WO2022184322A1 - Procédé pour la production d'un échangeur de chaleur à ailettes-plaques, soudure pour une utilisation dans un procédé de ce type, et échangeur de chaleur à ailettes-plaques - Google Patents

Procédé pour la production d'un échangeur de chaleur à ailettes-plaques, soudure pour une utilisation dans un procédé de ce type, et échangeur de chaleur à ailettes-plaques Download PDF

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Publication number
WO2022184322A1
WO2022184322A1 PCT/EP2022/025078 EP2022025078W WO2022184322A1 WO 2022184322 A1 WO2022184322 A1 WO 2022184322A1 EP 2022025078 W EP2022025078 W EP 2022025078W WO 2022184322 A1 WO2022184322 A1 WO 2022184322A1
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WO
WIPO (PCT)
Prior art keywords
atomic percent
content
solder
heat exchanger
plate
Prior art date
Application number
PCT/EP2022/025078
Other languages
German (de)
English (en)
Inventor
Herbert Aigner
Thomas Englert
Original Assignee
Linde Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linde Gmbh filed Critical Linde Gmbh
Publication of WO2022184322A1 publication Critical patent/WO2022184322A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
    • F28D9/0068—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements with means for changing flow direction of one heat exchange medium, e.g. using deflecting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286—Al as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/02—Alloys based on aluminium with silicon as the next major constituent
    • C22C21/04—Modified aluminium-silicon alloys
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0093—Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/04—Fastening; Joining by brazing

Definitions

  • the present invention relates to a method for producing a fin-plate heat exchanger, a solder for use in such a method, a separating plate with solder coating for use in such a method, and a fin-plate heat exchanger manufactured according to the method.
  • the present invention relates to brazed aluminum plate-fin heat exchangers (PFHE; designations according to the German and English editions of ISO 15547-2:3005), as they are used in a large number of process engineering systems at different pressures and temperatures are used.
  • Corresponding heat exchangers are used, for example, in the low-temperature separation of air, in the liquefaction of natural gas or in plants for the production of ethylene. If, in the following, a "heat exchanger” or “plate heat exchanger” is used for short, this always means a corresponding (hard) soldered fin-plate heat exchanger made of aluminum.
  • aluminum can also refer to an aluminum alloy.
  • Brazed fin-plate heat exchangers made of aluminum are shown in Figure 2 of the mentioned ISO 15547-2:3005 and on page 5 of the publication "The Standards of the Brazed Aluminum Plate-Fin Heat Exchanger Manufacturers' Association” by ALPEMA, 3rd edition 2010. shown and described. An illustration that essentially corresponds to the illustrations there is shown in the attached FIG. 1 and is explained in advance in the following.
  • the plate heat exchanger 100 shown partially opened in Figure 1 is used for heat exchange between five different process media A to E in the example shown.
  • the plate heat exchanger 100 comprises a multiplicity of separating plates 4 arranged parallel to one another, between which structural plates 3 (fins, ribs) are arranged.
  • the separating plates 4 and the structured plates 3 form heat exchange passages 1 for the process media A to E, which can thereby exchange heat with one another.
  • the structural sheets 3 are typically folded or corrugated, flow channels being formed by the folds or corrugations, as also shown in FIG. 1 of ISO 15547-2:3005.
  • the structural sheets 3 bring about improved heat transfer, targeted fluid guidance and an increase in the mechanical (tensile) strength.
  • the respective process media A to E flow separately from one another through the separating plates 4.
  • the individual passages 1 and the structured metal sheets 3 are each surrounded laterally by so-called sidebars 8, which, however, leave feed and removal openings 9 free.
  • the sidebars 8 keep the separating plates 4 at a distance and ensure mechanical reinforcement of the pressure chamber.
  • Reinforced cover plates 5 (cap sheets), which are arranged parallel to the separating plates 4, serve to close off at least two sides.
  • the process media A to E are fed in and removed via the feed and removal openings 9 by means of so-called headers 7 which are provided with nozzles 6 .
  • headers 7 which are provided with nozzles 6 .
  • further distribution structural sheets 2 distributed fins
  • distribute the process media A to E from the passages 1 into the header 7 where they are collected and drawn off via the corresponding nozzles 6 .
  • a cuboid heat exchanger block 10 is formed, under a "heat exchanger block" the components mentioned without the header 7 and nozzle 6 are to be understood in a connected state.
  • the plate heat exchanger 100 can be formed from a plurality of corresponding cuboid heat exchanger blocks 10 connected to one another, in particular for manufacturing reasons.
  • Corresponding aluminum plate heat exchangers 100 are brazed.
  • the components i.e. the separating plates 4, the structural laminations 3, the other structural laminations with the distributor lamellae 2, the cover plates 5 and the sidebars 8, of which the separating plates are usually provided with solder, are stacked on top of one another or arranged accordingly and in one Furnace heated in a vacuum or at a sub-atmospheric pressure level (so-called vacuum brazing).
  • the headers 7 and the sockets 6 are welded onto the heat exchanger block 10 produced in this way.
  • the headers 7 are typically manufactured using semi-cylindrical extrusions which are cut to the required length and then welded onto the heat exchanger block 10.
  • the object of the present invention is to simplify the production of fin-plate heat exchangers by vacuum brazing and in this way to provide improved fin-plate heat exchangers.
  • the invention proposes a method for producing a fin-plate heat exchanger, a solder for use in such a method, a separating plate with solder coating for use in such a method, and a fin-plate heat exchanger produced according to the method with the respective features of the independent patent claims.
  • Preferred embodiments of the invention are the subject matter of the dependent patent claims and the following description.
  • solders with a magnesium content of more than 1% are used for vacuum brazing of aluminum and thus also for use in the manufacture of fin-plate heat exchangers, as is also the case in relevant standards such as e.g. AWS 5.8, "Specification for Filler Metals for Brazing and Braze Welding".
  • the magnesium in the solder plating vaporizes during vacuum soldering in the furnace in the range of 530 to 560 °C and acts as a so-called "getter” during the soldering process in order to eliminate disturbing residual oxygen and moisture in order to improve the vacuum and the fluidity of the solder to enhance. Furthermore, will be happy.
  • Literature for example the AWS Brazing Handbook or the ASM Handbook 6, the oxide layer of the aluminum is torn open by the evaporated magnesium and thus the soldering is improved.
  • Another advantage of such solders is the formation of magnesium silicide precipitates, which improve the connection strength after a certain aging time.
  • a major disadvantage of this brazing material is that the evaporation of the magnesium leads to an accumulation of magnesium (so-called magnesium built-up) in the vacuum furnace. After a certain time, this can lead to fires in the vacuum furnace and (due to the hygroscopic properties of magnesium oxide) to a deterioration in vacuum formation. As a result, the oven has to be cleaned regularly and laboriously.
  • a silicon-based aluminum solder ie an alloy with aluminum as the main component and silicon in a content of 9 to 10 atomic percent, and a magnesium content of 0.1 to 0.65% and as specified below other alloying elements such as bismuth, zinc, titanium and copper, offers particular advantages when vacuum brazing aluminum and thus also advantages for use in the production of fin-plate heat exchangers.
  • the present invention proposes a method for manufacturing a fin-plate heat exchanger in which components of the fin-plate heat exchanger to be soldered are at least partially provided with solder and positioned relative to one another, and by heating the components to be soldered and the solder at a sub-atmospheric pressure level, soldered connections are made between the components to be soldered.
  • the solder used in the proposed method has aluminum as the main component, silicon in a content of 9 to 10 atomic percent, magnesium in a content of 0.1 to 0.65 atomic percent, iron in a content of 0.3 to 0.6 atomic percent , copper in a content up to 0.3 atomic percent, manganese in a content up to 0.1 atomic percent, zinc in a content up to 0.2 atomic percent, titanium in a content up to 0.2 atomic percent, bismuth in a content of 0.05 to 0.2 atomic percent and the balance aluminum. That is, aluminum is provided in an atomic percent content that adds up to the sum of the contents of the other alloying components for a total of 100 atomic percent.
  • the stated magnesium content in a corresponding solder allows the reliability and strength of corresponding solder connections, for example detected by the bursting pressure, to be significantly improved with a sufficient getter effect, without an accumulation of magnesium occurring in the soldering furnace.
  • the bursting strength improves by about 70% even when the magnesium content is increased from 0.05 atomic percent to 0.1 atomic percent.
  • a solder with a magnesium content of at least 0.11 atomic percent, 0.12 atomic percent, 0.13 atomic percent, 0.14 atomic percent or 0.15 atomic percent can also be selected within the scope of the present invention.
  • a further improvement in the bursting strength results from increasing magnesium contents, although it has been recognized that a plateau is almost reached at 0.65 atomic percent. Contents higher than this 0.65 atomic percent are therefore advantageously not chosen, since they would merely increase the magnesium content in the brazing furnace without any additional advantages.
  • the solder preferably has a magnesium content of 0.55 up to 0.65 atomic percent.
  • the magnesium contents mentioned prevent increased deposits of magnesium in the soldering furnace, but at the same time ensure sufficient magnesium as a getter and serve to improve the flowability of the solder (capillarity) in the soldering process.
  • the solder used in the context of the invention has silicon in a content of 9 to 10 atomic percent.
  • An appropriate silicon content ensures sufficient formation of magnesium silicide to increase the strength of the soldered joint. Furthermore, material erosion is satisfactorily prevented by this silicon content.
  • the solder used within the scope of the invention has one or more other alloying components selected from the group consisting of iron, copper, manganese, zinc, titanium and bismuth.
  • Bismuth improves the flowability of the solder during the soldering process. This results in particular in a reduction in the tendency to hot cracking when aluminum is welded to the heat exchanger blocks. Furthermore, the plating layer thickness can be reduced in this way and material costs can thus be saved.
  • the solder used in the invention has 0.3 to 0.6 atomic percent iron, up to 0.3 atomic percent copper, up to 0.1 atomic percent manganese, up to 0.2 atomic percent zinc, up to 0.2 atomic percent titanium and 0.05 to 0.2 atomic percent bismuth.
  • the solder does not include titanium.
  • the solder preferably has a manganese content of 0.006 to 0.1 atomic percent, particularly preferably 0.006 to 0.07 atomic percent.
  • the solder preferably has a zinc content of 0.0001 to 0.2 atomic percent, particularly preferably 0.0001 to 0.05 atomic percent.
  • the solder preferably has a copper content of 0 to 0.3 atom percent copper, particularly preferably 0.001 to 0.02 atom percent.
  • the solder has silicon in a content of 9.4 to 9.7 atomic percent, more preferably in a content of 9.5 to 9.6 atomic percent, and more preferably in a content of 9.5 atomic percent.
  • the present invention also extends to a solder for use in a method for producing a plate-fin heat exchanger, in which components of the plate-fin heat exchanger to be soldered are at least partially provided with the solder and positioned relative to one another, and in which by Heating the components to be soldered and the solder to a sub-atmospheric pressure level to produce soldered joints between the components to be soldered.
  • the solder has aluminum as a main component, silicon in a content of 9 to 10 atomic percent, magnesium in a content of 0.1 to 0.65 atomic percent, iron in a content of 0.3 to 0.6 atomic percent, copper in a content up to 0.3 atomic percent, manganese in a content up to 0.1 atomic percent, zinc in a content up to 0.2 atomic percent, titanium in a content up to 0.2 atomic percent, bismuth in a content from 0.05 to 0 .2 atomic percent, and the remainder is aluminum.
  • the present invention also includes a separating plate with a solder coating for use in a method for producing a fin-plate heat exchanger, in which separating plates are positioned relative to one another with other components of the fin-plate heat exchanger to be brazed, and in which by heating the separating plates and the other components to be soldered at a sub-atmospheric pressure level, soldered connections between the separating plates and the other components to be soldered are produced, the separating plate having a core layer which is coated on one or both sides with a layer of solder, characterized in that the core layer has an AI 3003 or AI 3004 aluminum alloy, and that the solder coating contains aluminum as the main component, silicon in a content of 9 to 10 atomic percent, magnesium in a content of 0.1 to 0.65 atomic percent, iron in a content of 0.3 to 0.6 atomic percent, Copper in a content up to 0.3 atomic percent t, manganese in a content up to 0.1 atomic percent, zinc in a content up to 0.2 atomic percent,
  • the Al 3003 alloy used in the present invention is defined in more detail in EN AW-3003, ISO Al-Mn1Cu, or ANSI/AA (USA) AA3003.
  • the AI 3004 alloy used in the present invention is defined in more detail in EN AW-3004, ISO AIMn1Mg1, or ANSI/AA (USA) AA3004.
  • the present invention also includes a fin and plate heat exchanger made by the method described above.
  • Point 1 Method (200) for producing a fin-plate heat exchanger (100), in which the components (3-8) of the fin-plate heat exchanger (100) to be soldered are at least partially provided with solder and positioned relative to one another, and in which solder joints are produced between the components (2-8) to be soldered by heating the components (3-8) to be soldered and the solder to a subatmospheric pressure level, the solder used being aluminum as the main component, silicon in the next lowest content after aluminum and magnesium in a content of 0.1 to 0.65 atomic percent.
  • the solder In addition to aluminium, silicon and magnesium, the solder usually has one or more other alloying components selected from the alloying components mentioned under item 3.
  • the aluminum content in the solder is chosen such that the aluminum content in atomic percent supplements the sum of the contents of the other alloying components to a total of 100 atomic percent. In other words, this means that aluminum forms a balance of the alloy (referred to as "balance aluminum" in English).
  • Point 2 Method (200) according to point 1, in which the solder has silicon in a content of 9 to 10 atomic percent.
  • Point 3 Method (200) according to point 1 or 2, in which the solder has one or more further alloying components selected from the group consisting of iron, copper, manganese, zinc, titanium and bismuth.
  • Item 4 Method according to item 1, item 2 or item 3, in which the solder contains 0.3 to 0.6 atomic percent iron, up to 0.3 atomic percent copper, up to 0.1 atomic percent manganese, up to 0.2 atomic percent Zinc, up to 0.2 atomic percent titanium and 0.05 to 0.2 atomic percent bismuth as the other alloying components.
  • Item 5 Solder for use in a method (200) for producing a fin-plate heat exchanger (100), in which the components (3-8) of the fin-plate heat exchanger (100) to be soldered are at least partially provided with the solder and are positioned relative to one another, and in which soldered connections are produced between the components (2-8) to be soldered by heating the components (3-8) to be soldered and the solder to a subatmospheric pressure level, characterized in that the solder contains aluminum as the main component, silicon in the next lowest grade after aluminum and magnesium in a grade of 0.1 to 0.65 atomic percent. See points 1, 2, 3 and 4 for other alloying components.
  • Finned-plate heat exchanger (100) which is produced by a method (200) in which the components (3-8) of the finned-plate heat exchanger (100) to be soldered are at least partially provided with solder and positioned relative to one another and in which soldered connections between the components (2-8) to be soldered are produced by heating the components (3-8) to be soldered and the solder at a sub-atmospheric pressure level, thereby characterized in that the solder has aluminum as a major component, silicon in the next lowest content after aluminum and magnesium in a content of 0.1 to 0.65 atomic percent. See points 1, 2, 3 and 4 for other alloying components.
  • Item 7 The plate-fin heat exchanger (100) according to item 7, which is manufactured by a method according to any one of items 1 to 4.
  • FIG. 1 shows a fin-plate heat exchanger that can be produced according to an embodiment of the invention in a simplified isometric representation.
  • FIG. 2 illustrates in the form of a diagram a bursting strength which can be achieved by solders according to embodiments of the invention.
  • FIG. 3 illustrates a method according to an embodiment of the invention in the form of a schematic flow chart.
  • FIG. 4 illustrates a solder-coated separator plate according to the invention. embodiment(s) of the invention
  • FIG. 1 has already been explained in the introduction to the description in the assessment of the prior art.
  • bursting strengths that can be achieved by solders according to embodiments of the invention are illustrated in the form of a diagram in which magnesium contents are given in atomic percent on the horizontal axis and bursting pressures in bar are given on the vertical axis.
  • the solders used here each had 0.05, 0.1, 0.3, 0.4, 0.65 and 1.5 atomic percent magnesium (in the following Table 1 as "Variant 0.05", “Variant 0.1” etc.), silicon, iron, copper, manganese and zinc (in the atomic percentages given in Table 1 below) and the balance aluminum. Mean values from three tests are shown in each case.
  • the bursting strength improves by around 70% when the magnesium content is increased from 0.05 atomic percent to 0.1 atomic percent. A further improvement in the bursting strength results from increasing magnesium contents, although a plateau is almost reached at 0.65 atomic percent.
  • FIG. 3 shows a method 200 according to an embodiment of the invention in the form of a simplified schematic flow chart. This includes arranging 210 and, if necessary, fixing the soldered components to be soldered in a vacuum soldering furnace, heating 220 the components to be soldered in the vacuum soldering furnace and thus soldering the components to be soldered, and optionally subsequent targeted cooling 230 and removal the soldered components from the soldering furnace and then further processing 240, such as the welding of headers and the like.
  • Separating plates according to the invention with a solder coating are preferably used for the production of the plate-fin heat exchanger.
  • 4 shows an embodiment of a separating plate 4 according to the invention with a coating of solder.
  • the separating plate has a core layer 42 which is coated with a solder layer 41 on both sides.
  • the solder layer 41 may have the components shown in Table 1 exhibit. Reference is made to the above explanations for Table 1. Deviating from the embodiment shown in FIG. 4, the core layer 42, which has two sides, a top and a bottom, can have a solder coating on only one of the two sides, ie on the top or bottom.
  • solder-coated separating plates 4 (of FIG. 4), fins 3, possibly fins 2, edge strips (sidebars) 8, cover plates 5 are stacked in a stack and then soldered in a vacuum oven as already explained in relation to FIG.
  • a separating plate 4 solder-coated on both sides is arranged, to connect the cover plates 5 (via the separating plates 4 coated with solder on both sides) to the fins 3, possibly 2, of the outermost passages 1.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

La présente invention concerne un procédé (200) pour production d'un échangeur de chaleur à ailettes-plaques (100), des composants (3-8) de l'échangeur de chaleur à ailettes-plaques (100) qui doivent être soudés étant au moins partiellement munis d'une soudure et sont positionnés les uns par rapport aux autres, et dans lequel, par le chauffage des composants (3-8) devant être soudés et de la soudure à un niveau de pression subatmosphérique, des joints de soudure sont produits entre les composants (2-8) devant être soudés. La soudure utilisée comprend de l'aluminium en tant que composant principal, du silicium à la concentration inférieure suivante après l'aluminium et du magnésium à une concentration de 0,1 à 0,65 pour cent atomique. L'invention concerne également une soudure correspondante, une tôle métallique de séparation revêtue de soudure (4), et un échangeur de chaleur à ailettes-plaques (100) produit de manière correspondante.
PCT/EP2022/025078 2021-03-04 2022-03-04 Procédé pour la production d'un échangeur de chaleur à ailettes-plaques, soudure pour une utilisation dans un procédé de ce type, et échangeur de chaleur à ailettes-plaques WO2022184322A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP21020124.0 2021-03-04
EP21020124 2021-03-04

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WO2022184322A1 true WO2022184322A1 (fr) 2022-09-09

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140329109A1 (en) * 2013-05-01 2014-11-06 Denso Corporation Method for brazing sheet material and heat exchanger
EP2670559B1 (fr) * 2011-01-31 2015-07-15 Aleris Rolled Products Germany GmbH Matériau de tôle à brasage en aluminium pour brasage sans flux

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2670559B1 (fr) * 2011-01-31 2015-07-15 Aleris Rolled Products Germany GmbH Matériau de tôle à brasage en aluminium pour brasage sans flux
US20140329109A1 (en) * 2013-05-01 2014-11-06 Denso Corporation Method for brazing sheet material and heat exchanger

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
W. DIERY: "The Manufacture of Plate-Fin Heat Exchangers at Linde", LINDE REPORTS ON SCIENCE AND TECHNOLOGY, pages 24 - 31

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