WO2022168268A1 - Procédé de génération d'informations de trajet de traitement - Google Patents

Procédé de génération d'informations de trajet de traitement Download PDF

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Publication number
WO2022168268A1
WO2022168268A1 PCT/JP2021/004346 JP2021004346W WO2022168268A1 WO 2022168268 A1 WO2022168268 A1 WO 2022168268A1 JP 2021004346 W JP2021004346 W JP 2021004346W WO 2022168268 A1 WO2022168268 A1 WO 2022168268A1
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WIPO (PCT)
Prior art keywords
information
machining
path information
processing
machining path
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PCT/JP2021/004346
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English (en)
Japanese (ja)
Inventor
和樹 上野
元英 石川
浩一 安葉
慧 関口
アツコ 増田
ふみ香 志岐
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株式会社ニコン
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Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to PCT/JP2021/004346 priority Critical patent/WO2022168268A1/fr
Publication of WO2022168268A1 publication Critical patent/WO2022168268A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing

Definitions

  • the present invention for example, relates to the technical field of machining path information generation methods capable of generating machining paths for shaping an object.
  • Patent Document 1 An example of a processing system that shapes an object is described in Patent Document 1.
  • One of the technical challenges of such processing systems is to reduce defects in the shaped objects.
  • processing path information for modeling an object by a 3D printer is generated, and based on the processing path information, the 3D printer models the object. Determining whether or not a void that is a defect occurs in the object in a case, and if it is determined that the void that is a defect occurs in the object, information about the void is provided together with model information based on the 3D model data. and displaying.
  • processing path information for modeling an object by a 3D printer is generated, and based on the processing path information, the 3D printer models the object. Determining whether or not a void that is a defect occurs in the object in a case where it is determined that the void that is a defect occurs in the object, and information about the void together with model information based on the machining path information when it is determined that the void that is a defect occurs in the object. and displaying.
  • processing path information for modeling an object by a 3D printer is generated; and based on the processing path information, the 3D printer models the object. and modifying the machining path information when it is determined that the object will have a gap. .
  • FIG. 1 is a block diagram showing the configuration of the processing system of this embodiment.
  • FIG. 2 is a cross-sectional view showing the structure of the processing apparatus of this embodiment.
  • FIG. 3 is a system configuration diagram showing the system configuration of the processing apparatus of this embodiment.
  • FIGS. 4A to 4E is a cross-sectional view showing a state in which a certain region on the workpiece is irradiated with the shaping light and the shaping material is supplied.
  • FIGS. 5(a) to 5(c) is a cross-sectional view showing the process of forming a three-dimensional structure.
  • FIG. 6 is a block diagram showing the configuration of the machining path generation device of this embodiment.
  • FIG. 7 is a flow chart showing the flow of operations performed by the machining path generation device.
  • FIG. 1 is a block diagram showing the configuration of the processing system of this embodiment.
  • FIG. 2 is a cross-sectional view showing the structure of the processing apparatus of this embodiment.
  • FIG. 3 is a system configuration diagram
  • FIG. 8(a) is a perspective view showing an example of a three-dimensional structure formed by a processing apparatus, and FIG. 8(b) shows a model for forming the three-dimensional structure shown in FIG. 8(a).
  • 8(c) is a plan view showing a processing path for forming the plurality of structural layers shown in FIG. 8(b);
  • FIG. 9(a) is a plan view showing partial machining paths extending along the X-axis direction, and
  • FIG. 9(b) is a modeled object formed based on the partial machining paths shown in FIG. 9(a). It is a sectional view showing.
  • FIG. 9(a) is a perspective view showing an example of a three-dimensional structure formed by a processing apparatus
  • FIG. 8(b) shows a model for forming the three-dimensional structure shown in FIG. 8(a).
  • 8(c) is a plan view showing a processing path for forming the plurality of structural layers shown in FIG. 8(b);
  • FIG. 10 schematically shows a modeled object formed based on a plurality of partial machining passes adjacent to each other at relatively narrow intervals, together with the plurality of partial machining passes.
  • FIG. 11 schematically shows a modeled object that is formed based on a plurality of partial machining passes adjacent to each other at relatively wide intervals, together with the plurality of partial machining passes.
  • FIG. 12 schematically shows a modeled object in which a plurality of openings are formed, together with a plurality of partial processing passes for forming the modeled object.
  • FIG. 13 schematically shows a modeled object with a plurality of openings, along with a plurality of partial processing passes for forming the modeled object.
  • FIG. 14 schematically shows a modeled object with a plurality of openings, along with a plurality of partial processing passes for forming the modeled object.
  • FIG. 15 schematically shows a modeled object that is formed based on a plurality of partial machining paths that intersect each other, together with the plurality of partial machining paths.
  • FIG. 16 shows an example of the display screen of the display device.
  • FIG. 17 shows an example of the display screen of the display device.
  • FIG. 18 shows an example of the display screen of the display device.
  • FIG. 19 schematically shows modified machining path information together with a modeled object that is shaped based on the modified machining path information.
  • FIG. 20 schematically shows corrected machining path information together with a modeled object that is shaped based on the corrected machining path information.
  • FIG. 21 shows an example of a display screen of a display device.
  • FIG. 22 is a block diagram showing the configuration of the processing system in the first modified example.
  • FIG. 23 is a flow chart showing the flow of operations performed by the processing system in the first modified example.
  • FIG. 24 is a block diagram showing the configuration of a machining path generation device in the second modified example.
  • FIG. 25 is a block diagram showing the configuration of a processing device in the third modified example.
  • FIG. 26 is a flow chart showing the flow of operations performed by the processing system in the third modified example.
  • Embodiments of a machining path information generation method, a machining information generation method, an information processing device, a computer program, and a recording medium will be described below with reference to the drawings.
  • Embodiments of a machining path information generating method, a machining information generating method, an information processing apparatus, a computer program, and a recording medium will be described below using the machining system SYS.
  • FIG. 1 is a block diagram showing the overall configuration of the machining system SYS.
  • the machining system SYS comprises a machining device 1 and a machining path generation device 2 .
  • the machining device 1 and the machining path generation device 2 can communicate via a communication network 3 including at least one of a wired communication network and a wireless communication network.
  • the processing device 1 is a device capable of modeling (in other words, forming) a three-dimensional structure ST, which is an object having a size in any three-dimensional direction. That is, the processing device 1 is a device capable of performing a processing operation (modeling operation) for molding the three-dimensional structure ST. For this reason, the processing device 1 may be called a modeling device. Similarly, the processing system SYS may be referred to as a modeling system.
  • the machining path generation device 2 is a device (for example, an information processing device) capable of generating machining path information PI, which is control information for the processing device 1 to shape the three-dimensional structure ST.
  • the machining pass information PI will be described in detail later.
  • the machining path generation device 2 transmits (that is, outputs) the generated machining path information PI to the processing device 1 via the communication network 3 .
  • the processing device 1 receives (that is, acquires) the processing path information PI transmitted from the processing path generation device 2 via the communication network 3 .
  • the processing device 1 performs a processing operation for forming the three-dimensional structure ST based on the acquired processing path information PI.
  • FIG. 2 is a cross-sectional view showing an example of the structure of the processing device 1 of this embodiment.
  • FIG. 3 is a system configuration diagram showing an example of the system configuration of the processing apparatus 1 of this embodiment.
  • each of the X-axis direction and the Y-axis direction is the horizontal direction (that is, a predetermined direction in the horizontal plane), and the Z-axis direction is the vertical direction (that is, the direction perpendicular to the horizontal plane). and substantially in the vertical direction or the gravitational direction).
  • the directions of rotation (in other words, tilt directions) about the X-, Y-, and Z-axes are referred to as the .theta.X direction, the .theta.Y direction, and the .theta.Z direction, respectively.
  • the Z-axis direction may be the direction of gravity.
  • the XY plane may be set horizontally.
  • the processing device 1 is capable of performing processing operations for modeling (that is, forming) the three-dimensional structure ST.
  • the three-dimensional structure ST is a three-dimensional object that has dimensions in all three-dimensional directions (for example, an object that has dimensions in the X-axis, Y-axis, and Z-axis directions).
  • the processing apparatus 1 can form a three-dimensional structure ST on a workpiece W that serves as a base (that is, a base material) for forming the three-dimensional structure ST.
  • the work W is a stage 131 to be described later
  • the processing device 1 can form the three-dimensional structure ST on the stage 131 .
  • the processing device 1 may be capable of forming the three-dimensional structure ST on the existing structure.
  • the processing device 1 may form the three-dimensional structure ST integrated with the existing structure (that is, the work W).
  • the operation of modeling the three-dimensional structure ST integrated with the existing structure may be considered equivalent to the operation of adding a new structure to the existing structure.
  • the existing structure may be, for example, a defective part requiring repair.
  • the processing device 1 may form the three-dimensional structure ST on the repair required item so as to fill the defective portion of the repair required item.
  • the processing device 1 may form a three-dimensional structure ST separable from the existing structure.
  • FIG. 2 shows an example in which the work W is an existing structure held by the stage 131 . Also, the description will be made below using an example in which the work W is an existing structure held by the stage 131 .
  • the processing apparatus 1 is an apparatus capable of forming the three-dimensional structure ST by performing additional processing (additional modeling) conforming to the laser build-up welding method.
  • the processing device 1 can also be said to be a 3D printer that forms an object using a layered manufacturing technique.
  • the layered manufacturing technology may also be referred to as rapid prototyping, rapid manufacturing, or additive manufacturing.
  • Laser Overlay Welding includes Direct Metal Deposition, Direct Energy Deposition, Laser Cladding, Laser Engineered Net Shaping, Direct Light Fabrication, Laser Consolidation, Shape ⁇ Deposition manufacturing, wire-feed laser deposition, gas through wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, It may also be referred to as laser powder deposition, laser additive manufacturing, laser rapid forming.
  • the processing device 1 forms a three-dimensional structure ST by processing the modeling material M with the processing light EL.
  • the modeling material M is a material that can be melted by irradiation with processing light EL having a predetermined intensity or more.
  • a modeling material M for example, at least one of a metallic material and a resinous material can be used.
  • the modeling material M other materials different from the metallic material and the resinous material may be used.
  • the building material M is a powdery or granular material. That is, the modeling material M is a granular material. However, the modeling material M does not have to be granular.
  • the modeling material M at least one of a wire-like modeling material and a gaseous modeling material may be used.
  • a housing 16 In order to form the three-dimensional structure ST, as shown in FIGS. , a housing 16 , a control device 17 , and a communication device 18 . At least part of each of the processing unit 12 and the stage unit 13 is accommodated within the chamber space 163 IN inside the housing 16 .
  • the material supply source 11 supplies the modeling material M to the processing unit 12 .
  • the material supply source 11 supplies a desired amount of modeling material M according to the required amount so that the required amount of modeling material M is supplied to the processing unit 12 per unit time in order to model the three-dimensional structure ST. Supply material M.
  • the processing unit 12 processes the modeling material M supplied from the material supply source 11 to model the three-dimensional structure ST.
  • the processing unit 12 includes a processing head 121 and a head drive system 122 to form the three-dimensional structure ST.
  • the processing head 121 includes an irradiation optical system 1211 capable of emitting processing light EL, and a material nozzle 1212 capable of supplying the modeling material M.
  • the machining head 121 and the head drive system 122 are accommodated within the chamber space 163IN.
  • at least a part of the processing head 121 and the head driving system 122 may be arranged in an external space 164OUT, which is a space outside the housing 16 .
  • the external space 164OUT may be a space that an operator of the processing apparatus 1 can enter.
  • the irradiation optical system 1211 is an optical system (for example, a condensing optical system) for emitting the processing light EL. Specifically, the irradiation optical system 1211 is optically connected to the light source 14 that emits the processing light EL via an optical transmission member 141 such as an optical fiber or a light pipe. The irradiation optical system 211 emits processing light EL propagating from the light source 14 via the light transmission member 141 . The irradiation optical system 1211 emits processing light EL downward (that is, to the -Z side) from the irradiation optical system 1211 . A stage 131 is arranged below the irradiation optical system 1211 .
  • the irradiation optical system 1211 irradiates the work W with the processing light EL, which is an energy beam. Specifically, the irradiation optical system 1211 processes the target irradiation area EA set on the workpiece W or in the vicinity of the workpiece W as an area irradiated (typically, condensed) with the processing light EL. Light EL can be irradiated.
  • the state of the irradiation optical system 1211 can be switched between a state in which the target irradiation area EA is irradiated with the processing light EL and a state in which the target irradiation area EA is not irradiated with the processing light EL under the control of the control device 17. is.
  • the direction of the processing light EL emitted from the irradiation optical system 1211 is not limited to directly below (that is, coinciding with the -Z-axis direction). good too.
  • the material nozzle 1212 supplies (for example, injects, jets, ejects, or sprays) the modeling material M from the supply outlet.
  • the material nozzle 1212 is physically connected to the material supply source 11 which is the supply source of the modeling material M via the supply pipe 111 and the mixing device 112 .
  • the material nozzle 1212 supplies the modeling material M supplied from the material supply source 11 through the supply pipe 111 and the mixing device 112 .
  • the material nozzle 1212 may pump the modeling material M supplied from the material supply source 11 through the supply pipe 111 .
  • the modeling material M from the material supply source 11 and the gas for transportation (that is, pressure-fed gas, for example, an inert gas such as nitrogen or argon) are mixed in the mixing device 112 and then passed through the supply pipe 111. may be pumped to the material nozzle 1212 via.
  • the material nozzle 1212 supplies the modeling material M with the gas for conveyance.
  • a purge gas supplied from the gas supply device 15 is used as the carrier gas.
  • gas supplied from a gas supply device different from the gas supply device 15 may be used as the transport gas.
  • the material nozzle 1212 is drawn in a tubular shape in FIG. 2, the shape of the material nozzle 1212 is not limited to this shape.
  • the material nozzle 1212 supplies the modeling material M downward (that is, to the ⁇ Z side) from the material nozzle 1212 .
  • a stage 131 is arranged below the material nozzle 1212 .
  • the material nozzle 1212 supplies the modeling material M toward the work W or the vicinity of the work W.
  • the traveling direction of the modeling material M supplied from the material nozzle 1212 is a direction inclined by a predetermined angle (an acute angle as an example) with respect to the Z-axis direction. good.
  • the material nozzle 1212 supplies the modeling material M to the target irradiation area EA where the irradiation optical system 1211 irradiates the processing light EL. Therefore, the target supply area MA set on or near the work W as the area where the material nozzle 1212 supplies the modeling material M matches (or at least partially overlaps) the target irradiation area EA. ), the material nozzle 1212 and the irradiation optics 1211 are aligned. In addition, the material nozzle 1212 may supply the modeling material M to the molten pool MP (see FIG. 4 and the like described later) formed by the processing light EL emitted from the irradiation optical system 1211 .
  • the material nozzle 1212 does not have to supply the modeling material M to the molten pool MP.
  • the processing system SYS may melt the modeling material M from the material nozzle 1212 before it reaches the workpiece W by the irradiation optical system 1211, and attach the molten modeling material M to the workpiece W. .
  • the head drive system 122 moves (that is, moves) the processing head 121 .
  • the head drive system 122 moves the processing head 121 along at least one of the X axis, Y axis, Z axis, ⁇ X direction, ⁇ Y direction, and ⁇ Z direction, for example.
  • the head drive system 122 moves the processing head 121
  • the relative positions of the processing head 121 and the stage 131 and the workpiece W placed on the stage 131 change.
  • the target irradiation area EA and the target supply area MA and the molten pool MP
  • the stage unit 13 has a stage 131 .
  • the stage 131 is housed in the chamber space 163IN.
  • a workpiece W can be placed on the stage 131 .
  • the stage 131 may be capable of holding the work W placed on the stage 131 .
  • the stage 131 may have at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, and the like to hold the work W.
  • the stage 131 may not be able to hold the work W placed on the stage 131 .
  • the workpiece W may be placed on the stage 131 without clamping.
  • the stage drive system 132 moves the stage 131 .
  • the stage drive system 132 moves the stage 131 along at least one of the X-axis, Y-axis, Z-axis, ⁇ X direction, ⁇ Y direction, and ⁇ Z direction.
  • the stage drive system 132 moves the stage 131, the relative position between the processing head 121 and the stage 131 (and the workpiece W placed on the stage 131) changes.
  • the target irradiation area EA and the target supply area MA (furthermore, the molten pool MP) move relative to the workpiece W.
  • the light source 14 emits, for example, at least one of infrared light, visible light, and ultraviolet light as processing light EL.
  • the processing light EL may include a plurality of pulsed lights (that is, a plurality of pulsed beams).
  • the processing light EL may include continuous light (CW: Continuous Wave).
  • the processing light EL may be laser light.
  • the light source 14 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD).
  • the laser light source may be a fiber laser, a CO2 laser, a YAG laser, an excimer laser, or the like) However, the processing light EL may not be laser light.
  • the light source 14 may include at least one of an arbitrary light source (for example, an LED (Light Emitting Diode), a discharge lamp, etc.).
  • the irradiation optical system 1211 is optically connected to the light source 14 via an optical transmission member 141 including at least one of an optical fiber and a light pipe. emits the processing light EL propagating from the light source 14 via the light transmission member 141 .
  • the gas supply device 15 is a supply source of purge gas for purging the chamber space 163IN.
  • the purge gas contains inert gas. Examples of inert gas include at least one of nitrogen gas and argon gas.
  • the gas supply device 15 is connected to the chamber space 163 IN via a supply port 162 formed in a partition member 161 of the housing 16 and a supply pipe 151 connecting the gas supply device 15 and the supply port 162 .
  • the gas supply device 15 supplies purge gas to the chamber space 163 IN through the supply pipe 151 and the supply port 162 . As a result, the chamber space 163IN becomes a space purged with the purge gas.
  • the purge gas supplied to the chamber space 163IN may be discharged from a discharge port (not shown) formed in the partition member 161 .
  • the gas supply device 15 may be a cylinder containing an inert gas.
  • the inert gas is nitrogen gas
  • the gas supply device 15 may be a nitrogen gas generator that generates nitrogen gas using the atmosphere as a raw material.
  • the gas supply device 15 may supply purge gas to the mixing device 112 to which the modeling material M from the material supply source 11 is supplied in addition to the chamber space 163IN.
  • the gas supply device 15 may be connected to the mixing device 112 via a supply pipe 152 that connects the gas supply device 15 and the mixing device 112 .
  • the gas supply device 15 supplies purge gas to the mixing device 112 via the supply pipe 152 .
  • the molding material M from the material supply source 11 is supplied through the supply pipe 111 toward the material nozzle 1212 (specifically , pumped).
  • the material nozzle 1212 will supply the building material M together with the purge gas for pumping the building material M from the supply outlet.
  • the housing 16 is a housing device that houses at least a part of each of the processing unit 12 and the stage unit 13 in a chamber space 163IN that is an internal space of the housing 16 .
  • the housing 16 includes a partition member 161 that defines a chamber space 163IN.
  • the partition member 161 is a member that separates the chamber space 163 IN and the external space 164 OUT of the housing 16 . In this case, the space surrounded by the partition member 161 becomes the chamber space 163IN.
  • the partition member 161 may be provided with a door that can be opened and closed. This door may be opened when the workpiece W is placed on the stage 131 . The door may be opened when the workpiece W and/or the three-dimensional structure ST is taken out from the stage 131. The door may be closed during periods when machining operations are being performed.
  • An observation window (not shown) for visually recognizing the chamber space 163IN from the external space 164OUT of the housing 16 may be formed in the partition member 161 .
  • the control device 17 controls the operation of the processing device 1.
  • the control device 17 may control the operation of the processing device 1 to shape the three-dimensional structure ST based on the processing path information PI transmitted from the processing path generation device 2 .
  • the control device 17 may include, for example, an arithmetic device and a storage device.
  • the computing device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit).
  • a storage device may include, for example, memory.
  • the control device 17 functions as a device that controls the operation of the processing device 1 as the arithmetic device executes a computer program.
  • This computer program is a computer program for causing the arithmetic device to perform (that is, to execute) an operation to be performed by the control device 17, which will be described later. That is, this computer program is a computer program for causing the control device 17 to function so as to cause the processing device 1 to perform the operation described later.
  • the computer program executed by the arithmetic device may be recorded in a storage device (that is, a recording medium) included in the control device 17, or may be stored in the control device 17 or may be externally attached to the control device 17. It may be recorded on a medium (for example, hard disk or semiconductor memory). Alternatively, the arithmetic device 21 may download the computer program to be executed from a device external to the control device 17 via the communication device 18 .
  • a storage device that is, a recording medium
  • the arithmetic device 21 may download the computer program to be executed from a device external to the control device 17 via the communication device 18 .
  • the control device 17 does not have to be provided inside the processing device 1 .
  • the control device 17 may be provided outside the processing device 1 as a server such as a cloud server.
  • the control device 17 may be integrated with the machining path generation device 2 .
  • the control device 17 and the processing device 1 may be connected by a wired and/or wireless network (for example, the communication network 4, or a data bus and/or communication line).
  • a wired network a network using a serial bus interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used.
  • a network using a parallel bus interface may be used as the wired network.
  • a network using an Ethernet (registered trademark) interface represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used.
  • a network using radio waves may be used as the wireless network.
  • An example of a network using radio waves is a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)).
  • a network using infrared rays may be used as the wireless network.
  • a network using optical communication may be used as the wireless network.
  • the control device 17 and the processing device 1 may be configured to be able to transmit and receive various information via the communication network 3 or the like.
  • control device 17 may be capable of transmitting information such as commands and control parameters to the processing device 1 via the communication network 3 or the like.
  • the communication device 18 included in the processing device 1 may function as a receiving device that receives information such as commands and control parameters from the control device 17 via the communication network 3 or the like.
  • the communication device 18 included in the processing apparatus 1 may function as a transmission device that transmits information such as commands and control parameters to the control device 17 via the communication network 3 or the like.
  • a first control device that performs part of the processing performed by the control device 17 is provided inside the processing device 1, while a second control device that performs another part of the processing performed by the control device 17 is provided.
  • the control device may be provided outside the processing device 1 .
  • part of the processing performed by the control device 17 may be performed by the machining path generation device 2 .
  • the control device 17 may use AI (artificial intelligence) to control the processing system SYS.
  • AI artificial intelligence
  • the control device 17 may execute a computer program to implement logical functional blocks using AI (artificial intelligence) within the control device 17 .
  • AI in the present embodiment may mean a learnable or learned computational model (hereinafter referred to as "learning model").
  • An example of a learning model is a computational model including a neural network.
  • a learning model may be learned (ie, constructed) by machine learning.
  • Recording media for recording computer programs executed by the control device 17 include CD-ROMs, CD-Rs, CD-RWs, flexible disks, MOs, DVD-ROMs, DVD-RAMs, DVD-Rs, DVD+Rs, and DVDs.
  • optical discs such as RW, DVD+RW and Blu-ray (registered trademark)
  • magnetic media such as magnetic tapes
  • magneto-optical discs semiconductor memories such as USB memories
  • the recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which the computer program is implemented in at least one form of software, firmware, etc.).
  • each process and function included in the computer program may be realized by a logical processing block realized in the control device 17 by the control device 17 (that is, computer) executing the computer program, It may be implemented by hardware such as a predetermined gate array (FPGA, ASIC) provided in the control device 17, or a mixture of logical processing blocks and partial hardware modules that implement some hardware elements. It can be implemented in the form of
  • the communication device 18 can communicate with the machining path generation device 2 via the communication network 3.
  • the communication device 18 can receive the machining path information PI generated by the machining path generation device 2 from the machining path generation device 2 .
  • processing apparatus 1 performs processing operations (additional processing operations in the present embodiment) for modeling the three-dimensional structure ST. For this reason, below, processing operation is explained as operation which processing device 1 performs.
  • the processing apparatus 1 performs processing operations for forming the three-dimensional structure ST by performing additional processing on the workpiece W.
  • FIG. Specifically, the processing apparatus 1 forms the three-dimensional structure ST using a laser build-up welding method. Therefore, the processing apparatus 1 may form the three-dimensional structure ST by performing an existing additional processing operation based on the laser build-up welding method.
  • An example of the processing operation for forming the three-dimensional structure ST using the laser build-up welding method will be briefly described below.
  • the processing apparatus 1 sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction.
  • structural layers layered partial structures
  • the processing apparatus 1 sequentially forms a plurality of structural layers SL obtained by slicing the three-dimensional structure ST along the Z-axis direction one by one.
  • a three-dimensional structure ST which is a laminated structure in which a plurality of structural layers SL are laminated, is formed.
  • the flow of operations for modeling the three-dimensional structure ST by sequentially modeling the plurality of structural layers SL one by one will be described below.
  • the processing apparatus 1 controls the processing head so that the target irradiation area EA is set in a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the structural layer SL that has been modeled. At least one of 121 and stage 131 is moved. After that, the processing apparatus 1 irradiates the target irradiation area EA with the processing light EL from the irradiation optical system 1211 . At this time, the condensing surface on which the processing light EL is condensed in the Z-axis direction may coincide with the modeling surface MS.
  • the condensing surface may be off the modeling surface MS in the Z-axis direction.
  • a molten pool that is, a pool of metal or the like melted by the processing light EL
  • the processing device 1 supplies the modeling material M from the material nozzle 1212 under the control of the control device 17 .
  • the modeling material M is supplied to the molten pool MP.
  • the modeling material M supplied to the molten pool MP is melted by the processing light EL irradiated to the molten pool MP.
  • the modeling material M supplied from the material nozzle 1212 may be melted by the processing light EL before reaching the molten pool MP, and the molten modeling material M may be supplied to the molten pool MP.
  • the modeling material M melted in the molten pool MP is cooled and solidified (that is, solidified).
  • solidified that is, solidified
  • the processing apparatus 1 performs a series of operations including forming the molten pool MP by irradiating the processing light EL, supplying the modeling material M to the molten pool MP, melting the supplied modeling material M, and solidifying the molten modeling material M. is repeated while moving the machining head 121 along at least one of the X-axis direction and the Y-axis direction with respect to the modeling surface MS, as shown in FIG. 4(d). At this time, the processing device 1 irradiates the processing light EL to a region on the modeling surface MS where the object is desired to be modeled, but does not irradiate a region on the modeling surface MS where the object is not desired to be modeled with the processing light EL.
  • the processing apparatus 1 moves the target irradiation area EA along the predetermined movement path on the modeling surface MS, and irradiates the processing light EL on the modeling surface MS at a timing corresponding to the distribution of the area where the object is desired to be modeled. to irradiate.
  • the movement path of the target irradiation area EA on the modeling surface MS (particularly, the movement path of the irradiation position irradiated with the processing light EL) is the machining path P (in other words, the tool path, shown in FIG. 8C described later). reference).
  • the machining pass information PI may include information on this machining pass P. FIG. Therefore, based on the processing path information PI, the processing apparatus 1 moves the target irradiation area EA along a predetermined movement path on the modeling surface MS, and adjusts the distribution of the area where the object is desired to be modeled.
  • the molding surface MS is irradiated with the processing light EL at the timing.
  • the processing path P is the processing position where the processing device 1 performs the additional processing on the modeling surface MS (that is, the processing performed by the processing device 1).
  • position and may mean a movement path of a modeling position where the processing apparatus 1 models a modeled object.
  • the molten pool MP also moves on the molding surface MS along the movement path corresponding to the movement path of the target irradiation area EA.
  • the molten pool MP is sequentially formed in a portion irradiated with the processing light EL in the area along the moving path of the target irradiation area EA on the modeling surface MS.
  • a structure layer SL corresponding to a modeled object which is an aggregate of the modeling material M solidified after being melted, is modeled on the modeling surface MS.
  • the structural layer SL corresponds to an assembly of objects formed on the modeling surface MS in a pattern corresponding to the moving path of the molten pool MP (that is, in a plan view, the structure layer SL has a shape corresponding to the moving path of the molten pool MP).
  • a structural layer SL) having a shape is formed.
  • the processing apparatus 1 supplies the modeling material M to the target irradiation area EA, and also supplies the processing light with an intensity that cannot form the molten pool MP.
  • the target irradiation area EA may be irradiated with EL.
  • the processing device 1 repeatedly performs the operation for forming such a structure layer SL under the control of the control device 17 based on the processing pass information PI. Specifically, first, the processing apparatus 1 performs an operation for forming the first structural layer SL#1 on the forming surface MS corresponding to the surface of the work W, according to the processing path information PI (particularly, the structural layer information on the machining pass P for modeling SL#1). As a result, the structural layer SL#1 is modeled on the modeling surface MS as shown in FIG. 5(a). After that, the processing apparatus 1 sets the surface (that is, the upper surface) of the structural layer SL#1 as a new modeling surface MS, and forms the second structural layer SL#2 on the new modeling surface MS. do.
  • the controller 17 In order to shape the structural layer SL#2, the controller 17 first activates at least one of the head drive system 122 and the stage drive system 132 so that the processing head 121 moves along the Z-axis with respect to the stage 131. Control. Specifically, the control device 17 controls at least one of the head drive system 122 and the stage drive system 132 to set the target irradiation area EA to the surface of the structure layer SL#1 (that is, the new modeling surface MS).
  • the processing head 121 is moved toward the +Z side and/or the stage 131 is moved toward the -Z side so that
  • the processing apparatus 1 performs processing path information PI (in particular, information on the processing path P corresponding to the structure layer SL#2) in the same operation as the operation for modeling the structure layer SL#1.
  • the structural layer SL#2 is formed on the structural layer SL#1.
  • the structural layer SL#2 is formed as shown in FIG. 5(b).
  • similar operations are repeated until all structural layers SL constituting the three-dimensional structure ST to be modeled on the workpiece W are modeled.
  • FIG. 5(c) a three-dimensional structure ST is formed by a laminated structure in which a plurality of structural layers SL are laminated.
  • FIG. 6 is a block diagram showing the configuration of the machining path generation device 2. As shown in FIG.
  • the machining path generation device 2 includes an arithmetic device 21, a storage device 22, and a communication device 23. Furthermore, the machining path generation device 2 may comprise an input device 24 and a display device 25 . However, the machining path generation device 2 does not have to include at least one of the input device 24 and the display device 25 . Arithmetic device 21 , storage device 22 , communication device 23 , input device 24 , and display device 25 may be connected via data bus 26 .
  • the computing device 21 includes, for example, at least one of a CPU and a GPU. Arithmetic device 21 reads a computer program. For example, arithmetic device 21 may read a computer program stored in storage device 22 . For example, the computing device 21 may read a computer program stored in a computer-readable non-temporary recording medium using a recording medium reading device (not shown). The computing device 21 may acquire (that is, download or read) a computer program from a device (not shown) arranged outside the machining path generation device 2 via the communication device 23 . Arithmetic device 21 executes the read computer program.
  • a logical functional block for executing the operation for example, the operation of generating machining path information PI
  • the arithmetic device 21 can function as a controller for realizing logical functional blocks for executing the operations that the machining path generation device 2 should perform.
  • FIG. 6 shows an example of logical functional blocks implemented within the arithmetic unit 21 to generate the machining path information PI.
  • the arithmetic unit 21 includes a path generation unit 211, which may be called a generation device, a defect determination unit 212, which may be called a determination device, and a display control device.
  • a good display control unit 213 and a path correction unit 214, which may be called a correction device, are implemented.
  • the operations of the path generation unit 211, the defect determination unit 212, the display control unit 213, and the path correction unit 214 will be described in detail later, but the outline thereof will be briefly described here.
  • the path generation unit 211 generates processing path information PI for forming the three-dimensional structure ST based on 3D model data representing a 3D model (three-dimensional model) of the three-dimensional structure ST to be formed by the processing apparatus 1.
  • the defect determination unit 212 determines whether or not a defect will occur in the three-dimensional structure ST when the processing apparatus 1 forms the three-dimensional structure ST based on the processing path information PI generated by the path generation unit 211. do.
  • the display control unit 213 controls the display device 25 to display information about the defect when the defect determination unit 212 determines that the three-dimensional structure ST has a defect.
  • the path correction section 214 corrects the machining path information PI generated by the path generation section 211 based on the determination result of the defect determination section 212 . Typically, the path correction section 214 corrects the machining path information PI generated by the path generation section 211 when the defect determination section 212 determines that a defect occurs in the three-dimensional structure ST.
  • part of the logical functional blocks realized within the arithmetic device 21 for generating the machining path information PI may be realized by AI (artificial intelligence).
  • AI artificial intelligence
  • some of the logical functional blocks implemented in the arithmetic unit 21 to generate the machining path information PI may be functional blocks using AI (artificial intelligence).
  • the path generation unit 211 may generate the machining path information PI using AI.
  • the defect determination unit 212 may determine whether or not a defect occurs in the three-dimensional structure ST by using AI.
  • the display control unit 213 may use AI to control the display device 25 to display information about defects.
  • the path correction unit 214 may correct the machining path information PI by using AI.
  • the storage device 22 can store desired data.
  • the storage device 22 may temporarily store computer programs executed by the arithmetic device 21 .
  • the storage device 22 may temporarily store data temporarily used by the arithmetic device 21 while the arithmetic device 21 is executing a computer program.
  • the storage device 22 may store data that the machining path generation device 2 saves over a long period of time.
  • the storage device 22 may include at least one of RAM (Random Access Memory), ROM (Read Only Memory), hard disk device, magneto-optical disk device, SSD (Solid State Drive), and disk array device. good. That is, the storage device 22 may include non-transitory recording media.
  • the communication device 23 can communicate with the processing device 1 via the communication network 3. In this embodiment, the communication device 23 can transmit the machining path information PI generated by the path generation unit 211 to the processing device 1 .
  • the input device 24 is a device that receives input of information to the machining path generation device 2 from outside the machining path generation device 2 .
  • the input device 24 may include an operation device (for example, at least one of a keyboard, a mouse, and a touch panel) that can be operated by the operator of the machining path generation device 2 .
  • the input device 24 may include a reading device capable of reading information recorded as data on a recording medium that can be externally attached to the machining path generation device 2 .
  • input device 24 may include a communication device capable of receiving information over a communication network.
  • the communication device 23 may be used as the input device 24 .
  • the display device 25 is a device capable of outputting information as an image. That is, the display device 25 is a device capable of displaying an image representing information to be output. In this embodiment, the display device 25 displays information about the defect when the defect determination unit 212 determines that the three-dimensional structure ST has a defect.
  • FIG. 7 is a flow chart showing the flow of operations performed by the machining path generation device 2 .
  • the operation to be performed by the machining path generation device 2 for example, the operation to generate the machining path information PI
  • the flowchart shown in FIG. 7 are performed by these logical functional blocks. Therefore, the flowchart shown in FIG. 7 may be regarded as showing the flow of information processing realized by the computer program (that is, software) executed by the machining path generation device 2 .
  • the path generation unit 211 acquires 3D model data representing a 3D model (three-dimensional model) of the three-dimensional structure ST to be modeled by the processing device 1 (step S11).
  • the path generation unit 211 may acquire 3D model data input to the machining path generation device 2 via the input device 24 .
  • the path generation unit 211 may acquire (for example, receive) 3D model data from a device external to the machining path generation device 2 via the communication device 23 .
  • the path generation unit 211 converts measurement data of a three-dimensional object measured by at least one of a measuring device (not shown) provided in the processing system SYS and a three-dimensional shape measuring machine provided separately from the processing system SYS to a 3D model. It may be acquired as data.
  • the format of the 3D model data may be any format.
  • the path generation unit 211 may acquire 3D model data conforming to the STL (Standard Triangulated Language) file format.
  • the path generation unit 211 may acquire 3D model data conforming to the STEP (Standard for Exchange of Product Model Data) file format.
  • the path generation unit 211 may acquire 3D model data conforming to the IGES (Initial Graphics Exchange Specification) file format.
  • the path generation unit 211 may acquire 3D model data conforming to the DWG file format.
  • the path generation unit 211 may acquire 3D model data conforming to the DXF (Drawing Exchange Format) file format.
  • the path generation unit 211 may acquire 3D model data conforming to the VRML (Virtual Reality Modeling Language) file format.
  • the path generation unit 211 may acquire 3D model data conforming to the ISO10303 file format.
  • the path generation unit 211 After that, the path generation unit 211 generates processing path information PI for molding the three-dimensional structure ST by the processing device 1 based on the 3D model data acquired in step S11 (step S12). That is, the path generation unit 211 generates processing path information PI for controlling the processing device 1 to form the three-dimensional structure ST based on the 3D model data acquired in step S11 (step S12). .
  • An example of the machining pass information PI will be described below with reference to FIGS. 8(a) to 8(c).
  • FIG. 8(a) shows an example of a three-dimensional structure ST formed by the processing device 1.
  • FIG. 8A the three-dimensional structure ST shown in FIG. 8(a) will be referred to as "three-dimensional structure ST8".
  • the three-dimensional structure ST8 includes a plate-like bottom member ST8a along the XY plane and a plate-like wall member ST8b extending from the bottom member ST8a along the Z-axis direction. I'm in.
  • the processing apparatus 1 shapes the three-dimensional structure ST8 shown in FIG. 8A, as described above, the processing apparatus 1 moves the three-dimensional structure ST8 along the Z axis direction A plurality of structural layers SL obtained by slicing are formed one by one.
  • the processing apparatus 1 sequentially shapes the structural layers SL#1 to SL#n (where n is the total number of structural layers SL forming the three-dimensional structure ST8). To go.
  • n is the total number of structural layers SL forming the three-dimensional structure ST8.
  • the path generation unit 211 may generate processing path information PI including a plurality of unit processing path information PIu for forming the plurality of structural layers SL by the processing device 1 .
  • the path generation unit 211 generates unit processing path information PIu#1 for forming the structure layer SL#1 by the processing device 1 and processing path information PIu#1 for forming the structure layer SL#2 by the processing device 1.
  • Machining pass information PI may be generated that includes information PI#2, .
  • the processing pass information may include information on the processing pass P corresponding to the movement path of the target irradiation area EA on the modeling surface MS (in particular, the movement path of the irradiation position irradiated with the processing light EL).
  • the pass generation unit 211 may generate processing pass information PI including information on a plurality of processing passes P for respectively modeling a plurality of structural layers SL.
  • the path generation unit 211 generates unit processing path information PIu#1 including information about the processing path P#1 for forming the structure layer SL#1, and the structure Unit processing pass information PIu#2 including information regarding processing pass P#2 for forming layer SL#2, . . . , including information regarding processing pass P#n for forming structure layer SL#n Machining pass information PI including unit machining pass information PIu#n may be generated.
  • the pass generation unit 211 In order to generate machining pass information PI including a plurality of unit machining pass information PIu for respectively forming a plurality of structure layers SL from 3D model data, the pass generation unit 211 generates the 3D model indicated by the 3D model data. By performing the slicing process, a plurality of pieces of slice data representing 3D models of the plurality of structural layers SL are generated. After that, the pass generation unit 211 may generate processing pass information PI including a plurality of unit processing pass information PIu for respectively modeling the plurality of structural layers SL based on the plurality of slice data. Software that generates slice data in this way may generally be referred to as slice software. Therefore, the computer program (that is, software) executed by the arithmetic device 21 of the machining path generation device 2 may function as slicing software.
  • the path generation unit 211 may generate machining path information PI indicating machining paths P that can be classified in units of partial machining paths Pp corresponding to part of the movement path of the target irradiation area EA.
  • the machining pass P may include a plurality of partial machining passes P, or may include a single partial machining pass P.
  • the path generation unit 211 generates at least one of a partial machining path PpX linearly extending along the X axis and a partial machining path PpY linearly extending along the Y axis. Machining pass information PI may be generated that indicates the machining pass P that includes.
  • the path generation unit 211 may generate machining path information PI indicating a machining path P including a partial machining path Pp extending along a direction intersecting the X-axis and the Y-axis.
  • the path generation unit 211 may generate machining path information PI indicating a machining path P including a curved partial machining path Pp.
  • the path generation unit 211 may generate the processing path information PI based on information about the molding accuracy (modeling accuracy) of the processing device 1 in addition to the 3D model data.
  • the information on modeling accuracy may include information on line width w.
  • the line width w is the width ( That is, the size in a second direction that intersects the first direction). For example, when the processing apparatus 1 irradiates the modeling surface MS with the processing light EL based on the partial processing path Pp extending along the X-axis direction as shown in FIG. It may mean the width in the Y-axis direction of the modeled object formed on the modeling surface MS as shown in (b).
  • the path generation unit 211 may generate the machining path information PI such that the lower limit value of the interval between two adjacent partial machining paths Pp is large.
  • the line width w (or any parameter that defines the modeling accuracy) may be specified by the operator of the processing device 1 or the operator of the machining path generation device 2 . Alternatively, a prespecified line width w may be used.
  • the defect determination unit 212 determines whether the formed three-dimensional structure ST has It is determined whether or not a defect occurs (step S13).
  • the processing device 1 does not have to actually shape the three-dimensional structure ST based on the processing path information PI generated at step S12.
  • the defect determination unit 212 may determine whether or not a defect occurs in the three-dimensional structure ST based on the machining path information PI. That is, the defect determination unit 212 determines whether a defect occurs in the three-dimensional structure ST before the processing apparatus 1 actually forms the three-dimensional structure ST based on the processing path information PI generated in step S12. is determined (step S13).
  • Defects that occur in the three-dimensional structure ST may include any phenomenon that is undesirable to occur in the three-dimensional structure ST that has been shaped.
  • the voids include voids (in other words, cavities) that are generated because at least part of the portion that should originally be filled with the solidified modeling material M is not filled with the solidified modeling material M. good.
  • the processing apparatus 1 shapes the three-dimensional structure ST using the processing path information PI generated in FIG. may include differences in the actual state of the three-dimensional structure ST.
  • the pass generation unit 211 generates processing pass information PI including a plurality of unit processing pass information PIu#1 to PIu#n for modeling the plurality of structural layers SL#1 to SL#n,
  • the processing apparatus 1 models the plurality of structural layers SL#1 to SL#n based on the plurality of unit processing pass information PIu#1 to PIu#n.
  • the defect determination unit 212 may determine whether or not voids are generated in the plurality of structural layers SL#1 to SL#n based on the plurality of unit machining pass information PIu#1 to PIu#n. good.
  • the defect determination unit 212 determines whether or not a gap is generated in the structure layer SL#1 based on the unit processing pass information PIu#1, and determines whether or not the structure layer SL#1 is formed based on the unit processing pass information PIu#2. It is also possible to determine whether or not a gap occurs in #2, . In other words, the defect determination unit 212 may divide the three-dimensional structure ST into a plurality of structure layers SL#1 to SL#n and determine whether or not a void is generated in each structure layer SL. Alternatively, the defect determination unit 212 may determine whether or not voids are generated in the three-dimensional structure ST without dividing the three-dimensional structure ST into the plurality of structure layers SL#1 to SL#n.
  • the path generation unit 211 may determine whether or not voids are generated in the three-dimensional structure ST based on parameters calculated from the machining path information PI.
  • An example of a parameter calculated from the machining pass information PI is the interval D between two adjacent partial machining passes Pp included in the machining pass information PI.
  • Another example of parameters calculated from the machining pass information PI is the intersection amount C of two partial machining passes Pp that are included in the machining pass information PI and intersect each other.
  • FIG. 10 shows a cross section of a model BO10 wider than the line width w.
  • the path generation unit 211 selects the object BO10 as the processing path P for forming the object BO10, as shown in the lower part of FIG. Machining path information PI is generated that indicates a plurality of partial machining paths Pp linearly extending along the extending direction and adjacent to each other.
  • FIG. 10 shows a cross section of a model BO10 wider than the line width w.
  • the path generation unit 211 selects the object BO10 as the processing path P for forming the object BO10, as shown in the lower part of FIG. Machining path information PI is generated that indicates a plurality of partial machining paths Pp linearly extending along the extending direction and adjacent to each other.
  • the defect determination unit 212 may determine that a gap is generated in the three-dimensional structure ST when the interval D between two adjacent partial processing passes Pp is larger than the threshold TH1. In particular, the defect determination unit 212 determines that the three-dimensional structure ST It may be determined that a void occurs in Note that the interval D may be set to an arbitrary value by the operator of the path generation device 2 (or the operator of the processing device 1).
  • the line width w may be used as the threshold TH1. This is because, as shown in FIG. 11, if the distance D between two adjacent partial processing passes Pp is equal to or less than the line width w, two shapes are formed based on the two adjacent partial processing passes Pp. This is because there is a low possibility that things will leave. However, depending on the specifications of the processing device 1 or the environment in which the processing device 1 is used, the processing device 1 may not always be able to form a modeled object having the same width as the line width w. For example, the processing device 1 may form a modeled object having a width narrower or wider than the line width w. Therefore, the threshold TH1 may be a value different from the line width w.
  • the threshold value TH1 the state in which the two objects respectively formed based on the two adjacent partial machining passes Pp are separated, and the state in which the two objects formed respectively based on the two adjacent partial machining passes Pp are not separated. Any value that can distinguish the state from the distance D between two adjacent partial machining passes Pp may be used. Note that the threshold TH1 may be set to an arbitrary value by the operator of the path generation device 2 (or the operator of the processing device 1).
  • FIGS. 12 to 14 a second specific example of the operation of determining whether or not a gap is generated in the three-dimensional structure ST based on the interval D between two adjacent partial machining passes Pp.
  • the upper part of FIG. 12 shows the upper surface and cross section of the modeled object BO12 in which a plurality of openings BO121 having a desired shape (circular in the example shown in FIG. 12) are formed in plan view.
  • the path generation unit 211 generates a machining path P for molding the object BO12 in a curved shape along the contour of the opening BO121 (in the example shown in FIG. 12, a circular path P).
  • machining pass information PI indicating a partial machining pass Pp#1 extending linearly and a partial machining pass Pp#2 extending linearly for forming the object around the opening BO121.
  • the distance D between two adjacent partial processing passes Pp#1 is smaller than the threshold TH2
  • the distance between the two adjacent partial machining passes Pp#1 is set to , as shown in the upper part of FIG.
  • the path generation unit 211 under the condition that the interval D between the two adjacent partial machining passes Pp#1 is smaller than the threshold value TH2, the path generation unit 211 generates the two adjacent partial machining passes Pp
  • the machining pass information PI is generated so that the partial machining pass Pp#2' is not set during #1.
  • the upper part of FIG. 14 shows that the partial machining pass Pp#2' is not set during #1.
  • the defect determination unit 212 may determine that a gap is generated in the three-dimensional structure ST when the interval D between two adjacent partial processing passes Pp is smaller than the threshold TH2. In particular, the defect determination unit 212 determines that a gap is generated in the three-dimensional structure ST when the interval D between two adjacent partial machining paths Pp extending along the contours of the two openings is smaller than the threshold TH2. You can judge.
  • the line width w may be used as the threshold TH2. This is because, as shown in FIGS. 13 and 14, if the distance D between two adjacent partial processing paths Pp that extend along the contours of two openings is greater than or equal to the line width w, then This is because a modeled object having a width equal to or larger than the line width w can be modeled, and the modeled object does not enter the two openings. However, depending on the specifications of the processing device 1 or the environment in which the processing device 1 is used, the processing device 1 may not always be able to form a modeled object having the same width as the line width w. For example, the processing device 1 may form a modeled object having a width narrower or wider than the line width w.
  • the threshold TH2 may be a value different from the line width w.
  • the threshold value TH2 a state in which a gap is formed (or the shape of the two openings is disturbed) between the two openings of the object that is formed based on two partial processing paths Pp that extend along the contour of the opening and are adjacent to each other. and a state in which no gap is formed between two openings (or the shapes of the two openings are not disturbed) in a modeled object formed based on two adjacent partial processing paths Pp. Any value distinguishable from the spacing D between paths Pp may be used.
  • the threshold TH2 may be set to an arbitrary value by the operator of the path generation device 2 (or the operator of the processing device 1).
  • the intersection amount C of the two intersecting partial machining paths Pp means the intersection amount (in other words, overlapping amount) of the two objects BO15 that are respectively formed by the two intersecting partial machining paths Pp.
  • the defect determination unit 212 may determine that a gap is generated in the three-dimensional structure ST when the intersection amount of the two intersecting partial processing paths Pp is smaller than the threshold TH3.
  • Zero may be used as the threshold TH3. This is because, as shown in FIG. 15, if the intersection amount C of the two intersecting partial machining paths Pp is greater than zero, the two objects formed based on the two intersecting partial machining paths Pp are separated from each other. because it never happens.
  • the processing device 1 may not always be able to form a modeled object having the same width as the line width w. For example, the processing device 1 may form a modeled object having a width narrower or wider than the line width w. Therefore, the threshold TH3 may be a value different from zero.
  • the two objects respectively formed based on the two intersecting partial processing paths Pp are separated, and the two objects formed based on the two intersecting partial processing paths Pp are not separated. Any value that can distinguish the state from the intersection amount C of the two intersecting partial machining paths Pp may be used.
  • At least one of the thresholds TH1 to TH3 may be variable. For example, at least one of the thresholds TH1 to TH3 may be specified or changed by the operator of the processing device 1. For example, at least one of the thresholds TH1 to TH3 may be specified or changed by the operator of the machining path generation device 2. However, at least one of the thresholds TH1 to TH3 may be a fixed value.
  • the defect determination unit 212 calculates the interval D between two adjacent partial machining passes Pp based on the machining pass information PI, and compares the calculated interval D with at least one of the threshold values TH1 and TH2. It may be determined whether or not a void is generated in the three-dimensional structure ST. Similarly, the defect determination unit 212 calculates the intersection amount C of the two intersecting partial machining paths Pp based on the machining path information PI, and compares the calculated intersection amount C with the threshold value TH3. It may be determined whether or not a gap is generated in the structure ST.
  • the defect determination unit 212 estimates the state of the modeled object to be formed based on two adjacent partial processing passes Pp based on the machining pass information PI, and based on the estimated state of the modeled object, determines the three-dimensional It may be determined whether or not a gap is generated in the structure ST.
  • the 3D model data acquired in step S11 of FIG. 7 indicates an ideal state of the three-dimensional structure ST to be modeled by the processing device 1.
  • the state of the three-dimensional structure ST estimated by the defect determination unit 212 indicates the actual state of the three-dimensional structure ST that is estimated to be shaped based on the machining path information PI.
  • An example of the state of the three-dimensional structure ST is the cross-sectional area of the three-dimensional structure ST in the direction along the modeling surface MS.
  • the defect determination unit 212 may generate information about the defect (hereinafter referred to as "defect information").
  • the defect information may be used as information displayed by the display device 25 under the control of the display control section 213, as will be detailed later. Therefore, since the defect information will be described in detail when describing the operation of displaying the defect information under the control of the display control unit 213, detailed description thereof will be omitted here.
  • the defect determination unit 212 may generate defect information based on the machining pass information PI without determining whether or not a defect occurs in the three-dimensional structure ST.
  • the display control unit 213 controls the display device 25 so as to display information (that is, defect information) about defects (voids in this embodiment) occurring in the three-dimensional structure ST (step S14).
  • the display control unit 213 controls the display device 25 to display defect information when it is determined in step S13 that the three-dimensional structure ST has a defect.
  • the display control unit 213 does not have to control the display device 25 to display the defect information when it is not determined in step S13 that the three-dimensional structure ST has a defect.
  • the display control unit 213 controls that even if the processing apparatus 1 models the three-dimensional structure ST based on the processing path information generated in step S12, no defect will occur in the three-dimensional structure ST to be modeled.
  • the display device 25 may be controlled to display information for notifying the operator of the machining path generation device 2 (or the operator of the processing device 1).
  • the defect information indicates that the processing apparatus 1 forms the three-dimensional structure ST based on the processing path information generated in step S12, and the operator of the processing path generation apparatus 2 that a defect occurs in the three-dimensional structure ST to be formed. (or the operator of the processing apparatus 1) may include information for notification.
  • defect information may include a text message for notifying that a defect occurs in the three-dimensional structure ST.
  • the defect information may include information on the state of defects occurring in the three-dimensional structure ST.
  • the defect status may include at least one of defect type, defect size, defect location, and defect shape.
  • the state of the defect i.e., the state of the void
  • the size of the void e.g., at least one of the X, Y, and Z directions.
  • the size of the void in one direction the size of the void in one direction
  • the location of the void e.g., the location of the void in at least one of the X, Y, and Z directions
  • shape of the void e.g., the shape of the void. good.
  • the display control unit 213 may control the display device 25 so as to display the defect information together with the model information regarding the three-dimensional structure ST. For example, as shown in FIGS. 16 and 17 showing display examples of defect information, the display control unit 213 displays 3
  • the display device 25 may be controlled to display a display object 92 indicating defects (voids) occurring in the dimensional structure ST.
  • the display control unit 213 may control the display device 25 to display the display object 92 over the display object 91 .
  • the display object 92 may also be referred to as a defect object or void object.
  • the display object 91 (that is, model information) is typically image information indicating the shape of the three-dimensional structure ST.
  • the display object 92 is image information distinguishable from the display object 91 displayed at a position where a defect occurs in the three-dimensional structure ST indicated by the display object 91 .
  • the display object 92 may be regarded as indicating not only the location of the defect, but also the size and shape of the defect.
  • FIG. 16 shows an example in which the model of the three-dimensional structure ST indicated by the display object 91 is a 2D model (two-dimensional model).
  • the display object 91 may indicate, for example, a section of the three-dimensional structure ST (for example, a section of the structure layer SL).
  • the display object 92 may indicate, for example, a defect that occurs within the cross-section of the three-dimensional structure ST.
  • the display object 92 may two-dimensionally indicate defects that occur within the three-dimensional structure ST.
  • FIG. 17 shows an example in which the model of the three-dimensional structure ST indicated by the display object 91 is a 3D model.
  • the display object 91 may, for example, stereoscopically represent the three-dimensional structure ST.
  • the display object 92 may indicate, for example, defects that occur within the three-dimensional structure ST.
  • the display object 92 may three-dimensionally represent defects occurring within the three-dimensional structure ST.
  • the display control unit 213 changes the state of the display device 25 into a 2D display state in which a display object 91 representing a 2D model of the three-dimensional structure ST and defect information (for example, a display object 92) is displayed, and a display state of the three-dimensional structure ST.
  • a 3D display state may be toggled between displaying defect information (eg, display object 92) along with display object 91 representing the 3D model.
  • the display control unit 213 may switch the state of the display device 25 between the 2D display state and the 3D display state based on the instruction of the operator of the machining path generation device 2 (or the operator of the processing device 1). good.
  • the display control unit 213 controls the display device to display the display object 91 based on the 3D model data acquired in step S11 of FIG. 7 (that is, the model information of the three-dimensional structure ST displayed on the display device 25). 25 may be controlled. In this case, the display control unit 213 may generate a display object 91 representing the 3D model indicated by the 3D model data as image information, and control the display device 25 to display the generated display object 91 . Alternatively, the display control unit 213 converts the 3D model indicated by the 3D model data into a 2D model to generate the display object 91 indicating the 2D model of the 3D structure ST as image information, and displays the generated display object 91 as image information. The display device 25 may be controlled to display.
  • the display control unit 213 may display the display object 91 based on the machining path information PI generated in step S12 of FIG. 7 (that is, the model information of the three-dimensional structure ST displayed on the display device 25).
  • the display device 25 may be controlled.
  • the display control unit 213 simulates the operation of the processing apparatus 1 to form the three-dimensional structure ST based on the machining pass information PI, thereby
  • a display device for estimating a model (for example, a 3D model or a 2D model) of the three-dimensional structure ST that is estimated to be formed by the processing device 1 and displaying a display object 91 showing the estimated model as image information. 25 may be controlled.
  • the defect determination unit 212 determines the model of the estimated three-dimensional structure ST Based on this model, it may be determined whether or not a defect occurs in the three-dimensional structure ST.
  • the defect determination unit 212 may determine whether or not a defect occurs in the three-dimensional structure ST based on the display object 91 (that is, image information) representing the estimated model as image information.
  • the display control unit 213 displays a display object for changing the determination condition used when determining whether or not a defect occurs in the three-dimensional structure ST.
  • the display device 25 may be controlled.
  • the display control unit 213 controls the operator (or The display device 25 may be controlled so as to display an operation object 93 that can be operated by the operator of the processing apparatus 1 .
  • FIG. 18 shows an example in which a slide bar for quantitatively specifying the determination condition is used as the operation object 93.
  • any display object capable of changing the determination condition typically In practice, a GUI (Graphical User Interface) may be used.
  • An example of the determination condition is a threshold (for example, at least one of the thresholds TH1 to TH3 described above) that is compared with the parameter calculated from the machining path information PI.
  • a threshold for example, at least one of the thresholds TH1 to TH2 described above
  • the display control unit 215 displays a display object (for example, an operation object 93 shown in FIG. 18) specifying the line width w as a display object for changing at least one of the thresholds TH1 to TH2.
  • the display device 25 may be controlled. In this case, it may be substantially considered that the line width w is used as the determination condition.
  • the defect determination unit 212 may re-determine whether or not a defect occurs in the three-dimensional structure ST based on the changed determination condition. Furthermore, when the determination condition is changed, the display control unit 213 causes the display device 25 to display defect information according to the latest determination result by the defect determination unit 212 based on the changed determination condition. may be controlled. In this case, the operator can change the determination condition while confirming the defect information updated in accordance with the change of the determination condition.
  • changing the determination condition is substantially equivalent to changing the modeling accuracy of the processing apparatus 1 and changing the modeling time.
  • the operator may change the line width w (that is, modeling accuracy and modeling time) so that the state of defects occurring in the three-dimensional structure ST becomes acceptable to the operator.
  • the line width w increases, voids are more likely to occur in the three-dimensional structure ST. This is because, as the line width w becomes thicker, the forming accuracy of the processing apparatus 1 becomes rougher. Therefore, as the line width w designated by the operator becomes thicker, the three-dimensional structure ST becomes more likely to have voids, but the modeling time becomes shorter.
  • the line width w specified by the operator becomes narrower, the three-dimensional structure ST becomes less likely to have voids, but the modeling time becomes longer. Under such circumstances, the operator checks the defect information and the like displayed on the display device 25, and tries to balance the condition of the voids generated in the three-dimensional structure ST (that is, the modeling accuracy) and the modeling time. , the line width w may be specified. Alternatively, while confirming the defect information displayed on the display device 25, the operator may give priority to shortening the modeling time over reducing the voids generated in the three-dimensional structure ST (that is, improving the modeling accuracy). , the line width w may be specified.
  • the operator may give priority to reducing the voids generated in the three-dimensional structure ST (that is, improving the modeling accuracy) rather than shortening the modeling time.
  • the line width w may be specified.
  • the path generation section 211 may calculate the time (modeling time) required to model the three-dimensional structure ST based on the machining path information PI.
  • the calculated modeling time may be displayed on the display device 25 as a display object 94 indicating the calculated modeling time under the control of the display control unit 213, as shown in FIG.
  • the path correction unit 214 determines whether or not it is necessary to correct the machining path information PI generated in step S12 (step S15). For example, when the operator of the machining path generation device 2 (or the operator of the processing device 1) desires to correct the machining path information PI, the path correction unit 214 needs to correct the machining pass information PI. It may be determined that there is For example, if the operator of the machining path generation device 2 (or the operator of the processing device 1) does not wish to correct the machining pass information PI, the path correction unit 214 needs to correct the machining pass information PI.
  • the path correction section 214 may determine that the machining path information PI needs to be corrected. For example, when it is determined in step S13 that no defect will occur in the three-dimensional structure ST, the path correction section 214 may determine that there is no need to correct the machining path information PI. For example, the path correction unit 214 determines that the machining path information PI needs to be corrected when the ratio of the space (for example, void) where the defect occurs to the volume of the three-dimensional structure ST exceeds the allowable ratio. may For example, the path correction unit 214 determines that there is no need to correct the machining path information PI when the ratio of the space (for example, void) where the defect occurs to the volume of the three-dimensional structure ST does not exceed the allowable ratio. You may
  • the path correction unit 214 corrects the machining pass information generated in step S12 (step S16).
  • the path correction unit 214 may correct the machining path information based on the determination result in step S13 (that is, the determination result as to whether or not a defect will occur in the three-dimensional structure ST).
  • the path correction unit 214 may correct the processing path information PI so that defects expected to occur in the three-dimensional structure ST will not occur during actual modeling.
  • the pass correction unit 214 may correct the machining pass information PI so that defects do not occur in the three-dimensional structure ST.
  • the path correction unit 214 compares defects expected to occur in the three-dimensional structure ST to be formed based on the machining path information PI before correction, and compares the defects to the machining path information PI after correction.
  • the machining path information PI may be corrected so that defects expected to occur in the three-dimensional structure ST to be modeled based on the machining path information PI are reduced.
  • the pass correction unit 214 may correct the machining pass information PI so as to reduce defects expected to occur in the three-dimensional structure ST.
  • the path correction unit 214 modifies the machining path information PI so as to add at least one new partial machining path Pp between two adjacent partial machining paths Pp. You can fix it. In other words, the path correction unit 214 adds a new partial processing path Pp for forming a modeled object (particularly, a modeled object for filling the gap) in a gap expected to occur in the three-dimensional structure ST. Alternatively, the machining pass information PI may be corrected.
  • the path correction unit 214 creates at least one new portion between two adjacent partial machining passes Pp (partial machining pass Pp#1 in FIG. 20), as shown in FIG.
  • the machining pass information PI may be modified so as to add a machining pass Pp (partial machining pass Pp#3 in FIG. 20).
  • the path correction unit 214 adds a new partial processing path Pp for forming a modeled object (particularly, a modeled object for filling the gap) in a gap expected to occur in the three-dimensional structure ST.
  • the machining pass information PI may be corrected.
  • the path correction unit 214 determines that the line width w corresponding to the partial machining pass Pp#3 added between the adjacent two partial machining passes Pp#1 is equal to the partial machining pass Pp other than the partial machining pass Pp#3.
  • the machining pass information PI may be corrected so as to be thinner than the line width w corresponding to .
  • the path correction unit 214 sets the line width w corresponding to the partial machining paths Pp#1 and Pp#2 to the first width w1, and sets the line width w corresponding to the partial machining path Pp#3 to the first width w1.
  • the machining pass information PI may be corrected so as to have a second width w2 narrower than the width w1.
  • the path correction unit 214 may change the shape of the three-dimensional structure ST so as to eliminate voids.
  • the path correction section 214 may change the shape of the three-dimensional structure ST so that the distance D between the two openings BO121 is widened.
  • the path correction unit 214 can secure a space for adding the partial machining pass Pp#3 between the two partial machining passes Pp#1 for respectively forming the two openings BO121.
  • the path correction unit 214 may change the shape of the three-dimensional structure ST so that the two openings BO121 have smaller diameters.
  • the path correction unit 214 performs partial machining pass Pp#1 between the two partial machining passes Pp#1 for forming the two openings BO121. Space can be reserved for adding Pp#3.
  • the modifying unit 214 may modify the machining pass information PI so as to change the line width w.
  • changing the line width w is substantially equivalent to changing the state of voids generated in the three-dimensional structure ST, changing the modeling accuracy of the processing apparatus 1, and changing the modeling time.
  • the display control unit 213 causes the operator to specify the priority between the reduction of voids generated in the three-dimensional structure ST (that is, the improvement of modeling accuracy) and the shortening of the modeling time.
  • Display device 25 may be controlled to display display object 95 .
  • the path correction unit 214 may specify (change) the line width w based on the operation result of the display object 95 .
  • the path correction unit 214 may specify the line width w such that the line width w is the first line width.
  • the path correction unit 214 adjusts the machining path under the constraint that the lower limit value of the interval between two adjacent partial machining paths Pp is the first lower limit value corresponding to the first line width.
  • Information PI may be modified.
  • the path correction unit 214 may specify the line width w such that the line width w is the second line width (where the second line width is thinner than the first line width).
  • the pass correction unit 214 sets the lower limit value of the interval between two adjacent partial machining passes Pp to the second lower limit value according to the second line width (however, the second lower limit value is the second lower limit value). 1), the machining pass information PI may be corrected.
  • the interval between two adjacent partial machining passes Pp is typically shorter than in the modeling time priority mode. That is, in the modeling time priority mode, the interval between two adjacent partial machining passes Pp is typically longer than in the modeling accuracy priority mode.
  • the path generation unit 211 sets the line width w to a third line width (where the third line width is thinner than the first line width and thicker than the second line width).
  • a line width w may be specified.
  • the pass correction unit 214 sets the lower limit value of the interval between two adjacent partial machining passes Pp to the third lower limit value according to the third line width (however, the third lower limit value corresponds to the third line width).
  • the machining pass information PI may be corrected under the constraint condition that it is less than the lower limit of 1 and greater than the second lower limit.
  • the path correction unit 214 may correct the machining path information PI so that the intersection amount C is equal to or greater than the threshold TH3.
  • the path correction unit 214 may extend (that is, lengthen) at least one of the two intersecting partial machining paths Pp to correct the machining path information PI so that the intersection amount C becomes equal to or greater than the threshold TH3. good.
  • the machining path generation device 2 uses the machining path information PI corrected in step S16 to perform the operations after step S13. That is, when the processing apparatus 1 models the three-dimensional structure ST based on the modified machining path information PI in step S16, the defect determination unit 212 determines whether a defect occurs in the modeled three-dimensional structure ST. (Step S13). Further, the display control unit 213 controls the display device 25 so as to display information (that is, defect information) regarding defects (voids in this embodiment) occurring in the three-dimensional structure ST (step S14).
  • the path correction unit 214 determines whether or not it is necessary to further correct the machining path information PI corrected in step S16 (step S15). However, the machining path generation device 2 does not have to perform the operations after step S13 using the machining path information PI corrected in step S16.
  • step S15 if it is determined that there is no need to modify the machining pass information PI (step S15: No), the path correction unit 214 corrects the machining pass information generated in step S12. No need to fix.
  • the machining path generation device 2 outputs the machining path information PI generated in step S12 to the processing device 1 (step S17).
  • the machining pass generation device 2 outputs the machining pass information PI corrected in step S16 to the processing device 1 (step S17).
  • the processing device 1 shapes the three-dimensional structure ST based on the processing path information PI output from the processing path generation device 2 .
  • the processing path generation device 2 generates the three-dimensional structure ST based on the processing path information PI. It is possible to determine whether or not a defect will occur in the three-dimensional structure ST. Furthermore, the machining path generator 2 can display information about defects. Therefore, the operator of the machining path generation device 2 (or the operator of the machining device 1) can grasp defects that are expected to occur in the three-dimensional structure ST. As a result, the operator of the machining path generation device 2 (or the operator of the machining device 1) can take desired countermeasures against defects. For example, the operator of the machining path generation device 2 (or the operator of the processing device 1) can take desired measures to form the three-dimensional structure ST with fewer defects. Therefore, the processing apparatus 1 can form the three-dimensional structure ST with reduced defects.
  • the machining path generation device 2 can correct the machining path information PI based on the determination result as to whether or not a defect occurs in the three-dimensional structure ST.
  • the machining path generation device 2 can generate machining path information PI capable of reducing defects occurring in the three-dimensional structure ST formed by the processing device 1 by correcting the machining path information PI. . Therefore, even if the operator of the machining path generation device 2 (or the operator of the processing device 1) does not take special measures against defects, the defects occurring in the three-dimensional structure ST formed by the processing device 1 are reduced. . That is, the processing apparatus 1 can form the three-dimensional structure ST with reduced defects.
  • FIG. 22 is a block diagram showing the configuration of the machining system SYS in the first modified example.
  • the processing system SYS in the first modified example is referred to as a processing system SYSa.
  • the machining system SYSa of the first modified example differs from the machining system SYS described above in that it further includes a measuring device 4a.
  • Other features of the processing system SYSa may be the same as other features of the processing system SYS.
  • the measuring device 4a can measure the three-dimensional structure ST formed by the processing device 1.
  • the measuring device 4a can measure the internal structure of the three-dimensional structure ST.
  • An example of such a measuring device 4a is a CT (Computed Tomography) measuring device.
  • the measuring device 4a and the machining path generation device 2 can communicate via a communication network 5a including at least one of a wired communication network and a wireless communication network.
  • the communication network 5a may be the same as the communication network 3. FIG.
  • FIG. 23 is a flow chart showing the operation flow of the machining system SYSa in the first modified example.
  • the path generation unit 211 of the machining path generation device 2 generates a 3D model (three-dimensional model) of the three-dimensional structure ST to be formed by the processing device 1.
  • Data is acquired (step S11), and machining pass information PI is generated based on the 3D model data (step S12).
  • the machining path generation device 2 outputs the machining path information PI generated in step S12 to the processing device 1 (step S17).
  • the machining path generation device 2 determines whether or not a defect occurs in the three-dimensional structure ST based on the machining path information PI (step S13), the defect information may be displayed (step S14 in FIG. 7), and the machining path information PI may be corrected (step S16 in FIG. 7).
  • the processing device 1 forms the three-dimensional structure ST based on the processing path information PI output in step S17 (step S21a).
  • the measuring device 4a measures the three-dimensional structure ST formed in step S21a (step S22a).
  • the measurement device 4a outputs measurement information indicating the measurement result of the three-dimensional structure ST to the machining path generation device 2 via the communication network 5a (step S23a).
  • the defect determination unit 212 of the machining path generation device 2 determines whether a defect (for example, a void) occurs in the three-dimensional structure ST formed by the processing device 1 in step S21a. It is determined whether or not there is (step S13a). That is, in the first modification, the processing path generation device 2 causes the processing device 1 to actually shape the three-dimensional structure ST based on the processing path information PI generated in step S12. It is determined whether or not a defect actually occurs in the modeled three-dimensional structure ST.
  • a defect for example, a void
  • the display control unit 213 of the machining path generation device 2 controls the display device 25 so as to display the defect information (step S14).
  • the display control unit 213 controls the display device 25 so as to display defect information when it is determined in step S13a that the three-dimensional structure ST has a defect.
  • the path correction unit 214 of the machining path generation device 2 performs step S12 based on the determination result in step S13a (that is, the determination result as to whether or not the three-dimensional structure ST has a defect).
  • the machining pass information PI generated in step S15 to step S16 is corrected.
  • the machining path generation device 2 outputs the machining path information PI corrected in step S16 to the machining device 1 (step S17).
  • the processing device 1 forms the three-dimensional structure ST to be formed next based on the processing path information PI output from the processing path generation device 2 (step S24a). That is, in the first modification, when the processing device 1 sequentially shapes a plurality of three-dimensional structures ST of the same type, the first three-dimensional structure ST that is first shaped by the processing device 1 has a defect. If so, the machining path information PI for forming the second and subsequent three-dimensional structures ST is corrected. Therefore, the machining path generation device 2 can generate machining path information PI capable of reducing defects that occur in the second and subsequent three-dimensional structures ST. That is, the processing apparatus 1 can form the three-dimensional structure ST with reduced defects.
  • FIG. 24 is a block diagram showing the configuration of a machining path generation device 2b in the second modified example.
  • the machining path generation device 2b in the second modification differs from the machining path generation device 2 described above in that a learning unit 215b as a logical functional block realized in the arithmetic unit 21 is It differs in that it is further equipped.
  • Other features of the machining path generator 2 b may be the same as other features of the machining path generator 2 .
  • the learning unit 215b learns the relationship between the determination result of the defect determination unit 212, the information (for example, 3D model data) on the three-dimensional structure ST to be modeled by the processing apparatus 1, and the processing path information PI.
  • the judgment result of the defect judging unit 212 is used in the judging operation (that is, estimating) for judging (that is, estimating) whether or not a defect occurs in the three-dimensional structure ST before the processing apparatus 1 actually forms the three-dimensional structure ST. 7 step S13) may be included.
  • the determination result of the defect determination unit 212 is used in the determination operation (step S13a in FIG. 23) of determining whether or not a defect actually occurs in the three-dimensional structure ST after the processing apparatus 1 actually forms the three-dimensional structure ST.
  • the determination operation of determining whether or not a defect actually occurs in the three-dimensional structure ST after the processing device 1 has actually formed the three-dimensional structure ST may be performed by measuring the three-dimensional structure ST by the measuring device 4a.
  • the measurement result of the three-dimensional structure ST by the measurement device 4 a may be used as the determination result of the defect determination unit 212 because the determination is performed based on the result.
  • the learning unit 215b may learn the tendency of machining path information in which defects are likely to occur by learning the relationship between the determination result of the defect determination unit 212, the information on the three-dimensional structure ST, and the machining path information PI.
  • the learning unit 215b may learn the tendency of machining path information in which defects are unlikely to occur by learning the relationship between the determination result of the defect determination unit 212, the information on the three-dimensional structure ST, and the machining path information PI.
  • big data including a large amount of the determination result of the defect determination unit 212, the information about the three-dimensional structure ST, and the machining path information PI may be provided.
  • the learning unit 215b learns the relationship between the determination result of the defect determination unit 212, the information on the three-dimensional structure ST, and the machining path information PI, thereby learning the tendency of the shape of the three-dimensional structure ST in which defects are likely to occur.
  • the learning unit 215b learns the relationship between the determination result of the defect determination unit 212, the information on the three-dimensional structure ST, and the machining path information PI, thereby learning the tendency of the shape of the three-dimensional structure ST in which defects are unlikely to occur.
  • the defect determination unit 212 may correct the machining path information PI based on the learning result so that defects occurring in the three-dimensional structure ST are reduced (ideally, eliminated).
  • the machining path generation device 2b can further reduce defects occurring in the three-dimensional structure ST, compared to the case where the machining path information PI is corrected without the path correction unit 214 referring to the learning result. , can be generated. That is, the processing apparatus 1 can form the three-dimensional structure ST with further reduced defects.
  • the learning result by the learning unit 215b may be referred to by the path correction unit 214 when the path correction unit 214 corrects the machining pass information PI.
  • the path correction unit 214 may correct the machining path information PI based on the learning result so that defects occurring in the three-dimensional structure ST are reduced (ideally, they are eliminated).
  • the machining path generation device 2b can further reduce defects occurring in the three-dimensional structure ST, compared to the case where the machining path information PI is corrected without the path correction unit 214 referring to the learning result. , can be generated. That is, the processing apparatus 1 can form the three-dimensional structure ST with further reduced defects.
  • the learning result by the learning unit 215b may be referred to by the defect determination unit 212 when the defect determination unit 212 determines whether or not a defect occurs in the three-dimensional structure ST.
  • the defect determination unit 212 can more accurately determine whether or not a defect occurs in the three-dimensional structure ST.
  • the path correction unit 214 uses the judgment result of the defect judgment unit 212 and the machining
  • the learning model used by the path correction unit 214 may be learned by using information (for example, 3D model data) on the three-dimensional structure ST to be modeled by the apparatus 1 and the processing path information PI as teacher data. .
  • the path correction unit 214 may use a learning model that outputs corrected machining path information when 3D model data, machining path information, and the determination result of the defect determination unit 212 are input. .
  • the teacher data used for the learning of the path correction unit 214 are the 3D model data and the machining path information PI, and the three-dimensional structure ST which is modeled using at least one of the 3D model data and the machining path information PI.
  • the learning of the learning model has already been explained.
  • the learning process of the system for correcting the machining path information PI is constructed by the learning unit 215b.
  • the learning process may be performed by machine learning, in which features are defined by humans, or by deep learning, in which features are extracted from learning data by artificial intelligence. Learning by deep learning may include learning using the structure of a neural network.
  • the operation of the path correction unit 214 correcting the machining pass information PI may be considered substantially equivalent to the operation of the path correction unit 214 generating new machining pass information PI. Therefore, the path generation unit 211 that generates the processing path information PI may also refer to the learning result of the learning unit 215b when generating the processing path information PI, like the path correction unit 214 does.
  • the learning unit 215b uses the determination result of the defect determination unit 212 and the The learning model used by the path generation unit 211 may be learned by using information (for example, 3D model data) about the three-dimensional structure ST to be processed and the machining path information PI as teacher data.
  • the learning model used by the path generation unit 211 and the learning model used by the path correction unit 214 may be prepared separately. Alternatively, a common learning model used by the path generation unit 211 and the path correction unit 214 may be prepared.
  • the defect determination unit 212 determines whether or not a defect occurs in the three-dimensional structure ST by using a learnable learning model (that is, AI)
  • the learning unit 215b performs defect determination.
  • the determination result of the unit 212 information (for example, 3D model data) on the three-dimensional structure ST to be modeled by the processing apparatus 1, and processing path information PI as teacher data
  • the learning used by the defect determination unit 212 Model training may be performed.
  • the defect determination unit 212 may use a learning model that outputs a determination result as to whether or not a defect occurs in the three-dimensional structure ST when 3D model data and machining path information are input. good.
  • the teacher data used for learning of the defect determination unit 212 are 3D model data and machining path information PI, and defects in the three-dimensional structure ST formed using the 3D model data and machining path information PI.
  • a plurality (typically, a large amount) of data sets including correct labels indicating presence/absence may be included.
  • the learning process of a system for determining whether or not a defect occurs in the three-dimensional structure ST is constructed by the learning unit 215b.
  • the learning process may be performed by machine learning, in which features are defined by humans, or by deep learning, in which features are extracted from learning data by artificial intelligence. Learning by deep learning may include learning using the structure of a neural network.
  • the learning model learned (constructed) in the learning process may be stored in the processing system SYS as an arithmetic model.
  • the arithmetic device 21 for example, CPU
  • the processing system SYS uses this arithmetic model to determine whether or not a defect occurs in the three-dimensional structure ST.
  • the learning model may be stored in an external device (for example, a server such as a cloud server) of the processing system SYS.
  • the processing system SYS includes data necessary for determining whether or not a defect occurs in the three-dimensional structure ST (for example, information on the three-dimensional structure ST (for example, 3D model data) and processing path information PI ) to an external device, and the external device may determine whether or not a defect occurs in the three-dimensional structure ST.
  • the external device may be arranged within the same area as the factory where the processing system SYS is installed, or may be arranged at a different location.
  • the country in which the processing system SYS is located may be the same as or different from the country in which the external device is located.
  • the processing system SYSb has the learning section 215b.
  • an external device for example, a server such as a cloud server
  • the learning unit 215b of an external device learns (that is, constructs) a learning model, and the learned learning model is implemented in the processing system SYSb (for example, the path generation device 2b).
  • FIG. 25 is a block diagram showing the configuration of a processing device 1c in the third modified example.
  • the processing device 1c differs from the processing device 1 described above in that it includes a measuring device 14c.
  • Other features of processing device 1c may be the same as other features of processing device 1 .
  • the measuring device 14c can measure the modeling surface MS during at least part of the modeling period during which the processing device 1c is modeling the three-dimensional structure ST.
  • the measuring device 4c can measure the molten pool MP formed on the modeling surface MS during at least part of the modeling period.
  • An example of such a measuring device 14c is a measuring device capable of optically measuring the modeling surface MS (in particular, the molten pool MP formed on the modeling surface MS). Capable of imaging the modeling surface MS (in particular, the molten pool MP formed on the modeling surface MS) as an example of a measuring device capable of optically measuring the modeling surface MS (particularly, the molten pool MP formed on the modeling surface MS) imaging device.
  • FIG. 26 is a flow chart showing the operation flow of the processing system SYSc in the third modification.
  • the path generation unit 211 of the machining path generation device 2 generates a 3D model (three-dimensional model) of the three-dimensional structure ST to be formed by the processing device 1c.
  • Data is acquired (step S11), and machining pass information PI is generated based on the 3D model data (step S12).
  • the machining path generation device 2 outputs the machining path information PI generated in step S12 to the processing device 1c (step S17).
  • the machining path generation device 2 determines whether or not a defect occurs in the three-dimensional structure ST based on the machining path information PI (step S13), the defect information may be displayed (step S14 in FIG. 7), and the machining path information PI may be corrected (step S16 in FIG. 7).
  • the processing device 1c starts molding the three-dimensional structure ST based on the processing path information PI output in step S17 (step S31c).
  • the measuring device 14c controls the modeling surface MS (particularly, modeling A molten pool MP) formed on the surface MS is measured (step S32c).
  • the processing device 1c outputs measurement information indicating the measurement result of the modeling surface MS (in particular, the molten pool MP formed on the modeling surface MS) by the measuring device 14c to the machining path generation device 2 via the communication network 3. (step S33c).
  • the defect determination unit 212 of the machining path generation device 2 determines whether a defect (for example, a void) has occurred in the three-dimensional structure ST formed by the processing device 1 based on the measurement information output in step S33c. It is determined whether or not (step S13c). That is, in the third modification, the machining path generation device 2 determines whether or not the three-dimensional structure ST has a defect during at least a part of the modeling period during which the processing device 1c shapes the three-dimensional structure ST. judge.
  • a defect for example, a void
  • the defect determination unit 212 calculates the size of the molten pool MP based on the measurement information, and based on the calculated size of the molten pool MP, if a defect (for example, void) occurs in the three-dimensional structure ST, It may be determined whether there is For example, when the processing apparatus 1 forms a modeled object with a certain line width w, a molten pool MP having a size corresponding to the set line width w is formed on the modeling surface MS. That is, ideally, the size of the molten pool MP formed on the modeling surface MS should match the target size according to the set line width w.
  • a defect for example, void
  • the defect determination unit 212 may determine that the three-dimensional structure ST has a defect when the size of the molten pool MP is smaller than the target size. Alternatively, the defect determination unit 212 may determine that the three-dimensional structure ST has a defect when the size of the molten pool MP is smaller than the target size by a certain amount or more.
  • the display control unit 213 of the machining path generation device 2 controls the display device 25 so as to display the defect information (step S14). That is, in the third modification, the machining path generation device 2 displays the defect information during at least part of the modeling period during which the processing device 1c is modeling the three-dimensional structure ST. Typically, the display control unit 213 controls the display device 25 to display defect information when it is determined in step S13c that the three-dimensional structure ST has a defect. Further, if necessary, the path correction unit 214 of the machining path generation device 2 performs step S12 based on the determination result in step S13c (that is, the determination result as to whether or not the three-dimensional structure ST has a defect).
  • the machining pass information PI generated in step S15 to step S16 is corrected. That is, in the third modification, the machining path generation device 2 corrects the machining path information PI during at least part of the modeling period during which the processing device 1c is modeling the three-dimensional structure ST. After that, the machining path generation device 2 outputs the machining path information PI corrected in step S16 to the machining device 1c (step S17).
  • the processing device 1c forms the three-dimensional structure ST based on the processing path information PI output from the processing path generation device 2 (step S34c). For example, as described above, the processing device 1c forms the three-dimensional structure ST by sequentially forming a plurality of structural layers SL.
  • the molten pool MP is measured during the period in which the k-th structural layer SL is formed (where k is a variable representing an integer equal to or greater than 1 and equal to or less than the total number of structural layers SL), and the measurement of the molten pool MP is performed.
  • the processing device 1c may shape the k+1th and subsequent structural layers SL based on the corrected machining pass information PI.
  • the modified processing path information PI is used to form the k+1-th and subsequent structural layers.
  • the processing device 1c can form the three-dimensional structure ST with reduced defects.
  • the machining path generation device 2 generates a defect in the kth structural layer SL formed by the processing device 1. occurs, the processing pass information PI for forming the k+1-th and subsequent structural layers SL may be corrected.
  • the machining path generation device 2 generates the machining path information PI for forming the three-dimensional structure ST by the processing device 1 .
  • the machining path generation device 2 may generate arbitrary machining information that is control information for forming the three-dimensional structure ST by the machining device 1 and that is control information different from the machining path information.
  • the defect determination unit 212 determines that a defect occurs in the three-dimensional structure ST when the processing apparatus 1 forms the three-dimensional structure ST based on the processing information generated by the path generation unit 211. It may be determined whether The path correction section 214 may correct the processing information generated by the path generation section 211 based on the determination result of the defect determination section 212 .
  • the machining path generation device 2 performs the path generation operation (step S12 in FIG. 7) for generating the machining path information PI, and the defect determination operation (step S13 in FIG. 7) for determining whether or not a defect occurs. Then, a defect display operation (step S14 in FIG. 7) for displaying information about the defect and a path correction operation (step S16 in FIG. 7) for correcting the machining path information PI are performed.
  • the machining path generation device 2 does not have to perform at least one of the path generation operation, the defect determination operation, the defect display operation, and the path correction operation. For example, the machining path generation device 2 may not perform the path generation operation.
  • an external path generation device different from the machining path generation device 2 may perform the path generation operation. At least one of a defect determination operation, a defect display operation, and a path correction operation may be performed. For example, the machining path generation device 2 may not perform the defect determination operation. In this case, an external defect determination device different from the machining path generation device 2 may perform the defect determination operation. It may be output to the device, or at least one of the defect display operation and the path correction operation may be performed based on the determination result of an external defect determination device. For example, the machining path generation device 2 does not have to perform the defect display operation.
  • an external defect display device different from the machining path generation device 2 may perform the defect display operation, or the machining path generation device 2 outputs the result of the defect determination operation to the external defect display device. good too.
  • the machining path generation device 2 does not have to perform the path correction operation.
  • an external path correction device different from the machining path generation device 2 may perform the path correction operation. At least one of the results may be output to an external path modification device.
  • the processing device 1 melts the modeling material M by irradiating the modeling material M with the processing light EL.
  • the processing apparatus 1 may melt the modeling material M by irradiating the modeling material M with an arbitrary energy beam.
  • arbitrary energy beams include at least one of charged particle beams and electromagnetic waves.
  • charged particle beams include at least one of electron beams and ion beams.
  • the processing device 1 forms the three-dimensional structure ST by performing additional processing based on the laser build-up welding method.
  • the processing apparatus 1 may model the three-dimensional structure ST by performing additional processing conforming to other methods capable of shaping the three-dimensional structure ST.
  • other methods that can form the three-dimensional structure ST include a powder bed fusion method such as selective laser sintering (SLS), a binder jetting method (binder jetting method: Binder Jetting), material jetting method (Material Jetting method: Material Jetting), stereolithography, and laser metal fusion method (LMF: Laser Metal Fusion).
  • the processing apparatus 1 may model the three-dimensional structure ST by performing machining in addition to or instead of performing at least one of additional processing and removal processing.
  • the machining path generation device 2 provides machining information for forming the three-dimensional structure ST by the machining device 1 (e.g. corresponding processing path) is generated (step S12 in FIG. 7), it is determined whether or not a defect occurs in the three-dimensional structure ST based on the processing information (step S13 in FIG. 7), and information on the defect is generated. is displayed (step S14 in FIG. 7), and the machining path information PI may be corrected (step S16 in FIG. 7).
  • the processing device 1 may perform arbitrary processing on the workpiece W.
  • the machining path generation device 2 provides machining information (for example, machining information on the machining path corresponding to the movement path of the machining position where the apparatus 1 performs machining (step S12 in FIG. 7), and when the machining apparatus 1 processes the workpiece W based on the machining information, After determining whether or not a defect occurs (step S13 in FIG. 7), information on the defect may be displayed (step S14 in FIG. 7) and the processing information may be corrected (step S16 in FIG. 7).
  • [Appendix 2] generating processing path information for modeling an object with a 3D printer based on the 3D model data; Determining whether or not voids, which are defects, will occur in the object when the object is modeled by the 3D printer, based on the processing path information; and displaying information about the void together with model information based on the machining pass information when it is determined that the void, which is a defect, occurs in the object.
  • the machining path information generating method according to any one of appendices 1 to 6, wherein the gap includes a gap formed in the object.
  • [Appendix 8] Determining whether or not a gap is generated in the object includes determining that the gap is generated in the object when the distance is greater than a first threshold. .
  • Determining whether or not a void is formed in the object includes determining that the void is formed in the object when the distance is less than a second threshold.
  • the described machining path information generation method [Appendix 12] 12. The machining path information generating method according to appendix 11, wherein each of the two movement paths extends in a curved line or in a circular shape. [Appendix 13] 13. The machining pass information generating method according to appendix 11 or 12, wherein the second threshold is variable. [Appendix 14] Determining whether or not a gap is generated in the object is based on the amount of intersection of the two intersecting movement paths included in the machining path information, and when the object is shaped based on the two movement paths. 14. The machining path information generating method according to any one of appendices 5 to 13, including determining whether or not the gap is generated at least partially. [Appendix 15] 15.
  • Appendix 16 16.
  • the air gap includes the difference in the actual state of the modeled object from the ideal state of the modeled object, assuming that the 3D printer models the object using the processing path information. 18.
  • Appendix 19 19.
  • the machining path information generating method according to any one of appendices 1 to 18, wherein the gap includes a gap formed in the object.
  • Displaying information about the voids along with the model information includes: a first display process for superimposing and displaying a first gap object indicating the position of the gap generated in the object on a first display object indicating the 3D model of the object; a second display process of superimposing a second display object indicating the cross section of the object on a second gap object indicating the position of the gap generated in the cross section of the object, and displaying at least one of these.
  • the machining path information generating method according to any one of 19 to 19.
  • the machining path information generating method includes switching between the first display process and the second display process.
  • Determining whether or not a gap is generated in the object is performed by comparing a parameter calculated from the machining path information with a predetermined threshold to determine whether or not the void is generated in the object. including Displaying information about the void includes displaying an operation object that can be operated to change the threshold, and using the threshold after the change when the threshold is changed using the operation object. 22.
  • the machining path information generating method according to appendix 20 or 21, wherein the first or second gap object indicating the position of the gap determined to occur in the object is displayed. [Appendix 23] 23.
  • the machining pass information generation method according to any one of appendices 1 to 22, further comprising correcting the machining pass information based on a determination result as to whether or not a gap is generated in the object.
  • Appendix 24 generating processing path information for modeling an object with a 3D printer based on the 3D model data; Determining whether or not a void will occur in the object when the 3D printer models the object based on the processing path information; and modifying the machining path information when it is determined that a gap is generated in the object.
  • the 3D printer shapes the object using the modified machining pass information
  • the 3D printer shapes the object using the uncorrected machining pass information. 25.
  • the processing path information includes information indicating a movement route of the modeling position by the 3D printer, Modifying the machining path includes modifying the machining path information such that at least one new movement path is added between two adjacent movement paths included in the machining path information. 26.
  • the processing path information includes information indicating a movement route of the modeling position by the 3D printer, Correcting the machining path includes correcting the machining path information such that an intersection amount of two intersecting movement paths included in the machining path information is equal to or greater than a predetermined threshold.
  • the machining path information generating method according to any one of the items.
  • Correcting the machining path includes correcting the machining path information so as to give priority to the modeling accuracy of the object over shortening the modeling time required to model the object; 28.
  • the processing path information includes information indicating a movement route of the modeling position by the 3D printer, modifying the machining path information so as to give priority to the molding accuracy over shortening the molding time, and the interval between two adjacent movement paths included in the modified machining path information is not modified. 29.
  • the processing path information includes information indicating a movement route of the modeling position by the 3D printer, Correcting the machining path information so as to give priority to shortening the modeling time over the modeling accuracy means that the interval between two adjacent movement paths included in the corrected machining path information is corrected. 30.
  • the method of generating machining path information according to appendix 28 or 29, comprising modifying the machining path information so that the distance between the two movement paths included in the machining path information that does not exist is longer than the interval between the two movement paths.
  • Appendix 31 machine-learning a relationship between a determination result as to whether or not a gap is formed in the object, object information about the object, and the machining path information; 31.
  • Appendix 32 performing a measurement process for measuring the processed object, which is the object actually formed by the 3D printer, using the processing path information; performing machine learning on the relationship between the result of the measurement process, the object information about the object, and the machining path information; 32.
  • Determining whether or not a void occurs in the object includes determining whether or not the void occurs in the object during at least part of a modeling period in which the 3D printer is modeling the object. , 33.
  • the machining pass information generation method according to any one of appendices 23 to 32, wherein correcting the machining pass information includes correcting the machining pass information during at least part of the modeling period.
  • the 3D printer forms the object by forming a molten pool, Determining whether the void will form in the object includes determining whether the void will form in the object based on information about the size of the weld pool during at least a portion of the shaping period. 33.
  • [Appendix 35] generating processing path information for modeling an object with a 3D printer based on the 3D model data; Determining whether or not a void will occur in the object when the 3D printer models the object based on the processing path information; and displaying information about the void when it is determined that the void is generated in the object.
  • [Appendix 36] generating processing path information for modeling an object with a 3D printer based on the 3D model data; generating information about voids generated in the object when the 3D printer models the object based on the processing path information; and displaying information about the void.
  • [Appendix 37] generating processing information for molding an object by a processing device based on the model data; Determining, based on the processing information, whether or not defects will occur when the processing device models the object; and displaying information about the defect when it is determined that the defect will occur.
  • [Appendix 38] generating processing information for molding an object by a processing device based on the model data; generating information about defects when the processing device models the object based on the processing information; and displaying information about the defect.
  • [Appendix 39] generating processing information for molding an object by a processing device based on the model data; Determining, based on the processing information, whether or not defects will occur when the processing device models the object; and modifying the processing information when it is determined that the object has a void.
  • [Appendix 40] a control device that determines, based on processing information for controlling the processing device, whether or not defects will occur when the processing device forms an object; and a display device that displays information about the defect when the control device determines that the defect occurs.
  • [Appendix 41] a control device that generates information about defects when the processing device forms an object based on processing information for controlling the processing device; and a display device that displays information about the defect generated by the control device.
  • [Appendix 42] a determination device that determines whether or not defects will occur when the processing device models an object based on processing information for controlling the processing device; and a correction device that corrects the processing information when the control device determines that the defect will occur.
  • [Appendix 43] Determining whether or not a defect will occur when the processing device forms an object based on processing information for controlling the processing device; and displaying information about the defect when it is determined that the defect will occur.
  • [Appendix 44] generating information about defects when the processing device models an object based on processing information for controlling the processing device; and displaying information about the defects.
  • [Appendix 45] Determining whether or not a defect will occur when the processing device forms an object based on processing information for controlling the processing device; and modifying the processing information when it is determined that the defect will occur.
  • Appendix 47 A computer program that causes a computer to execute the processing information generating method according to any one of appendices 37 to 39.
  • Appendix 48 A computer program that causes a computer to execute the processing information generating method according to any one of appendices 43 to 45.
  • Appendix 49 49. A recording medium on which the computer program according to any one of appendices 46 to 48 is recorded.
  • the present invention is not limited to the above-described embodiments, and can be modified as appropriate within a range that does not contradict the gist or idea of the invention that can be read from the scope of claims and the entire specification.
  • a generation method, a processing information generation method, an information processing device, a computer program, and a recording medium are also included in the technical scope of the present invention.

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Abstract

Procédé de génération d'informations de trajet de traitement consistant à : générer des informations de trajet de traitement pour fabriquer un objet à l'aide d'une imprimante 3D, sur la base de données de modèle 3D ; déterminer, sur la base des informations de trajet de traitement, si un espace qui constitue un défaut apparaîtra ou non dans l'objet lorsque l'imprimante 3D fabrique l'objet ; et afficher des informations de modèle sur la base des données de modèle 3D et des informations concernant l'espace lorsqu'il est déterminé qu'un espace qui constitue un défaut apparaîtra dans l'objet.
PCT/JP2021/004346 2021-02-05 2021-02-05 Procédé de génération d'informations de trajet de traitement WO2022168268A1 (fr)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2015199197A (ja) * 2014-04-04 2015-11-12 株式会社松浦機械製作所 三次元造形装置及び三次元形状造形物の製造方法
JP2017087718A (ja) * 2015-11-02 2017-05-25 株式会社リコー 造形処理システム、造形処理装置、造形処理方法およびプログラム
JP2019025761A (ja) * 2017-07-28 2019-02-21 コニカミノルタ株式会社 造形方法、造形装置、及び造形制御プログラム
JP2020519762A (ja) * 2017-05-10 2020-07-02 モナッシュ ユニバーシティ 付加製造プロセスの品質保証及び制御のための方法及びシステム
JP2020530070A (ja) * 2017-08-01 2020-10-15 シグマ ラボズ，インコーポレイテッド 付加製造動作中の放射熱エネルギーを測定するためのシステムおよび方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015199197A (ja) * 2014-04-04 2015-11-12 株式会社松浦機械製作所 三次元造形装置及び三次元形状造形物の製造方法
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