WO2022121476A1 - 散热装置及电子设备 - Google Patents

散热装置及电子设备 Download PDF

Info

Publication number
WO2022121476A1
WO2022121476A1 PCT/CN2021/122332 CN2021122332W WO2022121476A1 WO 2022121476 A1 WO2022121476 A1 WO 2022121476A1 CN 2021122332 W CN2021122332 W CN 2021122332W WO 2022121476 A1 WO2022121476 A1 WO 2022121476A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
column
electrical
hole
Prior art date
Application number
PCT/CN2021/122332
Other languages
English (en)
French (fr)
Inventor
程路
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP21902184.7A priority Critical patent/EP4258835A4/en
Publication of WO2022121476A1 publication Critical patent/WO2022121476A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks

Definitions

  • the embodiments of the present application relate to, but are not limited to, the field of heat dissipation technologies, and in particular, to a heat dissipation device and electronic equipment.
  • the number of modular devices integrated in the equipment is also gradually increasing, and accordingly, the heat dissipation performance of the equipment is also increasingly valued by users.
  • the heat sink is often installed on the top of the module device to achieve the heat dissipation effect.
  • the heat sink installed on the top of the module device easily leads to the installation problem of the heat sink that hinders other module devices.
  • Embodiments of the present application provide a heat sink and an electronic device, aiming to solve one of the related technical problems at least to a certain extent, including the problem of installing a heat sink on top of a module device, which prevents other module devices from installing the heat sink.
  • an embodiment of the present application provides a heat dissipation device, which is applied to an electrical module provided with a first heat source, the electrical module includes a first electrical medium layer, and the first electrical medium layer is provided with a first through hole , the first heat source covers the first through hole, and the heat dissipation device includes: a first heat dissipation body, which is provided with a first heat dissipation column, and the first heat dissipation column is set to pass through the first through hole and connected to the first heat source.
  • embodiments of the present application further provide an electronic device, including an electrical module and the heat dissipation device according to the first aspect, wherein the electrical module includes a first electrical medium layer, and the first electrical medium layer A first heat source and a first through hole are provided, the first heat source covers the first through hole; the first heat dissipation column of the heat dissipation device passes through the first through hole and communicates with the first heat source connect.
  • FIG. 1 is a schematic diagram of an electrical module to which a heat sink provided by an embodiment of the present application is applied;
  • FIG. 2 is a schematic diagram of a first heat source in an electrical module provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram of a heat sink provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a heat dissipation device provided by another embodiment of the present application.
  • FIG. 5 is a schematic diagram of a first heat sink in a heat sink provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a first heat sink in a heat sink provided by another embodiment of the present application.
  • FIG. 7 is a schematic diagram of a heat dissipation device provided by another embodiment of the present application.
  • FIG. 8 is a schematic diagram of a heat sink provided by another embodiment of the present application.
  • FIG. 9 is a schematic diagram of a first heat sink in a heat sink provided by another embodiment of the present application.
  • FIG. 10 is a schematic diagram of a heat dissipation device provided by another embodiment of the present application.
  • the present application provides a heat dissipation device and electronic equipment.
  • a first heat dissipation column By arranging a first heat dissipation column on the first heat dissipation body that can pass through a first through hole, the first heat source disposed on the first electrical medium layer can be directly connected to the first heat source.
  • a heat dissipation column dissipates heat, that is, when the first heat source is located on one side of the first electrical medium layer, a heat dissipation device can be installed on the other side of the first electrical medium layer to dissipate heat from the first heat source, so that the first heat dissipation
  • the body and the first heat source can be respectively arranged on opposite sides of the first electrical medium layer.
  • the heat dissipation device is already arranged on one side of the first heat source, there is no need to install a heat sink on the other side of the first heat source to It dissipates heat, thereby solving the problem that in some technical solutions, the heat sink is installed on the top of the module device, which prevents other module devices from installing the heat sink.
  • FIG. 1 is a schematic diagram of an electrical module 100 to which a heat dissipation device provided by an embodiment of the present application is applied.
  • the electrical module 100 includes a first electrical medium layer 110 provided with a first through hole 120 and a first heat source 130 , and the first heat source 130 covers the first through hole 120 .
  • the first through hole 120 may be disposed at any position of the first electrical medium layer 110 , and accordingly, the first heat source 130 may be disposed correspondingly according to the installation position of the first through hole 120 , and when necessary
  • a second through hole or more through holes may be provided on the first electrical medium layer 110 , and the function of the second through hole or more through holes is the same as that of the first electrical medium layer 110 .
  • the functions of the through holes 120 are the same, and they can all play the role of through connection.
  • the number of through holes can be set according to the number of module devices matched with the electrical module 100, that is, the number of the through holes is the same as that of the electrical module 100
  • the matched devices may include, but are not limited to, multiple heat source devices, such as a second heat source, a third heat source, etc.
  • a corresponding number of through holes may be set to match the above heat source devices.
  • the first electrical medium layer 110 can be, but is not limited to, various types of substrate boards, wire boards or integrated boards.
  • the first electrical medium layer 110 can be a common PCB board, which is integrated with It is not limited in this embodiment to set devices, or to use other boards with functions similar to the PCB board.
  • the electrical module 100 can be, but is not limited to, an integrated device under various functional conditions and combinations thereof.
  • the electrical module 100 can be a single first integrated device, and the first integrated device includes at least a first electrical medium.
  • the layer 110 and the integrated circuits arranged on the first electrical medium layer 110, or the like, or the electrical module 100 may also be a combination device including a plurality of first integrated devices, which is not limited in this embodiment.
  • the first heat source 130 can be, but is not limited to, various types of chip devices, module devices, etc., and its function can be selected according to the application of the device.
  • an optical module device can be used.
  • the chip device it can be set as a control chip or a chip that implements specific functions, which is not limited in this embodiment.
  • the first heat source 130 set in the electrical module 100 when the first heat source 130 set in the electrical module 100 is an optical module, the first heat source 130 can be set to two layers, namely the upper optical module 131 and the lower optical module 132 . It is connected in cascade mode and has a one-way heat transfer channel, so it can be dissipated in an integrated manner; in practical applications, the optical module can also be set to more than two layers, and each layer can be connected in a cascade mode , or use cascade connection between some layers, and the whole has similar heat dissipation performance, which will not be repeated here.
  • the electrical module 100 and the application scenarios described in the embodiments of the present application are for the purpose of illustrating the technical solutions of the embodiments of the present application more clearly, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application.
  • the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.
  • the electrical module 100 shown in FIG. 1 does not constitute a limitation to the embodiments of the present application, and may include more or less components than the one shown, or combine some components, or different Component placement.
  • FIG. 3 is a schematic diagram of a heat dissipation device 200 provided by an embodiment of the present application, and the heat dissipation device 200 can be applied to the electrical module shown in FIG. 1 .
  • the heat dissipation device 200 includes but is not limited to:
  • the first heat dissipation body 210 wherein the first heat dissipation body 210 is provided with a first heat dissipation column 211 , and the first heat dissipation column 211 is disposed to pass through a first through hole and is connected to the first heat source 130 .
  • the first heat source 130 disposed on the first electrical medium layer can be directly connected to the first heat dissipation column.
  • the heat sink 200 can be installed on the other side of the first electrical medium layer to dissipate heat from the first heat source 130, so that the first The heat sink 210 and the first heat source 130 can be disposed on opposite sides of the first electrical medium layer, respectively.
  • the heat sink 200 Since the heat sink 200 is already disposed on one side of the first heat source 130 at this time, there is no need to install the heat sink 200 on the other side of the first heat source 130 .
  • the radiator is installed on one side to dissipate heat, so that the problem of installing the radiator on the top of the module device in some technical solutions can prevent other module devices from installing the radiator.
  • the first heat dissipation body 210 and the first heat dissipation column 211 may be connected integrally or detachably.
  • the former is applicable to the case where the electrical module is fixed, that is, the heat dissipation device 200 is specially set to Matching with the electrical module, it can be understood that the integrated connection can be more convenient to match with the existing electrical module, which is convenient to improve the product quality of the heat sink 200, and the latter is suitable for processing and can be used to match different components. That is, the position between the first heat sink 210 and the first heat sink 211 can be matched with the corresponding electrical module through adjustment and processing.
  • the first heat sink 210 can be set in any three-dimensional shape, such as a rectangle.
  • the first heat dissipation column 211 can be installed at any position on the first heat dissipation body 210, and can be connected with the first heat dissipation body 210 at a certain angle, so that when the first heat dissipation body 210 is connected to the first heat dissipation body 210 When a heat dissipation column 211 penetrates the first through hole and is connected to the first heat source 130 , the installation stability of the first heat dissipation body 210 can still be ensured.
  • a heat-dissipating body 210 and the first heat-dissipating column 211 are further processed to improve the product quality of the heat-dissipating device 200 .
  • a plurality of first heat dissipation columns 211 may be provided, and the specific number may be set according to the actual application. At this time, each first heat dissipation column 211 may be matched with the corresponding The first heat dissipation column 211 can provide a heat dissipation channel for the heat source configured by the corresponding through hole, which further improves the use performance of the electrical module and its equipment as a whole.
  • the heat dissipation device further includes a third heat dissipation body 230 .
  • the third heat dissipation body 230 is disposed on the other side of the first electrical medium layer 120 , and is the same as the first heat source in the foregoing embodiment.
  • the 130 is located on one side of the first electrical medium layer 120, and a second heat source 140 is disposed on the other side of the first electrical medium layer 120, wherein the second heat source 140 is connected with the third heat sink 230, so that For the second heat source 140, a heat dissipation channel is formed on the other side of the first electrical medium layer 120 for heat dissipation.
  • the respective heat dissipation channels of the first heat source 130 and the second heat source 140 do not affect each other (refer to FIG. 4 .
  • the problem of thermal cascading can be avoided, and at the same time, it is convenient to lay the traces related to the first electrical medium layer 120 or the distance A between the related traces that have been laid out (shown in FIG. 4 ). out) to adjust.
  • the first heat dissipation body 210 is further provided with first heat dissipation teeth 240 configured to increase the heat dissipation area, and the heat dissipation capability of the first heat dissipation body 210 can be further improved by the first heat dissipation teeth 240
  • the installation method and quantity of the teeth 240 are not limited, and can be determined according to the actual application. For example, please refer to the specific example:
  • the direction of the first heat-dissipating teeth 240 can be set to be the same as the direction of the air duct, so that the heat-dissipation capability of the first heat-dissipating body 210 in the air-cooled heat dissipation scenario in the front-rear direction can be improved.
  • FIG. 5 for an air-cooled heat dissipation scenario in the front-rear direction, the direction of the first heat-dissipating teeth 240 can be set to be the same as the direction of the air duct, so that the heat-dissipation capability of the first heat-dissipating body 210 in the air-cooled heat dissipation scenario in the front-rear direction can be improved.
  • FIG. 5 for an air-cooled heat dissipation scenario in the front-rear direction, the direction of the first heat-dissipating teeth 240 can be set to be the same as the direction of the air duct, so that the heat-dissip
  • the direction of the first heat dissipation teeth 240 can also be set to be the same as the direction of the air duct, so that the first heat sink 210 can be improved in the left and right direction of air cooling and heat dissipation.
  • the heat dissipation capacity, or, similarly, the installation positions of the first heat dissipation teeth 240 are set correspondingly for the air cooling and heat dissipation scenarios in other directions. To avoid redundancy, details are not described here.
  • the heat dissipation device further includes a second heat dissipation body 220 , the first heat dissipation body 210 is further provided with a second heat dissipation column 212 , and the second heat dissipation column 212 It is arranged to pass through the second through hole and is connected to the second heat sink 220 .
  • the first heat dissipation column and the second heat dissipation column 212 can be disposed on the first heat dissipation body 210 at the same time.
  • a heat dissipation bridge is formed thereon to accelerate the heat dissipation of the first heat source 130, and in particular, a second heat dissipation body 220 is also provided, which can further conduct the heat accumulated on the first heat dissipation body 210 and transferred by the first heat source 130, Therefore, the heat dissipation effect for the first heat source 130 can be further improved.
  • the first heat dissipation body 210 and the second heat dissipation column 212 can also be connected integrally or detachably.
  • the former is suitable for the case where the electrical module is fixed, that is, the heat dissipation device is specially set to connect with the electrical module.
  • the integrated connection method can be matched with the existing electrical modules more conveniently, which is convenient to improve the product quality of the heat sink, and the latter is suitable for processing and can be used to match different electrical modules. That is, the position between the first heat dissipation body 210 and the second heat dissipation column 212 can be matched with the corresponding electrical module through adjustment and processing.
  • the first heat dissipation body 210 can be set in any three-dimensional shape, such as a rectangular body, a square body or a cylindrical body, etc.
  • the first heat dissipation column can be installed at any position on the first heat dissipation body 210, and can be connected with the first heat dissipation body 210 at a certain angle.
  • the ground connection method facilitates further processing of the first heat dissipation body 210 and the first heat dissipation column 211 of the heat dissipation device, thereby improving the product quality of the heat dissipation device.
  • a plurality of second heat dissipation columns 212 can also be provided, and the specific number can be set according to the actual application.
  • Each of the second heat dissipation columns 212 can provide heat dissipation channels for the heat sources configured with the corresponding through holes, which further improves the use performance of the electrical module and its equipment as a whole.
  • first heat sources 130 there are two first heat sources 130 , and a single second heat dissipation column 212 is used in cooperation with a group of first heat dissipation columns 211 , that is, one of the first heat dissipation columns 211 and the second heat dissipation column 212 is applied to one
  • the other first heat dissipation column 211 and the second heat dissipation column 212 are applied to another heat source device, so the second heat dissipation column 212 can be shared among different heat source devices, thereby reducing equipment cost and installation difficulty.
  • the stability of the structure needs to be ensured during installation. Therefore, it is selected to fix both sides of the second heat dissipation column 212, that is, by fixing elements or The connection between the first heat sink and the first electrical medium layer is achieved in any fixed manner, so as to fix the first heat sink 211 and the second heat sink 212 provided on the first heat sink.
  • the fixing elements can be arbitrarily arranged, such as using The nut 300 shown in FIG. 9 or similar devices can also be connected by means of welding, riveting, etc., which are not limited in this embodiment.
  • the structure shown in FIG. 10 can be further expanded, wherein the first heat source 130 is arranged in a squirrel cage structure and there are multiple ones, and different first heat sources 130 are arranged between
  • the distances are set to be different, and correspondingly, the distances between the second heat dissipation columns 212 and the matching first heat sources 130 are also different. It can be seen that even if the common setting method of the second heat dissipation columns 212 is adopted, the distance between the second heat dissipation columns 212 and the matching first heat source 130 is also different.
  • the distances between the different second heat dissipation columns 212 are set according to the wiring requirements, so as to meet the equipment setting conditions.
  • the second heat sink is further provided with second heat dissipation teeth arranged to increase the heat dissipation area, and the heat dissipation capability of the second heat dissipation body can be further improved by the second heat dissipation teeth.
  • the teeth and the first heat dissipation teeth in the embodiments shown in FIG. 5 and FIG. 6 belong to the same inventive concept. Therefore, for the specific implementation of the second heat dissipation teeth in this embodiment, reference may be made to the first heat dissipation teeth in the above embodiments. In a specific embodiment, in order to avoid redundancy, the specific implementation of the second heat dissipation teeth in this embodiment will not be repeated here.
  • the second heat dissipation body 220 is provided with a first heat dissipation surface 221 , and the first heat dissipation surface 221 is connected to the second heat dissipation column 212 . As shown in FIG.
  • the heat accumulated on the first heat dissipation body and transferred by the first heat source 130 can be further conducted through the first heat dissipation surface 221 , that is, the second heat dissipation body 220 provides the first heat source 130 with a
  • the heat dissipation channel can further improve the heat dissipation effect of the first heat source 130, wherein the first heat dissipation surface 221 can cover the second through hole, so that when the second heat dissipation column 212 is connected with the first heat dissipation surface 221, it can pass through the first heat dissipation surface 221. It can be realized by passing through the second through hole, so the installation is more convenient.
  • the second heat dissipation body 220 is further provided with a second heat dissipation surface 222 , and the second heat dissipation surface 222 is connected to the first heat source 130 .
  • the second heat dissipation surface 222 is connected to the first heat source 130 , so the first heat source 130 can also dissipate heat through the second heat dissipation surface 222 , that is, the second heat dissipation body 220 provides the first heat source 130
  • Another heat dissipation channel is provided, so that the first heat source 130 has two independent heat dissipation channels, which further improves the heat dissipation performance of the first heat source 130, especially for module devices connected in a cascaded manner, for example, for the above-mentioned
  • the multi-layer optical module mentioned in an embodiment is equivalent to providing an independent heat dissipation channel for each layer of the optical module, thereby reducing the influence caused by the excessive thermal resistance of one-way heat transfer
  • the first heat source 130 includes a first surface 131 and a second surface 132 disposed opposite to each other, the first heat dissipation column 211 is connected to the first surface 131 , and the second heat dissipation body 220 is connected to the second surface 132 connect.
  • the first heat source 131 and the second surface 132 are connected to the first heat source from the first surface 131 and the second surface 132.
  • the specifications of the first heat dissipation column 211 and the second heat dissipation column 212 can be set to be the same, or can be set according to the situation.
  • the angle, etc., for example, in the example of FIG. 7 the specifications of the second heat dissipation column 212 and the first heat dissipation column 211 are the same, that is, the connection between the first heat dissipation column 211 and the first surface 131 is equal to the second heat dissipation column.
  • 212 is connected to the first heat dissipation surface 221, and at the same time, another heat dissipation surface of the second heat dissipation body 220 is connected to the second surface 132.
  • the structure of the second heat dissipation body 220 can also be correspondingly arranged to match the first heat dissipation body and the first heat source. 130, which will not be repeated here.
  • the heat dissipation device further includes a first heat conduction pad and a second heat conduction pad, the first heat dissipation column is connected to the first surface through the first heat conduction pad, and the second heat sink is connected to the second surface through the second heat conduction pad.
  • the first thermal pad and the second thermal pad By arranging the first thermal pad and the second thermal pad, the heat of the first surface can be stably transferred to the first heat dissipation column, and the heat of the second surface can be stably transferred to the second heat sink, ensuring heat dissipation
  • the stability of transmission, and the thermal pad has a buffer function, so that each surface has a buffer when connecting with the corresponding heat dissipation structure, preventing the situation that the connection cannot be matched.
  • an embodiment of the present application also provides an electronic device, the electronic device includes: an electrical module as shown in the embodiment of FIG. 1, and a heat dissipation device as shown in the above embodiments, wherein the heat dissipation device
  • the first heat dissipating column of the radiator passes through the first through hole and is connected with the first heat source.
  • the electronic device by disposing the first heat dissipation column on the first heat dissipation body, the first heat dissipation column can pass through the first through hole, so that the first heat source disposed on the electrical module of the first electrical medium layer can be directly connected to the first heat dissipation column.
  • Heat dissipation that is, when the first heat source is on one side of the first electrical medium layer, a heat sink can be installed on the other side of the first electrical medium layer to dissipate heat from the first heat source, so that the first heat sink can interact with the first heat sink.
  • a heat source is respectively disposed on the opposite side of the first electrical medium layer. Since the heat dissipation device is already disposed on one side of the first heat source, there is no need to install a heat sink on the other side of the first heat source to dissipate heat. , so that in some technical solutions, installing a heat sink on the top of a module device can solve the problem of preventing other module devices from installing a heat sink.
  • the specific implementation of the electronic device in this embodiment can refer to the electrical module and the heat dissipation device in the above-mentioned embodiment.
  • the specific implementation manner of the electronic device in this embodiment will not be repeated here.
  • the embodiments of the present application include: a heat dissipation device applied to an electrical module, including a first heat dissipation body, and a first heat dissipation column is disposed, the first heat dissipation column is set to pass through the first through hole and is connected to the first heat source, wherein the electrical
  • the module includes a first electrical medium layer, the first electrical medium layer is provided with a first heat source and a first through hole, and the first heat source covers the first through hole.
  • the first heat dissipation column by disposing the first heat dissipation column on the first heat dissipation body, the first heat dissipation column can pass through the first through hole, so that the first heat source disposed on the first electrical medium layer can be directly connected to the first heat dissipation column
  • a heat sink can be installed on the other side of the first electrical medium layer to dissipate heat from the first heat source, so that the first heat sink can interact with the first heat sink.
  • the first heat sources are respectively arranged on opposite sides of the first electrical medium layer.
  • the heat dissipation device Since the heat dissipation device is already arranged on one side of the first heat source at this time, it is not necessary to install a heat sink on the other side of the first heat source to perform heat dissipation. heat dissipation, so as to solve the problem that in some technical solutions, the heat sink is installed on the top of the module device and the heat sink is prevented from being installed on other module devices.
  • the apparatus embodiments described above are only illustrative, wherein the units described as separate components may or may not be physically separated, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置及电子设备。其中，所述散热装置，应用于设置有第一热源(130)的电气模块(100)，包括：第一散热体(210)，设置有第一散热柱(211)，第一散热柱(211)被设置成穿设第一通孔并与第一热源(130)连接，其中，电气模块包括第一电气介质层，第一电气介质层设置有第一通孔，第一热源(130)遮盖第一通孔。

Description

散热装置及电子设备
相关申请的交叉引用
本申请基于申请号为202011434328.6、申请日为2020年12月10日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请实施例涉及但不限于散热技术领域，尤其涉及一种散热装置及电子设备。
背景技术
在电子设备领域，随着产品业务量增加以及系统集成度提升，设备内所集成的模块器件也在逐渐增多，相应地，设备的散热性能也越来越受到用户的重视。目前，针对设备内所集成的模块器件，往往通过在模块器件的顶部安装散热器以实现散热效果，但是，安装在模块器件的顶部的散热器容易导致阻碍其他模块器件的散热器的安装问题。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请实施例提供了一种散热装置及电子设备，旨在至少一定程度上解决相关的技术问题之一，包括在模块器件的顶部安装散热器而导致阻碍其他模块器件安装散热器的问题。
第一方面，本申请实施例提供了一种散热装置，应用于设置有第一热源的电气模块，所述电气模块包括第一电气介质层，所述第一电气介质层设置有第一通孔，所述第一热源遮盖所述第一通孔，所述散热装置包括：第一散热体，设置有第一散热柱，所述第一散热柱被设置成穿设所述第一通孔并与所述第一热源连接。
第二方面，本申请实施例还提供了一种电子设备，包括电气模块和如第一方面所述的散热装置，其中，所述电气模块包括第一电气介质层，所述第一电气介质层设置有第一热源和第一通孔，所述第一热源遮盖所述第一通孔；所述散热装置的所述第一散热柱穿设所述第一通孔并与所述第一热源连接。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1是本申请一个实施例提供的散热装置所应用的电气模块的示意图；
图2是本申请一个实施例提供的电气模块中的第一热源的示意图；
图3是本申请一个实施例提供的散热装置的示意图；
图4是本申请另一个实施例提供的散热装置的示意图；
图5是本申请一个实施例提供的散热装置中的第一散热体的示意图；
图6是本申请另一个实施例提供的散热装置中的第一散热体的示意图；
图7是本申请另一个实施例提供的散热装置的示意图；
图8是本申请另一个实施例提供的散热装置的示意图；
图9是本申请另一个实施例提供的散热装置中的第一散热体的示意图；
图10是本申请另一个实施例提供的散热装置的示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
需要说明的是，虽然在装置示意图中进行了功能模块划分，但是在某些情况下，可以以不同于装置中的模块划分进行示意。说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
本申请提供了一种散热装置及电子设备，通过在第一散热体上设置能够穿设第一通孔的第一散热柱，使得设置于第一电气介质层上的第一热源能够直接连接第一散热柱进行散热，即，在第一热源处于第一电气介质层一侧的情况下，能够在第一电气介质层的另一侧安装散热装置以对第一热源进行散热，使得第一散热体能够与第一热源分别设置在第一电气介质层的相对的侧面上，由于此时散热装置已经设置在第一热源的一侧，因此不需要在第一热源的另一侧安装散热器以对其进行散热，从而能够解决一些技术方案中在模块器件的顶部安装散热器而导致阻碍其他模块器件安装散热器的问题。
下面结合附图，对本申请实施例作进一步阐述。
如图1所示，图1是本申请一个实施例提供的散热装置所应用的电气模块100的示意图。
在图1的示例中，电气模块100包括第一电气介质层110，第一电气介质层110设置有第一通孔120和第一热源130，第一热源130遮盖第一通孔120。
在一实施例中，第一通孔120可以设置于第一电气介质层110的任意位置上，相应地，第一热源130可以根据第一通孔120的安装位置进行相应设置，并且，当需要在第一电气介质层110上匹配更多器件时，在第一电气介质层110上还可以设置有第二通孔或者更多通孔，第二通孔或者更多通孔的作用与第一通孔120的作用相同，均可以起到贯通连接作用，对于本领域技术人员而言，可以根据电气模块100所匹配的模块器件的数量来对应设置通孔的数量，即，与电气模块100所匹配的器件可以包括但不限于为多个热源器件，比如第二热源、第三热源等，相应地，可以设置对应数量的通孔与上述各个热源器件进行匹配。
在一实施例中，第一电气介质层110可以但不限于是各种类型的基材板、线材版或集成板，比如，第一电气介质层110可以采用常见的PCB板，通过PCB板集成设置器件，或者采用与PCB板的功能类似的其他材板等，这在本实施例中并未限制。
在一实施例中，电气模块100可以但不限于是各种功能条件下的集成器件及其组合，比如，电气模块100可以为单个的第一集成器件，第一集成器件至少包括第一电气介质层110以及于第一电气介质层110上布设的集成电路等，或者，电气模块100也可以为包括多个第 一集成器件的组合装置等，这在本实施例中并未限制。
在一实施例中，第一热源130可以但不限于是各种类型的芯片器件、模块器件等，其功能可以根据设备应用情况进行相应地选择，比如，为了实现设备通信，可以采用光模块器件来实现信息收发以取得设备通信效果，至于芯片器件，可以设置为控制芯片或实现具体功能的芯片，这在本实施例中均并未进行限制。
在一实施例中，参照图2，当电气模块100所设置的第一热源130为光模块时，第一热源130可以设置为两层，即上层光模块131和下层光模块132，两者采用级联方式进行连接，具有单向热传递通道，因而能够对其进行一体式散热；在实际应用中，光模块也可以设置为不止两层，其中各层之间可以均采用级联方式进行连接，或者于部分层间采用级联方式进行连接，整体也具有类似的散热性能，在此不作赘述。
本申请实施例描述的电气模块100以及应用场景是为了更加清楚的说明本申请实施例的技术方案，并不构成对于本申请实施例提供的技术方案的限定，本领域技术人员可知，随着电气模块100的演变和新应用场景的出现，本申请实施例提供的技术方案对于类似的技术问题，同样适用。
本领域技术人员可以理解的是，图1中示出的电气模块100并不构成对本申请实施例的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件布置。
基于上述电气模块100的结构，提出本申请的散热装置的各个实施例。
如图3所示，图3是本申请一个实施例提供的散热装置200的示意图，该散热装置200可以应用于图1所示的电气模块。
参照图3，该散热装置200，包括但不限于：
第一散热体210，其中，第一散热体210设置有第一散热柱211，第一散热柱211被设置成穿设第一通孔并与第一热源130连接。
在一实施例中，通过在第一散热体210上设置能够穿设第一通孔的第一散热柱211，使得设置于第一电气介质层上的第一热源130能够直接连接第一散热柱211进行散热，即，在第一热源130处于第一电气介质层一侧的情况下，能够在第一电气介质层的另一侧安装散热装置200以对第一热源130进行散热，使得第一散热体210能够与第一热源130分别设置在第一电气介质层的相对的侧面上，由于此时散热装置200已经设置在第一热源130的一侧，因此不需要在第一热源130的另一侧安装散热器以对其进行散热，从而能够解决一些技术方案中在模块器件的顶部安装散热器而导致阻碍其他模块器件安装散热器的问题。
在一实施例中，第一散热体210与第一散热柱211之间可以为一体连接，也可以为可拆卸地连接，前者适用于电气模块固定的情况，即该散热装置200是专门设置为与电气模块所匹配的，可以理解地是，通过一体连接方式能够更方便地与现有的电气模块进行匹配，便于提升散热装置200的产品质量，而后者适宜于进行加工，可以用于匹配不同的电气模块，即，可以通过调整加工使得第一散热体210与第一散热柱211之间的位置与相应的电气模块能够匹配，比如，第一散热体210可以设置为任意立体状，比如矩形体、正方形体或柱形体等，同样地，第一散热柱211可以安装在第一散热体210上的任意位置，且可与第一散热体210之间以某一角度进行连接，这样当第一散热柱211穿设第一通孔并与第一热源130连接时，仍能够确保第一散热体210具有安装稳定性，可以理解地是，通过可拆卸地连接方式便于对散热装置200的第一散热体210与第一散热柱211进行进一步地加工，从而提升散热装置200 的产品质量。
在一实施例中，第一散热柱211可以设置为多个，至于具体数量可根据实际应用情况来进行设定，此时各个第一散热柱211可以分别与相应的通孔进行匹配，使得各个第一散热柱211可以为相应的通孔所配置的热源提供散热通道，从整体上而言，进一步提高了电气模块及其设备的使用性能。
在一实施例中，如图4所示，该散热装置还包括第三散热体230，第三散热体230设置于第一电气介质层120的另一侧，与前述实施例中的第一热源130处于第一电气介质层120的一侧所对应地，在第一电气介质层120的另一侧上设置有第二热源140，其中，第二热源140与第三散热体230相连接，使得针对第二热源140在第一电气介质层120的另一侧上形成散热通道以进行散热，因此，第一热源130和第二热源140的各自的散热通道互不影响(可参照图4中的箭头方向所示)，实现分区散热，可以避免热级联问题，同时便于布设与第一电气介质层120相关的走线或者对已布局的相关走线间的距离A(在图4中已示出)进行调整。
在一实施例中，第一散热体210还设置有被设置成增加散热面积的第一散热齿240，通过第一散热齿240能够进一步提升第一散热体210的散热能力，其中，第一散热齿240的安装方式和数量均不限定，可以根据实际应用情况来进行确定，比如，请参照具体示例：
示例一
参照图5，针对前后方向的风冷散热场景，第一散热齿240的方向可以设置为与风道方向相同，从而能够提升第一散热体210在前后方向的风冷散热场景下的散热能力，或者，参照图6，针对左右方向的风冷散热场景，第一散热齿240的方向也可以设置为与风道方向相同，从而能够提升第一散热体210在左右方向的风冷散热场景下的散热能力，或者，类似地，针对其他方向的风冷散热场景以对应设置第一散热齿240的安装位置，为免冗余，在此不作赘述。
参照图7，在第一电气介质层还设置有第二通孔的情况下，散热装置还包括第二散热体220，第一散热体210还设置有第二散热柱212，第二散热柱212被设置成穿设第二通孔并与第二散热体220连接。
在一实施例中，通过在第一散热体210上设置第二散热柱212，使得第一散热柱与第二散热柱212能够同时设置于第一散热体210上，从而在第一散热体210上形成散热桥以加速对于第一热源130的散热，尤其是，还设置有第二散热体220，能够进一步将第一散热体210上所积聚的由第一热源130所传递的热量进行传导，从而能够进一步提升针对第一热源130的散热效果。
在一实施例中，第一散热体210与第二散热柱212之间也可以为一体连接或可拆卸地连接，前者适用于电气模块固定的情况，即该散热装置是专门设置为与电气模块所匹配的，可以理解地是，通过一体连接方式能够更方便地与现有的电气模块进行匹配，便于提升散热装置的产品质量，而后者适宜于进行加工，可以用于匹配不同的电气模块，即，可以通过调整加工使得第一散热体210与第二散热柱212之间的位置与相应的电气模块能够匹配，比如，第一散热体210可以设置为任意立体状，比如矩形体、正方形体或柱形体等，同样地，第一散热柱可以安装在第一散热体210上的任意位置，且可与第一散热体210之间以某一角度进行连接，可以理解地是，通过可拆卸地连接方式便于对散热装置的第一散热体210与第一散热柱211进行进一步地加工，从而提升散热装置的产品质量。
在一实施例中，第二散热柱212也可以设置为多个，至于具体数量可根据实际应用情况来进行设定，此时各个第二散热柱212可以分别与相应的通孔进行匹配，使得各个第二散热柱212可以为相应的通孔所配置的热源提供散热通道，从整体上而言，进一步提高了电气模块及其设备的使用性能。
为了更准确描述上述部分实施例的原理，以下同样给出具体示例进行说明。
示例二
参照图8，第一热源130设置有两个，单个第二散热柱212与一组第一散热柱211进行配合使用，即，其中一个第一散热柱211与该第二散热柱212应用于一个热源器件，另外一个第一散热柱211与该第二散热柱212应用于另一热源器件，因此能够实现不同热源器件间的第二散热柱212共用，从而能够降低设备成本及安装难度。
示例三
参照图9，针对不同热源器件间的第二散热柱212共用的情况，在设置时需要保证该结构的稳定性，因此选择对第二散热柱212的两侧进行固定，即，通过固定元件或以任意固定方式实现第一散热体与第一电气介质层的连接，从而固定第一散热体上所设置的第一散热柱211和第二散热柱212，其中，固定元件可以任意设置，比如采用图9中所示的螺母300或者类似的器件，也可以采用诸如焊接、铆接等方式实现连接，这在本实施例中并未限定。
示例四
在图9所示实施例的基础上进一步扩展，可以得到如图10所示的结构，其中，第一热源130设置为鼠笼式结构且设置有多个，并且不同的第一热源130之间的距离设置为不相同，相应地，第二散热柱212与相匹配的第一热源130间的距离也是不同的，可以看出，即便采用第二散热柱212共用的设置方式，也可以根据设备布线要求来设置不同的第二散热柱212之间的距离，从而满足设备设置条件。
在一实施例中，第二散热体还设置有被设置成增加散热面积的第二散热齿，通过第二散热齿能够进一步提升第二散热体的散热能力，由于本实施例中的第二散热齿与上述图5和图6所示实施例中的第一散热齿属于同一发明构思，因此本实施例中的第二散热齿的具体实施方式，可以参照上述实施例中的第一散热齿的具体实施例，为避免冗余，本实施例的第二散热齿的具体实施方式在此不再赘述。
在一实施例中，第二散热体220设置有第一散热面221，第一散热面221与第二散热柱212连接。如图7所示，通过第一散热面221能够进一步将第一散热体上所积聚的由第一热源130所传递的热量进行传导，即第二散热体220为第一热源130提供了一种散热通道，从而能够进一步提升针对第一热源130的散热效果，其中，第一散热面221可以覆盖于第二通孔，使得第二散热柱212在与第一散热面221进行连接时，可以通过穿设第二通孔即可实现，因此安装更加方便。
在一实施例中，第二散热体220还设置有第二散热面222，第二散热面222与第一热源130连接。在图7所示的示例中，第二散热面222与第一热源130进行连接，因此第一热源130同样能够通过第二散热面222进行散热，即第二散热体220为第一热源130提供了另一散热通道，使得第一热源130具有两个独立的散热通道，这进一步提升了第一热源130的散热性能，尤其是对于采用级联式方式连接的模块器件而言，比如，对于上述一实施例中所提到的多层光模块，相当于为每层光模块提供独立的散热通道，从而减小因单向热传递的热阻 过大而带来的影响，使得每层光模块均能够具备良好的散热性能。
在一实施例中，更具体地，第一热源130包括相对设置的第一表面131和第二表面132，第一散热柱211与第一表面131连接，第二散热体220与第二表面132连接。如图7所示，通过使第一热源130上的相对设置的第一表面131和第二表面132分别连接到相应的散热结构，从而分别从第一表面131和第二表面132对第一热源130进行散热，从而为其建立两个独立相向的散热通道，实现双向散热，相比于传统技术中的单向传递散热的方式，能够显著地提高其散热效率及稳定性。
在一实施例中，第一散热柱211与第二散热柱212的规格可以设置为相同，也可以根据情况自行设置，其中，此处的规格可以但不限于是大小、高度以及与散热装置间所呈角度等，比如，在图7的示例中，第二散热柱212与第一散热柱211规格相同，即，第一散热柱211与第一表面131的连接处等高于第二散热柱212与第一散热面221的连接处，同时，第二散热体220的另一散热面是与第二表面132连接的，因此，在第二散热体220的不同散热面之间存在高度差，所以需要对其补齐，以使得第二散热体220的整体结构保持稳定，即，如图7所示，第二散热体220的中间连接部223作为固定结构，其截面与第一热源130的截面保持平行，类似地，若第一散热柱211与第二散热柱212的规格是不相同的，也可以对应设置第二散热体220的结构，使之能够匹配第一散热体和第一热源130，在此不作赘述。
在一实施例中，散热装置还包括第一导热垫和第二导热垫，第一散热柱通过第一导热垫与第一表面连接，第二散热体通过第二导热垫与第二表面连接。通过设置第一导热垫和第二导热垫，使得第一表面的热量能够稳定地被传送到第一散热柱上，以及第二表面的热量能够稳定地被传送到第二散热体上，保证散热传递的稳定性，并且，导热垫具有缓冲作用，使得各表面在与相应散热结构进行连接时具备缓冲，防止出现无法匹配连接的情况。
另外，本申请的一个实施例还提供了一种电子设备，该电子设备包括：如图1实施例中所示的电气模块，以及如上述各实施例中所示的散热装置，其中，散热装置的第一散热柱穿设第一通孔并与第一热源连接。在该电子设备中，通过在第一散热体上设置能够穿设第一通孔的第一散热柱，使得设置于第一电气介质层电气模块上的第一热源能够直接连接第一散热柱进行散热，即，在第一热源处于第一电气介质层一侧的情况下，能够在第一电气介质层的另一侧安装散热装置以对第一热源进行散热，使得第一散热体能够与第一热源分别设置在第一电气介质层的相对的侧面上，由于此时散热装置已经设置在第一热源的一侧，因此不需要在第一热源的另一侧安装散热器以对其进行散热，从而能够解决一些技术方案中在模块器件的顶部安装散热器而导致阻碍其他模块器件安装散热器的问题。
由于本实施例中的电子设备与上述实施例中的电气模块以及散热装置属于同一发明构思，因此本实施例中的电子设备的具体实施方式，可以参照上述实施例中的电气模块以及散热装置的具体实施例，为避免冗余，本实施例的电子设备的具体实施方式在此不再赘述。
本申请实施例包括：应用于电气模块的散热装置，包括第一散热体，设置有第一散热柱，第一散热柱被设置成穿设第一通孔并与第一热源连接，其中，电气模块包括第一电气介质层，第一电气介质层设置有第一热源和第一通孔，第一热源遮盖第一通孔。根据本申请实施例提供的方案，通过在第一散热体上设置能够穿设第一通孔的第一散热柱，使得设置于第一电气介质层上的第一热源能够直接连接第一散热柱进行散热，即，在第一热源处于第一电气介质层一侧的情况下，能够在第一电气介质层的另一侧安装散热装置以对第一热源进行散热，使 得第一散热体能够与第一热源分别设置在第一电气介质层的相对的侧面上，由于此时散热装置已经设置在第一热源的一侧，因此不需要在第一热源的另一侧安装散热器以对其进行散热，从而能够解决一些技术方案中在模块器件的顶部安装散热器而导致阻碍其他模块器件安装散热器的问题。
并且，以上所描述的装置实施例仅仅是示意性的，其中作为分离部件说明的单元可以是或者也可以不是物理上分开的，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部模块来实现本实施例方案的目的。
以上是对本申请的一些实施方式进行的具体说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请范围的前提下还可作出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (10)

  1. 一种散热装置，应用于设置有第一热源的电气模块，其中，所述电气模块包括第一电气介质层，所述第一电气介质层设置有第一通孔，所述第一热源遮盖所述第一通孔，所述散热装置包括：
    第一散热体，设置有第一散热柱，所述第一散热柱被设置成穿设所述第一通孔并与所述第一热源连接。
  2. 根据权利要求1所述的散热装置，其中，在所述第一电气介质层还设置有第二通孔的情况下，所述散热装置还包括第二散热体，所述第一散热体还设置有第二散热柱，所述第二散热柱被设置成穿设所述第二通孔并与所述第二散热体连接。
  3. 根据权利要求2所述的散热装置，其中，所述第二散热体设置有第一散热面，所述第一散热面与所述第二散热柱连接。
  4. 根据权利要求3所述的散热装置，其中，所述第二散热体还设置有第二散热面，所述第二散热面与所述第一热源连接。
  5. 根据权利要求4所述的散热装置，其中，所述第一热源包括相对设置的第一表面和第二表面，所述第一散热柱与所述第一表面连接，所述第二散热体与所述第二表面连接。
  6. 根据权利要求2至5任意一项所述的散热装置，其中，所述第一散热柱和所述第二散热柱均设置有多个。
  7. 根据权利要求5所述的散热装置，其中，所述散热装置还包括第一导热垫和第二导热垫，所述第一散热柱通过所述第一导热垫与所述第一表面连接，所述第二散热体通过所述第二导热垫与所述第二表面连接。
  8. 根据权利要求1所述的散热装置，其中，所述第一散热体还设置有被设置成增加散热面积的第一散热齿。
  9. 根据权利要求2所述的散热装置，其中，所述第二散热体还设置有被设置成增加散热面积的第二散热齿。
  10. 一种电子设备，包括电气模块和如权利要求1至9任意一项所述的散热装置，其中，所述电气模块包括第一电气介质层，所述第一电气介质层设置有第一热源和第一通孔，所述第一热源遮盖所述第一通孔；所述散热装置的所述第一散热柱穿设所述第一通孔并与所述第一热源连接。
PCT/CN2021/122332 2020-12-10 2021-09-30 散热装置及电子设备 WO2022121476A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP21902184.7A EP4258835A4 (en) 2020-12-10 2021-09-30 HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011434328.6 2020-12-10
CN202011434328.6A CN114630547A (zh) 2020-12-10 2020-12-10 散热装置及电子设备

Publications (1)

Publication Number Publication Date
WO2022121476A1 true WO2022121476A1 (zh) 2022-06-16

Family

ID=81896047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/122332 WO2022121476A1 (zh) 2020-12-10 2021-09-30 散热装置及电子设备

Country Status (3)

Country Link
EP (1) EP4258835A4 (zh)
CN (1) CN114630547A (zh)
WO (1) WO2022121476A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137614A (zh) * 2011-11-22 2013-06-05 佳邦科技股份有限公司 加强散热的光学组件封装结构及其制造方法
TWM514656U (zh) * 2015-09-01 2015-12-21 wen-zhong Jin 具有散熱座之發光二極體結構
CN207011077U (zh) * 2017-07-10 2018-02-13 昆山旭发电子有限公司 一种能够提高散热能力的多层电路板
CN108633217A (zh) * 2017-03-24 2018-10-09 鸿进科技股份有限公司 散热鳍片组
CN208938959U (zh) * 2018-11-15 2019-06-04 杭州海康威视数字技术股份有限公司 散热结构及热像仪
US20210160997A1 (en) * 2019-11-26 2021-05-27 Eridan Communications, Inc. Integrated Circuit / Printed Circuit Board Assembly and Method of Manufacture

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528632A1 (de) * 1995-08-04 1997-02-06 Bosch Gmbh Robert Steuergerät bestehend aus mindestens zwei Gehäuseteilen
US5986884A (en) * 1998-07-13 1999-11-16 Ford Motor Company Method for cooling electronic components
WO2011137355A1 (en) * 2010-04-30 2011-11-03 Uniflux Led, Inc. A cooling structure for led lamps
CN103021877B (zh) * 2012-12-22 2016-03-09 中国船舶重工集团公司第七0九研究所 一种采用双路径传热的高密度芯片散热方法
CN104219928A (zh) * 2013-05-31 2014-12-17 启碁科技股份有限公司 散热组装结构
TW201505532A (zh) * 2013-07-26 2015-02-01 Jitboundary United Production Inc 高散熱電路板組
TWI544868B (zh) * 2014-07-11 2016-08-01 台達電子工業股份有限公司 散熱模組及其結合方法
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
EP3310140B1 (en) * 2016-10-14 2021-07-14 Vitesco Technologies GmbH Mounting assembly with a heatsink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137614A (zh) * 2011-11-22 2013-06-05 佳邦科技股份有限公司 加强散热的光学组件封装结构及其制造方法
TWM514656U (zh) * 2015-09-01 2015-12-21 wen-zhong Jin 具有散熱座之發光二極體結構
CN108633217A (zh) * 2017-03-24 2018-10-09 鸿进科技股份有限公司 散热鳍片组
CN207011077U (zh) * 2017-07-10 2018-02-13 昆山旭发电子有限公司 一种能够提高散热能力的多层电路板
CN208938959U (zh) * 2018-11-15 2019-06-04 杭州海康威视数字技术股份有限公司 散热结构及热像仪
US20210160997A1 (en) * 2019-11-26 2021-05-27 Eridan Communications, Inc. Integrated Circuit / Printed Circuit Board Assembly and Method of Manufacture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4258835A4 *

Also Published As

Publication number Publication date
CN114630547A (zh) 2022-06-14
EP4258835A4 (en) 2024-07-10
EP4258835A1 (en) 2023-10-11

Similar Documents

Publication Publication Date Title
US9456527B2 (en) Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly
US4884168A (en) Cooling plate with interboard connector apertures for circuit board assemblies
US9420721B2 (en) Liquid-cooled heat sink assemblies
US7499281B2 (en) Multi-chip module with power system
US8749990B2 (en) Multiple-board power converter
US20090279251A1 (en) Heat dissipation device with heat pipe
US6201699B1 (en) Transverse mountable heat sink for use in an electronic device
US10330397B2 (en) Water-cooling heat dissipating system and water-cooling head
TWI612877B (zh) 熱散高功率系統
US9877408B2 (en) Package assembly
US20060126297A1 (en) Processor module with thermal dissipation device
US7823866B1 (en) Distributed load edge clamp
US6483704B2 (en) Microprocessor heat sink retention module
US8717763B2 (en) Cooling system for electronic device and electronic device having same
US7145774B2 (en) Backside cooling apparatus for modular platforms
WO2022121476A1 (zh) 散热装置及电子设备
US10212847B1 (en) Air guiding duct, casing, and electronic device using the same
GB2164499A (en) Heat sinks for electronic components
WO2020125330A1 (zh) 光模块通信组件
US7272880B1 (en) Distributed load edge clamp
WO2023035761A1 (zh) 散热器固定结构及板级散热装置
US20190035709A1 (en) Electronic modules
US8300403B2 (en) Computer system and heat sink
US20050199377A1 (en) Heat dissipation module with heat pipes
TWI783526B (zh) 視頻轉碼擴充卡

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21902184

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202327045102

Country of ref document: IN

ENP Entry into the national phase

Ref document number: 2021902184

Country of ref document: EP

Effective date: 20230706

NENP Non-entry into the national phase

Ref country code: DE