WO2022192368A1 - Systèmes et méthodes pour améliorer la précision dans des procédés d'impression en trois dimensions - Google Patents

Systèmes et méthodes pour améliorer la précision dans des procédés d'impression en trois dimensions Download PDF

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Publication number
WO2022192368A1
WO2022192368A1 PCT/US2022/019511 US2022019511W WO2022192368A1 WO 2022192368 A1 WO2022192368 A1 WO 2022192368A1 US 2022019511 W US2022019511 W US 2022019511W WO 2022192368 A1 WO2022192368 A1 WO 2022192368A1
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WO
WIPO (PCT)
Prior art keywords
build platform
reflective element
light
signal
printing
Prior art date
Application number
PCT/US2022/019511
Other languages
English (en)
Inventor
Alton Hugh Phillips
Eric Peter Goodwin
Goldie Lynne GOLDSTEIN
Stephen Paul RENWICK
Michael Birk Binnard
Patrick Shih CHANG
Matthew David Rosa
Jonathan Kyle Wells
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Publication of WO2022192368A1 publication Critical patent/WO2022192368A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/31—Calibration of process steps or apparatus settings, e.g. before or during manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/22—Driving means
    • B22F12/226—Driving means for rotary motion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/30—Platforms or substrates
    • B22F12/37—Rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90—Means for process control, e.g. cameras or sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/227—Driving means
    • B29C64/241—Driving means for rotary motion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245—Platforms or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • Certain three-dimensional (3D) printing systems and methods utilize one or more rotating substrates to move a part or component that is being assembled on a 3D printing build platform between a plurality of stations. At each of the stations, one or more steps or operations in a 3D printing process are performed. Each station may perform a different step or operation in the 3D printing process. For instance, one station may be configured to deposit powder (for instance, metal powder) on the 3D printing build platform as it passes by the station. Another station may be configured to selectively direct energy (for instance, from a laser or an electron beam) to particular locations on the 3D printing build platform to heat the powder. Other stations may be configured to perform a variety of 3D printing or metrology operations.
  • powder for instance, metal powder
  • Another station may be configured to selectively direct energy (for instance, from a laser or an electron beam) to particular locations on the 3D printing build platform to heat the powder.
  • Other stations may be configured to perform a variety of 3D printing or metrology operations.
  • the use of such rotating platforms may allow for the more rapid manufacture of a single large part or component or the parallel manufacture of multiple parts or components.
  • a variety of effects may lead to positioning or orientation errors between the substrate and the 3D printing build platform, between the substrate and the stations, or between the 3D printing build platform and the station.
  • the energy deposited by the energy source may heat the substrate or the 3D printing build platform to temperatures near or above 1,000 degrees Celsius (°C).
  • Such heating may cause thermal expansion that may lead to positioning errors between the substrate and the 3D printing build platform or between the 3D printing build platform and the stations. Uncorrected, such positioning errors may significantly compromise the 3D printing process. Accordingly, presented herein are systems and methods for improving accuracy in 3D printing processes.
  • FIG. 1 shows a schematic depicting an exemplary system for correcting positioning errors in a three-dimensional (3D) printing process.
  • FIG. 2 shows a schematic depicting a first variation of an exemplary first sensing module for use with the system described herein with respect to FIG. 1.
  • FIG. 3 shows a schematic depicting a second variation of an exemplary first sensing module for use with the system described herein with respect to FIG. 1
  • FIG. 4 shows a schematic depicting a third variation of an exemplary first sensing module for use with the system described herein with respect to FIG. 1.
  • FIG. 5 shows an exemplary partially reflective mirror for use with the systems described herein with respect to FIGs. 2-4.
  • FIG. 6 shows an exemplary frustum of a cone for use with the systems described herein with respect to FIGs. 2-4.
  • FIG. 7 shows a schematic depicting an exemplary 3D printing build platform comprising at least one fiducial marker and at least one slot.
  • FIG. 8 shows a schematic depicting an exemplary system for correcting 3D printing building platform positioning errors.
  • FIG. 9 shows a first example of a sensor signal.
  • FIG. 10 shows a second example of a sensor signal.
  • FIG. 11 shows a flowchart depicting an exemplary method for correcting positioning errors in a 3D printing process.
  • FIG. 12 shows a block diagram of a computer system for correcting positioning errors in a 3D printing process.
  • FIG. 13 shows curves acquired from a simulation of a 3D printing platform.
  • FIG. 14 shows curves of FIG. 13 with the linear component removed.
  • FIG. 15 shows noise levels attributable to enforcing an assumption of linearity.
  • the invention can be implemented in numerous ways, including as a process; an apparatus; a system; a composition of matter; a computer program product embodied on a computer readable storage medium; and/or a processor, such as a processor configured to execute instructions stored on and/or provided by a memory coupled to the processor.
  • these implementations, or any other form that the invention may take, may be referred to as techniques.
  • the order of the steps of disclosed processes may be altered within the scope of the invention.
  • a component such as a processor or a memory described as being configured to perform a task may be implemented as a general component that is temporarily configured to perform the task at a given time or a specific component that is manufactured to perform the task.
  • the term “processor” refers to one or more devices, circuits, and/or processing cores configured to process data, such as computer program instructions.
  • the term “or” shall convey both disjunctive and conjunctive meanings.
  • the phrase “A or B” shall be interpreted to include element A alone, element B alone, and the combination of elements A and B.
  • Recent work in three-dimensional (3D) printing has allowed the production of additively manufactured metal parts having geometries that are difficult or impossible to manufacture using traditional subtractive manufacturing processes such as milling or lathing.
  • Such 3D printed metal parts may have material properties (such as tensile strength, density, and the like) that are substantially similar to those of metal parts manufactured using the traditional subtractive manufacturing processes.
  • Such 3D printing processes often utilize directed energy, such as laser light or an electron beam to selectively heat metal powders and thereby form layers of a metal part or component.
  • Certain 3D printing systems and methods utilize one or more rotating substrates to move a part or component that is being assembled on a 3D printing build platform between a plurality of stations. At each of the stations, one or more steps or operations in a 3D printing process are performed. Each station may perform a different step or operation in the 3D printing process. For instance, one station may be configured to deposit metal powder on the 3D printing build platform as it passes by the station. Another station may be configured to selectively direct energy to particular locations on the 3D printing build platform to heat the powder. Other stations may be configured to perform a variety of 3D printing or metrology operations. The use of such rotating platforms may allow for the more rapid manufacture of a single large part or component or the parallel manufacture of multiple parts or components.
  • the energy deposited by the energy source may heat the substrate or the 3D printing build platform to temperatures near or above 1,000 degrees Celsius (°C). Such heating may cause thermal expansion that may lead to positioning errors between the substrate and the 3D printing build platform or between the 3D printing build station and the stations. Uncorrected, such positioning errors may significantly compromise the 3D printing process.
  • a first sensing module may determine a position or an orientation of the substrate.
  • the first sensing module may utilize a variety of light sources, reflective elements, optical detectors, and controllers to determine the position or the orientation of the substrate.
  • a second sensing module may determine a position or an orientation of the 3D printing build platform relative to the position or the orientation of the substrate.
  • the second sensing module may employ one or more fiducial markers to determine information indicative of the position or the orientation of the 3D printing build platform.
  • the position or orientation information determined by the first or second sensing modules may be used to correct positioning or orientation errors in the 3D printing process.
  • the position information may be used to determine a positioning or an orientation error in the substrate or the 3D printing build platform.
  • the positioning error may then be compensated by, for example, altering the locations on the 3D printing build platform to which the energy is directed in response to the positioning or orientation error.
  • the positioning or orientation error may be compensated by controlling the location of the energy deposited onto the 3D printing build platform.
  • the system comprises: a substrate comprising at least one three-dimensional (3D) printing build platform coupled to the substrate; a first drive module configured to move the substrate; a second drive module configured to move the 3D printing build platform relative to the substrate; a first sensing module configured to generate a first signal indicative of a position or an orientation of the substrate; and a second sensing module configured to generate a second signal indicative of a position or an orientation of the at least one 3D printing build platform relative to the position or the orientation of the substrate.
  • the at least one 3D printing build platform is rotatably coupled to the substrate.
  • the first drive module is configured to rotate the substrate.
  • the second drive module is configured to rotate the at least one 3D printing build platform. In some embodiments, the second drive module is configured to rotate the at least one 3D printing build platform such that the orientation of the at least one 3D printing build platform is substantially unchanged while the substrate rotates.
  • the first drive module comprises a first motor configured to rotate the substrate and the second drive module comprises a second motor configured to rotate the at least one 3D printing build platform. In some embodiments, the second drive module comprises a timing belt or one or more gears coupled to the first drive module.
  • the first sensing module comprises: at least one first light source configured to project first light; a reflective element configured to receive the first light from the at least one first light source and to reflect the first light; at least one first optical detector configured to receive the first light reflected from the reflective element and to output the first signal; and a first controller configured to receive the first signal and to determine the position or the orientation of the substrate based on the first signal.
  • the first light source is configured to project the first light toward a center of the reflective element.
  • the first light comprises substantially collimated light.
  • the reflective element comprises a partially reflective element.
  • the position or the orientation of the substrate are selected from the group consisting of: a distance from the at least one first light source to the reflective element, a lateral displacement of the at least one first light source relative to the reflective element, a tip of the reflective element, a tilt of the reflective element, a rotational position of the reflective element, or any combination thereof.
  • the at least one first light source and the at least one first optical detector are configured to produce a first laser triangulation signal; and the first controller is configured to receive the first laser triangulation signal and to determine a distance from the at least one first light source to the reflective element based on the first laser triangulation signal.
  • the first sensing module further comprises a beamsplitter configured to receive the first light from the at least one first light source and to direct a portion of first light to the reflective element as first tip or tilt light;
  • the reflective element is configured to receive the first tip or tilt light from the beamsplitter and to reflect the first tip or tilt light;
  • the at least one first optical detector is configured to receive the first tip or tilt light from the reflective element and to output a first tip or tilt signal;
  • the first controller is configured to receive the first tip or tilt signal and to determine a tip or tilt of the reflective element based on the first tip or tilt signal.
  • the first sensing module further comprises a lens configured to receive the first light reflected from the reflective element;
  • the at least one first optical detector comprises a single pixel detector configured to receive the first light from the lens and to output the first signal; and the first controller is configured to receive the first signal and to determine a lateral displacement of the at least one first light source relative to the reflective element based on the first signal.
  • the partially reflective element comprises a plurality of reflective regions and a plurality of non-reflective regions, the plurality of reflective regions configured to permit the first light to reflect from the reflective element and the plurality of non-reflective regions configured to block the first light from reflecting from the reflective element;
  • the first signal comprises a plurality of reflective signals and a plurality of non-reflective signals;
  • the controller is configured to receive the plurality of reflective signals and the plurality of non- reflective signals and to determine the lateral displacement based on the plurality of reflective signals and the plurality of non-reflective signals.
  • the controller is further configured to determine a rotational position of the reflective element based on the plurality of reflective signals and the plurality of non-reflective signals.
  • the partially reflective element comprises a star mirror.
  • the at least one first light source and the at least one first optical detector are configured to produce a first lateral position laser triangulation signal; and the first controller is configured to receive the first lateral position laser triangulation signal and to determine a lateral displacement of the at least one first light source relative to the reflective element.
  • the reflective element comprises a frustum of a cone.
  • the frustum comprises a reflective upper surface.
  • the frustum comprises a sloping side surface configured to receive the first light and to reflect the first light.
  • the at least one 3D printing build platform comprises a plurality of 3D printing build platforms.
  • the at least one 3D printing platform comprises at least one fiducial marker.
  • the at least one fiducial marker comprises a plurality of fiducial markers.
  • the at least one fiducial marker is located upon the at least one 3D printing build platform.
  • the at least one fiducial marker is etched or cut into the at least one 3D printing build platform.
  • the at least one fiducial marker is cut through the at least one 3D printing build platform.
  • the at least one fiducial marker is located near an outside edge of the at least one 3D printing build platform.
  • the at least one fiducial marker comprises a shape selected from the group consisting of: a line, a curvilinear form, an arc, a chevron, a polygon, a triangle, a square, a pentagon, a hexagon, and a circle.
  • the 3D printing build platform further comprises at least one slot configured to substantially prevent a 3D printing powder from contacting the at least one fiducial marker.
  • the second sensing module comprises a laser triangulation sensor or an optical imaging sensor and the second signal comprises a second laser triangulation signal or a second optical imaging signal.
  • the second sensing module further comprises a second controller coupled to the second laser triangulation sensor or the second optical imaging sensor and configured to determine a positioning error of the 3D printing build platform based upon the second signal.
  • the system further comprises a powder source configured to deposit 3D printing powder on the at least one 3D printing build platform.
  • the powder source is configured to deposit the 3D printing powder on the at least one 3D printing build platform when the at least one 3D printing build platform is located under the powder source.
  • the system further comprises an energy source configured to deliver energy to the at least one 3D printing build platform.
  • the energy source is configured to deliver energy to a portion of the at least one 3D printing build platform when the at least one 3D printing build platform is located under the energy source.
  • the energy source comprises a laser or an electron beam.
  • a method for correcting positioning errors in a 3D printing process comprises: moving a substrate comprising at least one three-dimensional (3D) printing build platform coupled to the substrate; moving the 3D printing build platform relative to the substrate; generating a first signal indicative of a position or an orientation of the substrate; and generating a second signal indicative of a position or an orientation of the at least one 3D printing build platform relative to the position or the orientation of the substrate.
  • the at least one 3D printing build platform is rotatably coupled to the substrate.
  • moving the substrate comprises rotating the substrate.
  • moving the at least one 3D printing build platform comprises rotating the at least one 3D printing build platform.
  • rotating the at least one 3D printing build platform comprises rotating the at least one 3D printing build platform such that the orientation of the at least one 3D printing build platform is substantially unchanged while the substrate rotates.
  • generating the first signal comprises: projecting first light; using a reflective element configured to receive the first light and to reflect the first light; receiving the first light reflected from the reflective element and outputting the first signal; and receiving the first signal and determining the position or the orientation of the substrate based on the first signal.
  • the reflective element comprises a partially reflective element.
  • the position or the orientation of the substrate are selected from the group consisting of: a distance from the substrate to the reflective element, a lateral displacement of the substrate relative to the reflective element, a tip of the reflective element, a tilt of the reflective element, a rotational position of the reflective element, or any combination thereof.
  • the first signal comprises a first laser triangulation signal; and determining the distance from the substrate to the reflective element comprises determining the distance from the substrate to the reflective element based on the first laser triangulation signal.
  • generating the first signal comprises: receiving the first light and directing a portion of first light to the reflective element as first tip or tilt light; using the reflective element to receive the first tip or tilt light from the beamsplitter and to reflect the first tip or tilt light; receiving the first tip or tilt light from the reflective element and to output a first tip or tilt signal; and receiving the first tip or tilt signal and determining a tip or tilt of the reflective element based on the first tip or tilt signal.
  • generating the first signal comprises: using a lens to receive the first light reflected from the reflective element; using a single pixel detector to receive the first light from the lens and to output the first signal; and receiving the first signal and determining a lateral displacement of the substrate relative to the reflective element based on the first signal.
  • the partially reflective element comprises a plurality of reflective regions and a plurality of non-reflective regions, the plurality of reflective regions configured to permit the first light to reflect from the reflective element and the plurality of non- reflective regions configured to block the first light from reflecting from the reflective element;
  • the first signal comprises a plurality of reflective signals and a plurality of non- reflective signals; and the lateral displacement is determined based on the plurality of reflective signals and the plurality of non-reflective signals.
  • the method further comprises determining a rotational position of the reflective element based on the plurality of reflective signals and the plurality of non-reflective signals.
  • the partially reflective element comprises a star mirror.
  • the reflective element comprises a frustum of a cone.
  • the frustum comprises a reflective upper surface.
  • the frustum comprises a sloping side surface configured to receive the first light and to reflect the first light.
  • the at least one 3D printing build platform comprises a plurality of 3D printing build platforms.
  • the at least one 3D printing platform comprises at least one fiducial marker.
  • the at least one fiducial marker comprises a plurality of fiducial markers. In some embodiments, the at least one fiducial marker is located upon the at least one 3D printing build platform. In some embodiments, the at least one fiducial marker is etched or cut into the at least one 3D printing build platform. In some embodiments, the at least one fiducial marker is cut through the at least one 3D printing build platform. In some embodiments, the at least one fiducial marker is located near an outside edge of the at least one 3D printing build platform.
  • the at least one fiducial marker comprises a shape selected from the group consisting of: a line, a curvilinear form, an arc, a chevron, a polygon, a triangle, a square, a pentagon, a hexagon, and a circle.
  • the 3D printing build platform further comprises at least one slot configured to substantially prevent a 3D printing powder from contacting the at least one fiducial marker.
  • the second signal comprises a second laser triangulation signal or a second optical imaging signal.
  • the method further comprises determining a positioning error of the 3D printing build platform based upon the second signal.
  • the method further comprises depositing 3D printing powder on the at least one 3D printing build platform.
  • the method further comprises depositing the 3D printing powder on the at least one 3D printing build platform when the at least one 3D printing build platform is located under a powder source.
  • the method further comprises comprising delivering energy to the at least one 3D printing build platform.
  • the method further comprises delivering energy to a portion of the at least one 3D printing build platform when the at least one 3D printing build platform is located under an energy source.
  • the energy source comprises a laser or an electron beam.
  • the systems and methods described herein generally utilize one or more sensing modules to determine a position or an orientation of a substrate or of a 3D printing build platform.
  • a first sensing module may determine a position or an orientation of the substrate.
  • the first sensing module may utilize a variety of light sources, reflective elements, optical detectors, and controllers to determine the position or the orientation of the substrate.
  • a second sensing module may determine a position or an orientation of the 3D printing build platform relative to the position or the orientation of the substrate.
  • the second sensing module may employ one or more fiducial markers to determine information indicative of the position or the orientation of the 3D printing build platform.
  • the position or orientation information determined by the first or second sensing modules may be used to correct positioning or orientation errors in the 3D printing process.
  • the position information may be used to determine a positioning or an orientation error in the substrate or the 3D printing build platform.
  • the positioning error may then be compensated by, for example, altering the locations on the 3D printing build platform to which the energy is directed in response to the positioning or orientation error.
  • the positioning or orientation error may be compensated by controlling the location of the energy deposited onto the 3D printing build platform.
  • FIG. 1 shows a schematic depicting an exemplary system 100 for correcting positioning errors in a 3D printing process.
  • the system comprises a substrate 110 comprising at least one 3D printing build platform 120 located thereon.
  • the at least one 3D printing build platform is configured to support the production of a 3D printed part or component thereon.
  • the at least one 3D printing build platform comprises the 3D printing build platform 700 described herein with respect to FIG. 7.
  • the system 100 comprises a first drive module 130 configured to rotate the substrate.
  • the first drive module is configured to rotate the substrate such that the 3D printing build platform passes sequentially between a plurality of stations (not shown in FIG. 1), as described herein.
  • the first drive module comprises a first motor configured to rotate the substrate.
  • the system comprises a second drive module 140 configured to rotate the 3D printing build platform.
  • the second drive module is configured to rotate the 3D printing build platform such that an orientation of the 3D printing build platform is substantially unchanged while the substrate rotates.
  • the second drive module comprises a second motor configured to rotate the 3D printing build platform.
  • the second drive module comprises a timing belt coupled to the first drive module.
  • the second drive module comprises one or more gears coupled to the first drive module.
  • the system comprises a first sensing module 150.
  • the first sensing module is configured to generate a first signal indicative of a position or an orientation of the substrate.
  • the first sensing module 150 comprises any one, two, or three of the first sensing modules 200, 300, and 400 described herein with respect to FIGs. 2, 3, and 4, respectively.
  • the system comprises a second sensing module 160.
  • the second sensing module is configured to generate a second signal indicative of a position or an orientation of the at least one 3D printing build platform relative to the position or orientation of the substrate.
  • the second sensing module comprises the second sensing module described herein with respect to FIG. 8.
  • the system comprises a powder source 170.
  • the powder source is configured to deposit 3D printing powder on the at least one 3D printing build platform.
  • the powder source is configured to deposit the 3D printing powder on the at least one 3D printing build platform when the at least one 3D printing build platform is located under the powder source.
  • the powder source comprises a station of the plurality of stations described herein.
  • the system comprises an energy source 180.
  • the energy source is configured to deliver energy to the at least one 3D printing build platform.
  • the energy source is configured to deliver energy to a portion of the at least one 3D printing build platform when the at least one 3D printing build platform is located under the energy source.
  • the energy source comprises a laser source.
  • the energy source comprises an electron beam source.
  • the energy source comprises a station of the plurality of stations described herein.
  • the substrate may comprise any number of 3D printing build platforms.
  • the substrate comprises a plurality of 3D printing build platforms located thereon.
  • each 3D printing build platform of the plurality is configured to support the manufacture of a part or component of a plurality of parts or components thereon.
  • each 3D printing build platform is configured to support the manufacture of a sub-part of sub-component of a part or component thereon.
  • the substrate comprises at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more 3D printing build platforms. In some embodiments, the substrate comprises at most about 10, 9,
  • the substrate comprises a number of 3D printing build platforms that is within a range defined by any two of the preceding values.
  • the system may comprise any number of first sensing modules.
  • the system comprises at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more first sensing modules.
  • the system comprises at most about 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 first sensing modules.
  • the system comprises a number of first sensing modules that is within a range defined by any two of the preceding values.
  • the system may comprise any number of second sensing modules. In some embodiments, the system comprises at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more second sensing modules.
  • the system comprises at most about 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 second sensing modules. In some embodiments, the system comprises a number of second sensing modules that is within a range defined by any two of the preceding values.
  • the system may instead utilize linear motion.
  • the first drive module is configured to move the substrate in a linear manner.
  • the first drive module is configured to move the substrate such that the 3D printing build platform passes sequentially between a plurality of stations.
  • the first drive module is omitted from the system.
  • FIG. 2 shows a schematic depicting a first variation 200 of an exemplary first sensing module for use with the system 100 described herein with respect to FIG. 1.
  • the first variation comprises at least one first light source 210.
  • the first light source is configured to project first light 212.
  • the first light comprises substantially collimated light.
  • the substrate is located within a chamber (not shown in FIG. 2), such as a gas-tight chamber or a vacuum chamber.
  • the first light source is located within the chamber.
  • the first light source is located outside the chamber.
  • the chamber comprises at least one optical window (not shown in FIG. 2) configured to permit the first light to pass therethrough.
  • the first variation comprises a reflective element 220.
  • the reflective element is configured to receive the first light from the at least one first light source and to reflect reflected first light 222.
  • the reflective element is coupled to the substrate.
  • the reflective element is substantially centered on a center of the substrate.
  • the first light source is configured to project the first light toward the center of the substrate or the center of the reflective element.
  • the first light source is configured to project the first light toward a position located away from the center of the substrate or the center of the reflective element.
  • the first variation comprises at least one first optical detector 230.
  • the at least one optical sensor comprises an optical imaging sensor, such as a charge coupled device (CCD) camera or complementary metal oxide semiconductor (CMOS) camera.
  • the first optical detector is configured to receive the reflected first light from the reflective element and to output a first signal 232.
  • the first signal is indicative of the position or the orientation of the substrate.
  • the position or the orientation of the substrate are selected from the group consisting of: a distance from the at least one first light source to the reflective element (or to the substrate), a lateral displacement of the at least one first light source relative to the reflective element (or to the substrate), a tip of the reflective element (or of the substrate), a tilt of the reflective element (or of the substrate), a rotational position of the reflective element (or of the substrate), or any combination thereof.
  • the first variation comprises a first controller 240.
  • the first controller is coupled to the first optical detector.
  • the first controller is configured to receive the first signal from the first optical detector and to determine the position or the orientation of the substrate based on the first signal.
  • the first controller comprises a computer system, such as a computer system described herein with respect to FIG. 12.
  • the first light source and the first optical detector are configured to produce a first laser triangulation signal.
  • the first laser triangulation signal comprises a specular laser triangulation signal.
  • the first laser triangulation signal comprises a diffuse laser triangulation signal.
  • the first light source and the first optical detector are components of or integrated into a first laser triangulation sensor.
  • the first laser triangulation sensor comprises a specular laser triangulation sensor.
  • the first laser triangulation sensor comprises a diffuse laser triangulation sensor.
  • the first light source and the first optical detector are standalone components of the first variation.
  • the first controller is configured to receive the first laser triangulation signal.
  • the first laser triangulation is indicative of the distance from the light source to the reflective element (or to the substrate). In some embodiments, such a distance is referred to as a z position of the reflective element (or of the substrate).
  • the first controller is configured to receive the first laser triangulation signal and to determine the z position based on the first laser triangulation signal.
  • the z position is determined with an accuracy of at least about 1 micrometer (pm), 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 20 pm, 30 pm, 40 pm, 50 pm, or more, at most about 50 pm, 40 pm, 30 pm, 20 pm, 10 pm, 9 pm, 8 pm, 7 pm, 6 pm, 5 pm, 4 pm, 3 pm, 2 pm, 1 pm, or less, or an accuracy that is within a range defined by any two of the preceding values.
  • pm micrometer
  • the z position is determined using a reflective element comprising a planar mirror. In some embodiments, the z position is determined using a reflective element comprising a partially reflective element. In some embodiments, the partially reflective element has a reflectivity of at least about 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 20%, 30%, 40%, 50%, 60%, 70%, 80%, 90%, or more, at most about 90%, 80%, 70%, 60%, 50%, 40%, 30%, 20%, 10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1%, or less, or a reflectivity that is within a range defined by any two of the preceding values.
  • the partially reflective element comprises a plurality of reflective regions and a plurality of non -reflective regions, as described herein with respect to FIG. 5.
  • the reflectivity of the partially reflective element may be defined as a ratio of the surface area of the reflecting regions to the total surface area of the partially reflective element.
  • the partially reflective element comprises a star mirror.
  • the partially reflective element comprises a frustum of a cone, as described herein with respect to FIG. 6.
  • the first variation is configured to determine the lateral displacement of the at least one first light source relative to the reflective element (or to the substrate).
  • the first laser triangulation signal may be referred to as a “first lateral position laser triangulation signal.”
  • the first controller determines the lateral displacement based on the first lateral position laser triangulation signal based on the principles described herein with respect to FIG. 6.
  • use of a single first light source and a single first optical detector yields a single first lateral position laser triangulation signal and thus a single measurement of the lateral displacement along a single axis.
  • the first variation may use two, three, four, or more first light sources and two, three, four, or more first optical detectors to yield two, three, four, or more lateral position laser triangulation signals and thus two, three, four, or more measurements of the lateral displacement along two, three, four, or more axes.
  • the first controller is configured to receive the two, three, four, or more lateral position laser triangulation signals and to determine the two, three, four, or more measurements of the lateral displacement based on the two, three, four, or more lateral position laser triangulation signals.
  • FIG. 3 shows a schematic depicting a second variation 300 of an exemplary first sensing module for use with the system 100 described herein with respect to FIG. 1.
  • the second variation comprises many of the elements of the first variation described herein with respect to FIG. 2.
  • the second variation comprises at least one first light source 210 configured to project first light 212.
  • the first light source may comprise any first light source described herein with respect to FIG. 2.
  • the first light may comprise any first light described herein with respect to FIG. 2.
  • the second variation comprises a reflective element 220.
  • the reflective element comprises any reflective element described herein with respect to FIG. 2.
  • the second variation comprises a first optical detector 230.
  • the first optical detector comprises any first optical detector described herein with respect to FIG. 2.
  • the second variation comprises a first controller 240.
  • the first controller comprises any first controller described herein with respect to FIG. 2.
  • the second variation comprises a beamsplitter 310.
  • the beamsplitter is configured to receive the first light from the first light source and to direct a portion 312 of the first light to the reflective element.
  • the portion is directed to a location near the center of the reflective element.
  • a portion of the first light that is not directed to the reflective element is directed to a beam block (not shown in FIG. 3) or to an optical power meter (not shown in FIG. 3).
  • first tip light when the second variation is being used to measure a tip (a rotation q c about the x-axis) of the reflective element (or of the substrate), the portion of the first light that is directed to the reflective element is referred to as “first tip light.” In some embodiments, when the second variation is being used to measure a tilt (a rotation q g about the y-axis) of the reflective element (or of the substrate), the portion of the first light that is directed to the reflective element is referred to as “first tilt light.” In some embodiments, when the second variation is being used to measure both tip and tilt, the portion of the first light that is directed to the reflective element is referred to as “first tip or tilt light.”
  • the reflective element is configured to receive the first tip or tilt light from the beamsplitter and to reflect reflected first tip or tilt light 322.
  • the optical detector 230 is configured to receive the reflected first tip or tilt light (via the beamsplitter) and to output a first tip or tilt signal 332 based thereon.
  • the optical detector comprises an imaging sensor.
  • a tip or tilt of the reflective element (or of the substrate) alters a position on the imaging sensor at which the reflected first tip or tilt light is received.
  • the first tip or tilt signal thus comprises the position on the imaging sensor at which the reflected first tip or tilt light is received.
  • the first tip or tilt signal is indicative of a tip or tilt of the reflective element (or of the substrate).
  • the first controller is coupled to the optical detector. In some embodiments, the first controller is configured to receive the first tip or tilt signal. In some embodiments, the first controller is configured to receive the first tip or tilt signal and to determine a tip or tilt of the reflective element (or of the substrate) based on the first tip or tilt signal. In some embodiments, the first controller is configured to determine the tip or the tilt based on trigonometric calculations that include the z position determined using the first variation described herein with respect to FIG. 2.
  • the tip or the tilt is determined with an accuracy of at least about 1 arc second, 2 arc seconds, 3 arc seconds, 4 arc seconds, 5 arc seconds, 6 arc seconds, 7 arc seconds, 8 arc seconds, 9 arc seconds, 10 arc seconds, or more, at most about 10 arc seconds, 9 arc seconds, 8 arc seconds, 7 arc seconds, 6 arc seconds, 5 arc seconds, 4 arc seconds, 3 arc seconds, 2 arc seconds, 1 arc seconds, or less, or an accuracy that is within a range defined by any two of the preceding values.
  • the tip or tilt is determined using a reflective element comprising a planar mirror. In some embodiments, the tip or tilt is determined using a reflective element comprising a partially reflective element. In some embodiments, the partially reflective element comprises any partially reflective element described herein with respect to FIG. 2. For instance, in some embodiments, the partially reflective element comprises a plurality of reflective regions and a plurality of non-reflective regions, as described herein with respect to FIG. 5. In some embodiments, the partially reflective element comprises a star mirror. In some embodiments, the partially reflective element comprises a frustum of a cone, as described herein with respect to FIG. 6.
  • the second variation is configured to determine only a tip or only a tilt of the reflective element (or of the substrate). However, in some embodiments, the second variation is configured to determine both a tip and a tilt of the reflective element (or of the substrate).
  • the first light source, the beamsplitter, and the optical detector are configured to make simultaneous measurements of the tip and the tilt. In some embodiments, the first light source, the beamsplitter, and the optical detector are duplicated to make simultaneous or independent measurements of the tip and tilt.
  • FIG. 4 shows a schematic depicting a third variation 400 of an exemplary first sensing module for use with the system 100 described herein with respect to FIG. 1.
  • the third variation comprises many of the elements of the second variation described herein with respect to FIG. 3.
  • the third variation comprises at least one first light source 210 configured to project first light 212.
  • the first light source may comprise any first light source described herein with respect to FIG. 3.
  • the first light may comprise any first light described herein with respect to FIG. 3.
  • the third variation comprises a beamsplitter 310.
  • the beamsplitter is configured to receive the first light from the first light source and to direct a portion 312 of the first light to the reflective element 220. In some embodiments, the portion is directed to a location on the reflective element that is displaced from the center of the reflective element. In some embodiments, a portion of the first light that is not directed to the reflective element (not shown in FIG. 4) is directed to a beam block (not shown in FIG. 4) or to an optical power meter (not shown in FIG. 4). In some embodiments, the beamsplitter comprises any beamsplitter described herein with respect to FIG. 3. In some embodiments, the reflective element comprises any reflective element described herein with respect to FIG. 3.
  • the third variation comprises at least one first optical detector 230.
  • the first optical detector comprises a single pixel detector (SPD).
  • the third variation comprises a first controller 240.
  • the first controller comprises any first controller described herein with respect to FIG. 3.
  • the third variation comprises a lens 410.
  • the lens is configured to receive the reflected first light from the reflective element.
  • the lens is configured to direct the reflected first light to the SPD.
  • the lens is configured to direct the reflected first light to the SPD even if the reflective element (or the substrate) is subject to a tip or tilt.
  • the SPD outputs a first signal 432 in response to receiving the reflected first light.
  • the beamsplitter is configured to direct a portion of the first light to the reflective element and to pass the reflected first light to the SPD.
  • the first controller is coupled to the SPD.
  • the first controller is configured to receive the first signal and to determine a lateral displacement or a rotational position of the first light source relative to the reflective element (or to the substrate) based on the first signal.
  • the lateral displacement comprises a displacement along the x axis or the y axis.
  • the rotational position comprises a rotation q z of the substrate around its z axis.
  • the lateral displacement or the rotational position is determined using a partially reflective mirror and the principles described herein with respect to FIG. 5.
  • the lateral position is determined with an accuracy of at least about 1 micrometer (pm), 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, 10 pm, 20 pm, 30 pm, 40 pm, 50 pm, 60 pm, 70 pm, 80 pm, 90 pm, 100 pm, or more, at most about 100 pm, 90 pm, 80 pm, 70 pm, 60 pm, 50 pm, 40 pm, 30 pm, 20 pm, 10 pm, 9 pm, 8 pm, 7 pm, 6 pm, 5 pm,
  • the third variation may comprise any number of light sources and any number of SPDs.
  • the third variation may comprise first light sources configured to direct first source light to a position to the right of (+x direction) a center of the reflective element and to a position above (+y direction) the center of the reflective element, the reflections of which are received by two SPDs.
  • such a configuration allows determination of the displacements along the x-axis and along the y-axis.
  • the third variation comprises first light sources configured to direct first source light to positions to the right of (+x direction), above (+y direction), to the left of (-x direction), and below (-y direction) the center of the reflective element, the reflections of which are received by four SPDs.
  • such a configuration allows determination of the displacements along the x-axis, the y-axis, the -x-axis, and the -y-axis. In some embodiments, performing such measurements allows greater confidence in the determination of the lateral displacement. For instance, if the displacement obtained by the x- axis measurement is roughly equal to the displacement obtained by the -x-axis, this may allow confidence that the substrate has actually been laterally displaced along the x-axis or the -x-axis.
  • any number of light sources and SPDs may be used to measure any number of displacements along any axis, or along any off-axis position.
  • FIG. 5 shows an exemplary partially reflective mirror 500 for use with the systems described herein with respect to FIGs. 2-4.
  • the partially reflective mirror comprises a star mirror.
  • the partially reflective mirror may comprise a plurality of reflective regions 510 and a plurality of non-reflective regions 520.
  • the plurality of reflective regions are configured to permit the first light (not shown in FIG. 5) to reflect from the partially reflective element.
  • the plurality of non- reflective regions are configured to block the first light from reflective from the partially reflective elements.
  • the partially reflective mirror comprises at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, or more reflective regions or non-reflective regions, at most about 100, 90, 80, 70, 60, 50, 40, 30, 20, 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 reflective regions or non-reflective regions, or a number of reflective regions or non-reflective regions that is within a range defined by any two of the preceding values.
  • the partially reflective element is configured to rotate.
  • the first signal comprises a time-varying signal comprising a series of reflective signals and non-reflective signals.
  • the series of reflective signals manifest as periods of relatively high intensity as measured by the SPD and received by the first controller.
  • the series of non-reflective signals manifest as periods of relatively low intensity as measured by the SPD and received by the first controller.
  • the first controller is therefore configured to determine the lateral displacement by comparing a ratio of the time for which the first signal is of relatively high intensity to the time for which it is of relatively low intensity.
  • the first controller is configured to determine the rotational position by counting the number of high intensity signals (or the number of low intensity signals). Thus, in some embodiments, the first controller is configured to determine the lateral displacement of the first light source relative to the reflective element (or to the substrate) or the rotational position of the reflective element (or of the substrate) based on the plurality of reflective signals and the plurality of non-reflective signals.
  • FIG. 6 shows an exemplary frustum 600 of a cone for use with the systems described herein with respect to FIGs. 2-4.
  • the frustum comprises an upper surface 610 and a sloping side surface 620.
  • the upper surface comprises a reflective upper surface.
  • the reflective upper surface is used to determine the distance from the at least one first light source (not shown in FIG. 6) to the reflective element (or the substrate, not shown in FIG. 6), the tip of the reflective element (or the substrate), or the tilt of the reflective element (or the substrate), in accordance with the principles described herein with respect to FIGs. 2-4.
  • the sloping side surface is reflective.
  • the sloping side surface is diffusely reflective.
  • the sloping side surface is partially reflective.
  • the sloping side surface is used to determine the lateral displacement of the at least one first light source relative to the reflective element (or of the substrate), as described herein with respect to FIG. 2.
  • the sloping side surface is configured to receive the first light (not shown in FIG. 6) from the at least one first light source and to completely, diffusely, or partially reflect the first light to the at least one first optical detector (not shown in FIG. 6).
  • the first light strikes the sloping side surface at a location, is completely, diffusely, or partially reflected from the location, and is received by the at least one first optical detector.
  • the at least one first light source and the at least one first optical detector are configured to produce a first lateral position laser triangulation signal determined by the location on the sloping side surface where the first light hits.
  • the location at which the first light strikes the sloping side surface changes, thereby changing the first lateral position laser triangulation signal.
  • the first lateral position laser triangulation signal is indicative of the lateral position of the reflective element (or of the substrate).
  • the first controller is configured to receive the first lateral position laser triangulation signal and to determine the lateral displacement based on the first lateral position laser triangulation signal in accordance with the principles described herein.
  • use of a single first light source and a single first optical detector yields a single first lateral position laser triangulation signal and thus a single measurement of the lateral displacement along a single axis.
  • the first variation may use two, three, four, or more first light sources and two, three, four, or more first optical detectors to yield two, three, four, or more lateral position laser triangulation signals and thus two, three, four, or more measurements of the lateral displacement along two, three, four, or more axes.
  • two first light sources are configured to direct first light to the right of (+x direction) and above (+y direction) the reflective upper surface of the frustum, the reflections of which are received by two first optical detectors.
  • such a configuration allows determination of the displacements along the x-axis and the y-axis.
  • four first light source are configured to direct first light to positions to the right of (+x direction), above (+y direction), to the left of (-x direction), and below (-y direction) the reflective upper surface, the reflections of which are received by four first optical detectors.
  • such a configuration allows determination of the displacements along the x-axis, the y-axis, the -x-axis, and the -y-axis. In some embodiments, performing such measurements allows greater confidence in the determination of the lateral displacement. For instance, if the displacement obtained by the x-axis measurement is roughly equal to the displacement obtained by the -x-axis, this may allow confidence that the substrate has actually been laterally displaced along the x-axis or the -x-axis.
  • any number of light sources and optical detectors may be used to measure any number of displacements along any axis, or along any off-axis position.
  • FIG. 7 shows a schematic depicting an exemplary 3D printing build platform 700 comprising at least one fiducial marker and at least one slot.
  • the 3D printing build platform comprises at least one fiducial marker 710.
  • the at least one fiducial marker is located upon the at least one 3D printing build platform.
  • the at least one fiducial marker is etched or cut into the at least one 3D printing build platform.
  • the at least one fiducial marker is cut through the at least one 3D printing build platform.
  • the at least one fiducial marker comprises a shape such as a line, a curvilinear form, an arc, a chevron, a polygon, a triangle, a square, a pentagon, a hexagon, or a circle.
  • the at least one fiducial marker comprises at least about 2, 3, 4, 5, 6, 7, 8, 9, 10, or more edges.
  • the at least one fiducial marker comprises at most about 10, 9, 8, 7, 6, 5, 4, 3, or 2 edges.
  • the at least one fiducial marker comprises a number of edges that is within a range defined by any two of the preceding values.
  • the at least one fiducial marker is located near an outside edge of the at least one 3D printing build platform. In some embodiments, the at least one fiducial marker is located a distance from the outside edge of at least about 1 millimeter (mm), 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm, 80 mm, 90 mm, 100 mm, or more.
  • mm millimeter
  • the at least one fiducial marker is located a distance from the outside edge of at most about 100 mm, 90 mm, 80 mm, 70 mm, 60 mm, 50 mm, 40 mm, 30 mm, 20 mm, 10 mm, 9 mm, 8 mm, 7 mm, 6 mm, 5 mm, 4 mm, 3 mm, 2 mm, 1 mm, or less.
  • the at least one fiducial marker is located a distance from the outside edge that is within a range defined by any two of the preceding values.
  • the at least one fiducial marker shares at least one edge with the outside edge.
  • the at least one 3D printing build platform may comprise any number of fiducial markers.
  • the at least one 3D printing build platform comprises a plurality of fiducial markers.
  • the at least one 3D printing build platform comprises at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more fiducial markers.
  • the at least one 3D printing build platform comprises at most about 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 fiducial markers.
  • the at least one 3D printing build platform comprises a number of fiducial markers that is within a range defined by any two of the preceding values.
  • the plurality of fiducial markers are positioned asymmetrically, such that their edges cross the sensor at an angle to their direction of motion.
  • the angle is at least about 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, or more.
  • the angle is at most about 75 degrees, 70 degrees, 65 degrees, 60 degrees, 55 degrees, 50 degrees, 45 degrees, 40 degrees, 35 degrees, 30 degrees, 25 degrees, 20 degrees, 15 degrees, or less.
  • the angle within a range defined by any two of the preceding values.
  • the angle is within a range from about 15 degrees to about 75 degrees, from about 20 degrees to about 70 degrees, from about 25 degrees to about 65 degrees, from about 30 degrees to about 60 degrees, from about 35 degrees to about 55 degrees, or from about 40 degrees to about 50 degrees
  • the 3D printing build platform comprises at least one slot 720.
  • the at least one slot is configured to substantially prevent a 3D printing powder from contacting the at least one fiducial marker.
  • the at least one slot is configured to substantially prevent the 3D printing powder from accumulating on top of the at least one fiducial marker.
  • the at least one slot is configured to substantially prevent the 3D printing powder from accumulating within the at least one fiducial marker.
  • the at least one slot is etched or cut into the at least one 3D printing build platform.
  • the at least one slot is cut through the at least one 3D printing build platform.
  • the at least one 3D printing build platform may comprise any number of slots.
  • the at least one 3D printing build platform comprises a plurality of slots.
  • the at least one 3D printing build platform comprises at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more slots.
  • the at least one 3D printing build platform comprises at most about 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 slots.
  • the at least one 3D printing build platform comprises a number of slots that is within a range defined by any two of the preceding values.
  • FIG. 8 shows a schematic depicting an exemplary system 800 for correcting
  • the system 800 comprises many of the elements of system 100 described herein with respect to FIG. 1, such as the substrate 110, the 3D printing build platform 120, the first drive module 130, the second drive module 140, the first sensing module 150, the powder source 170, and the energy source 180.
  • the system 800 comprises a second sensing module 160 comprising a first sensor 810a, a second sensor 810b, and a second controller 820.
  • the 3D printing build platform comprises first, second, third, and fourth fiducial markers 830a, 830b, 830c, and 830d, respectively.
  • the first, second, third, and fourth fiducial markers are similar to any of the fiducial markers 710 described herein with respect to FIG. 7.
  • the first sensor or the second sensor is configured to detect signals indicative of a position of the first, second, third, or fourth fiducial marker.
  • the first sensor or the second sensor comprises an optical sensor.
  • the optical sensor comprises a laser triangulation sensor.
  • the laser triangulation sensor comprises a specular laser triangulation sensor.
  • the laser triangulation sensor comprises a diffuse laser triangulation sensor.
  • the optical sensor comprises an optical imaging sensor, such as a charge coupled device (CCD) camera or complementary metal oxide semiconductor (CMOS) camera.
  • CCD charge coupled device
  • CMOS complementary metal oxide semiconductor
  • the second controller is coupled to the first sensor or the second sensor. In some embodiments, the second controller is configured to determine a positioning error of the 3D printing build platform based upon the signal indicative of the position of the first, second, third, or fourth fiducial marker, as described herein (for example, with respect to FIGs. 9 and 10). In some embodiments, the second controller comprises a computer system, such as a computer system described herein with respect to FIG. 12.
  • the substrate rotates to move the 3D printing build platform sequentially along a path comprising first, second, third, and fourth positions 830, 840, 850, and 860, respectively.
  • the first fiducial marker enters a first field of view (FOV) of the first sensor.
  • the second fiducial marker enters the first FOV.
  • the third fiducial marker enters a second FOV of the second sensor.
  • the fourth fiducial marker enters the second FOV.
  • the first and second fiducial markers when the first and second fiducial markers (and any part or component being built on the 3D printing build platform) are out of the first FOV, light emitted by the first sensor hits the 3D printing build platform at a substantially constant first angle and is reflected or scattered to the first sensor at a substantially constant second angle.
  • the first sensor registers a substantially constant difference between the first and second angles as a substantially constant distance from the first sensor to the 3D printing build platform.
  • the second sensor when the third and fourth fiducial markers and, respectively, (and any part or component being built on the 3D printing build platform) are out of the second FOV, light emitted by the second sensor hits the 3D printing build platform at a substantially constant third angle and is reflected or scattered to the second sensor at a substantially constant fourth angle.
  • the second sensor registers a substantially constant difference between the third and fourth angles as a substantially constant distance from the second sensor to the 3D printing build platform.
  • the first sensor may produce a substantially constant signal for times other than those at which the first fiducial marker, second fiducial marker, or part or component passes within the first FOV and the second sensor may produce a substantially constant signal for times other than those at which the third fiducial marker, fourth fiducial marker 130d, or part or component passes within the second FOV.
  • the first or second fiducial marker when the first or second fiducial marker (or any part or component being built on the 3D printing build platform) enters the first FOV, light emitted by the first sensor hits the first or second fiducial markers at a fifth angle. In some embodiments, light reflected or scattered from the first or second fiducial markers is received by the first sensor at a sixth angle, which may be different from the fifth angle. In some embodiments, the fifth and sixth angles are different from the first and second angles. Thus, the first sensor may produce a change in signal when the first fiducial marker, second fiducial marker, or part or component is within the first FOV.
  • the second sensor may produce a change in signal when the third fiducial marker, fourth fiducial marker, or part or component is within the second FOV.
  • the fifth, sixth, seventh, or eighth angles are at least about 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, or more. In some embodiments, the fifth, sixth, seventh, or eighth angles are at most about 75 degrees, 70 degrees, 65 degrees, 60 degrees, 55 degrees, 50 degrees, 45 degrees, 40 degrees, 35 degrees, 30 degrees, 25 degrees, 20 degrees, 15 degrees, or less. In some embodiments, the fifth, sixth, seventh, or eighth angles are within a range defined by any two of the preceding values.
  • the fifth, sixth, seventh, or eighth angles are within a range from about 15 degrees to about 75 degrees, from about 20 degrees to about 70 degrees, from about 25 degrees to about 65 degrees, from about 30 degrees to about 60 degrees, from about 35 degrees to about 55 degrees, or from about 40 degrees to about 50 degrees.
  • the system may comprise any number of sensors.
  • the system comprises at least about 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or more sensor.
  • the system comprises at most about 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 sensors.
  • the system comprises a number of sensors that is within a range defined by any two of the preceding values.
  • FIG. 9 shows a first example of a sensor signal 900.
  • the sensor signal comprises a signal from the first sensor.
  • the sensor signal comprises a signal from the second sensor.
  • the signals from the first and second sensors may be combined to yield the sensor signal.
  • the first and second dips (increases in z position measured by the first or second sensor) 910 and 920, respectively, in the sensor signal correspond to the first and second fiducial markers passing within the first FOV, respectively.
  • the third and fourth dips 930 and 940, respectively, in the sensor signal correspond to the third and fourth fiducial markers passing within the second FOV, respectively.
  • the first and second dips in the sensor signal correspond to first and second edges of the first fiducial marker, second fiducial marker, third fiducial marker, or further fiducial marker passing within the first FOV.
  • the third and fourth dips in the sensor signal correspond to first and second edges of the first fiducial marker, second fiducial marker, third fiducial marker, or fourth fiducial marker passing within the second FOV.
  • the bump (decreases in z position measured by the first or second sensor) 950 in the combined signal corresponds to the part or component passing within the first or second FOV.
  • FIG. 10 shows a second example of a sensor signal 1000.
  • the sensor signal comprises a signal from the first sensor.
  • the sensor signal comprises a signal from the second sensor.
  • the signals from the first and second sensors may be combined to yield the sensor signal.
  • the first and second dips 1010 and 1020, respectively, in the sensor signal correspond to the first and second fiducial markers passing within the first FOV, respectively.
  • the third and fourth dips 1030 and 1040, respective, in the sensor signal correspond to the third and fourth fiducial markers passing within the second FOV, respectively.
  • the first and second dips in the sensor signal correspond to first and second edges of the first fiducial marker, second fiducial marker, third fiducial marker, or further fiducial marker passing within the first FOV.
  • the third and fourth dips in the sensor signal correspond to first and second edges of the first fiducial marker, second fiducial marker, third fiducial marker, or fourth fiducial marker passing within the second FOV.
  • the bump 1050 in the combined signal corresponds to the part or component passing within the first or second FOV.
  • the timings of the first, second, third, and fourth dips have changed.
  • changes in the timings of the first, second, third, and fourth dips arise due to expansion or contraction of the 3D printing build platform.
  • expansion or contraction results due to heating or cooling of the 3D printing build platform, as described herein.
  • the changes in the timings of the first, second, third, and fourth dips are indicative of an extent to which the 3D printing build platform has expanded or contracted and thus an extent to which a part or component being built on the 3D printing build platform has been displaced.
  • the timings of the first, second, third, and fourth dips are therefore used to correct for such displacements, allowing more accurate 3D printing operations even in the face of high temperature fluctuations.
  • displacements are estimated from the timings using a linear model:
  • G, t 2 , t 3 , and t 4 are the timings of the first, second, third, and fourth dips, respectively.
  • Sr is the origin error, or difference between the current position of an origin of the 3D printing build platform and a reference position. The origin error may arise due to thermal expansion or contraction of the substrate.
  • dq is the substrate angular error, or difference between the current angular position of the substrate and an angular position of the substrate that would be inferred from a programmed rotation speed of the substrate or the time of the measurement. The substrate angular error may arise due to thermal expansion or contraction of the substrate.
  • df is the 3D printing build platform angular error, or difference between the current orientation of the 3D printing build platform and an orientation of the 3D printing build platform that would be inferred from a programmed rotation speed of the 3D printing build platform or the time of the measurement.
  • the 3D printing build platform angular error may arise due to thermal expansion or contraction of the 3D printing build platform or of the substrate.
  • Ss is a 3D printing build platform radial error, or difference between the current radius of the 3D printing build platform and a reference radius.
  • the 3D printing build platform radial error may arise due to thermal expansion or contraction of the 3D printing build platform.
  • A- L , A 2 , A 3 , A 4 , B- L , B 2 , B 3 , B 4 , C , C 2 , C 3 , C 4 , D 4 , D 2 , D 3 , and D 4 are constants that depend on a geometry of the substrate, a geometry of the 3D printing build platform, a configuration of the first drive module, a configuration of the second drive module, or a position of the sensor.
  • k 4 , k 2 , k 3. and k 4 are constants that correspond to timings in a zero- error state of the system and depend on a geometry of the substrate, a geometry of the 3D printing build platform, a configuration of the first drive module, or a configuration of the second drive module.
  • Equation (1) may be rewritten and solved in vector- matrix form:
  • Equation (3) yields the origin error, substrate angular error, 3D printing build platform angular error, and 3D printing build platform radial error. These values may be used in a feedback system to, for instance, correct a location on the 3D printing build platform to which energy is directed during a 3D printing operation.
  • the at least one fiducial mark is configured to permit alignment of the 3D printing build plate within a 3D printing system.
  • the at least one fiducial mark is configured to permit alignment of the 3D printing build plate with respect to the substrate, the energy source, or the powder source.
  • the at least one fiducial mark comprises a pattern such as one or more arrays of lines, arrays of dots, triangles, rectangles, squares, polygons, or crosshairs.
  • the at least one fiducial mark comprises a knife edge.
  • the at least one fiducial mark comprises a barcode, QR code, serial number, or other mark that permits unique identification of the 3D printing build plate. In some embodiments, use of such a unique identification mark allows tracking of the processing history of a 3D printed part or component during, for instance, a volume manufacturing process.
  • the fiducial mark comprises at least one element (such as tantalum or tungsten) having an atomic weight significantly different from that of a material of which the 3D printing build plate is composed. In some embodiments, such a difference in atomic weights permits detection of the fiducial mark using an electron beam or ion beam. In some embodiments, the fiducial mark comprises at least one material having a reflectivity or absorptivity significantly different from that of the material of which the 3D printing build plate is composed. In some embodiments, such a difference in reflectivities or absorptivities permits detection of the fiducial mark using a laser or other optical source. [0091] In some embodiments, the at least one fiducial mark is applied to the top of the
  • the at least one fiducial mark is applied to the bottom of the 3D printing build platform.
  • the at least one fiducial mark is detected using a camera or other sensor at the beginning of fabrication of the 3D printed part or component or during fabrication of the 3D printed part or component.
  • the at least one fiducial mark is detected using a Faraday cup or other electron detector or ion detector to detect backscattered electrons or ions emitted as the electron beam or ion beam is scanned across the fiducial mark.
  • the at least one fiducial mark is detected using reflection or scattering of photons as the laser or other optical source is scanned across the fiducial mark.
  • the systems and principles for detecting positioning errors described herein with respect to FIGs. 1-10 are used to adjust the position of the energy emitted on the 3D printing build platform.
  • the systems and principles may be used to determine the measurements described herein (such as the distance from the at least one first light source to the reflective element, the lateral displacement of the at least one first light source relative to the reflective element, the tip of the reflective element, the tilt of the reflective element, the rotational position of the reflective element, or any combination thereof), and the position to which the energy is delivered may be corrected based on the measurements thereby permit delivery of the energy to an intended location on the 3D printing build platform.
  • FIG. 11 shows a flowchart depicting an exemplary method 1100 for correcting positioning errors in a 3D printing process.
  • a substrate is moved at 1110.
  • the substrate is rotated.
  • the substrate comprises any substrate described herein with respect to FIG. 1.
  • the substrate comprises at least one 3D printing build platform located thereon.
  • the at least one 3D printing build platform comprises any 3D printing build platform described herein with respect to FIG. 1 or FIG. 7.
  • the 3D printing build platform is moved relative to the substrate. In some embodiments, the 3D printing build platform is rotated. In some embodiments, the 3D printing build platform is rotated such that an orientation of the 3D printing build platform is substantially unchanged while the substrate rotates.
  • a first signal indicative of a position or an orientation of the substrate is generated.
  • the first signal is generated using any first sensing module described herein with respect to FIGs. 1, 2, 3, 4, 5, or 6.
  • a second signal indicative of a positioning or an orientation of the 3D printing build platform is generated.
  • the second signal is generated using any second sensing module described herein with respect to FIGs. 1, 7, or 8.
  • the method 1100, or any of operations 1110, 1120, 1130, and 1140, may be implemented using any of the systems described herein, such as any of the systems described herein with respect to FIGs. 1, 2, 3, 4, 5, 6, 7, and 8, respectively.
  • the systems comprise one or more processors and memory coupled to the one or more processors.
  • the one or more processors are configured to implement one or more operations of method 1100.
  • the memory is configured to provide the one or more processors with instructions corresponding to the operations of method 1100.
  • the instructions are embodied in a tangible computer readable storage medium.
  • FIG. 12 is a block diagram of a computer system 1200 used in some embodiments to perform portions of methods for correcting positioning errors in a 3D printing process described herein (such as operation 1110, 1120, 1130, or 1140 of method 1100 as described herein with respect to FIG. 11).
  • the computer system may be utilized as a component in systems for correcting positioning errors in a 3D printing process described herein.
  • FIG. 12 illustrates one embodiment of a general purpose computer system. Other computer system architectures and configurations can be used for carrying out the processing of the present invention.
  • Computer system 1200 made up of various subsystems described below, includes at least one microprocessor subsystem 1201.
  • the microprocessor subsystem comprises at least one central processing unit (CPU) or graphical processing unit (GPU).
  • the microprocessor subsystem can be implemented by a single-chip processor or by multiple processors.
  • the microprocessor subsystem is a general purpose digital processor which controls the operation of the computer system 1200. Using instructions retrieved from memory 1204, the microprocessor subsystem controls the reception and manipulation of input data, and the output and display of data on output devices.
  • the microprocessor subsystem 1201 is coupled bi-directionally with memory
  • primary storage 1204 which can include a first primary storage, typically a random access memory (RAM), and a second primary storage area, typically a read-only memory (ROM).
  • primary storage can be used as a general storage area and as scratch-pad memory, and can also be used to store input data and processed data. It can also store programming instructions and data, in the form of data objects and text objects, in addition to other data and instructions for processes operating on microprocessor subsystem.
  • primary storage typically includes basic operating instructions, program code, data and objects used by the microprocessor subsystem to perform its functions.
  • Primary storage devices 1204 may include any suitable computer-readable storage media, described below, depending on whether, for example, data access needs to be bi-directional or uni-directional.
  • the microprocessor subsystem 1201 can also directly and very rapidly retrieve and store frequently needed data in a cache memory (not shown).
  • a removable mass storage device 1205 provides additional data storage capacity for the computer system 1200, and is coupled either bi-directionally (read/write) or uni-directionally (read only) to microprocessor subsystem 1201.
  • Storage 1205 may also include computer-readable media such as magnetic tape, flash memory, signals embodied on a carrier wave, PC-CARDS, portable mass storage devices, holographic storage devices, and other storage devices.
  • a fixed mass storage 1209 can also provide additional data storage capacity. The most common example of mass storage 1209 is a hard disk drive.
  • Mass storage 1205 and 1209 generally store additional programming instructions, data, and the like that typically are not in active use by the processing subsystem. It will be appreciated that the information retained within mass storage 1205 and 1209 may be incorporated, if needed, in standard fashion as part of primary storage 1204 (e.g. RAM) as virtual memory.
  • bus 1206 can be used to provide access other subsystems and devices as well.
  • these can include a display monitor 1208, a network interface 1207, a keyboard 1202, and a pointing device 1203, as well as an auxiliary input/output device interface, a sound card, speakers, and other subsystems as needed.
  • the pointing device 1203 may be a mouse, stylus, track ball, or tablet, and is useful for interacting with a graphical user interface.
  • the network interface 1207 allows the processing subsystem 1201 to be coupled to another computer, computer network, or telecommunications network using a network connection as shown.
  • the processing subsystem 1201 might receive information, e.g., data objects or program instructions, from another network, or might output information to another network in the course of performing the above-described method steps.
  • Information often represented as a sequence of instructions to be executed on a processing subsystem, may be received from and outputted to another network, for example, in the form of a computer data signal embodied in a carrier wave.
  • An interface card or similar device and appropriate software implemented by processing subsystem 1201 can be used to connect the computer system 1200 to an external network and transfer data according to standard protocols.
  • method embodiments of the present invention may execute solely upon processing subsystem 1201, or may be performed across a network such as the Internet, intranet networks, or local area networks, in conjunction with a remote processing subsystem that shares a portion of the processing.
  • Additional mass storage devices may also be connected to processing subsystem 1201 through network interface 1207.
  • auxiliary I/O device interface (not shown) can be used in conjunction with computer system 1200.
  • the auxiliary I/O device interface can include general and customized interfaces that allow the processing subsystem 1201 to send and, more typically, receive data from other devices such as microphones, touch-sensitive displays, transducer card readers, tape readers, voice or handwriting recognizers, biometrics readers, cameras, portable mass storage devices, and other computers.
  • embodiments of the present invention further relate to computer storage products with a computer readable medium that contains program code for performing various computer-implemented operations.
  • the computer-readable medium is any data storage device that can store data which can thereafter be read by a computer system.
  • the media and program code may be those specially designed and constructed for the purposes of the present invention, or they may be of the kind well known to those of ordinary skill in the computer software arts.
  • Examples of computer-readable media include, but are not limited to, all the media mentioned above: magnetic media such as hard disks, floppy disks, and magnetic tape; optical media such as CD-ROM disks; magneto-optical media such as floptical disks; and specially configured hardware devices such as application-specific integrated circuits (ASICs), programmable logic devices (PLDs), and ROM and RAM devices.
  • the computer-readable medium can also be distributed as a data signal embodied in a carrier wave over a network of coupled computer systems so that the computer-readable code is stored and executed in a distributed fashion.
  • Examples of program code include both machine code, as produced, for example, by a compiler, or files containing higher level code that may be executed using an interpreter.
  • bus 1206 is illustrative of any interconnection scheme serving to link the subsystems.
  • Other computer architectures having different configurations of subsystems may also be utilized.
  • a rotating substrate and 3D printing build platform were simulated to determine the magnitude of errors resulting from assuming the linear form in Equations (1)- (6).
  • a substrate having a nominal radius of 250 millimeters (mm) was assumed.
  • the position of a 3D printing build platform on the substrate was traced until it reached a point representing a sensor position. From this, the timings t , t 2 , t 3 , and t 4 were determined.
  • Curves defining the relationships between the timings t , t 2 , t 3 , and t 4 and the errors Sr, dq, df, and Ss were determined by holding three of Sr, dq, df, and Ss constant, varying the other of Sr, dq, df, and Ss, and noting the timings. This procedure was repeated for each of Sr, dq, df, and Ss. From this, 16 curves were obtained, allowing determination of each element in the 4 x 4 matrix A or, equivalently, the 4 x 4 matrix A -1 . Approximately six million data points were collected.
  • FIG. 13 shows the curves acquired from the simulation. As shown in FIG. 13, the curves have a mostly linear character. From these curves, the matrix was determined: 1.8392 0.5838 0.4121 16675 0.1369 0.3821 0.3557 0.1253 0.6469 0.4565 0.6504 0.4599 1.0496 1.1263 1.0863 10896
  • FIG. 14 shows the curves acquired from the simulation with the linear component removed. As shown in FIG. 14, there is some nonlinear behavior that is not accounted for in the model. Therefore, further simulations were conducted to determine how substantial the error associated with the nonlinear behavior was in comparison to other sources of error within the system.
  • Embodiment 1 A system comprising: a substrate comprising at least one three-dimensional (3D) printing build platform coupled to the substrate; a first drive module configured to move the substrate; a second drive module configured to move the 3D printing build platform relative to the substrate; a first sensing module configured to generate a first signal indicative of a position or an orientation of the substrate; and a second sensing module configured to generate a second signal indicative of a position or an orientation of the at least one 3D printing build platform relative to the position or the orientation of the substrate.
  • Embodiment 2. The system of Embodiment 1, wherein the at least one 3D printing build platform is rotatably coupled to the substrate.
  • Embodiment 3 The system of Embodiment 1 or 2, wherein the first drive module is configured to rotate the substrate.
  • Embodiment 4 The system of any one of Embodiments 1-3, wherein the second drive module is configured to rotate the at least one 3D printing build platform.
  • Embodiment 5. The system of Embodiment 4, wherein the second drive module is configured to rotate the at least one 3D printing build platform such that the orientation of the at least one 3D printing build platform is substantially unchanged while the substrate rotates.
  • Embodiment 6 The system of any one of Embodiments 1-5, wherein the first drive module comprises a first motor configured to rotate the substrate and the second drive module comprises a second motor configured to rotate the at least one 3D printing build platform.
  • Embodiment 7 The system of any one of Embodiments 1-6, wherein the second drive module comprises a timing belt or one or more gears coupled to the first drive module.
  • Embodiment 8 The system of any one of Embodiments 1-7, wherein the first sensing module comprises: at least one first light source configured to project first light; a reflective element configured to receive the first light from the at least one first light source and to reflect the first light; at least one first optical detector configured to receive the first light reflected from the reflective element and to output the first signal; and a first controller configured to receive the first signal and to determine the position or the orientation of the substrate based on the first signal.
  • Embodiment 9 The system of Embodiment 8, wherein the first light source is configured to project the first light toward a center of the reflective element.
  • Embodiment 10 The system of Embodiment 8 or 9, wherein the first light comprises substantially collimated light.
  • Embodiment 11 The system of any one of Embodiments 8-10, wherein the reflective element comprises a partially reflective element.
  • Embodiment 12 The system of any one of Embodiments 8-11, wherein the position or the orientation of the substrate are selected from the group consisting of: a distance from the at least one first light source to the reflective element, a lateral displacement of the at least one first light source relative to the reflective element, a tip of the reflective element, a tilt of the reflective element, a rotational position of the reflective element, or any combination thereof.
  • Embodiment 13 The system of any one of Embodiments 8-12, wherein: the at least one first light source and the at least one first optical detector are configured to produce a first laser triangulation signal; and the first controller is configured to receive the first laser triangulation signal and to determine a distance from the at least one first light source to the reflective element based on the first laser triangulation signal.
  • Embodiment 14 The system of any one of Embodiments 8-13, wherein: the first sensing module further comprises a beamsplitter configured to receive the first light from the at least one first light source and to direct a portion of first light to the reflective element as first tip or tilt light; the reflective element is configured to receive the first tip or tilt light from the beamsplitter and to reflect the first tip or tilt light; the at least one first optical detector is configured to receive the first tip or tilt light from the reflective element and to output a first tip or tilt signal; and the first controller is configured to receive the first tip or tilt signal and to determine a tip or tilt of the reflective element based on the first tip or tilt signal. [00123] Embodiment 15.
  • the first sensing module further comprises a lens configured to receive the first light reflected from the reflective element
  • the at least one first optical detector comprises a single pixel detector configured to receive the first light from the lens and to output the first signal
  • the first controller is configured to receive the first signal and to determine a lateral displacement of the at least one first light source relative to the reflective element based on the first signal.
  • Embodiment 16 The system of Embodiment 15, wherein: the partially reflective element comprises a plurality of reflective regions and a plurality of non-reflective regions, the plurality of reflective regions configured to permit the first light to reflect from the reflective element and the plurality of non- reflective regions configured to block the first light from reflecting from the reflective element; the first signal comprises a plurality of reflective signals and a plurality of non-reflective signals; and the controller is configured to receive the plurality of reflective signals and the plurality of non-reflective signals and to determine the lateral displacement based on the plurality of reflective signals and the plurality of non-reflective signals.
  • Embodiment 17 The system of Embodiment 16, wherein the controller is further configured to determine a rotational position of the reflective element based on the plurality of reflective signals and the plurality of non-reflective signals.
  • Embodiment 18 The system of Embodiment 16 or 17, wherein the partially reflective element comprises a star mirror.
  • Embodiment 19 The system of any one of Embodiments 8-14, wherein: the at least one first light source and the at least one first optical detector are configured to produce a first lateral position laser triangulation signal; and the first controller is configured to receive the first lateral position laser triangulation signal and to determine a lateral displacement of the at least one first light source relative to the reflective element.
  • Embodiment 20 The system of Embodiment 19, wherein the reflective element comprises a frustum of a cone.
  • Embodiment 21 The system of Embodiment 20, wherein the frustum comprises a reflective upper surface.
  • Embodiment 22 The system of Embodiment 20 or 21, wherein the frustum comprises a sloping side surface configured to receive the first light and to reflect the first light.
  • Embodiment 23 The system of any one of Embodiments 1-22, wherein the at least one 3D printing build platform comprises a plurality of 3D printing build platforms.
  • Embodiment 24 The system of Embodiment 23, wherein the at least one 3D printing platform comprises at least one fiducial marker.
  • Embodiment 25 The system of Embodiment 23 or 24, wherein the at least one fiducial marker comprises a plurality of fiducial markers.
  • Embodiment 26 The system of any one of Embodiments 23-25, wherein the at least one fiducial marker is located upon the at least one 3D printing build platform.
  • Embodiment 27 The system of any one of Embodiments 23-25, wherein the at least one fiducial marker is etched or cut into the at least one 3D printing build platform.
  • Embodiment 28 The system of Embodiment 27, wherein the at least one fiducial marker is cut through the at least one 3D printing build platform.
  • Embodiment 29 The system of any one of Embodiments 23-28, wherein the at least one fiducial marker is located near an outside edge of the at least one 3D printing build platform.
  • Embodiment 30 The system of any one of Embodiments 23-29, wherein the at least one fiducial marker comprises a shape selected from the group consisting of: a line, a curvilinear form, an arc, a chevron, a polygon, a triangle, a square, a pentagon, a hexagon, and a circle.
  • Embodiment 31 The system of any one of Embodiments 23-30, wherein the 3D printing build platform further comprises at least one slot configured to substantially prevent a 3D printing powder from contacting the at least one fiducial marker.
  • Embodiment 32 The system of any one of Embodiments 23-31, wherein the second sensing module comprises a laser triangulation sensor or an optical imaging sensor and wherein the second signal comprises a second laser triangulation signal or a second optical imaging signal.
  • Embodiment 33 The system of Embodiment 32, wherein the second sensing module further comprises a second controller coupled to the second laser triangulation sensor or the second optical imaging sensor and configured to determine a positioning error of the 3D printing build platform based upon the second signal.
  • Embodiment 34 The system of any one of Embodiments 1-33, further comprising a powder source configured to deposit 3D printing powder on the at least one 3D printing build platform.
  • Embodiment 35 The system of Embodiment 34, wherein the powder source is configured to deposit the 3D printing powder on the at least one 3D printing build platform when the at least one 3D printing build platform is located under the powder source.
  • Embodiment 36 The system of any one of Embodiments 1-35, further comprising an energy source configured to deliver energy to the at least one 3D printing build platform.
  • Embodiment 37 The system of Embodiment 36, wherein the energy source is configured to deliver energy to a portion of the at least one 3D printing build platform when the at least one 3D printing build platform is located under the energy source.
  • Embodiment 38 The system of Embodiment 36 or 37, wherein the energy source comprises a laser or an electron beam.
  • Embodiment 39 A method comprising: moving a substrate comprising at least one three-dimensional (3D) printing build platform coupled to the substrate; moving the 3D printing build platform relative to the substrate; generating a first signal indicative of a position or an orientation of the substrate; and generating a second signal indicative of a position or an orientation of the at least one 3D printing build platform relative to the position or the orientation of the substrate.
  • 3D three-dimensional
  • Embodiment 40 The method of Embodiment 39, wherein the at least one 3D printing build platform is rotatably coupled to the substrate.
  • Embodiment 41 The method of Embodiment 39 or 40, wherein moving the substrate comprises rotating the substrate.
  • Embodiment 42 The method of any one of Embodiments 39-41, wherein moving the at least one 3D printing build platform comprises rotating the at least one 3D printing build platform.
  • Embodiment 43 The method of Embodiment 42, wherein rotating the at least one 3D printing build platform comprises rotating the at least one 3D printing build platform such that the orientation of the at least one 3D printing build platform is substantially unchanged while the substrate rotates.
  • Embodiment 44 The method of any one of Embodiments 39-43, wherein generating the first signal comprises: projecting first light; using a reflective element configured to receive the first light and to reflect the first light; receiving the first light reflected from the reflective element and outputting the first signal; and receiving the first signal and determining the position or the orientation of the substrate based on the first signal.
  • Embodiment 45 The method of Embodiment 44, wherein the reflective element comprises a partially reflective element.
  • Embodiment 46 The method of Embodiment 44 or 45, wherein the position or the orientation of the substrate are selected from the group consisting of: a distance from the substrate to the reflective element, a lateral displacement of the substrate relative to the reflective element, a tip of the reflective element, a tilt of the reflective element, a rotational position of the reflective element, or any combination thereof.
  • Embodiment 47 The method of any one of Embodiments 44-46, wherein the first signal comprises a first laser triangulation signal; and wherein determining the distance from the substrate to the reflective element comprises determining the distance from the substrate to the reflective element based on the first laser triangulation signal.
  • Embodiment 48 The method of any one of Embodiments 44-47, wherein generating the first signal comprises: receiving the first light and directing a portion of first light to the reflective element as first tip or tilt light; using the reflective element to receive the first tip or tilt light from the beamsplitter and to reflect the first tip or tilt light; receiving the first tip or tilt light from the reflective element and to output a first tip or tilt signal; and receiving the first tip or tilt signal and determining a tip or tilt of the reflective element based on the first tip or tilt signal.
  • Embodiment 49 The method of any one of Embodiments 44-48, wherein generating the first signal comprises: using a lens to receive the first light reflected from the reflective element; using a single pixel detector to receive the first light from the lens and to output the first signal; and receiving the first signal and determining a lateral displacement of the substrate relative to the reflective element based on the first signal.
  • Embodiment 50 The method of Embodiment 49, wherein: the partially reflective element comprises a plurality of reflective regions and a plurality of non-reflective regions, the plurality of reflective regions configured to permit the first light to reflect from the reflective element and the plurality of non- reflective regions configured to block the first light from reflecting from the reflective element; the first signal comprises a plurality of reflective signals and a plurality of non-reflective signals; and the lateral displacement is determined based on the plurality of reflective signals and the plurality of non-reflective signals.
  • Embodiment 51 The method of Embodiment 50, further comprising determining a rotational position of the reflective element based on the plurality of reflective signals and the plurality of non-reflective signals.
  • Embodiment 52 The method of Embodiment 50 or 52, wherein the partially reflective element comprises a star mirror.
  • Embodiment 53 The method of any one of Embodiments 44-48, wherein the first signal comprises a first lateral position laser triangulation signal; and wherein determining the lateral displacement of the substrate relative to the reflective element comprises determining the lateral displacement of the substrate relative to the reflective element based on the first lateral position laser triangulation signal.
  • Embodiment 54 The method of Embodiment 53, wherein the reflective element comprises a frustum of a cone.
  • Embodiment 55 The method of Embodiment 54, wherein the frustum comprises a reflective upper surface.
  • Embodiment 56 The method of Embodiment 54 or 55, wherein the frustum comprises a sloping side surface configured to receive the first light and to reflect the first light.
  • Embodiment 57 The method of any one of Embodiments 39-56, wherein the at least one 3D printing build platform comprises a plurality of 3D printing build platforms.
  • Embodiment 58 The method of Embodiment 57, wherein the at least one 3D printing platform comprises at least one fiducial marker.
  • Embodiment 59 The method of Embodiment 57 or 58, wherein the at least one fiducial marker comprises a plurality of fiducial markers.
  • Embodiment 60 The method of any one of Embodiments 57-59, wherein the at least one fiducial marker is located upon the at least one 3D printing build platform.
  • Embodiment 61 The method of any one of Embodiments 57-59, wherein the at least one fiducial marker is etched or cut into the at least one 3D printing build platform.
  • Embodiment 62 The method of Embodiment 61, wherein the at least one fiducial marker is cut through the at least one 3D printing build platform.
  • Embodiment 63 The method of any one of Embodiments 58-62, wherein the at least one fiducial marker is located near an outside edge of the at least one 3D printing build platform.
  • Embodiment 64 The method of any one of Embodiments 58-63, wherein the at least one fiducial marker comprises a shape selected from the group consisting of: a line, a curvilinear form, an arc, a chevron, a polygon, a triangle, a square, a pentagon, a hexagon, and a circle.
  • Embodiment 65 The method of any one of Embodiments 58-64, wherein the 3D printing build platform further comprises at least one slot configured to substantially prevent a 3D printing powder from contacting the at least one fiducial marker.
  • Embodiment 66 The method of any one of Embodiments 58-64, wherein the second signal comprises a second laser triangulation signal or a second optical imaging signal.
  • Embodiment 67 The method of Embodiment 66, further comprising determining a positioning error of the 3D printing build platform based upon the second signal.
  • Embodiment 68 The method of any one of Embodiments 39-67, further depositing 3D printing powder on the at least one 3D printing build platform.
  • Embodiment 69 The method of Embodiment 68, further comprising depositing the 3D printing powder on the at least one 3D printing build platform when the at least one 3D printing build platform is located under a powder source.
  • Embodiment 70 The method of any one of Embodiments 39-69, further comprising delivering energy to the at least one 3D printing build platform.
  • Embodiment 71 The method of Embodiment 70, further comprising delivering energy to a portion of the at least one 3D printing build platform when the at least one 3D printing build platform is located under an energy source.
  • Embodiment 72 The method of Embodiment 71, wherein the energy source comprises a laser or an electron beam.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Automation & Control Theory (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Le problème de correction d'erreurs de positionnement dans des procédés d'impression 3D est traité par des systèmes et des méthodes qui utilisent des modules de détection pour déterminer une position ou une orientation d'un substrat (110) ou d'une plate-forme de construction d'impression 3D (120). Un premier module de détection (150) peut déterminer une position ou une orientation du substrat. Le premier module de détection peut utiliser une variété de sources de lumière, d'éléments réfléchissants, de détecteurs optiques et de dispositifs de contrôle pour déterminer la position ou l'orientation du substrat. Un second module de détection (160) peut déterminer une position ou une orientation de la plate-forme de construction d'impression 3D par rapport à la position ou à l'orientation du substrat. Le second module de détection peut utiliser un ou plusieurs marqueurs visuels pour déterminer des informations indiquant la position ou l'orientation de la plate-forme de construction d'impression 3D. Les informations de position ou d'orientation déterminées par les premier ou second modules de détection peuvent être utilisées pour corriger des erreurs dans le procédé d'impression 3D.
PCT/US2022/019511 2021-03-10 2022-03-09 Systèmes et méthodes pour améliorer la précision dans des procédés d'impression en trois dimensions WO2022192368A1 (fr)

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