WO2022194342A1 - Broche de levage, ensemble broche de levage, plaque de réseau de broches, réseau de broches de levage, système de traitement, procédé de traitement de substrat, et procédé de maintien de réseau de broches de levage - Google Patents

Broche de levage, ensemble broche de levage, plaque de réseau de broches, réseau de broches de levage, système de traitement, procédé de traitement de substrat, et procédé de maintien de réseau de broches de levage Download PDF

Info

Publication number
WO2022194342A1
WO2022194342A1 PCT/EP2021/056525 EP2021056525W WO2022194342A1 WO 2022194342 A1 WO2022194342 A1 WO 2022194342A1 EP 2021056525 W EP2021056525 W EP 2021056525W WO 2022194342 A1 WO2022194342 A1 WO 2022194342A1
Authority
WO
WIPO (PCT)
Prior art keywords
lift pin
substrate
region
lift
pin array
Prior art date
Application number
PCT/EP2021/056525
Other languages
English (en)
Inventor
Sathiyamurthi GOVINDASAMY
Brijesh RAJU
Srinivasan Nagarajan
Wolfgang Klein
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to PCT/EP2021/056525 priority Critical patent/WO2022194342A1/fr
Priority to CN202190001011.5U priority patent/CN220856548U/zh
Publication of WO2022194342A1 publication Critical patent/WO2022194342A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • LIFT PIN LIFT PIN ASSEMBLY, PIN ARRAY PLATE, LIFT PIN ARRAY, PROCESSING SYSTEM, METHOD OF PROCESSING A SUBSTRATE, AND METHOD OF MAINTAINING A LIFT PIN ARRAY
  • Embodiments of the present disclosure relate to loading or unloading, respectively, of a substrate, for example, a large area substrate on a substrate support.
  • Embodiments of the present disclosure relate to a lift pin array, and a lift pin for loading or unloading of a substrate.
  • Embodiments particularly related to a lift pin for loading or unloading a substrate in a substrate processing system a lift pin assembly for loading or unloading a substrate in a substrate processing system, a pin array plate for a lift pin array, a lift pin array for loading or unloading a substrate in a substrate processing system, a processing system for processing a substrate in a vacuum chamber, a method of processing a substrate in a substrate processing system, and a method of maintaining a lift pin array of a substrate processing system.
  • Coated substrates may be used in several applications and in several technical fields.
  • substrates for displays can be coated by a PVD process, including substrates for high-density displays.
  • Some applications include insulating panels, substrates with TFTs, color filters or the like.
  • a coated substrate, such as a substrate for a display may include one or more layers of a material situated between two electrodes that are deposited on a substrate.
  • substrates are transported through subsequent processing chambers of the processing system, such as deposition chambers and optionally further processing chambers, e.g., cleaning chambers and/or etching chambers, wherein processing aspects are subsequently conducted in the processing chambers such that a plurality of substrates can be subsequently processing in a cluster system or continuously or quasi -continuously be processed in the in-line processing system.
  • a substrate may be supported on a support such as a support table or the substrates can be loaded onto substrate supports that are transported through the processing system.
  • An array of lift pins can be used to load or unload the substrate on a substrate support. Insufficient liability of the lift pins can significantly increase the time utilized for maintenance. Further, maintenance times for a pin array can be high, particularly in light of the plurality of lift pins utilized for loading or unloading.
  • a lift pin for loading or unloading a substrate in a substrate processing system includes a lift pin body extending along a length direction of the lift pin, the lift pin body having a plurality of regions extending along the length direction.
  • the plurality of regions include a support region, a bushing region below the support region, a rotational locking region below the support region, and a transversal locking region below the support region and below the rotational locking region.
  • a lift pin assembly for loading or unloading a substrate in a substrate processing system.
  • the lift pin assembly includes a lift pin a bushing configured to engage the bushing region of the lift pin.
  • the lift pin includes a lift pin body extending along a length direction of the lift pin, the lift pin body having a plurality of regions extending along the length direction.
  • the plurality of regions include a support region, a bushing region below the support region, a rotational locking region below the support region, and a transversal locking region below the support region and below the rotational locking region.
  • an array plate for a lift pin array includes a plate body having an upper surface and a lower surface and a plurality of openings extending through the plate body from the upper surface to the lower surface, one or more openings of the plurality of openings having a circular cross-section at the upper surface and an elongated cross-section at the lower surface.
  • the circular cross-section at the upper surface of the array plate may extend towards a plane between the upper surface and the lower surface and the plate body may extend into a circular segment of the circular cross-section in the plane.
  • a lift pin array for loading or unloading a substrate in a substrate processing system is provided two or more lift pins according to embodiments of the present disclosure and a pin array plate according to embodiments of the present disclosure.
  • each lift pin of the two or more lift pins includes a lift pin body extending along a length direction of the lift pin, the lift pin body having a plurality of regions extending along the length direction.
  • the plurality of regions include a support region, a bushing region below the support region, a rotational locking region below the support region, and a transversal locking region below the support region and below the rotational locking region.
  • the pin array plate includes a plate body having an upper surface and a lower surface and a plurality of openings extending through the plate body from the upper surface to the lower surface, one or more openings of the plurality of openings having a circular cross-section at the upper surface and an elongated cross-section at the lower surface.
  • a processing system for processing a substrate in a vacuum chamber includes a loading station configured for horizontal substrate loading a lift pin array according to embodiments of the present disclosure and a vacuum processing chamber.
  • a method of processing a substrate in a substrate processing system includes loading the substrate on a substrate support with lift pin array according embodiments of the present disclosure and processing a substrate in a vacuum chamber on the substrate support.
  • a method of maintaining a lift pin array of a substrate processing system includes inserting a lift pin into a bushing provided at a pin array plate, rotating the lift pin for transversal locking in a rotated orientation and securing the lift pin in the rotated orientation.
  • FIG. 1 shows a schematic cross-sectional view of a substrate support according to embodiments described herein;
  • FIG. 2 shows a schematic cross-sectional view of a lift pin provided in a pin array plate according to embodiments described herein;
  • FIG. 3A shows a schematic view of lift pin according to embodiments described herein;
  • FIG. 3B shows a schematic view of bushing according to embodiments described herein;
  • FIG. 4A shows a schematic top view of a pin array plate according to embodiments described herein;
  • FIG. 4B shows a schematic bottom view of a pin array plate according to embodiments described herein;
  • FIG. 5A shows a schematic view of a processing apparatus for processing a substrate according to embodiments described herein
  • FIG. 5B shows a schematic view of a processing apparatus for processing a substrate according to embodiments described herein;
  • FIG. 6 shows a flow chart illustrating a method of maintaining a lift pin array according to embodiments described herein.
  • FIG. 7 shows a flow chart illustrating a method of processing a substrate according to embodiments described herein.
  • Substrate supports can be used in a processing system, such as a vacuum deposition system, for holding and/or transporting substrates within a vacuum chamber of the processing system.
  • a substrate support can be a support table, e.g. a substrate support table, or a pedestal, e.g. a substrate support pedestal provided in a processing chamber of a vacuum processing system.
  • a support table may particularly be configured for horizontal substrate processing or essentially horizontal substrate processing.
  • the processing chamber including the substrate support may be provided in a cluster system.
  • a substrate support can be a carrier, particularly a carrier within an electrostatic chuck (ESC).
  • the carrier may particularly be configured for vertical substrate processing or essentially vertical substrate processing.
  • the substrate can be supported by the carrier and the carrier can move the substrate through a vacuum processing system and can support the substrate during processing of the substrate. Supporting a substrate with a carrier for substrate processing has the advantage of reduced glass breakage, for example, for transporting a substrate through a processing system.
  • Embodiments of the present invention generally relate to lift pins and a lift pin array for loading or unloading a substrate on a substrate support, such as a substrate support table or a carrier.
  • a substrate can be positioned on a lift pin array, for example, with a robot.
  • the substrate support and the lift pin array can be moved relative to each other to transfer the substrate, for example, a glass substrate or a wafer, from the lift pin array onto the substrate support.
  • the lift pin array can be lowered, the substrate support can be raised, or both.
  • Lift pin arrays can include a plurality of challenges such as one or more of: breakage, lack of perpendicularity and, thus, misalignment, and difficult or long maintenance times.
  • Embodiments of the present disclosure provide self-aligning, self-locking, and/or strengthened lift pins.
  • the lift pins can be provided in a lift pin array of a processing system, such as a cluster processing system shown in FIGS. 5 A and 5B.
  • the lift pin can further be anti -rotational, i.e. undesired rotation can be prevented. Further, maintenance and service activities can be improved by lift pins according to embodiments of the present disclosure.
  • FIG. 1 shows a schematic cross-sectional view of a substrate support 100 according to embodiments described herein.
  • the substrate support may be a substrate support table.
  • the substrate support 100 is configured for supporting a substrate in a processing chamber.
  • the substrate support 100 includes a substrate support body 140 having a substrate support surface, for example, a front side 142, for supporting the substrate. Opposite the front side 142, aback side 143 is provided.
  • the substrate support can include a chuck assembly.
  • the chuck assembly is configured to hold the substrate at the substrate support surface.
  • the chuck assembly may include an electrode assembly 125 for providing electrostatic forces to the substrate. For example, an electrostatic field may be provided by the electrode assembly 125 to act on the substrate for holding the substrate.
  • a substrate may be supported in a processing chamber or transported through a processing system while being held by the electrostatic field.
  • the substrate support 100 includes a substrate support surface, i.e. the front side 142.
  • a substrate to be carried through a processing system may be held at the substrate support surface of the substrate support.
  • the substrate may be held at the substrate support surface by electrostatic forces.
  • the substrate support 100 includes a plurality of first openings, such as openings 115.
  • the plurality of first openings allow for trespassing through the substrate support.
  • the substrate support may include a plurality of second openings 112 in the substrate support surface.
  • the plurality of second openings may be connected to the gas conduit 110.
  • the gas conduit may be connected to a gas supply.
  • the gas conduit may be connected to a gas source 160 for providing a cooling gas.
  • the gas source 160 can be a gas tank or a gas supply of a processing system.
  • the gas conduit may include a plurality of channels 116. Each of the channels of the plurality of channels 116 may open into one opening of the plurality of second openings 112.
  • the cooling gas can be provided between the substrate supported by the substrate support 100 and the substrate. Accordingly, the substrate temperature can be reduced during substrate processing.
  • the cooling gas can be selected from the group consisting of: helium, argon or the like.
  • the substrate support may include at least one non-conductive area.
  • the at least one non-conductive area may be made of a dielectric material.
  • the dielectric may be made of a high thermal conductivity dielectric material such as pyrolytic boron nitride, aluminum nitride, aluminum oxide, silicon nitride, alumina or an equivalent material, but may be made of such materials as polyimide.
  • the electrode assembly 125 may be embedded in the at least one non-conductive area or provided on the side of the non-conductive area opposite the substrate support surface.
  • the substrate support 100 may include one or more voltage sources configured to apply one or more voltages to the plurality of electrodes 122.
  • the one or more voltage sources are configured to ground at least some electrodes of the plurality of electrodes 122.
  • the one or more voltage sources can be configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and/or ground to the plurality of electrodes 122.
  • each electrode, every second electrode, every third electrode or every fourth electrode of the plurality of electrodes can be connected to a separate voltage source.
  • polarity refers to an electric polarity, i.e., negative (-) and positive (+).
  • first polarity can be the negative polarity and the second polarity can be the positive polarity, or the first polarity can be the positive polarity and the second polarity can be the negative polarity.
  • the ESC of the substrate support can be a mono-polar or a bi polar electrostatic chuck.
  • a controller 130 can be configured to control the one or more voltage sources for applying the one or more voltages and/or ground to the electrode assembly 125.
  • the controller 130 may be configured to regulate the chuck assembly i.e. the controller may be configured to control the electrostatic chucking.
  • the controller 130 may be configured to regulate the gas source 160.
  • the controller can be configured to control or communicate with the first temperature sensor and/or to control or communicate with the second temperature sensor.
  • the controller 130 as illustrated in FIG. 1 may be separated into individual controllers for the voltage source, the gas supply, and/or the temperature sensors.
  • the substrate support may be oriented substantially horizontally for a cluster processing system or a wafer processing system.
  • the substrate support may be oriented substantially vertically for an in-line processing system.
  • the substrate may be transported through the processing system in a substantially vertical orientation.
  • substantially horizontal is understood particularly when referring to the substrate orientation, to allow for a deviation from the horizontal direction or orientation of ⁇ 20° or below, e.g. of ⁇ 10° or below.
  • substantially vertical is understood particularly when referring to the substrate orientation, to allow for a deviation from the vertical direction or orientation of ⁇ 20° or below, e.g. of ⁇ 10° or below. This deviation from a vertical orientation can be provided for example because a substrate support with some deviation from the vertical orientation might result in a more stable substrate position, or a facing down substrate orientation might even better reduce particles on the substrate during deposition. Yet, the substrate orientation, e.g., during a layer deposition process, is considered substantially vertical. Generally, horizontal and vertical substrate orientations can be differentiated, wherein both orientations, a horizontal orientation or a vertical orientation may include a deviation as described above.
  • vertical direction or “vertical orientation” are understood to distinguish over “horizontal direction” or “horizontal orientation”.
  • the vertical direction is substantially parallel to the force of gravity.
  • the substrate may be loaded onto the substrate support in a substantially horizontal orientation.
  • Substrate lift pins which will be described in more detail with respect to FIGS. 2 and 3, may be utilized to load or unload the substrate in a horizontal orientation of the substrate support 100.
  • a substrate hand over or transfer i.e. an unloading of a process substrate from the substrate support or a loading of a substrate to be processed onto the substrate support can be provided in an essentially horizontal position, particularly a horizontal position.
  • a lift pin assembly such as a pin array can be used.
  • a lift pin for loading or unloading a substrate in a substrate processing system includes a lift pin body extending along a length direction of the lift pin, the lift pin body comprising a plurality of regions extending along the length direction.
  • the plurality of regions include a support region, a bushing region below the support region, a rotational locking region below the support region, and a transversal locking region below the support region and below the rotational locking region.
  • the support region of the lift pin body can be configured to support the substrate.
  • a tip of the support region can be in contact with a substrate during supporting of the substrate.
  • the bushing region of the lift pin body is configured to contact with the bushing to provide stability for the lift pin in a mounted configuration.
  • the bushing region can be slide fitted into the bushing during insertion of the lift pin into the pin array plate.
  • the transversal locking region is configured to prevent up-and-down movement of the lift pin relative to the pin array plate, particularly after rotation of the lift pin activating the transversal locking region by the rotation.
  • the rotational locking region is configured to limit the rotation of the lift pin during sampling of the lift pin to the pin array plate. A portion of the rotational locking region, for example, a rotational locking feature is blocked by a portion of the pin array plate when the rotation limit is reached.
  • FIG. 2 shows the lift pin assembly 200 coupled to a pin array plate 250.
  • the lift pin assembly 200 includes a lift pin 210 and the bushing 220.
  • the bushing 220 can be inserted into the pin array plate 250.
  • the bushing 220 can be fitted into an opening in the pin array plate 250.
  • the bushing 220 has an outer cylindrical portion.
  • the pin array plate 250 includes an opening with an inner cylindrical portion, wherein the outer cylindrical portion of the bushing 220 is fitted into the inner cylindrical portion of the pin array plate.
  • the bushing 220 is partially provided as a hollow cylinder. Accordingly, the bushing 220 further includes an inner cylindrical portion, which is configured to engage with an outer cylindrical portion of a corresponding region of the lift pin 210.
  • the lift pin assembly 200 may further include a lock nut 230 to secure the lift pin 210 at the pin array plate 250 after insertion of the lift pin 210 into the pin array plate.
  • the arrangement of a pin array plate, the lift pin, the lock nut, and the bushing allows for insertion, removal, and fixation of the lift pin from the upper side of the pin array plate 250.
  • the lift pin 210 has a lift pin body extending along a length direction indicated by the dashed line in FIG. 2.
  • the lift pin 210 includes a plurality of regions along the length direction. The plurality of regions serve different purposes.
  • the lift pin body includes a support region 211, which is only partially shown in FIG. 2. At the upper portion of the support region 211, a tip of the lift pin is provided. The substrate can be placed on the tip of the lift pin.
  • the support region can have a diameter of 8 mm or above, particularly of 9 mm or above. The diameter of the support region can be larger than the diameter of other regions of the lift pin body.
  • the lift pin body of the lift pin 210 can include a lock nut region 212.
  • the lock nut region is provided below the support region 211.
  • the lock nut region 212 is configured to engage with the lock nut 230.
  • the lock nut 230 secures the lift pin 210 to the pin array plate 250 after insertion of the lift pin into the pin array plate and a rotation of the lift pin to activate a transversal locking region 214.
  • the transversal locking region can provide an up-down locking feature.
  • the lock nut region 212 can be provided between the support region 211 and the bushing region 213 of the lift pin body of the lift pin 210.
  • the lock nut region can have at least partially a cylindrical shape, wherein the diameter of the lock nut region is smaller than the diameter of the support region. Further, the diameter of the lock nut region can be larger than the diameter of a bushing region. Accordingly, a downward movement of the lift pin into the bushing can be limited by the lock nut region.
  • the lift pin body of the lift pin 210 includes a bushing region 213.
  • the bushing region 213 can include a cylindrical contact surface with an outer circular cross-section.
  • the cylindrical contact surface of the bushing region 213 corresponds to an inner circular cross-section of the bushing 220.
  • the bushing region can have a diameter smaller than the support region and the bushing region. Further, the diameter of the bushing region can correspond to the maximum dimension of the transversal locking region having an elongated shape.
  • the lift pin 210 can be slide fitted into the bushing. Due to the particularly good manufacturing tolerances of cylindrical surfaces and openings, improved perpendicularity of a lift pin on the pin array plate 250 can be provided. Further, as compared to a common thread connection, the slide fit connection allows for increased diameters and, thus, increased stability of the lift pins in a lift pin array.
  • the cylindrical contact surface has a diameter of 6 mm or above, for example about 8 mm.
  • the length of the slide fit along the length direction indicated by the dashed line in FIG. 2 further improves the stability of the lift pin in the lift pin array.
  • the length of the slide fit coupling can be 10 mm or above, particularly about 50 mm.
  • the length of the cylindrical contact surface of the bushing region is larger than the diameter of the cylindrical contact surface.
  • An improved cross-sectional stability of the lift pin in the bushing 220 can be provided. Further, the slide fit with an increased length allows for an improved pin perpendicularity and/or can reduce bending of a lift pin 210 of a pin array, particularly when being loaded with a substrate.
  • An improved lift pin stability and an improved perpendicularity of a lift pin can reduce the risk of a collision of the lift pin, for example, with an opening 115 in the substrate support. A collision of the lift pin may result in breakage of the lift pin and may cause undesired maintenance cycles. Accordingly, the improved stability and/or perpendicularity of the lift pin can reduce maintenance times and, thus, increase the system uptime.
  • the lift pin body of the lift pin 210 includes a transversal locking region 214.
  • the transversal locking region has an elongated shape, for example an oval, a rectangle, or another elongated shape.
  • the shape can have a two-fold rotational symmetry (180°).
  • the shape does not have four-fold rotational symmetry (90°).
  • the elongated shape of the transversal locking region 214 allows for insertion and removal of the lift pin 210 from the pin array plate 250 through an elongated opening (see e.g. FIG. 4B) in the pin array plate.
  • FIG. 3 A shows the lift pin 210 and refers to some further additional or alternative implementations.
  • the support region 211 may include at least one spanner holder surface 311.
  • two (or more) spanner holding surfaces can be provided at a cylindrical surface of the support region.
  • Two spanner holding surfaces opposing each other can be provided to allow for operation of the lift pin 210 by a spanner.
  • the spanner holding surfaces can be flat surfaces provided on the generally cylindrical cross- section of the support region of the lift pin 210.
  • the lock nut region 212 may include a thread 314 along at least portion of the perimeter of the lock nut region or along the entire perimeter of the lock nut region. Accordingly, a lock nut 230 may be inserted, e.g. screwed, along the length direction of the lift pin 210 and may engage with the thread 314 provided at the lock nut region to secure the lift pin 210 by operation of the lock nut.
  • the lift pin 210 further includes rotational locking region 313.
  • the rotational locking region 313 provides a non-rotational symmetric shape.
  • the rotational locking region includes a first perimeter portion extending radially outward up to a first radius.
  • the first radius corresponds to the radius of the bushing region 213.
  • the rotational locking region 313 is recessed relative to the first portion and has a second radius which is smaller than the first radius.
  • the first radius extends to the right-hand side and essentially corresponds to the radius of the cylinder of the bushing region.
  • the rotational locking region has a smaller diameter and is recessed from the cylindrical shape.
  • the recessed portion i.e. the second perimeter portion allows for insertion of the lift pin 210 in the pin array plate 250.
  • the first perimeter portion limits the rotation of the lift pin to, for example, about 90°.
  • the first perimeter portion stops against a solid material of the pin array plate 250, wherein the pin array plate 250 does not have a full cylindrical opening in the plane of the rotational locking region of the pin array.
  • the pin array plate 250 extends into a circular segment or includes a circular segment in the plane of the rotational locking region, particularly to limit rotation of the pin array in the pin array plate.
  • FIG. 3B shows the bushing 220.
  • the bushing 220 includes a first region 301 corresponding to the bushing region of the lift pin 210 and includes a second region 303 corresponding to a rotational locking region of the lift pin.
  • the bushing 220 includes a cylindrical outer surface 320 and a cylindrical inner surface 324.
  • the cylindrical outer surface 320 corresponds to a cylindrical surface in the pin array plate 250.
  • the cylindrical inner surface 324 corresponds to the cylindrical outer surface of the bushing region of the lift pin body of the lift pin 210.
  • the corresponding cylindrical surfaces can provide for a slide fit of the bushing 220 into the pin array plate 250 and further for a slide fit of the lift pin 210 into the bushing 220.
  • the bushing has an inner cylindrical contact surface corresponding to the cylindrical contact surface of the lift pin.
  • the bushing 220 further includes recessed portion or cutout portion 322.
  • the cutout portion can have the shape of a circular segment.
  • the cutout portion allows for insertion of the bushing 220 into the pin array plate.
  • the cutout portion may correspond to the circular segment of the pin array plate 250 that limits rotation of the pin array.
  • a lift pin assembly for loading or unloading a substrate in a substrate processing system.
  • the lift pin assembly includes a lift pin according to embodiments described herein, for example with respect to FIGS. 2 and 3 A and a bushing configured to engage the bushing region of the lift pin.
  • the bushing can be provided according to any of the embodiments described with respect to FIGS. 2 and 3B.
  • the lift pin assembly may further include a locknut configured to engage the locknut region of the lift pin.
  • FIGS. 4A and 4B show a pin array plate 250.
  • FIG. 4A shows a schematic top view of a pin array plate and
  • FIG. 4B shows a schematic bottom view of a pin array plate.
  • the pin array plate 250 includes plate body having an upper surface 251 and a lower surface 253.
  • the pin array plate includes a plate body having a plurality of openings.
  • FIGS. 4 A and 4B show a portion of the pin array plate including one opening of the plurality of openings.
  • a circular cross-section 452 of the opening of the plurality of openings at the upper surface is shown.
  • the circular cross-section 452 extends downwardly towards the lower surface of the plate body and is configured to engage with the cylindrical outer surface 320 of the bushing 220.
  • the circular cross-section 452 extends downwardly towards a plane configured to engage with the rotational locking region of a lift pin.
  • a circular segment portion 422 of the plate body is shown in FIG. 4A.
  • the circular segment portion 422 can be integrally formed with the plate body of the pin array plate 250.
  • the circular segment portion 422 allows for insertion of the lift pin in a first lift pin orientation and limits rotation of the lift pin by, for example 90°, towards the second lift pin orientation.
  • FIG. 4B shows an elongated cross-section 454 at the lower surface of the pin array plate 250.
  • the lift pin In the first lift pin orientation, the lift pin can be inserted through the opening, wherein the elongated shape portion of the transversal locking region of the lift pin can trespass the elongated cross-section at the lower surface of the pin array plate.
  • the transversal locking region of the lift pin After a rotation of the lift pin into the second lift pin orientation, the transversal locking region of the lift pin is rotated relative to the elongated shape of the elongated cross-section 454. A transversal movement of the lift pin can be reduced or avoided.
  • a plate for a lift pin array includes a plate body having an upper surface and a lower surface and a plurality of openings extending through the plate body from the upper surface to the lower surface.
  • One or more openings of the plurality of openings have a circular cross-section at the upper surface and an elongated cross-section at the lower surface.
  • the circular cross section at the upper surface extends towards a plane between the upper surface and the lower surface and the plate body extends into a circular segment of the circular cross section in the plane.
  • an embodiment of the invention provides a lift pin array for loading or unloading a substrate in a substrate processing system.
  • the lift pin array includes two or more lift pins according to embodiments described herein and a pin array plate according to embodiments described herein.
  • a lift pin array is exemplarily shown in FIG. 5B, which is described in more detail below.
  • a lift pin array according to embodiments of the present disclosure can be assembled by providing, as an optional implementation, a lock nut at the lift pin.
  • the bushing is inserted into an opening of a pin array plate.
  • the lift pin is inserted from the upper surface of a pin array plate into the bushing.
  • the lift pin is rotated by, for example, 90° to provide the transversal locking of the transversal locking region of the lift pin with an elongated cross-section at the lower surface of the plate body of the pin array plate.
  • the rotation of the lift pin is limited by the rotational blocking region of the lift pin and the circular segment portion of the plate body of the pin array plate.
  • the lock nut or alternative implementations of a lock nut such as a recess at the lower surface of the plate body of the pin array plate and the spring configured to push the lift pin into the recess, can be utilized to secure the pin array at a plate.
  • a quick self-aligning, self-locking, anti -rotational and strengthened pin array for an assembly can be provided.
  • the lift pin is self-aligning by incorporating a slide fit of the bushing into the pin array plate and a slide fit of the lift pin into the bushing. Perpendicularity of the lift pin can be improved.
  • the assembly of a lift pin into the pin array plate can be provided from the upper surface of the plate body of the pin array plate.
  • the rotational locking region of the lift pin engaging with the pin array plate provides for the stopper feature to stop rotation, for example, after 90° rotation. Accordingly, the pin array is anti -rotational in the pin array plate.
  • Accidental removal of the lift pin from the pin array plate, particularly after locking the lift pin with a lock nut or the like, can be prevented.
  • a strengthened pin and/or improved perpendicularity can be provided. For example, larger lift pin diameters can be provided within the available space.
  • FIG. 5A shows a substrate processing system 500.
  • the substrate processing system 500 can be a cluster system having a transfer chamber 520.
  • the transfer chamber 520 can be a central transfer chamber.
  • a robot 522 can at least be partially disposed within the transfer chamber 520.
  • the robot 522 can have a robot arm 554.
  • the robot 522 can transfer substrates between the chambers coupled to the transfer chamber 520.
  • At least one load lock chamber 505 can be coupled to the transfer chamber 520.
  • FIG. 5A shows two load lock chambers 505 coupled to the transfer chamber 520.
  • One or more vacuum processing chambers 510 can be coupled to the transfer chamber 520.
  • the robot 522 can transfer the substrate between a load lock chamber and a deposition chamber and vice versa or between different deposition chambers attached to the transfer chamber 520.
  • a deposition apparatus or a processing chamber includes a vacuum chamber. Further, the transfer chamber 520 can be a vacuum transfer chamber. Accordingly, a substrate can be handled under vacuum from the load lock chamber to the transfer chamber, from the transfer chamber to the vacuum chamber of a deposition apparatus and from the vacuum chamber of first deposition apparatus to a vacuum chamber of a further deposition apparatus.
  • the apparatuses and systems described herein are configured in order to move and process large area substrates that may in particular have a surface of 1 m 2 or above.
  • substrate may particularly embrace substrates like glass substrates, for example, a glass plate.
  • a substrate may include wafers, slices of transparent crystal such as sapphire or the like.
  • substrate may embrace other substrates that can be inflexible or flexible, like e.g. a foil or a web.
  • the substrate may be formed by any material suitable for material deposition.
  • FIG. 5A schematically shows a substrate processing system 500 including one or more vacuum processing chambers 510 according to the present disclosure.
  • the one or more vacuum processing chambers 510 are intended for the deposition of material on a substrate and include a vacuum chamber and/or a sputter source area according to embodiments of the present disclosure.
  • An array of deposition sources configured to deposit material on the substrate at a processing area in a horizontal orientation can be provided.
  • FIG. 5 A further shows load lock chambers 505.
  • the vacuum transfer chamber 520 is coupled to the one or more deposition apparatuses.
  • the vacuum transfer chamber can move substrates to the one or more vacuum chambers through openings, particularly horizontal slit openings.
  • the load lock chambers 505 are configured to receive a substrate under atmospheric pressure or not under vacuum conditions A and then to transfer the substrate into the vacuum transfer chamber under vacuum conditions V.
  • the load chamber may also receive a substrate from the transfer chamber under a vacuum condition V and provide said substrate under atmospheric pressure or not under vacuum conditions A.
  • one or more further processing chambers may be coupled to the vacuum transfer chamber, for example, a central transfer chamber.
  • the one or more further processing chambers may be selected from a heating chamber coupled to the transfer chamber, a cooling chamber coupled to the transfer chamber, a pre-cleaning chamber coupled to the transfer chamber, a storage chamber coupled to the transfer chamber, an examination chamber coupled to the transfer chamber, and a CVD chamber coupled to the transfer chamber.
  • One or more of the above chambers, of the same type and/or different type may be coupled to a central transfer chamber.
  • the examination chamber may, for example, measure the thickness of a layer deposited in a previous deposition process or may control one or more layer thicknesses before the substrate is unloaded from a processing system. A control of layer thickness can be provided.
  • the cleaning or precleaning chamber may remove oxides from, for example, metal layers, or may remove photoresist residuals from a previous manufacturing operation.
  • FIG. 5B shows a deposition apparatus.
  • the deposition apparatus includes a vacuum chamber 511.
  • the vacuum chamber 511 can include various segments.
  • the segments can be defined by the functionality of the segments, i.e. some segments or portions of the segment and an adjacent segment may be fixedly connected or integrally formed. Separating the vacuum chamber into segments allows for reduced cost of ownership.
  • the vacuum chamber 511 as exemplarily shown in FIG. 5B includes a source frame segment 512.
  • the source frame segment can be a fixed segment that is at a fixed position relative to the processing system, for example, relative to the central transfer chamber.
  • the source frame segment is configured to support the source assembly and/or a source support assembly, respectively.
  • a plurality of sputter cathodes 551 and a plurality of anodes 552 are provided in the source frame segment.
  • another source such as an evaporation source, a spraying source, or a CVD source may be coupled to the source frame segment.
  • An upper lid assembly is provided over the source frame segment 512.
  • the upper lid assembly 514 can be removed from the source frame segment, for example, for maintaining components disposed in the upper lid assembly and/or for maintaining components of the source assembly or the source support assembly.
  • a substrate handling segment 516 is provided below the source frame segment.
  • the substrate handling segment 516 includes or houses components for substrate handling, substrate alignment, substrate masking, substrate support, or the like.
  • the lift pin array 550 can be utilized for loading on a substrate support table or unloading a substrate from a substrate support table and can be provided according to any of the embodiments of the present disclosure.
  • the vacuum processing chamber 510 can be supported by a pedestal 518.
  • the pedestal 518 can include three or more stands. Particularly, the pedestal may support at least the source frame segment 512.
  • a deposition apparatus or a vacuum processing chamber for large area substrate processing in a cluster processing system includes a vacuum chamber.
  • the deposition apparatus includes a vacuum processing chamber and a lift pin array according to any of the embodiments described herein.
  • the lift pin array may include a pin array plate and lift pins 210.
  • the lift pins 210 can be assembled from the top onto the plate.
  • the deposition apparatus further includes a substrate support 100 within the substrate handling segment and an actuator coupled to the substrate support to vertically move the substrate support 100 and the lift pin array 550 relative to each other.
  • FIG. 5B shows the substrate support 100 and the actuator 523 coupled to the substrate support 100.
  • the actuator 523 can be a linear actuator or drive configured to move the substrate support 100 vertically.
  • FIG. 5B shows the substrate support 100 in a first position below the upper ends of the substrate support pins or lift pins 210.
  • the actuator 523 may move the substrate support 100 to a second position, i.e. an upper position, wherein the substrate support is positioned above the upper ends of the substrate support pins.
  • the substrate disposed on the substrate support pins or lift pin 210 are contacted by the substrate support upon movement of the substrate support from the first position to the second position.
  • the substrate can be disposed on the substrate support for material deposition by lifting the substrate support from the first position to the second position. Further, the substrate can be disposed on the substrate support pins or lift pins 210, for example, after deposition, by lowering the substrate support holding the substrate from the second position to the first position.
  • the substrate support 100 acts as a table to support the substrate during deposition of the material layer on the substrate. If the table is moved to the upper position, i.e. the second position, the substrate can be disposed below the edge exclusion mask 530.
  • the substrate support shown in FIG. 5B is a substrate support according to embodiments of the present disclosure.
  • the substrate support may include an electrostatic chuck.
  • the substrate processing system 500 as shown in FIGS. 5A to 5B may be configured for CVD or PVD processes, such as sputter deposition.
  • the system can be configured for evaporation of e.g. an organic material for the manufacture of OLED devices.
  • the processing system may be a processing system for large area substrates, e.g., for display manufacturing.
  • the processing systems for which the structures and methods according to embodiments described herein are provided are for processing large area substrates having, for example, an area of 1 m 2 or larger.
  • a large area substrate can be GEN 5, which corresponds to a surface area of about 1.4 m 2 (1.1 m x 1.3 m), GEN 7.5, which corresponds to a surface area of about 4.29 m 2 (1.95 m x 2.2 m), GEN 8.5, which corresponds to a surface area of about 5.7 m 2 (2.2 m x 2.5 m), or even GEN 10, which corresponds to a surface area of about 8.7 m 2 (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented.
  • a processing system may process the substrate under vacuum conditions.
  • Vacuum conditions as used herein include pressure conditions in the range of below 10 1 mbar or below 10 3 mbar, such as 10 7 mbar to 10 2 mbar. Vacuum conditions may be applied through the use of vacuum pumps or other vacuum creating techniques.
  • vacuum conditions in the load lock chamber may be switched between atmospheric pressure conditions and subatmospheric pressure conditions, e.g. in a range at or below 10 1 mbar.
  • the substrate For transferring a substrate into a high vacuum chamber, the substrate may be inserted into the load lock chamber provided at atmospheric pressure, the load lock chamber may be sealed, and subsequently may be set at a subatmospheric pressure in the range below 10 1 mbar. Subsequently, an opening between the load lock chamber and the high vacuum chamber may be opened, and the substrate may be inserted into the high vacuum chamber to be transported into the processing chamber.
  • a processing system for processing a substrate in a vacuum chamber includes a loading station, particularly configured for horizontal substrate loading into and out of the processing system.
  • a vacuum processing chamber is provided.
  • the processing system includes a lift pin array according to embodiments of the present disclosure. Particularly, the lift pin array can be provided in the vacuum processing chamber.
  • FIG. 6 shows a flow chart illustrating a method 600 for assembling a lift pin array.
  • a similar method including at least some of the described operations can be provided for a method of maintaining a lift pin array of a substrate processing system, particularly by inserting one or more lift pins into the pin array plate.
  • a plurality of lift pins can be inserted and coupled to the pin array plate.
  • the bushing is inserted into the pin array plate.
  • the bushing can be press-fitted into the pin array plate.
  • the bushing can be inserted into the pin array plate during manufacturing and may remain inside the pin array plate for subsequent maintenance procedures, for example, the exchange of a lift pin.
  • the lock nut and the lift pin are pre-assembled.
  • the lock nut can be moved along a length direction of the lift pin to the locknut region of the lift pin.
  • the lift pin particularly the lift pin together with the locknut, is inserted into the bushing (see operation 630).
  • the lift pin and the locknut can be inserted from the top of the pin array plate.
  • the lift pin is coupled to the pin array plate.
  • the lift pin is rotated.
  • the lift pin can be rotated until the first perimeter portion of the rotational locking region contacts the surface of the pin array plate.
  • the anti-rotational feature of the rotational locking region limits the angle of rotation. For example, the anti -rotational region limits the angle of rotation to about 90°.
  • a locknut can be utilized to secure the pin in the rotated position.
  • the locknut may engage with a threaded portion of the locknut region by operation of the locknut.
  • a method of maintaining a lift pin array of a substrate processing system includes inserting or sliding a lift pin into the bushing provided at the pin array plate, particularly within an opening of the pin array plate.
  • the lift pin is rotated for transversal locking of the lift pin relative to the pin array plate by the transversal locking region of the lift pin.
  • the angle of rotation is limited by the rotational locking region or a rotational locking feature as described according to embodiments of the present disclosure.
  • the lift pin is secured in the rotated position. Particularly, the lift pin can be secured by a locknut operated from an upper side of the pin array plate.
  • FIG. 7 shows a flow chart of a method 700 of processing a substrate in a vacuum processing system according to embodiments described herein.
  • the method 700 includes in box 710 loading the substrate onto a substrate support.
  • the substrate is loaded onto the substrate support with a lift pin array according to any of the embodiments described herein.
  • the substrate is processed on the substrate support in a vacuum chamber.
  • a layer is deposited on the substrate.
  • the method may further include unloading the substrate from the substrate support. Unloading of the substrate may include pushing the substrate away from the substrate support by operation of a lift pin array, for example, in a horizontal orientation of the substrate support.
  • Embodiments of the present disclosure provide one or more of the following advantages.
  • Accidental loosening of a lift pin can be avoided, particularly by securing the lift pin in a locked position.
  • the design of the lift pins does not allow the pin to come out of the pin array plate such that accidents and resulting downtimes of the tool can be avoided.
  • Collision of lift pins by relative movements can be avoided or reduced due to the reduced bending and increased perpendicularity.
  • Easy assembly and maintenance, particularly from the top side of a pin array plate can be provided. Maintenance and installation are faster, which increases the manufacturing time of the tool. Further, cleaning of the lift pin is easier as compared to threaded lift pin assemblies.

Abstract

L'invention concerne une broche de levage pour charger ou décharger un substrat dans un système de traitement de substrat. La broche de levage comprend un corps de broche de levage s'étendant le long d'une direction de longueur de la broche de levage, le corps de broche de levage ayant une pluralité de régions s'étendant le long de la direction de la longueur. La pluralité de régions comprend une région de support, une zone de douille située au-dessous de la région de support, une région de blocage en rotation au-dessous de la région de support, et une région de verrouillage transversale au-dessous de la région de support et au-dessous de la région de blocage en rotation.
PCT/EP2021/056525 2021-03-15 2021-03-15 Broche de levage, ensemble broche de levage, plaque de réseau de broches, réseau de broches de levage, système de traitement, procédé de traitement de substrat, et procédé de maintien de réseau de broches de levage WO2022194342A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/EP2021/056525 WO2022194342A1 (fr) 2021-03-15 2021-03-15 Broche de levage, ensemble broche de levage, plaque de réseau de broches, réseau de broches de levage, système de traitement, procédé de traitement de substrat, et procédé de maintien de réseau de broches de levage
CN202190001011.5U CN220856548U (zh) 2021-03-15 2021-03-15 用于装载或卸载基板的升降销、升降销组件和升降销阵列、用于升降销阵列的销阵列板及用于处理基板的处理系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2021/056525 WO2022194342A1 (fr) 2021-03-15 2021-03-15 Broche de levage, ensemble broche de levage, plaque de réseau de broches, réseau de broches de levage, système de traitement, procédé de traitement de substrat, et procédé de maintien de réseau de broches de levage

Publications (1)

Publication Number Publication Date
WO2022194342A1 true WO2022194342A1 (fr) 2022-09-22

Family

ID=74947393

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2021/056525 WO2022194342A1 (fr) 2021-03-15 2021-03-15 Broche de levage, ensemble broche de levage, plaque de réseau de broches, réseau de broches de levage, système de traitement, procédé de traitement de substrat, et procédé de maintien de réseau de broches de levage

Country Status (2)

Country Link
CN (1) CN220856548U (fr)
WO (1) WO2022194342A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1283544A2 (fr) * 2001-08-08 2003-02-12 Asm Japan K.K. Chambre de réaction pour le traitement de plaquettes semiconductrices
US20060156981A1 (en) * 2005-01-18 2006-07-20 Kyle Fondurulia Wafer support pin assembly
US20090314211A1 (en) * 2008-06-24 2009-12-24 Applied Materials, Inc. Big foot lift pin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1283544A2 (fr) * 2001-08-08 2003-02-12 Asm Japan K.K. Chambre de réaction pour le traitement de plaquettes semiconductrices
US20060156981A1 (en) * 2005-01-18 2006-07-20 Kyle Fondurulia Wafer support pin assembly
US20090314211A1 (en) * 2008-06-24 2009-12-24 Applied Materials, Inc. Big foot lift pin

Also Published As

Publication number Publication date
CN220856548U (zh) 2024-04-26

Similar Documents

Publication Publication Date Title
TWI645495B (zh) 基板載體及應用其之處理系統與傳輸基板之方法
JP7166858B2 (ja) 半導体プロセスモジュールのためのインサイチュ装置
US9343347B2 (en) Portable electrostatic chuck carrier for thin substrates
US9076991B2 (en) Mask management system and method for OLED encapsulation
TW201334213A (zh) 處理太陽能電池晶圓的靜電吸盤
TW202217030A (zh) 基片處理模組及移動工件的方法
WO2022194342A1 (fr) Broche de levage, ensemble broche de levage, plaque de réseau de broches, réseau de broches de levage, système de traitement, procédé de traitement de substrat, et procédé de maintien de réseau de broches de levage
US11183411B2 (en) Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
CN115552581A (zh) 热控制的盖堆叠部件
KR20190132096A (ko) 기판이송장치
WO2023041185A1 (fr) Élément de support de cadre de masque, masque d'exclusion de bord, élément de cadre de masque, support de substrat, appareil de traitement de substrat et procédé de fabrication d'un ou de plusieurs dispositifs sur un substrat
CN112824558B (zh) 成膜装置、使用成膜装置的成膜方法及电子器件的制造方法
WO2020187412A1 (fr) Système de traitement, support pour transporter un substrat dans un système de traitement et procédé de transport d'un support
WO2022174919A1 (fr) Support de substrat, procédé de traitement d'un substrat, et système de traitement
CN117730403A (zh) 将腔室体积隔离成具有内部晶片移送能力的处理体积的方法
KR20220163422A (ko) 증착 장치, 프로세싱 시스템 및 광전자 디바이스의 층을 제조하는 방법
KR20210013191A (ko) 홀더, 적어도 2개의 홀더들을 포함하는 캐리어, 장치들 및 방법들
WO2013179481A1 (fr) Nacelle de montage de substrat

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21712775

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21712775

Country of ref document: EP

Kind code of ref document: A1