CN114793258A - Camera module and terminal equipment - Google Patents
Camera module and terminal equipment Download PDFInfo
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- CN114793258A CN114793258A CN202110097866.9A CN202110097866A CN114793258A CN 114793258 A CN114793258 A CN 114793258A CN 202110097866 A CN202110097866 A CN 202110097866A CN 114793258 A CN114793258 A CN 114793258A
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- tuning fork
- circuit board
- flexible circuit
- assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention discloses a camera module and terminal equipment, relates to the technical field of camera modules, and solves the technical problem that the camera module in the prior art is large in structural size. The camera module comprises a camera assembly, a flexible component, a tuning fork piezoelectric assembly and a conducting piece, wherein the flexible component is provided with a photosensitive chip, the tuning fork piezoelectric assembly is fixed with the camera assembly, the conducting piece is fixed with the photosensitive chip, and the conducting piece is connected to the tuning fork piezoelectric assembly in a sliding mode. The tuning fork piezoelectric component can generate vibration with a certain frequency after being electrified, so that the photosensitive chip is driven to move, and the function of focusing is realized. By adopting a tuning fork piezoelectric structure mode, the transmission piece can be driven to lift through different vibration frequencies by changing voltage. A voice coil motor for driving the camera assembly to move is eliminated, and the tuning fork piezoelectric structure is adopted for driving the photosensitive chip to move, so that the shoulder height of the camera module is smaller, and the size is smaller.
Description
Technical Field
The invention relates to the technical field of camera modules, in particular to a camera module and terminal equipment.
Background
In the related art, an automatic focusing camera module realizes an automatic focusing function through lens movement. This structure requires a single, complete voice coil motor to drive the lens movement, and a complete voice coil motor is usually bulky, which ultimately results in a large shoulder size of the camera module. As a front camera, since the screen occupancy ratio of a terminal device represented by a mobile phone is required to be more than 96%, the size of an opening of the screen is required to be small, and an auto-focusing module using a conventional voice coil motor to drive a lens to move cannot meet the requirement of miniaturization of a camera module.
Disclosure of Invention
In view of the above, an object of the present invention is to overcome the deficiencies of the prior art, and in a first aspect, a camera module is provided to solve the technical problem of a large volume of a camera module structure caused by a mode of driving a lens by a voice coil motor.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a camera module, comprising:
a camera assembly;
the flexible component is fixedly arranged with the camera assembly and comprises a carrying part and an elastic part which are connected, and the carrying part carries a photosensitive chip which is arranged opposite to the camera assembly;
the tuning fork piezoelectric assembly is fixedly connected with the camera assembly; and the number of the first and second groups,
the conducting piece is fixedly connected with the photosensitive chip and is in sliding connection with the tuning fork piezoelectric assembly;
the tuning fork piezoelectric assembly can drive the photosensitive chip to move through the vibration of the conducting piece.
On the basis of the technical scheme, the camera module can be further improved as follows.
Optionally, the carrying portion and the elastic portion are of an integrally formed flexible structure.
Optionally, the flexible component includes a flexible circuit board, one end of the flexible circuit board is bent, the bent end face of the flexible circuit board is provided with the carrying portion, and the bent connecting portion of the flexible circuit board is provided with the elastic portion.
Optionally, the flexible component includes a flexible circuit board, a hollowed-out portion is formed in the flexible circuit board, the middle portion of the flexible circuit board after being hollowed-out is provided with the carrying portion, the edge portion of the flexible circuit board after being hollowed-out is provided with a frame portion, and the rest portions of the flexible circuit board after being hollowed-out are provided with the elastic portion.
Optionally, the tuning fork piezoelectric assembly includes a tuning fork and a piezoelectric electrode, the tuning fork includes a tuning fork body and a yoke, the piezoelectric electrode is connected to the tuning fork body, and the conducting member is connected to the yoke in a sliding manner.
Optionally, the piezoelectric electrode includes a conductive part and an electrode part, which are electrically connected, the electrode part is fixed to the tuning fork body through a pressing piece, and the conductive part is used for acquiring a voltage.
Optionally, one of the conductive parts and the two electrode parts are integrally formed into a U-shaped structure, and the two electrode parts are respectively fixed to two sides of the tuning fork body.
Optionally, the number of the conducting pieces is two, the conducting pieces are slidably connected to the outer side or the inner side of the tuning fork piezoelectric assembly, and a resonance piece is connected between the two conducting pieces.
Optionally, the flexible component is connected to a carrier plate, and the photosensitive chip is connected to the carrier plate.
Optionally, the carrier plate is connected with a support, and the conducting element is connected to the support.
Optionally, the camera module further includes a housing and a base, the camera assembly is fixedly connected to the housing, the flexible component is fixedly connected to the base, and the housing is connected to the base.
Optionally, the support is loaded with an optical filter, and the optical filter is located between the camera assembly and the photosensitive chip.
Optionally, the bracket is provided with a mounting groove for mounting the position magnetic member, and the base is connected with a position sensor arranged opposite to the position magnetic member.
Optionally, the support is provided with a guide groove, the base is fixedly connected with a guide post, and the support is matched with the guide post in a sliding manner through the guide groove to guide the movement of the photosensitive chip.
Optionally, the carrying part can drive the photosensitive chip to move along the optical axis direction of the camera module, and/or the carrying part can drive the photosensitive chip to be perpendicular to the optical axis direction of the camera module to move or twist.
In a second aspect, the present invention further provides a terminal device, including the above camera module.
Compared with the prior art, the camera module provided by the invention has the beneficial effects that:
according to the focusing device, the tuning fork piezoelectric assembly is fixedly connected with the camera assembly, the conducting piece is fixedly connected with the photosensitive chip, vibration with a certain frequency can be generated after the tuning fork piezoelectric assembly is electrified, and the conducting piece is slidably connected with the tuning fork piezoelectric assembly, so that the photosensitive chip is driven to move under the vibration action of the tuning fork piezoelectric assembly, and the focusing function is realized.
The invention adopts a tuning fork piezoelectric structure mode, and can drive the conduction piece to ascend or descend through different vibration frequencies by changing voltage. According to the invention, a voice coil motor for driving the camera assembly to move is omitted, and the photosensitive chip is directly driven to move by adopting a tuning fork piezoelectric structure, so that the camera module has smaller shoulder height and smaller volume.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of an exploded structure of a camera module according to the present invention;
FIG. 2 is a schematic side sectional view of the camera module shown in FIG. 1;
FIG. 3 is a schematic cross-sectional view of the camera module shown in FIG. 1;
FIG. 4 is a schematic perspective view of the tuning fork of FIG. 1;
FIG. 5 is a schematic perspective view of the piezoelectric electrode of FIG. 1;
FIG. 6 is a schematic perspective view of the conductive element of FIG. 1;
FIG. 7 is another schematic perspective view of the tuning fork of FIG. 1 coupled to the conductive element;
FIG. 8 is a schematic perspective view of the flexible circuit board of FIG. 1;
fig. 9 is another schematic perspective view of the flexible circuit board in fig. 1;
FIG. 10 is a schematic diagram of another perspective structure of the flexible circuit board of FIG. 1;
fig. 11 is a schematic perspective view of the flexible circuit board in fig. 1.
In the figure:
10-a camera assembly; 20-a housing; 30-a bracket; 31-mounting groove; 32-a guide groove; 33-a conductor; 331-a resonant member; 34-position magnetic element; 40, a light filter; 50, a photosensitive chip; 60-tuning fork; 61-tuning fork body; 62-yoke arm; 63-tabletting; 70-piezoelectric electrodes; 71-a conductive portion; 72-an electrode section; 80-flexible circuit board; 81-carrying part; 82-bending the connecting part; 83-frame part; 831 — first contact site; 832-first bending region; 841-second contact site; 842-inner frame part; 843-third contact site; 851-fourth contact site; 852 — second bend region; 86-a carrier plate; 90-a base; 91-position sensor; 92-guide post.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely a few embodiments of the invention and are not to be taken as a comprehensive embodiment. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Example (b):
the present invention provides a camera module, as shown in fig. 1 to 3, which includes a camera assembly 10, wherein the camera assembly 10 generally includes a lens barrel, a plurality of lenses, and a spacer ring stacked together. The camera module obtains an image signal through the camera assembly 10, and the image signal is projected on the photosensitive chip 50 and converted into an electrical signal to be sent to the processor.
As shown in fig. 1-3, a camera head assembly 10 is coupled to a housing 20. The housing 20 is generally in the form of a half-box structure with an open top and an open bottom. The camera assembly 10 is attached to the top of the housing 20 by means including, but not limited to, adhesive, screw, snap, or integral molding. Wherein image signals acquired by the camera assembly 10 are transmitted through the top opening. Of course, the housing 20 may be designed into various structural forms such as a cylinder type, a box type, or a frame, and the specific structure of the housing 20 is not limited in this embodiment. After the housing 20 is fixedly connected to the camera head assembly 10, the generated driving force can be controlled below the camera head assembly 10, and the camera head assembly 10 can realize the function of automatic focusing without moving.
As shown in fig. 1 to 3, a base 90 is connected to the bottom of the housing 20, and the inside of the base 90 sinks to provide a sufficient movement space for the photo sensor chip 50. The housing 20 and the base 90 may be connected by any means including, but not limited to, adhesive, screw, or snap connection. Of course, the base 90 may be configured in a circular, annular, or polygonal configuration, depending on the actual configuration of the housing 20.
As shown in fig. 1 to fig. 3, the housing 20 is connected to the base 90 to form a housing structure, and the housing structure is fixedly connected with a flexible member, which is at least partially disposed inside the housing structure for driving the photosensitive chip 50 to move. In some embodiments, the flexible component may be a flexible circuit board 80, and the flexible circuit board 80 includes a mounting portion 81 and an elastic portion, and the mounting portion 81 is used for mounting the photosensitive chip 50 disposed opposite to the camera assembly 10. The flexible circuit board 80 is at least partially secured within a housing structure within which the photo sensor chip 50 is movable.
It can be understood that the flexible component may also be made of other materials with elasticity, such as silica gel, rubber, etc., and the photosensitive chip 50 may be separately connected to an external circuit board. However, in the present embodiment, the flexible circuit board 80 is directly selected as a flexible component, which not only can perform the function of carrying the photosensitive chip 50 to move along the optical axis direction of the camera assembly 10, but also can perform the functions of conducting electricity and transmitting data on the photosensitive chip 50. Adopt flexible circuit board 80 can realize function integration, be favorable to reducing the setting of all the other spare parts to be favorable to reducing the volume of whole camera module. In addition, the versatility of the flexible circuit board 80 is beneficial to reducing related parts, thereby reducing the cost.
As shown in fig. 4 to 6, the tuning fork piezoelectric assembly includes a tuning fork 60 and a piezoelectric electrode 70, and the tuning fork 60 has a substantially Y-shaped metal plate structure. The tuning fork 60 includes a tuning fork body 61 and two arms 62, the two arms 62 extend to the outside of the tuning fork body 61, and the tuning fork body 61 is fixed on the base 90. The piezoelectric electrode 70 includes a conductive portion 71 and an electrode portion 72 which are integrally formed, the electrode portion 72 is bent to form a U-shaped structure, and the two electrode portions 72 are attached to the tuning fork body 61 to drive the tuning fork 60 to vibrate. The conductive portion 71 of the piezoelectric electrode 70 is electrically connected to the flexible circuit board 80 for providing the electrode portion 72 with a voltage. Of course, the piezoelectric electrode 70 may be designed to have a separate structure in which one conductive portion 71 is connected to one electrode portion 72, and the two separate electrode portions 72 may be fixed to the tuning fork main body 61.
The electrode part 72 may be pressed onto the tuning fork body 61 through the pressing sheet 63, or may be adhered to the tuning fork body 61 through silver paste. The conductor 33 is slidably connected to the yoke 62. as shown in fig. 7, the conductor 33 may be slidably connected to the outside of the yoke 62 or may be slidably connected to the inside of the yoke 62. The resonator 331 can be connected between the two conductive elements 33, as the assembly space allows, to ensure that the vibration frequencies received by the two conductive elements 33 are identical. If the assembly space conditions are limited, the resonance member 331 may not be provided, and the frequency of the vibration of the two conductive members 33 may be controlled only by the voltage.
After the piezoelectric electrodes 70 obtain an alternating voltage from the flexible circuit board 80, the two electrode parts 72 located at two sides of the tuning fork body 61 drive the tuning fork body 61 to vibrate, and the tuning fork body 61 drives the two fork arms 62 to perform resonant motion. The conductor 33, when vibrated, slides up relative to the yoke 62 at one frequency of vibration and slides down relative to the yoke 62 at another frequency of vibration.
It is understood that, according to the structural size of the tuning fork 60, the two piezoelectric electrodes 70 can be respectively fixed on the two fork arms 62, and the function of the conductive element 33 sliding up and down relative to the fork arms 62 can also be achieved by controlling the voltages of the two piezoelectric electrodes 70. The tuning fork 60 may be made of nickel, chromium, titanium or their alloy materials, the piezoelectric electrode 70 may be made of piezoelectric ceramics, and the conductive element 33 may be made of the same material as the tuning fork 60.
As shown in fig. 8, as an embodiment, one end of the flexible circuit board 80 is bent, the bent end portion becomes a mounting portion 81, and the bent connection portion 82 becomes an elastic portion, that is, the mounting portion 81 can move or return in the optical axis direction of the camera assembly 10 by the elasticity of the bent connection portion 82. The number of times of bending the flexible circuit board 80 may be one or more.
According to the actual wiring condition of the flexible circuit board 80, the flexible circuit board 80 can be bent once to form a U-shaped structure; the flexible circuit board 80 may also be bent twice to form a Z-shaped or v-21274; it may also be bent a greater number of times to form a greater structural shape. Meanwhile, the specific bending shape of the flexible circuit board 80 may be selected according to the specific shape of the housing structure. For example, the folded mounting portion 81 is parallel to the unfolded flexible circuit board 80; alternatively, the mounting portion 81 after bending and the flexible circuit board 80 which is not bent are located on the same side or opposite side of the bent connection portion 82.
As shown in fig. 9, as another embodiment, the flexible printed circuit board 80 is provided with a hollow portion, a middle region after the hollow portion is a mounting portion 81, an edge portion after the hollow portion is a frame portion 83, and the rest portion after the hollow portion is an elastic portion. The elastic portion includes a first contact portion 831 and a first bending portion 832, the first bending portion 832 is an L-shaped bent plate structure, two ends of the first bending portion 832 are respectively connected with the two first contact portions 831, and the two first contact portions 831 are respectively connected with the carrying portion 81 and the frame portion 83, so that the whole flexible circuit board 80 is conducted. One or more first bending portions 832 may be provided between the mounting portion 81 and the frame portion 83 along the circumferential direction of the mounting portion 81. In the present embodiment, four equally-divided first bending portions 832 are selected along the circumferential direction of the mounting portion 81. Each set of the first contact portion 831 and the first bending portion 832 can be disposed with a plurality of sets of traces, and the widths of the first contact portion 831 and the first bending portion 832 can be set according to the requirement of the traces. The widths of the first contact region 831 and the first bending region 832 may be the same or different. Of course, the shape of first bending portion 832 is not limited to L-shape, and first bending portion 832 may be designed in a bow shape, an arc shape, or a wave shape.
It can be understood that due to the connection between the mounting portion 81 and the frame portion 83 via the first contact portion 831 and the first bending portion 832, the mounting portion 81 can be lifted and lowered relative to the frame portion 83, so that the photo sensor chip 50 can be moved or reset along the optical axis of the camera head assembly 10. That is, the elastic portion not only plays a role of elastically moving the photosensitive chip 50, but also plays a role of conducting and transmitting signals between the mounting portion 81 and the frame portion 83. Optionally, the mounting portion 81, the first contact portion 831, the first bending portion 832 and the frame portion 83 may be integrally formed by etching, so as to reduce the difficulty in manufacturing the component.
As shown in fig. 10, as another embodiment, the flexible circuit board 80 is also provided with a hollow portion. Except that the elastic portion includes a second contact portion 841, an inner frame portion 842, and a third contact portion 843. The inner frame portion 842 is provided between the mounting portion 81 and the frame portion 83, the mounting portion 81 and the inner frame portion 842 are connected by a third contact portion 843, and the inner frame portion 842 and the frame portion 83 are connected by a second contact portion 841. The two second contact portions 841 are disposed opposite to each other, the two third contact portions 843 are disposed opposite to each other, the second contact portions 841 are perpendicular to the third contact portions 843, the entire flexible printed circuit board 80 is also electrically connected, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second contact portion 841 and the third contact portion 843 may be arranged in an arc shape, a ring shape, or an inclined shape. The inner frame portion 842 may also be designed as a multi-segment split L-shaped or half-frame structure.
It can be understood that the mounting portion 81, the second contact portion 841, the inner frame portion 842, the third contact portion 843, and the frame portion 83 may also be integrally formed by etching, so as to reduce the difficulty in manufacturing the components. This structure makes the elastic rigidity of the mounting portion 81 larger, and is suitable for more sensitive movement control of the photosensitive chip 50. Meanwhile, due to the annular arrangement of the inner frame portion 842, the routing mode of the flexible circuit board 80 can be more flexible.
As another embodiment, as shown in fig. 11, the flexible circuit board 80 is further provided with a hollow portion. In contrast, the elastic portion includes a fourth contact portion 851 having a stripe structure and a second bending portion 852. Both ends of the second curved portion 852 are connected to the mounting portion 81 and the frame portion 83 via two fourth contact portions 851, respectively. The second bending portion 852 and the two fourth contact portions 851 are connected to form an integrally bent strip structure, and a plurality of bent strip structures are connected between the mounting portion 81 and the frame portion 83 in parallel. The entire flexible circuit board 80 is also electrically connected, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second bending portion 852 may also be designed in a strip structure form such as a bow shape, an arc shape or a wave shape. Similarly, the mounting portion 81, the fourth contact portion 851, the second bending portion 852, and the frame portion 83 may be integrally formed by etching.
It can be understood that the hollowed-out portion refers to a hollowed-out portion of the flexible circuit board 80, and the structural form of different elastic portions makes the rigidity of the flexible lifting portion 81 different. Meanwhile, the conductive performance of the flexible circuit board 80 is made different. The flexible circuit board 80 with different elastic part structural forms can be selected according to different models or specifications of the photosensitive chip 50 carried by the carrying part 81.
It should be noted that, due to the structural design of the mounting portion and the elastic portion, the flexible circuit board 80 can be applied not only to a scene in which the photosensitive chip 50 moves along the optical axis direction of the camera assembly 10, but also to an application of the photosensitive chip 50 in an anti-shake scene of the camera module. That is, the photosensitive chip 50 can not only move along the direction perpendicular to the plane of the flexible circuit board 80, but also move or twist along the plane of the flexible circuit board 80.
As shown in fig. 8 to 11, the flexible circuit board 80 includes a mounting portion 81 for electrical connection and an elastic portion, and the mounting portion 81 is used for mounting the photosensitive chip 50 disposed opposite to the camera assembly 10. As shown in fig. 8, the flexible circuit board 80 is formed by bending, a mounting portion 81 is formed at a bent portion of the flexible circuit board 80, and an elastic portion is formed at a bent portion of the flexible circuit board 80 by bending the connecting portion 82, that is, the mounting portion 81 can move or return in the optical axis direction of the camera assembly 10 by the elastic force of the bent portion of the connecting portion 82.
As shown in fig. 9, as another embodiment, the flexible circuit board 80 is provided with hollow portions, the hollow portions are distributed along a circumferential direction of a central region of the flexible circuit board 80, the central region forms a mounting portion 81, and the rest of the hollow portions form an elastic portion. The elastic portion includes a first contact portion 831 and a first bending portion 832, and the edge of the flexible circuit board 80 after being hollowed out forms a frame portion 83. The first bending portion 832 is a plate-type structure bent in an L-shape, two ends of the first bending portion 832 are electrically connected to the two first contact portions 831, and the two first contact portions 831 are electrically connected to the carrying portion 81 and the frame portion 83, respectively, so that the entire flexible circuit board 80 is electrically connected.
It can be understood that, due to the connection between the mounting portion 81 and the frame portion 83 via the first contact portion 831 and the first bending portion 832, the mounting portion 81 can be lifted and lowered elastically relative to the frame portion 83, so that the photosensitive chip 50 can be moved or reset along the optical axis direction of the camera head assembly 10. The elastic portion not only plays an elastic role in the photosensitive chip 50, but also plays a role in conduction between the mounting portion 81 and the frame portion 83. Of course, the first bending portion 832 may be designed to have a plate structure such as a bow shape, an arc shape, or a wave shape according to the requirement of the elastic rigidity of the mounting portion 81.
As shown in fig. 10, as another embodiment, the flexible circuit board 80 is also provided with a hollow portion. Except that the elastic portion includes a second contact portion 841, an inner frame portion 842, and a third contact portion 843. The inner frame portion 842 is provided between the mounting portion 81 and the frame portion 83, the mounting portion 81 and the inner frame portion 842 are connected by a third contact portion 843, and the inner frame portion 842 and the frame portion 83 are connected by a second contact portion 841. The two second contact portions 841 are disposed opposite to each other, the two third contact portions 843 are disposed opposite to each other, the second contact portions 841 are perpendicular to the third contact portions 843, the entire flexible printed circuit board 80 is also electrically connected, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second contact portion 841 and the third contact portion 843 may be arranged in an arc shape, a ring shape, or an inclined shape.
It can be understood that the inner frame portion 842 can be designed as a multi-segment split L-shaped or semi-frame structure according to the requirement of the elastic rigidity of the carrying portion 81.
As shown in fig. 11, as another embodiment, the flexible circuit board 80 is further provided with a hollow portion. In contrast, the elastic portion includes a fourth contact portion 851 and a second bending portion 852. Both ends of the second curved portion 852 are connected to the mounting portion 81 and the frame portion 83 via two fourth contact portions 851, respectively. The second bending portion 852 and the two fourth contact portions 851 are connected to form an integrally bent strip structure, and a plurality of bent strip structures are connected between the mounting portion 81 and the frame portion 83 in parallel. The entire flexible circuit board 80 is also electrically connected, and the mounting portion 81 is also elastically movable up and down with respect to the frame portion 83. Of course, the second bending portion 852 may be designed to have a strip structure such as a bow shape, an arc shape or a wave shape according to the requirement of the elastic rigidity of the mounting portion 81.
It can be understood that the hollowed-out portion refers to a hollowed-out portion of the flexible circuit board 80, and the structural form of different elastic portions makes the rigidity of the flexible lifting portion 81 different. At the same time, the conductive properties of the flexible circuit board 80 are made different. The flexible circuit board 80 with different elastic part structural forms can be selected according to different models or specifications of the photosensitive chip 50 carried by the carrying part 81.
As shown in fig. 1 to 3, after the housing 20 is connected to the chassis 90, the non-bent portion or the frame portion 83 of the flexible circuit board 80 is fixed so that the mounting portion 81 is located in the middle region of the chassis 90. Wherein, the middle region of the base 90 is a sink structure to provide a space for lifting the carrying portion 81. The carrying portion 81 is fixedly connected with a carrier plate 86, the carrier plate 86 is of a plate structure as a whole, and the carrier plate 86 may be connected with the carrying portion 81 as a separate structure or may be integrally formed with the carrying portion 81. Of course, the carrier plate 86 may also be designed with a groove adapted to the photosensitive chip 50, and when the photosensitive chip 50 is mounted on the carrier plate 86, the surface of the photosensitive chip 50 is flush with the surface of the carrier plate 86. The carrying portion 81 is electrically connected to the carrier 86, and the photosensitive chip 50 is electrically connected to the carrier 86.
As shown in fig. 1 to 3, the carrier plate 86 is fixedly connected to the frame-structured support 30, the support 30 is integrally formed with the conductive element 33 by insert molding, and the conductive element 33 may be fixed to the support 30 by adhesion. The middle of the bracket 30 is hollowed out, an installation groove 31 is formed in the outer side of the side wall of the bracket 30, the position magnetic part 34 is installed in the installation groove 31 of the bracket 30 in an insertion manner, and the photosensitive chip 50 is located in the hollowed-out position of the middle of the bracket 30. The base 90 is fixedly connected with a position sensor 91, the position sensor 91 is further electrically connected with the carrier plate 86, and the position sensor 91 is disposed opposite to the position magnetic member 34.
The position sensor 91 includes, but is not limited to, a hall sensor or a TMR magnetic sensor, and the position sensor 91 may be disposed opposite to the position magnetic member 34, or may be disposed diagonally opposite to the position magnetic member 34, as long as the position sensor 91 can sense a change in the magnetic field angle of the position magnetic member 34. The carrier plate 86 may be integrally formed with the carrying portion 81, or may be made of a rigid circuit board, a conductive aluminum foil or a copper sheet.
As shown in fig. 1 to 3, a mounting step is provided inside a side wall of the bracket 30, an optical filter 40 is provided inside a hollow position in a middle portion of the bracket 30, and the optical filter 40 is located between the camera module 10 and the photosensitive chip 50 and is used for filtering useless light waves. The diagonal line position of the side wall of the bracket 30 is also provided with a guide groove 32, the base 90 is fixedly connected with a guide post 92, and when the bracket 30 moves up and down, the guide groove 32 can directionally slide through the guide post 92.
It is understood that, depending on the specific configuration of the base 90 and the bracket 30, the guide slots 32 may be formed at the middle or four corners of the side wall of the bracket 30, and the corresponding guide posts 92 may be formed on the base 90. Of course, the directional lifting structure of the bracket 30 can also be designed in a way that the balls are matched with the rolling grooves.
The principle of the invention for realizing automatic focusing is as follows: the piezoelectric electrodes 70 drive the tuning fork 60 to vibrate after being electrified from the flexible circuit board 80, the tuning fork 60 transmits the vibration to the conducting element 33, and the conducting element 33 is vibrated to move up and down. Because the conduction member 33 is fixedly connected with the bracket 30, the conduction member 33 can drive the photosensitive chip 50 to move up and down through the bracket 30. The camera assembly 10 is fixed on the housing 20, and the guide structure is disposed between the bracket 30 and the base 90, so that the photosensitive chip 50 can move along the optical axis direction of the camera assembly 10. The image signal acquired by the camera assembly 10 sequentially passes through the opening at the top of the housing 20, the optical filter 40 and the hollow-out position in the middle of the bracket 30, and finally forms an image on the photosensitive chip 50. Meanwhile, the position sensor 91 acquires the relative position of the position magnetic member 34 in real time and feeds back the focal length of the auto-focusing.
The invention drives the photosensitive chip 50 to move along the optical axis direction of the camera component 10 by the structural mode of tuning fork piezoelectricity, has compact structure and few parts, and is convenient to assemble. Meanwhile, according to the camera modules of different sizes, the tuning fork 60 can be designed to be smaller in structural size, so that the shoulder height of the camera module is smaller, and the volume of the camera module is smaller. The invention also makes full use of the flexibility of the flexible circuit board 80, and designs the flexible circuit board 80 as a combination form of the carrying part 81 and the elastic part, thereby not only realizing the circuit function of the flexible circuit board 80, but also playing the role of supporting and elasticity for the photosensitive chip 50. The design of the voice coil motor is eliminated compared with the prior art.
In addition, different from the prior art, the focal length is adjusted by driving the photosensitive chip 50 to move along the optical axis direction of the camera module, and for the whole camera module in the using process, the overall shoulder height of the camera module is constant, which is beneficial to determining the installation space of the camera module. However, the shoulder height of the camera module in the use process of the camera module in the prior art is changed due to the fact that the camera module 10 is driven to move, and the determination of the installation space of the camera module is not facilitated.
It is to be understood that the present invention is not limited to a specific number of tuning fork piezoelectric assemblies. According to the actual atress needs of camera module, also can use multiunit tuning fork piezoelectric assembly to drive sensitization chip 50 simultaneously, multiunit tuning fork piezoelectric assembly can be for sensitization chip 50 symmetry setting to guarantee the stationarity that sensitization chip 50 removed.
The invention also provides terminal equipment which comprises the camera module in the embodiment. The terminal equipment comprises but is not limited to equipment such as a mobile phone, a tablet or a notebook computer, and the camera module can be installed on the terminal equipment only by forming a hole with a smaller size.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (16)
1. The utility model provides a camera module which characterized in that includes:
a camera assembly (10);
the flexible component is fixedly arranged on the camera assembly (10), the flexible component comprises a carrying part (81) and an elastic part which are connected, and the carrying part (81) carries a photosensitive chip (50) which is arranged opposite to the camera assembly (10);
the tuning fork piezoelectric assembly is fixedly connected with the camera assembly (10); and the number of the first and second groups,
the conducting piece (33), the conducting piece (33) is fixedly connected with the photosensitive chip (50), and the conducting piece (33) is in sliding connection with the tuning fork piezoelectric assembly;
the tuning fork piezoelectric component can drive the photosensitive chip (50) to move through the vibration of the conducting piece (33).
2. The camera module according to claim 1, wherein the mounting portion (81) and the elastic portion are a flexible structure integrally formed.
3. The camera module according to claim 2, wherein the flexible component includes a flexible circuit board (80), one end of the flexible circuit board (80) is bent, the bent end surface of the flexible circuit board (80) is provided with the mounting portion (81), and the bent connection portion (82) of the flexible circuit board (80) is provided with the elastic portion.
4. The camera module according to claim 2, wherein the flexible component includes a flexible circuit board (80), the flexible circuit board (80) is provided with a hollow portion, the middle portion of the flexible circuit board (80) after being hollow is provided with the carrying portion (81), the edge portion of the flexible circuit board (80) after being hollow is provided with a frame portion (83), and the rest portions of the flexible circuit board (80) after being hollow are provided with the elastic portions.
5. The camera module according to claim 1, wherein the tuning fork piezoelectric assembly comprises a tuning fork (60) and piezoelectric electrodes (70), the tuning fork (60) comprises a tuning fork body (61) and a fork arm (62), the piezoelectric electrodes (70) are connected with the tuning fork body (61), and the conductive member (33) is slidably connected with the fork arm (62).
6. The camera module according to claim 5, wherein the piezoelectric electrode (70) comprises a conductive part (71) and an electrode part (72) which are electrically connected, the electrode part (72) is fixed on the tuning fork body (61) through a pressing sheet (63), and the conductive part (71) is used for acquiring voltage.
7. The camera module according to claim 6, wherein one conductive part (71) and two electrode parts (72) are integrally formed into a U-shaped structure, and the two electrode parts (72) are respectively fixed on two sides of the tuning fork body (61).
8. The camera module according to any one of claims 1 to 7, wherein the number of the conductive members (33) is two, the two conductive members (33) are slidably connected to the outer side or the inner side of the tuning fork piezoelectric assembly, and a resonance member (331) is connected between the two conductive members (33).
9. The camera module according to claim 1, wherein a carrier plate (86) is connected to the flexible member, and the photosensitive chip (50) is connected to the carrier plate (86).
10. The camera module according to claim 9, characterized in that a bracket (30) is connected to the carrier plate (86), and the conductor (33) is connected to the bracket (30).
11. The camera module according to claim 10, further comprising a housing (20) and a base (90), wherein the camera assembly (10) is fixedly connected to the housing (20), the flexible member and the tuning fork piezoelectric assembly are fixedly connected to the base (90), respectively, and the housing (20) is connected to the base (90).
12. The camera module according to claim 10, wherein the holder (30) carries an optical filter (40), the optical filter (40) being located between the camera assembly (10) and the photo-sensitive chip (50).
13. The camera module according to claim 11, wherein the bracket (30) is provided with a mounting groove (31) for mounting the position magnetic member (34), and the base (90) is connected with a position sensor (91) disposed opposite to the position magnetic member (34).
14. The camera module according to claim 11, wherein the bracket (30) is provided with a guide groove (32), the base (90) is fixedly connected with a guide post (92), and the bracket (30) guides the movement of the photosensitive chip (50) through the sliding fit of the guide groove (32) and the guide post (92).
15. The camera module according to claim 1, wherein the mounting portion (81) can drive the photosensitive chip (50) to move along an optical axis of the camera module, and/or the mounting portion (81) can drive the photosensitive chip (50) to move or twist perpendicular to the optical axis of the camera module.
16. A terminal device, characterized by comprising the camera module set of any one of claims 1 to 15.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110097866.9A CN114793258B (en) | 2021-01-25 | 2021-01-25 | Camera module and terminal equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110097866.9A CN114793258B (en) | 2021-01-25 | 2021-01-25 | Camera module and terminal equipment |
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| CN114793258A true CN114793258A (en) | 2022-07-26 |
| CN114793258B CN114793258B (en) | 2024-04-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484368A (en) * | 2022-08-02 | 2022-12-16 | Oppo广东移动通信有限公司 | Imaging module and electronic equipment |
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|---|---|
| CN114793258B (en) | 2024-04-30 |
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