WO2022138617A1 - Laser machining device and control program of same, and detection method - Google Patents

Abstract

To provide a detection method and a laser machining device, with which the deterioration of at least one among an optical system and an imaging unit can be detected by imaging, with an imaging unit, visible light that scans a reference surface with the optical system and is condensed. According to the present invention, a laser marker comprises: a visible semiconductor laser which emits visible light; a Galvano scanner and an fθ lens which are disposed between the visible semiconductor laser and a machining surface so that the visible light is condensed while scanning the machining surface of an object to be machined; and a camera which images the machining surface, wherein a drawing process S10 for drawing an inspection pattern on the machining surface by means of the visible light, an acquisition process S12 for acquiring an inspection image by projecting the inspection pattern by imaging the machining surface, an analysis process S14 for performing image analysis on the inspection pattern on the basis of the inspection image, and a diagnosis process S16 for automatically diagnosing whether at least one among the fθ lens and the camera is deteriorated are executed.

Description

Laser processing equipment and its control program, detection method

The present disclosure relates to a laser processing device and a detection method for detecting stains on an optical system.

Conventionally, various techniques have been proposed for the above laser processing devices and the like. For example, the technique described in Patent Document 1 below includes a scanning lens for condensing a laser beam deflected by a deflection mirror onto a work piece, and a deflection region is obtained by using the deflection mirror and the scanning lens. An energy measuring means for measuring the energy of a laser beam deflected and irradiated by the deflection mirror at a plurality of different measurement positions in the deflection region in a laser processing apparatus that irradiates a plurality of positions in the lens with a laser beam for processing. It is characterized in that it is provided with a means for detecting dirt on the scanning lens based on the measurement by the energy measuring means.

Japanese Patent No. 3797327

In the above laser processing apparatus, the energy measuring means must be moved to the irradiation position in order to measure the energy of the laser beam, but the energy measuring means is moved each time in order to measure the energy at a plurality of different points. It must be a very time-consuming operation depending on the number of measurement points.

Therefore, the present disclosure has been made in view of the above-mentioned points, and by photographing the visible light scanned and condensed with respect to the reference plane by the optical system by the imaging unit, the optical system and the photographing unit can be quickly captured. It is an object of the present invention to provide a laser processing apparatus and a detection method capable of detecting at least one of the stains.

The present specification is arranged between a guide light emitting unit that emits a guide light which is visible light and a guide light emitting unit and a reference surface in order to collect the guide light while scanning the reference surface. It is equipped with an optical system, an imaging unit that photographs the reference plane, and a control unit. The control unit has a drawing process that draws an inspection pattern on the reference plane with guide light, and the inspection pattern is projected by imaging the reference plane. Based on the acquisition process for acquiring the inspection image, the analysis process for performing image analysis on the inspection pattern based on the inspection image, and the inspection result of the image analysis, the presence or absence of stains on at least one of the optical system and the photographing unit is checked. Disclosed is a laser processing apparatus characterized by performing diagnostic processing for automatic diagnosis and execution.

Further, in the present specification, there is a guide light emitting unit that emits a guide light which is visible light, and a guide light emitting unit and a reference surface in order to collect the guide light while scanning the reference surface. A stain detection method for detecting the presence or absence of stains on a laser processing device including an optical system to be arranged and an imaging unit for photographing a reference surface, a drawing step of drawing an inspection pattern on the reference surface with guide light, and a drawing step. An acquisition step of acquiring an inspection image in which an inspection pattern is projected by photographing a reference plane, an analysis step of performing image analysis on the inspection pattern based on the inspection image, and an optical system and imaging based on the inspection result of the image analysis. Disclosed is a stain detection method including a diagnostic step for automatically diagnosing the presence or absence of stains on at least one of the portions.

According to the present disclosure, the laser processing apparatus, its control program, and the detection method promptly capture the optical system and the imaging by photographing the visible light scanned and condensed with respect to the reference plane by the optical system by the imaging unit. It is possible to detect dirt on at least one of the parts.

It is a figure which showed the schematic structure of the laser marker of this embodiment. It is a block diagram showing the electrical structure of the laser marker. It is a figure showing the inspection pattern of the guide light in the inspection image acquired by the camera when the fθ lens of the laser marker and the camera are not dirty. (A) is a figure showing the inspection pattern of the guide light in the inspection image acquired by the camera when the fθ lens of the laser marker is contaminated with oil. (B) is a figure showing an inspection pattern of guide light in an inspection image acquired by a camera when the fθ lens of the laser marker is dirty with dust. (A) is a figure showing the inspection pattern of the guide light in the inspection image acquired by the camera when the camera of the laser marker is contaminated with oil. (B) is a figure showing the inspection pattern of the guide light in the inspection image acquired by the camera when the camera of the laser marker is contaminated with dust. It is a figure showing the inspection pattern of the guide light in the inspection image acquired by the camera when the fθ lens of the laser marker and the camera are contaminated with oil. (A) is a figure showing an image in which the oil-stained portion of the fθ lens is emphasized among the inspection patterns taken by the camera when the fθ lens of the laser marker is contaminated with oil. (B) is a figure showing an image in which the oil-stained portion of the camera is emphasized among the inspection patterns taken by the camera when the camera of the laser marker is contaminated with oil. It is a figure showing the inspection pattern and the re-inspection pattern of the guide light in the inspection image and the re-inspection image acquired by the camera when the fθ lens of the laser marker is contaminated with oil. (A) is a figure showing the irradiation area of the pointer light in the inspection image acquired by the camera when the pointer light emitter of the laser marker is not dirty. (B) is a diagram showing an irradiation area of pointer light in an inspection image acquired by a camera when the pointer light emitter of the laser marker is dirty with oil, and (C) is a diagram showing the irradiation area of the pointer light of the laser marker. It is a figure showing the irradiation area of a pointer light in the inspection image acquired by a camera when a pointer light emitter is contaminated with dust. It is a flowchart showing each process executed by the laser marker. It is a flowchart showing each process executed by the laser marker. It is a flowchart showing each process executed by the laser marker. It is a flowchart showing each process executed by the laser marker. It is a plan view which showed the machined surface of the machined object of the laser marker, and is the figure which showed the modification example of the inspection pattern drawn on the machined surface of a machined object.

Hereinafter, the laser marker of the present disclosure will be described with reference to the drawings based on the embodied embodiment. In FIGS. 1 and 2 used in the following description, a part of the basic configuration is omitted, and the dimensional ratio and the like of each drawn part are not always accurate. In the following description, the vertical direction is as shown in FIG.

[1. Schematic configuration of laser marker]
First, a schematic configuration of the laser marker 1 of the present embodiment will be described with reference to FIGS. 1 and 2. The laser marker 1 of this embodiment is composed of a print information creating unit 2 and a laser processing unit 3. The print information creating unit 2 is composed of a personal computer or the like.

The laser processing unit 3 performs marking (printing) processing by two-dimensionally scanning the processing laser beam R on the processing surface 8 of the processing object 7. The laser processing unit 3 includes a laser controller 6.

The laser controller 6 is composed of a computer and is connected to the print information creating unit 2 so as to be capable of bidirectional communication. The laser controller 6 drives and controls the laser processing unit 3 based on the print information, control parameters, various instruction information, and the like transmitted from the print information creation unit 2.

The outline configuration of the laser processing unit 3 will be described. The laser processing unit 3 includes a laser oscillation unit 12, a guide light unit 15, a dichroic mirror 101, a focal system 70, a pointer light emitter 105, a camera 103, a galvano scanner 18, an fθ lens 19, and the like, which are not shown. It is covered with a housing cover that has a substantially rectangular shape.

The laser oscillation unit 12 is composed of a laser oscillator 21 and the like. The laser oscillator 21 is composed of a CO2 laser, a YAG laser, or the like, and emits a processed laser beam R. The light diameter of the processed laser light R is adjusted (for example, enlarged) by a beam expander (not shown).

The guide light unit 15 is composed of a visible semiconductor laser 28 or the like. The visible semiconductor laser 28 emits a guide light Q, which is visible interference light, for example, a red laser light. The guide light Q is made into parallel light by a lens group (not shown), and is further scanned two-dimensionally to surround, for example, an image of a print pattern to be marked (printed) by the processed laser light R, and the image thereof. A rectangular image, an image having a predetermined shape, or the like is drawn on a machined surface 8 of a machined object 7 with a locus (time afterimage). That is, the guide light Q does not have the marking (printing) processing ability. In the present embodiment, the predetermined shape is a grid pattern, but a detailed description thereof will be described later.

The wavelength of the guide light Q is different from the wavelength of the processed laser light R. In the present embodiment, for example, the wavelength of the processed laser light R is 1064 nm, and the wavelength of the guide light Q is 650 nm.

In the dichroic mirror 101, almost all of the incident processed laser light R is transmitted. Further, in the dichroic mirror 101, the guide light Q is incident at an incident angle of 45 degrees at a substantially central position through which the processed laser light R is transmitted, and is reflected on the optical path of the processed laser light R at a reflection angle of 45 degrees. .. The reflectance of the dichroic mirror 101 has a wavelength dependence. Specifically, the dichroic mirror 101 is surface-treated with a multilayer film structure of a dielectric layer and a metal layer, has a high reflectance with respect to the wavelength of the guide light Q, and is light of other wavelengths. Is configured to be almost (99%) transparent.

The alternate long and short dash line in FIG. 1 indicates the optical axis 10 of the processed laser light R and the guide light Q. Further, the direction of the optical axis 10 indicates the path direction of the processed laser light R and the guide light Q.

The focal system 70 includes a first lens 72, a second lens 74, and a moving mechanism 76. In the focal system 70, the processed laser light R and the guide light Q that have passed through the dichroic mirror 101 enter the first lens 72 and pass therethrough. At that time, the light diameters of the processed laser light R and the guide light Q are reduced by the first lens 72. Further, the processed laser light R and the guide light Q that have passed through the first lens 72 enter the second lens 74 and pass through. At that time, the processed laser light R and the guide light Q are made into parallel light by the second lens 74. The moving mechanism 76 includes a focal system motor 80, a rack and pinion (not shown) that converts the rotational motion of the focal system motor 80 into linear motion, and the like, and is second by controlling the rotation of the focal system motor 80. The lens 74 is moved in the path direction of the processed laser light R and the guide light Q.

The moving mechanism 76 may be configured to move the first lens 72 instead of the second lens 74, or the first lens so that the distance between the first lens 72 and the second lens 74 changes. It may be configured to move both the 72 and the second lens 74.

The galvano scanner 18 two-dimensionally scans the processed laser light R and the guide light Q that have passed through the focal system 70. In the galvano scanner 18, the galvano X-axis motor 31 and the galvano Y-axis motor 32 are attached so that their respective motor axes are orthogonal to each other, and the scanning mirrors 18X and 18Y attached to the tip of each motor axis are inside. They are facing each other. Then, the processing laser light R and the guide light Q are two-dimensionally scanned by rotating the scanning mirrors 18X and 18Y under the rotation control of the motors 31 and 32. The two-dimensional scanning directions are the X direction and the Y direction.

The fθ lens 19 collects the processed laser light R and the guide light Q two-dimensionally scanned by the galvano scanner 18 on the processed surface 8 of the processed object 7. Therefore, the processing laser light R and the guide light Q are two-dimensionally scanned in the X direction and the Y direction on the processing surface 8 of the processing object 7 by the rotation control of the motors 31 and 32, respectively.

The wavelengths of the processed laser light R and the guide light Q are different. Therefore, when the distance between the first lens 72 and the second lens 74 in the focal system 70 is constant, the position where the processed laser light R and the guide light Q are focused (hereinafter referred to as “focus position F”) is. , It will be different in the vertical direction. Therefore, the focal position F of the processed laser light R and the guide light Q is set on the processed surface 8 of the processed object 7 by adjusting the distance between the first lens 72 and the second lens 74 in the focal system 70. It can be adjusted to.

Here, the distance between the reference position related to the position of the fθ lens 19 and the machined surface 8 of the machined object 7 is referred to as “working distance”. In the present embodiment, the lower surface of the fθ lens 19 is set as a reference position related to the position of the fθ lens 19. That is, the working distance L of the present embodiment is the distance between the lower surface of the fθ lens 19 and the machined surface 8 of the machined object 7. In addition to the lower surface of the fθ lens 19, the reference position related to the position of the fθ lens 19 includes, for example, the upper surface of the fθ lens 19 or the center of the fθ lens 19 in the vertical direction.

Therefore, when the working distance L changes, the distance between the lower surface of the fθ lens 19 and the machined surface 8 of the object to be machined 7 changes. Therefore, even in such a case, the first lens in the focal system 70 changes. By adjusting the distance between the 72 and the second lens 74, the focal position F of the processed laser light R and the guide light Q is aligned with the machined surface 8 of the machined object 7.

The pointer light emitter 105 emits the pointer light P, which is visible light, toward the processing surface 8 of the processing object 7, and is provided in the vicinity of the fθ lens 19. As a result, the pointer light P is irradiated on the machined surface 8 of the machined object 7 in a relatively small circular shape. The pointer light P may be a laser light having no marking (printing) processing ability as long as it is visible light.

The camera 103 is provided near the fθ lens 19 in a state of being directed to the machined surface 8 of the object to be machined 7. As a result, the camera 103 is drawn, for example, on the machined surface 8 of the object 7 by repeating the two-dimensional scanning of the illuminated circular pointer light P or the galvano scanner 18. The locus of the guide light Q is imaged. As a result, an image in which the machined surface 8 of the object 7 to be machined is projected and includes the locus of the circular pointer light P or the grid-shaped guide light Q is captured. The working distance L is determined based on an image taken by the camera 103 (a projection of the guide light Q and the pointer light P on the processing surface 8 of the processing object 7) and the like, but the technique thereof is determined. Since it is known, the description thereof will be omitted.

Next, the circuit configurations of the print information creating unit 2 and the laser processing unit 3 constituting the laser marker 1 will be described with reference to FIG. First, the circuit configuration of the laser processing unit 3 will be described.

As shown in FIG. 2, the laser processing unit 3 includes a laser controller 6, a galvano controller 35, a galvano driver 36, a laser driver 37, a semiconductor laser driver 38, a focal system driver 78, a pointer light emitter 105, and a camera 103. And so on. The laser controller 6 controls the entire laser processing unit 3. A galvano controller 35, a laser driver 37, a semiconductor laser driver 38, a focal system driver 78, and the like are electrically connected to the laser controller 6. Further, an external print information creating unit 2 is connected to the laser controller 6 and the camera 103 so as to be capable of bidirectional communication. Further, the pointer light emitter 105 is electrically connected to the laser controller 6. The laser controller 6 is configured to be able to receive each information transmitted from the print information creation unit 2 (for example, print information, control parameters for the laser processing unit 3, various instruction information from the user, etc.). The pointer light emitter 105 is configured to be able to receive each information (for example, lighting / extinguishing instruction information) transmitted from the print information creating unit 2. The camera 103 is configured to be able to receive each information (for example, image pickup instruction information) transmitted from the print information creation unit 2, and is configured to be able to transmit the captured image to the print information creation unit 2.

The laser controller 6 includes a CPU 41, a RAM 42, a ROM 43, and the like. The CPU 41 is an arithmetic unit and a control device that controls the entire laser processing unit 3. The CPU 41, RAM 42, and ROM 43 are connected to each other by a bus line (not shown), and data is exchanged with each other.

The RAM 42 is for temporarily storing various calculation results calculated by the CPU 41, (XY coordinates) data of the print pattern, and the like.

The ROM 43 stores various programs. For example, a program that calculates XY coordinate data of a print pattern based on the print information transmitted from the print information creation unit 2 and stores it in the RAM 42, or a guide light. A program or the like that calculates the XY coordinate data of the grid-like locus by Q and stores it in the RAM 42 is stored. In addition to the above-mentioned programs, the various programs include, for example, various delay values, the thickness, depth and number of print patterns corresponding to the print information input from the print information creation unit 2, and the laser oscillator 21. A program for storing various control parameters indicating the laser output, the laser pulse width of the processed laser light R, the speed of scanning the processed laser light R by the galvano scanner 18, the speed of scanning the guide light Q by the galvano scanner 18, etc. in the RAM 42, etc. There is. Further, the ROM 43 stores parameters for distortion correction, galvano scanner 18, offset correction data of the pointer light P, and status information (error information, number of times of processing, processing time, etc.) of the laser marker 1.

The CPU 41 performs various operations and controls based on various programs stored in the ROM 43.

The CPU 41 scans the XY coordinate data of the print pattern calculated based on the print information input from the print information creation unit 2, the XY coordinate data of the grid-like locus by the guide light Q, and the guide light Q by the galvano scanner 18. , And the galvano scanning speed information or the like indicating the speed or the like of scanning the processed laser beam R by the galvano scanner 18 is output to the galvano controller 35. Further, the CPU 41 outputs to the laser driver 37 the laser output of the laser oscillator 21 set based on the print information input from the print information creation unit 2, and the laser drive information indicating the laser pulse width of the processed laser light R and the like. do.

The CPU 41 outputs an on signal instructing the start of lighting of the visible semiconductor laser 28 or an off signal instructing the extinguishing of the visible semiconductor laser 28 to the semiconductor laser driver 38.

The galvano controller 35 is based on each information input from the laser controller 6 (for example, XY coordinate data of the print pattern, XY coordinate data of the grid-like locus by the guide light Q, galvano scanning speed information, etc.), and the galvano X-axis. The drive angle, rotation speed, and the like of the motor 31 and the galvano Y-axis motor 32 are calculated, and motor drive information indicating the drive angle and rotation speed is output to the galvano driver 36. The galvano driver 36 drives and controls the galvano X-axis motor 31 and the galvano Y-axis motor 32 based on the motor drive information input from the galvano controller 35, and scans the processed laser light R and the guide light Q in two dimensions.

The laser driver 37 drives the laser oscillator 21 based on the laser output of the laser oscillator 21 input from the laser controller 6 and the laser drive information indicating the laser pulse width of the processed laser light R and the like. The semiconductor laser driver 38 turns on or turns off the visible semiconductor laser 28 based on the on signal or off signal input from the laser controller 6.

The focus system driver 78 drives and controls the focus system motor 80 based on the information input from the laser controller 6 to move the second lens 74.

Next, the circuit configuration of the print information creation unit 2 will be described. The print information creation unit 2 includes a control unit 51, an input operation unit 55, a liquid crystal display (LCD) 56, a CD-ROM drive 58, and the like. An input operation unit 55, a liquid crystal display 56, a CD-ROM drive 58, and the like are connected to the control unit 51 via an input / output interface (not shown).

The input operation unit 55 is composed of a mouse, a keyboard, etc. (not shown), and is used, for example, when the user inputs various instruction information.

The CD-ROM drive 58 reads various data, various application software, and the like from the CD-ROM 57.

The control unit 51 can control the entire print information creation unit 2 and execute image processing described later by a known technique, and is capable of executing a CPU 61, a RAM 62, a ROM 63, and a hard disk drive (hereinafter, “HDD”). It is equipped with 66 and the like. The CPU 61 is an arithmetic unit and a control device that controls the entire print information creation unit 2. The CPU 61, RAM 62, and ROM 63 are connected to each other by a bus line (not shown), and data is exchanged with each other. Further, the CPU 61 and the HDD 66 are connected to each other via an input / output interface (not shown), and data is exchanged with each other.

The RAM 62 is for temporarily storing various calculation results and the like calculated by the CPU 61. The ROM 63 stores various programs and the like. Further, the ROM 63 stores data such as a start point, an end point, a focal point, and a curvature of the font of each character composed of a straight line and an elliptical arc for each type of font.

The HDD 66 stores various application software programs, various data files, and the like.

[2. Dirt detection]
The laser marker 1 of the present embodiment detects dirt on the fθ lens 19 and the camera 103. At that time, a grid-like locus is drawn on the machined surface 8 of the machined object 7 by the guide light Q that is two-dimensionally scanned. Further, by photographing the processed surface 8 of the processed object 7 with the camera 103 exposed for a relatively long time, for example, the inspection image 110 shown in FIG. 3 is acquired. In the inspection image 110 of FIG. 3, the inspection pattern 112 is projected on the machined surface 8 of the machined object 7. The inspection pattern 112 is a grid-like pattern, and is a trajectory drawn on the machined surface 8 of the object to be machined 7 by the guide light Q when the fθ lens 19 and the camera 103 are not dirty.

However, when the fθ lens 19 is contaminated with oil, for example, an inspection image 110 as shown in FIG. 4A is acquired. In the inspection image 110 of FIG. 4A, a portion 114 of the inspection pattern 112 corresponding to oil stains on the fθ lens 19 is blurred and projected. As a cause of such blurring, oil stains on the fθ lens 19 cause refraction and scattering of light. For example, since the fθ lens 19 is flat and has a relatively large aperture, the influence thereof is caused. It is possible that it will appear as a blur.

Further, when the fθ lens 19 is contaminated with dust, for example, an inspection image 110 as shown in FIG. 4B is acquired. In the inspection image 110 of FIG. 4B, a portion 116 of the inspection pattern 112 corresponding to dust stains on the fθ lens 19 is missing and projected. As a cause of such chipping, for example, the guide light Q may be blocked by dust.

Further, when the camera 103 is contaminated with oil, for example, an inspection image 110 as shown in FIG. 5A is acquired. In the inspection image 110 of FIG. 5A, a portion 118 of the inspection pattern 112 corresponding to oil stains of the camera 103 is distorted and projected. The cause of such distortion is refraction and scattering of light due to oil stains on the camera 103. For example, the cover glass of the camera 103 has a spherical shape and its diameter is relatively small, so that the effect is affected. It is possible that it appears as a distortion.

Further, when the camera 103 is dirty with dust, for example, the inspection image 110 as shown in FIG. 5B is acquired. In the inspection image 110 of FIG. 5B, in addition to the inspection pattern 112, the portion 120 corresponding to dust stains on the camera 103 is projected in a pattern different from that of the inspection pattern 112. As a cause of such projection, for example, it is conceivable that dust adhering to the cover glass of the camera 103 is photographed in a state of being out of focus.

Further, when both the fθ lens 19 and the camera 103 are contaminated with oil, for example, the inspection image 110 as shown in FIG. 6 is acquired. In the inspection image 110 of FIG. 6, in the inspection pattern 112, the portion 114 corresponding to the oil stain of the fθ lens 19 is blurred and projected, and the portion 118 corresponding to the oil stain of the camera 103 is distorted and projected. As shown in the inspection pattern 112 of FIG. 6, when the portion 114 corresponding to the oil stain of the fθ lens 19 and the portion 118 corresponding to the oil stain of the camera 103 overlap, the overlapping portions 114 and 118 are blurred. It may be distorted and projected.

From the above, the laser marker 1 of the present embodiment compares and collates the inspection pattern 112 of the inspection image 110 acquired by the camera 103 with the inspection pattern 112 when the fθ lens 19 and the camera 103 are not dirty, thereby making the fθ lens. 19 and the camera 103 are detected as dirty. The comparison and collation may be performed on the condition that the machined surface 8 of the machined object 7 is set at a predetermined position, or the inspection pattern 112 is enlarged or expanded based on the working distance L at the time of acquiring the inspection image 110. It may be reduced. Further, the inspection pattern 112 may be drawn on a surface other than the machined surface 8 of the machined object 7.

In the following description, the inspection pattern 112 when the fθ lens 19 and the camera 103 are not dirty is referred to as a “contrast pattern that serves as a reference for the inspection pattern 112”. The data of the comparison pattern, which is the reference of the inspection pattern 112, is stored in advance in the ROM 63, HDD 66, CD-ROM 57, or the like of the print information creating unit 2 for the above-mentioned comparison and collation.

Further, the laser marker 1 of the present embodiment displays an image on the liquid crystal display 56 that emphasizes the portion having the difference detected by the above comparison and collation. Specifically, when the inspection image 110 of FIG. 4A is acquired, for example, as shown in FIG. 7A, a portion 114 corresponding to oil stains on the fθ lens 19, that is, that is, An image 125 is generated in which the portion where the inspection pattern 112 is blurred and projected is surrounded by a circle 126, and the generated image 125 is displayed on the liquid crystal display 56. Further, when the inspection image 110 of FIG. 5A is acquired, for example, as shown in FIG. 7B, the four corners of the frame 128 of the comparison pattern, which is the reference of the inspection pattern 112, are formed. An image 125 arranged so as to overlap the four corners of the inspection pattern 112 is generated, and the generated image 125 is displayed on the liquid crystal display 56. In this way, the liquid crystal display 56 displays an image 125 that can be visually recognized by distinguishing between the portion without the difference and the portion with the difference detected in the above comparison and collation. In addition to the circle 126 and the frame 128, it was detected by the above comparison and collation by changing the brightness or color of the display or superimposing the inspection pattern 112 and the reference comparison pattern of the inspection pattern 112. An image 125 that can be visually recognized by distinguishing between a portion having no difference and a portion having a difference may be generated and displayed on the liquid crystal display 56.

Further, the laser marker 1 of the present embodiment can specify a range of stains on the fθ lens 19 and the camera 103 with coarse accuracy, and can detect stains on the fθ lens 19 and the camera 103 in the specified range. .. Such detection will be described by taking the case of FIG. 4A (that is, the case where the fθ lens 19 is contaminated with oil) as an example. As shown in FIG. 8, an inspection pattern 130 having a pitch a larger than that of the inspection pattern 112 is drawn on the machining surface 8 of the machining object 7 by the guide light Q that is two-dimensionally scanned. At that time, the inspection image 132 is acquired by photographing the machined surface 8 of the machined object 7 with the camera 103 exposed for a relatively long time.

In the inspection image 132, the portion where the inspection pattern 130 is blurred and projected is specified as the portion 114 corresponding to oil stain by the above comparison and collation. After that, on the machined surface 8 of the object to be machined 7, the pitch a is smaller than that of the inspection pattern 112 by the guide light Q two-dimensionally scanned in the range including the position corresponding to the position 114 specified in the inspection image 132. The re-inspection pattern 134 is drawn. In this way, on the machined surface 8 of the object to be machined 7, the re-inspection pattern 134, which is narrower than the drawing area 136 of the inspection pattern 130 and has a finer pitch a, becomes the inspection pattern 130 in the drawing area 136 of the inspection pattern 130. Instead, it is drawn with the guide light Q.

At that time, the re-inspection image 138 is acquired by photographing the processed surface 8 of the processed object 7 with the camera 103 exposed for a relatively long time. In the re-inspection image 138, oil stains on the fθ lens 19 are detected by the above comparison and collation.

Note that, in FIG. 8, in order to make the explanation easy to understand, the inspection image 132 and the re-inspection image 138 are superimposed and represented, and the inspection pattern 130 and the re-inspection pattern 134 are superimposed and represented. However, the inspection pattern 130 is projected on the inspection image 132, and the re-inspection pattern 134 is projected on the re-inspection image 138.

Further, in the comparative collation in the inspection image 132, the inspection pattern 130 when the fθ lens 19 and the camera 103 are not dirty is used as a reference comparison pattern of the inspection pattern 130. Further, in the comparative collation in the re-inspection image 138, the re-inspection pattern 134 when the fθ lens 19 and the camera 103 are not dirty is used as a reference comparison pattern of the re-inspection pattern 134. The data of the comparison patterns are also stored in advance in the ROM 63, HDD 66, CD-ROM 57, or the like of the print information creating unit 2 for comparison and collation.

The laser marker 1 of the present embodiment uses the inspection pattern 112 as the object to be machined 7 instead of the inspection pattern 130 having a pitch a larger than that of the inspection pattern 112 when specifying a dirty range of the fθ lens 19 and the camera 103. May be drawn on the machined surface 8 of.

Further, the laser marker 1 of the present embodiment detects dirt on the pointer light emitter 105. At that time, the pointer light P is emitted from the pointer light emitter 105 toward the machined surface 8 of the machined object 7. Further, by photographing the machined surface 8 of the machined object 7 with the camera 103, for example, the inspection image 110 shown in FIG. 9A is acquired. In the inspection image 110 of FIG. 9A, the irradiation region 122 of the pointer light P is projected on the processing surface 8 of the processing object 7. When the pointer light emitter 105 is not dirty, the irradiation region 122 of the pointer light P has a circular outer shape as shown in FIG. 9A.

However, when the pointer light emitter 105 is contaminated with oil, for example, an inspection image 110 as shown in FIG. 9B is acquired. In the inspection image 110 of FIG. 9B, the irradiation region 122 of the pointer light P changes its shape and is projected in an elliptical shape. When the pointer light emitter 105 is contaminated with oil, the irradiation area 122 of the pointer light P is in a state where the position is displaced or the area is changed in addition to the above-mentioned shape change in the inspection image 110 of FIG. 9B. It may be projected on. Further, interference fringes or abnormal light may be projected outside the irradiation area 122 of the pointer light P.

Further, when the pointer light emitter 105 is contaminated with dust, for example, an inspection image 110 as shown in FIG. 9C is acquired. In the inspection image 110 of FIG. 9C, the irradiation area 122 of the pointer light P is projected without the portion 124 corresponding to the dust stain.

From the above, the laser marker 1 of the present embodiment compares and collates the irradiation area 122 of the inspection image 110 acquired by the camera 103 with the irradiation area 122 when the pointer light emitter 105 is not dirty, thereby emitting pointer light. Detects dirt on the vessel 105. The comparison and collation is performed on the condition that the machined surface 8 of the object to be machined 7 is set at a predetermined position, as in the case described above (that is, when the dirt on the fθ lens 19 and the camera 103 is detected). Alternatively, the irradiation area 122 may be enlarged or reduced based on the working distance L at the time of acquisition of the inspection image 110. Further, the pointer light P may be applied to a surface other than the processing surface 8 of the processing object 7.

In the following description, the irradiation area 122 when the pointer light emitter 105 is not dirty is referred to as a “contrast area that serves as a reference for the irradiation area 122”. The data of the reference area of the irradiation area 122 is stored in advance in the ROM 63, HDD 66, CD-ROM 57, or the like of the print information creating unit 2 for the above-mentioned comparison and collation.

[3. Control flow]
The program of the detection method 200 shown in the flowcharts of FIGS. 10 to 13 is stored in the ROM 63 of the control unit 51, and is executed by the CPU 61 of the control unit 51 when detecting the dirt on the fθ lens 19 and the camera 103. Will be done. Therefore, in the processing described later, when the control target is a component of the laser processing unit 3, control is performed via the laser controller 6 except for the camera 103. This program may be stored in the CD-ROM 57, read by the CD-ROM drive 58, and executed by the CPU 61. This program will be described below.

When the detection method 200 is executed, in the program shown in the flowchart of FIG. 10, first, the drawing process of step 10 (hereinafter, simply referred to as “S”) 10 is performed. In this process, the inspection pattern 112 is drawn by the guide light Q on the machined surface 8 of the machined object 7. Therefore, the guide light Q is emitted from the guide light unit 15, and the scanning mirrors 18X and 18Y of the galvano scanner 18 are rotated so that the swing angle of the galvano scanner 18 becomes a predetermined angle. When such rotation (scanning) is repeated, a grid-like locus (that is, an inspection pattern 112) is drawn on the machined surface 8 of the machined object 7 by the guide light Q during the two-dimensional scanning.

In the acquisition process S12, the camera 103 photographs the processed surface 8 of the object to be processed 7, so that the inspection image 110 showing the inspection pattern 112 is acquired. At that time, the inspection pattern 112 is photographed by the camera 103 with the numerical value of the exposure time stored in the ROM 63.

In the analysis process S14, image analysis related to the inspection pattern 112 is performed based on the inspection image 110. In this process, the above-mentioned comparison and collation are performed as image analysis. As a result, the difference between the inspection pattern 112 projected on the inspection image 110 and the reference comparison pattern of the inspection pattern 112 is detected. Specifically, information on the line width, position, and brightness of each part of the acquired inspection image 110 is extracted and compared with the appropriate value of the pattern drawing image stored in advance when there is no stain. Based on the comparison result, it is detected as a difference. The differences include blurring of the inspection pattern 112 (see FIGS. 4A and 6), chipping (see FIG. 4B), distortion (see FIGS. 5A and 6), or inspection pattern 112. Has different patterns (see FIG. 5B) and the like.

In the diagnostic process S16, fθ is based on the inspection result of the image analysis in the above analysis process S14.
The presence or absence of dirt on at least one of the lens 19 and the camera 103 is automatically diagnosed. Therefore, the program shown in the flowchart of FIG. 11 is executed by the CPU 61 of the control unit 51.

In the program shown in the flowchart of FIG. 11, first, the determination process S20 is performed. In this process, it is determined whether or not the inspection result of the image analysis has a blur or a chip in the inspection pattern 112. Here, if the inspection result of the image analysis has blurring or chipping of the inspection pattern 112 (S20: YES), the determination process S22 is performed.

In this process, it is determined whether the inspection result of the image analysis includes distortion of the inspection pattern 112 or a pattern different from the inspection pattern 112. Here, if the inspection result of the image analysis includes distortion of the inspection pattern 112 or a pattern different from the inspection pattern 112 (S22: YES), the fθ lens 19 and the camera 103 are specified in the place where the stain is present. , The specific process S24 for displaying the fact on the liquid crystal display 56 is performed. After that, the process returns to the flowchart of FIG. On the other hand, when the inspection result of the image analysis does not show the distortion of the inspection pattern 112 and the pattern different from the inspection pattern 112 (S22: NO), the fθ lens 19 is specified in the place where the stain is present. The specific process S26 for displaying the fact on the liquid crystal display 56 is performed. After that, the process returns to the flowchart of FIG.

On the other hand, if there is no blurring or chipping of the inspection pattern 112 in the inspection result of the image analysis (S20: NO), the determination process S28 is performed. In this process, it is determined whether the inspection result of the image analysis has a distortion of the inspection pattern 112 or a pattern different from the inspection pattern 112. Here, if the inspection result of the image analysis includes distortion of the inspection pattern 112 or a pattern different from the inspection pattern 112 (S28: YES), the camera 103 is specified as a place where dirt is present, and this is indicated. The specific process S30 to be displayed on the liquid crystal display 56 is performed. After that, the process returns to the flowchart of FIG. On the other hand, when there is no distortion of the inspection pattern 112 and a pattern different from the inspection pattern 112 in the inspection result of the image analysis (S28: NO), the detection method without specifying the place where the stain exists. 200 ends. At that time, the liquid crystal display 56 indicates that the fθ lens 19 and the camera 103 are clean.

Returning to the flowchart of FIG. 10, the program represented by the flowchart of FIG. 12 is executed by the CPU 61 of the control unit 51. In the program shown in the flowchart of FIG. 12, first, the image generation process S40 is performed. In this process, regarding the part without the difference and the part with the difference detected by the comparative collation performed as the image analysis in the above analysis process S14, those parts are selectively given by the circle 126 or the frame 128, in different colors. An image 125 (see FIGS. 7 (A) and 7 (B)) that can be distinguished and visually recognized by display or the like is generated. In the display process S42, the generated image 125 is displayed on the liquid crystal display 56. After that, the detection method 200 ends.

When the detection method 200 detects the dirt on the pointer light emitter 105, the program shown in the flowchart of FIG. 10 is executed by the CPU 61 of the control unit 51. In that case, the irradiation region 122 of the pointer light P is used instead of the inspection pattern 112 of the guide light Q. Further, as described above, in the comparative collation performed as an image analysis in the analysis process S14, the reference comparison region of the irradiation region 122 is used instead of the reference comparison pattern of the inspection pattern 112. Further, in the comparative collation, as described above, the shape change, the positional deviation, or the area change of the irradiation area 122, or the interference fringes or abnormal light projected outside the irradiation area 122 are projected on the inspection image 110. It is detected as a difference between the region 122 and the reference contrast region of the irradiation region 122. Further, in the diagnostic process S16, when the difference between the irradiation area 122 projected on the inspection image 110 and the reference comparison area of the irradiation area 122 is detected, the pointer light emitter 105 is found to be dirty. When it is displayed on the liquid crystal display 56 and the difference is not detected, the liquid crystal display 56 indicates that the pointer light emitter 105 is clean. After that, the detection method 200 ends.

Further, when the detection method 200 roughly specifies a dirty range of the fθ lens 19 and the camera 103, and detects dirt on the fθ lens 19 and the camera 103 in the specified range, first, FIGS. 10 and 10 and FIGS. The program represented by each flowchart of 11 is executed by the CPU 61 of the control unit 51. However, in that case, as shown in FIG. 8, an inspection pattern 130 having a pitch a larger than that of the inspection pattern 112 is drawn instead of the inspection pattern 112 (S10), and the inspection pattern 130 is projected. Image 132 is acquired (S12). Further, in the comparative collation performed as an image analysis, a comparison pattern that is a reference of the inspection pattern 130 is used instead of the comparison pattern that is a reference of the inspection pattern 112 (S14).

Further, in each of the specific processes S24, S26, and S30, a portion having a blur, chip, distortion, or a pattern different from the inspection pattern 130 is specified in the inspection image 132. As a result, the diagnostic process S16 is performed. However, in each of the specific processes S24, S26, and S30, instead of specifying the fθ lens 19 or the camera 103 in a place where dirt is present, the liquid crystal display indicates that the fθ lens 19 or the camera 103 may be dirty. It is displayed on the display 56.

Further, after the diagnostic process S16 is performed, the program shown in the flowchart of FIG. 13 is executed by the CPU 61 of the control unit 51. When the redrawing process S50 is performed, the pitch a is higher than that of the inspection pattern 112 on the machined surface 8 of the machined object 7 in a range including the positions corresponding to the places specified by the specific processes S24, S26, and S30. A small re-inspection pattern 134 is drawn with the guide light Q during the two-dimensional scan. As a result, as shown in FIG. 8, on the machined surface 8 of the object to be machined 7, the pitch a is narrower than the drawing area 136 of the inspection pattern 130 in the drawing area 136 of the inspection pattern 130 and the pitch a is finer. The inspection pattern 134 is drawn with the guide light Q instead of the inspection pattern 130.

In the re-acquisition process S52, the camera 103 photographs the processed surface 8 of the object to be processed 7, so that the re-inspection image 138 showing the re-inspection pattern 134 is acquired. At that time, the re-inspection pattern 134 is photographed by the camera 103 with the numerical value of the exposure time stored in the ROM 63.

In the re-analysis process S54, image analysis regarding the re-inspection pattern 134 is performed based on the re-inspection image 138. In this process, the above-mentioned comparison and collation are performed as image analysis. As a result, the difference between the re-inspection pattern 134 projected on the re-inspection image 138 and the reference comparison pattern of the re-inspection pattern 134 is detected.

The re-diagnosis process S56 automatically diagnoses the presence or absence of dirt on at least one of the fθ lens 19 and the camera 103 based on the inspection result of the image analysis in the re-analysis process S54. Therefore, the program shown in the flowchart of FIG. 11 described above is executed by the CPU 61 of the control unit 51. Further, the program shown in the flowchart of FIG. 12 described above is executed by the CPU 61 of the control unit 51. After that, the detection method 200 ends.

[4. summary]
As described in detail above, the laser marker 1 of the present embodiment, its control program, and the detection method 200 are inspected by the guide light Q which is two-dimensionally scanned by the galvano scanner 18 and condensed by the fθ lens 19. The pattern 112 is drawn on the machined surface 8 of the machined object 7 (S10), and the machined surface 8 of the machined object 7 is photographed by the camera 103 to acquire the inspection image 110 on which the inspection pattern 112 is projected (S10). S12), an image analysis regarding the inspection pattern 112 is performed based on the inspection image 110 (S14), and the presence or absence of stains on at least one of the fθ lens 19 and the camera 103 is automatically diagnosed based on the inspection result of the image analysis (S12). S16). As a result, in the laser marker 1 and the detection method 200 of the present embodiment, the guide light Q scanned and focused on the machined surface 8 of the machined object 7 by the galvano scanner 18 and the fθ lens 19 is photographed by the camera 103. This makes it possible to quickly detect dirt on at least one of the fθ lens 19 and the camera 103 without moving a measuring device such as a power meter for inspection.

Further, since the laser marker 1 of the present embodiment performs image analysis by detecting the difference between the inspection pattern 112 projected on the inspection image 110 and the comparison pattern as a reference of the inspection pattern 112 (S14). It is possible to perform automatic diagnosis (S16) relatively easily.

That is, since the laser marker 1 of the present embodiment inspects the presence or absence of distortion, blurring, or chipping of the inspection pattern 112 in the image analysis (S14) (S20, S22, S28), the automatic diagnosis (S16) is relatively performed. It can be done easily.

Further, the laser marker 1 of the present embodiment has a distortion in the inspection pattern 112 or a pattern different from the inspection pattern 112 because the influence of the stain appearing on the inspection pattern 112 is different between the fθ lens 19 and the camera 103. When the camera 103 is specified as the place where the stain exists (S28: YES) and the inspection pattern 112 is blurred or chipped as the inspection content of the image analysis. , The fθ lens 19 is specified as a place where dirt is present (S20: YES). In this way, the laser marker 1 of the present embodiment identifies the place where the stain is present based on the inspection result of the image analysis, so that the stain can be easily dealt with.

Further, since the inspection pattern 112 of the laser marker 1 of the present embodiment is a grid pattern, it can be used in combination with, for example, a pattern used in a scribed circle test.

Further, the laser marker 1 of the present embodiment is drawn on the machined surface 8 of the object to be machined 7 when it is automatically diagnosed by the diagnostic process S16 that dirt may be present (S24, S26, S30). In the drawing area 136 of the inspection pattern 130, the re-inspection pattern 134, which is narrower than the drawing area 136 of the inspection pattern 130 and has a finer pitch a than the inspection pattern 112, is drawn by the guide light Q instead of the inspection pattern 130. (S50). Further, the re-inspection image 138 on which the re-inspection pattern 134 is projected is acquired by photographing the processed surface 8 of the processed object 7 (S52), and image analysis is performed on the re-inspection pattern 134 based on the re-inspection image 138. (S54), based on the inspection result of the image analysis, the presence or absence of dirt on at least one of the fθ lens 19 and the camera 103 is automatically diagnosed (S56). Thereby, the laser marker 1 of the present embodiment can detect the dirt of at least one of the fθ lens 19 and the camera 103 faster and more accurately.

Further, the laser marker 1 of the present embodiment generates a visible image 125 by distinguishing a portion having no difference and a portion having a difference by a circle 126, a frame 128, or the like (S40), and the image 125 is displayed on the liquid crystal display 56. Is displayed in (S42). Thereby, the laser marker 1 of the present embodiment can visually identify the position of dirt.

Further, the laser marker 1 of the present embodiment automatically diagnoses the presence or absence of dirt on the pointer light emitter 105 by treating the irradiation region 122 of the pointer light P on the machined surface 8 of the machined object 7 as an inspection pattern 112. S10 to S16). As a result, in the laser marker 1 of the present embodiment, the pointer light P irradiated to the machined surface 8 of the object to be machined 7 by the pointer light emitter 105 is photographed by the camera 103, whereby the pointer light emitter 105 It is possible to detect dirt.

Further, the laser marker 1 of the present embodiment determines the presence / absence of deviation, chipping, shape change, or area change of the irradiation area 122 of the pointer light P, or the presence / absence of interference fringes or abnormal light outside the irradiation area 122 of the pointer light P. Since the image analysis is performed by the inspection (S14), the automatic diagnosis (S16) can be performed relatively easily.

By the way, the laser marker 1 is an example of a "laser processing device". The machined surface 8 of the object to be machined 7 is an example of a “reference surface”. The galvano scanner 18 and the fθ lens 19 are examples of an “optical system”. The visible semiconductor laser 28 is an example of a “guided light emitting unit”. The liquid crystal display 56 is an example of a "display". The camera 103 is an example of a “shooting unit”. The pointer light emitter 105 is an example of a “pointer light irradiating unit”. The drawing process S10 is an example of a “drawing step”. The acquisition process S12 is an example of the “acquisition step”. The analysis process S14 is an example of an “analysis step”. The diagnostic process S16 is an example of a "diagnosis step".

[5. others]
The present disclosure is not limited to the present embodiment, and various changes can be made without departing from the spirit of the present embodiment.

For example, in the laser marker 1 of the present embodiment, the inspection pattern 140 as shown in FIG. 14 may be drawn on the machined surface 8 of the machined object 7 instead of the grid-shaped inspection pattern 112. Since the inspection pattern 140 is a pattern in which a plurality of straight lines are arranged in parallel, it can be easily drawn on the machined surface 8 of the machined object 7 as compared with the grid-shaped inspection pattern 112. The direction in which the plurality of straight lines are lined up in parallel may be any direction.

Further, although the liquid crystal display 56 is provided in the print information creation unit 2 composed of a personal computer or the like, it may be provided in the laser processing unit 3, or the print information creation unit 2 and the liquid crystal display 56 may be provided. It may be independent of the laser processing unit 3.

Further, the camera 103 is provided in the laser marker 1 in order to realize a function of aligning the focal position F of the processing laser light R and the guide light Q with the processing surface 8 of the processing object 7, but the laser processing The laser marker 1 may be provided in order to realize functions such as finish confirmation and reading of a one-dimensional code or a two-dimensional code. Further, the laser marker 1 may be provided only for executing the detection method 200.

1: Laser processing device, 8: Processed surface of the object to be processed, 28: Visible semiconductor laser, 51: Control unit, 56: Liquid crystal display, 103: Camera, 105: Pointer light emitter, 110: Inspection image, 112: Inspection Pattern, 122: Pointer light irradiation area, 125: Image, 130: Inspection pattern, 132: Inspection image, 134: Re-inspection pattern, 136: Inspection pattern drawing area, 138: Re-inspection image, 140: Inspection pattern, 200 : Detection method, a: Pitch, P: Pointer light, Q: Guide light, S10: Drawing process, S12: Acquisition process, S14: Analysis process, S16: Diagnosis process, S40: Image generation process, S42: Display process, S50 : Redraw processing, S52: Reacquisition processing, S54: Reanalysis processing, S56: Rediagnosis processing

Claims (14)

1. A guide light emitting part that emits a guide light that is visible light,
   An optical system arranged between the guide light emitting portion and the reference surface in order to collect the guide light while scanning it with respect to the reference surface.
   A shooting unit that shoots the reference plane and
   With a control unit,
   The control unit
   A drawing process for drawing an inspection pattern on the reference surface with the guide light, and
   An acquisition process for acquiring an inspection image on which the inspection pattern is projected by photographing the reference surface, and
   An analysis process for performing image analysis on the inspection pattern based on the inspection image, and
   A laser processing apparatus characterized by executing a diagnostic process for automatically diagnosing the presence or absence of stains on at least one of the optical system and the photographing unit based on the inspection result of the image analysis.
2. The first aspect of the present invention is characterized in that the analysis process performs the image analysis by detecting a difference between the inspection pattern displayed on the inspection image and a comparison pattern as a reference of the inspection pattern. Laser processing equipment.
3. The laser processing apparatus according to claim 1 or 2, wherein the analysis process inspects the presence or absence of distortion, blurring, or chipping of the inspection pattern in the image analysis.
4. The laser processing apparatus according to any one of claims 1 to 3, wherein the diagnostic process identifies a place where the stain is present based on the inspection result of the image analysis.
5. In the diagnostic process, when the inspection result of the image analysis is that the inspection pattern is distorted or has a pattern different from the inspection pattern, the imaging unit is specified as a place where the stain is present. The laser processing apparatus according to claim 4.
6. The fourth aspect of the present invention is characterized in that the optical system is specified as a place where the stain is present when the inspection content of the image analysis is that the inspection pattern has a blur or a chip. The laser processing device described.
7. The laser processing apparatus according to any one of claims 1 to 6, wherein the inspection pattern is a grid pattern.
8. The laser processing apparatus according to any one of claims 1 to 6, wherein the inspection pattern is a pattern in which a plurality of straight lines are arranged in parallel.
9. When the control unit is automatically diagnosed as having the dirt, the control unit is used.
   In the drawing area of the inspection pattern drawn on the reference plane, a redrawing process of drawing a re-inspection pattern narrower than the drawing area of the inspection pattern and having a finer pitch with the guide light instead of the inspection pattern, and
   A re-acquisition process for acquiring a re-inspection image on which the re-inspection pattern is projected by photographing the reference plane, and a re-acquisition process.
   A reanalysis process in which the image analysis is performed on the reinspection pattern based on the reinspection image, and
   7. The laser processing apparatus described in.
10. Equipped with a display
    The control unit
    An image generation process for generating a visible image by distinguishing between a portion having no difference and a portion having the difference.
    The laser processing apparatus according to claim 2, further comprising a display process of displaying the image on the display.
11. It is provided with a pointer light irradiation unit that irradiates the reference surface with pointer light which is visible light.
    The first or second aspect of the present invention, wherein the control unit automatically diagnoses the presence or absence of dirt on the pointer light irradiation unit by treating the pointer light irradiation region on the reference surface as the inspection pattern. Laser processing equipment.
12. In the analysis process, in the image analysis, the presence or absence of deviation, chipping, shape change, or area change of the pointer light irradiation region, or the presence or absence of interference fringes or abnormal light outside the pointer light irradiation region is inspected. 11. The laser processing apparatus according to claim 11.
13. A guide light emitting unit that emits a guide light that is visible light, and an optical system that is arranged between the guide light emitting unit and the reference surface in order to collect the guide light while scanning it with respect to the reference surface. It is a stain detection method for detecting the presence or absence of stains on a laser processing apparatus including a system and an imaging unit for photographing the reference surface.
    A drawing step of drawing an inspection pattern on the reference surface with the guide light,
    An acquisition step of acquiring an inspection image on which the inspection pattern is projected by photographing the reference surface, and
    An analysis step of performing image analysis on the inspection pattern based on the inspection image, and a diagnostic step of automatically diagnosing the presence or absence of stains on at least one of the optical system and the photographing portion based on the inspection result of the image analysis. And, a dirt detection method characterized by being provided with.
14. A guide light emitting unit that emits a guide light that is visible light, and an optical system that is arranged between the guide light emitting unit and the reference surface in order to collect the guide light while scanning it with respect to the reference surface. A laser processing device including a system, an imaging unit for photographing the reference plane, and a control unit.
    A drawing process for drawing an inspection pattern on the reference surface with the guide light, and
    An acquisition process for acquiring an inspection image on which the inspection pattern is projected by photographing the reference surface, and
    An analysis process for performing image analysis on the inspection pattern based on the inspection image, and
    A control program for a laser processing device for executing a diagnostic process for automatically diagnosing the presence or absence of stains on at least one of the optical system and the photographing unit based on the inspection result of the image analysis.

Images