WO2022131395A1 - Module de conversion thermoélectrique - Google Patents

Module de conversion thermoélectrique Download PDF

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Publication number
WO2022131395A1
WO2022131395A1 PCT/KR2020/018419 KR2020018419W WO2022131395A1 WO 2022131395 A1 WO2022131395 A1 WO 2022131395A1 KR 2020018419 W KR2020018419 W KR 2020018419W WO 2022131395 A1 WO2022131395 A1 WO 2022131395A1
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WIPO (PCT)
Prior art keywords
thermoelectric
heat
substrate
thermoelectric element
conversion module
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PCT/KR2020/018419
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English (en)
Korean (ko)
Inventor
손경현
양승호
양승진
황병진
연병훈
이태희
장봉중
Original Assignee
엘티메탈 주식회사
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Priority to PCT/KR2020/018419 priority Critical patent/WO2022131395A1/fr
Publication of WO2022131395A1 publication Critical patent/WO2022131395A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/853—Thermoelectric active materials comprising inorganic compositions comprising arsenic, antimony or bismuth

Definitions

  • the present invention relates to a thermoelectric conversion module having improved heating performance through structural improvement, and more particularly, it can include at least two thermoelectric elements to increase thermal conversion efficiency, and cooling and heating in one direction based on the thermoelectric element It is not only possible at the same time, but also relates to a thermoelectric conversion module in which the heating performance of the heating part is increased by extending the length and/or area of the heating part by at least 1.5 times compared to the cooling part.
  • thermoelectric element may be configured by arranging a plurality of pairs of N-type and P-type semiconductors on a plane, connecting them in series using a metal electrode, and arranging them on upper and lower substrates.
  • a temperature difference is applied to the upper and lower parts of the thermoelectric element, power is generated by the Seeback effect.
  • a temperature difference between the upper and lower parts is generated to cool the upper part and heat the lower part. This will generate the Peltier effect. It can be used as a power generation or temperature control device by using the thermoelectric characteristics of the above-described thermoelectric element.
  • the temperature control device may be configured by attaching a heat dissipation member to each of the heat generating unit and the cooling unit of the thermoelectric element, and may simultaneously dehumidify and dry the fluid passing through the cooling unit and the heat generating unit.
  • the fluid flowing into the interior is dehumidified as moisture condenses in the cooling unit, and then, the dehumidified fluid passes through the heating unit and is dried.
  • the air introduced through a fan first passes through a conduit in which the heat dissipating member of the cooling unit is disposed, and then is guided to a separate conduit in which the heat dissipating member of the heat generating unit is disposed, and drying is performed.
  • the cooling unit and the heating unit conduit are separately present as described above, as the flow of the fluid increases, a fluid vortex and a decrease in the flow rate are caused. A problem of lowering occurs.
  • the technical problem to be achieved by the present invention is to increase the heat conversion efficiency by including at least two thermoelectric elements while minimizing the vortex generation and flow velocity reduction of the fluid by simultaneously performing cooling and heating of the fluid in one direction, and heating the heating part It is to provide a novel structure of a thermoelectric conversion module with improved characteristics to increase drying efficiency.
  • the present invention provides a thermoelectric element unit in which at least two thermoelectric elements having a heating unit and a heat absorbing unit are connected in parallel; a cooling unit interposed between opposing heat absorbing units among at least two thermoelectric elements and extending in one direction; a heating part connected to the heating part of the at least two thermoelectric elements, respectively, and extending in another direction on the same plane as the cooling part; and a flow path formed between the cooling unit and the heating unit to allow a heat exchange medium to flow through, wherein the length ( D H ) of the heating unit on a plane is 1.5 times greater than the length of the cooling unit (DC ). module is provided.
  • the length ( D H ) of the heating part on a plane may be 2.0 to 3.0 times greater than the length (DC ) of the cooling part.
  • the flow path may be formed in one direction with respect to the thermoelectric element unit.
  • the thermoelectric element unit may include: a first thermoelectric element having a heat generating unit on one surface and a heat absorbing unit on the other surface; a second thermoelectric element having a heat absorbing part disposed opposite to the heat absorbing part of the first thermoelectric element, and a second thermoelectric element having a heat generating part on an opposite surface of the heat absorbing part, wherein the first thermoelectric element's heat generating part and the second thermoelectric element generate heat
  • the units may be respectively disposed on the outer surface of the thermoelectric element unit.
  • the cooling unit is connected to the heat absorbing part substrate of the first thermoelectric element and the heat absorbing part substrate of the second thermoelectric element
  • the heating part is connected to the heat absorbing part substrate of the first thermoelectric element and the second thermoelectric element. 2 It may be connected to the heating part substrate of the thermoelectric element.
  • the cooling unit one side of which is interposed between the heat absorbing portion substrate of the first thermoelectric element and the heat absorbing portion substrate of the second thermoelectric element is in contact with, and the other side is extended in one direction a first heat transfer member; and a heat absorbing fin provided on the other surface of the first heat transfer member and disposed to extend in one direction.
  • the heat generating unit one side is configured in a "U" shape to contact the heat generating unit substrate of the first thermoelectric element and the heat generating unit substrate of the second thermoelectric element, respectively, the other side is the a second heat transfer member extending in the other direction on the same plane as the cooling unit and connecting the one side to the other side; and heat dissipation fins provided on one side and the other surface of the second heat transfer member and extending in one direction.
  • the heat dissipation fin may include: a first heat dissipation fin disposed on the other surface of the second heat transfer member; and a second heat dissipation fin disposed on one surface of the second heat transfer member in the same direction as the first heat dissipation fin and has a fin height different from that of the first heat dissipation fin.
  • the height of the heat absorbing fin and the height of the first heat dissipation fin may be substantially the same, and the height of the first heat dissipation fin may be greater than the height of the second heat dissipation fin.
  • the end length of the heat absorbing fin, the first heat dissipation fin, and the second heat dissipation fin may be the same with respect to the first heat transfer member.
  • the heat absorbing fin, the first heat dissipation fin, and the second heat dissipation fin may include a plurality of structures each having a hollow shape, a fin shape, or a louver shape.
  • the first heat transfer member, the second heat transfer member, the heat absorbing fin, and the heat dissipation fin are respectively aluminum (Al), zinc (Zn), copper (Cu), nickel (Ni), and cobalt ( Co) may include at least one metal material.
  • the first thermoelectric element or the second thermoelectric element may include: a first substrate; a second substrate facing the first substrate; a first electrode and a second electrode respectively disposed between the first substrate and the second substrate; and a plurality of thermoelectric legs interposed between the first electrode and the second electrode.
  • first substrate and the second substrate may be the same as or different from each other, and may each independently be a ceramic substrate or a conductive substrate.
  • the conductive substrate may include: a metal substrate; and an insulating layer formed on one surface thereof.
  • the first substrate, the second substrate, the first electrode, or the second electrode is the same as or different from each other, and each of aluminum (Al), zinc (Zn), copper (Cu), At least one metal of nickel (Ni) and cobalt (Co) may be included.
  • thermoelectric leg is Bi-Te-based, Co-Sb-based, Pb-Te-based, Ge-Tb-based, Si-Ge-based, Sb-Te-based, Sm-Co-based, transition metal It may include at least one thermoelectric semiconductor material selected from silicide, Skuttrudite, Silicide, Half heusler, and combinations thereof.
  • thermoelectric conversion module may be provided in a washing machine, a dryer, or a dehumidifier.
  • heat conversion efficiency can be increased by including at least two thermoelectric elements, and the positions of the cooling unit and the heating unit are arranged in one direction with respect to the thermoelectric element as a reference, but the cooling unit and the By adjusting the length/area of the heating unit within a predetermined range, it is possible to significantly improve the heating performance and drying efficiency of the fluid under the same power without generating vortexes and reducing the flow rate of the fluid.
  • thermoelectric conversion module 1 is a perspective view illustrating a thermoelectric conversion module according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the thermoelectric conversion module according to FIG. 1 .
  • thermoelectric conversion module 3 is a conceptual diagram illustrating a flow path direction of the thermoelectric conversion module according to FIG. 1 .
  • thermoelectric element 4 is a perspective view illustrating a thermoelectric element according to an embodiment of the present invention.
  • thermoelectric conversion module 5 is a cross-sectional view of a thermoelectric conversion module according to Comparative Example 1 (prior art).
  • thermoelectric conversion module manufactured in Example 1 is a graph showing the results of 5 minutes measurement of the temperature of the heat dissipation fin and the outlet temperature change of the fluid using the thermoelectric conversion module manufactured in Example 1 for each position.
  • thermoelectric conversion module 7 is a graph showing the results of 5 minutes measurement of the temperature of the heat dissipation fin and the outlet temperature change of the fluid using the thermoelectric conversion module manufactured in Comparative Example 1.
  • thermoelectric element unit 100: thermoelectric element unit
  • a component when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements.
  • planar when referred to as “planar”, it means when the target part is viewed from above, and “in cross-section” means when viewed from the side when the cross-section of the target part is vertically cut.
  • An object of the present invention is to provide a novel structure of a thermoelectric conversion module provided in a washing machine or dryer, in which heating performance is significantly increased without vortex generation and flow rate reduction of a fluid through structural improvement.
  • a cooling unit for condensing and removing moisture from a heat exchange medium (eg, fluid, air, etc.) flowing into the interior, a thermoelectric element, and a heating unit for heating the dry air from which moisture has been removed from the cooling unit are included.
  • a heat exchange medium eg, fluid, air, etc.
  • a thermoelectric element e.g., thermoelectric element flowing into the interior
  • a thermoelectric element e.g., a thermoelectric element part
  • a cooling part eg, heat absorbing fin
  • a heat generating part eg, heat dissipating fin
  • thermoelectric elements to increase the thermal conversion efficiency of cooling and heat generation
  • the cooling and heating of the fluid passing through the thermoelectric conversion module to which the thermoelectric element is applied can be simultaneously performed in one conduit, so that the fluid Even if the flow rate of the fluid increases, the flow rate of the fluid can be continuously maintained by reducing the occurrence of vortex of the fluid.
  • the length/area of the heating unit (eg, heat dissipation fin) compared to the cooling unit (eg, heat absorbing fin) provided in the thermoelectric conversion module is extended to a predetermined range.
  • the temperature of the fluid passing through the heat dissipation fin of the thermoelectric conversion module The drying efficiency can be increased by significantly increasing the lifting and heating performance.
  • thermoelectric conversion module serves to remove moisture in a heat exchange medium (eg, fluid, air, etc.) flowing into the device by utilizing a thermoelectric element and to heat the dried heat exchange medium, It can be applied to a washing machine, a dryer and/or a dehumidifier.
  • a heat exchange medium eg, fluid, air, etc.
  • thermoelectric conversion module according to the present invention will be described with reference to the accompanying drawings.
  • the embodiment of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below.
  • FIG. 1 is a perspective view schematically showing the structure of a thermoelectric conversion module according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view of the thermoelectric conversion module
  • FIG. 3 is a flow path provided in the thermoelectric conversion module according to the present invention It is a conceptual diagram indicating the direction.
  • a thermoelectric conversion module includes: a thermoelectric element unit 100 to which at least two thermoelectric elements are connected in parallel; a cooling unit 200 interposed between opposing heat absorbing units among at least two thermoelectric elements and extending in one direction; a heating unit 300 connected to the heating units of the at least two thermoelectric elements, respectively, and extending in other directions on the same plane as the cooling unit 200; and a flow path (not shown) formed to allow a heat exchange medium to flow between the cooling unit 200 and the heat generating unit 300 .
  • the cooling unit 200 and the heat generating unit 300 performing a heat conversion function such as cooling or heating the incoming air (fluid) are, respectively, at least two thermoelectric elements constituting the thermoelectric element unit 100 ( It is disposed adjacent to any one of the first substrate 110 and the second substrate 120 provided in 100A and 100B.
  • a region in which the first substrate 110 of each thermoelectric element 100A, 100B is arranged and connected to perform a heat absorbing function is defined as the cooling unit 200
  • the second substrate of each thermoelectric element 100A, 100B An area in which 120) is arranged and connected to perform a heating function is defined as the heating unit 300 and will be described.
  • the cooling unit 200 functions as a dehumidifier to remove moisture by cooling and condensing air (fluid) introduced from the outside.
  • the heat generating unit 300 serves to heat and dry the dry air from which moisture has been removed from the cooling unit 200 .
  • the thermoelectric element unit 100 includes at least two thermoelectric elements 100A and 100B, which are connected in parallel to each other.
  • the thermoelectric element part 100 may include a first thermoelectric element 100A having a heat generating part on one surface and a heat absorbing part on the other surface; and a heat absorbing part disposed opposite to the heat absorbing part of the first thermoelectric element 100A; and a second thermoelectric element 100B having a heating part on the opposite surface of the heat absorbing part, wherein the heating part of the first thermoelectric element 100A and the heating part of the second thermoelectric element 100B are outside the thermoelectric element part It has a structure arranged on each side.
  • thermoelectric elements 100A and 100B are specifically exemplified and described in parallel.
  • the present invention is not limited to the above description, and an embodiment in which at least two thermoelectric elements 100A and 100B is connected in series or includes a series connection and a parallel connection at the same time also falls within the scope of the present invention.
  • the first thermoelectric element 100A or the second thermoelectric element 100B constituting the thermoelectric element unit 100 has a temperature drop of the cooling unit 200 and the heating unit 300 through thermoelectric characteristics generated when a current is applied. It plays a role in realizing the temperature rise at the same time.
  • the thermoelectric element unit 100 of the present invention includes at least two or more, specifically, two thermoelectric elements 100A and 100B, heat conversion efficiency can be increased during cooling and/or heat generation.
  • the first thermoelectric element 100A or the second thermoelectric element 100B may have a known configuration in which a P-type thermoelectric semiconductor and an N-type thermoelectric semiconductor are disposed between a pair of substrates facing each other, and thermoelectric power generation and / Alternatively, all elements for cooling are included.
  • each of the first thermoelectric element 100A or the second thermoelectric element 100B may include a first substrate 110 ; a second substrate 120 facing the first substrate 110; a first electrode and a second electrode respectively disposed between the first substrate 110 and the second substrate 120; and a plurality of thermoelectric legs 130 interposed between the first electrode and the second electrode to form a unit cell.
  • one of the pair of substrates 110 and 120 constitutes a heat absorbing part due to the Peltier effect when current is applied, and the other 110 and 120 constitutes a heat emitting part.
  • the cooling unit 200 is formed on the first substrate 110 connected to the first heat transfer member 210 , and the second substrate 120 connected to the second heat transfer member 310 .
  • the present invention is not limited thereto, and the positions of the heat absorbing part and the heat generating part may be appropriately changed if necessary.
  • the cooling unit 200 serves as a condenser that primarily performs cooling and condensation on air (eg, fluid) flowing into the interior to remove moisture.
  • the cooling unit is interposed between and in contact with the heat absorbing part substrate 110 of the first thermoelectric element 100A and the heat absorbing part substrate 110 of the second thermoelectric element 100B, and in particular, the first thermoelectric element 100A ) and a first heat transfer member 210 so that the heat absorbing function of the first substrate 110 provided in the second thermoelectric element 100B can be transferred; and a heat absorbing fin 220 having a flow path formed therein and extending in one direction.
  • first heat transfer member 210 is interposed between the first thermoelectric element 100A and the second thermoelectric element 100B and is in contact, and the other side is in contact with the outside of the thermoelectric element part 100 along one direction. is extended Specifically, one side of the first heat transfer member 210 is interposed between the first substrate 110 of the first thermoelectric element 100A and the first substrate 110 of the second thermoelectric element 100B in which the endothermic reaction occurs. In direct contact with them, the temperature is lowered, and this cold air is transferred to the heat absorbing fin 220 . Accordingly, the air introduced from the external fan (not shown) is supplied to the cooling unit 200, specifically, through the first substrate 110 provided in the first thermoelectric element 100A and the second thermoelectric element 100B, respectively.
  • the first heat transfer member 10 may have a substantially flat plate shape, and may be made of a conventional heat conductive material known in the art. For example, at least one metal of aluminum (Al), zinc (Zn), copper (Cu), nickel (Ni), and cobalt (Co) may be included. Its size can also be adjusted in various ways. Preferably, it may include at least one of copper (Cu) and aluminum (Al).
  • the heat absorbing fins 220 provided on the other surface of the first heat transfer member 210 described above may be disposed on all or part of the other surface of the first heat transfer member 210 spaced apart from the thermoelectric element unit 100 . have.
  • the heat absorbing fins 220 are disposed extending in one direction, for example, disposed in the direction of the flow path through which the fluid moves, specifically, may be disposed in the direction of the bottom of the first heat transfer member 210 .
  • the shape of the heat absorbing fin 220 is not particularly limited, and may have a shape of a heat absorbing fin known in the art. For example, it may include a plurality of structures having a hollow, fin, or louver shape.
  • the heat absorbing fin 220 may be made of a conventional thermally conductive material known in the art, for example, aluminum (Al), zinc (Zn), copper (Cu), nickel (Ni), and cobalt (Co) It may include at least one kind of metal material.
  • the first heat transfer member 210 and the heat absorbing fin 220 may be configured by bonding separate structures, or may be implemented as an integrated structure. In this case, the bonding method may be performed according to a conventional method known in the art, for example, bonding using a bonding material or a tape may be used.
  • the air cooled through the cooling unit 200 is discharged as moisture condenses, and then the dried air flows through the inside of the cooling unit 300 , specifically, the flow path formed by the flow path space between the plurality of heat absorbing fins 220 . It flows through the heat generating unit 300 (see FIG. 3).
  • the heat generating unit 300 serves to heat and dry the air condensed in the cooling unit 200 by using the thermal energy received from the thermoelectric element unit 100 .
  • the heating part 300 is a heating part substrate 120 of the thermoelectric element unit 100, specifically, the heating part substrate 120 of the first thermoelectric element 100A and the heating part substrate of the second thermoelectric element 100B ( 120), the second heat transfer member 310 so that the heating function of the second substrate 120 provided in the first thermoelectric element 100A and the second thermoelectric element 100B, for example, can be transmitted. ) and a heat dissipation fin 320 .
  • the heating unit 300 is simply arranged on the opposite surface of the cooling unit 200 around one thermoelectric element 100 , or the cooling unit 200 and the heating unit 300 are identical to each other. It was designed to have a size/area (see FIG. 5 below).
  • at least two or more thermoelectric elements constituting the thermoelectric conversion module are provided, but the arrangement structure of the heat generating unit 300 is modified and the length of the heat generating unit 300 compared to the cooling unit 200 / It is distinguished from the conventional thermoelectric conversion module in that the area ratio is extended to a predetermined range.
  • thermoelectric elements are provided to increase the efficiency of cooling and heat generation, and at the same time reduce the generation of vortex and the flow rate of fluid caused when moving from the cooling unit 200 to the heat generating unit 300 . While preventing , it is possible to significantly improve the heating performance of the heating unit 300 .
  • the length ( D H ) and/or area in the longitudinal direction on the plane of the heating unit 300 may be 1.5 times or more greater than the length (DC ) and/or area of the cooling unit 200, Specifically, it may be 2.0 to 3.0 times larger.
  • the length/area of the heat generating unit 300 compared to the cooling unit 200 specifically, the exposure length/exposed area of the heat dissipation fin 320 provided in the heat generating unit 300, is increased by 1.5 times or more compared to the heat absorbing fin 220. , it is possible to increase the temperature of the fluid by increasing the area of the heat generating unit 300 through which the fluid passes.
  • the lengths (D H , DC C ) of the heating unit 300 and the cooling unit 200 are measured based on the longitudinal length of the thermoelectric conversion module on a plane.
  • it is not particularly limited thereto, and adjusting the width direction length of the heating part 300 and the cooling part 200 or the area of the heating part 300 and the cooling part 200 to a predetermined range is also within the scope of the present invention. belongs to
  • thermoelectric conversion module satisfies the above-described plane length/area ratio parameter and the corresponding numerical value between the heating unit 300 and the cooling unit 200
  • the heating unit 300 constituting the thermoelectric conversion module It is not particularly limited in structure and/or material, shape, size, and the like.
  • the heat generating unit 300 has one side of a “C” shape, and the second substrate 120 of the first thermoelectric element 100A and the second thermoelectric element 100B of the second thermoelectric element 100B. 2 A second heat transfer member 310 in contact with the substrate 120, the other side extending in the other direction on the same plane as the cooling unit 200, the one side and the other side are connected to each other; and a heat dissipation fin 320 having a flow path formed therein and extending in the same direction as the heat absorbing fin 220 .
  • the second heat transfer member 310 may include a first heat transfer unit 311 in contact with the second substrate 120 of the second thermoelectric element 100B; a second heat transfer unit 312 in contact with the second substrate 120 of the first thermoelectric element 100A; A third heat transfer that is spaced apart from the first thermoelectric element 100A, the second thermoelectric element 100B, and the first heat transfer member 210 , and is positioned in parallel with the first heat transfer member 21 on the same plane. part 314; and a connection part 313 connecting the first heat transfer unit 311 , the second heat transfer unit 312 , and the third heat transfer unit 314 .
  • This second heat transfer member 310 is ' ', or the first heat transfer unit 311 in the form of; a second heat transfer unit 312; connection part 313; and the third heat transfer unit 314 may be bonded to each other through a bonding material or tape.
  • the second heat transfer member 310 may be made of a conventional heat conductive material known in the art. For example, at least one metal of aluminum (Al), zinc (Zn), copper (Cu), nickel (Ni), and cobalt (Co) may be included. Preferably, it may include at least one of copper (Cu) and aluminum (Al).
  • the size of the second heat transfer member 310 is not particularly limited as long as it satisfies the above-described length/area ratio of the cooling unit 200 to the heat generating unit 300 , and may be variously adjusted.
  • the heat dissipation fins 320 provided on the surface of the second heat transfer member 310 receive heat energy resulting from the exothermic reaction of the thermoelectric element unit 100 from the second heat transfer member 310 and use the heat to cool it. It performs a function of heating the dry air flowing in from the unit 200 to convert it into dry air.
  • the heat dissipation fins 320 may be disposed on a part or all of an area corresponding to the planar size of the heat generating part 300 , for example, all or part of the surface of the second heat transfer member 310 .
  • the heat dissipation fins 320 are preferably disposed on both one surface and the other surface of the second heat transfer member 310 .
  • the heat dissipation fin 320 may include a first heat dissipation fin 321 disposed on the other surface of the second heat transfer member 310 ; and a second heat dissipation fin 322 disposed on one surface of the second heat transfer member 310 in the same direction as the first heat dissipation fin 321 and has a fin height different from that of the first heat dissipation fin 321 .
  • the height of the first heat dissipation fin 321 may be greater than the height of the second heat dissipation fin 322 , and is not particularly limited.
  • the height of the first heat dissipation fin 321 may be substantially the same as the height of the heat absorbing fin 220 .
  • the end length of the heat absorbing fin 220 of the cooling unit 200 and the first heat dissipation fin 321 and the second heat dissipation fin 322 of the heat generating unit 300 with respect to the first heat transfer member 210 is can be the same.
  • the shape of the heat dissipation fin 320 is not particularly limited, and may have a shape known in the art. As an example, it may include a plurality of structures having a hollow, fin, or louver shape.
  • the material of the heat dissipation fin 320 may be configured the same as that of the heat absorbing fin 220 described above, for example, aluminum (Al), zinc (Zn), copper (Cu), nickel (Ni), and cobalt (Co). It may include at least one kind of metal material.
  • the second heat transfer member 310 and the heat dissipation fin 320 constituting the heat generating unit 300 may be configured by bonding separate structures, or may be implemented as an integrated structure. In this case, the bonding method may be performed according to a conventional method known in the art, for example, bonding using a bonding material or a tape may be used.
  • the flow path formed inside the cooling unit 200 and the heat generating unit 300 through which a fluid can flow is formed in one direction (or one direction) with respect to the thermoelectric element unit 100 .
  • the heat dissipation fins 320 are disposed extending in the same direction as the heat absorbing fins 220 , and specifically disposed toward the bottom of the second heat transfer member 210 . Accordingly, the flow path formed in the inside of the cooling unit 200 and the heat generating unit 300 may communicate in a straight line, and the thermoelectric conversion module including the above-described flow path increases the flow amount of the fluid, but the fluid vortex and the flow rate. The decrease is minimized, and the flow rate can be maintained (see FIG. 3 below).
  • the first heat transfer member 210 and the second heat transfer member 310 are disposed to be spaced apart from each other. In this case, the distance between them is not particularly limited, and may be appropriately adjusted within a range known in the art. Also, one end of the first heat transfer member 210 may be disposed closer to the thermoelectric element unit 100 than the heat absorbing fin 220 . In addition, one end of the first heat transfer member 210 is positioned in parallel with the second heat transfer member 310 and is specifically formed to extend toward the other side of the second heat transfer member 310 .
  • the separation distance between the thermoelectric element 100 and the heat absorbing fin 220 is equal to or greater than the separation distance between one end of the first heat transfer member 100 and the other side of the second heat transfer member 310 .
  • it is not particularly limited thereto, and may be appropriately changed within a range known in the art.
  • thermoelectric conversion module according to an embodiment of the present invention.
  • it is not limited only by the following manufacturing method, and the steps of each process may be modified or selectively mixed as needed.
  • the thermoelectric conversion module may be manufactured according to a method known in the art. For example, after preparing a plate-shaped first heat transfer member 210 and a bent second heat transfer member 310 having a 'C' shape on one side and a plate shape on the other side, respectively, the thermoelectric element unit 100 ) between the heat absorbing part substrate 110 of the first thermoelectric element 100A and the heat absorbing part substrate 110 of the second thermoelectric element 100B constituting the first heat transfer member 210 by interposing one side of the first heat transfer member 210 to bond, a heat absorbing fin 220 is disposed on the other surface of the first heat transfer member 210 to be bonded.
  • the heating part substrate 120 of the first thermoelectric element 100A and the heating part substrate 120 of the second thermoelectric element 100B are attached to one side of the second heat transfer member 310 having a “C” shape.
  • the second heat dissipation fins 322 and the first heat dissipation fins 321 having different heights are bonded to one side and the other side of the second heat transfer member 310 to complete fabrication.
  • the heat absorbing part substrate 110 of the first thermoelectric element 100A and the heat absorbing part substrate 110 of the second thermoelectric element 100B on the upper and lower surfaces of the first heat transfer member 10 based on one surface, respectively. After bonding, the first thermoelectric element 100A and the second thermoelectric element 100B are moved to one end of the first heat transfer member 10, and the first It may be manufactured by disposing the heat transfer fins 50 .
  • thermoelectric element 100A or 100B constituting the thermoelectric element unit 100 in the thermoelectric conversion module according to an embodiment of the present invention.
  • thermoelectric elements 100A and 100B may include a first substrate 110 ; a second substrate 120 facing the first substrate 110; a first electrode 140a and a second electrode 140b respectively disposed between the first substrate 110 and the second substrate 120; and a plurality of thermoelectric legs 130 interposed between the first electrode 140a and the second electrode 140b.
  • the first substrate 110 and the second substrate 120 each generate an exothermic or endothermic reaction when power is applied to the thermoelectric element, and may be made of a conventional electrically insulating material known in the art.
  • each of the first substrate 110 and the second substrate 120 may be a ceramic substrate composed of one or more of Al 2 O 3 , AlN, SiC, and ZrO 2 .
  • it may be composed of a high heat-resistance insulating resin or engineering plastic.
  • first substrate 110 and the second substrate 120 may be a metal substrate made of a conventional conductive metal material known in the art.
  • each of the first substrate 110 and the second substrate 120 may include at least one metal among aluminum (Al), zinc (Zn), copper (Cu), nickel (Ni), and cobalt (Co).
  • Al aluminum
  • Zn zinc
  • Cu copper
  • Ni nickel
  • Co cobalt
  • a first insulating layer is formed on one surface of the first substrate 110 on which the first electrode 140a is disposed, and the second substrate 120 on which the second electrode 140b is disposed.
  • a second insulating layer (not shown) may be formed on one surface, and the first insulating layer and the second insulating layer may have a structure in which they are disposed to face each other.
  • the first insulating layer and the second insulating layer are the same as or different from each other, and a conventional electrically insulating material known in the art for easy film formation may be used without limitation.
  • the thickness of the first insulating layer and the second insulating layer is not particularly limited, and may be, for example, 10 to 150 ⁇ m, specifically 30 to 120 ⁇ m.
  • the first substrate 110 and the second substrate 120 may each have a flat plate shape, and the size or thickness thereof is not particularly limited.
  • the positions of the heat absorption and heat generation of the substrate can be changed according to the direction of the current.
  • One of the two substrates is a cold side substrate on which an endothermic reaction occurs, and a heat dissipation pad may be applied to this substrate.
  • the heat dissipation pad may be formed of a silicone polymer or an acrylic polymer, and has a thermal conductivity in the range of 0.5 to 5.0 W/mk, thereby maximizing heat transfer efficiency. It can also act as an insulator.
  • the other one of the two substrates may be a heating part substrate (hot side).
  • the first substrate 110 connected to the above-described first heat transfer member 210 may be a heat absorbing part substrate
  • the second substrate 120 connected to the second heat transfer member 310 may be a heating part substrate. have.
  • a first electrode 140a and a second electrode 140b are respectively disposed on the first substrate 110 and the second substrate 120 that are disposed to face each other. That is, the second electrode 140b is disposed at a position opposite to the first electrode 140a.
  • the material of the first electrode 140a and the second electrode 140b is not particularly limited, and a material used as an electrode in the art may be used without limitation.
  • the first electrode 140a and the second electrode 140b are the same as or different from each other, and each independently aluminum (Al), zinc (Zn), copper (Cu), nickel (Ni), and cobalt ( Co) at least one metal may be used.
  • it may further include nickel, gold, silver, titanium, and the like. Its size can also be adjusted in various ways.
  • it may be a copper (Cu) electrode.
  • the first electrode 140a and the second electrode 140b may be patterned in a predetermined shape, and the shape is not particularly limited.
  • thermoelectric legs 130 are interposed between the first electrode 140a and the second electrode 140b.
  • the thermoelectric leg 130 includes a plurality of P-type thermoelectric legs 131 and N-type thermoelectric legs 132, respectively, which are alternately disposed in one direction. As described above, the P-type thermoelectric leg 131 and the N-type thermoelectric leg 132 adjacent in one direction are electrically connected in series to the first electrode 140a and the second electrode 140b, respectively. Each of these thermoelectric legs 130 includes a thermoelectric semiconductor substrate.
  • thermoelectric semiconductor included in the thermoelectric leg 130 may be formed of a conventional material in the art that generates electricity when a temperature difference occurs at both ends when electricity is applied, or when a temperature difference occurs at both ends.
  • thermoelectric semiconductors including at least one element selected from the group consisting of a transition metal, a rare earth element, a group 13 element, a group 14 element, a group 15 element, and a group 16 element may be used.
  • examples of the rare earth element include Y, Ce, La, and the like
  • examples of the transition metal include Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Cu
  • It may be at least one of Zn, Ag, and Re
  • examples of the group 13 element may include at least one of B, Al, Ga, and In
  • examples of the group 14 element include C, Si, Ge, Sn, and Pb.
  • examples of the group 15 elements may be at least one of P, As, Sb, and Bi
  • examples of the group 16 elements may include one or more of S, Se, and Te.
  • thermoelectric semiconductors include bismuth (Bi), tellium (Te), cobalt (Co), samarium (Sb), indium (In), and cerium (Ce) having a composition containing at least two or more of them. and non-limiting examples thereof, Bi-Te-based, Co-Sb-based, Pb-Te-based, Ge-Tb-based, Si-Ge-based, Sb-Te-based, Sm-Co-based, transition metal silicide-based, Scoo Terdite (Skuttrudite)-based, silicide (Silicide)-based, half whistler (Half heusler), or a combination thereof, and the like.
  • thermoelectric semiconductor a (Bi,Sb) 2 (Te,Se) 3 thermoelectric semiconductor in which Sb and Se are used as dopants may be exemplified, and as the Co-Sb-based thermoelectric semiconductor, CoSb may be exemplified.
  • Three -type thermoelectric semiconductor can be exemplified, and AgSbTe 2 and CuSbTe 2 can be exemplified as the Sb-Te-based thermoelectric semiconductor, and PbTe, (PbTe)mAgSbTe 2 and the like can be exemplified as the Pb-Te-based thermoelectric semiconductor.
  • thermoelectric semiconductor may be particles having a predetermined size, for example, an average particle diameter may be in the range of about 0.01 to about 100 ⁇ m.
  • thermoelectric semiconductor may be manufactured by various methods, and is not particularly limited.
  • the thermoelectric semiconductor may be manufactured by sequentially performing a pressure sintering method after performing a melt-spining method or a gas atomization method.
  • the thermoelectric leg 62 including the P-type thermoelectric leg and the N-type thermoelectric leg may be formed into a predetermined shape, for example, a rectangular parallelepiped shape by a method such as cutting, and applied to a thermoelectric element.
  • the thermoelectric element 100 includes: between the first electrode 140a and the thermoelectric leg 130 ; and a bonding material (not shown) disposed between at least one of, preferably, both of the thermoelectric leg 130 and the second electrode 140b.
  • a bonding material conventional bonding material components known in the art may be used without limitation.
  • the bonding material is Sn; a composition comprising a first metal of at least one of Pb, Al, and Zn;
  • the first metal may be formed of a composition including a second metal of at least one of Ni, Co, and Ag.
  • thermoelectric element 100 is disposed between the first electrode 140a and the thermoelectric leg 130 ; and a diffusion barrier layer (not shown) disposed between the thermoelectric leg 130 and the second electrode 140b.
  • a diffusion barrier layer can be used without limitation, a conventional component known in the art, for example, includes at least one selected from the group consisting of tantalum (Ta), tungsten (W), molybdenum (Mo) and titanium (Ti) can do.
  • the first electrode 140a and the second electrode 140b may be electrically connected to a power supply.
  • a DC voltage When a DC voltage is applied from the outside, the holes of the p-type thermoelectric leg and the electrons of the n-type thermoelectric leg move, thereby generating heat and endothermic heat at both ends of the thermoelectric leg.
  • at least one of the first electrode 140a and the second electrode 140b may be exposed to a heat source. When heat is supplied by an external heat source, electrons and holes move and current flows in the thermoelectric element to generate electricity.
  • thermoelectric element may be manufactured according to a method known in the art.
  • a ceramic substrate or a conductive substrate is used as a substrate, a conductive electrode pattern is formed on one surface of the substrate, and then heat-treated to fix it.
  • an insulating material is coated on one surface of the metal substrate on which the electrode is disposed, specifically, on one surface on which the thermoelectric leg is disposed to prevent conduction.
  • thermoelectric leg For an example of a method of manufacturing a thermoelectric leg using a thermoelectric material, slicing a Bi-Te or CoSb-based thermoelectric material to a desired thickness, and lapping to the final thickness, to increase the height of the material to 1 Adjust the step difference within /100. After forming a diffusion barrier film by surface coating of Co, Ni, Cr, and W on the surface of the thermoelectric material whose step is controlled, dicing, electric discharge machining, and multi-wire The thermoelectric leg is manufactured by cutting it to a desired size through a process such as.
  • thermoelectric legs are disposed between a pair of electrodes and then bonded.
  • a bonding material paste is applied to a predetermined thickness according to the pattern of the first electrode, and n-type and p-type thermoelectric legs are arranged thereon.
  • the final configuration is completed by placing the previously manufactured n-type and p-type thermoelectric legs in a state where only the bonding material is applied. Then, heat treatment at 200 to 500° C., final bonding, and connecting wires to complete the manufacture of the thermoelectric element.
  • thermoelectric conversion module undergoes condensation and drying processes using the effects of endothermic (cooling) and exothermic (heating) realized by applying a thermoelectric element, and includes at least two thermoelectric elements
  • the cooling unit eg, heat absorbing fin
  • the heating unit eg, heat dissipation fin
  • thermoelectric conversion module by extending the length/area of the heating part to a predetermined range compared to the cooling part, high drying efficiency can be exhibited by improving the heating performance of the heating part. Accordingly, when the thermoelectric conversion module according to an embodiment of the present invention is used, an excellent dehumidifying effect can be realized by increasing the heating performance and drying effect of the heat generating unit.
  • thermoelectric conversion module can be very universally applied to various home appliances and industrial equipment, including heat conversion devices requiring drying and dehumidification, washing machines, dryers, dehumidifiers, and the like.
  • thermoelectric conversion module of the present invention is not particularly limited to the above-described configuration, and if necessary, a conventional configuration known in the art may be separately employed, or may be selectively mixed and implemented.
  • thermoelectric conversion module shown in FIGS. 1 and 2 below was manufactured.
  • thermoelectric element having a size of 40.5 X 40.5 mm was used as the first thermoelectric element and the second thermoelectric element constituting the thermoelectric element unit.
  • a copper (Cu) metal plate was used as the first heat transfer member 300 used in the cooling unit and the second heat transfer member 400 used in the heat generating unit, respectively.
  • a thin metal having a thickness of 0.3 mm was used for the first and second heat transfer members, and heat absorbing fins and heat dissipating fins disposed on the surface of the heat transfer member were each made of Al alloy-based louver fins.
  • the length of the cooling unit including the first heat transfer member and the heat absorbing fin was 40 mm
  • the length of the heating unit including the second heat transfer member, the first heat dissipation fin, and the second heat dissipation fin was 80 mm.
  • the first and second heat transfer members and the heat dissipation fins were joined with solder paste, and thermal grease was applied between the thermoelectric element and the first and second heat transfer members to increase heat transfer efficiency and then joined using heat-resistant silicone.
  • the thermoelectric conversion module of Example 1 was manufactured.
  • thermoelectric conversion module of Comparative Example 1 was manufactured in the same manner as in Example 1, except that the length of the heat generating unit including the second heat transfer member and the heat dissipation fin was 40 mm instead of 80 mm in the same manner as the cooling unit (below see Fig. 5).
  • thermoelectric conversion module of Example 1 Compared with the thermoelectric conversion module of Example 1, one thermoelectric element was used.
  • the length of the heat dissipation fin of the heat dissipation part was manufactured to have the same size of 40 mm as the heat dissipation fin of the cooling part, and after placement in the conduit, an evaluation was performed to check the temperature difference between the inlet and the outlet by passing the fluid.
  • thermoelectric conversion module manufactured in Example 1 and Comparative Example 1 was placed in the conduit and the fluid was passed through, and then the temperature of each position of the heat dissipation fin and the temperature change of the fluid at the inlet and outlet were confirmed.
  • the results are shown in Table 1 and FIGS. 6-7, respectively.
  • thermoelectric conversion module of Comparative Example 1 As shown in Table 1, the temperature of the fluid passing through the thermoelectric conversion module of Comparative Example 1 was only about 40.0°C, and the temperature of the heating part was also 64°C (see FIG. 7 below). In contrast, in the thermoelectric conversion module of Example 1, it was found that the temperature of the heating part and the temperature of the fluid passing through the heating part were significantly increased compared to Comparative Example 1 (see FIG. 6 ). Through this, in the thermoelectric conversion module of the present invention, it was confirmed that the temperature of the fluid passing through the conduit was significantly increased and the heating performance was significantly increased under the same power condition through structural improvement.

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  • General Physics & Mathematics (AREA)
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Abstract

La présente invention concerne un module de conversion thermoélectrique ayant une performance de chauffage améliorée pour la même quantité d'énergie par l'intermédiaire d'une amélioration structurelle, et plus spécifiquement un module de conversion thermoélectrique qui comprend au moins deux éléments thermoélectriques et peut ainsi augmenter l'efficacité de conversion de chaleur lors du refroidissement et du chauffage, et dans lequel le refroidissement et le chauffage d'un fluide traversant l'intérieur sont réalisés dans un conduit, la longueur et/ou la surface d'une partie de chauffage étant augmentée par rapport à une partie de refroidissement pour être dans une plage prédéterminée, de telle sorte que la performance de chauffage de fluide est améliorée.
PCT/KR2020/018419 2020-12-16 2020-12-16 Module de conversion thermoélectrique WO2022131395A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070101602A1 (en) * 2005-11-04 2007-05-10 Lg Electronics Inc. Drum washing machine and clothes dryer using thermoelectric module
KR20150096180A (ko) * 2014-02-14 2015-08-24 엘지이노텍 주식회사 열전환장치
KR20150126828A (ko) * 2013-01-14 2015-11-13 젠썸 인코포레이티드 전기 디바이스의 열전 기반 열 관리
KR20160116776A (ko) * 2015-03-31 2016-10-10 엘지이노텍 주식회사 제습장치
KR20200034983A (ko) * 2018-04-04 2020-04-01 엘지이노텍 주식회사 열전소자

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070101602A1 (en) * 2005-11-04 2007-05-10 Lg Electronics Inc. Drum washing machine and clothes dryer using thermoelectric module
KR20150126828A (ko) * 2013-01-14 2015-11-13 젠썸 인코포레이티드 전기 디바이스의 열전 기반 열 관리
KR20150096180A (ko) * 2014-02-14 2015-08-24 엘지이노텍 주식회사 열전환장치
KR20160116776A (ko) * 2015-03-31 2016-10-10 엘지이노텍 주식회사 제습장치
KR20200034983A (ko) * 2018-04-04 2020-04-01 엘지이노텍 주식회사 열전소자

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