WO2022138184A1 - Active energy ray-curable resin composition, cured product, insulation material and resist member - Google Patents
Active energy ray-curable resin composition, cured product, insulation material and resist member Download PDFInfo
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- WO2022138184A1 WO2022138184A1 PCT/JP2021/045258 JP2021045258W WO2022138184A1 WO 2022138184 A1 WO2022138184 A1 WO 2022138184A1 JP 2021045258 W JP2021045258 W JP 2021045258W WO 2022138184 A1 WO2022138184 A1 WO 2022138184A1
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- resin
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- 239000011342 resin composition Substances 0.000 title claims abstract description 82
- 239000012774 insulation material Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 163
- 239000011347 resin Substances 0.000 claims abstract description 163
- -1 acrylate compound Chemical class 0.000 claims abstract description 160
- 239000003822 epoxy resin Substances 0.000 claims abstract description 127
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 127
- 239000002253 acid Substances 0.000 claims abstract description 102
- 150000001875 compounds Chemical class 0.000 claims abstract description 81
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 56
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000000203 mixture Substances 0.000 claims description 39
- 125000003700 epoxy group Chemical group 0.000 claims description 32
- 239000002994 raw material Substances 0.000 claims description 18
- 239000003999 initiator Substances 0.000 claims description 11
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000003513 alkali Substances 0.000 abstract description 28
- 239000000463 material Substances 0.000 abstract description 9
- 239000002585 base Substances 0.000 abstract description 2
- 239000007858 starting material Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 93
- 239000004925 Acrylic resin Substances 0.000 description 81
- NNVDGGDSRRQJMV-UHFFFAOYSA-L [dioctyl(2,2,5,5-tetramethylhexanoyloxy)stannyl] 2,2,5,5-tetramethylhexanoate Chemical compound CCCCCCCC[Sn](OC(=O)C(C)(C)CCC(C)(C)C)(OC(=O)C(C)(C)CCC(C)(C)C)CCCCCCCC NNVDGGDSRRQJMV-UHFFFAOYSA-L 0.000 description 64
- 238000003786 synthesis reaction Methods 0.000 description 62
- 230000015572 biosynthetic process Effects 0.000 description 61
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 52
- 238000006243 chemical reaction Methods 0.000 description 50
- 239000003054 catalyst Substances 0.000 description 46
- 150000007519 polyprotic acids Polymers 0.000 description 45
- 150000008065 acid anhydrides Chemical class 0.000 description 42
- 239000000047 product Substances 0.000 description 42
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 41
- 238000002360 preparation method Methods 0.000 description 41
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 39
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 36
- 239000003960 organic solvent Substances 0.000 description 35
- 238000007664 blowing Methods 0.000 description 33
- 239000000758 substrate Substances 0.000 description 33
- 238000010992 reflux Methods 0.000 description 32
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 30
- 229920003986 novolac Polymers 0.000 description 27
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 23
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 22
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 21
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 21
- 229920005862 polyol Polymers 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 239000000049 pigment Substances 0.000 description 19
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 17
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 16
- 239000005056 polyisocyanate Substances 0.000 description 16
- 229920001228 polyisocyanate Polymers 0.000 description 16
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 15
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 15
- 229920000058 polyacrylate Polymers 0.000 description 15
- 239000000178 monomer Substances 0.000 description 13
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 13
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 12
- 125000002723 alicyclic group Chemical group 0.000 description 12
- 125000001931 aliphatic group Chemical group 0.000 description 12
- 238000005886 esterification reaction Methods 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 11
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 11
- 125000002947 alkylene group Chemical group 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 10
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 10
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 125000004018 acid anhydride group Chemical group 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 8
- 150000002148 esters Chemical class 0.000 description 8
- 150000002596 lactones Chemical class 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 8
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 8
- 229920000178 Acrylic resin Polymers 0.000 description 7
- 230000002378 acidificating effect Effects 0.000 description 7
- 125000005702 oxyalkylene group Chemical group 0.000 description 7
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
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- 125000000524 functional group Chemical group 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 6
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- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 6
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- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
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- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 4
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- 229940014800 succinic anhydride Drugs 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 1
- IBWGNZVCJVLSHB-UHFFFAOYSA-M tetrabutylphosphanium;chloride Chemical compound [Cl-].CCCC[P+](CCCC)(CCCC)CCCC IBWGNZVCJVLSHB-UHFFFAOYSA-M 0.000 description 1
- FBOJNMRAZJRCNS-UHFFFAOYSA-M tetraethylphosphanium;chloride Chemical compound [Cl-].CC[P+](CC)(CC)CC FBOJNMRAZJRCNS-UHFFFAOYSA-M 0.000 description 1
- NJFUXFRJVIXVSG-UHFFFAOYSA-M tetramethylphosphanium;chloride Chemical compound [Cl-].C[P+](C)(C)C NJFUXFRJVIXVSG-UHFFFAOYSA-M 0.000 description 1
- QBAUHKSMFOSSGE-UHFFFAOYSA-M tetrapropylphosphanium;chloride Chemical compound [Cl-].CCC[P+](CCC)(CCC)CCC QBAUHKSMFOSSGE-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical compound S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- AVCVDUDESCZFHJ-UHFFFAOYSA-N triphenylphosphane;hydrochloride Chemical compound [Cl-].C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 AVCVDUDESCZFHJ-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- RKQOSDAEEGPRER-UHFFFAOYSA-L zinc diethyldithiocarbamate Chemical compound [Zn+2].CCN(CC)C([S-])=S.CCN(CC)C([S-])=S RKQOSDAEEGPRER-UHFFFAOYSA-L 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/067—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
Definitions
- the present invention relates to an active energy ray-curable resin composition, a cured product, an insulating material, and a resist member, which have excellent alkali developability and excellent elongation, elasticity, and substrate adhesion in a cured product.
- an acid group-containing epoxy acrylate resin obtained by reacting an epoxy resin with acrylic acid and then reacting with an acid anhydride has been widely used as a resin material for a solder resist for a printed wiring substrate.
- the required performance for the resin material for solder resist is that it cures with a small exposure amount, it has excellent alkali developability, and it has excellent heat resistance, strength, flexibility, elongation, dielectric properties, substrate adhesion, etc. in the cured product.
- Various things can be mentioned.
- the problem to be solved by the present invention is an active energy ray-curable resin composition, a cured product, an insulating material, which has excellent alkali developability and excellent elongation, elasticity, and substrate adhesion in a cured product. It is to provide a resist member.
- the present invention is an active energy ray containing a resin (A) having an acid group and a polymerizable unsaturated group, and a resin (B) having a polymerizable unsaturated group and a urethane bond other than the resin (A).
- the active energy ray-curable resin composition of the present invention has excellent alkali developability, and has excellent elongation, elasticity, and substrate adhesion in the cured product, and is therefore suitably used for insulating materials and resist members. be able to.
- the "excellent elasticity" in the present invention means a low elastic modulus.
- the active energy ray-curable resin composition of the present invention comprises a resin (A) having an acid group and a polymerizable unsaturated group, and a resin (B) having a polymerizable unsaturated group and a urethane bond other than the resin (A). It is characterized by using and as an essential reaction raw material.
- (meth) acrylate means acrylate and / or methacrylate.
- (meth) acryloyl means acryloyl and / or methacryloyl.
- (meth) acrylic means acrylic and / or methacrylic.
- the resin (A) having an acid group and a polymerizable unsaturated group may be any resin (A) having an acid group and a polymerizable unsaturated group in the resin, and for example, an acid group and a polymerizable unsaturated group may be used.
- Examples thereof include an acrylamide resin having a group, an ester resin having an acid group and a polymerizable unsaturated group, and the like.
- Examples of the acid group include a carboxyl group, a sulfonic acid group, and a phosphoric acid group.
- Examples of the polymerizable unsaturated group include (meth) acryloyl group, allyl group, isopropenyl group, 1-propenyl group, styryl group, styrylmethyl group, maleimide group, vinyl ether group and the like.
- Examples of the epoxy resin having an acid group and a polymerizable unsaturated group include an epoxy resin, an unsaturated monobasic acid, and an epoxy (meth) acrylate resin having an acid group using a polybasic acid anhydride as an essential raw material.
- Examples thereof include epoxy resins, unsaturated monobasic acids, polybasic acid anhydrides, polyisocyanate compounds, and epoxy (meth) acrylate resins having acid groups and urethane bonds using a (meth) acrylate compound having a hydroxyl group as a reaction raw material. ..
- epoxy resin examples include bisphenol type epoxy resin, phenylene ether type epoxy resin, naphthalene type epoxy resin, naphthylene ether type epoxy resin, biphenyl type epoxy resin, triphenylmethane type epoxy resin, phenol novolac type epoxy resin, and cresol.
- Novolak type epoxy resin bisphenol novolak type epoxy resin, naphthol novolak type epoxy resin, naphthol-phenol co-shrink novolak type epoxy resin, naphthol-cresol co-shrink novolak type epoxy resin, phenol aralkyl type epoxy resin, naphthol aralkyl type epoxy resin, Cyclopentadiene-phenol addition reaction type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, dihydroxybenzene type epoxy resin, trihydroxybenzene type epoxy resin, oxazolidone type epoxy resin and the like can be mentioned. These epoxy resins can be used alone or in combination of two or more.
- bisphenol type epoxy resin examples include bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol E type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy. Examples include resin.
- Examples of the hydrogenated bisphenol type epoxy resin include hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol B type epoxy resin, hydrogenated bisphenol E type epoxy resin, hydrogenated bisphenol F type epoxy resin, and hydrogenated bisphenol S type epoxy. Examples include resin.
- biphenol type epoxy resin examples include 4,4'-biphenol type epoxy resin, 2,2'-biphenol type epoxy resin, tetramethyl-4,4'-biphenol type epoxy resin, and tetramethyl-2,2'.
- -Biphenol type epoxy resin and the like can be mentioned.
- hydrogenated biphenol type epoxy resin examples include hydrogenated 4,4'-biphenol type epoxy resin, hydrogenated 2,2'-biphenol type epoxy resin, and hydrogenated tetramethyl-4,4'-biphenol type epoxy resin. , Hydrogenated tetramethyl-2,2'-biphenol type epoxy resin and the like.
- Examples of the unsaturated monobasic acid include acrylic acid, methacrylic acid, crotonic acid, cinnamic acid, ⁇ -cyanocinnamic acid, ⁇ -styrylacrylic acid, ⁇ -flufurylacrylic acid and the like. Further, an esterified product of the unsaturated monobasic acid, an acid halide, an acid anhydride and the like can also be used. Further, a compound represented by the following structural formula (1) can also be used.
- X represents an alkylene chain having 1 to 10 carbon atoms, a polyoxyalkylene chain, a (poly) ester chain, an aromatic hydrocarbon chain, or a (poly) carbonate chain, and a halogen atom in the structure. Or an alkoxy group or the like.
- Y is a hydrogen atom or a methyl group.
- polyoxyalkylene chain examples include a polyoxyethylene chain and a polyoxypropylene chain.
- Examples of the (poly) ester chain include a (poly) ester chain represented by the following structural formula (2).
- R 1 is an alkylene group having 1 to 10 carbon atoms, and n is an integer of 1 to 5.
- aromatic hydrocarbon chain examples include a phenylene chain, a naphthylene chain, a biphenylene chain, a phenylnaphthylene chain, and a binaphthylene chain.
- a hydrocarbon chain having an aromatic ring such as a benzene ring, a naphthalene ring, an anthracene ring, or a phenanthrene ring can also be used.
- These unsaturated monobasic acids can be used alone or in combination of two or more.
- polybasic acid anhydride examples include an aliphatic polybasic acid anhydride, an alicyclic polybasic acid anhydride, and an aromatic polybasic acid anhydride.
- Examples of the aliphatic polybasic acid anhydride include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelli acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, citraconic acid and itacone. Examples thereof include acid, glutaconic acid, and acid anhydrides of 1,2,3,4-butanetetracarboxylic acid.
- the aliphatic hydrocarbon group may be either a linear type or a branched type, and may have an unsaturated bond in the structure.
- an alicyclic polybasic acid anhydride having an acid anhydride group bonded to an alicyclic structure is used as an alicyclic polybasic acid anhydride, and the aromatic ring in other structural parts is used. It does not matter whether it is present or not.
- the alicyclic polybasic acid anhydride include tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, and bicyclo [2.2.1] heptane-2.
- aromatic polybasic acid anhydride examples include phthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid and biphenyltetracarboxylic acid.
- aromatic polybasic acid anhydride examples include phthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid and biphenyltetracarboxylic acid.
- examples thereof include acid anhydrides of benzophenone tetracarboxylic acid.
- polybasic acid anhydrides can be used alone or in combination of two or more.
- polyisocyanate compound examples include aliphatic diisocyanate compounds such as butane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate; norbornan diisocyanate and isophorone diisocyanate.
- Alicyclic diisocyanate compounds such as hydrogenated xylylene diisocyanate and hydrogenated diphenylmethane diisocyanate; tolylene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, diphenylmethane diisocyanate, 1,5-naphthalenedi isocyanate, 4,4'-diisocyanato-3 , 3'-Aromatic diisocyanate compounds such as dimethylbiphenyl and o-trizine diisocyanate; polymethylene polyphenyl polyisocyanate having a repeating structure represented by the following structural formula (3); these isocyanurate modified products, biuret modified products, Examples thereof include allophanate modified products. Further, these polyisocyanate compounds may be used alone or in combination of two or more.
- R 1 is either a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, respectively.
- R 2 is an alkyl group having 1 to 4 carbon atoms independently, l is an integer of 0 or 1 to 3, and m is an integer of 1 to 15. ]
- the (meth) acrylate compound having a hydroxyl group is not particularly limited as long as it is a compound having a hydroxyl group and a (meth) acryloyl group in its molecular structure, and a wide variety of compounds can be used. Examples thereof include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, trimethylolpropane (meth) acrylate, trimethylolpropane di (meth) acrylate, pentaerythritol (meth) acrylate, and pentaerythritol di (meth).
- a (poly) oxyalkylene chain such as a (poly) oxyethylene chain, a (poly) oxypropylene chain, or a (poly) oxytetramethylene chain was introduced into the molecular structure of the (meth) acrylate compound having various hydroxyl groups.
- a (poly) oxyalkylene modified product, a lactone modified product in which a (poly) lactone structure is introduced into the molecular structure of the (meth) acrylate compound having various hydroxyl groups, or the like can also be used.
- These (meth) acrylate compounds having a hydroxyl group may be used alone or in combination of two or more.
- the method for producing the epoxy resin having the acid group and the polymerizable unsaturated group is not particularly limited, and any method may be used for producing the epoxy resin.
- it may be carried out in an organic solvent if necessary, or a basic catalyst may be used if necessary.
- organic solvent examples include ketone solvents such as methyl ethyl ketone, acetone, dimethylformamide and methyl isobutyl ketone; cyclic ether solvents such as tetrahydrofuran and dioxolan; ester solvents such as methyl acetate, ethyl acetate and butyl acetate; toluene, xylene and solvent.
- ketone solvents such as methyl ethyl ketone, acetone, dimethylformamide and methyl isobutyl ketone
- cyclic ether solvents such as tetrahydrofuran and dioxolan
- ester solvents such as methyl acetate, ethyl acetate and butyl acetate
- toluene, xylene and solvent examples of the organic solvent.
- Aromatic solvents such as naphtha; alicyclic solvents such as cyclohexane and methylcyclohexane; alcohol solvents such as carbitol, cellosolve, methanol, isopropanol, butanol and propylene glycol monomethyl ether; alkylene glycol monoalkyl ethers and dialkylene glycol monoalkyl ethers.
- Glycol ether solvent such as dialkylene glycol monoalkyl ether acetate; methoxypropanol, cyclohexanone, methyl cellosolve, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate and the like.
- These organic solvents may be used alone or in combination of two or more. Further, the amount of the organic solvent used is preferably in the range of about 0.1 to 5 times the total mass of the reaction raw materials because the reaction efficiency is good.
- Examples of the basic catalyst include N-methylmorpholin, pyridine, 1,8-diazabicyclo [5.4.0] undecene-7 (DBU), 1,5-diazabicyclo [4.3.0] nonen-. 5 (DBN), 1,4-diazabicyclo [2.2.2] octane (DABCO), tri-n-butylamine or dimethylbenzylamine, butylamine, octylamine, monoethanolamine, diethanolamine, triethanolamine, imidazole, 1 -Methylimidazole, 2,4-dimethylimidazole, 1,4-diethylimidazole, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (N-phenyl) aminopropyltrimethoxysilane, 3-( Amine compounds such as 2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-aminoethyl)
- phosphine compounds such as trimethylphosphine, tributylphosphine, triphenylphosphine; tetramethylphosphonium chloride, tetraethylphosphonium chloride, tetrapropylphosphonium chloride, tetrabutylphosphonium chloride, tetrabutylphosphonium bromide, trimethyl (2-hydroxylpropyl) phosphonium chloride , Triphenylphosphonium chloride, phosphonium salts such as benzylphosphonium chloride; dibutyltin dilaurate, octyltin trilaurate, octyltin diacetate, dioctyltin diacetate, dioctyltin dineodecanoate, dibutyltin diacetate, tin octylate, 1 , 1,3,3-Tetrabutyl-1,3-Dodecan
- alkaline earth metal hydroxides alkali metal carbonates, alkali metal hydroxides and the like can also be used.
- alkali metal hydroxides are preferable because they are excellent in catalytic activity of the epoxy resin synthesis reaction, and for example, sodium hydroxide and potassium hydroxide are more preferable.
- These basic catalysts can be used alone or in combination of two or more. When using the basic catalyst, it may be used in the form of an aqueous solution of about 10% by mass to 55% by mass, or may be used in the form of a solid.
- Examples of the urethane resin having an acid group and a polymerizable unsaturated group include a polyisocyanate compound, a (meth) acrylate compound having a hydroxyl group, a polyol compound having a carboxyl group, and, if necessary, a polybasic acid anhydride.
- polyisocyanate compound the same one as exemplified as the above-mentioned polyisocyanate compound can be used, and the polyisocyanate compound may be used alone or in combination of two or more.
- the same compounds as those exemplified for the (meth) acrylate compound having a hydroxyl group can be used, and the (meth) acrylate compound having a hydroxyl group is used alone. It is also possible to use two or more kinds together.
- polyol compound having a carboxyl group examples include 2,2-dimethylolpropionic acid, 2,2-dimethylolbutanoic acid, 2,2-dimethylolpropane valeric acid and the like.
- the polyol compound having a carboxyl group may be used alone or in combination of two or more.
- polybasic acid anhydride the same ones as those exemplified as the above-mentioned polybasic acid anhydride can be used, and the polybasic acid anhydride may be used alone or in combination of two or more. You can also.
- polyol compound other than the polyol compound having a carboxyl group examples include aliphatic polyol compounds such as ethylene glycol, propylene glycol, butanediol, hexanediol, glycerin, trimethylolpropane, ditrimethylolpropane, pentaerythritol and dipentaerythritol.
- Aromatic polyol compounds such as biphenol and bisphenol; (poly) oxyalkylene chains such as (poly) oxyethylene chain, (poly) oxypropylene chain and (poly) oxytetramethylene chain in the molecular structure of the various polyol compounds.
- polystyrene foam in which (poly) lactone structure is introduced into the molecular structure of the various polyol compounds, and the like can be mentioned.
- the polyol compound other than the polyol compound having a carboxyl group may be used alone or in combination of two or more.
- the method for producing the urethane resin having the acid group and the polymerizable unsaturated group is not particularly limited, and any method may be used for producing the urethane resin.
- it may be carried out in an organic solvent if necessary, or a basic catalyst may be used if necessary.
- organic solvent the same ones as those exemplified as the above-mentioned organic solvent can be used, and the organic solvent can be used alone or in combination of two or more.
- the same catalysts as those exemplified as the above-mentioned basic catalyst can be used, and the basic catalyst may be used alone or in combination of two or more.
- the acrylic resin having an acid group and a polymerizable unsaturated group for example, a (meth) acrylate compound ( ⁇ ) having a reactive functional group such as a hydroxyl group, a carboxyl group, an isocyanate group or a glycidyl group is polymerized as an essential component.
- the acrylic resin intermediate may be a copolymer of the (meth) acrylate compound ( ⁇ ) and other compounds having a polymerizable unsaturated group, if necessary.
- the other compounds having a polymerizable unsaturated group include (meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.
- Acrylic acid alkyl ester alicyclic structure-containing (meth) acrylate such as cyclohexyl (meth) acrylate, isoboronyl (meth) acrylate, dicyclopentanyl (meth) acrylate; phenyl (meth) acrylate, benzyl (meth) acrylate, Aromatic ring-containing (meth) acrylates such as phenoxyethyl acrylate; (meth) acrylates having a silyl group such as 3-methacryloxypropyltrimethoxysilane; styrene derivatives such as styrene, ⁇ -methylstyrene and chlorostyrene can be mentioned. These can be used alone or in combination of two or more.
- the (meth) acrylate compound ( ⁇ ) is not particularly limited as long as it can react with the reactive functional group of the (meth) acrylate compound ( ⁇ ), but the combination is as follows from the viewpoint of reactivity. Is preferable. That is, when a (meth) acrylate having a hydroxyl group is used as the (meth) acrylate compound ( ⁇ ), it is preferable to use a (meth) acrylate having an isocyanate group as the (meth) acrylate compound ( ⁇ ).
- a (meth) acrylate having a carboxyl group is used as the (meth) acrylate compound ( ⁇ )
- a (meth) acrylate having an isocyanate group is used as the (meth) acrylate compound ( ⁇ )
- the (meth) acrylate compound ( ⁇ ) When a (meth) acrylate having a glycidyl group is used as the (meth) acrylate compound ( ⁇ ), it is preferable to use a (meth) acrylate having a carboxyl group as the (meth) acrylate compound ( ⁇ ).
- the (meth) acrylate compound ( ⁇ ) can be used alone or in combination of two or more.
- polybasic acid anhydride the same ones as those exemplified as the above-mentioned polybasic acid anhydride can be used, and the polybasic acid anhydride may be used alone or in combination of two or more. can.
- the method for producing the acrylic resin having the acid group and the polymerizable unsaturated group is not particularly limited, and any method may be used for producing the acrylic resin.
- it may be carried out in an organic solvent if necessary, or a basic catalyst may be used if necessary.
- organic solvent the same ones as those exemplified as the above-mentioned organic solvent can be used, and the organic solvent can be used alone or in combination of two or more.
- the same catalysts as those exemplified as the above-mentioned basic catalyst can be used, and the basic catalyst may be used alone or in combination of two or more.
- Examples of the amideimide resin having an acid group and a polymerizable unsaturated group include an amideimide resin having an acid group and / or an acid anhydride group, and a (meth) acrylate compound having a hydroxyl group and / or an epoxy group (meth).
- the compound having a reactive functional group may or may not have a (meth) acryloyl group.
- the amidimide resin may have only one of an acid group and an acid anhydride group, or may have both. From the viewpoint of reactivity with (meth) acrylate compounds having a hydroxyl group and epoxy compounds having a (meth) acryloyl group and reaction control, those having an acid anhydride group are preferable, and the acid group and the acid anhydride group are used. It is more preferable to have both of them.
- the solid acid value of the amideimide resin is preferably in the range of 60 to 350 mgKOH / g under neutral conditions, that is, under conditions where the acid anhydride group is not opened. On the other hand, the measured value under the condition that the acid anhydride group is opened, such as in the presence of water, is preferably in the range of 61 to 360 mgKOH / g.
- amidoimide resin examples include those obtained by using a polyisocyanate compound and a polybasic acid anhydride as reaction raw materials.
- polyisocyanate compound the same one as exemplified as the above-mentioned polyisocyanate compound can be used, and the polyisocyanate compound may be used alone or in combination of two or more.
- polybasic acid anhydride the same ones as those exemplified as the above-mentioned polybasic acid anhydride can be used, and the polybasic acid anhydride may be used alone or in combination of two or more. You can also.
- amidoimide resin a polybasic acid can be used as a reaction raw material in addition to the polyisocyanate compound and the polybasic acid anhydride, if necessary.
- any compound having two or more carboxyl groups in one molecule can be used.
- Phthalic acid methylhexahydrophthalic acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo [2.2.1] heptane- 2,3-Dicarboxylic acid, methylbicyclo [2.2.1] heptane-2,3-dicarboxylic acid, 4- (2,5-dioxotetratetra-3-yl) -1,2,3,4-tetrahydro Naphthalene-1,2-dicarboxylic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic acid, biphenyltricarboxylic acid, biphenyltetracar
- polybasic acid for example, a copolymer of a conjugated diene-based vinyl monomer and acrylonitrile, which has a carboxyl group in its molecule, can also be used. These polybasic acids can be used alone or in combination of two or more.
- the same compounds as those exemplified for the (meth) acrylate compound having a hydroxyl group can be used, and the (meth) acrylate compound having a hydroxyl group is used alone. It is also possible to use two or more kinds together.
- the (meth) acrylate compound having an epoxy group is not particularly limited as long as it has a (meth) acryloyl group and an epoxy group in its molecular structure, and a wide variety of compounds can be used.
- (meth) acrylate monomers having a glycidyl group such as glycidyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate glycidyl ether, and epoxycyclohexylmethyl (meth) acrylate; dihydroxybenzene diglycidyl ether, dihydroxynaphthalenedi glycidyl ether.
- Mono (meth) acrylates of diglycidyl ether compounds such as biphenol diglycidyl ether and bisphenol diglycidyl ether.
- These epoxy group-containing (meth) acrylate compounds may be used alone or in combination of two or more.
- one epoxy group can be obtained because an active energy ray-curable resin composition having excellent alkali developability and capable of forming a cured product having excellent elongation, elasticity and substrate adhesion can be obtained.
- the (meth) acrylate compound having (meth) is preferable, and an active energy ray-curable resin composition capable of forming a cured product having excellent alkali developability, excellent elongation, elasticity, and substrate adhesion can be obtained.
- a (meth) acrylate monomer having a glycidyl group is preferable. Further, the molecular weight of the (meth) acrylate monomer having a glycidyl group is preferably 500 or less. Further, the ratio of the (meth) acrylate monomer having a glycidyl group to the total mass of the (meth) acrylate compound having an epoxy group is preferably 70% by mass or more, and more preferably 90% by mass or more.
- the method for producing the amidoimide resin having the acid group and the polymerizable unsaturated group is not particularly limited, and any method may be used for production. In the production of the amidoimide resin having an acid group and a polymerizable unsaturated group, it may be carried out in an organic solvent if necessary, or a basic catalyst may be used if necessary.
- organic solvent the same ones as those exemplified as the above-mentioned organic solvent can be used, and the organic solvent can be used alone or in combination of two or more.
- the same catalysts as those exemplified as the above-mentioned basic catalyst can be used, and the basic catalyst may be used alone or in combination of two or more.
- Examples of the acrylamide resin having an acid group and a polymerizable unsaturated group include a compound having a phenolic hydroxyl group, an alkylene oxide or an alkylene carbonate, an N-alkoxyalkyl (meth) acrylamide compound, and a polybasic acid anhydride. , If necessary, those obtained by reacting with unsaturated monobasic acid can be mentioned.
- the same compound as exemplified as the above-mentioned compound having a phenolic hydroxyl group (a1) can be used, and the compound having the phenolic hydroxyl group can be used alone. It is also possible to use more than seeds together.
- alkylene oxide examples include ethylene oxide, propylene oxide, butylene oxide, and pentylene oxide.
- ethylene oxide or propylene oxide can be obtained because an active energy ray-curable resin composition having excellent alkali developability and capable of forming a cured product having excellent elongation, elasticity and substrate adhesion can be obtained. Is preferable.
- the alkylene oxide can be used alone or in combination of two or more.
- alkylene carbonate examples include ethylene carbonate, propylene carbonate, butylene carbonate, pentylene carbonate and the like.
- ethylene carbonate or propylene carbonate can be obtained. Is preferable.
- the alkylene carbonate can be used alone or in combination of two or more.
- N-alkoxyalkyl (meth) acrylamide compound examples include N-methoxymethyl (meth) acrylamide, N-ethoxymethyl (meth) acrylamide, N-butoxymethyl (meth) acrylamide, and N-methoxyethyl (meth) acrylamide. , N-ethoxyethyl (meth) acrylamide, N-butoxyethyl (meth) acrylamide and the like.
- the N-alkoxyalkyl (meth) acrylamide compound may be used alone or in combination of two or more.
- polybasic acid anhydride the same ones as those exemplified as the above-mentioned polybasic acid anhydride can be used, and the polybasic acid anhydride may be used alone or in combination of two or more. You can also.
- unsaturated monobasic acid the same as those exemplified as the above-mentioned unsaturated monobasic acid can be used, and the unsaturated monobasic acid can be used alone or in combination of two or more. ..
- the method for producing the acrylamide resin having the acid group and the polymerizable unsaturated group is not particularly limited, and any method may be used for producing the acrylamide resin.
- the acrylamide resin having an acid group and a polymerizable unsaturated group it may be carried out in an organic solvent if necessary, and a basic catalyst and an acidic catalyst may be used as necessary.
- organic solvent the same ones as those exemplified as the above-mentioned organic solvent can be used, and the organic solvent can be used alone or in combination of two or more.
- the same catalysts as those exemplified as the above-mentioned basic catalyst can be used, and the basic catalyst may be used alone or in combination of two or more.
- the acidic catalyst examples include inorganic acids such as hydrochloric acid, sulfuric acid and phosphoric acid, organic acids such as methanesulfonic acid, paratoluenesulfonic acid and oxalic acid, and Lewis acids such as boron trifluoride, anhydrous aluminum chloride and zinc chloride. And so on. Further, a solid acid catalyst having a strong acid such as a sulfonyl group can also be used. These acidic catalysts can be used alone or in combination of two or more.
- ester resin having an acid group and a polymerizable unsaturated group for example, a compound having a phenolic hydroxyl group, an alkylene oxide or an alkylene carbonate, an unsaturated monobasic acid, and a polybasic acid anhydride are reacted with each other.
- the obtained ones can be mentioned.
- the compound having a phenolic hydroxyl group means a compound having at least one phenolic hydroxyl group in the molecule.
- Examples of the compound having at least one phenolic hydroxyl group in the molecule include compounds represented by the following structural formulas (4-1) to (4-5).
- R 1 is any one of an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, and a halogen atom.
- R 2 are independently hydrogen atoms or methyl groups.
- p is 0 or an integer of 1 or more, preferably an integer of 0 or 1 to 3, more preferably 0 or 1, and even more preferably 0.
- q is an integer of 1 or more, preferably 2 or 3.
- the position of the substituent on the aromatic ring in the above structural formula is arbitrary, and for example, in the naphthalene ring of the structural formula (4-2), it may be substituted on any ring, and the structural formula ( In 4-3), it may be substituted on any ring of the benzene ring present in one molecule, and in the structural formula (4-4), it may be substituted on any ring of the benzene ring present in one molecule.
- the structural formula (4-5) it is shown that it may be substituted on any ring of the benzene ring present in one molecule, and the number of substituents in one molecule is indicated. Is shown to be p and q.
- the compound having a phenolic hydroxyl group includes, for example, a compound having at least one phenolic hydroxyl group in the molecule and a compound represented by any of the following structural formulas (x-1) to (x-5).
- a reaction product or the like using the above as an essential reaction raw material can also be used.
- a novolak type phenol resin or the like using one or more of compounds having at least one phenolic hydroxyl group in the molecule as a reaction raw material can also be used.
- h is 0 or 1.
- R 3 is any one of an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group, and a halogen atom, and i. Is 0 or an integer from 1 to 4.
- Z is any one of a vinyl group, a halomethyl group, a hydroxymethyl group and an alkyloxymethyl group.
- Y is any of an alkylene group having 1 to 4 carbon atoms, an oxygen atom, a sulfur atom, and a carbonyl group, and j is an integer of 1 to 4.
- alkylene oxide the same ones as those exemplified as the above-mentioned alkylene oxide can be used.
- ethylene oxide or propylene oxide can be obtained because an active energy ray-curable resin composition having excellent alkali developability and capable of forming a cured product having excellent elongation, elasticity and substrate adhesion can be obtained. Is preferable.
- the alkylene oxide can be used alone or in combination of two or more.
- alkylene carbonate the same ones as those exemplified as the above-mentioned alkylene carbonate can be used. Among these, since an active energy ray-curable resin composition having excellent alkali developability and capable of forming a cured product having excellent elongation, elasticity and substrate adhesion can be obtained, ethylene carbonate or propylene carbonate can be obtained. Is preferable.
- the alkylene carbonate can be used alone or in combination of two or more.
- unsaturated monobasic acid the same as those exemplified as the above-mentioned unsaturated monobasic acid can be used, and the unsaturated monobasic acid can be used alone or in combination of two or more. ..
- polybasic acid anhydride the same ones as those exemplified as the above-mentioned polybasic acid anhydride can be used, and the polybasic acid anhydride may be used alone or in combination of two or more. You can also.
- the method for producing the ester resin having the acid group and the polymerizable unsaturated group is not particularly limited, and any method may be used for producing the ester resin.
- the ester resin having an acid group and a polymerizable unsaturated group it may be carried out in an organic solvent if necessary, or a basic catalyst and an acidic catalyst may be used if necessary.
- organic solvent the same ones as those exemplified as the above-mentioned organic solvent can be used, and the organic solvent can be used alone or in combination of two or more.
- the same catalysts as those exemplified as the above-mentioned basic catalyst can be used, and the basic catalyst may be used alone or in combination of two or more.
- the same ones as those exemplified as the above-mentioned acidic catalyst can be used, and the acidic catalyst can be used alone or in combination of two or more.
- the acid value of the resin (A) having an acid group and a polymerizable unsaturated group of the present invention has excellent alkali developability, and is active energy ray curable having elongation, elasticity and substrate adhesion in a cured product. Since a resin composition can be obtained, the range of 50 to 150 mgKOH / g is preferable, and the range of 60 to 120 mgKOH / g is more preferable.
- the acid value of the (meth) acrylate resin having an acid group is a value measured by the neutralization titration method of JIS K0070 (1992).
- the resin (B) having a polymerizable unsaturated group and a urethane bond includes an epoxy resin (b1), an unsaturated monobasic acid (b2), a (meth) acrylate compound having a hydroxyl group (b3), and a compound having an isocyanate group. It is characterized in that (b4) is used as an essential raw material.
- the resin having an acid group, a polymerizable unsaturated group, and a urethane bond is treated as the resin (A).
- the epoxy resin (b1) the same ones as those exemplified as the above-mentioned epoxy resin can be used, and the epoxy resin (b1) can be used alone or in combination of two or more. Further, among these, a novolak type epoxy resin can be obtained because an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in a cured product can be obtained. Preferably, a cresol novolac type epoxy resin is more preferable.
- the epoxy resin (b1) preferably has a softening point of 78 ° C. or lower, more preferably 50 ° C. or higher and 70 ° C. or lower, and more preferably 60 ° C. or higher and 70 ° C. or lower.
- the softening point is a value measured by a method based on JIS K7234 (1986).
- the unsaturated monobasic acid (b2) the same ones as those exemplified as the above-mentioned unsaturated monobasic acid can be used, and the unsaturated monobasic acid (b2) can also be used alone. It is also possible to use more than seeds together. Further, among these, acrylic acid and methacrylic acid can be obtained because an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in a cured product can be obtained. Is preferable.
- the amount of the unsaturated monobasic acid (b2) used is 0.95 with respect to 1 mol of the epoxy group of the epoxy resin (b1) based on the acid group of the unsaturated monobasic acid (b2). It is preferably in the range of ⁇ 1.1 mol, more preferably 0.95 to 1.05.
- the (meth) acrylate compound (b3) having a hydroxyl group the same compound as those exemplified for the (meth) acrylate compound having a hydroxyl group can be used, and the compound (b3) may be used alone. Can also be used in combination of two or more. Further, among these, hydroxyethyl (meth) can be obtained because an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in a cured product can be obtained. Acrylate, pentaerythritol di (meth) acrylate, and pentaerythritol tri (meth) acrylate are preferable.
- the amount of the compound (b3) used is such that an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in a cured product can be obtained.
- the range of 0.3 to 0.7 mol is preferable with respect to 1 mol of the isocyanate group of the compound (b4) having an isocyanate group described later, and 0.4 to 0. A range of 6 mol is more preferred.
- the compound (b4) having an isocyanate group the same compounds as those exemplified as the above-mentioned polyisocyanate compound can be used, and the compound (b4) may be used alone or in combination of two or more. You can also. Further, among these, an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in a cured product can be obtained, and thus an aliphatic and / or an aliphatic and / or a substrate can be obtained.
- a compound having an isocyanate group having an alicyclic skeleton is preferable, a compound having an isocyanate group having an alicyclic skeleton is more preferable, and isophorone diisocyanate is more preferable.
- the amount of the compound (b4) used is such that an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in a cured product can be obtained. Therefore, the range of 0.1 to 0.7 mol is preferable with respect to 1 mol of the epoxy group of the epoxy resin (b1), preferably 0.2 to 0, based on the isocyanate group of the compound (b4). A range of 6 mol is more preferred.
- an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity, and substrate adhesion in a cured product can be obtained, and thus (meth). It preferably has an acryloyl group, an isocyanate group, and a urethane bond.
- the method for producing the resin (B) is not particularly limited, and any method may be used for producing the resin (B). For example, it may be produced by a method of reacting all of the reaction raw materials at once, or by a method of sequentially reacting the reaction raw materials.
- an epoxy resin (b1) for example, an epoxy resin (b1), an unsaturated monobasic acid (b2), a (meth) acrylate compound having a hydroxyl group (b3), and a compound having an isocyanate group (b3)
- Examples thereof include a method of reacting a reaction raw material containing b4) in the presence of a basic catalyst in a temperature range of 60 to 150 ° C.
- an epoxy resin (b1) and an unsaturated monobasic acid (b2) are previously reacted in the presence of a basic catalyst in a temperature range of 80 to 150 ° C. for reaction.
- the substance (I) is obtained, and the (meth) acrylate compound (b3) having a hydroxyl group and the compound (b4) having an isocyanate group are reacted in the presence of a basic catalyst in a temperature range of 50 to 120 ° C.
- the reaction product (I) and the reaction product (II) are reacted in the presence of a basic catalyst in a temperature range of 50 to 150 ° C. and the like.
- an active energy ray-curable resin composition having excellent alkali developability and capable of forming a cured product having excellent elongation, elasticity and substrate adhesion can be obtained. Therefore, the reaction can be obtained.
- a method of sequentially reacting the raw materials is preferable, and a method of obtaining the reaction product (I) and the reaction product (II) and then reacting the reaction product (I) with the reaction product (II) to produce the reaction product (I) is preferable. More preferred.
- reaction product (II) can also be carried out in an organic solvent, if necessary.
- organic solvent the same ones as those exemplified as the above-mentioned organic solvent can be used, and the organic solvent can be used alone or in combination of two or more.
- the same catalysts as those exemplified as the above-mentioned basic catalyst can be used, and the basic catalyst may be used alone or in combination of two or more.
- the amount of the basic catalyst used is, for example, an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in the cured product.
- an active energy ray-curable resin composition having excellent alkali developability and excellent elongation, elasticity and substrate adhesion in the cured product.
- the mass ratio of the solid content between the resin (A) and the resin (B) [(A) / (B)] has excellent alkali developability, and has excellent elongation, elasticity, and group in the cured product. Since an active energy ray-curable resin composition having material adhesion can be obtained, the range of 95/5 to 50/50 is preferable, the range of 95/5 to 60/40 is more preferable, and 95 / The range of 5 to 70/30 is more preferable.
- the method for producing the active energy ray-curable resin composition of the present invention is not particularly limited, and any method may be used for production.
- a method of mixing and producing each compounding component can be mentioned.
- the mixing method is not particularly limited, and a paint shaker, a disper, a roll mill, a bead mill, a ball mill, an attritor, a sand mill, a bead mill and the like may be used.
- the active energy ray-curable resin composition of the present invention it is preferable to use a photopolymerization initiator depending on the type of active energy ray used.
- photopolymerization initiator examples include 1-hydroxycyclohexylphenylketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-. Hydroxy-2-methyl-1-propane-1-one, thioxanthone and thioxanthone derivatives, 2,2'-dimethoxy-1,2-diphenylethan-1-one, diphenyl (2,4,6-trimethoxybenzoyl) phosphenyl Oxide, 2,4,6-trimethylbenzoyldiphenylphosphenyl oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphenyl oxide, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1- Examples thereof include photoradical polymerization initiators such as on, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone.
- Examples of commercially available products of the other photopolymerization initiators include “Omnirad 1173”, “Omnirad 184”, “Omnirad 127”, “Omnirad 2959”, “Omnirad 369”, “Omnirad 379”, “Omnirad 90".
- the amount of the photopolymerization initiator added is preferably in the range of 0.05 to 15% by mass, preferably 0.1 to 10% by mass, in the total of the components other than the solvent of the active energy ray-curable resin composition, for example. More preferably, it is in the range of%.
- the active energy ray-curable resin composition of the present invention may contain other resin components other than the resin (A) and the resin (B).
- the other resin components include various (meth) acrylate monomers.
- the total content of the resin (A) and the resin (B) has excellent alkali developability, and has excellent elongation, elasticity, and substrate adhesion in the cured product, and has active energy ray curability. Since a resin composition can be obtained, 10% by mass or more, more preferably 30% by mass or more, still more preferably 40% by mass or more, and 50% by mass, based on the total components other than the solvent of the active energy ray-curable resin composition. % Or more is particularly preferable.
- Examples of the various (meth) acrylate monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, and hexyl (meth) acrylate, 2 -Alipid mono (meth) acrylate compounds such as ethylhexyl (meth) acrylate and octyl (meth) acrylate; alicyclic mono (meth) such as cyclohexyl (meth) acrylate, isobornyl (meth) acrylate and adamantyl mono (meth) acrylate.
- Acrylate compounds such as glycidyl (meth) acrylate and tetrahydrofurfuryl acrylate; benzyl (meth) acrylate, phenyl (meth) acrylate, phenylbenzyl (meth) acrylate, phenoxy (meth) acrylate, Aromatic mono (meth) such as phenoxyethyl (meth) acrylate, phenoxyethoxyethyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, phenoxybenzyl (meth) acrylate, and phenylphenoxyethyl (meth) acrylate.
- heterocyclic mono (meth) acrylate compounds such as glycidyl (meth) acrylate and tetrahydrofurfuryl acrylate
- benzyl (meth) acrylate phenyl (meth) acrylate, phenylbenzyl (meth
- Mono (meth) acrylate compounds such as acrylate compounds: Polyoxy such as (poly) oxyethylene chain, (poly) oxypropylene chain, and (poly) oxytetramethylene chain in the molecular structure of the various mono (meth) acrylate monomers.
- An aliphatic di (meth) acrylate compound such as glycol di (meth) acrylate, propylene glycol di (meth) acrylate, butanediol di (meth) acrylate, hexanediol di (meth) acrylate, and neopentyl glycol di (meth) acrylate; 1,4-Cyclohexanedimethanol di (meth) acrylate, norbornandi (meth) acrylate, norbornan dimethanol di (meth) acrylate, dicyclopentanyldi (meth) acrylate, tricyclodecanedimethanol di (meth) acrylate, etc.
- An aliphatic tri (meth) acrylate compound such as (meth) acrylate and glycerin tri (meth) acrylate; a (poly) oxyethylene chain, a (poly) oxypropylene chain, etc. in the molecular structure of the aliphatic tri (meth) acrylate compound.
- a (meth) acrylate monomer in addition to the above-mentioned one, a (meth) acrylate monomer containing a phenol compound, a cyclic carbonate compound or a cyclic ether compound, and an unsaturated monocarboxylic acid as essential reaction raw materials. Can be used.
- phenol compound examples include cresol, xylenol, catechol, resorcinol, hydroquinone, 3-methylcatechol, 4-methylcatechol, 4-allylpyrocatechol, 1,2,3-trihydroxybenzene, 1,2,4-.
- Trihydroxybenzene 1-naphthol, 2-naphthol, 1,3-naphthalenediol, 1,5-naphthalenediol, 2,6-naphthalenediol, 2,7-naphthalenediol, hydrogenated bisphenol, hydrogenated biphenol, polyphenylene ether
- type diols polynaphthylene ether type diols, phenol novolac resins, cresol novolak resins, bisphenol novolak type resins, naphthol novolak type resins, phenol aralkyl type resins, naphthol aralkyl type resins, phenol resins having a cycloring structure and the like.
- cyclic carbonate compound examples include ethylene carbonate, propylene carbonate, butylene carbonate, and pentylene carbonate. These cyclic carbonate compounds may be used alone or in combination of two or more.
- cyclic ether compound examples include ethylene oxide, propylene oxide, and tetrahydrofuran. These cyclic ether compounds may be used alone or in combination of two or more.
- unsaturated monocarboxylic acid the same one as exemplified as the unsaturated monocarboxylic acid (B) described above can be used.
- the content of the other (meth) acrylate monomer is preferably 90% by mass or less in the non-volatile content of the active energy ray-curable resin composition of the present invention.
- the active energy ray-curable resin composition of the present invention may contain, if necessary, a curing agent, a curing accelerator, an ultraviolet absorber, a polymerization inhibitor, an antioxidant, an organic solvent, an inorganic filler or polymer fine particles. It can also contain various additives such as pigments, defoaming agents, viscosity modifiers, leveling agents, flame retardants, and storage stabilizers.
- curing agent examples include epoxy resins, polybasic acids, unsaturated monobasic acids, amine compounds, amide compounds, azo compounds, organic peroxides, polyol compounds, and epoxy resins.
- the same ones as those exemplified as the above-mentioned epoxy resin can be used, and the epoxy resin can be used alone or in combination of two or more.
- polybasic acid examples include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, and terephthalic acid.
- Tetrahydrophthalic acid Tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, citraconic acid, itaconic acid, glutaconic acid, 1,2,3,4-butanetetracarboxylic acid, cyclohexanetricarboxylic acid, cyclohexanetetracarboxylic acid, bicyclo [2 .2.1] Heptane-2,3-dicarboxylic acid, methylbicyclo [2.2.1] heptane-2,3-dicarboxylic acid, 4- (2,5-dioxotetraxoxy-3-yl) -1, 2,3,4-Tetrahydronaphthalene-1,2-dicarboxylic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, naphthalenetricarboxylic acid, naphthalenetetracarboxylic acid, biphenyldicarboxylic
- polybasic acid for example, a copolymer of a conjugated diene-based vinyl monomer and acrylonitrile, which has a carboxyl group in its molecule, can also be used.
- polybasic acids can be used alone or in combination of two or more.
- the same ones as those exemplified as the above-mentioned unsaturated monobasic acid can be used, and the unsaturated monobasic acid may be used alone or in combination of two or more. You can also.
- amine compound examples include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, imidazole, BF3-amine complex, guanidine derivative and the like. These amine compounds may be used alone or in combination of two or more.
- amide compound examples include a polyamide resin synthesized from a dimer of dicyandiamide and linolenic acid and ethylenediamine. These amide compounds may be used alone or in combination of two or more.
- azo compound examples include azobisisobutyronitrile.
- organic peroxide examples include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxyesters, peroxydicarbonates, alkyl peroxycarbonates and the like. These organic peroxides can be used alone or in combination of two or more.
- polyol compound examples include ethylene glycol, diethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, 1,3-butanediol, 3-methyl-1,3-butanediol, 1, 5-Pentanediol, Neopentylglycol, 1,6-hexanediol, Glycerin, Glycerin mono (meth) acrylate, Trimethylol ethane, Trimethylol methanemono (meth) acrylate, Trimethylol propane, Trimethylol propane mono (meth) acrylate , Pentaerythritol mono (meth) acrylate, pentaerythritol di (meth) acrylate and other polyol monomers; , Hexahydrophthalic acid, maleic acid, fumaric acid, citraconic acid, itaconic acid, glutaconic acid, polyester polyol obtained by coco
- the same ones as those exemplified as the above-mentioned epoxy resin can be used, and the epoxy resin can be used alone or in combination of two or more.
- the curing accelerator examples include phosphorus-based compounds, amine-based compounds, imidazoles, organic acid metal salts, Lewis acids, amine complex salts, and the like, which promote the curing reaction. These curing accelerators can be used alone or in combination of two or more.
- the amount of the curing accelerator added is preferably in the range of 0.01 to 10% by mass in the solid content of the active energy ray-curable resin composition, for example.
- UV absorber examples include 2- [4- ⁇ (2-hydroxy-3-dodecyloxypropyl) oxy ⁇ -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1. , 3,5-Triazine, 2- [4- ⁇ (2-Hydroxy-3-tridecyloxypropyl) oxy ⁇ -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1, Triazine derivatives such as 3,5-triazine, 2- (2'-xanthencarboxy-5'-methylphenyl) benzotriazole, 2- (2'-o-nitrobenzyloxy-5'-methylphenyl) benzotriazole, 2 -Xanthenecarboxy-4-dodecyloxybenzophenone, 2-o-nitrobenzyloxy-4-dodecyloxybenzophenone and the like can be mentioned. These UV absorbers can be used alone or in combination of two or more.
- polymerization inhibitor examples include p-methoxyphenol, p-methoxycresol, 4-methoxy-1-naphthol, 4,4'-dialkoxy-2,2'-bi-1-naphthol, 3- (N).
- -Salicyloyl amino-1,2,4-triazole, N'1, N'12-bis (2-hydroxybenzoyl) dodecanedihydrazide, styrenated phenol, N-isopropyl-N'-phenylbenzene-1,4-diamine , 6-ethoxy-2,2,4-trimethyl-1,2-dihydroquinone and other phenolic compounds, hydroquinone, methylhydroquinone, p-benzoquinone, methyl-p-benzoquinone, 2,5-diphenylbenzoquinone, 2-hydroxy- Quinone compounds such as 1,4-naphthoquinone, anthraquinone and diphenoquinone, melamine, p-phenylenediamine, 4-aminodiphenylamine, N.I.
- N'-diphenyl-p-phenylenediamine, N-i-propyl-N'-phenyl-p-phenylenediamine, N- (1.3-dimethylbutyl) -N'-phenyl-p-phenylenediamine, diphenylamine, 4 , 4'-dicumyl-diphenylamine, 4,4'-dioctyl-diphenylamine, poly (2,2,4-trimethyl-1,2-dihydroquinoline), sylated diphenylamine, sylated diphenylamine and 2,4,4-trimethyl Penten reaction products, amine compounds such as diphenylamine and 2,4,4-trimethylpenten reaction products, phenothiazine, distearylthiodipropionate, 2,2-bis ( ⁇ [3- (dodecylthio) propionyl] oxy ⁇ Methyl) -1,3-propanediyl bis [3- (
- the same compounds as those exemplified for the polymerization inhibitor can be used, and the antioxidant may be used alone or in combination of two or more.
- Examples of commercially available products of the polymerization inhibitor and the antioxidant include "Q-1300” and “Q-1301” manufactured by Wako Pure Chemical Industries, Ltd. and “Smilizer BBM-S” manufactured by Sumitomo Chemical Industries, Ltd. , “Smilizer GA-80 is” and the like.
- organic solvent the same ones as those exemplified as the above-mentioned organic solvent can be used, and the organic solvent can be used alone or in combination of two or more.
- inorganic filler examples include fused silica, crystalline silica, alumina, silicon nitride, aluminum hydroxide and the like.
- the pigment a known and commonly used inorganic pigment or organic pigment can be used.
- inorganic pigment examples include white pigment, antimony red, red iron oxide, cadmium red, cadmium yellow, cobalt blue, navy blue, ultramarine blue, carbon black, graphite and the like. These inorganic pigments can be used alone or in combination of two or more.
- white pigment examples include titanium oxide, zinc oxide, magnesium oxide, zirconium oxide, aluminum oxide, barium sulfate, silica, talc, mica, aluminum hydroxide, calcium silicate, aluminum silicate, hollow resin particles, and zinc sulfide. And so on.
- organic pigment examples include quinacridone pigment, quinacridone quinone pigment, dioxazine pigment, phthalocyanine pigment, anthrapyrimidine pigment, anthanthrone pigment, indanslon pigment, flavanthron pigment, perylene pigment, diketopyrrolopyrrole pigment, perinone pigment, and the like.
- organic pigments examples include quinophthalone pigments, anthraquinone pigments, thioindigo pigments, benzimidazolone pigments, and azo pigments. These organic pigments can be used alone or in combination of two or more.
- the flame retardant examples include red phosphorus, monoammonium phosphate, diammonium phosphate, triammonium phosphate, ammonium phosphate such as ammonium polyphosphate, and inorganic phosphorus compounds such as phosphate amide; phosphoric acid ester compounds and phosphoruses.
- Organophosphorus compounds such as phosphorus compounds and derivatives obtained by reacting them with compounds such as epoxy resins and phenol resins; nitrogen-based flame retardants such as triazine compounds, cyanuric acid compounds, isocyanuric acid compounds and phenothiazine; silicone oils, silicone rubbers, Silicone-based flame retardants such as silicone resins; examples thereof include metal hydroxides, metal oxides, metal carbonate compounds, metal powders,
- the cured product of the present invention can be obtained by irradiating the active energy ray-curable resin composition with active energy rays.
- the active energy ray include ionizing radiation such as ultraviolet rays, electron beams, ⁇ rays, ⁇ rays, and ⁇ rays.
- ultraviolet rays When ultraviolet rays are used as the active energy rays, they may be irradiated in an atmosphere of an inert gas such as nitrogen gas or in an air atmosphere in order to efficiently carry out the curing reaction by the ultraviolet rays.
- an ultraviolet lamp As a source of ultraviolet rays, an ultraviolet lamp is generally used from the viewpoint of practicality and economy. Specific examples thereof include low pressure mercury lamps, high pressure mercury lamps, ultrahigh pressure mercury lamps, xenon lamps, gallium lamps, metal halide lamps, sunlight, LEDs and the like.
- the integrated light amount of the active energy rays is not particularly limited, but is preferably 0.1 to 50 kJ / m 2 , and more preferably 0.5 to 10 kJ / m 2 .
- the integrated light amount is in the above range, it is preferable because the generation of the uncured portion can be prevented or suppressed.
- the irradiation of the active energy beam may be performed in one step or may be divided into two or more steps.
- the cured product of the present invention has excellent alkali developability and is excellent in elongation, elasticity and substrate adhesion, for example, solder resist, interlayer insulating material, packaging material and undercoat in semiconductor device applications. It can be suitably used as a package adhesive layer for a fill material, a circuit element, or the like, or as an adhesive layer between an integrated circuit element and a circuit board. Further, it can be suitably used for a thin film transistor protective film, a liquid crystal color filter protective film, a pigment resist for a color filter, a resist for a black matrix, a spacer and the like in a thin display application typified by LCD and OELD. Among these, it can be particularly preferably used for solder resist applications.
- the resist member of the present invention is, for example, a photomask in which the resin material for solder resist is applied onto a substrate, an organic solvent is volatilized and dried in a temperature range of about 60 to 100 ° C., and then a desired pattern is formed. It can be obtained by exposing the unexposed portion with an alkaline aqueous solution, developing the unexposed portion with an alkaline aqueous solution, and further heating and curing the unexposed portion in a temperature range of about 140 to 200 ° C.
- Examples of the base material include metal-clad laminates such as copper and aluminum.
- the reaction was carried out at 160 ° C. for 5 hours in a nitrogen atmosphere, and it was confirmed that the isocyanate group content was 0.1% by mass or less.
- the solid content acid value measured under the acid anhydride group non-ring-opening condition was 160 mgKOH / g. 0.3 parts by mass of methquinone, pentaerythritol polyacrylate mixture (“Aronix M-306” manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 172 parts by mass and triphenylphosphine 3.6 parts by mass was added, and the mixture was reacted at 110 ° C.
- a resin (1) having an acid group having a non-volatile content of 62% by mass and a polymerizable unsaturated group was obtained.
- the solid acid value of the resin (1) having the acid group and the polymerizable unsaturated group was 79 mgKOH / g.
- the acid value is a value measured based on the neutralization titration method of JIS K 0070 (1992).
- Equivalent amount 214 g / eq,) (hereinafter abbreviated as "epoxy resin (1)”) 214 parts by mass is dissolved, 0.9 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone are added, and then acrylic acid 72. A mass part and 1.4 parts by mass of triphenylphosphine were added, and the reaction was carried out at 120 ° C. for 10 hours while blowing air. Next, 72 parts by mass of diethylene glycol monomethyl ether acetate and 76 parts by mass of tetrahydrophthalic anhydride were added and reacted at 110 ° C. for 3 hours to obtain a resin (2) having an acid group and a polymerizable unsaturated group. The non-volatile content of the resin (2) having an acid group and a polymerizable unsaturated group was 65% by mass, and the solid content acid value was 80 mgKOH / g.
- urethane-containing acrylate resin (2) having an NCO% of 11.4%.
- the number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.3 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
- urethane-containing acrylate resin (3) having an NCO% of 13.5%.
- the number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.25 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
- urethane-containing acrylate resin (4) having an NCO% of 2.8%.
- the number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.7 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
- urethane-containing acrylate resin (5) having an NCO% of 2.2%.
- the number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.75 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
- urethane-containing acrylate resin (6) having an NCO% of 21.9%.
- the number of moles of hydroxyl groups of hydroxyethyl acrylate was 0.5 with respect to 1 mole of isocyanate groups of isophorone diisocyanate.
- m-xylylene diisocyanate (“Takenate 500” manufactured by Mitsui Chemicals, Inc.) was added in portions, and the reaction was carried out at 70 ° C. for 3 hours to obtain a urethane-containing acrylate resin having an NCO% of 6.2%. 7) was obtained.
- the number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.5 with respect to 1 mol of isocyanate groups contained in m-xylylene diisocyanate.
- the reaction was carried out at 80 ° C. for 8 hours to obtain a resin (2) having the desired polymerizable unsaturated group and urethane bond.
- the non-volatile content of the resin (2) having a polymerizable unsaturated group and a urethane bond was 62% by mass.
- the number of moles of acrylic acid is 1.0 with respect to 1 mol of epoxy group contained in the orthocresol novolak type epoxy resin, and the number of moles of isocyanate group contained in the urethane-containing acrylate resin (1) is 0.4. Met.
- epoxy resin (2) Softening point 69 ° C.
- epoxy resin (2) 207 parts by mass is dissolved, 0.8 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone are added, and then 72 parts by mass of acrylic acid. A part, 1.4 parts by mass of triphenylphosphine was added, and an esterification reaction was carried out at 120 ° C. for 10 hours while blowing air to obtain an epoxy acrylate resin (X1).
- the non-volatile content of the resin (4) having a polymerizable unsaturated group and a urethane bond was 62% by mass.
- the number of moles of acrylic acid is 1.0 with respect to 1 mol of epoxy groups contained in the orthocresol novolak type epoxy resin, and the number of moles of isocyanate groups contained in the urethane-containing acrylate resin (1) is 0.4. Met.
- the esterification reaction was carried out at 120 ° C. for 9 hours while blowing. Next, 222 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.05 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (10) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (10) having a polymerizable unsaturated group and a urethane bond was 62% by mass.
- the number of moles of acrylic acid is 1.0 with respect to 1 mol of epoxy group contained in the phenol novolac type epoxy resin, and the number of moles of isocyanate group contained in the urethane-containing acrylate resin (1) is 0.4. there were.
- the non-volatile content of the resin (11) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the naphthalene type epoxy resin, and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. rice field.
- the non-volatile content of the resin (12) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.12. there were.
- the non-volatile content of the resin (13) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.08. there were.
- the non-volatile content of the resin (14) having a polymerizable unsaturated group and a urethane bond was 60% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.68. there were.
- the non-volatile content of the resin (15) having a polymerizable unsaturated group and a urethane bond was 60% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.72. there were.
- the non-volatile content of the resin (16) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (2) is 0.4. there were.
- the non-volatile content of the resin (17) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (3) is 0.4. there were.
- the non-volatile content of the resin (18) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (4) is 0.4. there were.
- the non-volatile content of the resin (19) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (5) is 0.4. there were.
- the non-volatile content of the resin (20) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (6) is 0.4. there were.
- the non-volatile content of the resin (21) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (7) is 0.4. there were.
- the number of moles of methacrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
- Example 1 Preparation of active energy ray-curable resin composition (1)
- the resin (1) having an acid group and a polymerizable unsaturated group obtained in Synthesis Example 1, the resin (3) having a polymerizable unsaturated group and a urethane bond obtained in Synthesis Example 11, and orthocresol novolac as a curing agent.
- Type epoxy resin (“EPICLON N-680” manufactured by DIC Co., Ltd.), dipentaerythritol hexaacrylate, diethylene glycol monoethyl ether acetate, photopolymerization initiator (“Omnirad 907” manufactured by IGM Co., Ltd.), and 2-ethyl- 4-Methylimidazole and phthalocyanine green were blended in parts by mass shown in Tables 1 to 3 and kneaded with a roll mill to obtain an active energy ray-curable resin composition (1).
- the evaluation results are shown in Tables 1 to 3.
- Example 29 Preparation of active energy ray-curable resin composition (29)
- Type epoxy resin (“EPICLON N-680” manufactured by DIC Co., Ltd.), 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one (IMnirad manufactured by IGM Resins) as a photopolymerization initiator 907 ”) and diethylene glycol monomethyl ether acetate as an organic solvent were blended in parts by mass shown in Table 4 to obtain an active energy ray-curable resin composition (29).
- Example 30 to 56 Preparation of active energy ray-curable resin compositions (30) to (56)
- the active energy ray-curable resin compositions (30) to (56) were obtained in the same manner as in Example 29 with the compositions and formulations shown in Tables 4 to 6.
- Curable resin compositions (R3) and (R4) were obtained in the same manner as in Example 29 with the compositions and formulations shown in Table 6.
- test piece 1 The active energy ray-curable resin composition obtained in Examples and Comparative Examples was applied onto a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 ⁇ m) with a 50 ⁇ m applicator, and a metal halide lamp was used. After irradiating with ultraviolet rays of 10 kJ / m 2 , it was heated at 160 ° C. for 1 hour. The cured product was peeled off from the copper foil to obtain a test piece 1 (cured product).
- ⁇ Tensile test> The test piece 1 was cut into a size of 10 mm ⁇ 80 mm, and a tensile test was performed on the test piece 1 under the following measurement conditions using a precision universal testing machine Autograph “AG-IS” manufactured by Shimadzu Corporation. The elongation (%) and elastic modulus (MPa) until the test piece broke were measured and evaluated according to the following criteria.
- Measurement conditions temperature 23 ° C, humidity 50%, distance between marked lines 20 mm, distance between fulcrums 20 mm, tensile speed 10 mm / min
- the substrate adhesion was evaluated by measuring the peel strength.
- ⁇ Preparation of test piece 2> The active energy ray-curable resin composition obtained in Examples and Comparative Examples was applied onto a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 ⁇ m) with a 50 ⁇ m applicator, and a metal halide lamp was used. After irradiating with ultraviolet rays of 10 kJ / m 2 , the test piece 2 was obtained by heating at 160 ° C. for 1 hour.
- the test piece 2 was cut into a size of 1 cm in width and 12 cm in length, and the 90 ° peel strength was measured using a peeling tester (“A & D Tensilon” manufactured by A & D Co., Ltd., peeling speed 50 mm / min). Evaluated according to.
- the description of the mass part of the resin having an acid group and a polymerizable unsaturated group, the polymerizable unsaturated group and the resin having a urethane bond in Tables 1 to 6 is a solid content value.
- “Curing agent” in Tables 1 to 6 indicates an orthocresol novolak type epoxy resin (“EPICLON N-680” manufactured by DIC Corporation).
- Organic solvent in Tables 1 to 6 indicates diethylene glycol monomethyl ether acetate.
- Photopolymerization initiator in Tables 1 to 6 indicates “Omnirad-907” manufactured by IGM Resins.
- Examples 1 to 28 shown in Tables 1 to 3 are examples of the active energy ray-curable resin composition of the present invention. It was confirmed that these active energy ray-curable resin compositions have excellent alkali developability.
- Examples 29 to 56 shown in Tables 4 to 6 are examples of the active energy ray-curable resin composition of the present invention. It was confirmed that the cured product of these active energy ray-curable resin compositions had excellent elongation, elasticity and adhesion.
- Comparative Example 1 is an example of an active energy ray-curable resin composition that does not use a resin having a polymerizable unsaturated group and a urethane bond specified in the present invention. It was confirmed that this active energy ray-curable resin composition had insufficient alkali developability.
- Comparative Example 2 is an example of an active energy ray-curable resin composition that does not use a resin having an acid group and a polymerizable unsaturated group specified in the present invention. It was confirmed that this active energy ray-curable resin composition had insufficient alkali developability.
- Comparative Example 3 is an example of an active energy ray-curable resin composition which does not use a resin having a polymerizable unsaturated group and a urethane bond defined in the present invention as in Comparative Example 1. It was confirmed that this active energy ray-curable resin composition was remarkably insufficient in elongation, elasticity and substrate adhesion.
- Comparative Example 4 is an example of an active energy ray-curable resin composition that does not use a resin having an acid group and a polymerizable unsaturated group specified in the present invention as in Comparative Example 2. It was confirmed that this active energy ray-curable resin composition was remarkably insufficient in elongation, elasticity and substrate adhesion.
Abstract
Description
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート392質量部、イソホロンジイソシアネートのイソシアヌレート変性体(EVONIK社製「VESTANAT T-1890/100」、イソシアネート基含有量17.2質量%)(以下、「T-1890」と略記する。)244質量部、無水トリメリット酸192質量部、ジブチルヒドロキシトルエン1.0質量部を加えて溶解させた。窒素雰囲気下、160℃で5時間反応させ、イソシアネート基含有量が0.1質量%以下となっていることを確認した。酸無水物基非開環条件で測定した固形分酸価は160mgKOH/gであった。メトキノン0.3質量部、ペンタエリスリトールポリアクリレート混合物(東亜合成株式会社製「アロニックスM-306」、ペンタエリスリトールトリアクリレート含有量約67%、水酸基価159.7mgKOH/g)172質量部及びトリフェニルホスフィン3.6質量部を添加し、空気を吹き込みながら110℃で5時間反応させた。次いで、グリシジルメタクリレート163質量部を添加し、110℃で5時間反応させた。更に、無水コハク酸112質量部、ジエチレングリコールモノメチルエーテルアセテート122質量部を加えて110℃で5時間反応させ、不揮発分が62質量%の酸基及び重合性不飽和基を有する樹脂(1)を得た。この酸基及び重合性不飽和基を有する樹脂(1)の固形分酸価は79mgKOH/gであった。なお、酸価は、JIS K 0070(1992)の中和滴定法に基づいて測定した値である。 (Synthesis Example 1: Preparation of resin (1) having an acid group and a polymerizable unsaturated group)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 392 parts by mass of diethylene glycol monomethyl ether acetate, an isocyanurate-modified product of isophorone diisocyanate (“VESTANAT T-1890 / 100” manufactured by EVONIK Co., Ltd., isocyanate group content 17. 2% by mass) (hereinafter abbreviated as "T-1890") 244 parts by mass, 192 parts by mass of trimellitic anhydride and 1.0 part by mass of dibutylhydroxytoluene were added and dissolved. The reaction was carried out at 160 ° C. for 5 hours in a nitrogen atmosphere, and it was confirmed that the isocyanate group content was 0.1% by mass or less. The solid content acid value measured under the acid anhydride group non-ring-opening condition was 160 mgKOH / g. 0.3 parts by mass of methquinone, pentaerythritol polyacrylate mixture (“Aronix M-306” manufactured by Toagosei Co., Ltd., pentaerythritol triacrylate content of about 67%, hydroxyl value 159.7 mgKOH / g) 172 parts by mass and triphenylphosphine 3.6 parts by mass was added, and the mixture was reacted at 110 ° C. for 5 hours while blowing air. Then, 163 parts by mass of glycidyl methacrylate was added and reacted at 110 ° C. for 5 hours. Further, 112 parts by mass of succinic anhydride and 122 parts by mass of diethylene glycol monomethyl ether acetate were added and reacted at 110 ° C. for 5 hours to obtain a resin (1) having an acid group having a non-volatile content of 62% by mass and a polymerizable unsaturated group. rice field. The solid acid value of the resin (1) having the acid group and the polymerizable unsaturated group was 79 mgKOH / g. The acid value is a value measured based on the neutralization titration method of JIS K 0070 (1992).
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート123質量部を入れ、オルソクレゾールノボラック型エポキシ樹脂「EPICLON N-680」(DIC株式会社製、軟化点86℃、エポキシ当量:214g/eq、)(以下、「エポキシ樹脂(1)」と略記する)214質量部を溶解し、ジブチルヒドロキシトルエン0.9質量部、メトキノン0.2質量部加えた後、アクリル酸72質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で10時間反応を行なった。次いで、ジエチレングリコールモノメチルエーテルアセテート72質量部、テトラヒドロ無水フタル酸76質量部を加え110℃で3時間反応し、酸基及び重合性不飽和基を有する樹脂(2)を得た。この酸基及び重合性不飽和基を有する樹脂(2)の不揮発分は65質量%で、固形分酸価は80mgKOH/gであった。 (Synthesis Example 2: Preparation of Resin (2) Having Acid Group and Polymerizable Unsaturated Group)
Put 123 parts by mass of diethylene glycol monomethyl ether acetate in a flask equipped with a thermometer, a stirrer, and a reflux cooler, and orthocresol novolac type epoxy resin "EPICLON N-680" (manufactured by DIC Co., Ltd., softening point 86 ° C., epoxy). Equivalent amount: 214 g / eq,) (hereinafter abbreviated as "epoxy resin (1)") 214 parts by mass is dissolved, 0.9 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone are added, and then acrylic acid 72. A mass part and 1.4 parts by mass of triphenylphosphine were added, and the reaction was carried out at 120 ° C. for 10 hours while blowing air. Next, 72 parts by mass of diethylene glycol monomethyl ether acetate and 76 parts by mass of tetrahydrophthalic anhydride were added and reacted at 110 ° C. for 3 hours to obtain a resin (2) having an acid group and a polymerizable unsaturated group. The non-volatile content of the resin (2) having an acid group and a polymerizable unsaturated group was 65% by mass, and the solid content acid value was 80 mgKOH / g.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ペンタエリスリトールポリアクリレート混合物(東亜合成株式会社製「アロニックス M-305」、水酸基価115mgKOH/g)(以下、「ペンタエリスリトールポリアクリレート混合物(1)」と略記する)486質量部、ジブチルヒドロキシトルエン0.2質量部、メトキノン0.2質量部、ジオクチル錫ジネオデカノエート(日東化成株式会社製「ネオスタン U-830」)(以下、「ジオクチル錫ジネオデカノエート(1)」と略記する))0.07質量部を仕込み、空気を吹き込みながら、70℃に昇温した。次いでイソホロンジイソシアネート222質量部を分割で添加し、70℃で4時間反応を行い、NCO%が5.9%のウレタン含有アクリレート樹脂(1)を得た。イソホロンジイソシアネートが有するイソシアネート基1モルに対して、ペンタエリスリトールポリアクリレート混合物の有する水酸基のモル数は0.5であった。 (Synthesis Example 3: Preparation of Urethane-Containing Acrylate Resin (1))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, a pentaerythritol polyacrylate mixture (“Aronix M-305” manufactured by Toa Synthetic Co., Ltd., hydroxyl value 115 mgKOH / g) (hereinafter, “pentaerythritol polyacrylate mixture” (hereinafter, “pentaerythritol polyacrylate mixture”) 1) ”) 486 parts by mass, dibutyl hydroxytoluene 0.2 parts by mass, methquinone 0.2 parts by mass, dioctyl tin dineodecanoate (“Neostan U-830” manufactured by Nitto Kasei Co., Ltd.) (hereinafter, (Abbreviated as "Dioctyl tin dineodecanoate (1)")) 0.07 parts by mass was charged, and the temperature was raised to 70 ° C. while blowing air. Next, 222 parts by mass of isophorone diisocyanate was added in portions and reacted at 70 ° C. for 4 hours to obtain a urethane-containing acrylate resin (1) having an NCO% of 5.9%. The number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.5 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ペンタエリスリトールポリアクリレート混合物(1)292質量部、ジブチルヒドロキシトルエン0.2質量部、メトキノン0.2質量部、ジオクチル錫ジネオデカノエート(1)0.05質量部を仕込み、空気を吹き込みながら、70℃に昇温した。次いで、イソホロンジイソシアネート222質量部を分割で添加し、70℃で4時間反応を行い、NCO%が11.4%のウレタン含有アクリレート樹脂(2)を得た。イソホロンジイソシアネートが有するイソシアネート基1モルに対して、ペンタエリスリトールポリアクリレート混合物の有する水酸基のモル数は0.3であった。 (Synthesis Example 4: Preparation of Urethane-Containing Acrylate Resin (2))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, pentaerythritol polyacrylate mixture (1) 292 parts by mass, dibutyl hydroxytoluene 0.2 parts by mass, methquinone 0.2 parts by mass, dioctyl tin dineodecano Ate (1) 0.05 parts by mass was charged, and the temperature was raised to 70 ° C. while blowing air. Next, 222 parts by mass of isophorone diisocyanate was added in portions and reacted at 70 ° C. for 4 hours to obtain a urethane-containing acrylate resin (2) having an NCO% of 11.4%. The number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.3 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ペンタエリスリトールポリアクリレート混合物(1)243質量部、ジブチルヒドロキシトルエン0.1質量部、メトキノン0.1質量部、ジオクチル錫ジネオデカノエート(1)0.05質量部を仕込み、空気を吹き込みながら、70℃に昇温した。次いで、イソホロンジイソシアネート222質量部を分割で添加し、70℃で3時間反応を行い、NCO%が13.5%のウレタン含有アクリレート樹脂(3)を得た。イソホロンジイソシアネートが有するイソシアネート基1モルに対して、ペンタエリスリトールポリアクリレート混合物の有する水酸基のモル数は0.25であった。 (Synthesis Example 5: Preparation of Urethane-Containing Acrylate Resin (3))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, pentaerythritol polyacrylate mixture (1) 243 parts by mass, dibutyl hydroxytoluene 0.1 parts by mass, methquinone 0.1 parts by mass, dioctyl tin dineodecano Ate (1) 0.05 parts by mass was charged, and the temperature was raised to 70 ° C. while blowing air. Next, 222 parts by mass of isophorone diisocyanate was added in portions and reacted at 70 ° C. for 3 hours to obtain a urethane-containing acrylate resin (3) having an NCO% of 13.5%. The number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.25 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ペンタエリスリトールポリアクリレート混合物(1)681質量部、ジブチルヒドロキシトルエン0.3質量部、メトキノン0.3質量部、ジオクチル錫ジネオデカノエート(1)0.09質量部を仕込み、空気を吹き込みながら、70℃に昇温した。次いで、イソホロンジイソシアネート222質量部を分割で添加し、70℃で4時間反応を行い、NCO%が2.8%のウレタン含有アクリレート樹脂(4)を得た。イソホロンジイソシアネートが有するイソシアネート基1モルに対して、ペンタエリスリトールポリアクリレート混合物の有する水酸基のモル数は0.7であった。 (Synthesis Example 6: Preparation of Urethane-Containing Acrylate Resin (4))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, pentaerythritol polyacrylate mixture (1) 681 parts by mass, dibutylhydroxytoluene 0.3 parts by mass, methquinone 0.3 parts by mass, dioctyl tin dineodecano Ate (1) 0.09 part by mass was charged, and the temperature was raised to 70 ° C. while blowing air. Next, 222 parts by mass of isophorone diisocyanate was added in portions and reacted at 70 ° C. for 4 hours to obtain a urethane-containing acrylate resin (4) having an NCO% of 2.8%. The number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.7 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ペンタエリスリトールポリアクリレート混合物(1)729質量部、ジブチルヒドロキシトルエン0.3質量部、メトキノン0.3質量部、ジオクチル錫ジネオデカノエート(1)0.1質量部を仕込み、空気を吹き込みながら、70℃に昇温した。次いで、イソホロンジイソシアネート222質量部を分割で添加し、70℃で4時間反応を行い、NCO%が2.2%のウレタン含有アクリレート樹脂(5)を得た。イソホロンジイソシアネートが有するイソシアネート基1モルに対して、ペンタエリスリトールポリアクリレート混合物の有する水酸基のモル数は0.75であった。 (Synthesis Example 7: Preparation of Urethane-Containing Acrylate Resin (5))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, pentaerythritol polyacrylate mixture (1) 729 parts by mass, dibutyl hydroxytoluene 0.3 parts by mass, methquinone 0.3 parts by mass, dioctyl tin dineodecano Ate (1) 0.1 part by mass was charged, and the temperature was raised to 70 ° C. while blowing air. Next, 222 parts by mass of isophorone diisocyanate was added in portions and reacted at 70 ° C. for 4 hours to obtain a urethane-containing acrylate resin (5) having an NCO% of 2.2%. The number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.75 with respect to 1 mole of the isocyanate group of isophorone diisocyanate.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ヒドロキシエチルアクリレート116質量部、ジブチルヒドロキシトルエン0.1質量部、メトキノン0.1質量部、ジオクチル錫ジネオデカノエート(1)0.03質量部を仕込み、空気を吹き込みながら、70℃に昇温した。次いで、イソホロンジイソシアネート222質量部を分割で添加し、70℃で4時間反応を行い、NCO%が21.9%のウレタン含有アクリレート樹脂(6)を得た。イソホロンジイソシアネートが有するイソシアネート基1モルに対して、ヒドロキシエチルアクリレートの有する水酸基のモル数は0.5であった。 (Synthesis Example 8: Preparation of Urethane-Containing Acrylate Resin (6))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 116 parts by mass of hydroxyethyl acrylate, 0.1 part by mass of dibutyl hydroxytoluene, 0.1 part by mass of methquinone, and dioctyl tin dineodecanoate (1) 0. A 03 part by mass was charged and the temperature was raised to 70 ° C. while blowing air. Next, 222 parts by mass of isophorone diisocyanate was added in portions and reacted at 70 ° C. for 4 hours to obtain a urethane-containing acrylate resin (6) having an NCO% of 21.9%. The number of moles of hydroxyl groups of hydroxyethyl acrylate was 0.5 with respect to 1 mole of isocyanate groups of isophorone diisocyanate.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ペンタエリスリトールポリアクリレート混合物(1)486質量部、ジブチルヒドロキシトルエン0.2質量部、メトキノン0.2質量部、ジオクチル錫ジネオデカノエート(1)0.07質量部を仕込み、空気を吹き込みながら、70℃に昇温した。次いで、m-キシリレンジイソシアナート(三井化学株式会社製「タケネート 500」)188質量部を分割で添加し、70℃で3時間反応を行い、NCO%が6.2%のウレタン含有アクリレート樹脂(7)を得た。m-キシリレンジイソシアナートが有するイソシアネート基1モルに対して、ペンタエリスリトールポリアクリレート混合物の有する水酸基のモル数は0.5であった。 (Synthesis Example 9: Preparation of Urethane-Containing Acrylate Resin (7))
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, pentaerythritol polyacrylate mixture (1) 486 parts by mass, dibutyl hydroxytoluene 0.2 parts by mass, methquinone 0.2 parts by mass, dioctyl tin dineodecano Ate (1) 0.07 parts by mass was charged, and the temperature was raised to 70 ° C. while blowing air. Next, 188 parts by mass of m-xylylene diisocyanate (“Takenate 500” manufactured by Mitsui Chemicals, Inc.) was added in portions, and the reaction was carried out at 70 ° C. for 3 hours to obtain a urethane-containing acrylate resin having an NCO% of 6.2%. 7) was obtained. The number of moles of hydroxyl groups of the pentaerythritol polyacrylate mixture was 0.5 with respect to 1 mol of isocyanate groups contained in m-xylylene diisocyanate.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート123質量部を入れ、エポキシ樹脂(1)214質量部を溶解し、ジブチルヒドロキシトルエン0.9質量部、メトキノン0.2質量部加えた後、アクリル酸72質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で10時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート227質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(1)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(1)の不揮発分は62質量%であった。また、エポキシ樹脂(1)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 10: Preparation of resin (1) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 123 parts by mass of diethylene glycol monomethyl ether acetate was placed, 214 parts by mass of the epoxy resin (1) was dissolved, and 0.9 parts by mass of dibutylhydroxytoluene and 0. After adding 2 parts by mass, 72 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added, and the esterification reaction was carried out at 120 ° C. for 10 hours while blowing air. Next, 227 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (1) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (1) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (1), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート121質量部を入れ、オルソクレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-673」、軟化点78℃、エポキシ当量:210g/eq、)210質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸72質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で10時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート227質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(2)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(2)の不揮発分は62質量%であった。また、オルソクレゾールノボラック型エポキシ樹脂が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 11: Preparation of resin (2) having a polymerizable unsaturated group and a urethane bond)
Put 121 parts by mass of diethylene glycol monomethyl ether acetate in a flask equipped with a thermometer, a stirrer, and a reflux cooler, and orthocresol novolac type epoxy resin (“EPICLON N-673” manufactured by DIC Co., Ltd., softening point 78 ° C., epoxy. Equivalent: 210 g / eq,) 210 parts by mass was dissolved, 0.8 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone were added, and then 72 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added. , The esterification reaction was carried out at 120 ° C. for 10 hours while blowing air. Next, 227 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (2) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (2) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of epoxy group contained in the orthocresol novolak type epoxy resin, and the number of moles of isocyanate group contained in the urethane-containing acrylate resin (1) is 0.4. Met.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート120質量部を入れ、オルソクレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-665」、エポキシ当量:207g/eq、軟化点69℃)(以下、「エポキシ樹脂(2)」と略記する)207質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸72質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で10時間エステル化反応を行い、エポキシアクリレート樹脂(X1)を得た。次いで、ジエチレングリコールモノメチルエーテルアセテート226質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(3)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(3)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 12: Preparation of Resin (3) Having Polymerizable Unsaturated Group and Urethane Bond)
120 parts by mass of diethylene glycol monomethyl ether acetate was placed in a flask equipped with a thermometer, a stirrer, and a reflux cooler, and an orthocresol novolac type epoxy resin (“EPICLON N-665” manufactured by DIC Co., Ltd., epoxy equivalent: 207 g / eq). , Softening point 69 ° C.) (hereinafter abbreviated as "epoxy resin (2)") 207 parts by mass is dissolved, 0.8 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone are added, and then 72 parts by mass of acrylic acid. A part, 1.4 parts by mass of triphenylphosphine was added, and an esterification reaction was carried out at 120 ° C. for 10 hours while blowing air to obtain an epoxy acrylate resin (X1). Next, 226 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (3) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (3) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート120質量部を入れ、オルソクレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-660」、エポキシ当量:207g/eq、軟化点65℃)207質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸72質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で10時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート226質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(4)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(4)の不揮発分は62質量%であった。また、オルソクレゾールノボラック型エポキシ樹脂が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 13: Preparation of resin (4) having a polymerizable unsaturated group and a urethane bond)
Put 120 parts by mass of diethylene glycol monomethyl ether acetate in a flask equipped with a thermometer, a stirrer, and a reflux cooler, and orthocresol novolac type epoxy resin (“EPICLON N-660” manufactured by DIC Co., Ltd., epoxy equivalent: 207 g / eq. , Softening point 65 ° C.) 207 parts by mass was dissolved, 0.8 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone were added, and then 72 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added. The esterification reaction was carried out at 120 ° C. for 10 hours while blowing air. Next, 226 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (4) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (4) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of epoxy groups contained in the orthocresol novolak type epoxy resin, and the number of moles of isocyanate groups contained in the urethane-containing acrylate resin (1) is 0.4. Met.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート118質量部を入れ、エポキシ樹脂(2)207質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸69質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら110℃で10時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート225質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(5)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(5)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、0.96であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 14: Preparation of resin (5) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 118 parts by mass of diethylene glycol monomethyl ether acetate was placed, 207 parts by mass of the epoxy resin (2) was dissolved, 0.8 parts by mass of dibutylhydroxytoluene, and 0. After adding 2 parts by mass, 69 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added, and the esterification reaction was carried out at 110 ° C. for 10 hours while blowing air. Next, 225 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (5) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (5) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 0.96 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート117質量部を入れ、エポキシ樹脂(2)207質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸69質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら110℃で10時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート225質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(6)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(6)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、0.93であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 15: Preparation of resin (6) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 117 parts by mass of diethylene glycol monomethyl ether acetate was placed, 207 parts by mass of the epoxy resin (2) was dissolved, and 0.8 parts by mass of dibutylhydroxytoluene and 0. After adding 2 parts by mass, 69 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added, and the esterification reaction was carried out at 110 ° C. for 10 hours while blowing air. Next, 225 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (6) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (6) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 0.93 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート121質量部を入れ、エポキシ樹脂(2)207質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸75質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で12時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート227質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(7)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(7)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.04であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 16: Preparation of Resin (7) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 121 parts by mass of diethylene glycol monomethyl ether acetate was placed, 207 parts by mass of the epoxy resin (2) was dissolved, 0.8 parts by mass of dibutylhydroxytoluene, and 0. After adding 2 parts by mass, 75 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added, and the esterification reaction was carried out at 120 ° C. for 12 hours while blowing air. Next, 227 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (7) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (7) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.04 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート122質量部を入れ、エポキシ樹脂(2)207質量部を溶解し、ジブチルヒドロキシトルエン0.9質量部、メトキノン0.2質量部加えた後、アクリル酸78.5質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で13時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート227質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(8)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(8)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.09であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 17: Preparation of Resin (8) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 122 parts by mass of diethylene glycol monomethyl ether acetate was placed, 207 parts by mass of the epoxy resin (2) was dissolved, and 0.9 parts by mass of dibutylhydroxytoluene and 0. After adding 2 parts by mass, 78.5 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added, and an esterification reaction was carried out at 120 ° C. for 13 hours while blowing air. Next, 227 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (8) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (8) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.09 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート123質量部を入れ、エポキシ樹脂(2)207質量部を溶解し、ジブチルヒドロキシトルエン0.9質量部、メトキノン0.2質量部加えた後、アクリル酸80.6質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら120℃で14時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート228質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(9)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(9)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.12であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 18: Preparation of Resin (9) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 123 parts by mass of diethylene glycol monomethyl ether acetate was placed, 207 parts by mass of the epoxy resin (2) was dissolved, and 0.9 parts by mass of dibutylhydroxytoluene and 0. After adding 2 parts by mass, 80.6 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added, and an esterification reaction was carried out at 120 ° C. for 14 hours while blowing air. Next, 228 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (9) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (9) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.12 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート111質量部を入れ、フェノールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-770」、エポキシ当量:188g/eq、軟化点70℃)188質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸72質量部、トリフェニルホスフィン1.3質量部を添加し、空気を吹き込みながら120℃で9時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート222質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.05質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(10)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(10)の不揮発分は62質量%であった。また、フェノールノボラック型エポキシ樹脂が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 19: Preparation of resin (10) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 111 parts by mass of diethylene glycol monomethyl ether acetate was placed, and a phenol novolac type epoxy resin (“EPICLON N-770” manufactured by DIC Co., Ltd., epoxy equivalent: 188 g / eq, (Softening point 70 ° C.) 188 parts by mass was dissolved, 0.8 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone were added, then 72 parts by mass of acrylic acid and 1.3 parts by mass of triphenylphosphine were added, and air was added. The esterification reaction was carried out at 120 ° C. for 9 hours while blowing. Next, 222 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.05 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (10) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (10) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of epoxy group contained in the phenol novolac type epoxy resin, and the number of moles of isocyanate group contained in the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート119質量部を入れ、ナフタレン型エポキシ樹脂(DIC株式会社製「EPICLON HP-4770」、エポキシ当量:205g/eq、軟化点73℃)205質量部を溶解し、ジブチルヒドロキシトルエン0.8質量部、メトキノン0.2質量部加えた後、アクリル酸72質量部、トリフェニルホスフィン1.4質量部を添加し、空気を吹き込みながら110℃で12時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート226質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(11)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(11)の不揮発分は62質量%であった。また、ナフタレン型エポキシ樹脂が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 20: Preparation of Resin (11) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 119 parts by mass of diethylene glycol monomethyl ether acetate was placed, and a naphthalene-type epoxy resin (“EPICLON HP-4770” manufactured by DIC Co., Ltd., epoxy equivalent: 205 g / eq, softened. (Point 73 ° C.) 205 parts by mass was dissolved, 0.8 parts by mass of dibutylhydroxytoluene and 0.2 parts by mass of methquinone were added, and then 72 parts by mass of acrylic acid and 1.4 parts by mass of triphenylphosphine were added to add air. The esterification reaction was carried out at 110 ° C. for 12 hours while blowing. Next, 226 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added, and air was blown into the mixture. The reaction was carried out at 80 ° C. for 8 hours to obtain a resin (11) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (11) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the naphthalene type epoxy resin, and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. rice field.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート104質量部、合成例3で得たウレタン含有アクリレート樹脂(1)85.4質量部、ジオクチル錫ジネオデカノエート(1)0.04質量部を添加し、空気を吹き込みながら80℃で6時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(12)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(12)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.12であった。 (Synthesis Example 21: Preparation of resin (12) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 401 parts by mass of epoxy acrylate resin (X1), 104 parts by mass of diethylene glycol monomethyl ether acetate, and urethane-containing acrylate resin (1) 85.4 obtained in Synthesis Example 3. By mass, 0.04 part by mass of dioctyl tin dineodecanoate (1) was added, and the reaction was carried out at 80 ° C. for 6 hours while blowing air, and the resin having the desired polymerizable unsaturated group and urethane bond (12). ) Was obtained. The non-volatile content of the resin (12) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.12. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート86質量部、合成例3で得たウレタン含有アクリレート樹脂(1)57質量部、ジオクチル錫ジネオデカノエート(1)0.03質量部を添加し、空気を吹き込みながら80℃で5時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(13)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(13)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.08であった。 (Synthesis Example 22: Preparation of resin (13) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 401 parts by mass of epoxy acrylate resin (X1), 86 parts by mass of diethylene glycol monomethyl ether acetate, and 57 parts by mass of urethane-containing acrylate resin (1) obtained in Synthesis Example 3. , Dioctyl tin dineodecanoate (1) 0.03 part by mass was added, and the reaction was carried out at 80 ° C. for 5 hours while blowing air to obtain the resin (13) having the desired polymerizable unsaturated group and urethane bond. Obtained. The non-volatile content of the resin (13) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.08. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート389質量部、合成例3で得たウレタン含有アクリレート樹脂(1)484質量部、ジオクチル錫ジネオデカノエート(1)0.08質量部を添加し、空気を吹き込みながら80℃で10時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(14)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(14)の不揮発分は60質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.68であった。 (Synthesis Example 23: Preparation of resin (14) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 401 parts by mass of epoxy acrylate resin (X1), 389 parts by mass of diethylene glycol monomethyl ether acetate, and 484 parts by mass of urethane-containing acrylate resin (1) obtained in Synthesis Example 3. , Dioctyl tin dineodecanoate (1) 0.08 part by mass was added, and the reaction was carried out at 80 ° C. for 10 hours while blowing air to obtain the resin (14) having the desired polymerizable unsaturated group and urethane bond. Obtained. The non-volatile content of the resin (14) having a polymerizable unsaturated group and a urethane bond was 60% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.68. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート408質量部、合成例3で得たウレタン含有アクリレート樹脂(1)512.5質量部、ジオクチル錫ジネオデカノエート(1)0.08質量部を添加し、空気を吹き込みながら80℃で12時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(15)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(15)の不揮発分は60質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.72であった。 (Synthesis Example 24: Preparation of Resin (15) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 401 parts by mass of epoxy acrylate resin (X1), 408 parts by mass of diethylene glycol monomethyl ether acetate, and urethane-containing acrylate resin (1) 512.5 obtained in Synthesis Example 3 By mass, 0.08 part by mass of dioctyl tin dineodecanoate (1) was added, and the reaction was carried out at 80 ° C. for 12 hours while blowing air, and the resin having the desired polymerizable unsaturated group and urethane bond (15). ) Was obtained. The non-volatile content of the resin (15) having a polymerizable unsaturated group and a urethane bond was 60% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.72. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート142質量部、合成例4で得たウレタン含有アクリレート樹脂(2)147.4質量部、ジオクチル錫ジネオデカノエート(1)0.04質量部を添加し、空気を吹き込みながら80℃で10時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(16)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(16)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(2)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 25: Preparation of Resin (16) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 401 parts by mass of epoxy acrylate resin (X1), 142 parts by mass of diethylene glycol monomethyl ether acetate, and urethane-containing acrylate resin (2) 147.4 obtained in Synthesis Example 4. By mass, 0.04 part by mass of dioctyl tin dineodecanoate (1) was added, and the reaction was carried out at 80 ° C. for 10 hours while blowing air, and the resin having the desired polymerizable unsaturated group and urethane bond (16). ) Was obtained. The non-volatile content of the resin (16) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (2) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート128質量部、合成例5で得たウレタン含有アクリレート樹脂(3)124.4質量部、ジオクチル錫ジネオデカノエート(1)0.04質量部を添加し、空気を吹き込みながら80℃で11時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(17)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(17)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(3)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 26: Preparation of Resin (17) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 401 parts by mass of epoxy acrylate resin (X1), 128 parts by mass of diethylene glycol monomethyl ether acetate, and urethane-containing acrylate resin (3) 124.4 obtained in Synthesis Example 5. By mass, 0.04 part by mass of dioctyl tin dineodecanoate (1) was added, and the reaction was carried out at 80 ° C. for 11 hours while blowing air, and the resin having the desired polymerizable unsaturated group and urethane bond (17). ) Was obtained. The non-volatile content of the resin (17) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (3) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート419質量部、合成例6で得たウレタン含有アクリレート樹脂(4)600質量部、ジオクチル錫ジネオデカノエート(1)0.09質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(18)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(18)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(4)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis 27: Preparation of resin (18) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 401 parts by mass of epoxy acrylate resin (X1), 419 parts by mass of diethylene glycol monomethyl ether acetate, and 600 parts by mass of urethane-containing acrylate resin (4) obtained in Synthesis Example 6. , Dioctyl tin dineodecanoate (1) 0.09 part by mass was added, and the reaction was carried out at 80 ° C. for 8 hours while blowing air to obtain the resin (18) having the desired polymerizable unsaturated group and urethane bond. Obtained. The non-volatile content of the resin (18) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (4) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート519.5質量部、合成例7で得たウレタン含有アクリレート樹脂(5)763.6質量部、ジオクチル錫ジネオデカノエート(1)0.1質量部を添加し、空気を吹き込みながら80℃で7時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(19)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(19)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(5)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 28: Preparation of Resin (19) Having Polymerizable Unsaturated Group and Urethane Bond)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 401 parts by mass of epoxy acrylate resin (X1), 519.5 parts by mass of diethylene glycol monomethyl ether acetate, and urethane-containing acrylate resin (5) 763 obtained in Synthesis Example 7. .6 parts by mass, dioctyl tin dineodecanoate (1) 0.1 part by mass was added, and the reaction was carried out at 80 ° C. for 7 hours while blowing air, and the resin having the desired polymerizable unsaturated group and urethane bond. (19) was obtained. The non-volatile content of the resin (19) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (5) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート98.4質量部、合成例8で得たウレタン含有アクリレート樹脂(6)76.7質量部、ジオクチル錫ジネオデカノエート(1)0.1質量部を添加し、空気を吹き込みながら80℃で10時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(20)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(20)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(6)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 29: Preparation of resin (20) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 401 parts by mass of epoxy acrylate resin (X1), 98.4 parts by mass of diethylene glycol monomethyl ether acetate, and urethane-containing acrylate resin (6) 76 obtained in Synthesis Example 8. .7 parts by mass, dioctyl tin dineodecanoate (1) 0.1 part by mass was added, and the reaction was carried out at 80 ° C. for 10 hours while blowing air, and the resin having the desired polymerizable unsaturated group and urethane bond. (20) was obtained. The non-volatile content of the resin (20) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (6) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート217.5質量部、ジオクチル錫ジネオデカノエート(1)0.1質量部を添加し、空気を吹き込みながら80℃に昇温した。次いで、合成例9で得たウレタン含有アクリレート樹脂(7)271質量部を分割で添加し、80℃で5時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(21)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(21)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、アクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(7)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 30: Preparation of resin (21) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 401 parts by mass of epoxy acrylate resin (X1), 217.5 parts by mass of diethylene glycol monomethyl ether acetate, and 0.1 parts by mass of dioctyltin dineodecanoate (1). The temperature was raised to 80 ° C. while blowing air. Next, 271 parts by mass of the urethane-containing acrylate resin (7) obtained in Synthesis Example 9 was added in portions, and the reaction was carried out at 80 ° C. for 5 hours to obtain the resin (21) having the desired polymerizable unsaturated group and urethane bond. Obtained. The non-volatile content of the resin (21) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of acrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (7) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、ジエチレングリコールモノメチルエーテルアセテート125.6質量部を入れ、エポキシ樹脂(2)207質量部を溶解し、ジブチルヒドロキシトルエン0.9質量部、メトキノン0.2質量部加えた後、メタクリル酸86質量部、トリフェニルホスフィン1.5質量部を添加し、空気を吹き込みながら120℃で9時間エステル化反応を行った。次いで、ジエチレングリコールモノメチルエーテルアセテート228.5質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行い、目的の重合性不飽和基及びウレタン結合を有する樹脂(22)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(22)の不揮発分は62質量%であった。また、エポキシ樹脂(2)が有するエポキシ基1モルに対して、メタクリル酸のモル数は、1.0であり、ウレタン含有アクリレート樹脂(1)が有するイソシアネート基のモル数は、0.4であった。 (Synthesis Example 31: Preparation of resin (22) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux cooler, 125.6 parts by mass of diethylene glycol monomethyl ether acetate was placed, 207 parts by mass of the epoxy resin (2) was dissolved, and 0.9 parts by mass of dibutylhydroxytoluene and methquinone were dissolved. After adding 0.2 parts by mass, 86 parts by mass of methacrylic acid and 1.5 parts by mass of triphenylphosphine were added, and an esterification reaction was carried out at 120 ° C. for 9 hours while blowing air. Next, 228.5 parts by mass of diethylene glycol monomethyl ether acetate, 285 parts by mass of the urethane-containing acrylate resin (1) obtained in Synthesis Example 3, and 0.06 parts by mass of dioctyltin dineodecanoate (1) were added to add air. The reaction was carried out at 80 ° C. for 8 hours while blowing to obtain a resin (22) having the desired polymerizable unsaturated group and urethane bond. The non-volatile content of the resin (22) having a polymerizable unsaturated group and a urethane bond was 62% by mass. Further, the number of moles of methacrylic acid is 1.0 with respect to 1 mol of the epoxy group of the epoxy resin (2), and the number of moles of the isocyanate group of the urethane-containing acrylate resin (1) is 0.4. there were.
温度計、攪拌器、及び還流冷却器を備えたフラスコに、エポキシアクリレート樹脂(X1)401質量部、ジエチレングリコールモノメチルエーテルアセテート273質量部、合成例3で得たウレタン含有アクリレート樹脂(1)285質量部、ジオクチル錫ジネオデカノエート(1)0.06質量部を添加し、空気を吹き込みながら80℃で8時間反応を行った。次いで、テトラヒドロ無水フタル酸76質量部を添加し、110℃で3時間反応させ、重合性不飽和基及びウレタン結合を有する樹脂(23)を得た。この重合性不飽和基及びウレタン結合を有する樹脂(23)の不揮発分は62質量%であり、固形分酸価は46mgKOH/gであった。 (Synthesis 32: Preparation of resin (23) having a polymerizable unsaturated group and a urethane bond)
In a flask equipped with a thermometer, a stirrer, and a reflux condenser, 401 parts by mass of epoxy acrylate resin (X1), 273 parts by mass of diethylene glycol monomethyl ether acetate, and 285 parts by mass of urethane-containing acrylate resin (1) obtained in Synthesis Example 3. , 0.06 part by mass of dioctyl tin dineodecanoate (1) was added, and the reaction was carried out at 80 ° C. for 8 hours while blowing air. Then, 76 parts by mass of tetrahydrophthalic anhydride was added and reacted at 110 ° C. for 3 hours to obtain a resin (23) having a polymerizable unsaturated group and a urethane bond. The non-volatile content of the resin (23) having a polymerizable unsaturated group and a urethane bond was 62% by mass, and the solid content acid value was 46 mgKOH / g.
合成例1で得た酸基及び重合性不飽和基を有する樹脂(1)と、合成例11で得た重合性不飽和基及びウレタン結合を有する樹脂(3)と、硬化剤としてオルソクレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-680」)と、ジペンタエリスリトールヘキサアクリレートと、ジエチレングリコールモノエチルエーテルアセテートと、光重合開始剤(IGM社製「Omnirad 907」)と、2-エチル-4-メチルイミダゾールと、フタロシアニングリーンとを表1~3に示す質量部で配合し、ロールミルにより混錬して活性エネルギー線硬化性樹脂組成物(1)を得た。 (Example 1: Preparation of active energy ray-curable resin composition (1))
The resin (1) having an acid group and a polymerizable unsaturated group obtained in Synthesis Example 1, the resin (3) having a polymerizable unsaturated group and a urethane bond obtained in Synthesis Example 11, and orthocresol novolac as a curing agent. Type epoxy resin (“EPICLON N-680” manufactured by DIC Co., Ltd.), dipentaerythritol hexaacrylate, diethylene glycol monoethyl ether acetate, photopolymerization initiator (“Omnirad 907” manufactured by IGM Co., Ltd.), and 2-ethyl- 4-Methylimidazole and phthalocyanine green were blended in parts by mass shown in Tables 1 to 3 and kneaded with a roll mill to obtain an active energy ray-curable resin composition (1).
表1~3に示す組成及び配合で実施例1と同様の方法にて、硬化性樹脂組成物(2)~(28)を得た。 (Examples 2-28: Preparation of active energy ray-curable resin compositions (2)-(28))
Curable resin compositions (2) to (28) were obtained in the same manner as in Example 1 with the compositions and formulations shown in Tables 1 to 3.
合成例2で得た酸基及び重合性不飽和基を有する樹脂(2)と、硬化剤としてオルソクレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-680」)と、ジペンタエリスリトールヘキサアクリレートと、ジエチレングリコールモノエチルエーテルアセテートと、光重合開始剤(IGM社製「Omnirad 907」)と、2-エチル-4-メチルイミダゾールと、フタロシアニングリーンとを表3に示す質量部で配合し、ロールミルにより混錬して活性エネルギー線硬化性樹脂組成物(R1)を得た。 (Comparative Example 1: Preparation of active energy ray-curable resin composition (R1))
The resin (2) having an acid group and a polymerizable unsaturated group obtained in Synthesis Example 2, an orthocresol novolak type epoxy resin (“EPICLON N-680” manufactured by DIC Co., Ltd.) as a curing agent, and dipentaerythritol hexaacrylate. , Diethylene glycol monoethyl ether acetate, a photopolymerization initiator (“Omnirad 907” manufactured by IGM), 2-ethyl-4-methylimidazole, and phthalocyanine green in parts by mass shown in Table 3, and then a roll mill is used. The mixture was kneaded to obtain an active energy ray-curable resin composition (R1).
合成例30で得た重合性不飽和基及びウレタン結合を有する樹脂(21)と、硬化剤としてオルソクレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-680」)と、ジペンタエリスリトールヘキサアクリレートと、ジエチレングリコールモノエチルエーテルアセテートと、光重合開始剤(IGM社製「Omnirad 907」)と、2-エチル-4-メチルイミダゾールと、フタロシアニングリーンとを表3に示す質量部で配合し、ロールミルにより混錬して活性エネルギー線硬化性樹脂組成物(R2)を得た。 (Comparative Example 2: Preparation of active energy ray-curable resin composition (R2))
The resin (21) having a polymerizable unsaturated group and a urethane bond obtained in Synthesis Example 30, an orthocresol novolak type epoxy resin (“EPICLON N-680” manufactured by DIC Co., Ltd.) as a curing agent, and a dipentaerythritol hexaacrylate. , Diethylene glycol monoethyl ether acetate, a photopolymerization initiator (“Omnirad 907” manufactured by IGM), 2-ethyl-4-methylimidazole, and phthalocyanine green in parts by mass shown in Table 3, and then a roll mill is used. The mixture was kneaded to obtain an active energy ray-curable resin composition (R2).
各実施例及び比較例で得られた活性エネルギー線硬化性樹脂組成物を、アプリケーターを用いてガラス基材上に膜厚50μmとなるように塗布した後、80℃でそれぞれ70分間、80分間、90分間、100分間、110分、120分、130分、140分間乾燥させ、乾燥時間が異なるサンプルを作成した。これらを1%炭酸ナトリウム水溶液で30℃180秒間現像し、基板上に残渣が残らなかったサンプルの80℃での乾燥時間を乾燥管理幅として、以下の基準に従い評価した。なお、乾燥管理幅が長いほどアルカリ現像性が優れていることを示す。 [Evaluation method of alkaline developability]
The active energy ray-curable resin composition obtained in each Example and Comparative Example was applied onto a glass substrate using an applicator so as to have a film thickness of 50 μm, and then at 80 ° C. for 70 minutes and 80 minutes, respectively. The samples were dried for 90 minutes, 100 minutes, 110 minutes, 120 minutes, 130 minutes, and 140 minutes to prepare samples having different drying times. These were developed with a 1% aqueous sodium carbonate solution at 30 ° C. for 180 seconds, and the drying time at 80 ° C. of the sample in which no residue remained on the substrate was used as the drying control range and evaluated according to the following criteria. It should be noted that the longer the drying control range, the better the alkaline developability.
B:乾燥管理幅が120分超140分以下であった。
C:乾燥管理幅が100分超120分以下であった。
D:乾燥管理幅が80分超100分以下であった。
E:乾燥管理幅が80分以下であった。 A: The drying control width was over 140 minutes.
B: The drying control width was more than 120 minutes and 140 minutes or less.
C: The drying control width was more than 100 minutes and 120 minutes or less.
D: The drying control width was more than 80 minutes and 100 minutes or less.
E: The drying control width was 80 minutes or less.
合成例1で得た酸基及び重合性不飽和基を有する樹脂(1)と、合成例11で得た重合性不飽和基及びウレタン結合を有する樹脂(3)と、硬化剤としてオルソクレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-680」)、光重合開始剤として2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン(IGM Resins社製「Omnirad 907」)、有機溶剤としてジエチレングリコールモノメチルエーテルアセテートを表4に示す質量部で配合して、活性エネルギー線硬化性樹脂組成物(29)を得た。 (Example 29: Preparation of active energy ray-curable resin composition (29))
The resin (1) having an acid group and a polymerizable unsaturated group obtained in Synthesis Example 1, the resin (3) having a polymerizable unsaturated group and a urethane bond obtained in Synthesis Example 11, and orthocresol novolac as a curing agent. Type epoxy resin (“EPICLON N-680” manufactured by DIC Co., Ltd.), 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one (IMnirad manufactured by IGM Resins) as a photopolymerization initiator 907 ”) and diethylene glycol monomethyl ether acetate as an organic solvent were blended in parts by mass shown in Table 4 to obtain an active energy ray-curable resin composition (29).
表4~6に示す組成及び配合で実施例29と同様の方法にて、活性エネルギー線硬化性樹脂組成物(30)~(56)を得た。 (Examples 30 to 56: Preparation of active energy ray-curable resin compositions (30) to (56))
The active energy ray-curable resin compositions (30) to (56) were obtained in the same manner as in Example 29 with the compositions and formulations shown in Tables 4 to 6.
表6に示す組成及び配合で実施例29と同様の方法にて、硬化性樹脂組成物(R3)及び(R4)を得た。 (Comparative Examples 3 and 4: Preparation of active energy ray-curable resin compositions (R3) and (R4))
Curable resin compositions (R3) and (R4) were obtained in the same manner as in Example 29 with the compositions and formulations shown in Table 6.
伸度の測定及び弾性率の測定は、引張試験に基づいて行った。
<試験片1の作製>
銅箔(古河産業株式会社製、電解銅箔「F2-WS」18μm)上に実施例及び比較例で得られた活性エネルギー線硬化性樹脂組成物を50μmのアプリケーターで塗布し、メタルハライドランプを用いて10kJ/m2の紫外線を照射した後、160℃で1時間加熱した。銅箔から硬化物を剥離し、試験片1(硬化物)を得た。 [Measurement method of elongation and elastic modulus]
The measurement of elongation and the measurement of elastic modulus were performed based on the tensile test.
<Preparation of test piece 1>
The active energy ray-curable resin composition obtained in Examples and Comparative Examples was applied onto a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 μm) with a 50 μm applicator, and a metal halide lamp was used. After irradiating with ultraviolet rays of 10 kJ / m 2 , it was heated at 160 ° C. for 1 hour. The cured product was peeled off from the copper foil to obtain a test piece 1 (cured product).
前記試験片1を10mm×80mmの大きさに切り出し、株式会社島津製作所製精密万能試験機オートグラフ「AG-IS」を用いて、下記の測定条件で試験片1の引張試験を行った。試験片が破断するまでの伸度(%)及び弾性率(MPa)を測定し、以下の基準に従い評価した。 <Tensile test>
The test piece 1 was cut into a size of 10 mm × 80 mm, and a tensile test was performed on the test piece 1 under the following measurement conditions using a precision universal testing machine Autograph “AG-IS” manufactured by Shimadzu Corporation. The elongation (%) and elastic modulus (MPa) until the test piece broke were measured and evaluated according to the following criteria.
B:伸度が2.6%超2.9%以下であった。
C:伸度が2.3%超2.6%以下であった。
D:伸度が2.0%超2.3%以下であった。
E:伸度が2.0%以下であった。 A: The elongation was over 2.9%.
B: The elongation was more than 2.6% and 2.9% or less.
C: The elongation was more than 2.3% and 2.6% or less.
D: The elongation was more than 2.0% and 2.3% or less.
E: The elongation was 2.0% or less.
B:弾性率が2080MPa以上2160MPa未満であった。
C:弾性率が2160MPa以上2250MPa未満であった。
D:弾性率が2250MPa以上2330MPa未満であった。
E:弾性率が2330MPa以上であった。 A: The elastic modulus was less than 2080 MPa.
B: The elastic modulus was 2080 MPa or more and less than 2160 MPa.
C: The elastic modulus was 2160 MPa or more and less than 2250 MPa.
D: The elastic modulus was 2250 MPa or more and less than 2330 MPa.
E: The elastic modulus was 2330 MPa or more.
基材密着性の評価は、ピール強度の測定により行った。
<試験片2の作製>
銅箔(古河産業株式会社製、電解銅箔「F2-WS」18μm)上に実施例及び比較例で得られた活性エネルギー線硬化性樹脂組成物を50μmのアプリケーターで塗布し、メタルハライドランプを用いて10kJ/m2の紫外線を照射した後、160℃で1時間加熱し、試験片2を得た。 [Evaluation method of substrate adhesion]
The substrate adhesion was evaluated by measuring the peel strength.
<Preparation of test piece 2>
The active energy ray-curable resin composition obtained in Examples and Comparative Examples was applied onto a copper foil (manufactured by Furukawa Sangyo Co., Ltd., electrolytic copper foil "F2-WS" 18 μm) with a 50 μm applicator, and a metal halide lamp was used. After irradiating with ultraviolet rays of 10 kJ / m 2 , the test piece 2 was obtained by heating at 160 ° C. for 1 hour.
前記試験片2を幅1cm、長さ12cmの大きさに切り出し、剥離試験機(株式会社A&D製「A&Dテンシロン」、剥離速度50mm/分)を用いて90°ピール強度を測定し、以下の基準に従い評価した。 <Measuring method of peel strength>
The test piece 2 was cut into a size of 1 cm in width and 12 cm in length, and the 90 ° peel strength was measured using a peeling tester (“A & D Tensilon” manufactured by A & D Co., Ltd., peeling speed 50 mm / min). Evaluated according to.
B:密着性が0.90N/cm以上0.95N/cm未満であった。
C:密着性が0.85N/cm以上0.90N/cm未満であった。
D:密着性が0.80N/cm以上0.85N/cm未満であった。
E:密着性が0.80N/cm未満であった。 A: The adhesion was 0.95 N / cm or more.
B: Adhesion was 0.90 N / cm or more and less than 0.95 N / cm.
C: Adhesion was 0.85 N / cm or more and less than 0.90 N / cm.
D: Adhesion was 0.80 N / cm or more and less than 0.85 N / cm.
E: Adhesion was less than 0.80 N / cm.
Claims (11)
- 酸基及び重合性不飽和基を有する樹脂(A)と、
前記樹脂(A)以外の重合性不飽和基及びウレタン結合を有する樹脂(B)とを含有する活性エネルギー線硬化性樹脂組成物であって、
前記樹脂(B)が、エポキシ樹脂(b1)、不飽和一塩基酸(b2)、水酸基を有する(メタ)アクリレート化合物(b3)、及びイソシアネート基を有する化合物(b4)とを必須原料とするものであることを特徴とする活性エネルギー線硬化性樹脂組成物。 Resin (A) having an acid group and a polymerizable unsaturated group,
An active energy ray-curable resin composition containing a polymerizable unsaturated group other than the resin (A) and a resin (B) having a urethane bond.
The resin (B) contains an epoxy resin (b1), an unsaturated monobasic acid (b2), a (meth) acrylate compound (b3) having a hydroxyl group, and a compound (b4) having an isocyanate group as essential raw materials. An active energy ray-curable resin composition characterized by being. - 前記樹脂(A)と前記樹脂(B)の固形分の質量割合[(A)/(B)]が、95/5~50/50の範囲である請求項1記載の活性エネルギー線硬化性樹脂組成物。 The active energy ray-curable resin according to claim 1, wherein the mass ratio [(A) / (B)] of the solid content of the resin (A) and the resin (B) is in the range of 95/5 to 50/50. Composition.
- 前記不飽和一塩基酸(b2)の使用量が、前記不飽和一塩基酸(b2)の有する酸基を基準として、前記エポキシ樹脂(b1)が有するエポキシ基1モルに対して、0.95~1.1モルの範囲である請求項1又は2記載の活性エネルギー線硬化性樹脂組成物。 The amount of the unsaturated monobasic acid (b2) used is 0.95 with respect to 1 mol of the epoxy group of the epoxy resin (b1) based on the acid group of the unsaturated monobasic acid (b2). The active energy ray-curable resin composition according to claim 1 or 2, which is in the range of ~ 1.1 mol.
- 前記化合物(b3)の使用量が、前記化合物(b3)の有する水酸基を基準として、前記化合物(b4)が有するイソシアネート基1モルに対して、0.3~0.7モルの範囲である請求項1~3の何れか1項記載の活性エネルギー線硬化性樹脂組成物。 The amount of the compound (b3) used is in the range of 0.3 to 0.7 mol with respect to 1 mol of the isocyanate group of the compound (b4) based on the hydroxyl group of the compound (b3). Item 3. The active energy ray-curable resin composition according to any one of Items 1 to 3.
- 前記樹脂(B)が、(メタ)アクリロイル基及びイソシアネート基、並びにウレタン結合を有するものである請求項1~4のいずれか1項記載の活性エネルギー線硬化性樹脂組成物。 The active energy ray-curable resin composition according to any one of claims 1 to 4, wherein the resin (B) has a (meth) acryloyl group, an isocyanate group, and a urethane bond.
- 前記化合物(b4)の使用量が、前記化合物(b4)の有するイソシアネート基を基準として、前記エポキシ樹脂(b1)が有するエポキシ基1モルに対して、0.1~0.7モルの範囲である請求項1~3の何れか1項記載の活性エネルギー線硬化性樹脂組成物。 The amount of the compound (b4) used is in the range of 0.1 to 0.7 mol with respect to 1 mol of the epoxy group of the epoxy resin (b1) based on the isocyanate group of the compound (b4). The active energy ray-curable resin composition according to any one of claims 1 to 3.
- 前記エポキシ樹脂(b1)の軟化点が、78℃以下である請求項1~6の何れか1項記載の活性エネルギー線硬化性樹脂組成物。 The active energy ray-curable resin composition according to any one of claims 1 to 6, wherein the epoxy resin (b1) has a softening point of 78 ° C. or lower.
- さらに、光重合開始剤を含有するものである請求項1~7の何れか1項記載の活性エネルギー線硬化性樹脂組成物。 The active energy ray-curable resin composition according to any one of claims 1 to 7, further comprising a photopolymerization initiator.
- 請求項1~8の何れか1項記載の活性エネルギー線硬化性樹脂組成物の硬化物。 A cured product of the active energy ray-curable resin composition according to any one of claims 1 to 8.
- 請求項9記載の硬化物からなることを特徴とする絶縁材料。 An insulating material comprising the cured product according to claim 9.
- 請求項9記載の硬化物からなることを特徴とするレジスト部材。 A resist member made of the cured product according to claim 9.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS565861A (en) * | 1979-06-28 | 1981-01-21 | Mitsubishi Electric Corp | Varnish composition for insulating treatment |
JPH06228252A (en) * | 1993-02-03 | 1994-08-16 | Nippon Shokubai Co Ltd | Liquid photosensitive resin composition |
JP2010275339A (en) * | 2009-05-26 | 2010-12-09 | Mitsubishi Rayon Co Ltd | Curable composition and article |
CN110563925A (en) * | 2019-09-16 | 2019-12-13 | 上海昭和高分子有限公司 | Anhydride modified epoxy acrylic resin, alkali development high-heat-resistance polyurethane resin and solder resist ink thereof |
JP2020097704A (en) * | 2018-12-19 | 2020-06-25 | Dic株式会社 | Acid group-containing (meth)acrylate resin composition, curable resin composition, cured product, insulating material, resin material for solder resist, and resist member |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61243869A (en) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | Resist ink composition |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS565861A (en) * | 1979-06-28 | 1981-01-21 | Mitsubishi Electric Corp | Varnish composition for insulating treatment |
JPH06228252A (en) * | 1993-02-03 | 1994-08-16 | Nippon Shokubai Co Ltd | Liquid photosensitive resin composition |
JP2010275339A (en) * | 2009-05-26 | 2010-12-09 | Mitsubishi Rayon Co Ltd | Curable composition and article |
JP2020097704A (en) * | 2018-12-19 | 2020-06-25 | Dic株式会社 | Acid group-containing (meth)acrylate resin composition, curable resin composition, cured product, insulating material, resin material for solder resist, and resist member |
CN110563925A (en) * | 2019-09-16 | 2019-12-13 | 上海昭和高分子有限公司 | Anhydride modified epoxy acrylic resin, alkali development high-heat-resistance polyurethane resin and solder resist ink thereof |
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