WO2022154657A1 - Planar transmission line for communication with cryogenic devices - Google Patents

Planar transmission line for communication with cryogenic devices Download PDF

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Publication number
WO2022154657A1
WO2022154657A1 PCT/NL2021/050783 NL2021050783W WO2022154657A1 WO 2022154657 A1 WO2022154657 A1 WO 2022154657A1 NL 2021050783 W NL2021050783 W NL 2021050783W WO 2022154657 A1 WO2022154657 A1 WO 2022154657A1
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WO
WIPO (PCT)
Prior art keywords
transmission line
dielectric layer
planar transmission
layers
signal line
Prior art date
Application number
PCT/NL2021/050783
Other languages
French (fr)
Inventor
Wouter Martinus Gerard BOS
Chun Heung WONG
Kiefer James VERMEULEN
Robertus Franciscus Maria Van Den Brink
Jakob KAMMHUBER
Sal Jua Bosman
Original Assignee
Delft Circuits B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delft Circuits B.V. filed Critical Delft Circuits B.V.
Publication of WO2022154657A1 publication Critical patent/WO2022154657A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/68—Connections to or between superconductive connectors

Definitions

  • Planar transmission line for communication with cryogenic devices Planar transmission line for communication with cryogenic devices.
  • the invention relates to a planar transmission line for communication with cryogenic devices.
  • the known planar transmission line can be applied for communication of signals between an external electronic control device at room temperature and a cryogenic electronic system.
  • the cryogenic electronic system may comprise, for example, qubit devices, quantum processors, sensing and detector systems, quantum internet apparatus, medical devices, cryptographic devices, classical computing processors, and any other electronic devices.
  • cryogenic electronic circuits such as multi-pixel superconducting photon detectors used in astronomy and quantum communication applications.
  • Cryogenic cooling equipment is provided for maintaining the cryogenic electronic circuits at the required operating temperature of near zero Kelvin.
  • This cryogenic cooling equipment is often built up from a stack of separated temperature stages, wherein each lower stage is cooled down to a lower temperature. Due to the fundamentals of thermodynamics, the power required to progressively cool down to lower temperatures increases exponentially. For example a typical cryogenic cooling equipment consumes 20-30 kW for handling a thermal load of 12-18 pW at 100 mK.
  • the control device for cryogenic systems is typically placed outside the cryogenic equipment to prevent their power dissipation from heating up the cryogenic equipment as a whole and thus the cryogenic circuits as well. Therefore, a communication path is required for exchanging signals between cryogenic circuits at the final stage of the cryogenic equipment, through the top of the cryogenic equipment to the outside control electronics. Such path is typically constructed from a cascade of semi rigid transmission lines, usually coax cables, to abridge the distance and to intercept mechanical tension and vibrations during the cooling down procedure and operation.
  • Cryogenic circuits, such as the qubit devices require communication with the external control device for controlling the qubits and signaling back an actual state of each qubit to be to the control device. This requires also high frequency, HF, analogue signals. Typically, this signal can be in the range from low frequencies or DC to ultrahigh frequencies up to 60 GHz.
  • Recent cryogenic qubit devices have an increasing number of qubits. Each qubit requires individual communication to the control device outside the cryogenic device. This individual communication requires an increasing number of the transmission lines for the qubits.
  • the qubit device can comprise 96 qubits and requires at least 288 individual transmission lines that should be guided through subsequent thermal stages to the outside.
  • the transmission lines may comprise several coax connectors, for example, for bridging the consecutive stages of the cryogenic equipment. So, when the number of transmission lines increases, the total number of coax connectors in the transmission lines to bridge each stage is also increasing and relatively more space in the subsequent stages is required to accommodate for this increased number of coax connectors and may become a limiting condition for a further increase in numbers of qubits. Furthermore, the additional coax connectors may disturb the signals through transmission lines.
  • a planar transmission line for communication with cryogenic devices comprising a first part and a second part, wherein the first part comprises a first conductive layer, a first dielectric layer, a first signal line, a second dielectric layer and a second conductive layer, the second part comprises at least one of the first dielectric layer and the second dielectric layer, and the first signal line; and a connector arranged to connect the first part to the second part, wherein the layers of the first part and the layers of the second part forming a first connection of the first part and the second part are reciprocally staggered, such that a location of the first and second dielectric layer of the first part is shifted about a predetermined distance along a longitudinal axis of the planar flexible transmission line with respect to the first and the second dielectric layers of the second part.
  • the first signal line may be used for transmission of an HF signal through the transmission line.
  • reciprocally staggered means that the ends of the layers of the first part forming the connection are shifted about predetermined distances in a direction along a longitudinal axis of the planar transmission line and the ends of the layers of the second part forming the first connection are shifted about the same predetermined distances as the corresponding end of the corresponding layer of the first part such that, at the connection, the ends of the layers of the first art form fit with the ends of the layers of the second part.
  • This arrangement enables a stable connection between subsequent parts of the planar transmission lines.
  • planar transmission lines are simple to construct, and insensitive for tribo-electric noise effects, micro-phonic noise effects and external disturbing signals.
  • the planar transmission line according to the invention can be flexible and also smaller/ thinner than known transmission lines connected through coax connectors, thus enabling a high density of independent signal lines in a single multi-channel planar transmission line providing an improved transmission in the MHz and the GHz ranges.
  • the invention is also based on the following recognition that a transmission line is a wave guide and the geometric shape in a plane perpendicular to the propagation direction of the prior art transmission line is disturbed by the presence of the prior art coax connector, whereas the geometric shape of the waveguide formed by planar transmission line according to this disclosure is substantially equal along the propagation direction of the planar transmission line and the connector.
  • This equality enables interconnections which reduce reflections and improves transmission properties.
  • this configuration enable planar transmission lines and connections provided with multiple signal lines.
  • the second part further comprises a first conductive layer, the other one of the first and second dielectric layer and the second conductive layer. This arrangement resembles a connection between two parts of the planar transmission line.
  • the connector comprises a first conductive shell and a second conductive shell, wherein the first and the second conductive shell are arranged to connect the conductive layers. In this arrangement an overall shielding of the connector and the first signal line is obtained.
  • the planar transmission line is provided with a third dielectric layer at the outside of the first conductive layer of the first part and a fourth dielectric layer at the outside of the second conductive layer of second part.
  • the connector may comprise dielectric shells and the first and second conductive layers are shielding the planar transmission line.
  • the planar transmission line the second part further comprises a first conductive layer and the other one of the first and second dielectric layer; wherein the planar transmission line comprises a third part comprising the first conductive layer, the first dielectric layer, the first signal line, the second dielectric layer and the second conductive layer, wherein the connector is further arranged to connect second part to the third part, wherein the layers forming a second connection of the second part and the third part are reciprocally staggered.
  • the second part of the transmission line can be exchanged by another different second part of the transmission line with different characteristics than the characteristics of the removed second part.
  • the characteristics can be electronic, thermal, optical or mechanic. Also this arrangement allows connection of subsequent stages of the planar transmission line.
  • a length of the first part is larger than a length of the second part, wherein in the first part, the second dielectric layer and the second conductive layer are provided with a recess to fit a corresponding portion of the second part, and the first signal line of the first part is interrupted over the length of the recess; the corresponding portion of second part comprises the first signal line and the second dielectric layer, and another portion of the second part comprises a second conductive layer and a third additional dielectric layer wherein the layers of the first part and the second part forming a second connection are reciprocally staggered.
  • the second part of the transmission line can be also exchanged by a different second part of the transmission line with different electronic characteristics than the characteristics of the second part.
  • a length of the first part is larger than a length of the second part, wherein, in the first part, the second dielectric layer and the second conductive layer of the first part are provided with a recess to fit the second part and the first signal line is interrupted over the length of the recess; wherein the second part comprises the first signal line and the second dielectric layer; wherein the connector is further arranged to connect both sides of the recess of the second conductive layer; and the layers of the first part and the second part forming a second connection are reciprocally staggered.
  • the second part of the transmission line can be also exchanged by a different second part of the transmission line with different electronic characteristics than the characteristics of the second part.
  • the second part is provided with an electronic component connected in series with the first signal line.
  • the electronic component can be a passive or active electronic element.
  • a set of second parts can then be provided with predetermined different electronic characteristics.
  • planar transmission line is provided with a second signal line between the first and the second dielectric layers.
  • multiple first signal lines can be provided between the first and the second dielectric layer so that a multi-channel planar transmission line is obtained.
  • the first part and the second part comprise a third conductive layer, a third dielectric layer, a fourth dielectric layer between the second dielectric layer and the second conductive layer; and a second signal line between the third dielectric layer and the fourth dielectric layer.
  • This arrangement enables a multichannel transmission line with a three-dimensional arrangement of signal lines wherein the signal lines can be stacked in several layers above each other of the planar transmission and a multichannel transmission line can be obtained.
  • the number of channels can be 64 or more.
  • the invention further relates to an electronic device comprising the planar transmission line according to any of the claims 1- 15.
  • the electronic device may comprise an electronic control circuit, a cryogenic electronic circuit and a planar transmission line for communication between the electronic control circuit and the cryogenic circuit.
  • Fig. 1 shows an intersection of a planar transmission line
  • Fig. 2A shows an intersection of a planar transmission line according to an embodiment according to this disclosure
  • Fig. 2B shows an intersection of a planar transmission line according to an embodiment according to this disclosure
  • Fig. 2C shows an intersection of a planar transmission line according to an embodiment according to this disclosure
  • Fig. 3 shows a top view of the planar transmission line and a second conductive shell of the connector and the nut and screw mechanism according to an embodiment of this disclosure
  • Fig. 4 shows an intersection of an embodiment of the planar transmission line according to an embodiment of this disclosure
  • Fig. 5A shows an intersection of a planar transmission line according to an embodiment of this disclosure
  • Fig. 5B shows an intersection of a planar transmission line according to an embodiment of this disclosure
  • Fig.6 shows an intersection of a planar transmission line provided with multiple signal lines according to an embodiment of this disclosure
  • Fig. 7 shows an intersection of a planar transmission line provided with multiple signal lines according to an embodiment of this disclosure
  • Fig. 8 shows an embodiment of an electronic device comprising a planar transmission line according to an embodiment of this disclosure
  • Fig. 9 shows an electronic device comprising a planar transmission line according to an embodiment of this disclosure.
  • the planar transmission line can be used for communication between an electronic circuit at room temperature and a cryogenic device, for example, a cryogenic electronic circuit at a temperature of about 1 mK.
  • Fig. 1 shows diagrammatically a cross-section of a planar transmission line 10 according to an embodiment of this disclosure.
  • the planar transmission line 10 comprises a stack of a first conductive layer 11, a first dielectric layer 12, a first signal line 13, a second dielectric layer 14; and a second conductive layer 15.
  • the planar transmission line 1 can have rectangular geometry with a length of e.g. 100 mm or 200 mm and a width of e.g. 4 mm and a thickness of e.g. 0.3 mm.
  • the dielectric can be for example polyimide or Polytetrafluoroethylene, PTFE, Ethylene tetrafluoride ethylene, ETFE. In embodiments quartz, silicon and printed circuit board materials can be applied.
  • the planar transmission line 10 can be manufactured by providing a polyimide sheet forming the first dielectric layer 12 with the first conductive layer 11.
  • the first conductive layer can be provided by sputtering, electroplating or another thin or thick film process as is well known by the person skilled in the art.
  • the thickness of the polyimide sheet is in the range from, for example, in the range from 0.012 mm to 0.4 mm.
  • the conductive layer comprises silver Ag. Also gold Au, copper Cu, Aluminum or platinum Pt can be applied.
  • the conductive layers comprises superconductors, for example one of Niobium Nb, NiobiumTitanium NbTi, NiobiumTitaniumnitride, NbTiN, and Indium, In.
  • the conductive layers comprise a resistive film, for example, one of Nichrome, NiCr, Carbon C and IndiumTinOxide, ITO.
  • the thickness of the first and second conductive layer is, for example, 2pm.
  • the second dielectric layer 14 can also be formed by a polyimide sheet at which silver is provided for forming the second conductive layer 15. This can be done in a similar way as the first conductive layer 11 has been provided on the first dielectric layer 12.
  • the side of the first dielectric layer 12 facing away from the first conductive layer 11 can be provided with the first signal line 13.
  • the signal line 13 can be located in the center of the first dielectric layer.
  • the signal line 13 comprises a conductive material for signal transmission.
  • the signal line 13 can me made of the same conductive material as is used the first conductive layer 11.
  • the signal line 13 can have a width of e.g. 0.15 mm and a thickness of 0.002 mm.
  • the thickness of the polyimide sheet can be e.g. 0.1 mm.
  • Multiple signal lines, for example, five or ten signal lines 13 can be provided on the first dielectric layer 12 separated by a fixed distance selected from a range between 0.5 mm and 10 mm, for example 2 mm.
  • the planar transmission line can be provided with additional layers of polyimide to obtain a wished thickness. In an embodiment the planar transmission line is flexible.
  • the planar transmission line comprises two signal lines forming a pair of differential signal lines or symmetric signal lines, wherein the signal lines are arranged in the first and second dielectric layers between the first and second conductive layers.
  • the two signal lines can be arranged in a plane transverse or orthogonal to the conductive layers.
  • the two signal lines can be arranged in a plane between the first dielectric layer and the second dielectric layer of the planar transmission line.
  • the stack of layers can be formed by gluing, laminating, welding, cold welding, ultrasonic soldering, sealing blade coating, spin coating or dielectric resin.
  • the total thickness of the planar transmission lines may be, for example, 0.3 mm.
  • the ends of the transmission line 1 can be provided with connectors, wire bond pads, printed circuit boards, antennas, etc. (not shown) .
  • the known planar transmission lines can be obtained from Delft Circuits B.V. in the Netherlands.
  • Fig. 2A shows diagrammatically an intersection of a planar transmission line 20 according to an embodiment according to this disclosure. The intersection is along a longitudinal axis of the planar transmission line 20.
  • the stacks of the layers 11,12,14,15 of respectively a first part 20 A and a second part 20B of the planar transmission line are similar to the stack of the layers 11,12,14,15 as described with respect to of the planar transmission line 10 in Fig. 1.
  • an end of the signal line 13 of the first part 20A coincides with the end of the first dielectric layer 12 and the end of the signal line 13 of the second part 20B coincides with the end of second dielectric layer 14. Furthermore, the ends of the first and second conductive layers 11, 15 coincide with the ends of the first and second dielectric layers 12, 14 of the first and second parts 20A, 20B respectively. In this embodiment the ends of the signal line 13 overlap at the connection.
  • the thicknesses of the first and second conductive layers 11, 15 can have a value selected from the range between 2 and 5 p.
  • one end of the conductive layer at a cold side of the planar transmission line may comprise a superconductor and at that end the thickness may be reduced to 10 nm and at the other end of planar transmission line the conductive layer may comprise silver with a thickness of 35 pm.
  • the planar transmission line 20 comprises a connector
  • the connector may comprise a first conductive shell 16 and a second conductive shell 17.
  • the first and second conductive shells 16, 17 connect the ends of first conductive layers 11 and the second conductive layers 15 of the first part 20A and second part 20B respectively. This arrangement provides HF shielding of the connection.
  • the ends of the first and second dielectric layers 12,14 of the first part 20 A and the second part 20B are reciprocally staggered in a sense that the location of the respective first and second dielectric layers 12,14 of the first part 20A are shifted about predetermined distances in a direction along a longitudinal axis of the planar transmission line with respect to each other and the location of the respective ends of the first and second dielectric layers 12,14 of the second part 20B at the connection are shifted about the same predetermined distances in the same direction as the corresponding end of the corresponding layer of the first part 20A such that the ends of the layers of the first part form fit with the ends of the layers of the second part 20B.
  • This arrangement provides a form fit connection between ends of the first part 20 A and the second part 20B.
  • transitions between the first dielectric layers and the second dielectric layers 12, 14 between the first and second parts 20 A, 20B are staggered and the transitions between the first and second conductive layers 11, 12 of the first and second part 20 A, 20B are staggered.
  • a longitudinal axis of the first part 20A is axial to the longitudinal axis of the second part 20 B.
  • the longitudinal axis of the first part 20A is transverse or perpendicular to the longitudinal axis of the second part 20 B.
  • a second signal line 13 can be provided on the first dielectric layer 12 and facing the second dielectric layer 14.
  • multiple signals lines 13 can be provided on the first dielectric layer 12 and facing the second dielectric layer 14.
  • first and second conductive shells 16, 17 are blocked shaped and made of copper.
  • the conductive shells 16, 17 can be made of plastic or a polymer provided with a metal layer of, for example, copper Cu at the sides contacting the first and second conductive layers 11, 12.
  • the dimensions of the connector can be for example 25x10x10 mm (Ixwxh).
  • the connector comprises a screw and nut mechanism to detachably connect the conductive shells 16, 17 to each other. Also other connection means can be used.
  • Fig. 3 shows a top view of the first and second part 20A, 20B of the planar transmission line, the second conductive shell 17 of the connector, and the nut and screw mechanism 18 according to an embodiment of this disclosure.
  • Fig 2B shows diagrammatically an intersection of a planar transmission line 20 according to an embodiment according to this disclosure.
  • the intersection is along a longitudinal axis of the planar transmission line 20.
  • the stack of the layers 11,12,14,15 of respectively a first part 20 A and a second part 20B of the planar transmission line is similar to the stack of the layers 11,12,14,15 as described with respect to the planar transmission line 10 in Fig. 1.
  • the first and second part 20A, 20B are provided with a third conductive layer 21, a third dielectric layer 22 and a fourth dielectric layer 24 are provided between the second dielectric layer 14 and the second conductive layer 15.
  • a second signal line 23 is provided between the third dielectric layer 22 and the fourth dielectric layer 24.
  • an end of the signal line 13 of the first part 20 A coincides with the end of the first dielectric layer 12 and the end of the signal line 13 of the second part 20B coincides with the end of second dielectric layer 14 and an end of the second signal line 23 of the first part 20 A coincides with the end of the third dielectric layer 22 and the end of the second signal line 23 of the second part 20B coincides with the end of fourth dielectric layer 24.
  • the ends of the dielectric layers 12,14,22,24 are reciprocally staggered and the ends of the first and second signal lines 13, 23 overlap.
  • the transitions between the dielectric layers 12,14,22,24, the conductive layers 2 land the signal lines 13, 23 between the first and second part 20A, 20B are also staggered.
  • Fig. 2C shows diagrammatically an intersection of a planar transmission line 20 according to an embodiment according to this disclosure.
  • the intersection is along a longitudinal axis of the planar transmission line 20.
  • the stack of the layers 11,12,14,15 of respectively a first part 20 A and a second part 20B of the planar transmission line is similar to the stack of the layers 11,12,14,15 as described with respect to of the planar transmission line 10 in Fig. 1 and Fig. 2A.
  • an end of the signal line 13 of the first part 20 A coincides with the end of the first dielectric layer 12 and the end of the signal 13 of the second part 20B coincides with the end of second dielectric layer 14.
  • a first additional dielectric layer 25 is provided at the outside of a first conductive layer 11 of the stack of layers of the first part 20A and a second additional dielectric layer 26 is provided at the outside of the second conductive layer 15 at the other side of the stack of the second part 20B.
  • the ends of the first and second conductive layers 11, 15 coincide with the ends of the first and second additional dielectric layers 25, 26 respectively.
  • the connector may have non-conducting shells 27, 28.
  • the non-conductive shell can be made of a polymer or plastic.
  • the ends of the layers 25,11,12,14,15 of the first part 20A and 11,12,14,15,22 of the second part 20B are reciprocally staggered in a sense that the location of the respective dielectric layers 25, 11,12,14,15 of the first part 20A are shifted about predetermined distances in a direction along a longitudinal axis of the planar transmission line with respect to each other and the location of the respective ends of the layers 11,12,14,15,26 of the second part 20B at the connection are shifted about the same predetermined distances in the same direction as the corresponding end of the corresponding layer of the first part 20A such that the ends of the layers of the first part form fit with the ends of the layers of the second part 20B.
  • This arrangement provides a form fit connection between ends of the first part 20A and the second part 20B.
  • transitions between the dielectric layers 12, 14, the conductive layers 11,15 and the signal line 13 between the first and second part 20 A, 20B are also staggered.
  • Fig. 4 shows diagrammatically an intersection of the planar transmission line according to an embodiment of this disclosure.
  • Fig. 4 shows a planar transmission line 40 provided with a first part 40A, a second part 40B and a third part 40C.
  • the stacks of layers 11,12,14,15 of respectively the first part and third part are similar to the stack of layers 11,12,14,15 of the first and second part of the embodiment of Fig. 2.
  • the second part comprises the first conductive layer 11, the first dielectric layer 12, the signal line 13 and the second dielectric layer 1.
  • the second conductive layer is omitted.
  • the ends of the signal line 13 coincide with the ends of the first dielectric layer 12 of the first, second parts and third parts 40A, 40B, 40C.
  • the signal line 13 is provided at the first dielectric layer 12 facing the second dielectric layer 14. Furthermore, the ends of the first and second conductive layers 11, 15 coincide with the ends of the first and second dielectric layers 12, 14 respectively. Furthermore, the second conductive shell 17 of the connector between the first part 40 A and the second part 40B also connects the other end of the second part 40B to an end of the third part 40C. The ends of the first and second dielectric layers 12, 14 of the second part 40B and the ends of the first and second dielectric layers 12, 14 of the third part 40C forming the second connection are reciprocally staggered. This arrangement provides a form fit connection between the first part 40A, the second part 40B and the third part 40C. The transitions between the dielectric layers 12, 14, and the signal line 13 between the first and second part 20 A, 20B and the second and the third part 20B, 20C are also staggered.
  • the second part 40B can be exchanged with by a different second part with different characteristics than the characteristics of the exchanged second part.
  • the difference in characteristics can be mechanical, optical, electronic or thermal.
  • the second part 40B is provided with an electronic component connected in series with the signal line 13.
  • the electronic component (not shown) can be an active electronic element or passive electronic element.
  • the component can be a filter, a low pass filter, a band filter, a voltage divider, an attenuator, an amplifier, a convertor, a circulator, a resistor, a coil, a capacitors etc.
  • Fig. 5A shows diagrammatically a planar transmission line according to an embodiment of this disclosure.
  • Fig. 5A shows a first part 50A and a second part 50B of the planar transmission line 50.
  • the length of the first part 50A is larger than the length of the second part 50B.
  • the stack of the layers 11, 12, 14, 15 of the first part 50 A is similar to stack of layers 11,12,14,15 of the first part 20 A of Fig. 2 A.
  • the second dielectric layer 14 and the second conductive layer 15 of the first part 50A are provided with a recess arranged to fit a corresponding portion of the second part 50B.
  • the signal line 13 is provided on the side of second dielectric layer 14 opposite to the side facing the second conductive layer 15.
  • signal line 13 is interrupted over a portion of the length of the recess so that both ends of the signal line 13 on the first dielectric layer 12 of the first part 50A extend into to the recess.
  • the corresponding portion of the second part 50B comprises the second dielectric layer 12 and the signal line 13.
  • Another portion of the second part 50 B comprises the second conductive layer 15 and a third additional dielectric layer 51.
  • the signal line 13 coincides with the ends of the second dielectric layer 14.
  • the third additional dielectric layer 51 is provided on the second conductive layer 15 at the side opposite to the side where the signal line 13 is located.
  • the second dielectric layer 14 of the first part 50A and the second dielectric layer 14 of the second part 5 OB are reciprocally staggered, and at a second connection between the first part 50 A and the other end of the second part 5 OB the respective second dielectric layers 14 are also reciprocally staggered.
  • the first and second shells 16, 17 of the connector connect both ends of the second part 50 B to the first part 50 A and the second shell 17 connects the second conductive layers 15 of the first and second parts.
  • the overlapping ends of the signal line 13 are in contact at both sides of the recess of the first part 50A.
  • the connector can alternatively comprise two shells made of plastic or polymer.
  • transitions between the dielectric layers 14, the conductive layers 15 and the signal line 13 at both sides of the recess of the first part 20A are also staggered.
  • Fig. 5B shows diagrammatically a planar transmission line according to an embodiment of this disclosure.
  • the stack of the first part 50A is like the stack of the first part 50A as in Fig. 5A.
  • the second part 50C comprises the second dielectric layer 14 and the signal line 13.
  • the second part 50C fits in the recess of the first part 50A.
  • the connector comprises the first and second conductive shells 16, 17 to connect both ends of the second part 50C to the first part 50A, the second conductive shell 17 connects an end of the second conductive layer 15 at one side of the recess in first part 50A to the end of the second conductive layer 15 at other side of recess in the first part 50A.
  • the signal line 13 of the first part 50A is connected to the overlapping ends of the signal line of the second part 50C.
  • the end of the second dielectric layer 14 of the first part 50A and the end of the second dielectric layer 14 of the second part 50C are reciprocally staggered.
  • Fig.6 shows an intersection of a planar transmission line 60 provided with multiple signal lines 61,62,63,64, and 65 on the first dielectric layer 12 according to an embodiment of this disclosure.
  • Fig. 6 shows that a connection 66 between the first signal line 61 of the first part and the first signal line 61 of the second part is staggered with respect a second connection 67 between the third signal line 62 of the first part and the third signal line 62 of the second part.
  • Fig 7 shows an embodiment of a planar transmission line 70 according to this disclosure.
  • the stack of layers of the planar transmission line 70 comprises conductive layers 71, 80 and alternately dielectric layers 72,73,75,76,78,79 and conductive layers 74, 77.
  • the dielectric layers 72, 75, 78 are provided with 10 signal lines 81 between the two successive dielectric layers 72, 73; 75; 76; 79; 80 like the embodiment described with relation to Fig. 2B
  • the layers of the planar transmission line 70 according to this embodiment may be similar to the respective layers as described with Fig. 1.
  • This arrangement of layers and signal lines allows a 3D multichannel planar transmission line.
  • the connection between two parts of the 3D multichannel planar transmission line can also be reciprocally staggered
  • a thickness of the dielectric layers can be a value selected in the range between 10 and 200 pm, preferably between 20 and 100 pm and most preferably 20 pm.
  • a thickness of the conductive layers can be a value selected in the range between 2 and 35 pm.
  • one end of the conductive layer of the planar transmission line comprises a superconductor, the thickness may then be reduced to 10 nm and the end of the conducting layer at the other side of planar transmission line may be silver with a thickness of 35 pm.
  • Fig. 8 shows a planar transmission line provided with a thermal clamp according to an embodiment of this disclosure.
  • the planar transmission line 82 can be like one as described in one of the embodiments hereinbefore.
  • the planar transmission line 82 is provided with a connector comprising the first conductive shell 16 and the second conductive shell 17 to connect a first part 20A and a second part 20B.
  • the planar transmission line 82 is further provided with the thermal clamp 83 connected to one of the shelves 16, 17 of the connector.
  • the thermal clamp and the conductive shell can be maintained at a predetermined temperature.
  • the thermal clamp can be integrated in the first or second conductive shell 16, 17.
  • Fig. 9 shows an embodiment of an electronic device 90 comprising a planar transmission line 94.
  • the electronic device 90 may comprise an electronic control circuit 91, a cryogenic circuit 93 provided in a cryogenic cooling device 82 or fridge and the planar transmission line 94 according to an embodiment of the invention.
  • the planar transmission line 94 can be similar as described with relation to embodiments of Figs.2-8.
  • the planar transmission line 94 enters the fridge through a dedicated port 95.
  • the planar transmission line 94 provides communication between the electronic control circuit 91 and the cryogenic circuit 93.
  • the planar transmission line can also be applied between two consecutive stages at different temperatures inside a cryogenic apparatus.

Abstract

The invention relates to a planar transmission line for communication with cryogenic devices. The planar transmission line comprises a first part and a second part, wherein the first part comprises a first conductive layer, a first dielectric layer, a first signal line, a second dielectric layer and a second conductive layer, the second part comprises the first signal line and at least one of the first dielectric layer and the second dielectric layer, and a connector arranged to connect the first part to the second part; the respective layers forming a first connection of the first part and the second part are reciprocally staggered such that a location of the first and second dielectric layer of the first part is shifted about a predetermined distance along a longitudinal axis of the planar flexible transmission line with respect to the first and the second dielectric layers of the second part.

Description

Planar transmission line for communication with cryogenic devices.
Field of the invention
The invention relates to a planar transmission line for communication with cryogenic devices.
Background
The known planar transmission line can be applied for communication of signals between an external electronic control device at room temperature and a cryogenic electronic system.
The cryogenic electronic system may comprise, for example, qubit devices, quantum processors, sensing and detector systems, quantum internet apparatus, medical devices, cryptographic devices, classical computing processors, and any other electronic devices.
However, there are many other applications using cryogenic electronic circuits, such as multi-pixel superconducting photon detectors used in astronomy and quantum communication applications.
Cryogenic cooling equipment is provided for maintaining the cryogenic electronic circuits at the required operating temperature of near zero Kelvin. This cryogenic cooling equipment is often built up from a stack of separated temperature stages, wherein each lower stage is cooled down to a lower temperature. Due to the fundamentals of thermodynamics, the power required to progressively cool down to lower temperatures increases exponentially. For example a typical cryogenic cooling equipment consumes 20-30 kW for handling a thermal load of 12-18 pW at 100 mK.
The control device for cryogenic systems is typically placed outside the cryogenic equipment to prevent their power dissipation from heating up the cryogenic equipment as a whole and thus the cryogenic circuits as well. Therefore, a communication path is required for exchanging signals between cryogenic circuits at the final stage of the cryogenic equipment, through the top of the cryogenic equipment to the outside control electronics. Such path is typically constructed from a cascade of semi rigid transmission lines, usually coax cables, to abridge the distance and to intercept mechanical tension and vibrations during the cooling down procedure and operation. Cryogenic circuits, such as the qubit devices, require communication with the external control device for controlling the qubits and signaling back an actual state of each qubit to be to the control device. This requires also high frequency, HF, analogue signals. Typically, this signal can be in the range from low frequencies or DC to ultrahigh frequencies up to 60 GHz.
Recent cryogenic qubit devices have an increasing number of qubits. Each qubit requires individual communication to the control device outside the cryogenic device. This individual communication requires an increasing number of the transmission lines for the qubits. For example, the qubit device can comprise 96 qubits and requires at least 288 individual transmission lines that should be guided through subsequent thermal stages to the outside. The transmission lines may comprise several coax connectors, for example, for bridging the consecutive stages of the cryogenic equipment. So, when the number of transmission lines increases, the total number of coax connectors in the transmission lines to bridge each stage is also increasing and relatively more space in the subsequent stages is required to accommodate for this increased number of coax connectors and may become a limiting condition for a further increase in numbers of qubits. Furthermore, the additional coax connectors may disturb the signals through transmission lines.
Summary of the invention
It is therefore an object of the invention to mitigate the above indicated problems.
According to the invention this and other objects are achieved by a planar transmission line for communication with cryogenic devices comprising a first part and a second part, wherein the first part comprises a first conductive layer, a first dielectric layer, a first signal line, a second dielectric layer and a second conductive layer, the second part comprises at least one of the first dielectric layer and the second dielectric layer, and the first signal line; and a connector arranged to connect the first part to the second part, wherein the layers of the first part and the layers of the second part forming a first connection of the first part and the second part are reciprocally staggered, such that a location of the first and second dielectric layer of the first part is shifted about a predetermined distance along a longitudinal axis of the planar flexible transmission line with respect to the first and the second dielectric layers of the second part.
This arrangement has a planar geometry and allows a compact, flexible and robust form fit connection. The first signal line may be used for transmission of an HF signal through the transmission line.
In this disclosure reciprocally staggered means that the ends of the layers of the first part forming the connection are shifted about predetermined distances in a direction along a longitudinal axis of the planar transmission line and the ends of the layers of the second part forming the first connection are shifted about the same predetermined distances as the corresponding end of the corresponding layer of the first part such that, at the connection, the ends of the layers of the first art form fit with the ends of the layers of the second part. This arrangement enables a stable connection between subsequent parts of the planar transmission lines.
Furthermore, these planar transmission lines are simple to construct, and insensitive for tribo-electric noise effects, micro-phonic noise effects and external disturbing signals. The planar transmission line according to the invention can be flexible and also smaller/ thinner than known transmission lines connected through coax connectors, thus enabling a high density of independent signal lines in a single multi-channel planar transmission line providing an improved transmission in the MHz and the GHz ranges.
The invention is also based on the following recognition that a transmission line is a wave guide and the geometric shape in a plane perpendicular to the propagation direction of the prior art transmission line is disturbed by the presence of the prior art coax connector, whereas the geometric shape of the waveguide formed by planar transmission line according to this disclosure is substantially equal along the propagation direction of the planar transmission line and the connector. This equality enables interconnections which reduce reflections and improves transmission properties. Furthermore, this configuration enable planar transmission lines and connections provided with multiple signal lines.
In an advantageous embodiment the second part further comprises a first conductive layer, the other one of the first and second dielectric layer and the second conductive layer. This arrangement resembles a connection between two parts of the planar transmission line.
In a further embodiment of the planar transmission line the connector comprises a first conductive shell and a second conductive shell, wherein the first and the second conductive shell are arranged to connect the conductive layers. In this arrangement an overall shielding of the connector and the first signal line is obtained.
In an embodiment the planar transmission line is provided with a third dielectric layer at the outside of the first conductive layer of the first part and a fourth dielectric layer at the outside of the second conductive layer of second part. This arrangement enables that the connector may comprise dielectric shells and the first and second conductive layers are shielding the planar transmission line.
In an embodiment the planar transmission line the second part further comprises a first conductive layer and the other one of the first and second dielectric layer; wherein the planar transmission line comprises a third part comprising the first conductive layer, the first dielectric layer, the first signal line, the second dielectric layer and the second conductive layer, wherein the connector is further arranged to connect second part to the third part, wherein the layers forming a second connection of the second part and the third part are reciprocally staggered. In this arrangement the second part of the transmission line can be exchanged by another different second part of the transmission line with different characteristics than the characteristics of the removed second part. The characteristics can be electronic, thermal, optical or mechanic. Also this arrangement allows connection of subsequent stages of the planar transmission line.
In a different embodiment of the planar transmission a length of the first part is larger than a length of the second part, wherein in the first part, the second dielectric layer and the second conductive layer are provided with a recess to fit a corresponding portion of the second part, and the first signal line of the first part is interrupted over the length of the recess; the corresponding portion of second part comprises the first signal line and the second dielectric layer, and another portion of the second part comprises a second conductive layer and a third additional dielectric layer wherein the layers of the first part and the second part forming a second connection are reciprocally staggered. In this arrangement the second part of the transmission line can be also exchanged by a different second part of the transmission line with different electronic characteristics than the characteristics of the second part.
In an embodiment of the planar transmission line a length of the first part is larger than a length of the second part, wherein, in the first part, the second dielectric layer and the second conductive layer of the first part are provided with a recess to fit the second part and the first signal line is interrupted over the length of the recess; wherein the second part comprises the first signal line and the second dielectric layer; wherein the connector is further arranged to connect both sides of the recess of the second conductive layer; and the layers of the first part and the second part forming a second connection are reciprocally staggered. In this arrangement the second part of the transmission line can be also exchanged by a different second part of the transmission line with different electronic characteristics than the characteristics of the second part.
In an embodiment of the planar transmission line the second part is provided with an electronic component connected in series with the first signal line. The electronic component can be a passive or active electronic element. A set of second parts can then be provided with predetermined different electronic characteristics.
In an embodiment the planar transmission line is provided with a second signal line between the first and the second dielectric layers. In this arrangement multiple first signal lines can be provided between the first and the second dielectric layer so that a multi-channel planar transmission line is obtained.
In an embodiment of the planar transmission line wherein the first part and the second part comprise a third conductive layer, a third dielectric layer, a fourth dielectric layer between the second dielectric layer and the second conductive layer; and a second signal line between the third dielectric layer and the fourth dielectric layer. This arrangement enables a multichannel transmission line with a three-dimensional arrangement of signal lines wherein the signal lines can be stacked in several layers above each other of the planar transmission and a multichannel transmission line can be obtained. For example, the number of channels can be 64 or more.
The invention further relates to an electronic device comprising the planar transmission line according to any of the claims 1- 15. The electronic device may comprise an electronic control circuit, a cryogenic electronic circuit and a planar transmission line for communication between the electronic control circuit and the cryogenic circuit.
These and other features and effects of the present invention will be explained in more detail below with reference to drawings in which preferred and illustrative embodiments of the invention are shown. The person skilled in the art will realize that other alternatives and equivalent embodiments of the invention can be conceived and reduced to practice without departing from the scope of the present invention.
Brief description of the drawings
Fig. 1 shows an intersection of a planar transmission line;
Fig. 2A shows an intersection of a planar transmission line according to an embodiment according to this disclosure;
Fig. 2B shows an intersection of a planar transmission line according to an embodiment according to this disclosure;
Fig. 2C shows an intersection of a planar transmission line according to an embodiment according to this disclosure
Fig. 3 shows a top view of the planar transmission line and a second conductive shell of the connector and the nut and screw mechanism according to an embodiment of this disclosure;
Fig. 4 shows an intersection of an embodiment of the planar transmission line according to an embodiment of this disclosure;
Fig. 5A shows an intersection of a planar transmission line according to an embodiment of this disclosure;
Fig. 5B shows an intersection of a planar transmission line according to an embodiment of this disclosure;
Fig.6 shows an intersection of a planar transmission line provided with multiple signal lines according to an embodiment of this disclosure; Fig. 7 shows an intersection of a planar transmission line provided with multiple signal lines according to an embodiment of this disclosure;
Fig. 8 shows an embodiment of an electronic device comprising a planar transmission line according to an embodiment of this disclosure; and Fig. 9 shows an electronic device comprising a planar transmission line according to an embodiment of this disclosure.
Detailed description of embodiments
In the figures like numerals refer to similar components. The invention is explained with reference to Figs. 1 to 9.
The planar transmission line can be used for communication between an electronic circuit at room temperature and a cryogenic device, for example, a cryogenic electronic circuit at a temperature of about 1 mK.
Fig. 1 shows diagrammatically a cross-section of a planar transmission line 10 according to an embodiment of this disclosure. The planar transmission line 10 comprises a stack of a first conductive layer 11, a first dielectric layer 12, a first signal line 13, a second dielectric layer 14; and a second conductive layer 15. The planar transmission line 1 can have rectangular geometry with a length of e.g. 100 mm or 200 mm and a width of e.g. 4 mm and a thickness of e.g. 0.3 mm. The dielectric can be for example polyimide or Polytetrafluoroethylene, PTFE, Ethylene tetrafluoride ethylene, ETFE. In embodiments quartz, silicon and printed circuit board materials can be applied.
The planar transmission line 10 can be manufactured by providing a polyimide sheet forming the first dielectric layer 12 with the first conductive layer 11. For example, the first conductive layer can be provided by sputtering, electroplating or another thin or thick film process as is well known by the person skilled in the art. The thickness of the polyimide sheet is in the range from, for example, in the range from 0.012 mm to 0.4 mm. In an embodiment the conductive layer comprises silver Ag. Also gold Au, copper Cu, Aluminum or platinum Pt can be applied. In an embodiment the conductive layers comprises superconductors, for example one of Niobium Nb, NiobiumTitanium NbTi, NiobiumTitaniumnitride, NbTiN, and Indium, In. In an embodiment the conductive layers comprise a resistive film, for example, one of Nichrome, NiCr, Carbon C and IndiumTinOxide, ITO. The thickness of the first and second conductive layer is, for example, 2pm. The second dielectric layer 14 can also be formed by a polyimide sheet at which silver is provided for forming the second conductive layer 15. This can be done in a similar way as the first conductive layer 11 has been provided on the first dielectric layer 12. The side of the first dielectric layer 12 facing away from the first conductive layer 11 can be provided with the first signal line 13. The signal line 13 can be located in the center of the first dielectric layer. The signal line 13 comprises a conductive material for signal transmission. In an embodiment the signal line 13 can me made of the same conductive material as is used the first conductive layer 11. The signal line 13 can have a width of e.g. 0.15 mm and a thickness of 0.002 mm. The thickness of the polyimide sheet can be e.g. 0.1 mm. Multiple signal lines, for example, five or ten signal lines 13 can be provided on the first dielectric layer 12 separated by a fixed distance selected from a range between 0.5 mm and 10 mm, for example 2 mm. The planar transmission line can be provided with additional layers of polyimide to obtain a wished thickness. In an embodiment the planar transmission line is flexible.
In an embodiment the planar transmission line comprises two signal lines forming a pair of differential signal lines or symmetric signal lines, wherein the signal lines are arranged in the first and second dielectric layers between the first and second conductive layers. The two signal lines can be arranged in a plane transverse or orthogonal to the conductive layers. In an alternative embodiment the two signal lines can be arranged in a plane between the first dielectric layer and the second dielectric layer of the planar transmission line.
The stack of layers can be formed by gluing, laminating, welding, cold welding, ultrasonic soldering, sealing blade coating, spin coating or dielectric resin. The total thickness of the planar transmission lines may be, for example, 0.3 mm. The ends of the transmission line 1 can be provided with connectors, wire bond pads, printed circuit boards, antennas, etc. (not shown) . The known planar transmission lines can be obtained from Delft Circuits B.V. in the Netherlands. Fig. 2A shows diagrammatically an intersection of a planar transmission line 20 according to an embodiment according to this disclosure. The intersection is along a longitudinal axis of the planar transmission line 20. The stacks of the layers 11,12,14,15 of respectively a first part 20 A and a second part 20B of the planar transmission line are similar to the stack of the layers 11,12,14,15 as described with respect to of the planar transmission line 10 in Fig. 1.
In this embodiment an end of the signal line 13 of the first part 20A coincides with the end of the first dielectric layer 12 and the end of the signal line 13 of the second part 20B coincides with the end of second dielectric layer 14. Furthermore, the ends of the first and second conductive layers 11, 15 coincide with the ends of the first and second dielectric layers 12, 14 of the first and second parts 20A, 20B respectively. In this embodiment the ends of the signal line 13 overlap at the connection.
In embodiments the thicknesses of the first and second conductive layers 11, 15 can have a value selected from the range between 2 and 5 p. In an embodiment one end of the conductive layer at a cold side of the planar transmission line may comprise a superconductor and at that end the thickness may be reduced to 10 nm and at the other end of planar transmission line the conductive layer may comprise silver with a thickness of 35 pm.
Furthermore, the planar transmission line 20 comprises a connector, the connector may comprise a first conductive shell 16 and a second conductive shell 17. The first and second conductive shells 16, 17 connect the ends of first conductive layers 11 and the second conductive layers 15 of the first part 20A and second part 20B respectively. This arrangement provides HF shielding of the connection.
At the connection, the ends of the first and second dielectric layers 12,14 of the first part 20 A and the second part 20B are reciprocally staggered in a sense that the location of the respective first and second dielectric layers 12,14 of the first part 20A are shifted about predetermined distances in a direction along a longitudinal axis of the planar transmission line with respect to each other and the location of the respective ends of the first and second dielectric layers 12,14 of the second part 20B at the connection are shifted about the same predetermined distances in the same direction as the corresponding end of the corresponding layer of the first part 20A such that the ends of the layers of the first part form fit with the ends of the layers of the second part 20B. This arrangement provides a form fit connection between ends of the first part 20 A and the second part 20B.
Furthermore, the transitions between the first dielectric layers and the second dielectric layers 12, 14 between the first and second parts 20 A, 20B are staggered and the transitions between the first and second conductive layers 11, 12 of the first and second part 20 A, 20B are staggered.
Furthermore, in the embodiment of Fig. 2A a longitudinal axis of the first part 20A is axial to the longitudinal axis of the second part 20 B. In an embodiment the longitudinal axis of the first part 20A is transverse or perpendicular to the longitudinal axis of the second part 20 B.
Furthermore, in an embodiment a second signal line 13 can be provided on the first dielectric layer 12 and facing the second dielectric layer 14. In an embodiment multiple signals lines 13 can be provided on the first dielectric layer 12 and facing the second dielectric layer 14.
In an embodiment the first and second conductive shells 16, 17 are blocked shaped and made of copper. In an embodiment the conductive shells 16, 17 can be made of plastic or a polymer provided with a metal layer of, for example, copper Cu at the sides contacting the first and second conductive layers 11, 12. The dimensions of the connector can be for example 25x10x10 mm (Ixwxh).
In an embodiment the connector comprises a screw and nut mechanism to detachably connect the conductive shells 16, 17 to each other. Also other connection means can be used.
Fig. 3 shows a top view of the first and second part 20A, 20B of the planar transmission line, the second conductive shell 17 of the connector, and the nut and screw mechanism 18 according to an embodiment of this disclosure.
Fig 2B shows diagrammatically an intersection of a planar transmission line 20 according to an embodiment according to this disclosure. The intersection is along a longitudinal axis of the planar transmission line 20. The stack of the layers 11,12,14,15 of respectively a first part 20 A and a second part 20B of the planar transmission line is similar to the stack of the layers 11,12,14,15 as described with respect to the planar transmission line 10 in Fig. 1. In addition, the first and second part 20A, 20B are provided with a third conductive layer 21, a third dielectric layer 22 and a fourth dielectric layer 24 are provided between the second dielectric layer 14 and the second conductive layer 15. Furthermore, a second signal line 23 is provided between the third dielectric layer 22 and the fourth dielectric layer 24.
In this embodiment an end of the signal line 13 of the first part 20 A coincides with the end of the first dielectric layer 12 and the end of the signal line 13 of the second part 20B coincides with the end of second dielectric layer 14 and an end of the second signal line 23 of the first part 20 A coincides with the end of the third dielectric layer 22 and the end of the second signal line 23 of the second part 20B coincides with the end of fourth dielectric layer 24. In this embodiment at the connection the ends of the dielectric layers 12,14,22,24 are reciprocally staggered and the ends of the first and second signal lines 13, 23 overlap. The transitions between the dielectric layers 12,14,22,24, the conductive layers 2 land the signal lines 13, 23 between the first and second part 20A, 20B are also staggered.
Fig. 2C shows diagrammatically an intersection of a planar transmission line 20 according to an embodiment according to this disclosure. The intersection is along a longitudinal axis of the planar transmission line 20. The stack of the layers 11,12,14,15 of respectively a first part 20 A and a second part 20B of the planar transmission line is similar to the stack of the layers 11,12,14,15 as described with respect to of the planar transmission line 10 in Fig. 1 and Fig. 2A. In this embodiment an end of the signal line 13 of the first part 20 A coincides with the end of the first dielectric layer 12 and the end of the signal 13 of the second part 20B coincides with the end of second dielectric layer 14.
Furthermore, in this embodiment a first additional dielectric layer 25 is provided at the outside of a first conductive layer 11 of the stack of layers of the first part 20A and a second additional dielectric layer 26 is provided at the outside of the second conductive layer 15 at the other side of the stack of the second part 20B. In this embodiment the ends of the first and second conductive layers 11, 15 coincide with the ends of the first and second additional dielectric layers 25, 26 respectively. Furthermore, at the connection the ends of the conductive layers 11, 15 overlap and enables the contact. In this embodiment the connector may have non-conducting shells 27, 28. The non-conductive shell can be made of a polymer or plastic.
At the connection, the ends of the layers 25,11,12,14,15 of the first part 20A and 11,12,14,15,22 of the second part 20B are reciprocally staggered in a sense that the location of the respective dielectric layers 25, 11,12,14,15 of the first part 20A are shifted about predetermined distances in a direction along a longitudinal axis of the planar transmission line with respect to each other and the location of the respective ends of the layers 11,12,14,15,26 of the second part 20B at the connection are shifted about the same predetermined distances in the same direction as the corresponding end of the corresponding layer of the first part 20A such that the ends of the layers of the first part form fit with the ends of the layers of the second part 20B. This arrangement provides a form fit connection between ends of the first part 20A and the second part 20B.
The transitions between the dielectric layers 12, 14, the conductive layers 11,15 and the signal line 13 between the first and second part 20 A, 20B are also staggered.
Fig. 4 shows diagrammatically an intersection of the planar transmission line according to an embodiment of this disclosure. Fig. 4 shows a planar transmission line 40 provided with a first part 40A, a second part 40B and a third part 40C. The stacks of layers 11,12,14,15 of respectively the first part and third part are similar to the stack of layers 11,12,14,15 of the first and second part of the embodiment of Fig. 2. In this embodiment the second part comprises the first conductive layer 11, the first dielectric layer 12, the signal line 13 and the second dielectric layer 1. The second conductive layer is omitted. The ends of the signal line 13 coincide with the ends of the first dielectric layer 12 of the first, second parts and third parts 40A, 40B, 40C. Furthermore, the signal line 13 is provided at the first dielectric layer 12 facing the second dielectric layer 14. Furthermore, the ends of the first and second conductive layers 11, 15 coincide with the ends of the first and second dielectric layers 12, 14 respectively. Furthermore, the second conductive shell 17 of the connector between the first part 40 A and the second part 40B also connects the other end of the second part 40B to an end of the third part 40C. The ends of the first and second dielectric layers 12, 14 of the second part 40B and the ends of the first and second dielectric layers 12, 14 of the third part 40C forming the second connection are reciprocally staggered. This arrangement provides a form fit connection between the first part 40A, the second part 40B and the third part 40C. The transitions between the dielectric layers 12, 14, and the signal line 13 between the first and second part 20 A, 20B and the second and the third part 20B, 20C are also staggered.
In this embodiment the second part 40B can be exchanged with by a different second part with different characteristics than the characteristics of the exchanged second part. The difference in characteristics can be mechanical, optical, electronic or thermal. In an embodiment the second part 40B is provided with an electronic component connected in series with the signal line 13. The electronic component (not shown) can be an active electronic element or passive electronic element. In embodiments the component can be a filter, a low pass filter, a band filter, a voltage divider, an attenuator, an amplifier, a convertor, a circulator, a resistor, a coil, a capacitors etc.
Fig. 5A shows diagrammatically a planar transmission line according to an embodiment of this disclosure. Fig. 5A shows a first part 50A and a second part 50B of the planar transmission line 50. In this embodiment the length of the first part 50A is larger than the length of the second part 50B. Furthermore, the stack of the layers 11, 12, 14, 15 of the first part 50 A is similar to stack of layers 11,12,14,15 of the first part 20 A of Fig. 2 A. In this embodiment the second dielectric layer 14 and the second conductive layer 15 of the first part 50A are provided with a recess arranged to fit a corresponding portion of the second part 50B. In the second part 50B the signal line 13 is provided on the side of second dielectric layer 14 opposite to the side facing the second conductive layer 15. In this embodiment signal line 13 is interrupted over a portion of the length of the recess so that both ends of the signal line 13 on the first dielectric layer 12 of the first part 50A extend into to the recess. The corresponding portion of the second part 50B comprises the second dielectric layer 12 and the signal line 13. Another portion of the second part 50 B comprises the second conductive layer 15 and a third additional dielectric layer 51. Furthermore, in the second part 50 B the signal line 13 coincides with the ends of the second dielectric layer 14. Furthermore, in the second part the third additional dielectric layer 51 is provided on the second conductive layer 15 at the side opposite to the side where the signal line 13 is located. At a first connection between the first part 50A and the second part 50B, the second dielectric layer 14 of the first part 50A and the second dielectric layer 14 of the second part 5 OB are reciprocally staggered, and at a second connection between the first part 50 A and the other end of the second part 5 OB the respective second dielectric layers 14 are also reciprocally staggered. The first and second shells 16, 17 of the connector connect both ends of the second part 50 B to the first part 50 A and the second shell 17 connects the second conductive layers 15 of the first and second parts. The overlapping ends of the signal line 13 are in contact at both sides of the recess of the first part 50A. In this embodiment the connector can alternatively comprise two shells made of plastic or polymer.
The transitions between the dielectric layers 14, the conductive layers 15 and the signal line 13 at both sides of the recess of the first part 20A are also staggered.
Fig. 5B shows diagrammatically a planar transmission line according to an embodiment of this disclosure. In this embodiment the stack of the first part 50A is like the stack of the first part 50A as in Fig. 5A. Furthermore, the second part 50C comprises the second dielectric layer 14 and the signal line 13. In this embodiment the second part 50C fits in the recess of the first part 50A. In this embodiment the connector comprises the first and second conductive shells 16, 17 to connect both ends of the second part 50C to the first part 50A, the second conductive shell 17 connects an end of the second conductive layer 15 at one side of the recess in first part 50A to the end of the second conductive layer 15 at other side of recess in the first part 50A. The signal line 13 of the first part 50A is connected to the overlapping ends of the signal line of the second part 50C. At the connection the end of the second dielectric layer 14 of the first part 50A and the end of the second dielectric layer 14 of the second part 50C are reciprocally staggered.
The transitions between the second dielectric layers 14 and the signal line 13 between the first part 50A and the second part 50C are also staggered. Fig.6 shows an intersection of a planar transmission line 60 provided with multiple signal lines 61,62,63,64, and 65 on the first dielectric layer 12 according to an embodiment of this disclosure. Fig. 6 shows that a connection 66 between the first signal line 61 of the first part and the first signal line 61 of the second part is staggered with respect a second connection 67 between the third signal line 62 of the first part and the third signal line 62 of the second part.
Fig 7 shows an embodiment of a planar transmission line 70 according to this disclosure. In this embodiment the stack of layers of the planar transmission line 70 comprises conductive layers 71, 80 and alternately dielectric layers 72,73,75,76,78,79 and conductive layers 74, 77. In this embodiment the dielectric layers 72, 75, 78 are provided with 10 signal lines 81 between the two successive dielectric layers 72, 73; 75; 76; 79; 80 like the embodiment described with relation to Fig. 2B The layers of the planar transmission line 70 according to this embodiment may be similar to the respective layers as described with Fig. 1. This arrangement of layers and signal lines allows a 3D multichannel planar transmission line. In this arrangement the connection between two parts of the 3D multichannel planar transmission line can also be reciprocally staggered
In embodiments a thickness of the dielectric layers can be a value selected in the range between 10 and 200 pm, preferably between 20 and 100 pm and most preferably 20 pm.
In embodiments a thickness of the conductive layers can be a value selected in the range between 2 and 35 pm. In an embodiment one end of the conductive layer of the planar transmission line comprises a superconductor, the thickness may then be reduced to 10 nm and the end of the conducting layer at the other side of planar transmission line may be silver with a thickness of 35 pm.
Fig. 8 shows a planar transmission line provided with a thermal clamp according to an embodiment of this disclosure. The planar transmission line 82 can be like one as described in one of the embodiments hereinbefore. The planar transmission line 82 is provided with a connector comprising the first conductive shell 16 and the second conductive shell 17 to connect a first part 20A and a second part 20B. The planar transmission line 82 is further provided with the thermal clamp 83 connected to one of the shelves 16, 17 of the connector. In operation, the thermal clamp and the conductive shell can be maintained at a predetermined temperature. In an embodiment the thermal clamp can be integrated in the first or second conductive shell 16, 17.
Fig. 9 shows an embodiment of an electronic device 90 comprising a planar transmission line 94. In this embodiment the electronic device 90 may comprise an electronic control circuit 91, a cryogenic circuit 93 provided in a cryogenic cooling device 82 or fridge and the planar transmission line 94 according to an embodiment of the invention. The planar transmission line 94 can be similar as described with relation to embodiments of Figs.2-8. The planar transmission line 94 enters the fridge through a dedicated port 95. The planar transmission line 94 provides communication between the electronic control circuit 91 and the cryogenic circuit 93. In an embodiment the planar transmission line can also be applied between two consecutive stages at different temperatures inside a cryogenic apparatus.
Although illustrative embodiments of the present invention have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to these embodiments. Various changes or modifications may be effected by one skilled in the art without departing from the scope or the spirit of the invention as defined in the claims. Accordingly, reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, it is noted that the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Claims

CLAIMS Planar transmission line for communication with cryogenic devices comprising a first part (20A) and a second part (20B), wherein the first part (20A) comprises a first conductive layer (11), a first dielectric layer (12), a first signal line (13), a second dielectric layer (14) and a second conductive layer (15), the second part (20B) comprises a first signal line (13) and at least one of a first dielectric layer(12)and the second dielectric layer (14); and a connector arranged to connect the first part (20A) to the second part (20B), wherein the layers of the first part and the layers of the second part forming a first connection of the first part and the second part are reciprocally staggered such that a location of the first and second dielectric layer (12,14) of the first part (20A) is shifted about a predetermined distance along a longitudinal axis of the planar flexible transmission line (10) with respect to the first and the second dielectric layers (12,14) of the second part (20B). The planar transmission line of claim 1, wherein the second part further comprises a first conductive layer (11), the other one of the first and second dielectric layer (12,14) and a second conductive layer (15). The planar transmission line of claim 2, wherein the connector comprises a first conductive shell (16) and a second conductive shell (17), wherein the first and the second conductive shells are arranged to connect the first and second conductive layers (11,15) of the first (20 A) and second parts (20B) respectively. The planar transmission line of claim 2, wherein the planar transmission line is provided with a third dielectric layer (25) at the outside of the first conductive layer (11) of the first part (20 A) and a fourth dielectric layer (26) at the outside of the second conductive layer (15) of second part (20B) . The planar transmission line of claim 1, wherein the second part (40B) further comprises a first conductive layer (11) and the other one of the first and second dielectric layer (13,14); wherein the planar transmission line further comprises a third part comprising a first conductive layer (11), a first dielectric layer (12), a first signal line (13), a second dielectric layer (42) and a second conductive layer (15), wherein the connector is further arranged to connect the second part to the third part, and wherein the layers forming a second connection of the second part and the third part are reciprocally staggered. The planar transmission line of claim 1, wherein a length of the first part (20 A) is larger than a length of the second part (20B) , wherein, in the first part (20 A), the second dielectric layer (14) and the second conductive layer (15) are provided with a recess to fit a corresponding portion of the second part (20B) and the first signal line (13) is interrupted over a portion of the recess; wherein the corresponding portion of second part (20B) comprises the first signal line (13) and the second dielectric layer (14) , and another portion of the second part (20B) comprises a second conductive layer (15) and a third additional dielectric layer (51); and wherein the layers of the first part (20 A) and the second part (20B) forming a second connection are reciprocally staggered. The planar transmission line of claim 1, wherein a length of the first part
(20 A) is larger than a length of the second part (20B) , wherein in the first part (20 A) the second dielectric layer (14) and the second conductive layer (15) are provided with a recess to fit the second part (20B) , and the first signal line (13) is interrupted over a portion of the recess; wherein the second part (20B) comprises the first signal line (13) and the second dielectric layer (14); wherein the connector is further arranged to connect both sides of the recess of the second conductive layer (15); and the layers of the first part (20 A) and the second part (20B) forming a second connection are reciprocally staggered. The planar transmission line of any of the claims 1-7, wherein the second part (20B) is provided with an electronic component connected in series with the first signal line. The planar transmission line of any of the claim 1-8 wherein a second signal line is provided between the first and second dielectric layers of the first (20A) and second parts (20B) respectively.
10. The planar transmission line of claim 9, wherein a first connection between the first signal line of the first part (20 A) and the first signal line of the second part (20B) is shifted in a longitudinal direction of the planar transmission line with respect to a second connection between the second signal line of the first part and the second signal line of the second part.
11. The planar transmission line of claim 1 and 2, wherein the first part and the second part comprise a third conductive layer (21), a third dielectric layer (22), a fourth dielectric layer (24) between the second dielectric layer (14) and the second conductive layer (15); and a second signal line between the third dielectric layer and the fourth dielectric layer.
12. The planar transmission line of any of the claims 1-11 provided with a thermal clamp arranged to maintain the connector at a predetermined temperature.
13. The planar transmission line of claim 12, wherein the thermal clamp is integrated in one of the conductive shells.
14. The planar transmission line of any of the claims 1-13, wherein the connector is arranged to detachably connect the first part (20A) to the second part (20B).
15. Electronic device comprising a planar transmission line according to any one of the claims 1-14.
19
PCT/NL2021/050783 2021-01-13 2021-12-23 Planar transmission line for communication with cryogenic devices WO2022154657A1 (en)

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NL2027309A NL2027309B1 (en) 2021-01-13 2021-01-13 Planar transmission line for communication with cryogenic devices.
NL2027309 2021-01-13

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WO2022154657A1 true WO2022154657A1 (en) 2022-07-21

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Citations (5)

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US3218584A (en) * 1964-01-02 1965-11-16 Sanders Associates Inc Strip line connection
EP1544948A2 (en) * 2003-12-19 2005-06-22 Palo Alto Research Center Incorporated Flexible cable interconnect assembly
US20170194686A1 (en) * 2014-11-04 2017-07-06 Murata Manufacturing Co., Ltd. Transmission line cable
WO2018213494A1 (en) * 2017-05-16 2018-11-22 Rigetti & Co, Inc. Connecting electrical circuitry in a quantum computing system
US20190229390A1 (en) * 2016-12-01 2019-07-25 Murata Manufacturing Co., Ltd. Multilayer substrate connecting body and transmission line device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3218584A (en) * 1964-01-02 1965-11-16 Sanders Associates Inc Strip line connection
EP1544948A2 (en) * 2003-12-19 2005-06-22 Palo Alto Research Center Incorporated Flexible cable interconnect assembly
US20170194686A1 (en) * 2014-11-04 2017-07-06 Murata Manufacturing Co., Ltd. Transmission line cable
US20190229390A1 (en) * 2016-12-01 2019-07-25 Murata Manufacturing Co., Ltd. Multilayer substrate connecting body and transmission line device
WO2018213494A1 (en) * 2017-05-16 2018-11-22 Rigetti & Co, Inc. Connecting electrical circuitry in a quantum computing system

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