the hybrid substrate.
  • the aluminum alloy portion Prior to the insert molding, the aluminum alloy portion can be shaped using the CNC milling to form an interlock structure used for the insert molding process.
  • the hybrid substrate After the aluminum alloy portions and the magnesium alloy portions have been joined to form the hybrid substrate, the hybrid substrate can be CNC milled to further shape the hybrid substrate.
  • FIG. 5 is a flowchart illustrating an example method 500 of making a cover for an electronic device.
  • the method includes forming 510 an enclosure with a substrate.
  • the method further includes applying 520 an acid anodizing layer on the substrate.
  • the method further includes applying 530 a dye application on the acid anodizing layer.
  • the method further includes applying 540 a first nickel-free sealing layer on the dye application.
  • the method further includes applying 550 an alkaline anodizing layer on the first sealing layer.
  • the method further includes applying 560 a second nickel-free sealing layer on the alkaline anodizing layer.
  • the method can further include milling an edge along a corner of the substrate to expose a portion of the substrate after the first sealing layer Is applied and before the alkaline anodizing layer is applied, wherein the alkaline anodizing layer covers the milled edge.
  • the method can further include degreasing the substrate before the acid anodizing layer is formed using a degreasing compound including sodium carbonate and NaOH, and a surfactant including sodium caseinate, sodium polyacrylate, sodium polyoxyethylene alkyl ether carboxylate, sodium lauryl sulphate, and/or sodium dodecyi sulfate.
  • FIGS. 6A-6H show cross-sectional views illustrating another example method of making a cover for an electronic device
  • a first portion 610 can include magnesium alloy.
  • the first portion can be formed using forging or insert molding such as thixo-molding.
  • the first portion 610 is joined to a second portion 620 and a third portion 630.
  • the second and third portions can include aluminum alloy and can be formed using CNC milling.
  • the first portion can be joined to the second porting using welding or the first portion can be insert molded onto the second and third portion.
  • the first, second and third portions form a hybrid substrate for the electronic device. It should be appreciated that the first, second, and third portions may alternatively be formed of only one portion or one substrate formed of a material such as an aluminum alloy or a magnesium alloy.
  • the hybrid substrate is coated or covered with an acid anodizing layer 640.
  • the acid anodizing layer can coat all exposed surfaces of the hybrid substrate.
  • a dye application 650 is applied to the acid anodizing layer.
  • the dye application is covered with a first nickel-free sealing layer 660.
  • a corner of the second portion is milled along an edge to form a chamfer 670 that exposes a surface of the second portion.
  • a corner of the third portion is milled along an edge to form a chamfer 680 that exposes a surface of the third portion.
  • the chamfers also cut through the acid anodizing layer, the dye application, and the first nickel-free sealing layer.
  • the chamfers, the exposed portions of the acid anodizing layer, the dye application, and the first nickel-free sealing layer are covered with an alkaline anodizing layer 690.
  • the alkaline anodizing layer is covered with a second nickel-free sealing layer 695.
  • the substrate can be composed of a light metal substrate.
  • the light metal substrate can be made from a single metal, a metallic alloy, a combination of sections made from multiple metals, or a combination of metal and other materials, in certain examples, the light metal substrate can include aluminum, magnesium, lithium, niobium, titanium, zinc, or an alloy thereof, in further particular examples, the light metal substrate can include aluminum, an aluminum alloy, magnesium, or a magnesium alloy.
  • Non-limiting examples of elements that can be included in aluminum or magnesium alloys can include aluminum, magnesium, titanium, lithium, niobium, zinc, bismuth, copper, cadmium, iron, thorium, strontium, zirconium, manganese, nickel, lead, silver, chromium, silicon, tin, gadolinium, yttrium, calcium, antimony, cerium, lanthanum, or others.
  • the light metal substrate can include aluminum magnesium alloys made up of about 0.5% to about 13% magnesium by weight and 8/% to 99.5% aluminum by weight.
  • Examples of specific aluminum magnesium alloys can include 1050, 1060, 1199, 2014, 2024, 2219, 3004, 4041 , 5005, 5010, 5019, 5024, 5026, 5050, 5052, 5056, 5059, 5083, 5086, 5154, 5182, 5252, 5254, 5356, 5454, 5456, 5457, 5557, 5652, 5657, 5754, 6005, 6005A, 6060, 6061 , 6063, 6066, 6070, 6082, 6105, 6162, 6262 ,6351 , 6463, 7005, 7022,
  • the light metal substrate can include magnesium metal, a magnesium alloy that is 99% or more magnesium by weight, or a magnesium alloy that is from about 50% to about 99% magnesium by weight, in a particular example, the light metal substrate can include an alloy including magnesium and aluminum.
  • magnesium-aluminum alloys can include alloys made up of from about 91 % to about 99% magnesium by weight and from about 1 % to about 9% aluminum by weight, and alloys made up of about 0.5% to about 13% magnesium by weight and 87% to 99.5% aluminum by weight.
  • Specific examples of magnesium-aluminum alloys can include AZ63, AZ81 ,
  • the light metal substrate can be shaped to fit any type of electronic device, including the specific types of electronic devices described herein.
  • the light metal substrate can have any thickness suitable for a particular type of electronic device.
  • the thickness of the metal in the light metal substrate can be selected to provide a desired level of strength and weight for the cover of the electronic device.
  • the light metal substrate can have a thickness from about 0.5 mm to about 2 cm, from about 1 mm to about 1.5 cm, from about 1.5 mm to about 1.5 cm, from about 2 mm to about 1 cm, from about 3 mm to about 1 cm, from about 4 mm to about 1 cm, or from about 1 mm to about 5 mm, though thicknesses outside of these ranges can be used.
  • Paint coating layers may include a transparent primer coating as well as other paint coatings.
  • the paint coatings may include one, two, three or four layers or any other number of layers.
  • the paint coating may include a primer coat, a base coat, and/or a top coat.
  • the paint coating may be appiied using any number of techniques including spray painting or inkjet painting.
  • the paint may include a variety of materials.
  • a primer coat can include a polyester, epoxy, epoxy-polyester, epoxy-polyamide, a polyurethane, or a copolymer thereof.
  • a base coat can include a polyester, a polyurethane, polyacrylic, polyester-imide, and epoxy-polyamide, or a copolymer thereof
  • a top coat can include a polyurethane, a polyacrylic or polyacryiate, a urethane, an epoxy, or a copolymer thereof.
  • the paint coatings can be any number of colors and can be transparent, semi-transparent, or opaque.
  • colorant can include dyes and/or pigments.
  • Dyes refers to compounds or molecules that absorb electromagnetic radiation or certain wavelengths thereof. Dyes can impart a visible color to an ink if the dyes absorb wavelengths in the visible spectrum.
  • pigment generally includes pigment colorants, magnetic particles, aluminas, silicas, and/or other ceramics, organo-metaliics or other opaque particles, whether or not such particulates impart color.
  • pigment colorants primarily exemplifies the use of pigment colorants
  • the term “pigment” can be used more generally to describe pigment colorants and other pigments such as organometallics, ferrites, ceramics, etc. In one specific example, however, the pigment is a pigment colorant.
  • a layer thickness from about 0,1 pm to about 0.5 pm should be interpreted to include the explicitly recited limits of 0.1 pm to 0.5 ⁇ m, and to include thicknesses such as about 0.1 ⁇ m and about 0.5 pm, as well as subranges such as about 0.2 ⁇ m to about 0.4 ⁇ m, about 0.2 pm to about 0.5 ⁇ m, about 0.1 pm to about 0.4 pm etc.
  • Example 1 A laptop cover for an electronic device is made with a substrate.
  • the substrate is covered with an acid anodizing layer.
  • the acid anodizing layer is covered with a dye application.
  • the dye application is covered with a first nickel-free sealing layer.
  • the first nickel-free sealing layer is covered with an alkaline anodizing layer.
  • the alkaline anodizing layer is covered with a second nickel-free sealing layer.
  • a solution for the alkaline anodizing layer is formed of about 3 wt% to about 10 wt% of borax (sodium tetraborate) and about 2 wt% to about 8 wt% of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/ora complexing agent
  • the alkaline anodizing layer is applied at a voltage of about 100 to about 300 volts with a current of about 20 to about 40 amps with a frequency of about 30 to about 80 Hertz.
  • the solution of the alkaline anodizing layer has a pH balance of about 9 to about 13.
  • the alkaline anodizing layer is applied at a temperature of about 15 to about 50 degrees Celsius for a time period of about 20 to about 50 minutes.
  • the first nickel-free sealing layer and the second nickel-free sealing layer are formed from a compound that does not contain nickel.
  • Example 2 A laptop cover for an electronic device is made with a substrate.
  • the substrate is covered with an acid anodizing layer.
  • the acid anodizing layer is covered with a dye application.
  • the dye application is covered with a first nickel-free sealing layer.
  • a milled edge is formed along a corner of the substrate to expose a portion of the substrate. The milled edge cuts through a portion of the acid anodizing layer, the dye application, and the first nickel-free sealing layer.
  • the milled edge and the exposed portions of the acid anodizing layer, the dye application, and the first nickel-free sealing layer are covered with an alkaline anodizing layer.
  • the alkaline anodizing layer is covered with a second nickel-free sealing layer.
  • a solution for the alkaline anodizing layer is formed of about 3 wt% to about 10 wt% of borax (sodium tetraborate) and about 2 wt% to about 8 wt% of sodium silicate, potassium silicate, sodium hydroxide, potassium hydroxide, sodium carbonate, and/or a complexing agent.
  • the alkaline anodizing layer is applied at a voltage of about 100 to about 300 volts with a current of about 20 to about 40 amps with a frequency of about 30 to about 80 Hertz.
  • the solution of the alkaline anodizing layer has a pH balance of about 9 to about 13.
  • the alkaline anodizing layer is applied at a temperature of about 15 to about 50 degrees Celsius for a time period of about 20 to about 50 minutes.
  • the first nickel-free sealing layer and the second nickel-free sealing layer are formed from a compound that does not contain nickel.
  • Example 3 The laptop cover for an electronic device of either Example 1 or
  • Example 2 is made, in this example, the substrate is composed of an aluminum alloy.
  • the aluminum alloy includes from 50 wt% to 70 wt% aluminum.
  • Example 4 [0059] The laptop cover for an electronic device of either Example 1 or
  • Example 2 is made, in this example, the substrate is composed of a magnesium alloy.
  • the magnesium alloy includes more than 50 wt% magnesium.
  • Example 5 The laptop cover for an electronic device of either Example 1 or
  • Example 2 is made, in this example, the substrate is composed of a hybrid substrate that has an aluminum alloy portion and a magnesium alloy portion.
  • the aluminum alloy portion is used for the corner regions of a laptop cover, including ail corners of openings in the laptop cover.
  • the aluminum alloy includes from 50 wt% to 70 wt% aluminum.
  • the magnesium alloy portion is prepared by forging, and the magnesium alloy includes more than about 55 wt%.
  • the aluminum alloy portions are welded to the magnesium alloy portions to form a hybrid substrate.
  • the hybrid substrate Includes from about 10 wt% to about 45 wt% of the aluminum alloy and from about 55 wt% to about 90 wt% of the magnesium alloy.
  • CNC milling is then used to shape the hybrid substrate for the laptop cover including forming a “C” shape and/or as a keyboard surface with openings therein for keys, a track pad, a fingerprint pad, etc.
  • the hybrid substrate can then be polished.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Casings For Electric Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne des couvercles pour des dispositifs électroniques. Dans un exemple, un substrat peut comprendre un alliage métallique. Une couche d'anodisation acide peut être formée sur le substrat. Une application de colorant peut être appliquée sur la couche d'anodisation acide. Une première couche d'étanchéité sans nickel peut être formée sur l'application de colorant. Une couche d'anodisation alcaline peut être formée sur la première couche d'étanchéité. Une deuxième couche d'étanchéité exempte de nickel peut être formée sur la couche d'anodisation alcaline.
PCT/US2021/023122 2021-03-19 2021-03-19 Couvercles pour dispositifs électroniques WO2022197306A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US18/282,661 US20240158943A1 (en) 2021-03-19 2021-03-19 Covers for electronic devices
PCT/US2021/023122 WO2022197306A1 (fr) 2021-03-19 2021-03-19 Couvercles pour dispositifs électroniques
TW110145088A TW202237900A (zh) 2021-03-19 2021-12-02 用於電子裝置之罩蓋

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2021/023122 WO2022197306A1 (fr) 2021-03-19 2021-03-19 Couvercles pour dispositifs électroniques

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053447A1 (en) * 2000-08-31 2002-05-09 Kenichi Hashizume Apparatus cover case structure and electronic apparatus
CN201611982U (zh) * 2009-08-28 2010-10-20 朱启铭 电子装置外壳的表面披覆结构
WO2020055377A1 (fr) * 2018-09-10 2020-03-19 Hewlett-Packard Development Company, L.P. Couvercles pour dispositifs électroniques

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053447A1 (en) * 2000-08-31 2002-05-09 Kenichi Hashizume Apparatus cover case structure and electronic apparatus
CN201611982U (zh) * 2009-08-28 2010-10-20 朱启铭 电子装置外壳的表面披覆结构
WO2020055377A1 (fr) * 2018-09-10 2020-03-19 Hewlett-Packard Development Company, L.P. Couvercles pour dispositifs électroniques

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TW202237900A (zh) 2022-10-01

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