WO2022161415A1

WO2022161415A1 - Phase-change memory cell, phase-change memory, and electronic device

Info

Publication number: WO2022161415A1
Application number: PCT/CN2022/074134
Authority: WO
Inventors: 陈鑫
Original assignee: 华为技术有限公司
Priority date: 2021-02-01
Filing date: 2022-01-27
Publication date: 2022-08-04
Also published as: CN114843395A

Abstract

The present application belongs to the technical field of semiconductor storage. Disclosed are a phase-change memory cell, a phase-change memory, and an electronic device. The phase-change memory cell comprises a phase-change film, wherein the phase-change film comprises multiple phase-change material layers and multiple conductive insulating layers. The phase-change material layers and the conductive insulating layers are alternately arranged one below the other. The phase-change material layers are made of a phase-change material, and the conductive insulating layers are made of a conductive crystal material. Lattice mismatching between the phase-change material and the conductive crystal material is less than or equal to 10%, and the melting point of the phase-change material is lower than the melting point of the conductive crystal material. The phase-change material layer using the conductive crystal material layer as a crystal growth template facilitates a significant reduction in a crystallization time. The conductive insulating layer maintaining a stable crystal structure effectively prevents element migration of the phase-change material in the direction of an electric field.

Description

Phase change memory cell, phase change memory and electronic equipment

technical field

The present disclosure relates to the technical field of semiconductor storage, and in particular, to a phase-change memory cell, a phase-change memory, and an electronic device.

Background technique

Phase-change memory uses phase-change materials as storage media, which can be reversibly transformed between crystalline and amorphous states. The difference to realize the storage of data "0" and "1", the choice of phase change material has an important impact on the read and write speed of the phase change memory.

A related technology provides a superlattice phase change material, which is formed by alternately stacking multiple layers of GeTe films and multiple layers of Sb ₂ Te ₃ films, and has a high phase change speed, which is beneficial to improve the readability of the phase change memory. write speed. However, in the superlattice phase change material provided by the related art, during the operation, the Te element and the Sb element migrate to different electric field directions, so that the Sb-rich region and the Te-rich region are formed inside the phase change material, which is not conducive to the superlattice. The repeated erasing and writing of the phase change material will easily reduce its cycle life. In another related art, although an insulating layer with a high melting point can be added to the phase change material layer to hinder the element diffusion during the phase change process of the phase change material, the lattice loss between the phase change layer and the tissue diffusion layer is lost. The degree of distribution is greater than or equal to 11%, which limits the improvement of the phase transition speed of the superlattice.

SUMMARY OF THE INVENTION

In view of this, the present disclosure provides a phase-change memory cell, a phase-change memory, and an electronic device, which can solve the above-mentioned technical problems.

Specifically, it includes the following technical solutions:

In one aspect, embodiments of the present disclosure provide a phase-change memory cell, the phase-change memory cell comprising a phase-change film;

The phase change film comprises: multiple layers of phase change material and multiple layers of conductive insulation layers, the phase change material layers and the conductive insulation layers are alternately stacked;

The phase change material layer is formed of a phase change material, and the conductive isolation layer is formed of a conductive crystal material;

The degree of lattice mismatch between the phase change material and the conductive crystal material is less than or equal to 10%, and the melting point of the phase change material is lower than the melting point of the conductive crystal material.

The lattice mismatch between the phase change material and the conductive crystal material provided by the embodiment of the present invention is less than or equal to 10%, and the melting point of the phase change material is lower than the melting point of the conductive crystal material, which can prevent the phase change material from changing in phase During the process of element diffusion, the lattice mismatch degree between the phase change material and the conductive crystal material is less than or equal to 10%, which is beneficial to improve the phase change speed of the superlattice.

In some possible implementations, the degree of lattice mismatch between the phase change material and the conductive crystalline material is less than or equal to 5%.

The small difference in lattice constant between the phase change material and the conductive crystal material can provide power for the crystallization of the phase change material, and is beneficial to further improve the stability of the crystal structure formed when the phase change material is crystallized.

In some possible implementations, the phase change material layer has a thickness of 1 nm-10 nm;

The thickness of the conductive insulating layer is 1 nm-10 nm.

In some possible implementations, the cycle period of alternately stacking the phase change material layer and the conductive insulating layer is 2-50.

The thickness of the phase change material layer and the thickness of the conductive insulating layer, and the cycle period of alternately stacking the phase change material layer and the conductive insulating layer are within the above ranges, so as to be suitable for the phase change memory cell.

In some possible implementations, the phase change material is a Ge-Te binary compound, Sb _x Te _1-x (0.8<x≤1), a Bi-Te binary compound or a Ge-Sb-Te ternary compound ;

The conductive crystal material is ScTe, Sc ₂ Te ₃ , PtTe ₂ , Pt ₂ Te ₃ , PdTe ₂ , MoTe ₂ , Cr ₂ Te ₃ , SiTe ₂ , Si ₂ Te ₃ , NiTe ₂ , or CuTe ₂ .

The above-mentioned types of conductive crystalline materials have a stable crystal structure, which can effectively prevent the element migration of the phase change material in the direction of the electric field, and at the same time, when the lattice mismatch between the conductive crystalline material and the phase change material is kept less than or equal to 10% , the phase change material layer can use the conductive crystal material layer as a crystal growth template, which is beneficial to significantly reduce the crystallization time and improve the phase change speed of the phase change material.

In some possible implementations, the phase-change memory unit further includes: a substrate, a bottom electrode, a top electrode, and an insulating and heat insulating layer;

the bottom electrode is located on the surface of the substrate;

the phase change film is connected between the bottom electrode and the top electrode;

The insulating and heat insulating layer covers the side portion of the phase change film.

In some possible implementations, the phase-change memory cell is a confinement structure;

The top electrode, the phase change film, the bottom electrode, and the substrate are in contact with each other in sequence.

The phase change memory cell of this type of confinement structure reduces the current required for the RESET operation by reducing the volume of the phase change material layer, which is beneficial to obtain stronger stability.

The phase change memory unit further includes: a heating electrode;

The top electrode, the phase change film, the heating electrode, the bottom electrode, and the substrate are in contact with each other in sequence.

The phase change memory cell of this type of confinement structure reduces the current required for the RESET operation by reducing the volume of the phase change material layer, which is beneficial to obtain stronger stability. In addition, by using the heating electrode to contact the bottom surface of the phase change film, the phase change material layer can obtain higher heat generation efficiency, reduce heat dissipation, and help improve the phase change speed.

In some possible implementations, the phase-change memory cell is a T-type structure;

The substrate has a through hole, and the bottom electrode is located in the through hole;

The top electrode, the phase change film, and the substrate are in contact with each other in sequence, and the phase change film is also connected to the bottom electrode.

The phase-change memory cell with the T-type structure can reduce the contact area between the bottom electrode and the phase-change material layer, which is beneficial to improve thermal resistance and thermal efficiency.

On the other hand, an embodiment of the present disclosure also provides a phase change memory, where the phase change memory includes a plurality of any of the foregoing phase change memory cells.

Based on the use of the above phase change memory cells, the phase change memory provided by the embodiments of the present disclosure has at least the following advantages: high-density multi-value storage, high stability, good repeatability, and fast read and write speed.

In another aspect, an embodiment of the present disclosure further provides an electronic device, the electronic device includes a processor and the above-mentioned phase change memory, where the phase change memory is used to store data accessed by the processor.

Description of drawings

FIG. 1 is a schematic structural diagram of an exemplary phase change film provided by an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a crystal structure model of an exemplary GeTe/ScTe phase change thin film according to an embodiment of the present disclosure;

3 is a schematic diagram of a first preparation step of a phase-change memory cell with an exemplary confinement structure provided by an embodiment of the present disclosure;

4 is a schematic diagram of a second preparation step of a phase-change memory cell with an exemplary confinement structure provided in an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of a third preparation step of a phase-change memory cell with an exemplary confinement structure provided by an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a fourth preparation step of a phase-change memory cell with an exemplary confinement structure provided by an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of a phase-change memory cell with an exemplary confinement structure provided by an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of a preparation step of another exemplary confinement-structured phase-change memory cell according to an embodiment of the present disclosure;

9 is a schematic diagram of another preparation step of a phase change memory cell with another exemplary confinement structure provided in an embodiment of the present disclosure;

FIG. 10 is a schematic structural diagram of a phase change memory cell with another exemplary confinement structure provided by an embodiment of the present disclosure;

FIG. 11 is a schematic diagram of a first preparation step of an exemplary T-structured phase change memory cell according to an embodiment of the present disclosure;

FIG. 12 is a schematic diagram of a second preparation step of an exemplary T-structured phase change memory cell according to an embodiment of the present disclosure;

FIG. 13 is a schematic diagram of a third preparation step of an exemplary T-structured phase change memory cell according to an embodiment of the present disclosure;

FIG. 14 is a schematic diagram of a fourth preparation step of an exemplary T-structured phase change memory cell according to an embodiment of the present disclosure;

FIG. 15 is a schematic diagram of a fifth preparation step of an exemplary T-structured phase change memory cell according to an embodiment of the present disclosure;

FIG. 16 is a schematic diagram of a sixth preparation step of an exemplary T-structured phase change memory cell according to an embodiment of the present disclosure;

FIG. 17 is a schematic structural diagram of an exemplary T-structured phase-change memory cell according to an embodiment of the present disclosure;

18 is a schematic diagram of a class of application scenarios of an exemplary phase change memory cell provided by an embodiment of the present disclosure;

FIG. 19 is a schematic diagram of another type of application scenario of an exemplary phase change memory cell provided by an embodiment of the present disclosure.

The reference numerals denote:

1-phase change film, 101-phase change material layer, 102-conductive insulating layer,

2-substrate, 201-through hole,

31-bottom electrode, 32-top electrode,

4- Insulation and heat insulation layer,

401 - Insulation Hole,

5- Heating electrode,

100-Multivalued Phase Change Memory,

200 - dynamic random access memory,

300 - cache,

400-processor,

500 - Solid State Drive.

Detailed ways

In order to make the technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

Phase-change memory is a solid-state semiconductor non-volatile memory, which has the advantages of high-speed reading, high rewritable times, non-volatility, small component size, and low power consumption, and is widely used in semiconductor memory and other products. Phase-change memory uses phase-change materials as storage media, which can be reversibly transformed between crystalline and amorphous states. difference to realize the storage of data "0" and "1".

The working process of the phase change memory includes: SET process and RESET process. The SET process refers to: applying a wide and weak electric pulse to heat the phase change material, so that the temperature of the phase change material is increased to between the crystallization temperature and the melting temperature, and the phase change material crystallizes into an ordered state, forming a relatively stable state. Low resistivity crystalline state to achieve data "0" storage. The RESET process refers to the application of a narrow and strong electrical pulse to heat the phase change material, so that the temperature of the phase change material rises above the melting temperature, melts into a disordered state, and then undergoes a rapid cooling quenching process (> 10 ⁹ K/s), the phase change material directly enters the amorphous state with higher resistivity from the molten state to realize the storage of data "1".

It can be seen that the phase change speed of the phase change material directly affects the read and write speed of the phase change memory. The related art provides a superlattice phase change material, which is composed of multiple layers of GeTe thin films and multiple layers of Sb ₂ Te ₃ thin films alternately superimposed This kind of superlattice phase change material has a high phase change speed.

However, in the superlattice phase change material provided by the related art, during the operation, the Te element and the Sb element migrate to different electric field directions, so that the Sb-rich region and the Te-rich region are formed inside the phase change material, which is not conducive to the superlattice. The repeated erasing and writing of the phase change material will easily reduce its cycle life.

An embodiment of the present disclosure provides a phase-change memory cell, the phase-change memory cell includes a phase-change film 1, and as shown in FIG. 1 , the phase-change film 1 includes: a multi-layer phase-change material layer 101 and a multi-layer conductive insulation layer 102, the phase change material layer 101 and the conductive insulating layer 102 are alternately stacked;

The phase change material layer 101 is formed of a phase change material, and the conductive isolation layer 102 is formed of a conductive crystal material;

"The phase change material layers 101 and the conductive insulating layers 102 are alternately stacked" in the embodiments of the present disclosure, which means that there is one conductive insulating layer 102 between any two phase change material layers 101, or, any two layers There is a phase change material layer 101 between the conductive insulating layers 102 . That is to say, the phase change film 1 is a periodic cyclic structure formed by alternately stacking the phase change material layers 101 and the conductive insulating layers 102 , and belongs to the superlattice phase change material.

In the phase change memory cell provided by the embodiment of the present disclosure, based on the phase change film 1 used, the phase change material layers 101 and the conductive isolation layers 102 are alternately stacked, wherein the conductive crystal material used in the conductive isolation layer 102 has conductivity, so that the It has low resistance characteristics, so that the phase change material layer 101 and the conductive isolation layer 102 form a series relationship, and the resistance identification of the phase change material layer 101 is not affected. The melting point of the phase change material is lower than the melting point of the conductive crystal material, so that when the phase change material layer 101 undergoes a phase change, the conductive insulating layer 102 will maintain a stable crystal structure, effectively preventing the element migration of the phase change material in the direction of the electric field, which is beneficial to Improve the cycle life of phase change materials. The lattice mismatch between the phase change material and the conductive crystal material is less than or equal to 10%, so that the phase change material layer 101 can be crystallized from the interface of the conductive crystal material layer by epitaxial growth, and the conductive crystal material layer is used as the crystal growth. The template is beneficial to significantly reduce the crystallization time, improve the phase change speed of the phase change material, and further improve the read and write speed of the phase change memory. In addition, since the multi-layer phase change material layer 101 is used, the phase change film 1 can be phase-changed in layers, so as to obtain the capability of multi-level storage, which is beneficial to improve the data storage density of the phase change memory.

In the embodiment of the present disclosure, the crystal structures of the phase change material and the conductive crystal material are similar, or at least the crystal forms of the contact crystal planes of the phase change material and the conductive crystal material are similar, so as to obtain a higher degree of lattice matching between the two. , so that the conductive crystal material can be used as the crystal template of the phase change material.

In the embodiments of the present disclosure, the degree of lattice mismatch between the phase change material and the conductive crystal material is less than or equal to 10%, and in some possible implementations, the degree of lattice mismatch between the phase change material and the conductive crystal material is less than or equal to 5 %, further less than or equal to 4%, less than or equal to 3%, less than or equal to 2%, less than or equal to 1%, less than or equal to 0.5%, so that the phase change material can obtain a faster crystallization rate.

In addition, when the degree of lattice mismatch between the phase change material and the conductive crystal material is less than or equal to 5%, the small difference in lattice constant between the phase change material and the conductive crystal material can be a phase change The crystallization of the material provides the driving force, which is beneficial to further improve the stability of the crystalline structure formed when the phase change material is crystallized.

In some possible implementations, the thicknesses of the multilayer phase change material layers 101 involved in the phase change film 1 are all in the range of 1 nm-10 nm, such as 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm , 10 nm, etc., and the thicknesses of the multilayered phase change material layers 101 may all be the same, some of the phase change material layers 101 may be the same, or all the phase change material layers 101 may be different. The thickness of the phase change film 1 of any layer can be determined according to the corresponding operating voltage or operating current when the phase change occurs.

In some possible implementations, the thickness of the conductive insulating layer 102 involved in the phase change film 1 is in the range of 1 nm-10 nm, for example, 1 nm, 2 nm, 3 nm, 4 nm, 5 nm, 6 nm, 7 nm, 8 nm, 9 nm, 10 nm, etc. Moreover, the thicknesses of the multilayer conductive insulating layers 102 may all be the same, the thicknesses of some of the conductive insulating layers 102 may be the same, and the thicknesses of all the conductive insulating layers 102 may be different from each other. For any thickness of the conductive insulating layer 102 , the thickness of the conductive insulating layer 102 must be sufficient to effectively prevent the migration of elements between two adjacent phase change material layers 101 . The thickness of the conductive isolation layer 102 is determined by the magnitude of the corresponding operating voltage or operating current when the layer 101 undergoes a phase transition.

The thickness of the phase-change material layer and the thickness of the conductive insulating layer are within the above-mentioned ranges, so as to be suitable for the phase-change memory cell and obtain a wider adjustment range.

Taking a phase change material layer 101 and a layer of conductive insulating layer 102 stacked thereon as a cycle, in the embodiment of the present disclosure, the cycle cycle of alternately stacking the phase change material layer 101 and the conductive insulating layer 102 can be 2-50 , such as 2-10, 5-15, 5-20, 10-30, 15-40, etc.

For example, if the cycle period of alternately stacking the phase change material layer 101 and the conductive insulating layer 102 is 5, for example, the phase change film 1 may include the first phase change material layer 101 / the first conductive insulating layer 102 stacked in sequence / second phase change material layer 101 / second conductive isolation layer 102 / third phase change material layer 101 / third conductive isolation layer 102 / fourth phase change material layer 101 / fourth conductive isolation layer 102 / fifth phase change Material layer 101 / fifth conductive isolation layer 102 . The fifth conductive isolation layer 102 is optional.

In the phase change film 1, the types of phase change materials used in the multi-layer phase change material layer 101 may all be the same, may be partially different, or may be completely different. Correspondingly, the conductive crystal materials used in the multi-layer conductive insulating layer 102 The types may all be the same, some may be different, or all may be different. The type of the conductive isolation layer 102 must be selected according to the type of the adjacent phase change material layer 101 to ensure that the degree of lattice mismatch between the adjacent conductive isolation layer 102 and the phase change material layer 101 is less than or equal to 10%.

In some possible implementations, the phase change material is GeTe (germanium telluride) binary compound, Sb _x Te _1-x (0.8<x≤1), Bi-Te binary compound, or Ge-Sb-Te ternary compound compound;

The conductive crystal materials are ScTe (scandium telluride), Sc ₂ Te ₃ (two scandium tritelluride), PtTe ₂ (platinum ditelluride), Pt ₂ Te ₃ (two platinum tri telluride), PdTe ₂ (ditelluride) palladium), MoTe ₂ (molybdenum ditelluride), Cr ₂ Te ₃ (chromium tritelluride), SiTe ₂ (silicon ditelluride), Si ₂ Te ₃ (disilinium tritelluride), NiTe ₂ (ditelluride) nickel), or CuTe ₂ (copper ditelluride).

The above types of phase change materials can be used in combination with the following types of conductive crystal materials, as long as the lattice mismatch between the phase change materials used in combination and the conductive crystal materials is less than or equal to 10%, and the phase change materials used in combination The melting point of the conductive crystal material can be lower than the melting point of the conductive crystal material. The above-mentioned types of conductive crystalline materials have a stable crystal structure, which can effectively prevent the element migration of the phase change material in the direction of the electric field, and at the same time, when the lattice mismatch between the conductive crystalline material and the phase change material is kept less than or equal to 10% , the phase change material layer can use the conductive crystal material layer as a crystal growth template, which is beneficial to significantly reduce the crystallization time and improve the phase change speed of the phase change material.

For example, the embodiment of the present disclosure provides such a phase change film 1, which includes a phase change material layer 101 formed of a binary compound GeTe, and a conductive isolation layer 102 formed of a compound ScTe.

2 shows a schematic diagram of the crystal structure model of the GeTe/ScTe phase change film. The crystal forms of the compound GeTe and the compound ScTe are both hexagonal, and the contact crystal planes of the two are regular hexagons, that is to say, the side length All are of equal length, and the angle between adjacent sides is 120°. The lattice parameter of the contact crystal plane of the compound GeTe is

The lattice parameter of the contact plane of the compound ScTe is

The lattice mismatch between the two is 0.91%, so that the phase change material layer 101 made of GeTe material can be rapidly crystallized on the interface of the conductive insulating layer 102 made of ScTe material by epitaxial growth, which significantly improves the GeTe phase change material. The crystallization speed of the layer 101 reduces the crystallization time of the phase change material layer 101 .

In addition, the melting point of the compound GeTe is lower than the melting point of the compound ScTe, so that during the phase change of the phase change material layer 101 of the GeTe material, the conductive insulating layer 102 of the ScTe material will maintain a stable crystal structure, preventing the phase change material. Elements diffuse and migrate in the direction of the electric field, improving their cycle life.

The phase change film 1 provided in the embodiment of the present disclosure can be prepared by adopting the following preparation method: providing a phase change material and a conductive crystal material.

Using the phase change material and the conductive crystal material, the phase change material layer 101 and the conductive isolation layer 102 are alternately formed in turn through a thin film deposition process to obtain the phase change film 1 .

In some possible implementations, the phase change material is GeTe binary compound, Sb _x Te _1-x (0.8<x≤1), Bi-Te binary compound or Ge-Sb-Te ternary compound;

The thin film deposition processes used include, but are not limited to, the following: atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), in particular, such as plasma Volume enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process, magnetron sputtering, electron beam evaporation, etc.

The magnetron sputtering process can be used not only to form phase change films, but also to form electrode layers. In order to obtain the desired film structure, the applicable magnetron sputtering parameters are as follows:

The background vacuum degree is ^10-3 Pa- ^10-5 Pa, for example, 1× ^10-4 Pa-5× ^10-4 Pa;

The sputtering gas pressure is 0.3Pa-0.8Pa, for example, 0.5Pa;

The sputtering gas includes but is not limited to: at least one of argon Ar, krypton Kr, xenon Xe, neon Ne, nitrogen N ₂ , because argon is cheap and easy to obtain, argon Ar can be selected as the magnetron Sputter working gas.

When used to form the phase change film 1, radio frequency magnetron sputtering is used, the temperature of the substrate, that is, the temperature of the sample stage is 180°C-350°C, such as 200°C, 250°C, 300°C, etc., and the sputtering power is 70W -90W, for example, 75W, etc., in order to facilitate the smooth formation of the phase change film 1 .

When used to form the electrode layer, sputtering with DC power is adopted, the substrate temperature is 20°C-30°C, eg, 25°C, and the sputtering power is 100W-150W, eg, 120W, etc.

The phase-change memory cell further provided by the embodiments of the present disclosure is based on using any of the above-mentioned phase-change films, so that the phase-change memory cell has at least the following advantages:

(1) The conductive crystal material used in the conductive isolation layer 102 has conductivity, so that it has low resistance characteristics, so that the phase change material layer 101 and the conductive isolation layer 102 form a series relationship, and the resistance identification of the phase change material layer 101 is not affected, so that Phase change memory cells have good performance of storing data.

(2) The melting point of the phase change material is lower than the melting point of the conductive crystal material. When the phase change material layer 101 undergoes a phase change, the conductive insulating layer 102 will maintain a stable crystal structure, which effectively prevents the element migration of the phase change material in the direction of the electric field. It is beneficial to improve the cycle life of the phase change material, thereby improving the cycle life of the phase change memory unit.

(3) The degree of lattice mismatch between the phase change material and the conductive crystal material is less than or equal to 10%, in particular, less than or equal to 5%, for example, less than 1%, so that the phase change material layer 101 can be grown from conductive materials by epitaxial growth. The interface of the crystal material layer is crystallized, and the conductive crystal material layer is used as a crystal growth template, which is beneficial to significantly reduce the crystallization time, improve the phase change speed of the phase change material, and further improve the read and write speed of the phase change memory.

(4) Due to the use of the multi-layer phase change material layer 101, the phase change film 1 can be phase-changed in layers to obtain the ability of multi-level storage, so that the storage unit can realize multi-value storage, which is beneficial to improve the data storage density of the phase change memory. .

In addition to the phase change film 1 provided in the embodiment of the present disclosure, the phase change memory cell further includes a substrate 2, a top electrode 32, a bottom electrode 31, and an insulating and heat insulating layer, as shown in FIG. 7 . 4; wherein, the bottom electrode 31 is located on the surface of the substrate 2; the phase change film 1 is connected between the bottom electrode 31 and the top electrode 32;

In the embodiment of the present disclosure, the direction close to the substrate 2 is defined as the bottom direction, and the direction away from the substrate 2 is defined as the top direction.

The structures of the phase-change memory cells include, but are not limited to: (1) confinement-type structure, (2) T-type structure, etc. The structures of the phase-change memory cells of these two types of structures are exemplarily described below:

(11) In some possible implementations, an embodiment of the present disclosure provides a phase-change memory cell with a confinement structure, wherein, as shown in FIG. 7 , from the top to the bottom, the top electrode 32 , the phase change The thin film 1, the bottom electrode 31, and the substrate 2 are in contact with each other in sequence.

That is, the bottom electrode 31 is formed on the top surface of the substrate 2 , the phase change film 1 is formed on the top surface of the bottom electrode 31 , and the top electrode 32 is formed on the top surface of the phase change film 1 . In addition, the insulating layer 4 covers the side of the phase change film 1 and is located between the bottom electrode 31 and the top electrode 32 .

In this implementation manner, the bottommost layer of the phase change film 1 may be the phase change material layer 101 or the conductive insulating layer 102. For example, FIG. 7 shows that the bottommost layer of the phase change film 1 is the phase change material layer 101; The topmost layer of the phase change film 1 may be the phase change material layer 101 or the conductive insulating layer 102 . For example, FIG. 7 shows that the topmost layer of the phase change film 1 is the conductive insulating layer 102 .

The thickness of the phase change film 1 can be made smaller than the depth of the heat insulating hole 401, so that the bottom of the top electrode 32 is partially located in the heat insulating hole 401 to contact the phase change film 1; The top surface of the change film 1 is flat, so that the bottom surface of the top electrode 32 is also kept flat so as to be in contact with the insulating heat insulating layer 4 and the top surface of the phase change film 1 at the same time.

For the phase change memory cell of the confinement structure shown in (11), for example, when the bottommost layer of the phase change film 1 is the phase change material layer 101, since the bottom surface of the bottommost phase change material layer 101 is completely connected to the bottom electrode 31 In this way, under a specific operating voltage or operating current, the phase change material layer 101 of the bottommost layer can all undergo a phase change. Compared with the bottom electrode 31 , the volume of the phase change material layer 101 is relatively small, and this type of structure reduces the current required for the RESET operation by reducing the volume of the phase change material layer 101 to obtain stronger stability.

For this type of structure, by changing the operating voltage or operating current, the number of phase-change material layers 101 that undergo phase change can be changed (when these phase-change material layers 101 are phase-changed, they are all phase-changed). For example, in the direction from the bottom to the top, only the lowest phase change material layer 101 may be phase-transformed, or two phase-change material layers 101 may be phase-transformed, or three phase-change material layers may be phase-transformed 101 undergoes a phase change, etc., so that the phase-change memory cell achieves the effect of a layered phase change, and has the capability of multi-level storage.

For this type of phase change memory cell, it can be prepared by the following methods:

Step 1101 : Referring to FIG. 3 , a cleaned substrate 2 is provided, and a bottom electrode 31 is formed on the surface of the substrate 2 .

Step 1102 : Referring to FIG. 4 , an insulating and heat-insulating layer 4 is formed on the surface of the bottom electrode 31 , so that the insulating and heat-insulating layer 4 completely covers the bottom electrode 31 . Referring to FIG. 5 , the insulating and heat-insulating layer 4 is then etched. In particular, the portion of the insulating and heat-insulating layer 4 corresponding to the heat-insulating holes 401 is etched away, and the bottom electrode 31 is exposed. Insulation holes 401 are formed in layer 4 .

Step 1103 : Referring to FIG. 6 , according to the preparation method of the phase change film 1 , the phase change film 1 is formed in the heat insulating hole 401 . In particular, according to the distribution order of the phase change material layer 101 and the conductive insulating layer 102 in the phase change film 1 , the phase change material layer 101 and the conductive insulating layer 102 are alternately formed in the heat insulating hole 401 to obtain the phase change film 1 .

Step 1104 : Referring to FIG. 7 , a top electrode 32 is formed on the top surfaces of the phase change film 1 and the insulating and heat insulating layer 4 to obtain a phase change memory cell.

(12) In some possible implementations, an embodiment of the present disclosure provides a phase change memory cell with a confinement structure. As shown in FIG. 10 , the phase change memory cell with a confinement structure includes: a phase change film 1 , substrate 2, top electrode 32, bottom electrode 31, insulating layer 4, heating electrode 5; direction from top to bottom, top electrode 32, phase change film 1, heating electrode 5, bottom electrode 31, substrate 2 contact sequentially.

That is, the bottom electrode 31 is formed on the top surface of the substrate 2 , the heater electrode 5 is formed on the top surface of the bottom electrode 31 , the phase change film 1 is formed on the top surface of the heater electrode 5 , and the top electrode 32 is formed on the phase change film 1 the top surface. In addition, the insulating layer 4 covers the side of the phase change film 1 and is located between the bottom electrode 31 and the top electrode 32 .

In this implementation manner, the bottommost layer of the phase change film 1 may be the phase change material layer 101 or the conductive insulating layer 102. For example, FIG. 10 shows that the bottommost layer of the phase change film 1 is the phase change material layer 101; The topmost layer of the phase change film 1 may be the phase change material layer 101 or the conductive insulating layer 102 . For example, FIG. 10 shows that the topmost layer of the phase change film 1 is the conductive insulating layer 102 .

For the phase change memory cell with confinement structure shown in (12), the difference from the phase change memory cell with confinement structure shown in (11) is only that the heating electrode 5 is used instead of the bottom electrode 31 to communicate with The bottom surface of the phase change film 1 is in contact. The use of the heating electrode 5 can enable the phase change material layer 101 to obtain higher heat generation efficiency, reduce heat dissipation, and help increase the phase change speed. Besides, the working principle of the confinement structure phase change memory cell shown in (12) is similar to that of the confinement structure phase change memory cell shown in (11).

Step 1201 : Referring to FIG. 3 , a cleaned substrate 2 is provided, and a bottom electrode 31 is formed on the surface of the substrate 2 .

Step 1202 : Referring to FIG. 4 , an insulating and heat-insulating layer 4 is formed on the surface of the bottom electrode 31 , so that the insulating and heat-insulating layer 4 completely covers the bottom electrode 31 . Referring to FIG. 5 , the insulating and heat-insulating layer 4 is then etched. In particular, the portion of the insulating and heat-insulating layer 4 corresponding to the heat-insulating holes 401 is etched away, and the bottom electrode 31 is exposed. Insulation holes 401 are formed in layer 4 .

Step 1203 : Referring to FIG. 8 , the heating electrode 5 is formed in the heat insulating hole 401 .

Step 1204 : Referring to FIG. 9 , according to the preparation method of the phase change film 1 , continue to form the phase change film 1 on the heating electrode 5 . In particular, according to the distribution order of the phase change material layer 101 and the conductive insulating layer 102 in the phase change film 1, the phase change material layer 101 and the conductive insulating layer 102 are alternately formed on the heating electrode 5 located in the heat insulating hole 401 in turn, so as to obtain Phase change film 1.

Step 1205 : Referring to FIG. 10 , a top electrode 32 is formed on the top surfaces of the phase change film 1 and the insulating and heat insulating layer 4 to obtain a phase change memory cell.

(2) In some possible implementations, an embodiment of the present disclosure provides a phase-change memory cell with a T-type structure. As shown in FIG. 17 , the phase-change memory cell with a T-type structure includes: a phase change film 1 , the substrate 2, the top electrode 32, the bottom electrode 31, the insulating layer 4; wherein, the substrate 2 has a through hole 201, and the bottom electrode 31 is located in the through hole 201; the top electrode 32, the phase change film 1, the substrate 2 are sequentially contacted, and the phase change film 1 is also connected to the bottom electrode 31 .

That is, the bottom electrode 31 is formed in the through hole 201 of the substrate 2 , the phase change film 1 is formed on both the bottom electrode 31 and the top surface of the substrate 2 , and the top electrode 32 is formed on the top surface of the phase change film 1 . In addition, the insulating and heat insulating layer 4 covers the side portion of the phase change film 1 .

In this implementation manner, the bottommost layer of the phase change film 1 may be the phase change material layer 101 or the conductive insulating layer 102. For example, FIG. 17 shows that the bottommost layer of the phase change film 1 is the phase change material layer 101; The topmost layer of the phase change film 1 may be the phase change material layer 101 or the conductive insulating layer 102 . For example, FIG. 17 shows that the topmost layer of the phase change film 1 is the conductive insulating layer 102 .

For the phase-change memory cell of the T-type structure shown in (2), for example, when the bottommost layer of the phase-change film 1 is the phase-change material layer 101, because part of the bottom surface of the bottommost phase-change material layer 101 and the bottom electrode 31 contacts, so that under a specific operating voltage or operating current, only the part of the phase change material layer 101 in contact with the bottom electrode 31 undergoes a phase change, and the rest may not undergo a phase change. This type of structure improves thermal resistance and thermal efficiency by reducing the contact area between the bottom electrode 31 and the phase change material layer 101 .

For this type of structure, by changing the operating voltage or operating current, the number of phase-change material layers 101 that undergo phase change can be changed (these phase-change material layers 101 are partially phase-changed when they undergo phase change). For example, in the direction from the bottom to the top, only the lowest phase change material layer 101 may be phase-transformed, or two phase-change material layers 101 may be phase-transformed, or three phase-change material layers may be phase-transformed The layer 101 undergoes a phase change, etc., so that the phase change memory cell achieves the effect of a layered phase change and has the capability of multi-level storage.

Step 201 : Referring to FIG. 11 , forming a via hole 201 on the substrate 2 , referring to FIG. 12 , forming a bottom electrode 31 in the via hole 201 and making the top surfaces of the substrate 2 and the bottom electrode 31 level.

Step 202 : Referring to FIG. 13 , according to the preparation method of the phase change film 1 , the phase change film 1 is formed on the top surfaces of the substrate 2 and the bottom electrode 31 . In particular, according to the distribution order of the phase change material layer 101 and the conductive insulating layer 102 in the phase change film 1, the phase change material layer 101 and the conductive insulating layer 102 are alternately formed on the top surfaces of the substrate 2 and the bottom electrode 31 in turn to obtain Phase change film 1.

Step 203 : Referring to FIG. 14 , continue to form the top electrode 32 on the top surface of the phase change film 1 .

Step 204 : Referring to FIG. 15 , partially etch the top electrode 32 and the phase change film 1 until the substrate 2 is exposed.

Step 205 : Referring to FIG. 16 , an insulating and heat insulating layer 4 is formed on the etched top electrode 32 and the phase change film 1 until the insulating heat insulating layer 4 completely covers the top electrode 32 and the phase change film 1 .

In step 206 , referring to FIG. 17 , the top of the insulating and heat insulating layer 4 is etched to expose the top electrode 32 to obtain a phase change memory cell.

In the phase change memory cell provided by the embodiment of the present disclosure, the substrate 2 is used to provide support for the entire phase change memory cell structure. The material of the bottom 2 includes, but is not limited to, silicon dioxide, silicon carbide, silicon wafer, sapphire, diamond, and the like.

In application, the surface of the substrate 2 can be cleaned with organic solvents, such as ethanol and/or acetone, to remove impurities on the surface, such as organics, oxides, and metal ions. After cleaning, the substrate 2 can be dried in an oven at 60° C.-90° C. to obtain a sufficiently dry and clean substrate 2 . The bottom electrode 31 is located inside the through hole 201 on the substrate 2, and also plays the role of heat insulation.

In the phase change memory cell provided by the embodiment of the present disclosure, the top electrode 32 and the bottom electrode 31 can be prepared using common electrode materials in the art, as long as the following requirements are met: the melting point is higher than the melting point of the phase change material, and it is not easy to be oxidized. For example, the materials of the top electrode 32 and the bottom electrode 31 include, but are not limited to, titanium tungsten TiW (eg, Ti ₃ W ₇ ), tungsten W, aluminum Al, titanium nitride TiN, titanium Ti, tantalum Ta, silver Ag, Platinum Pt, carbon C, copper Cu, ruthenium Ru, gold Au, cobalt Co, chromium Cr, nickel Ni, iridium Ir, palladium Pd, rhodium Rh, etc. The electrode materials used in the involved heating electrode 5 include but are not limited to: titanium nitride TiN, tungsten W, Ti ₃ W ₇ and the like.

Based on the above-mentioned electrode materials, a process such as Physical Vapour Deposition (PVD) (eg, magnetron sputtering) can be used to deposit the above-mentioned electrode materials into the top electrode 32 or the bottom electrode 31 .

In the phase change memory unit provided by the embodiment of the present disclosure, the functions of the insulating and heat insulating layer 4 involved are at least as follows: (1) forming a heat insulating hole 401, so that the phase change film 1 is confined in the heat insulating hole 401 to prevent Reducing the heat required for the phase change is beneficial to reducing the power consumption of the phase change memory; (2) the short circuit between the top electrode 32 and the bottom electrode 31 can be avoided. The insulating and heat-insulating material used in the insulating and heat-insulating layer 4 needs to have a higher melting point to effectively prevent the diffusion of the phase-change material, and also needs to have better thermal stability, so as to endure and maintain when the phase-change material undergoes a phase change. Insulation and thermal insulation properties.

Exemplarily, the insulating and heat insulating materials used in the insulating heat insulating layer 4 include, but are not limited to: silicon nitride Si ₃ N ₄ , silicon dioxide SiO ₂ and the like. A process such as chemical vapor deposition (Chemical Vapor Deposition, CVD), specifically, for example, a plasma-enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process can be used to deposit the above-mentioned insulating and heat-insulating material into an insulating and heat-insulating layer 4. .

In the phase change memory cell provided by the embodiment of the present disclosure, the phase change material layer 101 and the conductive isolation layer 102 involved in the phase change film 1 can both adopt atomic layer deposition (atomic layer deposition, ALD), physical vapor deposition (Physical Vapour Deposition) , PVD), chemical vapor deposition (Chemical Vapor Deposition, CVD), in particular, such as plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) process, magnetron sputtering, electron beam evaporation and other processes to form .

In some possible implementations, after the phase change film 1 is formed, the phase change film 1 needs to be polished, so as to grow the top electrode on the phase change film 1 .

In another aspect, an embodiment of the present disclosure also provides a phase change memory, the phase change memory including a plurality of any of the above-mentioned phase change memory cells.

FIG. 18 provides a schematic diagram of an application scenario of a phase-change memory including a phase-change memory unit, which includes: a phase-change memory 100, a dynamic random access memory 200, a cache 300, a processor 400, and a solid-state hard disk 500 connected in communication, In application, the phase change memory 100 and the dynamic random access memory 200 can work together as a hybrid memory.

FIG. 19 provides a schematic diagram of another application scenario of the phase-change memory including the phase-change memory unit, which includes: the phase-change memory 100, the cache 300, the processor 400 and the solid-state hard disk 500 connected in communication. When applied, the phase-change memory 100 alone as memory.

It can be seen that the phase change memory including the phase change memory unit can synergize with the dynamic random access memory, and can even replace the dynamic random access memory as the memory, which is beneficial to increase the density of the memory (for example, it can reach a high density of ^4F2 ), It is easy to perform 3D integration with gated devices, and is compatible with the CMOS process, which reduces the cost of memory and avoids the power consumption problem caused by the continuous refresh of the dynamic random access memory.

Illustratively, the electronic device includes, but is not limited to, a computer, a printer, a mobile phone, a camera, and the like.

The present disclosure will be further described below by specific embodiments:

Example 1

This embodiment 1 provides a phase-change memory cell with a confinement structure, as shown in FIG. 10, including: a phase-change film 1, a substrate 2, a top electrode 32, a bottom electrode 31, an insulating layer 4, a heating electrode 5. From the top to the bottom, the top electrode 32 , the phase change film 1 , the heating electrode 5 , the bottom electrode 31 , and the substrate 2 are in contact with each other in sequence. Specifically, the bottom electrode 31 is formed on the top surface of the substrate 2 , the heater electrode 5 is formed on the top surface of the bottom electrode 31 , the phase change film 1 is formed on the top surface of the heater electrode 5 , and the top electrode 32 is formed on the phase change film 1 the top surface. In addition, the insulating layer 4 covers the side of the phase change film 1 and is located between the bottom electrode 31 and the top electrode 32 .

The phase change film 1 includes alternately stacked phase change material layers 101 of GeTe material and conductive insulating layers 102 of ScTe material, and the cycle period of alternately stacking the phase change material layers 101 and the conductive insulating layers 102 is 10, wherein each layer The thickness of the phase change material layer 101 is 5 nm, and the thickness of each conductive insulating layer 102 is 3 nm.

The phase change memory cell is prepared by the following method:

Step 1: Provide a cleaned substrate 2 made of silicon dioxide, form a bottom electrode 31 on the surface of the substrate 2, the bottom electrode 31 is a W electrode, and alternately clean the substrate 2 containing the bottom electrode 31 by acetone and ethanol, Remove various impurities such as organics, oxides and metal ions on the surface, and bake it in an oven at 80°C for 20 minutes to fully dry it.

Step 2 : depositing an insulating and heat insulating layer 4 made of Si ₃ N ₄ material on the surface of the bottom electrode 31 by a plasma-enhanced chemical vapor deposition method, so that the insulating heat insulating layer 4 completely covers the bottom electrode 31 . Then, the insulating and heat-insulating layer 4 is etched by electron beam lithography and reactive ion etching processes, and particularly, the part of the insulating and insulating layer 4 corresponding to the heat-insulating hole 401 is etched away, and the bottom electrode 31 is exposed. , a small hole with a diameter of 80 nm is formed as the thermal insulation hole 401 .

Step 3: A heating electrode 5 made of TiN material is formed in the heat insulating hole 401 by a magnetron sputtering method.

Step 4: According to the distribution order of the phase change material layer 101 and the conductive insulating layer 102 in the phase change film 1, by magnetron sputtering, alternately deposit the phase change material layers 101 on the heating electrode 5 located in the heat insulating hole 401 in turn. and the conductive insulating layer 102 to obtain the phase change film 1 .

Step 5: A top electrode 32 made of TiN is formed on the top surface of the insulating and heat insulating layer 4 of the phase change film 1 by a magnetron sputtering method to obtain a phase change memory cell.

The above magnetron sputtering parameters are as follows:

The background vacuum degree is 2.1×10 ^-4 Pa, the sputtering gas pressure is 0.5Pa, and the sputtering gas is argon gas. Also, the sputtering power was 75W. When used to form the electrode layer, sputtering with DC power was employed, the substrate temperature was 25°C, and the sputtering power was 120W.

In the phase change memory cell provided by the embodiment of the present disclosure, the ScTe compound is used as the conductive isolation layer 102, and it also serves as the crystallization template of the GeTe compound, which effectively improves the crystallization speed of the phase change memory. At the same time, the phase-change memory unit is a confinement type structure, and the memory unit occupies a small area, which is beneficial to significantly improve the density of the memory array.

Example 2

This embodiment 2 provides a phase-change memory cell with a confinement type structure, as shown in FIG. 17 , which includes: a phase-change memory cell with a T-type structure, which includes: a phase-change film 1 , a substrate 2 , and a top electrode 32. Bottom electrode 31, insulating layer 4; wherein, the substrate 2 has a through hole 201, and the bottom electrode 31 is located in the through hole 201; the top electrode 32, the phase change film 1, and the substrate 2 are in contact in sequence, and, The phase change film 1 is also connected to the bottom electrode 31 . Specifically, the bottom electrode 31 is formed in the through hole 201 of the substrate 2 , the phase change film 1 is formed on both the bottom electrode 31 and the top surface of the substrate 2 , and the top electrode 32 is formed on the top surface of the phase change film 1 . In addition, the insulating and heat insulating layer 4 covers the side portion of the phase change film 1 .

The phase change film 1 includes alternately stacked phase change material layers 101 of GeTe material and conductive insulating layers 102 of ScTe material, and the cycle period of alternately stacking the phase change material layers 101 and the conductive insulating layers 102 is 12, wherein each layer The thickness of the phase change material layer 101 is 5.5 nm, and the thickness of each conductive insulating layer 102 is 3 nm.

The phase change memory cell is prepared by the following method:

Step 1: Provide a cleaned substrate 2 made of silicon dioxide, form a through hole 201 on the substrate 2, and form a bottom electrode 31 with a diameter of 200 nm in the through hole 201 by magnetron sputtering. 31 is the W electrode. The substrate 2 containing the bottom electrode 31 is cleaned alternately with acetone and ethanol to remove various impurities such as organics, oxides and metal ions on the surface, and is baked in an oven at 80° C. for 20 minutes to make the substrate 2 . It is sufficiently dry.

Step 2: According to the distribution order of the phase change material layer 101 and the conductive insulating layer 102 in the phase change film 1, by the magnetron sputtering method, the phase change material layers 101 are alternately formed on the top surfaces of the substrate 2 and the bottom electrode 31 in turn. and the conductive insulating layer 102 to obtain the phase change film 1 .

Step 3: Continue to form the top electrode 32 of TiN material on the top surface of the phase change film 1 by the magnetron sputtering method.

Step 4: Partially etch the top electrode 32 and the phase change film 1 through electron beam lithography and reactive ion etching processes until the substrate 2 is exposed.

Step 5: By magnetron sputtering, an insulating and heat insulating layer 4 is formed on the etched top electrode 32 and the phase change film 1, until the insulating heat insulating layer 4 completely covers the top electrode 32 and the phase change film 1, Then, the top of the insulating and heat insulating layer 4 is etched to expose the top electrode 32 to obtain a phase change memory cell.

The above magnetron sputtering parameters are as follows:

The background vacuum is 2.1×10 ^-4 Pa, the sputtering pressure is 0.5Pa, and the sputtering gas is argon Ar. When the phase change film 1 is formed, radio frequency magnetron sputtering is used, and the substrate temperature is 300°C. Also, the sputtering power was 75W. When used to form the electrode layer, sputtering with DC power was employed, the substrate temperature was 25°C, and the sputtering power was 120W.

In the phase change memory cell provided by the embodiment of the present disclosure, the ScTe compound is used as the conductive isolation layer 102, and it also serves as the crystallization template of the GeTe compound, which effectively improves the crystallization speed of the phase change memory. At the same time, the phase-change memory cell has a T-shaped structure, which is simple in process, easy to operate, requires low precision for photolithography, and the insulating and heat-insulating layer 4 can effectively protect the phase-change memory cell from being oxidized by air.

The above description is only for the convenience of those skilled in the art to understand the technical solutions of the present disclosure, and is not intended to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included within the protection scope of the present disclosure.

Claims

A phase-change storage unit, characterized in that the phase-change storage unit comprises: a phase-change film (1);

The phase-change film (1) comprises: a multilayer phase-change material layer (101) and a multilayer conductive insulating layer (102), the phase-change material layers (101) and the conductive insulating layer (102) being alternately stacked;

The phase-change material layer (101) is formed of a phase-change material, and the conductive isolation layer (102) is formed of a conductive crystal material;

The degree of lattice mismatch between the phase change material and the conductive crystal material is less than or equal to 10%, and the melting point of the phase change material is lower than the melting point of the conductive crystal material.
The phase-change memory cell according to claim 1, wherein the degree of lattice mismatch between the phase-change material and the conductive crystal material is less than or equal to 5%.
The phase change memory cell according to claim 1, wherein the phase change material layer (101) has a thickness of 1 nm-10 nm;

The thickness of the conductive isolation layer (102) is 1 nm-10 nm.
The phase change memory cell according to claim 1, characterized in that a cycle period of alternately stacking the phase change material layer (101) and the conductive isolation layer (102) is 2-50.
The phase change memory cell according to claim 1, wherein the phase change material is Ge-Te binary compound, Sb x Te 1-x (0.8<x≤1), Bi-Te binary compound, Or Ge-Sb-Te ternary compound;

The conductive crystal material is ScTe, Sc 2 Te 3 , PtTe 2 , Pt 2 Te 3 , PdTe 2 , MoTe 2 , Cr 2 Te 3 , SiTe 2 , Si 2 Te 3 , NiTe 2 , or CuTe 2 .
The phase-change memory cell according to any one of claims 1-5, wherein the phase-change memory cell further comprises: a substrate (2), a bottom electrode (31), a top electrode (32), an insulating spacer thermal layer (4);

the bottom electrode (31) is located on the surface of the substrate (2);

The phase change film (1) is connected between the bottom electrode (31) and the top electrode (32);

The insulating and heat insulating layer (4) is coated on the side portion of the phase change film (1).
The phase change memory cell according to claim 6, wherein the phase change memory cell is a confinement structure;

The top electrode (32), the phase change film (1), the bottom electrode (31), and the substrate (2) are in contact with each other in sequence.
The phase change memory cell according to claim 6, wherein the phase change memory cell is a confinement structure;

The phase change storage unit further comprises: a heating electrode (5);

The top electrode (32), the phase change film (1), the heating electrode (5), the bottom electrode (31), and the substrate (2) are in contact with each other in sequence.
The phase-change memory cell according to claim 6, wherein the phase-change memory cell has a T-type structure;

The substrate (2) is provided with a through hole (201), and the bottom electrode (31) is located in the through hole (201);

The top electrode (32), the phase change film (1), and the substrate (2) are in contact with each other in sequence, and the phase change film (1) is also connected to the bottom electrode (31).
A phase change memory, characterized in that, the phase change memory comprises a plurality of phase change memory cells according to any one of claims 1-9.
An electronic device, characterized in that the electronic device comprises a processor and the phase-change memory of claim 10, wherein the phase-change memory is used to store data accessed by the processor.