WO2022193336A1

WO2022193336A1 - Wafer carrier identification card replacement device

Info

Publication number: WO2022193336A1
Application number: PCT/CN2021/082312
Authority: WO
Inventors: 季爱民; 张宁娜; 孙勤; 蒋孝恩
Original assignee: 台湾积体电路制造股份有限公司; 台积电(中国)有限公司
Priority date: 2021-03-19
Filing date: 2021-03-23
Publication date: 2022-09-22
Also published as: CN213424953U

Abstract

The present application provides a wafer carrier identification card replacement device, comprising a support, a clamping assembly, a first detection assembly, and a second detection assembly. The support extends in a longitudinal direction. The clamping assembly is disposed on the support, and comprises a first clamping member and a second clamping member which are used in cooperation. At least one of the first clamping member and the second clamping member is slidably arranged relative to the support in the longitudinal direction. The first detection assembly is provided between the first clamping member and the second clamping member to test first parameter information of an identification card, the first parameter information comprising information data of whether an identification card exists between the first clamping member and the second clamping member. The second detection assembly is movably disposed on the support in the longitudinal direction, and moves to the clamping assembly according to the first parameter information to obtain second parameter information of the identification card. The wafer carrier identification card replacement device provided by the present application can not only replace the manual operation and reduce the cost, but also improve the accuracy of the clamped position of the identification card, thereby improving the replacement efficiency of the identification card.

Description

Wafer carrier identification plate changer

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Chinese Patent Application No. 202120570604.5, filed on March 19, 2021, entitled "Wafer Carrier Identification Plate Replacement Device", the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the field of semiconductor technology, and in particular, to a wafer carrier identification plate replacement device.

Background technique

Wafer refers to the substrate (also called substrate) on which semiconductor transistors or integrated circuits are fabricated. Because it is a crystalline material, its shape is circular, so it is called a wafer. In recent years, the semiconductor industry has been vigorously developed in China, and the automation of the wafer production line has become an important factor in improving the output and quality of wafers.

In the current wafer production line, the identification plate of the wafer carrier needs to be manually replaced manually. The operator needs to pull out the identification plate from the previous wafer carrier and install it in another clean wafer carrier, which is inefficient. And the labor cost is high.

SUMMARY OF THE INVENTION

The embodiment of the present application provides a wafer carrier identification plate replacement device, so as to at least solve the problem of high cost and low efficiency caused by the need to manually replace the existing wafer carrier identification plate.

The embodiment of the present application provides a wafer carrier identification plate replacement device, including:

a bracket, extending along the longitudinal direction;

A clamping assembly, which is arranged on the bracket, the clamping assembly includes a first clamping member and a second clamping member that are used together, at least one of the first clamping member and the second clamping member The device is slidably arranged relative to the bracket along the longitudinal direction to adjust the distance between the first clamping member and the second clamping member;

The first detection component is arranged between the first clamping member and the second clamping member to detect the first parameter information of the identification plate, and the first parameter information includes the first clamping member and the second clamping member. Whether there is information data of the identification plate between the second clamping members;

The second detection component is disposed on the support along the longitudinal movement, the second detection component moves to the clamping component according to the first parameter information to obtain the second parameter information of the identification plate, the The second parameter information includes preset position information of the identification tag between the first clamping member and the second clamping member.

In some embodiments, the second detection assembly includes two first pressure-sensitive elements laterally disposed on both sides of the bracket, and the first pressure-sensitive elements can move from an initial position to the longitudinal direction from an initial position. Clamp assembly.

In some embodiments, the second detection assembly further includes a first driving member, the first driving member is disposed on the bracket and drives the first pressure-sensitive element to reciprocate linearly along the longitudinal direction.

In some embodiments, a third detection component is further included, and the third detection component is located in at least one of the first clamping member and the second clamping member to detect the third parameter information of the identification plate , the third parameter information includes the information data of whether the wafer carrier leaves the replacement device; when the first parameter information is that there is an identification plate between the first clamping piece and the second clamping piece , and the third parameter information is that when the wafer carrier leaves the replacement device, the second detection component moves to the clamping component.

In some embodiments, the third detection component includes a photosensitive element, and the photosensitive element is disposed on the side of the first holder facing the wafer carrier, and/or the photosensitive element is disposed on the The second holder faces the side of the wafer carrier.

In some embodiments, the first detection assembly includes a second pressure-sensitive element for detecting the first parameter information of the identification plate.

In some embodiments, the first clamp includes a first clamp portion and a first stop portion connected at an angle, and the second clamp includes a second clamp portion and a second clamp portion connected at an angle A stopper part, the first clamping part and the second clamping part are disposed opposite to each other along the longitudinal direction, and are used for clamping the identification plate.

In some embodiments, the clamping assembly further includes a driving assembly, the driving assembly includes a second driving member and a connecting member, the connecting member is connected to the first clamping member, and the second driving member passes through The connecting member drives the first clamping member to approach or move away from the second clamping member; the second clamping member is fixedly arranged on the bracket, and is located between the first clamping member and the second clamping member. Between the two detection components.

In some embodiments, a side of the bracket facing away from the second clamping member is provided with a groove, and the connecting member is located in the groove and can slide therein.

In some embodiments, the connecting member is provided with an escape hole extending through itself in the thickness direction, and the first detection component is located in the escape hole.

The wafer carrier identification plate replacement device provided by the embodiment of the present application can not only replace the labor, realize the clamping and release of the identification plate, and reduce the cost, but also can detect the identification plate by setting the first detection component and the second detection component. Whether it is clamped and whether the clamping position is correct, the accuracy of the clamped position of the identification plate is improved, thereby improving the replacement efficiency of the identification plate. In addition, the improvement of the accuracy of the clamping position of the identification plate can greatly improve the success rate of subsequent identification plates inserted into the clean wafer carrier, and reduce the friction between the identification plate and the wafer carrier caused by the deviation of the clamping position. friction to ensure accurate mating of the tag and wafer carrier.

Description of drawings

Features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

1 is a schematic structural diagram of a wafer carrier identification plate replacement device according to an embodiment of the present application;

Fig. 2 is the enlarged schematic diagram of A place in Fig. 1;

3 is a rear view of the wafer carrier identification plate replacement device shown in FIG. 1;

FIG. 4 is a schematic structural diagram of the wafer carrier identification plate replacement device, the wafer carrier and the manipulator shown in FIG. 1 in a working state.

Reference number:

1. Replace the device;

11. Bracket;

12, clamping assembly; 121, first clamping part; 122, second clamping part; 123, first clamping part; 124, first stop part; 125, second clamping part; 126, second 127, the second driving member; 128, the connecting member; 129, the avoidance hole;

13. The first detection component;

14. The second detection assembly; 141, the first pressure-sensitive element; 142, the first driving member;

15. Photosensitive element;

2. Signs;

3. Wafer carrier;

4. Mechanical arm;

X, landscape; Y, portrait.

Detailed ways

The embodiments of the present application will be described in further detail below with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present application by way of example, but should not be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

In the description of this application, it should be noted that, unless otherwise specified, the meaning of "plurality" is two or more; the terms "upper", "lower", "left", "right", "inner", " The orientation or positional relationship indicated by "outside" is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a reference to the present application. Application restrictions. Furthermore, the terms "first," "second," "third," etc. are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

Orientation words appearing in the following description are all directions shown in the drawings, and do not limit the specific structure of the present application. In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a connectable connection. Detachable connection, or integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

For a better understanding of the present application, the embodiments of the present application are described below with reference to FIGS. 1 to 4 .

FIG. 1 is a schematic structural diagram of a wafer carrier identification plate replacement device according to an embodiment of the present application. Referring to FIG. 1 , the wafer carrier identification plate replacement device provided by the embodiment of the present application includes a bracket 11 , a clamping component 12 , a first detection component 13 and a second detection component 14 . The bracket 11 is extended in the longitudinal direction Y. The clamping assembly 12 is arranged on the bracket 11 , and the clamping assembly 12 includes a first clamping member 121 and a second clamping member 122 that are used together. At least one of the first clamping member 121 and the second clamping member 122 is along the The longitudinal direction Y is slidably disposed relative to the bracket 11 to adjust the distance between the first clamping member 121 and the second clamping member 122 . The first detection component 13 is arranged between the first clamping member 121 and the second clamping member 122 to detect the first parameter information of the identification plate, and the first parameter information includes the first clamping member 121 and the second clamping member Whether there is information data of the sign between 122. The second detection component 14 moves along the longitudinal direction Y and is disposed on the bracket 11. The second detection component 14 moves to the clamping component 12 according to the first parameter information to obtain the second parameter information of the identification plate. The second parameter information includes the identification plate in the first clamp. Preset position information between the holder 121 and the second holder 122 .

The wafer carrier identification plate replacement device of the embodiment of the present application can not only replace labor, realize the clamping and releasing of identification plates, and reduce costs, but also can detect the identification by setting the first detection component 13 and the second detection component 14 . Whether the card is clamped and whether the clamping position is correct, thereby improving the accuracy of the clamping position of the identification card, thereby improving the replacement efficiency of the identification card. In addition, the improvement of the accuracy of the clamping position of the identification plate can greatly improve the success rate of subsequent identification plates inserted into the clean wafer carrier, and reduce the friction between the identification plate and the wafer carrier caused by the deviation of the clamping position. friction to ensure accurate mating of the tag and wafer carrier.

In some optional embodiments, the first detection component 13 includes a second pressure-sensitive element, and the second pressure-sensitive element is used to detect the first parameter information of the identification plate. Wherein, the second pressure sensitive element is a pressure sensor. The second pressure-sensitive element is disposed on the bracket 11 between the first clamping part 121 and the second clamping part 122 , and the second pressure-sensitive element may protrude from the surface of the bracket 11 . Of course, the second pressure-sensitive element can also be arranged on other structures, as long as it can detect whether there is information data of the identification plate between the first clamping member 121 and the second clamping member 122 . When the identification plate is clamped, the protruding second pressure-sensitive element will be squeezed, and then the second pressure-sensitive element sends out information data that the identification plate has been clamped.

In some other optional embodiments, the first detection component 13 includes a ranging sensor, and the ranging sensor detects the first parameter information of the identification plate. When the distance measuring sensor detects that the distance from the identification plate is within a certain range, it will send out information data that the identification plate has been clamped. For example, within the range of 0-5mm, it means that the identification plate has been clamped. Of course, the first detection component 13 may also include other types of detection elements, which can detect whether there is information data of the identification plate between the first clamping member 121 and the second clamping member 122.

In some optional embodiments, the second detection assembly 14 includes two first pressure-sensitive elements 141 disposed on both sides of the bracket 11 along the transverse direction X, and the first pressure-sensitive elements 141 can move from the initial position along the longitudinal direction Y to clamping component 12. Wherein, the initial position of the first pressure-sensitive element 141 is located in the middle or lower part of the bracket 11, the clamping assembly 12 is located at the upper part of the bracket 11, the first pressure-sensitive element 141 moves upward from the initial position to both sides of the clamping assembly 12, and then Obtain information about whether the identification plate is in the preset position between the first clamping member 121 and the second clamping member 122, that is, whether the identification plate is between the two first pressure-sensitive elements 141, if the identification plate is skewed, then One of the first pressure-sensitive elements 141 will touch the identification plate when it rises to the clamping assembly 12 , that is, the first pressure-sensitive element 141 will touch the identification plate when it rises to the second clamping member 122 , and the first pressure The sensitive element 141 will send out a signal that the sign is skewed when sensed. Of course, the second detection component 14 may also include other types of detection elements, which can detect whether the identification plate is in a preset position. The preset position refers to the set area where the sign is located, which can be determined according to actual needs. In this embodiment, the preset position refers to the area between the two first pressure-sensitive elements 141 .

In some other optional embodiments, the second detection component 14 includes a distance measuring sensor, which detects the distance from the distance sensor to the left side or the right side of the identification plate at the place where it rises to the clamping assembly 12, and obtains whether the identification plate is in the first position. Information data of the preset position between the clamping member 121 and the second clamping member 122 .

In some optional embodiments, the second detection assembly 14 further includes a first driving member 142 . The first driving member 142 is fixedly disposed on the bracket 11 and drives the first pressure-sensitive element 141 to reciprocate linearly along the longitudinal direction Y. The first driving member 142 is an electric cylinder, and of course, it can also be other components capable of driving the first pressure-sensitive element 141 to rise or fall, such as a hydraulic cylinder. The first driving member 142 drives the first pressure-sensitive element 141 to rise or fall, so that the first pressure-sensitive element 141 is in a position that does not affect the movement of the robot and the wafer carrier when not in use, so as to avoid interference.

In some optional embodiments, the wafer carrier identification plate replacement device further includes a third detection component, and the third detection component is located in at least one of the first clamping member 121 and the second clamping member 122 to detect the identification The third parameter information of the card, the third parameter information includes information data of whether the wafer carrier leaves the replacement device. When the first parameter information is that there is an identification plate between the first clamping member 121 and the second clamping member 122, and the third parameter information is that the wafer carrier leaves the replacement device, the second detection component 14 moves to the clamping component 12. Acquire second parameter information of the identification plate. By setting the third detection component, it is detected whether the wafer carrier leaves the replacement device. If the wafer carrier leaves the replacement device, and the first parameter information is that there is an identification plate between the first clamping member 121 and the second clamping member 122 , it means that the identification plate has just been removed and is on the replacement device, and it is necessary to detect whether the identification plate is skewed. At this time, the second detection component 14 is lifted up for detection without interfering with the wafer carrier.

In some optional embodiments, the third detection component includes a photosensitive element 15, and the photosensitive element 15 is fixedly disposed on the side of the second clamping member 122 facing the wafer carrier. Of course, the photosensitive element 15 may also be disposed on the side of the first holding member 121 facing the wafer carrier, or one photosensitive element 15 may be disposed on each of the first holding member 121 and the second holding member 122 . Since the wafer carriers are in close contact with the clamping assembly 12 during the process of removing or installing the identification plate, and the volume of the wafer carrier is much larger than that of the clamping assembly 12 , the wafer carriers are covered by the clamping assembly 12 . When most of the light is irradiated, the intensity of the light received by the clamping assembly 12 will become weaker. By arranging the photosensitive element 15, the light change of the clamping assembly 12 can be clearly sensed, and it can be accurately determined whether the wafer carrier leaves the replacement device. Since the second clamping member 122 is located below the first clamping member 121 , the shielded area is larger, and the photosensitive element 15 can be more clearly perceived when the photosensitive element 15 is disposed thereon. Of course, the third detection component may also include other detection elements capable of detecting whether the wafer carrier leaves the replacement device.

Please refer to FIG. 2 below. FIG. 2 is an enlarged schematic view of A in FIG. 1 . In some optional embodiments, the first clamping member 121 includes a first clamping portion 123 and a first stopper portion 124 connected at an angle. , the second clamping member 122 includes a second clamping portion 125 and a second stopper portion 126 connected at an angle, and the first clamping portion 123 and the second clamping portion 125 are arranged opposite to each other along the longitudinal direction Y for clamping the identification Card. By providing the first stopper portion 124 and the second stopper portion 126, the identification plate is prevented from slipping out. Optionally, the first clamping portion 123 and the first stopping portion 124 are connected at a right angle, and the second clamping portion 125 and the second stopping portion 126 are connected at a right angle. Of course, the first clamping portion 123 and the first stopper portion 124, the second clamping portion 125 and the second stopper portion 126 can also be connected at other angles, as long as the first stopper portion 124 and the second stopper portion are satisfied The stop function of the portion 126 is sufficient.

In some optional embodiments, the first stopper portion 124 and the first clamping portion 123 are integrally formed, and the second stopper portion 126 and the second clamping portion 125 are integrally formed. Of course, the first stopper portion 124 and the first clamping portion 123, and the second stopper portion 126 and the second clamping portion 125 may also adopt other connection methods, such as bonding.

Please refer to FIG. 3 below. FIG. 3 is a rear view of the wafer carrier identification plate replacement device shown in FIG. 1 . In some optional embodiments, the clamping assembly 12 further includes a driving assembly, the driving assembly includes a second driving member 127 and a connecting member 128 , the second driving member 127 is fixedly disposed on the bracket 11 , and the connecting member 128 is connected to the second driving member The output end of 127 is fixedly connected to the first clamping member 121 . The second clamping member 122 is fixedly disposed on the bracket 11 and is located between the first clamping member 121 and the second detection component 14 , and the first clamping member 121 is located above the bracket 11 . The second driving member 127 drives the first clamping member 121 to approach or move away from the second clamping member 122 via the connecting member 128 . The position of the second clamping member 122 is fixed, and the identification plate 2 is clamped by the first clamping member 121 being close to or away from the second clamping member 122 , which is more compact and reasonable in structure and more convenient to use.

In some optional embodiments, the second driving member 127 is an electric cylinder. Of course, the second driving member 127 may also be other components capable of driving the first clamping member 121 to perform linear motion, such as an electric telescopic rod, a pneumatic cylinder, a hydraulic cylinder, and the like.

In some optional embodiments, the second clamping portion 125 is screwed to the bracket 11 . The two adopt a detachable connection method, which is convenient to adjust the position of the second clamping part 125, and then the clamping distance between the first clamping part 123 and the second clamping part 125 can be adjusted according to different sizes of the sign 2 , to improve the applicability of the replacement device.

In other optional embodiments, the connecting member 128 is connected to the second clamping member 122 located below, the first clamping member 121 located above is fixedly disposed, and the second driving member 127 drives the second clamping member 122 to approach or away from the first clamping member 121 .

In some optional embodiments, a groove is provided on the side of the bracket 11 away from the second clamping member 122 , the connecting member 128 is located in the groove and slides in the groove, and the upper end of the connecting member 128 is fixedly connected to the first clamping portion 123 . By arranging a groove on the bracket 11, so that the connecting piece 128 is slidably arranged therein, it can not only provide guidance for the up and down movement of the connecting piece 128, improve the stability of the movement, but also reduce the width of the first clamping part 123, avoid Due to the large width of the first clamping portion 123 due to the thickness of the bracket 11 , the material is wasted.

Further, the connecting member 128 is provided with an escape hole 129 penetrating itself in the thickness direction, and the first detection component 13 is located in the escape hole 129 . Wherein, the connecting member 128 is a plate-shaped member, of course, it can also be a block-shaped member or a strip-shaped member.

The identification plate replacement device of the embodiment of the present application includes a control device, and the control device is connected to the first detection component 13, the second detection component 14, the third detection component and the driving component, so as to control the time when the above components perform corresponding actions and receive corresponding Information data and processing. Wherein, the control device may be located on the support 11, or may be integrated into the control system of the wafer production line.

Next, please refer to FIG. 4 to describe one of the working processes of the wafer carrier identification plate replacement device according to the embodiment of the present application. FIG. 4 shows the wafer carrier identification plate replacement device, the wafer carrier and the manipulator shown in FIG. 1 . Schematic diagram of the structure in working state.

The robot 4 clamps the wafer carrier 3 with the identification plate 2 to be replaced to the front of the clamping assembly 12 and inserts the identification plate 2 between the first clamping part 123 and the second clamping part 125 , and the robot 4 drives the wafer carrier 3 The tool 3 moves downward and is inserted into the locking groove formed by the second stopper portion 126 , the second clamping portion 125 and the bracket 11 , and then the second driving member 127 drives the first clamping member 121 via the connecting member 128 Moving downward, the first clamping part 123 and the second clamping part 125 clamp the identification plate 2 , and the manipulator 4 drives the wafer carrier 3 to move downward, so that the accommodating groove on the wafer carrier 3 is separated from the identification plate 2 , the manipulator 4 leaves with the wafer carrier 3 to be replaced; at this time, the first detection component 13 detects whether the identification plate 2 is clamped, and after it is determined to be clamped, the third detection component detects whether the wafer carrier 3 leaves the replacement. Device 1, if it leaves, the control device controls the first driving member 142 to drive the first pressure-sensitive element 141 to rise to the clamping assembly 12, and detects the movement of the identification plate 2 between the first clamping member 121 and the second clamping member 122. According to the preset position information, if the position of the identification plate 2 is correct, the first pressure sensitive element 141 descends to the initial position.

The manipulator 4 brings a clean wafer carrier 3 to the replacement device 1, and drives the wafer carrier 3 to move from bottom to top, so that the accommodating groove is inserted into both sides of the identification plate 2 from bottom to top. , the second driving member 127 drives the first clamping member 121 to rise and releases the identification plate 2, the robot 4 drives the wafer carrier 3 to rise for a certain distance, so that the identification plate 2 is separated from the second clamping member 122, and then the robot arm 4 leads the The clean wafer carrier 3 of the identification plate 2 retreats and leaves, and the replacement of the identification plate 2 is completed.

While the application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for parts thereof without departing from the scope of the application, particularly, provided that there is no structural conflict , each technical feature mentioned in each embodiment can be combined in any manner. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

A wafer carrier identification plate replacement device, comprising:

a bracket, extending along the longitudinal direction;

A clamping assembly, which is arranged on the bracket, the clamping assembly includes a first clamping member and a second clamping member that are used together, at least one of the first clamping member and the second clamping member The device is slidably arranged relative to the bracket along the longitudinal direction to adjust the distance between the first clamping member and the second clamping member;

The first detection component is arranged between the first clamping member and the second clamping member to detect the first parameter information of the identification plate, and the first parameter information includes the first clamping member and the second clamping member. Whether there is information data of the identification plate between the second clamping members;

The second detection component is disposed on the support along the longitudinal movement, the second detection component moves to the clamping component according to the first parameter information to obtain the second parameter information of the identification plate, the The second parameter information includes preset position information of the identification tag between the first clamping member and the second clamping member.
The wafer carrier identification plate replacement device according to claim 1, wherein the second detection assembly comprises two first pressure-sensitive elements laterally disposed on both sides of the bracket, the first pressure-sensitive elements The clamping assembly can be moved in the longitudinal direction from an initial position.
The wafer carrier identification plate replacement device according to claim 2, wherein the second detection component further comprises a first driving member, the first driving member is disposed on the bracket and drives the first pressure The sensitive element performs linear reciprocating motion along the longitudinal direction.
The wafer carrier identification plate replacement device of claim 1, further comprising a third detection assembly located in at least one of the first holder and the second holder , to detect the third parameter information of the identification plate, the third parameter information includes the information data of whether the wafer carrier leaves the replacement device;

When the first parameter information is that the identification plate exists between the first clamping member and the second clamping member, and the third parameter information is that the wafer carrier leaves the replacement device , the second detection component moves to the clamping component.
The wafer carrier identification plate replacement device according to claim 4, wherein the third detection component comprises a photosensitive element, and the photosensitive element is disposed on a side of the first clamping member facing the wafer carrier. and/or, the photosensitive element is disposed on the side of the second clamping member facing the wafer carrier.
The wafer carrier identification plate replacement device of claim 1, wherein the first detection assembly includes a second pressure-sensitive element for detecting the first pressure-sensitive element of the identification plate Parameter information.
The wafer carrier identification plate changing device of claim 1 , wherein the first clamping member includes a first clamping portion and a first stop portion connected at an angle, and the second clamping member includes The second clamping part and the second stopping part are connected at an angle, and the first clamping part and the second clamping part are arranged opposite to each other along the longitudinal direction, and are used for clamping the identification plate.
The wafer carrier identification plate changing device of claim 7, wherein the clamping assembly further comprises a driving assembly including a second driving member and a connecting member, the connecting member being connected to the first driving member a clamping member, the second driving member drives the first clamping member to approach or move away from the second clamping member through the connecting member;

The second clamping member is fixedly arranged on the bracket, and is located between the first clamping member and the second detection component.
The wafer carrier identification plate changing device according to claim 8, wherein a side of the bracket facing away from the second clamping member is provided with a groove, and the connecting member is located in the groove and can be inserted into the groove. which slides.
The wafer carrier identification plate replacement device according to claim 8 , wherein the connecting member is provided with an avoidance hole penetrating through itself in the thickness direction, and the first detection component is located in the avoidance hole.