WO2022172592A1 - Transport mechanism, resin molding device, and method for producing resin molded article - Google Patents

Transport mechanism, resin molding device, and method for producing resin molded article Download PDF

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Publication number
WO2022172592A1
WO2022172592A1 PCT/JP2021/046928 JP2021046928W WO2022172592A1 WO 2022172592 A1 WO2022172592 A1 WO 2022172592A1 JP 2021046928 W JP2021046928 W JP 2021046928W WO 2022172592 A1 WO2022172592 A1 WO 2022172592A1
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WO
WIPO (PCT)
Prior art keywords
resin
molded product
holding portion
unloader
holding
Prior art date
Application number
PCT/JP2021/046928
Other languages
French (fr)
Japanese (ja)
Inventor
周平 吉田
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN202180076879.6A priority Critical patent/CN116457183A/en
Priority to KR1020237015878A priority patent/KR20230085177A/en
Publication of WO2022172592A1 publication Critical patent/WO2022172592A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

Definitions

  • the present invention relates to technology of a conveying mechanism, a resin molding apparatus, and a method of manufacturing a resin molded product.
  • Patent Literature 1 discloses a technology related to a transport mechanism that transports the workpiece after resin molding and unnecessary resin (cull) from the mold.
  • This transport mechanism includes a work holding section that holds a work and a resin holding section that holds unnecessary resin.
  • the conveying mechanism can hold the outer peripheral edge of the work with the chuck claws provided in the work holding section, and can hold the unnecessary resin by sucking it with the suction pad provided in the resin holding section.
  • the transport mechanism can carry out the work and the unnecessary resin by retreating to the outside of the mold while holding the work and the unnecessary resin.
  • the thickness (height) of unnecessary resin generated during molding will also change according to the shape of the resin molded product.
  • the conveying mechanism disclosed in Patent Document 1 if the thickness of the unnecessary resin changes, the resin holding portion cannot properly hold the unnecessary resin. There is room for improvement in terms of low versatility of the transport mechanism.
  • An object of the present invention is to provide a transport mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product.
  • the conveying mechanism according to the present invention includes a molded product holding portion for holding a resin molded product and a resin holding portion for holding unnecessary resin. and an elevating support portion that supports the resin holding portion so that it can move up and down relative to the molded product holding portion.
  • a resin molding apparatus includes: a mold for obtaining the resin molded product by resin molding an object to be molded; the transport mechanism for transporting the resin molded product resin-molded by the mold; is provided.
  • a method for manufacturing a resin molded product according to the present invention uses the resin molding apparatus to manufacture a resin molded product.
  • the thickness (height) of the unnecessary resin can be changed, and versatility can be improved.
  • FIG. 2 is a front cross-sectional view showing a molding die and a lead frame
  • FIG. 4 is a front cross-sectional view showing a lower mold, a resin-sealed lead frame, and an unloader
  • FIG. 3 is a side partial cross-sectional view showing the unloader (especially the resin holding portion and the lift support portion)
  • FIG. 2 is a front cross-sectional view showing the unloader (especially the resin holding portion and the lift support portion);
  • FIG. 4 is a front cross-sectional view showing how the resin holding portion moves upward; Front sectional drawing which showed the unloader which concerns on 2nd embodiment. Front sectional drawing which showed the unloader which concerns on 3rd embodiment.
  • the resin molding apparatus 1 seals an electronic element such as a semiconductor chip with resin to manufacture a resin molded product.
  • the present embodiment exemplifies a resin molding apparatus 1 that performs resin molding using a transfer molding method.
  • the resin molding apparatus 1 comprises a supply module 100, a resin molding module 200, and an unloading module 300 as components. Each component is removable and replaceable with respect to other components.
  • the supply module 100 supplies the lead frame 10 , which is a type of substrate on which electronic elements are mounted, and the resin tablet T to the resin molding module 200 .
  • the lead frame 10 is exemplified in this embodiment, various other substrates (a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, etc.) can be used in addition to the lead frame 10. It is possible.
  • the supply module 100 mainly includes a frame delivery section 110 , a frame supply section 120 , a resin delivery section 130 , a resin supply section 140 , a loader 150 and a control section 160 .
  • the frame delivery section 110 delivers the lead frame 10 that is not resin-sealed and housed in an in-magazine unit (not shown) to the frame supply section 120 .
  • the frame supplying section 120 receives the lead frames 10 from the frame sending section 110 , properly aligns the received lead frames 10 , and delivers them to the loader 150 .
  • the resin delivery section 130 receives the resin tablet T from a stocker (not shown) and delivers the resin tablet T to the resin supply section 140 .
  • the resin supply unit 140 receives the resin tablets T from the resin delivery unit 130 , properly aligns the received resin tablets T, and delivers them to the loader 150 .
  • the loader 150 transports the lead frames 10 and resin tablets T received from the frame supply section 120 and the resin supply section 140 to the resin molding module 200 .
  • the control unit 160 controls the operation of each module of the resin molding apparatus 1.
  • the controller 160 controls the operations of the supply module 100 , the resin molding module 200 and the unloading module 300 . Also, the operation of each module can be arbitrarily changed (adjusted) using the control unit 160 .
  • control unit 160 is provided in the supply module 100
  • control unit 160 in another module.
  • controllers 160 may be provided for each module or each device to individually control the operations of each module or the like while interlocking them.
  • the resin molding module 200 seals the electronic elements attached to the lead frame 10 with resin.
  • two resin molding modules 200 are arranged side by side. By carrying out the resin sealing of the lead frame 10 in parallel with the two resin molding modules 200, the manufacturing efficiency of the resin molded product can be improved.
  • the resin molding module 200 mainly includes a mold 210 and a mold clamping mechanism (not shown).
  • the molding die 210 uses a molten resin material to resin-seal the electronic element mounted on the lead frame 10 .
  • the mold 210 includes a pair of upper and lower molds, ie, an upper mold 220 and a lower mold 230 (see FIG. 3, etc.).
  • the molding die 210 is provided with a heating portion (not shown) such as a heater.
  • the mold clamping mechanism (not shown) clamps or opens the mold 210 (upper mold 220 and lower mold 230) by moving the lower mold 230 up and down. For convenience, illustration of the mold clamping mechanism is omitted.
  • the unloading module 300 receives the resin-sealed lead frame 10 from the resin molding module 200 and unloads it.
  • the carry-out module 300 mainly includes an unloader 310 and a substrate accommodation section 320 .
  • the unloader 310 holds the resin-sealed lead frame 10 and unloads it to the substrate accommodating section 320 .
  • the unloader 310 is one embodiment of the transport mechanism according to the present invention.
  • the board accommodating portion 320 accommodates the resin-sealed lead frame 10 .
  • the method for manufacturing a resin molded product according to the present embodiment mainly includes a carry-in step S10, a resin molding step S20, and a carry-out step S30.
  • the loading step S10 is a step of loading the lead frame 10 and the resin tablet T into the resin molding module 200.
  • the frame delivery section 110 delivers the lead frames 10 accommodated in the in-magazine unit (not shown) to the frame supply section 120.
  • the frame supply unit 120 properly aligns the received lead frames 10 and delivers them to the loader 150 .
  • the resin delivery unit 130 delivers the resin tablet T received from the stocker (not shown) to the resin supply unit 140 .
  • the resin supply unit 140 transfers the required number of received resin tablets T to the loader 150 .
  • the loader 150 conveys the received lead frame 10 and resin tablet T to the molding die 210 of the resin molding module 200 . After the lead frame 10 and the resin tablet T are conveyed to the molding die 210, the process proceeds from the carrying-in step S10 to the resin molding step S20.
  • the resin molding step S20 is a step of resin-sealing the electronic element mounted on the lead frame 10 .
  • a mold clamping mechanism (not shown) clamps the mold 210. Then, the resin tablet T is heated and melted by a heating portion (not shown) of the molding die 210, and the lead frame 10 is resin-sealed using the generated fluid resin. After the lead frame 10 is resin-sealed, the process proceeds from the resin molding step S20 to the unloading step S30.
  • the carry-out step S30 is a step of receiving the resin-sealed lead frame 10 (resin molded product) from the resin-molded module 200 and carrying it out.
  • the mold clamping mechanism (not shown) opens the mold 210. Then, the resin-sealed lead frame 10 is released from the mold. After that, the unloader 310 unloads the lead frame 10 from the molding die 210 and accommodates it in the substrate accommodating section 320 of the unloading module 300 . At this time, unnecessary portions of the resin-molded lead frame 10 (unnecessary resin such as culls 10b and runners 10c, which will be described later) are appropriately removed. Thus, the resin-sealed lead frame 10 (resin molded product) is manufactured.
  • 3 shows the upper mold 220, the lower mold 230, and the lead frame 10 before resin sealing.
  • FIG. 4 also shows the lower mold 230 , the resin-sealed lead frame 10 , and the unloader 310 .
  • the present embodiment exemplifies (illustrates) the outline of each member described below, and does not limit the specific shape, arrangement, number, etc. of each member.
  • An electronic element is connected to the lead frame 10 before being resin-sealed, but FIG. 3 is omitted.
  • the upper mold 220 shown in FIG. 3 mainly includes an upper mold main body 221.
  • the upper mold main body 221 is a member that forms the main part of the upper mold 220 .
  • the upper mold main body 221 is formed to have an appropriate vertical thickness.
  • the upper mold main body 221 is fixed to an appropriate supporting member (not shown).
  • a cavity 221 a , a cull portion 221 b and a runner portion 221 c are formed on the lower surface of the upper mold body 221 .
  • the cavity 221a is a concave portion to which a resin material is supplied and resin-molded.
  • the cavity 221a is formed at a position facing the lead frame 10 placed on a lower mold 230 (a position where the electronic element can be resin-sealed).
  • the cavity 221a is formed in an appropriate shape according to the product (resin molded product).
  • the cull portion 221b is a recess formed at a position facing the pot block 232 of the lower die 230, which will be described later.
  • a cull portion 221b is formed in the left-right center of the upper die main body 221, and cavities 221a are formed on both left and right sides of the cull portion 221b.
  • the runner portion 221c is a recess that connects the cull portion 221b and the cavity 221a.
  • the depth of the runner portion 221c is formed to be shallower than that of the cull portion 221b.
  • the lower mold 230 mainly comprises a lower mold main body 231, a pot block 232 and an ejector pin 233.
  • the lower mold main body 231 is a member that forms the main part of the lower mold 230 .
  • the lower die main body 231 is formed to have an appropriate vertical thickness.
  • the lead frame 10 loaded in the loading step S10 is placed on the upper surface of the lower mold body 231 .
  • the pot block 232 is a member forming a pot 232a in which the resin tablet T supplied from the supply module 100 is accommodated. Pot block 232 is formed to have an appropriate height. A pot 232a is formed in the pot block 232 so as to open on the upper surface thereof. A plurality of pots 232a are formed at appropriate intervals (not shown). The resin tablet T housed in the pot 232a is injected from the upper end of the pot 232a by a plunger (not shown) in the resin molding step S20, and resin molding is performed.
  • the ejector pin 233 shown in FIG. 4 is a member for separating the lead frame 10 and the lower mold 230 after molding.
  • the ejector pin 233 is formed in a substantially cylindrical shape.
  • the ejector pin 233 is arranged with its axial direction directed in the up-down direction (vertical direction).
  • the ejector pin 233 is arranged while being inserted into a through hole (not shown) formed in the lower die main body 231 .
  • the ejector pin 233 is configured to be vertically movable relative to the lower die main body 231 . Specifically, the ejector pin 233 protrudes from the upper surface of the lower mold main body 231 as the lower mold main body 231 descends.
  • the unloader 310 shown in FIG. 4 mainly includes an unloader main body 311, a clamper 312, a molded product holding portion 315, a resin holding portion 313, and an elevation support portion 314 (see FIGS. 5 and 6).
  • the unloader main body 311 is a member that forms the main part of the unloader 310 .
  • the unloader main body 311 is formed to have an appropriate vertical thickness.
  • the unloader main body 311 can be moved horizontally and vertically (vertically) by an appropriate moving mechanism.
  • the clamper 312 holds the lead frame 10 .
  • the clamper 312 is provided on the unloader main body 311 .
  • the clamper 312 is formed in a substantially L shape when viewed from the front. More specifically, the clamper 312 is formed such that its lower end extends inward (toward the center of the unloader main body 311). An upper end portion of the clamper 312 is rotatably connected to the unloader main body 311 .
  • the clamper 312 is rotated by the drive force of a drive source (for example, motor, cylinder, etc.) (not shown).
  • a drive source for example, motor, cylinder, etc.
  • the resin holding portion 313 shown in FIGS. 4 to 6 is a portion that holds unnecessary resin (unnecessary resin) for the resin molded product among the resin materials used for resin molding. More specifically, the resin holding portion 313 is a portion that holds a cull 10b, which will be described later. In FIG. 4, detailed illustration of the structure of the resin holding portion 313 and an elevation support portion 314, which will be described later, is omitted. As shown in FIGS. 5 and 6, the resin holding portion 313 mainly includes a resin adsorption pipe portion 313a, a resin adsorption pad 313b, and a resin adsorption pipe block 313c.
  • the resin adsorption tube portion 313a is a hollow cylindrical member.
  • the resin adsorption tube portion 313a is arranged with its axial direction directed vertically.
  • the resin adsorption tube portion 313a is inserted into a through-hole 311a that penetrates the unloader main body 311 vertically.
  • a lower end portion of the resin adsorption tube portion 313 a is arranged to protrude downward from the lower surface of the unloader main body 311 .
  • the resin adsorption tube portion 313a is an embodiment of the pad mounting portion according to the present invention.
  • the resin suction pad 313b is a portion that comes into contact with unnecessary resin.
  • the resin adsorption pad 313b is attached to the resin adsorption tube portion 313a by being fixed to the lower end portion of the resin adsorption tube portion 313a.
  • the resin adsorption pad 313b is made of an elastic material such as rubber.
  • the resin adsorption pad 313b can adhere to the unnecessary resin by slightly bending when it comes into contact with the unnecessary resin.
  • the resin suction pad 313b is an embodiment of the suction pad according to the present invention.
  • a plurality of resin adsorption tube portions 313a and resin adsorption pads 313b are provided at positions where they can adsorb culls 10b, which will be described later.
  • FIG. 5 an example is shown in which a plurality of resin adsorption tube portions 313a and resin adsorption pads 313b are arranged in a row in the front-rear direction.
  • the number of resin adsorption tube portions 313a and resin adsorption pads 313b may be provided according to the number of culls 10b.
  • the resin adsorption pipe block 313c is a portion that supports the resin adsorption pipe portion 313a.
  • the resin adsorption pipe block 313c is formed in a substantially rectangular parallelepiped shape extending back and forth.
  • An air flow path 313d for adsorbing unnecessary resin is formed in the resin adsorption pipe block 313c.
  • 313 d of flow paths are connected to suction devices (not shown), such as a vacuum pump.
  • the resin adsorption pipe block 313c is arranged above the unloader main body 311. As shown in FIG.
  • the upper end of each resin adsorption pipe portion 313a is fixed to the resin adsorption pipe block 313c.
  • the hollow portion of each resin adsorption pipe portion 313a is connected to the flow path 313d of the resin adsorption pipe block 313c.
  • the lift support part 314 is a part that supports the resin holding part 313 so that it can be lifted up and down.
  • the lifting support part 314 mainly includes a bush 314a, a return plate 314b, a guide shaft 314c and a return spring 314d.
  • the bush 314a is a portion that guides the resin adsorption tube portion 313a up and down.
  • the bush 314a is cylindrically formed.
  • the bushing 314a is fixed to the through hole 311a of the unloader body 311 with its axis directed vertically.
  • the resin adsorption tube portion 313a is inserted into the bush 314a.
  • the outer peripheral surface of the resin adsorption tube portion 313a is in contact with the inner peripheral surface of the bushing 314a so as to be slidable up and down.
  • the bush 314a can prevent the resin adsorption tube portion 313a from moving in the horizontal direction, and can guide the resin adsorption tube portion 313a to move up and down.
  • the return plate 314 b is a portion fixed to the resin holding portion 313 .
  • the return plate 314b is arranged above the unloader main body 311 .
  • the return plate 314b is formed by appropriately bending a plate-like member. Specifically, the return plate 314b is formed such that the left and right central portions of a horizontally arranged plate-like member protrude upward. The left and right central portions of the return plate 314b are fixed to the upper surface of the resin adsorption pipe block 313c. In this manner, the return plate 314b is arranged to straddle the resin adsorption piping block 313c from side to side.
  • the return plates 314b are provided at the front and rear end portions of the resin adsorption piping block 313c, respectively.
  • the return plate 314 b can move up and down integrally with the resin holding portion 313 .
  • the return plate 314b is an embodiment of the lifting section according to the present invention.
  • the guide shaft 314c is a part that guides the return plate 314b so that it moves up and down and defines the range of movement of the return plate 314b.
  • the guide shaft 314c is arranged so as to pass vertically through the left and right ends of the return plate 314b.
  • a lower end portion of the guide shaft 314 c is fixed to the upper surface of the unloader main body 311 .
  • the guide shaft 314c can prevent the return plate 314b from moving in the horizontal direction and can guide the return plate 314b to move up and down.
  • the upper end of the guide shaft 314c is formed with a head having a larger diameter than the other portions. The guide shaft 314c can restrict upward movement of the return plate 314b by this head.
  • the guide shaft 314c is an embodiment of the movable range regulating section according to the present invention.
  • the return spring 314d applies downward force to the return plate 314b.
  • the return spring 314d is formed by a compression coil spring.
  • a return spring 314d is inserted into the guide shaft 314c and positioned between the return plate 314b and the head of the guide shaft 314c. As a result, the return spring 314d can always exert force downward on the return plate 314b.
  • the return spring 314d is an embodiment of the application section according to the present invention.
  • the molded product holding portion 315 shown in FIG. 4 is a portion that holds the resin that will become the resin molded product, out of the resin material used for resin molding. More specifically, the molded product holding portion 315 is a portion that holds a sealing portion 10a, which will be described later.
  • the molded article holding section 315 mainly includes a molded article suction tube section 315a and a molded article suction pad 315b.
  • the molded article adsorption tube portion 315a is a member formed in a hollow cylindrical shape.
  • the molded article suction tube portion 315a is arranged to extend downward from the lower surface of the unloader main body 311 .
  • the upper end of the molded product suction tube portion 315 a is fixed to the unloader main body 311 .
  • the molded article suction pipe portion 315a is connected to a suction device such as a vacuum pump (not shown) through an air flow path formed in the unloader main body 311 .
  • the molded article suction pad 315b is the part that comes into contact with the resin.
  • the molded article suction pad 315b is fixed to the lower end of the molded article suction tube portion 315a.
  • the molded product suction pad 315b is made of an elastic material such as rubber.
  • the resin holding portion 313 is supported so as to be vertically movable relative to the unloader main body 311 and the molded product holding portion 315 .
  • the sealing portion 10a molded in the cavity 221a is a portion that seals the electronic element attached to the lead frame 10 with resin.
  • the sealing portion 10a and the lead frame 10 are parts to be a product (resin molded product).
  • the cull 10b and the runner 10c are parts that are molded for the convenience of manufacturing, and are unnecessary parts (unnecessary resin) as a product.
  • the resin molding step S20 not only the sealing portion 10a necessary for the product but also the unnecessary resin (the cull 10b and the runner 10c) are molded.
  • the carry-out step S30 it is necessary to carry out not only the resin molded products (sealing portion 10a and lead frame 10) required as products, but also unnecessary resin from the mold 210.
  • FIGS. 7 and 8 how the resin-sealed lead frame 10 is unloaded from the molding die 210 in the unloading step S30 will be specifically described.
  • the reference numerals of each member are omitted as appropriate.
  • the lower mold main body 231 is lowered by a predetermined amount. Accordingly, the ejector pin 233 moves upward relative to the lower mold main body 231 , and the upper end of the ejector pin 233 protrudes above the upper surface of the lower mold main body 231 .
  • the lead frame 10 placed on the upper surface of the lower mold main body 231 is pushed up from below, and the lead frame 10 is lifted from the lower mold main body 231 (mold releasing). can be made). As a result, a gap is formed between the lead frame 10 and the upper surface of the lower die main body 231 .
  • the unloader 310 is moved above the lower die 230 and lowered to a predetermined position. Specifically, as shown in FIG. 7C, the unloader 310 is lowered to a position where the resin holding portion 313 and the molded product holding portion 315 are in contact with the cull 10b and the sealing portion 10a, respectively.
  • the resin holding portion 313 is configured to be able to properly suck the cull 10b by moving up and down with respect to the unloader main body 311 and the molded product holding portion 315 .
  • the operation of the resin holding portion 313 will be described in detail below.
  • the resin holding part 313 is not fixed to the unloader main body 311, but is supported so that it can move up and down. With such a configuration, even when the thickness (height) of the cull 10b is changed, the resin holding portion 313 can move up and down according to the height of the cull 10b. Can be properly adsorbed.
  • the cull 10b can be adsorbed by vacuuming through the resin adsorption pipe block 313c using a suction device (not shown) such as a vacuum pump.
  • the cull 10b can be properly adsorbed without changing the structure of the unloader 310.
  • the resin holding portion 313 can also move upward in accordance with the rise of the cull 10b. can be adsorbed to
  • the unloader 310 of the present embodiment can move the resin holding portion 313 up and down to change the thickness (height) of the cull 10b and move (raise) the cull 10b. can be used, and versatility can be enhanced.
  • the lower end of the clamper 312 is turned inward. Thereby, the lower end of the clamper 312 is inserted into the gap between the lead frame 10 and the upper surface of the lower mold body 231 . In this way, the unloader 310 can hold the lead frame 10 by sucking the resin-sealed lead frame 10 with the resin holding portion 313 and the molded product holding portion 315 and supporting it from below with the clamper 312 . .
  • the resin-sealed lead frame 10 (the lead frame 10, the sealing portion 10a, the cull 10b, and the runner 10c) can be lifted. .
  • the unloader 310 is moved to unload the resin-encapsulated lead frame 10 from the mold 210 .
  • the unloader 310 is moved to the carry-out module 300, the unnecessary resin (the cull 10b and the runner 10c) is removed as appropriate, and the lead frame 10 is accommodated in the substrate accommodation portion 320 (see FIG. 1).
  • carrying-out process S30 is completed.
  • the resin holding portion 313 is moved by its own weight to the lowest position (the position where the resin adsorption pipe block 313c or the return plate 314b touches the upper surface of the unloader main body 311, FIG. 6). reference).
  • the return spring 314d applies a downward force to the return plate 314b, the force applied by the return spring 314d can assist the resin holding portion 313 in descending.
  • the unloader 310 (conveyance mechanism) according to the present embodiment is a molded product holding portion 315 for holding a resin molded product; a resin holding portion 313 holding unnecessary resin; a lifting support portion 314 that supports the resin holding portion 313 so that it can move up and down relative to the molded article holding portion 315; is provided.
  • the resin holding portion 313 can be moved up and down according to the thickness (height) of the cull 10b (unnecessary resin). can be held. This eliminates the need to change the structure of the unloader 310 even if the thickness of the cull 10b is changed, and the versatility of the unloader 310 can be improved.
  • the resin holding portion 313 is a resin suction pad 313b (suction pad) in contact with the unnecessary resin; a resin adsorption tube portion 313a (pad attachment portion) to which the resin adsorption pad 313b is attached; and
  • the lifting support portion 314 supports the resin adsorption tube portion 313a so that it can be moved up and down.
  • the lifting support part 314 is a return plate 314b (elevating portion) that can move up and down integrally with the resin adsorption tube portion 313a; a guide shaft 314c (movable range defining portion) that defines the lifting range of the return plate 314b; is provided.
  • the lifting range of the resin holding portion 313 can be defined. As a result, it is possible to prevent problems such as excessive movement of the resin holding portion 313 and contact with other members.
  • the lifting support portion 314 further includes a return spring 314d (applying portion) that applies a downward force to the resin holding portion 313 .
  • the return spring 314d can assist the downward return of the resin holding portion 313 by its own weight.
  • the resin molding apparatus 1 a molding die 210 for obtaining the resin-molded product by resin-molding the lead frame 10 (molding object);
  • An unloader 310 (conveyor mechanism) that conveys the resin molded product resin-molded by the mold 210; is provided.
  • the versatility of the unloader 310 can be improved, and the versatility of the resin molding apparatus 1 can be improved.
  • the method for manufacturing a resin molded product according to this embodiment uses the resin molding apparatus 1 to manufacture a resin molded product.
  • the versatility of the unloader 310 can be improved, and the versatility of the resin molding apparatus 1 can be improved.
  • the unloader 310 according to the second embodiment shown in FIG. 9 differs from the unloader 310 according to the first embodiment (see FIG. 6, etc.) in that the force applied by the return spring 314d can be adjusted. A specific description will be given below.
  • the unloader 310 according to the second embodiment includes an adjustment portion 314e (a guide bolt 314f and an adjustment nut) capable of adjusting the force applied by a return spring 314d instead of the guide shaft 314c of the unloader 310 according to the first embodiment. 314g).
  • the guide bolt 314f is a portion that guides the return plate 314b so that it moves up and down and defines the range of movement of the return plate 314b.
  • the guide bolts 314f are arranged so as to pass vertically through the left and right ends of the return plate 314b.
  • a lower portion of the guide bolt 314f is fastened to an adjusting nut 314g, which will be described later.
  • the lower end of the guide bolt 314f (the portion protruding downward from the adjusting nut 314g) is inserted into a through hole formed in the unloader main body 311 (not shown).
  • the adjusting nut 314g is for adjusting the force applied by the return spring 314d by changing the length of the guide bolt 314f (the length of the portion protruding from the upper surface of the unloader main body 311).
  • the adjusting nut 314g is fixed to the top surface of the unloader main body 311. As shown in FIG.
  • the adjusting nuts 314g are provided at positions corresponding to the guide bolts 314f.
  • the length of the guide bolt 314f can be adjusted by tightening or loosening the guide bolt 314f with respect to the adjustment nut 314g in the adjusting portion 314e configured in this way.
  • the length of the return spring 314d arranged between the return plate 314b and the head of the guide bolt 314f can be adjusted.
  • the force applied by the return spring 314d can be adjusted according to the shape of the cull 10b and the like by the guide bolt 314f and the adjustment nut 314g.
  • the lifting support part 314 further includes the adjusting part 314e capable of adjusting the force applied by the return spring 314d (applying part).
  • the force applied by the return spring 314d can be adjusted according to the shape of the cull 10b.
  • the unnecessary resin the cull 10b and the runner 10c
  • weakening the force applied by the return spring 314d can prevent the cull 10b from falling off during transportation.
  • the unloader 310 according to the third embodiment shown in FIG. 310 (see FIG. 6, etc.). A specific description will be given below.
  • the pressing portion 316 mainly includes a pressing block 316a, a guide shaft 316b and a pressing spring 316c.
  • the pressing block 316a is a portion that contacts unnecessary resin.
  • the pressing block 316a is formed in a substantially rectangular parallelepiped shape.
  • the pressing blocks 316a are provided on both left and right sides of the resin holding portion 313, respectively.
  • the pressing block 316a is arranged so as to be positioned above the unnecessary resin (runner 10c in this embodiment).
  • the pressing block 316a is attached to the lower surface of the unloader main body 311 via a guide shaft 316b, which will be described later.
  • the guide shaft 316b is a part that supports the pressing block 316a so that it can move up and down.
  • the lower end of the guide shaft 316b is fixed to the pressing block 316a.
  • the upper portion of the guide shaft 316b is inserted into the lower surface of the unloader main body 311.
  • the guide shaft 316b is provided so as to be vertically movable with respect to the unloader main body 311.
  • the guide shaft 316b is provided by an appropriate method so as not to drop off from the unloader main body 311. As shown in FIG.
  • the configuration of the guide shaft 316b is not limited to this, as long as it can support the pressing block 316a so that it can move up and down.
  • the guide shaft 316b can be an extendable shaft-shaped member.
  • the pressing spring 316c applies downward force to the pressing block 316a.
  • the pressing spring 316c is formed by a compression coil spring.
  • the pressing spring 316c is inserted into the guide shaft 316b and arranged between the unloader main body 311 and the pressing block 316a. As a result, the pressing spring 316c can always apply downward force to the pressing block 316a.
  • the pressing portion 316 configured in this manner can press the unnecessary resin held by the resin holding portion 313 downward. Specifically, as shown in FIG. 10, in a state where the cull 10b is sucked by the resin holding portion 313, the pressing block 316a comes into contact with the runner 10c from above. The pressing block 316a presses the runner 10c downward by its own weight and the force applied by the pressing spring 316c.
  • the force with which the pressing portion 316 presses the runner 10 c downward is set to be smaller than the holding force (adsorption force) of the resin holding portion 313 . That is, when the resin holding portion 313 is sucking the cull 10b, the cull 10b and the runner 10c will not come off from the resin holding portion 313 due to the pressing force of the pressing portion 316. FIG. Therefore, unnecessary resin does not fall off unintentionally from the unloader 310 while the unloader 310 is unloading the lead frame 10 from the molding die 210 .
  • the unnecessary resin By pressing the unnecessary resin with the pressing portion 316 in this way, even if the unnecessary resin sticks to the resin adsorption pad 313b due to the influence of heat, material, etc., the unnecessary resin can be easily removed. can.
  • the unnecessary resin the cull 10b and the runner 10c
  • the resin molded product the sealing portion 10a and the lead frame 10
  • the weight of the unnecessary resin is relatively light. Even if the adsorption of the resin adsorption pad 313 is stopped, it is assumed that the unnecessary resin sticks to the resin adsorption pad 313b and does not come off.
  • the pressing portion 316 by providing the pressing portion 316 as in the present embodiment, even relatively light unnecessary resin can be easily dropped from the resin holding portion 313 .
  • the unloader 310 further includes the pressing portion 316 that presses the unnecessary resin held by the resin holding portion 313 downward.
  • the unnecessary resin can be easily removed from the resin holding portion 313 when the holding (adsorption) of the unnecessary resin by the resin holding portion 313 is finished.
  • the resin molding apparatus 1 using the transfer molding method (transfer type resin molding apparatus 1) was illustrated, but the present invention is not limited to this, and other methods (for example, compression method) etc.) can also be adopted.
  • the components (supply module 100, etc.) used in the resin molding apparatus 1 of the above embodiment are examples, and can be detached or replaced as appropriate.
  • the configuration and operation of the components (supply module 100, etc.) used in the resin molding apparatus 1 of the present embodiment are examples, and can be changed as appropriate.
  • a tablet-shaped resin material (resin tablet T) was shown, but the present invention is not limited to this. That is, as the resin material, it is possible to use not only a tablet-like material, but also an arbitrary form such as granular, powdery, and liquid.
  • the unloader 310 for unloading the resin molded product from the molding die 210 is shown as an example of the transport mechanism, but the present invention is not limited to this, and can be applied to various transport mechanisms. It is possible.
  • the molded article holding portion 315 is configured to adsorb and hold a resin molded article, but the present invention is not limited to this.
  • the arrangement of the clamper 312 can be appropriately changed so that the resin molded product can be properly held.
  • the present invention is not limited to this.
  • the return plate 314b with a member integrated with the resin holding portion 313 .
  • the lifting range of the resin holding portion 313 can be defined by a guide shaft 314c (see FIG. 6) or a guide bolt 314f (see FIG. 9).
  • the present invention is not limited to this.
  • a configuration is possible in which the plurality of resin suction pads 313b are individually raised and lowered one by one.
  • the adjusting portion 314e for adjusting the force applied by the return spring 314d was illustrated, but the configuration of the adjusting portion 314e is not limited to this. Any configuration can be used as long as the applied force can be adjusted.
  • the pressing portion 316 that presses the unnecessary resin downward was exemplified, but the configuration of the pressing portion 316 is not limited to this, and the unnecessary resin can be pressed.
  • the configuration can be changed arbitrarily.
  • the molded article holding portion 315 that holds the resin molded article is fixed to the unloader main body 311, but the present invention is not limited to this.
  • the molded article holding portion 315 can also be configured to be vertically movable in the same manner as the resin holding portion 313 . This can further improve the versatility of the unloader 310 .
  • resin molding device 210 mold 310 unloader 313 resin holding part 313a resin adsorption tube part 313b resin adsorption pad 314 elevation support part 314b return plate 314c guide shaft 314d return spring 314e adjustment part 315 molded product holding part 317 pressing part

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Abstract

Provided is a transport mechanism with which it is possible to respond to changes in the thickness (height) of unnecessary resin and improve versatility. The mechanism is provided with a molded-article-holding part for holding a resin molded article, a resin-holding part for holding unnecessary resin, and a raising and lowering support part for supporting the resin-holding part so that the resin-holding part can be raised or lowered up or down relative to the molded-article-holding part.

Description

搬送機構、樹脂成形装置及び樹脂成形品の製造方法CONVEYOR MECHANISM, RESIN MOLDING APPARATUS, AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCTS
　本発明は、搬送機構、樹脂成形装置及び樹脂成形品の製造方法の技術に関する。 The present invention relates to technology of a conveying mechanism, a resin molding apparatus, and a method of manufacturing a resin molded product.
　特許文献１には、樹脂成形後のワーク及び不要樹脂（カル）を金型から搬出する搬送機構に関する技術が開示されている。この搬送機構は、ワークを保持するワーク保持部と、不要樹脂を保持する樹脂保持部と、を具備している。この搬送機構は、ワーク保持部に設けられたチャック爪でワークの外周端部を保持すると共に、樹脂保持部に設けられた吸着パッドで不要樹脂を吸着して保持することができる。搬送機構は、ワーク及び不要樹脂を保持したまま金型外へと退避することで、ワーク及び不要樹脂を搬出することができる。 Patent Literature 1 discloses a technology related to a transport mechanism that transports the workpiece after resin molding and unnecessary resin (cull) from the mold. This transport mechanism includes a work holding section that holds a work and a resin holding section that holds unnecessary resin. The conveying mechanism can hold the outer peripheral edge of the work with the chuck claws provided in the work holding section, and can hold the unnecessary resin by sucking it with the suction pad provided in the resin holding section. The transport mechanism can carry out the work and the unnecessary resin by retreating to the outside of the mold while holding the work and the unnecessary resin.
特開２０２０－２６０８８号公報Japanese Patent Application Laid-Open No. 2020-26088
　ここで一般的には、樹脂成形品の形状等に応じて、成形時に発生する不要樹脂の厚さ（高さ）も変わることになる。特許文献１に開示されたような搬送機構では、不要樹脂の厚さが変わると樹脂保持部で適切に不要樹脂を保持することができなくなるため、樹脂保持部、若しくは搬送機構自体を交換して対応する必要があり、搬送機構の汎用性が低い点で改善の余地があった。 Here, in general, the thickness (height) of unnecessary resin generated during molding will also change according to the shape of the resin molded product. In the conveying mechanism disclosed in Patent Document 1, if the thickness of the unnecessary resin changes, the resin holding portion cannot properly hold the unnecessary resin. There is room for improvement in terms of low versatility of the transport mechanism.
　本発明は以上の如き状況に鑑みてなされたものであり、その解決しようとする課題は、不要樹脂の厚さ（高さ）の変更に対応することができ、汎用性を向上させることが可能な搬送機構、樹脂成形装置及び樹脂成形品の製造方法を提供することである。 The present invention has been made in view of the above circumstances, and the problem to be solved is to be able to cope with changes in the thickness (height) of the unnecessary resin and to improve versatility. An object of the present invention is to provide a transport mechanism, a resin molding apparatus, and a method for manufacturing a resin molded product.
　本発明の解決しようとする課題は以上の如くであり、この課題を解決するため、本発明に係る搬送機構は、樹脂成形品を保持する成形品保持部と、不要樹脂を保持する樹脂保持部と、前記成形品保持部に対して相対的に上下に昇降可能となるように前記樹脂保持部を支持する昇降支持部と、を具備するものである。 The problem to be solved by the present invention is as described above. In order to solve this problem, the conveying mechanism according to the present invention includes a molded product holding portion for holding a resin molded product and a resin holding portion for holding unnecessary resin. and an elevating support portion that supports the resin holding portion so that it can move up and down relative to the molded product holding portion.
　また、本発明に係る樹脂成形装置は、成形対象物を樹脂成形することにより前記樹脂成形品を得る成形型と、前記成形型によって樹脂成形された前記樹脂成形品を搬送する前記搬送機構と、を具備するものである。 Further, a resin molding apparatus according to the present invention includes: a mold for obtaining the resin molded product by resin molding an object to be molded; the transport mechanism for transporting the resin molded product resin-molded by the mold; is provided.
　また、本発明に係る樹脂成形品の製造方法は、前記樹脂成形装置を用いて樹脂成形品を製造するものである。 Further, a method for manufacturing a resin molded product according to the present invention uses the resin molding apparatus to manufacture a resin molded product.
　本発明によれば、不要樹脂の厚さ（高さ）の変更に対応することができ、汎用性を向上させることができる。 According to the present invention, the thickness (height) of the unnecessary resin can be changed, and versatility can be improved.
第一実施形態に係る樹脂成形装置の全体的な構成を示した平面模式図。BRIEF DESCRIPTION OF THE DRAWINGS The plane schematic diagram which showed the whole structure of the resin molding apparatus which concerns on 1st embodiment. 第一実施形態に係る樹脂成形品の製造方法を示したフローチャート。The flowchart which showed the manufacturing method of the resin molding which concerns on 1st embodiment. 成形型及びリードフレームを示した正面断面図。FIG. 2 is a front cross-sectional view showing a molding die and a lead frame; 下型、樹脂封止されたリードフレーム及びアンローダを示した正面断面図。FIG. 4 is a front cross-sectional view showing a lower mold, a resin-sealed lead frame, and an unloader; アンローダ（特に樹脂保持部及び昇降支持部）を示した側面一部断面図。FIG. 3 is a side partial cross-sectional view showing the unloader (especially the resin holding portion and the lift support portion); アンローダ（特に樹脂保持部及び昇降支持部）を示した正面断面図。FIG. 2 is a front cross-sectional view showing the unloader (especially the resin holding portion and the lift support portion); 搬出工程の様子を示した図。The figure which showed the mode of the carrying-out process. 樹脂保持部が上方に移動する様子を示した正面断面図。FIG. 4 is a front cross-sectional view showing how the resin holding portion moves upward; 第二実施形態に係るアンローダを示した正面断面図。Front sectional drawing which showed the unloader which concerns on 2nd embodiment. 第三実施形態に係るアンローダを示した正面断面図。Front sectional drawing which showed the unloader which concerns on 3rd embodiment.
　以下では、図中に示した矢印Ｕ、矢印Ｄ、矢印Ｌ、矢印Ｒ、矢印Ｆ及び矢印Ｂで示した方向を、それぞれ上方向、下方向、左方向、右方向、前方向及び後方向と定義して説明を行う。 Hereinafter, the directions indicated by arrow U, arrow D, arrow L, arrow R, arrow F, and arrow B shown in the drawings are referred to as upward, downward, leftward, rightward, forward, and backward directions, respectively. Define and explain.
　まず、図１を用いて、第一実施形態に係る樹脂成形装置１の構成について説明する。樹脂成形装置１は、半導体チップなどの電子素子を樹脂封止し、樹脂成形品を製造するものである。特に本実施形態では、トランスファーモールド法を利用して樹脂成形を行う樹脂成形装置１を例示している。 First, using FIG. 1, the configuration of the resin molding apparatus 1 according to the first embodiment will be described. The resin molding apparatus 1 seals an electronic element such as a semiconductor chip with resin to manufacture a resin molded product. In particular, the present embodiment exemplifies a resin molding apparatus 1 that performs resin molding using a transfer molding method.
　樹脂成形装置１は、構成要素として、供給モジュール１００、樹脂成形モジュール２００及び搬出モジュール３００を具備する。各構成要素は、他の構成要素に対して着脱可能かつ交換可能である。 The resin molding apparatus 1 comprises a supply module 100, a resin molding module 200, and an unloading module 300 as components. Each component is removable and replaceable with respect to other components.
　供給モジュール１００は、電子素子を装着した基板の一種であるリードフレーム１０、及び樹脂タブレットＴを樹脂成形モジュール２００へと供給するものである。なお、本実施形態ではリードフレーム１０を例示しているが、リードフレーム１０以外にも、その他種々の基板（ガラスエポキシ製基板、セラミック製基板、樹脂製基板、金属製基板等）を用いることが可能である。供給モジュール１００は、主としてフレーム送出部１１０、フレーム供給部１２０、樹脂送出部１３０、樹脂供給部１４０、ローダ１５０及び制御部１６０を具備する。 The supply module 100 supplies the lead frame 10 , which is a type of substrate on which electronic elements are mounted, and the resin tablet T to the resin molding module 200 . Although the lead frame 10 is exemplified in this embodiment, various other substrates (a glass epoxy substrate, a ceramic substrate, a resin substrate, a metal substrate, etc.) can be used in addition to the lead frame 10. It is possible. The supply module 100 mainly includes a frame delivery section 110 , a frame supply section 120 , a resin delivery section 130 , a resin supply section 140 , a loader 150 and a control section 160 .
　フレーム送出部１１０は、インマガジンユニット（不図示）に収容された樹脂封止されていないリードフレーム１０を、フレーム供給部１２０に送り出すものである。フレーム供給部１２０は、フレーム送出部１１０からリードフレーム１０を受け取り、受け取ったリードフレーム１０を適宜整列させてローダ１５０に受け渡すものである。 The frame delivery section 110 delivers the lead frame 10 that is not resin-sealed and housed in an in-magazine unit (not shown) to the frame supply section 120 . The frame supplying section 120 receives the lead frames 10 from the frame sending section 110 , properly aligns the received lead frames 10 , and delivers them to the loader 150 .
　樹脂送出部１３０は、ストッカ（不図示）から樹脂タブレットＴを受け取り、樹脂供給部１４０に樹脂タブレットＴを送り出すものである。樹脂供給部１４０は、樹脂送出部１３０から樹脂タブレットＴを受け取り、受け取った樹脂タブレットＴを適宜整列させてローダ１５０に受け渡すものである。 The resin delivery section 130 receives the resin tablet T from a stocker (not shown) and delivers the resin tablet T to the resin supply section 140 . The resin supply unit 140 receives the resin tablets T from the resin delivery unit 130 , properly aligns the received resin tablets T, and delivers them to the loader 150 .
　ローダ１５０は、フレーム供給部１２０及び樹脂供給部１４０から受け取ったリードフレーム１０及び樹脂タブレットＴを、樹脂成形モジュール２００に搬送するものである。 The loader 150 transports the lead frames 10 and resin tablets T received from the frame supply section 120 and the resin supply section 140 to the resin molding module 200 .
　制御部１６０は、樹脂成形装置１の各モジュールの動作を制御するものである。制御部１６０によって、供給モジュール１００、樹脂成形モジュール２００及び搬出モジュール３００の動作が制御される。また、制御部１６０を用いて、各モジュールの動作を任意に変更（調整）することができる。 The control unit 160 controls the operation of each module of the resin molding apparatus 1. The controller 160 controls the operations of the supply module 100 , the resin molding module 200 and the unloading module 300 . Also, the operation of each module can be arbitrarily changed (adjusted) using the control unit 160 .
　なお本実施形態においては、制御部１６０を供給モジュール１００に設けた例を示しているが、制御部１６０をその他のモジュールに設けることも可能である。また、制御部１６０を複数設けることも可能である。例えば、制御部１６０をモジュールごとや装置ごとに設け、各モジュール等の動作を互いに連動させながら個別に制御することも可能である。 Although this embodiment shows an example in which the control unit 160 is provided in the supply module 100, it is also possible to provide the control unit 160 in another module. It is also possible to provide a plurality of controllers 160 . For example, the control unit 160 may be provided for each module or each device to individually control the operations of each module or the like while interlocking them.
　樹脂成形モジュール２００は、リードフレーム１０に装着された電子素子を樹脂封止するものである。本実施形態においては、樹脂成形モジュール２００は２つ並べて配置される。２つの樹脂成形モジュール２００によってリードフレーム１０の樹脂封止を並行して行うことで、樹脂成形品の製造効率を向上させることができる。樹脂成形モジュール２００は、主として成形型２１０及び型締め機構（不図示）を具備する。 The resin molding module 200 seals the electronic elements attached to the lead frame 10 with resin. In this embodiment, two resin molding modules 200 are arranged side by side. By carrying out the resin sealing of the lead frame 10 in parallel with the two resin molding modules 200, the manufacturing efficiency of the resin molded product can be improved. The resin molding module 200 mainly includes a mold 210 and a mold clamping mechanism (not shown).
　成形型２１０は、溶融した樹脂材料を用いて、リードフレーム１０に装着された電子素子を樹脂封止するものである。成形型２１０は、上下一対の型、すなわち、上型２２０及び下型２３０（図３等参照）を具備する。成形型２１０には、ヒータ等の加熱部（不図示）が設けられる。 The molding die 210 uses a molten resin material to resin-seal the electronic element mounted on the lead frame 10 . The mold 210 includes a pair of upper and lower molds, ie, an upper mold 220 and a lower mold 230 (see FIG. 3, etc.). The molding die 210 is provided with a heating portion (not shown) such as a heater.
　型締め機構（不図示）は、下型２３０を上下に移動させることによって、成形型２１０（上型２２０及び下型２３０）を型締め又は型開きするものである。なお、便宜上、型締め機構の図示は省略している。 The mold clamping mechanism (not shown) clamps or opens the mold 210 (upper mold 220 and lower mold 230) by moving the lower mold 230 up and down. For convenience, illustration of the mold clamping mechanism is omitted.
　搬出モジュール３００は、樹脂封止されたリードフレーム１０を樹脂成形モジュール２００から受け取って搬出するものである。搬出モジュール３００は、主としてアンローダ３１０及び基板収容部３２０を具備する。 The unloading module 300 receives the resin-sealed lead frame 10 from the resin molding module 200 and unloads it. The carry-out module 300 mainly includes an unloader 310 and a substrate accommodation section 320 .
　アンローダ３１０は、樹脂封止されたリードフレーム１０を保持して基板収容部３２０へと搬出するものである。なお、アンローダ３１０は、本発明に係る搬送機構の実施の一形態である。基板収容部３２０は、樹脂封止されたリードフレーム１０を収容するものである。 The unloader 310 holds the resin-sealed lead frame 10 and unloads it to the substrate accommodating section 320 . In addition, the unloader 310 is one embodiment of the transport mechanism according to the present invention. The board accommodating portion 320 accommodates the resin-sealed lead frame 10 .
　次に、図１及び図２を用いて、上述の如く構成された樹脂成形装置１の動作（樹脂成形装置１を用いた樹脂成形品の製造方法）の概要について説明する。 Next, an overview of the operation of the resin molding apparatus 1 configured as described above (method for manufacturing a resin molded product using the resin molding apparatus 1) will be described with reference to FIGS.
　本実施形態に係る樹脂成形品の製造方法は、主として搬入工程Ｓ１０、樹脂成形工程Ｓ２０及び搬出工程Ｓ３０を含む。 The method for manufacturing a resin molded product according to the present embodiment mainly includes a carry-in step S10, a resin molding step S20, and a carry-out step S30.
　搬入工程Ｓ１０は、リードフレーム１０及び樹脂タブレットＴを樹脂成形モジュール２００に搬入する工程である。 The loading step S10 is a step of loading the lead frame 10 and the resin tablet T into the resin molding module 200.
　搬入工程Ｓ１０において、フレーム送出部１１０は、インマガジンユニット（不図示）に収容されたリードフレーム１０を、フレーム供給部１２０に送り出す。フレーム供給部１２０は、受け取ったリードフレーム１０を適宜整列させて、ローダ１５０に受け渡す。 In the carrying-in step S10, the frame delivery section 110 delivers the lead frames 10 accommodated in the in-magazine unit (not shown) to the frame supply section 120. The frame supply unit 120 properly aligns the received lead frames 10 and delivers them to the loader 150 .
　また、樹脂送出部１３０は、ストッカ（不図示）から受け取った樹脂タブレットＴを樹脂供給部１４０に送り出す。樹脂供給部１４０は、受け取った樹脂タブレットＴのうち必要な個数をローダ１５０に受け渡す。 Also, the resin delivery unit 130 delivers the resin tablet T received from the stocker (not shown) to the resin supply unit 140 . The resin supply unit 140 transfers the required number of received resin tablets T to the loader 150 .
　ローダ１５０は、受け取ったリードフレーム１０と樹脂タブレットＴを樹脂成形モジュール２００の成形型２１０に搬送する。リードフレーム１０と樹脂タブレットＴが成形型２１０に搬送された後、搬入工程Ｓ１０から樹脂成形工程Ｓ２０に移行する。 The loader 150 conveys the received lead frame 10 and resin tablet T to the molding die 210 of the resin molding module 200 . After the lead frame 10 and the resin tablet T are conveyed to the molding die 210, the process proceeds from the carrying-in step S10 to the resin molding step S20.
　樹脂成形工程Ｓ２０は、リードフレーム１０に装着された電子素子を樹脂封止する工程である。 The resin molding step S20 is a step of resin-sealing the electronic element mounted on the lead frame 10 .
　樹脂成形工程Ｓ２０において、型締め機構（不図示）は、成形型２１０を型締めする。そして、成形型２１０の加熱部（不図示）によって樹脂タブレットＴを加熱して溶融させ、生成された流動性樹脂を用いてリードフレーム１０を樹脂封止する。リードフレーム１０を樹脂封止した後、樹脂成形工程Ｓ２０から搬出工程Ｓ３０に移行する。 In the resin molding step S20, a mold clamping mechanism (not shown) clamps the mold 210. Then, the resin tablet T is heated and melted by a heating portion (not shown) of the molding die 210, and the lead frame 10 is resin-sealed using the generated fluid resin. After the lead frame 10 is resin-sealed, the process proceeds from the resin molding step S20 to the unloading step S30.
　搬出工程Ｓ３０は、樹脂封止されたリードフレーム１０（樹脂成形品）を樹脂成形モジュール２００から受け取って搬出する工程である。 The carry-out step S30 is a step of receiving the resin-sealed lead frame 10 (resin molded product) from the resin-molded module 200 and carrying it out.
　搬出工程Ｓ３０において、型締め機構（不図示）は、成形型２１０を型開きする。そして、樹脂封止されたリードフレーム１０を離型させる。その後、アンローダ３１０は、リードフレーム１０を成形型２１０から搬出し、搬出モジュール３００の基板収容部３２０に収容する。この際、樹脂成形されたリードフレーム１０の不要部分（後述するカル１０ｂ、ランナ１０ｃ等の不要樹脂）は適宜除去される。このようにして、樹脂封止されたリードフレーム１０（樹脂成形品）が製造される。 In the unloading step S30, the mold clamping mechanism (not shown) opens the mold 210. Then, the resin-sealed lead frame 10 is released from the mold. After that, the unloader 310 unloads the lead frame 10 from the molding die 210 and accommodates it in the substrate accommodating section 320 of the unloading module 300 . At this time, unnecessary portions of the resin-molded lead frame 10 (unnecessary resin such as culls 10b and runners 10c, which will be described later) are appropriately removed. Thus, the resin-sealed lead frame 10 (resin molded product) is manufactured.
　次に、図３から図６を用いて、樹脂成形装置１のうち、搬出工程Ｓ３０に関する構成について、より詳細に説明する。具体的には、成形型２１０（上型２２０及び下型２３０）、並びにアンローダ３１０の構成について説明する。なお図３は、上型２２０及び下型２３０、並びに樹脂封止される前のリードフレーム１０を示したものである。また図４は、下型２３０、樹脂封止されたリードフレーム１０、及びアンローダ３１０を示したものである。また本実施形態は、以下で説明する各部材の概略を例示（図示）するものであり、各部材の具体的な形状、配置、個数等は限定するものではない。なお、樹脂封止される前のリードフレーム１０は電子素子が接続されているが、図３は省略して示したものである。 Next, the configuration of the resin molding apparatus 1 relating to the unloading step S30 will be described in more detail with reference to FIGS. 3 to 6. FIG. Specifically, the configurations of the mold 210 (the upper mold 220 and the lower mold 230) and the unloader 310 will be described. 3 shows the upper mold 220, the lower mold 230, and the lead frame 10 before resin sealing. FIG. 4 also shows the lower mold 230 , the resin-sealed lead frame 10 , and the unloader 310 . Further, the present embodiment exemplifies (illustrates) the outline of each member described below, and does not limit the specific shape, arrangement, number, etc. of each member. An electronic element is connected to the lead frame 10 before being resin-sealed, but FIG. 3 is omitted.
　図３に示す上型２２０は、主として上型本体２２１を具備する。 The upper mold 220 shown in FIG. 3 mainly includes an upper mold main body 221.
　上型本体２２１は、上型２２０の主たる部分を形成する部材である。上型本体２２１は、適宜の上下厚さを有するように形成される。上型本体２２１は、適宜の支持部材（不図示）に固定される。上型本体２２１の下面には、キャビティ２２１ａ、カル部２２１ｂ及びランナ部２２１ｃが形成される。 The upper mold main body 221 is a member that forms the main part of the upper mold 220 . The upper mold main body 221 is formed to have an appropriate vertical thickness. The upper mold main body 221 is fixed to an appropriate supporting member (not shown). A cavity 221 a , a cull portion 221 b and a runner portion 221 c are formed on the lower surface of the upper mold body 221 .
　キャビティ２２１ａは、樹脂材料が供給されて樹脂成形される凹部である。キャビティ２２１ａは、後述する下型２３０に載置されたリードフレーム１０と対向する位置（電子素子を樹脂封止できる位置）に形成される。キャビティ２２１ａは、製品（樹脂成形品）に応じた適宜の形状に形成される。 The cavity 221a is a concave portion to which a resin material is supplied and resin-molded. The cavity 221a is formed at a position facing the lead frame 10 placed on a lower mold 230 (a position where the electronic element can be resin-sealed). The cavity 221a is formed in an appropriate shape according to the product (resin molded product).
　カル部２２１ｂは、後述する下型２３０のポットブロック２３２と対向する位置に形成された凹部である。本実施形態では、図３に示すように、上型本体２２１の左右中央にカル部２２１ｂが形成され、カル部２２１ｂの左右両側にキャビティ２２１ａが形成される。 The cull portion 221b is a recess formed at a position facing the pot block 232 of the lower die 230, which will be described later. In this embodiment, as shown in FIG. 3, a cull portion 221b is formed in the left-right center of the upper die main body 221, and cavities 221a are formed on both left and right sides of the cull portion 221b.
　ランナ部２２１ｃは、カル部２２１ｂとキャビティ２２１ａとを接続する凹部である。ランナ部２２１ｃの深さは、カル部２２１ｂよりも浅くなるように形成される。 The runner portion 221c is a recess that connects the cull portion 221b and the cavity 221a. The depth of the runner portion 221c is formed to be shallower than that of the cull portion 221b.
　下型２３０は、主として下型本体２３１、ポットブロック２３２及びエジェクタピン２３３を具備する。 The lower mold 230 mainly comprises a lower mold main body 231, a pot block 232 and an ejector pin 233.
　下型本体２３１は、下型２３０の主たる部分を形成する部材である。下型本体２３１は、適宜の上下厚さを有するように形成される。下型本体２３１の上面には、搬入工程Ｓ１０において搬入されたリードフレーム１０が載置される。 The lower mold main body 231 is a member that forms the main part of the lower mold 230 . The lower die main body 231 is formed to have an appropriate vertical thickness. The lead frame 10 loaded in the loading step S10 is placed on the upper surface of the lower mold body 231 .
　ポットブロック２３２は、供給モジュール１００から供給された樹脂タブレットＴが収容されるポット２３２ａが形成される部材である。ポットブロック２３２は、適宜の高さを有するように形成される。ポットブロック２３２には、その上面に開口するようにポット２３２ａが形成される。ポット２３２ａは、互いに適宜の間隔を空けて複数形成される（不図示）。ポット２３２ａに収容された樹脂タブレットＴは、樹脂成形工程Ｓ２０において、図示しないプランジャによってポット２３２ａの上端から射出され、樹脂成形が行われる。 The pot block 232 is a member forming a pot 232a in which the resin tablet T supplied from the supply module 100 is accommodated. Pot block 232 is formed to have an appropriate height. A pot 232a is formed in the pot block 232 so as to open on the upper surface thereof. A plurality of pots 232a are formed at appropriate intervals (not shown). The resin tablet T housed in the pot 232a is injected from the upper end of the pot 232a by a plunger (not shown) in the resin molding step S20, and resin molding is performed.
　図４に示すエジェクタピン２３３は、成形後のリードフレーム１０と下型２３０とを離型させるための部材である。エジェクタピン２３３は、略円柱状に形成される。エジェクタピン２３３は、軸線方向を上下方向（鉛直方向）に向けて配置される。エジェクタピン２３３は、下型本体２３１に形成された貫通孔（不図示）に挿入された状態で配置される。エジェクタピン２３３は、下型本体２３１に対して相対的に上下に移動可能に構成される。具体的には、エジェクタピン２３３は、下型本体２３１が下降するのに伴って、下型本体２３１の上面から突出する。 The ejector pin 233 shown in FIG. 4 is a member for separating the lead frame 10 and the lower mold 230 after molding. The ejector pin 233 is formed in a substantially cylindrical shape. The ejector pin 233 is arranged with its axial direction directed in the up-down direction (vertical direction). The ejector pin 233 is arranged while being inserted into a through hole (not shown) formed in the lower die main body 231 . The ejector pin 233 is configured to be vertically movable relative to the lower die main body 231 . Specifically, the ejector pin 233 protrudes from the upper surface of the lower mold main body 231 as the lower mold main body 231 descends.
　図４に示すアンローダ３１０は、主としてアンローダ本体３１１、クランパ３１２、成形品保持部３１５、樹脂保持部３１３及び昇降支持部３１４（図５及び図６参照）を具備する。 The unloader 310 shown in FIG. 4 mainly includes an unloader main body 311, a clamper 312, a molded product holding portion 315, a resin holding portion 313, and an elevation support portion 314 (see FIGS. 5 and 6).
　アンローダ本体３１１は、アンローダ３１０の主たる部分を形成する部材である。アンローダ本体３１１は、適宜の上下厚さを有するように形成される。アンローダ本体３１１は、適宜の移動機構によって、水平方向及び上下方向（鉛直方向）にそれぞれ移動することができる。 The unloader main body 311 is a member that forms the main part of the unloader 310 . The unloader main body 311 is formed to have an appropriate vertical thickness. The unloader main body 311 can be moved horizontally and vertically (vertically) by an appropriate moving mechanism.
　クランパ３１２は、リードフレーム１０を保持するものである。クランパ３１２は、アンローダ本体３１１に設けられる。クランパ３１２は、正面視略Ｌ字状に形成される。より具体的には、クランパ３１２は、下端部が内側（アンローダ本体３１１の中央側）に向かって延びるように形成されている。クランパ３１２の上端部は、アンローダ本体３１１に対して回動可能に連結されている。クランパ３１２は、図示せぬ駆動源（例えば、モータ、シリンダ等）の駆動力により回動される。 The clamper 312 holds the lead frame 10 . The clamper 312 is provided on the unloader main body 311 . The clamper 312 is formed in a substantially L shape when viewed from the front. More specifically, the clamper 312 is formed such that its lower end extends inward (toward the center of the unloader main body 311). An upper end portion of the clamper 312 is rotatably connected to the unloader main body 311 . The clamper 312 is rotated by the drive force of a drive source (for example, motor, cylinder, etc.) (not shown).
　図４から図６に示す樹脂保持部３１３は、樹脂成形に用いられた樹脂材料のうち、樹脂成形品に不要な樹脂（不要樹脂）を保持する部分である。より具体的には、樹脂保持部３１３は、後述するカル１０ｂを保持する部分である。なお、図４では、樹脂保持部３１３及び後述する昇降支持部３１４の構造の詳細な図示を省略している。図５及び図６に示すように、樹脂保持部３１３は、主として樹脂吸着管部３１３ａ、樹脂吸着パッド３１３ｂ及び樹脂吸着配管ブロック３１３ｃを具備する。 The resin holding portion 313 shown in FIGS. 4 to 6 is a portion that holds unnecessary resin (unnecessary resin) for the resin molded product among the resin materials used for resin molding. More specifically, the resin holding portion 313 is a portion that holds a cull 10b, which will be described later. In FIG. 4, detailed illustration of the structure of the resin holding portion 313 and an elevation support portion 314, which will be described later, is omitted. As shown in FIGS. 5 and 6, the resin holding portion 313 mainly includes a resin adsorption pipe portion 313a, a resin adsorption pad 313b, and a resin adsorption pipe block 313c.
　樹脂吸着管部３１３ａは、中空筒状に形成された部材である。樹脂吸着管部３１３ａは、軸線方向を上下に向けた状態で配置される。樹脂吸着管部３１３ａは、アンローダ本体３１１を上下に貫通する貫通孔３１１ａに挿入される。樹脂吸着管部３１３ａの下端部は、アンローダ本体３１１の下面から下方へと突出するように配置される。なお、樹脂吸着管部３１３ａは、本発明に係るパッド取付部の実施の一形態である。 The resin adsorption tube portion 313a is a hollow cylindrical member. The resin adsorption tube portion 313a is arranged with its axial direction directed vertically. The resin adsorption tube portion 313a is inserted into a through-hole 311a that penetrates the unloader main body 311 vertically. A lower end portion of the resin adsorption tube portion 313 a is arranged to protrude downward from the lower surface of the unloader main body 311 . The resin adsorption tube portion 313a is an embodiment of the pad mounting portion according to the present invention.
　樹脂吸着パッド３１３ｂは、不要樹脂と接触する部分である。樹脂吸着パッド３１３ｂは、樹脂吸着管部３１３ａの下端部に固定されることで、樹脂吸着管部３１３ａに取り付けられる。樹脂吸着パッド３１３ｂは、ゴム等の弾性素材により形成される。樹脂吸着パッド３１３ｂは、不要樹脂と接触した際に多少撓むことで、不要樹脂に密着することができる。なお、樹脂吸着パッド３１３ｂは、本発明に係る吸着パッドの実施の一形態である。 The resin suction pad 313b is a portion that comes into contact with unnecessary resin. The resin adsorption pad 313b is attached to the resin adsorption tube portion 313a by being fixed to the lower end portion of the resin adsorption tube portion 313a. The resin adsorption pad 313b is made of an elastic material such as rubber. The resin adsorption pad 313b can adhere to the unnecessary resin by slightly bending when it comes into contact with the unnecessary resin. Incidentally, the resin suction pad 313b is an embodiment of the suction pad according to the present invention.
　樹脂吸着管部３１３ａ及び樹脂吸着パッド３１３ｂは、後述するカル１０ｂを吸着可能な位置に複数設けられる。本実施形態では、図５に示すように、樹脂吸着管部３１３ａ及び樹脂吸着パッド３１３ｂが前後に複数並ぶように配置された例を示している。樹脂吸着管部３１３ａ及び樹脂吸着パッド３１３ｂの個数は、カル１０ｂの個数に応じて、設ければよい。 A plurality of resin adsorption tube portions 313a and resin adsorption pads 313b are provided at positions where they can adsorb culls 10b, which will be described later. In this embodiment, as shown in FIG. 5, an example is shown in which a plurality of resin adsorption tube portions 313a and resin adsorption pads 313b are arranged in a row in the front-rear direction. The number of resin adsorption tube portions 313a and resin adsorption pads 313b may be provided according to the number of culls 10b.
　樹脂吸着配管ブロック３１３ｃは、樹脂吸着管部３１３ａを支持する部分である。樹脂吸着配管ブロック３１３ｃは、前後に延びる略直方体状に形成される。樹脂吸着配管ブロック３１３ｃには、不要樹脂を吸着するための空気の流路３１３ｄが形成される。流路３１３ｄは、真空ポンプ等の吸引装置（不図示）に接続される。樹脂吸着配管ブロック３１３ｃは、アンローダ本体３１１の上側に配置される。樹脂吸着配管ブロック３１３ｃには、各樹脂吸着管部３１３ａの上端部が固定される。各樹脂吸着管部３１３ａの中空部は、樹脂吸着配管ブロック３１３ｃの流路３１３ｄと接続される。 The resin adsorption pipe block 313c is a portion that supports the resin adsorption pipe portion 313a. The resin adsorption pipe block 313c is formed in a substantially rectangular parallelepiped shape extending back and forth. An air flow path 313d for adsorbing unnecessary resin is formed in the resin adsorption pipe block 313c. 313 d of flow paths are connected to suction devices (not shown), such as a vacuum pump. The resin adsorption pipe block 313c is arranged above the unloader main body 311. As shown in FIG. The upper end of each resin adsorption pipe portion 313a is fixed to the resin adsorption pipe block 313c. The hollow portion of each resin adsorption pipe portion 313a is connected to the flow path 313d of the resin adsorption pipe block 313c.
　昇降支持部３１４は、樹脂保持部３１３を上下に昇降可能となるように支持する部分である。昇降支持部３１４は、主としてブシュ３１４ａ、戻しプレート３１４ｂ、ガイド用シャフト３１４ｃ及び戻しスプリング３１４ｄを具備する。 The lift support part 314 is a part that supports the resin holding part 313 so that it can be lifted up and down. The lifting support part 314 mainly includes a bush 314a, a return plate 314b, a guide shaft 314c and a return spring 314d.
　ブシュ３１４ａは、樹脂吸着管部３１３ａを上下に案内する部分である。ブシュ３１４ａは、円筒状に形成される。ブシュ３１４ａは、軸線を上下に向けた状態で、アンローダ本体３１１の貫通孔３１１ａに固定される。ブシュ３１４ａには、樹脂吸着管部３１３ａが挿入される。樹脂吸着管部３１３ａの外周面は、ブシュ３１４ａの内周面に対して上下に摺動可能となるように接している。これによってブシュ３１４ａは、樹脂吸着管部３１３ａが水平方向に移動するのを防止すると共に、上下に昇降するように案内することができる。 The bush 314a is a portion that guides the resin adsorption tube portion 313a up and down. The bush 314a is cylindrically formed. The bushing 314a is fixed to the through hole 311a of the unloader body 311 with its axis directed vertically. The resin adsorption tube portion 313a is inserted into the bush 314a. The outer peripheral surface of the resin adsorption tube portion 313a is in contact with the inner peripheral surface of the bushing 314a so as to be slidable up and down. As a result, the bush 314a can prevent the resin adsorption tube portion 313a from moving in the horizontal direction, and can guide the resin adsorption tube portion 313a to move up and down.
　戻しプレート３１４ｂは、樹脂保持部３１３に固定される部分である。戻しプレート３１４ｂは、アンローダ本体３１１の上側に配置される。戻しプレート３１４ｂは、板状の部材を適宜屈曲させて形成される。具体的には、戻しプレート３１４ｂは、水平に配置された板状部材の左右中央部を上方に突出させるようにして形成される。戻しプレート３１４ｂの左右中央部は、樹脂吸着配管ブロック３１３ｃの上面に固定される。このようにして、戻しプレート３１４ｂは、樹脂吸着配管ブロック３１３ｃを左右に跨ぐように配置される。戻しプレート３１４ｂは、樹脂吸着配管ブロック３１３ｃの前後両端部にそれぞれ設けられる。戻しプレート３１４ｂは、樹脂保持部３１３と一体的に昇降することができる。なお、戻しプレート３１４ｂは、本発明に係る昇降部の実施の一形態である。 The return plate 314 b is a portion fixed to the resin holding portion 313 . The return plate 314b is arranged above the unloader main body 311 . The return plate 314b is formed by appropriately bending a plate-like member. Specifically, the return plate 314b is formed such that the left and right central portions of a horizontally arranged plate-like member protrude upward. The left and right central portions of the return plate 314b are fixed to the upper surface of the resin adsorption pipe block 313c. In this manner, the return plate 314b is arranged to straddle the resin adsorption piping block 313c from side to side. The return plates 314b are provided at the front and rear end portions of the resin adsorption piping block 313c, respectively. The return plate 314 b can move up and down integrally with the resin holding portion 313 . Note that the return plate 314b is an embodiment of the lifting section according to the present invention.
　ガイド用シャフト３１４ｃは、戻しプレート３１４ｂを上下に昇降するように案内すると共に、戻しプレート３１４ｂの昇降範囲を規定する部分である。ガイド用シャフト３１４ｃは、戻しプレート３１４ｂの左右両端部を上下に貫通するように配置される。ガイド用シャフト３１４ｃの下端部は、アンローダ本体３１１の上面に固定される。これによってガイド用シャフト３１４ｃは、戻しプレート３１４ｂが水平方向に移動するのを防止すると共に、上下に昇降するように案内することができる。また、ガイド用シャフト３１４ｃの上端部には、他の部分よりも直径が大きい頭部が形成されている。ガイド用シャフト３１４ｃは、この頭部によって戻しプレート３１４ｂの上方への移動を規制することができる。これによって戻しプレート３１４ｂは、アンローダ本体３１１の上面と、ガイド用シャフト３１４ｃの頭部との間の範囲で昇降することができる。なお、ガイド用シャフト３１４ｃは、本発明に係る可動範囲規定部の実施の一形態である。 The guide shaft 314c is a part that guides the return plate 314b so that it moves up and down and defines the range of movement of the return plate 314b. The guide shaft 314c is arranged so as to pass vertically through the left and right ends of the return plate 314b. A lower end portion of the guide shaft 314 c is fixed to the upper surface of the unloader main body 311 . As a result, the guide shaft 314c can prevent the return plate 314b from moving in the horizontal direction and can guide the return plate 314b to move up and down. In addition, the upper end of the guide shaft 314c is formed with a head having a larger diameter than the other portions. The guide shaft 314c can restrict upward movement of the return plate 314b by this head. This allows the return plate 314b to move up and down in a range between the upper surface of the unloader main body 311 and the head of the guide shaft 314c. The guide shaft 314c is an embodiment of the movable range regulating section according to the present invention.
　戻しスプリング３１４ｄは、戻しプレート３１４ｂを下方に向かって力を付与するものである。戻しスプリング３１４ｄは、圧縮コイルばねにより形成される。戻しスプリング３１４ｄは、ガイド用シャフト３１４ｃに挿入され、戻しプレート３１４ｂとガイド用シャフト３１４ｃの頭部との間に配置される。これによって戻しスプリング３１４ｄは、戻しプレート３１４ｂを下方に向かって常時力を付与することができる。なお、戻しスプリング３１４ｄは、本発明に係る付与部の実施の一形態である。 The return spring 314d applies downward force to the return plate 314b. The return spring 314d is formed by a compression coil spring. A return spring 314d is inserted into the guide shaft 314c and positioned between the return plate 314b and the head of the guide shaft 314c. As a result, the return spring 314d can always exert force downward on the return plate 314b. The return spring 314d is an embodiment of the application section according to the present invention.
　図４に示す成形品保持部３１５は、樹脂成形に用いられた樹脂材料のうち、樹脂成形品となる樹脂を保持する部分である。より具体的には、成形品保持部３１５は、後述する封止部１０ａを保持する部分である。成形品保持部３１５は、主として成形品吸着管部３１５ａ及び成形品吸着パッド３１５ｂを具備する。 The molded product holding portion 315 shown in FIG. 4 is a portion that holds the resin that will become the resin molded product, out of the resin material used for resin molding. More specifically, the molded product holding portion 315 is a portion that holds a sealing portion 10a, which will be described later. The molded article holding section 315 mainly includes a molded article suction tube section 315a and a molded article suction pad 315b.
　成形品吸着管部３１５ａは、中空筒状に形成された部材である。成形品吸着管部３１５ａは、アンローダ本体３１１の下面から下方に向かって延びるように配置される。成形品吸着管部３１５ａの上端部は、アンローダ本体３１１に固定される。成形品吸着管部３１５ａは、アンローダ本体３１１に形成された空気の流路を介して、真空ポンプ等の吸引装置に接続される（不図示）。 The molded article adsorption tube portion 315a is a member formed in a hollow cylindrical shape. The molded article suction tube portion 315a is arranged to extend downward from the lower surface of the unloader main body 311 . The upper end of the molded product suction tube portion 315 a is fixed to the unloader main body 311 . The molded article suction pipe portion 315a is connected to a suction device such as a vacuum pump (not shown) through an air flow path formed in the unloader main body 311 .
　成形品吸着パッド３１５ｂは、樹脂と接触する部分である。成形品吸着パッド３１５ｂは、成形品吸着管部３１５ａの下端部に固定される。成形品吸着パッド３１５ｂは、ゴム等の弾性素材により形成される。 The molded article suction pad 315b is the part that comes into contact with the resin. The molded article suction pad 315b is fixed to the lower end of the molded article suction tube portion 315a. The molded product suction pad 315b is made of an elastic material such as rubber.
　このように構成されたアンローダ３１０において、樹脂保持部３１３は、アンローダ本体３１１や成形品保持部３１５に対して、相対的に上下に昇降可能となるように支持されている。 In the unloader 310 configured as described above, the resin holding portion 313 is supported so as to be vertically movable relative to the unloader main body 311 and the molded product holding portion 315 .
　次に、図３及び図４を用いて、樹脂封止されたリードフレーム１０について説明する。 Next, the resin-sealed lead frame 10 will be described with reference to FIGS. 3 and 4. FIG.
　樹脂成形工程Ｓ２０においてポット２３２ａから溶融した樹脂材料が射出されると、この樹脂材料は上型２２０（図３参照）のカル部２２１ｂ及びランナ部２２１ｃを介してキャビティ２２１ａへと供給される。これによって、図４に示すように、リードフレーム１０の上面には、上型２２０のカル部２２１ｂ、ランナ部２２１ｃ及びキャビティ２２１ａに応じた形状の樹脂が成形される。以下では、キャビティ２２１ａ、カル部２２１ｂ及びランナ部２２１ｃにおいて成形された樹脂を、それぞれ封止部１０ａ、カル１０ｂ及びランナ１０ｃと称する。 When the molten resin material is injected from the pot 232a in the resin molding step S20, this resin material is supplied to the cavity 221a through the cull portion 221b and the runner portion 221c of the upper mold 220 (see FIG. 3). As a result, as shown in FIG. 4, resin is formed on the upper surface of the lead frame 10 in a shape corresponding to the cull portion 221b, the runner portion 221c, and the cavity 221a of the upper die 220. As shown in FIG. In the following, the resin molded in the cavity 221a, the cull portion 221b and the runner portion 221c will be referred to as the sealing portion 10a, the cull portion 10b and the runner 10c, respectively.
　キャビティ２２１ａにおいて成形された封止部１０ａは、リードフレーム１０に装着された電子素子を樹脂封止する部分である。封止部１０ａ及びリードフレーム１０は、製品（樹脂成形品）となる部分である。一方、カル１０ｂ及びランナ１０ｃは製造の都合上成形される部分であり、製品としては不要な部分（不要樹脂）である。このように樹脂成形工程Ｓ２０では、製品として必要な封止部１０ａだけでなく、不要樹脂（カル１０ｂ及びランナ１０ｃ）も成形されている。搬出工程Ｓ３０では、製品として必要な樹脂成形品（封止部１０ａ及びリードフレーム１０）だけでなく、不要樹脂も成形型２１０から搬出する必要がある。 The sealing portion 10a molded in the cavity 221a is a portion that seals the electronic element attached to the lead frame 10 with resin. The sealing portion 10a and the lead frame 10 are parts to be a product (resin molded product). On the other hand, the cull 10b and the runner 10c are parts that are molded for the convenience of manufacturing, and are unnecessary parts (unnecessary resin) as a product. As described above, in the resin molding step S20, not only the sealing portion 10a necessary for the product but also the unnecessary resin (the cull 10b and the runner 10c) are molded. In the carry-out step S30, it is necessary to carry out not only the resin molded products (sealing portion 10a and lead frame 10) required as products, but also unnecessary resin from the mold 210. FIG.
　次に、図７及び図８を用いて、搬出工程Ｓ３０において、樹脂封止されたリードフレーム１０が成形型２１０から搬出される様子について、具体的に説明する。なお図７では、便宜上、各部材の符号を適宜省略している。 Next, referring to FIGS. 7 and 8, how the resin-sealed lead frame 10 is unloaded from the molding die 210 in the unloading step S30 will be specifically described. In addition, in FIG. 7, for the sake of convenience, the reference numerals of each member are omitted as appropriate.
　搬出工程Ｓ３０において、まず、図７（ａ）に示すように、下型本体２３１を所定の量だけ下降させる。これに伴って、エジェクタピン２３３は、下型本体２３１に対して相対的に上方に移動し、エジェクタピン２３３の上端部が下型本体２３１の上面よりも上方に突出する。このように、エジェクタピン２３３を下型本体２３１から突出させることで、下型本体２３１の上面に載せられたリードフレーム１０を下から押し上げ、リードフレーム１０を下型本体２３１から上昇させる（離型させる）ことができる。これによって、リードフレーム１０と下型本体２３１の上面との間には、隙間が形成されることになる。 In the unloading step S30, first, as shown in FIG. 7(a), the lower mold main body 231 is lowered by a predetermined amount. Accordingly, the ejector pin 233 moves upward relative to the lower mold main body 231 , and the upper end of the ejector pin 233 protrudes above the upper surface of the lower mold main body 231 . By projecting the ejector pin 233 from the lower mold main body 231 in this way, the lead frame 10 placed on the upper surface of the lower mold main body 231 is pushed up from below, and the lead frame 10 is lifted from the lower mold main body 231 (mold releasing). can be made). As a result, a gap is formed between the lead frame 10 and the upper surface of the lower die main body 231 .
　次に、図７（ｂ）に示すように、アンローダ３１０を下型２３０の上方まで移動させ、所定の位置まで下降させる。具体的には、図７（ｃ）に示すように、樹脂保持部３１３及び成形品保持部３１５が、それぞれカル１０ｂ及び封止部１０ａに接する位置までアンローダ３１０を下降させる。 Next, as shown in FIG. 7(b), the unloader 310 is moved above the lower die 230 and lowered to a predetermined position. Specifically, as shown in FIG. 7C, the unloader 310 is lowered to a position where the resin holding portion 313 and the molded product holding portion 315 are in contact with the cull 10b and the sealing portion 10a, respectively.
　ここで樹脂保持部３１３は、アンローダ本体３１１及び成形品保持部３１５に対して上下に昇降することで、カル１０ｂを適切に吸着することができるように構成されている。以下、この樹脂保持部３１３の動作について詳細に説明する。 Here, the resin holding portion 313 is configured to be able to properly suck the cull 10b by moving up and down with respect to the unloader main body 311 and the molded product holding portion 315 . The operation of the resin holding portion 313 will be described in detail below.
　図８に示すように、アンローダ３１０が下降して、樹脂保持部３１３がカル１０ｂに接すると、樹脂保持部３１３はカル１０ｂによって上に押されることになる。これによって、樹脂保持部３１３は、ブシュ３１４ａに沿って上方に移動する。また、樹脂保持部３１３に固定された戻しプレート３１４ｂも、戻しスプリング３１４ｄを収縮させながら、ガイド用シャフト３１４ｃに沿って上方に移動することになる。 As shown in FIG. 8, when the unloader 310 descends and the resin holding portion 313 contacts the cull 10b, the resin holding portion 313 is pushed upward by the cull 10b. As a result, the resin holding portion 313 moves upward along the bush 314a. The return plate 314b fixed to the resin holding portion 313 also moves upward along the guide shaft 314c while contracting the return spring 314d.
　このように、樹脂保持部３１３は、アンローダ本体３１１に対して固定されているのではなく、上下に昇降できるように支持されている。このような構成によって、カル１０ｂの厚さ（高さ）が変更された場合であっても、カル１０ｂの高さに応じて樹脂保持部３１３が上下に昇降することができるため、カル１０ｂを適切に吸着することができる。ここで、真空ポンプ等の吸引装置（不図示）を用い、樹脂吸着配管ブロック３１３ｃを介して真空引きすることで、カル１０ｂを吸着することができる。 Thus, the resin holding part 313 is not fixed to the unloader main body 311, but is supported so that it can move up and down. With such a configuration, even when the thickness (height) of the cull 10b is changed, the resin holding portion 313 can move up and down according to the height of the cull 10b. Can be properly adsorbed. Here, the cull 10b can be adsorbed by vacuuming through the resin adsorption pipe block 313c using a suction device (not shown) such as a vacuum pump.
　例えば、樹脂成形品の種類に応じてカル１０ｂの厚さが設計変更された場合であっても、アンローダ３１０の構造を変更することなく、カル１０ｂを適切に吸着することができる。また、プランジャ（不図示）を用いてカル１０ｂを上方に押し上げて離型させる場合などにも、カル１０ｂの上昇に応じて樹脂保持部３１３も上方に移動することができるため、カル１０ｂを適切に吸着することができる。このように、本実施形態のアンローダ３１０は、樹脂保持部３１３を上下に昇降可能とすることにより、カル１０ｂの厚さ（高さ）の変更や、カル１０ｂの移動（上昇）に対応することができ、汎用性を高めることができる。 For example, even if the design of the thickness of the cull 10b is changed according to the type of resin molded product, the cull 10b can be properly adsorbed without changing the structure of the unloader 310. Also, when the cull 10b is pushed upward using a plunger (not shown) to release the cull 10b, the resin holding portion 313 can also move upward in accordance with the rise of the cull 10b. can be adsorbed to As described above, the unloader 310 of the present embodiment can move the resin holding portion 313 up and down to change the thickness (height) of the cull 10b and move (raise) the cull 10b. can be used, and versatility can be enhanced.
　搬出工程Ｓ３０では、このようにして樹脂保持部３１３及び成形品保持部３１５がそれぞれカル１０ｂ及び封止部１０ａに接すると（図７（ｃ）参照）、吸引装置（不図示）を作動させ、樹脂保持部３１３及び成形品保持部３１５によって、カル１０ｂ及び封止部１０ａをそれぞれ吸着する。 In the unloading step S30, when the resin holding portion 313 and the molded product holding portion 315 come into contact with the cull 10b and the sealing portion 10a, respectively (see FIG. 7C), a suction device (not shown) is operated, The resin holding portion 313 and the molded product holding portion 315 suck the cull 10b and the sealing portion 10a, respectively.
　次に、図７（ｃ）に示すように、クランパ３１２の下端部を内側へと回動させる。これによって、クランパ３１２の下端部をリードフレーム１０と下型本体２３１の上面との間の隙間に挿入する。このようにアンローダ３１０は、樹脂封止されたリードフレーム１０を樹脂保持部３１３及び成形品保持部３１５で吸着すると共に、クランパ３１２で下方から支持することで、リードフレーム１０を保持することができる。 Next, as shown in FIG. 7(c), the lower end of the clamper 312 is turned inward. Thereby, the lower end of the clamper 312 is inserted into the gap between the lead frame 10 and the upper surface of the lower mold body 231 . In this way, the unloader 310 can hold the lead frame 10 by sucking the resin-sealed lead frame 10 with the resin holding portion 313 and the molded product holding portion 315 and supporting it from below with the clamper 312 . .
　次に、図７（ｄ）に示すように、アンローダ３１０を上昇させることで、樹脂封止されたリードフレーム１０（リードフレーム１０、封止部１０ａ、カル１０ｂ及びランナ１０ｃ）を持ち上げることができる。このアンローダ３１０を移動させ、樹脂封止されたリードフレーム１０を成形型２１０から搬出する。その後、アンローダ３１０を搬出モジュール３００へと移動させ、適宜不要樹脂（カル１０ｂ及びランナ１０ｃ）を除去し、リードフレーム１０を基板収容部３２０に収容する（図１参照）。このようにして、搬出工程Ｓ３０が完了する。 Next, as shown in FIG. 7D, by raising the unloader 310, the resin-sealed lead frame 10 (the lead frame 10, the sealing portion 10a, the cull 10b, and the runner 10c) can be lifted. . The unloader 310 is moved to unload the resin-encapsulated lead frame 10 from the mold 210 . After that, the unloader 310 is moved to the carry-out module 300, the unnecessary resin (the cull 10b and the runner 10c) is removed as appropriate, and the lead frame 10 is accommodated in the substrate accommodation portion 320 (see FIG. 1). Thus, carrying-out process S30 is completed.
　なお、不要樹脂（カル１０ｂ及びランナ１０ｃ）が除去されると、樹脂保持部３１３は自重により再び最下位置（樹脂吸着配管ブロック３１３ｃ又は戻しプレート３１４ｂがアンローダ本体３１１の上面に接する位置、図６参照）まで下降する。この際、戻しスプリング３１４ｄが戻しプレート３１４ｂを下方に向かって力を付与しているため、この戻しスプリング３１４ｄにより付与される力によって樹脂保持部３１３が下降するのを補助することができる。 When the unnecessary resin (the cull 10b and the runner 10c) is removed, the resin holding portion 313 is moved by its own weight to the lowest position (the position where the resin adsorption pipe block 313c or the return plate 314b touches the upper surface of the unloader main body 311, FIG. 6). reference). At this time, since the return spring 314d applies a downward force to the return plate 314b, the force applied by the return spring 314d can assist the resin holding portion 313 in descending.
　以上の如く、本実施形態に係るアンローダ３１０（搬送機構）は、
　樹脂成形品を保持する成形品保持部３１５と、
　不要樹脂を保持する樹脂保持部３１３と、
　前記成形品保持部３１５に対して相対的に上下に昇降可能となるように前記樹脂保持部３１３を支持する昇降支持部３１４と、
　を具備するものである。 As described above, the unloader 310 (conveyance mechanism) according to the present embodiment is
a molded product holding portion 315 for holding a resin molded product;
a resin holding portion 313 holding unnecessary resin;
a lifting support portion 314 that supports the resin holding portion 313 so that it can move up and down relative to the molded article holding portion 315;
is provided.
　このように構成することにより、不要樹脂の厚さ（高さ）の変更に対応することができ、アンローダ３１０の汎用性を向上させることができる。すなわち、樹脂保持部３１３をカル１０ｂ（不要樹脂）の厚さ（高さ）に応じて昇降させることができるため、カル１０ｂの厚さ等が変更された場合であっても、カル１０ｂを適切に保持することができる。これによって、カル１０ｂの厚さ等が変更されてもアンローダ３１０の構造を変更する必要がなくなり、アンローダ３１０の汎用性を向上させることができる。 By configuring in this way, it is possible to cope with changes in the thickness (height) of the unnecessary resin, and the versatility of the unloader 310 can be improved. That is, the resin holding portion 313 can be moved up and down according to the thickness (height) of the cull 10b (unnecessary resin). can be held. This eliminates the need to change the structure of the unloader 310 even if the thickness of the cull 10b is changed, and the versatility of the unloader 310 can be improved.
　また、前記樹脂保持部３１３は、
　前記不要樹脂と接する樹脂吸着パッド３１３ｂ（吸着パッド）と、
　前記樹脂吸着パッド３１３ｂが取り付けられる樹脂吸着管部３１３ａ（パッド取付部）と、
　を具備し、
　前記昇降支持部３１４は、前記樹脂吸着管部３１３ａを上下に昇降可能となるように支持するものである。 Further, the resin holding portion 313 is
a resin suction pad 313b (suction pad) in contact with the unnecessary resin;
a resin adsorption tube portion 313a (pad attachment portion) to which the resin adsorption pad 313b is attached;
and
The lifting support portion 314 supports the resin adsorption tube portion 313a so that it can be moved up and down.
　このように構成することにより、不要樹脂の厚さ（高さ）の変更に対応することができ、汎用性を向上させることができる。 By configuring in this way, it is possible to respond to changes in the thickness (height) of the unnecessary resin, and to improve versatility.
　また、前記昇降支持部３１４は、
　前記樹脂吸着管部３１３ａと一体的に昇降可能な戻しプレート３１４ｂ（昇降部）と、
　前記戻しプレート３１４ｂの昇降範囲を規定するガイド用シャフト３１４ｃ（可動範囲規定部）と、
　を具備するものである。 Further, the lifting support part 314 is
a return plate 314b (elevating portion) that can move up and down integrally with the resin adsorption tube portion 313a;
a guide shaft 314c (movable range defining portion) that defines the lifting range of the return plate 314b;
is provided.
　このように構成することにより、樹脂保持部３１３の昇降範囲を規定することができる。これによって、樹脂保持部３１３が過剰に移動して他の部材と接触する等の不具合の発生を防止することができる。 By configuring in this way, the lifting range of the resin holding portion 313 can be defined. As a result, it is possible to prevent problems such as excessive movement of the resin holding portion 313 and contact with other members.
　また、前記昇降支持部３１４は、前記樹脂保持部３１３を下方に向かって力を付与する戻しスプリング３１４ｄ（付与部）をさらに具備するものである。 In addition, the lifting support portion 314 further includes a return spring 314d (applying portion) that applies a downward force to the resin holding portion 313 .
　このように構成することにより、樹脂保持部３１３が自重によって下方に戻るのを、戻しスプリング３１４ｄによって補助することができる。 With this configuration, the return spring 314d can assist the downward return of the resin holding portion 313 by its own weight.
　また、本実施形態に係る樹脂成形装置１は、
　リードフレーム１０（成形対象物）を樹脂成形することにより前記樹脂成形品を得る成形型２１０と、
　前記成形型２１０によって樹脂成形された前記樹脂成形品を搬送するアンローダ３１０（搬送機構）と、
　を具備するものである。 Moreover, the resin molding apparatus 1 according to the present embodiment
a molding die 210 for obtaining the resin-molded product by resin-molding the lead frame 10 (molding object);
An unloader 310 (conveyor mechanism) that conveys the resin molded product resin-molded by the mold 210;
is provided.
　このように構成することにより、アンローダ３１０の汎用性を向上させることができ、ひいては樹脂成形装置１の汎用性を向上させることができる。 With this configuration, the versatility of the unloader 310 can be improved, and the versatility of the resin molding apparatus 1 can be improved.
　また、本実施形態に係る樹脂成形品の製造方法は、樹脂成形装置１を用いて樹脂成形品を製造するものである。 Also, the method for manufacturing a resin molded product according to this embodiment uses the resin molding apparatus 1 to manufacture a resin molded product.
　このように構成することにより、アンローダ３１０の汎用性を向上させることができ、ひいては樹脂成形装置１の汎用性を向上させることができる。 With this configuration, the versatility of the unloader 310 can be improved, and the versatility of the resin molding apparatus 1 can be improved.
　以下では、アンローダ３１０の変形例（第二実施形態及び第三実施形態）について説明する。なお以下の説明では、第一実施形態と同様の構成については同じ符号を用いて説明を適宜省略する。 Modified examples (second embodiment and third embodiment) of the unloader 310 will be described below. In addition, in the following description, the same code|symbol is used about the structure similar to 1st embodiment, and description is abbreviate|omitted suitably.
　図９に示す第二実施形態に係るアンローダ３１０は、戻しスプリング３１４ｄにより付与される力を調整できる点で、第一実施形態に係るアンローダ３１０（図６等参照）と異なる。以下、具体的に説明する。 The unloader 310 according to the second embodiment shown in FIG. 9 differs from the unloader 310 according to the first embodiment (see FIG. 6, etc.) in that the force applied by the return spring 314d can be adjusted. A specific description will be given below.
　第二実施形態に係るアンローダ３１０は、第一実施形態に係るアンローダ３１０のガイド用シャフト３１４ｃに代えて、戻しスプリング３１４ｄにより付与される力を調整可能な調整部３１４ｅ（ガイド用ボルト３１４ｆ及び調整ナット３１４ｇ）を具備している。 The unloader 310 according to the second embodiment includes an adjustment portion 314e (a guide bolt 314f and an adjustment nut) capable of adjusting the force applied by a return spring 314d instead of the guide shaft 314c of the unloader 310 according to the first embodiment. 314g).
　ガイド用ボルト３１４ｆは、戻しプレート３１４ｂを上下に昇降するように案内すると共に、戻しプレート３１４ｂの昇降範囲を規定する部分である。ガイド用ボルト３１４ｆは、戻しプレート３１４ｂの左右両端部を上下に貫通するように配置される。ガイド用ボルト３１４ｆの下部は、後述する調整ナット３１４ｇに締結される。またガイド用ボルト３１４ｆの下端部（調整ナット３１４ｇより下方に突出した部分）は、アンローダ本体３１１に形成された貫通孔に挿入される（不図示）。 The guide bolt 314f is a portion that guides the return plate 314b so that it moves up and down and defines the range of movement of the return plate 314b. The guide bolts 314f are arranged so as to pass vertically through the left and right ends of the return plate 314b. A lower portion of the guide bolt 314f is fastened to an adjusting nut 314g, which will be described later. The lower end of the guide bolt 314f (the portion protruding downward from the adjusting nut 314g) is inserted into a through hole formed in the unloader main body 311 (not shown).
　調整ナット３１４ｇは、ガイド用ボルト３１４ｆの長さ（アンローダ本体３１１の上面から突出した部分の長さ）を変更することで、戻しスプリング３１４ｄにより付与される力を調整するためのものである。調整ナット３１４ｇは、アンローダ本体３１１の上面に固定される。調整ナット３１４ｇは、ガイド用ボルト３１４ｆに対応する位置にそれぞれ設けられる。 The adjusting nut 314g is for adjusting the force applied by the return spring 314d by changing the length of the guide bolt 314f (the length of the portion protruding from the upper surface of the unloader main body 311). The adjusting nut 314g is fixed to the top surface of the unloader main body 311. As shown in FIG. The adjusting nuts 314g are provided at positions corresponding to the guide bolts 314f.
　このように構成された調整部３１４ｅにおいて、ガイド用ボルト３１４ｆを調整ナット３１４ｇに対して絞め込んだり緩めたりすることで、ガイド用ボルト３１４ｆの長さを調整することができる。これによって、戻しプレート３１４ｂとガイド用ボルト３１４ｆの頭部との間に配置された戻しスプリング３１４ｄの長さを調整することができる。戻しスプリング３１４ｄの長さを短くするほど戻しスプリング３１４ｄにより付与される力は大きくなり、戻しスプリング３１４ｄの長さを長くするほど戻しスプリング３１４ｄにより付与される力は小さくなる。このようにガイド用ボルト３１４ｆ及び調整ナット３１４ｇによって、カル１０ｂの形状等に応じて戻しスプリング３１４ｄにより付与される力を調整することができる。 The length of the guide bolt 314f can be adjusted by tightening or loosening the guide bolt 314f with respect to the adjustment nut 314g in the adjusting portion 314e configured in this way. Thereby, the length of the return spring 314d arranged between the return plate 314b and the head of the guide bolt 314f can be adjusted. The shorter the length of the return spring 314d, the greater the force exerted by the return spring 314d, and the longer the length of the return spring 314d, the less force exerted by the return spring 314d. Thus, the force applied by the return spring 314d can be adjusted according to the shape of the cull 10b and the like by the guide bolt 314f and the adjustment nut 314g.
　以上のように、第二実施形態に係る前記昇降支持部３１４は、前記戻しスプリング３１４ｄ（付与部）により付与される力を調整することが可能な調整部３１４ｅをさらに具備するものである。 As described above, the lifting support part 314 according to the second embodiment further includes the adjusting part 314e capable of adjusting the force applied by the return spring 314d (applying part).
　このように構成することにより、カル１０ｂの形状等に応じて戻しスプリング３１４ｄにより付与される力を調整することができる。例えば、ランナ１０ｃがリードフレーム１０の下方に形成され、かつカル１０ｂがランナ１０ｃの上方に形成されている場合など、下方への力によってリードフレーム１０から不要樹脂（カル１０ｂ及びランナ１０ｃ）が剥がれ落ちる可能性がある。このような場合には、戻しスプリング３１４ｄにより付与される力を弱めることで、カル１０ｂが搬送中に脱落するのを防止することができる。 With this configuration, the force applied by the return spring 314d can be adjusted according to the shape of the cull 10b. For example, when the runner 10c is formed below the lead frame 10 and the cull 10b is formed above the runner 10c, the unnecessary resin (the cull 10b and the runner 10c) is peeled off from the lead frame 10 by the downward force. may fall. In such a case, weakening the force applied by the return spring 314d can prevent the cull 10b from falling off during transportation.
　図１０に示す第三実施形態に係るアンローダ３１０は、樹脂保持部３１３によって保持された不要樹脂を下方に向かって押圧する押圧部３１６をさらに具備している点で、第一実施形態に係るアンローダ３１０（図６等参照）と異なる。以下、具体的に説明する。 The unloader 310 according to the third embodiment shown in FIG. 310 (see FIG. 6, etc.). A specific description will be given below.
　押圧部３１６は、主として押圧ブロック３１６ａ、ガイド軸３１６ｂ及び押圧スプリング３１６ｃを具備している。 The pressing portion 316 mainly includes a pressing block 316a, a guide shaft 316b and a pressing spring 316c.
　押圧ブロック３１６ａは、不要樹脂と接触する部分である。押圧ブロック３１６ａは、略直方体状に形成される。押圧ブロック３１６ａは、樹脂保持部３１３の左右両側にそれぞれ設けられる。押圧ブロック３１６ａは、不要樹脂（本実施形態では、ランナ１０ｃ）の上方に位置するように配置される。押圧ブロック３１６ａは、後述するガイド軸３１６ｂを介してアンローダ本体３１１の下面に取り付けられる。 The pressing block 316a is a portion that contacts unnecessary resin. The pressing block 316a is formed in a substantially rectangular parallelepiped shape. The pressing blocks 316a are provided on both left and right sides of the resin holding portion 313, respectively. The pressing block 316a is arranged so as to be positioned above the unnecessary resin (runner 10c in this embodiment). The pressing block 316a is attached to the lower surface of the unloader main body 311 via a guide shaft 316b, which will be described later.
　ガイド軸３１６ｂは、押圧ブロック３１６ａを上下に昇降可能となるように支持する部分である。ガイド軸３１６ｂの下端部は、押圧ブロック３１６ａに固定される。ガイド軸３１６ｂの上部は、アンローダ本体３１１の下面に挿入される。ガイド軸３１６ｂは、アンローダ本体３１１に対して上下に昇降可能となるように設けられている。またガイド軸３１６ｂは、適宜の方法でアンローダ本体３１１から脱落しないように設けられている。 The guide shaft 316b is a part that supports the pressing block 316a so that it can move up and down. The lower end of the guide shaft 316b is fixed to the pressing block 316a. The upper portion of the guide shaft 316b is inserted into the lower surface of the unloader main body 311. As shown in FIG. The guide shaft 316b is provided so as to be vertically movable with respect to the unloader main body 311. As shown in FIG. Also, the guide shaft 316b is provided by an appropriate method so as not to drop off from the unloader main body 311. As shown in FIG.
　なお、ガイド軸３１６ｂの構成はこれに限るものではなく、押圧ブロック３１６ａを上下に昇降可能に支持することが可能な構成であればよい。例えば、ガイド軸３１６ｂを伸縮可能な軸状の部材とすることも可能である。 It should be noted that the configuration of the guide shaft 316b is not limited to this, as long as it can support the pressing block 316a so that it can move up and down. For example, the guide shaft 316b can be an extendable shaft-shaped member.
　押圧スプリング３１６ｃは、押圧ブロック３１６ａを下方に向かって力を付与するものである。押圧スプリング３１６ｃは、圧縮コイルばねにより形成される。押圧スプリング３１６ｃは、ガイド軸３１６ｂに挿入され、アンローダ本体３１１と押圧ブロック３１６ａとの間に配置される。これによって押圧スプリング３１６ｃは、押圧ブロック３１６ａを下方に向かって常時力を付与することができる。 The pressing spring 316c applies downward force to the pressing block 316a. The pressing spring 316c is formed by a compression coil spring. The pressing spring 316c is inserted into the guide shaft 316b and arranged between the unloader main body 311 and the pressing block 316a. As a result, the pressing spring 316c can always apply downward force to the pressing block 316a.
　このように構成された押圧部３１６によって、樹脂保持部３１３によって保持された不要樹脂を下方に向かって押圧することができる。具体的には、図１０に示すように、樹脂保持部３１３によってカル１０ｂが吸着された状態において、押圧ブロック３１６ａがランナ１０ｃに上方から接触する。押圧ブロック３１６ａは、自重と押圧スプリング３１６ｃにより付与される力によってランナ１０ｃを下方に向かって押圧する。 The pressing portion 316 configured in this manner can press the unnecessary resin held by the resin holding portion 313 downward. Specifically, as shown in FIG. 10, in a state where the cull 10b is sucked by the resin holding portion 313, the pressing block 316a comes into contact with the runner 10c from above. The pressing block 316a presses the runner 10c downward by its own weight and the force applied by the pressing spring 316c.
　ここで、押圧部３１６がランナ１０ｃを下方に向かって押圧する力は、樹脂保持部３１３による保持力（吸着力）よりも小さくなるように設定されている。すなわち、樹脂保持部３１３がカル１０ｂを吸着している状態では、押圧部３１６の押圧力によってカル１０ｂ及びランナ１０ｃが樹脂保持部３１３から脱落することはない。従って、アンローダ３１０が成形型２１０からリードフレーム１０を搬出している途中で、不要樹脂がアンローダ３１０から意図せず脱落することはない。 Here, the force with which the pressing portion 316 presses the runner 10 c downward is set to be smaller than the holding force (adsorption force) of the resin holding portion 313 . That is, when the resin holding portion 313 is sucking the cull 10b, the cull 10b and the runner 10c will not come off from the resin holding portion 313 due to the pressing force of the pressing portion 316. FIG. Therefore, unnecessary resin does not fall off unintentionally from the unloader 310 while the unloader 310 is unloading the lead frame 10 from the molding die 210 .
　一方、アンローダ３１０によってリードフレーム１０が成形型２１０から搬出され、不要樹脂がアンローダ３１０から除去される際には、樹脂保持部３１３による吸着が停止される。また必要に応じて、樹脂保持部３１３（樹脂吸着パッド３１３ｂ）から空気が噴射される。この際、押圧部３１６が不要樹脂を下方に押圧しているため、不要樹脂に対して樹脂吸着パッド３１３ｂから離れるような力を加えることができ、樹脂保持部３１３から不要樹脂を速やかに脱落させることができる。 On the other hand, when the lead frame 10 is unloaded from the mold 210 by the unloader 310 and the unnecessary resin is removed from the unloader 310, the adsorption by the resin holding portion 313 is stopped. Also, if necessary, air is jetted from the resin holding portion 313 (resin suction pad 313b). At this time, since the pressing portion 316 presses the unnecessary resin downward, a force can be applied to the unnecessary resin so as to separate it from the resin adsorption pad 313 b , and the unnecessary resin is quickly removed from the resin holding portion 313 . be able to.
　このように、押圧部３１６によって不要樹脂を押圧することで、熱や材質等の影響で不要樹脂が樹脂吸着パッド３１３ｂに貼り付いている場合であっても、不要樹脂を脱落させ易くすることができる。特に、樹脂成形後に不要樹脂（カル１０ｂ及びランナ１０ｃ）と樹脂成形品（封止部１０ａ及びリードフレーム１０）とが分離している場合は、不要樹脂の重量が比較的軽いため、樹脂保持部３１３の吸着を停止させたとしても、不要樹脂が樹脂吸着パッド３１３ｂに張り付いて脱落しないことが想定される。しかし本実施形態のように押圧部３１６を設けることで、比較的軽い不要樹脂であっても、樹脂保持部３１３から容易に脱落させることができる。 By pressing the unnecessary resin with the pressing portion 316 in this way, even if the unnecessary resin sticks to the resin adsorption pad 313b due to the influence of heat, material, etc., the unnecessary resin can be easily removed. can. In particular, when the unnecessary resin (the cull 10b and the runner 10c) and the resin molded product (the sealing portion 10a and the lead frame 10) are separated after resin molding, the weight of the unnecessary resin is relatively light. Even if the adsorption of the resin adsorption pad 313 is stopped, it is assumed that the unnecessary resin sticks to the resin adsorption pad 313b and does not come off. However, by providing the pressing portion 316 as in the present embodiment, even relatively light unnecessary resin can be easily dropped from the resin holding portion 313 .
　以上のように、第三実施形態に係るアンローダ３１０は、前記樹脂保持部３１３によって保持された前記不要樹脂を下方に向かって押圧する押圧部３１６をさらに具備するものである。 As described above, the unloader 310 according to the third embodiment further includes the pressing portion 316 that presses the unnecessary resin held by the resin holding portion 313 downward.
　このように構成することにより、樹脂保持部３１３による不要樹脂の保持（吸着）が終了した際に、樹脂保持部３１３から不要樹脂を容易に脱落させることができる。 With this configuration, the unnecessary resin can be easily removed from the resin holding portion 313 when the holding (adsorption) of the unnecessary resin by the resin holding portion 313 is finished.
　以上、本発明の実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、特許請求の範囲に記載された発明の技術的思想の範囲内で適宜の変更が可能である。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and can be appropriately modified within the scope of the technical ideas of the invention described in the claims. .
　例えば、上記実施形態においては、トランスファーモールド法を利用した樹脂成形装置１（トランスファ方式の樹脂成形装置１）を例示したが、本発明はこれに限るものではなく、他の方式（例えば、コンプレッション方式等）を採用することも可能である。 For example, in the above embodiment, the resin molding apparatus 1 using the transfer molding method (transfer type resin molding apparatus 1) was illustrated, but the present invention is not limited to this, and other methods (for example, compression method) etc.) can also be adopted.
　また、上記実施形態の樹脂成形装置１に用いた構成要素（供給モジュール１００等）は一例であり、適宜着脱や交換することが可能である。例えば、樹脂成形モジュール２００の個数を変更することが可能である。また、本実施形態の樹脂成形装置１に用いた構成要素（供給モジュール１００等）の構成や動作は一例であり、適宜変更することが可能である。 In addition, the components (supply module 100, etc.) used in the resin molding apparatus 1 of the above embodiment are examples, and can be detached or replaced as appropriate. For example, it is possible to change the number of resin molding modules 200 . Also, the configuration and operation of the components (supply module 100, etc.) used in the resin molding apparatus 1 of the present embodiment are examples, and can be changed as appropriate.
　また、上記実施形態においては、タブレット状の樹脂材料（樹脂タブレットＴ）を用いる例を示したが、本発明はこれに限るものではない。すなわち、樹脂材料としては、タブレット状のものだけでなく、顆粒状、粉末状、液状など任意の形態のものを用いることが可能である。 Also, in the above embodiment, an example using a tablet-shaped resin material (resin tablet T) was shown, but the present invention is not limited to this. That is, as the resin material, it is possible to use not only a tablet-like material, but also an arbitrary form such as granular, powdery, and liquid.
　また、上記実施形態においては、搬送機構の一例として、成形型２１０から樹脂成形品を搬出するアンローダ３１０を示したが、本発明はこれに限るものではなく、種々の搬送機構に適用することが可能である。 In the above embodiment, the unloader 310 for unloading the resin molded product from the molding die 210 is shown as an example of the transport mechanism, but the present invention is not limited to this, and can be applied to various transport mechanisms. It is possible.
　また、上記実施形態においては、成形品保持部３１５として樹脂成形品を吸着して保持する構成を例示したが、本発明はこれに限るものではない。例えば、樹脂成形品を吸着することなく、クランパ３１２のみで保持することも可能である。この場合、樹脂成形品を適切に保持できるように、クランパ３１２の配置は適宜変更することができる。 Further, in the above-described embodiment, the molded article holding portion 315 is configured to adsorb and hold a resin molded article, but the present invention is not limited to this. For example, it is also possible to hold the resin molded product only with the clamper 312 without adsorbing it. In this case, the arrangement of the clamper 312 can be appropriately changed so that the resin molded product can be properly held.
　また、上記実施形態においては、樹脂保持部３１３に固定される戻しプレート３１４ｂを設けた例を示したが、本発明はこれに限るものではない。例えば、戻しプレート３１４ｂを樹脂保持部３１３と一体の部材で構成することも可能である。この場合、樹脂保持部３１３の昇降範囲を、ガイド用シャフト３１４ｃ（図６参照）やガイド用ボルト３１４ｆ（図９参照）によって規定することが可能である。 Also, in the above embodiment, an example in which the return plate 314b fixed to the resin holding portion 313 is provided has been shown, but the present invention is not limited to this. For example, it is possible to configure the return plate 314b with a member integrated with the resin holding portion 313 . In this case, the lifting range of the resin holding portion 313 can be defined by a guide shaft 314c (see FIG. 6) or a guide bolt 314f (see FIG. 9).
　また、上記実施形態においては、ガイド用シャフト３１４ｃ（図６参照）やガイド用ボルト３１４ｆ（図９参照）によって樹脂保持部３１３の昇降範囲を規定する例を示したが、本発明はこれに限るものではなく、その他適宜の部材で樹脂保持部３１３の昇降範囲を規定することが可能である。 Further, in the above-described embodiment, an example was shown in which the guide shaft 314c (see FIG. 6) and the guide bolt 314f (see FIG. 9) define the elevation range of the resin holding portion 313, but the present invention is limited to this. It is possible to define the lifting range of the resin holding portion 313 by other appropriate members instead of using a single member.
　また、上記実施形態においては、樹脂保持部３１３を下方に向かって力を付与する戻しスプリング３１４ｄを設けた例を示したが、本発明はこれに限るものではなく、戻しスプリング３１４ｄを設けない構成とすることも可能である。 In addition, in the above-described embodiment, an example in which the return spring 314d is provided to apply force downward to the resin holding portion 313 was shown, but the present invention is not limited to this, and a configuration in which the return spring 314d is not provided is shown. It is also possible to
　また、上記実施形態においては、複数の樹脂吸着パッド３１３ｂ（樹脂吸着管部３１３ａ）を樹脂吸着配管ブロック３１３ｃに固定することで、複数の樹脂吸着パッド３１３ｂが一体的に昇降する構成を例示したが、本発明はこれに限るものではない。例えば、複数の樹脂吸着パッド３１３ｂを１つずつ個別に昇降させる構成とすることも可能である。 Further, in the above-described embodiment, by fixing the plurality of resin adsorption pads 313b (resin adsorption pipe portion 313a) to the resin adsorption pipe block 313c, the configuration in which the plurality of resin adsorption pads 313b integrally move up and down has been illustrated. , the present invention is not limited to this. For example, a configuration is possible in which the plurality of resin suction pads 313b are individually raised and lowered one by one.
　また、上記実施形態（第二実施形態）においては、戻しスプリング３１４ｄにより付与される力を調整する調整部３１４ｅを例示したが、調整部３１４ｅの構成はこれに限るものではなく、戻しスプリング３１４ｄにより付与される力を調整可能な構成であれば、任意に変更することが可能である。 Further, in the above-described embodiment (second embodiment), the adjusting portion 314e for adjusting the force applied by the return spring 314d was illustrated, but the configuration of the adjusting portion 314e is not limited to this. Any configuration can be used as long as the applied force can be adjusted.
　また、上記実施形態（第三実施形態）においては、不要樹脂を下方に向かって押圧する押圧部３１６を例示したが、押圧部３１６の構成はこれに限るものではなく、不要樹脂を押圧可能な構成であれば、任意に変更することが可能である。 In addition, in the above embodiment (third embodiment), the pressing portion 316 that presses the unnecessary resin downward was exemplified, but the configuration of the pressing portion 316 is not limited to this, and the unnecessary resin can be pressed. The configuration can be changed arbitrarily.
　また、上記実施形態では、樹脂成形品を保持する成形品保持部３１５はアンローダ本体３１１に固定されるものとしたが、本発明はこれに限るものではない。例えば、成形品保持部３１５も樹脂保持部３１３と同様に上下に昇降可能な構成とすることも可能である。これによって、アンローダ３１０の汎用性をより向上させることができる。 Also, in the above embodiment, the molded article holding portion 315 that holds the resin molded article is fixed to the unloader main body 311, but the present invention is not limited to this. For example, the molded article holding portion 315 can also be configured to be vertically movable in the same manner as the resin holding portion 313 . This can further improve the versatility of the unloader 310 .
　１　　　　樹脂成形装置
　２１０　　成形型
　３１０　　アンローダ
　３１３　　樹脂保持部
　３１３ａ　樹脂吸着管部
　３１３ｂ　樹脂吸着パッド
　３１４　　昇降支持部
　３１４ｂ　戻しプレート
　３１４ｃ　ガイド用シャフト
　３１４ｄ　戻しスプリング
　３１４ｅ　調整部
　３１５　　成形品保持部
　３１７　　押圧部
 
  1 resin molding device 210 mold 310 unloader 313 resin holding part 313a resin adsorption tube part 313b resin adsorption pad 314 elevation support part 314b return plate 314c guide shaft 314d return spring 314e adjustment part 315 molded product holding part 317 pressing part

Claims (8)

  1. 　樹脂成形品を保持する成形品保持部と、
    　不要樹脂を保持する樹脂保持部と、
    　前記成形品保持部に対して相対的に上下に昇降可能となるように前記樹脂保持部を支持する昇降支持部と、
    　を具備する搬送機構。     a molded product holding part for holding a resin molded product;
    a resin holding portion for holding unnecessary resin;
    a lifting support portion that supports the resin holding portion so that it can be moved up and down relative to the molded product holding portion;
    A transport mechanism comprising:
  2. 　前記樹脂保持部は、
    　前記不要樹脂と接する吸着パッドと、
    　前記吸着パッドが取り付けられるパッド取付部と、
    　を具備し、
    　前記昇降支持部は、前記パッド取付部を上下に昇降可能となるように支持する、
    　請求項１に記載の搬送機構。     The resin holding portion is
    a suction pad in contact with the unnecessary resin;
    a pad attachment portion to which the suction pad is attached;
    and
    The lifting support part supports the pad mounting part so that it can be lifted up and down.
    A transport mechanism according to claim 1 .
  3. 　前記昇降支持部は、
    　前記パッド取付部と一体的に昇降可能な昇降部と、
    　前記昇降部の昇降範囲を規定する可動範囲規定部と、
    　を具備する、
    　請求項２に記載の搬送機構。     The elevating support section includes:
    an elevating section that can be elevated integrally with the pad mounting section;
    a movable range defining portion that defines the lifting range of the lifting portion;
    comprising a
    3. A transport mechanism according to claim 2.
  4. 　前記昇降支持部は、前記樹脂保持部を下方に向かって力を付与する付与部をさらに具備する、
    　請求項１から請求項３までのいずれか一項に記載の搬送機構。     The elevating support section further includes an applying section that applies a downward force to the resin holding section.
    A transport mechanism according to any one of claims 1 to 3.
  5. 　前記昇降支持部は、前記付与部により付与される力を調整することが可能な調整部をさらに具備する、
    　請求項４に記載の搬送機構。     The lifting support section further comprises an adjusting section capable of adjusting the force applied by the applying section.
    5. A transport mechanism according to claim 4.
  6. 　前記樹脂保持部によって保持された前記不要樹脂を下方に向かって押圧する押圧部をさらに具備する、
    　請求項１から請求項５までのいずれか一項に記載の搬送機構。     further comprising a pressing portion that presses downward the unnecessary resin held by the resin holding portion;
    A transport mechanism according to any one of claims 1 to 5.
  7. 　成形対象物を樹脂成形することにより前記樹脂成形品を得る成形型と、
    　前記成形型によって樹脂成形された前記樹脂成形品を搬送する請求項１から請求項６までのいずれか一項に記載の搬送機構と、
    　を具備する樹脂成形装置。     a mold for obtaining the resin molded product by resin-molding an object to be molded;
    The transport mechanism according to any one of claims 1 to 6, which transports the resin molded product resin-molded by the molding die;
    A resin molding device comprising:
  8. 　請求項７に記載の樹脂成形装置を用いて樹脂成形品を製造する、
    　樹脂成形品の製造方法。
     
          Manufacturing a resin molded product using the resin molding apparatus according to claim 7,
    A method for manufacturing a resin molded product.
PCT/JP2021/046928 2021-02-09 2021-12-20 Transport mechanism, resin molding device, and method for producing resin molded article WO2022172592A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07205218A (en) * 1994-01-17 1995-08-08 Hitachi Ltd Molded form separating apparatus
JPH0936156A (en) * 1995-07-25 1997-02-07 Mitsubishi Electric Corp Gate break device and method
JP2020062857A (en) * 2018-10-19 2020-04-23 Ｔｏｗａ株式会社 Transfer device, resin molding equipment, conveyance method, and manufacturing method of resin molded products

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7068094B2 (en) 2018-08-10 2022-05-16 アピックヤマダ株式会社 Work transfer device, resin transfer device and resin molding method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07205218A (en) * 1994-01-17 1995-08-08 Hitachi Ltd Molded form separating apparatus
JPH0936156A (en) * 1995-07-25 1997-02-07 Mitsubishi Electric Corp Gate break device and method
JP2020062857A (en) * 2018-10-19 2020-04-23 Ｔｏｗａ株式会社 Transfer device, resin molding equipment, conveyance method, and manufacturing method of resin molded products

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