WO2022129758A1 - Structure simplifiee de cellules solaires tandem a deux terminaux - Google Patents
Structure simplifiee de cellules solaires tandem a deux terminaux Download PDFInfo
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- WO2022129758A1 WO2022129758A1 PCT/FR2021/052296 FR2021052296W WO2022129758A1 WO 2022129758 A1 WO2022129758 A1 WO 2022129758A1 FR 2021052296 W FR2021052296 W FR 2021052296W WO 2022129758 A1 WO2022129758 A1 WO 2022129758A1
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- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 79
- 229910021423 nanocrystalline silicon Inorganic materials 0.000 claims abstract description 59
- 229910021419 crystalline silicon Inorganic materials 0.000 claims abstract description 43
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 35
- 239000010703 silicon Substances 0.000 claims abstract description 35
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 238000005215 recombination Methods 0.000 claims abstract description 30
- 230000006798 recombination Effects 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910021424 microcrystalline silicon Inorganic materials 0.000 claims description 59
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 20
- 229910021425 protocrystalline silicon Inorganic materials 0.000 claims description 12
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 claims description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims description 8
- 229920001167 Poly(triaryl amine) Polymers 0.000 claims 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 abstract 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- -1 GalnP Inorganic materials 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000013041 optical simulation Methods 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- UUIQMZJEGPQKFD-UHFFFAOYSA-N Methyl butyrate Chemical compound CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 2
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000011534 incubation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- XDXWNHPWWKGTKO-UHFFFAOYSA-N 207739-72-8 Chemical compound C1=CC(OC)=CC=C1N(C=1C=C2C3(C4=CC(=CC=C4C2=CC=1)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)C1=CC(=CC=C1C1=CC=C(C=C13)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)N(C=1C=CC(OC)=CC=1)C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 XDXWNHPWWKGTKO-UHFFFAOYSA-N 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- PNKUSGQVOMIXLU-UHFFFAOYSA-N Formamidine Chemical compound NC=N PNKUSGQVOMIXLU-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-O Methylammonium ion Chemical compound [NH3+]C BAVYZALUXZFZLV-UHFFFAOYSA-O 0.000 description 1
- JKSIBASBWOCEBD-UHFFFAOYSA-N N,N-bis(4-methoxyphenyl)-9,9'-spirobi[fluorene]-1-amine Chemical compound COc1ccc(cc1)N(c1ccc(OC)cc1)c1cccc2-c3ccccc3C3(c4ccccc4-c4ccccc34)c12 JKSIBASBWOCEBD-UHFFFAOYSA-N 0.000 description 1
- DMBHHRLKUKUOEG-UHFFFAOYSA-N N-phenyl aniline Natural products C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000002042 Silver nanowire Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- FZHSXDYFFIMBIB-UHFFFAOYSA-L diiodolead;methanamine Chemical compound NC.I[Pb]I FZHSXDYFFIMBIB-UHFFFAOYSA-L 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000572 ellipsometry Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical class [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000013080 microcrystalline material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/50—Photovoltaic [PV] devices
- H10K30/57—Photovoltaic [PV] devices comprising multiple junctions, e.g. tandem PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0745—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells
- H01L31/0747—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells comprising a heterojunction of crystalline and amorphous materials, e.g. heterojunction with intrinsic thin layer
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0725—Multiple junction or tandem solar cells
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/078—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers including different types of potential barriers provided for in two or more of groups H01L31/062 - H01L31/075
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/20—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising organic-organic junctions, e.g. donor-acceptor junctions
- H10K30/211—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising organic-organic junctions, e.g. donor-acceptor junctions comprising multiple junctions, e.g. double heterojunctions
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/40—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a p-i-n structure, e.g. having a perovskite absorber between p-type and n-type charge transport layers
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/50—Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the present invention relates to the field of photovoltaic devices, in particular photovoltaic cells of the perovskite tandem type on silicon heterojunction with 2 terminals.
- the invention relates to a simplified structure having (photo)electric properties comparable to those of a conventional tandem structure.
- Solar cells convert part of the spectral range of solar radiation into energy. To increase the efficiency of this conversion, it is possible to manufacture structures with tandem architecture comprising two subassemblies (i.e. a lower cell and an upper cell), absorbing in different spectral domains.
- the lower cell 10 can be, for example, a cell made of perovskite, of CIGS (Cu(ln,Ga)Se 2 ), or it can be a cell based on silicon, for example, with homojunction or with silicon heterojunction (HET-Si or SHJ for “Silicon HeteroJunction solar cell”), of the PERC (“Passivated Emitter and Rear Contact”) or TopCon (“Tunnel Oxide Passivated Contact”) type or even an N-type PERT cell with double diffusion of phosphorus.
- HET-Si or SHJ for “Silicon HeteroJunction solar cell” of the PERC (“Passivated Emitter and Rear Contact”) or TopCon (“Tunnel Oxide Passivated Contact”) type or even an N-type PERT cell with double diffusion of phosphorus.
- the upper cell 30 can be, for example, a perovskite, organic or multi-junction cell (MJSC) based on III-V materials (AlGaAs, GalnP, GaAs).
- MJSC organic or multi-junction cell
- the NIP-type structure conventionally comprises from the rear face to the front face (figure IA):
- a lower cell 10 comprising a layer of n-type doped amorphous silicon 11 ((n) a-Si:H), an n-type doped crystalline silicon substrate 12 (c-Si(n)) placed between two layers of intrinsic amorphous silicon 13, 14 ((i) a-Si:H),
- an upper cell 30 comprising: an N type layer 33 (SnO 2 for example), an active layer made of a perovskite material 31, a P type layer 32 (PTAA for example).
- Lower and upper electrodes 40, 50 as well as electrical contacts 60, 70 complete the structure.
- a lower cell 10 comprising a layer of p-doped amorphous silicon 15 ((p) a-Si:H), an n-type doped crystalline silicon substrate 12 (c-Si(n)), placed between two layers of silicon intrinsic amorphous 13, 14 ((i) a-Si:H), an N-type doped amorphous silicon layer 11 ((n) a-Si:H),
- an upper cell 30 comprising: a P-type layer 32, an active layer of perovskite material 31 and an N-type layer 33.
- Each sub-cell 10, 30 of the tandem structure comprises layers which make it possible to separate and select the charges according to their polarity.
- the recombination zone 20 between the two sub-cells is called “recombination junction” because it allows the charges to recombine. It also allows the series connection of the sub-cells and thus the addition of their voltages. It must lead to the recombination of the electrons generated in the upper cell and the holes generated in the lower cell for a tandem of NIP structure (Fig.1A) and the reverse for a PIN structure (Fig.1B).
- the recombination zone 20 is, for example, formed of a tunnel junction formed of two highly doped layers: one of the P type 21 ((p+)pc-Si:H) and the other of the N type 22 ((n+)pc-Si:H). In the case of a NIP structure, the layer 21 of the recombination zone also plays the role of transmitter of the lower cell 10.
- tandem structures require many steps to be manufactured, which increases manufacturing costs and the number of layers and interfaces that can lower performance (by adding series resistance, contact resistances, unwanted recombinations ).
- NIP-like tandem structure comprising a perovskite upper cell and a lower cell based on crystalline silicon and poly-Si can work by directly positioning the upper cell on the lower cell (Shen et al. “In situ recombination junction between p-Si and TiO 2 enables high-efficiency monolithic perovskite/Si tandem cells”, Science Advances, 2018; 4: eaau9711). More particularly, an N-type TiO 2 layer is deposited by ALD directly on the P-doped silicon of the lower cell. Then, a layer of perovskite and a P-type layer of PTAA are deposited. The operation of this structure is made possible thanks to the low contact resistivity between the ALD layer of TiO 2 and the P-doped silicon of the lower cell.
- tandem perovskite-on-silicon homojunction structure was fabricated by directly depositing the N-type SnO2 layer of the upper perovskite cell onto the P-type layer of the lower cell (Zheng et al. "Large area efficient interface layer free monolithic perovskite/homo-junction-silicon tandem solar cell with over 20% efficiency", Energy Environ. Sci ., 2018, 11, 2432-2443).
- An object of the present invention is to propose a perovskite tandem structure on silicon heterojunction based on amorphous silicon and on two-terminal crystalline silicon having good electrical properties and which is simpler and less expensive to manufacture.
- the present invention proposes a structure of tandem solar cells with 2-terminal perovskite on silicon heterojunction based on amorphous silicon and crystalline silicon comprising from the rear face towards the front face:
- a first silicon heterojunction solar cell based on amorphous silicon and crystalline silicon comprising, from the rear face towards the front face: a first layer of a first type of conductivity in amorphous silicon, a crystalline silicon substrate (from the first type of conductivity or of a second type of conductivity) arranged between two layers of intrinsic amorphous silicon, and optionally a first layer of a second type of conductivity in amorphous silicon,
- a recombination zone comprising at least one layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity
- a second solar cell comprising an active layer made of a perovskite material and a second layer of a second type of conductivity, the recombination zone further comprising a second layer of the first type of conductivity in contact with the active layer of the second cell solar cell or a layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity in contact with the active layer of the second solar cell.
- the invention differs fundamentally from the prior art in that in these structures, one of the layers of the recombination zone fulfills a dual function: both the role of charge selection (N or P type contact ) and participates in recombination junction function.
- This functional structure allows the recombination of charges and the series connection between the two sub-cells, without adding a layer and/or material. Additional space between the two sub-cells of the tandem structure, as is the case in conventional tandem structures.
- the recombination zone is a fully recombinant P-N junction (regardless of the recombination mechanisms).
- the recombination zone causes no reverse potential: no voltage loss in the tandem solar cell.
- This simplified structure is easier to manufacture compared to the structures of conventional tandem solar cells.
- the reduction in the number of structural layers and therefore of steps in the manufacturing process lead to a reduction in manufacturing costs.
- the first type of conductivity is an N-type conductivity (i.e. it is a NIP-type tandem structure).
- the structure may comprise from the rear face towards the front face:
- the first silicon heterojunction solar cell based on amorphous silicon and crystalline silicon comprising from the rear face towards the front face: the first layer of the first type of conductivity (type N) in amorphous silicon and the crystalline silicon substrate arranged between the two layers of intrinsic amorphous silicon,
- the second perovskite solar cell comprising towards the front face: the second layer of the first type of conductivity (type N), preferably of SnO 2 , the active layer of a perovskite material and the second layer of a second type of conductivity ( type P) preferably in PTAA.
- type N first type of conductivity
- type P second type of conductivity
- the recombination zone is then formed of the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity (type P) and of the second layer of the first type of conductivity (type N). These two layers are in direct contact.
- the upper cell is a conventional cell. This configuration makes it possible to obtain high yields.
- the structure may comprise from the rear face towards the front face:
- the first silicon heterojunction solar cell based on amorphous silicon and crystalline silicon comprising from the rear face towards the front face: the first layer of the first type of conductivity (type N) in amorphous silicon and the crystalline silicon substrate arranged between the two layers of intrinsic amorphous silicon,
- the second perovskite solar cell comprising towards the front face: the active layer in a perovskite material and the second layer of the second type of conductivity (type P) preferably in PTAA.
- the recombination zone is then formed of the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity (type P) and of the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity (type N) which form a junction tunnel.
- the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity (type N) also serves as a charge extractor in the second cell (perovskite).
- perovskite There is no need to add a layer of the first type of conductivity (type N), such as a layer of SnO 2 , in the second solar cell.
- the active layer of the second solar cell is in direct contact with the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity (type N).
- the layers based on nanocrystalline or microcrystalline silicon can be deposited in the same equipment as the amorphous silicon layers of the lower cell and on large surfaces in a homogeneous manner, which simplifies the manufacturing process and facilitates the obtaining a homogeneous perovskite layer.
- the first type of conductivity is a P-type conductivity (ie it is a tandem structure of the type
- the structure may comprise from the rear face towards the front face:
- the first silicon heterojunction solar cell based on amorphous silicon and crystalline silicon comprising, from the rear face towards the front face: the first layer of the first type of conductivity (type P) in amorphous silicon, the crystalline silicon substrate disposed between the two layers of intrinsic amorphous silicon, possibly the first layer of the second type of conductivity (type N) in amorphous silicon,
- the second perovskite solar cell comprising towards the front face: the second layer of the first type of conductivity (type P), preferably in PTAA or in TFB or alternatively obtained from phosphonate(s), silanes or carboxylic acids, the layer active in a perovskite material and the second layer of the second conductivity type (type N), preferably in SnO 2 or even a PCBM/SnO 2 or PCBM/BCP stack.
- type P the first type of conductivity
- type N the second conductivity type
- the recombination zone is then formed of the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity (type N) and of the second layer of the first type of conductivity (type P). These two layers are in direct contact.
- the lower cell is a classic heterojunction cell and does not require additional development.
- the structure may comprise from the rear face towards the front face:
- the first silicon heterojunction solar cell based on amorphous silicon and crystalline silicon comprising from the rear face towards the face front: the first layer of the first type of conductivity (type P) in amorphous silicon, the crystalline silicon substrate placed between the two layers of intrinsic amorphous silicon, the first layer of the second type of conductivity (type N) in amorphous silicon,
- the second perovskite solar cell comprising towards the front face: the active layer in a perovskite material and the second layer of the second type of conductivity (N type) preferably in SnO 2 or even a PCBM/SnO 2 or PCBM/BCP stack.
- N type the second type of conductivity
- the recombination zone is then formed of the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity (type N) and a layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity (type P) which form a tunnel junction .
- the layer based on nanocrystalline or microcrystalline silicon of the first conductivity type (type P) also serves as a charge extractor in the perovskite cell.
- the active layer of the second solar cell is in direct contact with the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity (type P).
- the layers based on nanocrystalline or microcrystalline silicon can be deposited in the same equipment as the amorphous silicon layers of the lower cell and on large surfaces in a homogeneous manner, which simplifies the manufacturing process and facilitates the obtaining a homogeneous perovskite layer. Strong currents can be obtained with this architecture.
- the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity and/or the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity is in pc-Si:H (p+), pc- Si:H (n+), nc-SiC x type N or P or nc-SiO y type N or P with x ranging from 0 to 1 and y ranging from 0 to 2.
- nanocrystalline or microcrystalline is meant a layer comprising both an amorphous phase and a crystalline phase, the crystalline phase having a grain size of less than 30 nm. It is generally between 1 and 10 nm for nanocrystalline silicon and generally between 10 and 30 nm and preferably between 10 and 20 nm for microcrystalline. Sometimes, in the literature, for grain sizes below 10 nm, we also find the denomination of microcrystalline silicon.
- the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity and/or the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity has a thickness ranging from 15 nm to 60 nm and preferably from 20 nm to 40 nm.
- the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity and/or the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity has a conductivity greater than 10 S.cm.
- the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity and/or the layer based on nanocrystalline or microcrystalline silicon of the second type of conductivity has a doping rate of 10 18 /cm 3 to 10 22 /cm 3 , and preferably between 10 19 /cm 3 and 10 2 °/cm 3 for type P and between 10 2 °/cm 3 and 10 21 /cm 3 for type N.
- FIG. 1A previously described in the prior art represents, schematically and in section, a two-terminal PIN-PIN tandem structure.
- FIG. 1B previously described in the prior art represents, schematically and in section, a tandem PIN-PIN structure with two terminals.
- FIG. 2A represents, schematically and in section, a simplified tandem structure NIP-PIN with two terminals, according to a particular embodiment of the invention.
- FIG. 2B represents, schematically and in section, a simplified tandem PIN-PIN structure with two terminals, according to another particular embodiment of the invention.
- FIG. 3A represents, schematically and in section, a simplified tandem structure PIN-PIN with two terminals, according to another particular embodiment of the invention.
- FIG. 3B represents, schematically and in section, a simplified PIN-PIN tandem structure with two terminals, according to another particular embodiment of the invention.
- Figures 4A and 4B are graphs representing the EQE and the '1-Rtot' value as a function of the wavelength (with Rtot corresponding to the total reflection of the stack of the cell (without the metallization on the front face )), obtained for tandem structures polished on the front face and on the back face, of NIP type (corresponding to FIGS. 1A, 2A and 3A) and of PIN type (corresponding to FIGS. IB, 2B and 3B) respectively.
- Figures 5A and 5B are graphs representing the EQE and the value '1-Rtot' as a function of the wavelength, obtained for tandem structures whose substrate is polished on the front face and with a classic pyramidal texturing on the face rear, PIN type (corresponding to Figures IB, 2B and 3B) and PIN type (corresponding to Figures IA, 2A and 3A) respectively.
- Figures 6A and 6B are graphs representing the EQE and the value '1-Rtot' as a function of the wavelength, obtained for textured tandem structures on the front face and on the back face, of NIP type (corresponding to the figures IA, 2A and 3A) and PIN type (corresponding to Figures IB, 2B and 3B) respectively.
- FIGS. 2A, 2B, 3A and 3B represent four simplified 100 perovskite tandem structures on silicon heterojunction (amorphous silicon/crystalline silicon). Each of these tandem structures 100 includes:
- first cell 110 (or lower cell for “bottom cell”) with silicon heterojunction (HET-Si or SHJ for "Silicon HeteroJunction solar cell”) positioned on the rear face of the device,
- HET-Si or SHJ silicon heterojunction solar cell
- a recombination zone a fully recombinant P-N junction (regardless of the recombination mechanisms), produced without adding additional layers and/or materials; the recombination zone does not lead to any reverse potential (i.e. no voltage loss in the tandem solar cell),
- a second perovskite cell 130 (or upper cell for “top cell”) positioned on the front face of the device.
- the front face is the face intended to receive the light radiation (represented by arrows in the figures).
- This NIP-type (or standard transmitter) tandem 100 structure includes: - the first silicon heterojunction solar cell 110 (based on amorphous silicon and crystalline silicon) comprising from the rear face towards the front face: a first layer of n-doped amorphous silicon (for example a layer of n-doped hydrogenated amorphous silicon also denoted (n) a-Si:H) 111 and a doped crystalline silicon substrate 112 (for example an n-doped crystalline silicon substrate also denoted c-Si (n)) arranged between two layers of intrinsic amorphous silicon 113, 114 (also called layers of (i)a-Si:H or intrinsic hydrogenated amorphous silicon),
- a layer based on nanocrystalline or microcrystalline silicon of type P 121 for example a layer of hydrogenated microcrystalline silicon doped p+ also denoted layer (p+) pc-Si:H), which also serves as an emitter in the heterojunction cell,
- a second perovskite solar cell 130 comprising towards the front face: an N-type layer 133 (for example an SnO 2 layer), an active layer 131 made of a perovskite material and a P-type layer 132 (for example a layer of PTAA).
- N-type layer 133 for example an SnO 2 layer
- active layer 131 made of a perovskite material
- P-type layer 132 for example a layer of PTAA
- This tandem structure 100 of the PIN type (or with inverted emitter) comprises:
- the first silicon heterojunction solar cell 110 based on amorphous silicon and crystalline silicon comprising from the rear face towards the front face: a p-type amorphous silicon layer 115 (for example a p-doped hydrogenated amorphous silicon layer, also denoted (p) a-Si:H), a doped crystalline silicon substrate 112 (for example a c-Si(n) substrate) arranged between two layers of intrinsic amorphous silicon 113, 114 (for example (i) a- Si:H), and possibly a first layer of N-type amorphous silicon 111 (for example (n) a-Si:H), which is also the incubation layer of the nano or microcrystalline layer 122,
- a p-type amorphous silicon layer 115 for example a p-doped hydrogenated amorphous silicon layer, also denoted (p) a-Si:H
- a doped crystalline silicon substrate 112 for example a c-S
- N 122 for example a layer of hydrogenated microcrystalline silicon doped n+ also denoted layer (n+) pc-Si:H
- a second perovskite solar cell 130 comprising towards the front face: a P-type layer 132 (for example a PTAA or TBF layer), an active layer 131 made of a perovskite material and an N-type layer 133 (for example a layer in SnO 2 or a PCBM/SnO 2 or PCBM/BCP bilayer).
- a P-type layer 132 for example a PTAA or TBF layer
- an active layer 131 made of a perovskite material
- an N-type layer 133 for example a layer in SnO 2 or a PCBM/SnO 2 or PCBM/BCP bilayer.
- the layer based on nanocrystalline or microcrystalline silicon of the first type of conductivity (P in the case of a NIP structure and N in the case of a PIN structure) is in contact directly with the layer of the second type of conductivity (N in the case of a NIP structure and P in the case of a PIN structure) of the second cell 130.
- the recombination junction is located between the layer based on nanocrystalline silicon or microcrystalline material of the first conductivity type and the charge carrier/extractor material of the second conductivity type of the second solar cell 130 (i.e. between layers 121 and 133 for the NIP structure and between layers 122 and 132 for the PIN structure) .
- tandem structure 100 represented in FIG. 3A.
- This NIP-type (or standard transmitter) tandem 100 structure includes:
- a first silicon heterojunction solar cell 110 based on amorphous silicon and crystalline silicon comprising, from the rear face towards the front face: an N-type amorphous silicon layer 111 (for example (n) a-Si:H) and a crystalline silicon substrate 112 (for example a c-Si (n) substrate) arranged between two layers of intrinsic amorphous silicon 113, 114 (for example (i) a-Si:H),
- a layer based on nanocrystalline or microcrystalline silicon of type P 121 which also plays the role of emitter of the heterojunction cell (for example (p+)pc-Si:H) and a layer based on nanocrystalline or microcrystalline silicon of type N 122 (e.g. (n+)pc-Si:H),
- a second perovskite solar cell 130 comprising towards the front face: an active layer (131) made of a perovskite material and a P-type layer 132 (for example a PTAA layer).
- This tandem structure 100 of the PIN type (or with inverted emitter) comprises: - a first silicon heterojunction solar cell 110 based on amorphous silicon and crystalline silicon comprising from the rear face towards the front face: a layer of P-type amorphous silicon 115 (for example (p) a-Si:H) and a crystalline silicon substrate 112 (for example a c-Si (n) substrate) arranged between two layers of intrinsic amorphous silicon 113, 114 (for example (i) a-Si:H), possibly an amorphous silicon layer of type N 111 (for example (n) a-Si:H), which is also the incubation layer of the nano or microcrystalline layer 121,
- a second perovskite solar cell 130 comprising towards the front face: an active layer 131 made of a perovskite material and an N-type layer 133 (for example an SnO 2 layer or a PCBM/SnO 2 bilayer).
- the P-type nanocrystalline or microcrystalline silicon-based layer 121 or 122 and the N-type nanocrystalline or microcrystalline silicon-based layer 122 or 121 form a tunnel junction 120.
- the one of these layers is in direct contact with the active layer 131 of the second solar cell 130 and then also acts as a charge extractor in the second cell 130.
- the layers of nanocrystalline or microcrystalline silicon of P type (p+) and/or of N type (n+) can have a thickness ranging from 20 to 40 nm.
- the Fermi level is between 4.5 and 5.9 eV.
- the Fermi level is between 3.9 and 4.4 eV.
- Nanocrystalline or microcrystalline silicon layers are heavily doped.
- the doping of the nanocrystalline or microcrystalline (p+ or n+) silicon layers ranges, for example, from 10 18 to 10 22 /cm 3 .
- the layers based on nanocrystalline or microcrystalline silicon are in pc-Si:H (p+), pc-Si:H (n+), nc-SiC x type N or P or nc-SiO y type N or
- Such layers advantageously have a high vertical conductivity, a low vertical resistance (typically less than 0.5 Ohm.cm 2 ) and/or a lateral conductivity greater than 10" 3 S.cm -1 .
- the p/n type doping levels of the layers 111 and 115 are, for example, between 10 and 10 /cm '
- the silicon substrate 12 of the lower cell can be polished or textured (for example, it can be textured in the form of 2 ⁇ m pyramids).
- the amorphous layers of the lower cell having a thickness of a few nanometers, they will take the form of the texturing of the substrate.
- the N-type layer 133 of the perovskite cell 130 also called “electron transport layer” (or EIL for "Electron Injection Layer” or ETL for “Electron Transport Layer”) is, for example, a metal oxide such as zinc oxide (ZnO), aluminum doped zinc oxide also called AZO (ZnO: Al), titanium oxide (TiO 2 ) or tin oxide (SnO 2 ). It can also be a stack of [6,6]-phenyl-C 6 i-methyl butanoate and SnO 2 (PCBM/SnO 2 ) or [6,6]-phenyl-C 6 i- bathocuproine methyl butanoate (PCBM/ BCP).
- PCBM/SnO 2 [6,6]-phenyl-C 6 i- bathocuproine methyl butanoate
- the P-type layer 132 of the perovskite cell 130 is also called “hole transport layer” (or HTL for “Hole Transport Layer”).
- the P-type layer 132 is, for example, an organic compound such as Poly(3,4- ethylenedioxythiophene) Polystyrene sulfonate (PEDOT:PSS), [poly(bis 4-phenyl ⁇ 2,4,6-trimethylphenyl ⁇ amine)] (PTAA), [Poly(A/,A/'-bis(4-butylphenyl)-A/,A/'-bis(phenyl)-benzidine] (Poly-TPD), 2,2 , ,7,7 , -Tetrakis[N,N-di(4-methoxyphenyl)amino]-9,9'- spirobifluorene (spiro-OMeTAD), N4,N4'-bis(4-(6-((3- ethyloxetan-3-yl
- the active layer 131 of the perovskite cell 130 comprises at least one perovskite material.
- the perovskite material has the general formula ABX 3 with A representing one or more monovalent organic cations, such as an ammonium, such as methylammonium or formamidinium, or even a monovalent metal cation, such as cesium or rubidium; B representing a divalent metal cation such as Pb, Sn, Ag or a mixture thereof; and X representing one or more halide anions.
- the perovskite material may have the particular formula H 2 NCHNH 2 PbX 3 or CH 3 NH 3 PbX 3 with X a halogen. It may be, for example, methylammonium lead iodide CH 3 NH 3 Pbl 3 .
- the perovskite material has the formula Cs x FAi. x Pb(li. y Br y ) 3 .
- the tandem device 100 can also comprise:
- the lower electrode 140 can advantageously be opaque or of limited transparency, for example a conductive transparent oxide such as in particular ITO, IOH (hydrogenated indium oxide), or AZO
- a conductive transparent oxide such as in particular ITO, IOH (hydrogenated indium oxide), or AZO
- This electrode 150 can be made of conductive transparent oxide, typically indium-tin oxide (ITO) or zinc oxide doped with aluminum (ZnO: AI), IZO, IZrO, IWO, etc., or it can be formed from a transparent conductive polymer comprising silver nanowires, for example ,
- the contact times can be for example in gold, aluminum or silver (deposited for example by evaporation, or printed by screen printing, inkjet printing, etc.).
- Simplified tandem structures 100 are shown in Figures 2A, 2B, 3A and 3B.
- Tables 1 and 2 below list the thicknesses of the simulated layers for NIP and PIN type architectures respectively.
- the perovskite used in the simulations is of the Cs x FAi type.
- x Pb(li. y Br y )3 (with x ⁇ 0.20; 0 ⁇ y ⁇ 1).
- Two different thicknesses were used to obtain less current deviation between the two sub-cells when the surface state is modified.
- the results presented will be with a perovskite 250 nm thick when the front side is polished and 415 nm thick when textured.
- Optical simulations of these structures were carried out using the CROWM software, taking into account the optical indices of the layers, their thickness and the state of the surface (totally flat, textured, etc.). These simulations are performed between 310 and 1200 nm with the AMI.5 solar spectrum. The optical indices were extracted by ellipsometry from the experimental layers.
- the front and back faces of the tandem structures can be polished or textured independently of each other.
- FIGS. 3A and 3B prove to be different from the others in terms of distribution of the absorption in the tandem cell, on the other hand the resulting short-circuit currents are very similar.
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