WO2022133922A1 - 一种多频天线及通信设备 - Google Patents
一种多频天线及通信设备 Download PDFInfo
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- WO2022133922A1 WO2022133922A1 PCT/CN2020/139086 CN2020139086W WO2022133922A1 WO 2022133922 A1 WO2022133922 A1 WO 2022133922A1 CN 2020139086 W CN2020139086 W CN 2020139086W WO 2022133922 A1 WO2022133922 A1 WO 2022133922A1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
- H01Q5/42—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements using two or more imbricated arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/30—Arrangements for providing operation on different wavebands
- H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/106—Microstrip slot antennas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
- H01Q19/108—Combination of a dipole with a plane reflecting surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
- H01Q5/45—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements using two or more feeds in association with a common reflecting, diffracting or refracting device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
- H01Q5/48—Combinations of two or more dipole type antennas
Definitions
- the present application relates to the field of communication technologies, and in particular, to a multi-frequency antenna and a communication device.
- high-frequency antenna units and low-frequency antenna units are usually configured at the same time.
- the high-frequency antenna unit has a large signal transmission capacity, and the low-frequency antenna unit has strong signal attenuation resistance.
- the spacing between the high-frequency antenna elements and the low-frequency antenna elements is usually small.
- the electromagnetic wave radiated by the low-frequency antenna unit is coupled to the high-frequency antenna unit, a common mode resonance will be generated in the high-frequency antenna unit, so that a low-frequency induced current is excited on the radiation part and the reflection ground of the high-frequency antenna unit, and the The induced current further excites low-frequency electromagnetic waves.
- the low-frequency electromagnetic wave will have a combined effect with the electromagnetic wave directly radiated by the low-frequency antenna unit, resulting in deterioration of pattern parameters such as gain stability and polarization suppression ratio of the low-frequency antenna unit.
- the present application provides a multi-frequency antenna and a communication device to improve directional parameters such as polarization suppression ratio and gain stability of a low-frequency antenna unit in the multi-frequency antenna.
- the present application provides a multi-frequency antenna
- the multi-frequency antenna includes at least one low-frequency antenna unit and at least one high-frequency antenna unit arranged in the same antenna front, and there may be low-frequency antenna units arranged in close proximity. and the high-frequency antenna unit, and the maximum distance between the adjacent low-frequency antenna unit and the high-frequency antenna unit is less than 0.5 times the wavelength of the low-frequency antenna unit, which can be understood as the wavelength of the low-frequency antenna unit working in a vacuum.
- the multi-frequency antenna may include a reflector and a feeding structure.
- the reflector is provided with a slot, the slot defines a strip conductor, the strip conductor is a part of the reflector, and one end of the strip conductor can be connected to other parts of the reflector to realize the grounding of the strip conductor.
- the feeding structure includes a microstrip line for the high-frequency antenna unit in the multi-frequency antenna, the microstrip line is located on one side of the reflector, and at least part of the projection of the microstrip line on the reflector falls within the contour range of the strip conductor .
- the strip conductor forms a common mode suppression inductance structure, which can couple the electromagnetic waves radiated by the low frequency antenna unit to the high frequency antenna unit, and the common mode generated on the high frequency antenna unit
- the induced current is effectively suppressed, so that the directional parameters such as the polarization suppression ratio and gain stability of the low-frequency antenna unit are significantly improved.
- the strip conductor is formed by slotting the reflector, that is, the strip conductor is used as a part of the reflector, the processing technology is simple, and no additional structure and assembly processes are required, so the multi-frequency antenna has a relatively low manufacturing cost. Low.
- the influence of the common mode suppression inductance structure formed by the strip conductor on the impedance continuity of the microstrip line can be avoided, so as to ensure the continuity of the impedance everywhere in the microstrip line, thereby improving the impedance of the high-frequency antenna unit. Radiation efficiency and working stability.
- the specific wiring shape of the strip conductor is not limited.
- the strip conductor may be wired in a straight line, a serpentine shape, or a zigzag line.
- the length of the strip conductor in the wiring direction of the strip conductor can be greater than 1/20 of the wavelength of the low-frequency antenna unit (this wavelength can be understood as the wavelength of the low-frequency antenna unit operating in a vacuum environment). wavelength) to effectively suppress the common-mode induced current generated on the high-frequency antenna unit.
- the width of the strip conductor in the direction perpendicular to the wiring of the strip conductor, may be 0.2 to 5 times the width of the microstrip line.
- the width of the strip conductor in the direction perpendicular to the wiring of the strip conductor, is 0.1 mm ⁇ 10 mm.
- the ratio of the length of the strip conductor in the wiring direction to the width of the strip conductor in the direction perpendicular to the wiring direction of the strip conductor may be greater than 5:1.
- the inductance of the common mode suppression inductance structure formed by the strip conductor is relatively large, so that the common mode induced current can be effectively suppressed.
- the feeding structure when the feeding structure is specifically set, may further include a feeding line, and the feeding line is respectively connected with the microstrip line and the strip conductor, and is used for feeding the high-frequency antenna unit.
- the radiating part is fed.
- the feed line generally includes a signal conductor and a ground conductor, wherein the signal conductor can be connected with the microstrip line, and the ground conductor can be connected with the strip conductor.
- a through hole may be provided on the strip conductor, so that the feed line passes through the through hole and is connected to the microstrip line.
- the feeding structure may further include a feeding joint, the feeding joint and the microstrip line may be arranged on the same side of the reflector, and the microstrip line is connected to the feeding joint.
- the feeding joint can be connected with the feeding circuit, and the radio frequency signal can be transmitted to the radiation part through the feeding joint and the microstrip line for emission.
- the slot can be a continuous slot which is arranged continuously, and the shape formed by the slot has a bottom and an open end.
- the multi-frequency antenna may further include a first jumper, the first jumper is arranged between the bottom and the open end, and the projection of the first jumper on the reflection plate divides the slot into two parts.
- the strip conductor may be located between the first jumper and the microstrip line, or the microstrip line may be located between the first jumper and the strip conductor, and both ends of the first jumper are located in the slotted On the two sides facing away from the strip conductor, the two ends of the first jumper are respectively connected with the reflector.
- the slot forms a short-circuit structure at the position of the first jumper, which is equivalent to shortening the size of the slot along the wiring direction of the strip conductor, thereby effectively reducing the reflection of high-frequency signals from the slot.
- the back of the board is leaked to reduce the influence on the directional parameters such as the front-to-back ratio, polarization suppression ratio and gain stability of the high-frequency antenna unit.
- the slot can be a first U-shaped slot, and in this case, the projection of the microstrip line on the reflector is inserted into the area defined by the first U-shaped slot.
- the impedance of the microstrip line In order to make the impedance of the microstrip line continuous, thereby improving the radiation efficiency and working stability of the high-frequency antenna unit.
- the multi-frequency antenna can be set based on the structure of the PCB.
- the first jumper, the reflector, and the microstrip line can be respectively disposed on different conductor layers of the printed circuit board.
- both ends of the first jumper can be respectively opened through the The vias on the printed circuit board are connected to the reflector.
- the slot can also be configured as a discontinuous slot.
- the slot includes a first slot portion and a second slot portion that are separated from each other.
- the strip conductor includes a first conductor portion and a second conductor portion which are connected to each other.
- the slot defines the strip conductor, specifically: the first slot portion defines the first conductor portion, and the second slot portion defines the second conductor portion.
- the first slotted portion may be a closed annular slot
- the second slotted portion may be a second U-shaped slot with an opening at one end, and the opening of the second U-shaped slot faces the side away from the annular slot. Since the first slotted portion and the second slotted portion are two ends that are not connected to each other, the portion of the reflector on the peripheral side of the slotted portion is short-circuited between the first slotted portion and the second slotted portion, which is equivalent to In order to shorten the size of the slot along the wiring direction of the strip conductor, it can effectively reduce the leakage of high-frequency signals from the slot to the back of the reflector, so as to reduce the front-to-back ratio and polarization suppression ratio of the high-frequency antenna unit. and gain stability and other directional parameters.
- the multi-frequency antenna may further comprise a second jumper, and two ends of the second jumper are respectively connected with the first conductor part and the second conductor part.
- the equivalent inductance of the common mode suppression inductance structure formed by the strip conductor will not change, so that the common mode induced current generated on the high frequency antenna unit can be controlled. Effective suppression, so that the directional parameters such as polarization suppression ratio and gain stability of the low-frequency antenna unit can be significantly improved.
- the multi-frequency antenna can also be set based on the structure of the PCB.
- the reflector and the microstrip line can be disposed on different conductor layers of the printed circuit board, respectively, and the second jumper and the microstrip line are located on the same conductor layer of the printed circuit board.
- both ends of the first jumper can be connected to the reflector plate through via holes opened on the printed circuit board, respectively. In this way, increasing the number of conductor layers of the PCB can be avoided, thereby effectively reducing the cost of the multi-frequency antenna.
- the two jumpers are respectively disposed on both sides of the microstrip line.
- the continuity of the impedance of the microstrip line can be effectively improved, thereby improving the radiation efficiency and working stability of the high-frequency antenna unit.
- the impedance of the microstrip line can be controlled.
- the distance between the second jumper and the microstrip line may be 0.1 to 10 times the thickness of the dielectric substrate of the PCB.
- the reflective plate may also have a periodically arranged grid structure.
- the strip conductors may be arranged between the mesh structures.
- the strip conductors are arranged within a grid structure.
- the present application further provides a communication device, the communication device includes the multi-frequency antenna of the first aspect, and the communication device may be, but not limited to, a base station, a radar, or other devices.
- the common-mode suppression inductance structure formed by the strip conductor can effectively suppress the common-mode induced current generated on the high-frequency antenna unit in the multi-frequency antenna, so that the polarization suppression ratio of the low-frequency antenna unit and the Directional parameters such as gain stability have been significantly improved.
- the impedance of the microstrip line is continuous, which can improve the radiation efficiency and working stability of the high-frequency antenna unit.
- the manufacturing cost of the multi-frequency antenna is low, thereby effectively reducing the cost of the entire communication device.
- FIG. 1 is a schematic structural diagram of an antenna feeding system provided by an embodiment of the present application.
- FIG. 2 is a schematic structural diagram of a base station antenna provided by an embodiment of the present application.
- FIG. 3 is a schematic diagram of the distribution of a multi-frequency antenna provided by the present application.
- 4a is a directional diagram of a low-frequency antenna unit in an antenna array composed of a low-frequency antenna unit;
- FIG. 4b is a directional diagram of a low-frequency antenna unit in an antenna array composed of a low-frequency antenna unit and a high-frequency antenna unit;
- FIG. 5 is a schematic structural diagram of a multi-frequency antenna provided by an embodiment of the present application.
- FIG. 6 is a schematic partial structure diagram of a multi-frequency antenna provided by an embodiment of the present application.
- FIG. 7 is a schematic diagram of an equivalent circuit formed at a strip conductor provided by an embodiment of the present application.
- FIG. 8 is a top view of a reflector provided by an embodiment of the application.
- FIG. 9 is an exploded diagram of a multi-frequency antenna provided by an embodiment of the present application.
- FIG. 10 is a cross-sectional view of a multi-frequency antenna provided by an embodiment of the application.
- 11a is a schematic structural diagram of an antenna array consisting of two low-frequency antenna units provided by the application;
- Figure 11b is a cross-sectional view of Figure 11a
- Fig. 11c is a directional diagram of a low frequency antenna unit in the antenna array shown in Fig. 11a;
- Fig. 12a is a kind of structural representation of the antenna array that is formed by two low-frequency antenna units and eight high-frequency antenna units provided by the application;
- Figure 12b is a cross-sectional view of the antenna array shown in Figure 12a;
- Fig. 12c is a directional diagram of a low frequency antenna unit in the antenna array shown in Fig. 12a;
- FIG. 13a is a schematic structural diagram of an antenna array consisting of two low-frequency antenna units and eight high-frequency antenna units provided by the application;
- Figure 13b is a cross-sectional view of the antenna array shown in Figure 13a;
- Fig. 13c is a directional diagram of a low frequency antenna unit in the antenna array shown in Fig. 13a;
- FIG. 14 is a schematic partial structure diagram of a multi-frequency antenna provided by another embodiment of the present application.
- FIG. 15 is a schematic partial structure diagram of a multi-frequency antenna provided by another embodiment of the present application.
- FIG. 16 is a cross-sectional view of a partial structure of the multi-frequency antenna provided in FIG. 15;
- 17a is a schematic structural diagram of an antenna array consisting of eight high-frequency antenna units provided by the application;
- Figure 17b is a cross-sectional view of the antenna array shown in Figure 17a;
- Fig. 17c is a directional diagram of a high frequency antenna unit in the antenna array shown in Fig. 17a;
- 18 is a directional diagram of another high-frequency antenna unit in an antenna array consisting of two low-frequency antenna units and eight high-frequency antenna units provided by the application;
- FIG. 19a is a schematic structural diagram of another antenna array consisting of two low-frequency antenna units and eight high-frequency antenna units provided by the application;
- Fig. 19b is a directional diagram of a high-frequency antenna unit in the antenna array shown in Fig. 19a;
- 20 is an exploded view of a partial structure of a multi-frequency antenna provided by another embodiment of the present application.
- FIG. 21 is a schematic partial structure diagram of a multi-frequency antenna provided by another embodiment of the present application.
- FIG. 22 is a schematic partial structure diagram of a multi-frequency antenna provided by another embodiment of the present application.
- FIG. 23 is a cross-sectional view of a multi-frequency antenna provided by another embodiment of the present application.
- FIG. 24 is an exploded view of a multi-frequency antenna provided by another embodiment of the present application.
- FIG. 25 is a schematic structural diagram of a multi-frequency antenna provided by another embodiment of the present application.
- 10-antenna 1-low frequency antenna unit; 2-high frequency antenna unit; 101-radiating part; 1011-radiating surface reference dielectric substrate;
- 301-transmission components 302-calibration network; 303-phase shifter; 304-combiner; 305-filter; 306-microstrip line;
- Fig. 1 shows a schematic structural diagram of an antenna feeding system of a base station according to an embodiment of the present application.
- the antenna feeding system of the base station may generally include structures such as an antenna 10 , a pole 20 , and an antenna adjustment bracket 30 .
- the antenna 10 of the base station is usually arranged in the radome 40, and the radome 40 has good electromagnetic wave penetration characteristics in terms of electrical performance, and can withstand the impact of external harsh environments in terms of mechanical properties, so as to protect the antenna system from The role of external environmental influences.
- the radome 40 can be mounted on the pole 20 or the iron tower through the antenna adjustment bracket 30 , so as to facilitate the reception or transmission of signals of the antenna 10 .
- the base station may further include a radio frequency processing unit 50 and a signal processing unit 60 .
- the radio frequency processing unit 50 may be configured to perform frequency selection, amplification and down-conversion processing on the wireless signal received by the antenna 10 , and convert it into an intermediate frequency signal or a baseband signal and send it to the signal processing unit 60 . Or it is used to convert the signal processing unit 60 or the intermediate frequency signal into electromagnetic waves through up-conversion and amplification processing through the antenna 10 and send it out.
- the signal processing unit 60 can be connected to the feeding structure of the antenna 10 through the radio frequency processing unit 50 , and is used for processing the intermediate frequency signal or the baseband signal sent by the radio frequency processing unit 50 .
- the radio frequency processing unit 50 may be integrated with the antenna 10 , and the signal processing unit 60 is located at the far end of the antenna 10 . In other embodiments, the radio frequency processing unit 50 and the signal processing unit 60 may also be located at the far end of the antenna 10 at the same time.
- the radio frequency processing unit 50 and the signal processing unit 60 may be connected through a cable 70 .
- FIG. 1 and FIG. 2 may be referred to together, and FIG. 2 is a schematic structural diagram of a base station antenna according to a possible embodiment of the present application.
- the antenna 10 of the base station may include a radiation part 101 and a reflector 102 .
- the radiating part 101 may also be called an antenna element, a vibrator, etc.
- the radiating part 101 is a unit constituting the basic structure of an antenna array, and it can effectively radiate or receive radio waves.
- the frequencies of the radiation parts 101 may be the same or different.
- the reflector 102 can also be called a bottom plate, an antenna panel or a metal reflective surface, etc.
- the reflector 102 can improve the receiving sensitivity of the antenna signal and reflect the antenna signal at the receiving point; in addition, the reflector 102 can realize the directional radiation of the antenna signal , the radiation performance of the antenna 10 is improved.
- the radiation part 101 is usually placed on the surface of one side of the reflector 102, which can not only greatly enhance the signal receiving or transmitting capability of the antenna 10, but also can block and shield the back surface of the reflector 102 (in this application, the back of the reflector 102 refers to the Interference effect on signal reception by other radio waves of the reflector 102 on the side opposite to where the radiation portion 101 is provided.
- the radiating part 101 can receive or transmit radio frequency signals through the respective feeding structures 3 .
- the feeding structure 3 is usually composed of a controlled impedance transmission line.
- the feeding structure 3 can feed the wireless signal to the radiating part 101 according to a certain amplitude and phase, or send the received wireless signal to the base station according to a certain amplitude and phase.
- Signal processing unit 60 the feeding structure 3 can realize different radiation beam directions through the transmission component 301, or be connected with the calibration network 302 to obtain calibration signals required by the system.
- a phase shifter 303 may be included in the feeding structure 3 to change the maximum direction of antenna signal radiation.
- a combiner 304 may also be provided in the feeding structure 3 (which can be used to combine signals of different frequencies into one channel and transmit through the antenna 10; or when used in reverse, it can be used to combine the signals received by the antenna 10 according to different The frequency is divided and multiplexed to the signal processing unit 50 for processing), the filter 305 (for filtering out the interference signal) and other modules for extending the performance.
- the low-frequency antenna unit 1 and the high-frequency antenna unit 2 are usually configured simultaneously in the same antenna array to form a multi-frequency antenna.
- the specific operating frequencies of the low-frequency antenna unit 1 and the high-frequency antenna unit 2 are not limited, but the operating frequency of the high-frequency antenna unit 2 is higher than the operating frequency of the low-frequency antenna unit 1.
- the operating frequency of the high-frequency antenna unit 2 is made 30% higher than the operating frequency of the low-frequency antenna unit 1 .
- FIG. 3 shows a schematic diagram of the distribution of an antenna.
- the antenna includes a low frequency antenna unit 1 distributed on the reflector 102 and a plurality of high frequency antenna units 2 distributed around the low frequency antenna unit 1.
- the low frequency antenna unit 1 and the high frequency antenna unit 2 share an antenna front (ie The area where the reflector 102 is located), the low-frequency antenna unit 1 and the high-frequency antenna unit 2 are arranged close to each other, and the maximum distance between the two is sometimes less than 0.5 times the wavelength of the low-frequency antenna 1, which can be understood as the low-frequency antenna unit 1.
- wavelengths to operate in a vacuum environment to form a common aperture antenna.
- the antenna elements of two frequency bands or even multiple frequency bands are arranged in the same antenna array, which can greatly reduce the size of the multi-frequency antenna, and obtain the application advantages of miniaturization, light weight and easy deployment.
- the electromagnetic waves radiated by the low-frequency antenna unit 1 are coupled to the high-frequency antenna unit 2
- the high frequency antenna unit 2 is in common mode resonance, a low frequency common mode induced current will be excited in the radiation part and the reflection ground of the high frequency antenna unit 2, and the common mode induced current will further excite low frequency electromagnetic waves.
- the low-frequency electromagnetic wave will have a combined effect with the electromagnetic wave directly radiated by the low-frequency antenna unit 1 , resulting in deterioration of the directional diagram parameters such as the gain stability and the polarization suppression ratio of the low-frequency antenna unit 1 .
- FIG. 4a is the polarization pattern of the low frequency antenna unit 1 in the antenna array composed of the low frequency antenna unit 1
- FIG. 4b is the low frequency in the multi-frequency antenna in FIG. 3 Polarization pattern of antenna element 1.
- Fig. 4a and Fig. 4b the main polarization pattern curve and the cross-polarization pattern curve of some frequency points selected at intermediate intervals in the working frequency band of the low frequency antenna unit 1 are shown, wherein each solid line represents the low frequency antenna unit 1
- the main polarization pattern curve corresponding to a frequency point in the working frequency band of the Directivity parameters such as gain stability and polarization rejection ratio over the entire operating frequency band.
- the ordinate represents the normalized gain, and the unit is dB (decibel), the abscissa represents the azimuth Phi, and the unit is "°" (ie, degree), and the solid line indicates The main polarization pattern of , and the cross-polarization pattern represented by the dotted line.
- the polarization form of the low-frequency antenna unit 1 may be, but not limited to, single polarization, dual polarization, or circular polarization. The polarization directions are the same.
- the top of the main lobe of the solid line part in Fig. 4b has a downward depression relative to the top of the main lobe of the solid line part in Fig.
- the gain stability of the low-frequency antenna unit 1 deteriorates, and the gain of some frequency points decreases by more than 6dB.
- the average value of the dashed line part in FIG. 4b has a greater improvement than the average value of the dashed line part in FIG. 4a, indicating that after the high frequency antenna unit 2 is arranged in the array of the low frequency antenna unit 1, The polarization suppression ratio deteriorated.
- the embodiments of the present application provide a multi-frequency antenna to improve the directional parameters such as the polarization suppression ratio and gain stability of the low-frequency antenna unit 1 in the multi-frequency antenna, and at the same time improve the radiation efficiency of the high-frequency antenna unit 2 and job stability.
- FIG. 5 is a schematic structural diagram of a multi-frequency antenna provided by an embodiment of the present application.
- the multi-frequency antenna includes a reflector 102 , and a low-frequency antenna unit 1 and a high-frequency antenna unit 2 distributed on the reflector 102 .
- the material of the reflector 102 may be, but not limited to, metals such as gold, silver, copper, iron, and aluminum, or alloys such as stainless steel, aluminum alloy, and nickel alloy.
- the low-frequency antenna unit 1 is located on the peripheral side of the high-frequency antenna unit 2, and the low-frequency antenna unit 1 and the high-frequency antenna unit 2 may be different. It is not limited to be distributed on the reflection plate 102 in an array.
- FIG. 6 is a schematic partial structure diagram of a multi-frequency antenna according to a possible embodiment of the present application.
- the reflector 102 is provided with a slot 1021 , and the slot 1021 defines a strip conductor 1022 .
- the direction of the slot 1021 can be in a semi-enclosed shape with one end open, so that a semi-enclosed strip area is divided on the reflector 102, and the above-mentioned strip conductor 1022 is located in the semi-enclosed strip area.
- the specific wiring shape of the strip conductor 1022 is not limited.
- the strip conductor 1022 may be wired in a straight line, a serpentine shape, or a zigzag line. Regardless of the shape of the strip conductor 1022 for wiring, the length of the strip conductor 1022 in the wiring direction of the strip conductor 1022 (X direction as shown in FIG. 6 ) may be greater than 1/20 of the wavelength of the low frequency antenna unit 1 , the wavelength can be understood as the wavelength at which the low-frequency antenna unit 1 works in a vacuum environment. In addition, in the plane where the reflector is located, perpendicular to the wiring direction of the strip conductor 1022 (the Y direction in FIG. 6 ), the width of the strip conductor 1022 may be 0.1 mm ⁇ 10 mm. In some embodiments, the ratio of the length of the strip conductor 1022 in the routing direction thereof to the width of the strip conductor 1022 in the routing direction perpendicular to the strip conductor 1022 may be greater than 5:1.
- one end of the strip conductor 1022 is still connected to other parts of the reflector 102 (the connection method may be direct connection or indirect connection), that is, the strip conductor 1022 is still a part of the reflector 102 , so as to realize the grounding setting of the strip conductor 1022 .
- the strip conductor 1022 is equivalent to a common mode suppression inductance structure, and a region such as the strip conductor 1022 is formed in the area where the strip conductor 1022 is located.
- the inductor-capacitor parallel resonant circuit (LC parallel resonant circuit) shown in Figure 7 can achieve the purpose of suppressing the common mode induced current.
- the strip conductor 1022 may be arranged corresponding to the high-frequency antenna unit 2 .
- the multi-frequency antenna further includes a feeding structure 3
- the feeding structure 3 includes a microstrip line 306 for the high-frequency antenna unit 2
- the microstrip line 306 is located on one side of the reflector 102, And at least part of the projection of the microstrip line 306 on the reflective plate 102 falls within the contour range of the strip conductor 1022 .
- the microstrip line 306 and the strip conductor 1022 may also be arranged in parallel, that is, the wiring directions of the microstrip line 306 and the strip conductor 1022 may be the same.
- the wiring shape of the microstrip line 306 may be the same as or different from that of the strip conductor 1022 , as long as the distance between them is approximately the same everywhere in the thickness direction of the reflector 102 . Therefore, the common mode suppression inductance structure formed by the strip conductors 1022 is prevented from affecting the impedance continuity of the microstrip line 306, so as to ensure the continuity of the impedance of the microstrip line 306, thereby improving the radiation efficiency and working stability of the high-frequency antenna unit 2. sex.
- the width of the strip conductor 1022 may be 0.2 to 5 times the width of the microstrip line 306 in the direction perpendicular to the wiring of the strip conductor 1022 .
- the inductance of the common mode suppression inductance structure formed by the strip conductor 1022 can be relatively large, so that the common mode induced current can be effectively suppressed .
- the slot 1021 may be disposed around the microstrip line 306 , for specific implementation, please refer to FIG. 8 .
- the microstrip line 306 is arranged on the reflector 102, and then the slot 1021 is arranged around the microstrip line 306 on the reflector 102 to obtain the strip conductor 1022, which can effectively simplify the multi-frequency antenna manufacturing process.
- the wiring direction of the microstrip line 306 and the strip conductor 1022 may be the same, and the slot 1021 may be, but not limited to, a U-shaped slot. It can be seen from FIG.
- the projected width of the microstrip line 306 on the reflective plate 102 may be less than or equal to the width of the strip conductor 1022; in the wiring direction of the strip conductor 1022 On the reflective plate 102, the projected length of the microstrip line 306 on the reflective plate 102 is greater than the length of the strip conductor 1022, so that a part of the projection of the microstrip line 306 on the reflective plate 102 is located in the area defined by the U-shaped groove, and the other part is from the U-shaped groove.
- the opening of the U-shaped groove extends beyond the above-defined area, which can be understood as the projection of the microstrip line 306 on the reflector 102 is inserted into the area defined by the U-shaped groove, so that the microstrip line 306 can be everywhere impedance is continuous.
- FIG. 9 shows an arrangement of the high-frequency antenna unit 2 according to a possible embodiment of the present application.
- the feeding structure 3 further includes a feeding line 307, which is respectively connected to the microstrip line 306 and the strip conductor 1022, and the feeding line 307 can be used to feed the radiating part 101 of the high-frequency antenna unit 2 .
- the radiating portion 101 of the high-frequency antenna unit 2 is disposed on the side of the reflector 102 away from the microstrip line 306 , and the radiating portion 101 of the high-frequency antenna unit 2 may include a radiating surface reference dielectric substrate 1011 , which is disposed on the The radiation surface refers to the first radiation arm 1012 , the second radiation arm 1013 and the coupling feeding structure 1014 of the dielectric substrate 1011 .
- the first radiation arm 1012 and the second radiation arm 1013 are arranged on the first surface of the radiation surface reference dielectric substrate 1011 , and the coupling feed structure 1014 is arranged on the second surface of the radiation surface reference dielectric substrate 1011 .
- the feeder 307 is a coaxial feeder.
- the feeder 307 may also be, but not limited to, a microstrip structure, a stripline, or a coplanar waveguide. Transmission line (coplanar waveguide, CPW), etc. It can be understood that no matter what form the feed line 307 is, it is provided with a signal conductor and a ground conductor.
- FIG. 10 shows a schematic structural diagram of the connection between the radiating portion 101 of the high-frequency antenna unit 2 and the feeding structure 3 according to an embodiment of the present application.
- the feeder 307 is a coaxial feeder
- the coaxial feeder includes an inner conductor 3071 and an outer conductor 3072 arranged coaxially.
- an insulating layer can be arranged between the inner conductor 3071 and the outer conductor 3072 , to avoid short circuit between the inner conductor 3071 and the outer conductor 3072 .
- the inner conductor 3071 can be used as the signal conductor of the feed line 307
- the outer conductor 3071 can be used as the ground conductor of the feed line 307 .
- one end of the inner conductor 3071 (signal conductor) of the feeding line 307 is connected to the signal conductor of the microstrip line 306, and the other end is fed through the coupling feed.
- the electrical structure 1014 is feed-connected to the first radiation arm 1012 ; one end of the outer conductor 3072 (ground conductor) of the feed line 307 is connected to the strip conductor 1022 , and the other end is electrically connected to the second radiation arm 1013 .
- the high-frequency antenna unit 2 is a dipole antenna.
- the high-frequency antenna unit 2 may also be, but is not limited to, a monopole antenna, Electromagnetic dipole antenna or patch antenna, etc. No matter what structure the high-frequency antenna unit 2 adopts, the connection manner of the high-frequency antenna unit 2 is similar to that of the feed line 307 , and will not be introduced one by one here.
- a through hole 10221 may be provided on the strip conductor 1022 , so that the feed line 307 can be connected to the microstrip line 306 through the through hole.
- the feeding structure 3 may further include a feeding joint 308, and the feeding joint 308 and the microstrip line 306 are arranged on the same side of the reflector 102, and the microstrip Line 306 is connected to feed connector 308 .
- the feeding joint 308 can be connected to the feeding circuit, and the radio frequency signal can be transmitted to the radiation part 101 through the feeding joint 308 and the microstrip line 306 for transmission.
- the multi-frequency antenna may be configured based on the structure of the PCB.
- a PCB is usually composed of a conductor layer and a dielectric substrate 309 disposed between two adjacent conductor layers, the reflector 102 and the microstrip line 306 can be disposed on two different parts of the PCB.
- the structure and processing technology of the multi-frequency antenna can be simplified.
- FIG. 11a shows an antenna array composed of two low-frequency antenna units 1;
- Fig. 11b is an A-direction view of the antenna array shown in Fig. 11a.
- FIG. 11c is a simulation result of the pattern of the horizontal plane of the antenna array shown in the above-mentioned FIG. 11a.
- the operating frequency of the low-frequency antenna unit 1 is 0.69GHz-0.96GHz.
- FIG. 12a shows a multi-frequency antenna composed of two low-frequency antenna units 1 and eight high-frequency antenna units 2;
- FIG. 12b is the A-direction view section of the multi-frequency antenna shown in FIG. 12a picture.
- FIG. 12c is a simulation result of the pattern of the horizontal plane of the multi-frequency antenna shown in the above-mentioned FIG. 12a.
- FIG. 13a is a multi-frequency antenna provided by an embodiment of the application, wherein the multi-frequency antenna is composed of two low-frequency antenna units 1 and eight high-frequency antenna units 2, wherein the reflector 102 A slot is provided at a position corresponding to the high-frequency antenna unit 2 to form a strip conductor 1022;
- FIG. 13b is an A-direction side view of the multi-frequency antenna shown in FIG. 13a.
- FIG. 13c is a simulation result of the pattern of the horizontal plane of the multi-frequency antenna shown in the above-mentioned FIG. 13a.
- the top of the main lobe in the solid line part in Fig. 12c has a downward depression relative to the top of the main lobe in the solid line part in Fig. 11c, indicating that in the array of the low-frequency antenna element 1
- the gain stability of the low-frequency antenna unit 1 deteriorates.
- the average value of the dashed line part in Fig. 12c has a larger improvement than the average value of the dashed line part in Fig. 11c, indicating that after the high frequency antenna element 2 is arranged in the array of the low frequency antenna element 1, the pole of the low frequency antenna element 1 The inhibition ratio deteriorated.
- the common mode suppression inductance structure formed by the strip conductor 1022 can effectively suppress the common mode induced current generated on the high frequency antenna unit 2, so that the polarization of the low frequency antenna unit 1 can be effectively suppressed. Directivity parameters such as rejection ratio and gain stability are significantly improved.
- the strip conductor 1022 is formed by slotting the reflector 102 , that is, the strip conductor 1022 is a part of the reflector 102 , the processing process is simple, and additional structures and assembly processes are not required, so the multi-frequency antenna production cost is low.
- the present application While significantly improving the directional parameters such as the polarization suppression ratio and gain stability of the low-frequency antenna unit 1, the present application also hopes to further reduce the front-to-back ratio, polarization suppression ratio and gain of the high-frequency antenna unit 2 The influence of directional parameters such as stability, thereby improving the radiation performance of the multi-frequency antenna.
- the length of the slot 1021 along the wiring direction of the strip conductor 1022 may be considered to control the length of the slot 1021 along the wiring direction of the strip conductor 1022, but at the same time, the length of the strip conductor 1022 cannot be shortened, so as to avoid reducing the strip conductor 1022
- the formed common mode suppresses the equivalent inductance of the inductor structure, so that the common mode induced current generated on the high frequency antenna unit 2 can be effectively suppressed.
- FIG. 14 shows a schematic structural diagram of a reflector in a multi-frequency antenna according to an embodiment of the present application.
- the slot 1021 is a continuous slot continuously disposed on the reflector 102, and the shape formed by the slot 1021 has a bottom 1021a and an open end 1021b.
- the multi-frequency antenna may further include a first jumper 4 , so that the length of the slot 1021 along the wiring direction of the strip conductor 1022 can be adjusted through the first jumper 4 .
- the strip conductor 1022 can be located between the first jumper 4 and the microstrip line 306 , and the two ends of the first jumper 4 are respectively located on both sides of the slot 1021 away from the strip conductor 1022 , and Both ends of the first jumper 4 are respectively connected to the reflector 102 .
- the first jumper 4 is disposed between the bottom 1021a and the open end 1021b of the slot 1021 , and the projection of the first jumper 4 on the reflector 102 divides the slot 1021 into two parts.
- the slot 1021 forms a short-circuit structure at the position of the first jumper 4, which is equivalent to shortening the size of the slot 1021 along the wiring direction of the strip conductor 1022, thereby effectively reducing the frequency of high-frequency signals from the opening.
- the slot 1021 leaks to the back of the reflector 102 to reduce the influence on the directional parameters such as the front-to-back ratio, the polarization suppression ratio and the gain stability of the high-frequency antenna unit 2 .
- the microstrip line 306 may also be located between the first jumper 4 and the strip conductor 1022 , and the specific arrangement thereof is similar to that in the above-mentioned embodiments, which will not be repeated here.
- the first jumper 4 on the reflector 102, it does not affect the specific arrangement of the strip conductor 1022, and the common mode suppression inductance formed by the strip conductor 1022
- the equivalent inductance of the structure does not change, so that the common-mode induced current generated on the high-frequency antenna unit 2 can be effectively suppressed, so that the directional parameters such as the polarization suppression ratio and gain stability of the low-frequency antenna unit 1 can be obtained.
- FIG. 15 is a schematic structural diagram of a reflector in a multi-frequency antenna according to a possible embodiment of the present application.
- the slot 1021 may be, but not limited to, a U-shaped slot. Additionally, at least a portion of the projection of the microstrip line 306 on the reflector plate 102 may fall within the area bounded by the U-shaped groove.
- the wiring direction of the microstrip line 306 and the strip conductor 1022 is the same, and in the direction perpendicular to the wiring direction of the strip conductor 1022, the projection width of the microstrip line 306 on the reflective plate 102 may be smaller than or equal to the width of the strip conductor 1022; in the wiring direction of the strip conductor 1022, the projected length of the microstrip line 306 on the reflector 102 is greater than the length of the strip conductor 1022, so that the microstrip line 306 on the reflector 102 A part of the projection is located in the area defined by the U-shaped groove, and the other part extends from the opening of the U-shaped groove to outside the above-defined area, which can be understood as the projection of the microstrip line 306 on the reflector 102 inserted in the U-shaped groove. within the area bounded by the groove. In order to ensure that the impedance of the microstrip line 306 is continuous, the radiation efficiency and working stability of the high-frequency antenna unit 2 are improved.
- the multi-frequency antenna may be configured based on the structure of the PCB.
- a PCB is usually composed of a conductor layer and a dielectric substrate 309 disposed between two adjacent conductor layers, the first jumper 4 , the reflector 102 and the microstrip can be connected in this way.
- the lines 306 are respectively disposed on different conductor layers of the printed circuit board.
- both ends of the first jumper 4 can be respectively connected to the reflector 102 through via holes opened on the printed circuit board. Therefore, the structure and processing technology of the multi-frequency antenna can be effectively simplified.
- Figure 17a shows an antenna array composed of eight high-frequency antenna elements 2;
- Figure 17b is an A-direction view of the antenna array shown in Figure 17a.
- FIG. 17c is the simulation result of the pattern of the horizontal plane of the high-frequency antenna unit 2 in the antenna array shown in FIG. 17a.
- the operating frequency of the high-frequency antenna unit 2 is 1.90GHz ⁇ 2.10GHz.
- FIG. 18 is a simulation result of the pattern of the horizontal plane of the high-frequency antenna unit 2 in the multi-frequency antenna shown in FIG. 13a.
- FIG. 19a is a multi-frequency antenna provided by an embodiment of the application, wherein the multi-frequency antenna is composed of two low-frequency antenna units 1 and eight high-frequency antenna units 2, wherein the reflector 102 A slot is provided at a position corresponding to the high-frequency antenna unit 2, and a first jumper is provided between the bottom of the slot and the open end.
- FIG. 19b is a simulation result of the pattern of the horizontal plane of the high-frequency antenna unit 2 in the multi-frequency antenna shown in FIG. 19a.
- the multi-frequency antenna provided in this embodiment of the present application, since the first jumper 4 is disposed between the bottom 1021a and the open end 1021b of the slot 1021, the projection of the first jumper 4 on the reflector 102 will
- the slot 1021 is divided into two parts. In this way, the slot 1021 forms a short-circuit structure at the position of the first jumper 4, which is equivalent to shortening the size of the slot 1021 along the wiring direction of the strip conductor 1022, thereby effectively reducing the impact on the high-frequency antenna.
- the influence of directional parameters such as front-to-back ratio, polarization suppression ratio and gain stability of unit 2.
- the first jumper 4 is arranged on the reflector 102, it does not affect the specific arrangement of the strip conductors 1022, so the equivalent inductance of the common mode suppression inductance structure formed by the strip conductors 1022 does not change, so that the The common-mode induced current generated on the high-frequency antenna unit 2 can be effectively suppressed, so that the directional parameters such as the polarization suppression ratio and gain stability of the low-frequency antenna unit 1 can be significantly improved.
- FIG. 20 is a schematic structural diagram of a multi-frequency antenna provided by a possible embodiment of the present application.
- the slot 1021 includes a first slot portion 1021c and a second slot portion 1021d that are separated from each other, and the strip conductor 1022 includes a first conductor portion 1022a and a second conductor portion 1022b that are connected to each other.
- the slot 1021 defines the strip conductor 1022
- the first slot portion 1021c defines the first conductor portion 1022a
- the second slot portion 1021d defines the second conductor portion 1022b.
- the first slot portion 1021c may be a closed annular slot, and the shape of the annular slot may be, but not limited to, an "O" shape or a "D" shape.
- the second slot portion 1021d may be a semi-enclosed semi-closed slot with an opening at one end, and the shape of the semi-closed slot may be, but not limited to, a U-shape.
- the opening of the U-shaped slot faces the side away from the first slotted portion 1021c. In this way, on the layer where the reflector 102 is located, the first conductor portion 1022a and the second conductor portion 1022b of the strip conductor 1022 are two sections that are not connected to each other, and the second conductor portion 1022b is grounded.
- the multi-frequency antenna includes a second jumper 5, and both ends of the second jumper 5 are respectively connected to the first conductor portion 1022a and the second conductor portion 1022b, so that the first conductor portion 1022a and the second conductor portion 1022a are connected to the second conductor portion 1022a.
- the two conductor parts 1022b are connected by the second jumper 5 .
- the portion of the reflector 102 on the peripheral side of the slot is short-circuited between the first slot portion 1021c and the second slot portion 1021d through the second jumper 5, which is It is equivalent to shortening the size of the slot 1021 along the wiring direction of the strip conductor 1022, thereby effectively reducing the leakage of high-frequency signals from the slot 1021 to the back of the reflector 102, so as to reduce the impact on the high-frequency antenna unit 2
- the influence of directional parameters such as front-to-back ratio, polarization suppression ratio and gain stability.
- the common mode suppression inductance formed by the strip conductor 1022 does not change, so that the common-mode induced current generated on the high-frequency antenna unit 2 can be effectively suppressed, so that the directional parameters such as the polarization suppression ratio and gain stability of the low-frequency antenna unit 1 can be obtained.
- the directional parameters such as the polarization suppression ratio and gain stability of the low-frequency antenna unit 1 can be obtained.
- the multi-frequency antenna can be set based on the structure of the PCB. Since a PCB is usually composed of a conductor layer and a dielectric substrate 309 arranged between two adjacent conductor layers, the reflector 102 and the microstrip line 306 can be arranged on different conductor layers of the printed circuit board, and the first Two jumpers (not shown in the figure) and the microstrip line 306 are arranged on the same conductor layer of the printed circuit board. Using the multi-frequency antenna of this solution can avoid increasing the number of conductor layers of the PCB, thereby effectively reducing the cost of the multi-frequency antenna.
- both ends of the second jumper 5 can be respectively connected to the first conductor portion 1022a and the second conductor portion 1022b through via holes opened in the printed circuit board. Therefore, the structure and processing technology of the multi-frequency antenna can be effectively simplified.
- the number of the second jumper 5 is not specifically limited.
- this solution can ensure the continuous return flow of the microstrip line 306 , thereby effectively improving the impedance continuity of the microstrip line 306 , thereby improving the radiation efficiency and working stability of the high-frequency antenna unit 2 .
- the distance between the microstrip line 306 and the second jumper 5 can be adjusted.
- the distance between the second jumper 5 and the microstrip line 306 is 0.1 to 10 times the thickness of the dielectric substrate 309 , so as to realize the continuity of impedance throughout the microstrip line 306 .
- the reflecting plate 102 may also have a periodically arranged grid structure 1023 .
- the strip conductors 1022 may be disposed within locally continuous metal planes between the mesh structures 1023 .
- the strip conductors 1022 can also be arranged in the interval of a single grid structure 1023, so as to realize the comprehensive optimization of the performance of the multi-frequency antenna.
- other structures of the multi-frequency antenna can be set with reference to any of the above-mentioned embodiments, and details are not described here.
- the present application also provides a communication device, where the communication device includes the multi-frequency antenna of any of the foregoing embodiments, and the communication device may be, but not limited to, a base station, a radar, or other devices.
- the common-mode suppression inductance structure formed by the strip conductor can effectively suppress the common-mode induced current generated on the high-frequency antenna unit, so that the polarization suppression ratio and gain stability of the low-frequency antenna unit 1 can be improved.
- the directionality parameter has been significantly improved.
- the impedance of the microstrip line is continuous, which can improve the radiation efficiency and working stability of the high-frequency antenna unit.
- the manufacturing cost of the multi-frequency antenna is low, thereby effectively reducing the cost of the entire communication device.
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Abstract
本申请公开了一种多频天线及通信设备,涉及通信技术领域。该多频天线包括反射板和馈电结构。其中,反射板设有开槽,开槽界定出一个带状导体,此时带状导体的一端仍与反射板的其它部分连接,以实现带状导体的接地设置。馈电结构包括用于多频天线中高频天线单元的微带线,微带线位于反射板的一侧,且微带线在反射板上的投影的至少部分落在带状导体的轮廓范围内。采用本申请的多频天线,可对高频天线单元上产生的共模感应电流进行有效的抑制,从而使低频天线单元的极化抑制比和增益稳定性等方向性参数得到显著的改善。另外,微带线各处的阻抗连续,其可提高高频天线单元的辐射效率和工作稳定性。
Description
本申请涉及通信技术领域,尤其涉及一种多频天线及通信设备。
在基站等通讯设备中,通常同时配置高频天线单元和低频天线单元,高频天线单元的信号传输容量大,低频天线单元的信号抗衰减能力强。而为了减小通讯设备的体积,有时需要将高频天线单元和低频天线单元配置于同一个天线阵面中,形成多频天线。
在多频天线中,高频天线单元和低频天线单元之间的间距通常较小。这样,由低频天线单元辐射出的电磁波耦合至高频天线单元时,会在高频天线单元产生共模谐振,从而在高频天线单元的辐射部和反射地上激励出低频的感应电流,而该感应电流会进一步激励出低频电磁波。该低频电磁波会与低频天线单元直接辐射出的电磁波综合作用,导致低频天线单元的增益稳定性和极化抑制比等方向图参数恶化。
发明内容
本申请提供一种多频天线及通信设备,以改善多频天线中低频天线单元的极化抑制比和增益稳定性等方向性参数。
第一方面,本申请提供一种多频天线,该多频天线包括设置于同一个天线阵面中的至少一个低频天线单元和至少一个高频天线单元,其可以存在相靠近设置的低频天线单元和高频天线单元,且该相靠近设置的低频天线单元和高频天线单元之间的最大间距小于0.5倍的低频天线单元的波长,该波长可以理解为低频天线单元在真空中工作的波长。在具体设置多频天线时,其可以包括反射板以及馈电结构。其中,反射板上设有开槽,该开槽界定出一个带状导体,该带状导体作为反射板的一部分,其一端可与反射板的其它部分连接,以实现带状导体的接地设置。馈电结构包括用于多频天线中高频天线单元的微带线,微带线位于反射板的一侧,且微带线在反射板上的投影的至少部分落在带状导体的轮廓范围内。
在本申请提供的多频天线中,带状导体形成一个共模抑制电感结构,其可对由低频天线单元辐射出的电磁波耦合至高频天线单元,且在高频天线单元上产生的共模感应电流进行有效的抑制,从而使低频天线单元的极化抑制比和增益稳定性等方向性参数得到显著的改善。另外,由于带状导体为对反射板进行开槽形成的,即带状导体作为反射板的一部分,其加工工艺简单,且无需增加额外的结构及组装工序,因此该多频天线的制作成本较低。
并且,采用本申请的技术方案,可避免带状导体构成的共模抑制电感结构对微带线的阻抗连续性造成影响,以保证微带线各处的阻抗连续,进而提高高频天线单元的辐射效率和工作稳定性。
在本申请一个可能的实现方式中,不对带状导体的具体布线形状进行限定,示例性的,带状导体可呈直线形、蛇线形或者折线形进行布线。无论带状导体呈何种形状进行布线,在带状导体布线方向上,带状导体的长度可大于1/20的低频天线单元的波长(该波长可理解为低频天线单元在真空环境下工作的波长),以对高频天线单元上产生的共模感应电流进行有效的抑制。
在本申请一个可能的实现方式中,在垂直于带状导体布线的方向上,可使带状导体的宽度为微带线宽度的0.2~5倍。示例性的,在垂直于带状导体布线的方向上,带状导体的宽度为0.1mm~10mm。另外,还可以使带状导体在其布线方向上的长度,与在垂直于带状导体布线方向上,带状导体的宽度的比值大于5:1。这样可在使微带线与带状导体之间的电容基本不变的基础上,使带状导体构成的共模抑制电感结构的电感比较大,从而能够有效的抑制共模感应电流。
在本申请一个可能的实现方式中,在具体设置馈电结构时,馈电结构还可以包括馈电线,该馈电线分别与微带线和带状导体连接,以用于给高频天线单元的辐射部进行馈电。具体实施例时,馈电线通常包括信号导体和接地导体,其中,信号导体可与微带线连接,接地导体与带状导体连接。
为了实现馈电线与微带线的连接,可以在带状导体上设置有通孔,以使馈电线穿过通孔与微带线连接。从而可简化多频天线的结构。
另外,馈电结构还可以包括馈电接头,馈电接头可与微带线设置于反射板的同一侧,且微带线与馈电接头连接。这样,馈电接头可与馈电电路连接,射频信号可通过馈电接头以及微带线输送至辐射部进行发射。
在本申请一个可能的实现方式中,开槽可为连续设置的连续槽,该开槽所形成的形状具有底部和开口端。多频天线还可以包括第一跨接件,第一跨接件设置于底部和开口端之间,第一跨接件在反射板上的投影将开槽分割为两部分。另外,带状导体可以位于第一跨接件和微带线之间,或者微带线位于第一跨接件和带状导体之间,且第一跨接件的两端分别位于开槽的背离带状导体的两侧,第一跨接件的两端分别与反射板连接。这样,开槽在第一跨接件位置处形成一个短路结构,其等效于缩短了开槽的沿带状导体的布线方向的尺寸,从而可有效的减少高频信号从开槽处向反射板背面泄露,以减小对高频天线单元的前后比、极化抑制比和增益稳定性等方向性参数的影响。
在该实现方式中,开槽可为第一U形槽,此时微带线在反射板上的投影插设于第一U形槽界定的区域内。以使微带线各处的阻抗连续,进而提高高频天线单元的辐射效率和工作稳定性。
另外,为了简化多频天线的结构以及加工工艺,可使多频天线基于PCB的结构进行设置。具体的,可将第一跨接件、反射板与微带线分别设置于印制电路板的不同的导体层上,在该实现方式中,第一跨接件的两端可分别通过开设于印制电路板上的过孔与反射板连接。
在本申请另外一个可能的实现方式中,开槽还可以设置为非连续槽,示例性的,开槽包括互相分离的第一开槽部和第二开槽部。此时,带状导体包括互相连接的第一导体部和第二导体部。在该实现方式中,开槽界定出带状导体,具体为:第一开槽部界定出第一导体部,第二开槽部界定出第二导体部。
其中,第一开槽部可为闭合的环形槽,第二开槽部可以为一端具有开口的第二U形槽,且第二U形槽的开口朝向背离环形槽的一侧。由于第一开槽部与第二开槽部为互不连接的两端,反射板的位于开槽周侧的部分在第一开槽部和第二开槽部之间短路连接,其等效于缩短了开槽的沿带状导体的布线方向的尺寸,从而可有效的减少高频信号从开槽处向反射板背面泄露,以减小对高频天线单元的前后比、极化抑制比和增益稳定性等方向性参数的影响。
为了实现第一导体部与第二导体部的连接,多频天线还可以包括第二跨接件,且第二 跨接件的两端分别与第一导体部和第二导体部连接。以减小对带状导体的布线方向的长度造成影响,则带状导体形成的共模抑制电感结构的等效电感量不发生变化,从而可对高频天线单元上产生的共模感应电流进行有效的抑制,以使低频天线单元的极化抑制比和增益稳定性等方向性参数得到显著的改善。
在该实现方式中,多频天线也可基于PCB的结构进行设置。具体的,可将反射板与微带线分别设置于印制电路板的不同的导体层上,且第二跨接件与微带线位于印制电路板的同一导体层。在该实现方式中,第一跨接件的两端可分别通过开设于印制电路板上的过孔与反射板连接。这样,可避免增加PCB的导体层的层数,从而有效的降低多频天线的成本。
另外,第二跨接件可以为两个,该两个跨接件分别设置于微带线的两侧。以使微带线的回流连续,从而有效的提高微带线各处阻抗的连续性,进而提高高频天线单元的辐射效率和工作稳定性。
通过调整第二跨接件与微带线之间的间距,可实现对微带线的阻抗进行控制。在一个可能的实现方式中,可使第二跨接件与微带线之间的间距为0.1~10倍的PCB的介质基板的厚度。
在本申请一个可能的实现方式中,反射板还可以具有周期排布的网格结构。此时,带状导体可设置于网格结构之间。或者,带状导体设置于网格结构内。以使多频天线集成定向反射、空间滤波、馈电以及共模抑制等功能,实现多频天线的综合优化。
第二方面,本申请还提供一种通讯设备,该通讯设备包括第一方面的多频天线,通讯设备可以但不限于为基站、雷达或者其它设备。在该通讯设备中,带状导体形成的共模抑制电感结构可对多频天线中的高频天线单元上产生的共模感应电流进行有效的抑制,从而使低频天线单元的极化抑制比和增益稳定性等方向性参数得到显著的改善。并且,微带线各处的阻抗连续,其可提高高频天线单元的辐射效率和工作稳定性。另外,该多频天线的制作成本较低,从而可有效的降低整个通讯设备的成本。
图1为本申请一种实施例提供的天线馈电系统的结构示意图;
图2为本申请一种实施例提供的基站天线的结构示意图;
图3为本申请提供的一种多频天线的分布示意图;
图4a为由低频天线单元组成的天线阵列中低频天线单元的方向图;
图4b为由低频天线单元和高频天线单元组成的天线阵列中低频天线单元的方向图;
图5为本申请一种实施例提供的多频天线的结构示意图;
图6为本申请一种实施例提供的多频天线的局部结构示意图;
图7为本申请一种实施例提供的带状导体处形成的等效电路示意图;
图8为本申请一种实施例提供的反射板的俯视图;
图9为本申请一种实施例提供的多频天线的爆炸图;
图10为本申请一种实施例提供的多频天线的剖视图;
图11a为本申请提供的一种由两个低频天线单元组成的天线阵列的结构示意图;
图11b为图11a的剖视图;
图11c为图11a所示的天线阵列中低频天线单元的方向图;
图12a为本申请提供的一种由两个低频天线单元和八个高频天线单元组成的天线阵列 的结构示意图;
图12b为图12a所示的天线阵列的剖视图;
图12c为图12a所示的天线阵列中低频天线单元的方向图;
图13a为本申请提供的一种由两个低频天线单元和八个高频天线单元组成的天线阵列的结构示意图;
图13b为图13a所示的天线阵列的剖视图;
图13c为图13a所示的天线阵列中低频天线单元的方向图;
图14为本申请另一种实施例提供的多频天线的局部结构示意图;
图15为本申请另一种实施例提供的多频天线的局部结构示意图;
图16为图15提供的多频天线的局部结构的剖视图;
图17a为本申请提供的一种由八个高频天线单元组成的天线阵列的结构示意图;
图17b为图17a所示的天线阵列的剖视图;
图17c为图17a所示的天线阵列中高频天线单元的方向图;
图18为本申请提供的另外一种由两个低频天线单元和八个高频天线单元组成的天线阵列中高频天线单元的方向图;
图19a为本申请提供的另一种由两个低频天线单元和八个高频天线单元组成的天线阵列的结构示意图;
图19b为图19a所示的天线阵列中高频天线单元的方向图;
图20为本申请另一种实施例提供的多频天线的局部结构的爆炸图;
图21为本申请另一种实施例提供的多频天线的局部结构示意图;
图22为本申请另一种实施例提供的多频天线的局部结构示意图;
图23为本申请另一种实施例提供的多频天线的剖视图;
图24为本申请另一种实施例提供的多频天线的爆炸图;
图25为本申请另一种实施例提供的多频天线的结构示意图。
附图标记:
10-天线;1-低频天线单元;2-高频天线单元;101-辐射部;1011-辐射面参考介质基板;
1012-第一辐射臂;1013-第二辐射臂;1014-耦合馈电结构;102-反射板;1021-开槽;
1021a-底部;1021b-开口端;1021c-第一开槽部;1021d-第二开槽部;1022-带状导体;
1022a-第一导体部;1022b-第二导体部;10221-通孔;1023-网格结构;3-馈电结构;
301-传动部件;302-校准网络;303-移相器;304-合路器;305-滤波器;306-微带线;
307-馈电线;3071-内导体;3072-外导体;308-馈电接头;309-介质基板;
4-第一跨接件;5-第二跨接件;20-抱杆;30-天线调整支架;40-天线罩;
50-射频处理单元;60-信号处理单元;70-电缆线。
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。需要说明的是,下文中“耦接”一词均指“直接连接或者间接连接”。
为了方便理解本申请实施例提供的多频天线,下面说明一下其应用场景,本申请实施例提供的多频天线可应用于基站等通讯设备中。参照图1,图1展示了本申请一种实施例 的基站的天线馈电系统的结构示意图。基站的天线馈电系统通常可以包括天线10、抱杆20、天线调整支架30等结构。其中,基站的天线10通常会设置在天线罩40中,天线罩40在电气性能上具有良好的电磁波穿透特性,机械性能上能经受外部恶劣环境的影响,从而可起到保护天线系统免受外部环境影响的作用。天线罩40可通过天线调整支架30安装于抱杆20或者铁塔上,以便于天线10的信号接收或者发射。
另外,基站还可以包括射频处理单元50和信号处理单元60。其中,射频处理单元50可用于对天线10接收到的无线信号进行选频、放大以及下变频处理,并将其转换成中频信号或基带信号发送给信号处理单元60。或者用于将信号处理单元60或中频信号经过上变频以及放大处理通过天线10转换成电磁波发送出去。信号处理单元60可通过射频处理单元50与天线10的馈电结构连接,用于对射频处理单元50发送的中频信号或基带信号进行处理。
在一种可能的实施例中,射频处理单元50可与天线10一体设置,信号处理单元60位于天线10的远端。在另外一些实施例中,还可以使射频处理单元50和信号处理单元60同时位于天线10的远端。射频处理单元50与信号处理单元60可以通过电缆线70连接。
更为具体地,可一并参照图1和图2,图2为本申请一种可能的实施例的基站天线的结构示意图。其中,如图2所示,基站的天线10可以包括辐射部101和反射板102。其中,辐射部101也可以称为天线振子、振子等,辐射部101为构成天线阵列的基本结构的单元,它能有效地辐射或接收无线电波。在天线10中,辐射部101的频率可以相同或者不同。反射板102也可以称为底板、天线面板或者金属反射面等,反射板102可以提高天线信号的接收灵敏度,把天线信号反射聚集在接收点上;另外,反射板102可以实现天线信号的定向辐射,提高天线10的辐射性能。辐射部101通常放置于反射板102一侧表面,这不但可以大大增强天线10的信号接收或发射能力,还能够起到阻挡、屏蔽来自反射板102背面(本申请中反射板102的背面是指与反射板102的用于设置辐射部101相背的一侧)的其它电波对信号接收的干扰作用。
在基站的天线10中,辐射部101可通过各自的馈电结构3接收或发射射频信号。馈电结构3通常由受控的阻抗传输线构成,馈电结构3可把无线信号按照一定的幅度、相位馈送到辐射部101,或者将接收到的无线信号按照一定的幅度、相位发送到基站的信号处理单元60。另外,馈电结构3可以通过传动部件301实现不同辐射波束指向,或者与校准网络302连接以获取系统所需的校准信号。在馈电结构3中可以包括移相器303,以用来改变天线信号辐射的最大方向。在馈电结构3中还可能设置有合路器304(可用于把不同频率的信号合成一路,通过天线10发射;或者反向使用时,可以用于将天线10接收到的信号,根据不同的频率分成多路传输到信号处理单元50进行处理)、滤波器305(用于滤除干扰信号)等用于扩展性能的模块。
目前,基站天线中,通常在同一个天线阵面中同时配置低频天线单元1和高频天线单元2,形成多频天线。在本申请各个实施例中,不对低频天线单元1和高频天线单元2的具体工作频率进行限定,但是高频天线单元2的工作频率高于低频天线单元1的工作频率,示例性的,可使高频天线单元2的工作频率比低频天线单元1的工作频率高30%。
可以参照图3,图3展示了一种天线的分布示意图。该天线中包括分布于反射板102上的一个低频天线单元1和围绕该低频天线单元1分布的多个高频天线单元2,低频天线单元1和高频天线单元2共用一个天线阵面(即反射板102所在区域),低频天线单元1 和高频天线单元2相靠近设置,二者之间的最大间距有时会小于0.5倍的低频天线1的波长,该波长可理解为低频天线单元1在真空环境下工作的波长,以形成共孔径天线。通过共孔径技术,将两个频段甚至多个频段的天线单元共天线阵面排布,可以大幅度缩小多频天线的外形尺寸,获得小型化、轻量化、易部署的应用优势。
但是,可继续参照图3,在共孔径天线中,由于高频天线单元2和低频天线单元1之间的间距较小,这样,由低频天线单元1辐射出的电磁波耦合至高频天线单元2时,会在高频天线单元2产生共模谐振,从而在高频天线单元2的辐射部和反射地上激励出低频的共模感应电流,而该共模感应电流会进一步激励出低频电磁波。该低频电磁波会与低频天线单元1直接辐射出的电磁波综合作用,导致低频天线单元1的增益稳定性和极化抑制比等方向图参数恶化。
具体的,可一并参照图4a和图4b,图4a为由低频天线单元1组成的天线阵列中的低频天线单元1的极化方向图,图4b为图3中的多频天线中的低频天线单元1的极化方向图。在图4a和图4b中,展示了低频天线单元1的工作频带中等间隔选取的一些频点的主极化方向图曲线和交叉极化方向图曲线,其中,每条实线表示低频天线单元1的工作频带中的一个频点对应的主极化方向图曲线,每条虚线表示低频天线单元1的工作频带中的一个频点对应的交叉极化方向图曲线,以用于反应低频天线单元1在整个工作频带内的增益稳定性和极化抑制比等方向性参数。另外,在图4a和图4b中,纵坐标表示归一化增益,单位均为dB(分贝),横坐标表示方位角Phi,单位均为“°”(即度,degree),实线部分表示的为主极化方向图,虚线部分表示的为交叉极化方向图。可以理解的是,在本申请实施例中,低频天线单元1的极化形式可以但不限于为单极化、双极化或者圆极化等,图4a和图4b所表示的低频天线单元1的极化方向相同。
对比图4a和图4b可知,图4b中的实线部分主瓣的顶部相对于图4a中的实线部分的主瓣的顶部出现了向下的凹陷,表明在低频天线单元1的阵列中设置高频天线单元2后,低频天线单元1的增益稳定性恶化,部分频点增益降低超过6dB。另外,图4b中的虚线部分的平均值相对于图4a中的虚线部分的平均值具有较大的提高,表明在低频天线单元1的阵列中设置高频天线单元2后,低频天线单元1的极化抑制比恶化。
基于此,本申请实施例提供了一种多频天线,以改善多频天线中低频天线单元1的极化抑制比和增益稳定性等方向性参数的同时,提高高频天线单元2的辐射效率和工作稳定性。
参照图5,图5为本申请一种实施例提供的多频天线的结构示意图。该多频天线包括反射板102,以及分布于反射板102上的低频天线单元1和高频天线单元2。其中,反射板102的材质可以但不限于为金、银、铜、铁和铝等金属,或者为不锈钢、铝合金和镍合金等合金。在本申请实施例中,低频天线单元1为至少一个,高频天线单元2为至少一个,低频天线单元1位于高频天线单元2的周侧,低频天线单元1和高频天线单元2可以但不限于呈阵列分布于反射板102上。
一并参照图5和图6,图6为本申请的一个可能的实施例的多频天线的局部结构示意图。在本申请中,反射板102上设置有开槽1021,该开槽1021界定出一个带状导体1022。具体实施时,开槽1021的走向可呈一端开口的半包围的形状,从而在反射板102上分割出一个半包围的带状区域,上述的带状导体1022位于该半包围的带状区域内。在本申请中,不对带状导体1022的具体布线形状进行限定,示例性的,带状导体1022可呈直线形、 蛇线形或者折线形进行布线。无论带状导体1022呈何种形状进行布线,在带状导体1022布线方向(如图6中所示的X方向)上,带状导体1022的长度可大于1/20的低频天线单元1的波长,该波长可理解为低频天线单元1在真空环境下工作的波长。另外,在反射板所在平面内,垂直于带状导体1022布线方向(如图6中的Y方向)上,带状导体1022的宽度可为0.1mm~10mm。在一些实施例中,还可以使带状导体1022在其布线方向上的长度,与在垂直于带状导体1022布线方向上带状导体1022的宽度的比值大于5:1。
可以理解的是,在本申请中,带状导体1022的一端仍与反射板102的其它部分连接(其连接方式可以为直接连接或者间接连接),即带状导体1022仍为反射板102的一部分,从而实现该带状导体1022的接地设置。此时,对于上述的高频天线单元2激励出的共模感应电流而言,该带状导体1022相当于一个共模抑制电感结构,并且在该带状导体1022所处的区域内形成一个如图7所示的电感电容并联谐振电路(LC parallel resonant circuit),从而可达到抑制共模感应电流的目的。
为了能够对高频天线单元2上产生的共模感应电流进行有效的抑制,可将带状导体1022对应高频天线单元2进行设置。具体实施时,可继续参照图6,多频天线还包括馈电结构3,馈电结构3包括用于高频天线单元2的微带线306,微带线306位于反射板102的一侧,且微带线306在反射板102上的投影的至少部分落在带状导体1022的轮廓范围内。在本申请一些实施例中,还可使微带线306与带状导体1022并行设置,即微带线306与带状导体1022的布线方向可以相同。另外,微带线306的布线形状可与带状导体1022相同,也可不同,只要在反射板102的厚度方向上,使二者之间各处的间距近似一致即可。从而避免带状导体1022构成的共模抑制电感结构对微带线306的阻抗连续性造成影响,以保证微带线306各处的阻抗连续,进而提高高频天线单元2的辐射效率和工作稳定性。
另外,在垂直于带状导体1022布线的方向上,可使带状导体1022的宽度为微带线306宽度的0.2~5倍。这样可在使微带线306与带状导体1022之间的电容基本不变的基础上,使带状导体1022构成的共模抑制电感结构的电感比较大,从而能够有效的抑制共模感应电流。
在本申请一个可能的实施例中,开槽1021可围绕微带线306进行设置,具体实施时,可参照图8。首先在反射板102上布设微带线306,然后再在反射板102上围绕微带线306进行开槽1021的设置以得到带状导体1022,这样可有效的简化多频天线的加工工艺。在该实施例中,微带线306可与带状导体1022的布线方向相同,开槽1021可以但不限于为U形槽。从图8中可以看出,在垂直于带状导体1022布线方向上,微带线306在反射板102上的投影的宽度可以小于或等于带状导体1022的宽度;在带状导体1022布线方向上,微带线306在反射板102上的投影的长度大于带状导体1022的长度,这样微带线306在反射板102上的投影的一部分位于U形槽界定的区域内,另一部分从U形槽的开口处伸出至上述界定的区域外,其可以理解为微带线306在反射板102上的投影插设于该U形槽界定的区域内,从而可使微带线306各处的阻抗连续。
参照图9,图9展示了本申请一种可能的实施例的高频天线单元2的设置方式。在该实施例中,馈电结构3还包括馈电线307,馈电线307分别与微带线306和带状导体1022连接,并且馈电线307可用于给高频天线单元2的辐射部101馈电。
在具体实施例时,高频天线单元2的辐射部101设置于反射板102的背离微带线306的一侧,高频天线单元2的辐射部101可以包括辐射面参考介质基板1011,设置于辐射面 参考介质基板1011的第一辐射臂1012、第二辐射臂1013以及耦合馈电结构1014。其中,第一辐射臂1012和第二辐射臂1013设置于辐射面参考介质基板1011的第一面,耦合馈电结构1014设置于辐射面参考介质基板1011的第二面。另外,在图9所示的实施例中,馈电线307为同轴馈线,在本申请另外一些实施例中,馈电线307还可以但不限于为微带线结构、带状线或者共面波导传输线(coplanar waveguide,CPW)等。可以理解的是,无论馈电线307为何种形式,其均设置有信号导体和接地导体。
可一并参照图9和图10,图10展示了本申请一种实施例的高频天线单元2的辐射部101与馈电结构3连接的结构示意图。在图10所示的实施例中,馈电线307为同轴馈线,该同轴馈线包括同轴设置的内导体3071与外导体3072,通常在内导体3071和外导体3072之间可以设置绝缘层,以避免隔内导体3071与外导体3072的短路。其中,内导体3071可作为馈电线307的信号导体,外导体3071可作为馈电线307的接地导体。具体地,将高频天线单元2的辐射部101与馈电结构3进行连接时,馈电线307的内导体3071(信号导体)的一端与微带线306的信号导体连接,另一端通过耦合馈电结构1014与第一辐射臂1012馈电连接;馈电线307的外导体3072(接地导体)的一端与带状导体1022连接,另一端与第二辐射臂1013电连接。
在上述图9和图10所示的实施例中,高频天线单元2为偶极子天线,在本申请另外一些实施例中,高频天线单元2还可以但不限于为单极子天线、电磁偶极子天线或者贴片天线等。无论高频天线单元2采用何种结构,其与馈电线307的连接方式相类似,在此不进行一一介绍。
另外,由于高频天线单元2的辐射部101与微带线306位于反射板102的两侧,为了便于馈电线307的信号导体同时与第一辐射臂1012及微带线306进行连接,继续参照图9,可在带状导体1022上设置通孔10221,从而使馈电线307能够穿过该通孔与微带线306进行连接。
一并参照图9和图10,在本申请一些实施例中,馈电结构3还可以包括馈电接头308,馈电接头308与微带线306设置于反射板102的同一侧,且微带线306与馈电接头308连接。其中,馈电接头308可与馈电电路连接,射频信号可通过馈电接头308以及微带线306输送至辐射部101进行发射。
在本申请一些实施例中,多频天线可基于PCB的结构进行设置。具体实施时,可参照图10,由于PCB通常由导体层和设置于相邻的两个导体层之间的介质基板309构成,反射板102与微带线306可设置于PCB的两个不同的导体层上,从而可简化该多频天线的结构以及加工工艺。
参照图11a和图11b,图11a展示了一种由两个低频天线单元1组成的天线阵列;图11b为图11a所示的天线阵列的A向视图。另外,参照图11c,图11c为上述图11a所示的天线阵列的水平面的方向图仿真结果,在本申请该实施例中,低频天线单元1的工作频率为0.69GHz~0.96GHz。
参照图12a和图12b,图12a展示了一种由两个低频天线单元1和八个高频天线单元2组成的多频天线;图12b为图12a所示的多频天线的A向视图截面图。另外,参照图12c,图12c为上述图12a所示的多频天线的水平面的方向图仿真结果。
参照图13a和图13b,图13a为本申请一种实施例提供的多频天线,其中,该多频天线由两个低频天线单元1和八个高频天线单元2组成,其中,反射板102对应高频天线单 元2的位置处设置有开槽以形成带状导体1022;图13b为图13a所示的多频天线的A向侧视图。另外,参照图13c,图13c为上述图13a所示的多频天线的水平面的方向图仿真结果。
在图11c、图12c和图13c中,纵坐标表示归一化增益,单位均为dB(分贝),横坐标表示方位角Phi,单位均为“°”(即度,degree),实线部分表示的为主极化方向图,虚线部分表示的为交叉极化方向图,图11c、图12c和图13c中曲线的含义与上述图4a和图4b中相类似,在此不进行赘述。
通过对比图11c和图12c可知,图12c中的实线部分主瓣的顶部相对于图11c中的实线部分的主瓣的顶部出现了向下的凹陷,表明在低频天线单元1的阵列中设置高频天线单元2后,低频天线单元1的增益稳定性恶化。另外,图12c的虚线部分的平均值相对于图11c中的虚线部分的平均值具有较大的提高,表明在低频天线单元1的阵列中设置高频天线单元2后,低频天线单元1的极化抑制比恶化。另外,对比图13c和图12c可知,采用本申请提供的多频天线,低频天线单元1的方向图获得了显著改善,另外,增益最低值从5.2dB左右提升到了6.8dB左右。
因此,采用本申请提供的多频天线,带状导体1022形成的共模抑制电感结构可对高频天线单元2上产生的共模感应电流进行有效的抑制,从而使低频天线单元1的极化抑制比和增益稳定性等方向性参数得到显著的改善。另外,由于带状导体1022为对反射板102进行开槽形成的,即带状导体1022作为反射板102的一部分,其加工工艺简单,且无需增加额外的结构及组装工序,因此该多频天线的制作成本较低。
在使低频天线单元1的极化抑制比和增益稳定性等方向性参数得到显著的改善的同时,本申请还希望进一步能够减小对高频天线单元2的前后比、极化抑制比和增益稳定性等方向性参数的影响,从而提高多频天线的辐射性能。
在本申请一个可能的实施例中,可考虑对开槽1021的沿带状导体1022的布线方向的长度进行控制,但同时又不能缩短带状导体1022的长度,以避免减小带状导体1022形成的共模抑制电感结构的等效电感量,从而能够对高频天线单元2上产生的共模感应电流进行有效的抑制。
参照图14,图14展示了本申请一种实施例的多频天线中的反射板的结构示意图。在该实施例中,开槽1021为连续设置于反射板102上的连续槽,且开槽1021所形成的形状具有底部1021a和开口端1021b。多频天线还可以包括第一跨接件4,以通过该第一跨接件4来实现对开槽1021的沿带状导体1022的布线方向的长度进行调整。
具体实施时,可使带状导体1022位于第一跨接件4和微带线306之间,第一跨接件4的两端分别位于开槽1021的背离带状导体1022的两侧,且第一跨接件4的两端分别与反射板102连接。另外,第一跨接件4设置于开槽1021的底部1021a和开口端1021b之间,第一跨接件4在反射板102上的投影将开槽1021分割为两部分。这样,开槽1021在第一跨接件4位置处形成一个短路结构,其等效于缩短了开槽1021的沿带状导体1022的布线方向的尺寸,从而可有效的减少高频信号从开槽1021处向反射板102的背面泄露,以减小对高频天线单元2的前后比、极化抑制比和增益稳定性等方向性参数的影响。在本申请另外一些实施例中,还可以使微带线306位于第一跨接件4和带状导体1022之间,其具体设置方式与上述实施例相类似,在此不进行赘述。
可以理解的是,在本申请实施例中,通过在反射板102上设置第一跨接件4,其对于 带状导体1022的具体设置不造成影响,则带状导体1022形成的共模抑制电感结构的等效电感量不发生变化,从而可对高频天线单元2上产生的共模感应电流进行有效的抑制,以使低频天线单元1的极化抑制比和增益稳定性等方向性参数得到显著的改善。
参照图15,图15为本申请一个可能的实施例的多频天线中的反射板的结构示意图。在本申请该实施例中,开槽1021可以但不限于为U形槽。另外,微带线306在反射板102上的投影的至少部分可落在该U形槽界定的区域内。示例性的,可继续参照图15,微带线306与带状导体1022的布线方向相同,在垂直于带状导体1022布线方向上,微带线306在反射板102上的投影的宽度可以小于或等于带状导体1022的宽度;在带状导体1022布线方向上,微带线306在反射板102上的投影的长度大于带状导体1022的长度,这样微带线306在反射板102上的投影的一部分位于U形槽界定的区域内,另一部分从U形槽的开口处伸出至上述界定的区域外,其可以理解为微带线306在反射板102上的投影插设于该U形槽界定的区域内。以保证微带线306各处的阻抗连续,进而提高高频天线单元2的辐射效率和工作稳定性。
在本申请一些实施例中,多频天线可基于PCB的结构进行设置。具体实施时,可参照图16,由于PCB通常由导体层和设置于相邻的两个导体层之间的介质基板309构成,这样,可将第一跨接件4、反射板102与微带线306分别设置于印制电路板的不同的导体层上,在该实施例中,第一跨接件4的两端可分别通过开设于印制电路板上的过孔与反射板102连接。从而可有效的简化该多频天线的结构以及加工工艺。
可以理解的是,本申请该实施例的多频天线的其它结构可参照上述实施例进行设置,在此不进行赘述。
参照图17a和图17b,图17a展示了一种由八个高频天线单元2组成的天线阵列;图17b为图17a所示的天线阵列的A向视图。另外,参照图17c,图17c为上述图17a所示的天线阵列中高频天线单元2的水平面的方向图仿真结果,在本申请该实施例中,高频天线单元2的工作频率为1.90GHz~2.10GHz。
参照图18,图18为上述图13a所示的多频天线中高频天线单元2的水平面的方向图仿真结果。
参照图19a和图19b,图19a为本申请一种实施例提供的多频天线,其中,该多频天线由两个低频天线单元1和八个高频天线单元2组成,其中,反射板102对应高频天线单元2的位置处设置有开槽,且设置有位于开槽的底部与开口端之间的第一跨接件。参照图19b,图19b为上述图19a所示的多频天线中高频天线单元2的水平面的方向图仿真结果。
在图17c、图18和图19b中,纵坐标表示归一化增益,单位均为dB(分贝),横坐标表示方位角Phi,单位均为“°”(即度,degree),实线部分表示的为主极化方向图,虚线部分表示的为交叉极化方向图,图17c、图18和图19b中曲线的含义与上述图4a和图4b中相类似,在此不进行赘述。
通过对比图17c和图18可知,图18中的实线部分主瓣的顶部相对于图17c中的实线部分的主瓣的顶部出现了向下的凹陷,表明在高频天线单元2的阵列中设置低频天线单元1时,还需要进一步改善高频天线单元2的增益稳定性。另外,图18的虚线部分的平均值相对于图17c中的虚线部分的平均值具有较大的提高,表明在高频天线单元2的阵列中设置低频天线单元1后,即使在反射板102的对应高频天线单元2的位置处设置有带状导体1022,高频天线单元2的极化抑制比也会恶化。另外,对比图19b和图18可知,采用本 申请提供的多频天线,高频天线单元2的方向图畸变获得了显著改善,其中,3dB波束的宽度从41.8°-77.2°,改善到了66.7°-79°,同时轴向交叉抑制比提升11.6dB左右。
因此,采用本申请该实施例提供的多频天线,由于第一跨接件4设置于开槽1021的底部1021a和开口端1021b之间,第一跨接件4在反射板102上的投影将开槽1021分割为两部分。这样,开槽1021在第一跨接件4位置处形成一个短路结构,其等效于缩短了开槽1021的沿带状导体1022的布线方向的尺寸,从而可有效的减小对高频天线单元2的前后比、极化抑制比和增益稳定性等方向性参数的影响。另外,在反射板102上设置第一跨接件4,其对于带状导体1022的具体设置不造成影响,则带状导体1022形成的共模抑制电感结构的等效电感量不发生变化,从而可对高频天线单元2上产生的共模感应电流进行有效的抑制,以使低频天线单元1的极化抑制比和增益稳定性等方向性参数得到显著的改善。
在本申请中,对开槽1021的沿带状导体1022的布线方向的长度的控制除了可采用上述在反射板102上设置第一跨接件4的方式外,还可以其它的方式。示例性的,参照图20,图20为本申请一种可能的实施例提供的多频天线的结构示意图。在该实施例中,开槽1021包括互相分离的第一开槽部1021c和第二开槽部1021d,带状导体1022包括互相连接的第一导体部1022a和第二导体部1022b。其中,具体实施时,开槽1021界定出带状导体1022,可为第一开槽部1021c界定出第一导体部1022a,第二开槽部1021d界定出第二导体部1022b。
在具体设置开槽1021时,继续参照图20,第一开槽部1021c可为闭合的环形槽,该环形槽的形状可以但不限于为“O”形或者“D”形等。第二开槽部1021d可为半包围的、一端具有开口的半闭合槽,该半闭合槽的形状可以但不限于为U形。当第二开槽部1021b为U形槽时,U形槽的开口朝向背离第一开槽部1021c的一侧。这样,在反射板102所在层上,带状导体1022的第一导体部1022a与第二导体部1022b为互不连接的两段,第二导体部1022b接地设置。
在本申请中,带状导体1022的第一导体部1022a与第二导体部1022b的连接方式有很多,可参照图21,图21为本申请另一个可能的实施例的多频天线中反射板的结构示意图。在该实施例中,多频天线包括第二跨接件5,第二跨接件5的两端分别与第一导体部1022a及第二导体部1022b连接,从而使第一导体部1022a与第二导体部1022b通过第二跨接件5进行连接。
可以理解的是,在本申请实施例中,反射板102的位于开槽周侧的部分在第一开槽部1021c和第二开槽部1021d之间通过第二跨接件5短路连接,其等效于缩短了开槽1021的沿带状导体1022的布线方向的尺寸,从而可有效的减少高频信号从开槽1021处向反射板102的背面泄露,以减小对高频天线单元2的前后比、极化抑制比和增益稳定性等方向性参数的影响。
另外,通过第二跨接件5将第一导体部1022a和第二导体部1022b连接,其对于带状导体1022的布线方向的长度基本不造成影响,则带状导体1022形成的共模抑制电感结构的等效电感量不发生变化,从而可对高频天线单元2上产生的共模感应电流进行有效的抑制,以使低频天线单元1的极化抑制比和增益稳定性等方向性参数得到显著的改善。
可参照图22,在本申请该实施例中,多频天线可基于PCB的结构进行设置。由于PCB通常由导体层和设置于相邻的两个导体层之间的介质基板309构成,这样,可将反射板102 和微带线306设置于印制电路板的不同导体层,并使第二跨接件(图中未示出)与微带线306设置于印制电路板的同一导体层。采用本方案的多频天线,可避免增加PCB的导体层的层数,从而有效的降低多频天线的成本。另外,在该实施例中,在将第二跨接件5的两端可分别通过开设于印制电路板的过孔与第一导体部1022a连接和第二导体部1022b连接。从而可有效的简化该多频天线的结构以及加工工艺。
在本申请实施例中,不对第二跨接件5的数量进行具体的限定。示例性的,一并参照图21和图23,第二跨接件5可为两个,且该两个第二跨接件5分别位于微带线306的两侧,两个第二跨接件5的两端分别与第一导体部1022a连接和第二导体部1022b连接。可参照图22,采用该方案,可保证微带线306的回流连续,从而有效的提高微带线306各处阻抗的连续性,进而提高高频天线单元2的辐射效率和工作稳定性。
另外,在本申请该实施例中,为了实现对微带线306的阻抗进行控制,可对微带线306与第二跨接件5之间的间距进行调整。示例性的,第二跨接件5与微带线306之间的间距为0.1~10倍的介质基板309的厚度,以实现微带线306各处阻抗的连续性。
可以理解的是,本申请该实施例的多频天线的其它结构可参照上述实施例进行设置,在此不进行赘述。
考虑到频率选择表面(frequency selective surface,FFS)具备定向反射、空间滤波、馈电以及共模抑制的功能,因此,为了使多频天线能够集成更多的功能,在本申请一些实施例中,参照图24和图25,还可以使反射板102具有周期排布的网格结构1023。在该实施例中,带状导体1022可设置于网格结构1023之间的局部连续金属面内。或者,带状导体1022还可以设置于单一的网格结构1023的区间内,以实现多频天线的性能综合优化。另外,在该实施例中,多频天线的其它结构均可参照上述任意实施例进行设置,在此不进行赘述。
本申请还提供一种通讯设备,该通讯设备包括上述任一实施例的多频天线,通讯设备可以但不限于为基站、雷达或者其它设备。在该通讯设备中,带状导体形成的共模抑制电感结构可对高频天线单元上产生的共模感应电流进行有效的抑制,从而使低频天线单元1的极化抑制比和增益稳定性等方向性参数得到显著的改善。并且,微带线各处的阻抗连续,其可提高高频天线单元的辐射效率和工作稳定性。另外,该多频天线的制作成本较低,从而可有效的降低整个通讯设备的成本。
显然,本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的保护范围。这样,倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内,则本申请也意图包含这些改动和变型在内。
Claims (20)
- 一种多频天线,其特征在于,包括反射板以及馈电结构;所述反射板设有开槽,所述开槽界定出带状导体,所述带状导体为所述反射板的一部分,且所述带状导体的一端与所述反射板的其它部分连接;所述馈电结构包括用于所述多频天线中高频天线单元的微带线,所述微带线位于所述反射板的一侧,且所述微带线在所述反射板上的投影的至少部分落在所述带状导体的轮廓范围内。
- 如权利要求1所述的多频天线,其特征在于,所述馈电结构还包括馈电线,所述馈电线用于给所述高频天线单元的辐射部馈电;所述馈电线的信号导体与所述微带线连接,所述馈电线的接地导体与所述带状导体连接。
- 如权利要求1或2所述的多频天线,其特征在于,所述带状导体具有通孔,所述馈电线的信号导体穿过所述通孔与所述微带线连接。
- 如权利要求1~3任一项所述的多频天线,其特征在于,所述开槽为连续槽,所述多频天线还包括第一跨接件,所述开槽所形成的形状具有底部和开口端,所述第一跨接件设置于所述底部和所述开口端之间;所述带状导体位于所述第一跨接件和所述微带线之间,或所述微带线位于所述第一跨接件和所述带状导体之间;所述第一跨接件的两端分别位于所述开槽的背离所述带状导体的两侧,且所述第一跨接件的两端分别与所述反射板连接。
- 如权利要求4所述的多频天线,其特征在于,所述开槽为第一U形槽,所述微带线在所述反射板上的投影插设于所述第一U形槽界定的区域内。
- 如权利要求4或5所述的多频天线,其特征在于,所述第一跨接件、所述反射板和所述微带线分别位于印制电路板的不同导体层;所述第一跨接件通过开设于所述印制电路板的过孔与所述反射板连接。
- 如权利要求1~3任一项所述的多频天线,其特征在于,所述开槽包括互相分离的第一开槽部和第二开槽部,所述带状导体包括互相连接的第一导体部和第二导体部;所述开槽界定出带状导体,包括:所述第一开槽部界定出所述第一导体部,所述第二开槽部界定出所述第二导体部。
- 如权利要求7所述的多频天线,其特征在于,所述第一开槽部为环形槽,所述第二开槽部为第二U形槽,所述第二U形槽的开口朝向背离所述环形槽的一侧。
- 如权利要求7或8所述的多频天线,其特征在于,所述多频天线还包括第二跨接件,所述第二跨接件的两端分别与所述第一导体部和所述第二导体部连接。
- 如权利要求9所述的多频天线,其特征在于,所述反射板和所述微带线位于印制电路板的不同导体层,所述第二跨接件与所述微带线位于所述印制电路板的同一导体层;所述第二跨接件的两端分别与所述第一导体部连接和所述第二导体部连接,包括:所述第二跨接件的两端通过开设于所述印制电路板的过孔分别与所述第一导体部连接和所述第二导体部连接。
- 如权利要求10所述的多频天线,其特征在于,所述第二跨接件为两个,两个所述第二跨接件分别设置于所述微带线的两侧。
- 如权利要求10或11所述的天线,其特征在于,所述印制电路板包括设置于所述 反射板与所述微带线之间的介质基板,所述第二跨接件与所述微带线之间的间距为0.1~10倍的所述介质基板的厚度。
- 如权利要求1~12任一项所述的多频天线,其特征在于,所述馈电结构还包括馈电接头,所述馈电接头与所述微带线设置于所述反射板的同一侧;所述微带线与所述馈电接头连接。
- 如权利要求1~13任一项所述的多频天线,其特征在于,所述反射板具有周期排布的网格结构,所述带状导体设置于所述网格结构之间;或所述带状导体设置于所述网格结构内。
- 如权利要求1~14任一项所述的多频天线,其特征在于,在垂直于所述带状导体布线的方向上,所述带状导体的宽度为所述微带线宽度的0.2~5倍。
- 如权利要求15所述的多频天线,其特征在于,在垂直于所述带状导体布线的方向上,所述带状导体的宽度为0.1mm~10mm。
- 如权利要求1~16任一项所述的多频天线,其特征在于,在所述带状导体布线方向上,所述带状导体的长度大于1/20的所述低频天线单元的波长。
- 如权利要求1~17任一项所述的多频天线,其特征在于,所述带状导体的布线方向上的长度,与在垂直于所述带状导体布线方向上所述带状导体的宽度的比值大于5:1。
- 如权利要求1~18任一项所述的多频天线,其特征在于,所述多频天线的低频天线单元与高频天线单元之间的最大间距小于0.5倍的所述低频天线单元的波长。
- 一种通信设备,其特征在于,包括如权利要求1~19任一项所述的多频天线。
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EP4246721A4 (en) | 2024-02-21 |
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