WO2022127175A1 - 一种电子设备 - Google Patents

一种电子设备 Download PDF

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Publication number
WO2022127175A1
WO2022127175A1 PCT/CN2021/114443 CN2021114443W WO2022127175A1 WO 2022127175 A1 WO2022127175 A1 WO 2022127175A1 CN 2021114443 W CN2021114443 W CN 2021114443W WO 2022127175 A1 WO2022127175 A1 WO 2022127175A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
electronic device
heat dissipation
antenna unit
present application
Prior art date
Application number
PCT/CN2021/114443
Other languages
English (en)
French (fr)
Inventor
孙乔
李堃
呼延思雷
叶茂
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US18/001,753 priority Critical patent/US20230232587A1/en
Priority to EP21905108.3A priority patent/EP4156876A4/en
Publication of WO2022127175A1 publication Critical patent/WO2022127175A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

Definitions

  • the present application relates to the field of wireless communication, and in particular, to an electronic device.
  • the second generation (2G) mobile communication system mainly supported the call function.
  • Electronic equipment was only a tool for people to send and receive text messages and voice communication.
  • the wireless Internet access function uses voice channels for data transmission. to transfer, the speed is extremely slow.
  • electronic devices can also be used to listen to music online, watch online videos, real-time videos, etc.
  • various functional applications require wireless network to upload and download data, therefore, high-speed data transmission becomes extremely important.
  • the present application provides an electronic device, which solves the problem of mutual influence between the heat-dissipating component and the patch antenna in the electronic device by reusing the heat-dissipating components in the electronic device.
  • an electronic device comprising: a heat sink, a first feeding unit, a printed circuit board (PCB), a middle frame and a back cover; wherein the PCB is arranged around the middle frame and the back cover a part of the heat sink is arranged between the PCB and the back cover; the heat sink is provided with a first feed point, and the first feed unit is located in the first feed The electrical point is electrically connected with the heat sink.
  • PCB printed circuit board
  • the heat dissipation member can be used as a heat dissipation member to distribute heat evenly, so as to achieve the purpose of cooling down the overheated electronic device.
  • the heat sink can be used as the radiator of the antenna, forming an antenna unit with the feeding unit, and generating radiation to the outside. Quantity requirements can also be applied to other communication systems.
  • the electronic device further includes: a battery; the battery is provided in the space enclosed by the middle frame and the back cover; The part is disposed between the battery and the back cover.
  • a part of the heat sink may be arranged above the heat source, and the other part may be arranged in a low heat area to achieve the purpose of heat dissipation, and a part of the heat sink may not be arranged between the battery and the back cover.
  • the actual layout changes the placement position of the heat sink, which is not limited in this application.
  • the electronic device further includes a second feeding unit; wherein a second feeding point is provided on the heat sink, and the second feeding unit The heat sink is electrically connected at the second feed point.
  • the first feeding unit and the heat sink form the first antenna unit
  • the second feed unit and the heat sink form the second antenna unit
  • the heat sink may be shared as the radiator of the antenna
  • the electronic device further includes a floor; a first ground point is provided on the heat dissipation member, and the heat dissipation member is electrically connected to the floor at the first ground point. connect.
  • the current flow on the heat sink can be effectively changed, so as to affect the radiation characteristics of the antenna unit formed by the heat sink.
  • the heat dissipation member is electrically connected to the floor at the first ground point, including: the heat dissipation member is connected to the floor at the first ground point Direct connection or indirect coupling connection.
  • different grounding methods can be flexibly selected according to the spatial layout of the electronic device.
  • a slit is provided on the heat dissipation member.
  • the current path can be blocked by arranging a slit on the heat sink, so as to change the direction of the current on the heat sink, so as to affect the radiation characteristics of the antenna unit formed by the heat sink.
  • the slit is an open slit or a closed slit.
  • the size, position and quantity of the slits can be adjusted according to actual design or production needs.
  • the electronic device further includes a metal member; the metal member is disposed above the heat dissipation member.
  • the direction of the current on the heat sink is changed by indirect coupling of the metal parts, so as to affect the radiation characteristics of the antenna unit formed by the heat sink.
  • the metal member is disposed above the heat dissipation member, including: the metal member is disposed between the heat dissipation member and the PCB, or, all between the heat sink and the battery, or between the heat sink and the back cover, or the back cover is away from the surface of the heat sink.
  • the first feeding unit is electrically connected to the heat sink at the first feeding point, including: the first feeding unit is in The first feeding point is directly connected or indirectly coupled to the heat sink.
  • different power feeding modes can be flexibly selected according to the spatial layout of the electronic device.
  • the electronic device may further include a coupling member; wherein the first feeding unit is electrically connected to the coupling member, and the coupling member is in the first At the feeding point, the antenna unit formed by the first feeding unit and the heat sink is indirectly coupled and fed.
  • the coupling member may be realized by using a laser direct molding technology, printing on a flexible circuit board, or using a floating metal or the like.
  • FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of the relative positions of the heat sink and the patch antenna in the electronic device provided by the present application.
  • FIG. 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a cross-section of the first region along a first direction.
  • FIG. 5 is a schematic diagram of a cross-section of the heat sink along a second direction.
  • FIG. 6 is a simulation result diagram of the antenna unit shown in FIG. 3 .
  • FIG. 7 is a schematic structural diagram of an antenna layout in an electronic device.
  • FIG. 8 is a simulation result diagram between the antenna elements shown in FIG. 7 .
  • FIG. 9 is an electric field distribution diagram corresponding to 2.64 GHz.
  • FIG. 10 is an electric field distribution diagram corresponding to 3.5 GHz.
  • FIG. 11 is an electric field distribution diagram corresponding to 4 GHz.
  • FIG. 12 is an electric field distribution diagram corresponding to 4.7 GHz.
  • FIG. 13 is a schematic structural diagram of each region on a heat sink provided by an embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 15 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 16 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 17 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 18 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • connection can be understood as physical contact and electrical conduction between components; it can also be understood as a printed circuit board (printed circuit board, PCB) copper foil or wire between different components in the circuit structure It is a form of connection in the form of physical lines that can transmit electrical signals.
  • a “communication connection” may refer to the transmission of electrical signals, including wireless communication connections and wired communication connections. The wireless communication connection does not require a physical medium, and does not belong to the connection relationship that defines the product structure.
  • connection and “connection” can refer to a mechanical connection relationship or physical connection relationship, that is, the connection between A and B or the connection between A and B can refer to the existence of fastened components (such as screws, bolts, rivets, etc.) between A and B. etc.), or A and B are in contact with each other and A and B are difficult to be separated.
  • the technical solutions provided in this application are applicable to electronic devices using one or more of the following communication technologies: Bluetooth (blue tooth, BT) communication technology, global positioning system (global positioning system, GPS) communication technology, wireless fidelity (wireless fidelity) communication technology , WiFi) communication technology, global system for mobile communications (GSM) communication technology, wideband code division multiple access (WCDMA) communication technology, long term evolution (long term evolution, LTE) communication technology , 5G communication technology and other communication technologies in the future.
  • the electronic devices in the embodiments of the present application may be mobile phones, tablet computers, notebook computers, smart bracelets, smart watches, smart helmets, smart glasses, and the like.
  • the electronic device may also be a cellular phone, a cordless phone, a session initiation protocol (SIP) phone, a wireless local loop (WLL) station, a personal digital assistant (PDA), with wireless communication Functional handheld devices, computing devices or other processing devices connected to wireless modems, in-vehicle devices, electronic devices in 5G networks or electronic devices in the future evolved public land mobile network (PLMN), etc.
  • SIP session initiation protocol
  • WLL wireless local loop
  • PDA personal digital assistant
  • the application examples are not limited to this.
  • FIG. 1 exemplarily shows the internal environment of the electronic device provided by the present application, and the electronic device is a mobile phone for illustration.
  • the electronic device 10 may include: a cover glass 13, a display 15, a printed circuit board (PCB) 17, a housing 19 and a back cover ( rearcover )21.
  • PCB printed circuit board
  • rearcover back cover
  • the glass cover 13 may be disposed close to the display screen 15 , and may be mainly used for protecting and dustproofing the display screen 15 .
  • the display screen 15 can be a liquid crystal display (liquid crystal display, LCD), a light emitting diode (light emitting diode, LED) or an organic light-emitting diode (organic light-emitting diode, OLED), etc., and this application does not do this limit.
  • liquid crystal display liquid crystal display, LCD
  • light emitting diode light emitting diode, LED
  • organic light-emitting diode organic light-emitting diode, OLED
  • the printed circuit board PCB17 can be a flame-resistant material (FR-4) dielectric board, a Rogers (Rogers) dielectric board, or a mixed dielectric board of Rogers and FR-4, and so on.
  • FR-4 is the code name for a grade of flame-resistant materials
  • Rogers dielectric board is a high-frequency board.
  • a metal layer may be provided on the side of the printed circuit board PCB17 close to the middle frame 19 , and the metal layer may be formed by etching metal on the surface of the PCB17 . This metal layer can be used to ground the electronic components carried on the printed circuit board PCB17 to prevent electric shock to the user or damage to the equipment. This metal layer can be referred to as the PCB floor.
  • the electronic device 10 may also have other floors for grounding, such as a metal midframe or other metal planes in the electronic device.
  • a plurality of electronic components are arranged on the PCB 17, and the plurality of electronic components include one or more of a processor, a power management module, a memory, a sensor, a SIM card interface, etc., and the interior or surface of these electronic components will also be provided with metal .
  • the electronic device 10 may also include a battery, which is not shown here.
  • the battery can be arranged in the middle frame 19, the battery can divide the PCB 17 into a main board and a sub-board, the main board can be arranged between the frame 11 of the middle frame 19 and the upper edge of the battery, and the sub-board can be arranged in the middle frame 19 and the lower edge of the battery between.
  • the interior or surface of the battery may also be provided with a metal layer.
  • the middle frame 19 mainly plays a supporting role of the whole machine.
  • the middle frame 19 may include a frame 11, and the frame 11 may be formed of a conductive material such as metal.
  • the frame 11 can extend around the periphery of the electronic device 10 and the display screen 15 , and the frame 11 can specifically surround the four sides of the display screen 15 to help fix the display screen 15 .
  • the frame 11 made of metal material can be directly used as the metal frame of the electronic device 10 to form the appearance of the metal frame, which is suitable for metal industrial design (ID).
  • the outer surface of the frame 11 may also be made of a non-metallic material, such as a plastic frame, to form the appearance of a non-metal frame, which is suitable for a non-metal ID.
  • the back cover 21 may be a back cover made of a metal material or a back cover made of a non-conductive material, such as a non-metal back cover such as a glass back cover and a plastic back cover.
  • FIG. 1 only schematically shows some components included in the electronic device 10 , and the actual shapes, actual sizes and actual structures of these components are not limited by FIG. 1 .
  • the electronic device 10 may further include devices such as cameras and sensors.
  • the surface where the display screen of the electronic device is located is the front surface
  • the surface where the back cover is located is the back surface
  • the surface where the frame is located is the side surface
  • the antenna disposed on the back of the electronic device is generally a patch antenna.
  • the back cover of the electronic device begins to evolve towards a non-metallic direction.
  • the power consumption of the chip corresponding to the 5G wireless communication system will be about 2.5 times that of 4G, and the power consumption and heat generation during operation will rise sharply.
  • the heat dissipation design transfers the heat generated in the high heat area (the area where the chip on the PCB is located) to the low heat area (the area where the battery is located) through the heat sink to distribute the heat evenly.
  • the embodiment of the present application provides an antenna structure, which can take into account the radiation characteristics of the antenna and the heat dissipation performance of the heat dissipation member, and effectively solve the contradiction between the two.
  • FIG. 3 to FIG. 5 are schematic structural diagrams of an electronic device provided by an embodiment of the present application.
  • 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • 4 is a schematic diagram of a cross-section of the first region along a first direction.
  • 5 is a schematic diagram of a cross-section of the heat sink along a second direction.
  • the electronic device may include a heat sink 110 , a PCB 17 , a battery 20 and a middle frame 19 .
  • the PCB 17 and the battery 20 can be arranged in the area enclosed by the middle frame 19 , the part of the heat sink 110 can be arranged above the PCB 17 , and the part of the heat sink 110 can be arranged above the battery 20 .
  • a feeding point 111 may be provided in the first region 112 of the heat dissipation member 110 , and the power feeding unit 120 in the electronic device may be electrically connected to the heat dissipation member at the feeding point 111 .
  • the heat dissipation member 110 can uniformly distribute the heat in the electronic device. Therefore, part of the heat sink can be arranged above the heat source (electronic device on the PCB), and the other part can be arranged in the low heat area to achieve the purpose of heat dissipation.
  • the placement position of the heat sink is changed according to the actual layout in the electronic device, which is not limited in this application.
  • the electronic device may further include a power feeding unit 120 and a back cover 21 .
  • part of the heat sink 110 is disposed between the PCB 17 and the back cover 21 .
  • a portion of the heat dissipation member 110 is disposed between the battery 20 and the rear cover 21 .
  • the first direction may be the direction in which the short side of the frame of the electronic device is located.
  • the second direction may be the direction in which the long side of the frame of the electronic device is located.
  • the heat sink 110 provided in the embodiment of the present application can be used as a heat sink to transfer the heat generated in the high heat area (the area where the chip on the PCB is located) to the low heat area (the area where the battery is located), so that the heat is evenly distributed, so as to realize the protection of overheated electronic devices. cooling purpose.
  • the heat sink 110 can be used as a radiator of the antenna, forming an antenna unit with the feeding unit, and generating radiation to the outside. The requirement of the system on the number of antennas can also be applied to other communication systems.
  • the electronic device may further include a coupling member 121 , and the feeding unit 120 may be electrically connected to the coupling member 121 to perform indirect coupling and feeding for the antenna unit at the feeding point 111 .
  • the feeding unit 120 may also be directly connected to the heat sink 110 at the feeding point 111 to directly feed the antenna unit.
  • indirect coupling is a concept relative to direct coupling, that is, air-space coupling, and there is no direct electrical connection between the two.
  • direct coupling is a direct electrical connection, feeding directly at the feed point.
  • the coupling member 121 can be realized by using laser-direct-structuring (LDS), flexible printed circuit (FPC) printing, or using floating metal (FLM) or the like.
  • LDS laser-direct-structuring
  • FPC flexible printed circuit
  • FLM floating metal
  • the size of the heat sink 110 can be adjusted according to actual production or design.
  • the length L1 of the heat sink 110 is 98 mm and the width L2 is 65 mm for illustration, but the specific size of the heat sink 110 is not limited.
  • the size of the first region 112 of the heat dissipation member 110 may be adjusted according to actual production or design.
  • the length L3 of the first region 112 of the heat sink 110 is 24 mm and the width L4 is 16 mm for illustration, but the specific size of the heat sink 110 is not limited.
  • the position of the first region 112 of the heat sink 110 can also be adjusted.
  • the first region 112 is taken as an example in the junction area of two sides of the heat sink 110 , and it can also be set at other positions of the heat sink 110 , such as the central area.
  • the PCB 17 may include a shielding cover 172 and a metal layer 171 , the metal layer 171 may be used as a ground (ground, GND) of the antenna unit, and the shielding cover 172 is electrically connected to the metal layer 171 for preventing Electronic devices within shield 172 are subject to external electromagnetic interference.
  • GND ground
  • the distance H1 between the shield 172 and the heat sink 110 may be 0.2 mm
  • the distance H2 between the metal layer 171 and the heat sink 110 may be 0.8 mm
  • the coupling member 121 The distance H3 from the metal layer 171 may be 0.65 mm
  • the distance H4 between the coupling member 121 and the heat dissipation member 110 may be 0.15 mm
  • the distance H5 between the heat dissipation member 110 and the battery 20 may be 0.1 mm.
  • an insulating layer may be provided on the surface of the heat sink 110 close to the battery 20 to avoid direct contact between the heat sink 110 and the metal components and reduce the performance of the antenna unit.
  • the heat sink 110 may be a graphite sheet, a copper sheet, etc., and has the characteristics of fast heat dissipation and high electrical conductivity.
  • FIG. 6 is a simulation result diagram of the antenna unit shown in FIG. 3 . Among them, the simulation results of S-parameters, radiation efficiency (radiation efficiency) and system efficiency (total efficiency) are included.
  • the working frequency band of the antenna unit formed by multiplexing the heat sink provided by the embodiment of the present application can cover the N41 (2.496GHz–2.69GHz) frequency band, the N77 (3.3GHz–4.2GHz) frequency band and the N79 (4.4GHz) frequency band –5.0GHz) frequency band.
  • the radiation efficiency and the system efficiency can also meet the requirements.
  • the heat sink is used as the antenna radiator, but the radiation area of the heat sink is much larger than the operating wavelength corresponding to the lowest operating frequency band of the antenna unit.
  • FIG. 7 is a schematic structural diagram of an antenna layout in an electronic device.
  • the electronic device may include an antenna unit 1 , an antenna unit 2 , an antenna unit 3 , an antenna unit 4 and an antenna unit 5 .
  • the antenna unit 1 is a solution of using a heat sink as an antenna radiator provided by an embodiment of the present application.
  • the antenna unit 2 , the antenna unit 3 , the antenna unit 4 and the antenna unit 5 are common metal frame antennas, which are only used as examples in this application.
  • FIG. 8 is a simulation result diagram between the antenna elements shown in FIG. 7 .
  • S11 is the S parameter corresponding to the antenna unit 1
  • S22 is the S parameter corresponding to the antenna unit 2
  • S33 is the S parameter corresponding to the antenna unit 3
  • S44 is the S parameter corresponding to the antenna unit 4
  • S55 is the S parameter corresponding to the antenna unit 4.
  • Antenna unit 1, antenna unit 2, antenna unit 3, antenna unit 4 and antenna unit 5 can all work in the corresponding working frequency bands, and antenna unit 1 and antenna unit 2, antenna unit 3, antenna unit 4 and antenna unit 5 can maintain good isolation, from the results, the worst isolation is -18dB.
  • FIG. 9 to 12 are electric field distribution diagrams of the antenna unit shown in FIG. 3 .
  • FIG. 9 is an electric field distribution diagram corresponding to 2.64 GHz.
  • FIG. 10 is an electric field distribution diagram corresponding to 3.5 GHz.
  • FIG. 11 is an electric field distribution diagram corresponding to 4 GHz.
  • FIG. 12 is an electric field distribution diagram corresponding to 4.7 GHz.
  • the resonance mode of the antenna unit is the TM01 mode of the heat sink in the first region and its surrounding parts, and the electric field distribution on the heat sink in the remaining regions is very small.
  • the resonance mode of the antenna unit is the TM10 mode of the heat sink in the first region and its surrounding, and the electric field distribution on the heat sink in the remaining regions is very small.
  • the resonance mode of the antenna unit is the TM11 mode of the heat sink in the first area and its surrounding area, and the heat sink along the battery edge area in the remaining areas has a strong electric field distribution. .
  • the resonance mode of the antenna unit is the TM02 mode of the heat sink in the first area and its surrounding area, and the heat sink along the battery edge area in the remaining areas has the TM20 mode. Electric field distribution.
  • the heat sink in the second region 112 on the left side of the first region 112 has a great influence on the TM01 mode, which is equivalent to a parallel capacitor effect, making the TM01 mode lower. It also has certain effects on other modes.
  • the heat sink in the third region 114 disposed along the side edge of the battery has a great influence on the TM10 mode and the higher-order mode, which is equivalent to the effect of parallel capacitance, resulting in a low resonance.
  • the heat sink in the fourth region 115 arranged along the upper edge of the battery has basically no radiation effect in the TM01/TM10/TM11 mode, and will have the effect of shunting. The current distribution is stronger in TM02 mode.
  • FIG. 14 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • a heat sink is used as an antenna radiator.
  • the patch antenna corresponding to the first area is selected, which is not in contact with the heat sink, as a comparison solution of the present application.
  • the SAR value of the technical solution provided by the present application is significantly lower than that of the prior art, and its performance is better. This is because the heat sinks outside the first area play a role of diverting the flow.
  • the antenna unit shown in (a) in Figure 14 is in the left hand (hand left, HL) model, the right hand (hand right, HR) model, and the left head and hand left (beside head and hand left, BHHL) model ) model and the beside head and hand right (BHHR) model.
  • the technical solution provided by the present application has similar performance, and the technical solution provided by the present application does not cause the head-to-hand performance to deteriorate due to the enlarged antenna radiator.
  • FIG. 15 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the electronic device may include a first feeding unit, a second feeding unit and a third feeding unit.
  • the heat sink 200 may be provided with a first feeding point 201 , a second feeding point 202 and a third feeding point 203 .
  • the first feeding unit may be electrically connected with the heat sink 200 at the first feeding point 201 .
  • the second feeding unit may be electrically connected to the heat sink 200 at the second feeding point 202 .
  • the third feeding unit may be electrically connected with the heat sink 200 at the third feeding point 203 .
  • first feed unit and the heat sink form the first antenna unit
  • the second feed unit and the heat sink form the second antenna unit
  • the third feed unit and the heat sink form the third antenna unit
  • the heat sink is complete
  • the plane is not made up of several parts.
  • the first antenna unit, the second feeding unit and the third antenna unit share the same radiator, but the corresponding main radiation parts are different.
  • the number of feeding points can be adjusted according to actual design or production needs, and this application only uses three feeding points as an example, and does not limit the specific number.
  • FIG. 16 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • a first ground point 301 and a second ground point 302 may be provided on the heat sink 300 .
  • the heat sink 300 may be electrically connected to the floor of the electronic device at the first ground point 301 and the second ground point 302 .
  • the floor of the electronic device may be a metal layer in the PCB of the electronic device, a middle frame or other metal layers.
  • the heat sink may be electrically connected to the floor by indirect coupling at the ground point.
  • the heat sink can also be directly connected to the floor at the ground point.
  • grounding points can be adjusted according to actual design or production needs.
  • the present application only takes two grounding points as an example, and the specific number thereof is not limited.
  • FIG. 17 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the heat sink 400 may be provided with a first slit 401 , a second slit 402 and a third slit 403 .
  • the slit on the heat sink 400 may be an open slit or a closed slit, which is not limited in this application.
  • the current path can be blocked by arranging slits on the heat sink 400 to change the direction of the current on the heat sink 400 to affect the radiation characteristics of the antenna unit formed by the heat sink. Therefore, the size, position and quantity of the slits can be adjusted according to actual design or production requirements.
  • the present application only uses three slits as an example, and does not limit the specific size, position and quantity thereof.
  • FIG. 18 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the electronic device may further include a first metal member 501 and a second metal member 502 , which may be disposed above the heat sink.
  • the first metal piece 501 and the second metal piece 502 can be disposed between the heat sink and the PCB, or between the heat sink and the battery, or between the heat sink and the back cover, or the back cover is away from the surface of the heat sink, That is, there is a certain distance from the heat sink in the third direction.
  • the third direction is a direction perpendicular to the plane where the back cover is located.
  • the size, position and quantity of the connecting metal parts can be adjusted according to actual design or production requirements.
  • the present application only uses two metal parts as an example, and does not limit the specific size, position and quantity thereof.
  • the disclosed system, apparatus and method may be implemented in other manners.
  • the apparatus embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.

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Abstract

本申请实施例提供了一种电子设备，通过将电子设备中的散热件复用，解决了电子设备中散热部件和贴片天线相互影响的问题。本申请实施例提供的散热件可以作为散热部件使热量均匀分布，以实现对过热的电子器件降温的目的。同时，散热件可以作为天线的辐射体，与馈电单元形成天线单元，向外产生辐射，第一区域内的散热件可以作为天线单元的主要辐射体使用，以满足着5G无线通信系统对天线数量的需求，也可以应用于其他通信系统中。

Description

一种电子设备
本申请要求于2020年12月15日提交中国专利局、申请号为202023019475.5、申请名称为“一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及无线通信领域，尤其涉及一种电子设备。
背景技术
随着无线通信技术的快速发展，过去第二代(second generation，2G)移动通信系统主要支持通话功能，电子设备只是人们用于收发简讯以及语音沟通的工具，无线上网功能由于数据传输利用语音信道来传送，速度极为缓慢。现今，电子设备除了用于通话、发送短信、拍照之外，更可用于在线听音乐、观看网络影片、实时视频等，涵盖了人们生活中通话、影视娱乐以及电子商务等各式应用，在这之中，多种功能应用都需要无线网络上传及下载数据，因此，数据的高速传输变得极为重要。
随着人们对于高速数据传输的需求提升，电子设备的工业设计(industrial design，ID)的发展趋势是大屏占比，多摄像头。这造成了天线净空的大幅减小，布局空间越来越受限。同时出现了很多新的通信规格，需要在手机中布局更多的天线。第五代(5th generation，5G)无线通信系统对天线数量的需求也越来越多。
发明内容
本申请提供一种电子设备，通过将电子设备中的散热件复用，解决了电子设备中散热部件和贴片天线相互影响的问题。
第一方面，提供了一种电子设备，包括：散热件，第一馈电单元，印刷电路板PCB，中框和后盖；其中，所述PCB设置在所述中框和所述后盖围成的空间内；所述散热件的部分设置在所述PCB与所述后盖之间；所述散热件上设置有第一馈电点，所述第一馈电单元在所述第一馈电点处与所述散热件电连接。
根据本申请实施例，散热件可以作为散热部件使热量均匀分布，以实现对过热的电子器件降温的目的。同时，散热件可以作为天线的辐射体，与馈电单元形成天线单元，向外产生辐射，第一区域内的散热件可以作为天线单元的主要辐射体使用，以满足着5G无线通信系统对天线数量的需求，也可以应用于其他通信系统中。
结合第一方面，在第一方面的某些实现方式中，所述电子设备还包括：电池；所述电池设置在所述中框和所述后盖围成的空间内；所述散热件的部分设置在所述电池与所述后盖之间。
根据本申请实施例，散热件可以一部分设置在热源的上方，另一部分设置在低热区，达到散热的目的，散热件的部分也可以不设置在电池和后盖之间，可以根据电子设备内的实际布局改变散热件的放置位置，本申请对此并不做限定。
结合第一方面，在第一方面的某些实现方式中，所述电子设备还包括第二馈电单元；其中，所述散热件上设置有第二馈电点，所述第二馈电单元在所述第二馈电点处与所述散热件电连接。
根据本申请实施例，第一馈电单元和散热件形成第一天线单元，第二馈电单元和散热件形成第二天线单元，可以共用散热件作为天线的辐射体。
结合第一方面，在第一方面的某些实现方式中，所述电子设备还包括地板；所述散热件上设置有第一接地点，所述散热件在所述第一接地点与地板电连接。
根据本申请实施例，通过在散热件上设置接地点可以有效改变散热件上的电流走向，以影响散热件形成的天线单元的辐射特性。
结合第一方面，在第一方面的某些实现方式中，所述散热件在所述第一接地点与地板电连接，包括：所述散热件在所述第一接地点处与所述地板直接连接或间接耦合连接。
根据本申请实施例，根据本申请实施例，可以根据电子设备内的空间布局，灵活选择不同的接地方式。
结合第一方面，在第一方面的某些实现方式中，所述散热件上设置有缝隙。
根据本申请实施例，通过在散热件上设置缝隙可以阻断电流路径，以改变散热件上的电流走向，以影响散热件形成的天线单元的辐射特性。
结合第一方面，在第一方面的某些实现方式中，所述缝隙为开口缝隙或闭合缝隙。
根据本申请实施例，可以根据实际的设计或生产需要调整缝隙的尺寸，位置以及数量。
结合第一方面，在第一方面的某些实现方式中，所述电子设备还包括金属件；所述金属件设置于所述散热件上方。
根据本申请实施例，通过金属件间接耦合的方式改变散热件上的电流走向，以影响散热件形成的天线单元的辐射特性。
结合第一方面，在第一方面的某些实现方式中，所述金属件设置于所述散热件上方，包括：所述金属件设置于所述散热件与所述PCB之间，或，所述散热件与所述电池之间，或，所述散热件与所述后盖之间，或，所述后盖远离所述散热件的表面。
根据本申请实施例，可以根据电子设备内的空间布局，灵活选择不同的位置设置金属件。
结合第一方面，在第一方面的某些实现方式中，所述第一馈电单元在所述第一馈电点处与所述散热件电连接，包括：所述第一馈电单元在所述第一馈电点处与所述散热件直接连接或间接耦合连接。
根据本申请实施例，可以根据电子设备内的空间布局，灵活选择不同的馈电方式。
结合第一方面，在第一方面的某些实现方式中，电子设备还可以包括耦合件；其中，所述第一馈电单元与所述耦合件电连接，所述耦合件在所述第一馈电点处为所述第一馈电单元和所述散热件形成的天线单元间接耦合馈电。
根据本申请实施例，耦合件可以通过采用激光直接成型技术、柔性电路板印刷或采用浮动金属等方式实现。
附图说明
图1是本申请实施例提供的电子设备的示意图。
图2是本申请提供的电子设备中散热件和贴片天线相对位置示意图。
图3是本申请实施例提供的一种电子设备的结构示意图。
图4是第一区域沿第一方向的横截面的示意图。
图5是散热件沿第二方向的横截面的示意图。
图6是图3所示的天线单元的仿真结果图。
图7是电子设备中天线布局的结构示意图。
图8是图7所示的天线单元之间的仿真结果图。
图9是2.64GHz对应的电场分布图。
图10是3.5GHz对应的电场分布图。
图11是4GHz对应的电场分布图。
图12是4.7GHz对应的电场分布图。
图13是本申请实施例提供的散热件上各个区域的结构示意图。
图14是本申请实施例提供的电子设备的结构示意图。
图15是本申请实施例提供的一种电子设备的结构示意图。
图16是本申请实施例提供的一种电子设备的结构示意图。
图17是本申请实施例提供的一种电子设备的结构示意图。
图18是本申请实施例提供的一种电子设备的结构示意图。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
应理解，在本申请中“电连接”可理解为元器件物理接触并电导通；也可理解为线路构造中不同元器件之间通过印制电路板(printed circuit board，PCB)铜箔或导线等可传输电信号的实体线路进行连接的形式。“通信连接”可以指电信号传输，包括无线通信连接和有线通信连接。无线通信连接不需要实体媒介，且不属于对产品构造进行限定的连接关系。“连接”、“相连”均可以指一种机械连接关系或物理连接关系，即A与B连接或A与B相连可以指，A与B之间存在紧固的构件(如螺钉、螺栓、铆钉等)，或者A与B相互接触且A与B难以被分离。
本申请提供的技术方案适用于采用以下一种或多种通信技术的电子设备：蓝牙(blue tooth，BT)通信技术、全球定位系统(global positioning system，GPS)通信技术、无线保真(wireless fidelity，WiFi)通信技术、全球移动通讯系统(global system for mobile communications，GSM)通信技术、宽频码分多址(wideband code division multiple access，WCDMA)通信技术、长期演进(long term evolution，LTE)通信技术、5G通信技术以及未来其他通信技术等。本申请实施例中的电子设备可以是手机、平板电脑、笔记本电脑、智能手环、智能手表、智能头盔、智能眼镜等。电子设备还可以是蜂窝电话、无绳电话、会话启动协议(session initiation protocol，SIP)电话、无线本地环路(wireless local loop，WLL)站、个人数字助手(personal digital assistant，PDA)、具有无线通信功能的手持设备、计算设备或连接到无线调制解调器的其它处理设备、车载设备，5G网络中的电子设备或者未来演进的公用陆地移动通信网络(public land mobile network，PLMN)中的电子设备等，本申请实施例对此并不限定。
图1示例性示出了本申请提供的电子设备内部环境，以电子设备为手机进行说明。
如图1所示，电子设备10可以包括：玻璃盖板(cover glass)13、显示屏(display) 15、印刷电路板(printed circuit board，PCB)17、中框(housing)19和后盖(rear cover)21。
其中，玻璃盖板13可以紧贴显示屏15设置，可主要用于对显示屏15起到保护防尘作用。
可选地，显示屏15可以是液晶显示器(liquid crystal display，LCD)，发光二极管(light emitting diode，LED)或者有机发光半导体(organic light-emitting diode，OLED)等，本申请对此并不做限制。
其中，印刷电路板PCB17可以采用耐燃材料(FR-4)介质板，也可以采用罗杰斯(Rogers)介质板，也可以采用Rogers和FR-4的混合介质板，等等。这里，FR-4是一种耐燃材料等级的代号，Rogers介质板一种高频板。印刷电路板PCB17靠近中框19的一侧可以设置一金属层，该金属层可以通过在PCB17的表面蚀刻金属形成。该金属层可用于印刷电路板PCB17上承载的电子元件接地，以防止用户触电或设备损坏。该金属层可以称为PCB地板。不限于PCB地板，电子设备10还可以具有其他用于接地的地板，例如金属中框或者电子设备中其他的金属平面。此外，PCB17上设置有多个电子元件，多个电子元件包括处理器，电源管理模块、内存、传感器、SIM卡接口等中的一个或多个，这些电子元件的内部或表面也会设置有金属。
其中，电子设备10还可以包括电池，在此未示出。电池可以设置于中框19内，电池可以将PCB17分为主板和子板，主板可以设置于中框19的边框11和电池的上边沿之间，子板可以设置于中框19和电池的下边沿之间。电池的内部或表面也会设置有金属层。
其中，中框19主要起整机的支撑作用。中框19可以包括边框11，边框11可以由金属等传导性材料形成。边框11可以绕电子设备10和显示屏15的外围延伸，边框11具体可以包围显示屏15的四个侧边，帮助固定显示屏15。在一种实现中，金属材料制成的边框11可以直接用作电子设备10的金属边框，形成金属边框的外观，适用于金属工业设计(industrial design，ID)。在另一种实现中，边框11的外表面还可以为非金属材料，例如塑料边框，形成非金属边框的外观，适用于非金属ID。
其中，后盖21可以是金属材料制成的后盖，也可以是非导电材料制成的后盖，如玻璃后盖、塑料后盖等非金属后盖。
图1仅示意性的示出了电子设备10包括的一些部件，这些部件的实际形状、实际大小和实际构造不受图1限定。此外，电子设备10还可以包括摄像头、传感器等器件。
应理解，在本申请中，可以认为电子设备的显示屏所在的面为正面，后盖所在的面为背面，边框所在的面为侧面。
随着5G无线通信系统的发展，对天线的数量需求大大增加，需要在电子设备的背面设置天线，如图2所示。设置在电子设备的背面的天线一般为贴片(patch)天线，为了不影响天线的辐射性能，电子设备的后盖开始向非金属方向演进。但是，5G无线通信系统对应的芯片的功耗将是4G的2.5倍左右，工作时的功耗和发热量急剧上升，而由于电子设备的后盖为非金属，散热效果不佳，需要额外的散热设计，如图2所示，通过散热件将高热区(PCB上的芯片所在区域)所产生的热量传输至低热区(电池所在区域)，使热量均匀分布。
应理解，对于贴片天线来说，要实现较高的空中下载技术测试(over the air，OTA)性能和较低的电磁波吸收比值(specific absorption rate，SAR)，通常需要较大的面积。 但是，由于散热件的面积很大，基本占据大部分电子设备背面的空间，而散热件通常为石墨等材料，其电导率较高，与贴片天线重合的话，会极大的影响天线的性能。
本申请实施例提供了一种天线结构，可以兼顾天线的辐射特性和散热件的散热性能，有效解决两者的矛盾。
图3至图5是本申请实施例提供的电子设备的结构示意图。其中，图3是本申请实施例提供的一种电子设备的结构示意图。图4是第一区域沿第一方向的横截面的示意图。图5是散热件沿第二方向的横截面的示意图。
如图3所示，电子设备可以包括散热件110，PCB17，电池20和中框19。其中，PCB17和电池20可以设置在中框19围成的区域内，散热件110的部分可以设置于PCB17的上方，散热件110的部分可以设置于电池20的上方。散热件110的第一区域112内可以设置有馈电点111，电子设备内的馈电单元120可以在馈电点111处与散热件电连接。
应理解，散热件110的可以使电子设备内的热量均匀分布。因此，散热件可以一部分设置在热源(PCB上的电子器件)的上方，另一部分设置在低热区，达到散热的目的，散热件的部分也可以不设置在电池20和后盖21之间，可以根据电子设备内的实际布局改变散热件的放置位置，本申请对此并不做限定。
如图4所示，电子设备还可以包括馈电单元120和后盖21。其中，散热件110的部分设置在PCB17与后盖21之间。如图5所示，散热件110的部分设置在电池20与后盖21之间。第一方向可以是电子设备的边框中短边所在的方向。第二方向可以是电子设备的边框中长边所在的方向。
应理解，本申请实施例通过将散热件110复用，解决了电子设备中散热部件和贴片天线相互影响的问题。本申请实施例提供的散热件110可以作为散热部件将高热区(PCB上的芯片所在区域)所产生的热量传输至低热区(电池所在区域)，使热量均匀分布，以实现对过热的电子器件降温的目的。同时，散热件110可以作为天线的辐射体，与馈电单元形成天线单元，向外产生辐射，第一区域112内的散热件110可以作为天线单元的主要辐射体使用，以满足着5G无线通信系统对天线数量的需求，也可以应用于其他通信系统中。
可选地，电子设备还可以包括耦合件121，馈电单元120可以与耦合件121电连接，在馈电点111处为天线单元进行间接耦合馈电。或者，馈电单元120也可以直接在馈电点111处与散热件110连接，为天线单元进行直接馈电。
应理解，间接耦合是相对于直接耦合的概念，即隔空耦合，两者之间并不直接电连接。而直接耦合是直接电连接，在馈电点处直接馈电。
可选地，耦合件121可以通过采用激光直接成型技术(laser-direct-structuring，LDS)、柔性电路板(flexible printed circuit，FPC)印刷或采用浮动金属(floating metal，FLM)等方式实现。
可选地，如图3所示，散热件110的尺寸可以根据实际的生产或设计进行调整。本申请实施例在下文中的仿真结果图，以散热件110的长度L1为98mm，宽度L2为65mm为例进行说明，但并不限制散热件110的具体尺寸。
可选地，如图3所示，散热件110的第一区域112的尺寸可以根据实际的生产或设计进行调整。本申请实施例在下文中的仿真结果图，以散热件110的第一区域112的长度L3为24mm，宽度L4为16mm为例进行说明，但并不限制散热件110的具体尺寸。同时，散热件110的第一区域112的位置也可以进行调整，本申请实施例以第一区域112位于散 热件110的两条边的交界区域为例，也可以设置于散热件110的其他位置，例如中心区域。
可选地，如图4所示，PCB17可以包括屏蔽罩172和金属层171，金属层171可以作为天线单元的地板(ground，GND)使用，屏蔽罩172与金属层171电连接，用于防止屏蔽罩172内的电子器件受到外部电磁干扰。
可选地，如图4和图5所示，屏蔽罩172与散热件110之间的距离H1可以为0.2mm，金属层171与散热件110之间的距离H2可以为0.8mm，耦合件121与金属层171之间的距离H3可以为0.65mm，耦合件121与散热件110之间的距离H4可以为0.15mm，散热件110与电池20之间的距离H5可以为0.1mm。应理解，上述数据仅作为本申请实施例中的举例使用，可以根据实际的生产或设计进行调整。
可选地，散热件110靠近电池20的表面可以设置有绝缘层，避免散热件110与金属部件直接接触，降低天线单元的性能。
可选地，散热件110可以是石墨片，铜片等，同时具有散热快及电导率高的特点。
图6是图3所示的天线单元的仿真结果图。其中，包括S参数，辐射效率(radiation efficiency)和系统效率(total efficiency)的仿真结果图。
如图6所示，本申请实施例提供的通过复用散热件形成的天线单元的工作频段可以覆盖N41(2.496GHz–2.69GHz)频段，N77(3.3GHz–4.2GHz)频段和N79(4.4GHz–5.0GHz)频段。同时，在天线单元产生的谐振对应的工作频段内，辐射效率和系统效率也可以满足需要。
应理解，本申请实施例所提供的技术方案中，利用散热件作为天线辐射体，但是，散热件进行辐射的面积远大于天线单元最低工作频段对应的工作波长。
图7是电子设备中天线布局的结构示意图。
如图7所示，电子设备中可以包括天线单元1，天线单元2，天线单元3，天线单元4和天线单元5。
其中，天线单元1为本申请实施例提供的利用散热件作为天线辐射体的方案。天线单元2，天线单元3，天线单元4和天线单元5为常见的金属边框天线，本申请仅作为示例使用。
图8是图7所示的天线单元之间的仿真结果图。
如图8所示，其中，S11为天线单元1对应的S参数，S22为天线单元2对应的S参数，S33为天线单元3对应的S参数，S44为天线单元4对应的S参数，S55为天线单元5对应的S参数。在天线单元1，天线单元2，天线单元3，天线单元4和天线单元5均可以工作在对应的工作频段内，并且，天线单元1与天线单元2，天线单元3，天线单元4和天线单元5之间可以保持良好的隔离度，从结果来看，最差隔离度为-18dB。
图9至图12是图3所示的天线单元的电场分布图。其中，图9是2.64GHz对应的电场分布图。图10是3.5GHz对应的电场分布图。图11是4GHz对应的电场分布图。图12是4.7GHz对应的电场分布图。
如图9所示，在N41频段内的频点2.64GHz时，天线单元的谐振模式为第一区域内及其周围散热件的TM01模式，其余区域的散热件上的电场分布很少。
如图10所示，在N77频段内的频点3.5GHz时，天线单元的谐振模式为第一区域内及其周围散热件的TM10模式，其余区域的散热件上的电场分布很少。
如图11所示，在N77频段内的频点4GHz时，天线单元的谐振模式为第一区域内及 其周围散热件的TM11模式，其余区域中沿电池边沿区域的散热件有较强电场分布。
如图12所示，在N79频段内的频点4.7GHz时，天线单元的谐振模式为第一区域内及其周围散热件的TM02模式，其余区域中沿电池边沿区域的散热件有TM20模式的电场分布。
应理解，如图13所示，第一区域112左侧的第二区域112内的散热件对TM01模式影响很大，相当于并电容作用，使TM01模式偏低。对其它模式也有一定的影响。沿电池侧边沿设置的第三区域114内的散热件对TM10模式和高次模式影响大，相当于并电容作用，造成谐振偏低。沿电池上边沿设置的第四区域115内的散热件基本在TM01/TM10/TM11模式下基本无辐射作用，会起到分流的效果。在TM02模式下电流分布较强。
图14是本申请实施例提供的电子设备的结构示意图。
如图14中的(a)所示，为本申请提供的技术方案，利用散热件作为天线辐射体。如图14中的(b)所示，为传统技术中的技术方案，选择与第一区域对应的贴片天线，与散热件不接触，作为本申请的对比方案。
如下表1所示，为图14中的(a)所示的天线单元在归一化总辐射功率(total radiated power，TRP)为19dB时，在电子设备后(back)0mm和5mm对应的SAR值。
表1
Figure PCTCN2021114443-appb-000001
如下表2所示，为图14中的(b)所示的天线单元在归一化TRP为19dB时，在电子设备后(back)0mm和5mm对应的SAR值。
表2
Figure PCTCN2021114443-appb-000002
如上表所示，本申请提供的技术方案相较于现有技术来说，其SAR值明显低于现有技术，其性能更优。这是由于第一区域外的散热件起到分流的作用。
如下表3所示，为图14中的(a)所示的天线单元在左手(hand left，HL)模型，右手(hand right，HR)模型，左侧头手(beside head and hand left，BHHL)模型和右侧头手(beside head and hand right，BHHR)模型下的性能。
表3
频率(GHz) HR(GHz) HL(GHz) BHHR(GHz) BHHL(GHz)
2.65 -0.4 -0.7 -1.2 -1.7
3.3 -0.7 -0.7 -1 -1
3.8 -0.5 -0.5 -1 -0.7
4.2 -1.5 -1.5 -2 -2.2
4.5 -0.5 -0.5 -1.5 -1.5
5 -0.5 -0.5 -1.3 -1
如下表4所示，为图14中的(b)所示的天线单元在HL模型，HR模型，BHHL模型和BHHR模型下的性能。
表4
频率(GHz) HR(GHz) HL(GHz) BHHR(GHz) BHHL(GHz)
3.3 -0.5 -0.5 -1 -0.5
3.8 -1.2 -0.5 -2 -1.5
4.2 -0.5 0.5 -0.5 -0.5
4.5 -0.5 -0.3 -0.5 -0.5
5 -0.5 -0.5 -1 -1
如上表所示，本申请提供的技术方案相较于现有技术来说，性能相似，本申请提供的技术方案并没有因为天线辐射体变大导致头手性能变差。
图15是本申请实施例提供的一种电子设备的结构示意图。
电子设备可以包括第一馈电单元，第二馈电单元和第三馈电单元。
如图15所示，散热件200上可以设置有第一馈电点201，第二馈电点202和第三馈电点203。第一馈电单元可以在第一馈电点201处与散热件200电连接。第二馈电单元可以在第二馈电点202处与散热件200电连接。第三馈电单元可以在第三馈电点203处与散热件200电连接。
应理解，第一馈电单元和散热件形成第一天线单元，第二馈电单元和散热件形成第二天线单元，第三馈电单元和散热件形成第三天线单元，散热件为完整的平面，并不是由几部分拼接而成。第一天线单元，第二馈电单元和第三天线单元共用同一个辐射体，但是对应的主要辐射部分有区别。
同时，可以根据实际的设计或生产需要调整馈电点的数量，本申请仅以三个馈电点作 为举例，并不限制其具体的数量。
图16是本申请实施例提供的一种电子设备的结构示意图。
如图16所示，散热件300上可以设置有第一接地点301和第二接地点302。散热件300可以在第一接地点301和第二接地点302处与电子设备的地板电连接。
可选地，电子设备的地板可以是电子设备的PCB中的金属层，中框或其他金属层。
可选地，散热件可以在接地点处通过间接耦合与地板电连接。或者，散热件也可以直接在接地点处与地板直接连接。
应理解，通过在散热件300上设置接地点可以有效改变散热件300上的电流走向，以影响散热件形成的天线单元的辐射特性。因此，可以根据实际的设计或生产需要调整接地点的数量，本申请仅以两个接地点作为举例，并不限制其具体的数量。
图17是本申请实施例提供的一种电子设备的结构示意图。
如图17所示，散热件400上可以设置有第一缝隙401，第二缝隙402和第三缝隙403。
可选地，散热件400上的缝隙可以是开口缝隙，也可以是闭合缝隙，本申请对此并做限制。
应理解，通过在散热件400上设置缝隙可以阻断电流路径，以改变散热件400上的电流走向，以影响散热件形成的天线单元的辐射特性。因此，可以根据实际的设计或生产需要调整缝隙的尺寸，位置以及数量，本申请仅以三个缝隙作为举例，并不限制其具体的尺寸，位置以及数量。
图18是本申请实施例提供的一种电子设备的结构示意图。
如图18所示，电子设备还可以包括第一金属件501和第二金属件502，可以设置于散热件的上方。例如，第一金属件501和第二金属件502可以设置于散热件与PCB之间，或，散热件与电池之间，或，散热件与后盖之间或，后盖远离散热件的表面，即在第三方向上与散热件有一定的距离。其中，第三方向为垂直于后盖所在平面的方向。
应理解，通过在散热件500周围设置金属件，可以通过金属件间接耦合的方式改变散热件500上的电流走向，以影响散热件形成的天线单元的辐射特性。因此，可以根据实际的设计或生产需要调整接金属件的尺寸，位置以及数量，本申请仅以两个金属件作为举例，并不限制其具体的尺寸，位置以及数量。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的系统、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种电子设备，其特征在于，包括：
    散热件，第一馈电单元，印刷电路板PCB，中框和后盖；
    其中，所述PCB设置在所述中框和所述后盖围成的空间内；
    所述散热件的部分设置在所述PCB与所述后盖之间；
    所述散热件上设置有第一馈电点，所述第一馈电单元在所述第一馈电点处与所述散热件电连接。
  2. 根据权利要求1所述的电子设备，其特征在于，所述电子设备还包括：电池；
    所述电池设置在所述中框和所述后盖围成的空间内；
    所述散热件的部分设置在所述电池与所述后盖之间。
  3. 根据权利要求1所述的电子设备，其特征在于，
    所述电子设备还包括第二馈电单元；
    其中，所述散热件上设置有第二馈电点，所述第二馈电单元在所述第二馈电点处与所述散热件电连接。
  4. 根据权利要求3所述的电子设备，其特征在于，
    所述电子设备还包括地板；
    所述散热件上设置有第一接地点，所述散热件在所述第一接地点与地板电连接。
  5. 根据权利要求4所述的电子设备，其特征在于，所述散热件在所述第一接地点与地板电连接，包括：所述散热件在所述第一接地点处与所述地板直接连接或间接耦合连接。
  6. 根据权利要求3所述的电子设备，其特征在于，所述散热件上设置有缝隙。
  7. 根据权利要求6所述的电子设备，其特征在于，所述缝隙为开口缝隙或闭合缝隙。
  8. 根据权利要求2所述的电子设备，其特征在于，
    所述电子设备还包括金属件；
    所述金属件设置于所述散热件上方。
  9. 根据权利要求8所述的电子设备，其特征在于，所述金属件设置于所述散热件上方，包括：
    所述金属件设置于所述散热件与所述PCB之间，或，所述散热件与所述电池之间，或，所述散热件与所述后盖之间，或，所述后盖远离所述散热件的表面。
  10. 根据权利要求1至9中任一项所述的电子设备，其特征在于，所述第一馈电单元在所述第一馈电点处与所述散热件电连接，包括：所述第一馈电单元在所述第一馈电点处与所述散热件直接连接或间接耦合连接。
  11. 根据权利要求10所述的电子设备，其特征在于，
    电子设备还包括耦合件；
    其中，所述第一馈电单元与所述耦合件电连接，所述耦合件在所述第一馈电点处为所述第一馈电单元和所述散热件形成的天线单元间接耦合馈电。
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