WO2022183825A1 - 传感器和电子设备 - Google Patents

传感器和电子设备 Download PDF

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Publication number
WO2022183825A1
WO2022183825A1 PCT/CN2021/143054 CN2021143054W WO2022183825A1 WO 2022183825 A1 WO2022183825 A1 WO 2022183825A1 CN 2021143054 W CN2021143054 W CN 2021143054W WO 2022183825 A1 WO2022183825 A1 WO 2022183825A1
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WO
WIPO (PCT)
Prior art keywords
sensor
permanent magnet
vibrating
calibration
vibration
Prior art date
Application number
PCT/CN2021/143054
Other languages
English (en)
French (fr)
Inventor
安琪
冷群文
邹泉波
周汪洋
丁凯文
赵海轮
周良
Original Assignee
歌尔微电子股份有限公司
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Publication of WO2022183825A1 publication Critical patent/WO2022183825A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00

Definitions

  • the present application relates to the technical field of acoustic-electrical conversion, and in particular, to a sensor and an electronic device applying the sensor.
  • the detection unit set inside the sensor can detect the change of the magnetic field of the permanent magnet during the vibration of the diaphragm, and change the output electrical signal according to the change of the detected magnetic field, but in the actual production and application process, there will be various errors and As a result, the electrical signal output by the detection unit is inaccurate, which reduces the accuracy of the sensor.
  • the main purpose of this application is to provide a sensor, which aims to improve the precision and accuracy of the sensor.
  • the sensor proposed in this application includes:
  • the vibrating part is connected to the fixing part and can vibrate reciprocally relative to the fixing part;
  • a permanent magnet which is arranged on the vibrating part and vibrates following the vibrating part
  • the function sensor is provided on the fixing part, and the function sensor is configured to sense a change in the magnetic field of the permanent magnet during the vibration of the vibration part, and output a changed electrical signal;
  • a calibration sensor is provided on the vibrating part and vibrates following the vibrating part, and the calibration sensor is configured to sense the magnetic field of the permanent magnet and correct the electrical signal output by the functional sensor.
  • the calibration sensor and the permanent magnet are disposed on the same surface of the vibration part.
  • the center of the calibration sensor and the center of the permanent magnet are the same distance from the vibration part.
  • the line connecting the centers of the two functional sensors is defined as the first direction
  • the line connecting the center of the calibration sensor and the center of the permanent magnet is defined as the second direction
  • the first direction is perpendicular to the second direction
  • the magnetic pole direction of the permanent magnet is parallel to the plane where the vibration part is located
  • the pinning direction of the calibration sensor is parallel to the plane where the vibration part is located
  • the fixing portion is surrounded on the outside of the vibrating portion, and one end of the vibrating portion is connected to the fixing portion to form a cantilever structure.
  • the magnetic pole direction of the permanent magnet is perpendicular to the plane where the vibrating part is located
  • the pinning direction of the calibration sensor is perpendicular to the plane where the vibrating part is located.
  • the pinning direction of at least one calibration sensor is parallel to the plane where the vibration part is located
  • the pinning direction of at least one calibration sensor is parallel to the plane where the vibration part is located.
  • the plane is vertical, and the magnetic pole direction of the permanent magnet is parallel or perpendicular to the plane where the vibrating part is located.
  • the senor includes:
  • the support part is connected between the substrate and the vibrating membrane, and encloses the vibrating membrane and the substrate to form a sealed or open space, and the fixing part is arranged on the substrate , the vibrating part is provided on the vibrating membrane.
  • the present application also proposes an electronic device, including a sensor
  • the sensor includes:
  • the vibrating part is connected to the fixing part and can vibrate reciprocally relative to the fixing part;
  • a permanent magnet which is arranged on the vibrating part and vibrates following the vibrating part
  • the function sensor is provided on the fixing part, and the function sensor is configured to sense a change in the magnetic field of the permanent magnet during the vibration of the vibration part, and output a changed electrical signal;
  • a calibration sensor is provided on the vibrating part and vibrates following the vibrating part, and the calibration sensor is configured to sense the magnetic field of the permanent magnet and correct the electrical signal output by the functional sensor.
  • the sensor of the technical solution of the present application adds a calibration sensor.
  • the calibration sensor is arranged on the vibration part and vibrates with the vibration part.
  • the calibration sensor is configured to sense the magnetic field of the permanent magnet and correct the electrical signal output by the functional sensor.
  • the magnetic field generated by the permanent magnet acts on the calibration sensor, and the calibration sensor can output a corresponding electrical signal according to the magnetic field acting on it, so that the performance of the permanent magnet and the error caused by the process or other factors can be detected.
  • the setting of the calibration sensor can The electrical signal output by the functional sensor is corrected, so that the final output signal of the sensor has high precision and high accuracy.
  • FIG. 1 is a schematic structural diagram of an embodiment of a sensor of the present application
  • FIG. 2 is a schematic structural diagram of another embodiment of the sensor of the present application.
  • Fig. 3 is the sectional view along the A-A direction in Fig. 2;
  • Fig. 4 is the sectional view along the B-B direction in Fig. 2;
  • FIG. 5 is a schematic diagram of the direction of the magnetic field received by the functional sensor relative to the permanent magnet at different positions of the z-axis during the vibration process of the vibrating portion when the permanent magnet in FIG. 2 is placed on a plane;
  • FIG. 6 is a schematic diagram of the direction of the magnetic field received by the vibrating part during the vibration process of the calibration sensor when the permanent magnet in FIG. 2 is placed on a plane;
  • FIG. 7 is a schematic diagram of the direction of the magnetic field received by the functional sensor relative to the permanent magnet at different positions of the z-axis during the vibration of the vibrating portion when the permanent magnet in FIG. 2 is placed vertically;
  • FIG. 8 is a schematic diagram of the direction of the magnetic field that the vibrating portion calibrates the sensor to receive during the vibration process when the permanent magnet in FIG. 2 is placed vertically;
  • FIG. 9 is a schematic structural diagram of another embodiment of the sensor of the present application.
  • FIG. 10 is a schematic structural diagram of another embodiment of the sensor of the present application.
  • the present application proposes a sensor 100 .
  • the sensor 100 includes a fixed part 51 and a vibration part 53 .
  • the vibration part 53 is connected to the fixed part 51 and can vibrate back and forth relative to the fixed part 51 .
  • the vibrating portion 53 is provided with a permanent magnet 60, and the permanent magnet 60 can be attached to the surface of the vibrating portion 53. During the vibrating portion 53 vibrating relative to the fixed portion 51, the permanent magnet 60 on the vibrating portion 53 vibrates together with the vibrating portion 53. .
  • the sensor 100 further includes a function sensor 70 , which is arranged on the fixed part 51 , and is configured to sense changes in the magnetic field of the permanent magnet 60 during the vibration of the vibration part 53 and output a changed electrical signal.
  • a function sensor 70 which is arranged on the fixed part 51 , and is configured to sense changes in the magnetic field of the permanent magnet 60 during the vibration of the vibration part 53 and output a changed electrical signal.
  • the permanent magnet 60 reciprocates relative to the functional sensor 70 , and the magnetic field acting on the functional sensor 70 by the permanent magnet 60 changes continuously, so that the electrical signal output by the functional sensor 70 changes continuously.
  • a calibration sensor 80 is added to the sensor 100 of the technical solution of the present application.
  • the calibration sensor 80 is arranged on the vibration part 53 and vibrates with the vibration part 53 .
  • the calibration sensor 80 is configured to sense the magnetic field of the permanent magnet 60 . signal is corrected.
  • the magnetic field generated by the permanent magnet 60 acts on the calibration sensor 80, and the calibration sensor 80 can output a corresponding electrical signal according to the magnetic field acting on it, so as to detect the performance of the permanent magnet 60 and the error caused by the process or other factors.
  • the arrangement of the sensor 80 can correct the electrical signal output by the functional sensor 70 , so that the final signal output by the sensor 100 has high precision and high accuracy.
  • the calibration sensor 80 can be completed simultaneously with the functional sensor 70 , without increasing the overall process complexity of the sensor 100 , making the production process of the sensor 100 with the calibration sensor 80 simple.
  • both the functional sensor 70 and the calibration sensor 80 are electrically connected to the chip, and the program in the chip can calculate the electrical signal output by the functional sensor 70 and the electrical signal output by the calibration sensor 80, and output the corrected signal. electric signal.
  • the program in the chip can calculate the electrical signal output by the functional sensor 70 and the electrical signal output by the calibration sensor 80, and output the corrected signal. electric signal.
  • the algorithm built into the program in the chip can calculate the standard value and the actual value to obtain a correction value, and use the correction value to perform a correction on the electrical signal output by the functional sensor 70. After correction, an accurate electrical signal after correction is obtained and output, so that the accuracy of the sensor 100 can be improved.
  • the calibration sensor 80 may be a Hall sensor, a giant magnetoresistive sensor, a tunneling magnetoresistive sensor or an anisotropic magnetoresistive sensor, and may also be other sensors, which are not limited herein.
  • the sensor 100 includes a vibrating membrane 50, and the vibrating portion 53 is a part of the vibrating membrane 50 that can vibrate relative to the fixed portion 51.
  • the calibration sensor 80 and the permanent magnet 60 are arranged on the same surface of the vibrating portion 53, so that the center of the calibration sensor 80 is the same as the one on the vibrating portion 53.
  • the distance between the center of the permanent magnet 60 and the vibration part 53 is closer, thereby reducing or eliminating the magnetic field component of the permanent magnet 60 acting on the calibration sensor 80, so that the calibration sensor 80 has high sensitivity to the magnetic field detection by the magnet itself.
  • the distance between the center of the calibration sensor 80 and the center of the permanent magnet 60 relative to the vibration part 53 is consistent, so that the magnetic field component of the permanent magnet 60 acting on the calibration sensor 80 is zero, so that the emission of the calibration sensor 80 to the permanent magnet 60 can be obtained.
  • the magnetic field detection effect is accurate.
  • the height of the calibration sensor 80 relative to the vibration part 53 and the height of the permanent magnet 60 relative to the vibration part 53 may be set to be the same.
  • the sensor 100 includes a substrate 10, a support portion 30 and a diaphragm 50, and the support portion 30 is connected between the substrate 10 and the diaphragm 50, and encloses the substrate Bottom 10 and diaphragm 50 form a sealed or open space.
  • the fixed portion 51 and the vibrating portion 53 are both disposed on the vibrating film 50 .
  • a groove may be formed on the vibrating film 50 , and the portion connected to the support portion 30 is the fixed portion 51 , and the fixed portion 51 is surrounded by the vibrating portion 53 .
  • one end of the vibrating part 53 is connected to the fixing part 51 to form a cantilever structure. Under this structure, the vibration part 53 is formed as a cantilever structure, and the sensitivity is higher during the vibration process.
  • the two functional sensors 70 are symmetrically arranged relative to the permanent magnet 60. Under the action of the magnetic field of the permanent magnet 60, the magnetic fields of the two functional sensors 70 subjected to the magnetic field are the same in magnitude and opposite in direction, thereby reducing or eliminating the A single functional sensor 70 detects the effects of environmental factors in the process.
  • the fixing portion 51 includes a first side edge 511 and a second side edge 512 arranged oppositely, and a third side edge 513 and a fourth side edge 514 arranged oppositely.
  • the side 513 , the second side 512 and the fourth side 514 are connected end to end to form a ring shape
  • the vibrating portion 53 is located in the area surrounded by the fixed portion 51
  • one end of the vibrating portion 53 is connected to the fourth side 514 to form a cantilever.
  • the permanent magnet 60 is arranged on the cantilever structure
  • two functional sensors 70 are respectively arranged on the first side 511 and the second side 512
  • the two function sensors 70 are symmetrically arranged with respect to the permanent magnet 60 on the cantilever structure.
  • the calibration sensor 80 may be located at any position on the vibration part 53 relative to the permanent magnet 60 .
  • the line connecting the centers of the two function sensors 70 is defined as the first direction
  • the line connecting the center of the calibration sensor 80 and the center of the permanent magnet 60 is defined as the second direction
  • the first direction and the second direction are arranged at an included angle.
  • the included angle between the first direction and the second direction may be 90°, that is, the first direction is perpendicular to the second direction; the embodiment shown in FIG. 9 , the angle between the first direction and the second direction can also be 45°; in the embodiment shown in FIG. 10 , the angle between the first direction and the second direction can also be 0° (180°), That is, the first direction coincides with the second direction.
  • the included angle between the first direction and the second direction may also be any other angle value.
  • the calibration sensor 80 When the first direction is perpendicular to the second direction, the calibration sensor 80 is located in the direction in which the permanent magnet 60 is close to the third side 513 or the permanent magnet 60 is close to the fourth side 514. At this time, the distance between the calibration sensor 80 and the function sensor 70 If it is farther away, there is enough space on the vibration part 53 to install the calibration sensor 80 , which can facilitate the production and manufacture of the sensor 100 , improve the installation efficiency of the sensor 100 , and make the assembled sensor 100 smaller in size and more compact in structure.
  • the calibration sensor 80 can also be located in the direction of the permanent magnet 60 close to the first side 511 or the second side 512 .
  • the number of calibration sensors 80 may be one, or two or more. When there are two calibration sensors 80 , the two calibration sensors 80 are symmetrically arranged relative to the permanent magnet 60 .
  • the permanent magnets 60 may be placed in a plane or vertically.
  • the connection line between the N pole and the S pole of the permanent magnet 60 is arranged parallel to the plane where the vibration part 53 is located.
  • 5 shows that during the vibration process of the vibrating part 53 , when the functional sensor 70 is in the z-axis positive (z+) position and the z-axis negative (z-) position relative to the permanent magnet 60 , the functional sensor 70 is affected by the permanent magnet 60 .
  • the direction of the magnetic field (the total amount and component of the magnetic field applied to the functional sensor 70 ), in this figure, the position of the permanent magnet 60 is assumed to be 0 during the vibration of the vibrating part 53 .
  • FIG. 6 shows the direction in which the magnetic field force of the permanent magnet 60 acts on the calibration sensor 80 during the vibrating process of the vibrating portion 53 .
  • the magnetic pole direction of the permanent magnet 60 is parallel to the plane where the vibration part 53 is located
  • the pinning direction of the calibration sensor 80 is parallel to the plane where the vibration part 53 is located. Because the direction of the magnetic field of the permanent magnet 60 acting on the calibration sensor 80 under this structure is parallel to the plane where the vibration part 53 is located, the pinning direction of the calibration sensor 80 must also be parallel to the plane where the vibration part 53 is located, so that the magnetic field of the permanent magnet 60 can be affected. size is checked.
  • FIGS. 7 and 8 when the permanent magnet 60 is placed vertically, the line connecting the N pole and the S pole of the permanent magnet 60 is perpendicular to the plane where the vibrating portion 53 is located. 7 shows that during the vibration process of the vibrating part 53 , when the functional sensor 70 is in the z-axis positive (z+) position and the z-axis negative (z ⁇ ) position relative to the permanent magnet 60 , the functional sensor 70 is affected by the permanent magnet 60 .
  • the direction of the magnetic field (the total amount and component of the magnetic field applied to the functional sensor 70 ), in this figure, the position of the permanent magnet 60 is assumed to be 0 during the vibration of the vibrating part 53 .
  • FIG 8 shows the direction in which the magnetic field force of the permanent magnet 60 acts on the calibration sensor 80 during the vibrating process of the vibrating portion 53 .
  • the magnetic pole direction of the permanent magnet 60 is perpendicular to the plane where the vibrating portion 53 is located
  • the pinning direction of the calibration sensor 80 is perpendicular to the plane where the vibrating portion 53 is located. Since the direction of the magnetic field of the permanent magnet 60 acting on the calibration sensor 80 under this structure is perpendicular to the plane where the vibration part 53 is located, the pinning direction of the calibration sensor 80 must also be perpendicular to the plane where the vibration part 53 is located, so that the magnetic field of the permanent magnet 60 can be affected. size is checked.
  • the permanent magnet 60 During the process of manufacturing the permanent magnet 60, there may be a certain deviation in the structure and process of the permanent magnet 60 itself. When such deviation exists, when the permanent magnet 60 is placed horizontally, the permanent magnet 60 is applied to the calibration sensor 80.
  • the magnetic fields above are not necessarily parallel to the plane where the vibration part 53 is located, and components in other directions may also exist.
  • At least two calibration sensors 80 can be provided, wherein the pinning direction of at least one calibration sensor 80 is parallel to the plane where the vibration part 53 is located, and is used for the permanent magnet 60 to act on the calibration sensor 80
  • the magnetic field parallel to the plane where the vibration part 53 is located is detected; the pinning direction of at least one calibration sensor 80 is perpendicular to the plane where the vibration part 53 is located, and the calibration sensor 80 is configured to act on the calibration sensor 80 by the permanent magnet 60 and vibrate.
  • the magnetic field perpendicular to the plane where the part 53 is located is detected.
  • the at least two calibration sensors 80 are both electrically connected to the chip, and jointly correct the electrical signal output by the functional sensor 70 , so that the signal output by the sensor 100 can be more accurate and precise.
  • At least two calibration sensors 80 may be provided, wherein at least one calibration sensor 80 is pinned The direction is perpendicular to the plane where the vibration part 53 is located, and is used to detect the magnetic field that the permanent magnet 60 acts on the calibration sensor 80 and is perpendicular to the plane where the vibration part 53 is located; the pinning direction of at least one calibration sensor 80 is parallel to the plane where the vibration part 53 is located.
  • the calibration sensor 80 is configured to detect the magnetic field that the permanent magnet 60 acts on the calibration sensor 80 and is parallel to the plane where the vibration part 53 is located.
  • the at least two calibration sensors 80 are both electrically connected to the chip, and jointly correct the electrical signal output by the functional sensor 70 , so that the signal output by the sensor 100 can be more accurate and precise.
  • the fixing portion 51 may be disposed on the substrate 10, that is, the fixing portion 51 is a part of the substrate 10, and the vibrating portion 53 is disposed on the vibrating film 50, that is, the vibrating portion 53 is a part of the diaphragm 50 .
  • the permanent magnet 60 on the vibrating membrane 50 can also vibrate relative to the functional sensor 70 on the substrate 10, and the permanent magnet 60 acts on the magnitude and direction of the magnetic field on the functional sensor 70. It can also change continuously with the occurrence of vibration, and the functional sensor 70 outputs a changing electrical signal according to the vibration of the diaphragm 50 .
  • the present application also proposes an electronic device, which includes a main control board and a sensor 100.
  • the specific structure of the sensor 100 refers to the above-mentioned embodiments. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it has at least the above-mentioned features. All the functions brought by the technical solutions of the embodiments will not be repeated here.
  • the chip of the sensor 100 is electrically connected to the main control board of the electronic device.
  • the electronic device further includes a housing, and the sensor 100 is accommodated in the housing to protect the electrical components inside the electronic device and the sensor 100 .
  • the chip in the sensor 100 of the present application may also be directly disposed on the main control board of the electronic device, and integrated with other electrical components on the main control board, so as to achieve the effect of compact structure.
  • the electronic device can be a portable mobile terminal such as a mobile phone, a tablet computer, a game console, etc., or can be a vehicle-mounted device or a corresponding structure on a smart home.
  • the sensor 100 can be a microphone, a pressure sensor 100, a displacement sensor 100, or any known Other sensors 100.
  • the electronic device may further include a display screen and/or keys, the display screen and keys are electrically connected to the main control board, and a user can control the function of the sensor 100 by touching the display screen and/or keys.

Abstract

一种传感器和电子设备，其中传感器（100）包括：固定部（51）；振动部（53），所述振动部（53）连接所述固定部（51），并可相对所述固定部（51）往复振动；永磁体（60），所述永磁体（60）设于所述振动部（53），并跟随所述振动部（53）振动；功能传感器（70），所述功能传感器（70）设于所述固定部（51），所述功能传感器（70）被配置为在所述振动部（53）振动过程中感应所述永磁体（60）的磁场变化，而输出变化的电信号；以及校准传感器（80），所述校准传感器（80）设于所述振动部（53），并跟随所述振动部（53）振动，所述校准传感器（80）被配置为感应所述永磁体（60）的磁场，而对所述功能传感器（70）输出的电信号进行修正。

Description

传感器和电子设备
本申请要求于2021年3月1号申请的、申请号为202110227060.7的中国专利申请的优先权，其全部内容通过引用结合于此。
技术领域
本申请涉及声电转换技术领域，特别涉及一种传感器和应用该传感器的电子设备。
 背景技术
目前市场上的传感器种类繁多，例如压力传感器、位移传感器等，均是通过平板电容器的原理对振膜的振动进行检测。传感器内部设置的检测单元能够在振膜振动过程中对永磁体的磁场变化进行检测，根据检测到的磁场变化而改变输出的电信号，但在实际生产和应用过程中，会存在各种误差而造成检测单元输出的电信号不准确，使得传感器的精度降低。
 技术问题
本申请的主要目的是提供一种传感器，旨在提高传感器的精度和准确度。
 技术解决方案
为实现上述目的，本申请提出的传感器，包括：
固定部；
振动部，所述振动部连接所述固定部，并可相对所述固定部往复振动；
永磁体，所述永磁体设于所述振动部，并跟随所述振动部振动；
功能传感器，所述功能传感器设于所述固定部，所述功能传感器被配置为在所述振动部振动过程中感应所述永磁体的磁场变化，而输出变化的电信号；以及
校准传感器，所述校准传感器设于所述振动部，并跟随所述振动部振动，所述校准传感器被配置为感应所述永磁体的磁场，而对所述功能传感器输出的电信号进行修正。
在一实施方式中，所述校准传感器与所述永磁体设置于所述振动部的同一表面。
在一实施方式中，所述校准传感器的中心与所述永磁体的中心相对所述振动部的距离一致。
在一实施方式中，所述功能传感器为两个，两所述功能传感器相对所述永磁体对称设置；
定义两所述功能传感器的中心连线为第一方向，定义所述校准传感器的中心与所述永磁体的中心连线为第二方向，所述第一方向与所述第二方向垂直。
在一实施方式中，所述永磁体的磁极方向与所述振动部所在平面平行，所述校准传感器的钉扎方向与所述振动部所在平面平行。
在一实施方式中，所述固定部围设于所述振动部的外侧，所述振动部的一端连接所述固定部，形成悬臂结构。
在一实施方式中，所述永磁体的磁极方向与所述振动部所在平面垂直，所述校准传感器的钉扎方向与所述振动部所在平面垂直。
在一实施方式中，所述校准传感器为至少两个，至少一所述校准传感器的钉扎方向与所述振动部所在平面平行，至少一所述校准传感器的钉扎方向与所述振动部所在平面垂直，所述永磁体的磁极方向与所述振动部所在平面平行或垂直。
在一实施方式中，所述传感器包括：
衬底；
支撑部；以及
振膜，所述支撑部连接于所述衬底和所述振膜之间，并围合所述振膜和所述衬底形成密封或开放的空间，所述固定部设于所述衬底，所述振动部设于所述振膜。
本申请还提出一种电子设备，包括传感器；
所述传感器包括：
固定部；
振动部，所述振动部连接所述固定部，并可相对所述固定部往复振动；
永磁体，所述永磁体设于所述振动部，并跟随所述振动部振动；
功能传感器，所述功能传感器设于所述固定部，所述功能传感器被配置为在所述振动部振动过程中感应所述永磁体的磁场变化，而输出变化的电信号；以及
校准传感器，所述校准传感器设于所述振动部，并跟随所述振动部振动，所述校准传感器被配置为感应所述永磁体的磁场，而对所述功能传感器输出的电信号进行修正。
 有益效果
本申请技术方案的传感器增设了校准传感器，校准传感器设于振动部，并跟随振动部振动，校准传感器被配置为感应永磁体的磁场，而对功能传感器输出的电信号进行修正。永磁体产生的磁场作用于校准传感器，该校准传感器根据作用其上的磁场能够输出相应的电信号，从而能够对永磁体性能和由于工艺或其他因素导致的误差进行检测，该校准传感器的设置能够对功能传感器输出的电信号进行修正，使得传感器最终输出的信号精度高、准确度高。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请传感器一实施例的结构示意图；
图2为本申请传感器另一实施例的结构示意图；
图3为图2中沿A-A方向的剖视图；
图4为图2中沿B-B方向的剖视图；
图5为图2中永磁体为平面摆放时，振动部在振动过程中功能传感器相对永磁体在z轴不同位置时受到的磁场方向的示意图；
图6为图2中永磁体为平面摆放时，振动部在振动过程中校准传感器受到的磁场方向示意图；
图7为图2中永磁体为垂直放置时，振动部在振动过程中功能传感器相对永磁体在z轴不同位置时受到的磁场方向的示意图；
图8为图2中永磁体为垂直放置时，振动部在振动过程中校准传感器受到的磁场方向的示意图；
图9为本申请传感器又一实施例的结构示意图；
图10为本申请传感器再一实施例的结构示意图。
附图标号说明：
标号 名称 标号 名称
100 传感器 513 第三侧边
10 衬底 514 第四侧边
30 支撑部 53 振动部
50 振膜 60 永磁体
51 固定部 70 功能传感器
511 第一侧边 80 校准传感器
512 第二侧边    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，本申请实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本申请中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
参见图1，本申请提出一种传感器100，该传感器100包括固定部51和振动部53，振动部53连接固定部51，并可相对固定部51进行往复振动。振动部53上设有永磁体60，该永磁体60可以贴附于振动部53的表面，在振动部53相对固定部51进行振动的过程中，其上的永磁体60跟随振动部53一起振动。
该传感器100还包括功能传感器70，功能传感器70设于固定部51，功能传感器70被配置为在振动部53振动过程中感应永磁体60的磁场变化，而输出变化的电信号。
在振动部53相对固定部51进行振动过程中，永磁体60相对功能传感器70进行往复运动，永磁体60作用于功能传感器70上的磁场不断变化，使得功能传感器70输出的电信号不断变化。
本申请技术方案的传感器100增设了校准传感器80，校准传感器80设于振动部53，并跟随振动部53振动，校准传感器80被配置为感应永磁体60的磁场，而对功能传感器70输出的电信号进行修正。永磁体60产生的磁场作用于校准传感器80，该校准传感器80根据作用其上的磁场能够输出相应的电信号，从而能够对永磁体60性能和由于工艺或其他因素导致的误差进行检测，该校准传感器80的设置能够对功能传感器70输出的电信号进行修正，使得传感器100最终输出的信号精度高、准确度高。
在生产和制造过程中，校准传感器80可以与功能传感器70同步完成，不会增加该传感器100整体的工艺复杂程度，使得具有该校准传感器80的传感器100生产过程简单。
本申请技术方案中，功能传感器70和校准传感器80均电性连接于芯片，该芯片内的程序能够对功能传感器70输出的电信号和校准传感器80输出的电信号进行计算，并输出修正后的电信号。当成型后的永磁体60性能为标准状态时，且永磁体60与功能传感器70的相对位置为标准状态时，可以计算得出校准传感器80所在位置的磁场方向和大小所对应的标准值，根据实际作用于校准传感器80的磁场方向和大小可以得到实际值，芯片中程序内置的算法能够将该标准值和实际值进行计算得到修正值，并利用该修正值对功能传感器70输出的电信号进行修正，得到修正后的准确的电信号进行输出，从而能够提高传感器100的准确度。
该校准传感器80可以为霍尔传感器、巨磁阻传感器、隧道磁阻传感器或各向异性磁阻传感器，还可以为其他传感器，在此不做限定。
传感器100包括振膜50，该振动部53为振膜50上能够相对固定部51进行振动的部分，校准传感器80与永磁体60设置位于振动部53的同一表面，可以使得校准传感器80的中心与永磁体60的中心相对振动部53的距离更加接近，从而减小或消除永磁体60作用于校准传感器80上的磁场分量，使得校准传感器80对用磁体自身磁场检测灵敏度高。
进一步地，校准传感器80的中心与永磁体60的中心相对振动部53的距离一致，使得永磁体60作用于校准传感器80上的磁场分量为零，从而使得校准传感器80对永磁体60的发出得到磁场检测效果准确。具体可以为，将校准传感器80的相对振动部53的高度与永磁体60相对振动部53的高度设置为相同。
结合图2、图3和图4所示的实施例中，传感器100包括衬底10、支撑部30和振膜50，支撑部30连接于衬底10和振膜50之间，并围合衬底10和振膜50形成密封或开放的空间。固定部51和振动部53均设于振膜50，具体可以为，在振膜50上成型出沟槽，连接于支撑部30的部分为固定部51，固定部51围设于振动部53的外侧，振动部53的一端连接固定部51，形成悬臂结构。该结构下形成为悬臂结构的振动部53，振动过程中灵敏度更高。
将功能传感器70为两个，两功能传感器70相对永磁体60对称设置，在永磁体60的磁场作用下，两个功能传感器70受到磁场作用的磁场大小相同、方向相反，从而能够减小或消除单个功能传感器70检测过程中环境因素造成的影响。
如图2所示，固定部51包括相对设置的第一侧边511和第二侧边512，以及相对设置的第三侧边513和第四侧边514，该第一侧边511、第三侧边513、第二侧边512和第四侧边514依次首尾相连形成环状，振动部53位于固定部51所围区域内，且振动部53的一端连接该第四侧边514，形成悬臂结构，永磁体60设于悬臂结构上，两功能传感器70分别设于第一侧边511和第二侧边512，该两功能传感器70相对于悬臂结构上的永磁体60对称设置。
本申请技术方案中，校准传感器80可以位于振动部53上相对永磁体60的任意位置。
定义两功能传感器70的中心连线为第一方向，定义校准传感器80的中心与永磁体60的中心连线为第二方向，该第一方向与第二方向呈夹角设置。
如图1和图2所示的实施例中，该第一方向与第二方向的夹角可以为90°，即，第一方向与所述第二方向垂直；如图9所示的实施例中，也可以为第一方向与第二方向的夹角为45°；如图10所示的实施例中，还可以为第一方向与第二方向的夹角为0°（180°），即，第一方向与第二方向相重合。该第一方向和第二方向的夹角还可以为其他任意角度值。
当第一方向与第二方向相垂直时，校准传感器80位于永磁体60靠近第三侧边513或永磁体60靠近第四侧边514的方向，此时，校准传感器80距离功能传感器70的距离较远，振动部53上有足够的空间对校准传感器80进行安装，能够便于传感器100的生产、制造，提高传感器100的安装效率，且使得组装成型的传感器100体积更加小巧、结构更加紧凑。
可以理解地，该校准传感器80也可以位于永磁体60靠近第一侧边511或第二侧边512的方向。
校准传感器80的数量可以为一个，也可以为两个或两个以上，当校准传感器80为两个时，两个校准传感器80相对永磁体60对称设置。
本申请技术方案中，永磁体60可以为平面摆放也可以为垂直摆放。
参见图5和图6示出了当永磁体60为平面摆放时，永磁体60的N极和S极的连线沿平行于振动部53所在平面设置。图5所示为在振动部53振动过程中，功能传感器70相对永磁体60处于z轴正向（z+）的位置和处于z轴负向（z-）位置时，功能传感器70受到永磁体60的磁场作用方向（功能传感器70所受磁场作用的总量和分量），该图示中，振动部53振动过程中假设永磁体60所处的位置为z为0的情况。图6所示为在振动部53振动过程中，校准传感器80受到永磁体60的磁场力作用方向。永磁体60的磁极方向与振动部53所在平面平行，校准传感器80的钉扎方向与振动部53所在平面平行。由于该结构下永磁体60作用于校准传感器80上的磁场方向为与振动部53所在平面平行，该校准传感器80的钉扎方向也要与振动部53所在平面平行，才能对永磁体60的磁场大小进行检测。
参见图7和图8，当永磁体60为垂直摆放时，永磁体60的N极和S极的连线垂直于振动部53所在平面。图7所示为在振动部53振动过程中，功能传感器70相对永磁体60处于z轴正向（z+）的位置和处于z轴负向（z-）位置时，功能传感器70受到永磁体60的磁场作用方向（功能传感器70所受磁场作用的总量和分量），该图示中，振动部53振动过程中假设永磁体60所处的位置为z为0的情况。图8所示为在振动部53振动过程中，校准传感器80受到永磁体60的磁场力作用方向。永磁体60的磁极方向与所述振动部53所在平面垂直，所述校准传感器80的钉扎方向与所述振动部53所在平面垂直。由于该结构下永磁体60作用于校准传感器80上的磁场方向为与振动部53所在平面垂直，该校准传感器80的钉扎方向也要与振动部53所在平面垂直，才能对永磁体60的磁场大小进行检测。
由于在对永磁体60进行制造的过程中，永磁体60本身的结构和工艺可能存在一定偏差，当这种偏差存在时，当永磁体60为水平摆放时，永磁体60施加于校准传感器80上的磁场不一定均为与振动部53所在平面平行，还可以存在其他方向的分量，为了对该可能出现的偏差进行检测，当永磁体60为平面摆放时，即，永磁体60的磁极方向与振动部53所在平面平行时，校准传感器80可以设置为至少两个，其中至少一校准传感器80的钉扎方向与振动部53所在平面平行，用于对永磁体60作用于该校准传感器80上与振动部53所在平面平行的磁场进行检测；至少一校准传感器80的钉扎方向与振动部53所在平面垂直，该校准传感器80被配置为对永磁体60作用于该校准传感器80上与振动部53所在平面垂直的磁场进行检测。该至少两校准传感器80均电性连接于芯片上，共同对功能传感器70输出的电信号进行修正，从而使传感器100输出的信号能够更准确、精度更高。
同样地，当永磁体60为垂直摆放时，即，永磁体60的磁极方向与振动部53所在平面垂直时，校准传感器80也可以设置为至少两个，其中至少一校准传感器80的钉扎方向与振动部53所在平面垂直，用于对永磁体60作用于该校准传感器80上与振动部53所在平面垂直的磁场进行检测；至少一校准传感器80的钉扎方向与振动部53所在平面平行，该校准传感器80被配置为对永磁体60作用于该校准传感器80上与振动部53所在平面平行的磁场进行检测。该至少两校准传感器80均电性连接于芯片上，共同对功能传感器70输出的电信号进行修正，从而使传感器100输出的信号能够更准确、精度更高。
本申请一未图示的实施例中，固定部51可以设置于衬底10上，即，固定部51为衬底10的一部分，振动部53设置于振膜50上，即，振动部53为振膜50的一部分。该实施例中，振膜50在进行振动过程中，振膜50上的永磁体60也能相对衬底10上的功能传感器70进行振动，永磁体60作用于功能传感器70上的磁场大小和方向也能随着振动的发生而不断变化，功能传感器70根据振膜50的振动而输出变化的电信号。
本申请还提出一种电子设备，该电子设备包括主控板和传感器100，该传感器100的具体结构参照上述实施例，由于本电子设备采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有功能，在此不再一一赘述。其中，传感器100的芯片电性连接电子设备的主控板。
电子设备还包括壳体，传感器100容置于壳体中，用以对电子设备内部的电气元件以及传感器100进行保护。本申请传感器100中的芯片还可以直接设置于电子设备的主控板上，与主控板上的其他电气元件进行集成，以达到结构紧凑的效果。
该电子设备可以为手机、平板电脑、游戏机等便携式的移动终端，也可以为车载设备或智能家居上相应的结构，该传感器100可以为麦克风、压力传感器100、位移传感器100或本领域熟知的其他传感器100。
该电子设备还可以进一步包括显示屏和/或按键，该显示屏和按键电性连接主控板，用户可以通过触控显示屏和或按键能够实现对传感器100的功能控制。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (10)

  1. 一种传感器，包括：
    固定部；
    振动部，所述振动部连接所述固定部，并可相对所述固定部往复振动；
    永磁体，所述永磁体设于所述振动部，并跟随所述振动部振动；
    功能传感器，所述功能传感器设于所述固定部，所述功能传感器被配置为在所述振动部振动过程中感应所述永磁体的磁场变化，而输出变化的电信号；以及
    校准传感器，所述校准传感器设于所述振动部，并跟随所述振动部振动，所述校准传感器被配置为感应所述永磁体的磁场，而对所述功能传感器输出的电信号进行修正。
  2. 如权利要求1所述的传感器，其中，所述校准传感器与所述永磁体设置于所述振动部的同一表面。
  3. 如权利要求2所述的传感器，其中，所述校准传感器的中心与所述永磁体的中心相对所述振动部的距离一致。
  4. 如权利要求1所述的传感器，其中，所述功能传感器为两个，两所述功能传感器相对所述永磁体对称设置；
    定义两所述功能传感器的中心连线为第一方向，定义所述校准传感器的中心与所述永磁体的中心连线为第二方向，所述第一方向与所述第二方向垂直。
  5. 如权利要求1所述的传感器，其中，所述永磁体的磁极方向与所述振动部所在平面平行，所述校准传感器的钉扎方向与所述振动部所在平面平行。
  6. 如权利要求1至5中任意一项所述的传感器，其中，所述固定部围设于所述振动部的外侧，所述振动部的一端连接所述固定部，形成悬臂结构。
  7. 如权利要求1至5中任一项所述的传感器，其中，所述永磁体的磁极方向与所述振动部所在平面垂直，所述校准传感器的钉扎方向与所述振动部所在平面垂直。
  8. 如权利要求1至5中任一项所述的传感器，其中，所述校准传感器为至少两个，至少一所述校准传感器的钉扎方向与所述振动部所在平面平行，至少一所述校准传感器的钉扎方向与所述振动部所在平面垂直，所述永磁体的磁极方向与所述振动部所在平面平行或垂直。
  9. 如权利要求1所述的传感器，其中，所述传感器包括：
    衬底；
    支撑部；以及
    振膜，所述支撑部连接于所述衬底和所述振膜之间，并围合所述振膜和所述衬底形成密封或开放的空间，所述固定部设于所述衬底，所述振动部设于所述振膜。
  10. 一种电子设备，包括如权利要求1至9中任一项所述的传感器。
PCT/CN2021/143054 2021-03-01 2021-12-30 传感器和电子设备 WO2022183825A1 (zh)

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