WO2022135609A1

WO2022135609A1 - Rehabilitation system

Info

Publication number: WO2022135609A1
Application number: PCT/CN2022/070347
Authority: WO
Inventors: 胡俊; 杨屹巍; 邸霈; 罗毅
Original assignee: 苏州微创康复医疗科技(集团)有限公司
Priority date: 2020-12-21
Filing date: 2022-01-05
Publication date: 2022-06-30
Also published as: CN112220610A; CN215994455U

Abstract

A rehabilitation system, comprising a handle and a circulation part connected to the handle. The handle comprises a grip part (100) and a connection part (101) connected to the grip part (100); the grip part (100) comprises a heat conduction part (1) and a semiconductor heat exchange module (3); the heat conduction part (1) is connected to the semiconductor heat exchange module (3); the semiconductor heat exchange module (3) is used for cooling or heating and acts on a body surface by means of the heat conduction part (1); the grip part (100) is used for allowing a user to hold and move on the surface of a target treatment site during treatment; a connection part (101) is used for connecting the grip part (100) to the circulation part to supply electrical energy to the semiconductor heat exchange module (3); and during treatment, the semiconductor heat exchange module (3) is closer to the target treatment site than the connection part (101) to achieve the objective of rapidly heating or cooling the handle.

Description

a rehabilitation system

technical field

The present application relates to the technical field of medical devices, and in particular, to a rehabilitation system.

Background technique

At present, the traditional rehabilitation treatment method is to use physical therapy to lay the affected area with the help of wrapping bags. This kind of rehabilitation treatment method is relatively traditional and has the following disadvantages in actual use:

(1) Corresponding treatment plans cannot be provided for different patients with different affected parts, and the treatment methods are relatively simple, and the temperature rise and fall speed of this kind of physical therapy using wrapping bags is slow, and the patients need to wait for a long time, which seriously affects the treatment. Effect.

(2) This method of physical therapy using a wrapping bag will generate pressure during the treatment process, and some patients may feel uncomfortable due to individual differences.

(3) For locally injured patients, whose overall motor function has not been lost, physical therapy can be carried out with wrapping bags. However, it is inconvenient to use this structure for seriously injured patients or patients with inconvenient mobility, so the use of wrapping bags (cold bags or hot water bags) has certain limitations.

SUMMARY OF THE INVENTION

In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a rehabilitation system. Compared with the prior art, the present application can solve one or more problems in the prior art.

To achieve the above object, the technical scheme of the application is as follows:

A rehabilitation system, the rehabilitation system comprises a handle and a circulation part connected with the handle, the handle comprises a hand-held part and a connection part connected with the hand-held part, the hand-held part comprises a heat conducting part and a semiconductor heat exchange module , the heat conduction part is connected with the semiconductor heat exchange module, the semiconductor heat exchange module is used for cooling or heating and acts on the body surface through the heat conduction part, and the hand-held part is used for the user to hold and treat When moving and operating on the surface of the target treatment site, the connecting part is used to connect the hand-held part to the circulating part for supplying electric power to the semiconductor heat exchange module; during treatment, the semiconductor heat exchange module is compared with The connecting portion is closer to the target treatment site.

Further, the rehabilitation system further includes a memory, a processor, and an input part, wherein a computer program is stored in the memory, the input part is used for a user to input a treatment plan, and the processor is used to retrieve the corresponding treatment plan. A computer program of the solution, and causing the computer program, when executed by the processor, to control the handle to operate at a preset temperature and a corresponding preset temperature duration.

Further, the treatment regimen includes detumescence and analgesia.

Further, the treatment plan for reducing swelling includes treatment plans for different treatment areas, and the processor is configured to control the handle to operate with a corresponding preset temperature and a preset temperature duration according to the treatment area selected by the input part.

Further, the different treatment areas include large areas greater than 12×12 cm, medium areas greater than 10×10 cm and less than or equal to 12×12 cm, and small areas less than or equal to 10×10 cm.

Further, in the treatment plan for reducing swelling, the preset temperature includes a high temperature temperature and a low temperature temperature, wherein the high temperature temperature range corresponding to the treatment area is 30-45°C, and the duration of the high temperature temperature is 17s～45°C. 200 s; the low temperature temperature range corresponding to the treatment area is 0 to 10° C., and the low temperature duration of the low temperature temperature is 15 to 200 s.

Further, the analgesic treatment plan includes treatment plans for different treatment sites, and the processor controls the handle according to the treatment site selected by the input part to operate with a corresponding preset temperature and a preset temperature duration.

Further, the treatment site includes bone and muscle.

Further, in the muscle analgesia treatment plan, the preset temperature includes a high temperature temperature and a low temperature temperature, the high temperature temperature ranges from 30 to 45°C, and the duration of the high temperature temperature is 17 to 150s; The low temperature temperature ranges from 0 to 10° C., and the duration of the low temperature temperature is from 15 s to 75 s.

Further, in the bone analgesia treatment plan, the preset temperature includes a high temperature temperature and a low temperature temperature, the high temperature temperature ranges from 30 to 45°C, and the duration of the high temperature temperature is 17 to 100s; The low temperature temperature ranges from 0 to 10° C., and the duration of the low temperature temperature is from 100 s to 200 s.

Further, the processor is used for:

According to the treatment area input by the input device, obtain the treatment area information and the treatment duration information corresponding to the treatment area;

Control the handle to continuously cool down or heat up, and according to the sensed temperature information from the handle, determine whether the sensed temperature reaches the target temperature, if it reaches the target temperature, start recording the duration, if the duration reaches the target duration , the cooling or heating operation of the handle is stopped.

Further, the processor is used for:

According to the treatment part input by the input device, obtain the treatment part information and the treatment duration information corresponding to the treatment part;

Further, the connection part includes a water circuit and an electric circuit for connecting the hand-held part to the circulation part, the circulation part includes a water pump, a heat dissipation part and a sensor, and the water circuit is in fluid communication with the water pump and the heat dissipation part And the flow rate of the liquid in the water channel is detected by the sensor.

Further, the hand-held part includes a first sensor disposed between the heat-conducting part and the semiconductor heat exchange module, so as to sense the current temperature of the heat-conducting part, and then detect the temperature applied on the body surface.

Further, the rehabilitation system includes a laser generator, a control board connected with the laser generator, and a third sensor, the third sensor is connected between the laser generator and the control board for The temperature of the laser generator is detected and fed back to the control board.

Further, the rehabilitation system further includes a laser handle, the laser handle includes a light guide end and a connection end, the light guide end and the connection end are detachably connected and include a plurality of light guides with different sizes that can be replaced. end.

Further, the rehabilitation system further includes a first casing and a second casing arranged in a stack, the circulation part is located in the first casing, and the laser generator is located in the second casing.

Further, the first casing is provided with a handle connecting end for connecting with the handle and a ventilation port for fluid communication with the semiconductor heat exchange module, and the second casing is provided with the laser The laser handle connection end of the handle connection.

Further, the rehabilitation system further includes a display unit located on the first casing or the second casing, and the display unit is used to display different operation modes of the rehabilitation system to the user and allow the user to select different operations. The rehabilitation system is operated in a mode, the different operation modes include at least one of cold therapy, heat therapy, thermal shock therapy, and thermal cycle therapy. In the thermal shock therapy mode, the user operates the The display unit may indicate that the semiconductor heat exchange module is at different temperatures for different treatment times.

Further, the computer program realizes when executed by the processor:

C1, obtain the set initial temperature information, initial temperature duration information, target temperature information and target temperature duration information;

C2, obtain the temperature information sensed by the first sensor, and determine whether the sensed temperature reaches the initial temperature, if it reaches the initial temperature, start recording the duration, and when the set initial temperature duration is reached, control the semiconductor thermal The exchange module continues to cool down or heat up, and according to the temperature information sensed by the first sensor, determines whether the sensed temperature reaches the target temperature, if it reaches the target temperature, it starts recording the duration, if the duration reaches the target temperature duration, then Go to the next step C3;

C3, stop the cooling or heating operation of the semiconductor heat exchange module.

Further, in the C1, it includes obtaining the set number of cycles, and in the C2, if the duration reaches the target temperature duration, it is judged whether the set number of cycles is satisfied, and if not, then repeat the execution of C2 Until the set number of cycles is satisfied, the next step C3 is executed.

Further, the computer program realizes when executed by the processor:

Get the set laser treatment time;

Instruct the laser generator to emit the corresponding laser;

Determine whether the duration of the laser emitted by the laser generator reaches the set treatment time;

When the set treatment time is reached, the laser treatment ends.

Further, when the computer program is executed by the processor, it also implements:

It is judged whether it is an alternate treatment mode, and if so, after the laser treatment is ended, the handle is activated to realize the alternate treatment between the laser handle and the handle.

Compared with the prior art, the beneficial technical effects of the present application are as follows:

(1) The rehabilitation system of the present application stores a preset computer program in the memory in advance, the user inputs the treatment plan on the input device, and the processor retrieves the computer program corresponding to the treatment plan and executes the corresponding command, so that the computer program is executed by the user. When the processor is executed, the handle is controlled to operate at a preset temperature and a corresponding preset temperature duration, so as to achieve the purpose of rapidly increasing and decreasing the temperature of the handle.

(1) The handle provided in this application utilizes the Peltier effect to directly act on the surface of the human body through the heat conduction part that satisfies the biocompatibility of the semiconductor heat exchange module. Compared with traditional wrapping bags (cold and hot compress bags), it can achieve rapid cooling or The purpose of heating, and avoid the waterway blockage problem of traditional wrapping bags.

(2) Further, the design of the handle cancels the design of the traditional wrapping bag, making the treatment more portable and compact. The user can directly treat the part that needs to be treated, and the movable way of the handle improves the comfort, convenience and flexibility of the patient's use.

(3) Further, compared with the design of the traditional wrapping bag, the design of the handle eliminates the need for large-area treatment, so that the treatment site and treatment area are more targeted, so that the skin without the patient can avoid being stimulated by cold therapy or heat therapy .

(4) Further, the design of the handle can facilitate the patient to self-treat according to the situation, and the first sensor provided in the handle can accurately feedback the current treatment temperature acting on the patient, so that the patient can adjust in real time according to the self-feeling.

(5) Further, the setting of the laser handle used together with the handle enables the application to have two treatment methods: laser therapy and hot and cold compress therapy, and the laser therapy method used for body surface irradiation can use biological effects to relieve muscle pain, It makes the treatment more scientific and reasonable, and combines the two dimensions of light and temperature adjustment for compound treatment, which enriches the treatment methods.

(6) Correspondingly, the rehabilitation system provided by the present application can realize the rapid increase/decrease of the temperature of the handle and the reciprocating cycle, which can rapidly decrease the temperature from a certain initial temperature or at the set time within a set time. Within a certain time, the temperature is rapidly lowered from a certain initial temperature to the target temperature and then raised to the initial temperature, and the reciprocating cycle can effectively improve the treatment effect.

Description of drawings

FIG. 1 shows a schematic diagram of a display interface in an embodiment of the present application.

FIG. 2 shows a schematic structural diagram of the handle part of the handle according to the embodiment of the present application and the circulation part connected thereto.

FIG. 3 shows a schematic structural diagram of the first embodiment of the rehabilitation system including the handle of FIG. 1 of the present application.

FIG. 4 shows a schematic structural diagram of the connection between the laser handle and the host according to the embodiment of the present application.

FIG. 5 shows a schematic structural diagram of the second embodiment of the rehabilitation system including a handle and a laser handle of the present application.

FIG. 6 shows a schematic flowchart of the operation of the laser handle controlled by the rehabilitation system in the embodiment of the present application.

FIG. 7 shows a schematic flowchart of the cold and thermal shock operation performed by the control handle of the rehabilitation system in the embodiment of the present application.

FIG. 8 shows a schematic flow chart of the control handle of the rehabilitation system performing the cooling and heating cycle operation in the embodiment of the present application.

FIG. 9 shows a schematic diagram of the treatment device in the embodiment of the present application.

FIG. 10 shows a schematic diagram of the handle in the embodiment of the present application.

FIG. 11 shows a schematic diagram of the laser handle in the embodiment of the present application.

Figure 12 shows a plurality of alternatively used light guide ends of the laser handle in embodiments of the present application.

FIG. 13 shows a schematic diagram of the display interface in the muscle analgesia treatment scheme in the embodiment of the present application.

Labels in the drawings: 1, heat conduction part; 2, first sensor; 3, semiconductor heat exchange module; 4, water circuit; 5, water pump; 6, heat dissipation part; 7, second sensor; 8, circuit; 9, PC; 10. Adjustable constant current source; 11. Laser generator; 12. Third sensor; 13. First motherboard; 1301, First interface; 1302, Second interface; 1303, SPI interface; 1304, RS485 interface; 1305, processor; 14, power board; 1401, chip; 1402, first inverter; 1403, second inverter; 1404, power supply; 15, display unit; 16, host; 17, laser handle connection end; 18, Power interface; 19, handle connection end; 20, vent; 100, handle part; 101, connection part; 300, light guide end; 301, connection end; 40, first shell; 41, second shell; 500 , display interface; 501, small area options; 52, medium area options; 503, large area options; 504, bone options; 505, muscle options.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present application clearer, a cold and hot compress therapy device and a system including the device proposed in the present application will be further described below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present application will become more apparent from the description below. It should be noted that the accompanying drawings are in a very simplified form and all use inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present application. For the purpose, features and advantages of the present application to be more clearly understood, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the technology, and are not used to limit the implementation of this application. Therefore, it does not have technical substantive significance. Any modification of structure, change of proportional relationship or adjustment of size should still fall within the scope of this application without affecting the effect that the application can produce and the purpose that can be achieved. The scope of the disclosed technical content can be covered.

The first embodiment of the rehabilitation system:

The rehabilitation system provided by the present application includes a memory, a processor, an input part, a handle and a circulation part connected to the handle, wherein a computer program is stored in the memory, the input part is used for the user to input a treatment plan, the The processor is used for retrieving a computer program corresponding to the treatment plan, and when executed by the processor, the computer program controls the handle to operate at a preset temperature and a corresponding preset temperature duration.

The handle part provided in the present application can be operated by a user or a doctor while moving, and can directly act on the body requiring cold therapy or heat therapy, such as movement on the surface of the human body. Compared with the large-area treatment of the traditional wrapping bag, the above-mentioned handle part makes the treatment method more targeted, so that the normal skin will not be stimulated by cold or heat.

The following first describes the specific structure of the handle:

Specifically, please refer to FIG. 2 and FIG. 10 , the handle includes a handle portion 100 and a connecting portion 101 , the interior of the handle portion 100 includes a heat conducting portion 1 and a semiconductor heat exchange module 3 , and the semiconductor heat exchange module 3 is used for Cooling or heating and acting on the surface of the human body through the heat conduction part 1 . Preferably, the heat-conducting portion 1 is made of heat-conducting metal. The connecting portion 101 is used to connect the handle portion 100 with other power supplies, fluid circulation devices and other equipment. In the preferred embodiment of the present application, the connecting portion 101 is tubular, and the interior of the connecting portion 101 is used to set the water channel 4 / water circulation channel and circuit 8 / power circuit and connect the handle part 100 to the circulation part. Of course, in some embodiments, the water circuit 4 and the circuit 8 may be separately provided in two independent connecting parts 101 . During treatment, the heat conducting portion 1 and the semiconductor heat exchange module 3 are closer to the target treatment site than the connecting portion.

Specifically, please refer to FIG. 2 , the semiconductor heat exchange module 3 is preferably a semiconductor refrigerator (TEC), which is made by using the Peltier effect of semiconductor materials. When it is even, the endothermic and exothermic phenomena will occur at the joints of different semiconductors with different current directions, so as to achieve heat exchange.

Specifically, the inside of the handle further includes a first sensor 2, and the first sensor 2 is located between the heat-conducting portion 1 and the semiconductor heat exchange module 3, so as to sense the current temperature of the heat-conducting portion 1, so as to accurately Detects the temperature applied to the surface of the human body.

The handle part 100 of the handle is used for hand-held operation by the user, and the user can move and operate the handle part 100 on the surface of the target treatment part according to different target treatment parts. With this setting, it is convenient for the user to flexibly move the handle at any time according to the different needs of each treatment site. Since the semiconductor exchange module 3 is arranged in the handle portion 100, and the handle portion 100 directly acts on the target treatment portion, that is, the semiconductor heat exchange module 3 is arranged close to the treatment site, and does not need to be heated through the connection portion. Therefore, the semiconductor exchange module 3 directly acts on the treatment site through the heat conduction part 1 during treatment, so that the purpose of quickly applying the adjusted temperature directly to the treatment site can be achieved; in addition, based on the above setting of the semiconductor module 3, The function of rapid heating and cooling treatment is realized, so that the volume of the handle portion 100 can be reduced to a size that is convenient for the user to hold, and the treatment portion can be changed continuously by moving in real time. However, in the prior art, the semiconductor exchange module is usually arranged away from the treatment site, that is, the semiconductor exchange module and other fluid exchange modules are arranged in the same area, and then the regulated temperature is transferred to the treatment site through the connecting part. This type of device Not only cannot the adjusted temperature be applied to the treatment part quickly, but also the volume is large, so it can only be used for fixed part treatment, and cannot be moved at any time, so it cannot realize the flexible application of hand-held operation.

Please refer to FIG. 3 , which schematically shows the internal circuit of the rehabilitation system according to the first embodiment of the present application. The rehabilitation system includes: the above-mentioned handle, the first main board 13 for controlling the operation state of the handle, and the above-mentioned The power supply board 14 connected to the first main board 13 is used for supplying power to the semiconductor heat exchange module 3 via the power supply 1404 . The rehabilitation system is used to perform four treatment modes: cold therapy, heat therapy, cold and heat shock therapy (relative to cold therapy or heat therapy, the temperature rises and falls faster) and cold and heat cycle therapy.

Please continue to refer to FIG. 1 and FIG. 3 . Specifically, a processor 1305 , a memory, at least one ADC interface and at least one RS485 interface 1304 are respectively provided on the first motherboard 13 . Preferably, the above-mentioned processor 1305 is a processor equipped with a Cortex M3 core and is connected to the input part. The above-mentioned memory is used to store a computer program, the input part is used for a user to input a treatment plan, and the processor 1305 is used to call up a computer program corresponding to the treatment plan, so that the computer program is executed by the processor. Different treatment regimens are implemented to achieve the treatment of the patient. In the rehabilitation system, the ADC interface includes a first interface 1301 (ADC1) and a second interface 1302 (ADC2), and the input part is preferably a display screen, which is the display unit 15 in this embodiment. The display screen has a display interface 500 for the user to observe and operate for selecting a corresponding treatment plan.

Further, please refer to FIG. 1 , the treatment plan displayed on the display interface 500 includes a detumescence treatment plan and an analgesic treatment plan.

The following is a detailed description of the process of the detumescence treatment plan as follows:

Please continue to refer to Figure 1:

E1: The user inputs a detumescence treatment plan on the display interface 500, and at the same time selects any one of the small area option 501, the medium area option 502, or the large area option 503 in the detumescence treatment plan neutron display interface according to the disease condition. In this process, the user selects The small area option 501 is taken as an example for description, and the area range of the small area is less than or equal to 10×10 cm.

E2: The processor 1305 retrieves the treatment plan for reducing swelling according to the input small area option 501 and retrieves the treatment plan corresponding to the treatment area from the memory, and the processor 1305 obtains the treatment area set under the treatment plan and the treatment plan corresponding to the treatment area. Treatment duration information and control the semiconductor heat exchange module 3 to pass forward current or reverse current to heat up or cool down. Specifically, please refer to the treatment plan for reducing swelling in Table 1 below. In this treatment plan, the processor 1305 obtains the treatment plan for reducing swelling in the small area option 501, and it is necessary to control the semiconductor heat exchange module 3 to pass forward current to increase temperature The temperature reaches a high temperature of 30-45°C, preferably 40°C in this embodiment, and the duration of the high-temperature temperature is 17s-200s, preferably 1min in this embodiment. Then, the semiconductor heat exchange module 3 is controlled to pass reverse current to cool down to a low temperature of 0-10°C, preferably 5°C in this embodiment, and the duration of the low-temperature temperature is 15s-200s, preferably 1min in this embodiment.

E3: Obtain sensing initial temperature information, specifically, the first sensor 2 measures the temperature of the heat conduction portion 1 and sends the sensed initial temperature information to the processor 1305.

E4: The processor 1305 determines whether the required treatment temperature corresponding to the small area option 501 in step E2 is reached, that is, the initial temperature according to the obtained sensing initial temperature information [for example, when hyperthermia is treated first and then hypothermia is treated, the initial temperature is mid-hyperthermia In the case of hyperthermia treatment, the initial temperature is 0°C in the hypothermic temperature], and the current temperature is displayed to the user through the display unit 15. If the required treatment temperature set in step E2 is reached, a prompt to use The patient starts the treatment and proceeds to step E5, and if the initial temperature set in step E2 is not reached, then proceeds to step E3.

E5: The user can move and operate the handle, so that the heat-conducting part 1 of the handle is in contact with the surface of the affected area and performs treatment. In this treatment mode, the processor automatically switches between high temperature and low temperature for alternate treatment according to a preset duration, and controls the alternate treatment. The number of cycles, for example, 2 times. When switching between high temperature and low temperature, the controller does not record the time; for a small area, the first high temperature and then low temperature treatment is used as an example, and the high temperature lasts for 1 min and then the low temperature lasts for 1 min, until the processor 1305 detects that the number of cycles is satisfied End treatment.

Further, in this embodiment, the heat conducting part 1 can perform high temperature temperature first and then low temperature temperature, or can perform low temperature temperature first and then perform high temperature temperature, as long as the treatment area and duration in Table 1 are satisfied.

In other anti-swelling treatment schemes, after the user selects a medium area or a large area, the processor executes the corresponding duration and switches between high temperature and low temperature, as shown in Table 1, and the execution process is the same as the above steps.

Correspondingly, in other embodiments of the present application, when the user selects the medium area option 502 in the display interface 500, the process is the same as steps E1 to E5, and the area range of the medium area is greater than 10×10 cm and less than or equal to 12 ×12cm, under the medium-area treatment plan, the semiconductor heat exchange module 3 is the same as the small-area treatment plan in the range of high-temperature temperature, the preferred time, the range and preferred time of low-temperature temperature, and the range of high-temperature duration and low-temperature duration. , in the treatment plan of the medium area in this embodiment, the high temperature duration of the semiconductor heat exchange module 3 is selected as 2min at high temperature, the duration at low temperature is 2min, and the total duration is 4min.

Correspondingly, in other embodiments of the present application, when the user selects the large area option 503 in the display interface 500, the process is the same as steps E1 to E5, and the area of the large area is larger than 12×12 cm, and the large area treatment Under the scheme, the range of high temperature, the preferred time, the range of low temperature and the preferred time, and the range of high temperature duration and low temperature duration of the semiconductor heat exchange module 3 are the same as those of the small area treatment scheme, the difference is that in this embodiment, the large area In the treatment plan of the semiconductor heat exchange module 3 at the high temperature, the high temperature duration is 3 minutes, the low temperature duration is 3 minutes, and the total duration is 6 minutes.

Further, it can be seen from the above content that in the anti-swelling treatment plan, when the treatment area is larger, the duration of the high temperature temperature and the low temperature temperature will also increase at the same time.

Table 1 Treatment options for swelling

Similarly, the following detailed description of the process of analgesic treatment plan is as follows:

F1: The user inputs an analgesic treatment plan on the display interface 500, and at the same time selects any one of the bone option 504 and the muscle option 505 in the analgesic treatment plan neutron display interface according to the condition, please refer to Table 2. In this process, the user selects a muscle The option 505 is taken as an example for description. Correspondingly, in other embodiments of the present application, if the user selects the skeleton option 504, reference may be made to Table 3.

F2: The processor 1305 retrieves the treatment plan corresponding to the treatment site from the memory according to the muscle option 505 input by the user, the processor 1305 obtains the treatment duration information set under the treatment plan and controls the semiconductor heat exchange module 3-way Input forward current or reverse current to heat up or cool down. Specifically, please refer to the treatment plan for muscle analgesia in Table 2. In this treatment plan, the processor 1305 obtains the treatment plan for muscle analgesia and needs to control the semiconductor heat exchange module 3 to pass forward current to raise the temperature to a high temperature of 30~ 45°C, 40°C is selected in this embodiment, and the duration of the high temperature temperature is 17s-150s, which is selected as 2min in this embodiment. Then, the semiconductor heat exchange module 3 is controlled to pass reverse current to cool down to a low temperature of 0-10°C, which is 5°C in this embodiment, and the low-temperature temperature lasts for 15s-75s, which is 1min in this embodiment.

F3: Obtain sensing initial temperature information, specifically, the first sensor 2 measures the temperature of the heat conduction part 1 and sends the sensed initial temperature information to the processor 1305.

F4: The processor 1305 determines whether the required treatment temperature corresponding to the muscle option 505 in step F2, that is, the initial temperature, is reached according to the acquired sensing initial temperature information, and displays the current temperature to the user through the display unit 15. If it reaches the temperature in step F2 If the set treatment temperature is required, the user can be prompted to start treatment and enter step F5; if the initial temperature set in step F2 is not reached, enter step F3.

F5: The user can move and operate the handle, so that the heat-conducting part 1 of the handle is in contact with the surface of the affected area and perform treatment. In this treatment mode, the processor automatically switches between high temperature and low temperature for alternate treatment according to a preset duration, and controls the alternate treatment. The number of cycles, for example, 2 times. When switching between high temperature and low temperature, the controller does not record the time; please refer to Table 2. Taking high temperature and then low temperature treatment as an example, the high temperature lasts for 2 minutes and then the low temperature lasts for 1 minute, waiting for the processor 1305 to detect End the treatment when the number of cycles is met. Referring to FIG. 13 , in the above operation process, the display interface 500 continuously displays the preset temperature information and the duration information corresponding to the preset temperature.

Further, please refer to Table 2 and Table 3, in the treatment plan of muscle pain relief, the duration of high temperature temperature is required for a long time. In the skeletal analgesic regimen, the duration of hypothermia was longer, and the total duration of the skeletal analgesic regimen was longer than the total duration of the muscle analgesic regimen.

Table 2 Treatment options for muscle pain

Table 3 Treatment options for bone pain

After starting the treatment, the display interface of the display device simultaneously displays the treatment process, as shown in FIG. 13 , the information displayed during the muscle analgesia treatment, including the current temperature, the duration and the number of cycles.

Further, a chip 1401 and at least one inverter are respectively arranged on the power board 14, the chip 1401 is an ARM chip and is used for connecting to the first main board 13 through the RS485 interface 1304 for receiving the first main board 13 Based on the instructions sent by the processor 1305 , the inverter is used to control the working mode of the semiconductor heat exchange module 3 via the instructions of the processor 1305 . The inverter includes a first inverter 1402 and a second inverter 1403, wherein the chip 1401 is connected in communication with the semiconductor heat exchange module 3 through the first inverter 1402 to control the direction of the current flowing into the semiconductor heat exchange module 3 Cooling or heating is performed, and the time required for cooling or heating is controlled by controlling the magnitude of the current flowing into the semiconductor heat exchange module 3 .

Please refer to FIG. 3 , the above-mentioned rehabilitation system further includes a display unit 15, the display unit 15 is connected to the SPI interface 1303 provided on the first main board 13 for displaying the treatment mode, the current treatment temperature and the treatment time and can be selected by The graphical interface of the device sends control instructions to the processor 1305, and the processor 1305 executes the corresponding instructions. Preferably, in the rehabilitation system provided by this embodiment, the display unit 15 is an LCD display screen, and the LCD display screen feeds back the temperature data fed back by the temperature sensor in real time. Optional graphical interface to issue control commands.

Please refer to FIG. 1 , the rehabilitation system in this embodiment includes the above-mentioned handle and a circulation part connected with the handle, and the circulation part is arranged outside the handle and connected with the handle for Electric power is supplied to the semiconductor heat exchange module 3 , and a fluid, such as water, is transferred to achieve heat exchange with the semiconductor heat exchange module, so as to realize cooling or heating of the semiconductor heat exchange module 3 . By controlling the electric energy and fluid provided by the circulating part to the handle, the rapid temperature rise and fall of the handle can be realized.

Referring to FIG. 2 , the circulation part is connected to the handle part 100 , which includes a water pump 5 for driving the liquid circulation in the water channel 4 and a heat dissipation part 6 for heat exchange with the water channel 4 . The water pump 5 and the heat dissipation part 6 are connected to the semiconductor heat exchange module 3 through the water channel 4 to form a heat exchange circuit. Specifically, the above-mentioned water channel 4 is used for exchanging energy for the semiconductor heat exchange module 3 to promote the heating or cooling operation of the semiconductor heat exchange module. Preferably, in the rehabilitation system provided in this embodiment, the heat dissipation part 6 is a heat dissipation fin with a fan. The circulation part also includes a second sensor 7, the second sensor 7 is arranged in the circulation loop between the semiconductor heat exchange module 3, the water pump 5 and the heat dissipation part 6, so as to detect the liquid in the waterway 4 flow rate. Preferably, the second sensor 7 in the rehabilitation system provided in this embodiment is a flow rate sensor.

Please refer to FIG. 3. Specifically, the specific operation process of the rehabilitation system will be introduced as follows:

The above-mentioned first interface 1301 is used for receiving the temperature information fed back by the first sensor 2, and after corresponding processing by the processor 1305, the temperature information is displayed on the LCD display screen in real time through the SPI interface 1303. Therefore, the user or doctor will be able to know the temperature of the semiconductor heat exchange module acting on the surface of the human body through the display screen. The above-mentioned second interface 1302 is used to receive the flow rate information fed back by the flow rate sensor, so as to judge the flow rate of the water flow and thus the current heat exchange situation. The above-mentioned flow rate sensor measures the liquid flow rate in the water circuit 4 in real time and feeds it back to the processor 1305. The processor 1305 controls the speed of the temperature change of the handle to reach the set temperature by controlling the flow rate of the liquid.

Further, the chip 1401 is connected to the water pump 5 through the second inverter 1403 , and can control the input water pump 5 through the instructions sent by the processor 1305 , thereby controlling the flow rate of the liquid in the water circuit 4 .

Further, the following describes the cooling or heating principle of the semiconductor heat exchange module 3 as follows:

Cooling process: the semiconductor heat exchange module 3 is supplied with a forward current, using the Peltier effect to reduce the temperature on the side of the handle portion 100 close to the surface of the human body, and the other side of the handle portion 100 away from the body surface, such as the other side away from the surface of the human body. The temperature rises on one side. The circulation part is started, the water pump 5 draws out the liquid whose temperature has increased in the water channel 4 and flows into the heat dissipation part 6 through the water channel 4, and the high temperature liquid, such as water, is dissipated by the heat sink/fan of the heat dissipation part, so that the high temperature liquid in the water channel 4 is dissipated. The temperature drops, and then the liquid with the reduced temperature in the water channel 4 returns to the high temperature side of the semiconductor heat exchange module 3 through the water pump 5, and circulates back and forth, thereby lowering the other side of the handle portion 100 away from the body surface.

Heating process: The semiconductor heat exchange module 3 is supplied with a reverse current, using the Peltier effect to increase the temperature of one side of the handle close to the surface of the human body, while the temperature of the other side of the handle far from the surface of the human body decreases. The water pump 5 extracts the liquid with reduced temperature in the water channel 4 and flows into the heat dissipation part 6 through the water channel 4, and the temperature in the air is brought into the water channel through the heat sink/fan of the heat dissipation part 6, so that the temperature of the low-temperature liquid in the water channel 4 rises, and then The liquid in the water passage 4 returns to the low temperature side of the semiconductor heat exchange module 3, and circulates back and forth.

Further, the rehabilitation system has a thermal shock therapy mode and a cycle therapy mode. The user or the user can select the relevant treatment mode through the display unit 15, and the processor 1305 executes the relevant instructions according to the user's selection. The specific execution process is as follows:

Please refer to Figure 7, the process of the cold and heat shock therapy mode is as follows:

S1: Acquire the set initial temperature information, initial temperature duration information, target temperature information and target temperature duration information. Specifically, the user selects the hot and cold shock therapy mode through the LCD display screen, and enters the required treatment in the display screen. temperature, that is, setting the initial temperature and the required duration of the initial temperature, and inputting the target temperature and the required duration of the target temperature in the display screen. The treatment temperature information and time information control the semiconductor heat exchange module 3 to pass forward current or reverse current to heat up or cool down.

S2: Obtain sensing initial temperature information, specifically, the first sensor 2 measures the temperature of the heat conduction part 1 and sends the sensed initial temperature information to the processor 1305.

S3: The processor 1305 judges whether the required treatment temperature, that is, the initial temperature described in step S1, is reached according to the acquired sensing initial temperature information, and displays the current temperature to the user through the display unit 15. If it reaches the setting in step S1 If the required treatment temperature is reached, the user can be prompted to start treatment and proceed to step S5, and if the initial temperature set in step S1 is not reached, proceed to step S4.

S4: Control the semiconductor heat exchange module 3 to continuously lower/raise the temperature until the temperature detected by the first sensor 2 satisfies the set initial temperature, and then proceed to step S5.

S5: The user can move and operate the handle, so that the heat-conducting part 1 of the handle is in contact with the surface of the affected area and the initial temperature is performed to start treatment. In this treatment mode, the handle does not need to be moved out of the affected area of the patient and needs to maintain the initial temperature set in step S1 for a continuous period of time. time, and the next step is performed after the processor 1305 detects that the set initial temperature duration is satisfied.

S6: Control the semiconductor heat exchange module 3 to continue cooling/heating until the temperature detected by the first sensor 2 satisfies the set target temperature, and then step S7 is entered. In this step, the handle does not need to be removed from the patient's affected area and can continue to cover the patient's affected area.

S7: The heat-conducting portion 1 of the handle continues to contact the surface of the affected area and executes the target temperature to start treatment. In this treatment mode, the handle does not need to be moved out of the affected area of the patient and needs to maintain the duration of the target temperature set in step S1, until the processor 1305 detects that the temperature is satisfied The treatment ends after the set target temperature duration.

In another embodiment of the present application, the thermal shock therapy mode may also execute the target temperature first and then execute the initial temperature, and the sequence of the target temperature and initial temperature can be replaced according to different patients.

Referring to FIG. 8 , the difference between the cyclic therapy mode and the thermal shock therapy mode is that the number of cycles is also set. After the target temperature duration is satisfied, the processor 1305 determines whether the set number of cycles is satisfied, and when the set number of cycles is satisfied End the treatment when the set number of cycles is not met, and return to the cycle for execution.

The cold therapy and heat therapy modes can directly perform therapy through the target temperature set by the user, which will not be described in detail here.

The second embodiment of the rehabilitation system:

The difference between the second embodiment and the first embodiment is that the rehabilitation system is also configured with a laser handle and a host 16 connected with the laser handle, wherein the host 16 is connected with the laser handle, and the specific structure of the host 16 provided with the laser handle is described below:

Please refer to FIG. 4 and FIG. 5, which respectively show the structural block diagram of the host 16 and the laser handle and the structural block diagram including the host 16, the laser handle and the rehabilitation system described in the first embodiment above. A mainboard 13 is connected to the RS485 interface 1304. The overall structure of the mainboard is substantially the same as that of the mainboard in the first embodiment described above, but the two functions are substantially different. In the rehabilitation system provided in this embodiment, two RS485 interfaces 1304 are configured on the first motherboard 13 , one of which is used to connect to the PC 9 on the host 16 , and the other is used to connect to the ARM chip on the power board 14 .

Please refer to FIG. 4 , specifically, the host 16 includes a control board and a laser generator 11 , the control board is used to connect with the first motherboard 13 via the RS485 interface 1304 , and the signal output end of the control board is connected to the laser generator 11 . The signal input end is connected to control the laser generator 11 to emit or turn off the laser light, or adjust the pulse of the laser light, etc., so as to realize different laser treatments. The signal output end of the laser generator 11 is connected to the signal input end of the laser handle through an optical fiber. Specifically, in the rehabilitation system provided in this embodiment, a PC9 and an adjustable constant current source 10 are provided on the control board, wherein the signal input port of the PC9 is connected to the first main board 13 through the RS485 interface 1304 for receiving or sending two-way communication. instruction. The signal output port of the PC9 is connected with the signal input port of the adjustable constant current source 10 , and the signal output port of the adjustable constant current source 10 is connected with the signal input port of the laser generator 11 .

Further, please refer to FIG. 4 , the host 16 further includes a third sensor 12, and the third sensor 12 is connected between the laser generator 11 and the PC9 of the control board for detecting the temperature of the laser generator 11 and feeding it back to the control panel. Preferably, the third sensor 12 is also a temperature sensor, which is used to detect the temperature of the laser generator 11 and transmit the temperature information to the PC 9 .

As shown in FIG. 11 , the laser handle includes a light guide end 300 and a connection end 301 . The light guide end 300 is detachably connected to the connection end 301 and includes a plurality of interchangeable light guide ends 300 of different sizes. (as shown in FIG. 12 ), in order to adjust different laser irradiation ranges, the connecting end 301 includes an optical fiber for connecting with the laser generator 11 . The laser light emitted by the laser generator 11 is transmitted to the light guide end 300 through the optical fiber/light guide, and the laser output from the light guide end 300 irradiates the surface of the human body for laser treatment.

Preferably, in the rehabilitation system provided in the second embodiment, the PC 9 is a Windows-based X86 platform and is used for communicating with the first main board 13 for communicating with the LCD display screen and receiving instructions and laser control. The software part of the rehabilitation system is solidified in the PC9, wherein the PC9 can also read the temperature information of the third sensor 12 for overheat protection.

Preferably, in the rehabilitation system provided by the second embodiment, the above-mentioned adjustable constant current source 10 is used to drive the laser generator 11. After the laser generator 11 receives the control signal of the PC9, the control signal is converted into a current signal, and the The laser generator 11 is controlled.

The difference between the rehabilitation system in this embodiment and the treatment mode in Embodiment 1 is that it also has a laser treatment mode. The laser treatment mode uses biochemical principles for treatment. Please refer to FIG. 6 , and the specific process is as follows:

B1: The processor 1305 obtains the set laser treatment time, specifically, the user selects the laser treatment mode through the LCD display screen, and inputs the time required for treatment in the LCD display screen.

B2: Please refer to FIG. 4 and FIG. 5, the processor 1305 converts the above input information into commands and feeds them back to the PC9, and the PC9 controls the adjustable constant current source 10 to control the laser generator 11 to emit corresponding laser light to realize the corresponding treatment.

B3: After starting the laser treatment, the PC9 automatically counts the treatment time, and judges whether the set treatment time is reached through the processor 1305. If the treatment time has not been reached, return to step B2.

B4: If the set treatment time is reached, the laser treatment will end.

Correspondingly, the rehabilitation system described in the present application is not limited to a single handle or a single laser handle for treatment. According to the treatment needs, the laser handle and the handle can be turned on at the same time or alternately, that is, the alternate treatment mode is adopted, so as to perform the laser and cold, hot, cold and hot shock alternate treatment on the patient, such as sprain, the inventor of the present application found that in 48 Within hours, the treatment method is the cold compress used on the medical handle combined with low-dose continuous laser treatment, and the sprain after 48 hours is treated with hot compress on the medical handle combined with high-dose laser treatment. This treatment method can achieve better results. The therapeutic effect helps the patient to recover quickly. Similarly, for other different traumas, the laser handle and the handle can be used for alternate treatment for different times.

Computer programs corresponding to the various treatment modes of the medical system described above are pre-stored in the memory (not shown) of the medical system, and the different treatment modes are realized when the processor executes the computer program.

Further, as shown in FIG. 9 , which is a schematic diagram of a treatment device including the rehabilitation system according to the above first and second embodiments of the present application, the treatment device further includes a first casing 40 and a In the preferred embodiment of the present application, the second casing 41 is located above the first casing 40, and the above-mentioned display unit 15 is disposed above the second casing 41, The manner in which the three components are stacked in this way increases the overall height of the treatment device, so as to meet the operating height of the doctor or the patient. The second housing 41 is provided with a laser handle connecting end 17 , and the connecting end 301 of the laser handle (as shown in FIG. 11 ) can be connected to the laser handle connecting end 17 for connecting with the second housing 41 The internal circuit for controlling the operation of the laser handle is connected, for example, to the host 16 as shown in FIG. 3 disposed in the second housing 41 , so as to control the laser handle to perform corresponding treatment.

Further, as shown in FIG. 9 , the first housing 40 of the rehabilitation system described in the present application has a power interface 18 , and the power interface 18 includes an alternating current power interface and a direct current power interface, which are used to provide current for the power board 14 to Provides power to the electronics within the rehabilitation system.

Further, as shown in FIG. 9 , the rehabilitation system of the present application has a handle connecting end 19 , and the handle part 100 can be connected to the handle connecting end 19 through the connecting part 101 , and then connected to the first housing 40 for controlling the system. The circuit of the handle, for example, is connected to the loop portion as shown in FIG. 1 provided in the first housing 40, or the circuit for controlling the handle as described above in FIG. 4 .

As mentioned above, the circuit for controlling the laser handle and the circuit for controlling the medical handle are respectively arranged in the second casing 41 and the first casing 40, so that on the one hand, the whole rehabilitation system can be provided. In the case of vertical height, the lateral volume of the rehabilitation system is effectively reduced, which is convenient for placement and use. On the other hand, it can avoid the mutual influence of the two circuits and facilitate maintenance, especially the influence of the waterway in the circulation part on the laser control circuit. .

Further, as shown in FIG. 9 , the rehabilitation system of the present application has a vent 20 on the first housing 40 that is in fluid communication with the semiconductor heat exchange module, and the vent 20 is used for the heat sink in the heat dissipation part 6 . / Fan and the heat dissipation of the fluid, for example, the fluid is the air flow generated by the heat sink/fan in the heat dissipation part 6, and the air with higher temperature circulates from the inside of the system to the outside of the system to achieve heat dissipation.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification. Although the arrows in the drawings of the present application indicate the connection relationship between the components in the circuit, they do not represent the only signal transmission direction between the components. Bidirectional transmission, which is not limited in this application.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are relatively specific and detailed, but should not be construed as a limitation on the scope of the patent application. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can also be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the appended claims.

Claims

A rehabilitation system is characterized in that: the rehabilitation system comprises a handle and a circulation part connected with the handle, the handle comprises a hand-held part and a connection part connected with the hand-held part, the hand-held part comprises a heat conducting part and A semiconductor heat exchange module, the heat conduction part is connected to the semiconductor heat exchange module, the semiconductor heat exchange module is used for cooling or heating and acts on the body surface through the heat conduction part, and the hand-held part is used for the user The hand-held part is held and moved to operate on the surface of the target treatment site during treatment, and the connecting part is used to connect the hand-held part to the circulating part for supplying electric energy to the semiconductor heat exchange module; during treatment, the semiconductor heat exchange A module is closer to the target treatment site than the connecting portion.
The rehabilitation system according to claim 1, characterized by comprising a memory, a processor, and an input part, wherein a computer program is stored in the memory, the input part is used for a user to input a treatment plan, and the processor is used to adjust the A computer program corresponding to the treatment plan is taken, and when executed by the processor, the computer program controls the handle to operate at a preset temperature and a corresponding preset temperature duration.
The rehabilitation system according to claim 2, wherein the treatment plan includes detumescence treatment and analgesic treatment.
The rehabilitation system according to claim 2, wherein the anti-swelling treatment plan includes treatment plans for different treatment areas, and the processor is configured to control the handle according to the treatment area selected by the input part to use a corresponding preset temperature and preset temperature duration to operate.
The rehabilitation system of claim 4, wherein the different treatment areas include a large area greater than 12 x 12 cm, a medium area greater than 10 x 10 cm and less than or equal to 12 x 12 cm, and a large area less than or equal to 10 x 10 cm small area.
The rehabilitation system according to claim 4, wherein: in the anti-swelling treatment plan, the preset temperature includes a high temperature temperature and a low temperature temperature, wherein the high temperature temperature range corresponding to the treatment area is 30-45°C , the duration of the high temperature temperature is 17-200s;

The low temperature temperature range corresponding to the treatment area is 0 to 10° C., and the low temperature duration of the low temperature temperature is 15 to 200 s.
The rehabilitation system according to claim 3, wherein the analgesic treatment plan includes treatment plans for different treatment parts, and the processor controls the handle to adopt a corresponding preset temperature according to the treatment part selected by the input part and preset temperature duration.
The rehabilitation system of claim 7, wherein the treatment site includes bone and muscle.
The rehabilitation system according to claim 8, wherein: in the plan for analgesic treatment of the muscles, the preset temperature includes a high temperature temperature and a low temperature temperature, and the high temperature temperature ranges from 30 to 45 °C, the duration of the high temperature is 17-150s; the range of the low temperature is 0-10°C, and the duration of the low temperature is 15-75s.
The rehabilitation system according to claim 8, wherein in the scheme for analgesic treatment of the bones, the preset temperature includes a high temperature temperature and a low temperature temperature, and the high temperature temperature ranges from 30 to 45 °C, the duration of the high temperature is 17-100s; the range of the low temperature is 0-10°C, and the duration of the low temperature is 100-200s.
The rehabilitation system according to claim 1, wherein the connection part comprises a water circuit and an electric circuit for connecting the hand-held part to the circulation part, and the circulation part comprises a water pump, a heat dissipation part and a second sensor , the water channel is in fluid communication with the water pump and the heat dissipation part, and the flow rate of the liquid in the water channel is detected by the second sensor.
The rehabilitation system according to claim 1, wherein the hand-held part comprises a first sensor disposed between the heat-conducting part and the semiconductor heat exchange module for sensing the current temperature of the heat-conducting part , and then detect the temperature applied to the body surface.
The rehabilitation system according to claim 1, wherein the rehabilitation system comprises a laser generator, a control board connected to the laser generator, and a third sensor, and the third sensor is connected to the laser generator and the control board, so as to detect the temperature of the laser generator and feed it back to the control board.
The rehabilitation system according to claim 13, wherein the rehabilitation system further comprises a laser handle, the laser handle comprises a connection end and a plurality of light guide ends with different sizes, each of the light guide ends is connected to the light guide end. The connecting end can be detachably connected for easy replacement.
The rehabilitation system according to claim 14, wherein the rehabilitation system further comprises a first casing and a second casing arranged in a stack, the circulation part is located in the first casing, and the laser generator in the second housing.
The rehabilitation system according to claim 15, wherein the first housing is provided with a handle connecting end for connecting with the handle and a vent in fluid communication with the semiconductor heat exchange module, and the first housing is provided with a handle connecting end for connecting with the handle The two shells are provided with a laser handle connecting end for connecting with the laser handle.
The rehabilitation system according to claim 16, wherein the rehabilitation system further comprises a display unit located on the first casing or the second casing, and the display unit is used to display the information of the rehabilitation system to the user. Different operation modes, and different operation modes for the user to select to operate the rehabilitation system, the different operation modes include at least one of cold therapy, heat therapy, cold and heat shock therapy, and cold and heat cycle therapy, in the cold In the thermal shock therapy mode, the user can instruct the semiconductor heat exchange module to last for different treatment times at different temperatures by operating the display unit.
The rehabilitation system of claim 2, wherein:

The hand-held part includes a first sensor disposed between the heat-conducting part and the semiconductor heat exchange module, so as to sense the current temperature of the heat-conducting part, and then detect the temperature applied on the body surface;

The computer program, when executed by the processor, implements:

C1, obtain the set initial temperature information, initial temperature duration information, target temperature information and target temperature duration information;

C2, obtain the temperature information sensed by the first sensor, and determine whether the sensed temperature reaches the initial temperature, if it reaches the initial temperature, start recording the duration, and when the set initial temperature duration is reached, control the The semiconductor heat exchange module continuously cools or heats up, and according to the temperature information sensed by the first sensor, determines whether the sensed temperature reaches the target temperature, if it reaches the target temperature, starts recording the duration, if the duration reaches the target temperature duration, then proceed to the next step C3;

C3, stop the cooling or heating operation of the semiconductor heat exchange module.
The rehabilitation system of claim 18, wherein:

In the C1, it also includes acquiring the set number of cycles, and in the C2, if the duration reaches the target temperature duration, judging whether the set number of cycles is satisfied, and if not, repeating the execution The C2 executes the next step C3 until the set number of cycles is satisfied.
The rehabilitation system of claim 13, wherein:

Also includes a memory in which a computer program is stored, and the computer program, when executed by the processor, implements:

Get the set laser treatment time;

instructing the laser generator to emit the corresponding laser;

Judging whether the duration of the laser emitted by the laser generator reaches the set laser treatment time;

If the set laser treatment time is reached, the laser treatment is ended.