WO2022147861A1 - 均热板的制造方法、均热板及中框均热板 - Google Patents

均热板的制造方法、均热板及中框均热板 Download PDF

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Publication number
WO2022147861A1
WO2022147861A1 PCT/CN2021/074018 CN2021074018W WO2022147861A1 WO 2022147861 A1 WO2022147861 A1 WO 2022147861A1 CN 2021074018 W CN2021074018 W CN 2021074018W WO 2022147861 A1 WO2022147861 A1 WO 2022147861A1
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Prior art keywords
soaking plate
vapor chamber
welding
lower cover
manufacturing
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PCT/CN2021/074018
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English (en)
French (fr)
Inventor
于全耀
梁平平
李学华
陈�光
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东莞领杰金属精密制造科技有限公司
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Application filed by 东莞领杰金属精密制造科技有限公司 filed Critical 东莞领杰金属精密制造科技有限公司
Priority to US18/026,299 priority Critical patent/US20230366632A1/en
Priority to EP21916914.1A priority patent/EP4199670A4/en
Priority to KR1020237009199A priority patent/KR20230051286A/ko
Priority to JP2023540983A priority patent/JP2023541209A/ja
Publication of WO2022147861A1 publication Critical patent/WO2022147861A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/082—Heat exchange elements made from metals or metal alloys from steel or ferrous alloys
    • F28F21/083—Heat exchange elements made from metals or metal alloys from steel or ferrous alloys from stainless steel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/02—Reinforcing means for casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2230/00—Sealing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/06—Fastening; Joining by welding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Definitions

  • the invention relates to the technical field of heat dissipation, and in particular, to a method for manufacturing a soaking plate, a soaking plate and a middle frame soaking plate.
  • vapor chambers as the application hotspot of heat dissipation technology, are applied to more types of mobile phones.
  • the existing technology after the heat treatment process of the soaking plate, the material strength of the soaking plate is greatly weakened, and the mechanical strength is lacking, which is greatly limited in application.
  • the existing vapor chambers are all covered on the electronic components in the traditional middle frame, and only have the function of heat dissipation, and the function is relatively single.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention proposes a method for manufacturing a vapor chamber, which has good anti-aging performance, and has high mechanical strength while having heat dissipation effect, so that it can be used as a support when installing electronic components, and has various functions. .
  • the present invention also proposes a soaking plate using the above-mentioned manufacturing method of the soaking plate.
  • the present invention also provides a middle-frame vapor chamber with the above vapor chamber.
  • Stiffener welding is performed on the heat soaking plate after the sealing treatment.
  • the manufacturing method of the soaking plate according to the embodiment of the present invention has at least the following beneficial effects: by adopting surface heat treatment, the soaking plate does not react with water, so that the anti-aging performance of the soaking plate is effectively improved.
  • the manufacturing method of the soaking plate by welding the soaking plate with reinforcing ribs, strengthens the overall mechanical strength of the soaking plate, so that the soaking plate has a high mechanical strength while having a heat dissipation effect.
  • the soaking plate can be used as a support and has various functions. Therefore, the soaking plate manufactured by the method for manufacturing the soaking plate of the present invention has good anti-aging performance and good mechanical strength, can support electronic components, and has various functions.
  • different raw materials for each part of the vapor chamber are prepared, and according to the predetermined shape of each part, the raw material corresponding to each part is used for processing and forming, including the following steps:
  • the upper cover of the soaking plate is obtained by punching or etching the stainless steel plate;
  • the stainless steel plate is punched or etched to obtain the lower cover
  • the liquid-absorbent core of the soaking plate is obtained by laser cutting the copper mesh.
  • assembling each part of the formed vapor chamber, and welding and sealing each part of the vapor chamber after the assembly is completed including the following steps:
  • performing surface heat treatment on the vaporizing plate after welding and sealing includes the following steps:
  • the heat soaking plate after welding and sealing is placed in an oven, the temperature of the oven is maintained between 100 degrees and 400 degrees, and the oven is baked for 1 to 5 hours.
  • the passivation treatment of the soaking plate after the surface heat treatment includes the following steps:
  • the soaking plate after surface heat treatment is placed in a hydrogen furnace, the temperature of the hydrogen furnace is kept between 500 degrees and 950 degrees, and the hydrogen furnace is turned off after heating for 1 to 6 hours.
  • the hot plate was cooled to normal temperature with the hydrogen furnace.
  • assembling the passivation-treated vapor chamber and the liquid injection pipe includes the following steps:
  • the annealed liquid injection pipe is inserted into the water injection port of the soaking plate, and fixed by welding.
  • the soaking plate of the embodiment of the second aspect of the present invention is manufactured by the above-mentioned manufacturing method of the soaking plate.
  • the soaking plate according to the embodiment of the present invention has at least the following beneficial effects: good anti-aging performance, high mechanical strength, and can play a supporting role for electronic components.
  • a surface of the upper cover near the liquid-absorbent core is provided with a plurality of reinforcing ribs, and the reinforcing ribs are in conflict with the surface of the lower cover near the liquid-absorbent core. , the reinforcing rib is welded with the lower cover.
  • a plurality of welding points are disposed on the surface of the lower cover on the side away from the absorbent core, and the positions of the welding points are directly opposite to the reinforcing rib inside the vapor chamber.
  • the welding point welds the reinforcing rib to the lower cover.
  • the middle frame vapor chamber according to the third aspect of the present invention includes:
  • the middle frame is provided with an opening
  • the vapor chamber is located in the opening and welded with the middle frame.
  • the middle frame soaking plate according to the embodiment of the present invention has at least the following beneficial effects: by welding the soaking plate and the middle frame, the soaking plate and the middle frame are connected as a whole, and the mechanical strength of the middle frame soaking plate is enhanced, and further On the premise of achieving the same effect, the thickness of the heat-spreading plate of the middle frame can be reduced, and heat dissipation can be carried out in a large area.
  • FIG. 1 is a schematic flowchart of a method for manufacturing a vapor chamber according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of an exploded structure of a vapor chamber according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a middle frame soaking plate according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of an exploded structure of a middle frame vapor chamber according to an embodiment of the present invention.
  • the azimuth description such as the azimuth or position relationship indicated by up, down, front, rear, left, right, etc.
  • the azimuth description is based on the azimuth or position relationship shown in the drawings, only In order to facilitate the description of the present invention and simplify the description, it is not indicated or implied that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
  • a method of manufacturing a vapor chamber according to an embodiment of the present invention will be described below with reference to FIGS. 1 and 3 .
  • a method for manufacturing a vapor chamber according to an embodiment of the present invention includes:
  • the rib 111 is welded to the heat soaking plate 100 after the sealing process.
  • the soaking plate 100 adopts the surface heat treatment process, so that the soaking plate 100 does not react with water, the anti-aging performance is effectively improved, and the reliability of the soaking plate 100 is ensured;
  • the overall mechanical strength of the vapor chamber 100 is strengthened, so that the vapor chamber 100 has a high mechanical strength while having a heat dissipation effect.
  • the vapor chamber 100 can be used as a support and has various functions. . Therefore, the manufacturing method of the vapor chamber 100 of the present invention has good anti-aging performance and good mechanical strength, in addition to heat dissipation of electronic components, it can also be used as a support body for mounting electronic components. Versatile.
  • the upper cover 110 is obtained by punching or etching the stainless steel plate;
  • the lower cover 130 is obtained by punching or etching the stainless steel plate;
  • the liquid-absorbent core 120 of the vapor chamber 100 is obtained by laser cutting the copper mesh.
  • the soaking plate 100 includes an upper cover 110 , a liquid absorbing core 120 and a lower cover 130 .
  • the materials of the upper cover 110 and the lower cover 130 are made of stainless steel plates, so that the soaking plate 100 has Better mechanical strength.
  • the absorbent core 120 is a porous copper mesh.
  • the upper cover 110 of the vapor chamber is rectangular
  • the liquid absorbent core 120 is rectangular with a plurality of through holes
  • the lower cover 130 has a rectangular shape with a plurality of protrusions matched with the through holes of the wick 120 .
  • the soaking plate 100 further includes a working medium, and the soaking plate 100 assembled with the liquid injection pipe is injected with water, and water is used as the working medium. Further, the vapor chamber 100 can also be injected with ethanol as a working medium.
  • the soaking plate 100 after water injection is evacuated.
  • vacuuming equipment is usually used for vacuuming.
  • sealing the vacuumed vapor chamber 100 includes the following steps:
  • the above-mentioned sealing treatment is carried out with a secondary degasser.
  • the sealing treatment can effectively remove the exhaust gas in the soaking plate, and effectively seal the liquid injection pipe to improve the heat dissipation effect of the soaking plate.
  • welding the rib 111 to the heat soaking plate 100 after the sealing process includes the following steps:
  • the protrusions of the upper cover 110 are welded to the lower cover 130 by laser welding through the welding points 131 .
  • the welding of the reinforcing ribs 111 can effectively increase the mechanical strength of the soaking plate.
  • assembling each part of the formed vapor chamber 100 and welding and sealing each part of the assembled vapor chamber 100 includes the following steps:
  • the upper cover 110 is placed on the lower cover 130 on which the wick 120 is fixed, and the wick 120 is sealed in the cavity formed by the upper cover 110 and the lower cover 130 by brazing, fusion welding or pressure welding.
  • high temperature brazing can be used for brazing
  • laser welding can be used for fusion welding
  • diffusion welding can be used for pressure welding.
  • the surface heat treatment of the welded and sealed soaking plate 100 includes the following steps:
  • the heat soaking plate 100 after welding and sealing is placed in an oven, and the temperature of the oven is maintained between 100 degrees and 400 degrees, and baked for 1 to 5 hours.
  • the soaking plate 100 After the surface heat treatment, the soaking plate 100 can have good anti-aging performance.
  • the passivation treatment of the soaking plate 100 after the surface heat treatment includes the following steps:
  • the soaking plate 100 after surface heat treatment is placed in a hydrogen furnace, the temperature of the hydrogen furnace is kept between 500 degrees and 950 degrees, and the hydrogen furnace is turned off after heating for 1 to 6 hours, and the soaking plate 100 is cooled with the hydrogen furnace. to room temperature.
  • the vapor chamber 100 can have a better anti-corrosion effect.
  • assembling the passivation-treated vapor chamber 100 and the liquid injection pipe includes the following steps:
  • the annealed liquid injection pipe is inserted into the water injection port of the soaking plate 100 and fixed by welding.
  • the liquid injection pipe is subjected to annealing treatment, the annealing temperature is 400 degrees to 800 degrees, the temperature is kept for 1 hour to 3 hours, and the furnace is cooled to room temperature.
  • the operation is simple and provides conditions for subsequent processes.
  • the vapor chamber 100 according to an embodiment of the present invention is described below with reference to FIG. 2 .
  • the soaking plate 100 of the embodiment of the present invention is manufactured by the above-mentioned manufacturing method of the soaking plate 100 .
  • the vapor chamber 100 has good anti-aging performance, certain corrosion resistance, and high mechanical strength, which can play a supporting role for electronic components.
  • a plurality of reinforcing ribs 111 are provided on the surface of the upper cover 110 on the side close to the liquid absorbent core 120 , and the reinforcing ribs 111 and the surface of the lower cover 130 on the side close to the liquid absorbent core 120 are provided.
  • the reinforcing rib 111 is welded with the lower cover 130 .
  • the mechanical strength of the vapor chamber is effectively enhanced, so that the vapor chamber 100 can be used as a support body for installing electronic components while having a heat dissipation effect, and has various functions.
  • the surface of the lower cover 130 on the side away from the wick 120 is provided with a plurality of welding points 131 , and the positions of the welding points 131 are directly opposite to the reinforcing ribs 111 inside the soaking plate 100 .
  • the reinforcing rib 111 is welded with the lower cover 130 through the welding point 131 .
  • the welding method of the reinforcing ribs 111 is laser welding
  • the number of welding points 131 is four
  • the connecting lines of the welding points 131 form a square, which is more conducive to uniform stress.
  • a middle frame vapor chamber according to an embodiment of the present invention will be described below with reference to FIGS. 3 and 4 .
  • a middle frame vapor chamber includes:
  • the middle frame 200 is provided with an opening 210;
  • the vapor chamber 100 is located in the opening 210 and welded with the middle frame 200 .
  • the soaking plate 100 and the middle frame 200 are connected as a whole, the mechanical strength of the soaking plate 100 of the middle frame 200 is enhanced, and the middle frame 200 can be reduced on the premise of achieving the same effect.
  • the thickness of the vapor chamber and can dissipate heat in a large area.
  • connection method of the vapor chamber 100 and the middle frame 200 may be laser welding, riveting or gluing.

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Abstract

本发明公开了一种均热板的制造方法、均热板及中框均热板，涉及散热技术领域。均热板的制造方法，包括有以下步骤：准备均热板的各个部分的不同原材料，根据各个部分的预定形状，使用与各个部分相对应的原材料进行加工成型；将加工成型的均热板的各个部分进行组装，将完成组装后的均热板的各个部分进行焊接密封；将焊接密封后的均热板进行表面热处理；将表面热处理后的均热板进行钝化处理；将钝化处理后的均热板与注液管进行组装；将与注液管组装后的均热板进行注水；将注水后的均热板进行抽真空；将抽真空后的均热板进行封口处理；将封口处理后的均热板进行加强筋111焊接。上述方法使得均热板具有较高的力学强度，并且中框均热板散热效果好。

Description

均热板的制造方法、均热板及中框均热板 技术领域
本发明涉及散热技术领域，尤其涉及一种均热板的制造方法、均热板及中框均热板。
背景技术
相关技术中，手机等电子产品在向轻薄化发展，留给元器件的装配空间也越来越小，因此，均热板作为散热技术的应用热点，应用在了更多种类的手机上。根据现有工艺，均热板在经过热处理工艺后，其材质强度极大减弱，缺少力学强度，在应用上受到了较大的限制。此外，现有的均热板均是覆盖在传统中框中的电子元器件上，仅具有散热功能，功能较为单一。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明提出一种均热板的制造方法，抗老化性能好，并且在具有散热效果的同时具有较高的力学强度，使得在进行电子元器件安装的时起到支撑使用，功能多样。
本发明还提出一种采用上述均热板的制造方法的均热板。
本发明还提出一种具有上述均热板的中框均热板。
根据本发明的第一方面实施例的均热板的制造方法，包括有以下步骤：
准备均热板的各个部分的不同原材料，根据所述各个部分的预定形状，使用与所述各个部分相对应的所述原材料进行加工成型；
将加工成型的所述均热板的所述各个部分进行组装，将完成组装后的所述均热板的所述各个部分进行焊接密封；
将焊接密封后的所述均热板进行表面热处理；
将表面热处理后的所述均热板进行钝化处理；
将钝化处理后的所述均热板与注液管进行组装；
将与所述注液管组装后的所述均热板进行注水；
将注水后的所述均热板进行抽真空；
将抽真空后的所述均热板进行封口处理；
将封口处理后的所述均热板进行加强筋焊接。
根据本发明实施例的均热板的制造方法，至少具有如下有益效果：通过采用表面热处理，使得均热板不与水反应，使得均热板的抗老化性能得到有效提升，此外，本发明的均热板的制造方法，通过使均热板焊接有加强筋，加强了均热板的整体力学强度，使得均热板在具有散热效果的同时具有较高的力学强度，在进行电子元器件的安装时，均热板可以起到支撑使用，功能多样。因此，通过本发明的均热板的制造方法制成的均热板，抗老化性能好，并且具有很好的力学强度，对电子元器件能够起到支撑作用，功能多样。
根据本发明的一些实施例，准备均热板的各个部分的不同原材料，根据所述各个部分的预定形状，使用与所述各个部分相对应的所述原材料进行加工成型，包括有以下步骤：
根据所述均热板的上盖的预定形状，将不锈钢板材进行冲压或者蚀刻获得所述上盖；
根据所述均热板的下盖的预定形状，将所述不锈钢板材进行冲压或者蚀刻获得所述下盖；
根据所述均热板的吸液芯的预定形状，将铜网进行激光切割获得所述吸液芯。
根据本发明的一些实施例，将加工成型的所述均热板的各个部分进行组装，将完成组装后的所述均热板的各个部分进行焊接密封，包括有以下步骤：
将所述吸液芯放在所述下盖中，使用高温烧结或电阻焊将所述吸液芯固定在所述下盖上；
将所述上盖放在固定有所述吸液芯的所述下盖上，采用钎焊、熔焊或压焊，将所述吸液芯密封在所述上盖与所述下盖形成的腔室内。
根据本发明的一些实施例，将焊接密封后的所述均热板进行表面热处理，包括有以下步骤：
将焊接密封后的所述均热板置于烤箱中，将所述烤箱的温度保持在100度到400度之间，烘烤1到5小时。
根据本发明的一些实施例，将表面热处理后的所述均热板进行钝化处理，包括有以下步骤：
将表面热处理后的所述均热板置于氢气炉内，将所述氢气炉的温度保持在500度到950度之间，加热1到6小时后关掉所述氢气炉，将所述均热板随所述氢气炉冷却至常温。
根据本发明的一些实施例，将钝化处理后的所述均热板与注液管进行组装，包括有以下步骤：
将所述注液管进行退火处理；
将退火处理后的所述注液管插入所述均热板的注水口，采用焊接固定。
根据本发明的第二方面实施例的均热板，所述均热板采用如上所述的均热板的制造方法制成。
根据本发明实施例的均热板，至少具有如下有益效果：抗老化性能好，具有较高的力学强度，能够对电子元器件起到支撑作用。
根据本发明的一些实施例，所述上盖靠近所述吸液芯一侧的表面设有多个加强筋，所述加强筋与所述下盖靠近所述吸液芯一侧的表面相抵触，所述加强筋与所述下盖焊接。
根据本发明的一些实施例，所述下盖远离所述吸液芯一侧的表面设置有多个焊接点，所述焊接点的位置正对所述均热板内部的所述加强筋，通过所述焊接点将所述加强筋与所述下盖焊接。
根据本发明的第三方面实施例的中框均热板，包括：
中框，所述中框设置有开口；
如上所述的均热板，所述均热板位于所述开口内并与所述中框焊接。
根据本发明实施例的中框均热板，至少具有如下有益效果：通过均热板与中框焊接，使均热板与中框连为一体，增强了中框均热板的力学强度，进而可以在达到同样效果的前提下减少中框均热板的厚度，并且能够大面积散热。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
下面结合附图和实施例对本发明做进一步的说明，其中：
图1为本发明的实施例的均热板的制造方法的流程示意图；
图2为本发明的实施例的均热板的分解结构示意图；
图3为本发明的实施例的中框均热板的结构示意图；
图4为本发明的实施例的中框均热板的分解结构示意图。
附图标记：
均热板100、上盖110、加强筋111、吸液芯120、下盖130、焊接点131、中框200、开口210。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或 类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，涉及到方位描述，例如上、下、前、后、左、右等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，若干的含义是一个以上，多个的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。如果有描述到第一、第二只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
本发明的描述中，除非另有明确的限定，设置、安装、连接等词语应做广义理解，所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本发明中的具体含义。
本发明的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
下面参照图1和图3描述根据本发明实施例的均热板的制造方法。
如图1和图3所示，根据本发明实施例的均热板的制造方法，包括：
准备均热板100的各个部分的不同原材料，根据各个部分的预定形状，使用与各个部分相对应的原材料进行加工成型；
将加工成型的均热板100的各个部分进行组装，将完成组装后的均热板100的各个部分进行焊接密封；
将焊接密封后的均热板100进行表面热处理；
将表面热处理后的均热板100进行钝化处理；
将钝化处理后的均热板100与注液管进行组装；
将与注液管组装后的均热板100进行注水；
将注水后的均热板100进行抽真空；
将抽真空后的均热板100进行封口处理；
将封口处理后的均热板100进行加强筋111焊接。
相关技术中，手机逐渐向轻薄化发展，留给电子元器件的装配空间也越来越小，均热板100作为手机散热的技术解决方案，得到了更多的应用，
均热板100通过采用表面热处理工艺，使得均热板100不与水反应，抗老化性能得到了有效提高，保证了均热板100的可靠性；此外，均热板100通过焊接加强筋111，加强了均热板100的整体力学强度，使得均热板100在具有散热效果的同时具有较高的力学强度，在进行电子元器件的安装时，均热板100可以起到支撑使用，功能多样。因此，本发明的均热板100的制造方法，抗老化性能好，并且具有很好的力学强度，除了可以进行电子元器件的散热之外，还能够作为电子元器件安装的支撑体进行使用，功能多样。
可以理解的是，如图1所示，步骤中准备均热板100的各个部分的不同原材料，根据各个部分的预定形状，使用与各个部分相对应的原材料进行加工成型，包括有以下步骤：
根据均热板100的上盖110的预定形状，将不锈钢板材进行冲压或者蚀刻获得上盖110；
根据均热板100的下盖130的预定形状，将不锈钢板材进行冲压或者蚀刻获得下盖130；
根据均热板100的吸液芯120的预定形状，将铜网进行激光切割获得吸液芯120。
具体地，如图2所示，均热板100包括上盖110、吸液芯120和下盖130，上盖110和下盖130的材料均采用不锈钢板材作为原材料，能够使得均热板100具有更好的力学强度。具体地，吸液芯120为多孔铜网。
具体地，如图2所示，根据各个部分的预定形状，包括有以下预定形状：均热板的上盖110为矩型，吸液芯120为具有多个通孔的矩型，下盖130具有多个与吸液芯120的通孔相配合的凸块，下盖130为矩型。
可以理解的是，如图1所示，均热板100还包括工作介质，将与注液管组装后的均热板100进行注水，把水作为工作介质。进一步地，均热板100还可以注入乙醇作为工作介质。
可以理解的是，如图1所示，将注水后的均热板100进行抽真空，为了使注水后的均热板100取得更好的散热效果，通常会采用抽真空设备进行抽真空处理。
可以理解的是，如图1所示，将抽真空后的均热板100进行封口处理，包括有以下步骤：
对均热板100进行加热，通过注液管排出均热板内部的气体；
对注液管依次进行封口、裁断。
进一步地，上述封口处理采用二次除气机进行处理。封口处理能够有效排除均热板内的废气，并对注液管进行有效密封，提高均热板的散热效果。
可以理解的是，如图1所示，将封口处理后的均热板100进行加强筋111焊接，包括有以下步骤：
确定多个加强筋111的焊接点131；
通过焊接点131，采用激光焊将上盖110的凸起部焊接在下盖130上。
加强筋111焊接，可有效增加均热板的力学强度。
可以理解的是，如图1所示，将加工成型的均热板100的各个部分进行组装，将完成组装后的均热板100的各个部分进行焊接密封，包括有以下步骤：
将吸液芯120放在下盖130中，使用高温烧结或电阻焊将吸液芯120固定在下盖130上；
将上盖110放在固定有吸液芯120的下盖130上，采用钎焊、熔焊或压焊，将吸液芯120密封在上盖110与下盖130形成的腔室内。
具体地，钎焊可以采用高温钎焊，熔焊可以采用激光焊，压焊可以采用扩散焊。通过采用上述焊接方式，能够取得较好的焊接效果，密封效果佳。
可以理解的是，如图1所示，将焊接密封后的均热板100进行表面热处理，包括有以下步骤：
将焊接密封后的均热板100置于烤箱中，将烤箱的温度保持在100度到400度之间，烘烤1到5小时。
通过表面热处理后，能够使得均热板100具有很好的抗老化性能。
可以理解的是，如图1所示，将表面热处理后的均热板100进行钝化处理，包括有以下步骤：
将表面热处理后的均热板100置于氢气炉内，将氢气炉的温度保持在500度到950度之间，加热1到6小时后关掉氢气炉，将均热板100随氢气炉冷却至常温。
通过钝化处理后，能够使得均热板100具有较好的抗腐蚀效果。
可以理解的是，如图1所示，将钝化处理后的均热板100与注液管进行组装，包括有以下步骤：
将注液管进行退火处理；
将退火处理后的注液管插入均热板100的注水口，采用焊接固定。
具体地，注液管进行退火处理，退火温度为400度到800度，保温1小时到3小时，随炉冷却至室温，操作简单，为后续的工序提供条件。
下面参照图2描述根据本发明实施例的均热板100。
如图2所示，根据本发明实施例的均热板100，均热板100采用上述的均热板100的制造方法制成。
经过上述工艺的处理，均热板100的抗老化性能好，具有一定的抗腐蚀性，并且具有较 高的力学强度，能够对电子元器件起到支撑作用。
可以理解的是，如图2和图3所示，上盖110靠近吸液芯120一侧的表面设有多个加强筋111，加强筋111与下盖130靠近吸液芯120一侧的表面相抵触，加强筋111与下盖130焊接。
通过焊接加强筋111，有效增强了均热板的力学强度，使得均热板100在具有散热效果的同时，还能够作为电子元器件安装的支撑体进行使用，功能多样。
可以理解的是，如图2和图3所示，下盖130远离吸液芯120一侧的表面设置有多个焊接点131，焊接点131的位置正对均热板100内部的加强筋111，通过焊接点131将加强筋111与下盖130焊接。
具体地，加强筋111的焊接方式为激光焊，焊接点131为4个，焊接点131的连线形成正方形，更利于均匀受力。
下面参照图3和图4描述根据本发明实施例的中框均热板。
如图3和图4所示，根据本发明实施例的中框均热板，包括：
中框200，中框200设置有开口210；
如上述的均热板100，均热板100位于开口210内并与中框200焊接。
通过均热板100与中框200焊接，使均热板100与中框200连为一体，增强了中框200均热板100的力学强度，进而可以在达到同样效果的前提下减少中框200均热板的厚度，并且能够大面积散热。
具体地，均热板100与中框200的连接方法，可以使用激光焊接、铆接或胶结。
上面结合附图对本发明实施例作了详细说明，但是本发明不限于上述实施例，在所属技术领域普通技术人员所具备的知识范围内，还可以在不脱离本发明宗旨的前提下作出各种变化。此外，在不冲突的情况下，本发明的实施例及实施例中的特征可以相互组合。

Claims (10)

  1. 均热板的制造方法，其特征在于，包括有以下步骤：
    准备均热板(100)的各个部分的不同原材料，根据所述各个部分的预定形状，使用与所述各个部分相对应的所述原材料进行加工成型；
    将加工成型的所述均热板(100)的所述各个部分进行组装，将完成组装后的所述均热板(100)的所述各个部分进行焊接密封；
    将焊接密封后的所述均热板(100)进行表面热处理；
    将表面热处理后的所述均热板(100)进行钝化处理；
    将钝化处理后的所述均热板(100)与注液管进行组装；
    将与所述注液管组装后的所述均热板(100)进行注水；
    将注水后的所述均热板(100)进行抽真空；
    将抽真空后的所述均热板(100)进行封口处理；
    将封口处理后的所述均热板(100)进行加强筋(111)焊接。
  2. 根据权利要求1所述的均热板的制造方法，其特征在于，准备均热板(100)的各个部分的不同原材料，根据所述各个部分的预定形状，使用与所述各个部分相对应的所述原材料进行加工成型，包括有以下步骤：
    根据所述均热板(100)的上盖(110)的预定形状，将不锈钢板材进行冲压或者蚀刻获得所述上盖(110)；
    根据所述均热板(100)的下盖(130)的预定形状，将所述不锈钢板材进行冲压或者蚀刻获得所述下盖(130)；
    根据所述均热板(100)的吸液芯(120)的预定形状，将铜网进行激光切割获得所述吸液芯(120)。
  3. 根据权利要求2所述的均热板的制造方法，其特征在于，将加工成型的所述均热板(100)的各个部分进行组装，将完成组装后的所述均热板(100)的各个部分进行焊接密封，包括有以下步骤：
    将所述吸液芯(120)放在所述下盖(130)中，使用高温烧结或电阻焊将所述吸液芯(120)固定在所述下盖(130)上；
    将所述上盖(110)放在固定有所述吸液芯(120)的所述下盖(130)上，采用钎焊、熔焊或压焊，将所述吸液芯(120)密封在所述上盖(110)与所述下盖(130)形成的腔室内。
  4. 根据权利要求1所述的均热板的制造方法，其特征在于，将焊接密封后的所述均热板(100)进行表面热处理，包括有以下步骤：
    将焊接密封后的所述均热板(100)置于烤箱中，将所述烤箱的温度保持在100度到400度之间，烘烤1到5小时。
  5. 根据权利要求1所述的均热板的制造方法，其特征在于，将表面热处理后的所述均热板(100)进行钝化处理，包括有以下步骤：
    将表面热处理后的所述均热板(100)置于氢气炉内，将所述氢气炉的温度保持在500度到950度之间，加热1到6小时后关掉所述氢气炉，将所述均热板(100)随所述氢气炉冷却至常温。
  6. 根据权利要求1所述的均热板的制造方法，其特征在于，将钝化处理后的所述均热板(100)与注液管进行组装，包括有以下步骤：
    将所述注液管进行退火处理；
    将退火处理后的所述注液管插入所述均热板(100)的注水口，采用焊接固定。
  7. 均热板，其特征在于，所述均热板(100)采用如权利要求2所述的均热板(100)的制造方法制成。
  8. 根据权利要求7所述的均热板，其特征在于，所述上盖(110)靠近所述吸液芯(120)一侧的表面设有多个加强筋(111)(111)，所述加强筋(111)与所述下盖(130)靠近所述吸液芯(120)一侧的表面相抵触，所述加强筋(111)与所述下盖(130)焊接。
  9. 根据权利要求8所述的均热板，其特征在于，所述下盖(130)远离所述吸液芯(120)一侧的表面设置有多个焊接点(131)，所述焊接点(131)的位置正对所述均热板(100)内部的所述加强筋(111)，通过所述焊接点(131)将所述加强筋(111)与所述下盖(130)焊接。
  10. 中框均热板，其特征在于，包括：
    中框(200)，所述中框(200)设置有开口(210)；
    如权利要求7至9任一项所述的均热板(100)，所述均热板(100)位于所述开口(210)内并与所述中框(200)焊接。
PCT/CN2021/074018 2021-01-11 2021-01-28 均热板的制造方法、均热板及中框均热板 WO2022147861A1 (zh)

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KR1020237009199A KR20230051286A (ko) 2021-01-11 2021-01-28 베이퍼 챔버의 제조 방법, 베이퍼 챔버 및 미들 프레임 베이퍼 챔버
JP2023540983A JP2023541209A (ja) 2021-01-11 2021-01-28 ベイパーチャンバーの製造方法、ベイパーチャンバー及びミドルフレーム付きベイパーチャンバー

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