CN114793258B - Camera module and terminal equipment - Google Patents
Camera module and terminal equipment Download PDFInfo
- Publication number
- CN114793258B CN114793258B CN202110097866.9A CN202110097866A CN114793258B CN 114793258 B CN114793258 B CN 114793258B CN 202110097866 A CN202110097866 A CN 202110097866A CN 114793258 B CN114793258 B CN 114793258B
- Authority
- CN
- China
- Prior art keywords
- camera module
- tuning fork
- circuit board
- flexible circuit
- photosensitive chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 33
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention discloses a camera module and terminal equipment, relates to the technical field of camera modules, and solves the technical problem that the structure of the camera module in the prior art is large. The camera module comprises a camera component, a flexible component, a tuning fork piezoelectric component and a conducting piece, wherein the flexible component is carried with a photosensitive chip, the tuning fork piezoelectric component is fixed with the camera component, the conducting piece is fixed with the photosensitive chip, and the conducting piece is connected with the tuning fork piezoelectric component in a sliding manner. After the tuning fork piezoelectric component is electrified, vibration with a certain frequency can be generated, and then the photosensitive chip is driven to move, so that the focusing function is realized. The tuning fork piezoelectric structure mode is adopted, and the conduction piece can be driven to rise and fall through different vibration frequencies by changing the voltage. The voice coil motor driving the camera component to move is canceled, and the tuning fork piezoelectric structure is adopted to drive the photosensitive chip to move, so that the shoulder height of the camera module is smaller and the size is smaller.
Description
Technical Field
The invention relates to the technical field of camera modules, in particular to a camera module and terminal equipment.
Background
In the related art, an auto-focusing camera module is capable of achieving an auto-focusing function through lens movement. Such a construction requires a separate, integral voice coil motor to drive the movement of the lens, and an integral voice coil motor is typically bulky, ultimately resulting in a camera module with a large shoulder height. As a front camera, the screen ratio of terminal equipment represented by a mobile phone is required to be more than 96%, so that the size of an opening of the screen is required to be smaller, and an automatic focusing module for driving a lens to move by adopting a conventional voice coil motor cannot meet the requirement of miniaturization of the camera module.
Disclosure of Invention
In view of the above, the present invention aims to overcome the shortcomings of the prior art, and in a first aspect, a camera module is provided to solve the technical problem that the size of the camera module is large due to the adoption of a voice coil motor to drive a lens to move.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a camera module, comprising:
A camera assembly;
The camera component is fixedly arranged with the flexible component, the flexible component comprises a carrying part and an elastic part which are connected, and a photosensitive chip which is arranged opposite to the camera component is carried on the carrying part;
The tuning fork piezoelectric assembly is fixedly connected with the camera assembly; and
The conducting piece is fixedly connected with the photosensitive chip and is in sliding connection with the tuning fork piezoelectric component;
wherein, the tuning fork piezoelectric assembly can drive the photosensitive chip to move through the vibration of the conducting piece.
On the basis of the technical scheme, the camera module can be improved as follows.
Optionally, the carrying part and the elastic part are integrally formed flexible structures.
Optionally, the flexible component includes the flexible circuit board, the one end of flexible circuit board is buckled, the terminal surface of buckling of flexible circuit board sets up carry-on position, the connecting portion of buckling of flexible circuit board sets up elasticity position.
Optionally, the flexible part includes the flexible circuit board, the fretwork position has been seted up to the flexible circuit board, the middle part after the flexible circuit board fretwork sets up carry-on position, the edge position after the flexible circuit board fretwork sets up the frame position, other positions after the flexible circuit board fretwork set up the elasticity position.
Optionally, the tuning fork piezoelectric assembly comprises a tuning fork and a piezoelectric electrode, the tuning fork comprises a tuning fork body and a fork arm, the piezoelectric electrode is connected with the tuning fork body, and the conducting piece is connected with the fork arm in a sliding mode.
Optionally, the piezoelectric electrode includes electrically connected conductive portion and electrode portion, electrode portion is fixed in through the preforming tuning fork body, conductive portion is used for acquireing voltage.
Optionally, one of the conductive parts and the two electrode parts are integrally formed into a U-shaped structure, and the two electrode parts are respectively fixed on two sides of the tuning fork body.
Optionally, two conducting pieces are provided, the two conducting pieces are slidably connected to the outer side or the inner side of the tuning fork piezoelectric assembly, and a resonance piece is connected between the two conducting pieces.
Optionally, the flexible component is connected with a carrier plate, and the photosensitive chip is connected with the carrier plate.
Optionally, the carrier plate is connected with a bracket, and the conductive member is connected to the bracket.
Optionally, the camera module further includes a housing and a base, the camera module is fixedly connected with the housing, the flexible component and the tuning fork piezoelectric module are fixedly connected with the base respectively, and the housing is connected with the base.
Optionally, the support is provided with an optical filter, and the optical filter is located between the camera component and the photosensitive chip.
Optionally, the support is provided with a mounting groove for mounting the position magnetic part, and the base is connected with a position sensor which is arranged opposite to the position magnetic part.
Optionally, the support is provided with the guide way, the base is connected and is fixed with the guide post, the support is through the guide way with the sliding fit of guide post is right the removal direction of sensitization chip.
Optionally, the carrying part can drive the photosensitive chip to move along the optical axis direction of the camera module, and/or the carrying part can drive the photosensitive chip to move or twist perpendicular to the optical axis direction of the camera module.
In a second aspect, the invention further provides a terminal device, which comprises the camera module.
Compared with the prior art, the camera module provided by the invention has the beneficial effects that:
According to the invention, the tuning fork piezoelectric assembly is fixedly connected with the camera assembly, the conducting piece is fixedly connected with the photosensitive chip, and when the tuning fork piezoelectric assembly is electrified, vibration with a certain frequency can be generated.
The invention adopts a tuning fork piezoelectric structure mode, and can drive the conduction piece to rise or fall through different vibration frequencies by changing the voltage. According to the invention, a voice coil motor for driving the camera component to move is omitted, and the tuning fork piezoelectric structure is adopted to directly drive the photosensitive chip to move, so that the shoulder height of the camera module is smaller and the size is smaller.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an exploded view of a camera module according to the present invention;
FIG. 2 is a schematic cross-sectional side view of the camera module of FIG. 1;
FIG. 3 is a schematic diagram of a cross-sectional structure of the other side of the camera module of FIG. 1;
FIG. 4 is a schematic perspective view of the tuning fork of FIG. 1;
FIG. 5 is a schematic perspective view of the piezoelectric electrode of FIG. 1;
FIG. 6 is a schematic perspective view of the conductive element of FIG. 1;
FIG. 7 is another perspective view of the tuning fork of FIG. 1 coupled to a conductive member;
FIG. 8 is a schematic diagram of a perspective structure of the flexible circuit board of FIG. 1;
FIG. 9 is another perspective view of the flexible circuit board of FIG. 1;
FIG. 10 is a schematic view of another perspective structure of the flexible circuit board of FIG. 1;
fig. 11 is a schematic view of another perspective structure of the flexible circuit board in fig. 1.
In the figure:
10-a camera assembly; 20-a housing; 30-a bracket; 31-mounting groove; 32-a guide groove; 33-a conductive member; 331—a resonant member; 34-position magnetic member; 40-an optical filter; 50, a photosensitive chip; 60-tuning fork; 61-tuning fork body; 62-yoke; 63-tabletting; 70-piezoelectric electrodes; 71-a conductive part; 72-an electrode portion; 80-a flexible circuit board; 81-mounting part; 82-a bent connection; 83-a frame part; 831-first contact site; 832-first bend; 841-second contact location; 842-inner frame portion; 843-third contact site; 851-fourth contact location; 852-a second bend region; 86—a carrier plate; 90-base; 91-a position sensor; 92-guiding columns.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are only some of the embodiments of the present invention and not all the embodiments. All other embodiments, based on the examples herein, which are within the scope of the invention as defined by the claims, will be within the scope of the invention as defined by the claims.
Examples:
the invention provides a camera module, as shown in fig. 1 to 3, comprising a camera assembly 10, wherein the camera assembly 10 generally comprises a lens barrel, a plurality of lenses, a spacer ring and other components stacked together. The camera module obtains an image signal through the camera module 10, and the image signal is projected on the photosensitive chip 50 and converted into an electrical signal to be sent to the processor.
As shown in fig. 1 to 3, a housing 20 is connected to the camera module 10. The housing 20 is generally a semi-box structure with an open top and an open bottom. The camera assembly 10 is attached to the top outside of the housing 20 by means including, but not limited to, adhesive, screw attachment, snap attachment, or integral molding. Wherein the image signal acquired by the camera assembly 10 is transmitted through the top opening. Of course, the housing 20 may be designed into various forms such as a cylinder, a box, or a frame, and the specific structure of the housing 20 is not limited in this embodiment. In addition, after the housing 20 is fixedly connected with the camera assembly 10, the generated driving force can be controlled below the camera assembly 10, so that the camera assembly 10 can realize an automatic focusing function under the condition that the camera assembly 10 does not move.
As shown in fig. 1 to 3, a base 90 is connected to the bottom of the housing 20, and the inside of the base 90 is sunk to provide a sufficient movement space for the photosensitive chip 50. The manner of attachment of the housing 20 to the base 90 includes, but is not limited to, adhesive, screw attachment, or snap attachment. Of course, the base 90 may be designed in a circular, ring-shaped or polygonal configuration, depending on the actual configuration of the housing 20.
As shown in fig. 1 to 3, the housing 20 is connected with the base 90 to form a housing structure, and the housing structure is fixedly connected with a flexible component, and the flexible component is at least partially disposed inside the housing structure and is used for driving the photosensitive chip 50 to move. In some embodiments, the flexible component may be a flexible circuit board 80, where the flexible circuit board 80 includes a mounting portion 81 and an elastic portion, and the mounting portion 81 is used to mount the photosensitive chip 50 disposed opposite to the camera module 10. The flexible circuit board 80 is at least partially fixed inside the housing structure within which the photosensitive chip 50 can move.
It can be understood that the flexible component can be made of other elastic materials such as silica gel, rubber, etc., and the photosensitive chip 50 is only required to be separately connected with the circuit board. However, in this embodiment, the flexible circuit board 80 is directly selected as a flexible component, which not only can play a role in moving the mounted photosensitive chip 50 along the optical axis direction of the camera module 10, but also can play a role in conducting electricity and transmitting data to the photosensitive chip 50. The adoption of the flexible circuit board 80 can realize functional integration, and is beneficial to reducing the arrangement of other parts, thereby being beneficial to reducing the volume of the whole camera module. In addition, the versatility of the flexible circuit board 80 facilitates a reduction in the number of associated components, thereby reducing costs.
As shown in fig. 4 to 6, the tuning fork piezoelectric assembly includes a tuning fork 60 and a piezoelectric electrode 70, and the tuning fork 60 has a substantially Y-shaped metal plate-like structure. Wherein the tuning fork 60 includes a tuning fork body 61 and prongs 62, the two prongs 62 extend to the outside of the tuning fork body 61, and the tuning fork body 61 is fixed on the base 90. The piezoelectric electrode 70 includes an integrally formed conductive portion 71 and an electrode portion 72, the electrode portion 72 is bent to form a U-shaped structure, and the two electrode portions 72 are attached to the tuning fork body 61 to drive the tuning fork 60 to vibrate. The conductive portion 71 of the piezoelectric electrode 70 is electrically connected to the flexible circuit board 80 for providing the electrode portion 72 with a voltage. Of course, the piezoelectric electrode 70 may be configured as a separate structure in which one conductive portion 71 is connected to one electrode portion 72, and the electrode portions 72 of the two separate structures may be fixed to the tuning fork body 61.
The electrode portion 72 may be pressed against the tuning fork body 61 by the pressing piece 63, or may be stuck to the tuning fork body 61 by silver paste. The conductive member 33 is slidably coupled to the yoke 62, and as shown in fig. 7, the conductive member 33 may be slidably coupled to the outside of the yoke 62 or may be slidably coupled to the inside of the yoke 62. The resonance member 331 may be connected between the two conductive members 33 under the condition that the assembly space allows, so as to ensure that the frequencies of vibrations received by the two conductive members 33 are uniform. If the assembly space conditions are limited, the resonator 331 may not be provided, but only the frequency of vibration of the two conductors 33 may be controlled by voltage.
After the piezoelectric electrodes 70 obtain an ac voltage from the flexible circuit board 80, the two electrode portions 72 located at both sides of the tuning fork body 61 drive the tuning fork body 61 to vibrate, and the tuning fork body 61 drives the two prongs 62 to move in resonance. After the vibration, the conductive member 33 is slid up with respect to the yoke 62 at one vibration frequency and is slid down with respect to the yoke 62 at another vibration frequency.
It will be appreciated that, depending on the structural dimensions of the tuning fork 60, two piezoelectric electrodes 70 may be fixed to the two prongs 62, respectively, and the voltage of the two piezoelectric electrodes 70 may be controlled, so that the function of lifting and sliding the conductive member 33 relative to the prongs 62 may be achieved. The tuning fork 60 may be a metal sheet structure made of nickel, chromium, titanium or alloy materials thereof, the piezoelectric electrode 70 may be made of piezoelectric ceramics, and the conductive member 33 may be made of the same material as the tuning fork 60.
As shown in fig. 8, as an embodiment, one end of the flexible circuit board 80 is bent and formed, the bent end portion becomes a mounting portion 81, and the bent connection portion 82 becomes an elastic portion, that is, the mounting portion 81 can be moved or reset in the optical axis direction of the camera module 10 by the elastic action of the bent connection portion 82. The number of times the flexible circuit board 80 is bent may be one or more times.
According to the actual wiring condition of the flexible circuit board 80, the flexible circuit board 80 can be bent once to form a U-shaped structure; the flexible circuit board 80 may also be bent twice to form a Z-shaped or 匚 -shaped structure; it is also possible to bend more times to form more structural shapes. Meanwhile, depending on the specific shape of the housing structure, the specific bending shape of the flexible circuit board 80 may be selected. For example, the mounting portion 81 after bending is parallel to the flexible circuit board 80 which is not bent; or the mounting portion 81 after bending and the flexible circuit board 80 without bending are positioned on the same side or opposite sides of the bending connection portion 82.
As shown in fig. 9, in another embodiment, the flexible circuit board 80 is provided with a hollowed-out portion, the hollowed-out middle area becomes a mounting portion 81, the hollowed-out edge portion becomes a frame portion 83, and the rest portion after hollowed-out becomes an elastic portion. The elastic part comprises a first contact part 831 and a first bending part 832, the first bending part 832 is in an L-shaped bent plate structure, two ends of the first bending part 832 are respectively connected with two first contact parts 831, and the two first contact parts 831 are respectively connected with the carrying part 81 and the frame part 83, so that the whole flexible circuit board 80 is conducted. One or more first bending portions 832 may be provided between the mounting portion 81 and the frame portion 83 along the circumferential direction of the mounting portion 81. In this embodiment, four equally divided first bending portions 832 are selected in the circumferential direction of the mounting portion 81. Multiple sets of traces can be disposed on each set of the first contact portion 831 and the first bending portion 832, and the widths of the first contact portion 831 and the first bending portion 832 can be set according to the trace requirements. The widths of the first contact portion 831 and the first bending portion 832 may be the same or different. Of course, the shape of the first bending portion 832 is not limited to the L shape, and the first bending portion 832 may be designed in a bow shape, an arc shape, or a wave shape.
It can be appreciated that, due to the connection between the mounting portion 81 and the frame portion 83 via the first contact portion 831 and the first bending portion 832, the mounting portion 81 can be elastically lifted with respect to the frame portion 83, so that the photosensitive chip 50 can be moved or reset along the optical axis direction of the camera assembly 10. That is, the elastic portion plays a role in not only elastically moving the photosensitive chip 50 but also conducting electricity and transmitting signals between the mounting portion 81 and the frame portion 83. Optionally, the mounting portion 81, the first contact portion 831, the first bending portion 832, and the frame portion 83 may be integrally formed by etching, so as to reduce manufacturing difficulty of the component.
As another embodiment, as shown in fig. 10, the flexible circuit board 80 is also provided with a hollowed-out portion. The elastic portion includes a second contact portion 841, an inner frame portion 842, and a third contact portion 843. The inner frame portion 842 is provided between the mounting portion 81 and the frame portion 83, the mounting portion 81 and the inner frame portion 842 are connected by the third contact portion 843, and the inner frame portion 842 and the frame portion 83 are connected by the second contact portion 841. The two second contact portions 841 are disposed opposite to each other, the two third contact portions 843 are disposed opposite to each other, the second contact portions 841 are perpendicular to the third contact portions 843, the entire flexible circuit board 80 is similarly conducted, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second contact portion 841 and the third contact portion 843 may be configured in various manners such as arc arrangement, annular arrangement or inclined arrangement. The inner frame portion 842 may also be designed as a multi-segment split L-shaped or half-frame structure.
It is understood that the mounting portion 81, the second contact portion 841, the inner frame portion 842, the third contact portion 843, and the frame portion 83 may be integrally formed by etching, so as to reduce the difficulty in manufacturing the components. This structure makes the elastic rigidity of the mounting portion 81 large, and is suitable for movement control of the photosensitive chip 50 which is more sensitive. Meanwhile, due to the annular arrangement of the inner frame portion 842, the wiring mode of the flexible circuit board 80 can be more flexible.
As yet another embodiment, as shown in fig. 11, the flexible circuit board 80 is also provided with a hollowed-out portion. The elastic portion includes a fourth contact portion 851 and a second bending portion 852 of the bar-shaped structure. Both ends of the second bending portion 852 are connected to the mounting portion 81 and the frame portion 83 via two fourth contact portions 851, respectively. The second bending portion 852 is connected to the two fourth contact portions 851 to form a strip-shaped structure having an overall bent shape, and a plurality of strip-shaped structures having a bent shape are connected side by side between the mounting portion 81 and the frame portion 83. The entire flexible circuit board 80 is also turned on, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second bending portion 852 may be configured in a bar-shaped structure such as an arcuate shape, an arc shape, or a wave shape. Similarly, the mounting portion 81, the fourth contact portion 851, the second bending portion 852, and the frame portion 83 may be integrally formed by etching.
It can be understood that the hollowed-out portion refers to a hollowed-out portion on the flexible circuit board 80, and the rigidity of the mounting portion 81 in elastic lifting is different due to the structural form of different elastic portions. At the same time, the conductive properties of the flexible circuit board 80 are made different. The flexible circuit board 80 having a different elastic portion structure may be selected according to different models or specifications of the photosensitive chip 50 mounted on the mounting portion 81.
It should be noted that, due to the structural design of the mounting portion and the elastic portion, the flexible circuit board 80 is not only suitable for a scene in which the photosensitive chip 50 moves along the optical axis direction of the camera module 10, but also suitable for an application of the photosensitive chip 50 in a camera module anti-shake scene. That is, the photosensitive chip 50 can move in the vertical direction of the plane of the flexible circuit board 80, and can also move or twist in the direction of the plane of the flexible circuit board 80.
As shown in fig. 8 to 11, the flexible circuit board 80 includes a mounting portion 81 and an elastic portion that are electrically connected, and the mounting portion 81 is used for mounting the photosensitive chip 50 disposed opposite to the camera module 10. As shown in fig. 8, the flexible circuit board 80 is bent and formed, the bent portion of the flexible circuit board 80 forms a mounting portion 81, and the bent portion bending connection portion 82 of the flexible circuit board 80 forms an elastic portion, that is, the mounting portion 81 can move or return to the optical axis direction of the camera module 10 under the elastic action of the bent portion bending connection portion 82.
As shown in fig. 9, as another embodiment, the flexible circuit board 80 is provided with hollowed-out portions, the hollowed-out portions are distributed along the circumferential direction of the central area of the flexible circuit board 80, the central area forms a carrying portion 81, and the rest portions after the hollowed-out portions are hollowed out form elastic portions. The elastic portion includes a first contact portion 831 and a first bending portion 832, and a border portion 83 is formed at the hollowed edge of the flexible circuit board 80. The first bending portion 832 is in an L-shaped bent plate structure, two ends of the first bending portion 832 are respectively and electrically connected with two first contact portions 831, and the two first contact portions 831 are respectively and electrically connected with the carrying portion 81 and the frame portion 83, so that the whole flexible circuit board 80 is conducted.
It can be appreciated that, due to the connection between the mounting portion 81 and the frame portion 83 via the first contact portion 831 and the first bending portion 832, the mounting portion 81 can be elastically lifted with respect to the frame portion 83, so that the photosensitive chip 50 can be moved or reset along the optical axis direction of the camera assembly 10. The elastic portion plays a role in not only elasticity of the photosensitive chip 50 but also conduction between the mounting portion 81 and the frame portion 83. Of course, the first bending portion 832 may be designed in a plate-type structure such as an arcuate shape, an arc shape or a wave shape according to the elastic rigidity of the mounting portion 81.
As another embodiment, as shown in fig. 10, the flexible circuit board 80 is also provided with a hollowed-out portion. The elastic portion includes a second contact portion 841, an inner frame portion 842, and a third contact portion 843. The inner frame portion 842 is provided between the mounting portion 81 and the frame portion 83, the mounting portion 81 and the inner frame portion 842 are connected by the third contact portion 843, and the inner frame portion 842 and the frame portion 83 are connected by the second contact portion 841. The two second contact portions 841 are disposed opposite to each other, the two third contact portions 843 are disposed opposite to each other, the second contact portions 841 are perpendicular to the third contact portions 843, the entire flexible circuit board 80 is similarly conducted, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second contact portion 841 and the third contact portion 843 may be configured in various manners such as arc arrangement, annular arrangement or inclined arrangement.
It will be appreciated that the inner frame portion 842 may also be designed as a multi-segment split L-shaped or half-frame structure depending on the spring stiffness requirements of the mounting portion 81.
As yet another embodiment, as shown in fig. 11, the flexible circuit board 80 is also provided with a hollowed-out portion. The elastic portion includes a fourth contact portion 851 and a second bending portion 852. Both ends of the second bending portion 852 are connected to the mounting portion 81 and the frame portion 83 via two fourth contact portions 851, respectively. The second bending portion 852 is connected to the two fourth contact portions 851 to form a strip-shaped structure having an overall bent shape, and a plurality of strip-shaped structures having a bent shape are connected side by side between the mounting portion 81 and the frame portion 83. The entire flexible circuit board 80 is also turned on, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second bending portion 852 may be configured in a bar-like structure such as an arcuate shape, an arc shape, or a wave shape, according to the elastic rigidity of the mounting portion 81.
It can be understood that the hollowed-out portion refers to a hollowed-out portion on the flexible circuit board 80, and the rigidity of the mounting portion 81 in elastic lifting is different due to the structural form of different elastic portions. At the same time, the conductive properties of the flexible circuit board 80 are made different. The flexible circuit board 80 having a different elastic portion structure may be selected according to different models or specifications of the photosensitive chip 50 mounted on the mounting portion 81.
As shown in fig. 1 to 3, after the housing 20 is connected to the base 90, the non-bent portion or the frame portion 83 of the flexible circuit board 80 is fixed so that the mounting portion 81 is located in the middle region of the base 90. The middle area of the base 90 is a sink structure, so as to provide a space for lifting the carrying part 81. The carrier plate 86 is fixedly connected to the mounting portion 81, and the carrier plate 86 is integrally formed in a plate structure, and the carrier plate 86 may be connected to the mounting portion 81 as a separate structure or may be integrally formed with the mounting portion 81. Of course, the carrier plate 86 may also be designed with a groove adapted to the photosensitive chip 50, and when the photosensitive chip 50 is mounted on the carrier plate 86, the surface of the photosensitive chip 50 is flush with the surface of the carrier plate 86. The mounting portion 81 is electrically connected to the carrier 86, and the photosensitive chip 50 is electrically connected to the carrier 86.
As shown in fig. 1 to 3, the carrier 86 is fixedly connected with the frame-structured bracket 30, and the bracket 30 is integrally formed with the conductive member 33 by embedding injection molding, but it is also possible to fix the conductive member 33 to the bracket 30 by adhesion. The middle part of the bracket 30 is hollowed out, the outer side of the side wall of the bracket 30 is provided with a mounting groove 31, the position magnetic part 34 is mounted in the mounting groove 31 of the bracket 30 in a plug-in mounting mode, and the photosensitive chip 50 is positioned in the hollowed-out position of the middle part of the bracket 30. The base 90 is fixedly connected with a position sensor 91, the position sensor 91 is electrically connected with the carrier plate 86, and the position sensor 91 is opposite to the position magnetic member 34.
The position sensor 91 includes, but is not limited to, a hall sensor or a TMR magnetic sensor, etc., and the position sensor 91 may be disposed opposite to the position magnetic member 34, or may be disposed diagonally to the position magnetic member 34, so long as the position sensor 91 is capable of sensing a change in the magnetic field angle of the position magnetic member 34. The carrier 86 may be integrally formed with the mounting portion 81, or may be made of a material such as a hard circuit board, a conductive aluminum foil, or a copper sheet.
As shown in fig. 1 to 3, an installation step is arranged in the side wall of the bracket 30, a light filter 40 is arranged in the hollow position in the middle of the bracket 30, and the light filter 40 is located between the camera component 10 and the photosensitive chip 50 and is used for filtering useless light waves. The diagonal position of the side wall of the bracket 30 is also provided with a guide groove 32, the base 90 is fixedly connected with a guide post 92, and when the bracket 30 moves up and down, the guide groove 32 can directionally slide through the guide post 92.
It will be appreciated that, depending on the specific structural shapes of the base 90 and the bracket 30, the guide grooves 32 may be formed in the middle or four corners of the side walls of the bracket 30, and the corresponding guide posts 92 may be provided on the base 90. Of course, the directional lifting movement structure of the support 30 can also be designed in a way that the balls are matched with the rolling grooves.
The principle of the invention for realizing automatic focusing is as follows: the piezoelectric electrode 70 is powered from the flexible circuit board 80 to drive the tuning fork 60 to vibrate, the tuning fork 60 transmits the vibration to the conductive member 33, and the conductive member 33 is lifted and lowered by the vibration. Since the conducting piece 33 is fixedly connected with the bracket 30, the conducting piece 33 can drive the photosensitive chip 50 to do lifting motion through the bracket 30. The camera module 10 is fixed on the housing 20, and a guiding structure is arranged between the bracket 30 and the base 90, so that the photosensitive chip 50 can move along the optical axis direction of the camera module 10. The image signal obtained by the camera assembly 10 sequentially passes through the opening at the top of the housing 20, the optical filter 40 and the hollow position in the middle of the bracket 30, and finally forms an image on the photosensitive chip 50. At the same time, the position sensor 91 acquires the relative position of the position magnetic member 34 in real time, and feeds back the focal length of the auto-focus.
The invention drives the photosensitive chip 50 to move along the optical axis direction of the camera component 10 by a tuning fork piezoelectric structure mode, has compact structure and fewer parts, and is convenient for assembly. Meanwhile, according to camera modules of different sizes, the tuning fork 60 can be designed to be of smaller structural size, so that the shoulder height and the size of the camera module are smaller. The invention fully utilizes the flexible characteristic of the flexible circuit board 80, designs the flexible circuit board 80 into a combination form of the carrying part 81 and the elastic part, not only realizes the circuit function of the flexible circuit board 80, but also plays a role in supporting and elasticity of the photosensitive chip 50. The design of the voice coil motor is eliminated relative to the prior art.
In addition, unlike the prior art, the invention adjusts the focal length by driving the photosensitive chip 50to move along the optical axis direction of the camera module, and the whole shoulder height of the camera module is certain for the whole camera module in the use process, thereby being beneficial to the determination of the installation space of the camera module. However, the camera module in the prior art is unfavorable for determining the installation space of the camera module due to the shoulder height change of the camera module in the use process caused by the movement of the driving camera module 10.
It will be appreciated that the invention is not limited to a particular number of tuning fork piezoelectric assemblies. According to the actual stress requirement of the camera module, multiple groups of tuning fork piezoelectric assemblies can be used for driving the photosensitive chip 50 at the same time, and the multiple groups of tuning fork piezoelectric assemblies can be symmetrically arranged relative to the photosensitive chip 50 so as to ensure the moving stability of the photosensitive chip 50.
The invention also provides terminal equipment comprising the camera module in the embodiment. The terminal equipment comprises, but is not limited to, mobile phones, tablets or notebook computers and the like, and can be provided with the camera module only by opening holes with smaller sizes.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention.
Claims (15)
1. A camera module, comprising:
A camera assembly (10);
The camera assembly (10) is fixedly arranged with the flexible component, the flexible component comprises a carrying part (81) and an elastic part which are connected, and the carrying part (81) carries a photosensitive chip (50) which is arranged opposite to the camera assembly (10);
The tuning fork piezoelectric assembly is fixedly connected with the camera assembly (10); and
A conductive member (33), wherein the conductive member (33) is fixedly connected with the photosensitive chip (50), and the conductive member (33) is slidably connected with the tuning fork piezoelectric assembly;
Wherein the tuning fork piezoelectric assembly is capable of driving the photosensitive chip (50) to move by vibration of the conductive member (33);
The flexible component comprises a flexible circuit board (80), the flexible circuit board (80) is provided with a hollowed-out part, the middle part of the hollowed-out flexible circuit board (80) is provided with a carrying part (81), the edge part of the hollowed-out flexible circuit board (80) is provided with a frame part (83), and the rest parts of the hollowed-out flexible circuit board (80) are provided with elastic parts;
The elastic part comprises a second contact part, an inner frame part and a third contact part, the inner frame part is arranged between the carrying part and the frame part, the carrying part is connected with the inner frame part through the third contact part, the inner frame part is connected with the frame part through the second contact part, two second contact parts are oppositely arranged, two third contact parts are oppositely arranged, and the second contact part is perpendicular to the third contact part;
the mounting part, the second contact part, the inner frame part, the third contact part and the frame part are integrally formed by etching.
2. Camera module according to claim 1, characterized in that the mounting portion (81) and the elastic portion are of an integrally formed flexible structure.
3. The camera module according to claim 2, wherein the flexible member includes a flexible circuit board (80), one end of the flexible circuit board (80) is bent, a bent end surface of the flexible circuit board (80) is provided with the mounting portion (81), and a bent connection portion (82) of the flexible circuit board (80) is provided with the elastic portion.
4. The camera module of claim 1, wherein the tuning fork piezoelectric assembly comprises a tuning fork (60) and a piezoelectric electrode (70), the tuning fork (60) comprising a tuning fork body (61) and a fork arm (62), the piezoelectric electrode (70) being connected to the tuning fork body (61), the conductive member (33) being slidably connected to the fork arm (62).
5. The camera module according to claim 4, wherein the piezoelectric electrode (70) includes a conductive portion (71) and an electrode portion (72) electrically connected, the electrode portion (72) is fixed to the tuning fork body (61) by a pressing piece (63), and the conductive portion (71) is used for acquiring a voltage.
6. The camera module according to claim 5, wherein one of the conductive portions (71) and two of the electrode portions (72) are integrally formed into a U-shaped structure, and the two electrode portions (72) are respectively fixed to both sides of the tuning fork body (61).
7. Camera module according to any of claims 1 to 6, characterized in that two of the conductive elements (33) are provided, two of the conductive elements (33) being slidably connected to the outside or inside of the tuning fork piezoelectric assembly, a resonator element (331) being connected between the two conductive elements (33).
8. The camera module of claim 1, wherein the flexible member is connected to a carrier plate (86), and the photosensitive chip (50) is connected to the carrier plate (86).
9. Camera module according to claim 8, characterized in that the carrier plate (86) is connected with a bracket (30), the conducting element (33) being connected to the bracket (30).
10. The camera module of claim 9, further comprising a housing (20) and a base (90), wherein the camera module (10) is fixedly connected to the housing (20), wherein the flexible member and the tuning fork piezoelectric assembly are fixedly connected to the base (90), respectively, and wherein the housing (20) is connected to the base (90).
11. Camera module according to claim 9, characterized in that the holder (30) is mounted with a filter (40), the filter (40) being located between the camera module (10) and the light sensitive chip (50).
12. Camera module according to claim 10, characterized in that the bracket (30) is provided with a mounting groove (31) for mounting a position magnetic member (34), and the base (90) is connected with a position sensor (91) arranged opposite to the position magnetic member (34).
13. Camera module according to claim 10, characterized in that the support (30) is provided with a guiding groove (32), the base (90) is fixedly connected with a guiding post (92), and the support (30) guides the movement of the photosensitive chip (50) through the sliding fit of the guiding groove (32) and the guiding post (92).
14. Camera module according to claim 1, characterized in that the mounting part (81) can drive the photosensitive chip (50) to move along the optical axis direction of the camera module, and/or the mounting part (81) can drive the photosensitive chip (50) to move or twist perpendicular to the optical axis direction of the camera module.
15. A terminal device comprising the camera module of any one of claims 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110097866.9A CN114793258B (en) | 2021-01-25 | 2021-01-25 | Camera module and terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110097866.9A CN114793258B (en) | 2021-01-25 | 2021-01-25 | Camera module and terminal equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114793258A CN114793258A (en) | 2022-07-26 |
| CN114793258B true CN114793258B (en) | 2024-04-30 |
Family
ID=82459287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110097866.9A Active CN114793258B (en) | 2021-01-25 | 2021-01-25 | Camera module and terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114793258B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484368B (en) * | 2022-08-02 | 2024-03-12 | Oppo广东移动通信有限公司 | Imaging module and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003032537A (en) * | 2001-07-13 | 2003-01-31 | Miwa Engineering:Kk | Imaging device moving apparatus and electronic camera |
| JP2007318851A (en) * | 2006-05-24 | 2007-12-06 | Shicoh Eng Co Ltd | Linear driver, lens driving device and camera shake arrester |
| CN109451205A (en) * | 2018-10-15 | 2019-03-08 | 信利光电股份有限公司 | A kind of novel camera module |
| CN110290305A (en) * | 2019-07-29 | 2019-09-27 | 昆山丘钛微电子科技有限公司 | Driving device and camera module |
| CN111479046A (en) * | 2020-04-17 | 2020-07-31 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3922278B2 (en) * | 2004-09-10 | 2007-05-30 | コニカミノルタフォトイメージング株式会社 | Camera with shake correction mechanism |
-
2021
- 2021-01-25 CN CN202110097866.9A patent/CN114793258B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003032537A (en) * | 2001-07-13 | 2003-01-31 | Miwa Engineering:Kk | Imaging device moving apparatus and electronic camera |
| JP2007318851A (en) * | 2006-05-24 | 2007-12-06 | Shicoh Eng Co Ltd | Linear driver, lens driving device and camera shake arrester |
| CN109451205A (en) * | 2018-10-15 | 2019-03-08 | 信利光电股份有限公司 | A kind of novel camera module |
| CN110290305A (en) * | 2019-07-29 | 2019-09-27 | 昆山丘钛微电子科技有限公司 | Driving device and camera module |
| CN111479046A (en) * | 2020-04-17 | 2020-07-31 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114793258A (en) | 2022-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212115444U (en) | Camera module and electronic equipment | |
| US9900483B2 (en) | Camera module | |
| US8682150B2 (en) | Lens driving apparatus | |
| CN111212199A (en) | Driving mechanism, camera module and electronic equipment | |
| CN113411484B (en) | Camera module and electronic equipment | |
| JP2018106168A (en) | Driving mechanism | |
| CN110441882B (en) | Lens actuating module and electronic device | |
| CN113660404B (en) | Camera module and electronic equipment | |
| CN112865400A (en) | Motor anti-shake mechanism, lens driving device, camera device, and electronic product | |
| CN114793258B (en) | Camera module and terminal equipment | |
| CN113784047B (en) | Anti-shake mechanism for lens device, driving device, imaging device, and electronic apparatus | |
| CN214311231U (en) | Drive module, camera module and electronic equipment | |
| CN214311230U (en) | Drive module, camera module and electronic equipment | |
| TW201248294A (en) | Image stabilizing module and image capturing device | |
| KR100985665B1 (en) | Camera module | |
| CN115268167A (en) | Camera shooting module | |
| CN114793257A (en) | Camera module and terminal equipment | |
| CN220896783U (en) | Sensor mobile device and camera module | |
| CN114793261A (en) | Prop up posture electromagnetic drive ware and camera module | |
| CN218350662U (en) | Optical element driving device, image pickup device, and mobile terminal | |
| CN114793260A (en) | Flexible circuit board and camera module | |
| CN214412866U (en) | Lens module and electronic equipment | |
| CN214586185U (en) | Anti-shake lens driving device | |
| CN217034425U (en) | Base and lens driving device | |
| CN220020071U (en) | Lens driving device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |