WO2022196120A1 - Appareil de revêtement de substrat et procédé de revêtement de substrat - Google Patents

Appareil de revêtement de substrat et procédé de revêtement de substrat Download PDF

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Publication number
WO2022196120A1
WO2022196120A1 PCT/JP2022/003054 JP2022003054W WO2022196120A1 WO 2022196120 A1 WO2022196120 A1 WO 2022196120A1 JP 2022003054 W JP2022003054 W JP 2022003054W WO 2022196120 A1 WO2022196120 A1 WO 2022196120A1
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Prior art keywords
substrate
notch
slit nozzle
coating
unit
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PCT/JP2022/003054
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English (en)
Japanese (ja)
Inventor
裕滋 安陪
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株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2022196120A1 publication Critical patent/WO2022196120A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/10—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention is applied to precision substrates such as glass substrates for FPDs such as liquid crystal display devices and organic EL display devices, semiconductor wafers, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, and substrates for electronic paper.
  • the present invention relates to a substrate coating technique for supplying and coating a processing liquid from a slit nozzle onto a substrate for an electronic device or a substrate for a semiconductor package (hereinafter simply referred to as "substrate").
  • a substrate coating apparatus that applies a processing liquid to a substrate by discharging the processing liquid from the slit nozzle while moving the slit nozzle relative to the substrate.
  • a substrate coating apparatus capable of coating a processing liquid not only on a rectangular substrate but also on a circular semiconductor wafer, for example.
  • a capillary type substrate coating apparatus see Patent Document 1
  • a slit width adjustment type substrate coating apparatus see Patent Document 2
  • JP 2017-148769 A Japanese Patent Application Laid-Open No. 2017-164700
  • the contact area of the processing liquid supplied from the ejection port changes continuously according to the position of the slit nozzle moving along the upper surface of the substrate. As shown in FIG. 4, which will be described later, the wetted area gradually widens immediately after the start of coating and reaches a maximum when approaching the center of the substrate. After passing through it, the wetted area gradually narrows.
  • the slit nozzle reaches the end position of the semiconductor wafer in the moving direction of the slit nozzle, the coating process is completed and the slit nozzle is separated from the substrate.
  • the processing liquid is in contact with the discharge port of the slit nozzle to the end at the end position, forming a liquid pool.
  • the slit nozzle is separated from the substrate in this state, the last liquid pool is cut off, and most of the processing liquid forming the liquid pool remains on the substrate side. As a result, a film thickness defect occurs at the end position, which may adversely affect the treatment with the treatment liquid performed after the coating treatment.
  • non-effective area means an area located outside the effective area to be processed with the processing liquid and not to be processed. Therefore, when a slit nozzle is used to apply a processing liquid to a substrate having a notch, it is desirable to perform coating processing after considering the position of the notch. Coating processing was performed by a substrate coating device.
  • the coating process is performed while a part of the effective area is positioned at the terminal position, so that the part of the effective area (the terminal position) can be favorably processed by the process executed after the coating process.
  • the effective area is narrowed.
  • the present invention has been made in view of the above problems, and provides a substrate coating apparatus and a substrate coating method that use a slit nozzle to supply a processing liquid to a substrate having a notch, and expands the effective area in which the processing liquid is uniformly coated. , is intended to increase the productivity of the treatment with the treatment liquid.
  • One aspect of the present invention is a substrate coating apparatus that coats a substrate with a processing liquid, in which a notch portion is provided in an ineffective region that is located outside an effective region that is to be processed with the processing liquid and that is not to be processed.
  • a slit nozzle that supplies a processing liquid from a slit-shaped ejection port; a moving unit that moves the slit nozzle relative to the substrate; an attitude adjustment mechanism that adjusts the attitude of the substrate with respect to the slit nozzle;
  • the slit nozzle is moved relative to the substrate in the direction of movement perpendicular to the extending direction of the ejection port while supplying the processing liquid from the ejection port toward the substrate, and the coating process is performed, and the liquid is discharged to the end position of the substrate in the movement direction.
  • a coating control unit moves the slit nozzle relatively away from the substrate, a notch position acquiring unit acquires positional information of the notch, and a coating process is performed based on the positional information acquired by the notch position acquiring unit. and a posture control unit that controls the posture adjustment mechanism to position the notch at the terminal position before the start of.
  • Another aspect of the present invention is a substrate coating method, which comprises a substrate having a notch provided in a non-effective region which is located outside an effective region to be processed with a processing liquid and which is not to be processed. is positioned with respect to a slit nozzle having a slit-shaped discharge port at its tip, and a movement perpendicular to the extending direction of the discharge port while supplying the processing liquid from the discharge port toward the positioned substrate.
  • the slit nozzle moves relative to the substrate while the cutout portion of the substrate remains positioned at the terminal position in the moving direction of the slit nozzle.
  • the processing liquid is applied to the substrate.
  • the slit nozzle is positioned above the terminal position, but after that the slit nozzle is relatively separated from the substrate.
  • the liquid pool formed at the end position is cut off, and most of the processing liquid forming the liquid pool remains in the notch, resulting in film thickness defects. In this way, the location where the film thickness defect occurs is limited to the notch, and the treatment liquid can be uniformly applied to the other regions.
  • FIG. 2 is a perspective view schematically showing the configuration of a coating unit installed in the substrate coating apparatus of FIG. 1; It is a schematic diagram which shows the whole board
  • FIG. 10 is a diagram showing the progress of coating processing by the coating unit; It is a figure which shows the structure of 3rd Embodiment of the board
  • 6A and 6B are diagrams schematically showing operations performed in the substrate coating apparatus shown in FIG. 5; FIG.
  • FIG. 1 is a diagram showing the configuration of the first embodiment of the substrate coating apparatus according to the present invention.
  • 2 is a perspective view schematically showing the configuration of a coating unit installed in the substrate coating apparatus of FIG. 1.
  • an XYZ orthogonal coordinate system in which the Z direction is the vertical direction and the XY plane is the horizontal plane is appropriately attached in order to clarify the directional relationship of each part of the coating unit.
  • This substrate coating apparatus 1 is an apparatus for coating a processing liquid on the upper surface of a substrate W having a notch (in this embodiment, a notch) Wn formed in a part of the peripheral portion thereof.
  • This substrate coating apparatus 1 includes a notch detection unit 2 that detects a notch Wn, a coating unit 3 that applies a processing liquid to the upper surface of the substrate W, and a transport robot that transports the substrate W from the notch detection unit 2 to the coating unit 3. 4 and a control unit 5 for controlling the entire device.
  • the notch detection unit 2 includes a stage 21 that holds an unprocessed substrate W brought into the substrate coating apparatus 1 from outside the apparatus, and a stage rotation mechanism 22 that rotates the stage 21 around a rotation axis RX extending in the vertical direction Z. and a notch detector 23 for detecting the notch Wn of the substrate W.
  • the stage 21 has a substantially disk-shaped outer shape.
  • a plurality of suction holes (not shown) are dispersedly provided on the upper surface of the stage 21 . These suction holes are connected to a vacuum pump or the like. Then, the atmosphere in the suction holes is exhausted by the operation of the vacuum pump. Thereby, the stage 21 holds the substrate W placed on the upper surface of the stage 21 in a horizontal posture.
  • the stage rotation mechanism 22 has a rotation shaft 221 extending vertically downward from the central lower surface of the stage 21 and a motor 222 connected to the lower end of the rotation shaft 221 . Then, the stage 21 and the substrate W held on the stage 21 are rotated around the rotation axis RX parallel to the vertical direction Z by the operation of the motor 222 in response to the rotation command from the control unit 5 . Note that this stage rotation is performed in a state in which the rotation center axis CX of the substrate W is aligned with the rotation axis RX.
  • the notch detector 23 has a light projector 231 arranged at a position higher than the substrate W held on the stage 21 and a light receiver 232 arranged at a position lower than the substrate W.
  • the notch detector 23 can be horizontally moved with respect to the stage 21 by a detection movement mechanism (not shown). For example, as shown in FIG. 1, when the notch detector 23 is moved closer to the stage 21, the light projector 231 and the light receiver 232 are arranged so as to sandwich the peripheral edge of the substrate W from above and below. In this state, the notch portion Wn is detected while the substrate W makes one rotation by the motor operation according to the rotation command from the control unit 5 . That is, at the timing when the notch Wn is positioned between the light projector 231 and the light receiver 232, a signal indicating the position of the notch Wn is output to the control unit 5 as the positional information of the notch Wn.
  • the transport robot 4 is arranged between the notch detection unit 2 and the application unit 3 .
  • the transport robot 4 includes a base portion 41 fixed to an apparatus housing, an articulated arm 42 provided rotatably about a vertical axis with respect to the base portion 41, and a hand attached to the tip of the articulated arm 42. 43.
  • the hand 43 has a structure in which the substrate W can be placed and held on its upper surface. Therefore, the articulated arm 42 extends to the notch detection unit 2 so that the hand 43 can receive the substrate W from the stage 21 . Further, the transport robot 4 can move the hand 43 holding the substrate W to the coating unit 3 and transfer the substrate W to the coating unit 3 .
  • the transport robot 4 changes the direction of the hand 43 around the rotation center axis CX of the substrate W, thereby arbitrarily adjusting the position of the notch Wn in plan view from above. do. This point will be detailed later.
  • a transfer robot having such an articulated arm and a hand for holding a substrate is well known, so a detailed description thereof will be omitted.
  • the coating unit 3 is a device called a slit coater that uses a slit nozzle 32 to coat the upper surface Wu of the substrate W with the processing liquid.
  • the treatment liquid includes, for example, a resist liquid, a color filter liquid, polyimide, silicon, nanometal ink, slurry containing a conductive material, and the like.
  • the coating unit 3 includes a stage 31 capable of holding a substrate W by suction in a horizontal position, a slit nozzle 32 discharging a processing liquid onto the substrate W held on the stage 31, and a processing liquid supplying the processing liquid to the slit nozzle 32.
  • a supply unit 33 and a nozzle moving mechanism 34 for moving the slit nozzle 32 with respect to the substrate W in the Y direction are provided.
  • the stage 31 is made of stone material such as granite having a substantially rectangular parallelepiped shape, and the (+Y) side of its upper surface (+Z side) is processed into a substantially horizontal flat surface to hold the substrate W. 311.
  • a large number of vacuum suction ports (not shown) are dispersedly formed on the holding surface 311 . By sucking the substrate W by these vacuum suction ports, the substrate W is held substantially horizontally at a predetermined position during the coating process.
  • the manner in which the substrate W is held is not limited to this. For example, the substrate W may be held mechanically.
  • the slit nozzle 32 has a slit-shaped discharge port 321 (FIG. 1) extending in the X direction.
  • a processing liquid supply unit 33 is connected to the slit nozzle 32 .
  • the substrate W is a substantially circular semiconductor wafer, a capillary system is adopted as in the apparatus described in Patent Document 1. That is, the slit nozzle 32 is moved relative to the substrate W from the ( ⁇ Y) direction side to the (+Y) direction side by the nozzle moving mechanism 34 while bringing the discharge port 321 close to the upper surface Wu of the substrate W.
  • the treatment liquid is ejected from the ejection port 321 by the surface tension of the treatment liquid (bead of the treatment liquid) generated between the ejection port 321 and the substrate W during this movement. For this reason, the processing liquid is discharged from the portion of the discharge port 321 extending in the X direction that faces the substrate W, but the processing liquid is not discharged from the portion where the substrate W does not exist.
  • Such a change in ejection state occurs as the slit nozzle 32 is moved in the Y direction with respect to the substrate W by the nozzle moving mechanism 34 .
  • the slit nozzle 32 moves upward from the substrate W and then returns from the (+Y) direction to the ( ⁇ Y) direction.
  • the nozzle moving mechanism 34 has a bridge structure nozzle support 341 that traverses above the stage 31 in the X direction and supports the slit nozzle 32, and a nozzle moving unit 342 that horizontally moves the nozzle support 341 in the Y direction. Therefore, the slit nozzle 32 supported by the nozzle support 341 can be horizontally moved in the Y direction by the nozzle moving part 342 .
  • the nozzle support 341 has a fixed member 341a to which the slit nozzle 32 is fixed, and two elevating mechanisms 341b that support and lift the fixed member 341a.
  • the fixing member 341a is a rod-shaped member having a rectangular cross section with its longitudinal direction in the X direction, and is made of carbon fiber reinforced resin or the like.
  • the two elevating mechanisms 341b are connected to both ends of the fixed member 341a in the longitudinal direction, and each have an AC servomotor, a ball screw, and the like.
  • the fixing member 341a and the slit nozzle 32 are integrally elevated in the vertical direction (Z direction), and the distance between the discharge port of the slit nozzle 32 and the upper surface Wu of the substrate W, that is, the substrate W
  • the relative height of the ejection port with respect to the upper surface Wu is adjusted.
  • the position of the slit nozzle 32 in the Z direction can be detected by a linear encoder (not shown).
  • the nozzle moving unit 342 includes two guide rails 343 that guide the movement of the slit nozzle 32 in the Y direction, two linear motors 344 that are driving sources, and a nozzle for detecting the position of the ejection port of the slit nozzle 32. 2 linear encoders 345 are provided.
  • the two guide rails 343 are arranged at both ends of the stage 31 in the X direction so as to sandwich the mounting range of the substrate W from the X direction, and extend in the Y direction so as to include the mounting range of the substrate W. ing.
  • the slit nozzle 32 moves in the Y direction above the substrate W held on the stage 31 by guiding the lower ends of the two lifting mechanisms 341b along the two guide rails 343, respectively.
  • Each of the two linear motors 344 is an AC coreless linear motor having a stator 344a and a mover 344b.
  • the stators 344a are provided on both sides of the stage 31 in the X direction along the Y direction.
  • the mover 344b is fixed to the outside of the lifting mechanism 341b.
  • the linear motor 344 functions as a drive source for the nozzle moving mechanism 34 by magnetic force generated between the stator 344a and the mover 344b.
  • each of the two linear encoders 345 has a scale portion 345a and a detection portion 345b.
  • the scale portion 345a is provided along the Y direction under the stator 344a of the linear motor 344 fixed to the stage 31.
  • the detector 345b is fixed further outside the mover 344b of the linear motor 344 fixed to the lifting mechanism 341b, and arranged to face the scale 345a.
  • the linear encoder 345 detects the position of the ejection port of the slit nozzle 32 in the Y direction (corresponding to the nozzle movement direction or relative movement direction) based on the relative positional relationship between the scale portion 345a and the detection portion 345b.
  • a control unit 5 is provided to control the notch detection unit 2, coating unit 3, and transport robot 4 configured as described above.
  • the control unit 5 includes an arithmetic unit 51 (for example, a CPU) that performs various kinds of arithmetic processing, and a storage unit 52 (for example, a ROM, a RAM, etc.) that stores basic programs and various information. It has the configuration of a general computer system connected to The bus line further includes a fixed disk 53 (for example, hard disk drive) for storing application programs, a display unit 54 (for example, display) for displaying various information, and an input unit 55 (for example, keyboard, mouse, etc.) are appropriately connected via an interface (I/F) or the like.
  • a touch panel display in which the functions of the display unit 54 and the input unit 55 are integrated may be used.
  • the application program stored in advance in the fixed disk 53 is copied to the storage unit 52 (for example, RAM), and the calculation unit 51 executes calculation processing according to the application program in the storage unit 52, Acquisition of notch position information from the notch detection unit 2, posture control of the substrate W by the transfer robot 4, and coating of the treatment liquid by the coating unit 3 are executed.
  • the calculation section 51 of the control unit 5 functions as the "notch position acquisition section", the "posture control section” and the “application control section” of the present invention, and controls each section of the device to perform the operations described below. Run.
  • FIG. 3 is a schematic diagram showing the overall operation of the substrate coating apparatus shown in FIG. 1, and FIG. 4 is a diagram showing the progress of coating processing by the coating unit. While the upper part of each drawing shows a plan view as seen from above, the lower part shows a side view.
  • Processing by the substrate coating apparatus 1 is started by loading the coating target substrate W onto the stage 21 . That is, when the substrate W is placed on the stage 21 of the notch detection unit 2 in a state in which the rotation center axis CX of the substrate W is aligned with the rotation axis RX of the stage 21, the substrate W is moved by the operation of a vacuum pump (not shown). W is held on the stage 21 in a so-called face-up posture in which the upper surface Wu faces upward.
  • the notch detector 23 is positioned at a retracted position away from the stage 21 while this loading process is being performed. This avoids interference between the substrate W being carried in and the notch detector 23 .
  • the notch detector 23 moves to the vicinity of the stage 21 and is positioned at the detection position as shown in column (a) of FIG. As a result, the light projector 231 and the light receiver 232 are arranged so as to sandwich the peripheral portion of the substrate W from above and below. Subsequently, the stage rotation mechanism 22 starts rotating the stage 21 . Then, the notch detector 23 detects the notch Wn before the substrate W rotates once. That is, at the timing when the notch Wn is positioned between the light projector 231 and the light receiver 232, a signal indicating the position of the notch Wn is output to the control unit 5 as positional information (notch position information) of the notch Wn. Further, after the stage 21 rotates one round or more, the rotation is stopped and the notch detector 23 is retracted from the stage 21 .
  • the calculation section 51 of the control unit 5 acquires the position of the notch Wn in the rotation direction R about the rotation axis RX. Thereby, the direction in which the notch Wn of the substrate W faces can be accurately grasped. For example, in column (a) of FIG. 4, the notch Wn is held on the stage 21 in a posture in which the slit nozzle 32 is positioned on the ( ⁇ Y) direction side in the moving direction Y (the coating start side as described later).
  • the calculation unit 51 recognizes that the
  • the transport robot 4 extends the articulated arm 42 to the stage 21 of the notch detection unit 2 and receives the substrate W with the hand 43 .
  • the transfer robot 4 extends the multi-joint arm 42 to the stage 31 of the coating unit 3 via the upper side of the base portion 41 to support the substrate W.
  • the hand 43 is positioned above the stage 31 . That is, the transfer of the substrate W by the transfer robot 4 is executed.
  • the computing unit 51 moves the hand 43 from the (+Y) direction to the ( ⁇ Y) direction while moving the hand 43 from the upper position of the stage 21 to the upper position of the stage 31.
  • the transfer robot 4 is controlled so as to change to .
  • the posture of the substrate W is adjusted so that the notch Wn is positioned in the (+Y) direction (fourth step).
  • a lift pin (not shown) rises from the central portion of the stage 31 to support the lower surface of the substrate W.
  • the hand 43 retreats in the (+Y) direction.
  • the substrate W is transferred from the hand 43 to the lift pins.
  • the lift pins descend into the stage 31 to place the substrate W on the stage 31 and hold it on the stage 31 of the coating unit 3 by a suction mechanism (not shown).
  • the slit nozzle 32 is moved to a position suitable for coating processing, and the slit nozzle 32 is positioned at the pre-coating position as shown in column (a) of FIG. 4 (first step). Then, while the slit nozzle 32 moves in the (+Y) direction, the treatment liquid supplied from the treatment liquid supply unit 33 is ejected from the ejection port 321 to coat the upper surface Wu of the substrate W with the treatment liquid. That is, in the present embodiment, the posture of the substrate W is adjusted before the coating process as described above, and the notch Wn is located at the end position Pe of the substrate W in the movement direction Y of the slit nozzle 32, that is, in the (+Y) direction. is doing.
  • the treatment liquid discharge width gradually narrows, and the final application of the treatment liquid is performed at the notch Wn.
  • the notch Wn is positioned at the end position Pe of the substrate W, and after the slit nozzle 32 reaches above the end position Pe, the supply of the processing liquid is stopped, and (f) in FIG. As shown in the column, the slit nozzle 32 is separated from the substrate W in the (+Y) direction to complete the coating process (third step).
  • the liquid pool formed at the end position Pe is cut off, and most of the processing liquid forming the liquid pool remains on the substrate side, that is, in the notch Wn, causing a film thickness defect (( f) See bold line in column).
  • the notch Wn is a so-called non-effective area.
  • the film thickness defects that occur in the final stage of the coating process are limited to the non-effective area of the substrate W.
  • FIG. Therefore, the area of the substrate W other than the cutout portion Wn can be used as an effective area, and the processing liquid can be uniformly applied to the effective area.
  • a so-called chamfered area (effective area) in which a device or the like can be built in the substrate W can be expanded.
  • the nozzle moving mechanism 34 corresponds to an example of the "moving section" of the present invention.
  • the transport robot 4 corresponds to an example of the "attitude adjusting mechanism” of the present invention.
  • the X direction and the Y direction respectively correspond to the "extending direction” and the "moving direction” of the invention, and the inside of the XY plane corresponds to the "inside the plane parallel to the substrate” of the invention.
  • the stage 31 corresponds to an example of the "substrate holder" of the present invention.
  • the notch detecting unit 2 performs the step of acquiring the positional information of the notch Wn, while the position of the substrate W is adjusted so that the notch Wn is positioned at the end position Pe based on the positional information. is performed by the transport robot 4 .
  • the two steps described above may be performed by the notch detection unit 2 (second embodiment). That is, the notch detection unit 2 not only detects the notch Wn in the same manner as in the first embodiment, but also rotates the stage 21 in the rotation direction R so that the notch Wn is positioned at the end position Pe. You may adjust the attitude
  • the stage rotating mechanism 22 functions as the "rotating section" of the present invention.
  • the transport robot 4 transports the substrate W toward the stage 31 of the coating unit 3 while maintaining the attitude adjusted by the notch detection unit 2 .
  • the transport robot 4 functions as the "transport unit” of the present invention.
  • a transport mechanism of a roller transport system or a shuttle system may be used as the "transport unit" of the present invention.
  • notch detection and attitude adjustment are performed by a unit other than the coating unit 3, but notch detection, attitude adjustment, and coating processing may be performed collectively in the coating unit 3 (third embodiment).
  • FIG. 5 is a diagram showing the configuration of the third embodiment of the substrate coating apparatus according to the present invention.
  • the major difference between the third embodiment and the first embodiment is that the spin chuck mechanism of the first embodiment is adopted instead of the stage 31 and that the notch detector of the first embodiment is installed in the coating unit 3.
  • the difference is that the notch detection unit 2 and the transfer robot 4 are omitted in accordance with the above configuration, and the other configurations are basically the same as those of the first embodiment. Therefore, in the following description, while focusing on the differences, the same reference numerals are given to the same configurations, and the description of the configurations will be omitted.
  • a stage 35 is provided as a substrate holding portion for holding the substrate W.
  • the stage 35 is configured in the same manner as the stage 21 of the first embodiment, and can hold the substrate W with the upper surface Wu facing upward.
  • a stage rotation mechanism 36 is connected to the stage 35 .
  • the stage rotation mechanism 36 has a rotation shaft 361 extending vertically downward from the center lower surface of the stage 35 and a motor 362 connected to the lower end of the rotation shaft 361 . Then, the stage 35 and the substrate W held on the stage 35 are rotated around the rotation axis RX parallel to the vertical direction Z by the operation of the motor 362 in response to the rotation command from the control unit 5 .
  • the notch detector 37 has a light projector 371 arranged at a position higher than the substrate W held on the stage 35 and a light receiver 372 arranged at a position lower than the substrate W.
  • the notch detector 37 can be moved horizontally with respect to the stage 35 by a detection movement mechanism (not shown). For example, as shown in FIG. 5, when the notch detector 37 is moved closer to the stage 35, the light projector 371 and the light receiver 372 are arranged so as to sandwich the peripheral edge of the substrate W from above and below. In this state, the notch portion Wn is detected while the substrate W makes one rotation by the motor operation according to the rotation command from the control unit 5 . That is, at the timing when the notch Wn is positioned between the light projector 371 and the light receiver 372, a signal indicating the position of the notch Wn is output to the control unit 5 as the positional information of the notch Wn.
  • FIG. 6 is a diagram schematically showing operations performed by the substrate coating apparatus shown in FIG.
  • the plan view seen from above is shown in the upper part of the figure, the side view is shown in the lower part.
  • processing by the substrate coating apparatus 1 is started by loading the substrate W to be coated onto the stage 35 . That is, when the substrate W is placed on the stage 35 with the rotation center axis CX of the substrate W aligned with the rotation axis RX of the stage 21, a vacuum pump (not shown) operates to move the substrate W upward. It is held on the stage 35 in a so-called face-up posture in which Wu faces upward. During this loading process, the slit nozzle 32 and the notch detector 37 are positioned at a retracted position away from the stage 35 . This avoids interference between the substrate W being carried in and the notch detector 37 .
  • the notch detector 37 moves to the vicinity of the stage 35 and is positioned at the detection position as shown in column (a) of the figure.
  • the light projector 371 and the light receiver 372 are arranged so as to sandwich the peripheral portion of the substrate W from above and below.
  • the stage rotation mechanism 36 starts rotating the stage 35 .
  • the notch detector 37 detects the notch Wn before the substrate W rotates once. That is, when the notch Wn is positioned between the light projector 371 and the light receiver 372, a signal indicating the position of the notch Wn is output to the control unit 5 as positional information (notch position information) of the notch Wn. Further, the notch detector 37 is retracted from the stage 35 after detecting the notch Wn.
  • the calculation section 51 of the control unit 5 acquires the position of the notch Wn in the rotation direction R about the rotation axis RX. Thereby, the direction in which the notch Wn of the substrate W faces can be accurately grasped.
  • column (a) of the figure shows an example of a state in which the substrate W is rotated one or more rounds for detection of the notch Wn and then stopped. Then, based on the signal from the notch detector 37, the calculator 51 recognizes that the notch Wn is held by the stage 35 at a position shifted from the end position Pe in the rotation direction of the substrate W.
  • the calculation unit 51 gives the stage rotation mechanism 36 a rotation instruction to rotate the notch Wn by an angle corresponding to the amount of deviation from the end position Pe.
  • the motor 362 operates to rotate the stage 35 around the rotation axis RX.
  • the posture of the substrate W is adjusted so that the notch Wn is positioned at the end position Pe, as shown in column (b) of the figure (fourth step).
  • the rotation of the substrate W since the detection position of the notch Wn by the notch detector 37 is matched with the end position Pe, the rotation of the substrate W may be stopped simultaneously with the detection of the notch Wn. In this case, notch detection and posture adjustment can be performed collectively.
  • the rotation of the stage 35 is stopped, and the slit nozzle 32 is moved from the standby position on the (-Y) direction side of the stage 35 to the position suitable for the coating process while the notch Wn is positioned at the end position Pe. moved to a position.
  • the slit nozzle 32 is positioned at the pre-coating position (first step).
  • the slit nozzle 32 moves in the (+Y) direction and ejects the processing liquid supplied from the processing liquid supply unit 33 from the ejection port 321 to dispense the processing liquid onto the upper surface Wu of the substrate W. Apply (see (c) in the figure).
  • the supply of the processing liquid is stopped and the slit nozzle 32 moves away from the substrate W in the (+Y) direction to complete the coating process (third step).
  • the liquid pool formed at the end position Pe is cut off, and most of the processing liquid forming the liquid pool remains on the substrate side, that is, in the notch Wn, causing a film thickness defect (( f) See bold line in column).
  • the notch Wn is a so-called non-effective area, and the area of the substrate W other than the notch Wn is regarded as an effective area, and the processing liquid can be uniformly applied to the effective area.
  • the third embodiment has the same effects as those of the first embodiment.
  • the present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the present invention.
  • the present invention is applied to a semiconductor wafer having notches, but the present invention can also be applied to substrates having notches other than notches, such as orientation flats.
  • the processing liquid is applied to the substrate W by the capillary method.
  • the present invention can also be applied to
  • the slit nozzle 32 is moved in the moving direction Y to apply the treatment liquid, but the application mode is not limited to this.
  • the substrate W may be moved while the slit nozzle 32 is fixed.
  • both the slit nozzle 32 and the substrate W may be moved to apply the treatment liquid.
  • the present invention can be applied to general substrate coating techniques in which the slit nozzle 32 is moved relative to the substrate W to perform the coating process.
  • the supply of the treatment liquid is stopped and the liquid is drained by separating the slit nozzle 32 from the substrate W at the same time.
  • the supply of the processing liquid may be stopped. That is, the processing liquid may be supplied to the terminal position Pe using a liquid pool formed near the terminal position Pe. In this case, the residual amount of the processing liquid at the end position Pe can be suppressed.
  • the method of detecting the notch Wn in the notch detectors 23 and 37 is not limited to the transmission method described above, and may be arbitrary.
  • the notch Wn may be detected by a reflection method. .
  • the notch Wn is detected by the notch detectors 23 and 37, and the detection results are sent to the control unit 5 as notch position information. may be obtained.
  • the control unit 5 may receive the notch position information from the external device via a communication line or the like.
  • the present invention can be applied to general substrate coating techniques in which a processing liquid is supplied from a slit nozzle to a substrate having a notch formed in a non-effective area.

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Dans la présente invention, une buse à fente se déplace par rapport à un substrat tandis qu'une encoche dans le substrat est située au niveau d'une position d'extrémité finale dans un sens de déplacement. Par conséquent, le liquide de traitement est appliqué sur le substrat. Ensuite, la buse à fente s'éloigne de manière relative du substrat. À ce moment, un réservoir de liquide formé au niveau de la position d'extrémité finale est drainé, et la majeure partie du liquide de traitement formant le réservoir de liquide reste sur l'encoche, provoquant un défaut d'épaisseur de film. De cette manière, le défaut d'épaisseur de film ne se produit qu'au niveau de l'encoche, et l'autre zone est uniformément revêtue du liquide de traitement.
PCT/JP2022/003054 2021-03-18 2022-01-27 Appareil de revêtement de substrat et procédé de revêtement de substrat WO2022196120A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-044303 2021-03-18
JP2021044303A JP2022143661A (ja) 2021-03-18 2021-03-18 基板塗布装置および基板塗布方法

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WO2022196120A1 true WO2022196120A1 (fr) 2022-09-22

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116553A (ja) * 2003-10-02 2005-04-28 Tokyo Electron Ltd 塗布膜形成装置及び塗布膜形成方法
JP2006287181A (ja) * 2005-01-28 2006-10-19 E-Beam Corp 基板処理装置及び基板処理方法
JP2007335613A (ja) * 2006-06-15 2007-12-27 Nikon Corp 基板位置検出装置、基板搬送装置、露光装置、基板位置検出方法及びマイクロデバイスの製造方法
WO2013146948A1 (fr) * 2012-03-29 2013-10-03 東レ株式会社 Dispositif de revêtement et procédé de revêtement
JP2017148769A (ja) * 2016-02-26 2017-08-31 東レ株式会社 塗布装置及び塗布方法
JP2018069230A (ja) * 2016-10-20 2018-05-10 株式会社Sat 塗布ヘッド及び塗布装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005116553A (ja) * 2003-10-02 2005-04-28 Tokyo Electron Ltd 塗布膜形成装置及び塗布膜形成方法
JP2006287181A (ja) * 2005-01-28 2006-10-19 E-Beam Corp 基板処理装置及び基板処理方法
JP2007335613A (ja) * 2006-06-15 2007-12-27 Nikon Corp 基板位置検出装置、基板搬送装置、露光装置、基板位置検出方法及びマイクロデバイスの製造方法
WO2013146948A1 (fr) * 2012-03-29 2013-10-03 東レ株式会社 Dispositif de revêtement et procédé de revêtement
JP2017148769A (ja) * 2016-02-26 2017-08-31 東レ株式会社 塗布装置及び塗布方法
JP2018069230A (ja) * 2016-10-20 2018-05-10 株式会社Sat 塗布ヘッド及び塗布装置

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