WO2022153808A1 - Imaging device and electronic apparatus - Google Patents

Abstract

[Problem] To curb degradation of image quality due to vibration. [Solution] This imaging device is provided with: a photoelectric conversion unit that is provided to each of a plurality of pixels and outputs an electrical signal obtained through photoelectric conversion within a period corresponding to a speed of movement of a subject moving in a relative manner; and a computation unit for integrating the electrical signal for each of the colors of the plurality of pixels. Two aforementioned pixels that perform photoelectric conversion of different colors of light are arranged without any gap along the direction of relative movement of the subject.

Description

Imaging devices and electronic devices

The embodiments according to the present disclosure relate to an imaging device and an electronic device.

Time delay integration (TDI) sensors are used in fields such as FA (Factory Automation) and aerial photography. This TDI sensor is a sensor that performs TDI processing that integrates the amount of electric charge while shifting the time according to the moving speed of the subject (see Patent Document 1).

Japanese Patent Application Laid-Open No. 2014-510447

However, for example, when realizing a TDI color sensor in a CCD (Charge Coupled Device) structure, it is necessary to arrange an output circuit between each color group such as a red group, a green group, and a blue group. That is, a color gap is generated between the color groups. In the CCD structure, it is difficult to suppress the intercolor gap. When a color gap is formed, there is a problem that the accuracy of the restored image is lowered due to color shift due to vibration in the direction perpendicular to the traveling direction of the document when the document (subject) is read by the TDI color sensor. That is, the image quality of the TDI color sensor may deteriorate due to vibration during reading.

Therefore, the present disclosure provides an imaging device and an electronic device capable of suppressing deterioration of image quality due to vibration.

To solve the above problems, according to this disclosure,
A photoelectric conversion unit provided for each of a plurality of pixels and outputting an electrical signal photoelectrically converted within a period corresponding to the moving speed of a relatively moving subject.
A calculation unit that integrates the electric signal for each color of the plurality of pixels is provided.
An imaging device is provided in which two pixels that photoelectrically convert light of different colors are arranged without gaps along the relative moving direction of the subject.

A first pixel region containing one or more of the pixels that photoelectrically convert light of the first color, and a second pixel region including one or more of the pixels that photoelectrically convert light of a second color different from the first color. The third pixel region including one or more of the pixels that photoelectrically convert the light of the first color and the light of the third color different from the second color is without a gap along the relative moving direction of the subject. It may be arranged.

Each of the first pixel region, the second pixel region, and the third pixel region includes one or more of the pixels in the first direction, which is the relative movement direction of the subject, and in the first direction. One or more of the pixels may be included in the intersecting second direction.

The first pixel region, the second pixel region, and the third pixel region are arranged without being mixed in the second direction.
The first pixel region and the second pixel region are arranged without gaps in the first direction.
The second pixel region and the third pixel region may be arranged without a gap in the first direction.

The first pixel region, the second pixel region, and the third pixel region are arranged in a mixed manner in the first direction and the second direction.
The first pixel region and the second pixel region are arranged without gaps in the first direction.
The second pixel region and the third pixel region may be arranged without a gap in the first direction.

The first pixel area, the second pixel area, and the third pixel area may be arranged in a bayer array.

The pixel has a color filter corresponding to the wavelength band of light to be photoelectrically converted.
The two color filters corresponding to different colors may be arranged without gaps along the relative moving direction of the subject.

The first pixel region comprises one or more of the pixels having a first color filter that transmits light of the first color.
The second pixel region comprises one or more of the pixels having a second color filter that transmits light of the second color.
The third pixel region comprises one or more of the pixels having a third color filter that transmits light of the third color.
The first color filter, the second color filter, and the third color filter may be arranged without gaps along the first direction, which is the relative movement direction of the subject.

The first color filter, the second color filter, and the third color filter are arranged without being mixed in the second direction intersecting the first direction.
The first color filter and the second color filter are arranged without gaps in the first direction.
The second color filter and the third color filter may be arranged without a gap in the first direction.

The first color filter, the second color filter, and the third color filter are arranged in a mixed manner in the first direction and the second direction intersecting the first direction.
The first color filter and the second color filter are arranged without gaps in the first direction.
The second color filter and the third color filter may be arranged without a gap in the first direction.

The first color filter, the second color filter, and the third color filter may be arranged in a bayer array.

An ADC (Analog to Digital Converter), which is arranged for each of the plurality of pixels and converts the electric signal into a digital signal, is further provided.
The calculation unit may integrate the digital signals for each color.

The first chip on which the photoelectric conversion unit is arranged and
A second chip that is laminated with the first chip and on which the ADC is arranged may be further provided.

The ADC may be arranged at a position where it overlaps with the photoelectric conversion unit in the stacking direction.

According to the present disclosure, the imaging device and
A moving unit that moves the subject of the imaging device at a predetermined speed is provided.
The image pickup device
A photoelectric conversion unit provided for each of a plurality of pixels and outputting an electrical signal photoelectrically converted within a period corresponding to the moving speed of a relatively moving subject.
A calculation unit that integrates the electric signal for each color of the plurality of pixels is provided.
An electronic device is provided in which two pixels that photoelectrically convert light of different colors are arranged without gaps along the relative moving direction of the subject.

It is a block diagram which shows one configuration example of the image pickup apparatus in the 1st Embodiment of this technique. It is a figure for demonstrating the use example of the image pickup system in 1st Embodiment of this technique. It is a figure which shows an example of the laminated structure of the solid-state image pickup device in the 1st Embodiment of this technique. It is a block diagram which shows one structural example of the light receiving chip in the 1st Embodiment of this technique. It is a block diagram which shows one structural example of the circuit chip in 1st Embodiment of this technique. It is a figure which shows one configuration example of the pixel AD (Analog to Digital) conversion part in the 1st Embodiment of this technique. It is a block diagram which shows one configuration example of ADC (Analog to Digital Converter) in the 1st Embodiment of this technique. It is a circuit diagram which shows one configuration example of the differential input circuit and the positive feedback circuit in the 1st Embodiment of this technique. It is a circuit diagram which shows one configuration example of the pixel circuit and the amplifier circuit in the 1st Embodiment of this technique. It is a top view which shows an example of the layout of the element in a pixel in 1st Embodiment of this technique. It is a block diagram which shows one structural example of the signal processing circuit in 1st Embodiment of this technique. It is a circuit diagram which shows one structural example of the arithmetic circuit in 1st Embodiment of this technique. It is a figure which shows an example of TDI processing in 1st Embodiment of this technique. This is an example of a flowchart showing an example of the operation of the imaging system according to the first embodiment of the present technology. It is a figure which shows an example of the structure of the image pickup apparatus in the 1st Embodiment of this technique. It is a figure explaining the influence of vibration when the intercolor gap is large. It is a figure explaining the influence of vibration when the intercolor gap is small. It is a figure explaining the intercolor gap. It is a figure explaining the relationship between a color gap and vibration. It is a graph which shows a transfer function. It is a figure which shows an example of the structure of the image pickup device in the 1st modification. It is a figure which shows an example of the structure of the image pickup apparatus in the 2nd modification. It is a figure which shows an example of the structure of the image pickup apparatus in the 2nd Embodiment of this technique.

Hereinafter, embodiments of the imaging device and the electronic device will be described with reference to the drawings. In the following, the main components of the image pickup device and the electronic device will be mainly described, but the image pickup device and the electronic device may have components and functions not shown or described. The following description does not exclude components or functions not shown or described.

<First Embodiment>
[Configuration example of imaging device]
FIG. 1 is a block diagram showing a configuration example of an image pickup apparatus 100 according to a first embodiment of the present technology. The image pickup device 100 is a device for capturing image data, and includes an optical unit 110, a solid-state image sensor 200, a storage unit 120, a control unit 130, and a communication unit 140.

The optical unit 110 collects the incident light and guides it to the solid-state image sensor 200. The solid-state image sensor 200 captures image data. The solid-state image sensor 200 supplies image data to the storage unit 120 via a signal line 209.

The storage unit 120 stores image data. The control unit 130 controls the solid-state image sensor 200 to capture image data. The control unit 130 supplies the solid-state image sensor 200 with a vertical synchronization signal VSYNC indicating the image pickup timing, for example, via the signal line 208.

The communication unit 140 reads the image data from the storage unit 120 and transmits it to the outside.

FIG. 2 is a diagram for explaining a usage example of the image pickup apparatus 100 in the first embodiment of the present technology. As illustrated in the figure, the image pickup apparatus 100 is used in a factory or the like where a belt conveyor 510 is provided.

FIG. 2 is also a diagram showing the electronic device 1 of the present technology. The electronic device 1 includes an image pickup device 100 and a belt conveyor (moving unit) 510. The electronic device 1 may include a housing (not shown) or the like for fixing the image pickup apparatus 100.

The belt conveyor 510 moves the subject 511 in a predetermined direction at a constant speed. The image pickup apparatus 100 is fixed in the vicinity of the belt conveyor 510, and images the subject 511 to generate image data. The image data is used, for example, for inspection of the presence or absence of defects. As a result, FA is realized.

The image pickup apparatus 100 captures a subject 511 moving at a constant speed, but the present invention is not limited to this configuration. The image pickup device 100 may move at a constant speed to take an image of the subject, such as in aerial photography.

[Structure example of solid-state image sensor]
FIG. 3 is a diagram showing an example of a laminated structure of the solid-state image sensor 200 according to the first embodiment of the present technology. The solid-state image sensor 200 includes a circuit chip (second chip) 202 and a light receiving chip (first chip) 201 laminated on the circuit chip 202. These chips are electrically connected via a connection such as a via. In addition to vias, it can also be connected by Cu-Cu bonding or bumps.

FIG. 4 is a block diagram showing a configuration example of the light receiving chip 201 according to the first embodiment of the present technology. The light receiving chip 201 is provided with a pixel array unit 210 and a peripheral circuit 212.

A plurality of pixel circuits 220 are arranged in a two-dimensional grid pattern in the pixel array unit 210. Further, the pixel array unit 210 is divided into a plurality of pixel blocks 211. In each of these pixel blocks 211, for example, a pixel circuit 220 having 4 rows × 2 columns is arranged. Further, for each pixel circuit 220, a plurality of transistors are further arranged outside the pixel circuit 220, but these transistors are omitted in the figure for convenience of description.

For example, a circuit that supplies a DC (Direct Current) voltage is arranged in the peripheral circuit 212.

FIG. 5 is a block diagram showing a configuration example of the circuit chip 202 according to the first embodiment of the present technology. A DAC (Digital to Analog Converter) 251, a pixel drive circuit 252, a time code generation unit 253, a pixel AD conversion unit 254, and a vertical scanning circuit 255 are arranged on the circuit chip 202. Further, a control circuit 256, a signal processing circuit 400, an image processing circuit 260, and an output circuit 257 are arranged on the circuit chip 202.

The DAC 251 generates a reference signal by DA (Digital to Analog) conversion within a predetermined AD conversion period. For example, a saw blade-shaped lamp signal is used as a reference signal. The DAC 251 supplies the reference signal to the pixel AD conversion unit 254.

The time code generation unit 253 generates a time code indicating the time within the AD conversion period. The time code generation unit 253 is realized by, for example, a counter. As the counter, for example, a Gray code counter is used. The time code generation unit 253 supplies the time code to the pixel AD conversion unit 254.

The pixel drive circuit 252 drives each of the pixel circuits 220 to generate an analog pixel signal.

The pixel AD conversion unit 254 performs AD conversion that converts each analog signal (that is, a pixel signal) of the pixel circuit 220 into a digital signal. The pixel AD conversion unit 254 is divided by a plurality of clusters 300. The cluster 300 is provided for each pixel block 211 and converts the analog signal in the corresponding pixel block 211 into a digital signal.

The pixel AD conversion unit 254 generates image data in which digital signals are arranged by AD conversion as a frame and supplies the image data to the signal processing circuit 400.

The vertical scanning circuit 255 drives the pixel AD conversion unit 254 to execute AD conversion.

The signal processing circuit 400 performs predetermined signal processing on the frame. As signal processing, various processes including CDS (Correlated Double Sampling) processing and TDI processing are executed. The signal processing circuit 400 supplies the processed frame to the image processing circuit 260.

The image processing circuit 260 executes predetermined image processing on the frame from the signal processing circuit 400. As image processing, image recognition processing, black level correction processing, image correction processing, demosaic processing, and the like are executed. The image processing circuit 260 supplies the processed frame to the output circuit 257.

The output circuit 257 outputs the frame after image processing to the outside.

The control circuit 256 controls the operation timings of the DAC 251, the pixel drive circuit 252, the vertical scanning circuit 255, the signal processing circuit 400, the image processing circuit 260, and the output circuit 257 in synchronization with the vertical synchronization signal VSYNC.

[Configuration example of pixel AD conversion unit]
FIG. 6 is a diagram showing a configuration example of the pixel AD conversion unit 254 according to the first embodiment of the present technology. A plurality of ADCs 310 are arranged in a two-dimensional grid pattern in the pixel AD conversion unit 254. The ADC 310 is arranged for each pixel circuit 220. When the number of rows and columns of the pixel circuit 220 is N rows (N is an integer) and M columns (M is an integer), N × M ADC 310s are arranged.

In each of the clusters 300, the same number of ADC 310s as the number of pixel circuits 220 in the pixel block 211 are arranged. When the pixel circuit 220 having 4 rows × 2 columns is arranged in the pixel block 211, the ADC 310 having 4 rows × 2 columns is also arranged in the cluster 300.

The ADC 310 performs AD conversion on an analog pixel signal generated by the corresponding pixel circuit 220. The ADC 310 compares the pixel signal and the reference signal in the AD conversion, and holds the time code when the comparison result is inverted. Then, the ADC 310 outputs the held time code as a digital signal after AD conversion.

In addition, a repeater unit 360 is arranged for each row of the cluster 300. When the number of columns of the cluster 300 is M / 2, M / 2 repeater units 360 are arranged. The repeater unit 360 transfers the time code. The repeater unit 360 transfers the time code from the time code generation unit 253 to the ADC 310. Further, the repeater unit 360 transfers a digital signal from the ADC 310 to the signal processing circuit 400. This transfer of digital signals is also referred to as "reading" the digital signals.

Further, in the figure, the numbers in parentheses indicate an example of the reading order of the digital signals of the ADC 310. For example, the odd-numbered column digital signal in the first row is read first, and the even-numbered column digital signal in the first row is read second. The odd-numbered column digital signal in the second row is read out third, and the even-numbered column digital signal in the second row is read out third. Hereinafter, similarly, the odd-numbered columns and even-numbered columns of the digital signals in each row are read out in order.

Although the ADC 310 is arranged for each pixel circuit 220, the configuration is not limited to this. A plurality of pixel circuits 220 may be configured to share one ADC 310.

[ADC configuration example]
FIG. 7 is a block diagram showing a configuration example of the ADC 310 according to the first embodiment of the present technology. The ADC 310 includes a differential input circuit 320, a positive feedback circuit 330, a latch control circuit 340, and a plurality of latch circuits 350.

Further, an amplifier circuit 230 is arranged between the pixel circuit 220 and the ADC 310. The amplifier circuit 230 amplifies the pixel signal from the pixel circuit 220 and supplies it to the ADC 310. The circuit including the pixel circuit 220 and the amplifier circuit 230 functions as one pixel.

Further, the pixel circuit 220, the amplifier circuit 230, and a part of the differential input circuit 320 are arranged on the light receiving chip 201, and the rest of the differential input circuit 320 and the circuit in the subsequent stage are arranged on the circuit chip 202. To.

The differential input circuit (comparator) 320 compares the pixel signal from the amplifier circuit 230 with the reference signal from the DAC 251. The differential input circuit 320 supplies a comparison result signal indicating the comparison result to the positive feedback circuit 330.

The positive feedback circuit 330 adds a part of the output to the input (comparison result signal) and supplies it to the latch control circuit 340 as an output signal VCO.

The latch control circuit 340 causes a plurality of latch circuits 350 to hold the time code when the output signal VCO is inverted according to the control signal xWORD from the vertical scanning circuit 255.

The latch circuit 350 holds the time code from the repeater unit 360 according to the control of the latch control circuit 340. The latch circuit 350 is provided for the number of bits of the time code. For example, when the time code is 15 bits, 15 latch circuits 350 are arranged in the ADC 310. Further, the held time code is read out by the repeater unit 360 as a digital signal after AD conversion.

According to the configuration illustrated in the figure, the ADC 310 converts the pixel signal from the amplifier circuit 230 into a digital signal.

[Configuration example of differential input circuit and positive feedback circuit]
FIG. 8 is a circuit diagram showing a configuration example of a pixel circuit 220, a differential input circuit 320, and a positive feedback circuit 330 according to the first embodiment of the present technology.

The differential input circuit 320 includes pMOS (p-channel Metal Oxide Semiconductor) transistors 321, 324 and 326. Further, the differential input circuit 320 includes nMOS (n-channel MOS) transistors 322, 323, 325, 327 and 328. Of these, the nMOS transistors 322, 323, 325 and 328 are arranged on the light receiving chip 201, and the rest are arranged on the circuit chip 202.

The nMOS transistors 322 and 325 form a differential pair, and the source of these transistors is commonly connected to the drain of the nMOS transistor 323. Further, the drain of the nMOS transistor 322 is connected to the drain of the pMOS transistor 321 and the gate of the pMOS transistors 321 and 324. The drain of the nMOS transistor 325 is connected to the drain of the pMOS transistor 324 and the gate of the pMOS transistor 326. Further, a reference signal REF from the DAC 251 is input to the gate of the nMOS transistor 322.

A predetermined bias voltage Vb is applied to the gate of the nMOS transistor 323, and a predetermined ground voltage is applied to the source of the nMOS transistor 323.

The pixel signal SIG from the amplifier circuit 230 is input to the gate of the nMOS transistor 325.

The pMOS transistors 321, 324 and 326 form a current mirror circuit. A power supply voltage VDDH is applied to the sources of the pMOS transistors 321, 324 and 326. This power supply voltage VDDH is higher than the power supply voltage VDDL described later.

A power supply voltage VDDL is applied to the gate of the nMOS transistor 327. Further, the drain of the nMOS transistor 327 is connected to the drain of the pMOS transistor 326, and the source is connected to the positive feedback circuit 330.

The nMOS transistor 328 short-circuits the gate and drain of the nMOS transistor 325 according to the auto zero signal AZ from the pixel drive circuit 252.

The positive feedback circuit 330 includes pMOS transistors 331, 332, 334 and 335, and nMOS transistors 333, 336 and 337. The pMOS transistors 331 and 332 and the nMOS transistor 333 are connected in series with the power supply voltage VDDL. Further, a drive signal INI2 from the vertical scanning circuit 255 is input to the gate of the pMOS transistor 331. The connection points of the pMOS transistor 332 and the nMOS transistor 333 are connected to the source of the nMOS transistor 327.

A ground voltage is applied to the source of the nMOS transistor 333, and a drive signal INI1 from the vertical scanning circuit 255 is input to the gate.

The pMOS transistors 334 and 335 are connected in series with the power supply voltage VDDL. Further, the drain of the pMOS transistor 335 is connected to the gate of the pMOS transistor 332 and the drain of the nMOS transistors 336 and 337. The control signal TESTVCO from the vertical scanning circuit 255 is input to the gates of the pMOS transistor 335 and the nMOS transistor 337. Further, the gates of the pMOS transistor 334 and the nMOS transistor 336 are connected to the connection points of the pMOS transistor 332 and the nMOS transistor 333.

The output signal VCO is output from the connection point of the pMOS transistor 335 and the nMOS transistor 337. Further, a ground voltage is applied to the sources of the nMOS transistors 336 and 337.

Note that each of the differential input circuit 320 and the positive feedback circuit 330 is not limited to the circuit illustrated in FIG. 8 as long as it has the functions described in FIG. 7.

[Configuration example of amplifier circuit and pixel circuit]
FIG. 9 is a circuit diagram showing a configuration example of the pixel circuit 220 and the amplifier circuit 230 according to the first embodiment of the present technology.

The pixel circuit 220 includes an emission transistor 221, a photoelectric conversion element 222, a transfer transistor 223, a reset transistor 224, a capacitance 225, a gain control transistor 226, and a floating diffusion layer 227. For example, an nMOS transistor is used as the emission transistor 221, the transfer transistor 223, the reset transistor 224, and the gain control transistor 226.

The discharge transistor 221 discharges the electric charge accumulated in the photoelectric conversion element 222 according to the drive signal OFG from the pixel drive circuit 252. The photoelectric conversion element 222 generates an electric charge by photoelectric conversion.

The transfer transistor 223 transfers an electric charge from the photoelectric conversion element 222 to the floating diffusion layer 227 according to the transfer signal TG from the pixel drive circuit 252.

The reset transistor 224 initializes the floating diffusion layer 227 according to the reset signal RST from the pixel drive circuit 252.

The capacitance 225 is inserted between the connection node of the reset transistor 224 and the gain control transistor 226 and the ground terminal.

The gain control transistor 226 controls the analog gain with respect to the voltage of the floating diffusion layer 227 according to the control signal FDG from the pixel drive circuit 252. By reducing the voltage of the floating diffusion layer 227 by analog gain and outputting it, the amount of signals handled by the pixel circuit 220, that is, the amount of saturation signals can be increased.

The floating diffusion layer 227 accumulates the transferred electric charge and generates a voltage according to the amount of electric charge.

Further, the amplifier circuit 230 includes nMOS transistors 231 and 232 and a capacitance 233. The nMOS transistors 231 and 232 are connected in series between the power supply and the ground terminal. The gate of the nMOS transistor 231 on the power supply side is connected to the floating diffusion layer 227. A predetermined bias voltage VB2 is applied to the gate of the nMOS transistor 232 on the ground side.

Further, the connection nodes of the nMOS transistors 231 and 232 are connected to the differential input circuit 320 via the capacitance 233. Assuming that the gate-source capacitance of the nMOS transistor 325 on the pixel signal side of the differential pairs in the differential input circuit 320 is Cgs, the capacitance value of the capacitance 233 is considerably larger than the gate-source capacitance Cgs. Set. If the floating diffusion layer 227 and the gate of the nMOS transistor 325 are directly connected, the fluctuation of the floating diffusion layer 227 becomes large due to the coupling between the gate-source capacitance Cgs and the floating diffusion layer 227, and the AD conversion period becomes longer. It may take a long time. However, the effect of this coupling can be mitigated by adding capacity 233.

Note that each of the pixel circuit 220 and the amplifier circuit 230 is not limited to the circuit illustrated in FIG. 9 as long as it has the functions described in FIG. 7.

FIG. 10 is a plan view showing an example of the layout of the elements in the pixels according to the first embodiment of the present technology. The optical axis of the incident light is the Z axis, the predetermined axis perpendicular to the Z axis is the X axis, and the Z axis and the axis perpendicular to the X axis are the Y axes.

On the light receiving surface, that is, the XY plane, a plurality of photoelectric conversion elements 222 in rows N and columns M are arranged in a two-dimensional lattice pattern. The size of these photoelectric conversion elements 222 in the Y-axis direction is defined as Y1. In this XY plane, the M photoelectric conversion elements 222 are arranged adjacent to each other along the X-axis direction without any gap. The set of M photoelectric conversion elements 222 arranged in the X-axis direction and the set of digital signals corresponding to them are hereinafter referred to as "lines". On the other hand, along the Y-axis direction, the N photoelectric conversion elements 222 are arranged with an interval of Y2. In other words, the N lines are arranged at intervals of Y2. Here, it is assumed that the following relationship is established between the size Y1 and the interval Y2.
Y1 ≤ Y2 ・ ・ ・ Equation 1

In the figure, the interval Y2 is the same value as the size Y1. As illustrated in Equation 1, the interval Y2 can be made larger than the size Y1. When the interval Y2 is larger than the size Y1, the interval Y2 is set to an integral multiple of Y1. As the interval Y2 is increased, the size of the lower ADC 310 in the Y-axis direction can be increased. Therefore, the size of the ADC 310 in the X-axis direction can be reduced accordingly to miniaturize the pixels in the X-axis direction. can.

Further, in the Y-axis direction, a transistor arrangement region 241 is provided in the gap region 240 between each of the N photoelectric conversion elements 222. A predetermined number of transistors, a floating diffusion layer 227, and capacitances 233 and 225 are arranged in the transistor arrangement region 241. A predetermined number of transistors include discharge transistors 221 and reset transistors 224 and gain control transistors 226, and nMOS transistors 231, 232, 322, 323 and 325. In other words, in the transistor arrangement region 241, the transistor in the differential input circuit 320 illustrated in FIG. 8 and the transistor in the pixel circuit 220 and the amplifier circuit 230 illustrated in FIG. 9 are arranged. As described with reference to FIG. 9, these transistors generate a signal (pixel signal or a signal obtained by amplifying the pixel signal) according to the amount of electric charge generated by any one of the plurality of photoelectric conversion elements 222. do. Further, a transfer transistor 223 is arranged between the transistor arrangement region 241 and the photoelectric conversion element 222.

Here, the N-row and M-column photoelectric conversion elements 222 are arranged without gaps along the X-axis direction and the Y-axis direction, and various transistors such as the discharge transistor 221 and the stray diffusion layer 227 are arranged in the photoelectric conversion element 222. Let's assume a comparative example of arranging around. In this comparative example, the light receiving area of the photoelectric conversion element 222 becomes narrower as the number of transistors increases.

On the other hand, as illustrated in the figure, in the configuration in which N photoelectric conversion elements 222 are arranged at predetermined intervals in the Y-axis direction, transistors and the like can be arranged in the gap area 240. , The light receiving area can be made wider than that of the comparative example. By expanding the light receiving area, the sensitivity of the pixel can be improved. Further, since more transistors can be arranged than in the comparative example, additional circuits such as an amplifier circuit 230 can be further arranged in addition to the pixel circuit 220.

Further, in the example shown in FIG. 10, one pixel P includes a photoelectric conversion element 222 and a gap region 240.

[Example of signal processing circuit configuration]
FIG. 11 is a block diagram showing a configuration example of the signal processing circuit 400 according to the first embodiment of the present technology. The signal processing circuit 400 includes a plurality of selectors 405, a plurality of arithmetic circuits 410, a CDS frame memory 440, and a TDI frame memory 450.

The selector 405 is arranged for each column of the cluster 300, in other words, for each repeater unit 360. When two rows of ADC 310s are arranged in the cluster 300, a selector 405 is arranged in every two rows. Further, the arithmetic circuit 410 is arranged for each row of the ADC 310. When the ADC 310 has M columns, M / 2 selectors 405 and M arithmetic circuits 410 are arranged.

As described above, the repeater unit 360 outputs an odd-numbered row of digital signals and an even-numbered row of digital signals in order.

The selector 405 selects the output destination of the digital signal according to the control of the control circuit 256. When an odd-numbered sequence is output by the repeater unit 360, the selector 405 outputs a digital signal to the arithmetic circuit 410 corresponding to the odd-numbered sequence. On the other hand, when an even-numbered sequence is output, the selector 405 outputs a digital signal to the arithmetic circuit 410 corresponding to the even-numbered sequence.

The arithmetic circuit 410 performs CDS processing and TDI processing on the digital signal from the selector 405.

Here, the digital signal includes a P-phase level and a D-phase level. The P-phase level indicates the level when the pixel circuit 220 is initialized by the reset signal RST. On the other hand, the D-phase level indicates a level according to the exposure amount when the electric charge is transferred by the transfer signal TG. The P-phase level is also called the reset level, and the D-phase level is also called the signal level.

In the CDS processing, the M arithmetic circuits 410 hold the P-phase frames in which the P-phase levels are arranged in the CDS frame memory 440. Then, the M arithmetic circuits 410 obtain the difference between the P-phase level and the D-phase level for each pixel, and generate a CDS frame in which the difference data is arranged. On the other hand, in the TDI processing, the M arithmetic circuits 410 hold the frames after the CDS processing in the TDI frame memory 450, and update the TDI frame memory 450 with the integrated data.

Further, the M arithmetic circuits 410 supply the CDS frame and the TDI frame after the TDI processing to the image processing circuit 260.

[Configuration example of arithmetic circuit]
FIG. 12 is a circuit diagram showing a configuration example of the arithmetic circuit 410 according to the first embodiment of the present technology. The arithmetic circuit 410 includes a TDI circuit 420 and a CDS circuit 430. The TDI circuit 420 includes a buffer 421, a selector 422, an adder 423, and a switch 424. The CDS circuit 430 includes a selector 431, a buffer 432, a selector 433, a subtractor 434 and a switch 435. The operation of the selectors 422, 431 and 433 and the switches 424 and 425, respectively, is controlled by, for example, the control circuit 256.

The selector 431 selects either a digital signal from the selector 405 or a digital signal from the TDI frame memory 450 and outputs it to the buffer 421.

The buffer 421 delays and outputs the signal from the selector 431.

The selector 422 selects either a digital signal from the buffer 421 or a digital signal having a decimal value of "0" and outputs it to the adder 423.

The adder 423 adds the digital signal from the selector 422 and the digital signal from the buffer 432. The adder 423 supplies a digital signal indicating the added value to the switch 424 as integrated data.

The switch 424 opens and closes the path between the adder 423 and the TDI frame memory 450.

The buffer 432 delays and outputs the signal from the CDS frame memory 440.

The selector 433 selects either a digital signal from the buffer 432 or a digital signal having a decimal value of "0" and outputs it to the subtractor 434.

The subtractor 434 calculates the difference between the digital signal from the buffer 421 and the digital signal from the selector 433. The subtractor 434 supplies a digital signal indicating the difference to the switch 435 as the difference data.

The switch 435 opens and closes the path between the subtractor 434 and the CDS frame memory 440.

According to the configuration illustrated in the figure, the CDS circuit 430 can perform CDS processing. Further, the TDI circuit 420 can perform TDI processing.

FIG. 13 is a diagram showing an example of TDI processing in the first embodiment of the present technology. For example, it is assumed that the CDS frame memory 440 and the TDI frame memory 450 are initialized, the frame F1 is first imaged, and then the frames F2, F3, F4, F5, F6, F7 and F8 are imaged in order. In the figure, frames F5 and later are omitted. The arrows in the figure indicate the moving direction of the subject. As illustrated in the figure, it is assumed that the subject moves one line at a time in the direction in which the row address increases along the Y-axis direction. The gray part between the lines in the figure shows the gap area between the lines. The gap area is for one line.

In the TDI processing, the signal processing circuit 400 integrates the line L1 of the frame F1 after the CDS processing, the line L2 of the frame F3, the line L3 of the frame F5, and the line L4 of the frame F7. As described above, since the subject moves one line at a time and the gap area is one line, the pattern of each line to be integrated is the same. The signal processing circuit 400 outputs the integrated line as the last line of the TDI frame.

Further, in the TDI processing, the signal processing circuit 400 integrates the line L1 of the frame F2 after the CDS processing, the line L2 of the frame F4, the line L3 of the frame F6, and the line L4 of the frame F8. The signal processing circuit 400 outputs the integrated line as the penultimate line of the TDI frame. Similarly, the other lines are generated by integrating the four lines after the frame F3.

When the moving speed of the subject is fast, it is necessary to shorten the exposure time in order to prevent blurring. If the exposure time is shortened, the image may become dark, but by performing the TDI process, it is possible to integrate a plurality of lines of the same pattern to improve the brightness. Further, as the number of integrated lines increases, noise is reduced due to the smoothing effect. By improving the brightness and reducing the noise, the image quality of the frame (that is, the image data) can be improved as compared with the case where the TDI processing is not performed.

The signal processing circuit 400 integrates four lines, but the number of integrated lines is not limited to four as long as it is two or more. Further, the signal processing circuit 400 integrates four lines from the first line for the first eight frames, but the present invention is not limited to this configuration. For example, when the moving direction of the subject is opposite, the signal processing circuit 400 may integrate 4 lines from the last line for the first 8 frames.

Further, although there is a gap area for one line between the lines, lines of the same pattern are integrated by setting every other frame to be integrated, such as frames F1, F3, F5 and F7. be able to. When the gap area between the lines is set to 2 lines or 3 lines, the frames to be integrated may be set to every 2 or 3 frames.

[Operation example of solid-state image sensor]
FIG. 14 is an example of a flowchart showing an example of the operation of the solid-state image sensor 200 according to the first embodiment of the present technology. This operation is started, for example, when a predetermined application for imaging a frame is executed.

The pixel drive circuit 252 in the solid-state image sensor 200 drives all the pixels and starts exposure at the same time (step S901). Such control of exposing all pixels at the same time is called a global shutter method.

Immediately before the end of exposure, the ADC 310 AD-converts the P-phase level (step S902). Then, at the end of the exposure, the ADC 310 AD-converts the D-phase level, and the arithmetic circuit 410 performs the CDS process (step S903).

The image processing circuit 260 performs predetermined image processing on the frame after the CDS processing (step S904), and the arithmetic circuit 410 performs TDI processing (step S905). The image processing circuit 260 performs predetermined image processing on the frame after the TDI processing (step S906), and the output circuit 257 outputs the processing result (step S907). After step S907, the solid-state image sensor 200 ends the process of imaging one frame. When two or more frames are continuously imaged, steps S901 to S907 are repeatedly executed in synchronization with the vertical synchronization signal VSYNC.

As described above, according to the first embodiment of the present technique, a plurality of photoelectric conversion elements 222 are arranged at regular intervals along the Y-axis direction, and transistors are arranged between them. The light receiving area of the photoelectric conversion element 222 can be made wider than that in the case where the light receiving area is not opened. Thereby, the sensitivity of the pixel can be improved.

[Color sensor]
FIG. 15 is a diagram showing an example of the configuration of the image pickup apparatus 100 according to the first embodiment of the present technology.

The image pickup apparatus 100 shown in FIG. 15 is a TDI color sensor having a color filter. Further, the image pickup apparatus 100 is, for example, a TDI linear image sensor. The color filter passes light in a wavelength band corresponding to a predetermined color. The data of TDI processing is added for each color.

The pixel P shown in FIG. 15 corresponds to the pixel P shown in FIG. The pixel P includes a pixel PR arranged in the red filter (R), a pixel PG arranged in the green filter (G), and a pixel PB arranged in the blue filter (B).

In the color filter shown in FIG. 15, the color pattern is a color group array. The color filter includes, for example, a red filter group, a green filter group, and a blue filter group in which a plurality of red filters, green filters, and blue filters are arranged adjacent to each other.

In the example shown in FIG. 15, three pixels P of the same color are arranged in the X direction and the Y direction, respectively. However, the number of pixels P arranged is not limited to this. When the image pickup apparatus 100 is a linear sensor, for example, pixels P such as 1000 or 2000 are arranged side by side in the X direction. Further, for example, 16 pixels P per color are arranged side by side in the Y direction.

One pixel P includes a photoelectric conversion element 222. The photoelectric conversion element 222 is provided in each of the plurality of pixels P, and outputs an electrical signal photoelectrically converted within a period corresponding to the moving speed of the relatively moving subject 511. The "relative movement direction" is not limited to the case described with reference to FIG. 2, and includes the case where the subject 511 is fixed and the image pickup apparatus 100 is moved.

The ADC 310 is arranged for each of the plurality of pixels P and converts an electric signal into a digital signal.

The arithmetic circuit (calculation unit) 410 arranged outside the pixel area integrates electric signals for each color of a plurality of pixels P. More specifically, the arithmetic circuit 410 integrates the digital signals converted by the ADC 310 for each color. Therefore, as shown in FIG. 5, the arithmetic circuit 410 in the signal processing circuit 400 integrates the digital signals output from the ADC 310 in the pixel AD conversion unit 254 for each color.

The image pickup apparatus 100 has a laminated structure as described with reference to FIG. The ADC 310 is arranged at a position where it overlaps with the photoelectric conversion element 222 in the stacking direction. More specifically, the differential input circuit 320 and the latch circuit 350 are arranged directly below the photoelectric conversion element 222. The differential input circuit 320 receives a slope signal from the DAC 251 arranged outside the pixel area. As a result, the ADC 310 performs the single slope AD conversion. The digital value is held in the latch circuit 350 and transferred every H to a logic circuit such as the signal processing circuit 400.

Next, the details of the arrangement of the pixel P and the color filter for each color will be described.

The two pixels P that photoelectrically convert light of different colors are arranged without a gap along the relative moving direction (Y direction) of the subject 511. In the example shown in FIG. 15, the pixel PR and the pixel PG that are adjacent to each other along the Y direction are arranged so as to be in contact with each other without a gap. The pixel PG and the pixel PB that are adjacent to each other along the Y direction are arranged so as to be in contact with each other without a gap. As a result, there is almost no intercolor gap between the pixel PR and the pixel PG and between the pixel PG and the pixel PB. As a result, deterioration of image quality due to vibration can be suppressed. That is, the vibration resistance of the image pickup apparatus 100 and the electronic device 1 can be improved. The details of the vibration resistance will be described later with reference to FIGS. 16A to 19.

In the example shown in FIG. 15, a first pixel region including one or more pixels P that photoelectrically convert light of the first color and one or more pixels P that photoelectrically convert light of a second color different from the first color are formed. The relative movement direction (Y) of the subject 511 is the second pixel region including the second pixel region and the third pixel region including one or more pixels P that photoelectrically convert the light of the first color and the third color different from the second color. It is arranged without a gap along the direction).

The first color, the second color, and the third color are, for example, red, green, and blue, respectively, but the type and order of the colors are not limited to this. The first pixel area, the second pixel area, and the third pixel area are, for example, areas in which one or more red pixel PRs, one or more green pixel PGs, and one or more blue pixel PBs are arranged, respectively. , The type and order of colors are not limited to this.

Each of the first pixel region, the second pixel region, and the third pixel region includes one or more pixels P in the first direction (Y direction), which is the relative movement direction of the subject 511, and is in the first direction. One or more pixels P are included in the intersecting second direction (X direction).

Pixels P of each color are arranged according to a color group array. That is, the first pixel region, the second pixel region, and the third pixel region are arranged without being mixed in the X direction. The first pixel area and the second pixel area are arranged without a gap in the Y direction. The second pixel area and the third pixel area are arranged without a gap in the Y direction.

Pixel P has a color filter corresponding to the wavelength band of light to be photoelectrically converted. The two color filters corresponding to different colors are arranged without gaps along the relative moving direction of the subject 511.

The first pixel region has one or more pixels P having a first color filter that transmits light of the first color. The second pixel region has one or more pixels P having a second color filter that transmits light of the second color. The third pixel region has one or more pixels P having a third color filter that transmits light of the third color. The first color filter, the second color filter, and the third color filter are arranged without gaps along the Y direction, which is the relative movement direction of the subject 511.

Further, the first color filter, the second color filter, and the third color filter are arranged without being mixed in the X direction intersecting the Y direction. The first color filter and the second color filter are arranged without a gap in the Y direction. The second color filter and the third color filter are arranged without a gap in the Y direction.

[Vibration resistance]
Next, the relationship between the intercolor gap of the pixel P and the vibration resistance will be described.

FIG. 16A is a diagram illustrating the effect of vibration when the color gap is large. FIG. 16B is a diagram illustrating the effect of vibration when the color gap is small.

FIG. 16A shows an example assuming that a subject is scanned and synthesized at different times using a linear sensor for single colors of red, green, and blue. In this case, the vibration V at the left and right reading positions (positions in the X direction) of the image has almost no correlation between the red, green, and blue colors. Therefore, in the composite image, color shift occurs according to the difference in vibration V for each color.

FIG. 16B shows an example in which it is assumed that the positions in the scanning direction (positions in the Y direction) are almost the same between the colors using the linear sensors for red, green, and blue monochromatic colors. In this case, the vibration V at the left and right reading positions of the image is almost the same for each color. That is, the correlation of vibration V for each color is strong. Therefore, there is almost no color shift in the composite image.

The intercolor gap of the pixel P in TDI can be considered in the same manner as in FIGS. 16A and 16B. That is, the smaller the intercolor gap of the pixel P, the stronger the correlation between the vibration Vs at the left and right reading positions. As a result, the color shift of the composite image is reduced. As a result, deterioration of image quality due to vibration can be suppressed.

FIG. 17 is a diagram illustrating the intercolor gap GC. FIG. 17 shows a pixel PR for red and a pixel PG for green as an example.

The intercolor gap GC is a value obtained by subtracting the same color pixel distance DP from the CF end distance DCF, which is the distance between the color filter (CF) end of the red filter and the CF end of the green filter. The same-color pixel distance DP is the product of the pixel pitch and the number of same-color TDI stages. The pixel pitch indicates the distance of one pixel P in the Y direction. The number of TDI stages of the same color is the number of stages of the pixels P of the same color arranged side by side in the Y direction, and is 4 in the example shown in FIG.

FIG. 18 is a diagram for explaining the relationship between the intercolor gap GC and vibration. In FIG. 18, for example, the read interval of the TDI pixel is 1 μs, and the read interval between the colors of the first red pixel and the first green pixel is 10 μs.

The high-frequency vibration noise NH and the low-frequency vibration noise NL shown in FIG. 18 are models that follow 1 / f. That is, as shown in FIG. 18, the vibration noise NL having a large amplitude has a low frequency, and the vibration noise NH having a small amplitude has a high frequency. Vibration noise is defined as a simple difference of lateral (X direction) vibration received between colors. Moreover, since the TDI pixel can be regarded as the act of averaging the TDI pixel, the transfer function can be calculated by the Laplace transform and the reaction to the noise spectrum can be quantified.

FIG. 19 is a graph showing the transfer function.

As explained with reference to FIG. 18, the vibration noise spectrum NS generally shows a vibration spectrum in which the amplitude is large when the frequency is low and the amplitude is small when the frequency is high.

In the transmission function TF1, the read interval between the colors of the first red pixel and the first green pixel is 10 μs, the read interval of one pixel is 1 μs, and the non-TDI transmission when four pixels are added. It is a function. The transmission function TF2 is a TDI transmission function when the read interval between the colors of the first red pixel and the first green pixel is 10 μs, the read interval of one pixel is 1 μs, and four pixels are added. Is. The transmission function TF2 is a TDI transmission function when the read interval between the colors of the first red pixel and the first green pixel is 5 μs, the read interval of one pixel is 1 μs, and four pixels are added. Is.

The transfer function shows wavy behavior depending on the frequency. A value of zero in the transfer function indicates that the difference in vibration is zero between the first pixel in red and the first pixel in green, for example, when the frequencies have maximum vibration values. That is, the residual noise of vibration becomes zero due to the correspondence between the read time difference between the first red pixel and the first green pixel and the frequency of vibration. For example, if the frequency shifts and the vibration difference does not become zero, the transfer function becomes a finite value. The transfer function periodically becomes zero, depending on the multiple of the frequency.

The final residual noise is the integral (area) of the product of the vibration noise spectrum NS and the transfer functions TF1 to TF3. For example, the unit of the area is arbitrary, and the area of the product of the vibration noise spectrum NS and the transfer functions TF1 to TF3 is 29161.9, 7945.6, and 4000, respectively. Comparing the transfer function TF1 and the transfer function TF2, it can be seen that the noise can be compressed by averaging with 4 pixels by the TDI process. Further, when the transfer function TF2 and the transfer function TF3 are compared, it can be seen that the smaller the read interval between the colors of the first red pixel and the first green pixel, the smaller the noise. Therefore, it can be seen that the vibration resistance is improved by reducing the intercolor gap.

As described above, according to the first embodiment, in the image pickup apparatus 100 which is a TDI color sensor, two pixels P for different colors are arranged so as to be in contact with each other without a gap. As a result, the intercolor gap GC can be suppressed, and deterioration of image quality due to vibration can be suppressed.

The arrangement of the color filters is not necessarily limited to the example shown in FIG. For example, a color filter in which one of red, blue, and green is further added may be used.

[First Comparative Example]
FIG. 20 is a diagram showing an example of the configuration of the image pickup apparatus 100 in the first comparative example. The first modification is different from the first embodiment in that a CCD (Charge Coupled Device) structure is used instead of the CMOS (Complementary Metal Oxide Semiconductor) structure.

In the example shown in FIG. 20, since the CCD structure is used, for example, a circuit for extracting the electric charge generated by the red pixel PR is arranged between the red pixel PR and the green pixel PG. To. As a result, the intercolor gap GC of the pixel P becomes large. As a result, the accuracy of the composite image deteriorates due to vibration in the direction (X direction) perpendicular to the traveling direction (Y direction) of the subject. That is, the image quality deteriorates due to vibration. In the CCD structure, it is difficult to reduce the intercolor gap GC because it is necessary to provide a space for the output circuit between the color pixel groups. In the example shown in FIG. 20, the blue pixel PB is omitted, but the intercolor gap GC between the green pixel PG and the blue pixel PB is also the same.

On the other hand, the image pickup apparatus 100 in the first embodiment has a CMOS structure, and an ADC 310 is arranged for each pixel P. As a result, the TDI processing in the arithmetic circuit 410 (signal processing circuit 400) can be the addition of digital signals. As a result, the space of the output circuit in the CCD structure becomes unnecessary. Therefore, the intercolor gap GC (gap between color pixel groups) of the pixel P can be suppressed, and the deterioration of the image quality due to vibration can be suppressed.

[Second comparative example]
FIG. 21 is a diagram showing an example of the configuration of the image pickup apparatus 100 in the second modification. The second modification is different from the first embodiment in that the ADC 310 is provided not for each pixel P but for each column (pixel string) including a plurality of pixels P.

When realizing TDI processing with a CMOS structure, a column ADC type in which ADC 310 is arranged for each column is also conceivable. In this case, for example, it is conceivable that the signal line emits a signal line for outputting the signal line voltage toward the lower side of the paper surface of FIG. 21. Thereby, the intercolor gap can be suppressed as in the first embodiment. However, since it is necessary to arrange the wiring of the signal line, the aperture ratio is lowered. In the example shown in FIG. 21, the signal line is arranged above the pixels P of other colors (Z direction).

On the other hand, in the first embodiment, it is possible to suppress a decrease in the aperture ratio due to the arrangement of the signal line, and it is possible to suppress a decrease in the area of the photoelectric conversion element 222. The column ADC type can also suppress the intercolor gap and suppress the deterioration of image quality due to vibration. However, from the viewpoint of pixel characteristics such as aperture ratio, it is more preferable that the ADC 310 is arranged for each pixel P.

<Second Embodiment>
FIG. 22 is a diagram showing an example of the configuration of the image pickup apparatus 100 according to the second embodiment of the present technology. The second embodiment is different from the first embodiment in that the color pattern of the color filter is a bayer array.

In the color filter shown in FIG. 22, the color of the pixel P changes for each pixel P along the Y direction. That is, the two pixels P adjacent to each other along the moving direction of the subject 511 receive light of different colors.

The first pixel area, the second pixel area, and the third pixel area are arranged in a mixed manner in the Y direction and the X direction. The first pixel area and the second pixel area are arranged without a gap in the Y direction. The second pixel area and the third pixel area are arranged without a gap in the Y direction. More specifically, as shown in FIG. 22, the first pixel region, the second pixel region, and the third pixel region are arranged in a bayer array.

Further, the first color filter, the second color filter, and the third color filter are arranged in a mixed manner in the Y direction and the X direction.
The first color filter and the second color filter are arranged without a gap in the Y direction. The second color filter and the third color filter are arranged without a gap in the Y direction. More specifically, as shown in FIG. 22, the first color filter, the second color filter, and the third color filter are arranged in a bayer array.

Even if the intercolor gap is almost zero, if the position in the Y direction is different for each color, the effect of vibration on each color is not necessarily the same. In the color group arrangement shown in FIG. 15, for example, there is a case where vibration is received at the imaging timing of the red pixel PR line, and then the imaging timing of the green pixel PG and the blue pixel PB line. Be done. In this case, the correlation of vibrations received for each color is weakened.

On the other hand, in the bayer array, pixels P for different colors are arranged in the line next to a certain pixel P. Thereby, the time difference of the imaging timing for each color can be shortened. As a result, the correlation of vibrations received for each color can be further strengthened, and deterioration of image quality due to vibrations such as color shift can be further suppressed. Therefore, the bayer arrangement can be selected as an option when emphasizing color shift.

Further, usually, in a TDI sensor having a CCD structure, as described with reference to FIG. 20, it is necessary to integrate the charges immediately after the electric charges are generated by physical transfer, and the pixels are arranged in a Bayer arrangement due to the limitation of the circuit arrangement. Is difficult.

On the other hand, in the second embodiment, the ADC 310 is arranged for each pixel P, and the latch circuit 350 holds the time code as described with reference to FIG. 7, so that the integration process is performed later. Can be done. As a result, the color filter of the bayer array can be selected.

The present technology can have the following configurations.
(1) A photoelectric conversion unit provided for each of a plurality of pixels and outputting an electrical signal photoelectrically converted within a period corresponding to the moving speed of a relatively moving subject.
A calculation unit that integrates the electric signal for each color of the plurality of pixels is provided.
An imaging device in which two pixels that photoelectrically convert light of different colors are arranged without gaps along the relative moving direction of the subject.
(2) A second pixel region including one or more of the pixels that photoelectrically convert light of the first color and one or more of the pixels that photoelectrically convert light of a second color different from the first color. A pixel region and a third pixel region containing one or more of the pixels that photoelectrically convert light of the first color and a third color different from the second color are along the relative moving direction of the subject. The imaging device according to (1), which is arranged without gaps.
(3) Each of the first pixel region, the second pixel region, and the third pixel region includes one or more of the pixels in the first direction, which is the relative movement direction of the subject, and the first pixel region. The imaging apparatus according to (2), which includes one or more of the pixels in a second direction intersecting in one direction.
(4) The first pixel region, the second pixel region, and the third pixel region are arranged without being mixed in the second direction.
The first pixel region and the second pixel region are arranged without gaps in the first direction.
The imaging apparatus according to (3), wherein the second pixel region and the third pixel region are arranged without gaps in the first direction.
(5) The first pixel region, the second pixel region, and the third pixel region are arranged in a mixed manner in the first direction and the second direction.
The first pixel region and the second pixel region are arranged without gaps in the first direction.
The imaging apparatus according to (3), wherein the second pixel region and the third pixel region are arranged without gaps in the first direction.
(6) The image pickup apparatus according to (5), wherein the first pixel region is arranged in the second pixel region and the third pixel region is arranged in a bayer array.
(7) The pixel has a color filter corresponding to the wavelength band of light to be photoelectrically converted.
The imaging device according to any one of (1) to (6), wherein the two color filters corresponding to different colors are arranged without a gap along the relative moving direction of the subject.
(8) The first pixel region has one or more of the pixels having a first color filter that transmits light of the first color.
The second pixel region comprises one or more of the pixels having a second color filter that transmits light of the second color.
The third pixel region comprises one or more of the pixels having a third color filter that transmits light of the third color.
The first color filter, the second color filter, and the third color filter are arranged without gaps along the first direction, which is the relative movement direction of the subject, (2) to (6). The imaging apparatus according to any one of the above.
(9) The first color filter, the second color filter, and the third color filter are arranged without being mixed in the second direction intersecting the first direction.
The first color filter and the second color filter are arranged without gaps in the first direction.
The image pickup apparatus according to (8), wherein the second color filter and the third color filter are arranged without gaps in the first direction.
(10) The first color filter, the second color filter, and the third color filter are arranged in a mixed manner in the first direction and the second direction intersecting the first direction.
The first color filter and the second color filter are arranged without gaps in the first direction.
The image pickup apparatus according to (8), wherein the second color filter and the third color filter are arranged without gaps in the first direction.
(11) The image pickup apparatus according to (10), wherein the first color filter, the second color filter, and the third color filter are arranged in a bayer array.
(12) An ADC (Analog to Digital Converter), which is arranged for each of the plurality of pixels and converts the electric signal into a digital signal, is further provided.
The imaging device according to any one of (1) to (11), wherein the calculation unit integrates the digital signals for each color.
(13) The first chip on which the photoelectric conversion unit is arranged and
The imaging apparatus according to (12), further comprising a second chip that is laminated with the first chip and on which the ADC is arranged.
(14) The image pickup apparatus according to (13), wherein the ADC is arranged at a position overlapping the photoelectric conversion unit in the stacking direction.
(15) Imaging device and
A moving unit that moves the subject of the imaging device at a predetermined speed is provided.
The image pickup device
A photoelectric conversion unit provided for each of a plurality of pixels and outputting an electrical signal photoelectrically converted within a period corresponding to the moving speed of a relatively moving subject.
A calculation unit that integrates the electric signal for each color of the plurality of pixels is provided.
An electronic device in which two pixels that photoelectrically convert light of different colors are arranged without gaps along the relative moving direction of the subject.

The aspect of the present disclosure is not limited to the individual embodiments described above, but also includes various modifications that can be conceived by those skilled in the art, and the effects of the present disclosure are not limited to the above-mentioned contents. That is, various additions, changes and partial deletions are possible without departing from the conceptual idea and purpose of the present disclosure derived from the contents defined in the claims and their equivalents.

1 Electronic device, 100 image pickup device, 201 light receiving chip, 202 circuit chip, 222 photoelectric conversion element, 310 ADC, 400 signal processing circuit, 410 arithmetic circuit, 510 belt conveyor, 511 subject, P pixel, PR pixel, PG pixel, PB Pixel

Claims (15)

1. A photoelectric conversion unit provided for each of a plurality of pixels and outputting an electrical signal photoelectrically converted within a period corresponding to the moving speed of a relatively moving subject.
   A calculation unit that integrates the electric signal for each color of the plurality of pixels is provided.
   An imaging device in which two pixels that photoelectrically convert light of different colors are arranged without gaps along the relative moving direction of the subject.
2. A first pixel region containing one or more of the pixels that photoelectrically convert light of the first color, and a second pixel region including one or more of the pixels that photoelectrically convert light of a second color different from the first color. The third pixel region including one or more of the pixels that photoelectrically convert the light of the first color and the light of the third color different from the second color is without a gap along the relative moving direction of the subject. The imaging device according to claim 1, which is arranged.
3. Each of the first pixel region, the second pixel region, and the third pixel region includes one or more of the pixels in the first direction, which is the relative movement direction of the subject, and in the first direction. The imaging apparatus according to claim 2, further comprising one or more of the pixels in a second intersecting direction.
4. The first pixel region, the second pixel region, and the third pixel region are arranged without being mixed in the second direction.
   The first pixel region and the second pixel region are arranged without gaps in the first direction.
   The imaging device according to claim 3, wherein the second pixel region and the third pixel region are arranged without gaps in the first direction.
5. The first pixel region, the second pixel region, and the third pixel region are arranged in a mixed manner in the first direction and the second direction.
   The first pixel region and the second pixel region are arranged without gaps in the first direction.
   The imaging device according to claim 3, wherein the second pixel region and the third pixel region are arranged without gaps in the first direction.
6. The imaging device according to claim 5, wherein the first pixel region, the second pixel region, and the third pixel region are arranged in a bayer array.
7. The pixel has a color filter corresponding to the wavelength band of light to be photoelectrically converted.
   The imaging device according to claim 1, wherein the two color filters corresponding to different colors are arranged without gaps along the relative moving direction of the subject.
8. The first pixel region comprises one or more of the pixels having a first color filter that transmits light of the first color.
   The second pixel region comprises one or more of the pixels having a second color filter that transmits light of the second color.
   The third pixel region comprises one or more of the pixels having a third color filter that transmits light of the third color.
   The imaging according to claim 2, wherein the first color filter, the second color filter, and the third color filter are arranged without gaps along the first direction, which is the relative movement direction of the subject. Device.
9. The first color filter, the second color filter, and the third color filter are arranged without being mixed in the second direction intersecting the first direction.
   The first color filter and the second color filter are arranged without gaps in the first direction.
   The imaging device according to claim 8, wherein the second color filter and the third color filter are arranged without gaps in the first direction.
10. The first color filter, the second color filter, and the third color filter are arranged in a mixed manner in the first direction and the second direction intersecting the first direction.
    The first color filter and the second color filter are arranged without gaps in the first direction.
    The imaging device according to claim 8, wherein the second color filter and the third color filter are arranged without gaps in the first direction.
11. The imaging device according to claim 10, wherein the first color filter, the second color filter, and the third color filter are arranged in a bayer array.
12. An ADC (Analog to Digital Converter), which is arranged for each of the plurality of pixels and converts the electric signal into a digital signal, is further provided.
    The imaging device according to claim 1, wherein the calculation unit integrates the digital signals for each color.
13. The first chip on which the photoelectric conversion unit is arranged and
    The imaging apparatus according to claim 12, further comprising a second chip that is laminated with the first chip and on which the ADC is arranged.
14. The imaging device according to claim 13, wherein the ADC is arranged at a position overlapping the photoelectric conversion unit in the stacking direction.
15. Imaging device and
    A moving unit that moves the subject of the imaging device at a predetermined speed is provided.
    The image pickup device
    A photoelectric conversion unit provided for each of a plurality of pixels and outputting an electrical signal photoelectrically converted within a period corresponding to the moving speed of a relatively moving subject.
    A calculation unit that integrates the electric signal for each color of the plurality of pixels is provided.
    An electronic device in which two pixels that photoelectrically convert light of different colors are arranged without gaps along the relative moving direction of the subject.

Images