WO2022191020A1 - ガラスセラミック材料、積層体、及び、電子部品 - Google Patents

ガラスセラミック材料、積層体、及び、電子部品 Download PDF

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Publication number
WO2022191020A1
WO2022191020A1 PCT/JP2022/009046 JP2022009046W WO2022191020A1 WO 2022191020 A1 WO2022191020 A1 WO 2022191020A1 JP 2022009046 W JP2022009046 W JP 2022009046W WO 2022191020 A1 WO2022191020 A1 WO 2022191020A1
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Prior art keywords
glass
weight
laminate
ceramic material
parts
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Ceased
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PCT/JP2022/009046
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English (en)
French (fr)
Japanese (ja)
Inventor
禎章 坂本
裕 千秋
大樹 足立
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to CN202280020960.7A priority Critical patent/CN116981648A/zh
Priority to JP2023505474A priority patent/JP7597203B2/ja
Publication of WO2022191020A1 publication Critical patent/WO2022191020A1/ja
Priority to US18/463,703 priority patent/US20230416142A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • the present invention relates to glass-ceramic materials, laminates, and electronic components.
  • Patent Document 1 discloses borosilicate glass of 50 to 85% SiO 2 , 10 to 25% B 2 O 3 , 0.5 to 5% K 2 O, and 0.01 to 1% Al 2 O 3 .
  • a glass-ceramic composite material is disclosed which consists of 90% and 10-50% of one or more SiO 2 fillers selected from the group of ⁇ -quartz, ⁇ -cristobalite and ⁇ -tridymite.
  • glass-ceramic composite materials During firing of glass-ceramic composite materials (hereinafter also referred to as glass-ceramic materials), densification proceeds due to the viscous flow of the glass while the maximum temperature is maintained.
  • the time at which the objects to be fired reach the maximum temperature varies. Therefore, it is necessary to adjust the holding time to be longer so that the sintering object, which reaches the maximum temperature late, is sufficiently densified.
  • the glass ceramic material containing a large amount of SiO 2 component as disclosed in Patent Document 1 has a relatively high glass viscosity at the maximum firing temperature. For this reason, it is necessary to lengthen the holding time of the highest temperature during firing, and the above problem becomes significant.
  • the present invention has been made to solve the above problems, and provides a glass-ceramic material capable of obtaining a dense sintered body even when the maximum temperature is maintained for a long period of time during firing, and a glass-ceramic material comprising the It is an object of the present invention to provide a laminate obtained by laminating a plurality of glass ceramic layers which are sintered bodies, and an electronic component including the laminate.
  • the glass-ceramic material of the present invention is selected from the group consisting of glasses containing SiO2 , B2O3 and M2O ( M is an alkali metal), fillers containing quartz, MnO, NiO, CuO and ZnO. and at least one metal oxide, and the content of the metal oxide is 0.05 parts by weight or more and 2 parts by weight or less with respect to a total of 100 parts by weight of the glass and the filler. characterized by M is an alkali metal), fillers containing quartz, MnO, NiO, CuO and ZnO. and at least one metal oxide, and the content of the metal oxide is 0.05 parts by weight or more and 2 parts by weight or less with respect to a total of 100 parts by weight of the glass and the filler. characterized by
  • the laminate of the present invention is characterized by laminating a plurality of glass ceramic layers, which are sintered bodies of the above glass ceramic materials.
  • An electronic component of the present invention is characterized by comprising the laminate.
  • a glass-ceramic material capable of obtaining a dense sintered body even when the maximum temperature is maintained for a long time during firing, and a plurality of glass-ceramic layers, which are sintered bodies of the glass-ceramic material, are laminated. It is possible to provide a laminate formed by the above-described laminate and an electronic component including the laminate.
  • FIG. 1 is a schematic cross-sectional view showing an example of the laminate of the present invention.
  • FIG. 2 is a schematic cross-sectional view showing an example of the electronic component of the present invention.
  • the glass-ceramic material, laminate, and electronic component of the present invention will be described below. It should be noted that the present invention is not limited to the following configurations, and may be modified as appropriate without departing from the gist of the present invention.
  • the present invention also includes a combination of a plurality of individual preferred configurations described below.
  • the glass-ceramic material of the present invention is a low temperature co-fired ceramics (LTCC) material.
  • LTCC low temperature co-fired ceramics
  • the term "low-temperature co-fired ceramic material” means a glass-ceramic material that can be sintered at a firing temperature of 1000°C or less.
  • the glass-ceramic material of the present invention is selected from the group consisting of glasses containing SiO2 , B2O3 and M2O ( M is an alkali metal), fillers containing quartz, MnO, NiO, CuO and ZnO. and at least one metal oxide, and the content of the metal oxide is 0.05 parts by weight or more and 2 parts by weight or less with respect to a total of 100 parts by weight of the glass and the filler. characterized by
  • the glass-ceramic material of the present invention contains a specific amount of the above metal oxide, so that densification proceeds uniformly even when the maximum temperature is maintained for a long time during firing, so that a dense sintered body can be obtained. It is possible to obtain
  • the glass-ceramic material of the present invention contains SiO2 , B2O3 and M2O ( M is an alkali metal).
  • SiO2 in the glass contributes to the decrease of the dielectric constant when the glass-ceramic material is fired. As a result, stray capacitance and the like associated with higher frequency electrical signals are suppressed.
  • the sintered body of the glass-ceramic material becomes dense.
  • M 2 O in the glass contributes to lowering the viscosity of the glass. Therefore, the sintered body of the glass-ceramic material becomes dense.
  • M 2 O is not particularly limited as long as it is an alkali metal oxide, but Li 2 O, K 2 O or Na 2 O is preferable, and K 2 O is more preferable.
  • One type of M 2 O may be used, or a plurality of types may be used.
  • the content of SiO 2 in the glass is preferably 65% by weight or more and 90% by weight or less in terms of oxide. More preferably, it is 70% by weight or more and 85% by weight or less.
  • the content of B 2 O 3 in the glass is preferably 5% by weight or more and 30% by weight or less in terms of oxide. It is more preferably 10% by weight or more and 25% by weight or less.
  • the content of M 2 O in the glass is preferably 1% by weight or more and 5% by weight or less in terms of oxide. More preferably, it is 1.5% by weight or more and 4.5% by weight or less.
  • the total amount thereof is defined as the content of M 2 O.
  • the glass may further contain Al 2 O 3 .
  • Al 2 O 3 in the glass contributes to improving the chemical stability of the glass.
  • the content of Al 2 O 3 in the glass is preferably 0.1% by weight or more and 2% by weight or less in terms of oxide. More preferably, it is 0.5% by weight or more and 1% by weight or less.
  • the glass may further contain an alkaline earth metal oxide such as CaO.
  • an alkaline earth metal oxide such as CaO.
  • the glass preferably does not contain alkaline earth metal oxides.
  • its content in the glass is preferably less than 15% by weight, more preferably less than 5% by weight, and even more preferably less than 1% by weight.
  • the glass may contain impurities in addition to the above components.
  • the content of impurities in the glass is preferably less than 5% by weight, more preferably less than 1% by weight.
  • the filler comprises quartz.
  • the filler contributes to improving mechanical strength when the glass-ceramic material is fired.
  • "filler” means an inorganic additive that is not included in the glass.
  • the quartz in the filler contributes to increasing the coefficient of thermal expansion when the glass-ceramic material is fired.
  • the inclusion of quartz in the glass-ceramic material results in a high coefficient of thermal expansion when fired, since the coefficient of thermal expansion of quartz is approximately 15 ppm/K compared to the coefficient of thermal expansion of glass of approximately 6 ppm/K. is obtained. Therefore, compressive stress is generated in the cooling process after firing, and the mechanical strength (for example, bending strength) increases. Also, the reliability of mounting on a mounting substrate (for example, a resin substrate) is enhanced.
  • the filler may contain only quartz, but may further contain SiO 2 other than quartz. Also, the filler may further contain Al 2 O 3 and/or ZrO 2 .
  • Al 2 O 3 and ZrO 2 as fillers in the glass-ceramic material prevents the precipitation of cristobalite crystals when fired.
  • Cristobalite crystals are a kind of SiO2 crystals, but since they undergo a phase transition at about 280°C, if cristobalite crystals precipitate during the firing process of the glass-ceramic material, the volume will change significantly in a high-temperature environment, reducing reliability.
  • Al 2 O 3 and ZrO 2 in the filler also contribute to low dielectric loss, high coefficient of thermal expansion and high mechanical strength when the glass-ceramic material is fired.
  • the content is preferably 1% by weight or more and 5% by weight or less.
  • the filler more preferably contains only quartz.
  • the glass-ceramic material of the present invention contains 50 to 90 parts by weight of the glass and 10 to 50 parts by weight of the filler with respect to a total of 100 parts by weight of the glass and the filler. is preferred. More preferably, the glass is 60 parts by weight or more and 80 parts by weight or less, and the filler is 20 parts by weight or more and 40 parts by weight or less.
  • the glass-ceramic material of the present invention contains at least one metal oxide selected from the group consisting of MnO, NiO, CuO and ZnO, and the metal oxide is 0.05 parts by weight or more and 2 parts by weight or less. When multiple types of metal oxides are used, the total amount of all metal oxides used is adjusted to 0.05 parts by weight or more and 2 parts by weight or less with respect to the total of 100 parts by weight of the glass and the filler.
  • a dense sintered body with a high relative density can be obtained even if the firing time is long.
  • Such a sintered body is excellent in dielectric constant and Q value (reciprocal of dielectric loss).
  • CuO is preferable as the metal oxide.
  • the glass-ceramic material of the present invention even if the firing time is long, the densification progresses uniformly, so it is possible to obtain a dense sintered body.
  • the glass and the filler can be distinguished by analyzing the electron diffraction pattern with a transmission electron microscope (TEM).
  • composition of the glass-ceramic material of the present invention one obtained by measuring the composition of a sintered body of the glass-ceramic material described later may be used.
  • a glass ceramic material containing a large amount of SiO 2 component as disclosed in Patent Document 1 has a relatively high glass viscosity at the maximum firing temperature, as described above. Therefore, precipitation of crystals from the glass is less likely to occur during firing.
  • the composition of the glass-ceramic material of the present invention is substantially the same as the composition of the sintered body of the glass-ceramic material.
  • the laminate of the present invention is characterized by laminating a plurality of glass ceramic layers which are sintered bodies of the glass ceramic material of the present invention.
  • the compositions of the glass-ceramic layers may be the same or different, but are preferably the same.
  • the relative density of the laminate is preferably 90% or higher, more preferably 95% or higher.
  • the relative density is a value obtained by dividing the apparent density measured by the Archimedes method by the true density.
  • the true density is the density of powder obtained by pulverizing the laminate.
  • the apparent density is the density including voids, and the volume ratio of the voids in the laminate can be calculated by dividing the apparent density by the true density.
  • a relative density of 100% means that the laminate contains no voids.
  • the dielectric constant of the laminate is preferably 4.5 or less.
  • the dielectric constant is measured under 3 GHz conditions by the perturbation method.
  • the Q value which is the reciprocal of the dielectric loss of the laminate, is preferably 250 or more.
  • the Q factor is determined as the reciprocal of the measured dielectric loss at 3 GHz by the perturbation method.
  • the laminate of the present invention may further include a conductor layer.
  • a conductor layer is provided between the glass-ceramic layers adjacent to each other in the stacking direction and/or on the surface of the glass-ceramic layer.
  • the laminate of the present invention may further include via conductors.
  • a via conductor is provided so as to penetrate the glass ceramic layer.
  • the conductor layers and via conductors can be formed using a conductive paste containing Ag or Cu by screen printing, photolithography, or the like.
  • FIG. 1 is a schematic cross-sectional view showing an example of the laminate of the present invention.
  • the laminate of the present invention may be applied to multilayer ceramic substrates.
  • a laminate (multilayer ceramic substrate) 1 shown in FIG. 1 is formed by laminating a plurality of glass ceramic layers 3 (five layers in FIG. 1).
  • Conductor layers 9, 10, 11 and via conductors 12 may be formed in the laminate 1. These constitute, for example, passive elements such as capacitors and inductors, and connection wiring for electrical connection between elements.
  • the conductor layers 9, 10, 11 and via conductors 12 preferably contain Ag or Cu as a main component.
  • Ag or Cu As a main component.
  • the glass-ceramic material of the present invention that is, the low-temperature co-fired ceramic material is used as the constituent material of the glass-ceramic layer 3, co-firing with Ag or Cu is possible.
  • the conductor layer 9 is arranged inside the laminate 1 . Specifically, the conductor layer 9 is arranged between two glass ceramic layers 3 adjacent in the stacking direction.
  • the conductor layer 10 is arranged on one main surface of the laminate 1 .
  • the conductor layer 11 is arranged on the other main surface of the laminate 1 .
  • the via conductors 12 are arranged so as to penetrate the glass ceramic layer 3 to electrically connect the conductor layers 9 in different layers, electrically connect the conductor layers 9 and 10, or connect the conductor layers 9 and 10 to each other. It plays a role of electrically connecting 9 and 11.
  • a multilayer ceramic substrate which is an example of the laminate of the present invention, is produced, for example, as follows.
  • (A) Preparation of glass-ceramic material The glass-ceramic material of the present invention is prepared by mixing glass, filler, and metal oxide in a predetermined composition.
  • the glass-ceramic material of the present invention is mixed with a binder, a plasticizer and the like to prepare a ceramic slurry. Then, the ceramic slurry is formed on a substrate film (eg, polyethylene terephthalate (PET) film) and then dried to produce a green sheet.
  • a substrate film eg, polyethylene terephthalate (PET) film
  • the firing temperature of the laminated green sheet is not particularly limited as long as it is a temperature at which the glass-ceramics of the present invention constituting the green sheet can be sintered, and is, for example, 1000°C or less.
  • the firing atmosphere of the laminated green sheet is not particularly limited, but an air atmosphere is preferable when a material such as Ag that is difficult to oxidize is used as the conductor layer and the via conductor, and a nitrogen atmosphere is preferable when a material that is easily oxidized such as Cu is used.
  • a low-oxygen atmosphere, such as an atmosphere, is preferred.
  • the atmosphere for firing the laminated green sheet may be a reducing atmosphere.
  • the laminated green sheets may be fired while sandwiched between the restraining green sheets.
  • the constraining green sheet contains as a main component an inorganic material (for example, Al 2 O 3 ) that does not substantially sinter at the sintering temperature of the glass-ceramic material of the present invention that constitutes the green sheet. Therefore, the constraining green sheet does not shrink when the laminated green sheet is fired, and acts to suppress the shrinkage of the laminated green sheet in the main surface direction. As a result, the dimensional accuracy of the obtained laminate 1 (especially the conductor layers 9, 10, 11 and the via conductors 12) is enhanced.
  • the main component of the conductor layer is Cu, and the metal oxide contained in the glass ceramic layer contains at least CuO.
  • the fact that the main component of the conductor layer is Cu means that 90% by volume or more of the conductor layer is made of Cu.
  • the conductor layer is preferably made of a mixture of Cu, glass and aluminum oxide.
  • the glass used for forming the conductor layer the same glass as that contained in the glass-ceramic material of the present invention can be used. That the metal oxide contains at least CuO means that the metal oxide contains only CuO, or contains CuO and one or more metal oxides other than CuO. More preferably, the metal oxide contains only CuO.
  • the main component of the via conductors is Cu
  • the metal oxide contained in the glass ceramic layer contains at least CuO.
  • An electronic component of the present invention is characterized by comprising the laminate of the present invention.
  • the electronic component of the present invention includes, for example, a multilayer ceramic substrate, which is an example of the laminate of the present invention, and chip components mounted on the multilayer ceramic substrate.
  • Chip parts include, for example, LC filters, capacitors, inductors, and the like.
  • FIG. 2 is a cross-sectional schematic diagram showing an example of the electronic component of the present invention.
  • chip components 13 and 14 may be mounted on the laminate (multilayer ceramic substrate) 1 while being electrically connected to the conductor layer 10 .
  • an electronic component 2 including the laminate 1 is configured.
  • the electronic component 2 may be mounted on a mounting board (for example, a motherboard) so as to be electrically connected via the conductor layer 11.
  • a mounting board for example, a motherboard
  • the laminate of the present invention may be applied to chip components mounted on a multilayer ceramic substrate. That is, the laminate of the present invention may be applied to LC filters, capacitors, inductors, and the like.
  • the laminate of the present invention when the laminate of the present invention is applied to a capacitor, the laminate includes a conductor layer between adjacent glass ceramic layers in the lamination direction.
  • the laminate of the present invention may be applied to other than multilayer ceramic substrates and chip components.
  • a glass ceramic material having the composition shown in Table 2 was prepared by putting a glass powder, a quartz powder as a filler, and a metal oxide in ethanol and mixing them with a ball mill. Both the quartz powder and the metal oxide had median particle sizes of 1 ⁇ m.
  • a ceramic slurry was prepared by mixing the glass-ceramic material prepared above, a binder solution of polyvinyl butyral dissolved in ethanol, and a dioctyl phthalate (DOP) solution as a plasticizer. Next, the ceramic slurry was formed on a polyethylene terephthalate film using a doctor blade and then dried at 40° C. to produce green sheets S1 to S29 with a thickness of 50 ⁇ m.
  • DOP dioctyl phthalate
  • Table 2 shows the evaluation results. If the relative density was 95% or more, it was judged to be dense. In addition, when the dielectric constant was 4.5 or less, it was determined that the dielectric constant was low, and when the Q value was 250 or more, it was determined that the dielectric loss was low.
  • the laminates of Examples 1 to 14 had a relative density of 95% or more, a dielectric constant of 4.5 or less, and a Q value of 250 or more.
  • Comparative Example 1 in which the firing time is short, has appropriate relative density, dielectric constant and Q value, but the firing time In Comparative Examples 2 and 3 in which the time is 120 minutes or more, the relative density was 90% or less, and Comparative Example 3 also had a low Q value.
  • the metal oxide content was less than 0.05 parts by weight, the relative density was low, and the Q values of Comparative Examples 10 and 11 were also low.
  • Laminate (multilayer ceramic substrate) 2 electronic component 3 glass ceramic layer 9, 10, 11 conductor layer 12 via conductor 13, 14 chip component

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PCT/JP2022/009046 2021-03-12 2022-03-03 ガラスセラミック材料、積層体、及び、電子部品 Ceased WO2022191020A1 (ja)

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