WO2022143960A1 - 光电器件 - Google Patents

光电器件 Download PDF

Info

Publication number
WO2022143960A1
WO2022143960A1 PCT/CN2021/143432 CN2021143432W WO2022143960A1 WO 2022143960 A1 WO2022143960 A1 WO 2022143960A1 CN 2021143432 W CN2021143432 W CN 2021143432W WO 2022143960 A1 WO2022143960 A1 WO 2022143960A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole transport
layer
energy level
quantum dot
valence band
Prior art date
Application number
PCT/CN2021/143432
Other languages
English (en)
French (fr)
Inventor
王天锋
杨一行
Original Assignee
Tcl科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US18/270,575 priority Critical patent/US20240081088A1/en
Application filed by Tcl科技集团股份有限公司 filed Critical Tcl科技集团股份有限公司
Publication of WO2022143960A1 publication Critical patent/WO2022143960A1/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/54—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing zinc or cadmium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/56—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing sulfur
    • C09K11/562—Chalcogenides
    • C09K11/565—Chalcogenides with zinc cadmium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H10K50/166—Electron transporting layers comprising a multilayered structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2101/00—Properties of the organic materials covered by group H10K85/00
    • H10K2101/30—Highest occupied molecular orbital [HOMO], lowest unoccupied molecular orbital [LUMO] or Fermi energy values
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2101/00—Properties of the organic materials covered by group H10K85/00
    • H10K2101/40—Interrelation of parameters between multiple constituent active layers or sublayers, e.g. HOMO values in adjacent layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

Definitions

  • the present application relates to the field of display technology, in particular to an optoelectronic device.
  • QLED Quantum dot light-emitting display technology
  • OLED organic light-emitting display
  • QLED is an active light-emitting technology, so it also has high luminous efficiency, fast response speed, high contrast, Wide viewing angle and other advantages.
  • QLED Due to the excellent material properties of quantum dots in QLED display technology, QLED has performance advantages over OLED in many aspects, such as: the emission of quantum dots is continuously adjustable and the emission width is extremely narrow, which can achieve a wider color gamut and higher Purity display; the inorganic material characteristics of quantum dots make QLED have better device stability; the driving voltage of QLED device is lower than that of OLED, which can achieve higher brightness and reduce energy consumption; at the same time, QLED display technology and printing display production process and The matching technology can realize the high-efficiency mass production preparation of large size, low cost, and rollability. Therefore, QLED is considered to be one of the preferred technologies for next-generation display screens that are thin, portable, flexible, transparent and high-performance in the future.
  • the device structure of QLED is more borrowed from OLED display technology, except that the light-emitting layer material is replaced by organic light-emitting material.
  • other functional layer materials such as charge injection layer or charge transport layer, often use existing materials in OLEDs.
  • the explanation of device physics in QLED devices, the selection and collocation of energy levels of functional layer materials, etc. also follow the existing theoretical system in OLED.
  • the application of the classical device physics conclusions obtained in the research of OLED devices to the QLED device system has indeed significantly improved the performance of QLED devices, especially the efficiency of QLED devices.
  • One of the purposes of the embodiments of the present application is to provide an optoelectronic device, which aims to solve the problem that it is difficult to simultaneously improve the optoelectronic efficiency and lifetime performance of the QLED device in the related art.
  • an optoelectronic device comprising: an anode, a hole transport layer on the anode, a quantum dot light-emitting layer on the hole transport layer, and a cathode on the quantum dot light-emitting layer , the hole transport layer contains at least two hole transport materials, wherein the absolute value of the top energy level of the valence band of at least one hole transport material is less than or equal to 5.3 eV, and the valence band of at least one hole transport material The absolute value of the top energy level is greater than 5.3 eV.
  • the beneficial effect of the optoelectronic device provided by the embodiments of the present application is that the hole transport layer in the optoelectronic device is a mixed material, wherein the top energy level of the valence band of at least one hole transport material is less than or equal to 5.3 eV, and the shell of the conventional quantum dot light-emitting material
  • the layer energy level is often relatively deep (6.0eV or deeper), therefore, an energy level difference greater than or equal to 0.5eV is formed between the hole transport material of the shallow energy level and the quantum dot shell material.
  • the fine control of the hole injection barrier between the hole transport material and the quantum dot shell layer can be achieved.
  • the hole transport material with deep energy levels modulates the hole mobility in the HTL layer. Realize the energy level barrier of ⁇ E EML-HTL greater than or equal to 0.5eV. By increasing the hole injection barrier, the hole injection efficiency is reduced, so as to balance the injection balance of holes and electrons in the light-emitting layer, improve the luminous efficiency of the device, and avoid charge at the same time. The effect of accumulation on device lifetime.
  • FIG. 1 is a schematic structural diagram of the optoelectronic device provided by the first aspect of the present application.
  • FIG. 2 is a schematic structural diagram of the optoelectronic device provided by the second aspect of the present application.
  • FIG. 3 is a schematic structural diagram of the optoelectronic device provided by the third aspect of the present application.
  • FIG. 4 is a schematic structural diagram of the optoelectronic device provided by the fourth aspect of the present application.
  • FIG. 5 is a schematic structural diagram of the optoelectronic device provided by the fifth aspect of the present application.
  • FIG. 6 is a schematic structural diagram of the optoelectronic device provided by the sixth aspect of the present application.
  • FIG. 7 is a schematic structural diagram of the optoelectronic device provided by the seventh aspect of the present application.
  • FIG. 8 is a schematic structural diagram of the optoelectronic device provided by the eighth aspect of the present application.
  • FIG. 9 is a schematic structural diagram of the optoelectronic device provided by the ninth aspect of the present application.
  • FIG. 10 is a schematic structural diagram of the optoelectronic device provided by the tenth aspect of the present application.
  • FIG. 11 is a schematic structural diagram of the optoelectronic device provided by the eleventh aspect of the present application.
  • FIG. 12 is a schematic structural diagram of the optoelectronic device provided by the twelfth aspect of the present application.
  • FIG. 13 is a schematic structural diagram of the optoelectronic device provided by the thirteenth aspect of the present application.
  • FIG. 14 is a schematic diagram of a positive structure of a quantum dot light-emitting diode provided by an embodiment of the present application.
  • 15 is a schematic diagram of an inversion structure of a quantum dot light-emitting diode provided in an embodiment of the present application.
  • 16 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 1 to 7 of the present application;
  • 17 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 8 to 9 of the present application;
  • FIG. 18 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 10 to 11 of the present application;
  • FIG. 19 is a graph showing the relationship between the voltage and time of the quantum dot light-emitting diodes provided in Examples 12 to 14 of the present application;
  • FIG. 20 is a graph showing the relationship between the voltage and time of the quantum dot light-emitting diodes provided in Examples 15 to 19 of the present application;
  • FIG. 21 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 20 to 25 of the present application;
  • FIG. 22 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 26 to 28 of the present application;
  • FIG. 24 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 32 to 35 of the present application;
  • FIG. 25 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 36 to 38 of the present application;
  • FIG. 26 is a graph showing the relationship between voltage and time of the quantum dot light-emitting diodes provided in Examples 39 to 41 of the present application;
  • FIG. 27 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 39 to 41 of the present application;
  • FIG. 28 is a graph showing the relationship between voltage and time of the quantum dot light-emitting diodes provided in Examples 42 to 43 of the present application;
  • FIG. 29 is a test chart of the luminous lifetime of the quantum dot light-emitting diodes provided in Examples 42 to 43 of the present application.
  • At least one means one or more
  • plural items means two or more.
  • At least one item(s) below” or similar expressions thereof refer to any combination of these items, including any combination of single item(s) or plural items(s).
  • at least one (one) of a, b, or c or, “at least one (one) of a, b, and c” can mean: a,b,c,a-b( That is, a and b), a-c, b-c, or a-b-c, where a, b, and c can be single or multiple respectively.
  • ⁇ E HTL-HIL E HOMO,HTL -E HIL
  • ⁇ E EML-HTL E HOMO,EML -E HTL
  • all energy level/work function values are absolute values, and the absolute value of the energy level is large The energy level is deep, and the absolute value of the energy level is small, the energy level is shallow.
  • the key of this application is to simultaneously improve the lifetime and photoelectric efficiency of QLED devices.
  • the time of device efficiency test is usually short, so it characterizes the instantaneous state of the QLED device at the beginning of operation; while the device life characterizes the continuous operation of the device and enters into a stable state The ability to maintain device efficiency after state.
  • the injection rate of electrons into the light-emitting layer is usually faster than that of holes. Therefore, in order to balance and improve the recombination efficiency of holes and electrons in the light-emitting layer of a QLED device, a hole injection layer is usually set in the device, and the injection barrier between two adjacent functional layers is minimized to enhance the hole efficiency. injection efficiency, thereby improving carrier injection efficiency and reducing interfacial charge accumulation.
  • this method can only improve the photoelectric efficiency at the initial instant of the QLED device to a certain extent, but cannot improve the device life at the same time, and even reduces the device life.
  • QLED has some special mechanisms different from the OLED device system.
  • the mechanism is closely related to the performance of QLED devices, especially the device lifetime.
  • this application finds through research that: in the initial working state of the QLED device, the injection rate of electrons in the light-emitting layer is faster than that of holes, resulting in the negative charge of the quantum dot material. Factors such as ligand binding and Coulomb blocking effects are maintained.
  • the negatively charged state of the quantum dot material makes it more and more difficult to inject electrons during the continuous operation of the QLED device, resulting in an imbalance between the actual injection of electrons and holes in the light-emitting layer.
  • the negatively charged state of the quantum dot material also tends to be stable, that is, the electrons newly captured and bound by the quantum dots reach a dynamic balance with the electrons consumed by the radiative transition.
  • the injection rate of electrons into the light-emitting layer is much lower than that in the initial state, and the hole injection rate required to achieve the balance of charge injection in the light-emitting layer is actually relatively low.
  • the hole injection efficiency is still improved based on the theoretical system of traditional OLED devices, the use of deep-level hole transport layers can only form an instantaneous balance of charge injection in the initial stage of QLED device operation, and achieve high device efficiency at the initial instant.
  • the QLED device enters a stable working state, excessive hole injection will aggravate the unbalanced state of electrons and holes in the light-emitting layer of the device, and the efficiency of the QLED device cannot be maintained, and thus decreases. And this charge imbalance will continue to increase as the device continues to work, resulting in a corresponding rapid decline in the life of the QLED device.
  • the key to fine-tuning the carrier injection of holes and electrons on both sides of the device is: on the one hand , regulating the injection rate of holes to a lower rate, so that the injection rate of holes and the injection rate of electrons in the stable working state of the QLED device are balanced, and the recombination efficiency of the QLED device is improved.
  • the hole injection rate required for QLED devices in the actual stable operating state is lower than traditionally expected, carrier accumulation is prone to occur, causing irreversible damage to the device. Therefore, the influence of carrier accumulation on the device life should be avoided as much as possible, and the device life should be improved.
  • a first aspect of an embodiment of the present application provides an optoelectronic device, comprising: an anode, a hole transport layer on the anode, a quantum dot light-emitting layer on the hole transport layer, and a hole transport layer on the hole transport layer.
  • the cathode on the quantum dot light-emitting layer, the quantum dot light-emitting layer includes a quantum dot material with a core-shell structure, and the valence band top energy level difference between the outer shell layer material of the quantum dot material and the hole transport material in the hole transport layer is greater than or equal to 0.5eV .
  • a valence band top energy level difference greater than or equal to 0.5 eV is constructed between the outer shell layer material of the quantum dot material and the hole transport material, that is, E EML-HTL ⁇ 0.5 eV.
  • the hole injection efficiency is reduced by increasing the hole injection barrier, thereby balancing the injection balance of holes and electrons in the light-emitting layer.
  • the present application finds through research that at least an energy level barrier of ⁇ E EML-HTL ⁇ 0.5 eV is required to achieve high hole injection efficiency.
  • the hole injection barrier of ⁇ E EML-HTL ⁇ 0.5eV in the present application will not prevent holes from being injected, because the energy level of the outer shell of the quantum dots will be band-bended in the energized working state, and carriers can pass through.
  • the tunneling effect realizes the injection; thus, although this increase in the energy level barrier will cause a decrease in the carrier injection rate, it will not completely hinder the final injection of carriers.
  • Quantum dot materials are generally composed of groups II-IV, II-VI, II-V, III-V, III-VI, IV-VI, I-III-VI, II-IV-VI of the periodic table of elements.
  • the core-shell structure quantum dot material includes a core and an outer shell.
  • the quantum dot material of the core-shell structure includes an inner core, an outer shell layer, and an intermediate bridge layer between the inner core and the outer shell layer, and the intermediate bridge layer may be one layer or multiple layers.
  • the core material determines the luminescence performance
  • the shell material protects the luminescence stability of the core and facilitates the injection of carriers. Electrons and holes are injected into the core through the shell layer to emit light.
  • the band gap of the inner core is narrower than that of the outer shell, so the energy level difference between the valence band of the hole transport material and the inner core of the quantum dot is smaller than the energy level difference of the valence band of the hole transport material and the outer shell of the quantum dot. Therefore, the ⁇ E EML-HTL of the embodiment of the present application is greater than or equal to 0.5 eV, which can simultaneously ensure the effective injection of hole carriers into the inner core of the quantum dot material.
  • the specific structure and specific material type of the quantum dot material of the core-shell structure in the embodiments of the present application are described in detail in the following embodiments according to different application situations.
  • the valence band top energy level difference between the outer shell layer material of the quantum dot material and the hole transport material in the hole transport layer is 0.5-1.7 eV, that is, the ⁇ E EML-HTL is 0.5 eV-1.7 eV, and the quantum dot material is 0.5-1.7 eV.
  • the energy level barrier in this range constructed between the outer shell material and the hole transport material can be applied to device systems constructed of different hole transport materials and quantum dot materials to optimize the injection of electrons and holes in different device systems. balance.
  • ⁇ E EML-HTL different top valence band energy level differences ⁇ E EML-HTL can be set according to the specific material properties, and the carrier injection rate of holes and electrons on both sides of the light-emitting layer can be finely adjusted to balance the injection of holes and electrons.
  • the valence band top energy level difference between the shell layer material of the quantum dot material and the hole transport material is 0.5eV ⁇ 0.7eV
  • the hole transport material can be TFB, P12, P15
  • the materials are ZnSe, CdS, such as: TFB-ZnSe, P12/P15-CdS and other device systems.
  • the valence band top energy level difference between the shell layer material of the quantum dot material and the hole transport material is 0.7eV ⁇ 1.0eV
  • the hole transport material can be TFB, P09
  • the quantum dot shell material is ZnSe, CdS, such as: P09-ZnSe, TFB-CdS and other device systems.
  • the valence band top energy level difference between the outer shell layer material of the quantum dot material and the hole transport material is 1.0eV ⁇ 1.4eV
  • the hole transport material can be TFB, P09, P13, P14
  • the quantum The point shell materials are CdS, ZnSe, ZnS, such as: TFB-ZnS, P09-CdS, P13/P14-ZnSe and other device systems.
  • the valence band top energy level difference between the shell layer material of the quantum dot material and the hole transport material is greater than 1.4 eV to 1.7 eV, and device systems such as P09-ZnS and P13/P14-ZnS can be used in this case.
  • a hole injection layer in the current device is often used to improve the hole injection efficiency
  • the QLED devices of some embodiments of the present application need to regulate the hole injection rate to a lower rate in a certain way. Therefore, in some specific embodiments, a hole injection layer may not be provided in the optoelectronic device provided in the first aspect of the embodiments of the present application.
  • the setting of the hole injection layer in the QLED device can not only improve the hole injection efficiency, but also adjust the stable and balanced injection of holes, which is one of the key factors affecting the performance and life of the device. Therefore, in the embodiments of the present application, the hole injection efficiency in the device can also be controlled by arranging a hole injection layer in the device, and the influence of charge accumulation on the life of the device can be reduced. specifically:
  • the voltage rise of the QLED device caused at this time is significantly different from the voltage rise caused by the charge accumulation at the EML interface as follows: the interface between the HIL and the HTL generates an electric field due to the charge accumulation, and the damage caused is usually irreversible, and the damage This can happen all the time as the device continues to be energized, i.e. it will continue to deteriorate; while the charge accumulation at the EML interface is reversible and will reach a certain degree of saturation. Therefore, the interfacial charge accumulation between HIL and HTL has a greater impact on the performance of the device, such as lifetime.
  • the embodiments of the present application optimize the injection and recombination efficiency of carriers in the QLED device.
  • an optoelectronic device is provided on the basis of the embodiments of the first aspect or independently.
  • the optoelectronic device includes a first hole injection layer, and the first hole injection layer is located in the Between the anode layer and the hole transport layer, the absolute value of the difference between the top energy level of the valence band of the hole transport layer material and the work function of the first hole injection material in the first hole injection layer is less than or equal to 0.2 eV.
  • the energy level barrier of hole injection between HTL and HIL can be significantly reduced, and the injection efficiency of holes from the anode can be improved, It is conducive to the effective injection of holes from HIL to HTL, eliminating potential barriers and interface charges, reducing the overall resistance of the device, thereby reducing irreversible damage caused by charge accumulation at the interface between HIL and HTL, reducing device driving voltage and improving device life. .
  • the absolute value of the difference between the valence band top energy level of the hole transport layer material and the work function of the first hole injection material is 0 eV.
  • in the examples of the present application is 0. At this time, the effective injection effect of holes from HIL to HTL is good, the potential barrier and interface charges are eliminated, and the overall resistance of the device is reduced, thereby reducing the driving voltage of the device and improving the life of the device. .
  • the absolute value of the work function of the first hole injection material is 5.3 eV ⁇ 5.6 eV
  • the absolute value of the valence band energy level of the hole injection material with the work function size is compared with that of the conventional hole transport material. Close to (about 5.4eV), it is beneficial to control
  • HIL and HTL materials with suitable energy levels, so that
  • the mobility of the hole transport material is higher than 1 ⁇ 10 ⁇ 4 cm 2 /Vs.
  • the examples of the present application use hole transport materials with a mobility higher than 1 ⁇ 10 -4 cm 2 /Vs.
  • the inventors have found through numerous experiments that the use of hole transport materials with the above mobility can improve the hole transport and migration effect and prevent the Charge accumulation, eliminate interface charge, better reduce device driving voltage and improve device life.
  • a third aspect of the embodiments of the present application provides an optoelectronic device based on the first aspect or independently, comprising a second hole injection layer, and the second hole injection layer is located in the anode layer and the hole transport layer, the difference between the valence band top energy level of the hole transport layer material in the hole transport layer and the work function difference of the second hole injection material in the second hole injection layer is less than -0.2 eV.
  • the anode direction is increased.
  • the hole injection barrier of the HIL reduces the overall rate of hole injection in the QLED device and effectively controls the number of holes entering the QLED device. On the one hand, it effectively reduces the rate of hole injection into the light-emitting layer, balances the hole-electron injection rate in the light-emitting layer, and improves the carrier recombination efficiency; on the other hand, it can avoid excessive hole injection in HTL and HIL.
  • Charge accumulation is formed at the interface to prevent irreversible damage to the life of the device caused by the charge accumulation at the interface.
  • a hole blocking barrier from HTL to HIL is formed, which prevents holes from diffusing to the HIL layer, improves the utilization rate of holes, and ensures the effective "survival" of holes before being injected into the light-emitting layer.
  • the holes injected in the device are fully and effectively utilized, the luminous efficiency of the device is guaranteed, and the device efficiency and service life are improved at the same time.
  • the quantum dot material of the core-shell structure contained in the quantum dot light-emitting layer of the optoelectronic device has a valence band top energy level difference between the outer shell layer material and the hole transport material greater than 0 eV, that is, ⁇ E EML-HTL >0,
  • the energy level of the light-emitting layer is deeper than that of the hole transport layer; at the same time, there is an injection barrier less than -0.2eV between the hole transport layer material and the second hole injection material, that is, ⁇ E HTL-HIL ⁇ -0.2eV, the hole
  • the energy level of the injection layer is deeper than that of the hole transport layer.
  • a "deep-shallow-deep” energy level structure is formed between the light-emitting layer, the hole transport layer and the hole injection layer, so that the holes injected into the hole transport layer form a hole carrier well.
  • the accumulated holes are effectively "stored” without diffusing to other functional layers or interfaces other than the HTL layer. And eliminate the influence of interface charge on the device, on the basis of ensuring the balance of carrier injection in the stable working state of the device, more fully and effectively use the holes injected in the device, ensure the luminous efficiency of the device, and realize the efficiency and life of the device. Simultaneously increase.
  • the valence band top energy level difference between the outer shell layer material of the quantum dot material and the hole transport material is greater than or equal to 0.5 eV; in some other specific embodiments, the outer shell layer material of the quantum dot material and the hole transport material
  • the energy level difference at the top of the valence band can also be 0.5eV ⁇ 1.7eV, that is, ⁇ E EML-HTL is 0.5eV ⁇ 1.7eV. It has been verified by experiments that the hole carrier trap formed by the above embodiment has a good effect. In the actual application process The injection balance of holes and electrons in the light-emitting layer of the device can be controlled more precisely through the hole carrier trap, thereby improving the carrier recombination efficiency.
  • the difference between the valence band top energy level of the hole transport layer material and the work function of the second hole injection material is -0.9eV ⁇ -0.2eV, and the difference between ⁇ E HTL-HIL is -0.9eV ⁇ - 0.2eV, in this range, the injection and transport of holes have a good balance effect. If it is lower than -0.9eV, the hole injection resistance will increase, resulting in a decrease in the amount of hole injection, which affects the balanced injection and effective recombination of holes and electrons in the light-emitting layer; Accumulation is formed, and the utilization rate is not high.
  • the absolute value of the work function of the second hole injection material is 5.4 eV ⁇ 5.8 eV.
  • the absolute value of the work function of the second hole injection material in the embodiment of the present application is 5.4 eV to 5.8 eV, which is favorable for forming a hole blocking barrier with an energy range of less than -0.2 eV with the hole transport material.
  • the absolute value of the valence band of the conventional hole transport material is about 5.3-5.4 eV
  • the second hole injection material with the absolute value of the work function greater than or equal to 5.4 eV can form a negative energy less than -0.2 eV with the conventional hole transport material level difference, thereby forming a hole blocking barrier, optimizing the hole injection rate, and improving the hole utilization rate.
  • the mobility of the hole transport material is higher than 1 ⁇ 10 -4 cm 2 /Vs
  • the embodiment of the present application adopts a hole transport material with a mobility higher than 1 ⁇ 10 -4 cm 2 /Vs to ensure that The transport and migration effect of holes prevents charge accumulation, eliminates interface charges, and better reduces device driving voltage and improves device life.
  • the hole injection material is selected from a metal oxide material. That is, in some embodiments, when the optoelectronic device includes a first hole injection layer, the first hole injection material in the first hole injection layer is selected from metal oxide materials. In other specific embodiments, when the optoelectronic device includes a second hole injection layer, the second hole injection material in the second hole injection layer is selected from metal oxide materials.
  • the metal oxide material used as the hole injection material has better stability and is not acidic, which not only meets the requirements for hole injection in the above embodiments, but also does not affect adjacent holes.
  • the functional layer has a negative impact. The decay of the life of the device caused by the thermal effect or the electrical effect damage of the organic hole injection material during the working process of the device is avoided, and the damage to the adjacent functional layer due to the acidity of the organic hole injection material is avoided.
  • the metal oxide material includes: at least one metal nanomaterial selected from tungsten oxide, molybdenum oxide, vanadium oxide, nickel oxide, and copper oxide, and these metal nanomaterials have good stability and are not acidic,
  • the size of the work function can be adjusted to achieve the construction of energy level barriers of different sizes with the hole transport layer, which is beneficial to control hole injection and transport, improve the carrier recombination efficiency, and reduce the effect of charge accumulation on the life of the device. Impact.
  • the particle size of the metal oxide material is 2 to 10 nm, and the metal oxide material with a small particle size is conducive to depositing a thin film with a dense film layer and a uniform thickness, which improves the bonding tightness with the adjacent functional layer. , reducing the interface resistance, which is beneficial to improve the device performance.
  • the hole injection material can also be poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid (PEDOT:PSS), HIL2, HIL1-1, HIL1-2, copper phthalocyanine (CuPc), 2,3,5,6-tetrafluoro-7,7',8,8'-tetracyanoquinone-dimethane (F4-TCNQ), 2,3,6,7,10,11-hexa Organic hole injection materials such as cyano-1,4,5,8,9,12-hexaazatriphenylene (HATCN).
  • PEDOT:PSS poly(3,4-ethylenedioxythiophene)-polystyrenesulfonic acid
  • HIL2 HIL1-1, HIL1-2
  • CuPc copper phthalocyanine
  • F4-TCNQ 2,3,5,6-tetrafluoro-7,7',8,8'-tetracyanoquinone-dimethane
  • HTCN 2,3,6,7
  • PEDOT:PSS contains the structural formula: The organic molecule of , its work function is -5.1eV; HIL2 contains the structural formula: The organic molecule of , its work function is -5.6eV; HIL1-1 and HIL1-2 both contain the structural formula: The work function of HIL1-1 is -5.4 eV and the work function of HIL1-2 is -5.3 eV.
  • the thickness of the first hole injection layer is 10-150 nm. In other embodiments, the thickness of the second hole injection layer is 10-150 nm.
  • the thickness of the hole injection layer of the present application can be flexibly adjusted according to actual application requirements, and at the same time, the hole injection rate can be better adjusted by adjusting the thickness of the hole injection layer.
  • a fourth aspect of the embodiment of the present application provides an optoelectronic device, the hole transport layer of the optoelectronic device contains at least two kinds of hole transport materials, wherein the valence band of at least one hole transport material is The absolute value of the top energy level is less than or equal to 5.3 eV.
  • the above-mentioned at least two hole transport materials include at least one hole transport material whose absolute value of the top energy level of the valence band is less than or equal to 5.3 eV and one type of hole transport material whose absolute value of the top energy level of the valence band is greater than 5.3 eV hole transport material.
  • the hole transport layer of the optoelectronic device provided in the fourth aspect of the present application is a mixed material layer comprising a plurality of hole transport materials with different valence band top energy levels, wherein the valence band top energy level of at least one hole transport material is less than or equal to 5.3 eV, while the shell energy level of conventional quantum dot light-emitting materials is often relatively deep (6.0 eV or deeper), therefore, an energy level difference greater than or equal to 0.5 eV is formed between the hole transport material with shallow energy level and the quantum dot shell material.
  • the included hole transport material whose absolute value of the top energy level of the valence band is greater than 5.3 eV can control the energy level difference between the hole transport material and the outer shell layer of the light emitting material in a small and fine manner. Therefore, in the hole transport layer, the hole transport material with an absolute value less than or equal to 5.3eV and a deep level hole transport material with an absolute value greater than 5.3eV can be matched with each other to realize the interaction between the hole transport material and the quantum hole transport material.
  • the fine tuning of the hole injection barrier between the dot shell layers can also be used to tune the hole mobility in the HTL layer through hole transport materials with different energy levels. Realize the energy level barrier of ⁇ E EML-HTL greater than or equal to 0.5eV.
  • the hole transport layer of the optoelectronic device contains at least two kinds of hole transport materials, wherein the absolute value of the valence band top energy level of one hole transport material is less than or equal to 5.3 eV, and also includes the valence band top The absolute value of the energy level is greater than 5.3 eV and less than 5.8 eV for hole transport materials.
  • the hole transport layer includes at least two hole transport materials, and the absolute value of the top energy level of the valence band of one hole transport material is less than or equal to 5.3 eV, and also includes the absolute value of the top energy level of the valence band. A hole transport material greater than or equal to 5.8eV.
  • the hole transport layer includes at least three hole transport materials, and the absolute value of the top energy level of the valence band of one hole transport material is less than or equal to 5.3 eV, and also includes the top energy level of the valence band.
  • the hole injection barrier can be flexibly adjusted according to practical application requirements, device systems and other factors, so that the injection energy level barrier of holes to the light-emitting material is greater than or equal to 0.5eV, reducing the injection efficiency of holes, so as to balance the injection balance of holes and electrons in the light-emitting layer, and the application is flexible and convenient.
  • the electron transport layer of the optoelectronic device may use a metal such as an organic electron transport material layer and ZnO nanoparticles. At least one of an oxide nanoparticle layer, a sputter deposited metal oxide layer.
  • the hole transport layer when the hole transport layer includes at least one hole transport material with a valence band top energy level of less than or equal to 5.3 eV and a valence band top energy level greater than 5.3 eV and less than 5.8 eV, the hole transport The layer has a relatively moderate top energy level of the valence band and hole mobility, so it can be well matched with conventional metal oxides such as ZnO or organic electron transport materials, which is beneficial to the regulation of the charge balance between holes and electrons.
  • metal oxide nanoparticles can be used in the electron transport layer of the optoelectronic device, and the surface groups are selected to be less connected. of metal oxide nanoparticles.
  • the hole transport layer includes a hole transport material whose valence band top energy level is greater than 5.8 eV, the energy level and mobility are both the same as the valence band top energy level of the aforementioned hole transport material.
  • the hole transport layer materials with a shallow valence band top energy level of less than or equal to 5.3eV have great differences, and continuous regulation in a large window range can be achieved through different mixing ratios, which is suitable for devices from the initial state to continuous operation to QLED device systems with more variable electron injection and transport changes during steady state, such as metal oxide nanoparticles with fewer surface groups attached.
  • the hole transport layer is a mixed material layer comprising hole transport materials of different energy levels, wherein the mass percentage of the hole transport materials with the absolute value of the top energy level of the valence band less than or equal to 5.3 eV is 30%. ⁇ 90%; this percentage of the shallow-level hole transport material can easily form a hole injection barrier greater than or equal to 0.5 eV with the shell layer of the light-emitting material. In practical applications, it can be flexibly adjusted according to the depth of the material energy level. The mixing ratio of materials of different energy levels. In some specific embodiments, when the absolute value of the top energy level of the valence band is less than or equal to 5.3 eV, the mass percentage content of the hole transport material is 50-60%, which has a good effect.
  • the hole transport layer is a mixed material layer comprising hole transport materials of different energy levels, wherein the mobility of at least one hole transport material is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs, the present application
  • the high mobility of the hole transport material of the embodiment ensures the transport and mobility of holes, and reduces the accumulation of holes at the interface, which affects the performance of the device.
  • the top energy level of the valence band of the hole transport layer material with high hole mobility is relatively shallow, which also ensures the formation of a suitable energy range with the quantum dot shell material.
  • the hole transport layer is a mixed material layer comprising hole transport materials of different energy levels, wherein the mobility of at least one hole transport material is higher than 1 ⁇ 10 ⁇ 2 cm 2 /Vs. In other specific embodiments, the hole transport layer is a mixed material layer comprising hole transport materials of different energy levels, wherein the mobility of each hole transport material is higher than 1 ⁇ 10 -3 cm 2 /Vs .
  • the above-mentioned embodiments of the present application optimize the mobility of hole transport materials, ensure the hole transport efficiency, avoid charge accumulation affecting device performance, and ensure the combination of deep and shallow hole transport materials in the hole transport layer.
  • the injection barrier of the hole ensures the formation of an energy level barrier with ⁇ E EML-HTL greater than or equal to 0.5eV, and optimizes the injection balance and recombination efficiency of carriers in the QLED device.
  • a fifth aspect of the embodiment of the present application provides an optoelectronic device, wherein the hole transport layer of the optoelectronic device contains at least two kinds of hole transport materials, and the top energy level of the valence band of each hole transport material is The absolute value of is less than or equal to 5.3eV.
  • the hole transport layer of the optoelectronic device provided in the fifth aspect of the present application is a mixed material layer comprising a plurality of hole transport materials with different valence band top energy levels, wherein the valence band top energy level of each hole transport material is less than It is equal to 5.3eV, which can form an energy level difference of 0.5eV or more with the quantum dot light-emitting material with a deeper shell energy level.
  • the device ⁇ E EML-HTL ⁇ 0.5 eV. Therefore, after the QLED device enters a stable working state, the charge injection balance and the device efficiency are maintained, and the device life is optimized.
  • the hole mobility of the mixed hole transport layer can also be finely regulated by different mixing ratios by using the different hole mobilities of the hole transport layer materials that are also all of the hole transport layer materials with shallow valence band top energy levels.
  • the hole transport layer comprises a mixed material layer of hole transport materials of different energy levels, wherein the mass percentage of each hole transport material is 5-95%, and the mass percentage of each hole transport material is 5-95%. Mixing and matching of hole transport materials with different ratios has a good control effect on the hole mobility and injection barrier of the mixed hole transport layer.
  • the hole transport layer comprises a mixed material layer of hole transport materials of different energy levels, wherein at least one hole transport material has a mobility higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs, high hole transport
  • the high-efficiency hole transport layer material has a relatively shallow top energy level in the valence band.
  • the mobility of the hole transport material is limited, and the high mobility ensures the transport and mobility of holes, and at the same time ensures the formation of a more suitable injection barrier, so as to avoid the accumulation of holes at the interface and affect the device performance.
  • the mobility of at least one hole transport material in the hole transport layer is higher than 1 ⁇ 10 ⁇ 2 cm 2 /Vs.
  • the mobility of each hole transport material in the hole transport layer is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs.
  • the top energy level of the valence band of the hole transport material in the hole transport layer is all less than or equal to 5.3 eV
  • surface-passivated metal oxide nanoparticles are used in the electron transport layer of the optoelectronic device, and the surface is selected to be sufficiently modified and passivated. of metal oxide nanoparticles.
  • the top energy level of the valence band of the hole transport material in the hole transport layer is all less than or equal to 5.3 eV
  • the hole transport material is at least one selected from the group consisting of polymers containing aniline groups and copolymers containing fluorene groups and aniline groups, and these hole transport materials have holes It has the advantages of high transmission efficiency, good stability and easy access.
  • hole transport materials with suitable energy level and mobility can be selected according to the actual application requirements, specifically:
  • a hole transport material with an absolute value of valence band top energy level less than or equal to 5.3 eV can be selected: At least one of P09 and P13. Among them, the structural formula of P13 is: The structural formula of P09 is:
  • the transmission material includes: at least one of TFB, poly-TPD, and P11.
  • the structural formula of P11 is:
  • the structural formula of poly-TPD is:
  • the structural formula of TFB is:
  • the hole transport material with an absolute value of valence band top energy level greater than or equal to 5.8 eV includes: At least one of P15 and P12. Among them, the structural formula of P12 is: The structural formula of P15 is:
  • the mobility of the hole transport material is higher than 1 ⁇ 10 -4 cm 2 /Vs, and the high mobility ensures the transport and mobility of holes and reduces the effect of charge accumulation on the device lifetime.
  • the quantum dot material of the core-shell structure includes the outer shell layer, the inner core, and an intermediate shell layer located between the inner core and the outer shell layer; wherein, the top energy level of the valence band of the core material is shallower than that of the outer shell.
  • the valence band top energy level of the layer material; the valence band top energy level of the intermediate shell layer material is between the valence band top energy level of the core material and the valence band top energy level of the shell layer material.
  • the core material affects the luminescence performance
  • the shell material protects the luminescence stability of the core and facilitates carrier injection
  • the valence band is between the core and the shell layer.
  • plays an intermediate transition role which is conducive to carrier injection.
  • the intermediate shell layer can form a stepped energy level transition from the inner core to the outer shell layer in energy level, which is helpful to achieve effective carrier injection, effective confinement and Reduced flickering at lattice interfaces.
  • the outer shell layer of the quantum dot material includes: an alloy material formed by at least one or at least two of CdS, ZnSe, ZnTe, ZnS, ZnSeS, CdZnS, and PbS.
  • These shell layer materials not only protect the luminescence stability of the core and facilitate the injection of carriers into the quantum dot core for luminescence, but also form an energy level barrier with ⁇ E EML-HTL greater than or equal to 0.5eV with the HTL layer material.
  • the barrier can reduce the injection efficiency of holes, so as to balance the injection balance of holes and electrons in the light-emitting layer, improve the luminous efficiency of the device, and reduce the influence of charge accumulation on the life of the device.
  • the inner core of the quantum dot material includes: at least one of CdSe, CdZnSe, CdZnS, CdSeS, CdZnSeS, InP, InGaP, GaN, GaP, ZnSe, ZnTe, ZnTeSe.
  • the luminescent properties of quantum dot materials are related to the core materials. These materials ensure that QLED devices can emit light in the visible light range of 400-700 nm, which not only meets the range required for the application of optoelectronic display devices, but also the beneficial effects achieved by the energy level relationship of these materials can be achieved. better reflect.
  • the intermediate shell material is selected from at least one of CdZnSe, ZnSe, CdZnS, CdZnSeS, CdS, CdSeS.
  • the intermediate shell layer is selected to form a continuous natural transition from the inner core to the outer layer in the composition, which helps to achieve the least crystallinity among the inner core, the intermediate shell and the outer shell. Lattice mismatch and minimum lattice defects, so as to achieve the optimal luminescence performance of the core-shell quantum dot material itself.
  • the emission peak wavelength range of the quantum dot material is 400-700 nm. On the one hand, this wavelength range is required for the application of optoelectronic display devices; The beneficial effect can be better reflected.
  • the thickness of the outer shell layer of the quantum dot material is 0.2-6.0 nm, which covers the thickness of the conventional outer shell and can be widely used in QLED devices of different systems. If the thickness of the outer shell layer is too large, the rate at which carriers are injected into the light-emitting quantum dots through the tunneling effect will decrease; and if the thickness of the outer shell layer is too small, the outer shell material cannot sufficiently protect and passivate the core material. , which affects the luminescence and stability properties of quantum dot materials.
  • the optoelectronic device further includes an electron transport layer
  • the electron transport material in the electron transport layer is selected from at least one of metal oxo compound transport materials and organic transport materials.
  • metal oxide materials generally have high electron mobility, and can be prepared into thin films in QLED devices by solution method or vacuum sputtering method.
  • Organic electron transport layer materials can achieve energy level regulation in a wide range, and can be prepared into thin films in QLED devices by vacuum evaporation or solution methods; solution methods include inkjet printing, spin coating, jet printing , slot coating or screen printing, etc. More suitable electron transport materials can be flexibly selected according to actual application requirements.
  • the metal oxide transport material is selected from at least one of zinc oxide, titanium oxide, zinc sulfide, cadmium sulfide. These metal oxo compound transport materials used in the above embodiments of the present application all have high electron transfer efficiency. In some embodiments, in order to improve electron transfer efficiency, the metal oxo compound transport material is selected from at least one of zinc oxide, titanium oxide, zinc sulfide, and cadmium sulfide doped with metal elements, wherein the metal elements include aluminum, At least one of magnesium, lithium, lanthanum, yttrium, manganese, gallium, iron, chromium, and cobalt, these metal elements can improve the electron transfer efficiency of the material.
  • the particle size of the metal oxo compound transport material is less than or equal to 10 nm.
  • the metal oxy compound transport material with small particle size is more conducive to the deposition of electron transport layer films with dense film layers and uniform thickness. The tightness of its bonding with the adjacent functional layers reduces the interface resistance and is more conducive to improving the performance of the device.
  • the metal oxide compound transport material with small particle size has a wider band gap, which reduces the quenching of the exciton emission of the quantum dot material and improves the device efficiency.
  • the electron mobility of the metal oxo compound transport material is 10 -2 to 10 -3 cm 2 /Vs, and the electron transport material with high mobility can reduce the accumulation of charges in the interface layer, improve electron injection, compound efficiency.
  • the electron mobility of the organic transport material is not less than 10 ⁇ 4 cm 2 /Vs.
  • the organic transport material is selected from the group consisting of 8-quinolinolato-lithium (Alq 3 ), aluminum octaquinolate, fullerene derivatives PCBM, 3,5-bis(4-tert-butylphenyl) - At least one of 4-phenyl-4H-1,2,4-triazole (BPT), 1,3,5-tris(1-phenyl-1H-benzimidazol-2-yl)benzene (TPBi) A sort of.
  • These organic transport materials can realize energy level regulation in a wide range, which is more conducive to regulating the energy levels of each functional layer of the device and improving the stability and photoelectric conversion efficiency of the device.
  • the electron transport layer is a laminated composite structure, which includes at least two sub-electron transport layers.
  • the electron transport layer can be regulated more flexibly to better optimize device performance.
  • the material of at least one sub-electron transport layer is a metal oxo compound transport material.
  • all sub-electron transport layers are metal oxides, and the metal oxide materials of different sub-electron transport layers may be the same or different. That is, in the multilayer electron transport layer in which all the sub-electron transport layers are metal oxides, there may be a sub-electron transport layer comprising at least one layer of metal oxide nanoparticles and at least one layer of non-nanoparticle type metal oxides. Sub electron transport layer.
  • the sub-electron transport layers can be doped and intrinsic metal oxides (eg, Mg-doped ZnO + intrinsic ZnO), respectively. It can also be that the sub-electron transport layers are all of the same metal oxide nanoparticles. When the sub-electron transport layers are all of the same metal oxide nanoparticle, the electron mobilities of different sub-electron transport layers may be the same or different.
  • the material of at least one sub-electron transport layer is an organic transport material. In some embodiments, in the electron transport layer, the material of at least one sub-electron transport layer is a metal oxo compound transport material, the material of at least one sub-electron transport layer is an organic transport material, and the metal oxide of different sub-electron transport layers
  • the metal oxide materials can be the same or different; the metal oxide materials are selected as nanoparticles of the corresponding metal oxide.
  • the electron transport layer has both high electron mobility and flexibility of energy level matching through the co-coordination of the metal oxo compound transport material and the organic transport material in the electron transport layer.
  • the electron transport layer comprising multiple sub-electron transport layers may be a combination of ZnO nanoparticles + NaF, a combination of Mg-doped ZnO nanoparticles + NaF, and other stacked composite structures.
  • the core material affects the luminescence properties of the quantum dot material
  • the shell material plays a protective role and is conducive to carrier injection.
  • the thickness of the shell layer and the top energy level of the valence band of the hole transport material can be adjusted so that the difference in the top energy level of the valence band between the shell layer material of the quantum dot material and the hole transport material is greater than or equal to 0.5 eV, that is, to construct the expected injection barrier, E EML-HTL ⁇ 0.5 eV, optimize the balance of electron and hole injection efficiency in the light-emitting layer, and improve the device efficiency and service life.
  • a sixth aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, the quantum dot light-emitting layer includes a quantum dot material with a core-shell structure, and the quantum dot material has a core-shell structure.
  • the outer shell layer is ZnSe, and the absolute value of the top energy level of the valence band of the hole transport material in the hole transport layer is less than or equal to 5.4 eV.
  • the structure of the optoelectronic device is designed according to characteristics such as the energy level of ZnSe. Specifically, since the valence band energy level of the ZnSe shell material is relatively shallow (the absolute value of the energy level is small), to construct a hole injection barrier with a valence band top energy level difference ( ⁇ E EML-HTL ) greater than or equal to 0.5 eV, then The absolute value of the top energy level of the valence band of the hole transport material should be less than or equal to 5.4 eV.
  • a hole injection barrier is constructed, which reduces the hole injection rate, balances the injection efficiency of electron holes in the light-emitting layer, reduces the accumulation of carriers, and improves the luminous efficiency.
  • the thickness of the ZnSe shell layer is 2-5 nm. Due to the relatively narrow band gap of ZnSe in the embodiments of the present application, the binding ability of excitons in the quantum dot core is relatively poor.
  • the thickness of the outer shell layer is selected to be 2.0 to 5.0 nanometers. If the thickness of the outer shell layer is too large, the rate at which carriers are injected into the luminescent quantum dots through the tunneling effect will decrease; while the thickness of the outer shell layer is too small, the rate at which carriers are injected into the luminescent quantum dots through the tunneling effect will decrease. However, when the thickness of the outer shell layer is small to a certain extent, the outer shell layer structure will not be able to sufficiently protect and passivate the inner core, thereby affecting the luminescence performance and stability of the quantum dot material.
  • the emission peak wavelength of the quantum dot material is 510-640 nm.
  • the quantum dot light-emitting material should be a red or green quantum dot with a light-emitting peak wavelength range of 510-640 nanometers, so as to better ensure the light-emitting efficiency of the quantum dot.
  • the valence band top energy level difference between the ZnSe material and the hole transport material is 0.5-1.0 eV.
  • the energy level difference ( ⁇ E EML-HTL ) can be selected between 0.5 and 1.0 eV. If the ⁇ E EML-HTL is too large, the efficiency of hole injection into the luminescent core of the quantum dot will be reduced, and the luminous efficiency of the quantum dot material will be affected.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9 eV to 5.4 eV, within this range, a more suitable hole injection barrier can be constructed with the ZnSe shell material, and the load in the light-emitting layer can be optimized. Carrier injection and recombination efficiency.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9 eV to 5.4 eV, and at this time, the difference between the top energy levels of the valence band of the ZnSe material and the hole transport material is 0.5 to 1.0 eV.
  • the mobility of the hole transport material is higher than 1 ⁇ 10 -3 cm 2 /Vs. Since the absolute value of the top energy level of the valence band of the hole transport material used in the embodiments of the present application is less than or equal to 5.4 eV, Shallow energy level, the hole transport layer material with the shallower valence band top energy level usually has higher hole mobility, which is conducive to the efficient hole transport of holes in a certain thickness of the hole transport layer film, reducing the efficiency of the hole transport layer. The overall resistance of the device is reduced, thereby reducing the driving voltage of the device and improving the life of the device.
  • a seventh aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, the quantum dot light-emitting layer includes a quantum dot material with a core-shell structure, and the quantum dot material has a core-shell structure.
  • the outer shell layer is ZnS, and the absolute value of the top energy level of the valence band of the hole transport material in the hole transport layer is less than or equal to 6.0 eV.
  • the structure of the optoelectronic device is designed according to characteristics such as the energy level of ZnS. Specifically, the valence band energy level of the ZnS shell material is deeper (relative to ZnSe, the absolute value of the energy level is larger), to construct a valence band top energy level difference ( ⁇ E EML-HTL ) greater than or equal to 0.5eV, the hole transport The top energy level of the valence band of the material may be less than or equal to 6.0 eV.
  • a hole injection barrier is constructed, which reduces the hole injection rate, balances the injection efficiency of electron holes in the light-emitting layer, reduces the accumulation of carriers, and improves the luminous efficiency.
  • the thickness of the ZnS shell is 0.2-2.0 nm. Due to the wide band gap of ZnS in the embodiment of the present application, the binding ability of excitons in the core of the quantum dot is relatively strong. Therefore, the thin ZnS shell layer thickness can basically ensure the good luminous efficiency of the quantum dot light-emitting material itself, and the shell layer The thickness is 0.2 to 2.0 nanometers. At the same time, the thin ZnS shell can also effectively reduce the overall resistance of the device, reduce the driving voltage of the device, and improve the performance of the device.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9 eV to 6.0 eV, within this range, a more suitable hole injection barrier can be constructed with the ZnS shell material, and the load in the light-emitting layer can be optimized. Carrier injection and recombination efficiency. In some embodiments, the absolute value of the valence band top energy level of the hole transport material is 4.9 eV to 5.5 eV.
  • the valence band top energy level difference between the ZnS material and the hole transport material is 1.0-1.6 eV.
  • the rate at which carriers are injected into the light-emitting quantum dots through the tunneling effect becomes stronger. Therefore, the corresponding hole transport layer material and the quantum dot shell layer in the quantum dot light-emitting layer are
  • the valence band top energy level difference ( ⁇ E EML-HTL ) of the material needs to be appropriately increased to better balance the injection balance of holes and electrons, and its range should be between 1.0-1.6 eV. If the ⁇ E EML-HTL should not be too large, the efficiency of hole injection into the luminescent core of the quantum dot will be reduced, and the luminous efficiency of the quantum dot material will be affected.
  • the emission peak wavelength of the quantum dot material is 400-700 nm. Due to the wide band gap of ZnS, the embodiment of the present application has a strong binding ability for excitons in the quantum dot core, which can effectively ensure the luminous efficiency of the quantum dot material itself. All quantum dot materials have a wide range of applications.
  • the hole mobility is relatively low, and the mobility of the hole transport material is higher than 1 ⁇ 10 -4 cm 2 /Vs. In some embodiments, the mobility of the hole transport material is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs.
  • an eighth aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, the quantum dot light-emitting layer includes a quantum dot material with a core-shell structure, and the quantum dot material has a core-shell structure.
  • the outer shell layer is CdZnS, and the absolute value of the top energy level of the valence band of the hole transport material in the hole transport layer is less than or equal to 5.9 eV.
  • the structure of the optoelectronic device is designed according to characteristics such as the energy level of CdZnS.
  • CdZnS is used as the outer shell layer of the quantum dot in this embodiment, and the valence band energy level is between ZnSe and ZnS, it is necessary to construct a hole injection potential with a valence band top energy level difference ( ⁇ EEML-HTL) greater than or equal to 0.5eV. barrier, the top energy level of the valence band of the hole transport material needs to be less than or equal to 5.9 eV.
  • the hole injection rate is reduced, the injection efficiency of electron holes in the light-emitting layer is balanced, the accumulation of carriers is reduced, and the light-emitting efficiency is improved.
  • the thickness of the CdZnS shell is 0.5 to 3.0 nm. Since the band gap of CdZnS is between ZnSe and ZnS, when the thickness of the shell is 0.5 to 3.0 nm, the excitons in the core of the quantum dot can be protected at the same time. binding ability, and the good luminous efficiency of the quantum dot luminescent material itself.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9-5.9 eV, within this range, a more suitable hole injection barrier can be constructed with the CdZnS shell material, and the current carrying in the light-emitting layer can be optimized. Sub-injection and recombination efficiency. In some embodiments, the absolute value of the valence band top energy level of the hole transport material is 4.9-5.5 eV.
  • the valence band top energy level difference between the CdZnS material and the hole transport material is 0.8-1.4 eV.
  • the valence band top energy level difference ( ⁇ E EML-HTL ) of the hole transport layer material in the embodiment of the present application and the quantum dot shell layer material in the quantum dot light-emitting layer ranges from 0.8 to 1.4 eV, which can ensure that carriers are injected through the tunneling effect To the efficiency of the luminescent quantum dots, it can better balance the injection efficiency of holes and electrons. If the ⁇ E EML-HTL is too large, the efficiency of carrier injection into the core of the light-emitting quantum dots through the tunneling effect is reduced; if the ⁇ E EML-HTL is too small, the injection rate of holes is poorly adjusted.
  • the emission peak wavelength of the quantum dot material is 400-700 nm. Since CdZnS has relatively strong binding ability to excitons in the quantum dot core, the embodiment of the present application can effectively ensure the luminous efficiency of the quantum dot material itself, and is suitable for all quantum dot materials in the visible light region with a luminous peak wavelength of 400-700 nm. Wide range of applications.
  • the hole mobility is relatively low, and the mobility of the hole transport material is higher than 1 ⁇ 10 -4 cm 2 /Vs. In some embodiments, the mobility of the hole transport material is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs.
  • a ninth aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, wherein the quantum dot light-emitting layer includes a quantum dot material with a core-shell structure, and the quantum dot material has a core-shell structure.
  • the outer shell layer is ZnSeS, and the absolute value of the top energy level of the valence band of the hole transport material in the hole transport layer is less than or equal to 5.7 eV.
  • the structure of the optoelectronic device is designed according to characteristics such as energy levels of ZnSeS. Specifically, since ZnSeS is used as the outer shell layer of the quantum dot in this embodiment, and the valence band energy level is between ZnSe and ZnS, it is necessary to construct a hole injection potential with a valence band top energy level difference ( ⁇ EEML-HTL) greater than or equal to 0.5eV. barrier, the top energy level of the valence band of the hole transport material needs to be less than or equal to 5.7 eV. Through the constructed hole injection barrier, the hole injection rate is reduced, the injection efficiency of electron holes in the light-emitting layer is balanced, the accumulation of carriers is reduced, and the light-emitting efficiency is improved.
  • ⁇ EEML-HTL valence band top energy level difference
  • the thickness of the ZnSeS shell is 1.0-4.0 nm. Since the easily oxidized Se in the ZnSeS shell is closer to the surface of the quantum dots, the ZnSeS shell needs to be thicker to ensure sufficient protection and passivation for the core. , so that the thickness of the ZnSeS shell layer is 1.0-4.0 nm.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9-5.7 eV, within this range, a more suitable hole injection barrier can be constructed with the ZnSeS shell material, and the current carrying in the light-emitting layer can be optimized. Sub-injection and recombination efficiency. In some embodiments, the absolute value of the valence band top energy level of the hole transport material is 4.9-5.4 eV.
  • the valence band top energy level difference between the ZnSeS material and the hole transport material is 0.9-1.4 eV.
  • the valence band top energy level difference ( ⁇ E EML-HTL ) of the hole transport layer material and the quantum dot shell layer material in the quantum dot light-emitting layer in the embodiment of the present application is in the range of 0.9 to 1.4 eV, it is possible to ensure that the carriers pass through the tunneling effect.
  • the efficiency of injection into the light-emitting quantum dots can better balance the injection efficiency of holes and electrons. If the ⁇ E EML-HTL is too large, the efficiency of carrier injection into the core of the light-emitting quantum dots through the tunneling effect is reduced; if the ⁇ E EML-HTL is too small, the injection rate of holes is poorly adjusted.
  • the emission peak wavelength of the quantum dot material is 400-700 nm. Due to the relatively strong binding ability of ZnSeS to excitons in the quantum dot core, the embodiment of the present application can effectively ensure the luminous efficiency of the quantum dot material itself, and is suitable for all quantum dot materials in the visible light region with a luminous peak wavelength of 400-700 nm. Wide range of applications.
  • the hole mobility is relatively low, and the mobility of the hole transport material is higher than 1 ⁇ 10 -4 cm 2 /Vs. In some embodiments, the mobility of the hole transport material is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs.
  • the hole transport material is at least one selected from the group consisting of polymers containing aniline groups and copolymers containing fluorene groups and aniline groups.
  • Hole transport materials with suitable mobility can be selected according to specific application requirements.
  • the aniline group-containing polymer with the absolute value of the top energy level of the valence band of the hole transport material less than or equal to 5.4 eV includes: poly-TPD, P9, TFB, P13.
  • the copolymer containing a fluorene group and an aniline group whose absolute value of the top energy level of the valence band of the hole transport material is less than or equal to 5.4 eV includes: TFB, P13.
  • the aniline group-containing polymers whose absolute value of the top energy level of the valence band of the hole transport material is greater than 5.4 eV and less than or equal to 5.9 eV include: P11, P12, and P15.
  • the copolymers containing fluorene groups and aniline groups whose absolute value of the top energy level of the valence band of the hole transport material is greater than 5.4 eV and less than or equal to 5.9 eV include: P12 and P15.
  • the quantum dot material of the core-shell structure includes the outer shell layer, the inner core, and an intermediate shell layer located between the inner core and the outer shell layer; wherein, the valence band of the core material is The top energy level is shallower than that of the outer shell material; the top energy level of the intermediate shell material is between the top energy level of the valence band of the core material and that of the outer shell material.
  • the core material is selected from Groups II-IV, II-VI, II-V, III-V, III-VI, IV-VI, I-III-VI, At least one of II-IV-VI and II-IV-V semiconductor compounds.
  • the core material is selected from at least one of CdSe, CdZnSe, CdSeS, CdZnSeS, InP, InGaP, GaP, ZnTe, and ZnTeSe. These core materials have good luminescence properties, and have a good coordination effect with the outer layer ZnSe, ZnS, CdZnS or ZnSeS.
  • the intermediate shell material is selected from at least one of CdZnSe, ZnSe, CdZnS, CdZnSeS, CdS, and CdSeS.
  • the matching principle of the middle shell layer in the embodiment of the present application is as follows: the composition of the middle shell layer preferably forms a continuous and natural transition from the inner core to the outer layer, which is helpful to realize the inner core, the middle shell layer and the outer shell layer. The least lattice mismatch and the least lattice defects between them, so as to achieve the optimal luminescence performance of the core-shell quantum dot material itself; the intermediate shell layer generally needs to form a stepped energy level from the core to the outer shell layer in terms of energy level. transition, which helps to achieve efficient carrier injection, efficient confinement and reduction of flickering at the lattice interface.
  • the optimization of the hole injection functional layer in the optoelectronic device in the second or third aspect can also be combined, and a first hole injection layer, a first hole injection layer and a second hole injection layer can be included.
  • the absolute value of the difference between the work function of the first hole injection material and the top energy level of the valence band of the hole transport material is less than or equal to 0.2 eV.
  • the difference between the top energy level of the valence band of the hole transport layer material and the work function of the second hole injection material in the second hole injection layer is less than -0.2 eV.
  • the utilization rate of holes in the device is improved, the hole injection rate is finely controlled, the carrier injection in the device is balanced, and the recombination efficiency is improved; at the same time, the influence of the charge accumulation in the interface layer on the life of the device is reduced.
  • an electron transport layer may also be included, and the electron transport layer includes at least two sub-electron transport layers arranged in layers; wherein, the material of at least one sub-electron transport layer is metal oxide family of compound transport materials. Alternatively, the material of at least one sub-electron transport layer is an organic transport material. Alternatively, the material comprising at least one sub-electron transport layer at the same time is a metal oxo compound transport material and the material of one sub-electron transport layer is an organic transport material.
  • a tenth aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, the quantum dot light-emitting layer includes a quantum dot material with a core-shell structure, and the quantum dot material has a core-shell structure.
  • the outer shell layer is ZnSe, and the mobility of the hole transport material in the hole transport layer is higher than 1 ⁇ 10 -3 cm 2 /Vs.
  • the valence band energy level of the ZnSe shell material is relatively shallow (the absolute value of the energy level is small) and the band gap is relatively narrow, the binding ability of the excitons in the core-shell structure of the quantum dot is relatively small. Poor, in order to ensure the good luminous efficiency of the quantum dot light-emitting material itself, a thicker ZnSe outer shell layer thickness is required, and the rate of injection into the light-emitting quantum dots through the tunneling effect becomes weaker.
  • E EML-HTL 0.5eV
  • HTL material with high hole mobility which is higher than 1 ⁇ 10 -3 cm 2 /Vs can compensate for the effect of tunneling effect on the hole injection rate, balance the injection efficiency of electron holes in the light-emitting layer, reduce the accumulation of carriers, and improve the luminous efficiency.
  • the thickness of the ZnSe shell layer is 2-5 nm. Due to the relatively narrow band gap of ZnSe in the embodiments of the present application, the binding ability of excitons in the quantum dot core is relatively poor.
  • the thickness of the outer shell layer is 2.0-5.0 nanometers. If the thickness of the outer shell layer is too large, the rate at which carriers are injected into the luminescent quantum dots through the tunneling effect will decrease; while the thickness of the outer shell layer is too small, the rate at which carriers are injected into the luminescent quantum dots through the tunneling effect will decrease. However, when the thickness of the outer shell layer is too small, the outer shell layer structure cannot sufficiently protect and passivate the inner core, thereby affecting the luminescence performance and stability of the quantum dot material.
  • the emission peak wavelength of the quantum dot material is 510-640 nm.
  • the luminous efficiency of the quantum dot material itself cannot be fully guaranteed even if a thick ZnSe outer layer is used.
  • the luminescent material should be red or green quantum dots with a luminescence peak wavelength range of 510-640 nm, so as to better ensure the luminous efficiency of the quantum dots.
  • the valence band top energy level difference between the ZnSe material and the hole transport material is 0.5-1.0 eV.
  • the rate at which carriers are injected into the light-emitting quantum dots through the tunneling effect is weakened.
  • the energy level difference ( ⁇ E EML-HTL ) should not be too large, and its range should be between 0.5 and 1.0 eV. If the ⁇ E EML-HTL should not be too large, the efficiency of hole injection into the luminescent core of the quantum dot will be reduced, and the luminous efficiency of the quantum dot material will be affected.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9 eV to 5.4 eV, within this range, a more suitable hole injection barrier can be constructed with the ZnSe shell material, and the loading in the light-emitting layer can be optimized. Carrier injection and recombination efficiency.
  • an eleventh aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, the quantum dot light-emitting layer includes a core-shell structure quantum dot material, and the quantum dot material
  • the outer shell layer is ZnS, and the mobility of the hole transport material in the hole transport layer is higher than 1 ⁇ 10 -4 cm 2 /Vs.
  • the thickness can basically ensure the good luminous efficiency of the quantum dot light-emitting material itself, so that the rate at which carriers are injected into the light-emitting quantum dots through the tunneling effect becomes stronger.
  • the hole mobility of the hole transport material used is greater than or equal to 1 ⁇ 10 -4 cm 2 /Vs, which can simultaneously realize that the difference in the top energy level of the valence band between the outer shell material of the quantum dot material and the hole transport material is greater than or equal to 0.5
  • the thickness of the ZnS shell is 0.2-2.0 nm. Due to the wide band gap of ZnS in the embodiment of the present application, the binding ability of excitons in the core of the quantum dot is relatively strong. Therefore, the thin ZnS shell layer thickness can basically ensure the good luminous efficiency of the quantum dot light-emitting material itself, and the shell layer The thickness is 0.2 to 2.0 nanometers. At the same time, the thin ZnS shell can also effectively reduce the overall resistance of the device, reduce the driving voltage of the device, and improve the performance of the device.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9 eV to 6.0 eV, within this range, a more suitable hole injection barrier can be constructed with the ZnS shell material, and the load in the light-emitting layer can be optimized. Carrier injection and recombination efficiency. In some embodiments, the absolute value of the valence band top energy level of the hole transport material is 4.9 eV to 5.5 eV.
  • the valence band top energy level difference between the ZnS material and the hole transport material is 1.0-1.6 eV.
  • the rate at which carriers are injected into the light-emitting quantum dots through the tunneling effect becomes stronger. Therefore, the corresponding hole transport layer material and the quantum dot shell layer in the quantum dot light-emitting layer are
  • the valence band top energy level difference ( ⁇ E EML-HTL ) of the material needs to be appropriately increased to better balance the injection balance of holes and electrons, and its range should be between 1.0 and 1.6 eV. If the ⁇ E EML-HTL should not be too large, the efficiency of hole injection into the luminescent core of the quantum dot will be reduced, and the luminous efficiency of the quantum dot material will be affected.
  • the emission peak wavelength of the quantum dot material is 400-700 nm. Due to the wide band gap of ZnS, the embodiment of the present application has a strong binding ability for excitons in the quantum dot core, which can effectively ensure the luminous efficiency of the quantum dot material itself. All quantum dot materials have a wide range of applications.
  • the mobility of the hole transport material is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs.
  • a twelfth aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, the quantum dot light-emitting layer includes a core-shell structure quantum dot material, and the quantum dot material
  • the outer shell layer is CdZnS, and the mobility of the hole transport material in the hole transport layer is higher than 1 ⁇ 10 -4 cm 2 /Vs.
  • the outer shell layer of the quantum dot is CdZnS, and its band gap width is between ZnSe and ZnS.
  • the thickness of the layer can basically ensure the good luminous efficiency of the quantum dot light-emitting material itself, so the thickness of the outer shell layer has little influence on the tunneling effect of carriers.
  • the valence band energy level of the CdZnS shell material is between ZnSe and ZnS.
  • the hole injection barrier with ⁇ E EML-HTL ⁇ 0.5 eV can be constructed and the hole transport and injection into the quantum dot material can be ensured at the same time. s efficiency.
  • the thickness of the CdZnS shell is 0.5 to 3.0 nm. Since the band gap of CdZnS is between ZnSe and ZnS, when the thickness of the shell is 0.5 to 3.0 nm, the excitons in the core of the quantum dot can be protected at the same time. binding ability, and the good luminous efficiency of the quantum dot luminescent material itself.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9-5.9 eV, within this range, a more suitable hole injection barrier can be constructed with the CdZnS shell material, and the current carrying in the light-emitting layer can be optimized. Sub-injection and recombination efficiency. In some embodiments, the absolute value of the valence band top energy level of the hole transport material is 4.9-5.5 eV.
  • the valence band top energy level difference between the CdZnS material and the hole transport material is 0.8-1.4 eV.
  • the valence band top energy level difference ( ⁇ E EML-HTL ) of the hole transport layer material in the embodiment of the present application and the quantum dot shell layer material in the quantum dot light-emitting layer ranges from 0.8 to 1.4 eV, which can ensure that carriers are injected through the tunneling effect To the efficiency of the luminescent quantum dots, it can better balance the injection efficiency of holes and electrons. If the ⁇ E EML-HTL is too large, the efficiency of carrier injection into the core of the light-emitting quantum dots through the tunneling effect is reduced; if the ⁇ E EML-HTL is too small, the injection rate of holes is poorly adjusted.
  • the emission peak wavelength of the quantum dot material is 400-700 nm. Since CdZnS has relatively strong binding ability to excitons in the quantum dot core, the embodiment of the present application can effectively ensure the luminous efficiency of the quantum dot material itself, and is suitable for all quantum dot materials in the visible light region with a luminous peak wavelength of 400-700 nm. Wide range of applications.
  • the mobility of the hole transport material is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs.
  • a thirteenth aspect of the embodiment of the present application provides an optoelectronic device, comprising a quantum dot light-emitting layer and a hole transport layer, the quantum dot light-emitting layer includes a core-shell structure quantum dot material, and the quantum dot material
  • the outer shell layer is ZnSeS, and the mobility of the hole transport material in the hole transport layer is higher than 1 ⁇ 10 -4 cm 2 /Vs.
  • the outer shell layer of the quantum dot is made of ZnSeS, and its band gap width is between ZnSe and ZnS.
  • the tunneling effect of the electrons has less influence.
  • the valence band energy level of the ZnSeS shell material is between ZnSe and ZnS.
  • ⁇ E EML-HTL valence band top energy level difference
  • the required hole transport material The top energy level of the valence band is relatively shallow. Therefore, when the hole mobility of the HTL material is greater than or equal to 1 ⁇ 10 -4 cm 2 /Vs, it can simultaneously satisfy the construction of the hole injection barrier and ensure the efficiency of hole transport and injection into the quantum dot material.
  • the thickness of the ZnSeS shell is 1.0-4.0 nm. Since the easily oxidized Se in the ZnSeS shell is closer to the surface of the quantum dots, the ZnSeS shell needs to be thicker to ensure sufficient protection and passivation for the core. , so that the thickness of the ZnSeS shell layer is 1.0-4.0 nm.
  • the absolute value of the top energy level of the valence band of the hole transport material is 4.9-5.7 eV, within this range, a more suitable hole injection barrier can be constructed with the ZnSeS shell material, and the current carrying in the light-emitting layer can be optimized. Sub-injection and recombination efficiency. In some embodiments, the absolute value of the valence band top energy level of the hole transport material is 4.9-5.4 eV.
  • the valence band top energy level difference between the ZnSeS material and the hole transport material is 0.9-1.4 eV.
  • the valence band top energy level difference ( ⁇ E EML-HTL ) of the hole transport layer material and the quantum dot shell layer material in the quantum dot light-emitting layer in the embodiment of the present application is in the range of 0.9 to 1.4 eV, it is possible to ensure that the carriers pass through the tunneling effect.
  • the efficiency of injection into the light-emitting quantum dots can better balance the injection efficiency of holes and electrons. If the ⁇ E EML-HTL is too large, the efficiency of carrier injection into the core of the light-emitting quantum dots through the tunneling effect is reduced; if the ⁇ E EML-HTL is too small, the injection rate of holes is poorly adjusted.
  • the emission peak wavelength of the quantum dot material is 400-700 nm. Due to the relatively strong binding ability of ZnSeS to excitons in the quantum dot core, the embodiment of the present application can effectively ensure the luminous efficiency of the quantum dot material itself, and is suitable for all quantum dot materials in the visible light region with a luminous peak wavelength of 400-700 nm. Wide range of applications.
  • the mobility of the hole transport material is higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs.
  • the hole transport material is at least one selected from the group consisting of polymers containing aniline groups and copolymers containing fluorene groups and aniline groups.
  • hole transport materials with appropriate mobility can be selected according to specific application requirements.
  • the aniline group-containing polymers having a mobility of the hole transport material higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs include: poly-TPD, TFB, P9, P11, P13.
  • the fluorene group and aniline group-containing copolymers with the mobility of the hole transport material higher than 1 ⁇ 10 ⁇ 3 cm 2 /Vs include: TFB, P13.
  • the aniline group-containing polymers having a mobility of the hole transport material higher than 1 ⁇ 10 ⁇ 4 cm 2 /Vs include: poly-TPD, TFB, P9, P11, P13, P15.
  • the fluorene group and aniline group-containing copolymers having a mobility of the hole transport material higher than 1 ⁇ 10 ⁇ 4 cm 2 /Vs include: TFB, P13, P15.
  • the quantum dot material of the core-shell structure further includes an inner core, and an intermediate shell layer located between the inner core and the outer shell layer; wherein, the top energy level of the valence band of the core material is shallow The valence band top energy level of the outer shell material; the valence band top energy level of the middle shell material is between the valence band top energy level of the core material and the valence band top energy level of the outer shell material.
  • the core material is selected from Groups II-IV, II-VI, II-V, III-V, III-VI, IV-VI, I-III-VI, At least one of II-IV-VI and II-IV-V semiconductor compounds.
  • the core material is selected from at least one of CdSe, CdZnSe, CdSeS, CdZnSeS, InP, InGaP, GaP, ZnTe, and ZnTeSe. These core materials have good luminescence properties, and have a good coordination effect with the outer layer ZnSe, ZnS, CdZnS or ZnSeS.
  • the intermediate shell material is selected from at least one of CdZnSe, ZnSe, CdZnS, CdZnSeS, CdS, and CdSeS.
  • the matching principle of the middle shell layer in the embodiment of the present application is as follows: the composition of the middle shell layer preferably forms a continuous and natural transition from the inner core to the outer layer, which is helpful to realize the inner core, the middle shell layer and the outer shell layer. The least lattice mismatch and the least lattice defects between them, so as to achieve the optimal luminescence performance of the core-shell quantum dot material itself; the intermediate shell layer generally needs to form a stepped energy level from the core to the outer shell layer in terms of energy level. transition, which helps to achieve efficient carrier injection, efficient confinement and reduction of flickering at the lattice interface.
  • the optimization of the hole injection functional layer in the optoelectronic device in the second or third aspect may also be combined, and a first hole injection layer may be included, and the first hole injection
  • the absolute value of the difference between the work function of the first hole injection material of the layer and the top energy level of the valence band of the hole transport material is less than or equal to 0.2 eV.
  • a second hole injection layer is included, and the difference between the top energy level of the valence band of the material of the hole transport layer and the work function of the second hole injection material in the second hole injection layer is less than -0.2 eV.
  • the utilization rate of holes in the device is improved, the hole injection rate is finely controlled, the carrier injection in the device is balanced, and the recombination efficiency is improved; at the same time, the influence of the charge accumulation in the interface layer on the life of the device is reduced.
  • an electron transport layer may also be included, and the electron transport layer includes at least two sub-electron transport layers arranged in layers; wherein, the material of at least one sub-electron transport layer is metal Oxygen compound transport material. Alternatively, the material of at least one sub-electron transport layer is an organic transport material. Alternatively, the material comprising at least one sub-electron transport layer at the same time is a metal oxo compound transport material and the material of one sub-electron transport layer is an organic transport material.
  • the device is not limited by the device structure, and may be a device with a positive structure or a device with an inversion structure.
  • the positive structure optoelectronic device includes a stacked structure of oppositely disposed anode and cathode, a light-emitting layer disposed between the anode and the cathode, and the anode disposed on the substrate.
  • a hole functional layer such as a hole injection layer and a hole transport layer can also be set between the anode and the light-emitting layer; and an electron functional layer such as an electron transport layer and an electron injection layer can also be set between the cathode and the light-emitting layer, as shown in Figure 14 shown.
  • the optoelectronic device includes a substrate, an anode disposed on the surface of the substrate, a hole transport layer disposed on the surface of the anode, a light emitting layer disposed on the surface of the hole transport layer, An electron transport layer on the surface of the layer and a cathode disposed on the surface of the electron transport layer.
  • the inversion structure optoelectronic device comprises a stacked structure of oppositely disposed anode and cathode, a light-emitting layer disposed between the anode and the cathode, and the cathode disposed on the substrate.
  • a hole functional layer such as a hole injection layer and a hole transport layer can also be set between the anode and the light-emitting layer; and an electron functional layer such as an electron transport layer and an electron injection layer can also be set between the cathode and the light-emitting layer, as shown in Figure 15 shown.
  • the optoelectronic device includes a substrate, a cathode disposed on the surface of the substrate, an electron transport layer disposed on the surface of the cathode, a light emitting layer disposed on the surface of the electron transport layer,
  • the hole transport layer is an anode disposed on the surface of the hole transport layer.
  • the choice of the substrate is not limited, and a rigid substrate or a flexible substrate may be used.
  • the rigid substrate includes, but is not limited to, one or more of glass and metal foil.
  • the flexible substrate includes, but is not limited to, polyethylene terephthalate (PET), polyethylene terephthalate (PEN), polyetheretherketone (PEEK), polystyrene (PS), polyethersulfone (PES), polycarbonate (PC), polyarylate (PAT), polyarylate (PAR), polyimide (PI), polyvinyl chloride (PV), poly One or more of ethylene (PE), polyvinylpyrrolidone (PVP), and textile fibers.
  • PET polyethylene terephthalate
  • PEN polyethylene terephthalate
  • PEEK polyetheretherketone
  • PS polystyrene
  • PS polyethersulfone
  • PC polycarbonate
  • PAT polyarylate
  • PAR polyarylate
  • PI polyimide
  • PV polyviny
  • the choice of anode material is not limited and can be selected from doped metal oxides, including but not limited to indium doped tin oxide (ITO), fluorine doped tin oxide (FTO), antimony doped tin oxide (ATO), Aluminum-Doped Zinc Oxide (AZO), Gallium-Doped Zinc Oxide (GZO), Indium-Doped Zinc Oxide (IZO), Magnesium-Doped Zinc Oxide (MZO), Aluminum-Doped Magnesium Oxide (AMO) one or more.
  • doped metal oxides including but not limited to indium doped tin oxide (ITO), fluorine doped tin oxide (FTO), antimony doped tin oxide (ATO), Aluminum-Doped Zinc Oxide (AZO), Gallium-Doped Zinc Oxide (GZO), Indium-Doped Zinc Oxide (IZO), Magnesium-Doped Zinc Oxide (MZO), Aluminum-Doped Magnesium Oxide (AMO)
  • the cathode material may be one or more of various conductive carbon materials, conductive metal oxide materials, and metallic materials.
  • conductive carbon materials include, but are not limited to, doped or undoped carbon nanotubes, doped or undoped graphene, doped or undoped graphene oxide, C60, graphite, carbon fiber, many Empty carbon, or a mixture thereof.
  • the conductive metal oxide material includes, but is not limited to, ITO, FTO, ATO, AZO, or mixtures thereof.
  • the metal materials include, but are not limited to, Al, Ag, Cu, Mo, Au, or their alloys; among the metal materials, their forms include but are not limited to dense films, nanowires, nanospheres, nanometers Rods, nanocones, hollow nanospheres, or mixtures thereof.
  • the cathodes are Ag, Al.
  • the quantum dot light-emitting layer has a thickness of 8-100 nm. In some embodiments, the hole transport layer has a thickness of 10-150 nm. In some embodiments, the electron transport layer has a thickness of 10-200 nm. In practical applications, the electron functional layer, the light emitting layer, and the hole functional layer in the device can be designed with appropriate thicknesses according to the characteristics of the device in the above embodiments.
  • a hole injection layer is grown on the surface of the anode
  • an electron transport layer is deposited on the quantum dot light-emitting layer, and a cathode electrode is evaporated on the electron transport layer to obtain an optoelectronic device.
  • step S10 the ITO substrate needs to undergo a pretreatment process, and the steps include: cleaning the ITO conductive glass with a detergent to preliminarily remove the stains existing on the surface, and then sequentially soaking in deionized water, acetone, anhydrous ethanol, and deionized water. Ultrasonic cleaning was carried out for 20 min to remove impurities on the surface, and finally dried with high-purity nitrogen to obtain the ITO positive electrode.
  • the step of growing the hole injection layer includes: preparing a metal oxide and other materials into a thin film in the QLED device by a solution method, a vacuum sputtering method, and a vacuum evaporation method; wherein, the solution method method Including inkjet printing, spin coating, spray printing (spray printing), slot-die printing (slot-die printing) or screen printing (screen printing) and the like.
  • the step of growing the hole transport layer includes: placing the ITO substrate on a spin coater, and using the prepared solution of the hole transport material to spin to form a film; adjusting the concentration of the solution and the spin coating speed and spin coating time to control the film thickness, followed by thermal annealing at an appropriate temperature.
  • the step of depositing the quantum dot light-emitting layer on the hole transport layer includes: placing the substrate on which the hole transport layer has been spin-coated on a spin coater, and spinning a solution of a prepared light-emitting substance with a certain concentration. Coating into a film, controlling the thickness of the light-emitting layer by adjusting the concentration of the solution, the spin coating speed and the spin coating time, about 20-60 nm, and drying at an appropriate temperature.
  • the step of depositing the electron transport layer on the quantum dot light-emitting layer includes: placing the substrate on which the quantum dot light-emitting layer has been spin-coated on a spin coater, and preparing a certain concentration of electron transport composite material
  • the solution is spin-coated to form a film by drip coating, spin coating, soaking, coating, printing, evaporation and other processes, and is controlled by adjusting the concentration of the solution, the spin coating speed (for example, the rotation speed is between 3000 and 5000 rpm) and the spin coating time.
  • the thickness of the electron transport layer is about 20 to 60 nm, and then annealed under the conditions of 150 ° C to 200 ° C to form a film, and the solvent is fully removed.
  • the steps of preparing the cathode include: placing the substrate on which each functional layer has been deposited into an evaporation chamber and thermally vapor-depositing a layer of 60-100 nm metal silver or aluminum as a cathode through a mask.
  • the method for preparing an optoelectronic device further includes encapsulating the laminated optoelectronic device; the curing resin used in the encapsulation is acrylic resin, acrylate resin or epoxy resin; resin curing adopts UV irradiation, Heat or a combination of both.
  • the encapsulation process can be done by conventional machine encapsulation or manual encapsulation. In the packaging process environment, the oxygen content and water content are both lower than 0.1ppm to ensure the stability of the device.
  • the method for preparing an optoelectronic device further includes, after encapsulating the optoelectronic device, introducing one or more processes including ultraviolet irradiation, heating, positive and negative pressure, applied electric field, and applied magnetic field; applying a process
  • the atmosphere can be air or an inert atmosphere.
  • the device of the embodiment of the present application adopts the ITO/HIL/HTL/QD/ETL/AL structure, and a certain heating treatment is performed after packaging.
  • the advantages of the technical solution of the present application are explained in detail by comparing the collocation and comparison of different functional layers in the device.
  • the life test adopts the constant current method, under the constant current of 50mA/ cm2 , the silicon photosystem is used to test the brightness change of the device, and the time when the brightness of the device starts from the highest point and decays to 95% of the highest brightness is recorded LT95, Then extrapolate the 1000nit LT95S life of the device through the empirical formula. This method is convenient for comparing the lifetime of devices with different brightness levels, and has a wide range of applications in practical optoelectronic devices.
  • the energy level test method of each material in the examples of the present application after spin-coating each functional layer material to form a film, the energy level test is carried out by UPS (ultraviolet photoelectron spectroscopy) method.
  • UPS ultraviolet photoelectron spectroscopy
  • Valence band top VB(HOMO): E HOMO E F-HOMO + ⁇ , where E F-HOMO is the difference between the material HOMO(VB) and the Fermi level, corresponding to the first occurrence of the low binding energy end in the binding energy spectrum the starting edge of a peak;
  • E LOMO E HOMO -E HOMO-LOMO
  • E HOMO-LOMO is the band gap of the material, obtained from UV-Vis (ultraviolet absorption spectrum).
  • this application sets up Examples 1 to 7.
  • the effect of hole injection barrier on performance such as device lifetime.
  • the two kinds of quantum dots used in Examples 1 to 7 of the present application are: blue QD1 whose outer shell is CdZnS (the inner core is CdZnSe, the middle shell is ZnSe, the outer shell thickness is 1.5 nm, and the top energy level of the valence band is -6.2 eV) , blue QD2 with ZnS outer shell (the inner core is CdZnSe, the middle shell is ZnSe, the ZnS shell thickness is 0.3 nm, and the top energy level of the valence band is 6.5 eV).
  • the blue QD3 with ZnSeS shell (the inner core is CdZnSe, the middle shell is ZnSe), the hole transport materials are P9 (E HOMO : 5.1 eV), P15 (E HOMO : 5.8 eV), and the hole injection layer is PEDOT:PSS (E HOMO : 5.1eV), the electron transport layer adopts ZnO, as shown in Table 1 below:
  • the ⁇ E EML-HTL barrier difference increases from 0.4eV to 0.7eV, and the device lifetime is significantly improved
  • the 1000nit LT95S life is increased from 0.72 to 6.29.
  • the device injection balance is optimized, and the device lifetime can be enhanced. It shows that reducing the hole injection efficiency by increasing the hole injection barrier can better balance the injection balance of holes and electrons in the light-emitting layer, and improve the luminous efficiency and luminous life of the device.
  • this application sets up Examples 8 to 11, through the comparison of different HTL and HTL, to illustrate the effect of the ⁇ E HTL-HIL hole injection barrier on the device life. and other performance effects.
  • blue quantum dots whose outer shell is ZnS (the inner core is CdZnSe, the middle shell is ZnSe, the outer shell thickness is 0.3 nm, and the top energy level of the valence band is 6.5 eV) are used, and in Examples 10 to 11
  • the red quantum dots with the outer shell of ZnS (the core is CdZnSe, the middle shell is ZnSe, the shell thickness is 0.3 nm, and the top energy level of the valence band is 6.5 eV) are used, and the hole transport materials are P9 (E HOMO : 5.5 eV), P11 (E HOMO : 5.5eV), P13 (E HOMO : 4.9eV), the hole injection layer adopts PEDOT:PSS (E HOMO : 5.1eV) and HIL2 (work function: 5.6eV), and the electron transport layer adopts ZnO.
  • Table 2 shows that
  • the present application sets up Examples 12 to 19, through the comparison of different HTL and HTL, to illustrate the
  • blue quantum dots whose outer shell is ZnS (the inner core is CdZnSe, the middle shell is ZnSe, the outer shell thickness is 0.3 nm, and the top energy level of the valence band is 6.5 eV) are used, and in Examples 15 to 19
  • the red quantum dots with the outer shell of ZnS (the core is CdZnSe, the middle shell is ZnSe, the shell thickness is 0.3 nm, and the top energy level of the valence band is 6.5 eV) are used, and the hole transport materials are P9 (E HOMO : 5.5 eV), P13 (E HOMO : 4.9 eV), TFB (E HOMO : 5.4 eV), the hole injection layer adopts PEDOT: PSS (E HOMO : 5.1 eV), HIL1-1 (work function: 5.4 eV) and HIL1-2 (work function: 5.4 eV) letter: 5.3eV), the electron
  • this application sets up Examples 20 to 25.
  • the HTL materials can build a hole injection barrier, optimize the carrier recombination efficiency and Impact on device life and other performance.
  • blue quantum dots with ZnS outer shells (the inner core is CdZnSe, the middle shell is ZnSe, the outer shell thickness is 0.3 nm, and the top energy level of the valence band is 6.5 eV) are used, and the hole transport materials are respectively P12 (E HOMO : 5.8eV), P13 (E HOMO : 4.9eV), TFB (E HOMO : 5.4eV), the hole injection layer adopts PEDOT:PSS (E HOMO : 5.1eV), as shown in Table 4 below:
  • the deep-level HTL can reduce the brightness change in the lifetime test caused by the exciton transfer of the HTL and QD, and reduce the rising segment. Therefore, by mixing the shallow energy level and the deep energy level, the lifespan of the device can be ensured, and the rising segment of the brightness of the device can be reduced, so that the device can quickly enter a stable state, which is beneficial to subsequent tests and applications. Comparing Examples 22, 24, and 25 in conjunction with Figure 21, it can be seen that from Examples 22 to 24 to 25, the doping ratio of deep-level materials increases, the lifetimes are all between 60-80h, and the difference in lifetimes is small.
  • the medium brightness rise time is about 7h, 5h, and 4h, respectively; compared with Example 21, Example 22, 24 or 25 has a higher proportion of deep-level materials, and the mobility of hole transport materials can be adjusted more widely and easier. Quantum dot devices with higher lifetime are obtained.
  • the absolute value of the top energy level of the valence band of the hole transport material should be less than or equal to 6.0eV, as shown in Examples 26-28 in Table 5 below (the hole injection layer adopts PEDOT:PSS (E HOMO : 5.1eV),
  • the electron transport layer uses ZnO):
  • Examples 29-31 when the outer shell layer of the blue quantum dot material is ZnSe (the inner core is CdZnSe, the middle shell layer is ZnSe, and the thickness of the outer shell layer is 2-5 nm, in order to construct a suitable ⁇ E EML-HTL energy level potential
  • the absolute value of the top energy level of the valence band of the hole transport material should be less than or equal to 5.4eV, as shown in Examples 29 to 31 in Table 6 below (the hole injection layer adopts PEDOT:PSS (E HOMO : 5.1eV), and the electron transport layer using ZnO):
  • the absolute value of the top energy level of the valence band of the hole transport material must be less than or equal to 5.9eV, as shown in Examples 32 to 35 in Table 7 below (the hole injection layer adopts PEDOT:PSS (E HOMO : 5.1eV),
  • the electron transport layer uses ZnO):
  • the outer shell of the blue quantum dot material is ZnSeS (the inner core is CdZnSe, the middle shell is ZnSe, and the outer shell thickness is 1.0-4.0 nm)
  • the absolute value of the top energy level of the valence band of the hole transport material must be less than or equal to 5.7eV, as shown in Examples 36 to 38 in Table 8 below (the hole injection layer adopts PEDOT:PSS (E HOMO : 5.1eV),
  • the electron transport layer uses ZnO):
  • red quantum dots whose outer shells are ZnS are used.
  • red quantum dots with ZnS outer shell inner core of CdZnSe, middle shell of ZnSe, valence band top energy level of 6.5 eV were used, and ZnO was used as the electron transport layer.
  • ZnS outer shell inner core of CdZnSe, middle shell of ZnSe, valence band top energy level of 6.5 eV
  • the driving voltage of the device drops more obviously under constant current operation for a long time, indicating that the HTL mobility is higher than 1x10 -3 cm 2 /Vs, and better performance can be achieved.
  • the effect of suppressing the voltage rise of the device is higher than 1x10 -3 cm 2 /Vs, and better performance can be achieved.
  • the damage of the hole injection material of MoO 3 is effectively suppressed, so that the voltage rise of the device in the working process is compared with that of the organic material.
  • the hole injection layer material device has a significant reduction, and the measured time of the device life has also been effectively improved.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请公开一种光电器件，包括依次层叠设置的阳极、空穴传输层、量子点发光层和阴极，所述空穴传输层中至少包含两种空穴传输材料，其中，至少一种空穴传输材料的价带顶能级的绝对值小于等于5.3eV，至少一种空穴传输材料的价带顶能级的绝对值大于5.3eV。本申请提供的光电器件中空穴传输层为混合材料，通过浅能级空穴传输材料、深能级空穴传输材料之间的相互搭配，实现对空穴传输材料与量子点外壳层之间的空穴注入势垒的精细调控，有利于构建≥0.5eV的能级势垒，降低空穴的注入效率，从而平衡发光层中空穴与电子的注入平衡，提高器件发光效率，同时避免电荷积累对器件寿命的影响。

Description

光电器件
本申请要求于2020年12月31日在中国专利局提交的、申请号为202011633955.2、发明名称为“光电器件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，具体涉及一种光电器件。
背景技术
这里的陈述仅提供与本申请有关的背景信息，而不必然构成现有技术。量子点发光显示技术(QLED)是近年来迅速兴起的一种新型显示技术，QLED与有机发光显示(OLED)类似，均为主动发光技术，因此同样具有发光效率高、响应速度快、对比度高、可视角度宽等优点。由于QLED显示技术中量子点自身所具有的优良材料特性，使得QLED在众多方面比OLED更具性能优势，如：量子点的发光连续可调且发光宽度极窄，可实现更广色域更高纯度显示；量子点的无机材料特性使得QLED具有更好的器件稳定性；QLED器件的驱动电压比OLED更低，能实现更高亮度并降低能耗；同时QLED显示技术与印刷显示的生产工艺和技术相匹配，能够实现大尺寸、低成本、可卷曲的高效量产制备。因此，QLED被认为是未来轻薄，便携，柔性，透明，高性能的下一代显示屏幕的首选技术之一。
由于QLED与OLED显示技术在发光原理上的相似性，因此，目前在QLED显示技术的开发过程中，QLED的器件结构更多地都是借鉴OLED显示技术，除了发光层材料由有机发光材料替换为量子点材料外，其他功能层材料诸如电荷注入层或电荷传输层等材料往往是利用OLED中已有的材料。同时对于QLED器件中器件物理的解释、功能层材料能级的选择和搭配原则等也均是遵循OLED中的已有理论体系。将OLED器件研究中所得到经典器件物理结论应用到QLED器件体系中，确实对于QLED器件性能起到了显著的提升效果，尤其是QLED器件效率。
但是，目前OLED中所形成的经典思路和策略均无法实现对QLED器件寿命的有效提升，而且通过OLED器件经典思路和策略虽然能提高QLED器件效率，但研究发现这些高效QLED器件的器件寿命却显著差于具有更低效率的相似器件。因此，现有的基于OLED器件理论体系所设计的QLED器件结构并不能同时提升QLED器件的光电效率和寿命性能。对应于QLED器件体系所具有的独特的器件机制，需要开发新的更具有针对性的新QLED器件结构。
技术问题
本申请实施例的目的之一在于：提供一种光电器件，旨在解决相关技术难以同时提高QLED器件的光电效率和寿命性能的问题。
技术解决方案
为解决上述技术问题，本申请实施例采用的技术方案是：
第一方面，提供了一种光电器件，包括：阳极、在所述阳极上的空穴传输层、在所述空穴传输层上的量子点发光层和在所述量子点发光层上的阴极，所述空穴传输层中至少包含两种空穴传输材料，其中，至少一种空穴传输材料的价带顶能级的绝对值小于等于5.3eV，至少一种空穴传输材料的价带顶能级的绝对值大于5.3eV。
本申请实施例提供的光电器件的有益效果在于：光电器件中空穴传输层为混合材料，其中至少一种空穴传输材料的价带顶能级小于等于5.3eV，而常规量子点发光材料的壳层能级往往比较深(6.0eV或更深)，因此，使得浅能级的空穴传输材料与量子点外壳材料之间形成大于等于0.5eV的能级差。空穴传输层中通过浅能级材料、深能级材料之间的相互搭配，可实现对空穴传输材料与量子点外壳层之间的空穴注入势垒的精细调控，同时也可以通过不同能级深浅的空穴传输材料调节HTL层中空穴迁移率。实现ΔE EML-HTL大于等于0.5eV的能级势垒，通过提高空穴注入势垒，降低空穴的注入效率，从而平衡发光层中空穴与电子的注入平衡，提高器件发光效率，同时避免电荷积累对器件寿命的影响。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例或示范性技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请第一方面提供的光电器件的结构示意图；
图2是本申请第二方面提供的光电器件的结构示意图；
图3是本申请第三方面提供的光电器件的结构示意图；
图4是本申请第四方面提供的光电器件的结构示意图；
图5是本申请第五方面提供的光电器件的结构示意图；
图6是本申请第六方面提供的光电器件的结构示意图；
图7是本申请第七方面提供的光电器件的结构示意图；
图8是本申请第八方面提供的光电器件的结构示意图；
图9是本申请第九方面提供的光电器件的结构示意图；
图10是本申请第十方面提供的光电器件的结构示意图；
图11是本申请第十一方面提供的光电器件的结构示意图；
图12是本申请第十二方面提供的光电器件的结构示意图；
图13是本申请第十三方面提供的光电器件的结构示意图；
图14是本申请实施例提供的量子点发光二极管的正型结构示意图；
图15是本申请实施例提供的量子点发光二极管的反型结构示意图；
图16是本申请实施例1～7提供的量子点发光二极管发光寿命的测试图；
图17是本申请实施例8～9提供的量子点发光二极管发光寿命的测试图；
图18是本申请实施例10～11提供的量子点发光二极管发光寿命的测试图；
图19是本申请实施例12～14提供的量子点发光二极管电压与时间的变化关系图；
图20是本申请实施例15～19提供的量子点发光二极管电压与时间的变化关系图；
图21是本申请实施例20～25提供的量子点发光二极管发光寿命的测试图；
图22是本申请实施例26～28提供的量子点发光二极管发光寿命的测试图；
图23是本申请实施例29～31提供的量子点发光二极管发光寿命的测试图；
图24是本申请实施例32～35提供的量子点发光二极管发光寿命的测试图；
图25是本申请实施例36～38提供的量子点发光二极管发光寿命的测试图；
图26是本申请实施例39～41提供的量子点发光二极管电压与时间的变化关系图；
图27是本申请实施例39～41提供的量子点发光二极管发光寿命的测试图；
图28是本申请实施例42～43提供的量子点发光二极管电压与时间的变化关系图；
图29是本申请实施例42～43提供的量子点发光二极管发光寿命的测试图。
本发明的实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
本申请中，术语“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况。其中A，B可以是单数或者复数。
本申请中，术语“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况。其中A，B可以是单数或者复数。
本申请中，“至少一个”是指一个或者多个，“多个”是指两个或两个以上。“以下至少一项(个)”或其类似表达，是指的这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，“a,b,或c中的至少一项(个)”，或，“a,b,和c中的至少一项(个)”，均可以表示：a,b,c,a-b(即a和b),a-c,b-c,或a-b-c，其中a,b,c分别可以是单个，也可以是多个。
应理解，在本申请的各种实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，部分或全部步骤可以并行执行或先后执行，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请实施例的实施过程构成任何限定。在本申请实施例中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请。在本申请实施例和所附权利要求书中所使用的单数形式的“一种”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
在本申请实施例中，ΔE HTL-HIL＝E HOMO,HTL-E HIL，ΔE EML-HTL＝E HOMO,EML-E HTL，所有能级/功函值均取绝对值，能级绝对值大表示能级深，能级绝对值小表示能级浅。
本申请的关键在于同时提高QLED器件的寿命和光电效率。目前，器件寿命的测试与器件效率的表征存在显著的差异：器件效率测试的时间通常较短，因此表征的是QLED器件工作起始时瞬间状态；而器件寿命表征的是器件持续工作并进入稳定状态后对于器件效率的保持能力。
目前，基于传统OLED器件已有的理论体系，认为电子向发光层注入的速率通常比空穴要快。因此，为平衡以及提高QLED器件发光层中空穴和电子的复合效率，通常会在器件中设置空穴注入层、尽量减小相邻两层功能层之间注入势垒等方式来增强空穴的注入效率，从而提高载流子注入效率并减少界面电荷积累。但是该方法仅能在一定程度上提高QLED器件起始瞬间的光电效率，却无法同时提高器件寿命，甚至会降低器件寿命。本申请通过对于QLED器件机理研究的逐步开展和深入，发现在QLED器件体系中由于量子点材料以及其他具有特殊材料表面的纳米材料的使用，使得QLED具有一些不同于OLED器件体系的特殊机制，这些机制与QLED器件的性能尤其是器件寿命具有密切的关系。
具体地，本申请通过研究发现：QLED器件在初始工作状态时，发光层中电子注入速率比空穴快，导致量子点材料带负电，且这种负电状态会因量子点材料的结构特性和表面配体的束缚作用、库仑阻塞效应等因素得以保持。然而，量子点材料的负电状态使得QLED器件在持续工作过程中，电子的注入变得越来越困难，从而导致发光层中电子与空穴实际注入不平衡。QLED器件持续点亮工作至稳定状态的过程中，量子点材料带负电的状态也趋于稳定，即被量子点新捕获束缚的电子与发生辐射跃迁所消耗的电子达到动态平衡。此时电子向发光层的注入速率相比起始状态时要低很多，达到发光层中电荷注入平衡所需的空穴注入速率实际也相对较低。若仍然基于传统OLED器件的理论体系提高空穴的注入效率，采用深能级的空穴传输层只能在QLED器件工作起始阶段形成电荷注入的瞬间平衡，达到起始瞬间的高器件效率。但是，随着QLED器件进入稳定的工作状态，过量的空穴注入反而会加重器件发光层中电子与空穴的不平衡状态，QLED器件效率无法保持，随之降低。且这种电荷的不平衡状态会随着器件持续工作而不断加剧，导致QLED器件寿命也会相应地迅速衰减。
因此，为了实现在器件发光层中载流子的注入平衡，获得更高效率和更长使用寿命的器件，对器件两侧空穴和电子的载流子注入进行精细调控的关键在于：一方面，调控空穴注入至较低的速率，使QLED器件稳定工作状态中空穴的注入速率与电子的注入速率平衡，提高QLED器件复合效率。另一方面，由于QLED器件在实际稳定工作状态中所需的空穴注入速率比传统预期的低，容易出现载流子积累，对器件造成不可逆转的破坏。因此，要尽量避免载流子积累对器件寿命的影响，提高器件使用寿命。
如附图1所示，本申请实施例第一方面提供一种光电器件，包括：阳极、在所述阳极上的空穴传输层、在所述空穴传输层上的量子点发光层和在所述量子点发光层上的阴极，量子点发光层中包括核壳结构的量子点材料，量子点材料的外壳层材料与空穴传输层中空穴传输材料的价带顶能级差大于等于0.5eV。
本申请第一方面提供的光电器件，在量子点材料的外壳层材料与空穴传输材料之间构建了大于等于0.5eV的价带顶能级差，即E EML-HTL≥0.5eV。通过提高空穴注入势垒来降低空穴的注入效率，从而平衡发光层中空穴与电子的注入平衡。基于目前空穴传输材料的能级特性，以及量子点材料的外壳材料的能级特性，本申请通过研究发现至少需要ΔE EML-HTL≥0.5eV的能级势垒，才能实现空穴注入效率的显著减小，使发光层中电子与空穴注入效率平衡。另外，本申请ΔE EML-HTL≥0.5eV的空穴注入势垒并不会导致空穴无法注入，因为量子点在通电工作状态下外壳层的能级会发生能带弯曲，载流子可以通过隧穿效应实现注入；因而这种能级势垒的增加虽然会造成载流子注入速率的降低，但并不会完全阻碍载流子的最终注入。
量子点材料一般由元素周期表II-IV族、II-VI族、II-V族、III-V族、III-VI族、IV-VI族、I-III-VI族、II-IV-VI族、II-IV-V族等半导体化合物构成，或由上述半导体化合物中至少两种组成的核壳结构。在一些实施例中，核壳结构的量子点材料中，包括内核和外壳层。在另一些实施例中，核壳结构的量子点材料中，包括内核、外壳层，以及位于内核和外壳层之间的中间桥层，中间桥层可以是一层，也可以是多层。核壳结构的量子点材料中内核材料决定发光性能，外壳材料起到保护内核发光稳定性，利于载流子注入作用，电子、空穴经过外壳层注入到内核进行发光。一般内核的带隙比外壳窄，所以空穴传输材料与量子点内核价带能级差要小于空穴传输材料与量子点外壳价带能级差。因此，本申请实施例ΔE EML-HTL大于等于0.5eV能够同时确保空穴载流子有效的注入量子点材料的内核。本申请实施例对核壳结构的量子点材料的具体结构和具体材料类型，在后文实施例中根据不同应用情况有详细描述。
在一些实施例中，量子点材料的外壳层材料与空穴传输层中空穴传输材料的价带顶能级差为0.5～1.7eV，即ΔE EML-HTL为0.5eV～1.7eV，在量子点材料的外壳层材料与空穴传输材料之间构建的该范围的能级势垒，可适用于由不同空穴传输材料和量子点材料构筑的器件体系，优化不同器件体系中电子与空穴的注入平衡。在实际应用中可根据具体的材料性能，设置不同顶价带能级差ΔE EML-HTL的情形，精细调控发光层两侧空穴和电子的载流子注入速率，使空穴和电子注入平衡。
在一些具体实施例中，量子点材料的外壳层材料与空穴传输材料的价带顶能级差为0.5eV～0.7eV，此时可以采用空穴传输材料为TFB、P12、P15，量子点外壳材料为ZnSe、CdS，如：TFB-ZnSe、P12/P15-CdS等器件体系。
在一些具体实施例中，量子点材料的外壳层材料与空穴传输材料的价带顶能级差为0.7eV～1.0eV，此时可以采用空穴传输材料为TFB、P09，量子点外壳材料为ZnSe、CdS，如：P09-ZnSe、TFB-CdS等器件体系。
在一些具体实施例中，量子点材料的外壳层材料与空穴传输材料的价带顶能级差为1.0eV～1.4eV，此时可以采用空穴传输材料为TFB、P09、P13、P14，量子点外壳材料为CdS、ZnSe、ZnS，如：TFB-ZnS、P09-CdS、P13/P14-ZnSe等器件体系。
在一些具体实施例中，量子点材料的外壳层材料与空穴传输材料的价带顶能级差大于1.4eV～1.7 eV，此时可以采用P09-ZnS、P13/P14-ZnS等器件体系。
从一方面考虑，由于目前器件中空穴注入层往往是为了提高空穴的注入效率，而本申请部分实施例QLED器件需要通过一定的方式调控空穴注入至较低的速率。因此，在一些具体实施例中，本申请实施例第一方面提供的光电器件中可以不设置空穴注入层。
从另一方面考虑，QLED器件中空穴注入层的设置不仅仅可以提高空穴注入效率，同时也能调节空穴平稳、均衡注入，是影响器件的性能、寿命等性能关键因素之一。因此，本申请实施例也可以通过在器件中设置空穴注入层调控器件中空穴注入效率，以及减少电荷积累对器件寿命的影响。具体地：
通常在QLED器件性能的研究中，更多关注的是发光层EML两侧，如HTL或ETL界面的电荷积累所造成的界面损坏，以及对于EML发光层中激子的淬灭。但实际上HIL到HTL的界面能级势垒也容易形成电荷积累，从而使得HIL与HTL之间的界面在电场的作用下发生不可逆的破坏，造成器件电压上升，器件亮度衰减。而且，此时所造成的QLED器件电压上升与在EML界面处电荷积累所造成的电压上升存在如下明显不同：HIL与HTL之间界面由于电荷积累产生电场，所造成的破坏通常不可逆，并且该破坏可以随着器件持续通电一直发生，即会持续恶化；而EML界面处的电荷积累是可逆的且会达到一定程度的饱和。因此，HIL与HTL之间界面电荷积累对器件的寿命等性能影响更大。
一方面，本申请实施例为了减少HIL与HTL界面电荷积累对器件寿命性能造成不可逆破坏，优化QLED器件内载流子的注入、复合效率。如附图2所示，本申请实施例第二方面，在上述第一方面实施例的基础上或者单独提供一种光电器件，光电器件包括第一空穴注入层，第一空穴注入层位于阳极层和空穴传输层之间，空穴传输层材料的价带顶能级与第一空穴注入层中第一空穴注入材料的功函差值的绝对值小于等于0.2eV。
本申请第二方面提供的光电器件，通过限定|ΔE HTL-HIL|小于等于0.2eV，使HTL与HIL之间的空穴注入能级势垒能够显著降低，提高空穴从阳极的注入效率，有利于空穴从HIL向HTL的有效注入，消除势垒及界面电荷，减小器件的整体电阻，从而减少在HIL和HTL之间界面处电荷积累造成不可逆破坏，降低器件驱动电压、提升器件寿命。若|ΔE HTL-HIL|大于0.2eV，则HIL到HTL的界面能级势垒容易形成电荷积累，从而使得HIL与HTL之间的界面在电场的作用下发生不可逆的破坏，造成器件电压上升，器件亮度衰减。
在一些实施例中，空穴传输层材料的价带顶能级与第一空穴注入材料的功函差值的绝对值为0eV。本申请实施例的|ΔE HTL-HIL|为0，此时空穴从HIL向HTL的有效注入效果好，势垒及界面电荷消除，器件的整体电阻减小，从而降低器件驱动电压、提升器件寿命。
在一些实施例中，第一空穴注入材料的功函绝对值为5.3eV～5.6eV，该功函大小的空穴注入材料与目前常规的空穴传输材料的价带能级的绝对值比较接近(5.4eV左右)，有利于控制|ΔE HTL-HIL|在较低的范围，使两者能级基本齐平，消除势垒及界面电荷，降低器件驱动电压、提升器件寿命。本申请实施例通过选择具有合适能级的HIL和HTL材料，使|ΔE HTL-HIL|小于等于0.2eV，可以有效消除HIL到HTL的能级势垒，以及界面处的电荷积累，从而减少在HIL和HTL之间界面处造成的不可逆破坏。
在一些实施例中，空穴传输材料的迁移率高于1×10 -4cm 2/Vs。本申请实施例采用迁移率高于1×10 -4cm 2/Vs的空穴传输材料，经发明人大量实验发现，采用上述迁移率的空穴传输材料可改善空穴的传输迁移效果，防止电荷积累，消除界面电荷，更好的降低器件驱动电压、提升器件寿命。
另一方面，本申请实施例为了降低QLED器件内空穴注入速率，调控载流子的注入、复合效率，同时减少HIL与HTL界面电荷积累对器件寿命性能造成不可逆破坏。如附图3所示，本申请实施例第三方面，在上述第一方面实施例的基础上或者单独提供一种光电器件，包括第二空穴注入层，第二空穴注入层位于阳极层和空穴传输层之间，空穴传输层中空穴传输层材料的价带顶能级与第二空穴注入层中第二空穴注入材料的功函差值小于-0.2eV。
本申请第三方面提供的光电器件，通过在空穴传输层材料与第二空穴注入材料之间构筑小于-0.2eV的注入势垒，即ΔE HTL-HIL＜-0.2eV，增大阳极向HIL的空穴注入势垒，从而降低QLED器件内空穴注入的整体速率，有效控制了进入QLED器件内的空穴数量。一方面，有效的减少了空穴注入到发光层内的速率，使发光层中空穴电子注入速率平衡，提高载流子复合效率；另一方面，又能避免空穴注入过多在HTL和HIL界面处形成电荷积累，防止界面电荷积累对器件寿命造成不可逆的破坏作用。同时，形成从HTL向HIL的空穴阻挡势垒，防止空穴扩散至HIL层，提高空穴的利用率，确保空穴在注入到发光层之前有效的“存活”。保证载流子在器件稳定工作状态下注入平衡的基础上，充分有效地利用器件中注入的空穴，保证器件的发光效率，实现器件效率和寿命的同时提升。
在一些实施例中，光电器件的量子点发光层中包含的核壳结构的量子点材料，其外壳层材料与空穴传输材料的价带顶能级差大于0eV，即ΔE EML-HTL＞0，发光层的能级深于空穴传输层；同时，空穴传输层材料与第二空穴注入材料之间存在小于-0.2eV的注入势垒，即ΔE HTL-HIL＜-0.2eV，空穴注入层的能 级深于空穴传输层。此时，在发光层-空穴传输层-空穴注入层之间，形成“深-浅-深”的能级结构，使注入到空穴传输层的空穴形成空穴载流子阱，有效地“存储”住累积的空穴而不扩散至HTL层以外的其他功能层或界面。并消除界面电荷对器件的影响，在保证载流子在器件稳定工作状态下注入平衡的基础上，更充分有效地利用器件中注入的空穴，保证器件的发光效率，实现器件效率和寿命的同时提升。在一些具体实施例中，量子点材料的外壳层材料与空穴传输材料的价带顶能级差大于等于0.5eV；在其他一些具体实施例中，量子点材料的外壳层材料与空穴传输材料的价带顶能级差还可以为0.5eV～1.7eV，即ΔE EML-HTL为0.5eV～1.7eV，经实验验证，上述实施例形成的空穴载流子阱效果好，在实际应用过程中通过空穴载流子阱更精细的调控器件发光层中空穴与电子的注入平衡，提高载流子复合效率。
在一些实施例中，空穴传输层材料的价带顶能级与第二空穴注入材料的功函差值为-0.9eV～-0.2eV，ΔE HTL-HIL差值为-0.9eV～-0.2eV，在该范围内对空穴的注入和传输有较好的平衡效果。若低于-0.9eV，则空穴注入阻力加大，导致空穴注入量减少，影响发光层中空穴与电子的平衡注入及有效复合；若势垒大于-0.2eV，则空穴容易在界面形成积累，且利用率不高。
在一些实施例中，第二空穴注入材料的功函绝对值为5.4eV～5.8eV。本申请实施例第二空穴注入材料的功函绝对值为5.4eV～5.8eV，在该范围内有利于与空穴传输材料之间形成能极差小于-0.2eV空穴阻挡势垒。具体地，常规空穴传输材料的价带绝对值大概在5.3-5.4eV，功函绝对值大于等于5.4eV的第二空穴注入材料可与常规空穴传输材料形成小于-0.2eV的负能级差，从而形成空穴阻挡势垒，优化空穴注入速率，提高空穴利用率。
在一些实施例中，空穴传输材料的迁移率高于1×10 -4cm 2/Vs，本申请实施例采用迁移率高于1×10 -4cm 2/Vs的空穴传输材料，确保空穴的传输迁移效果，防止电荷积累，消除界面电荷，更好的降低器件驱动电压、提升器件寿命。
本申请上述第二方面和第三方面实施例中，空穴注入材料选择金属氧化物材料。即，在一些具体实施例中，当光电器件包含第一空穴注入层时，第一空穴注入层中第一空穴注入材料选自金属氧化物材料。在另一些具体实施例中，当光电器件包含第二空穴注入层时，第二空穴注入层中第二空穴注入材料选自金属氧化物材料。本申请上述实施例中，空穴注入材料采用的金属氧化物材料，具有更好的稳定性，且不具有酸性，不但能满足上述各实施例对空穴注入的要求，而且不会对相邻功能层产生负面影响。避免了有机空穴注入材料在器件工作过程中由于热效应或电学效应破坏对器件寿命造成的衰减，同时避免了有机空穴注入材料的酸性对相邻功能层的破坏作用。
在一些实施例中，金属氧化物材料包括：氧化钨、氧化钼、氧化钒、氧化镍、氧化铜中的至少一种金属纳米材料，这些金属纳米材料具有较好的稳定性，不具有酸性，在实际应用过程中可通过调控功函大小，实现与空穴传输层构筑不同大小的能级势垒，进而有利于调控空穴注入和传输，提高载流子复合效率，减少电荷积累对器件寿命的影响。
在一些实施例中，金属氧化物材料的粒径为2～10nm，小粒径的金属氧化物材料有利于沉积得到膜层致密、厚度均一的薄膜，提高其与相邻功能层的结合紧密性，降低界面电阻，有利于提高器件性能。
在另一些实施例中，空穴注入材料也可以采用聚(3,4-乙烯二氧噻吩)-聚苯乙烯磺酸(PEDOT:PSS)、HIL2、HIL1-1、HIL1-2、酞菁铜(CuPc)、2,3,5,6-四氟-7,7',8,8'-四氰醌-二甲烷(F4-TCNQ)、2,3,6,7,10,11-六氰基-1,4,5,8,9,12-六氮杂苯并菲(HATCN)等有机空穴注入材料。其中，PEDOT:PSS包含结构式为：
Figure PCTCN2021143432-appb-000001
的有机分子，其功函为-5.1eV；HIL2包含结构式为：
Figure PCTCN2021143432-appb-000002
Figure PCTCN2021143432-appb-000003
的有机分子，其功函为-5.6eV；HIL1-1和HIL1-2中均包含结构式为：
Figure PCTCN2021143432-appb-000004
的有机分子，HIL1-1的功函为-5.4eV，HIL1-2的功函为-5.3eV。
在一些实施例中，第一空穴注入层的厚度为10～150nm。在另一些实施例中，第二空穴注入层的厚度为10～150nm。本申请空穴注入层的厚度可根据实际应用需求进行灵活调控，同时也可通过对空穴注入层厚度的调节较好的实现对空穴注入速率的调节。
本申请实施例为了构筑ΔE EML-HTL大于等于0.5eV的能级势垒，实现降低QLED器件内空穴注入速率，调控载流子的注入、复合效率的目的，同时减少HIL与HTL界面电荷积累对器件寿命性能造成不可逆破坏。如附图4所示，本申请实施例第四方面提供一种光电器件，该光电器件的空穴传输层中至少包含两种空穴传输材料，其中，至少一种空穴传输材料的价带顶能级的绝对值小于等于5.3eV。在具体实施例中，上述至少两种空穴传输材料至少包括一种价带顶能级的绝对值小于等于5.3eV的空穴传输材料和一种价带顶能级的绝对值大于5.3eV的空穴传输材料。
本申请第四方面提供的光电器件的空穴传输层为包含多种不同价带顶能级空穴传输材料的混合材料层，其中至少一种空穴传输材料的价带顶能级小于等于5.3eV，而常规量子点发光材料的壳层能级往往比较深(6.0eV或更深)，因此，使得浅能级的空穴传输材料与量子点外壳材料之间形成大于等于0.5eV的能级差。另外，包含的价带顶能级绝对值大于5.3eV的空穴传输材料，可小幅度更精细的调控空穴传输材料与发光材料外壳层之间的能级差。从而使空穴传输层中通过绝对值小于等于5.3eV的浅能级空穴传输材料、绝对值大于5.3eV的深能级空穴传输材料之间的相互搭配，实现对空穴传输材料与量子点外壳层之间的空穴注入势垒的精细调控，同时也可以通过不同能级深浅的空穴传输材料调节HTL层中空穴迁移率。实现ΔE EML-HTL大于等于0.5eV的能级势垒，通过提高空穴注入势垒，降低空穴的注入效率，从而改善发光层中空穴与电子的注入平衡，提高器件发光效率，同时减少电荷积累对器件寿命的影响。
在一些实施例中，光电器件的空穴传输层中至少包含两种空穴传输材料，其中，一种空穴传输材料的价带顶能级的绝对值小于等于5.3eV，还包括价带顶能级的绝对值大于5.3eV小于5.8eV的空穴传输材料。在一些实施例中，空穴传输层中至少包含两种空穴传输材料，一种空穴传输材料的价带顶能级的绝对值小于等于5.3eV，还包括价带顶能级的绝对值大于等于5.8eV的空穴传输材料。在另一些实施例中，空穴传输层中至少包含三种空穴传输材料，一种空穴传输材料的价带顶能级的绝对值小于等于5.3eV，同时还包括价带顶能级的绝对值大于5.3eV小于5.8eV的空穴传输材料和价带顶能级的绝对值大于等于5.8eV的空穴传输材料。本申请实施例通过浅能级材料和深能级材料的混合匹配，可根据实际应用需求、器件体系等因素灵活调控空穴注入势垒，使空穴到发光材料的注入能级势垒大于等于0.5eV，降低空穴的注入效率，从而平衡发光层中空穴与电子的注入平衡，应用灵活方便。
在一些实施例中，当空穴传输层中包括价带顶能级大于5.3eV小于5.8eV的空穴传输材料时，光电器件的电子传输层中可以采用有机电子传输材料层、ZnO纳米颗粒等金属氧化物纳米颗粒层、溅射沉积的金属氧化物层中的至少一种。本申请实施例当空穴传输层中包括至少一种空穴传输材料的价带顶能级小于等于5.3eV和价带顶能级大于5.3eV小于5.8eV的空穴传输材料时，此时空穴传输层具有较为适中的价带顶能级和空穴迁移率，因此可以较好地与ZnO等常规金属氧化物或有机电子传输材料相匹配，有利于空穴与电子电荷平衡的调控。
在一些实施例中，当空穴传输层中包括价带顶能级大于等于5.8eV的空穴传输材料时，光电器件的电子传输层中可以采用金属氧化物纳米颗粒，选择表面基团连接较少的金属氧化物纳米颗粒。本申请实施例当空穴传输层中包括价带顶能级大于5.8eV的空穴传输材料时，此时在能级和迁移率两个性能上均与前述空穴传输材料的价带顶能级小于等于5.3eV的浅价带顶能级的空穴传输层材料具有较大的差异，通过不同的混合比例可以实现在较大窗口范围内的连续调控，适合于从器件初始状态到持续工作至稳定状态过程中电子注入和传输变化差异性较大的QLED器件体系，例如表面基团连接较少的金属氧化物纳米颗粒。
在一些实施例中，空穴传输层为包含不同能级空穴传输材料的混合材料层，其中，价带顶能级的绝对值小于等于5.3eV的空穴传输材料的质量百分含量为30～90％；浅能级空穴传输材料的该百分含量，容易与发光材料的外壳层形成大于等于0.5eV的空穴注入势垒，在实际应用中，可根据材料能级深浅，灵活调控各能级大小材料的混合比例。在一些具体实施例中，价带顶能级的绝对值小于等于5.3eV的空穴传输材料的质量百分含量为50～60％时具有不错的效果。
在一些实施例中，空穴传输层为包含不同能级空穴传输材料的混合材料层，其中，至少一种空穴传输材料的迁移率高于1×10 -3cm 2/Vs，本申请实施例空穴传输材料的高迁移率确保了空穴的传输迁移性能，减少空穴在界面积累导致影响器件性能。另外，高空穴迁移率的空穴传输层材料其价带顶能级相对比较浅，也确保了与量子点外壳材料之间形成合适的能极差。
在一些具体实施例中，空穴传输层为包含不同能级空穴传输材料的混合材料层，其中，至少一种空穴传输材料的迁移率高于1×10 -2cm 2/Vs。在另一些具体实施例中，空穴传输层为包含不同能级空穴传输材料的混合材料层，其中，每一种空穴传输材料的迁移率均高于1×10 -3cm 2/Vs。本申请上述实施例通过优化空穴传输材料的迁移率，同时确保空穴的迁移效率，避免电荷积累影响器件性能，同时确保空穴传输层中深浅能级的空穴传输材料的搭配，构筑空穴的注入势垒，确保形成ΔE EML-HTL大于等于0.5eV的能级势垒，优化QLED器件内载流子的注入平衡和复合效率。
本申请实施例为了构筑ΔE EML-HTL大于等于0.5eV的能级势垒，实现降低QLED器件内空穴注入速率，调控载流子的注入、复合效率的目的，同时减少HIL与HTL界面电荷积累对器件寿命性能造成不可逆破坏。如附图5所示，本申请实施例第五方面提供一种光电器件，该光电器件的空穴传输层中至少包含两种空穴传输材料，每种空穴传输材料的价带顶能级的绝对值均小于等于5.3eV。
本申请第五方面提供的光电器件的空穴传输层为包含多种不同价带顶能级空穴传输材料的混合材料层，其中，每一种空穴传输材料的价带顶能级均小于等于5.3eV，与壳层能级较深的量子点发光材料可形成大于等于0.5eV的能级差。实现对于构造HTL与EML中量子点外壳层之间的空穴注入势垒更精细的调控，使器件ΔE EML-HTL≥0.5eV。从而实现QLED器件在进入稳定工作状态后，电荷注入平衡以及器件效率保持，实现器件寿命的最优化。另外，利用同样都为具有浅价带顶能级的空穴传输层材料的不同空穴迁移率，通过不同混合比例还可以对混合空穴传输层的空穴迁移率进行精细调控。
在一些实施例中，空穴传输层包含不同能级空穴传输材料的混合材料层，其中，每一种空穴传输材料的质量百分含量为5～95％，通过不同能级深浅、迁移率大小的空穴传输材料混合搭配，对混合空穴传输层的空穴迁移率和注入势垒有较好的调控效果。
在一些实施例中，空穴传输层包含不同能级空穴传输材料的混合材料层，其中，至少一种空穴传输材料的迁移率高于1×10 -3cm 2/Vs，高空穴迁移率的空穴传输层材料其价带顶能级相对比较浅。限定空穴传输材料的迁移率，高迁移率确保了空穴的传输迁移性能，同时确保了形成更合适的注入势垒，避免空穴在界面积累导致影响器件性能。在一些实施例中，空穴传输层中至少一种空穴传输材料的迁移率高于1×10 -2cm 2/Vs。在一些实施例中，空穴传输层中，每一种空穴传输材料的迁移率均高于1×10 -3cm 2/Vs。
在一些实施例中，当空穴传输层中空穴传输材料的价带顶能级均小于等于5.3eV时，光电器件的电子传输层中采用表面钝化的金属氧化物纳米颗粒，选择表面充分修饰钝化的金属氧化物纳米颗粒。本申请实施例当空穴传输层中空穴传输材料的价带顶能级均小于等于5.3eV时，要对应电子注入和传输变化小的材料，此时适合于从器件初始状态到持续工作至稳定状态过程中电子注入和传输变化差异性较小的QLED器件体系，例如表面充分修饰钝化的金属氧化物纳米颗粒。
本申请上述各实施例的光电器件中，空穴传输材料选自含苯胺基团的聚合物、含有芴基团和苯胺基团的共聚物中的至少一种，这些空穴传输材料具有空穴传输效率高，稳定性好，容易获取等优点。在实际应用过程中，可根据实际应用需求，选择合适能级大小、迁移率的空穴传输材料，具体地：
在一些具体实施例中，当光电器件中需要价带顶能级的绝对值小于等于5.3eV的空穴材料时，价带顶能级的绝对值小于等于5.3eV的空穴传输材料可选择：P09、P13中的至少一种。其中，P13的结构式为：
Figure PCTCN2021143432-appb-000005
P09的结构式为：
Figure PCTCN2021143432-appb-000006
在另一些具体实施例中，当光电器件中需要价带顶能级的绝对值大于5.3eV小于5.8eV的空穴材料时，价带顶能级的绝对值大于5.3eV小于5.8eV的空穴传输材料包括：TFB、poly-TPD、P11中的至少 一种。其中，P11的结构式为：
Figure PCTCN2021143432-appb-000007
poly-TPD的结构式为：
Figure PCTCN2021143432-appb-000008
TFB的结构式为：
Figure PCTCN2021143432-appb-000009
在另一些具体实施例中，当光电器件中需要价带顶能级的绝对值大于等于5.8eV的空穴材料时，价带顶能级的绝对值大于等于5.8eV的空穴传输材料包括：P15、P12中的至少一种。其中，P12的结构式为：
Figure PCTCN2021143432-appb-000010
P15的结构式为：
Figure PCTCN2021143432-appb-000011
在一些实施例中，空穴传输材料的迁移率高于1×10 -4cm 2/Vs，高迁移率确保了空穴的传输迁移性能，减少电荷积累对器件寿命的影响。
本申请上述各实施例中，核壳结构的量子点材料包括上述外壳层，还包括内核，以及位于内核与外壳层之间的中间壳层；其中，内核材料的价带顶能级浅于外壳层材料的价带顶能级；中间壳层材料的价带顶能级介于内核材料的价带顶能级和外壳层材料的价带顶能级之间。本申请实施例核壳结构的量子点材料中，内核材料影响发光性能，外壳材料起到保护内核发光稳定性和利于载流子注入作用，价带介于内核与外壳层之间的中间壳层，起到中间过渡作用，有利于载流子注入，中间壳层在能级上可形成从内核到外壳层的阶梯式能级过渡，这样有助于实现载流子的有效注入、有效束缚以及减少晶格界面的闪烁。
在一些实施例中，量子点材料的外壳层包括：CdS、ZnSe、ZnTe、ZnS、ZnSeS、CdZnS、PbS中的至少一种或者至少两种形成的合金材料。这些外壳层材料不但保护内核发光稳定性，利于载流子注入到量子点内核进行发光，而且能与HTL层材料形成ΔE EML-HTL大于等于0.5eV的能级势垒，通过提高空穴注入势垒，降低空穴的注入效率，从而平衡发光层中空穴与电子的注入平衡，提高器件发光效率，同时减少电荷积累对器件寿命的影响。
在一些实施例中，量子点材料的内核包括：CdSe、CdZnSe、CdZnS、CdSeS、CdZnSeS、InP、InGaP、GaN、GaP、ZnSe、ZnTe、ZnTeSe中的至少一种。量子点材料的发光性能与内核材料相关，这些材料确保了QLED器件在400～700nm可见光范围内实现发光，不但满足光电显示器件应用所需的范围，而且这些材料能级相互关系实现的有益效果能够更好地体现。
在一些实施例中，中间壳层材料选自CdZnSe、ZnSe、CdZnS、CdZnSeS、CdS、CdSeS中的至少一种。在本申请的具体实施例中，中间壳层选择在组成成分上形成从内核到外层的组成成分连续自然过渡，这样有助于实现内核、中间壳层、外壳层三者之间最少的晶格失配及最少的晶格缺陷，从而实现核壳量子点材料自身最优的发光性能。
在一些实施例中，量子点材料的发光峰波长范围为400～700nm，一方面这个波长范围是光电显示器件应用所需的范围，另一方面器件中发光层在此波长范围能级相互关系实现的有益效果能够更好地体 现。
在一些实施例中，量子点材料的外壳层厚度为0.2～6.0nm，该厚度涵盖了常规外壳的厚度，可广泛是适用于不同体系的QLED器件中。若外壳层的厚度过大时，载流子通过隧穿效应注入到发光量子点的速率会降低；而外壳层的厚度过小时，外壳材料无法对内核材料起到足够的保护作用和钝化作用，影响量子点材料的发光性能和稳定性能。
本申请上述各实施例中，光电器件还包括电子传输层，电子传输层中电子传输材料选自金属氧族化合物传输材料、有机传输材料中的至少一种。其中，金属氧化物材料一般来说具有较高的电子迁移率，可通过溶液法方式或真空溅射方式在QLED器件中制备成薄膜。有机电子传输层材料可以在较宽的范围内实现能级的调控，可通过真空蒸镀方式或溶液法方式在QLED器件中制备成薄膜；其中溶液法方式包括喷墨打印、旋涂、喷印、狭缝涂布或丝网印刷等。可根据实际应用需求灵活选择更合适的电子传输材料。
在一些实施例中，金属氧族化合物传输材料选自氧化锌、氧化钛、硫化锌、硫化镉中的至少一种。本申请上述实施例采用的这些金属氧族化合物传输材料均具有较高的电子迁移效率。在一些实施例中，为提高电子迁移效率，金属氧族化合物传输材料选自掺杂有金属元素的氧化锌、氧化钛、硫化锌、硫化镉中的至少一种，其中，金属元素包括铝、镁、锂、镧、钇、锰、镓、铁、铬、钴中至少一种，这些金属元素可提高材料的电子迁移效率。
在一些实施例中，金属氧族化合物传输材料的粒径小于等于10nm，一方面，小粒径的金属氧族化合物传输材料更有利于沉积得到膜层致密、厚度均一的电子传输层薄膜，提高其与相邻功能层的结合紧密性，降低界面电阻，更有利于提高器件性能。另一方面，小粒径的金属氧族化合物传输材料带隙更宽，减小了对量子点材料的激子发光淬灭，提高器件效率。
在一些实施例中，金属氧族化合物传输材料的电子迁移率为10 -2～10 -3cm 2/Vs，高迁移率的电子传输材料，能够减少电荷在界面层的积累，提高电子注入、复合效率。
在一些实施例中，有机传输材料的电子迁移率不低于10 -4cm 2/Vs。在一些实施例中，有机传输材料选自8-羟基喹啉-锂(Alq 3)、八羟基喹啉铝、富勒烯衍生物PCBM、3,5-双(4-叔丁基苯基)-4-苯基-4H-1,2,4-三唑(BPT)、1,3,5-三(1-苯基-1H-苯并咪唑-2-基)苯(TPBi)中的至少一种。这些有机传输材料可以在较宽的范围内实现能级的调控，更有利于调控器件各功能层能级，提高器件的稳定性和光电转化效率。
在一些实施例中，电子传输层为叠层复合结构，其中包括至少两层子电子传输层，通过选择不同传输迁移效率、能级调控特性的子电子传输层，可更灵活的调控电子传输层性，从而更好的优化器件性能。
在一些实施例中，电子传输层中，至少一层子电子传输层的材料为金属氧族化合物传输材料。在一些实施例中，电子传输层中，所有子电子传输层均为金属氧化物，不同子电子传输层的金属氧化物材料可以相同或不同。即在所有子电子传输层均为金属氧化物的多层电子传输层中，可以为包含至少一层的金属氧化物纳米颗粒的子电子传输层以及至少一层的非纳米颗粒类型金属氧化物的子电子传输层。也可以为子电子传输层分别是掺杂和本征金属氧化物(如Mg掺杂ZnO+本征ZnO)。也可以为子电子传输层均为同一种金属氧化物纳米颗粒。当子电子传输层均为同一种金属氧化物纳米颗粒时，不同子电子传输层的电子迁移率可以相同或不相同。
在一些实施例中，电子传输层中，至少一层子电子传输层的材料为有机传输材料。在一些实施例中，电子传输层中，至少一层子电子传输层的材料为金属氧族化合物传输材料，至少一层子电子传输层的材料为有机传输材料，不同子电子传输层的金属氧化物材料可以相同或不同；金属氧化物材料选择为相应金属氧化物的纳米颗粒。通过电子传输层中金属氧族化合物传输材料和有机传输材料的共同调配作用，使电子传输层同时具有高电子迁移率以及能级匹配的灵活性。实现电子传输层的能级和电子迁移率的有效调控，从而达到与空穴注入的充分匹配。在一些具体实施例中，包含多层子电子传输层的电子传输层可以是ZnO纳米颗粒+NaF的组合、Mg掺杂ZnO纳米颗粒+NaF的组合等叠层复合结构。
由于核壳结构的量子点材料中，内核材料影响量子点材料的发光性能，壳层材料起到保护作用，以及有利于载流子注入。当外壳层材料确定后，可以通过调节壳层厚度以及空穴传输材料的价带顶能级大小等，使量子点材料的外壳层材料与空穴传输材料之间价带顶能级差大于等于0.5eV，即构建预期的注入势垒，E EML-HTL≥0.5eV，优化发光层中电子与空穴注入效率平衡，提高器件效率和使用寿命。
如附图6所示，本申请实施例第六方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为ZnSe，空穴传输层中空穴传输材料的价带顶能级的绝对值小于等于5.4eV。
本申请第六方面提供的光电器件，在量子点材料的外壳层具体为ZnSe的前提下，根据ZnSe的能级等特性，设计了光电器件的结构。具体地，由于ZnSe外壳材料的价带能级相对较浅(能级绝对值较小)，若要构建价带顶能级差(ΔE EML-HTL)大于等于0.5eV的空穴注入势垒，则空穴传输材料的价带顶能级 绝对值应小于等于5.4eV。此时，ΔE EML-HTL≥0.5eV，构建了空穴注入势垒，降低空穴注入速率，平衡发光层中电子空穴的注入效率，减少载流子积累，提高发光效率。
在一些实施例中，量子点材料中，ZnSe壳层厚度为2～5nm。本申请实施例由于ZnSe的带隙相对较窄，对于量子点内核中激子的束缚能力相对较差，为了保证量子点内核发光材料自身的良好发光效率，需使用较厚的ZnSe外壳层厚度，选择的外壳层厚度为2.0～5.0纳米。若外壳层的厚度过大时，载流子通过隧穿效应注入到发光量子点的速率会降低；而外壳层的厚度过小时，载流子通过隧穿效应注入到发光量子点的速率则会提高，但是当外壳层的厚度小到一定程度时，外壳层结构将无法对内核起到足够的保护和钝化作用，从而影响量子点材料的发光性能和稳定性。
在一些实施例中，量子点材料的发光峰波长为510～640nm。对于发光波长较短、量子点核带隙较宽的蓝色核壳量子点来说，即使使用厚的ZnSe外壳层仍然无法充分保证量子点材料自身的发光效率，因此，本申请实施例选择的量子点发光材料应为发光峰波长范围应为510～640纳米的红色或绿色量子点，更好的确保量子点的发光效率。
在一些实施例中，ZnSe材料与空穴传输材料的价带顶能级差为0.5～1.0eV。本申请实施例由于ZnSe外壳层具有较厚的厚度，导致载流子通过隧穿效应注入到发光量子点的速率变弱，因此相应的空穴传输层材料与量子点外壳层材料的价带顶能级差(ΔE EML-HTL)可以选择在0.5～1.0eV之间。若ΔE EML-HTL过大，将降低空穴注入量子点发光内核的效率，影响量子点材料的发光效率。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9eV～5.4eV，在该范围内能够与ZnSe外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。
在一些具体实施例中，空穴传输材料的价带顶能级的绝对值为4.9eV～5.4eV，此时，ZnSe材料与空穴传输材料的价带顶能级差为0.5～1.0eV。
在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs，由于本申请实施例采用的空穴传输材料的价带顶能级的绝对值小于等于5.4eV，能级较浅，较浅的价带顶能级的空穴传输层材料通常会具有较高的空穴迁移率，有利于空穴在一定厚度的空穴传输层薄膜中有效传输空穴，减小了器件的整体电阻，从而降低器件驱动电压、提升器件寿命。
如附图7所示，本申请实施例第七方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为ZnS，空穴传输层中空穴传输材料的价带顶能级的绝对值小于等于6.0eV。
本申请第七方面提供的光电器件，在量子点材料的外壳层具体为ZnS的前提下，根据ZnS的能级等特性，设计了光电器件的结构。具体地，ZnS外壳材料的价带能级较深(相对于ZnSe而言，能级绝对值更大)，要构建价带顶能级差(ΔE EML-HTL)大于等于0.5eV，则空穴传输材料的价带顶能级小于等于6.0eV即可。此时，ΔE EML-HTL≥0.5eV，构建了空穴注入势垒，降低空穴注入速率，平衡发光层中电子空穴的注入效率，减少载流子积累，提高发光效率。
在一些实施例中，ZnS壳层厚度为0.2～2.0nm。本申请实施例由于ZnS的带隙较宽，对于量子点内核中激子的束缚能力较强，因此采用较薄的ZnS外壳层厚度就可以基本保证量子点发光材料自身的良好发光效率，外壳层厚度为0.2～2.0纳米。同时薄ZnS外壳也可有效降低器件的整体电阻，降低器件驱动电压从而提升器件性能。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9eV～6.0eV，在该范围内能够与ZnS外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9eV～5.5eV。
在一些实施例中，ZnS材料与空穴传输材料的价带顶能级差为1.0～1.6eV。本申请实施例由于ZnS外壳层具有较薄的厚度，导致载流子通过隧穿效应注入到发光量子点的速率变强，因此相应的空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)需要适当地增加，从而更好平衡空穴与电子的注入平衡，其范围应在1.0-1.6eV之间。若ΔE EML-HTL不宜过大，则降低了空穴注入量子点发光内核的效率，影响量子点材料的发光效率。
在一些实施例中，量子点材料的发光峰波长为400～700nm。本申请实施例由于ZnS的带隙较宽，对于量子点内核中激子的束缚能力较强，可有效保证量子点材料自身的发光效率，适用于发光峰波长为400～700nm的可见光区域内的所有量子点材料，适用范围广。
在一些实施例中，由于本申请实施例采用的空穴传输材料的价带顶能级较深(小于等于6.0eV)，空穴迁移率相对较低，空穴传输材料的迁移率高于1×10 -4cm 2/Vs。在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
如附图8所示，本申请实施例第八方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为CdZnS，空穴传输层中空穴传输材料 的价带顶能级的绝对值小于等于5.9eV。
本申请第八方面提供的光电器件，在量子点材料的外壳层具体为CdZnS的前提下，根据CdZnS的能级等特性，设计了光电器件的结构。具体地，由于本实施例量子点的外壳层采用CdZnS，价带能级介于ZnSe和ZnS之间，此时要构建价带顶能级差(ΔEEML-HTL)大于等于0.5eV的空穴注入势垒，则空穴传输材料的价带顶能级需要小于等于5.9eV。通过构建的空穴注入势垒，降低空穴注入速率，平衡发光层中电子空穴的注入效率，减少载流子积累，提高发光效率。
在一些实施例中，CdZnS壳层厚度为0.5～3.0nm，由于CdZnS的带隙介于ZnSe和ZnS之间，外壳层厚度为0.5～3.0纳米时，能够同时保障对于量子点内核中激子的束缚能力，以及量子点发光材料自身的良好发光效率。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.9eV，在该范围内能够与CdZnS外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.5eV。
在一些实施例中，CdZnS材料与空穴传输材料的价带顶能级差为0.8～1.4eV。本申请实施例空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)范围为0.8～1.4eV，既可保障载流子通过隧穿效应注入到发光量子点的效率，又能较好的平衡空穴与电子的注入效率。若ΔE EML-HTL过大，则载流子通过隧穿效应注入到发光量子点内核的效率降低；若ΔE EML-HTL过小，则对空穴的注入速率调节不佳。
在一些实施例中，量子点材料的发光峰波长为400～700nm。本申请实施例由于CdZnS对量子点内核中激子的束缚能力相对较强，可有效保证量子点材料自身的发光效率，适用于发光峰波长为400～700nm的可见光区域内的所有量子点材料，适用范围广。
在一些实施例中，由于本申请实施例采用的空穴传输材料的价带顶能级较深(小于等于5.9eV)，空穴迁移率相对较低，空穴传输材料的迁移率高于1×10 -4cm 2/Vs。在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
如附图9所示，本申请实施例第九方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为ZnSeS，空穴传输层中空穴传输材料的价带顶能级的绝对值小于等于5.7eV。
本申请第九方面提供的光电器件，在量子点材料的外壳层具体为ZnSeS的前提下，根据ZnSeS的能级等特性，设计了光电器件的结构。具体地，由于本实施例量子点的外壳层采用ZnSeS，价带能级介于ZnSe和ZnS之间，此时要构建价带顶能级差(ΔEEML-HTL)大于等于0.5eV的空穴注入势垒，则空穴传输材料的价带顶能级需要小于等于5.7eV。通过构建的空穴注入势垒，降低空穴注入速率，平衡发光层中电子空穴的注入效率，减少载流子积累，提高发光效率。
在一些实施例中，ZnSeS壳层厚度为1.0～4.0nm，由于ZnSeS外壳中易被氧化的Se更接近于量子点表面，因此ZnSeS外壳需要厚度更大一些以保证对于内核足够的保护和钝化，从而ZnSeS外壳层厚度为1.0～4.0纳米。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.7eV，在该范围内能够与ZnSeS外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.4eV。
在一些实施例中，ZnSeS材料与空穴传输材料的价带顶能级差为0.9～1.4eV。本申请实施例空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)范围为0.9～1.4eV时，既可保障载流子通过隧穿效应注入到发光量子点的效率，又能较好的平衡空穴与电子的注入效率。若ΔE EML-HTL过大，则载流子通过隧穿效应注入到发光量子点内核的效率降低；若ΔE EML-HTL过小，则对空穴的注入速率调节不佳。
在一些实施例中，量子点材料的发光峰波长为400～700nm。本申请实施例由于ZnSeS对量子点内核中激子的束缚能力相对较强，可有效保证量子点材料自身的发光效率，适用于发光峰波长为400～700nm的可见光区域内的所有量子点材料，适用范围广。
在一些实施例中，由于本申请实施例采用的空穴传输材料的价带顶能级较深(小于等于5.7eV)，空穴迁移率相对较低，空穴传输材料的迁移率高于1×10 -4cm 2/Vs。在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
本申请上述第六～九方面提供中光电器件中，空穴传输材料选自含苯胺基团的聚合物、含有芴基团和苯胺基团的共聚物中的至少一种，在实际应用中，可根据具体的应用需求选择合适迁移率的空穴传输材料。
在一些实施例中，空穴传输材料的价带顶能级的绝对值小于等于5.4eV的含苯胺基团的聚合物包 括：poly-TPD、P9、TFB、P13。
在一些实施例中，空穴传输材料的价带顶能级的绝对值小于等于5.4eV的含有芴基团和苯胺基团的共聚物包括：TFB、P13。
在一些实施例中，空穴传输材料的价带顶能级的绝对值大于5.4eV小于等于5.9eV的含苯胺基团的聚合物包括：P11、P12、P15。
在一些实施例中，空穴传输材料的价带顶能级的绝对值大于5.4eV小于等于5.9eV的含有芴基团和苯胺基团的共聚物包括：P12、P15。
本申请上述第六～九方面提供中光电器件中，核壳结构的量子点材料包括上述外壳层，还包括内核，以及位于内核与外壳层之间的中间壳层；其中，内核材料的价带顶能级浅于外壳层材料的价带顶能级；中间壳层材料的价带顶能级介于内核材料的价带顶能级和外壳层材料的价带顶能级之间。
在一些实施例中，内核材料选自元素周期表II-IV族、II-VI族、II-V族、III-V族、III-VI族、IV-VI族、I-III-VI族、II-IV-VI族、II-IV-V族半导体化合物中的至少一种。在一些具体实施例中，内核材料选自CdSe、CdZnSe、CdSeS、CdZnSeS、InP、InGaP、GaP、ZnTe、ZnTeSe中的至少一种。这些内核材料发光性能好，与外壳层ZnSe、ZnS、CdZnS或者ZnSeS均有较好的配合效果。
在一些具体实施例中，中间壳层材料选自CdZnSe、ZnSe、CdZnS、CdZnSeS、CdS、CdSeS中的至少一种。本申请实施例中间壳层的搭配原则为：中间壳层在组成成分上最好是形成从内核到外层的组成成分连续自然过渡，这样有助于实现内核、中间壳层、外壳层三者之间最少的晶格失配及最少的晶格缺陷，从而实现核壳量子点材料自身最优的发光性能；中间壳层在能级上一般是需形成从内核到外壳层的阶梯式能级过渡，这样有助于实现载流子的有效注入、有效束缚以及减少晶格界面的闪烁。
本申请上述第六～九方面提供中光电器件中，还可以结合上述第二或三方面光电器件中对空穴注入功能层的优化，可以包括第一空穴注入层，第一空穴注入层的第一空穴注入材料的功函与空穴传输材料的价带顶能级差值的绝对值小于等于0.2eV。或者，第二空穴注入层，空穴传输层材料的价带顶能级与第二空穴注入层中第二空穴注入材料的功函差值小于-0.2eV。提高器件中空穴利用率，精细调控空穴注入速率，使器件内载流子注入平衡，提高复合效率；同时，减少界面层电荷积累对器件寿命的影响。
本申请上述第六～九方面提供中光电器件中，还可以包括电子传输层，电子传输层包括至少两层叠层设置的子电子传输层；其中，至少一层子电子传输层的材料为金属氧族化合物传输材料。或者，至少一层子电子传输层的材料为有机传输材料。或者，至少同时包含一层子电子传输层的材料为金属氧族化合物传输材料和一层子电子传输层的材料为有机传输材料。
如附图10所示，本申请实施例第十方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为ZnSe，空穴传输层中空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
本申请第十方面提供的光电器件，由于ZnSe外壳材料的价带能级相对较浅(能级绝对值较小)，带隙相对较窄，对于量子点核壳结构中激子的束缚能力相对较差，为了保证量子点发光材料自身的良好发光效率，需使用较厚的ZnSe外壳层厚度，通过隧穿效应注入到发光量子点的速率变弱。外壳层为ZnSe的量子点层为了满足其HTL与EML中量子点外壳层之间空穴注入势垒的构造，E EML-HTL≥0.5eV，需搭配空穴迁移率高的HTL材料，高于1×10 -3cm 2/Vs，弥补隧穿效应对空穴注入速率的影响，平衡发光层中电子空穴的注入效率，减少载流子积累，提高发光效率。
在一些实施例中，量子点材料中，ZnSe壳层厚度为2～5nm。本申请实施例由于ZnSe的带隙相对较窄，对于量子点内核中激子的束缚能力相对较差，为了保证量子点内核发光材料自身的良好发光效率，需使用较厚的ZnSe外壳层厚度，外壳层厚度为2.0～5.0纳米。若外壳层的厚度过大时，载流子通过隧穿效应注入到发光量子点的速率会降低；而外壳层的厚度过小时，载流子通过隧穿效应注入到发光量子点的速率则会提高，但是当外壳层的厚度过小时，外壳层结构无法对内核起到足够的保护和钝化作用，从而影响量子点材料的发光性能和稳定性。
在一些实施例中，量子点材料的发光峰波长为510～640nm。对于发光波长较短、量子点核带隙较宽的蓝色核壳量子点来说，即使使用厚的ZnSe外壳层仍然无法充分保证量子点材料自身的发光效率，因此，本申请实施例量子点发光材料应为发光峰波长范围应为510～640纳米的红色或绿色量子点，更好的确保量子点的发光效率。
在一些实施例中，ZnSe材料与空穴传输材料的价带顶能级差为0.5～1.0eV。本申请实施例由于ZnSe外壳层具有较厚的厚度，导致载流子通过隧穿效应注入到发光量子点的速率变弱，因此相应的空穴传输层材料与量子点外壳层材料的价带顶能级差(ΔE EML-HTL)不宜过大，其范围应在0.5～1.0eV之间。若ΔE EML-HTL不宜过大，则降低了空穴注入量子点发光内核的效率，影响量子点材料的发光效率。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9eV～5.4eV，在该范围内能够与ZnSe 外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。
如附图11所示，本申请实施例第十一方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为ZnS，空穴传输层中空穴传输材料的迁移率高于1×10 -4cm 2/Vs。
本申请第十一方面提供的光电器件，当量子点外壳材料采用ZnS时，由于ZnS的带隙较宽，对于量子点核壳结构中激子的束缚能力较强，采用较薄的ZnS外壳层厚度就可以基本保证量子点发光材料自身的良好发光效率，从而载流子通过隧穿效应注入到发光量子点的速率变强。采用的空穴传输材料的空穴迁移率大于等于1×10 -4cm 2/Vs，即可同时实现构造量子点材料的外壳层材料与空穴传输材料之间价带顶能级差大于等于0.5eV的空穴注入势垒，E EML-HTL≥0.5eV，以及确保空穴传输和注入到量子点材料内的效率。
在一些实施例中，ZnS壳层厚度为0.2～2.0nm。本申请实施例由于ZnS的带隙较宽，对于量子点内核中激子的束缚能力较强，因此采用较薄的ZnS外壳层厚度就可以基本保证量子点发光材料自身的良好发光效率，外壳层厚度为0.2～2.0纳米。同时薄ZnS外壳也可有效降低器件的整体电阻，降低器件驱动电压从而提升器件性能。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9eV～6.0eV，在该范围内能够与ZnS外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9eV～5.5eV。
在一些实施例中，ZnS材料与空穴传输材料的价带顶能级差为1.0～1.6eV。本申请实施例由于ZnS外壳层具有较薄的厚度，导致载流子通过隧穿效应注入到发光量子点的速率变强，因此相应的空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)需要适当地增加，从而更好平衡空穴与电子的注入平衡，其范围应在1.0～1.6eV之间。若ΔE EML-HTL不宜过大，则降低了空穴注入量子点发光内核的效率，影响量子点材料的发光效率。
在一些实施例中，量子点材料的发光峰波长为400～700nm。本申请实施例由于ZnS的带隙较宽，对于量子点内核中激子的束缚能力较强，可有效保证量子点材料自身的发光效率，适用于发光峰波长为400～700nm的可见光区域内的所有量子点材料，适用范围广。
在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
如附图12所示，本申请实施例第十二方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为CdZnS，空穴传输层中空穴传输材料的迁移率高于1×10 -4cm 2/Vs。
本申请第十二方面提供的光电器件，量子点的外壳层采用CdZnS，其带隙宽度介于ZnSe和ZnS之间，对于量子点核壳结构中激子的束缚能力适中，相对适中的CdZnS外壳层厚度，便可基本保证量子点发光材料自身的良好发光效率，因而外壳层厚度对载流子的隧穿效应影响较小。同时，CdZnS外壳材料的价带能级介于ZnSe和ZnS之间，要构建价带顶能级差(ΔE EML-HTL)大于等于0.5eV的空穴注入势垒，所需的空穴传输材料的价带顶能级相对较浅。因此，HTL材料的空穴迁移率大于等于1×10 -4cm 2/Vs时，即可同时满足构建ΔE EML-HTL≥0.5eV的空穴注入势垒和确保空穴传输注入量子点材料内的效率。
在一些实施例中，CdZnS壳层厚度为0.5～3.0nm，由于CdZnS的带隙介于ZnSe和ZnS之间，外壳层厚度为0.5～3.0纳米时，能够同时保障对于量子点内核中激子的束缚能力，以及量子点发光材料自身的良好发光效率。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.9eV，在该范围内能够与CdZnS外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.5eV。
在一些实施例中，CdZnS材料与空穴传输材料的价带顶能级差为0.8～1.4eV。本申请实施例空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)范围为0.8～1.4eV，既可保障载流子通过隧穿效应注入到发光量子点的效率，又能较好的平衡空穴与电子的注入效率。若ΔE EML-HTL过大，则载流子通过隧穿效应注入到发光量子点内核的效率降低；若ΔE EML-HTL过小，则对空穴的注入速率调节不佳。
在一些实施例中，量子点材料的发光峰波长为400～700nm。本申请实施例由于CdZnS对量子点内核中激子的束缚能力相对较强，可有效保证量子点材料自身的发光效率，适用于发光峰波长为400～700nm的可见光区域内的所有量子点材料，适用范围广。
在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
如附图13所示，本申请实施例第十三方面提供了一种光电器件，包括量子点发光层和空穴传输层，量子点发光层中包含核壳结构的量子点材料，量子点材料的外壳层为ZnSeS，空穴传输层中空穴传输材 料的迁移率高于1×10 -4cm 2/Vs。
本申请第十三方面提供的光电器件，量子点的外壳层采用ZnSeS，其带隙宽度介于ZnSe和ZnS之间，对于量子点核壳结构中激子的束缚能力适中，外壳层对载流子的隧穿效应影响较小。同时，ZnSeS外壳材料的价带能级介于ZnSe和ZnS之间，要构建价带顶能级差(ΔE EML-HTL)大于等于0.5eV的空穴注入势垒，所需的空穴传输材料的价带顶能级相对较浅。因此，HTL材料的空穴迁移率大于等于1×10 -4cm 2/Vs时，即可同时满足构建空穴注入势垒，和确保空穴传输注入量子点材料内的效率。
在一些实施例中，ZnSeS壳层厚度为1.0～4.0nm，由于ZnSeS外壳中易被氧化的Se更接近于量子点表面，因此ZnSeS外壳需要厚度更大一些以保证对于内核足够的保护和钝化，从而ZnSeS外壳层厚度为1.0～4.0纳米。
在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.7eV，在该范围内能够与ZnSeS外壳材料构筑更合适的空穴注入势垒，优化发光层中载流子注入和复合效率。在一些实施例中，空穴传输材料的价带顶能级的绝对值为4.9～5.4eV。
在一些实施例中，ZnSeS材料与空穴传输材料的价带顶能级差为0.9～1.4eV。本申请实施例空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)范围为0.9～1.4eV时，既可保障载流子通过隧穿效应注入到发光量子点的效率，又能较好的平衡空穴与电子的注入效率。若ΔE EML-HTL过大，则载流子通过隧穿效应注入到发光量子点内核的效率降低；若ΔE EML-HTL过小，则对空穴的注入速率调节不佳。
在一些实施例中，量子点材料的发光峰波长为400～700nm。本申请实施例由于ZnSeS对量子点内核中激子的束缚能力相对较强，可有效保证量子点材料自身的发光效率，适用于发光峰波长为400～700nm的可见光区域内的所有量子点材料，适用范围广。
在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
本申请上述第十～十三方面提供中光电器件中，空穴传输材料选自含苯胺基团的聚合物、含有芴基团和苯胺基团的共聚物中的至少一种，在实际应用中，可根据具体的应用需求选择合适迁移率的空穴传输材料。
在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs的含苯胺基团的聚合物包括：poly-TPD、TFB、P9、P11、P13。
在一些实施例中，空穴传输材料的迁移率高于1×10 -3cm 2/Vs的含有芴基团和苯胺基团的共聚物包括：TFB、P13。
在一些实施例中，空穴传输材料的迁移率高于1×10 -4cm 2/Vs的含苯胺基团的聚合物包括：poly-TPD、TFB、P9、P11、P13、P15。
在一些实施例中，空穴传输材料的迁移率高于1×10 -4cm 2/Vs的含有芴基团和苯胺基团的共聚物包括：TFB、P13、P15。
本申请上述第十～十三方面提供中光电器件中，核壳结构的量子点材料还包括内核，以及位于内核与外壳层之间的中间壳层；其中，内核材料的价带顶能级浅于外壳层材料的价带顶能级；中间壳层材料的价带顶能级介于内核材料的价带顶能级和外壳层材料的价带顶能级之间。
在一些实施例中，内核材料选自元素周期表II-IV族、II-VI族、II-V族、III-V族、III-VI族、IV-VI族、I-III-VI族、II-IV-VI族、II-IV-V族半导体化合物中的至少一种。在一些具体实施例中，内核材料选自CdSe、CdZnSe、CdSeS、CdZnSeS、InP、InGaP、GaP、ZnTe、ZnTeSe中的至少一种。这些内核材料发光性能好，与外壳层ZnSe、ZnS、CdZnS或者ZnSeS均有较好的配合效果。
在一些具体实施例中，中间壳层材料选自CdZnSe、ZnSe、CdZnS、CdZnSeS、CdS、CdSeS中的至少一种。本申请实施例中间壳层的搭配原则为：中间壳层在组成成分上最好是形成从内核到外层的组成成分连续自然过渡，这样有助于实现内核、中间壳层、外壳层三者之间最少的晶格失配及最少的晶格缺陷，从而实现核壳量子点材料自身最优的发光性能；中间壳层在能级上一般是需形成从内核到外壳层的阶梯式能级过渡，这样有助于实现载流子的有效注入、有效束缚以及减少晶格界面的闪烁。
本申请上述第十～十三方面提供中光电器件中，还可以结合上述第二或三方面光电器件中对空穴注入功能层的优化，可以包括第一空穴注入层，第一空穴注入层的第一空穴注入材料的功函与空穴传输材料的价带顶能级差值的绝对值小于等于0.2eV。或者，包括第二空穴注入层，空穴传输层材料的价带顶能级与第二空穴注入层中第二空穴注入材料的功函差值小于-0.2eV。提高器件中空穴利用率，精细调控空穴注入速率，使器件内载流子注入平衡，提高复合效率；同时，减少界面层电荷积累对器件寿命的影响。
本申请上述第十～十三方面提供中光电器件中，还可以包括电子传输层，电子传输层包括至少两层叠层设置的子电子传输层；其中，至少一层子电子传输层的材料为金属氧族化合物传输材料。或者，至 少一层子电子传输层的材料为有机传输材料。或者，至少同时包含一层子电子传输层的材料为金属氧族化合物传输材料和一层子电子传输层的材料为有机传输材料。
本申请上述各实施例中，器件不受器件结构的限制，可以是正型结构的器件，也可以反型结构的器件。
在一种实施方式中，正型结构光电器件包括相对设置的阳极和阴极的层叠结构，设置在阳极和阴极之间的发光层，且阳极设置在衬底上。阳极和发光层之间还可以设置空穴注入层、空穴传输层等空穴功能层；在阴极和发光层之间还可以设置电子传输层、电子注入层等电子功能层，如附图14所示。在一些具体正型结构器件的实施例中，光电器件包括衬底，设置在衬底表面的阳极，设置在阳极表面的空穴传输层，设置在空穴传输层表面的发光层，设置在发光层表面的电子传输层和设置在电子传输层表面的阴极。
在一种实施方式中，反型结构光电器件包括相对设置的阳极和阴极的叠层结构，设置在阳极和阴极之间的发光层，且阴极设置在衬底上。阳极和发光层之间还可以设置空穴注入层、空穴传输层等空穴功能层；在阴极和发光层之间还可以设置电子传输层、电子注入层等电子功能层，如附图15所示。在一些反型结构器件的实施例中，光电器件包括衬底，设置在衬底表面的阴极，设置在阴极表面的电子传输层，设置在电子传输层表面的发光层，设置在发光层表面的空穴传输层，设置在空穴传输层表面的阳极。
在一些实施例中，衬底的选用不受限制，可以采用刚性基板，也可以采用柔性基板。在一些具体实施例中，刚性基板包括但不限于玻璃、金属箔片中的一种或多种。在一些具体实施例中，柔性基板包括但不限于聚对苯二甲酸乙二醇酯(PET)、聚对苯二甲酸乙二醇酯(PEN)、聚醚醚酮(PEEK)、聚苯乙烯(PS)、聚醚砜(PES)、聚碳酸酯(PC)、聚芳基酸酯(PAT)、聚芳酯(PAR)、聚酰亚胺(PI)、聚氯乙烯(PV)、聚乙烯(PE)、聚乙烯吡咯烷酮(PVP)、纺织纤维中的一种或多种。
在一些实施例中，阳极材料的选用不受限制，可选自掺杂金属氧化物，包括但不限于铟掺杂氧化锡(ITO)、氟掺杂氧化锡(FTO)、锑掺杂氧化锡(ATO)、铝掺杂氧化锌(AZO)、镓掺杂氧化锌(GZO)、铟掺杂氧化锌(IZO)、镁掺杂氧化锌(MZO)、铝掺杂氧化镁(AMO)中的一种或多种。也可以选自掺杂或非掺杂的透明金属氧化物之间夹着金属的复合电极，包括但不限于AZO/Ag/AZO、AZO/Al/AZO、ITO/Ag/ITO、ITO/Al/ITO、ZnO/Ag/ZnO、ZnO/Al/ZnO、TiO 2/Ag/TiO 2、TiO 2/Al/TiO 2、ZnS/Ag/ZnS、ZnS/Al/ZnS、TiO 2/Ag/TiO 2、TiO 2/Al/TiO 2中的一种或多种。
在一些实施例中，阴极材料可以是各种导电碳材料、导电金属氧化物材料、金属材料中的一种或多种。在一些具体实施例中，导电碳材料包括但不限于掺杂或非掺杂碳纳米管、掺杂或非掺杂石墨烯、掺杂或非掺杂氧化石墨烯、C60、石墨、碳纤维、多空碳、或它们的混合物。在一些具体实施例中，导电金属氧化物材料包括但不限于ITO、FTO、ATO、AZO、或它们的混合物。在一些具体实施例中，金属材料包括但不限于Al、Ag、Cu、Mo、Au、或它们的合金；其中的金属材料中，其形态包括但不限于致密薄膜、纳米线、纳米球、纳米棒、纳米锥、纳米空心球、或它们的混合物。具体的，阴极为Ag、Al。
在一些实施例中，量子点发光层的厚度为8～100nm。在一些实施例中，空穴传输层的厚度为10～150nm。在一些实施例中，电子传输层的厚度为10～200nm。在实际应用中，器件中的电子功能层、发光层、空穴功能层可根据上述各实施例中器件的特性对应设计合适的厚度。
本申请实施例光电器件的制备包括步骤：
S10.获取沉积有阳极的基板；
S20.在阳极表面生长一空穴注入层；
S30.在空穴注入层表面生长一空穴传输层；
S40.接着沉积量子点发光层于空穴传输层上；
S50.最后沉积电子传输层于量子点发光层上，并蒸镀阴极极于电子传输层上，得到光电器件。
具体地，步骤S10中，ITO基底需要经过预处理过程，步骤包括：将ITO导电玻璃用清洁剂清洗，初步去除表面存在的污渍，随后依次在去离子水、丙酮、无水乙醇、去离子水中分别超声清洗20min，以除去表面存在的杂质，最后用高纯氮气吹干，即可得到ITO正极。
具体地，步骤S20中，生长空穴注入层的步骤包括：将金属氧化物等材料通过溶液法方式、真空溅射方式、真空蒸镀方式在QLED器件中制备成薄膜；其中，溶液法的方式包括喷墨打印、旋涂、喷印(spray printing)、狭缝涂布(slot-die printing)或丝网印刷(screen printing)等。
具体地，步骤S30中，生长空穴传输层的步骤包括：将ITO基板置于旋涂仪上，用配制好的空穴传输材料的溶液旋涂成膜；通过调节溶液的浓度、旋涂速度和旋涂时间来控制膜厚，然后在适当温度下热退火处理。
具体地，步骤S40中，沉积量子点发光层于空穴传输层上的步骤包括：将已旋涂上空穴传输层的基片置于旋涂仪上，将配制好一定浓度的发光物质溶液旋涂成膜，通过调节溶液的浓度、旋涂速度和旋涂 时间来控制发光层的厚度，约20～60nm，在适当温度下干燥。
具体地，步骤S50中，沉积电子传输层于量子点发光层上的步骤包括：将已旋涂上量子点发光层的基片置于旋涂仪上，将配制好一定浓度的电子传输复合材料溶液通过滴涂、旋涂、浸泡、涂布、打印、蒸镀等工艺旋涂成膜，通过调节溶液的浓度、旋涂速度(例如，转速在3000～5000rpm之间)和旋涂时间来控制电子传输层的厚度，约20～60nm，然后在150℃～200℃的条件下退火成膜，充分去除溶剂。
具体地，阴极制备的步骤包括：将沉积完各功能层的衬底置于蒸镀仓中通过掩膜板热蒸镀一层60-100nm的金属银或者铝作为阴极。
在一些实施例中，光电器件的制备方法，还包括对层叠制备的光电器件进行封装；封装所采用的固化树脂为丙烯酸类树脂、丙烯酸酯类树脂或环氧类树脂；树脂固化采用UV照射、加热或两者的结合。封装处理可采用常用的机器封装，也可以采用手动封装。封装处理的环境中，氧含量和水含量均低于0.1ppm，以保证器件的稳定性。
在一些实施例中，光电器件的制备方法，还包括在对光电器件进行封装后，引入包括紫外照射、加热、正负压力、外加电场、外加磁场在内的一种或多种工艺；施加工艺时的气氛可以为空气或惰性气氛。
为使本申请上述实施细节和操作能清楚地被本领域技术人员理解，以及本申请实施例光电器件的进步性能显著的体现，以下通过多个实施例来举例说明上述技术方案。
本申请实施例器件采用ITO/HIL/HTL/QD/ETL/AL结构，封装后进行一定的加热处理，通过对器件中不同功能层的搭配对比，来说明详细说明本申请技术方案的优势。在下列实施例中，寿命测试采用恒流法，在恒定50mA/cm 2电流驱动下，采用硅光系统测试器件亮度变化，记录器件亮度从最高点开始，衰减到最高亮度95％的时间LT95，再通过经验公式外推器件1000nit LT95S寿命。此方法便于不同亮度水平器件的寿命比较，在实际光电器件中有着广泛的应用。
1000nit LT95＝(L Max/1000) 1.7×LT95
本申请实施例中各材料能级测试方法：将各功能层材料进行旋涂成膜后，采用UPS(紫外光电子能谱)的方法进行能级测试。
功函数Φ＝hν-E cutoff，其中hv为入射激发光子的能量，E cutoff为激发的二次电子截止位置；
价带顶VB(HOMO)：E HOMO＝E F-HOMO+Φ，其中E F-HOMO为材料HOMO(VB)与费米能级差值，对应结合能谱中低结合能端出现的第一个峰的起始边；
导带底(LOMO)：E LOMO＝E HOMO-E HOMO-LOMO，其中，E HOMO-LOMO为材料的带隙，由UV-Vis(紫外吸收谱)得到。
实施例1～7
为验证量子点材料的外壳层材料与空穴传输材料之间的空穴注入势垒对器件性能的影响，本申请设置了实施例1～7，通过不同HTL和QD的搭配对比，来说明空穴注入势垒对器件寿命等性能的影响。
本申请实施例1～7中采用的两种量子点为：外壳为CdZnS的蓝色QD1(内核为CdZnSe，中间壳层为ZnSe，外壳厚度为1.5nm，价带顶能级为-6.2eV)、外壳为ZnS的蓝色QD2(内核为CdZnSe，中间壳层为ZnSe，ZnS外壳厚度为0.3nm，价带顶能级为6.5eV)。外壳为ZnSeS的蓝色QD3(内核为CdZnSe，中间壳层为ZnSe)空穴传输材料分别为P9(E HOMO:5.1eV)、P15(E HOMO:5.8eV)，空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)，电子传输层采用ZnO，具体如下表1所示：
表1
Figure PCTCN2021143432-appb-000012
由上表1以及附图16(横坐标为时间、纵坐标为亮度)的测试结果可知，对于同一CdZnS(6.2eV)外壳量子点，将HTL从P15(5.8eV)改为P9(5.1eV)，ΔE EML-HTL势垒差从0.4eV增大至1.1eV，器件寿命得到提高，1000nit LT95S寿命从0.72提高到1.26。另外，对于同一P15(5.8eV)材料，改变量子点外壳，从CdZnS(6.2eV)改为ZnS(6.5eV)，ΔE EML-HTL势垒差从0.4eV增大至0.7eV，器件寿命得到显著提高，1000nit LT95S寿命从0.72提高到6.29。
由此可见，无论是调整HTL或者EML材料，使价带顶能级差ΔE EML-HTL增大到0.5eV以上，器件注入平衡得到优化，器件寿命都能得到增强。说明通过提高空穴注入势垒来降低空穴的注入效率，能够更好的平衡发光层中空穴与电子的注入平衡，提高器件发光效率和发光寿命。
实施例8～11
为验证HIL到HTL的界面能级势垒对器件性能的影响，本申请设置了实施例8～11，通过不同HTL和HTL的搭配对比，来说明ΔE HTL-HIL空穴注入势垒对器件寿命等性能的影响。
本申请实施例8～9中采用外壳为ZnS的蓝色量子点(内核为CdZnSe，中间壳层为ZnSe，外壳厚度为0.3nm，价带顶能级为6.5eV)，实施例10～11中采用外壳为ZnS的红色量子点(内核为CdZnSe，中间壳层为ZnSe，外壳厚度为0.3nm，价带顶能级为6.5eV)，空穴传输材料分别为P9(E HOMO:5.5eV)、P11(E HOMO:5.5eV)、P13(E HOMO:4.9eV)，空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)和HIL2(功函:5.6eV)，电子传输层采用ZnO，具体如下表2所示：
表2
Figure PCTCN2021143432-appb-000013
注释：当ΔE HTL-HIL＜0.2eV时，在现有的HIL材料和实验数据下，ΔE EML-HTL必然是大于0.5eV的。
由上述表2和附图17和18(横坐标为时间、纵坐标为亮度)测试结果可知，实施例8和9蓝色量子点器件相对较，以及实施例10与11红色量子点器件相对较，当HTL与HIL之间的空穴注入能级势垒ΔE HTL-HIL＜-0.2eV时，相对于ΔE HTL-HIL大于等于-0.2eV的实施例，器件寿命1000nit LT95S得到提高。说明增大阳极向HIL的空穴注入势垒，降低了QLED器件内空穴注入的整体速率，有效控制了进入QLED器件内的空穴数量，不但提高载流子复合效率；而且减少了空穴注入过多在HTL和HIL界面处形成电荷积累，提高了器件的发光寿命。
实施例12～19
为验证HIL到HTL的界面能级势垒对器件性能的影响，本申请设置了实施例12～19，通过不同HTL和HTL的搭配对比，来说明|ΔE HTL-HIL|空穴注入势垒对器件驱动电压等性能的影响。
本申请实施例12～14中采用外壳为ZnS的蓝色量子点(内核为CdZnSe，中间壳层为ZnSe，外壳厚度为0.3nm，价带顶能级为6.5eV)，实施例15～19中采用外壳为ZnS的红色量子点(内核为CdZnSe，中间壳层为ZnSe，外壳厚度为0.3nm，价带顶能级为6.5eV)，空穴传输材料分别为P9(E HOMO:5.5eV)、P13(E HOMO:4.9eV)、TFB(E HOMO:5.4eV)，空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)、HIL1-1(功函:5.4eV)和HIL1-2(功函:5.3eV)，电子传输层采用ZnO，具体如下表3所示：
表3
Figure PCTCN2021143432-appb-000014
Figure PCTCN2021143432-appb-000015
由上述表3和附图19和20(横坐标为时间、纵坐标为电压)测试结果可知，当HTL与HIL之间的空穴注入能级势垒|ΔE HTL-HIL|小于等于0.2eV时，相对于|ΔE HTL-HIL|大于0.2的实施例，器件空穴传输侧的电荷积累很小，器件长时间恒流工作下，器件的驱动电压涨幅明显减小，器件寿命1000nit LT95S得到提高。同时，当HIL和HTL间的势垒差很小时，界面几乎无电荷积累，对侧无老化，器件的空穴注入能力稳定，器件的寿命也得到提升。说明降低空穴注入能级势垒，有利于空穴从HIL向HTL的有效注入，消除势垒及界面电荷，减小器件的整体电阻，从而提高器件的寿命。
实施例20～25
为验证空穴传输层材料对器件性能的影响，本申请设置了实施例20～25，通过不同HTL材料的搭配对比，来说明HTL材料对构建空穴注入势垒，优化载流子复合效率以及对器件寿命等性能的影响。
本申请实施例20～25中采用外壳为ZnS的蓝色量子点(内核为CdZnSe，中间壳层为ZnSe，外壳厚度为0.3nm，价带顶能级为6.5eV)，空穴传输材料分别为P12(E HOMO:5.8eV)、P13(E HOMO:4.9eV)、TFB(E HOMO:5.4eV)，空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)，具体如下表4所示：
表4
Figure PCTCN2021143432-appb-000016
由上述表4和附图21(横坐标为时间、纵坐标为亮度)测试结果可知，空穴传输层中可选择不同能级大小的材料混合，灵活调控ΔE EML-HTL注入势垒，构筑ΔE EML-HTL大于等于0.5eV的能级势垒，实现降低QLED器件内空穴注入速率，调控载流子的注入、复合效率的目的，同时减少HIL与HTL界面电荷积累对器件寿命性能造成不可逆破坏。并且，测试结果表明混合空穴传输层的器件有更好的发光寿命。深能级的HTL可以减少HTL和QD的激子转移导致的寿命测试中的亮度变化，减小上升段。因此通过浅能级与深能级的混合，可以保证器件的寿命的同时，减小器件亮度的上升段，使器件快速进入稳定状态，有利于后续的测试和应用。结合附图21对比实施例22、24和25可以看出，从实施例22到24到25，深能级的材料掺杂比例增多，寿命均在60-80h之间，寿命差异较小，测试中亮度上升时间分别约为7h，5h，4h；实施例22、24或25相比于实施例21，深能级材料比例更高，空穴传输材料的迁移率的调控幅度更大，更容易得到较高寿命的量子点器件。
实施例26～28
在实施例26～28中，当蓝色量子点材料的外壳层为ZnS(内核为CdZnSe，中间壳层为ZnSe，外壳层厚度为0.2-2.0nm)时，为构筑合适的ΔE EML-HTL能级势垒，空穴传输材料的价带顶能级的绝对值需小于等于6.0eV，如下表5实施例26～28所示(空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)，电子传输层采用ZnO)：
表5
Figure PCTCN2021143432-appb-000017
由上述表5和附图22(横坐标为时间、纵坐标为亮度)测试结果可知，当量子点发光层材料外壳层为ZnS，外壳层厚度为0.2～2.0纳米时，空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)范围在1.0～1.6eV，此时器件有更好的发光寿命。
实施例29～31
在实施例29～31中，当蓝色量子点材料的外壳层为ZnSe(内核为CdZnSe，中间壳层为ZnSe，外壳层厚度为2～5nm时，为构筑合适的ΔE EML-HTL能级势垒，空穴传输材料的价带顶能级的绝对值需小于等于5.4eV，如下表6实施例29～31所示(空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)，电子传输层采用ZnO)：
表6
Figure PCTCN2021143432-appb-000018
由上述表6和附图23(横坐标为时间、纵坐标为亮度)测试结果可知，当量子点发光层材料外壳层为ZnS，外壳层厚度为2～5纳米时，空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)范围在0.5～1.0eV，此时器件有更好的发光寿命。
实施例32～35
在实施例32～35中，当蓝色量子点材料的外壳层为CdZnS(内核为CdZnSe，中间壳层为ZnSe，外壳层厚度为0.5-3.0nm)时，为构筑合适的ΔE EML-HTL能级势垒，空穴传输材料的价带顶能级的绝对值需小于等于5.9eV，如下表7实施例32～35所示(空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)，电子传输层采用ZnO)：
表7
Figure PCTCN2021143432-appb-000019
由上述表7和附图24(横坐标为时间、纵坐标为亮度)测试结果可知，当量子点发光层材料外壳层为CdZnS，外壳层厚度为0.5-3.0纳米时，空穴传输层材料与量子点发光层中量子点外壳层材料的价带 顶能级差(ΔE EML-HTL)范围在0.8-1.4eV，此时器件有更好的发光寿命。
实施例36～38
在实施例36～38中，当蓝色量子点材料的外壳层为ZnSeS(内核为CdZnSe，中间壳层为ZnSe，外壳层厚度为1.0～4.0nm)时，为构筑合适的ΔE EML-HTL能级势垒，空穴传输材料的价带顶能级的绝对值需小于等于5.7eV，如下表8实施例36～38所示(空穴注入层采用PEDOT:PSS(E HOMO:5.1eV)，电子传输层采用ZnO)：
表8
Figure PCTCN2021143432-appb-000020
由上述表8和附图24(横坐标为时间、纵坐标为亮度)测试结果可知，当量子点发光层材料外壳层为CdZnS，外壳层厚度为0.5-3.0纳米时，空穴传输层材料与量子点发光层中量子点外壳层材料的价带顶能级差(ΔE EML-HTL)范围在0.9-1.4eV，此时器件有更好的发光寿命。
实施例39～43
为了验证空穴注入层对器件性能的影响，本申请设置如下实施例。实施例39～41中，采用外壳为ZnS的红色量子点(内核为CdZnSe，中间壳层为ZnSe，价带顶能级为6.5eV)。实施例42～43中，采用外壳为ZnS的红色量子点(内核为CdZnSe，中间壳层为ZnSe，价带顶能级为6.5eV)，电子传输层采用ZnO。如表9所示：
表9
Figure PCTCN2021143432-appb-000021
由上述表9和附图26和28(横坐标为时间、纵坐标为电压)，以及附图27和29(横坐标为时间、纵坐标为亮度)测试结果可知，当器件去掉HIL层后，空穴注入层和空穴传输层间的电荷积累和酸性PEDOT对器件的影响消失，在器件长时间恒流工作下，器件的驱动电压几乎不变，甚至因为电荷填补了器件内的缺陷，器件驱动电压有下降趋势。采用迁移率更高的P11材料，制备无HIL器件后，器件长时间恒流工作下，器件的驱动电压下降更明显，说明HTL迁移率高于1x10 -3cm 2/Vs,可取得更优的抑制器件电压上涨的效果。
另外，当使用无机金属氧化物MoO 3代替有机的PEDOT:PSS作为空穴注入层材料后，由于MoO 3空穴注入材料的破坏被有效抑制，使得器件在工作工程中的电压上升相比于有机空穴注入层材料器件有着显著的降低，同时器件寿命的实测时长也得到了有效的提升。
以上仅为本申请的可选实施例而已，并不用于限制本申请。对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (23)

  1. 一种光电器件，其特征在于，所述光电器件包括：阳极、在所述阳极上的空穴传输层、在所述空穴传输层上的量子点发光层和在所述量子点发光层上的阴极，所述空穴传输层中至少包含两种空穴传输材料，其中，至少一种空穴传输材料的价带顶能级的绝对值小于等于5.3eV，至少一种空穴传输材料的价带顶能级的绝对值大于5.3eV。
  2. 如权利要求1所述的光电器件，其特征在于，所述空穴传输层中还包括价带顶能级的绝对值大于5.3eV小于5.8eV的空穴传输材料。
  3. 如权利要求1所述的光电器件，其特征在于，所述空穴传输层中还包括价带顶能级的绝对值大于等于5.8eV的空穴传输材料。
  4. 如权利要求2或3所述的光电器件，其特征在于，所述空穴传输层中，价带顶能级的绝对值小于等于5.3eV的空穴传输材料的质量百分含量为30～90％。
  5. 如权利要求2或3所述的光电器件，其特征在于，所述空穴传输层中，至少一种空穴传输材料的迁移率高于1×10 -3cm 2/Vs。
  6. 如权利要求5任一所述的光电器件，其特征在于，所述空穴传输层中，每一种空穴传输材料的迁移率均高于1×10 -3cm 2/Vs。
  7. 如权利要求4任一所述的光电器件，其特征在于，所述空穴传输层中空穴传输材料选自含苯胺基团的聚合物、含有芴基团和苯胺基团的共聚物中的至少一种。
  8. 如权利要求7所述的光电器件，其特征在于，所述空穴传输层中，所述价带顶能级的绝对值小于等于5.3eV的空穴传输材料包括：P09、P13中的至少一种。
  9. 如权利要求7所述的光电器件，其特征在于，所述价带顶能级的绝对值大于5.3eV小于5.8eV的空穴传输材料包括：TFB、poly-TPD、P11中的至少一种。
  10. 如权利要求7所述的光电器件，其特征在于，所述价带顶能级的绝对值大于等于5.8eV的空穴传输材料包括：P15、P12中的至少一种。
  11. 如权利要求1所述的光电器件，其特征在于，所述光电器件还包括量子点发光层；所述量子点发光层中包括核壳结构的量子点材料，所述核壳结构的量子点材料由内至外依次包括内核、中间壳层和外壳层；其中，
    内核材料的价带顶能级浅于所述外壳层材料的价带顶能级；
    中间壳层材料的价带顶能级介于内核材料的价带顶能级和所述外壳层材料的价带顶能级之间；
    外壳层材料与所述空穴传输材料的价带顶能级差大于0.5eV。
  12. 如权利要求11所述的光电器件，其特征在于，所述量子点材料的外壳层材料与所述空穴传输材料的价带顶能级差为0.5eV～1.7eV。
  13. 如权利要求11所述的光电器件，其特征在于，所述外壳层材料包括：CdS、ZnSe、ZnTe、ZnS、ZnSeS、CdZnS、PbS中的至少一种或者至少两种形成的合金材料。
  14. 如权利要求11所述的光电器件，其特征在于，所述内核材料包括：CdSe、CdZnSe、CdZnS、CdSeS、CdZnSeS、InP、InGaP、GaN、GaP、ZnSe、ZnTe、ZnTeSe中的至少一种。
  15. 如权利要求11所述的光电器件，其特征在于，所述中间壳层材料选自CdZnSe、ZnSe、CdZnS、CdZnSeS、CdS、CdSeS中的至少一种。
  16. 如权利要求1所述的光电器件，其特征在于，所述光电器件还包括电子传输层，当所述空穴传输层中包括价带顶能级大于5.3eV小于5.8eV的空穴传输材料时，所述电子传输层中包括：有机电子传输材料层、金属氧化物纳米颗粒层、溅射沉积的金属氧化物层中的至少一种；
    当所述空穴传输层中包括价带顶能级大于等于5.8eV的空穴传输材料时，所述电子传输层中包括：金属氧化物纳米颗粒。
  17. 如权利要求16所述的光电器件，其特征在于，所述电子传输层包括至少两层叠层设置的子电子传输层；其中，至少一层子电子传输层的材料为金属氧族化合物传输材料；和/或，至少一层子电子传输层的材料为有机传输材料。
  18. 如权利要求17所述的光电器件，其特征在于，所述金属氧族化合物传输材料的电子迁移率为10 -2～10 -3cm 2/Vs。
  19. 如权利要求17所述的光电器件，其特征在于，所述有机传输材料的电子迁移率小于10 -4cm 2/Vs。
  20. 如权利要求17所述的光电器件，其特征在于，所述金属氧族化合物传输材料选自氧化锌、氧化钛、硫化锌、硫化镉中的至少一种。
  21. 如权利要求17或20所述的光电器件，其特征在于，所述金属氧族化合物传输材料选自掺杂有金属元素的氧化锌、氧化钛、硫化锌、硫化镉中的至少一种，其中，所述金属元素包括铝、镁、锂、镧、 钇、锰、镓、铁、铬、钴中至少一种。
  22. 如权利要求17或20所述的光电器件，其特征在于，所述金属氧族化合物传输材料为纳米颗粒，所述金属氧族化合物传输材料的粒径小于等于10nm。
  23. 如权利要求17或20所述的光电器件，其特征在于，所述有机传输材料选自8-羟基喹啉-锂、八羟基喹啉铝、富勒烯衍生物、3,5-双(4-叔丁基苯基)-4-苯基-4H-1,2,4-三唑、1,3,5-三(1-苯基-1H-苯并咪唑-2-基)苯中的至少一种。
PCT/CN2021/143432 2020-12-31 2021-12-30 光电器件 WO2022143960A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/270,575 US20240081088A1 (en) 2020-12-31 2020-12-30 Photoelectric devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011633955.2 2020-12-31
CN202011633955.2A CN114695711A (zh) 2020-12-31 2020-12-31 光电器件

Publications (1)

Publication Number Publication Date
WO2022143960A1 true WO2022143960A1 (zh) 2022-07-07

Family

ID=82134852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/143432 WO2022143960A1 (zh) 2020-12-31 2021-12-30 光电器件

Country Status (3)

Country Link
US (1) US20240081088A1 (zh)
CN (1) CN114695711A (zh)
WO (1) WO2022143960A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013019030A1 (ko) * 2011-07-29 2013-02-07 한양대학교 산학협력단 양자점을 포함하는 색변환용 고분자층이 내부에 삽입된 유기발광소자
CN105244451A (zh) * 2015-10-16 2016-01-13 Tcl集团股份有限公司 一种具有混合htl的量子点发光二极管及其制备方法
CN106654026A (zh) * 2016-11-22 2017-05-10 纳晶科技股份有限公司 量子点电致发光器件、具有其的显示装置及照明装置
CN108963087A (zh) * 2017-11-29 2018-12-07 广东聚华印刷显示技术有限公司 量子点电致发光器件及显示器
CN110212102A (zh) * 2018-03-29 2019-09-06 京东方科技集团股份有限公司 量子点发光二极管、其制备方法及显示器件
CN110246973A (zh) * 2018-03-09 2019-09-17 三星电子株式会社 量子点器件和电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013019030A1 (ko) * 2011-07-29 2013-02-07 한양대학교 산학협력단 양자점을 포함하는 색변환용 고분자층이 내부에 삽입된 유기발광소자
CN105244451A (zh) * 2015-10-16 2016-01-13 Tcl集团股份有限公司 一种具有混合htl的量子点发光二极管及其制备方法
CN106654026A (zh) * 2016-11-22 2017-05-10 纳晶科技股份有限公司 量子点电致发光器件、具有其的显示装置及照明装置
CN108963087A (zh) * 2017-11-29 2018-12-07 广东聚华印刷显示技术有限公司 量子点电致发光器件及显示器
CN110246973A (zh) * 2018-03-09 2019-09-17 三星电子株式会社 量子点器件和电子设备
CN110212102A (zh) * 2018-03-29 2019-09-06 京东方科技集团股份有限公司 量子点发光二极管、其制备方法及显示器件

Also Published As

Publication number Publication date
CN114695711A (zh) 2022-07-01
US20240081088A1 (en) 2024-03-07

Similar Documents

Publication Publication Date Title
CN103904178A (zh) 量子点发光器件
WO2020134147A1 (zh) 一种量子点发光二极管
WO2020134161A1 (zh) 一种量子点发光二极管及其制备方法
WO2022143822A1 (zh) 光电器件
WO2022143831A1 (zh) 光电器件
WO2022143960A1 (zh) 光电器件
WO2022143824A1 (zh) 光电器件
WO2022143825A1 (zh) 光电器件
WO2022143821A1 (zh) 光电器件
WO2022143832A1 (zh) 光电器件
WO2022143828A1 (zh) 光电器件
WO2022143830A1 (zh) 光电器件
WO2022143827A1 (zh) 光电器件
WO2022143826A1 (zh) 光电器件
WO2022143829A1 (zh) 光电器件
WO2022143823A1 (zh) 光电器件
WO2022143566A1 (zh) 发光器件及其制备方法
WO2022143567A1 (zh) 光电器件
WO2022143556A1 (zh) 光电器件
Vasanthi et al. Metal oxide charge transport materials for light emitting diodes-An overview
CN114665029A (zh) 发光二极管及其制备方法
WO2023193427A1 (zh) 一种发光器件及其制备方法、显示装置
WO2022143820A1 (zh) 发光器件及其制备方法
WO2022011990A1 (zh) 发光器件及其制备方法
WO2023056829A1 (zh) 量子点发光层、量子点发光层的制备方法和量子点发光二极管器件

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21914689

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 18270575

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21914689

Country of ref document: EP

Kind code of ref document: A1