WO2022147913A1

WO2022147913A1 - Package structure for radio frequency front-end module, and mobile terminal

Info

Publication number: WO2022147913A1
Application number: PCT/CN2021/084111
Authority: WO
Inventors: 何文卿
Original assignee: 闻泰科技(深圳)有限公司
Priority date: 2021-01-05
Filing date: 2021-03-30
Publication date: 2022-07-14
Also published as: CN112865835A

Abstract

The present application relates to a package structure for a radio frequency front-end module, and a mobile terminal. The package structure for a radio frequency front-end module comprises a radio frequency amplification unit, a first radio frequency switch, a duplex unit, and a second radio frequency switch; the first radio frequency switch is separately connected to the radio frequency amplification unit and the duplex unit; the duplex unit is connected to the second radio frequency switch; the radio frequency amplification unit, the first radio frequency switch, the duplex unit, and the second radio frequency switch are packaged into at least two chips, and the radio frequency amplification unit and the duplex unit are packaged in different chips; the at least two chips are stacked and soldered on a printed circuit board in a direction perpendicular to the printed circuit board. By means of the technical solution of the present application, design of the radio frequency amplification unit and design of the duplex unit can be performed independently; thus, the flexibility of application of the radio frequency front-end module is improved, the design of the radio frequency front-end module is more compact, and the layout space of the printed circuit board is effectively saved.

Description

A package structure of a radio frequency front-end module and a mobile terminal

This disclosure claims the priority of the Chinese patent application with the application number 2021100090559 and the invention titled "A package structure of a radio frequency front-end module and a mobile terminal" filed with the China Patent Office on January 5, 2021, the entire contents of which are by reference Incorporated in this disclosure.

technical field

The present disclosure relates to the technical field of packaging, and in particular, to a packaging structure of a radio frequency front-end module and a mobile terminal.

Background technique

With the continuous development and evolution of 5G terminal equipment, 5G terminal equipment needs to be compatible with various countries and regions, taking into account various aspects such as design cost and performance. Therefore, in the selection of RF front-end modules, it is necessary to comprehensively consider the miniaturization and combination flexibility of the RF front-end modules.

From the perspective of the currently available RF front-end modules, the RF amplifier unit and the duplex unit are both integrated in the RF front-end module, that is, the RF amplifier unit and the duplex unit are integrated into one chip. Changes in demand require manufacturers to continuously develop new RF front-end modules, that is, they need to use new RF front-end modules for matching, which results in huge development pressure on RF front-end module manufacturers. On the other hand, in order to avoid many models of RF front-end modules, manufacturers will develop large and comprehensive products, which will increase the chip area and waste material costs.

SUMMARY OF THE INVENTION

(1) Technical problems to be solved

The technical problem to be solved by the present disclosure is to solve the problems of huge development pressure, increased chip area and waste of material cost when RF front-end module manufacturers develop new RF front-end modules.

(2) Technical solutions

In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a packaging structure and a mobile terminal for a radio frequency front-end module, so that the design of the radio frequency amplification unit and the duplex unit can be carried out independently, and the radio frequency front-end module is improved. The flexibility of group application makes the design of the RF front-end module more compact, effectively saving the layout space of the printed circuit board.

In a first aspect, an embodiment of the present disclosure provides a packaging structure of a radio frequency front-end module, including:

a radio frequency amplifying unit, a first radio frequency switch, a duplex unit and a second radio frequency switch, the first radio frequency switch is respectively connected to the radio frequency amplifying unit and the duplex unit, and the duplex unit is connected to the second radio frequency switch connection;

The radio frequency amplification unit, the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged as at least two chips, and the radio frequency amplification unit and the duplex unit are packaged in different places. in the chip;

The at least two chips are superimposed and soldered on the printed circuit board along a direction perpendicular to the printed circuit board.

Optionally, the duplex unit includes at least two duplex paths, and the duplex paths are used to filter radio frequency signals;

The first radio frequency switch is connected to the duplex unit through one of the duplex paths, and the second radio frequency switch is connected to the duplex unit through one of the duplex paths.

Optionally, among the at least two chips, the chip with the largest distance from the printed circuit board is provided with a plurality of pads adjacent to the surface of the printed circuit board, and the remaining chips are away from the surface of the printed circuit board and A plurality of pads are arranged adjacent to the surface of the printed circuit board.

Optionally, the radio frequency amplification unit, the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged into two chips, and the two chips include a first chip and a second chip, The first chip and the second chip are superimposed and welded on the printed circuit board along a direction perpendicular to the printed circuit board.

Optionally, the first chip is welded on the printed circuit board, and the second chip is welded on the first chip;

The pads of the first chip facing away from the surface of the printed circuit board have the same number and distribution positions as the pads of the second chip adjacent to the surface of the printed circuit board.

Optionally, the input end of the radio frequency front-end module is connected to the pad on one side of the first chip adjacent to the printed circuit board;

The output end of the RF front-end module is connected to the pad on the side of the second chip adjacent to the printed circuit board.

Optionally, the radio frequency amplification unit and the first radio frequency switch are packaged as the first chip, and the duplex unit and the second radio frequency switch are packaged as the second chip; or,

The radio frequency amplification unit is packaged as the first chip, and the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged as the second chip.

Optionally, the first chip is soldered to the printed circuit board, and the second chip is soldered to a surface of the first chip facing away from the printed circuit board.

Optionally, the radio frequency amplification unit, the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged into three chips, and the three chips include a first chip, a second chip and For the third chip, the first chip, the second chip and the third chip are superimposed and welded on the printed circuit board along a direction perpendicular to the printed circuit board.

Optionally, the radio frequency amplification unit and the first radio frequency switch are packaged as the first chip, the duplex unit is packaged as the second chip, and the second radio frequency switch is packaged as the first chip a third chip; or,

The radio frequency amplification unit is packaged as the first chip, the first radio frequency switch and the duplex unit are packaged as the second chip, and the second radio frequency switch is packaged as the third chip; or,

The radio frequency amplification unit is packaged as the first chip, the first radio frequency switch is packaged as the second chip, the duplex unit and the second radio frequency switch are packaged as the third chip .

Optionally, the first die is soldered to the printed circuit board, the second die is soldered to a surface of the first die facing away from the printed circuit board, and the third die is soldered to the second die The chip faces away from the surface of the printed circuit board.

Optionally, the output end of the RF front-end module is connected to a pad on a side of the third chip adjacent to the printed circuit board.

Optionally, the radio frequency amplification unit is packaged as a first chip, the first radio frequency switch is packaged as a second chip, the duplex unit is packaged as a third chip, and the second radio frequency switch is packaged as a the fourth chip;

The first chip, the second chip, the third chip and the fourth chip are sequentially stacked and welded on the printed circuit board along the direction perpendicular to the printed circuit board, and the first chip is welded to the printed circuit board. on the printed circuit board.

Optionally, the package structure of the RF front-end module further includes: a heat dissipation pad;

The heat dissipation pad is disposed on a surface of the first chip adjacent to the printed circuit board.

In a second aspect, an embodiment of the present disclosure further provides a mobile terminal, including the packaging structure of the radio frequency front-end module as described in the first aspect.

(3) Beneficial effects

Compared with the prior art, the technical solutions provided by the embodiments of the present disclosure have the following advantages:

The packaging structure of the radio frequency front-end module provided by the embodiment of the present disclosure includes a radio frequency amplification unit, a first radio frequency switch, a duplex unit, and a second radio frequency switch. The first radio frequency switch is respectively connected to the radio frequency amplification unit and the duplex unit. The duplex unit Connected with the second radio frequency switch, the radio frequency amplifying unit, the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged into at least two chips, and the radio frequency amplifying unit and the duplex unit are packaged in different chips. As a result, it solves the need to constantly design and develop new RF front-end modules due to the different RF front-end module designs and changes in demand caused by the RF amplifier unit and the duplex unit being packaged in one chip. Due to the waste of resources such as material cost, the design of the RF amplifier unit and the duplex unit can be carried out independently, and the RF amplifier unit can remain relatively stable and independent. In the design of different RF front-end modules, the same RF amplification can be maintained. It can be applied to different countries and regions only by adjusting the duplex unit, which makes the frequency band collocation of the RF front-end module more flexible, reduces the design redundancy of the RF front-end module, and improves the application of the RF front-end module. flexibility, which relieves the development pressure of manufacturers. In addition, at least two chips are arranged along the direction perpendicular to the printed circuit board, superimposed and welded on the printed circuit board, which makes the design of the RF front-end module more compact, reduces the area occupied by the RF front-end module on the printed circuit board, and effectively saves money the layout space of the printed circuit board.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the accompanying drawings that are required to be used in the description of the embodiments or the prior art will be briefly introduced below. In other words, on the premise of no creative labor, other drawings can also be obtained from these drawings.

1 is a schematic diagram of a connection structure of a radio frequency front-end module according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a packaging structure of a radio frequency front-end module according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of a packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of setting pads on a chip according to an embodiment of the present disclosure;

6 is a schematic diagram of another RF front-end module packaging structure provided by an embodiment of the present disclosure;

FIG. 7 is a schematic diagram of a package and disassembly method of another radio frequency front-end module provided by an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of a packaging and disassembling manner of another radio frequency front-end module provided by an embodiment of the present disclosure;

FIG. 9 is a schematic diagram of a packaging and disassembling manner of another radio frequency front-end module provided by an embodiment of the present disclosure;

10 is a schematic diagram of another RF front-end module packaging structure provided by an embodiment of the present disclosure;

FIG. 11 is a schematic diagram of another packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure.

Detailed ways

In order to more clearly understand the above objects, features and advantages of the present disclosure, the solutions of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments may be combined with each other under the condition of no conflict.

Many specific details are set forth in the following description to facilitate a full understanding of the present disclosure, but the present disclosure can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only a part of the embodiments of the present disclosure, and Not all examples.

FIG. 1 is a schematic diagram of a connection structure of a radio frequency front-end module according to an embodiment of the present disclosure. As shown in FIG. 1 , the package structure of the RF front-end module includes a RF amplifier unit 1, a first RF switch 2, a duplex unit 3 and a second RF switch 4. The first RF switch 2 is connected to the RF amplifier unit 1 and the duplex unit respectively. The unit 3 is connected, and the duplex unit 3 is connected with the second radio frequency switch 4 . Specifically, the input terminal IN of the radio frequency front-end module inputs a small radio frequency signal, the radio frequency amplification unit 1 is used to amplify the radio frequency signal input by the input terminal IN of the radio frequency front-end module, and the duplex unit 3 includes a plurality of duplex paths , the duplex channel is used to filter the amplified RF signal, the first RF switch 2 and the second RF switch 4 are used to select the channel for accessing the RF front-end module, and the second RF switch 4 outputs the filtered signal through the output terminal OUT. the radio frequency signal. FIG. 1 exemplarily shows that the duplex unit 3 includes two duplex modules 31 and one filter module 32. The radio frequency transmission path in the duplex unit 3 is connected to the radio frequency amplifying unit 1, and the one that is not connected to the radio frequency amplifying unit 1 is the radio frequency transmission path. For the radio frequency receiving channel, the duplex module 31 can filter the radio frequency transmitting channel and the radio frequency receiving channel with different bandwidths, and the filtering module 32 can only filter the radio frequency transmitting channel with a set bandwidth.

FIG. 2 is a schematic diagram of a packaging structure of a radio frequency front-end module according to an embodiment of the present disclosure. 1 and 2, the radio frequency amplification unit 1, the first radio frequency switch 2, the duplex unit 3 and the second radio frequency switch 4 are packaged into at least two chips, and FIG. 2 exemplarily sets the radio frequency amplification unit 1, the first radio frequency The switch 2 , the duplex unit 3 and the second radio frequency switch 4 are packaged as a chip 100 and a chip 200 , and the radio frequency amplification unit 1 and the duplex unit 3 are packaged in different chips.

Therefore, in the embodiment of the present disclosure, the radio frequency amplifying unit 1 and the duplex unit 3 are set to be packaged in different chips. When the chips are used together, it is ensured that there is one chip encapsulated with the radio frequency amplifying unit 1 and one chip encapsulated with the duplex unit 3 . The chips can be used together. As a result, it solves the need to constantly design and develop new RF front-end modules due to the different RF front-end module designs and changes in demand caused by the RF amplifier unit 1 and the duplex unit 3 being packaged in one chip. , resulting in waste of resources such as material cost, so that the design of the RF amplifier unit 1 and the duplex unit 3 can be carried out independently, and the RF amplifier unit 1 can remain relatively stable and independent. In the design of different RF front-end modules, you can Keeping the same RF amplifier unit 1, it can be applied to different countries and regions only by adjusting the duplex unit 3, which makes the frequency band collocation of the RF front-end module more flexible and reduces the design redundancy of the RF front-end module. It improves the flexibility of RF front-end module application and relieves the development pressure of manufacturers.

1 and 2 , at least two chips, for example, chip 100 and chip 200 , are superimposed and soldered on the printed circuit board 5 along a direction perpendicular to the printed circuit board 5 . Specifically, the RF front-end module is divided into at least two modules and designed into a package form that can be superimposed and welded, so that the design of the RF front-end module is more compact, and the area of the printed circuit board 5 occupied by the RF front-end module is reduced. , effectively saving the layout space of the printed circuit board 5 .

Optionally, with reference to FIG. 1 and FIG. 2 , among at least two chips, the chip with the largest distance from the printed circuit board 5 is set. For example, the surface of the chip 100 facing away from the printed circuit board 5 and the surface adjacent to the printed circuit board 5 are provided with a plurality of pads. For the soldering pads, other chips, such as the top and bottom of the chip 100, are provided with a plurality of soldering pads, and the lowermost chip, such as the chip 100, is soldered or mounted on the printed circuit board through the bottom pads. 5, the remaining chips, such as the chip 200, are welded between the two chips through the pads at the bottom and the pads reserved on the top of the chip 100 below the chip 200, thereby forming a superimposed welding RF front-end module package structure. Therefore, the design of the RF front-end module is made more compact, the area occupied by the RF front-end module on the printed circuit board 5 is reduced, and the layout space of the printed circuit board 5 is effectively saved.

Optionally, in conjunction with FIG. 1 and FIG. 2 , the radio frequency amplification unit 1, the first radio frequency switch 2, the duplex unit 3 and the second radio frequency switch 4 may be packaged into two chips, and the two chips include the first chip 6 and the second radio frequency switch 4. The second chip 7 , the first chip 6 and the second chip 7 are superimposed and soldered on the printed circuit board 5 along the direction perpendicular to the printed circuit board 5 .

FIG. 3 is a schematic diagram of a packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure. 1 to 3, when the radio frequency amplification unit 1, the first radio frequency switch 2, the duplex unit 3 and the second radio frequency switch 4 are packaged into two chips, the radio frequency amplification unit 1 and the first radio frequency switch 2 may be packaged For the first chip 6 , the duplex unit 3 and the second radio frequency switch 4 are packaged as a second chip 7 . Specifically, it is set that the radio frequency amplification unit 1 and the first radio frequency switch 2 are packaged as the first chip 6, and the duplex unit 3 and the second radio frequency switch 4 are packaged as the second chip 7, so that the radio frequency amplification unit 1 and the duplex unit 3 are packaged as the second chip 7. Being packaged in different chips makes the frequency band collocation of the RF front-end module more flexible, reduces the design redundancy of the RF front-end module, improves the flexibility of the application of the RF front-end module, and relieves the development pressure of manufacturers.

FIG. 4 is a schematic diagram of a packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure. 1 , 2 and 4 , when the RF amplification unit 1 , the first RF switch 2 , the duplex unit 3 and the second RF switch 4 are packaged into two chips, the RF amplification unit 1 may also be packaged as the first RF amplification unit 1 . A chip 6 , the first radio frequency switch 2 , the duplex unit 3 and the second radio frequency switch 4 are packaged as a second chip 7 . Similarly, it is set that the radio frequency amplifying unit 1 is packaged as the first chip 6 , the first radio frequency switch 2 , the duplex unit 3 and the second radio frequency switch 4 are packaged as the second chip 7 , so that the radio frequency amplifying unit 1 and the duplex unit 3 are packaged as the second chip 7 . Being packaged in different chips makes the frequency band collocation of the RF front-end module more flexible, reduces the design redundancy of the RF front-end module, improves the flexibility of the application of the RF front-end module, and relieves the development pressure of manufacturers.

Optionally, with reference to FIGS. 1 to 4 , the first chip 6 may be soldered to the printed circuit board 5 , and the second chip 7 may be soldered to the surface of the first chip 6 away from the printed circuit board 5 . When a radio frequency switch 2 , a duplex unit 3 and a second radio frequency switch 4 are packaged into two chips, the radio frequency amplification unit 1 and the first radio frequency switch 2 can be packaged as a first chip 6 , and the duplex unit 3 and the second radio frequency switch 4 are packaged as a first chip 6 . The radio frequency switch 4 is packaged as the second chip 7, or the radio frequency amplification unit 1 is packaged as the first chip 6, and the first radio frequency switch 2, the duplex unit 3 and the second radio frequency switch 4 are packaged as the second chip 7, which realizes The first chip 6 encapsulated with the radio frequency amplifier unit 1 is welded on the printed circuit board 5 , and the radio frequency amplifier unit 1 can dissipate heat through the metal layer on the printed circuit board 5 , which is conducive to optimizing the heat dissipation effect of the radio frequency amplifier unit 1 .

In addition, set the first chip 6 to be welded to the printed circuit board 5, and the second chip 7 to be welded to the surface of the first chip 6 away from the printed circuit board 5, according to the radio frequency amplification unit 1 and the first radio frequency switch 2 in the radio frequency front-end module. , The connection sequence of the duplex unit 3 and the second RF switch 4 is set at the upper and lower positions of the package, which is beneficial to simplify the design of the pads at the bottom of the uppermost chip and the top and bottom of the remaining chips.

For example, in the case where the radio frequency amplification unit 1 and the first radio frequency switch 2 are packaged as the first chip 6, and the duplex unit 3 and the second radio frequency switch 4 are packaged as the second chip 7, it is only necessary to pass through the adjacent chips, the upper chip The pads on the bottom and the pads on the top of the lower chip can realize the electrical connection relationship between the first radio frequency switch 2 and the duplex unit 3 . For example, in the case where the RF amplifier unit 1 is packaged as the first chip 6, and the first RF switch 2, the duplex unit 3 and the second RF switch 4 are packaged as the second chip 7, it only needs to pass through the adjacent chips, the upper chip The pad on the bottom and the pad on the top of the lower chip can realize the electrical connection relationship between the RF amplification unit 1 and the first RF switch 2, and in the above case, the input terminal IN of the RF front-end module can be directly printed through the lowermost chip. The pads on one side of the circuit board 5 realize the connection with the printed circuit board 5 .

FIG. 5 is a schematic diagram of an on-chip pad arrangement according to an embodiment of the present disclosure. With reference to FIGS. 1 to 5 , the diagram on the left side of FIG. 5 may be the arrangement of the pads on the side of the first chip 6 away from the printed circuit board 5 or the arrangement of the pads on the side of the second chip 7 adjacent to the printed circuit board 5 . The figure on the right in 5 may be the arrangement of the pads on the side of the first chip 6 adjacent to the printed circuit board 5 . Specifically, the first chip 6 is soldered on the printed circuit board 5 through the pads on the side of the first chip 6 adjacent to the printed circuit board 5 , and the pads on the side of the first chip 6 away from the printed circuit board 5 are adjacent to the second chip 7 The number and distribution of the pads on the side of the printed circuit board 5 are the same, and the second chip 7 passes through the pads on the side of the second chip 7 adjacent to the printed circuit board 5 and the first chip 6 on the side away from the printed circuit board 5 . Solder to the first chip 6 .

In addition, both the input terminal IN and the output terminal OUT of the RF front-end module in FIG. 1 need to be connected to the printed circuit board 5 , and the input terminal IN can be connected to the printed circuit board 5 through the welding relationship between the first chip 6 and the printed circuit board 5 . For connection, the output terminal OUT is led out from the pad on the side of the second chip 7 adjacent to the printed circuit board 5 , and the connection with the printed circuit board 5 can be realized through the pad passing through the first chip 6 .

FIG. 6 is a schematic diagram of another RF front-end module packaging structure according to an embodiment of the present disclosure. 1 and 6 , the radio frequency amplification unit 1 , the first radio frequency switch 2 , the duplex unit 3 and the second radio frequency switch 4 can be packaged into three chips, and the three chips include a first chip 6 and a second chip 7 and the third chip 8 , the first chip 6 , the second chip 7 and the third chip 8 are superimposed and welded on the printed circuit board 5 along the direction perpendicular to the printed circuit board 5 .

FIG. 7 is a schematic diagram of another packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure. 1 , 6 and 7 , when the radio frequency amplifying unit 1 , the first radio frequency switch 2 , the duplex unit 3 and the second radio frequency switch 4 are packaged into three chips, the radio frequency amplifying unit 1 and the first radio frequency switch can be set 2 is packaged as the first chip 6 , the duplex unit 3 is packaged as the second chip 7 , and the second radio frequency switch 4 is packaged as the third chip 8 . Specifically, it is set that the radio frequency amplification unit 1 and the first radio frequency switch 2 are packaged as the first chip 6, the duplex unit 3 is packaged as the second chip 7, and the second radio frequency switch 4 is packaged as the third chip 8, so that the radio frequency amplification Unit 1 and duplex unit 3 are packaged in different chips, which makes the frequency band collocation of the RF front-end module more flexible, reduces the design redundancy of the RF front-end module, improves the flexibility of the application of the RF front-end module, and alleviates the The development pressure of manufacturers.

FIG. 8 is a schematic diagram of another packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure. 1 , 6 and 8 , when the radio frequency amplifying unit 1 , the first radio frequency switch 2 , the duplex unit 3 and the second radio frequency switch 4 are packaged into three chips, the radio frequency amplifying unit 1 may be packaged as the first The chip 6 , the first RF switch 2 and the duplex unit 3 are packaged as a second chip 7 , and the second RF switch 4 is packaged as a third chip 8 . Specifically, it is set that the RF amplification unit 1 is packaged as the first chip 6, the first RF switch 2 and the duplex unit 3 are packaged as the second chip 7, and the second RF switch 4 is packaged as the third chip 8, so that the RF amplification Unit 1 and duplex unit 3 are packaged in different chips, which makes the frequency band collocation of the RF front-end module more flexible, reduces the design redundancy of the RF front-end module, improves the flexibility of the application of the RF front-end module, and alleviates the The development pressure of manufacturers.

FIG. 9 is a schematic diagram of another packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure. 1 , 6 and 9 , when the radio frequency amplifying unit 1 , the first radio frequency switch 2 , the duplex unit 3 and the second radio frequency switch 4 are packaged into three chips, the radio frequency amplifying unit 1 may be packaged as the first The chip 6 , the first radio frequency switch 2 are packaged as the second chip 7 , the duplex unit 3 and the second radio frequency switch 4 are packaged as the third chip 8 . Specifically, it is set that the radio frequency amplification unit 1 is packaged as the first chip 6, the first radio frequency switch 2 is packaged as the second chip 7, the duplex unit 3 and the second radio frequency switch 4 are packaged as the third chip 8, so that the radio frequency The amplification unit 1 and the duplex unit 3 are packaged in different chips, which makes the frequency band collocation of the RF front-end module more flexible, reduces the design redundancy of the RF front-end module, and improves the flexibility of the application of the RF front-end module. Alleviate the development pressure of manufacturers.

Optionally, with reference to FIG. 1 and FIG. 6 to FIG. 9 , the first chip 6 may be welded to the printed circuit board 5 , the second chip 7 may be welded to the surface of the first chip 6 away from the printed circuit board 5 , and the third chip 8 Soldered to the surface of the second chip 7 away from the printed circuit board 5, since the radio frequency amplifying unit 1, the first radio frequency switch 2, the duplex unit 3 and the second radio frequency switch 4 are packaged into three chips, the radio frequency amplifying unit 1 can be set and the first radio frequency switch 2 is packaged as the first chip 6, the duplex unit 3 is packaged as the second chip 7, the second radio frequency switch 4 is packaged as the third chip 8, or the radio frequency amplification unit 1 is packaged as the first chip The chip 6, the first radio frequency switch 2 and the duplex unit 3 are packaged as the second chip 7, the second radio frequency switch 4 is packaged as the third chip 8, or the radio frequency amplification unit 1 is packaged as the first chip 6, the first The RF switch 2 is packaged as a second chip 7 , the duplex unit 3 and the second RF switch 4 are packaged as a third chip 8 , and the first chip 6 packaged with the RF amplifier unit 1 is soldered to the printed circuit board 5 . On the other hand, the radio frequency amplifying unit 1 can dissipate heat through the metal layer on the printed circuit board 5 , which is beneficial to optimize the heat dissipation effect of the radio frequency amplifying unit 1 .

When the first chip 6 is welded to the printed circuit board 5, the second chip 7 is welded to the surface of the first chip 6 away from the printed circuit board 5, and the third chip 8 is welded to the surface of the second chip 7 away from the printed circuit board 5, The diagram on the left side of FIG. 5 may show the arrangement of the pads on the side of the first chip 6 away from the printed circuit board 5 , the arrangement of the pads on the side of the second chip 7 adjacent to and away from the printed circuit board 5 , or the arrangement of the pads on the side of the third chip 8 adjacent to the printed circuit board 5 . The arrangement of the pads on the side of the circuit board 5 , the right side of FIG. 5 shows the arrangement of the pads on the side of the first chip 6 adjacent to the printed circuit board 5 .

In addition, the first chip 6 is soldered to the printed circuit board 5, the second chip 7 is soldered to the surface of the first chip 6 facing away from the printed circuit board 5, and the third chip 8 is soldered to the surface of the second chip 7 facing away from the printed circuit board 5. , according to the connection sequence of the RF amplifier unit 1, the first RF switch 2, the duplex unit 3 and the second RF switch 4 in the RF front-end module, the upper and lower positions of the package are set, which is beneficial to simplify the bottom of the top chip and the top of the other chips. and pad design at the bottom.

For example, in the case where the RF amplifier unit 1 and the first RF switch 2 are packaged as the first chip 6, the duplex unit 3 is packaged as the second chip 7, and the second RF switch 4 is packaged as the third chip 8, only the In adjacent chips, the pads on the bottom of the upper chip and the pads on the top of the lower chip can realize the electrical connection relationship between the first RF switch 2 and the duplex unit 3 and the electrical connection relationship between the duplex unit 3 and the second RF switch 4. . For example, in the case where the RF amplifier unit 1 is packaged as the first chip 6, the first RF switch 2 and the duplex unit 3 are packaged as the second chip 7, and the second RF switch 4 is packaged as the third chip 8, only the In adjacent chips, the pads on the bottom of the upper chip and the pads on the top of the lower chip can realize the electrical connection relationship between the radio frequency amplification unit 1 and the first radio frequency switch 2 and the duplex unit 3 and the second radio frequency switch 4 . For example, in the case where the RF amplifier unit 1 is packaged as the first chip 6 , the first RF switch 2 is packaged as the second chip 7 , the duplex unit 3 and the second RF switch 4 are packaged as the third chip 8 , only the The electrical connection relationship between the radio frequency amplification unit 1 and the first radio frequency switch 2 and the first radio frequency switch 2 and the duplex unit 3 can be realized through the pads at the bottom of the upper chip and the pads at the top of the lower chip in the adjacent chips, and the above In this case, the input terminal IN of the RF front-end module can be directly connected to the printed circuit board 5 through the pad on the side of the lowermost chip adjacent to the printed circuit board 5 .

In addition, both the input terminal IN and the output terminal OUT of the RF front-end module in FIG. 1 need to be connected to the printed circuit board 5 , and the input terminal IN can be connected to the printed circuit board 5 through the welding relationship between the first chip 6 and the printed circuit board 5 . Connection, the output terminal OUT is led out from the pad on the side of the third chip 8 adjacent to the printed circuit board 5 , and the connection with the printed circuit board 5 can be realized through the pad passing through the second chip 7 and the pad passing through the first chip 6 .

FIG. 10 is a schematic diagram of another RF front-end module packaging structure according to an embodiment of the present disclosure. 1 and 10 , it can be set that the radio frequency amplification unit 1 is packaged as the first chip 6 , the first radio frequency switch 2 is packaged as the second chip 7 , the duplex unit 3 is packaged as the third chip 8 , and the second radio frequency switch 4 is packaged as a fourth chip 9; the first chip 6, the second chip 7, the third chip 8 and the fourth chip 9 are superimposed and welded on the printed circuit board 5 in the direction perpendicular to the printed circuit board 5, the first The chip 6 is soldered to the printed circuit board 5 .

FIG. 11 is a schematic diagram of another packaging and disassembling manner of a radio frequency front-end module according to an embodiment of the present disclosure. 1 , 10 and 11 , the radio frequency amplification unit 1 is packaged as a first chip 6 , the first radio frequency switch 2 is packaged as a second chip 7 , the duplex unit 3 is packaged as a third chip 8 , and the second radio frequency switch 2 is packaged as a second chip 7 . The switch 4 is packaged as a fourth chip 9 . Specifically, it is set that the radio frequency amplification unit 1 is packaged as the first chip 6, the first radio frequency switch 2 is packaged as the second chip 7, the duplex unit 3 is packaged as the third chip 8, and the second radio frequency switch 4 is packaged as the first chip 8. Four chips 9, so that the RF amplifier unit 1 and the duplex unit 3 are packaged in different chips, which makes the frequency band collocation of the RF front-end module more flexible, reduces the design redundancy of the RF front-end module, and improves the RF front-end module. The flexibility of group application relieves the development pressure of manufacturers.

In addition, the radio frequency amplifier unit 1 is set to be packaged as the first chip 6, and the first chip 6 is welded to the printed circuit board 5, so that the first chip 6 encapsulated with the radio frequency amplifier unit 1 is welded to the printed circuit board 5, and the radio frequency amplifier unit 1 is welded to the printed circuit board 5. The amplifying unit 1 can dissipate heat through the metal layer on the printed circuit board 5 , which is conducive to optimizing the heat dissipation effect of the radio frequency amplifying unit 1 .

It is set that the radio frequency amplification unit 1 is packaged as the first chip 6 , the first radio frequency switch 2 is packaged as the second chip 7 , the duplex unit 3 is packaged as the third chip 8 , and the second radio frequency switch 4 is packaged as the fourth chip 9 5 shows the pad arrangement on the side of the first chip 6 away from the printed circuit board 5, the pad arrangement on the side of the second chip 7 adjacent to and away from the printed circuit board 5, the third chip 8 The pad arrangement on the side adjacent to and away from the printed circuit board 5 or the pad arrangement on the side of the fourth chip 9 adjacent to the printed circuit board 5, the right side of FIG. 5 shows the side of the first chip 6 adjacent to the printed circuit board 5 pad settings.

In addition, the first chip 6 , the second chip 7 , the third chip 8 and the fourth chip 9 are arranged to be stacked and welded on the printed circuit board 5 in the direction perpendicular to the printed circuit board 5 in sequence, that is, the first chip 6 is set to be welded to the printed circuit board 5 . On the printed circuit board 5, the second chip 7 is soldered to the surface of the first chip 6 facing away from the printed circuit board 5, the third chip 8 is soldered to the surface of the second chip 7 facing away from the printed circuit board 5, and the fourth chip 9 is soldered to the third The chip 8 is away from the surface of the printed circuit board 5, and the upper and lower positions of the package are set according to the connection sequence of the RF amplifier unit 1, the first RF switch 2, the duplex unit 3 and the second RF switch 4 in the RF front-end module, which is beneficial to Simplify the design of the pads at the bottom of the top chip and the top and bottom of the rest of the chips. Only the pads on the bottom of the upper chip and the pads on the top of the lower chip in the adjacent chips are used to realize the RF amplification unit 1, the first RF switch 2, and the first RF switch. An electrical connection relationship between the radio frequency switch 2 and the duplex unit 3 and the duplex unit 3 and the second radio frequency switch 4 is sufficient.

In addition, both the input terminal IN and the output terminal OUT of the RF front-end module in FIG. 1 need to be connected to the printed circuit board 5 , and the input terminal IN can be connected to the printed circuit board 5 through the welding relationship between the first chip 6 and the printed circuit board 5 . Connection, the output terminal OUT is drawn from the pad on the side of the fourth chip 9 adjacent to the printed circuit board 5, and can be realized through the pads of the third chip 8, the pads of the second chip 7 and the pads of the first chip 6. Connection to the printed circuit board 5.

Optionally, with reference to FIG. 1 to FIG. 11 , the chip soldered on the printed circuit board 5 may be provided with a grounding heat dissipation pad 11 on one side adjacent to the printed circuit board 5 . Exemplarily, a grounding heat dissipation pad 11 may be provided on the side of the first chip 6 adjacent to the printed circuit board 5, and the grounding heat dissipation pad 11 has a larger area, which is conducive to optimizing the heat dissipation effect of the first chip 6, for example, is conducive to Optimize the heat dissipation effect of the RF amplifier unit 1. The remaining pads 12 in FIG. 5 can be signal transmission pads, which are smaller in area than the grounding heat dissipation pads 11 .

It should be noted that FIG. 5 only exemplarily shows the number and arrangement of the pads on the chip surface, the embodiment of the present disclosure does not specifically limit the number and arrangement of the pads on the chip surface, to ensure that the chip Corresponding welding can be achieved between the printed circuit board 5 and the chips.

In summary, the embodiment of the present disclosure sets the radio frequency amplification unit and the duplex unit to be packaged in different chips, which solves the difference and requirements of the RF front-end module design caused by the radio frequency amplification unit and the duplex unit being packaged in one chip. The change of the RF front-end module requires continuous design and development of new RF front-end modules, resulting in waste of resources such as material cost, so that the design of the RF amplifier unit and the duplex unit can be carried out independently, and the RF amplifier unit can remain relatively stable. and independent, in the design of different RF front-end modules, the same RF amplifier unit can be maintained, and it can be applied to different countries and regions only by adjusting the duplex unit, making the frequency band collocation of the RF front-end module more flexible , reducing the design redundancy of the RF front-end module, improving the flexibility of the application of the RF front-end module, and relieving the development pressure of manufacturers. In addition, at least two chips are arranged along the direction perpendicular to the printed circuit board, superimposed and welded on the printed circuit board, which makes the design of the RF front-end module more compact, reduces the area occupied by the RF front-end module on the printed circuit board, and effectively saves money the layout space of the printed circuit board.

Embodiments of the present disclosure also provide a mobile terminal, which includes the packaging structure of the RF front-end module as described in the above embodiments. Therefore, the mobile terminal provided by the embodiments of the present disclosure also has the above beneficial effects, which will not be repeated here. Exemplarily, the mobile terminal may be, for example, an electronic device such as a mobile phone or a tablet computer.

It should be noted that, in this document, relational terms such as "first" and "second" etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these There is no such actual relationship or sequence between entities or operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article, or device that includes the element.

The above are only specific embodiments of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure is not to be limited to the embodiments herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Industrial Applicability

The packaging structure of the radio frequency front-end module provided by the present disclosure includes a radio frequency amplification unit, a first radio frequency switch, a duplex unit and a second radio frequency switch, which are packaged into at least two chips, and the radio frequency amplification unit and the duplex unit are packaged In different chips, the design of the RF amplifier unit and the duplex unit can be carried out independently, which improves the flexibility of the RF front-end module application, makes the design of the RF front-end module more compact, and effectively saves the layout space of the printed circuit board. , has strong industrial practicability.

Claims

A package structure of a radio frequency front-end module, characterized in that it includes:

a radio frequency amplifying unit, a first radio frequency switch, a duplex unit and a second radio frequency switch, the first radio frequency switch is respectively connected to the radio frequency amplifying unit and the duplex unit, and the duplex unit is connected to the second radio frequency switch connection;

The radio frequency amplification unit, the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged as at least two chips, and the radio frequency amplification unit and the duplex unit are packaged in different places. in the chip;

The at least two chips are superimposed and soldered on the printed circuit board along a direction perpendicular to the printed circuit board.
The packaging structure of the radio frequency front-end module according to claim 1, wherein the duplex unit comprises at least two duplex paths, and the duplex paths are used for filtering radio frequency signals;

The first radio frequency switch is connected to the duplex unit through one of the duplex paths, and the second radio frequency switch is connected to the duplex unit through one of the duplex paths.
The package structure of the RF front-end module according to claim 1, wherein among the at least two chips, the chip with the largest distance from the printed circuit board is disposed adjacent to the surface of the printed circuit board. A plurality of pads are provided on the surfaces of the remaining chips away from the printed circuit board and on the surfaces adjacent to the printed circuit board.
The packaging structure of the radio frequency front-end module according to claim 1, wherein the radio frequency amplification unit, the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged into two chips , the two chips include a first chip and a second chip, and the first chip and the second chip are superimposed and welded on the printed circuit board along a direction perpendicular to the printed circuit board.
The package structure of the RF front-end module according to claim 4, wherein the first chip is welded on the printed circuit board, and the second chip is welded on the first chip;

The pads of the first chip facing away from the surface of the printed circuit board have the same number and distribution positions as the pads of the second chip adjacent to the surface of the printed circuit board.
The packaging structure of the RF front-end module according to claim 5, wherein the input end of the RF front-end module is connected to a pad on one side of the first chip adjacent to the printed circuit board;

The output end of the RF front-end module is connected to the pad on the side of the second chip adjacent to the printed circuit board.
The packaging structure of the radio frequency front-end module according to claim 4, wherein the radio frequency amplification unit and the first radio frequency switch are packaged as the first chip, the duplex unit and the second radio frequency switch are packaged as the first chip. The radio frequency switch is packaged as the second chip; or,

The radio frequency amplification unit is packaged as the first chip, and the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged as the second chip.
The package structure of the RF front-end module according to claim 7, wherein the first chip is welded to the printed circuit board, and the second chip is welded to the first chip away from the printed circuit surface of the board.
The packaging structure of the radio frequency front-end module according to claim 1, wherein the radio frequency amplification unit, the first radio frequency switch, the duplex unit and the second radio frequency switch are packaged into three chips , the three chips include a first chip, a second chip and a third chip, and the first chip, the second chip and the third chip are superimposed and welded to the printed circuit board.
The packaging structure of the RF front-end module according to claim 9, wherein the RF amplification unit and the first RF switch are packaged as the first chip, and the duplex unit is packaged as the The second chip, the second radio frequency switch is packaged as the third chip; or,

The radio frequency amplification unit is packaged as the first chip, the first radio frequency switch and the duplex unit are packaged as the second chip, and the second radio frequency switch is packaged as the third chip; or,

The radio frequency amplification unit is packaged as the first chip, the first radio frequency switch is packaged as the second chip, the duplex unit and the second radio frequency switch are packaged as the third chip .
The package structure of the RF front-end module according to claim 10, wherein the first chip is welded to the printed circuit board, and the second chip is welded to the first chip away from the printed circuit the surface of the board, the third die is soldered to the surface of the second die facing away from the printed circuit board.
The packaging structure of the radio frequency front-end module according to any one of claims 9-11, wherein the output end of the radio frequency front-end module and the pad on one side of the third chip are adjacent to the printed circuit board connect.
The packaging structure of the RF front-end module according to claim 1, wherein the RF amplifier unit is packaged as a first chip, the first RF switch is packaged as a second chip, and the duplex unit is packaged as a first chip. packaged as a third chip, and the second radio frequency switch is packaged as a fourth chip;

The first chip, the second chip, the third chip and the fourth chip are sequentially stacked and welded on the printed circuit board along the direction perpendicular to the printed circuit board, and the first chip is welded to the printed circuit board. on the printed circuit board.
The packaging structure of the RF front-end module according to any one of claims 1-13, wherein the packaging structure of the RF front-end module further comprises: a heat dissipation pad;

The heat dissipation pad is disposed on a surface of the first chip adjacent to the printed circuit board.
A mobile terminal, characterized in that it comprises the packaging structure of the radio frequency front-end module according to any one of claims 1-14.