WO2022125325A3 - Sintering equipment - Google Patents

Sintering equipment Download PDF

Info

Publication number
WO2022125325A3
WO2022125325A3 PCT/US2021/061089 US2021061089W WO2022125325A3 WO 2022125325 A3 WO2022125325 A3 WO 2022125325A3 US 2021061089 W US2021061089 W US 2021061089W WO 2022125325 A3 WO2022125325 A3 WO 2022125325A3
Authority
WO
WIPO (PCT)
Prior art keywords
sintering
space
cooling
section
filter
Prior art date
Application number
PCT/US2021/061089
Other languages
French (fr)
Other versions
WO2022125325A2 (en
Inventor
Huixiang Li
Chuanbo WANG
Original Assignee
Illinois Tool Works Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illinois Tool Works Inc. filed Critical Illinois Tool Works Inc.
Publication of WO2022125325A2 publication Critical patent/WO2022125325A2/en
Publication of WO2022125325A3 publication Critical patent/WO2022125325A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/02—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity of multiple-track type; of multiple-chamber type; Combinations of furnaces
    • F27B9/028—Multi-chamber type furnaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
    • B01D46/12—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces in multiple arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/12—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity with special arrangements for preheating or cooling the charge
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/30—Details, accessories, or equipment peculiar to furnaces of these types
    • F27B9/3005—Details, accessories, or equipment peculiar to furnaces of these types arrangements for circulating gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/12—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity with special arrangements for preheating or cooling the charge
    • F27B2009/124—Cooling
    • F27B2009/126—Cooling involving the circulation of cooling gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)

Abstract

The present application provides sintering equipment. The sintering equipment comprises: a sintering section, the sintering section having a sintering space, and the sintering space being configured to sinter photovoltaic devices conveyed to pass the sintering space; a cooling section, the cooling section having a cooling space, the cooling section being located downstream of the sintering section disposed in the conveyance direction of photovoltaic devices, and the cooling section being configured to cool photovoltaic devices conveyed to pass the cooling space; a filter system, the filter system comprising a filter device, the filter device having a filter device housing and a filter element disposed in the filter device housing, the filter device housing having an air inlet and an air outlet, the air inlet and the air outlet both communicating with the cooling space of the cooling section, and the filter device being configured to filter air in the cooling space. The filter system of the sintering equipment in the present application can reduce dust particles in the sintering equipment.
PCT/US2021/061089 2020-12-11 2021-11-30 Sintering equipment WO2022125325A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011446655.3 2020-12-11
CN202011446655.3A CN114623683A (en) 2020-12-11 2020-12-11 Sintering equipment

Publications (2)

Publication Number Publication Date
WO2022125325A2 WO2022125325A2 (en) 2022-06-16
WO2022125325A3 true WO2022125325A3 (en) 2022-08-04

Family

ID=80091357

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2021/061089 WO2022125325A2 (en) 2020-12-11 2021-11-30 Sintering equipment

Country Status (3)

Country Link
CN (1) CN114623683A (en)
TW (1) TW202225624A (en)
WO (1) WO2022125325A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115183584B (en) * 2022-07-14 2023-08-11 四川大学 Multistage flow equalizing sintering device and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205023315U (en) * 2015-09-16 2016-02-10 江苏英富光电科技有限公司 Discharge mechanism of solar cell layer press
US20190249923A1 (en) * 2018-02-15 2019-08-15 Illinois Tool Works Inc. Methods and apparatus to provide closed loop control in a solar cell production system
CN110314441A (en) * 2018-03-30 2019-10-11 台湾积体电路制造股份有限公司 The method for the fluid that filter device and filtering use in semiconductor fabrication
CN209896100U (en) * 2019-07-04 2020-01-03 安徽正飞信息科技有限公司 LED packaging structure capable of being cooled rapidly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205023315U (en) * 2015-09-16 2016-02-10 江苏英富光电科技有限公司 Discharge mechanism of solar cell layer press
US20190249923A1 (en) * 2018-02-15 2019-08-15 Illinois Tool Works Inc. Methods and apparatus to provide closed loop control in a solar cell production system
CN110314441A (en) * 2018-03-30 2019-10-11 台湾积体电路制造股份有限公司 The method for the fluid that filter device and filtering use in semiconductor fabrication
CN209896100U (en) * 2019-07-04 2020-01-03 安徽正飞信息科技有限公司 LED packaging structure capable of being cooled rapidly

Also Published As

Publication number Publication date
CN114623683A (en) 2022-06-14
WO2022125325A2 (en) 2022-06-16
TW202225624A (en) 2022-07-01

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