WO2022119200A1 - Dispositif électronique comprenant une clé latérale et procédé pour le fabriquer - Google Patents

Dispositif électronique comprenant une clé latérale et procédé pour le fabriquer Download PDF

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Publication number
WO2022119200A1
WO2022119200A1 PCT/KR2021/017149 KR2021017149W WO2022119200A1 WO 2022119200 A1 WO2022119200 A1 WO 2022119200A1 KR 2021017149 W KR2021017149 W KR 2021017149W WO 2022119200 A1 WO2022119200 A1 WO 2022119200A1
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WIPO (PCT)
Prior art keywords
support body
electronic device
guide
key
bracket
Prior art date
Application number
PCT/KR2021/017149
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English (en)
Korean (ko)
Inventor
심유섭
김호수
최환석
강이태
박영문
배창석
이욱진
Original Assignee
삼성전자(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020210032630A external-priority patent/KR20220078441A/ko
Application filed by 삼성전자(주) filed Critical 삼성전자(주)
Publication of WO2022119200A1 publication Critical patent/WO2022119200A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements

Definitions

  • the present disclosure relates to an electronic device having a side key and a manufacturing method thereof.
  • a portable electronic device such as a smart phone may provide various functions, such as a call function and a multimedia file playback function.
  • a side key may be provided on one side of the electronic device to perform a function of adjusting the volume of a call, adjusting the volume of playing a multimedia file, or turning on/off the screen while performing the above-described functions. have.
  • the contact portion of the side key moves to the inside of the electronic device, and the key module in contact with the contact portion of the side key is operated by the movement of the side key to generate an electrical signal.
  • the generated electrical signal may be transmitted to a processor disposed on the main printed circuit board to perform a function related to a side key input.
  • the key module may include a first bracket supporting the key circuit unit and a second bracket supporting the first bracket.
  • the first bracket and the second bracket may be respectively mounted in key mounting grooves provided on the outside of the housing.
  • one support portion bent to one side from the lower end of the first bracket, two support portions provided on both sides of the second bracket, and one support portion bent to one side from the upper end of the second bracket, respectively include an inner wall of one side of the key mounting groove, It can be inserted into the four guide grooves formed by digging in both side walls and one inner wall. In this way, performing digging at 4 places in the key mounting groove may cause cracks in the set strength test of 3-axis bending.
  • the present disclosure provides an electronic device having excellent mechanical strength and a method for manufacturing the same.
  • the electronic device constitutes an exterior of the electronic device and includes a housing including a recess having an opening provided to communicate from the outside in a first direction, and a side key assembly provided in the recess.
  • the side key assembly may include a side key provided to be operated through the opening, a key circuit unit operated according to the manipulation of the side key, a first support body supporting one surface of the key circuit unit in the first direction, and the first A first bracket extending from a support body and including a first guide supported in the recess, a second support body supporting one surface of the first bracket in the first direction, and a second perpendicular to the first direction a second bracket including a second guide protruding from one side of the second support body in the direction opposite to the first direction and having a support surface for supporting the side surface of the first support body in the second direction; include
  • the recess may include a guide groove formed in the first direction, and the first guide may extend in the first direction to be supported by the guide groove.
  • the first guide may include a side surface of the first support body opposite to the second direction.
  • the first guide may be formed by bending at one side of the first support body in a direction opposite to the second direction.
  • the second support body may include an inclined portion inclined at a predetermined angle in a direction opposite to the second direction.
  • An extension direction of the first guide and a protrusion direction of the second guide may be opposite to each other.
  • the support surface may be a first support surface
  • the second guide may include a second support surface contacting an inner surface of the recess facing in a direction opposite to the second direction.
  • the second bracket may include an insertion guide surface extending from the first support surface toward the second support surface.
  • the opening is a first opening
  • the recess includes a second opening opened in the first direction and a direction perpendicular to the second direction to receive the key module
  • the second bracket includes the second opening. It may include a separation groove portion having a communication portion communicating with the opening and an extension portion extending from the communication portion in the second direction.
  • the separation groove portion may include a locking protrusion protruding in a direction opposite to the second direction.
  • the first bracket may include a first support portion extending from the first support body in a direction opposite to the first direction to limit movement of the key circuit portion toward the second opening.
  • the second bracket may include a second support portion extending from the second support body in a direction opposite to the first direction to restrict movement of the first support body toward the second opening.
  • the support surface may press the side surface of the first support body in the second direction.
  • the first guide may be provided on one side of the first support body in a direction opposite to the second direction.
  • the electronic device constitutes an exterior of the electronic device and includes a housing including a recess having an opening provided to communicate from the outside in a first direction, and a side key assembly provided in the recess.
  • the side key assembly may include a side key provided to be operated through the opening, a key circuit unit operated according to the manipulation of the side key, a first support body supporting one surface of the key circuit unit in the first direction, and the first A first bracket extending from a support body in the first direction and including a first guide supported in the recess to limit movement of the first support body in a second direction perpendicular to the first direction or in a direction opposite to that and a second support body supporting one surface of the first bracket in the first direction, and the first support body protruding from one side of the second support body in the second direction in a direction opposite to the first direction and a second bracket including a second guide interposed between a side surface of the second direction and an inner surface of the recess facing in a direction opposite to the first direction and a second bracket
  • a method of manufacturing an electronic device includes an operation of forming a housing constituting an exterior of the electronic device, an operation of forming a recess in the housing having an opening provided to communicate in a first direction from the outside, the operation of being inserted into the opening An operation of forming a side key, an operation of forming a key circuit part operated according to the operation of the side key, a first support body supporting one surface of the key circuit part in the first direction, and extending from the first support body An operation of forming a first bracket including a first guide supported by the recess, a second support body supporting one surface of the first bracket in the first direction, and a second direction perpendicular to the first direction forming a second bracket including a second guide protruding from one side of the second support body in the opposite direction to the first direction and having a support surface for supporting the side surface of the first support body in the second direction It may include an action to
  • the forming of the recess may include forming a guide groove extending in the first direction.
  • the method of manufacturing an electronic device includes inserting the first support body and the first guide of the first bracket into the recess and the guide groove, respectively, and the second support body and the second guide are the first support body, respectively.
  • the second bracket to be inserted between one surface in the first direction and the inner surface in the first direction of the recess and between the one surface in the second direction of the first support body and the inner surface in the second direction of the recess.
  • the method may further include inserting into the recess.
  • the support surface of the second guide may press one side of the first support body in the second direction in a direction opposite to the second direction.
  • the recess may include a second opening through which the second bracket is inserted, and the operation of forming the second bracket may include an operation of forming a separation groove portion provided with a locking protrusion protruding in a direction opposite to the second direction.
  • the electronic device can increase set strength by reducing the number of cuts for supporting the key module and the space of the recess for mounting the key module.
  • the electronic device of the present disclosure can reduce the manufacturing cost of components by simplifying the structure of the key module.
  • FIG. 1 is a diagram illustrating a front surface of an electronic device according to an exemplary embodiment.
  • FIG. 2 is a diagram illustrating a rear surface of an electronic device according to an exemplary embodiment.
  • FIG. 3 is a view showing a front surface of the housing of FIG. 2 .
  • FIG. 4 is a view showing a rear surface of the housing of FIG. 2 .
  • FIG. 5 is a view illustrating a state in which a first side key assembly is mounted on an edge of a housing according to an exemplary embodiment.
  • FIG. 6 is a view illustrating a state in which the first side key assembly is separated from the rim of the housing according to an exemplary embodiment.
  • FIG. 7 is a view taken along line A-A of FIG. 6 .
  • FIG. 8 is an exploded view illustrating a side key according to an exemplary embodiment.
  • FIG. 9 is a view taken along line B-B of FIG. 5 .
  • FIG. 10 is a view showing the key module of FIG. 6 .
  • FIG. 11 is an exploded view showing the front of the key module according to an embodiment.
  • FIG. 12 is an exploded view showing the rear side of the key module according to an embodiment.
  • FIG. 13 is a view showing a first bracket according to an embodiment.
  • FIG. 14 is a view illustrating a state in which a waterproof member, a key circuit unit, and a first bracket coupled to each other are mounted in a recess provided on an edge of the housing according to an exemplary embodiment.
  • 15 is a view of a second bracket viewed from a first direction according to an embodiment.
  • 16 is a view of a second bracket viewed from a direction opposite to the first direction according to an embodiment.
  • FIG. 17 is a view taken along line C-C of FIG. 5 .
  • FIG. 18 is a flowchart illustrating a method of manufacturing an electronic device according to an exemplary embodiment.
  • 19 is a view for explaining a process of assembling a side key assembly according to an exemplary embodiment.
  • 20 is a block diagram of an electronic device in a network environment, according to an embodiment.
  • expressions such as “have,” “may have,” “include,” or “may include” indicate the presence of a corresponding characteristic (eg, a numerical value, function, operation, or component such as a part). and does not exclude the presence of additional features.
  • expressions such as “A or B,” “at least one of A and/and B,” or “one or more of A or/and B” may include all possible combinations of the items listed together.
  • “A or B,” “at least one of A and B,” or “at least one of A or B” means (1) includes at least one A, (2) includes at least one B; Or (3) it may refer to all cases including both at least one A and at least one B.
  • An electronic device may include, for example, a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, Desktop PC (desktop PC), laptop PC (laptop PC), netbook computer (netbook computer), workstation, server, PDA (personal digital assistant), PMP (portable multimedia player), MP3 player, mobile medical device, It may include at least one of a camera and a wearable device.
  • the wearable device may be an accessory type (eg, a watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)), a fabric or an integral type of clothing (eg, it may include at least one of an electronic garment), a body attachable type (eg a skin pad or a tattoo), or a bioimplantable type (eg, an implantable circuit).
  • an accessory type eg, a watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)
  • HMD head-mounted-device
  • a fabric or an integral type of clothing For example, it may include at least one of an electronic garment), a body attachable type (eg a skin pad or a tattoo), or a bioimplantable type (eg, an implantable circuit).
  • HMD head-mounted-device
  • FIG. 1 is a view showing a front side of an electronic device 1 according to an exemplary embodiment
  • FIG. 2 is a view showing a rear side of the electronic device 1 according to an exemplary embodiment.
  • the electronic device 1 may have a type of cuboid having a certain volume or a shape similar to a cuboid.
  • the front and back surfaces of the electronic device 1 are implemented as flat planes, but all or some of the four sides of the electronic device 1 (eg, the two sides of the left/right side) may be randomized to improve grip. It can be implemented with curvature.
  • the electronic device 1 may include a cover window 10 , a housing 20 , and a rear cover 30 .
  • the cover window 10 may form the front exterior of the electronic device 1 .
  • the cover window 10 may be coupled to the housing 20 with a space inside the housing 20 in which the internal components can be accommodated. At least a partial area of the cover window 10 may be provided with a transparent material (eg, glass), and a screen output through the display may be displayed outside through the transparent partial area.
  • a transparent material eg, glass
  • the cover window 10 may cover internal components disposed in the housing 20 , for example, the display module from the front side.
  • the cover window 10 may be bent from one surface of the electronic device 1 .
  • the cover window 10 may be bent at the edges of both side ends of the electronic device 1 .
  • the housing 20 may fix and support internal components included in the electronic device 1 , for example, a display module (not shown), a battery (not shown), and a printed circuit board (not shown).
  • a display module is seated and fixed on one side of the housing 20 facing the cover window 10
  • a printed circuit board, and/or a battery is mounted on the other side of the housing 20 facing the rear cover 30 . and can be fixed.
  • the printed circuit board may have a processor, a memory, and/or a communication module disposed thereon.
  • the housing 20 may include a front surface, a rear surface, and a side surface that at least partially surrounds a space between the front surface and the rear surface.
  • the housing 20 may have two side keys 41 and 51 exposed to the outside in a partial region of the side surface.
  • the rear cover 30 may form a rear exterior of the electronic device 1 .
  • the rear cover 30 may cover the components accommodated in the housing 20 from the rear side.
  • the rear cover 30 may be bent at the edges of both ends of the electronic device 1 .
  • the rear cover 30 may include a camera area 31 provided to expose at least one rear camera lens 32 .
  • the electronic device 1 may further include a side cover that forms the exterior of the side part.
  • FIG. 3 is a view showing the front surface 201 of the housing 20 of FIG. 2
  • FIG. 4 is a view showing the rear surface 202 of the housing 20 of FIG. 2 .
  • the housing 20 may include a first space 21 on the front surface 201 .
  • An internal component of the electronic device 1 such as a display module may be accommodated in the first space 21 .
  • the housing 20 may include a second space 22 on the rear surface 202 .
  • a battery and a first printed circuit board and a second printed circuit board on which electronic components are disposed may be accommodated.
  • the housing 20 may include a rim 24 surrounding the first space 21 and the second space 22 .
  • the two side key assemblies 40 and 50 may be disposed on the rim 24 . At this time, one side key assembly 40 is inserted from the rear surface 202 of the housing 20 shown in FIG. 4 , and the other side key assembly 50 is inserted from the front surface 201 of the housing 20 shown in FIG. 3 . can be inserted.
  • the side key assemblies 40 and 50 may provide an interface for user input. For example, when the user presses the side keys 41 and 51 , the key modules 42 and 52 are operated to generate an electrical signal.
  • the electronic device 1 may perform a function related to input of a side key in response to the generated electrical signal.
  • the electronic device 1 may perform a function of turning on/off the screen of the display in response to an input of one side key assembly 40 and the other side key assembly 50 . ), it is possible to perform the function of adjusting the volume of the call or the volume of playing multimedia files in response to the input.
  • one side key assembly 40 may have two pressed contact portions, and the other side key assembly 50 may have two pressed contact portions.
  • the electronic device 1 may omit at least one of the above-described side keys, and may further include at least one other side key.
  • the above-described side key or at least one other side key may have one, two, or three or more contact portions.
  • FIG. 5 is a view showing a state in which the side key assembly 40 is mounted on the rim 24 of the housing 20
  • FIG. 6 is a view showing the side key assembly 40 is separated from the rim 24 of the housing 20. It is a view showing the state
  • FIG. 7 is a view taken along line A-A of FIG. 6 .
  • the side key assembly 40 may be mounted on the rim 24 of the housing 20 .
  • the side key assembly 40 may include a side key 41 and a key module 42 .
  • the key module 42 includes a waterproof member 421 , an adhesive tape 422 , a key circuit unit 423 , a first bracket 424 supporting the key circuit unit 423 , and a second bracket 424 supporting the first bracket 424 .
  • a bracket 425 may be included. A detailed structure of the key module 42 will be described later.
  • the first direction is defined as a direction in which the side key 41 is inserted into the first opening 2411 from the outside, and the second direction is perpendicular to the first direction on the same plane.
  • One direction is defined, and the third direction is defined as a direction perpendicular to the first direction and the second direction.
  • a recess 241 recessed in a direction opposite to the third direction may be provided in the rim 24 of the housing 20 to accommodate the side key assembly 40 .
  • the recess 241 may include a first opening 2411 communicating in a first direction to insert the side key 41 and a second opening 2412 open to inserting the key module 42 .
  • the recess 241 may have a guide groove 2413 in which the first guide ( 4244 of FIG. 11 ) of the first bracket 424 is inserted and supported.
  • the recess 241 may include an inner wall surface 2415 facing in a direction opposite to the first direction, an inner surface 2416 facing in a direction opposite to the second direction, and an inner surface 2417 facing the second direction.
  • FIG. 8 is an exploded view of the side key 41
  • FIG. 9 is a view taken along line B-B of FIG.
  • the side key 41 may include a key cover 411 , a key holder 412 , and a key pusher 413 .
  • the key cover 411 may be exposed to the outside and may be pressed by a user.
  • the key cover 411 may include a holder receiving part 4111 in which the holder supporting part 4123 of the key holder 412 is accommodated.
  • the key holder 412 includes, for example, a pusher receiving portion 4121 for accommodating the pusher support portion 4131 of the key pusher 413, and four hooks for supporting the key holder 412 to the first opening 2411 ( 4122 ) and a holder support part 4123 inserted into the holder accommodating part 4111 of the key cover 411 .
  • the key holder 412 may be formed of, for example, a urethane resin that can be deformed and restored.
  • the hook 4122 may protrude along the outer peripheral surface of the pusher receiving portion 4121 of the key holder 412 .
  • the hook 4122 is deformed inside the pusher receiving part 4121 when inserted into the first opening 2411, and then enters the recess 241 and then restored to the opposite direction to the first direction. It may be engaged and fastened to the inner wall surface 2410 of the provided recess 241 .
  • the key pusher 413 includes a pusher support part 4131 inserted and supported in the pusher receiving part 4121 of the key holder 412 and a pusher protrusion 4132 capable of pressing the switch 4231 of the key circuit part 423 to be described later. ) may be included.
  • FIG. 10 is a view showing the key module 42 of FIG. 6
  • FIG. 11 is an exploded view of the key module 42 viewed from one direction
  • FIG. It is a drawing seen from
  • the key module 42 includes a waterproof member 421 for waterproofing, an adhesive tape 422 for attaching the waterproof member 421 to the key circuit unit 423, and a side key for operation of the key. It may include a key circuit unit 423 that operates accordingly, a first bracket 424 supporting the key circuit unit 423 , and a second bracket 425 supporting the first bracket 424 .
  • the waterproof member 421 may seal between the first opening 2411 and the recess 241 into which the side key 41 is inserted to prevent water from flowing through the first opening 2411 from the outside.
  • the waterproof member 421 has a plate shape and a sealing part 4212 provided to cover the waterproof member body 4210 having a third opening ( 4211 in FIG. 12 ) formed in the center, and the third opening 4211 of the waterproofing member body 4210 . ), and first and second fastening holes 4215 and 4216 may be included.
  • the sealing part 4212 may be provided on a surface facing the first opening 2411 in a direction opposite to the first direction, and may have a frame shape surrounding the first opening 2411 .
  • the sealing part 4212 may be provided with a contact part 4213 in contact with the pusher protrusion ( 4132 of FIG. 8 ) of the side key 41 on the first surface facing the first opening 2411 .
  • the sealing part 4212 may include a contact protrusion 4214 provided on a surface facing the first direction, that is, the key circuit part 423 .
  • the sealing part 4212 may be made of an elastic material, for example, synthetic rubber, silicone, or natural rubber.
  • the adhesive tape 422 includes a fourth opening 4221 of a position and shape corresponding to the third opening 4211 of the waterproof member body 4210, and first and second fastening holes 4215 of the waterproof member 421, It may include third and fourth fastening holes 4222 and 4223 of positions and shapes corresponding to 4216 .
  • the contact protrusion 4214 of the waterproof member 421 may directly contact the switch 4231 of the key circuit unit 423 through the third opening 4211 and the fourth opening 4221 according to the operation of the side key 41 .
  • the key circuit unit 423 is an FPCB, and may generate an electrical signal for performing a predetermined function according to the user's manipulation of the side key 41 and transmit it to the processor of the main circuit board.
  • the key circuit part 423 is a plate-shaped circuit part main body 4230, a switch 4231 provided at a position corresponding to the contact protrusion 4214 of the waterproof member 421 of the circuit part main body 4230, a switch of the circuit part main body 4230 ( Circuit wiring 4232 for transferring the electrical signal generated in 4231 to the connector 4235, and fifth and sixth fastening holes 4233 of positions and shapes corresponding to the third and fourth fastening holes 4222 and 4223, 4234) may be included.
  • FIG. 13 is a view showing a first bracket 424 according to an embodiment.
  • the first bracket 424 includes the first support body 4240 supporting one surface of the key circuit unit 423 in the first direction, and the first bracket 424 provided on one side opposite to the second direction. It may include a first guide 4244 and a first support portion 4245 provided at one end in the third direction of the other side in the second direction.
  • the first support body 4240 may support one surface of the key circuit part 423 in the first direction.
  • the first support body 4240 may include seventh and eighth fastening holes 4242 and 4243 of positions and shapes corresponding to the fifth and sixth fastening holes 4233,4234 of the key circuit unit 423 . .
  • the first, third, fifth, and seventh fastening holes (4215,4222,4233,4242) and the second, fourth, sixth, and eighth fastening holes (4216,4223,4234,4243) have a waterproof member
  • a protrusion (not shown) of the assembly jig may be inserted so that the 421 , the adhesive tape 422 , the key circuit unit 423 , and the first bracket 424 are mutually assembled in the correct position.
  • the waterproof member 421, the adhesive tape 422, the key circuit part 423, and the first bracket 424 are formed with the first, third, fifth, and seventh fastening holes 4215,4222,4233,4242 and
  • the second, fourth, sixth, and eighth fastening holes 4216, 4223,4234, and 4243 may be integrally coupled by fastening means (not shown), for example, bolts and nuts, respectively.
  • the first guide 4244 may be bent in the first direction from one side of the first support body 4240 in a direction opposite to the second direction. As shown in FIG. 5 , the first guide 4244 may be inserted into the guide groove 2413 of the recess 241 to support the first bracket 424 not to move in the second direction or the opposite direction. .
  • the first support portion 4245 may be formed by bending in a direction opposite to the first direction.
  • the first support part 4245 restricts movement of the waterproof member 421 and the key circuit part 423 integrally coupled to the first recess 241 in the third direction, that is, toward the second opening (2412 in FIG. 7 ). can do.
  • FIG 14 is a view showing a state in which the waterproof member 421, the key circuit part 423, and the first bracket 424 coupled to the recess 241 provided in the rim 24 of the housing 20 are mounted.
  • the waterproof member 421 , the key circuit part 423 , and the first bracket 424 coupled to each other may be positioned in the first region 241a of the recess 241 .
  • the first guide 4244 of the first bracket 424 may be supported by the guide groove 2413 of the recess 241 .
  • a second bracket 425 to be described later may be inserted into the second region 241b of the recess 241 to support the first bracket 424 inserted earlier.
  • FIG. 15 is a view of the second bracket 425 according to an embodiment viewed from one direction
  • FIG. 16 is a view of the second bracket 425 according to an embodiment as viewed from the opposite direction in one direction
  • FIG. 17 is It is a view taken along the line C-C of FIG. 5 .
  • the second bracket 425 includes a second support body 4250 , a second guide 4252 and a second support body ( A second support portion 4256 extending from one end of the third direction 4250 in a direction opposite to the first direction may be included.
  • the second bracket 425 may be assembled by being inserted into the second region 241b of the recess 241 shown in FIG. 14 .
  • the second support body 4250 supports one surface of the first bracket 424 in a plate shape in the first direction
  • the second guide 4252 is a side surface of the first bracket 424 in the second direction (refer to FIG. 13 ). 4246) can be supported.
  • the second guide 4252 may protrude from the second support body 4250 in a direction opposite to the first direction.
  • the second guide 4252 may include a first support surface 4253 in contact with the second directional side surface 4246 of the first bracket 424 as shown in FIGS. 15 and 17 .
  • the second guide 4252 may include an insertion guide surface 4254 that is bent and extended in the second direction from the first support surface 4253 .
  • the insertion guide surface 4254 may guide the smooth insertion of the second bracket 425 into the second region 241b shown in FIG. 14 .
  • the second guide 4252 may include a second support surface 4258 provided to face the second direction as shown in FIG. 16 .
  • the second support surface 4258 may contact the inner surface 2416 of the recess 241 in the second direction as shown in FIG. 17 .
  • the second support 4256 may be formed by bending in a direction opposite to the first direction.
  • the second support 4256 may restrict movement of the first bracket 424 in the third direction of the first recess 241 , that is, toward the second opening 2412 of FIG. 7 .
  • the second bracket 425 may include an inclined portion 4257 inclined at a predetermined angle in a direction opposite to the second direction from one side of the second support body 4250 in the third direction.
  • the inclined portion 4257 prevents interference with the circuit wiring 4232 of the key circuit portion 423 extending in the first direction when the second bracket 425 is inserted or separated from the second region 241b of FIG. 14 . can do.
  • the second direction side surface 4258 of the second bracket 425 may be supported on the second direction inner side surface 2416 of the recess 241 as shown in FIG. 17 .
  • the second direction side surface 4258 of the second bracket 425 may include a cutout groove 4259 cut in a direction opposite to the second direction.
  • the second bracket 425 may include a separation groove 4255 for separation while being inserted into the second region (241b of FIG. 14 ) of the recess 241 .
  • the separation groove 4255 includes a communication portion 4255a communicating with the second opening 2412 in FIG. 7 in the third direction and an extension portion 4255b extending from the communication portion 4255a in the second direction. ) may be included.
  • the user can separate the second bracket 425 by lifting the locking jaw 4261 while inserting a tool such as tweezers into the separation groove 4255 .
  • the first bracket 424 is attached to the first region of the recess 241 so that the first guide 4244 is supported by the guide groove 2413 (FIG. 14). 241a), and then inserting the second bracket 425 into the second region 241b of the recess 241, so that it can be simply mounted on the housing 20.
  • the first guide 4244 may be omitted.
  • one side 4247 of the first support body 4240 in the opposite direction to the second direction may be directly supported on the side surface ( 2417 of FIG. 7 ) opposite to the second direction of the recess 241 .
  • the movement of the first bracket 424 in the opposite direction to the second direction is limited by one side 4247 of the first support body 4240, and the movement of the first bracket 424 in the second direction is the second direction. It may be limited by the second guide 4252 of the bracket 425 .
  • FIG. 18 is a flowchart illustrating a method of manufacturing the electronic device 1 according to an exemplary embodiment
  • FIG. 19 is a view for explaining a process of assembling the side key assembly 40 .
  • the housing 20 constituting the exterior of the electronic device 1 may be formed.
  • the housing 20 may include an inner frame of a casting material and an outer frame of a rolled or compressed material, and may be formed by insert injection with an injection material.
  • a recess 241 having a first opening 2411 through which the side key 41 is inserted may be formed in the rim 24 of the housing 20 in communication from the outside in the first direction.
  • a guide groove 2413 extending in the first direction may be formed in the recess 241 .
  • the side key 41 inserted into the first opening 2411 may be formed.
  • the key circuit unit 423 operated according to the operation of the side key 41 may be formed.
  • the first support body 4240 supporting one surface of the key circuit part 423 in the first direction, and the first guide 4244 extending from the first support body 4240 and supported by the recess 241 ), including a first bracket 424 may be formed.
  • the second support body 4250 for supporting one surface of the first bracket 424 in the first direction, and the second support body 4250 from one side of the second support body 4250 in the second direction perpendicular to the first direction It is possible to form a second bracket 425 including a second guide 4252 protruding in the opposite direction to the first direction and having a support surface 4253 for supporting the side surface of the first support body 4240 in the second direction. have.
  • the key circuit unit 423 and the first bracket 424 formed as described above may be integrally coupled to each other.
  • the waterproof member 421 shown in FIGS. 11 and 12 is attached to the key circuit part 423 by an adhesive tape 422 .
  • the key circuit part 423 and the first bracket 424 coupled to each other allow the first guide 4244 to be inserted into the guide groove 2413 to be inserted into the recess 241. may be inserted into the first region 241a of
  • the second support body 4250 and the second guide 4252 of the second bracket 425 may be inserted into the second region 241b of the recess 241 , respectively.
  • the second support body 4250 is inserted between one surface of the first support body 4240 in the first direction and the inner surface of the recess 241 on the first direction side
  • the second guide 4252 is the first support body 4240 . It may be inserted between one side surface of the body 4240 in the second direction and an inner surface of the recess 241 on the second direction side.
  • the second guide 4252 is inserted between one side surface of the first support body 4240 in the second direction and the inner surface of the recess 241 in the second direction. Accordingly, movement in the second direction or the opposite direction may be restricted.
  • the first support surface 4253 of the second guide 4252 may press the first bracket 424 in a direction opposite to the second direction.
  • the side key 41 may be inserted into the first opening 2411 to be coupled.
  • the electronic device 1 communicates with the electronic device 2 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 (eg: It can communicate with at least one of the electronic device 4 and the server 8 through a long-distance wireless communication network).
  • the electronic device 1 may communicate with the electronic device 4 through the server 8 .
  • the electronic device 1 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178
  • may be omitted or one or more other components may be added to the electronic device 1 .
  • some of these components are integrated into one component (eg, display module 160 ). can be
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 1 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit
  • NPU neural processing unit
  • image signal processor e.g., a sensor hub processor, or a communication processor.
  • the main processor 121 e.g, a central processing unit or an application processor
  • a secondary processor 123
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 1 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the co-processor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning, for example, may be performed in the electronic device 1 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 8).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 1 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 1 from the outside (eg, a user) of the electronic device 1 .
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen) 3 .
  • the sound output module 155 may output a sound signal to the outside of the electronic device 1 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 160 may visually provide information to the outside (eg, a user) of the electronic device 1 .
  • the display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires sound through the input module 150 , or an external electronic device (eg, the sound output module 155 ) connected directly or wirelessly with the electronic device 1 . The sound may be output through the electronic device 2) (eg, a speaker or headphones).
  • the electronic device 2 eg, a speaker or headphones.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 1 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used for the electronic device 1 to be directly or wirelessly connected with an external electronic device (eg, the electronic device 2 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 178 may include a connector through which the electronic device 1 can be physically connected to an external electronic device (eg, the electronic device 2 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 1 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 1 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1 and an external electronic device (eg, the electronic device 2, the electronic device 4, or the server 8). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 4 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy It may communicate with the external electronic device 4 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a telecommunication network such as a LAN
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . It is possible to confirm or authenticate the electronic device 1 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 1 , an external electronic device (eg, the electronic device 4 ), or a network system (eg, the second network 199 ).
  • the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna radiator provided to integrally extend from the built-in frame 210 made of a conductive material constituting the housing 20 .
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna).
  • At least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 .
  • the communication module 190 can be selected.
  • a signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to one side (eg, underside) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band), and the
  • the printed circuit board may include a plurality of antennas (eg, an array antenna) disposed on or adjacent to the back surface (eg, an upper surface or a side surface) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 1 and the external electronic device 4 through the server 8 connected to the second network 199 .
  • Each of the external electronic devices 2 or 4 may be the same as or different from the electronic device 1 .
  • all or part of the operations executed in the electronic device 1 may be executed in one or more external electronic devices 2, 4, or 8 of the external electronic device.
  • the electronic device 1 may instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1 .
  • the electronic device 1 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 1 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 4 may include an Internet of things (IoT) device.
  • the server 8 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 4 or the server 8 may be included in the second network 199 .
  • the electronic device 1 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • an intelligent service eg, smart home, smart city, smart car, or health care

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Telephone Set Structure (AREA)

Abstract

L'invention concerne un dispositif électronique comprenant une clé latérale. Le dispositif électronique comprend un boîtier qui configure l'apparence externe du dispositif électronique et comprend un évidement ayant une ouverture prévue pour communiquer avec l'extérieur dans une première direction, et un ensemble clé latérale disposé dans l'évidement. L'ensemble clé latérale comprend une clé latérale prévue pour être manipulée à travers l'ouverture, une unité de circuit de clé actionnée en fonction de la manipulation de la clé latérale, un premier support comprenant un premier corps de support pour supporter une surface dans la première direction de l'unité de circuit de clé et un premier guide s'étendant à partir du premier corps de support pour être supporté par l'évidement, et un second support comprenant un second corps de support pour supporter une surface dans la première direction du premier support et un second guide ayant une surface de support dépassant dans une direction opposée à la première direction depuis un côté du second corps de support dans une seconde direction perpendiculaire à la première direction pour supporter une surface latérale dans la seconde direction du premier corps de support.
PCT/KR2021/017149 2020-12-03 2021-11-22 Dispositif électronique comprenant une clé latérale et procédé pour le fabriquer WO2022119200A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2020-0167525 2020-12-03
KR20200167525 2020-12-03
KR10-2021-0032630 2021-03-12
KR1020210032630A KR20220078441A (ko) 2020-12-03 2021-03-12 사이드 키를 가진 전자장치 및 그의 제조방법

Publications (1)

Publication Number Publication Date
WO2022119200A1 true WO2022119200A1 (fr) 2022-06-09

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WO (1) WO2022119200A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080043998A (ko) * 2006-11-15 2008-05-20 엘지전자 주식회사 사이드키를 구비한 이동단말기
JP2017521931A (ja) * 2014-06-17 2017-08-03 ゼットティーイー コーポレーションＺｔｅ Ｃｏｒｐｏｒａｔｉｏｎ 端末サイドキーの防水装置及び端末
KR20170099626A (ko) * 2016-02-24 2017-09-01 삼성전자주식회사 사이드 키 및 이를 포함하는 전자 장치
CN208903896U (zh) * 2018-10-26 2019-05-24 Oppo广东移动通信有限公司 电子设备及其侧键组件
CN210518502U (zh) * 2019-11-08 2020-05-12 上海闻泰电子科技有限公司 侧键fpc安装结构及终端设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080043998A (ko) * 2006-11-15 2008-05-20 엘지전자 주식회사 사이드키를 구비한 이동단말기
JP2017521931A (ja) * 2014-06-17 2017-08-03 ゼットティーイー コーポレーションＺｔｅ Ｃｏｒｐｏｒａｔｉｏｎ 端末サイドキーの防水装置及び端末
KR20170099626A (ko) * 2016-02-24 2017-09-01 삼성전자주식회사 사이드 키 및 이를 포함하는 전자 장치
CN208903896U (zh) * 2018-10-26 2019-05-24 Oppo广东移动通信有限公司 电子设备及其侧键组件
CN210518502U (zh) * 2019-11-08 2020-05-12 上海闻泰电子科技有限公司 侧键fpc安装结构及终端设备

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