WO2022163719A1 - 被覆工具および切削工具 - Google Patents
被覆工具および切削工具 Download PDFInfo
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- WO2022163719A1 WO2022163719A1 PCT/JP2022/002929 JP2022002929W WO2022163719A1 WO 2022163719 A1 WO2022163719 A1 WO 2022163719A1 JP 2022002929 W JP2022002929 W JP 2022002929W WO 2022163719 A1 WO2022163719 A1 WO 2022163719A1
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- layer
- coating layer
- adhesion
- coated tool
- metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
- B23B27/18—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing
- B23B27/20—Cutting tools of which the bits or tips or cutting inserts are of special material with cutting bits or tips or cutting inserts rigidly mounted, e.g. by brazing with diamond bits or cutting inserts
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
Definitions
- the present disclosure relates to coated tools and cutting tools.
- a coated tool is a coated tool having a substrate and a coating layer positioned on the substrate.
- the coated tool has a first face with a rake face, a second face with a flank face, and a ridge located between the first and second faces.
- a cutting edge is positioned on at least a portion of the ridge.
- the cutting edge has a third surface at least partially.
- the coating layer has at least a second coating layer located on the second surface and a third coating layer located on the third surface.
- a cutting tool has a rod-shaped holder having a pocket at its end, and the above-described coated tool positioned within the pocket.
- FIG. 1 is a perspective view showing an example of a coated tool according to an embodiment
- FIG. FIG. 2 is a side cross-sectional view showing an example of the coated tool according to the embodiment.
- FIG. 3 is a schematic enlarged view of section III shown in FIG.
- FIG. 4 is a schematic cross-sectional view showing another example of the configuration of the coating layer.
- FIG. 5 is a schematic cross-sectional view showing another example of the configuration of the coating layer.
- 6 is a schematic enlarged view of the VI portion shown in FIG. 3.
- FIG. 7 is a schematic enlarged view of the VII section shown in FIG. 6.
- FIG. FIG. 8 is a front view showing an example of the cutting tool according to the embodiment;
- Coated tools are known in which wear resistance and the like are improved by coating the surface of a substrate such as cemented carbide, cermet, ceramics, etc. with a coating layer. Coated tools of this type have room for further improvement in terms of achieving longer life.
- ⁇ Coated tool> 1 is a perspective view showing an example of a coated tool according to an embodiment; FIG. As shown in FIG. 1 , the coated tool 1 according to the embodiment may have a chip body 2 and a cutting edge portion 3 .
- the coated tool 1 according to the embodiment has, for example, a hexahedral shape in which the upper and lower surfaces (surfaces intersecting the Z-axis shown in FIG. 1) are parallelograms.
- the coated tool 1 has a first surface 6 (here, the top surface), a second surface 7 (here, the side surface) connected to the first surface 6, and a position between the first surface 6 and the second surface 7. It has a ridgeline portion 8 that The first face 6 has a rake face for scooping chips generated by cutting. Also, the second surface 7 has a flank.
- the first surface 6 has a plurality of (here, four) corners 61 when viewed from above.
- the corner means a region including the corner of the first surface 6 .
- a cutting edge 11 is positioned on the ridgeline portion 8 of at least one of the plurality of corner portions 61 .
- the coated tool 1 cuts a work material by bringing the cutting edge 11 into contact with the work material.
- the tip body 2 is made of cemented carbide, for example.
- Cemented carbide contains W (tungsten), specifically WC (tungsten carbide).
- the cemented carbide may contain at least one of Ni (nickel) and Co (cobalt).
- the tip body 2 may be made of cermet.
- the cermet contains, for example, Ti (titanium), specifically TiC (titanium carbide) or TiN (titanium nitride).
- the cermet may contain Ni or Co.
- a bearing surface 4 for attaching the cutting edge portion 3 may be positioned on one of the locations of the tip body 2 corresponding to the corner portion 61 of the coated tool 1 . Further, a through hole 5 may be positioned in the central portion of the chip body 2 so as to vertically penetrate the chip body 2 . A screw 75 for attaching the coated tool 1 to a holder 70 described later is inserted into the through hole 5 (see FIG. 7).
- the cutting edge portion 3 is integrated with the tip body 2 by being attached to the bearing surface 4 of the tip body 2 .
- the cutting edge portion 3 constitutes one of the plurality of corner portions 61 of the coated tool 1 .
- the cutting edge portion 3 constitutes a part of the first surface 6, the second surface 7 and the ridgeline portion 8 described above.
- the cutting edge 11 is located on at least a part of the ridgeline portion 8 of the cutting edge portion 3 .
- FIG. 2 is a side sectional view showing an example of the coated tool 1 according to the embodiment.
- the cutting edge portion 3 has a base 10 and a coating layer 20 .
- the substrate 10 may be cemented carbide, cermet, or ceramics. Moreover, it may contain a plurality of boron nitride particles.
- the substrate 10 is a cubic boron nitride (cBN) sintered body and may contain a plurality of cubic boron nitride particles.
- the substrate 10 may have a binder phase containing TiN, Al, Al2O3 , etc. between the boron nitride particles. A plurality of boron nitride particles are strongly bound together by such a binding phase. Note that the substrate 10 does not necessarily need to have a binder phase.
- the substrate 10 is positioned at the cutting edge portion 3, but the substrate 10 may be the main body 2 and the cutting edge portion 3. In other words, for example, a rectangular substrate 10 may be used.
- a third surface 9 that is continuous with the first surface 6 and the second surface 7 is positioned on at least a portion of the cutting edge 11 .
- the third surface 9 is, for example, a C surface (chamfer surface) obtained by cutting the corner between the first surface 6 and the second surface 7 obliquely and linearly.
- the third surface 9 may be an R surface (round surface) in which the corners of the first surface 6 and the second surface 7 are rounded.
- a substrate 30 made of cemented carbide or cermet, for example, may be located on the underside of the base body 10 .
- the base 10 is bonded to the bearing surface 4 of the chip body 2 via the substrate 30 and the bonding material 40 .
- the bonding material 40 is, for example, brazing material.
- the base body 10 may be joined to the tip body 2 via a joining material 40 at a portion other than the seat surface 4 of the tip body 2 .
- the coating layer 20 is coated on the substrate 10 for the purpose of improving wear resistance, heat resistance, etc. of the cutting edge 3, for example.
- the coating layer 20 is positioned on both the chip body 2 and the base 10 in the example of FIG.
- the second surface 7 has high wear resistance and heat resistance.
- the coating layer 20 has a first coating layer located on the first surface 6 , a second coating layer located on the second surface 7 and a third coating layer located on the third surface 9 .
- the adhesion between the first coating layer and the first surface 6 is defined as the first adhesion
- the adhesion between the second coating layer and the second surface 7 is defined as the second adhesion
- the third coating layer and the third When the adhesion force with the surface 9 is defined as the third adhesion force, in the coated tool 1 according to the embodiment, the third adhesion force is smaller than the second adhesion force.
- the inventors of the present application have found that the service life of the coated tool 1 can be extended by relatively reducing the adhesion force of the third coating layer located on the third surface 9 .
- One of the reasons for this is that, in the case of machining in which the coated tool 1 performs intermittent cutting while being in contact with the cooling liquid and a thermal shock is applied to the coated tool 1, if the adhesion of the third coating layer is strong, the third coating layer This is thought to be because the substrate 10, which is the base material, is damaged when it is destroyed.
- the third adhesion force is made smaller than the first adhesion force and the second adhesion force.
- the coated tool 1 having such a configuration can suppress damage to the substrate 10 on the third surface 9 . Therefore, according to the coated tool 1 which concerns on embodiment, lifetime improvement can be achieved.
- the third coating layer has relatively low adhesion, it is removed from the third surface 9 as the work material is cut, for example, at the beginning of use of the coated tool 1 (for example, at the first use). Therefore, according to the coated tool 1, by confirming the presence or absence of the third coating layer, it is possible to easily determine whether the tool is unused or used.
- the coating layer 20 preferably has a color different from that of the substrate 10 . In this case, whether the product is unused or used can be easily visually determined.
- the third adhesion force may be 40N or less. According to such a configuration, the adhesion between the third coating layer and the third surface 9 can be appropriately reduced, and the service life of the coated tool 1 can be appropriately extended.
- the second adhesion may be 80 N or more. With this configuration, the wear resistance and heat resistance of the second surface 7 can be appropriately increased.
- first to third adhesion strengths may be measured by, for example, a scratch test.
- the thickness of the third coating layer may be thinner than the thicknesses of the first and second coating layers.
- the thickness of the third coating layer is reduced, damage to the entire substrate 10 is suppressed when the coating layer 20 is destroyed. Therefore, the coated tool 1 having such a configuration can achieve further extension of life.
- the thickness of the first coating layer and the second coating layer may be 0.5 ⁇ m or more and 5.0 ⁇ m or less.
- the thickness of the third coating layer may be 0.01 ⁇ m or more and less than 5.0 ⁇ m.
- the coating layer 20 has a high adhesion layer 20A and a low adhesion layer 20B.
- the high adhesion layer 20A is located on the substrate 10, and the low adhesion layer 20B entirely covers the substrate 10 and the high adhesion layer 20A.
- the low adhesion layer 20 ⁇ /b>B may be positioned at least on the third surface 9 .
- the high adhesion layer 20A is, for example, a film formed by PVD (physical vapor deposition). A specific configuration example of the high adhesion layer 20A will be described later.
- the low adhesion layer 20B is a film having a smaller adhesion to the substrate 10 than the high adhesion layer 20A.
- the low adhesion layer 20B may be a resin layer.
- an acrylic resin, an ultraviolet curable resin, an epoxy resin, or the like can be used as the low adhesion layer 20B.
- the low adhesion layer 20B may be a paint such as poster color or acrylic gouache. Also, the low adhesion layer 20B may be a film formed by a CVD method (chemical vapor deposition method). Also, the low adhesion layer 20B may be a PVD film in which the bias conditions and the like are adjusted so that the adhesion is smaller than that of the high adhesion layer 20A. Also, the low adhesion layer 20B may be a Ti-based PVD film. Ti has poor wettability with the substrate 10 according to the embodiment and low adhesion with the substrate 10 . Therefore, by using Ti as the low adhesion layer 20B, it is possible to obtain the low adhesion layer 20B having lower adhesion than the high adhesion layer 20A. Further, when the low adhesion layer 20B is a compound such as Ti nitride, carbide, or carbonitride, the difference in thermal expansion with respect to the substrate 10 is large and the residual stress is large, so the adhesion can be reduced.
- FIG. 3 is a schematic enlarged view of section III shown in FIG.
- the coating layer 20 includes a first coating layer 201 located on the first surface 6, a second coating layer 202 located on the second surface 7, and a third coating layer 202 located on the third surface 9. and layer 203 .
- the first coating layer 201 and the second coating layer 202 have a high adhesion layer 20A and a low adhesion layer 20B. That is, the first coating layer 201 has a high adhesion layer 20A positioned on the first surface 6 and a low adhesion layer 20B positioned on the high adhesion layer 20A. Also, the second coating layer 202 has a high adhesion layer 20A located on the second surface 7 and a low adhesion layer 20B located on the high adhesion layer 20A.
- the third coating layer 203 has only the low adhesion layer 20B out of the high adhesion layer 20A and the low adhesion layer 20B. That is, the low adhesion layer 20B in the third coating layer 203 is in contact with the third surface 9 and exposed on the surface of the third coating layer 203 .
- the third coating layer 203 does not have the high adhesion layer 20A, and the low adhesion layer 20B is in contact with the third surface 9 without the high adhesion layer 20A interposed therebetween. Therefore, the third coating layer 203 has less adhesion to the substrate 10 than the first coating layer 201 and the second coating layer 202 .
- FIG. 4 and 5 are schematic cross-sectional views showing another example of the configuration of the coating layer 20.
- the first coating layer 201 may have only the low adhesion layer 20B among the high adhesion layer 20A and the low adhesion layer 20B, similarly to the third covering layer 203.
- the adhesion (third adhesion) between the third coating layer 203 and the third surface 9 is equivalent to the adhesion (first adhesion) between the first coating layer 201 and the first surface 6. good too.
- the adhesion (third adhesion) between the third coating layer 203 and the third surface 9 should be at least smaller than the adhesion (second adhesion) between the second coating layer 202 and the second surface 7. Just do it.
- both the high adhesion layer 20A and the low adhesion layer 20B may not be positioned on the first surface 6. That is, the substrate 10 may be exposed on the first surface 6 .
- the inventors of the present application found that the coated tool 1 without the coating layer 20 on the first surface 6 is better than the case where the coating layer 20 is provided on the first surface 6 corresponding to the rake face. It was found that the durability of According to this, the coated tool 1 with the first surface 6 corresponding to the rake face exposed has high durability.
- the thickness of the third coating layer 203 may be thinner in the region near the first surface 6 than in the region near the second surface 7 . In other words, the thickness of the third coating layer 203 may gradually increase from the first surface 6 toward the second surface 7 .
- the coated tool 1 having such a configuration has a good balance of chipping resistance, wear resistance, and heat resistance.
- FIG. 6 is a schematic enlarged view of the VI portion shown in FIG. 3.
- FIG. 6 is a schematic enlarged view of the VI portion shown in FIG. 3.
- the high adhesion layer 20A has at least a hard layer 21.
- the hard layer 21 may have one or more metal nitride layers.
- the hard layer 21 is a layer superior in wear resistance as compared with the metal layer 22 .
- the hard layer 21 may be one layer. Also, a plurality of metal nitride layers may overlap. Further, the hard layer 21 may have a laminated portion 23 in which a plurality of metal nitride layers are laminated, and a third metal nitride layer 24 located on the laminated portion 23 . The configuration of the hard layer 21 will be described later.
- the high adhesion layer 20A may have a metal layer 22 .
- Metal layer 22 is located between substrate 10 and hard layer 21 . Specifically, the metal layer 22 is in contact with the substrate 10 on one side and the hard layer 21 on the other side.
- the metal layer 22 has higher adhesion to the substrate 10 than the hard layer 21 does.
- Metal elements having such properties include Zr, V, Cr, W, Al, Si, and Y, for example.
- the metal layer 22 contains at least one metal element among the above metal elements.
- Ti simple substance, Zr simple substance, V simple substance, Cr simple substance and Al simple substance are not used as the metal layer 22 . This is because they are not suitable for use in cutting tools because they all have low melting points and low oxidation resistance. Also, Hf alone, Nb alone, Ta alone, and Mo alone have low adhesion to the substrate 10 . However, this does not apply to alloys containing Ti, Zr, V, Cr, Ta, Nb, Hf and Al.
- the metal layer 22 may be an Al--Cr alloy layer containing an Al--Cr alloy. Since the metal layer 22 has particularly high adhesion to the substrate 10, it is highly effective in improving the adhesion between the substrate 10 and the high adhesion layer 20A.
- the Al content in the metal layer 22 may be higher than the Cr content in the metal layer 22 .
- the composition ratio (atomic %) of Al and Cr in the metal layer 22 may be 70:30. By setting such a composition ratio, the adhesion between the substrate 10 and the metal layer 22 is higher.
- the metal layer 22 may contain components other than the above metal elements (Zr, V, Cr, W, Al, Si, Y). However, from the viewpoint of adhesion to the substrate 10, the metal layer 22 may contain at least 95 atomic percent of the above metal elements in total. More preferably, the metal layer 22 may contain the above metal elements in a total amount of 98 atomic % or more. For example, when the metal layer 22 is an Al—Cr alloy layer, the metal layer 22 may contain at least Al and Cr in a total amount of 95 atomic % or more. Furthermore, the metal layer 22 may contain at least Al and Cr in a total amount of 98 atomic % or more. The ratio of metal components in metal layer 22 can be identified by analysis using, for example, an EDS (energy dispersive X-ray spectrometer).
- EDS energy dispersive X-ray spectrometer
- the metal layer 22 contains Ti as little as possible from the viewpoint of improving adhesion with the substrate 10 .
- the Ti content in the metal layer 22 may be 15 atomic % or less.
- the coated tool 1 by providing the metal layer 22 having higher wettability with the substrate 10 than the hard layer 21 between the substrate 10 and the hard layer 21, high adhesion to the substrate 10 is achieved. Adhesion with the layer 20A can be improved. In addition, since the metal layer 22 has high adhesion to the hard layer 21 , the hard layer 21 is less likely to separate from the metal layer 22 .
- the cBN used as the substrate 10 is an insulator.
- cBN which is an insulator, has room for improvement in adhesion to films formed by the PVD method (physical vapor deposition).
- the adhesion between the hard layer 21 formed by PVD and the metal layer 22 is high.
- FIG. 7 is a schematic enlarged view of the VII section shown in FIG. 6.
- FIG. 7 is a schematic enlarged view of the VII section shown in FIG. 6.
- the hard layer 21 has a laminated portion 23 positioned on the metal layer 22 and a third metal nitride layer 24 positioned on the laminated portion 23 .
- the laminated portion 23 has a plurality of first metal nitride layers 23a and a plurality of second metal nitride layers 23b.
- the laminated portion 23 has a structure in which first metal nitride layers 23a and second metal nitride layers 23b are alternately laminated.
- each of the first metal nitride layer 23a and the second metal nitride layer 23b may be 50 nm or less.
- the first metal nitride layer 23a is a layer in contact with the metal layer 22, and the second metal nitride layer 23b is formed on the first metal nitride layer 23a.
- the first metal nitride layer 23a and the second metal nitride layer 23b may contain the metal contained in the metal layer 22.
- the metal layer 22 contains two types of metal (here, referred to as "first metal” and "second metal”).
- first metal nitride layer 23a contains nitrides of the first metal and the third metal.
- a third metal is a metal that is not contained in the metal layer 22 .
- the second metal nitride layer 23b contains nitrides of the first metal and the second metal.
- the metal layer 22 may contain Al and Cr.
- the first metal nitride layer 23a may contain Al.
- the first metal nitride layer 23a may be an AlTiN layer containing AlTiN, which is a nitride of Al and Ti.
- the second metal nitride layer 23b may be an AlCrN layer containing AlCrN, which is a nitride of Al and Cr.
- the adhesion between the metal layer 22 and the hard layer 21 is high. Since this makes it difficult for the hard layer 21 to separate from the metal layer 22, the durability of the high adhesion layer 20A is high.
- the first metal nitride layer 23a that is, the AlTiN layer
- the second metal nitride layer 23b that is, the AlCrN layer is excellent in heat resistance and oxidation resistance, for example.
- the high adhesion layer 20A includes the first metal nitride layer 23a and the second metal nitride layer 23b having different compositions, thereby controlling the properties of the hard layer 21 such as wear resistance and heat resistance. be able to. Thereby, the tool life of the coated tool 1 can be extended.
- mechanical properties such as adhesion to the metal layer 22 and wear resistance can be improved while maintaining the excellent heat resistance of AlCrN.
- the laminated portion 23 may be formed by, for example, an arc ion plating method (AIP method).
- AIP method utilizes arc discharge in a vacuum atmosphere to evaporate target metals (here, AlTi target and AlCr target) and form metal nitrides (here, AlTiN and AlCrN) by combining with N2 gas. It is a method of filming.
- the metal layer 22 may also be formed by the AIP method.
- the third metal nitride layer 24 may be positioned on the laminated portion 23 . Specifically, the third metal nitride layer 24 is in contact with the second metal nitride layer 23 b of the laminated portion 23 .
- the third metal nitride layer 24 is, for example, a metal nitride layer (AlTiN layer) containing Ti and Al, like the first metal nitride layer 23a.
- the thickness of the third metal nitride layer 24 may be thicker than each thickness of the first metal nitride layer 23a and the second metal nitride layer 23b. Specifically, when the thickness of the first metal nitride layer 23a and the second metal nitride layer 23b is set to 50 nm or less as described above, the thickness of the third metal nitride layer 24 may be set to 1 ⁇ m or more. For example, the thickness of the third metal nitride layer 24 may be 1.2 ⁇ m.
- the welding resistance of the coated tool 1 can be improved.
- the hardness of the third metal nitride layer 24 is high, the wear resistance of the coated tool 1 can be improved.
- the oxidation start temperature of the third metal nitride layer 24 is high, the oxidation resistance of the coated tool 1 can be improved.
- the thickness of the third metal nitride layer 24 may be thicker than the thickness of the laminated portion 23 .
- the thickness of the third metal nitride layer 24 may be 1 ⁇ m or more.
- the thickness of the third metal nitride layer 24 may be 1.2 ⁇ m. In this way, by making the third metal nitride layer 24 thicker than the laminated portion 23, the effect of improving the above-described adhesion resistance, wear resistance, etc. is further enhanced.
- the thickness of the metal layer 22 may be, for example, 0.1 ⁇ m or more and less than 0.6 ⁇ m. That is, the metal layer 22 may be thicker than each of the first metal nitride layer 23 a and the second metal nitride layer 23 b and thinner than the laminated portion 23 .
- a cBN powder having an average particle size of 2.5 ⁇ m or more and 4.5 ⁇ m or less and a cBN powder having an average particle size of 0.5 ⁇ m or less and 1.5 ⁇ m or less are mixed at a volume ratio of 8 or more and 9 or less: 1 or more and 2 or less.
- an organic solvent is added. Alcohols such as acetone and IPA can be used as the organic solvent. After that, they are pulverized and mixed in a ball mill for 20 hours or more and 24 hours or less. After grinding and mixing, the solvent is evaporated to obtain a second mixed powder.
- the obtained first mixed powder and second mixed powder are blended at a volume ratio of 68 or more and 78 or less: 22 or more and 32 or less.
- An organic solvent and an organic binder are added to the prepared powder. Alcohols such as acetone and IPA can be used as the organic solvent.
- the organic binder paraffin, acrylic resin, or the like can be used. After that, they are pulverized and mixed in a ball mill for 20 hours or more and 24 hours or less, and then the organic solvent is evaporated to obtain a third mixed powder.
- a dispersant may be added as necessary in the process using a ball mill.
- a compact is obtained by molding this third mixed powder into a predetermined shape.
- known methods such as uniaxial pressure pressing, cold isostatic pressing (CIP), etc. can be used.
- This compact is heated at a predetermined temperature in the range of 300° C. or higher and 600° C. or lower to evaporate and remove the organic binder.
- the compact is put into an ultra-high pressure heating device and heated at 1200°C or higher and 1500°C or lower under a pressure of 4 GPa or higher and 6 GPa or lower for 15 minutes or longer and 30 minutes or shorter.
- the cubic boron nitride sintered body according to the embodiment is obtained.
- the resulting cubic boron nitride sintered body is attached to the bearing surface of the tip body made of cemented carbide via a bonding material.
- a chip according to the example is obtained.
- the low adhesion layer 20B is further formed on the surface of the chip.
- the low adhesion layer 20B is made of resin or paint, it can be formed by dip coating or the like.
- the low adhesion layer 20B is a CVD film or a PVD film, it can be formed using the CVD method or the PVD method, respectively.
- FIG. 8 is a front view showing an example of the cutting tool according to the embodiment.
- the cutting tool 100 has a coated tool 1 and a holder 70 for fixing the coated tool 1 .
- the holder 70 is a rod-shaped member extending from a first end (upper end in FIG. 8) toward a second end (lower end in FIG. 8).
- the holder 70 is made of steel or cast iron, for example. In particular, among these members, it is preferable to use steel with high toughness.
- the holder 70 has a pocket 73 at the end on the first end side.
- the pocket 73 is a portion to which the coated tool 1 is attached, and has a seating surface that intersects with the rotational direction of the work material and a restraining side surface that is inclined with respect to the seating surface.
- the seating surface is provided with screw holes into which screws 75, which will be described later, are screwed.
- the coated tool 1 is positioned in the pocket 73 of the holder 70 and attached to the holder 70 with screws 75 . That is, the screw 75 is inserted into the through hole 5 of the coated tool 1, and the tip of the screw 75 is inserted into the screw hole formed in the seating surface of the pocket 73 to screw the screw portions together. Thereby, the coated tool 1 is attached to the holder 70 so that the cutting edge portion 3 protrudes outward from the holder 70 .
- the embodiment exemplifies a cutting tool used for so-called turning.
- Turning includes, for example, inner diameter machining, outer diameter machining, and grooving.
- the cutting tools are not limited to those used for turning.
- the coated tool 1 may be used as a cutting tool used for milling.
- the cutting of a work material includes (1) a step of rotating the work material, (2) a step of bringing the cutting edge 11 of the coated tool 1 into contact with the rotating work material to cut the work material, and and (3) separating the coated tool 1 from the work piece.
- Representative examples of the material of the work material include carbon steel, alloy steel, stainless steel, cast iron, non-ferrous metals, and the like.
- the coated tool 1 in which the substrate 10 made of boron nitride particles or the like is attached to the tip body 2 made of cemented carbide or the like and coated with the coating layer 20 has been described.
- the coated tool according to the present disclosure for example, has a hexahedral substrate whose upper and lower surfaces are parallelograms, and all of which are cubic boron nitride sintered bodies, and the coated tool is coated on the substrate. Layers may be formed.
- the upper and lower surfaces of the covered tool 1 are parallelogram-shaped is shown, but the upper and lower surfaces of the covered tool 1 may be rhombic, square, or the like. Moreover, the shape of the upper surface and the lower surface of the coated tool 1 may be triangular, pentagonal, hexagonal, or the like.
- the shape of the coated tool 1 may be either positive type or negative type.
- the positive type is a type in which side surfaces are inclined with respect to a central axis passing through the center of the upper surface and the center of the lower surface of the coated tool 1
- the negative type is a type in which the side surfaces are parallel to the central axis.
- the substrate 10 contains cubic boron nitride (cBN) particles.
- the substrates disclosed herein may contain particles such as, for example, hexagonal boron nitride (hBN), rhombohedral boron nitride (rBN), wurtzite boron nitride (wBN), and the like.
- the substrate 10 is not limited to boron nitride, and may be cemented carbide, cermet, or the like.
- Cemented carbide contains W (tungsten), specifically WC (tungsten carbide).
- the cemented carbide may contain Ni (nickel) or Co (cobalt).
- the cermet contains, for example, Ti (titanium), specifically TiC (titanium carbide) or TiN (titanium nitride).
- the cermet may contain Ni or Co.
- the coated tool 1 is used for cutting, but the coated tool according to the present application can also be applied to tools other than cutting tools, such as excavating tools and blades.
- Cutting edge portion 6 First surface 7: Second surface 8: Ridge line portion 9: Third surface 10: Substrate 11: Cutting edge 20: Coating layer 20A: High adhesion layer 20B: Low adhesion layer 21: hard layer 22: metal layer 23: laminated portion 23a: first metal nitride layer 23b: second metal nitride layer 24: third metal nitride layer 30: substrate 61: corner portion 100: cutting tool 201: third 1 Coating layer 202: Second coating layer 203: Third coating layer
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- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0248103A (ja) * | 1989-06-20 | 1990-02-16 | Sumitomo Electric Ind Ltd | 被覆超硬合金工具及びその製造法 |
WO2005105348A1 (ja) * | 2004-04-30 | 2005-11-10 | Sumitomo Electric Hardmetal Corp. | 表面被覆立方晶窒化硼素焼結体工具およびその製造方法 |
JP2006281363A (ja) * | 2005-03-31 | 2006-10-19 | Kyocera Corp | 表面被覆部材および表面被覆切削工具 |
JP2008105164A (ja) * | 2006-10-27 | 2008-05-08 | Kyocera Corp | 表面被覆切削工具 |
JP2008229839A (ja) * | 2007-02-23 | 2008-10-02 | Kyocera Corp | 被覆層付き切削工具および切削装置 |
JP2011093053A (ja) * | 2009-10-30 | 2011-05-12 | Mitsubishi Materials Corp | 切削工具およびその製造方法 |
WO2012056758A1 (ja) * | 2010-10-28 | 2012-05-03 | 住友電工ハードメタル株式会社 | 表面被覆焼結体 |
WO2017188266A1 (ja) * | 2016-04-25 | 2017-11-02 | 京セラ株式会社 | インサート及び切削工具 |
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- 2022-01-26 WO PCT/JP2022/002929 patent/WO2022163719A1/ja active Application Filing
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0248103A (ja) * | 1989-06-20 | 1990-02-16 | Sumitomo Electric Ind Ltd | 被覆超硬合金工具及びその製造法 |
WO2005105348A1 (ja) * | 2004-04-30 | 2005-11-10 | Sumitomo Electric Hardmetal Corp. | 表面被覆立方晶窒化硼素焼結体工具およびその製造方法 |
JP2006281363A (ja) * | 2005-03-31 | 2006-10-19 | Kyocera Corp | 表面被覆部材および表面被覆切削工具 |
JP2008105164A (ja) * | 2006-10-27 | 2008-05-08 | Kyocera Corp | 表面被覆切削工具 |
JP2008229839A (ja) * | 2007-02-23 | 2008-10-02 | Kyocera Corp | 被覆層付き切削工具および切削装置 |
JP2011093053A (ja) * | 2009-10-30 | 2011-05-12 | Mitsubishi Materials Corp | 切削工具およびその製造方法 |
WO2012056758A1 (ja) * | 2010-10-28 | 2012-05-03 | 住友電工ハードメタル株式会社 | 表面被覆焼結体 |
WO2017188266A1 (ja) * | 2016-04-25 | 2017-11-02 | 京セラ株式会社 | インサート及び切削工具 |
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