US20200309470A1 - Vapor chamber - Google Patents
Vapor chamber Download PDFInfo
- Publication number
- US20200309470A1 US20200309470A1 US16/902,075 US202016902075A US2020309470A1 US 20200309470 A1 US20200309470 A1 US 20200309470A1 US 202016902075 A US202016902075 A US 202016902075A US 2020309470 A1 US2020309470 A1 US 2020309470A1
- Authority
- US
- United States
- Prior art keywords
- plate
- supporting portions
- vapor chamber
- chamber according
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/04—Fastening; Joining by brazing
- F28F2275/045—Fastening; Joining by brazing with particular processing steps, e.g. by allowing displacement of parts during brazing or by using a reservoir for storing brazing material
Definitions
- the present invention relates to a vapor chamber.
- a conventional vapor chamber has an upper cover and a lower copper sealed with each other and a chamber is enclosed therein.
- the upper cover and the lower copper are sealed by brazing.
- Brazing is a joining method for joining two pieces by heating and melting a filler having a melting temperature below that of the pieces. Thereby, the filler is flowable and capable of filling gaps between the two pieces via capillarity, and the two pieces can be joined by solidified filler.
- the brazed portion has a certain thickness and a whole thickness of the upper and lower cover is therefore increased at least 0.02 to 0.03 mm at the brazed periphery. Therefore, a supporting structure in the vapor chamber is stretched and even separated, and issues of strength, flatness and high temperature expansion and deformation are resulted. The issues are more obvious and serious in a compact vapor chamber.
- the present invention provides a vapor chamber.
- the vapor chamber has a first plate, a second plate and a brazing structure connected to the first plate and the second plate.
- the first plate has an outer surface, an inner surface, a sealing edge extending outwardly at a periphery of the first plate, a level difference formed between the first plate and the sealing edge, and a plurality of first supporting portions formed on the inner surface of the first plate.
- the second plate also has an outer surface and an inner surface, the inner surface of the second plate is spaced apart from the inner surface of the first plate, and the second plate covers the first plate to form a chamber.
- a plurality of second supporting portions is formed on the inner surface of the second plate.
- the brazing structure has a sealing portion and a plurality of connecting portions, the sealing portion is fixed between the second plate and the sealing edge of the first plate, and the respective connecting portions are disposed between the first supporting portions of the first plate and the second supporting portions of the second plate.
- FIG. 1 is an exploded view illustrating a vapor chamber of the present invention
- FIG. 2 is a perspective view illustrating the assembled vapor chamber of the present invention
- FIG. 3 is a cross-sectional view of the assembled vapor chamber of the present invention.
- FIG. 4 is a partial enlarged view showing the second embodiment of the portion A in FIG. 3 ;
- FIG. 5 is a partial enlarged view showing the third embodiment of the portion A in FIG. 3 ;
- FIG. 6 is a partial enlarged view showing the fourth embodiment of the portion A in FIG. 3 ;
- FIG. 7 is a partial enlarged view showing the fifth embodiment of the portion A in FIG. 3 ;
- FIG. 8 is a partial enlarged view showing the sixth embodiment of the portion A in FIG. 3 ;
- FIG. 9 is a partial enlarged view showing the seventh embodiment of the portion A in FIG. 3 ;
- FIG. 10 is a partial enlarged view showing the eighth embodiment of the portion A in FIG. 3 ;
- FIG. 11 is a partial enlarged view showing the ninth embodiment of the portion A in FIG. 3 ;
- FIG. 12 is a top view showing an inner structure of the present disclosure.
- FIG. 13 is a top view showing another embodiment of the inner structure of the present disclosure.
- FIG. 14 is a top view showing further another embodiment of the inner structure of the present disclosure.
- the present disclosure provides a vapor chamber with an improved inner structure in particular a thin vapor chamber.
- the thin vapor chamber has a small thickness ranged from 0.1 to 0.8 mm and preferably 0.3 to 0.4 mm.
- the supporting structure of the vapor chamber has a first plate 1 , a second plate 2 and a brazing structure 3 connected between the first plate 1 and second plate 2 .
- the first and second plates 1 , 2 are flat plates which are made of, for example, copper (Cu), titanium (Ti), or stainless steel (SUS).
- Each of the first and second plates 1 , 2 has a thickness ranged from 0.02 to 0.2 mm, and the thickness is preferably 0.05 mm.
- each of the first plate 1 and the second plate 2 has an outer surface 10 , 20 and an inner surface 11 , 21 .
- a sealing edge 12 extends from a periphery of the first plate 1
- a sealing edge 22 extends from a periphery of the second plate 2 .
- the level difference makes the first plate 1 and the second plate 2 enclose a sealed empty chamber 4 between the inner surfaces 11 , 21 shown in the partial enlarged view of the portion A in FIG. 3 .
- a plurality of first supporting portions 13 are disposed on the inner surfaces 11 of the first plate 1
- a plurality of second supporting portions 23 are disposed on the respective inner surfaces 21 of the second plate 2 .
- the respective first supporting portions 13 of the first plate 1 are disposed corresponding to the respective second supporting portions 23 of the second plate 2 for supporting in the chamber 4 between the first plate 1 and the second plate 2 , and the chamber 4 is thereby maintained.
- the first supporting portions 13 of the first plate 1 and the second supporting portions 23 of the second plate 2 are cylinders, and the first supporting portions 13 and the corresponding second supporting portions 23 have same diameter or contour.
- a capillary layer 14 could be disposed on the inner surface 11 of the first plate 1 , a plurality of through holes 140 are defined on the capillary layer 14 corresponding to the first supporting portions 13 of the first plate 1 , the first supporting portions 13 are inserted though the respective through holes 140 , and the capillary layer 14 thereby can attach on the inner surface 11 of the first plate 1 .
- a plurality of reliefs 24 are formed on the inner surface 21 of the second plate 2 by etching and at least one steam channel 240 is enclosed by the reliefs 24 .
- the first plate 1 and the second plate 2 are sealed by the brazing structure 3 .
- the brazing structure 3 having a sealing portion 30 and a plurality of connecting portions 31 is formed by a filler via a brazing process.
- the sealing portion 30 is extended between the sealing edges 12 , 22 of the first plates 1 and the second plate 2 .
- the peripheries of the first plates 1 and the second plate 2 excluded a degassing portion for vacuuming the chamber 4 , are sealed by the sealing portion 30 .
- Each connecting portion 31 is connected to the respectively first supporting portions 13 of the first plate 1 and the corresponding second supporting portions 23 of the second plate 2 for ensuring the first supporting portions 13 and the second supporting portion 23 are solidly connected with each other via the connecting portion 31 .
- the sealing portion 30 and the connecting portions 31 are substantially identical in thickness, a stable structure for supporting the vapor chamber is thereby formed, and an external surface of the vapor chamber is ensured to be flat.
- the aforementioned content describes the vapor chamber with the improved inner structure.
- the first supporting portions 13 of the first plate 1 and the corresponding second supporting portions 23 of the second plate 2 could have different diameters or contours.
- the first supporting portions 13 of the first plate 1 has a contour larger than the second supporting portions 23 of the second plate 2 .
- the first supporting portions 13 of the first plate 1 has a contour smaller than the second supporting portions 23 of the second plate 2 .
- an additional spilling groove 130 , 230 could be defined on each first supporting portion 13 of the first plate 1 or each second supporting portion 23 of the second plate 2 .
- at least one spilling groove 130 is recessed into the first supporting portion 13 of the first plate 1 .
- at least one spilling groove 230 is recessed into the second supporting portion 23 of the second plate 2 . The filler is allowed to flow into the recessed spilling grooves 130 , 230 to prevent from spillover.
- the respective first supporting portions 13 , 23 of the first plate 1 are provided with the aforementioned spilling grooves 130
- the corresponding second supporting portions 23 of the second plate 2 are provided with the aforementioned spilling grooves 230 .
- the spilling grooves 130 on the respective first supporting portions 13 of the first plate 1 and the spilling grooves 230 on the respective second supporting portions 23 of the second plate 2 could be different in number and thereby disposed to be a staggered or asymmetric arrangement.
- Each spilling groove 130 , 230 could have a cross section of a rectangular shape or a square shape shown in FIGS. 6 to 9 , alternatively a curve shape shown in FIG. 10 , and alternatively a V shape or an inverted V shape shown in FIG. 11 .
- the arrangement of the first supporting portions 13 of the first plate 1 and the second supporting portions 23 of the second plate 2 could be uniformly spread on the first plate 1 and the second plate 2 , for example, a stagger arrangement.
- the aforementioned first supporting portions 13 and second supporting portions 23 could be not only cylinders but also square or rectangular columns shown in FIGS. 13 and 14 .
- some of the first supporting portions 13 and the second supporting portions 23 adjacent to the sealing edge 12 , 22 could be extended to connect to the sealing edge 12 , 22 , and the structure of the vapor chamber is thereby reinforced.
- the present invention can certainly achieve the anticipated objects and solve the problems of conventional techniques, and has novelty and non-obviousness, so the present invention completely meets the requirements of patentability. Therefore, a request to patent the present invention is filed according to patent laws. Examination is kindly requested, and allowance of the present invention is solicited to protect the rights of the inventor.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
- This application is a continuing-in-part application of U.S. patent application Ser. No. 16/264,612, filed on Jan. 31, 2019, and entitled “VAPOR CHAMBER WITH SUPPORT STRUCTURE AND MANUFACTURING METHOD THEREFOR”, which claims priority to CN201810146134.2 filed Feb. 12, 2018. The entire disclosures of the above applications are all incorporated herein by reference.
- The present invention relates to a vapor chamber.
- A conventional vapor chamber has an upper cover and a lower copper sealed with each other and a chamber is enclosed therein. The upper cover and the lower copper are sealed by brazing. Brazing is a joining method for joining two pieces by heating and melting a filler having a melting temperature below that of the pieces. Thereby, the filler is flowable and capable of filling gaps between the two pieces via capillarity, and the two pieces can be joined by solidified filler.
- After aforementioned brazing, the brazed portion has a certain thickness and a whole thickness of the upper and lower cover is therefore increased at least 0.02 to 0.03 mm at the brazed periphery. Therefore, a supporting structure in the vapor chamber is stretched and even separated, and issues of strength, flatness and high temperature expansion and deformation are resulted. The issues are more obvious and serious in a compact vapor chamber.
- In view of this, the inventor studied various technologies and created an effective solution in the present disclosure.
- It is an objective of the present invention to provide a vapor chamber which is prevented from issues of strength, flatness and expansion in high temperature therein caused by enlarging of gaps between the brazed two plates.
- Accordingly, the present invention provides a vapor chamber. The vapor chamber has a first plate, a second plate and a brazing structure connected to the first plate and the second plate. The first plate has an outer surface, an inner surface, a sealing edge extending outwardly at a periphery of the first plate, a level difference formed between the first plate and the sealing edge, and a plurality of first supporting portions formed on the inner surface of the first plate. The second plate also has an outer surface and an inner surface, the inner surface of the second plate is spaced apart from the inner surface of the first plate, and the second plate covers the first plate to form a chamber. A plurality of second supporting portions is formed on the inner surface of the second plate. The brazing structure has a sealing portion and a plurality of connecting portions, the sealing portion is fixed between the second plate and the sealing edge of the first plate, and the respective connecting portions are disposed between the first supporting portions of the first plate and the second supporting portions of the second plate.
- The disclosure will become more fully understood from the detailed description and the drawings given herein below for illustration only, and thus does not limit the disclosure, wherein:
-
FIG. 1 is an exploded view illustrating a vapor chamber of the present invention; -
FIG. 2 is a perspective view illustrating the assembled vapor chamber of the present invention; -
FIG. 3 is a cross-sectional view of the assembled vapor chamber of the present invention; -
FIG. 4 is a partial enlarged view showing the second embodiment of the portion A inFIG. 3 ; -
FIG. 5 is a partial enlarged view showing the third embodiment of the portion A inFIG. 3 ; -
FIG. 6 is a partial enlarged view showing the fourth embodiment of the portion A inFIG. 3 ; -
FIG. 7 is a partial enlarged view showing the fifth embodiment of the portion A inFIG. 3 ; -
FIG. 8 is a partial enlarged view showing the sixth embodiment of the portion A inFIG. 3 ; -
FIG. 9 is a partial enlarged view showing the seventh embodiment of the portion A inFIG. 3 ; -
FIG. 10 is a partial enlarged view showing the eighth embodiment of the portion A inFIG. 3 ; -
FIG. 11 is a partial enlarged view showing the ninth embodiment of the portion A inFIG. 3 ; -
FIG. 12 is a top view showing an inner structure of the present disclosure; -
FIG. 13 is a top view showing another embodiment of the inner structure of the present disclosure; -
FIG. 14 is a top view showing further another embodiment of the inner structure of the present disclosure. - Detailed descriptions and technical contents of the present disclosure are illustrated below in conjunction with the accompanying drawings. However, it is to be understood that the descriptions and the accompanying drawings disclosed herein are merely illustrative and exemplary and not intended to limit the scope of the present disclosure.
- Please refer to the exploded view of the present disclosure shown in
FIG. 1 and the assembled perspective view of the present disclosure shown inFIG. 2 . The present disclosure provides a vapor chamber with an improved inner structure in particular a thin vapor chamber. The thin vapor chamber has a small thickness ranged from 0.1 to 0.8 mm and preferably 0.3 to 0.4 mm. The supporting structure of the vapor chamber has afirst plate 1, asecond plate 2 and abrazing structure 3 connected between thefirst plate 1 andsecond plate 2. - Specifically, the first and
second plates second plates first plate 1 and thesecond plate 2 has anouter surface inner surface sealing edge 12 extends from a periphery of thefirst plate 1, and asealing edge 22 extends from a periphery of thesecond plate 2. On at least one of the two plates 1 (or 2) is provided a level difference between the inner surface 11 (or 21) thereof and the sealing edges 12 (or 22) thereof. The level difference makes thefirst plate 1 and thesecond plate 2 enclose a sealedempty chamber 4 between theinner surfaces FIG. 3 . - Please further refer to
FIG. 3 , a plurality of first supportingportions 13 are disposed on theinner surfaces 11 of thefirst plate 1, and a plurality of second supportingportions 23 are disposed on the respectiveinner surfaces 21 of thesecond plate 2. In thefirst plate 1 and thesecond plate 2 closed with each other, the respective first supportingportions 13 of thefirst plate 1 are disposed corresponding to the respective second supportingportions 23 of thesecond plate 2 for supporting in thechamber 4 between thefirst plate 1 and thesecond plate 2, and thechamber 4 is thereby maintained. Specifically, according to the present embodiment, the first supportingportions 13 of thefirst plate 1 and the second supportingportions 23 of thesecond plate 2 are cylinders, and the first supportingportions 13 and the corresponding second supportingportions 23 have same diameter or contour. Furthermore, acapillary layer 14 could be disposed on theinner surface 11 of thefirst plate 1, a plurality of throughholes 140 are defined on thecapillary layer 14 corresponding to the first supportingportions 13 of thefirst plate 1, the first supportingportions 13 are inserted though the respective throughholes 140, and thecapillary layer 14 thereby can attach on theinner surface 11 of thefirst plate 1. A plurality ofreliefs 24 are formed on theinner surface 21 of thesecond plate 2 by etching and at least onesteam channel 240 is enclosed by thereliefs 24. - According to the present disclosure shown in
FIGS. 1,2 and 3 , thefirst plate 1 and thesecond plate 2 are sealed by thebrazing structure 3. Thebrazing structure 3 having a sealingportion 30 and a plurality of connectingportions 31 is formed by a filler via a brazing process. The sealingportion 30 is extended between thesealing edges first plates 1 and thesecond plate 2. The peripheries of thefirst plates 1 and thesecond plate 2, excluded a degassing portion for vacuuming thechamber 4, are sealed by the sealingportion 30. Each connectingportion 31 is connected to the respectively first supportingportions 13 of thefirst plate 1 and the corresponding second supportingportions 23 of thesecond plate 2 for ensuring the first supportingportions 13 and the second supportingportion 23 are solidly connected with each other via the connectingportion 31. Moreover, the sealingportion 30 and the connectingportions 31 are substantially identical in thickness, a stable structure for supporting the vapor chamber is thereby formed, and an external surface of the vapor chamber is ensured to be flat. - The aforementioned content describes the vapor chamber with the improved inner structure.
- Furthermore, the second and the third embodiments respectively shown in
FIGS. 4 and 5 are different from the aforementioned embodiment, the first supportingportions 13 of thefirst plate 1 and the corresponding second supportingportions 23 of thesecond plate 2 could have different diameters or contours. According toFIG. 4 , the first supportingportions 13 of thefirst plate 1 has a contour larger than the second supportingportions 23 of thesecond plate 2. Alternatively, according toFIG. 5 , the first supportingportions 13 of thefirst plate 1 has a contour smaller than the second supportingportions 23 of thesecond plate 2. Thereby, an acceptable range of tolerance of aligning could be increased, and the spillover soldering filler of the connectingportion 31 is thereby prevented from flowing onto thecapillary layer 14 or into thevapor flow channel 240 during the brazing process. - Further according to the fourth and fifth embodiments of the present disclosure shown in
FIGS. 6 and 7 , anadditional spilling groove portion 13 of thefirst plate 1 or each second supportingportion 23 of thesecond plate 2. According toFIG. 6 , at least one spillinggroove 130 is recessed into the first supportingportion 13 of thefirst plate 1. Alternatively, according toFIG. 7 , at least one spillinggroove 230 is recessed into the second supportingportion 23 of thesecond plate 2. The filler is allowed to flow into the recessed spillinggrooves FIGS. 8 and 9 , alternatively, the respective first supportingportions first plate 1 are provided with the aforementioned spillinggrooves 130, and the corresponding second supportingportions 23 of thesecond plate 2 are provided with the aforementioned spillinggrooves 230. According toFIG. 9 , the spillinggrooves 130 on the respective first supportingportions 13 of thefirst plate 1 and the spillinggrooves 230 on the respective second supportingportions 23 of thesecond plate 2 could be different in number and thereby disposed to be a staggered or asymmetric arrangement. - Each spilling
groove FIGS. 6 to 9 , alternatively a curve shape shown inFIG. 10 , and alternatively a V shape or an inverted V shape shown inFIG. 11 . - Further refer to
FIG. 12 , the arrangement of the first supportingportions 13 of thefirst plate 1 and the second supportingportions 23 of thesecond plate 2 could be uniformly spread on thefirst plate 1 and thesecond plate 2, for example, a stagger arrangement. Furthermore, the aforementioned first supportingportions 13 and second supportingportions 23 could be not only cylinders but also square or rectangular columns shown inFIGS. 13 and 14 . Moreover, for extending the peripheries of thefirst plates 1 and thesecond plate 2, some of the first supportingportions 13 and the second supportingportions 23 adjacent to the sealingedge edge - In summary, the present invention can certainly achieve the anticipated objects and solve the problems of conventional techniques, and has novelty and non-obviousness, so the present invention completely meets the requirements of patentability. Therefore, a request to patent the present invention is filed according to patent laws. Examination is kindly requested, and allowance of the present invention is solicited to protect the rights of the inventor.
- It is to be understood that the above descriptions are merely the preferable embodiments of the present invention and are not intended to limit the scope of the present invention. Equivalent changes and modifications made in the spirit of the present invention are regarded as falling within the scope of the present invention.
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/902,075 US20200309470A1 (en) | 2018-02-12 | 2020-06-15 | Vapor chamber |
US17/959,971 US20230021686A1 (en) | 2018-02-12 | 2022-10-04 | Internal structure of vapor chamber |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810146134.2 | 2018-02-12 | ||
CN201810146134.2A CN110167312B (en) | 2018-02-12 | 2018-02-12 | Support structure of vapor chamber and method for fabricating the same |
US16/264,612 US20190249938A1 (en) | 2018-02-12 | 2019-01-31 | Vapor chamber with support structure and manufacturing method therefor |
US16/902,075 US20200309470A1 (en) | 2018-02-12 | 2020-06-15 | Vapor chamber |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/264,612 Continuation-In-Part US20190249938A1 (en) | 2018-02-12 | 2019-01-31 | Vapor chamber with support structure and manufacturing method therefor |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/959,971 Continuation US20230021686A1 (en) | 2018-02-12 | 2022-10-04 | Internal structure of vapor chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
US20200309470A1 true US20200309470A1 (en) | 2020-10-01 |
Family
ID=72605452
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/902,075 Abandoned US20200309470A1 (en) | 2018-02-12 | 2020-06-15 | Vapor chamber |
US17/959,971 Pending US20230021686A1 (en) | 2018-02-12 | 2022-10-04 | Internal structure of vapor chamber |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/959,971 Pending US20230021686A1 (en) | 2018-02-12 | 2022-10-04 | Internal structure of vapor chamber |
Country Status (1)
Country | Link |
---|---|
US (2) | US20200309470A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210015003A1 (en) * | 2019-07-10 | 2021-01-14 | Therlect Co., Ltd. | Heat dissipating plate, manufacturing method therefor and electronic device having the same |
CN113390279A (en) * | 2021-05-06 | 2021-09-14 | 太仓市华盈电子材料有限公司 | Narrow-edge-sealed temperature-equalizing plate and manufacturing method thereof |
DE102021126643A1 (en) | 2021-10-14 | 2023-04-20 | Asia Vital Components Co., Ltd. China | A vapor chamber with improved two-phase flow boiling structure |
EP4199670A4 (en) * | 2021-01-11 | 2024-03-27 | Dongguan Lingjie Precision Machining Technology Co., Ltd. | Manufacturing method for vapor chamber, vapor chamber and middle frame vapor chamber |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5276586A (en) * | 1991-04-25 | 1994-01-04 | Hitachi, Ltd. | Bonding structure of thermal conductive members for a multi-chip module |
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US8042606B2 (en) * | 2006-08-09 | 2011-10-25 | Utah State University Research Foundation | Minimal-temperature-differential, omni-directional-reflux, heat exchanger |
US10744603B2 (en) * | 2015-03-16 | 2020-08-18 | Dana Canada Corporation | Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same |
-
2020
- 2020-06-15 US US16/902,075 patent/US20200309470A1/en not_active Abandoned
-
2022
- 2022-10-04 US US17/959,971 patent/US20230021686A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5276586A (en) * | 1991-04-25 | 1994-01-04 | Hitachi, Ltd. | Bonding structure of thermal conductive members for a multi-chip module |
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
US8042606B2 (en) * | 2006-08-09 | 2011-10-25 | Utah State University Research Foundation | Minimal-temperature-differential, omni-directional-reflux, heat exchanger |
US10744603B2 (en) * | 2015-03-16 | 2020-08-18 | Dana Canada Corporation | Heat exchangers with plates having surface patterns for enhancing flatness and methods for manufacturing same |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210015003A1 (en) * | 2019-07-10 | 2021-01-14 | Therlect Co., Ltd. | Heat dissipating plate, manufacturing method therefor and electronic device having the same |
US11617283B2 (en) * | 2019-07-10 | 2023-03-28 | Therlect Co., Ltd. | Heat dissipating plate, manufacturing method therefor and electronic device having the same |
EP4199670A4 (en) * | 2021-01-11 | 2024-03-27 | Dongguan Lingjie Precision Machining Technology Co., Ltd. | Manufacturing method for vapor chamber, vapor chamber and middle frame vapor chamber |
CN113390279A (en) * | 2021-05-06 | 2021-09-14 | 太仓市华盈电子材料有限公司 | Narrow-edge-sealed temperature-equalizing plate and manufacturing method thereof |
DE102021126643A1 (en) | 2021-10-14 | 2023-04-20 | Asia Vital Components Co., Ltd. China | A vapor chamber with improved two-phase flow boiling structure |
Also Published As
Publication number | Publication date |
---|---|
US20230021686A1 (en) | 2023-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20200309470A1 (en) | Vapor chamber | |
US11421942B2 (en) | Vapor chamber | |
US11202390B2 (en) | Heat dissipation unit connection reinforcement structure | |
US8316921B2 (en) | Plate type heat pipe and heat sink using the same | |
US20150101784A1 (en) | Heat pipe with ultra-thin flat wick structure | |
WO2018199218A1 (en) | Vapor chamber | |
US9894801B1 (en) | Cold plate | |
US20080216994A1 (en) | Vapor-Augmented Heat Spreader Device | |
US20110048682A1 (en) | Heat dissipation device | |
CN107429976B (en) | Heat exchanger with plate having surface pattern for improving flatness and method of manufacturing the same | |
KR102475643B1 (en) | Header tank of heat exchanger and heat exchanger having the same | |
US20230339053A1 (en) | Vapor chamber with support structure | |
HUE024508T2 (en) | Stacked plate heat exchanger | |
US20080047140A1 (en) | Method For Manufacturing Isothermal Plate | |
US20180263140A1 (en) | Method of manufacturing heat sink module | |
WO2015025908A1 (en) | Heat exchanger | |
US9841246B2 (en) | Dual material vapor chamber and upper shell thereof | |
US20190011193A1 (en) | Plate heat exchanger | |
RU2626032C2 (en) | Plate heat exchanger with gasket | |
US20070023177A1 (en) | Cooling fin assembly | |
JP2006207860A (en) | Heat exchange plate | |
US11997828B2 (en) | Vapor chamber and assembly method thereof | |
US11320207B2 (en) | Heat transfer plate for plate heat exchanger and plate heat exchanger with the same | |
US10161690B2 (en) | Multi-layer heat exchanger and method of distributing flow within a fluid layer of a multi-layer heat exchanger | |
US11788795B2 (en) | Vapor chamber |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: DELTA ELECTRONICS, INC., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, SHIH-LIN;CHEN, WEN-SHIANG;YANG, SHU-CHENG;REEL/FRAME:052943/0541 Effective date: 20200525 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |