WO2022184089A1

WO2022184089A1 - Photosensitive assembly, camera module, mobile electronic device and optical image stabilization method

Info

Publication number: WO2022184089A1
Application number: PCT/CN2022/078773
Authority: WO
Inventors: 杨祎; 魏罕钢; 赵波杰; 戎琦; 赵瑜; 刘佳
Original assignee: 宁波舜宇光电信息有限公司
Priority date: 2021-03-04
Filing date: 2022-03-02
Publication date: 2022-09-09
Also published as: CN115037849B; CN115037849A

Abstract

Provided in the present disclosure are a photosensitive assembly (1a, 1b, 1c, 1d), which comprises a photosensitive chip (2), a circuit board (3) and at least one drive mechanism. The circuit board (3) bears the photosensitive chip (2) and is electrically connected thereto. The drive mechanism comprises a resonator (122), a piezoelectric element (123) arranged on the resonator (122), and a driven member (121) movably clamped on the resonator (122), wherein the driven member (121) can be driven to move relative to the resonator (122), and the driven member (121) is fixedly connected to the circuit board; and in response to a pulse voltage signal applied to the piezoelectric element (123), the drive mechanism can drive the circuit board to move. In addition, the present disclosure further relates to a camera module (20a, 20b, 31) which comprises the photosensitive assembly, a mobile electronic device (31) which comprises the camera module, and an optical image stabilization method which can be applied to the mobile electronic device.

Description

Photosensitive component, camera module, mobile electronic device and optical anti-shake method

technical field

The present disclosure relates to the field of electromechanical technology, and in particular, to a photosensitive component, a camera module including the photosensitive component, a mobile electronic device including the camera module, and an optical anti-fighting device that can be applied to the mobile electronic device. Shake method.

Background technique

The descriptions herein merely provide background information related to the present disclosure and do not necessarily constitute prior art.

At present, with the rapid development of electronics and network technologies and the popularization of the Internet, people's lives are inseparable from mobile electronic devices such as mobile phones and tablet computers. Therefore, the technology of camera modules for acquiring video or images has also been rapidly developed and widely used. When a user uses a mobile electronic device (such as a mobile phone, etc.) to capture an image, the shaking of the user's hand may cause the mobile electronic device to shake, so that the image captured by the electronic device becomes blurred.

In addition, as the imaging quality requirements of the camera module of mobile electronic equipment are getting higher and higher, the volume and weight of the lens are getting bigger and bigger, the area of the photosensitive chip is getting bigger and bigger, and the volume of the corresponding circuit board assembly is also getting bigger and bigger. large, resulting in an ever-increasing demand for the driving force of a driving mechanism such as a motor. However, the current mobile electronic devices (eg, smart phones) have great restrictions on the volume of the camera module, and thus limit the volume occupied by the driving mechanism. In other words, with the development trend of lenses, photosensitive chips, circuit board components, etc. of mobile electronic devices to larger volume and heavier weight, it is difficult to increase the driving force provided by the driving mechanism accordingly. On the premise that the driving force is limited, the stroke of the driving mechanism is too short, the thrust is too small, and the moving speed is too slow, which will also affect the focusing and anti-shake capabilities of the mobile electronic device. In addition, traditional drive mechanisms such as motors are equipped with magnets and coils. When the distance between the two magnets is too close (for example, less than 7mm), their magnetic fields will interact with each other, causing the magnets to shift or shake, thereby affecting Focusing and imaging quality of camera modules of mobile electronic devices.

SUMMARY OF THE INVENTION

In view of this, the present disclosure provides a photosensitive assembly, a camera module and a mobile electronic device including the photosensitive assembly, and an optical anti-shake method.

According to one aspect of the present disclosure, there is provided a photosensitive assembly comprising: a photosensitive chip configured to convert an image imaged thereon into an electrical signal; a circuit board including circuit traces and configured to carry the photosensitive chip and Electrically connected with the photosensitive chip; at least one driving mechanism, each driving mechanism includes a piezoelectric element, a resonator and a follower, the piezoelectric element is arranged on the resonator, the resonator is arranged to movably clamp the follower, and can A follower is driven to move relative to the resonator, the follower being fixedly connected to the circuit board, whereby each drive mechanism is configured to drive the circuit board in motion in response to a pulsed voltage signal applied to the piezoelectric element.

According to some embodiments of the present disclosure, wherein: the resonator includes a plurality of resonating arms connected to each other by connecting parts, each of the resonating arms includes a contact part; and the follower is movably clamped at one end by the contact parts of the plurality of resonating arms rod.

According to some embodiments of the present disclosure, the follower is a round rod with a circular cross-section.

According to some embodiments of the present disclosure, the at least one driving mechanism includes a first driving mechanism, and the driving element of the first driving mechanism is fixedly connected to the first transmission member, and the first transmission member is fixedly connected to the first side surface of the circuit board.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a first suspension fixedly connected to a second side surface of the circuit board to elastically support the circuit board, the second side surface adjoining the first side surface.

According to some embodiments of the present disclosure, the first suspension includes a U-shaped member and at least one connecting member, one end of each connecting member is fixedly connected to the bottom of the U-shaped member, and is perpendicular to the plane where the U-shaped member is located, wherein each connecting member is The other end of the piece is fixedly connected to the second side.

According to some embodiments of the present disclosure, the at least one connecting piece is a connecting piece, and one end of the one connecting piece is fixedly connected to the midpoint of the bottom of the U-shaped piece.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a first suspension wire and a second suspension wire, which are arranged to elastically support the circuit board; wherein the first end of the first suspension wire is fixedly connected to the bottom of the U-shaped member One end of the first suspension wire is fixedly connected to the first transmission member; wherein, the first end of the second suspension wire is fixedly connected to the other end of the bottom of the U-shaped member, and the second end of the second suspension wire is fixed is connected to the first mounting member, and the first mounting member is fixedly connected to the third side surface of the circuit board, and the third side surface is opposite to the first side surface.

According to some embodiments of the present disclosure, the at least one driving mechanism further includes a second driving mechanism, the driven member of the second driving mechanism is fixedly connected to the second transmission member, and the second transmission member is fixedly connected to the second side surface of the circuit board .

According to some embodiments of the present disclosure, the photosensitive assembly further includes a second suspension fixedly connected to the first side surface of the circuit board to elastically support the circuit board.

According to some embodiments of the present disclosure, the second suspension includes a U-shaped member and at least one connecting member, one end of each connecting member is fixedly connected to the bottom of the U-shaped member of the second suspension, and is perpendicular to the U-shaped member of the second suspension. The plane where the shaped piece is located, wherein the other end of each connecting piece is fixedly connected to the first side surface.

According to some embodiments of the present disclosure, the at least one connecting piece of the second suspension is a connecting piece, one end of which is fixedly connected to the midpoint of the bottom of the U-shaped piece of the second suspension.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a third suspension wire and a fourth suspension wire, which are arranged to elastically support the circuit board; wherein the first end of the third suspension wire is fixedly connected to the second suspension wire One end of the bottom of the U-shaped member, the second end of the second suspension wire is fixedly connected to the second transmission member; wherein, the first end of the second suspension wire is fixedly connected to the bottom of the U-shaped member (111) of the second suspension The other end of the second suspension wire is fixedly connected to the second mounting piece, and the second mounting piece is fixedly connected to the fourth side surface of the circuit board, and the fourth side surface is opposite to the second side surface.

According to some embodiments of the present disclosure, the at least one drive mechanism includes: a first drive mechanism whose drive element is fixedly connected to the first side of the circuit board; and a second drive mechanism whose drive element is fixedly connected to a second side of the circuit board a side surface; a third driving mechanism, the driving element of which is fixedly connected to the fourth side surface of the circuit board; wherein the first side surface is adjacent to the second side surface and the fourth side surface, and the second side surface is opposite to the fourth side surface.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a suspension wire, one end of which is fixedly connected to the circuit board and is arranged to elastically support the circuit board.

According to some embodiments of the present disclosure, the number of suspension wires is four.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a spherical hinge fixedly connected to the circuit board and configured to elastically support the circuit board.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a filter and a bracket, the filter is arranged on the bracket, and the bracket is arranged on the bearing surface of the circuit board that carries the photosensitive chip, so that the filter It is located on the optical path of the photosensitive chip, and the orthographic projection of the filter on the circuit board completely covers the photosensitive chip.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a base plate configured to support the at least one driving mechanism and the circuit board.

According to some embodiments of the present disclosure, the photosensitive assembly further includes a flexible circuit board configured to electrically connect the circuit board to circuit connectors on the substrate.

According to another aspect of the present disclosure, a camera module is provided, comprising: the photosensitive assembly as described above; an optical lens configured to collect light signals so that the light signals are imaged at an imaging surface of a photosensitive chip; focusing a driving mechanism, which is set to be able to move the optical lens relative to the photosensitive chip, so that the photosensitive chip is within the focal depth range of the optical lens; a casing, which is set to support the optical lens and the focus driving mechanism; wherein, the casing surrounds the photosensitive assembly, The optical lens is movably mounted on the housing, and the optical axis of the optical lens coincides with the optical axis of the photosensitive chip, and the focus driving mechanism is fixedly mounted on the housing and located at the periphery of the optical lens.

According to some embodiments of the present disclosure, in the aforementioned camera module, one of the first suspension and the second suspension is fixedly connected to the focus driving mechanism.

According to some embodiments of the present disclosure, in the aforementioned camera module, one of the first suspension and the second suspension is fixedly connected to the housing.

According to another aspect of the present disclosure, a camera module is provided, comprising: the photosensitive assembly as described above; an optical lens configured to collect light signals so that the light signals are imaged at an imaging surface of a photosensitive chip; focusing a driving mechanism, which is set to be able to move the optical lens relative to the photosensitive chip, so that the photosensitive chip is within the focal depth range of the optical lens; a casing, which is set to support the optical lens and the focus driving mechanism; wherein, the casing surrounds the photosensitive assembly, The optical lens is movably mounted on the housing and the optical axis of the optical lens coincides with the optical axis of the photosensitive chip. The focus drive mechanism is fixedly mounted on the housing and located at the periphery of the optical lens, and the other end of the suspension wire is fixedly connected to the focus Drive mechanism.

According to another aspect of the present disclosure, a mobile electronic device is provided, which includes the camera module as described above.

According to another aspect of the present disclosure, there is provided an optical anti-shake method, which can be applied to the aforementioned mobile electronic device, the method comprising: acquiring the offset direction and offset distance of the photosensitive chip relative to the optical lens; Based on the offset direction and offset distance, a pulsed voltage signal is generated; the pulsed voltage is applied to the piezoelectric element of the driving mechanism, so that the driving mechanism drives the circuit board, thereby realigning the photosensitive chip and the optical lens.

Description of drawings

The specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings, so that more details, features and advantages of the present disclosure can be more fully recognized and understood, in the accompanying drawings:

FIG. 1 is a schematic structural diagram of a photosensitive assembly according to some embodiments of the present disclosure;

2 is a schematic structural diagram of a photosensitive assembly according to other embodiments of the present disclosure;

3 is a schematic structural diagram of a photosensitive assembly according to other embodiments of the present disclosure;

Fig. 4 schematically shows the photosensitive assembly shown in Fig. 3 in the form of a perspective view;

FIG. 5 schematically shows a photosensitive assembly according to other embodiments of the present disclosure in a perspective view;

6 is a schematic structural diagram of a driving mechanism according to some embodiments of the present disclosure;

Figure 7 is a simplified schematic cross-sectional view of the drive mechanism shown in Figure 6;

8-10 are schematic diagrams of the working principle of the resonator of the driving mechanism proposed by the present disclosure;

11 is a schematic structural diagram of a driving mechanism according to other embodiments of the present disclosure;

12 is a schematic structural diagram of a driving mechanism according to other embodiments of the present disclosure;

13 is a schematic structural diagram of a driving mechanism according to other embodiments of the present disclosure;

14 is a schematic structural diagram of a multilayer piezoelectric element according to some embodiments of the present disclosure;

15 is a schematic structural diagram of a camera module according to some embodiments of the present disclosure, wherein the photosensitive assembly adopts the photosensitive assembly shown in FIGS. 3 and 4;

16 is a schematic structural diagram of a camera module according to other embodiments of the present disclosure, wherein the photosensitive assembly adopts the photosensitive assembly shown in FIG. 5;

17 is a schematic structural diagram of a mobile electronic device according to some embodiments of the present disclosure;

18 is a flowchart of an optical image stabilization method according to some embodiments of the present disclosure.

It should be noted that what is shown in the drawings is schematic only and is therefore not necessarily drawn to scale and does not constitute any limitation of the present disclosure. Furthermore, the same features are designated by the same reference numerals throughout the drawings.

List of reference signs

1a, 1b, 1c, 1d Photosensitive components 121 Followers

2 Sensitive chip 122 Resonator

3 Circuit board 1221 Resonator arm

3a The first side 1222 The contact part

3b 2nd side 1223 Contact surface

3c The third side 123 Piezoelectric element

3d 4th side 124 multilayer piezoelectric element

4 1241 Piezoelectric unit

5a The first transmission piece 125 The first connector

5b The first installation piece 126 The second connector

6a The second transmission piece 13a The first suspension wire

6b The second mounting piece 13b The second suspension wire

7 The third transmission piece 14a The third suspension wire

8 Spherical hinges 14b fourth suspension wire

11a 1st Suspension 15 Suspension Wire

11b 2nd Suspension 21 Filter

111 U-shaped piece 22 Bracket

1111 Arms Arms 23 Flexible circuit boards

1112 The bottom of the circuit connector

112 Connecting piece 25 Housing

12a First drive mechanism 26 Focus drive mechanism

12b Second drive mechanism 27 Optical lens

12c The third drive mechanism

Detailed ways

The following description provides specific details of various embodiments of the present disclosure so that those skilled in the art can fully understand and practice the various embodiments of the present disclosure. It should be pointed out that the embodiments listed here are only used to clearly illustrate the concept of various solutions of the present disclosure, and should not be construed as any limitation to the present disclosure. The features of the photosensitive assembly, camera module, mobile electronic device and optical anti-shake method involved herein can be arbitrarily combined or replaced within the framework of the concept of the present disclosure, as long as they do not violate natural laws or technical specifications, and all fall within the scope of this disclosure. within the scope of the open concept.

Orientational terms such as upper, lower, left, right, front, rear, front, back, top, bottom, etc. referred to or may be referred to herein are defined relative to the configurations shown in the various figures, which are relative Therefore, it can be changed accordingly according to its different locations and different usage states. Therefore, these and other terms of orientation should not be construed as limiting.

Referring to FIG. 1 , a structure of a photosensitive assembly according to some embodiments of the present disclosure is schematically shown in a plan view. As shown in FIG. 1, the photosensitive assembly 1a includes a photosensitive chip 2, a circuit board 3, a first driving mechanism 12a, a first transmission member 5a, a first suspension 11a, a first suspension wire 13a and a second suspension wire 13b.

The photosensitive chip 2 is used to convert the image formed thereon into electrical signals. The photosensitive chip 2 may be any known suitable photosensitive chip, such as, but not limited to, a charge coupled device (CCD) photosensitive chip and a metal oxide semiconductor element (CMOS) photosensitive chip. The circuit board 3 can be configured to carry the photosensitive chip 2 . It should be understood that the surface of the wiring board 3 carrying the photosensitive chip 2 is referred to herein as a carrying surface, and the four surfaces adjacent to the carrying surface and surrounding the wiring board 3 are referred to as side surfaces of the wiring board 3 . FIG. 1 shows that the bearing surface of the circuit board 3 is rectangular, but it should be understood that the bearing surface of the circuit board 3 may also have any other suitable shape, such as, but not limited to, square, trapezoid or circular. Four sides of the circuit board 3 are shown in FIG. 1 , namely, the first side 3a, the second side 3b, the third side 3c and the fourth side 3d. Optionally, the circuit board 3 may include circuit traces in order to achieve electrical connection with the photosensitive chip 2 . It will be appreciated that the circuit traces may be provided on at least one of the carrying surface of the circuit board 3 and the backside opposite the carrying surface.

The first driving mechanism 12a can be used to drive the circuit board 3 to reciprocate. The first driving mechanism 12a may include a follower 121 and a resonator 122, and may include a piezoelectric element. The first driving mechanism 12a may have the structure and principle of the driving mechanism as shown in FIGS. 6 to 11 of the present disclosure. The first driving mechanism 12a will be described below with reference to FIG. 6 . As shown in FIG. 6 , the first driving mechanism 12a may include a resonator 122 and a piezoelectric element 123 provided on the resonator 122 . By applying different pulse voltage signals, such as pulse voltage signals of different frequencies, to the piezoelectric element 123, the piezoelectric element 123 can be excited to generate a piezoelectric effect, and the resonator 122 can enter different vibration modes, thereby performing different movements. , such as, but not limited to, linear motion and/or rotation. The first driving mechanism 12a may further include a follower 121 . The follower 121 can be a rod-shaped object, can be a round rod or a polygonal rod, and is movably arranged relative to the resonator 122 along the central axis of the resonator 122 , for example, one end of the follower can be movably connected to the resonator 122 . Thus, the resonator 122 can drive the follower 121 to perform corresponding movement.

Continuing to refer to FIG. 1, in the photosensitive assembly 1a, the resonator 122 of the first driving mechanism 12a is disposed adjacent to the intersection of the first side surface 3a and the second side surface 3b, and the opening direction of the resonator 122 is the direction along the X axis The follower 121 extends along the direction of the X axis, it is fixedly connected with the first transmission member 5a, and the first transmission member 5a can be fixed with the end adjacent to the fourth side surface 3d in the first side surface 3a of the circuit board 3 connection; thus, the follower 121 can drive the circuit board 3 to move. As shown in FIG. 1 , based on the resonator 122 and the follower 121 , the first driving mechanism 12 a can drive the circuit board 3 to perform linear motion along the X-axis direction and/or rotate around the X-axis. In this case, the follower 121 may be referred to as a driving element of the first driving mechanism 12a. It should be understood that, in some embodiments of the present disclosure, the driving mechanism may not include a follower, but may fixedly connect the resonator 122 to the circuit board 3 , such as fixedly connected to the first side 3a of the circuit board 3 , As a result, the resonator 122 can drive the circuit board 3 to move. In this case, the resonator 122 may be referred to as a driving element of the driving mechanism.

According to other different embodiments, the resonator 122 can be fixedly connected to the circuit board 3, and the follower is arranged to be fixedly different. In this case, the follower is in fact designed as a kind of fixed guide. For example, such a guide can be fastened to the base structure of the camera module or constructed as part of the base structure. The resonator 122 is movably disposed relative to the guide member, for example, one end of the guide member can be movably connected with the resonator 122 . The resonator 122 is fixedly connected with the circuit board 3 and can drive the circuit board 3 to move relative to the guide together. Under different vibration modes of the resonator 122 , the resonator 122 and the circuit board 3 fixedly connected to the resonator 113 can move relative to the fixed guide, thereby achieving the effect of optical anti-shake.

It should also be understood that the first transmission member 5a may have any suitable shape, such as, but not limited to, a rod shape or a sheet shape, and may be made of any suitable material, such as, but not limited to, a metal material . In addition, the first transmission member 5a can also be fixedly connected to any suitable position of the first side surface 3a, for example, but not limited to, the middle position of the first side surface 3a along the X-axis direction.

The structure and working principle of the driving mechanism will be described in more detail below with reference to the related drawings.

The photosensitive assembly 1 a shown in FIG. 1 further includes a first suspension 11 a for elastically supporting the circuit board 3 . The first suspension 11a can have any suitable shape, and can be made of any suitable material, so as to have a certain rigidity and deformation ability, so as to stably support the circuit board 3 and allow the circuit board 3 to have a certain degree of deformation. degree of displacement, that is, the circuit board 3 is elastically supported so that the circuit board 3 can be driven by the driving mechanism. As a non-limiting example, the first suspension 11a may be formed as a metal dome. Referring to Figure 4, a specific form of the first suspension 11a is shown. As shown in FIG. 4 , the first suspension 11 a may include a U-shaped member 111 and a connecting member 112 . The U-shaped piece 111 has two arms 1111 and a bottom 1112 connecting the two arms 1111 . One end of the connecting piece 112 is fixedly connected to the middle position of the bottom 1112 of the U-shaped piece 111, and the connecting piece 1112 may be perpendicular to the plane where the U-shaped piece 111 is located. As shown in FIG. 4, the connector 1112 may be perpendicular to the plane YZ. As a non-limiting example, the number of connectors 1112 may be two or more, may be distributed along the length of the bottom 1112, and may be fixedly connected to the bottom 1112 in the same manner. Additionally, the connector 112 may have any suitable shape, such as, but not limited to, a rod shape or a sheet shape. Continuing to refer to FIG. 1 and in conjunction with FIG. 4 , the other end of the connecting piece 112 is fixedly connected to the second side 3b of the circuit board 3 , and the two arms 1111 of the U-shaped piece 111 may be fixedly connected to something such as a housing or a base plate It is a kind of stationary component, thereby realizing the elastic support for the circuit board 3 .

As shown in FIG. 1, the photosensitive assembly 1a further includes a pair of suspension wires, ie, a first suspension wire 13a and a second suspension wire 13b. One end of the first suspension wire 13a may be fixedly connected to one end of the bottom 1112 of the U-shaped member 111 of the first suspension 11a, and the other end thereof may be fixedly connected to the first transmission member 5a; one end of the second suspension wire 13b may be The other end of the bottom portion 1112 of the U-shaped piece 111 that is fixedly connected to the first suspension 11a, the other end of which may be fixedly connected to the first mounting piece 5b, which may be fixedly connected to the third side surface 3a. The end adjacent to the fourth side surface 3d. Thus, the first suspension wires 13 a and the second suspension wires 13 b can assist in elastically supporting the circuit board 3 .

The first mount 5b may have any suitable shape, such as, but not limited to, a boss or a tab, and may be made of any suitable material, such as a metallic material. Similar to the suspension, the suspension wire may be made of any suitable material so as to have some stiffness and deformability, such as, but not limited to, wire. In addition, the connection position of the suspension wire can also be selected according to needs. For example, one end of the first suspension wire 13a can also be fixedly connected to the first side surface 3a of the circuit board 3, and/or one end of the second suspension wire 13b can be connected It is fixedly connected to the third side 3c of the circuit board.

Referring to FIG. 2 , it schematically illustrates the structure of a photosensitive assembly according to other embodiments of the present disclosure in a plan view. As shown in FIG. 2, the photosensitive assembly 1b includes a photosensitive chip 2, a circuit board 3, a second driving mechanism 12b, a second suspension 11b, a second transmission member 6a, a pair of suspension wires (ie, the third suspension wire 14a and the first Four suspension wires 14b) and a second mount 6b. The photosensitive assembly 1b shown in FIG. 2 has a similar structure to the photosensitive assembly 1a shown in FIG. 1, and wherein the second driving mechanism 12b, the second suspension 11b, the second transmission member 6a, the second mounting member 6b, the third The structure of the suspension wire 14a and the fourth suspension wire 14b is the same as that of the first driving mechanism 12a, the first suspension 11a, the first transmission member 5a, the first mounting member 5b, the first suspension wire 13a and the second suspension wire 13b. Therefore, these similarities or similarities will not be repeated hereafter.

In the photosensitive assembly 1b, the resonator 122 of the second driving mechanism 12b may be disposed adjacent to the intersection of the first side surface 3a and the second side surface 3b, and the opening direction of the resonator 122 is the direction along the Y axis; the follower 121 may extend along the direction of the Y axis, and may be fixedly connected to the second transmission member 6a, and the second transmission member 6a may be fixedly connected to an end of the second side surface 3b of the circuit board 3 adjacent to the third side surface 3c. Thus, the second driving mechanism 12b can drive the circuit board 3 to perform linear movement along the Y-axis direction and/or rotate around the Y-axis. Furthermore, the second suspension 11b is fixedly connected to the first side surface 3a of the wiring board 3 corresponding to the disposition form of the second driving mechanism 12b. The third suspension wire 14a may be fixedly connected to one end of the bottom 1112 of the U-shaped member 111 of the second suspension 11b and the second transmission member 6a, and the fourth suspension wire 14b may be fixedly connected to the U-shaped member of the second suspension 11b The other end of the bottom 1112 of the piece 111 and the second mounting piece 6b.

3 and 4 , wherein, FIG. 3 schematically shows the structure of a photosensitive assembly according to other embodiments of the present disclosure in the form of a plan view, and FIG. 4 schematically shows the structure of the photosensitive assembly shown in FIG. 3 in the form of a perspective view photosensitive components.

As shown in FIGS. 3 and 4 , and with reference to FIGS. 1 and 2 , the photosensitive assembly 1 c includes a photosensitive chip 2 , a circuit board 3 , a first driving mechanism 12 a , a second driving mechanism 12 b , a first transmission member 5 a , a second driving mechanism 12 b , a The transmission member 6a, the first suspension 11a, the second suspension 11b, the first mounting member 5b, the second mounting member 6b, and the corresponding two pairs of suspension wires (ie, the first suspension wire 13a, the second suspension wire 13b, the Three suspension wires 14a and a fourth suspension wire 14b). The first driving mechanism 12a, the first transmission member 5a, the first suspension 11a, the first mounting member 5b and the corresponding pair of

suspension wires

13a and 13b have the same structure and arrangement as those shown in FIG. 1, And the second driving mechanism 12b, the second transmission member 6a, the second suspension 11b, the second mounting member 6b and the corresponding pair of

suspension wires

14a and 14b have the same structures and arrangements as those shown in FIG. 2 . . Therefore, these similarities or similarities will not be repeated hereafter. In addition, FIG. 4 also shows the base plate 4 to which the two arms 1111 of the U-shaped piece 111 of the second suspension 11b are fixedly connected, and the resonators 122 of the first drive mechanism 12a and the second drive mechanism 12b It is also fixedly connected to the base plate 4 .

As can be seen from the foregoing description, the first driving mechanism 12a can drive the circuit board 3 to perform linear motion along the X axis and/or rotate around the X axis, and the second driving mechanism 12b can drive the circuit board 3 to perform linear motion and/or along the Y axis direction. Or rotate around the Y axis. In addition, due to the existence of two driving mechanisms, the photosensitive assembly 1c can also drive the circuit board 3 to rotate around the Z axis. As a non-limiting example, the first driving mechanism 12a can drive the circuit board 3 to linearly move along the X-axis direction, and at the same time, the second driving mechanism 12b can drive the circuit board 3 to linearly move along the Y-axis direction. With the cooperation of a driving mechanism 12a and a second driving mechanism 12b, the circuit board 3 can be driven to rotate around the Z axis. Therefore, the photosensitive assembly 1c shown in FIGS. 3 and 4 can realize five-axis optical image stabilization. In addition, in the photosensitive assembly 1c shown in FIGS. 3 and 4, the first driving mechanism 12a, the first transmission member 5a, the first suspension 11a, the

suspension wires

13a, 13b, the second driving mechanism 12b, the second transmission member 6a, The second suspension 11b and the

suspension wires

14a, 14b are arranged in such a way that they do not interfere with each other in space, and can also maintain the stability of the photosensitive assembly 1c in the non-working state, and can drive the photosensitive assembly 1c in the working state. A slight shift or rotation is generated in the desired direction to achieve the effect of optical image stabilization.

It should be understood that suspensions and/or suspension wires are not necessary for photosensitive assemblies according to the present disclosure. That is to say, the suspension and/or the suspension wire of the photosensitive assembly provided in the above-mentioned exemplary embodiments may be omitted according to actual conditions. In other embodiments according to the present disclosure as will be described hereinafter, the suspension may be omitted where stable elastic support of the circuit board has been achieved.

Referring to FIG. 5 , a photosensitive assembly according to further embodiments of the present disclosure is schematically shown in a perspective view. As shown in FIG. 5 , the photosensitive assembly 1d may include a photosensitive chip 2, a circuit board 3, a first driving mechanism 12a, a first transmission member 5a, a second driving mechanism 12b, a second transmission member 6a, a third driving mechanism 12c, a Three transmission members 7, as well as four suspension wires 15 and spherical hinges 8 are also included. In addition, FIG. 5 also shows the substrate 4 . The resonators of each drive mechanism are fixedly connected to the base plate 4 .

The resonator 122 of the first driving mechanism 12a is disposed at the intersection of the first side 3a and the second side 3b, and the opening of the resonator 122 is along the direction of the Z axis; the follower 121 of the first driving mechanism 12a is along the Z axis. Extending in the direction of the X axis, it is fixedly connected with the first transmission member 5a, and the first transmission member 5a can be fixedly connected with the end of the first side surface 3a of the circuit board 3 adjacent to the fourth side surface 3d. The resonator 122 of the second driving mechanism 12b is disposed at the intersection of the second side 3b and the third side 3c, and the opening of the resonator 122 is also along the direction of the Z axis; the follower 121 of the second driving mechanism 12b is along the Z-axis. Extending in the direction of the Y axis, it is fixedly connected with the second transmission member 6a, and the second transmission member 6a can be fixedly connected with one end of the second side surface 3b of the circuit board 3 adjacent to the first side surface 3a. The resonator 122 of the third driving mechanism 12c is disposed at the intersection of the third side 3c and the fourth side 3d, and the opening of the resonator 122 is also in the direction of the Z axis; the follower 121 of the third driving mechanism 12c is also Extending along the direction of the Y axis, it is fixedly connected with the third transmission member 7, and the third transmission member 7 can be fixedly connected with an end of the fourth side surface 3d of the circuit board 3 adjacent to the first side surface 3a. Based on the setting of the driving mechanism shown in FIG. 5 , as a non-limiting example, when the follower 121 of the first driving mechanism 12a and the second driving mechanism 12b simultaneously generate the same translation in the Z-axis direction, the circuit board 3 can be driven to rotate around The Y axis direction rotates; when the follower 121 of the second driving mechanism 12b and the third driving mechanism 12c simultaneously generate the same translation in the Z axis direction, the circuit board 3 can be driven to rotate around the X axis direction.

As shown in FIG. 5 , in order to stably and elastically support the circuit board 3 , the photosensitive assembly 1 d includes four suspension wires 15 and a spherical hinge 8 . The material and form of the suspension wires 15 are the same as those described above, for example, metal wires; in addition, the number of the suspension wires 15 can also be determined according to actual needs, such as but not limited to, three, five, six, etc. . One end of the suspension wire 15 may be fixedly connected to one corner of the circuit board 13, and the other end thereof may be fixedly connected to other stationary components such as a housing. The spherical hinge 8 is used to achieve stable elastic support for the circuit board 3 . It should be understood that the suspension wire 15 and the spherical hinge 8 may have any suitable form, which is not limited herein.

The structure of the driving mechanism will be exemplarily described below with reference to FIGS. 6 and 7 . FIG. 6 is a schematic structural diagram of a driving mechanism according to some embodiments of the present disclosure, and FIG. 7 is a simplified schematic cross-sectional view of the driving mechanism shown in FIG. 6 . As shown, the resonator 122 may include a plurality of resonating arms 1221, which are connected to each other by connecting portions, and are configured as a whole, for example, in the shape of a tuning fork. Each resonator arm 1221 may be provided with a contact portion 1222 and a piezoelectric element 123 , and the contact portions 1222 of the plurality of resonator arms 1221 may be used to movably clamp the follower 121 .

The piezoelectric element 123 may be made of a material having a piezoelectric effect, such as single crystal or polycrystalline ceramic. When the frequency of the external electric field is consistent with the natural frequency of the piezoelectric element 123, the piezoelectric element 123 enters a resonance state, causing the resonating arm 1221 to vibrate. The follower 121 is displaced. By applying different pulse voltages, different vibration modes can be generated, thereby realizing different motion modes, and the specific action principle will be described later with reference to the accompanying drawings.

Specifically, since the number of the resonance arms 1221 is multiple, the number of the piezoelectric elements 123 of the driving mechanism 12 may also be correspondingly multiple. Optionally, the first electrodes of the plurality of piezoelectric elements 123 can be connected in parallel and then electrically connected to the first electrodes of the driving circuit, and the second electrodes of the plurality of piezoelectric elements 123 can be connected in parallel and then electrically connected to the second electrodes of the driving circuit. .

In the embodiments shown in FIGS. 1 to 4 , the follower 121 may be configured as a round rod with a circular cross section, one end of which is movably clamped by the contact parts 1222 of the plurality of resonating arms 1221 , so that it can resonate The force of the arm 1221 is used to reciprocate along the Y-axis direction of the illustrated Cartesian coordinate system. Optionally, the curvature of the contact surface 1223 is smaller than the curvature of the side peripheral surface of the follower 121, so that there is not only a sufficient preload force therebetween, but also a sufficient friction force for the follower 121 to drive the follower 121. The moving member 121 moves.

For example, here the follower 121 can be configured as an L-shaped round rod as a whole, and its other free end away from the resonator 122 can be fixedly connected with the circuit board 3 so as to drive it along the X of the illustrated Cartesian coordinate system. Reciprocating movement in the axis and/or Y-axis direction.

Optionally, the follower 121 may be a polygonal rod, or have a special-shaped cross section or the like.

It should be understood that, in the concept of the present disclosure, the specific structural forms of the resonator 122 , the piezoelectric element 123 and the follower 121 and their mutual positional relationship can be reasonably selected according to the design structure and product performance, and are not limited here. Illustrative form.

8 , 9 and 10 , the possible action forms and principles of the resonator 122 under the excitation of the piezoelectric element 123 will be briefly described below. In short, by exciting the resonator 122 with the piezoelectric element 123, it can be put into different vibration states.

Figure 8 shows a typical state at the first excitation frequency. On the one hand, the resonating arms 1221 vibrate in the longitudinal direction (Y direction), and on the other hand, vibrate close to or apart from each other (X direction). Depending on which of the two vibrations takes precedence over the other, the contact portion 1222 is caused to perform an elliptical motion with a corresponding rotational direction. The contact portion 1222 can thus exert a force in the positive or negative Y direction on the follower 121 .

FIG. 9 corresponds to the state at a second excitation frequency different from the first excitation frequency. At this time, the contact portions 1222 mainly vibrate in the X direction and collide with each other. The follower 121 can thus be guided movably and can be moved by an external force.

FIG. 10 corresponds to different third excitation frequencies, at which time the resonant arm 1221 can perform torsional motion around the longitudinal direction (Y direction), and drive the follower 121 in a corresponding manner.

The surface of the contact portion 1222 of the resonance arm 1221 in contact with the follower 121 is the contact surface 1223 . Optionally, the shape of the contact surface 1223 may match the shape of the side peripheral surface of the corresponding follower 121 , so as to achieve more precise force transmission and motion control between the follower 121 and the resonance arm 1221 .

In this embodiment, the number of the resonance arms 1221 is two, and the two resonance arms 1221 are disposed opposite to each other at intervals. The follower 121 is rod-shaped and is arranged perpendicular to the resonance arm 1221 . In other embodiments, the number of resonance arms 1221 may be three, four or more.

By selecting different pulse voltages, especially voltages with different frequencies, different vibration excitation modes of the resonant arm 1221 can be realized, and then the follower 121 can be driven to realize different movement modes, including the movement direction, speed, step distance and action frequency. and other changes. The present application is not limited to the specific form of the driving mechanism 12 given as the exemplary embodiment, but the structural form and its combination may be reasonably selected according to the design and performance.

FIG. 11 shows a schematic structural diagram of some embodiments of the drive mechanism 12 . As shown in FIG. 11 , one end of the follower 121 of the driving mechanism 12 close to the resonator 122 is configured with a plurality of sub-rods 1211 , for example, including the sub-rods 1211 corresponding to the number of the resonating arms 1221 of the driving mechanism 12 , such as sub-rods The number of parts 1211 is two. Optionally, for example, through pre-stressing formed by pre-shaped shapes or material properties, the acting force and reaction force generated between each sub-rod portion 1211 and the corresponding resonating arm 1221 can be formed between the sub-rod portion 1211 and the resonating arm 1221. Form an interference fit. Therefore, even when the driving mechanism 12 is not powered on, a self-locking effect can be formed between the follower 121 and the resonating arm 1221 , which is beneficial to achieve precise control and adjustment of the motion mode. The follower 121 shown in FIG. 11 includes a driving mechanism of the sub-rod portion 1211 , which can be applied to the embodiment of the photosensitive assembly shown in FIG. 5 .

FIG. 12 shows a schematic structural diagram of other embodiments of the driving mechanism 12 . As shown in the figure, piezoelectric elements 123 may be provided on the inner side and the outer side of the resonating arm 1221, for example, in a symmetrical arrangement, which is conducive to driving the follower 121 uniformly and balancedly to achieve different movement modes.

FIG. 13 shows a schematic structural diagram of other embodiments of the driving mechanism 12 , where the piezoelectric element 123 is disposed outside the resonance arm 1221 . The piezoelectric element 123 may be a single-layer piezoelectric element. The piezoelectric element 123 may be connected to the resonant arm 1221 through a conductive adhesive, and the conductive adhesive may be an adhesive added with silver epoxy or conductive micro-metal balls. Alternatively, the piezoelectric element 123 may be coated or formed layer by layer on the resonating arm 1221, or the piezoelectric element 123 may be conductively connected to the resonating arm 1221 through an electrolytic technique.

FIG. 14 shows a schematic view of the structure of the multilayer piezoelectric element of the driving mechanism 12 . Here, the piezoelectric element may be a multilayer piezoelectric element 124, and the multilayer piezoelectric element 124 includes a plurality of piezoelectric units 1241, and conductive electrodes made of silver, nickel or platinum are arranged between each two piezoelectric units 1241. Floor. A plurality of piezoelectric units 1241 are arranged alternately and have a thickness in the range of 10-20 μm, and the multilayer piezoelectric element 124 has the advantage of lower operating voltage than the single-layer piezoelectric element. For example, a single-layer piezoelectric element with a thickness of 0.25mm needs a voltage of 100V to reach the working electric field, while a 20-layer multilayer piezoelectric element with a thickness of 12.5μm can operate at a voltage of 5V, which is more convenient to use.

Referring to FIG. 15 , it schematically shows the structure of a camera module according to some embodiments of the present disclosure, wherein the photosensitive assembly adopts the photosensitive assembly 1 c shown in FIGS. 3 and 4 . For clarity, the camera module 20a in FIG. 15 does not show the driving mechanism and the suspension wires, but only shows the photosensitive chip 2, the circuit board 3, the first suspension 11a, the second suspension 11b and the substrate 4. These The structures and operation modes of the components are the same as those described in detail above, and will not be repeated here.

As shown in FIG. 15 , the camera module 20 a further includes a filter 21 and a corresponding bracket 22 . The filter 21 can be disposed on the bracket 22, and the bracket 22 can be disposed on the bearing surface of the circuit board 3 that carries the photosensitive chip 2, for example, but not limited to, by means of bonding. The optical filter 21 is disposed on the optical path of the photosensitive chip 2 , and the orthographic projection of the optical filter 21 on the circuit board 3 completely covers the photosensitive chip 2 . Thus, the filter 21 is arranged to allow light within a specific wavelength range to reach the photosensitive chip 2 . The camera module 20a may further include a flexible circuit board 23, which may be configured to electrically connect the circuit board 3 with the circuit connector 24 located on the substrate 4 as shown in the figure.

Continuing to refer to FIG. 15 , the camera module 20 a further includes a housing 25 , a focus driving mechanism 26 and an optical lens 27 . Housing 25 may have any suitable shape and may be made of any suitable material. The housing 25 may be fixedly attached to the substrate 4 and surround the photosensitive assembly in any suitable manner, such as, but not limited to, gluing, welding, and utilizing any suitable fasteners. The optical lens 27 is movably mounted on the housing 25 , and the optical axis of the optical lens 25 coincides with the optical axis of the photosensitive chip 2 . Therefore, the optical lens 27 is also located on the optical path of the photosensitive chip 2 . Thus, the optical lens 27 is arranged to collect the light signal, so that the light signal is imaged at the photosensitive chip 2 . The focus drive mechanism 26 is fixedly attached to the housing 25 and is located around the optical lens 27 . Thus, the focus driving mechanism 26 is configured to move the optical lens 27 relative to the photosensitive chip 2 so that the photosensitive chip 2 is within the focal depth range of the optical lens 27 , so that the optical signal can be clearly imaged at the photosensitive chip 2 . In the camera module 20 a shown in FIG. 15 , the first suspension 11 a is fixedly connected to the focus driving mechanism 26 so as to achieve stable elastic support for the circuit board 3 . However, in other not-shown embodiments of the present disclosure, the first suspension 11 a may also be fixedly connected to the housing 25 .

Referring to FIG. 16 , it schematically shows the structure of a camera module according to some embodiments of the present disclosure, wherein the photosensitive assembly adopts the photosensitive assembly 1 d shown in FIG. 5 . For the sake of clarity, the camera module 20b in FIG. 16 does not show the driving mechanism and the spherical hinge, but only shows the photosensitive chip 2, the circuit board 3, the suspension wire 15 and the substrate 4. The structure and operation of these components are the same as the previous ones. The content that has been described in detail in the text is the same, and will not be repeated here. In addition, similar to the camera module 20a shown in FIG. 15 , the camera module 20b also includes a filter 21 , a bracket 22 , a flexible circuit board 23 , a circuit connector 24 , a housing 25 , a focus driving mechanism 26 and an optical lens 27 . The structures and arrangement forms of these components are the same as those of the same components in the camera module 20a shown in FIG. 15 , and thus are not repeated here.

As shown in FIG. 16 , in the camera module 20b, the suspension wire 15 is fixedly connected to the focus drive mechanism 26 to achieve stable elastic support for the circuit board 3. However, it should be understood that in other embodiments of the present disclosure, the suspension wire 15 may also be fixedly connected to the housing 25 .

Referring to FIG. 17, the structure of a mobile electronic device according to some embodiments of the present disclosure is schematically shown. As shown in FIG. 17 , the mobile electronic device 30 includes a camera module 31 . Mobile electronic device 30 may be any suitable electronic device such as, but not limited to, a smartphone, tablet computer, smart glasses, and the like. The camera module 31 may be any camera module described above, and may include any photosensitive assembly described above.

Referring to FIG. 18 , an optical anti-shake method according to some embodiments of the present disclosure is schematically shown in the form of a flowchart, which may be applied to a mobile electronic device 30 according to the present disclosure. As shown in the figure, the optical image stabilization method 100 includes the following steps:

In step 110, the offset direction and offset distance of the photosensitive chip 2 relative to the optical lens 27 are obtained;

at step 120, generating a pulsed voltage signal based on the offset direction and the offset distance; and

In step 130, the pulse voltage is applied to the piezoelectric element of the driving mechanism, so that the driving mechanism drives the circuit board 3, so that the photosensitive chip 2 and the optical lens 27 are realigned.

The optical anti-shake method 100 will be described in more detail below with reference to the photosensitive components shown in FIGS. 3 and 4 and the camera module shown in FIG. 15 . As a non-limiting example, in the mobile electronic device 30, the spatial positions and states of the optical lens 27 and the photosensitive chip 2 may be acquired by sensors, and corresponding sensing results may be generated. These sensing results may be sent to the controller of the mobile electronic device 30 . Based on these sensing results, the controller can determine the offset direction and offset distance and/or angle of the photosensitive chip 2 relative to the optical lens 27 . For example, but not limited to, the controller may compare the sensing result of the photosensitive chip 2 with the sensing result of the optical lens 27, thereby determining the corresponding offset direction and offset distance and/or angle. When the offset of the position of the photosensitive chip 2 relative to the position of the optical lens 27 is greater than a predetermined threshold, based on the determined offset direction and offset distance and/or angle, the controller of the mobile electronic device 30 may generate a corresponding control signal and send it to the corresponding control circuit. The control circuit is used to control the corresponding drive mechanism. Taking the photosensitive assembly shown in FIG. 3 and FIG. 4 as an example, the mobile electronic device 30 may include a first control circuit and a second control circuit, wherein the first control circuit is used to control the first driving mechanism 12a, and the second control circuit is used for for controlling the second driving mechanism 12b. The first control circuit and/or the second control circuit can generate pulse voltages with corresponding excitation frequencies, so that the resonators in the first driving mechanism 12a and/or the second driving mechanism 12b are in a corresponding vibration state, and drive the corresponding The follower moves so as to drive the circuit board 3 to move accordingly, until it is determined that the offset of the position of the photosensitive chip 2 relative to the position of the optical lens 27 is less than or equal to a predetermined threshold.

As a non-limiting example, the first control circuit may generate a pulse voltage having a first excitation frequency, and the pulse voltage may cause the resonator in the first driving mechanism 12a to have a vibration state as shown in FIG. 8, thereby driving the first The follower 121 in the drive mechanism 12a, and thus the drive circuit board 3, moves in the direction indicated by the X-axis shown in Figs. 3 and 4; the first control circuit can also generate a pulse voltage with a second excitation frequency , the pulse voltage can cause the resonator in the first driving mechanism 12a to have a vibration state as shown in FIG. 9, thereby driving the follower 121 in the first driving mechanism 12a, and thus driving the circuit board 3, along the 3. Movement in the opposite direction of the X-axis as shown in FIG. 4 ; the first control circuit can also generate a pulse voltage with a third excitation frequency, which can make the resonator in the first drive mechanism 12a have the effect shown in FIG. 10 . In the vibration state shown, the follower 121 in the first driving mechanism 12a can be driven, and thus the circuit board 3 can be driven to rotate around the X-axis shown in FIG. 3 and FIG. 4 . As a non-limiting example, the second control circuit may generate a pulse voltage having a first excitation frequency, which may cause the resonator in the second driving mechanism 12b to have a vibrating state as shown in FIG. 8, thereby driving the second The follower 121 in the drive mechanism 12b, and thus the drive circuit board 3, moves in the direction indicated by the Y axis as shown in Figures 3 and 4; the second control circuit can also generate a pulse voltage with a second excitation frequency , the pulse voltage can make the resonator in the second driving mechanism 12b have a vibration state as shown in FIG. 3. Movement in the opposite direction of the Y-axis as shown in FIG. 4 ; the second control circuit can also generate a pulse voltage with a third excitation frequency, which can make the resonator in the second drive mechanism 12b have the effect shown in FIG. 10 . In the vibration state shown, the follower 121 in the second driving mechanism 12b can be driven, and thus the circuit board 3 can be driven to rotate around the Y-axis shown in FIG. 3 and FIG. 4 . It should be understood that the first excitation frequency, the second excitation frequency and the third excitation frequency are different from each other. In addition, as a non-limiting example, it is easy to understand that when the first control circuit generates a pulse voltage with a first excitation frequency, the driven member 121 in the first driving mechanism 12a is driven along the lines shown in FIGS. 3 and 4 . The shown X axis moves in the direction pointed by, and at the same time, the second control circuit generates a pulse voltage with a second excitation frequency, so as to drive the follower 121 in the second driving mechanism 12b along the Y shown in FIG. 3 and FIG. 4 . When the shaft moves in the opposite direction, the first driving mechanism 12a and the second driving mechanism 12b cooperate with each other to drive the circuit board 3 to rotate around the Z axis shown in FIGS. 3 and 4 .

By implementing the optical anti-shake method applied to the mobile electronic device proposed by the present disclosure, for example, by applying a suitable pulse voltage, the driving mechanism of the photosensitive component in the mobile electronic device is controlled, so as to control the displacement and rotation angle of the circuit board 3 , thereby The position of the photosensitive chip 2 can be controlled for the unexpected shaking of the mobile electronic device, so that it can be re-aligned with the optical lens 27, thereby realizing the technical effect of five-axis optical image stabilization.

In addition, the photosensitive assembly according to the present disclosure combines the driving mechanism with the circuit board carrying the photosensitive chip, which can not only make the structure of the photosensitive assembly more compact and avoid occupying a larger space, but also is based on piezoelectric elements, resonators and slaves. The driving mechanism of the moving element can also provide a larger driving force, so it is suitable for driving heavier circuit board assemblies, especially for large-chip camera modules. In addition, since the driving mechanism according to the present disclosure excites the resonator through piezoelectric elements and uses different vibration modes of the resonator to drive the follower, the driving mechanism has sensitive response, high driving speed and high motion accuracy.

The terminology used herein is used only to describe the embodiments in the present disclosure and is not intended to limit the present disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It is also to be understood that the terms "comprising" and "comprising", when used in this disclosure, refer to the presence of the stated feature, but do not exclude the presence of one or more other features or the addition of one or more other features feature. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various features, these features should not be limited by these terms. These terms are only used to distinguish one feature from another.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is also to be understood that terms such as those defined in commonly used dictionaries should be construed to have meanings consistent with their meanings in the relevant art and/or the context of this specification, and should not be idealized or overly interpreted in a formal sense, unless expressly defined as such herein.

In the description of this specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples" and the like refer to specific features described in connection with the embodiment or example, A structure, material, or feature is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.

The various steps included in the methods described in this specification do not necessarily have to be performed in the order disclosed, but may be performed in a different order as desired. In addition, the disclosed method may also include other additional steps according to actual needs. It should be understood that the logic and/or steps represented in the flowcharts or otherwise described herein, for example, may be considered an ordered listing of executable instructions for implementing the logical functions, which may be embodied in any computer. readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device), or in combination with these used to execute a system, device or device. Furthermore, for the purposes of this specification, a "computer-readable medium" can be any medium that can contain, store, communicate, propagate, or transport the program for use by or in connection with an instruction execution system, apparatus, or apparatus. device.

Although the present disclosure has been described in detail in connection with some embodiments, it is not intended to be limited to the specific form set forth herein. Rather, the scope of the present disclosure is limited only by the appended claims.

Claims

A photosensitive assembly (1a, 1b, 1c, 1d), comprising:

a photosensitive chip (2), which is arranged to convert an image formed thereon into an electrical signal;

A circuit board (3) comprising circuit traces and configured to carry the photosensitive chip (2) and be electrically connected to the photosensitive chip (2);

At least one driving mechanism, each driving mechanism includes a piezoelectric element (123), a resonator (122) and a follower (121), the piezoelectric element (123) is arranged on the resonator (122), so The resonator (122) is arranged to movably clamp the follower (121), and is capable of driving the follower (121) to move relative to the resonator (122), the follower (121) ) is fixedly connected to the circuit board (3), whereby each drive mechanism is arranged to drive the circuit board (3) in motion in response to a pulsed voltage signal applied to the piezoelectric element (123).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 1, wherein:

the resonator (122) comprises a plurality of resonating arms (1221) connected to each other by connecting parts, each resonating arm (1221) comprising a contact part (1222);

The follower (121) is a rod whose one end is movably clamped by the contact portions (1222) of the plurality of resonance arms (1221).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 1 or 2, wherein the follower (121) is a round rod with a circular cross section.
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 1 to 3, wherein the at least one driving mechanism comprises a first driving mechanism (12a), the first driving mechanism (12a) ) is fixedly connected to the first transmission member (5a), which is fixedly connected to the first side surface (3a) of the circuit board (3).
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 1 to 4, wherein the photosensitive assembly (2) further comprises a first suspension (11a), the first suspension (11a) is fixedly connected to the second side (3b) of the circuit board (3) to elastically support the circuit board (3), the second side (3b) and the first side (3a) ) adjoining.
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 5, wherein the first suspension (11a) comprises a U-shaped piece (111) and at least one connecting piece (112), each connecting piece ( One end of 112) is fixedly connected to the bottom (1112) of the U-shaped piece (111), and is perpendicular to the plane where the U-shaped piece (111) is located, wherein the other end of each connecting piece (112) is fixedly connected to the the second side (3b).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 6, wherein the at least one connecting member (112) is a connecting member (112), and one end of the one connecting member (112) is fixedly connected to the midpoint of the bottom (1112) of the U-shaped piece (111).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 6 or 7, wherein the photosensitive assembly further comprises a first suspension wire (13a) and a second suspension wire (13b), which are arranged in pairs of the The circuit board (3) is elastically supported;

Wherein, the first end of the first suspension wire (13a) is fixedly connected to one end of the bottom (1112) of the U-shaped piece (111), and the second end of the first suspension wire (13a) is fixedly connected to the the first transmission member (5a);

Wherein, the first end of the second suspension wire (13b) is fixedly connected to the other end of the bottom (1112) of the U-shaped piece (111), and the second end of the second suspension wire (13b) is fixedly connected to the first mounting piece (5b), the first mounting piece (5b) is fixedly connected to the third side surface (3c) of the circuit board (3), and the third side surface (3c) is connected to the first side surface (3a) On the contrary.
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 4 to 8, wherein the at least one driving mechanism further comprises a second driving mechanism (12b), the second driving mechanism ( The follower (121) of 12b) is fixedly connected to the second transmission member (6a), and the second transmission member (6a) is fixedly connected to the second side surface (3b) of the circuit board (3).
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 5 to 9, wherein the photosensitive assembly (1a, 1b, 1c, 1d) further comprises a second suspension (11b), The second suspension (11b) is fixedly connected to the first side surface (3a) of the circuit board (3) to elastically support the circuit board (3).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 10, wherein the second suspension (11b) comprises a U-shaped piece (111) and at least one connecting piece (112), each connecting piece ( One end of 112) is fixedly connected to the bottom (1112) of the U-shaped member (111) of the second suspension (11b), and is perpendicular to where the U-shaped member (111) of the second suspension (11B) is located. A plane, wherein the other end of each connecting piece (112) is fixedly connected to the first side surface (3a).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 11, wherein at least one connecting piece (112) of the second suspension (11b) is a connecting piece (112), one end of which is fixedly connected to the midpoint of the bottom (1112) of the U-shaped piece (111) of the second suspension (11b).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 11, wherein the photosensitive assembly (1a, 1b, 1c, 1d) further comprises a third suspension wire (14a) and a fourth suspension wire (14b) ), which is arranged to elastically support the circuit board (3);

Wherein, the first end of the third suspension wire (14a) is fixedly connected to one end of the bottom (1112) of the U-shaped member (111) of the second suspension wire (11b), and the second suspension wire (14a) ) is fixedly connected to the second transmission member (6a);

Wherein, the first end of the second suspension wire (14b) is fixedly connected to the other end of the bottom (1112) of the U-shaped member (111) of the second suspension (11b), and the second suspension wire (11b) The second end of 14b) is fixedly connected to the second mounting piece (6b), the second mounting piece (6b) is fixedly connected to the fourth side surface (3d) of the circuit board (3), and the fourth side surface ( 3d) is opposite to said second side (3b).
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 1 to 3, wherein the at least one driving mechanism comprises:

a first drive mechanism (12a), the drive element of which is fixedly connected to the first side surface (3a) of the circuit board (3);

a second drive mechanism (12b), the drive element of which is fixedly connected to the second side (3b) of the circuit board (3);

a third drive mechanism (12c), the drive element of which is fixedly connected to the fourth side surface (3d) of the circuit board (3);

Wherein, the first side surface (3a) is adjacent to the second side surface (3b) and the fourth side surface (3d), and the second side surface (3b) is opposite to the fourth side surface (3d).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 14, wherein the photosensitive assembly (1a, 1b, 1c, 1d) further comprises a suspension wire (15), and the suspension wire (15) has One end is fixedly connected to the circuit board (3), and is arranged to elastically support the circuit board (3).
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 15, wherein the number of the suspension wires (15) is four.
The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 14 or 15, wherein the photosensitive assembly (1a, 1b, 1c, 1d) further comprises a spherical hinge (8), the spherical hinge (8) ) is fixedly connected to the circuit board (3) and arranged to elastically support the circuit board (3).
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 1 to 17, wherein the photosensitive assembly (1a, 1b, 1c, 1d) further comprises a filter (21) and a bracket (22), the filter (21) is arranged on the bracket (22), and the bracket (22) is arranged on the circuit board (3) on which the photosensitive chip (2) is carried on the bearing surface, so that the filter (21) is located on the optical path of the photosensitive chip (2), and the orthographic projection of the filter (21) on the circuit board (3) is completely covered The photosensitive chip (2).
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 1 to 18, wherein the photosensitive assembly (1a, 1b, 1c, 1d) further comprises a substrate (4) arranged to The at least one driving mechanism and the circuit board (3) are supported.
The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 1 to 19, wherein the photosensitive assembly (1a, 1b, 1c, 1d) further comprises a flexible circuit board (23), which It is arranged to electrically connect the circuit board (3) to a circuit connector (24) on the base plate (4).
A camera module (20a, 20b, 31), comprising:

The photosensitive assembly (1a, 1b, 1c, 1d) according to any one of claims 10 to 13;

an optical lens (27) arranged to collect light signals for imaging the light signals at the imaging surface of the photosensitive chip (2);

A focus driving mechanism (26), which is arranged to be able to move the optical lens (27) relative to the photosensitive chip (2), so that the photosensitive chip (2) is in the focal depth range of the optical lens (27) Inside;

a housing (25) configured to support the optical lens (27) and the focus drive mechanism (26);

Wherein, the casing (25) surrounds the photosensitive components (1a, 1b, 1c, 1d), the optical lens (27) is movably mounted on the casing (25), and the optical lens ( The optical axis of 27) coincides with the optical axis of the photosensitive chip (2), and the focus driving mechanism (26) is fixedly mounted on the housing (25) and located at the periphery of the optical lens (27).
The camera module (20a, 20b, 31) of claim 21, wherein one of the first suspension (11a) and the second suspension (11b) is fixedly connected to the focus drive Agency (26).
The camera module (20a, 20b, 31) of claim 21 or 22, wherein one of the first suspension (11a) and the second suspension (11b) is fixedly connected to the housing (25).
A camera module (20a, 20b, 31), comprising:

The photosensitive assembly (1a, 1b, 1c, 1d) according to claim 15 or 16;

an optical lens (27) arranged to collect light signals for imaging the light signals at the imaging surface of the photosensitive chip (2);

A focus driving mechanism (26), which is arranged to be able to move the optical lens (27) relative to the photosensitive chip (2), so that the photosensitive chip (2) is in the focal depth range of the optical lens (27) Inside;

a housing (25), the housing (25) is configured to support the optical lens (27) and the focus driving mechanism (26);

Wherein, the casing (25) surrounds the photosensitive components (1a, 1b, 1c, 1d), the optical lens (27) is movably mounted on the casing (25), and the optical lens ( 27) The optical axis coincides with the optical axis of the photosensitive chip (2), the focus driving mechanism (26) is fixedly mounted on the housing (25), and is located at the periphery of the optical lens (27), The other end of the suspension wire (15) is fixedly connected to the focus driving mechanism (26).
A mobile electronic device (30), comprising the camera module (20a, 20b, 31) according to any one of claims 21 to 24.
An optical anti-shake method (100), which can be applied to the mobile electronic device (30) according to claim 25, the optical anti-shake method (100) comprising:

acquiring the offset direction and offset distance of the photosensitive chip (2) relative to the optical lens (27);

generating a pulsed voltage signal based on the offset direction and the offset distance;

The pulse voltage is applied to the piezoelectric element (123) of the driving mechanism, so that the driving mechanism drives the circuit board (3), so that the photosensitive chip (2) and the optical lens (27) are connected ) to realign.