WO2022147502A1 - Procédé de fabrication de cartes de transaction électroniques - Google Patents

Procédé de fabrication de cartes de transaction électroniques Download PDF

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Publication number
WO2022147502A1
WO2022147502A1 PCT/US2022/011039 US2022011039W WO2022147502A1 WO 2022147502 A1 WO2022147502 A1 WO 2022147502A1 US 2022011039 W US2022011039 W US 2022011039W WO 2022147502 A1 WO2022147502 A1 WO 2022147502A1
Authority
WO
WIPO (PCT)
Prior art keywords
filler material
metal substrate
slit
central
substrate
Prior art date
Application number
PCT/US2022/011039
Other languages
English (en)
Inventor
Patrick Daley
Edmond DAVIS
Aaron Tucker
Original Assignee
Credit Card Supplies Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Credit Card Supplies Corporation filed Critical Credit Card Supplies Corporation
Publication of WO2022147502A1 publication Critical patent/WO2022147502A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets

Definitions

  • the present invention is a method of providing a transaction card with the ability to transmit electronic information (e.g., credit card, financial instrument, identification card, security card, and the like including those with Europay, Mastercard and Visa chip - EMV chip) used to provide information about an account, the user or bearer, the card or other information including the ability to authenticate the account, user, bearer, card or associated an event or transactions card
  • electronic information e.g., credit card, financial instrument, identification card, security card, and the like including those with Europay, Mastercard and Visa chip - EMV chip
  • the magnetic stripe e.g., mag stripe
  • the magnetic stripe typically stores digital data using magnetic based particles on a band of a magnetic material placed on the card.
  • the magnetic stripe e.g., swipe card or magstripe
  • the magnetic stripe can be read (e.g., data retrieve from the magnetic stripe) by swiping past a magnetic reading head or placing the magnetic stripe in proximity to a reader.
  • ISO/IEC 7810, ISO/IEC 7811 , ISO/IEC 7812, ISO/IEC 7813, ISO 8583, and ISO/IEC 4909 have provided definitions of the physical properties of the card, including size, flexibility, location of the magstripe, magnetic characteristics, and data formats.
  • a magnetic stripe can include magnetic particles suspended in a resin where the particles can be applied directly to the card or made into a stripe on a plastic backing which is applied to the card.
  • the material used to make the particles defines the Coercivity (see below) of the stripe.
  • Standard low coercivity stripes use iron oxide as the material to make the particles, high coercivity stripes are made from other materials like barium ferrite. These materials are mixed with a resin to form a uniform slurry which is then coated onto a substrate.
  • the slurry is usually coated onto a wide plastic sheet and dried.
  • the plastic sheet is then sliced into the stripe width and applied to the card during the card manufacturing process.
  • the application of the stripe e.g., cut sheet
  • the application of the stripe includes lamination, hot-stamp, and cold-peel. All of these are a three-step application process and require making the sheet, making the stripe, and applying the stripe of the card.
  • a magnetic slurry is painted on the card.
  • a significant disadvantage with the current technology in adding magnetic stripes to the card is that the application of the magnetic stripe to a card can lead to error and premature wear and failures. Further, the amount of magnetic material that can be placed on a card is limited to the thickness of the applied stripe. It is undesirable for the magnetic stripe to cause a ridge or to be raised too much above the card substrate as this disadvantage prevents the face of the card from being planer. Further, it is shown that if the magnetic stripe is exposed to a magnetic field, the information on the magnetic stripe can be damaged and even erased.
  • Cards including cards have evolved from credit cards and other cards having raised alphanumeric characters built included on the card into cards having embedded chips, EMV chip and other electronics.
  • a card has the footprint of a credit card.
  • the housing of the card typically includes electronics that can store information thereby making the card “smart” in that it can store its data and applications.
  • Some cards have basic data processing functionality by adding processors.
  • Cards can store personal information, store digital currency, verify identity and any combination thereof. Cards have advanced from cards that only include raised characters, magnetic strips or barcodes that rely on the card processing of other networks to function.
  • metal financial cards are desirable both in the look and feel of the card.
  • Metal cards with added weight and the sounds when contacting a surface, have become a symbol of status and seem to be more attractive to consumers that desire leading edge technologies.
  • financial institutions are consistently seeking new solutions for customer as well as points of differentiation with their competitors. Offering metal cards with these financial institutions brand is one vehicle used by these financial institutions.
  • United States Patent 7,530,491 shown a card that include a core layer that is thermoplastic material which could include PVC, PET copolymer, or other substrate.
  • the card includes a pocket that can be filled with a panel.
  • the fill panel be adhered to the pocket.
  • a contactless card comprising a substrate; creating a slit, that, in one embodiment, can be at least 250p in thickness into a substrate.
  • the slit can be useful to counteract the shielding created when a conductive substrate is present.
  • the slit can redefine the flow of electrons in, what is effectively a Faraday cage, created by a conductive substrate.
  • the slit can reduce or prevent the substrate from interfering with the EMV chip and allow the conductive material to act as an antenna.
  • the reconfiguring and/or redirecting of electrons can occur when using a number of substrate materials including brass, silver, gold, aluminum, molybdenum, titanium, tungsten, other metals, and any combination.
  • the slit can be filled with a malleable filler material.
  • the filler material can be a polymer, ceramic, composite, plastic, and any combination.
  • the substrate and the filler material can be coated or painted.
  • the method can include attaching a chip to the substrate.
  • the coating or painting can be color, metallic or both.
  • the method can strengthen the slitted area and substrate by using the filler material.
  • the filling of the slitted area can be force cured at a higher temperature than the temperature where filling occurs.
  • This filling process can be performed multiple times so that the filler material, in the event of shrinkage, completely fills the slit and results in a planar surface. Repeating the filling and curing process assists with a complete fill of the slit and can assist with providing a flush and level surface defined by the substrate and filled slit.
  • the slit can be cut into the substrate at a depth of 20 p or less in one embodiment.
  • a chip can be inserted in the substrate. Testing can be performed to determine if the card can be read by a reader.
  • Figure 1 is a diagram of aspects of a card
  • Figure 2A is a diagram of aspects of a card
  • Figure 2B is a diagram of aspects of a card
  • Figure 3A is a perspective view of aspects of a card
  • Figure 3B is an edge view of aspects of a card
  • Figure 3C is an edge view of aspects of a card
  • Figure 4 is a flowchart of aspects of the manufacturing process
  • Figure 5A is an edge view of aspects of a card
  • Figure 5B is an edge view of aspects of a card
  • Figure 6A is an edge view of aspects of a card
  • Figure 6B is an edge view of aspects of a card
  • Figure 7A is an edge view of aspects of a card
  • Figure 7B is a perspective view of aspects of a card
  • Figure 7C is an edge view of aspects of a card
  • Figure 7D is a front view of aspects of a card
  • Figure 8A is a top view of aspects of a card
  • Figure 8B is a top view of aspects of a card
  • Figure 8C is a side view of aspects of a card
  • Figure 9A is a side view of aspects of a card
  • Figure 9B is a side view of aspects of a card
  • Figure 10A is a side view of aspects of a card
  • Figure 10B is a side view of aspects of a card
  • Figure 10C is a side view of aspects of a card.
  • Figure 10D is a side view of aspects of a card.
  • a card 10 including a magnetic strip 12, signature block 14 and chip 16.
  • information must be transmitted from the chip to a reader.
  • information from the chip needs to be read from the front of the card as shown in Figure 1 and the back of the card as shown in Figure 1 .
  • the process can begin with a substrate which can be a layer of the completed card.
  • An antenna connected to the chip is needed for transmission of data from the chip to a reader without the chip contacting the reader.
  • the card includes a metal layer or other component that prevents electrical transmission the chip is unable to transmit information to the reader.
  • the card can include a slit 18 where the antenna can be disposed thereby exposing the antenna to a reader allowing transmission of information from the chip to a reader.
  • An insulating substrate or other layer can be used while also allowing for contactless transmission of data. Once the slit is made into the substrate, the substrate will no longer interfere with the signal of the EMV chip to provide for a contactless transaction.
  • the slit can be filled in a manner so that the surface of the card and the filled slit is smooth. In one embodiment, the surface of the substrate and the surface of the slit have a variance in thickness of less than 20 p and can be less than 10 p.
  • the slit (or void) placed in the card cannot be filled with a material that is conductive (e.g., the filler material is non-conductive).
  • the non-conductive filler material can be applied in, on, or over the card and its slit.
  • the filler material can be dielectric.
  • the process of providing the filler material can include processing or treating a portion of or the entire card using an injection machine, manual application, additive manufacturing, phase change application, of both.
  • the process of providing the filler material can include rolling, spraying, printing, spreading, or self-leveling the filler material into the slit.
  • the filler material, once applied to the card and inserted into the slit can be cured at a temperature at least one-degree Fahrenheit more than the application temperature.
  • the filler material can then be force cured.
  • the process of applying filler material can be through multiple applications.
  • the filler material can be cured by forced air or heat which can strengthen the filler material as well as bond the filler material to the substrate creating a solid composite.
  • the composite can receive printing or can be coated with paint or other coating.
  • Application of a coating or paint can include curing the coating or paint to obscure the filled slit.
  • the slit 18 can be manufactured into the card by cutting or included when the substrate is first made.
  • the slit can extend into the substrate, or other layer, partially or completely.
  • the filler material can be placed on the slit in phases so that a first portion of filler material 20 can be placed in the slit and cured.
  • This method provides for the metal substrate to transfer from an undesirable electrically interfering substrate to where a portion or even the entire substrate acts as an antenna.
  • a second portion of filler material 22 can then be added to complete the filling of the slit.
  • the card can then be smoothed so that the front face and the rear face are planer.
  • the coating or paint that can be applied over the filled slit and surrounding area can be on a single or multi-phase process.
  • the application of the coating or paint can involve a vacuum or physical vapor deposition which provide for an aesthetic appearance of metal or metallization.
  • the filling of the slit and application of the coating and the paint can strengthen the substrate and card.
  • the filled slit with a coating or paint allows for an atheistically smooth surface while also allowing the transmission of data from the card chip to a reader to be successful even when an insulating substrate or layer (e.g., metal substrate) is used.
  • the manufacturing process can begin with providing a substrate or one layer of a card at 24.
  • a slit or void can be included in the card at 26.
  • the card can be prepared for receipt of a chip, processor, controller, antenna, or other component at 28.
  • the substrate can have a recess placed on the substrate for receiving a chip.
  • the chip and other components can then be received by the card and the recess placed on the card at 30.
  • Filler material can be placed into the slit at 32.
  • the filler material can be cured at 34.
  • the filling process can include multiple steps or multiple applications so that if further steps are needed at 36, the process can return to 32 or other processing step to complete the card.
  • the card can be coated or painted at 38.
  • the card can be tested at 40 to determine if it is operational and if so, the process completes. If the card is not operational, the card can be corrected or discarded at 42.
  • the substrate with filler 44 can have one or more upper layers 46 and one or more lower layers 48 applied to the substrate.
  • the upper layer and the lower layer can be taken from the group consisting of an insulation layer, buffer, PET, PVC, copolymer, laminate, paint, layer applied using methods such as physical vapor deposition, and any combination thereof.
  • the layers can be opaque, transparent, holographic, polarized, semi-transparent and any combination thereof.
  • multiple layers are disposed on each side of the substrate with the layer mirroring each other as shown in Figure 5B.
  • the substrate 44 can carry a first upper layer 46a and a second upper layer 46b where the first and the second layer are taken from the group consisting of an insulation layer, buffer, PET, PVC, copolymer, laminate, paint, layer applied using methods such as physical vapor deposition, and any combination thereof.
  • a first lower layer 48a and a second lower layer 48b can be carried by the substrate where the first and the second lower layers are taken from the group consisting of an insulation layer, buffer, PET, PVC, laminate, paint, film, layer applied using methods such as physical vapor deposition, and any combination thereof.
  • the first upper layer 46a can be made from the same material as the first lower layer 48a.
  • the second upper layer 46b can be made from the same material as the second lower layer 48b.
  • An antenna assembly can be disposed in the first upper layer, between the first upper layer and the second upper layer, in the second upper layer, on the second upper layer and any combination thereof.
  • An antenna assembly can be disposed in the first lower layer, between the first lower layer and the second lower layer, in the second lower layer, on the second lower layer, and any combination thereof.
  • the first layer upper layer and the first lower layer need not be adjacent to the substrate.
  • An antenna assembly can be disposed between or included in one of the layers.
  • Filler material 22 can be planer with the substrate prior to the application of one or more layers.
  • the filler material can have a concave or convex edge relative to the substrate that is in the range of -5.00 pm to +5.00 pm.
  • the filler material forms a convex surface 50.
  • the peak of the convex surface can be in the range of 0.00 pm to 10.00 pm relative to the surface 52 of the substrate an in one embedment between 0.00 pm to 5.00 pm.
  • the filler material forms a concave surface 54.
  • the trough of the concave surface can be in the range of 0.00 pm to -10.00 pm relative to the surface 52 of the substrate an in one embedment between 0.00 pm to -5.00 pm.
  • the undesirable discontinuity of the planer transition across the substrate surface and the filler material is reduced or eliminated.
  • a substrate 56 is shown which is used to receive printing, one or more layers and magnetic material.
  • the substrate can have a slot 58 that can be cut into the substrate or manufactured into the substrate when the substrate is created.
  • the depth of the slot can be deeper than the thickness of a traditional magnetic stripe that is made from a sheet of film.
  • the slot can then be filled with a magnetic material that can be added to the slot using additive manufacturing.
  • the magnetic material can include magnetic particles that are included in the material which is applied using additive manufacturing.
  • the magnetic material can include a polymer with magnetic particles mixed in with the polymer so that when the additive manufacturing process is used to apply the magnetic material to the substrate, a magnetic stripe is formed.
  • the additive manufacturing process can include the application of two material to form the substrate with a magnetic stripe or magnetic area.
  • the additive manufacturing process can include a first set of passes where substrate material is added and a first portion 60 of the substrate is created.
  • the additive manufacturing process can be used to create a second portion 62 that can have substrate material 62a and magnetic material 62b deposited on the first portion of the substrate 60.
  • the magnetic material can include magnetic particles configured to allowing recording of information in a range of 25 to 500 bits per inch. There can be one or more stripes placed on the substrate.
  • the substrate, with magnetic material can be coated and painted in one embodiment.
  • a third portion 64 can be manufactured through additive manufacturing that can include adding indicia 66 such as alpha numeric characters, figures, shapes, images, and any combination to the substrate.
  • the additive manufacturing process can cause an account number to be placed on the substrate in raised numbers or the substrate can be created with material absent so that the absence of material causes numbers to appear debossed or imbedded into the substrate.
  • the indicia can be an account number that can be separate din more or more groupings 70a through 70d.
  • the magnetic portion 72 made with additive manufacturing place placing the magnetic material during or after the substrate is made can be on one side of the substrate with the indicia manufactured on the other side of the substrate.
  • the indicia can be a custom image of graphic that is supplied by a user and can allow each card to be customized by the user.
  • the concave or convex surface of the filler material is not perceivable to the human touch and provides for an aesthetic appearance and feeling.
  • the multiple filling and curing steps allow for the filler material to be generally planer with the surface of the substrate an account for expansion and shrinkage of the filler material during the manufacturing process.
  • a plate 74 that can be used for the manufacturer of cards so that the slit 18 is included in the card.
  • the card can be stamped from metal and the antenna configured to be disposed on the slit.
  • the slit can include a central section 75a. In one embodiment, the central section can generally run the length of the substrate.
  • the slit can include a first end 75b that include a first turn 77a and extends generally to a first edge 79a of the substrate.
  • the slit can include a second end 75c that include a second turn 77b and extends generally to a second edge 79b of the substrate.
  • the slit can be in generally an “S” configuration, accordion configuration, spiral configuration including a circular, square, triangular, rectangular, or asymmetric spiral configuration, and any combination.
  • the slit can be position central to the substrate of offset from the center of the substrate.
  • the slit can be continuous with a chip area adapted for receiving a chip.
  • the slit can include lateral walls 76a and 76b.
  • the slit can also include support walls such as 78a and 78b.
  • the angle 0 between the support wall and a horizontal edge 80 of the plate or card can be in the range of 100.0 degrees to 170.0 degrees. In one embodiment, the angle 0 is 135.0 degrees.
  • the distance between the central area of the slit can be of a smaller distance that that of the distance between the lateral walls. For example, if the central distance is C and the distance between the lateral wall is L, C ⁇ L.
  • the slit 18 can be filled with a resin 82.
  • the resin can be a bi-component adhesive that can be epoxy based in on embodiment.
  • the resin can include a component taken from the group consisting of polyamidoamine, amines, polyethylenepoly-, tetraethylenepentamine fraction, 2,4,6-tris (dimethylaminomethyl) phenol, 3-aminopropyltriethoxysilane and any combination thereof.
  • the resin can include polyamidoamine in the range of 25% to 75%.
  • the resin can include amines, polyethylenepoly-, tetraethylenepentamine fraction in the range of 0.5% to 10%.
  • the resin can include 2,4,6-tris (dimethylaminomethyl) phenol in the range of 0.5% to 10%.
  • the resin can include 3-aminopropyltriethoxysilane in the range of 0.5% to 10%.
  • the resin can have a medium viscosity greater than about 50,000 mPa s at room temperature.
  • the resin can include the reaction product of Bisphenol A and epichlorhydrine (having an average molecular weight ⁇ 700) and can be greater than 50% of the resin.
  • the resin can include neodecanoic acid, 2,3-epoxypropyl ester and be in the range of 0.5% to 10% of the resin.
  • the filler material can include the resin and a ferromagnetic material added to the material to provide for a ferromagnetic resin that can be added to the slit.
  • the resin can be applied in one process, allowed to cure, or partially cure and an additional resin applied in a second process. When cured to dry, the resin is flush with the horizontal edge of the card or plate. When painted, the card or plate appears flat and of a single material rather than metal with resin.
  • the slit can include diagonal walls relative to the edges of the card.
  • the walls can have an angel between 50 degrees and 85 degrees relative to a horizontal plane.
  • the resins of binding agent can be injected through an injection port 84 that can include a valve to allow resin of a binding agent to enter the slit. Once a pre-determined volume of resin or binding agent is injected into the slit in the substrate, the valve can be closed.
  • a nonstick layer 86 material such as ceramic, silicone, enamel, polytetrafluoroethylene or other nonstick or hydrophobic material can be placed on the substrate or on a pressure plate. The nonstick layer can be adjacent to one or both side of the substrate.
  • a pressures plate 88 can then apply pressures and/or heat to the side of the substrate configured to cure the resin or binding agent, dissipate excess resin or binding agent across the side of the substrate to provide a smooth surface, smooth the resin or binding agent and any combination.
  • the pressure plate can be included in a manual or hydraulic press and be included in the manufacturing process of a financial card.
  • the substrate and resin or binding agent can be removed from the press and additional layers can be added to the substrate such as a protective layer, paint layer, transparent layer, glass layer, polymer layer, security overlay, metal layer, adhesive, ink layer, printer layer, and any combination.
  • the substrate can include material taken from the group consisting of paint, security overlay, UV print, personalization layer, glass, polymer, metal, adhesive, ink, and any combination.
  • the slit 18 can initially be filled with filler material producing a first fill 90 that which does not completely fill the slit to a top plane 92 parallel to a top face of the substrate defining a top void 94.
  • the filler material of the first fill need not completely fill the slit to a bottom plane 96 parallel to a lower face of the substrate defining a lower void 98.
  • the first fill results in a central fill layer in the substrate.
  • the central fill layer can comprise a difference material than the top fill filler material and the bottom fill filler material.
  • a top fill can be applied to the top void and cured.
  • a bottom fill can be applied to the bottom void and cured.
  • the swelling or the shrinkage of the fill be reduced as the top void and the bottom void as these voids are each of a smaller area than the entire slit itself. If the top filler is not flush with the top plane, the top filler can be planed, sanded, brushed, or otherwise physically modified so that the top filler is flush with the top plane. If the bottom filler is not flush with the bottom plane, the bottom filler can be planed, sanded, brushed, or otherwise physically modified so that the bottom filler is flush with the bottom plane.
  • the first fill, top fill and bottom fill can be of the same or difference material and can be deposited in the slit using additive manufacturing,

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Procédé de fourniture d'une carte sans contact dotée d'un substrat métallique présentant de première et seconde faces, l'une supérieure et l'autre inférieure. Une fente peut être créée dans le substrat métallique, la fente ayant des extrémités s'étendant jusqu'aux bords du substrat. Le procédé consiste à charger la fente au moyen d'un matériau de charge de chargement central, le chargement central délimitant un vide supérieur entre le chargement central et un plan supérieur par rapport à une face supérieure du substrat et le chargement central délimitant un vide inférieur entre le chargement central et un plan inférieur par rapport à une face inférieure du substrat. Le matériau de charge des parties centrale, supérieure et inférieure est durci et raboté pour être aligné sur les surfaces avant et arrière du substrat. Le matériau de charge peut être une résine et la fente peut avoir une configuration, de manière générale, en S, ou une partie d'une configuration en S.
PCT/US2022/011039 2020-12-31 2022-01-03 Procédé de fabrication de cartes de transaction électroniques WO2022147502A1 (fr)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US202063132957P 2020-12-31 2020-12-31
US63/132,957 2020-12-31
US202163138727P 2021-01-18 2021-01-18
US63/138,727 2021-01-18
US202163142652P 2021-01-28 2021-01-28
US63/142,652 2021-01-28
US202163224616P 2021-07-22 2021-07-22
US63/224,616 2021-07-22
US202163236401P 2021-08-24 2021-08-24
US63/236,401 2021-08-24

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5013900A (en) * 1982-12-28 1991-05-07 Gao Gesellschaft Fur Automation Und Organisation Mbh Identification card with integrated circuit
US7116231B2 (en) * 2002-09-13 2006-10-03 Ask S.A. Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
US20120055013A1 (en) * 2010-07-13 2012-03-08 Féinics AmaTech Nominee Limited Forming microstructures and antennas for transponders
JP2018092465A (ja) * 2016-12-06 2018-06-14 凸版印刷株式会社 非接触ｉｃカードおよびその製造方法
US10832116B2 (en) * 2016-04-21 2020-11-10 Soo Hyang KANG Metal contactless smart card and method for fabricating the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5013900A (en) * 1982-12-28 1991-05-07 Gao Gesellschaft Fur Automation Und Organisation Mbh Identification card with integrated circuit
US7116231B2 (en) * 2002-09-13 2006-10-03 Ask S.A. Method of producing a contactless chip card or a contact/contactless hybrid chip card with improved flatness
US20120055013A1 (en) * 2010-07-13 2012-03-08 Féinics AmaTech Nominee Limited Forming microstructures and antennas for transponders
US10832116B2 (en) * 2016-04-21 2020-11-10 Soo Hyang KANG Metal contactless smart card and method for fabricating the same
JP2018092465A (ja) * 2016-12-06 2018-06-14 凸版印刷株式会社 非接触ｉｃカードおよびその製造方法

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