WO2022173139A1 - Dispositif électronique comprenant structure de dissipation de chaleur - Google Patents

Dispositif électronique comprenant structure de dissipation de chaleur Download PDF

Info

Publication number
WO2022173139A1
WO2022173139A1 PCT/KR2022/000960 KR2022000960W WO2022173139A1 WO 2022173139 A1 WO2022173139 A1 WO 2022173139A1 KR 2022000960 W KR2022000960 W KR 2022000960W WO 2022173139 A1 WO2022173139 A1 WO 2022173139A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
dissipation member
disposed
electronic device
hole
Prior art date
Application number
PCT/KR2022/000960
Other languages
English (en)
Korean (ko)
Inventor
여문기
박민
조정규
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022173139A1 publication Critical patent/WO2022173139A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a heat dissipation structure.
  • While electronic devices are gradually becoming smaller, their functions are gradually being diversified. Electrical elements embedded in the electronic device may be arranged such that the distance from the surrounding structures is gradually narrowed or concentrated according to the miniaturization and slimming of the electronic device, and may generate high temperature heat due to performing various functions. Such high-temperature heat may cause malfunction of the electronic device and may give a user discomfort. Accordingly, the electronic device may need a heat dissipation structure capable of effectively diffusing heat generated from an electrical element to the surroundings.
  • the electronic device includes at least one substrate (eg, a printed circuit board (PCB) or a flexible printed circuit board (FPCB)) disposed in an internal space and a heating element disposed on the substrate, and includes at least one electric It may include a device (eg, an AP, an application processor). At least one electrical element may generate heat, and the generated heat may be diffused to the surroundings through a heat dissipation structure disposed in an internal space of the electronic device. For example, heat generated from the at least one electrical element may be diffused through a metal housing (eg, a conductive side member or a metal bracket) of the electronic device.
  • a metal housing eg, a conductive side member or a metal bracket
  • the electronic device may further include at least one heat dissipation member disposed between the at least one electrical element and the metal housing.
  • a material having excellent thermal conductivity such as a graphite sheet, a heat pipe, or a vapor chamber, may be used.
  • Various embodiments of the present disclosure may provide an electronic device including a heat dissipation structure.
  • an electronic device including a heat dissipation structure capable of inducing heat diffusion from a heat source to an entire area of the electronic device may be provided.
  • an electronic device including a heat dissipation structure configured to effectively dissipate heat without increasing volume may be provided.
  • an electronic device includes a housing and a second surface disposed in an inner space of the housing, a first surface and a second surface facing in a direction opposite to the first surface, and at least partially at least one through hole a support member including a, and a first heat dissipation member that corresponds to at least a portion of the first surface in the interior space, and is disposed at least partially overlapping the at least one through hole when the first surface is viewed from above and a second heat dissipation member corresponding to at least a portion of the second surface in the interior space, and disposed to at least partially overlap with the at least one through hole when the first surface is viewed from above, and the at least one and a heat transfer member disposed in the through hole and thermally connecting the first heat dissipation member and the second heat dissipation member.
  • the electronic device has a heat dissipation structure that thermally connects heat dissipation members disposed on opposite surfaces of each other through a heat transmission member disposed in at least one through hole formed in a support member made of a metal material. By providing, heat generated from the heat source can be rapidly diffused to the entire area of the electronic device.
  • FIG. 1 is a perspective view of a front side of an electronic device (eg, a mobile electronic device) according to various embodiments of the present disclosure
  • FIG. 2 is a perspective view of a rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure
  • FIG. 4A is a configuration view of a side member viewed from the front according to various embodiments of the present disclosure
  • 4B is a configuration view of a side member viewed from the rear according to various embodiments of the present disclosure
  • 5A is a block diagram of an electronic device including a first heat dissipation member, viewed from the front, according to various embodiments of the present disclosure
  • 5B is a configuration diagram of an electronic device including a second heat dissipation member, as viewed from the rear, according to various embodiments of the present disclosure
  • FIG. 6 is a partial cross-sectional view of an electronic device taken along line 6-6 of FIG. 5A according to various embodiments of the present disclosure
  • FIGS. 7A and 7B are schematic diagrams illustrating an assembly sequence of a heat transfer member according to various embodiments of the present disclosure
  • FIGS. 8A and 8B are views illustrating heat flow of an electronic device before and after application of a heat dissipation structure according to various embodiments of the present disclosure
  • FIGS. 9A and 9B are partial cross-sectional views of an electronic device illustrating a state in which a first heat dissipation member and a second heat dissipation member are thermally connected through a heat transfer member according to various embodiments of the present disclosure
  • FIGS. 10A and 10B are partial cross-sectional views of an electronic device illustrating an arrangement structure of a first heat dissipation member and a second heat dissipation member based on a heat transfer member according to various embodiments of the present disclosure
  • FIG. 11 is a block diagram of an electronic device including a first heat dissipation member, viewed from the front, according to various embodiments of the present disclosure
  • FIG. 1 is a perspective view of a front side of an electronic device 100 (eg, a mobile electronic device) according to various embodiments of the present disclosure.
  • 2 is a perspective view of a rear surface of the electronic device 100 of FIG. 1 according to various embodiments of the present disclosure.
  • an electronic device 100 includes a first surface (or front) 110A, a second surface (or rear) 110B, and a first surface 110A. and a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B.
  • the housing may refer to a structure forming a part of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1 .
  • the first surface 110A may be formed by the front plate 102 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent.
  • the second surface 110B may be formed by the substantially opaque back plate 111 .
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure 118 (or "side member") including a metal and/or a polymer.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 has a first region 110D that extends seamlessly by bending from the first surface 110A toward the rear plate, a long edge of the front plate. edge) can be included at both ends.
  • the rear plate 111 may include a second region 110E that extends seamlessly from the second surface 110B toward the front plate at both ends of the long edge. have.
  • the front plate 102 or the back plate 111 may include only one of the first region 110D or the second region 110E.
  • the front plate 102 may not include the first region and the second region, but only a flat plane disposed parallel to the second surface 110B.
  • the side bezel structure 118 when viewed from the side of the electronic device, has a first thickness ( or width), and may have a second thickness thinner than the first thickness on the side surface including the first region 110D or the second region 110E.
  • the electronic device 100 includes a display 101 , an input device 103 , a sound output device 107 , 114 , a sensor module 104 , 119 , a camera module 105 , 112 , and a key. It may include at least one of an input device 117 , an indicator (not shown), and a connector 108 . In some embodiments, the electronic device 100 may omit at least one of the components (eg, the key input device 117 or an indicator) or additionally include other components.
  • the display 101 may be exposed through a substantial portion of the front plate 102 , for example. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 forming the first area 110D of the first surface 110A and the side surface 110C.
  • the display 101 may be disposed adjacent to or coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.
  • at least a portion of the sensor module 104 , 119 , and/or at least a portion of a key input device 117 is located in the first area 110D and/or the second area 110E. can be placed.
  • the input device 103 may include a microphone 103 .
  • the input device 103 may include a plurality of microphones 103 arranged to sense the direction of the sound.
  • the sound output devices 107 and 114 may include speakers 107 and 114 .
  • the speakers 107 and 114 may include an external speaker 107 and a receiver 114 for calls.
  • the microphone 103 , the speakers 107 , 114 , and the connector 108 may be at least partially disposed in the internal space of the electronic device 100 , and may be formed through at least one hole formed in the housing 110 . may be exposed to the external environment.
  • the hole formed in the housing 110 may be commonly used for the microphone 103 and the speakers 107 and 114 .
  • the sound output devices 107 and 114 may include a speaker (eg, a piezo speaker) that operates while excluding a hole formed in the housing 110 .
  • the sensor modules 104 and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104 and 119 include, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 110A of the housing 110 . ) (eg, a fingerprint sensor), and/or a third sensor module 119 (eg, an HRM sensor) disposed on the second surface 110B of the housing 110 .
  • the fingerprint sensor may be disposed on the first surface 110A (eg, a home key button) of the housing 110 , a partial region of the second surface 110B, and/or under the display 101 .
  • the electronic device 100 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor, a proximity sensor, and an illuminance sensor.
  • a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor, a proximity sensor, and an illuminance sensor.
  • the camera modules 105 and 112 include a first camera module 105 disposed on the first surface 110A of the electronic device 100, and a second camera module 112 disposed on the second surface 110B of the electronic device 100, and/or flash 113 .
  • the camera modules 105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one surface of the electronic device 100 .
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 .
  • the electronic device 100 may not include some or all of the above-mentioned key input devices 117 and the not included key input devices 117 are displayed on the display 101 as soft keys or the like. It may be implemented in other forms.
  • the key input device 117 may be implemented using a pressure sensor included in the display 101 .
  • the indicator may be disposed, for example, on the first surface 110A of the housing 110 .
  • the indicator may provide, for example, state information of the electronic device 100 in the form of a light (eg, a light emitting device).
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 105 .
  • the indicator may include, for example, an LED, an IR LED and/or a xenon lamp.
  • the connector hole 108 includes a first connector hole 108 capable of receiving a connector (eg, a universal serial bus (USB) connector) for transmitting and receiving power and/or data with an external electronic device, and/or It may include a second connector hole (or earphone jack) (not shown) capable of accommodating a connector for transmitting and receiving an audio signal to and from an external electronic device.
  • a connector eg, a universal serial bus (USB) connector
  • USB universal serial bus
  • the camera modules 105 and 112 , some of the camera modules 105 , some of the sensor modules 104 and 119 , or an indicator may be disposed to be exposed through the display 101 .
  • the camera module 105 , the sensor module 104 , or the indicator may come into contact with the external environment from the internal space of the electronic device 100 through the perforated opening or transmission area up to the front plate 102 of the display 101 .
  • the area where the display 101 and the camera module 105 face each other may be formed as a transparent area having a predetermined transmittance as a part of an area displaying content.
  • the transmission region may be formed to have a transmittance in a range of about 5% to about 20%.
  • the transmission area may include an area overlapping an effective area (eg, an angle of view area) of the camera module 105 through which light for generating an image by being imaged by an image sensor passes.
  • the transmissive area of the display 101 may include an area having a lower pixel density than the surrounding area.
  • the transmissive area may replace the opening.
  • the camera module 105 may include an under display camera (UDC).
  • UDC under display camera
  • some sensor modules 104 may be arranged to perform their functions without being visually exposed through the front plate 102 in the internal space of the electronic device.
  • the area of the display 101 facing the sensor module may not need a perforated opening.
  • the electronic device 100 has a bar-type or plate-type appearance, but the present disclosure is not limited thereto.
  • the illustrated electronic device 100 may be a part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device.
  • foldable electronic device “slidable electronic device”, “stretchable electronic device” and/or “rollable electronic device” This means that bending deformation of the display (eg, the display 330 of FIG. 3 ) is possible, at least a part of it is folded, rolled or rolled, or at least partially the area is expanded and/or the housing It may refer to an electronic device that can be accommodated inside (eg, the housing 110 of FIGS.
  • a foldable electronic device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device expands a screen display area by unfolding a display or exposing a larger area of the display to the outside according to a user's needs. Can be used.
  • FIG. 3 is an exploded perspective view of the electronic device 100 of FIG. 1 according to various embodiments of the present disclosure.
  • the electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 100 of FIGS. 1 and 2 , or may include another embodiment of the electronic device.
  • the electronic device 300 (eg, the electronic device 100 of FIG. 1 or FIG. 2 ) includes a side member 310 (eg, a side bezel structure) and a support member 311 (eg, a bracket). or support structure), a front cover 320 (eg, the front plate 302 of FIG. 1 ), a display 330 (eg, the display 101 of FIG. 1 ), at least one substrate 341 , 342 (eg, the display 101 of FIG. 1 ). : printed circuit board (PCB), flexible PCB (FPCB), or rigid-flex PCB (RFPCB), battery 350, additional support member 360 (eg rear case), antenna 370 and rear cover ( 380) (eg, the rear plate 111 of FIG.
  • PCB printed circuit board
  • FPCB flexible PCB
  • RFPCB rigid-flex PCB
  • the electronic device 300 may omit at least one of the components (eg, the support member 311 or the additional support member 360 ) or additionally include other components. At least one of the components of the electronic device 300 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and overlapping descriptions may be omitted. .
  • the side member 310 may include a first surface 3101 facing a first direction (eg, a z-axis direction), a second surface 3102 facing a direction opposite to the first surface 3101 , and a second side member 310 .
  • a side surface 3103 surrounding the space between the first surface 3101 and the second surface 3102 (eg, the inner space 3001 of FIG. 6 ) may be included.
  • at least a portion of the side surface 3103 may form an exterior of the electronic device.
  • the support member 311 may be disposed in such a way that it extends from the side member 310 toward the internal space 3001 of the electronic device 300 .
  • the support member 311 may be disposed separately from the side member 310 .
  • the side member 310 and/or the support member 311 may be formed of, for example, a metal material and/or a non-metal material (eg, a polymer).
  • the support member 311 may support at least a portion of the display 330 through the first surface 3101 , and at least one substrate 341 , 342 through the second surface 3102 . and/or may be arranged to support at least a portion of the battery 350 .
  • the at least one substrate 341 , 342 includes a first substrate 341 (eg: main substrate) and a second substrate 342 (eg, a sub substrate) disposed on the other side.
  • the first substrate 341 and/or the second substrate 342 may include a processor, a memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • the interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300 , for example, a non-rechargeable primary cell, or a rechargeable secondary cell, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed substantially on the same plane as, for example, at least one of the substrates 341 and 342 . According to an embodiment, the battery 350 may be disposed in a way that it is embedded in the electronic device 300 . In some embodiments, the battery 350 may be detachably disposed from the electronic device 300 .
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by some or a combination of the side members 310 and/or the support members 311 .
  • the electronic device 300 may further include a digitizer for detecting an external electronic pen.
  • the support member 311 may include at least one through-hole 3104 and 3105 formed to penetrate from the first surface 3101 to the second surface 3102 .
  • the at least one through hole (3104, 3105) is a jig hole (jig hole) 3104 for manufacturing the side member 310, a hole 3105 for placing a sensor (eg, a fingerprint sensor), It may include at least one of a swelling hole for the battery 350 and a hole used as a passage path of an electrical connection member (eg, FPCB, flexible printed circuit board).
  • an electrical connection member eg, FPCB, flexible printed circuit board
  • the electronic device 300 includes a first heat dissipation member 410 disposed at a position corresponding to a partial region of the first surface 3101 of the support member 311 and a second portion of the support member 311 .
  • a second heat dissipation member 420 disposed at a position corresponding to a partial region of the surface 3102, a third heat dissipation member 430 disposed side by side at a position adjacent to the second heat dissipation member, and at least one through hole 3104 It may include an disposed heat transfer member 440 .
  • the third heat dissipation member 430 may be disposed at a position that at least partially overlaps with at least one substrate 341 including an electrical device (eg, the electrical device 3411 of FIG. 6 ).
  • the second heat dissipation member 420 may include a region that does not at least partially overlap the first heat dissipation member 410 when the first surface 3101 is viewed from above.
  • the first heat dissipation member 410 and the second heat dissipation member 420 are arranged to at least partially overlap the heat transfer member 440 when the first surface 3101 is viewed from above, may be thermally connected. Accordingly, the heat generated from the electrical device (eg, the electrical device 3411 of FIG.
  • the opening portion (eg, the opening portion 3140-1 in FIG. 11 ) may include at least a portion of an edge and/or at least a corner of the support member 311 and/or the side member 310 . It may be formed in such a way that a part is removed through a chamfering process.
  • 4A is a configuration view of a side member viewed from the front according to various embodiments of the present disclosure
  • 4B is a configuration view of a side member viewed from the rear according to various embodiments of the present disclosure
  • the electronic device (eg, the electronic device 300 of FIG. 3 ) is connected to the side member 310 and the electronic device (eg, the electronic device 300 of FIG. 3 ) from the side member 310 ). It may include a support member 311 extending into the inner space (eg, the inner space 3001 of FIG. 6 ).
  • the side member 311 may include a conductive portion 310a (eg, a metal material) and a non-conductive portion 310b (eg, a polymer) coupled to the conductive portion 310a.
  • the conductive part 310a is designed for efficient arrangement of electronic components disposed in an internal space (eg, the internal space 3001 of FIG. 6 ) of the electronic device (eg, the electronic device 300 of FIG. 3 ). It may be arranged to have excellent rigidity based on the
  • the side member 310 may have a first surface 3101 oriented in a specified direction (eg, z-axis direction), and a first surface 3101 oriented in a direction opposite to the first surface 3101 (eg, -z-axis direction). and a side 3103 surrounding the second side 3102 and the space between the first side 3101 and the second side 3102 .
  • the side surface 3103 is a first side 3103a having a first length in a specified direction (eg, the y-axis direction), and a direction perpendicular to the first side 3103a (eg, the -x-axis direction).
  • the electronic device eg, the electronic device 300 of FIG. 3
  • the electronic device 300 of FIG. 3 has a length in a direction parallel to the first side 3103a and the third side 3103c of the side member 310 (eg, the y-axis direction). It can be formed to have.
  • the side member 310 may include at least one through hole formed from the first surface 3101 to the second surface.
  • the at least one through hole (3104, 3105) is a jig hole (jig hole) 3104 for manufacturing the side member 310, a hole 3105 for placing a sensor (eg, a fingerprint sensor), It may include at least one of a swelling hole for the battery 350 and a hole used as a passage path of an electrical connection member (eg, FPCB, flexible printed circuit board).
  • the at least one through-hole 3104 and 3105 may be intentionally formed at a location designated for a heat dissipation structure according to exemplary embodiments of the present disclosure.
  • 5A is a block diagram of an electronic device including a first heat dissipation member, viewed from the front, according to various embodiments of the present disclosure
  • 5B is a configuration diagram of an electronic device including a second heat dissipation member, as viewed from the rear, according to various embodiments of the present disclosure
  • the electronic device 300 may include a side member 310 including a support member 311 extending at least partially into the inner space 3001 .
  • the electronic device 300 may include the first heat dissipation member 410 disposed through a partial region of the first surface 3101 of the support member 311 .
  • the electronic device 300 may include an adhesive member 331 (eg, a double-sided tape) disposed through another area of the first surface 3101 of the support member 311 .
  • the adhesive member 331 may be used to attach the display 330 disposed on the first surface 3101 .
  • the first heat dissipation member 410 may be disposed on a partial area of the first surface 3101 excluding the area where the adhesive member 331 is disposed. According to an embodiment, the first heat dissipation member 410 may be disposed at a position that at least partially overlaps the at least one through hole 3104 when the first surface 3101 is viewed from above. According to an embodiment, the display 330 is supported through at least a portion of the first surface 3101 of the side member 310 in the internal space 3001 of the electronic device 300 , and a front cover (eg: It may be arranged to be visible from the outside through the front plate 320 of FIG. 3 .
  • a front cover eg: It may be arranged to be visible from the outside through the front plate 320 of FIG. 3 .
  • the second heat dissipation member 420 and the first substrate 341 are disposed in a region overlapping the battery 350 .
  • a third heat dissipation member 430 disposed in an area that at least partially overlaps.
  • the second heat dissipation member 420 may be disposed at a position that at least partially overlaps the at least one through hole 3104 when the first surface 3101 is viewed from above.
  • an adhesive member 351 eg, a double-sided tape
  • for attaching the battery 350 may be laminated on the second heat dissipation member 420 .
  • the electronic device 300 includes a first region (region A) on which a first substrate 341 including an electric element (eg, the electric element 3411 of FIG. 6 ) is disposed as a heat source, and a battery; A second region (region B) in which the 350 and the second substrate 342 are disposed may be included.
  • the first area (area A) and the second area (area B) may be in a region-separated state, and the second heat dissipation member 420 and the third heat dissipation member 430 are thermally separated. It may be in a state arranged to be separated.
  • the first heat dissipation member 410 , the second heat dissipation member 420 , or the third heat dissipation member 430 may include a graphite sheet, a thermal paste, a liquid or solid thermal interface material (TIM) or a vapor chamber. It may include at least one.
  • the electronic device 300 may include a heat transfer member (eg, the heat transfer member 440 of FIG. 6 ) disposed in the at least one through hole 3104 .
  • the heat transfer member eg, the heat transfer member 440 of FIG. 6
  • the heat transfer member may be disposed to thermally connect the first heat dissipation member 410 and the second heat dissipation member 420 .
  • FIG. 6 is a partial cross-sectional view of an electronic device taken along line 6-6 of FIG. 5A according to various embodiments of the present disclosure
  • the electronic device 300 provides a first surface 3101 facing a first direction (eg, a z-axis direction) and a second direction opposite to the first surface 3101 (eg, a -z-axis direction).
  • a side member 310 comprising a support member 311 including a second face 3102 facing 320), the display 330 disposed between the front cover 320 and the first surface 3101 and arranged to be visible from the outside through the front cover 320, disposed to correspond to the second surface 3102 a first substrate 341 , a second substrate 342 , and a first substrate 341 and a second substrate 342 disposed between the rear cover 380 , the rear cover 380 and the second surface 3102 ) It may include a battery 350 disposed therebetween.
  • the support member 311 may include at least one through hole 3104 .
  • the at least one through hole 3104 may be at least partially filled through the heat transfer member 440 .
  • the electronic device 300 is disposed on the first surface 3101 , and when the first surface 3101 is viewed from above, the first electronic device 300 is disposed to at least partially overlap the heat transfer member 440 .
  • a heat dissipation member 410 may be included.
  • the electronic device 300 is disposed on the second surface 3102 , and when the first surface 3101 is viewed from above, the second electronic device 300 is disposed to at least partially overlap the heat transfer member 440 .
  • a heat dissipation member 420 may be included.
  • the electronic device 300 is disposed at a position different from that of the second heat dissipation member 420 on the second surface 3102 , and when the first surface 3101 is viewed from above, the first substrate A third heat dissipation member 430 disposed at least partially overlapping with the 341 may be included.
  • the first substrate 341 may be disposed in a first area (area A) of the electronic device 300
  • the battery 350 and the second substrate 342 may be disposed in a first area (area A).
  • region B may be disposed in a different second region
  • the electronic device 300 includes an electrical device 3411 (eg, an application processor (AP)) disposed on the substrate 341 and another device disposed between the electrical device 3411 and the third heat dissipation member.
  • a heat transfer member 430 may be included.
  • another heat transfer member 430 may be thermally connected to contact with or close to the electrical element 4311 and/or the third heat dissipation member 430 .
  • another heat transfer member 430 may include a thermal interface material (TIM).
  • TIM thermal interface material
  • heat generated from the electrical element 3411 is collected to the third heat dissipation member 430 through another heat transfer member 450, but in the first region ( It may be difficult to transfer to the second heat dissipation member 420 of the second region (region B), which is regionally separated from the region A).
  • the heat collected by the third heat dissipation member 430 is transferred to the first heat dissipation member 410 through the conductive portion 310a of the support member 311 , but is partially disposed on the first surface 3101 . It may be difficult to diffuse to the entire area of the support member 311 through the first heat dissipation member 410 .
  • the heat transfer member 440 disposed in the at least one through hole 3104 may thermally connect the first heat dissipation member 410 and the second heat dissipation member 420 to each other. have. Accordingly, the heat collected from the third heat dissipation member 430 is transferred to the first heat dissipation member ( The heat transferred to 410 and collected by the first heat dissipating member 410 is transferred to the second heat dissipating member 420 through the heat transmitting member 440 , and thus the entire area (eg, area A) of the support member 311 . and B) can spread rapidly.
  • FIGS. 7A and 7B are schematic diagrams illustrating an assembly sequence of a heat transfer member according to various embodiments of the present disclosure
  • the heat transfer member 440 may include an elastic member 441 and a deployment sheet 442 disposed to surround at least a portion of the elastic member 441 .
  • the unfolding sheet 442 may include a heat dissipation sheet 443 (eg, a graphite sheet) and a protective film disposed to surround the heat dissipation sheet 443 .
  • the elastic member 441 may be formed of a material having elasticity, such as PU foam, sponge, urethane, or silicone.
  • the elastic member 441 may be formed in a shape corresponding to at least one through-hole (eg, the through-hole 3104 in FIG. 6 ), and is developed to correspond to the elastic member 441 .
  • the deployment area 442 includes a first heat dissipation member (eg, the first heat dissipation member 410 of FIG. 6 ) and a second heat dissipation member (eg, the second heat dissipation member 420 of FIG. 6 );
  • a heat dissipation sheet 443 may be formed so as to be exposed on the contacted surface, and a first heat dissipation member (eg, the first heat dissipation member 410 in FIG. 6 ) and a second heat dissipation member (eg, the heat dissipation tape 444 )
  • the heat transfer member 440 is packaged through the elastic material 441 and the unfolding sheet 422 punched out in a shape corresponding thereto, so that at least one through hole (eg, the through hole in FIG. 6 ). It may be advantageous to correspond to the various shapes of the hole 3104).
  • FIGS. 8A and 8B are views illustrating heat flow of an electronic device before and after application of a heat dissipation structure according to various embodiments of the present disclosure
  • the temperature near the heat source of the electronic device 300 was 40.9° C., while the first heat dissipation member 410 through the heat transfer member 440 . It can be seen that in a state in which the heat dissipation structure of the present disclosure in which the heat dissipation structure of the present disclosure is thermally connected to the second heat dissipation member 420 is applied, the temperature near the heat source of the electronic device 300 is relatively low to 40°C. This may mean that, through the heat dissipation structure according to the present disclosure, heat generated from the heat source is relatively more diffused to the surroundings, thereby reducing the local heat pooling phenomenon of the electronic device.
  • FIGS. 9A and 9B are partial cross-sectional views of an electronic device illustrating a state in which a first heat dissipation member and a second heat dissipation member are thermally connected through a heat transfer member according to various embodiments of the present disclosure
  • At least one through hole 3104 formed to overlap with at least a portion of the second heat dissipation member 420 disposed on the surface 3102 may be included.
  • the heat transfer member 440 - which fills at least one through hole 3104 and thermally connects the first heat dissipation member 410 and the second heat dissipation member 420 to each other. 1) may be included.
  • the heat transfer member 440-1 may include a liquid or solid thermal interface material (TIM), thermal paste, or a metal material.
  • TIM liquid or solid thermal interface material
  • the heat transfer member 440-1 is a metal having relatively higher thermal conductivity than the conductive portion of the support member 311 (eg, the conductive portion 310a of FIG. 4A ) when a metal material is applied. material may be included.
  • the support member 311 is at least one through-hole and may include a plurality of through-holes 3106 .
  • the plurality of through-holes 3106 may be spaced apart from each other at a predetermined interval.
  • each of the plurality of through-holes 3106 may be filled with a heat transfer member 440 - 2 , and the heat transfer member 440 - 2 includes the first heat dissipation member 410 and the second heat dissipation member. may be thermally connected to 420 .
  • FIGS. 10A and 10B are partial cross-sectional views of an electronic device illustrating an arrangement structure of a first heat dissipation member and a second heat dissipation member based on a heat transfer member according to various embodiments of the present disclosure
  • the first heat dissipation member 410 and the second heat dissipation member 420 are disposed to overlap the entire area of the heat transfer member 440 when the first surface 3101 is viewed from above.
  • the present invention is not limited thereto, and the first heat dissipation member 410 and/or the second heat dissipation member 420 may be disposed to partially overlap the heat transfer member 440 when the first surface 3101 is viewed from above. may be
  • At least one through hole 3104 formed to overlap with at least a portion of the second heat dissipation member 420 disposed on the surface 3102 may be included.
  • the first heat dissipation member 410 may be disposed to partially overlap the heat transfer member 440 when the first surface 3101 is viewed from above.
  • the second heat dissipation member 420 may be disposed to partially overlap the heat transfer member 440 when the first surface 3101 is viewed from above.
  • the first heat dissipation member 410 may be disposed to have a designated separation section t1 that does not overlap the second heat dissipation member when the first surface 3101 is viewed from above.
  • the first heat dissipation member 410 and the second heat dissipation member 420 are thermally connected to the heat transfer member 440 even if they do not overlap when the first surface 3101 is viewed from above. Therefore, smooth heat flow can be induced.
  • the first heat dissipation member 410 disposed on the first surface 3101 of the support member 311 and the second surface 3102 are disposed At least one through hole 3104 formed to overlap at least a portion of the second heat dissipation member 420 may be included.
  • the first heat dissipation member 410 may be disposed to partially overlap the heat transfer member 440 when the first surface 3101 is viewed from above.
  • the second heat dissipation member 420 may be disposed to partially overlap the heat transfer member 440 when the first surface 3101 is viewed from above.
  • the first heat dissipation member 410 may be disposed to have an overlapping section t2 partially overlapped with the second heat dissipation member when the first surface 3101 is viewed from above.
  • the first heat dissipation member 410 and the second heat dissipation member 420 are thermally connected to the heat transfer member 440 even if they partially overlap when the first surface 3101 is viewed from above. Therefore, smooth heat flow can be induced.
  • FIG. 11 is a block diagram of an electronic device including a first heat dissipation member, viewed from the front, according to various embodiments of the present disclosure
  • the electronic device 300 may include a side member 310 and a support member 311 extending at least partially from the side member 310 to an internal space of the electronic device.
  • the support member 311 may include an opening part 3104 - 1 that is at least partially open along the edge (eg, a portion of the edge and/or corners are removed in a chamfered manner).
  • the heat transfer member eg, the heat transfer member 440 of FIG. 6
  • the heat transfer member may be filled in at least a portion of the opening 3104 - 1, and a first heat dissipation member (eg, the first heat dissipation member of FIG. 6 ( 410)) and a second heat dissipation member (eg, the second heat dissipation member 420 of FIG. 6 ).
  • the electronic device (eg, the electronic device 300 of FIG. 6 ) includes a housing (eg, the housing 110 of FIG. 1 ) and an internal space of the housing (eg, the internal space of FIG. 6 ) 3001)) and facing a first surface (eg, the first surface 3101 of FIG. 6 ) and a second surface (eg, the -z-axis direction of FIG. 6 ) facing the opposite direction to the first surface (eg: A support member (eg, support member 311 of FIG. 6 ) that includes the second surface 3102 of FIG. 6 ) and at least partially includes at least one through hole (eg, the through hole 3104 of FIG. 6 ).
  • a first heat dissipation member eg, in FIG. 6
  • the first heat dissipation member 410 in the inner space, correspond to at least a portion of the second surface, and at least partially overlap the at least one through hole when the first surface is viewed from above a second heat dissipation member (eg, the second heat dissipation member 420 of FIG. 6 ) and a column disposed in the at least one through hole and thermally connecting the first heat dissipation member and the second heat dissipation member
  • a transfer member eg, the heat transfer member 440 of FIG. 6
  • the heat transfer member 440 of FIG. 6 may be included.
  • the support member may be at least partially formed of a metal material.
  • the first heat dissipation member and the second heat dissipation member may not overlap.
  • the first heat dissipation member and the second heat dissipation member may at least partially overlap.
  • the heat transfer member may at least partially fill the at least one through hole.
  • the heat transfer member includes an elastic member and a heat dissipation sheet disposed to surround an outer surface of the elastic member, and at least a portion of the heat dissipation sheet includes the first heat dissipation member and the second heat dissipation member and It can be arranged in such a way as to be in contact.
  • the heat dissipation sheet may include a graphite sheet.
  • the heat transfer member may include a liquid or solid thermal interface material (TIM), thermal paste, or a metal material at least partially accommodated in the at least one through hole.
  • TIM liquid or solid thermal interface material
  • At least one electrical element disposed to correspond to the second surface and thermally connected to the support member may be included.
  • the heat generated from the at least one electrical element may be sequentially or in reverse sequentially diffused through the support member, the first heat dissipation member, the heat transfer member, and the second heat dissipation member.
  • it further includes a third heat dissipation member disposed between the at least one electrical element and the second surface, wherein when the first surface is viewed from above, the third heat dissipation member is the first heat dissipation member It may be disposed so as not to overlap the member.
  • the third heat dissipation member may include a vapor chamber or a TIM.
  • the first heat dissipation member and the second heat dissipation member may be disposed in such a way that they are in contact with at least a portion of the heat transfer member.
  • the at least one through-hole includes a plurality of through-holes disposed at a predetermined interval in the support member, the heat transfer member fills the plurality of through-holes, and the first When viewed from above, at least a portion of the first heat dissipation member and at least a portion of the second heat dissipation member may be disposed to overlap the plurality of through holes.
  • the first heat dissipation member and the second heat dissipation member may include a graphite sheet or a heat dissipation coating layer disposed on the first surface and the second surface of the support member.
  • the at least one through-hole is at least one of a swelling hole for a battery, a jig hole for manufacturing the side member, a hole for arranging a sensor, or a hole used as a passage for an electrical connection member. may contain one.
  • the housing includes a front cover corresponding to the first surface, a rear cover corresponding to the second surface, and a conductive side member surrounding the inner space between the front cover and the rear cover. and the support member may extend from the conductive side member into the inner space.
  • the display may further include a display disposed between the first surface and the front cover, and disposed to be at least partially visible from the outside through the front cover.
  • the first surface when the first surface is viewed from above, it includes an adhesive member disposed at a position that does not overlap the first heat dissipation member and attaching the display to the first surface, and the first surface When viewed from above, the adhesive member may be at least partially overlapped with the second heat dissipation member.
  • the second heat dissipation sheet is at least partially formed with the battery can be nested.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Selon divers modes de réalisation, un dispositif électronique peut comprendre : un boîtier ; un élément de support, qui est disposé dans l'espace interne du boîtier, comprend une première surface et une seconde surface orientée dans la direction opposée à la première surface, et comprend au moins partiellement au moins un trou traversant ; un premier élément de dissipation de chaleur, qui correspond à au moins une partie de la première surface dans l'espace intérieur et est disposée de façon à chevaucher au moins partiellement ledit au moins un trou traversant lorsque la première surface est vue depuis le dessus ; un second élément de dissipation de chaleur, qui correspond à au moins une partie de la seconde surface dans l'espace interne et est disposé de façon à chevaucher au moins partiellement ledit au moins un trou traversant lorsque la première surface est vue depuis le dessus ; et un élément de transfert de chaleur, qui est disposé dans le ou les trous traversants et connecte thermiquement le premier élément de dissipation de chaleur et le second élément de dissipation de chaleur.
PCT/KR2022/000960 2021-02-09 2022-01-19 Dispositif électronique comprenant structure de dissipation de chaleur WO2022173139A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210018540A KR20220114922A (ko) 2021-02-09 2021-02-09 방열 구조를 포함하는 전자 장치
KR10-2021-0018540 2021-02-09

Publications (1)

Publication Number Publication Date
WO2022173139A1 true WO2022173139A1 (fr) 2022-08-18

Family

ID=82837695

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/000960 WO2022173139A1 (fr) 2021-02-09 2022-01-19 Dispositif électronique comprenant structure de dissipation de chaleur

Country Status (2)

Country Link
KR (1) KR20220114922A (fr)
WO (1) WO2022173139A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150005043A1 (en) * 2012-01-16 2015-01-01 Nec Casio Modile Communications, Ltd. Portable terminal device
JP2015015545A (ja) * 2013-07-03 2015-01-22 パナソニック株式会社 携帯端末
KR20150100472A (ko) * 2014-02-24 2015-09-02 삼성전자주식회사 하드웨어 쉴드 장치 및 이를 포함하는 전자 장치
JP5939102B2 (ja) * 2012-09-18 2016-06-22 富士通株式会社 電子機器
KR20160128950A (ko) * 2013-10-31 2016-11-08 주식회사 아모그린텍 방열 부재 및 그를 구비한 휴대용 단말기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150005043A1 (en) * 2012-01-16 2015-01-01 Nec Casio Modile Communications, Ltd. Portable terminal device
JP5939102B2 (ja) * 2012-09-18 2016-06-22 富士通株式会社 電子機器
JP2015015545A (ja) * 2013-07-03 2015-01-22 パナソニック株式会社 携帯端末
KR20160128950A (ko) * 2013-10-31 2016-11-08 주식회사 아모그린텍 방열 부재 및 그를 구비한 휴대용 단말기
KR20150100472A (ko) * 2014-02-24 2015-09-02 삼성전자주식회사 하드웨어 쉴드 장치 및 이를 포함하는 전자 장치

Also Published As

Publication number Publication date
KR20220114922A (ko) 2022-08-17

Similar Documents

Publication Publication Date Title
WO2020204360A1 (fr) Dispositif électronique comprenant un écran
WO2020032438A1 (fr) Dispositif électronique comprenant un élément de blindage connecté à une plaque conductrice recouvrant l'ouverture d'un boîtier de protection
WO2021153929A1 (fr) Dispositif électronique comprenant un évent d'aération
WO2021033919A1 (fr) Dispositif électronique comprenant un module d'appareil photographique
WO2020171452A1 (fr) Structure d'empilement de cartes de circuit imprimé utilisant un interposeur et dispositif électronique la comprenant
WO2019212163A1 (fr) Structure de conduit de dispositif électronique et dispositif électronique comprenant une telle structure
WO2021015424A1 (fr) Dispositif électronique comprenant une feuille de blindage et un élément de rayonnement thermique
WO2022173129A1 (fr) Dispositif électronique comprenant structure de dissipation de chaleur
WO2021172739A1 (fr) Dispositif électronique comprenant une interposeur
WO2020130445A1 (fr) Film décoratif et dispositif électronique comprenant un tel film décoratif
WO2019172719A1 (fr) Carte de circuit imprimé comprenant une structure conductrice pour connecter électriquement des fils, et dispositif électronique la comprenant
WO2020145648A1 (fr) Ensemble d'affichage et dispositif électronique le comprenant
WO2022071747A1 (fr) Dispositif électronique comprenant une structure étanche
WO2022030837A1 (fr) Structure d'imperméabilisation d'un dispositif électronique, et dispositif électronique comprenant ladite structure
WO2020022759A1 (fr) Dispositif électronique comportant une structure de rayonnement thermique
WO2022050581A1 (fr) Dispositif électronique comprenant un support
WO2021157835A1 (fr) Appareil électronique comprenant un élément de dissipation de chaleur
WO2022173139A1 (fr) Dispositif électronique comprenant structure de dissipation de chaleur
WO2021235677A1 (fr) Dispositif électronique contenant un module sonore
WO2022071701A1 (fr) Dispositif électronique comprenant une unité d'affichage flexible
WO2021162298A1 (fr) Dispositif électronique comprenant un affichage
WO2020262794A1 (fr) Dispositif électronique comprenant une structure d'antenne pouvant être installée dans un espace étroit
WO2022177203A1 (fr) Dispositif électronique comprenant une chambre à vapeur
WO2020085639A1 (fr) Dispositif électronique comprenant une structure de renforcement de masse
WO2020054943A1 (fr) Élément ruban et appareil électronique comprenant celui-ci

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22752899

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22752899

Country of ref document: EP

Kind code of ref document: A1