WO2022118410A1

WO2022118410A1 - Component mounter

Info

Publication number: WO2022118410A1
Application number: PCT/JP2020/044912
Authority: WO
Inventors: 大佑中村
Original assignee: 株式会社Fuji
Priority date: 2020-12-02
Filing date: 2020-12-02
Publication date: 2022-06-09
Also published as: JPWO2022118410A1

Abstract

Component mounters mount electronic components on substrates. This component mounter comprises: an imaging device that images an electronic component; a light source that emits light to the electronic component when the electronic component is imaged by the imaging device; an adjustment member comprising an imaging surface for brightness adjustment; and an adjustment unit which, when the imaging surface irradiated with the light from the light source is imaged by the imaging device, adjusts, on the basis of the brightness of the imaging surface detected from the captured image of the imaging surface, the amount of light emitted from the light source.

Description

Component mounting machine

This specification relates to a component mounting machine that mounts electronic components on a board.

In the component mounting machine that mounts electronic components on the board, an image pickup device used to image the electronic components is installed in the component mounting machine. For example, the component mounting machine disclosed in Japanese Patent Application Laid-Open No. 2018-6767 includes an image pickup device for imaging the back surface of an electronic component and a light source for illuminating the back surface of the electronic component during imaging.

The component mounting machine of JP-A-2018-6767 illuminates the image pickup target by irradiating the image pickup target with light from the light source when the image pickup device (for example, the back surface of the electronic component) is imaged. If the light emitted from the light source is too weak or too strong, the image pickup target cannot be properly imaged. For example, when the amount of light from the light source is not appropriate, such as when the amount of light from the light source is attenuated due to deterioration of the light source, it is necessary for the operator to perform work for adjusting the light source.

This specification discloses a technique for efficiently adjusting the amount of light of a light source used for imaging.

The component mounting machine disclosed in this specification mounts electronic components on a substrate. The component mounting machine includes an image pickup device that captures an image of an electronic component, a light source that irradiates the electronic component with light when the image pickup device images the electronic component, an adjustment member provided with an image pickup surface for brightness adjustment, and light from the light source. It is provided with an adjusting unit that adjusts the amount of light emitted from the light source based on the brightness of the image pickup surface detected from the image pickup image of the image pickup surface that has been imaged when the image pickup surface irradiated with the image is imaged by the image pickup device. ..

The figure which shows the schematic structure of the component mounting machine which concerns on Example. FIG. 1 is a cross-sectional view taken along the line II-II of FIG. The block diagram which shows the control system of the component mounting machine which concerns on Example. A flowchart showing an example of a process of adjusting a light source using a brightness adjusting part.

The main features of the examples described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are limited to the combinations described in the claims at the time of filing. It's not a thing.

The component mounting machine disclosed in the present specification includes an adjusting member for adjusting the brightness and an adjusting unit that adjusts the amount of light of the light source based on the brightness detected from the captured image of the adjusting member. As a result, the amount of light from the light source can be automatically adjusted without the intervention of an operator. Therefore, the amount of light from the light source can be adjusted efficiently.

In the component mounting machine disclosed in the present specification, the adjusting unit may adjust the amount of light emitted from the light source so that the brightness of the imaging surface detected from the captured image is within a predetermined range. According to such a configuration, the amount of light of the light source can be appropriately adjusted.

In the component mounting machine disclosed in the present specification, the adjusting member may be configured to be movable between a standby position set in the component mounting machine and an imaging position that can be imaged by an imaging device. According to such a configuration, the adjusting member is placed in the standby position when an operation other than the adjustment by the adjusting unit is executed (for example, during the execution of the mounting operation), and is placed in the imaging position when the adjustment is executed. Be placed. By always arranging the adjusting member in the component mounting machine in this way, it is possible to adjust the amount of light of the light source at an appropriate timing. Further, even if the adjusting member is always arranged in the component mounting machine, it is arranged in the standby position when another operation is executed, so that the other operation can be suitably executed.

The component mounting machine disclosed in the present specification may further include a nozzle for adsorbing electronic components. The image pickup apparatus may be configured to image the back surface of the electronic component adsorbed on the nozzle. The adjusting member may be configured to be adsorbable to the nozzle, and the imaging surface of the adjusting member adsorbed to the nozzle may be capable of being imaged by the image pickup device. According to such a configuration, the amount of light of the light source for the image pickup device that images the back surface of the electronic component can be appropriately adjusted.

The component mounting machine 10 according to the embodiment will be described with reference to the drawings. The component mounting machine 10 is a device for mounting the electronic component 4 on the circuit board 2. The component mounting machine 10 is also referred to as an electronic component mounting device or a chip mounter. Usually, the component mounting machine 10 is installed together with other board working machines such as a solder printing machine and a board inspection machine to form a series of mounting lines.

As shown in FIGS. 1 and 2, the component mounting machine 10 includes a plurality of component feeders 12, a feeder holding unit 14, a mounting head 16, a head moving device 18, a substrate conveyor 20, an imaging unit 30, and the like. It includes a parts accommodating portion 50, a control device 26, and a touch panel 24. A management device 8 configured to be able to communicate with the component mounting machine 10 is arranged outside the component mounting machine 10.

Each component feeder 12 accommodates a plurality of electronic components 4. The component feeder 12 is detachably attached to the feeder holding portion 14 and supplies the electronic component 4 to the mounting head 16. The specific configuration of the component feeder 12 is not particularly limited. Each component feeder 12 is, for example, in a tape-type feeder that supplies a plurality of electronic components 4 housed on a tape, a tray-type feeder that supplies a plurality of electronic components 4 housed on a tray, or in a container. It may be any of bulk feeders that supply a plurality of randomly housed electronic components 4.

The feeder holding unit 14 is provided with a plurality of slots, and the component feeder 12 can be detachably installed in each of the plurality of slots. The feeder holding portion 14 may be fixed to the component mounting machine 10 or may be detachable from the component mounting machine 10.

The mounting head 16 has a nozzle 6 that attracts the electronic component 4. The nozzle 6 is detachably attached to the mounting head 16. The mounting head 16 can move the nozzle 6 in the Z direction (here, the vertical direction), and brings the nozzle 6 closer to and further from the component feeder 12 and the circuit board 2. The mounting head 16 can mount the electronic component 4 sucked on the nozzle 6 on the circuit board 2 while sucking the electronic component 4 from the component feeder 12 by the nozzle 6. The mounting head 16 is not limited to the one having a single nozzle 6, and may have a plurality of nozzles 6.

The head moving device 18 moves the mounting head 16 between the component feeder 12 and the circuit board 2. As an example, the head moving device 18 of this embodiment is an XY robot that moves the moving base 18a in the X direction and the Y direction, and the mounting head 16 is fixed to the moving base 18a. The mounting head 16 is not limited to the one fixed to the moving base 18a, and may be detachably attached to the moving base 18a.

The board conveyor 20 is a device for carrying in, positioning, and carrying out the circuit board 2. As an example, the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.

The image pickup unit 30 is arranged between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side of the pair of substrate conveyors 20). As shown in FIG. 3, the image pickup unit 30 includes a camera 32 and a light source 34. The camera 32 is arranged so that the shooting direction thereof faces upward, and the nozzle 6 in a state where the electronic component 4 is attracted is imaged from below. That is, when the nozzle 6 attracts the electronic component 4, the camera 32 photographs the lower surface of the electronic component 4 attracted to the nozzle 6. For the camera 32, for example, a CCD camera is used. The light source 34 is composed of LEDs and illuminates the lower surface (imaging surface) of the electronic component 4 adsorbed on the nozzle 6. The image data of the image captured by the image pickup unit 30 is stored in the memory (not shown) of the control device 26.

As shown in FIG. 2, the parts accommodating portion 50 is arranged between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side of the pair of substrate conveyors 20). ing. The parts accommodating portion 50 accommodates the luminance adjusting part 52. The luminance adjusting part 52 has a plate shape and is configured to be adsorbable to the nozzle 6. In this embodiment, the luminance adjusting part 52 has substantially the same dimensions and mass as the electronic component 4. The brightness adjusting part 52 is used to adjust the brightness of the captured image captured by the imaging unit 30. The brightness adjusting part 52 has an image pickup surface for brightness adjustment on the lower surface thereof. The image pickup unit 30 takes an image of the image pickup surface for brightness adjustment, and adjusts the amount of light of the light source 34 so that the brightness of the image captured image becomes appropriate. Specifically, a gray sheet is attached to the lower surface of the luminance adjusting part 52. The gray value (that is, the contrast between white and black) is measured from the captured image obtained by capturing the gray sheet, and the light amount of the light source 34 is adjusted based on the measured gray value.

In this embodiment, the luminance adjusting part 52 is housed in the part accommodating portion 50 installed between the component feeder 12 and the substrate conveyor 20, but the configuration is not limited to this. The luminance adjusting part 52 may be arranged (accommodated) at any position in the component mounting machine 10 as long as it can be attracted by the nozzle 6 (that is, a position accessible by the mounting head 16).

The control device 26 is configured by using a computer including a CPU and a storage device. The control device 26 controls the operation of each part of the component mounting machine 10 based on the production program transmitted from the management device 8. As shown in FIG. 3, the control device 26 is connected to the head moving device 18, the board conveyor 20, the touch panel 24, and the image pickup unit 30, and each part of the head moving device 18, the board conveyor 20, the touch panel 24, and the image pickup unit 30. Is in control. The touch panel 24 is a display device that provides various information of the component mounting machine 10 to the operator, and is an input device that receives instructions and information from the operator.

Next, a process of adjusting the light source 34 using the luminance adjusting part 52 will be described. The process of adjusting the light source 34 is performed, for example, before the component mounting machine 10 starts executing the mounting process according to the production program. The process of adjusting the light source 34 may be executed at any timing desired by the operator.

As shown in FIG. 4, first, the control device 26 sucks the upper surface of the luminance adjusting part 52 with the nozzle 6 (S12). Specifically, the control device 26 has a moving base so that the nozzle 6 is arranged above the luminance adjusting part 52 housed in the part accommodating portion 50 with the nozzle 6 mounted on the mounting head 16. Move 18a. Then, the control device 26 moves the nozzle 6 downward and attracts the upper surface of the brightness adjusting part 52.

Next, the control device 26 images the lower surface of the luminance adjusting part 52 (that is, the image pickup surface for luminance adjustment) with the image pickup unit 30 (S14). Specifically, the control device 26 moves the moving base 18a so that the luminance adjusting part 52 is arranged above the image pickup unit 30. Then, the control device 26 takes an image of the lower surface of the luminance adjusting part 52 by the image pickup unit 30. An imaging surface to which a gray sheet is attached is provided on the lower surface of the brightness adjusting part 52. The image pickup unit 30 takes an image of the image pickup surface of the luminance adjusting part 52. The captured image data is stored in a memory (not shown) of the control device 26.

Next, the control device 26 measures the gray value of the captured image (S16), and determines whether or not the measured gray value is within a predetermined range (S18). The predetermined range is set so that the brightness of the captured image is in an appropriate range, and is stored in advance in the memory (not shown) of the control device 26. When the measured gray value is within a predetermined range (YES in step S18), the control device 26 determines that the amount of light of the light source 34 is appropriate. In this case, since it is not necessary to change the amount of light of the light source 34, the process ends.

On the other hand, when the measured gray value is out of the predetermined range (NO in step S18), the control device 26 determines that the light amount of the light source 34 is not appropriate, and changes the current value to the light source 34 (S20). .. Specifically, when the measured gray value is smaller than the predetermined range, the control device 26 determines that the amount of light of the light source 34 is small, and increases the current value to the light source 34. Examples of the case where the measured gray value becomes smaller than the predetermined range include the case where the light source 34 deteriorates over time and the amount of light from the light source 34 is attenuated. On the other hand, when the measured gray value is larger than the predetermined range, the control device 26 determines that the amount of light of the light source 34 is large, and reduces the current value to the light source 34. The case where the measured gray value becomes larger than the predetermined range is, for example, the case where the set current value (before replacement) is not appropriate due to the replacement of the light source 34.

When the current value to the light source 34 is changed, the control device 26 returns to the process of step S14, and the image pickup unit 30 again images the lower surface of the luminance adjusting part 52. Then, the processes of steps S14 to S20 are repeated. In this way, by repeating the processes of steps S14 to S20 until the measured gray value is within the predetermined range, the light amount of the light source 34 is appropriately adjusted. In this embodiment, the amount of light of the light source 34 is adjusted by changing the current value to the light source 34, but the present invention is not limited to such a configuration. It suffices if the amount of light of the light source 34 can be adjusted, and for example, the voltage value to the light source 34 may be changed.

In this embodiment, the light amount of the light source 34 is adjusted by using the luminance adjusting part 52 arranged in the component mounting machine 10. Conventionally, when adjusting the light amount of the light source of the image pickup unit 30, the operator removes the light source from the component mounting machine 10 and performs the adjustment work outside the component mounting machine 10. In the component mounting machine 10 of this embodiment, the amount of light of the light source 34 can be automatically adjusted without the intervention of an operator. Therefore, the adjustment of the light source 34 of the image pickup unit 30 can be efficiently executed.

In this embodiment, the light intensity of the light source 34 is adjusted by using the luminance adjusting component 52 for the image pickup unit 30 that images the lower surface of the electronic component 4, but the present invention is not limited to such a configuration. If it is an image pickup unit installed in the component mounting machine 10, the amount of light of the light source can be adjusted by the same method. For example, the same method can be applied to an image pickup unit (hereinafter, also referred to as a mark image pickup unit) that images the upper surface of the electronic component 4. Specifically, a luminance adjusting sheet provided with a gray sheet is arranged (accommodated) in the component mounting machine 10, and the luminance adjusting sheet can be imaged by a mark imaging unit (for example, on a board conveyor 20 or the like). ). Then, the luminance adjustment sheet is imaged by the mark image pickup unit, and the light amount of the light source of the mark image pickup unit is adjusted based on the image pickup screen. As a result, the amount of light from the light source can be adjusted for the image pickup unit for the mark.

The points to be noted regarding the component mounting machine 10 described in the examples will be described. The camera 32 of the embodiment is an example of the “imaging device”, the luminance adjusting part 52 is an example of the “adjusting member”, and the control device 26 is an example of the “adjusting unit”.

Although specific examples of the disclosed techniques have been described in detail in the present specification, these are merely examples and do not limit the scope of claims. The techniques described in the claims include various modifications and modifications of the specific examples exemplified above. Further, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the techniques exemplified in this specification or drawings achieve a plurality of purposes at the same time, and achieving one of the purposes itself has technical usefulness.

Claims

It is a component mounting machine that mounts electronic components on a board.
An image pickup device that captures images of the electronic components and
A light source that irradiates the electronic component with light when the electronic component is imaged by the image pickup device.
An adjustment member provided with an image pickup surface for brightness adjustment,
When the image pickup surface irradiated with the light from the light source is imaged by the image pickup apparatus, the image pickup surface is irradiated from the light source based on the brightness of the image pickup surface detected from the image captured on the image pickup surface. A component mounting machine equipped with an adjustment unit that adjusts the amount of light.
The component mounting machine according to claim 1, wherein the adjusting unit adjusts the amount of light emitted from the light source so that the brightness of the imaging surface detected from the captured image is within a predetermined range.
The component mounting machine according to claim 1 or 2, wherein the adjusting member is configured to be movable between a standby position set in the component mounting machine and an imaging position that can be imaged by the imaging device.
Further equipped with a nozzle for adsorbing the electronic component,
The image pickup device is configured to image the back surface of the electronic component adsorbed on the nozzle.
Any one of claims 1 to 3, wherein the adjusting member is configured to be adsorbable to the nozzle, and the imaging surface of the adjusting member adsorbed to the nozzle can be imaged by the imaging device. The component mounting machine described in the section.