WO2022110349A1 - Microphone piézoélectrique et son procédé de fabrication - Google Patents

Microphone piézoélectrique et son procédé de fabrication Download PDF

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Publication number
WO2022110349A1
WO2022110349A1 PCT/CN2020/136636 CN2020136636W WO2022110349A1 WO 2022110349 A1 WO2022110349 A1 WO 2022110349A1 CN 2020136636 W CN2020136636 W CN 2020136636W WO 2022110349 A1 WO2022110349 A1 WO 2022110349A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
sub
piezoelectric
fixed
elastic
Prior art date
Application number
PCT/CN2020/136636
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English (en)
Chinese (zh)
Inventor
石正雨
童贝
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022110349A1 publication Critical patent/WO2022110349A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/222—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers

Definitions

  • the present application relates to a piezoelectric microphone, and in particular, to a piezoelectric microphone with a diaphragm having a large torque.
  • MEMS microphones There are many types of microphones, including moving coil, condenser, aluminum ribbon, carbon, etc.
  • ECM electret
  • MEMS microelectromechanical
  • SMT surface mount
  • the MEMS microphone In the MEMS microphone, it is divided into two types: capacitive and piezoelectric. Piezoelectric versus capacitive update.
  • the main advantage of piezoelectric technology is that it is robust and unaffected by the environment, while capacitive technology suffers from performance degradation over time: in condenser microphones, if there is particulate contamination between the diaphragm and the backplate, the performance of the microphone will be reduced. Change.
  • SNR signal-to-noise ratio
  • the width of the free end of the piezoelectric microphone cantilever beam of the existing structure is smaller than that of the fixed end, the torque generated under the action of sound pressure is low, and the signal-to-noise ratio is low, and the free end warps under the residual stress, resulting in a large gap, which affects Microphone low frequency performance.
  • the purpose of this application is to provide a piezoelectric microphone.
  • it includes a base with a back cavity and a piezoelectric cantilever diaphragm fixed on the base; the piezoelectric cantilever vibrator
  • the membrane at least includes a first sub-diaphragm and a second sub-diaphragm, one end of each sub-diaphragm is fixed with the base to form a fixed end, and the other end is suspended above the back cavity to form a movable end connected to the fixed end, and the width of the movable end is not less than Regarding the width of the fixed end
  • the piezoelectric microphone further includes an elastic elastic member, one end of the elastic elastic member is connected to the movable end of the first sub-diaphragm, and the other end is connected to the second sub-diaphragm and/or the base.
  • the back cavity is in the shape of a square
  • the elastic elastic member connecting the first sub-diaphragm and the second sub-diaphragm is located on the central axis of the square and is parallel to the fixed ends of the first and second sub-diaphragms.
  • the back cavity is in the shape of an octagon
  • the elastic expansion member connecting the first sub-diaphragm and the second sub-diaphragm is located on the central axis of the octagon, and is connected to the fixed ends of the first sub-diaphragm and the second sub-diaphragm. parallel.
  • the back cavity is hexagonal
  • the elastic expansion member connecting the first sub-diaphragm and the second sub-diaphragm is located on the central axis of the hexagon, and is connected to the fixed ends of the first sub-diaphragm and the second sub-diaphragm. parallel.
  • the back cavity is in the shape of a cross
  • the elastic expansion member connecting the first sub-diaphragm and the second sub-diaphragm is located on the central axis of the cross and is parallel to the fixed ends of the first and second sub-diaphragms.
  • the elastic elastic member is a flexible spring structure.
  • the elastic elastic member is a hollow pattern on the sub-diaphragm.
  • the hollow pattern includes a zigzag groove, a swastika groove or a rhombus groove
  • Another aspect of the present application provides a method for making a piezoelectric microphone, comprising the following steps:
  • S1 deposit a layer of piezoelectric material on the substrate, so that the piezoelectric material is fixed on the substrate material;
  • S2 Divide the first sub-diaphragm and the second sub-diaphragm on the piezoelectric material, and fix one end of each sub-diaphragm with the base to form a fixed end, and the other end to form a free movable end, and the width of the movable end is not less than the fixed end the width of the end;
  • a back cavity with a polygonal shape is etched on the substrate.
  • the elastic elastic member is a hollow pattern on the sub-diaphragm.
  • the width of the movable end of the cantilever beam in the structure of the piezoelectric microphone is not less than the width of the fixed end, and a larger torque will be generated under the action of sound pressure, thereby improving the signal-to-noise ratio of the microphone;
  • a flexible spring structure is arranged on the free moving edge of the cantilever beam, so that when the cantilever beam is warped, the spring deforms with the cantilever beam, thereby avoiding the generation of gaps and improving the low-frequency performance of the microphone.
  • FIG. 1 is a top view of a specific embodiment of the present application and an enlarged view of an elastic telescopic element
  • FIG. 2 is a top view of a plurality of specific embodiments of the present application.
  • FIG. 3 is a perspective view of a specific embodiment of the present application.
  • Fig. 4(a) is a schematic diagram of the prior art without elastic elastic members
  • Fig. 4(b) is a functional schematic diagram of the elastic elastic members in the present application and an enlarged view thereof.
  • the present application provides a piezoelectric microphone 100 , which includes a substrate 10 having a back cavity 11 , and a piezoelectric cantilever diaphragm 20 fixed above the substrate 10 .
  • the piezoelectric cantilever beam diaphragm 20 includes a pair of first sub-diaphragms 21 and second sub-diaphragms 22 arranged oppositely.
  • the pair of sub-diaphragms of the piezoelectric cantilever beam diaphragm 20 will deform under the action of external sound pressure. , and the piezoelectric effect occurs to generate electrical signal output.
  • the back cavity 11 is a cavity formed by the substrate 10 and the piezoelectric cantilever beam diaphragm 20. Due to the existence of the back cavity 11, when the same sound intensity acts on the piezoelectric cantilever beam diaphragm 20, the piezoelectric cantilever beam diaphragm 20 will vibrate. The displacement is greatly increased, and thus the increased strain produces more charge.
  • the first sub-diaphragm 21 and the second sub-diaphragm 22 have the same shape, each sub-diaphragm has at least one fixed end 211, 221 fixed on the base 10, and at least one of the sub-diaphragms is elastically connected to the other sub-diaphragm.
  • the movable ends 212 and 222 of the telescopic piece 30 are connected.
  • the elastic elastic member 30 and the fixed ends connecting the first sub-diaphragm 21 and the second sub-diaphragm 22 with the base 10 form certain constraints on the first sub-diaphragm 21 and the second sub-diaphragm 22, so that the first sub-diaphragm 21 and the second sub-diaphragm 22 are bound to a certain extent.
  • the membrane 21 and the second sub-diaphragm 22 are suspended above the back cavity 11 of the substrate 10, and make the two first sub-diaphragms 21 and the second sub-diaphragm 22 on the same plane as much as possible, so as to reduce the damage caused by the two diaphragms.
  • the signal-to-noise ratio decreases due to the deformation of the first sub-diaphragm 21 and the second sub-diaphragm 22 .
  • the lengths of the movable ends 212 and 222 of the sub-diaphragm are not less than the lengths of the fixed ends 211 and 221 .
  • the material of the substrate 10 may be a material such as silicon that can be processed by an etching process, so that the back cavity 11 can be etched on the base material of the substrate 10 .
  • the material of the piezoelectric cantilever diaphragm 20 is a ceramic material capable of generating piezoelectric effect, such as AlN, perovskite oxide and the like.
  • the material of the piezoelectric cantilever diaphragm 20 may be deposited on the base by methods such as physical vapor deposition.
  • the piezoelectric cantilever beam diaphragm 20 has only two first sub-diaphragms 21 and the fixed ends 211 and 221 of the second sub-diaphragm 22 connected to the base 10.
  • the piezoelectric cantilever beam diaphragm 20 is adjacent to the base 10 except for the fixed ends 211 and 221 of the first sub-diaphragm 21 and the second sub-diaphragm 22, The connection is also made using elastic elastic members 30 .
  • all sides of the piezoelectric cantilever diaphragm 20 are connected to the base 10, which can further improve the stability.
  • the piezoelectric cantilever beam vibrating film 20 includes at least three-layer structures, which respectively include a first electrode sheet, a piezoelectric diaphragm, and a second electrode sheet that are sequentially stacked along the vibration direction, and the first electrode sheet is provided with On the side of the piezoelectric cantilever diaphragm 20 close to the back cavity 11 . More specifically, the piezoelectric cantilever diaphragm 20 may also have a five-layer structure or a multi-layer structure.
  • the elastic elastic member 30 is a soft spring structure, which connects the base 10 and the piezoelectric cantilever beam diaphragm 20 and connects the two first sub-diaphragms 21 ,
  • the spring and the piezoelectric cantilever beam diaphragm 20 can be deformed together, thereby avoiding the generation of the gap as shown in FIG. 4(a), thereby improving the low frequency of the microphone. performance.
  • the soft spring structure as the elastic elastic member 30 is a hollow pattern etched on the first sub-diaphragm 21 and the second sub-diaphragm 22 .
  • the hollow pattern may be a zigzag groove, a swastika groove or a rhombus groove.
  • the above-mentioned hollow pattern is etched on the piezoelectric cantilever beam vibrating film 20 deposited on the base by a method such as physical vapor deposition by photolithography.
  • the required movable ends 212 , 222 and the part where the piezoelectric cantilever beam diaphragm 20 is connected to the base 10 can be directly etched on a whole piece of the deposited piezoelectric cantilever beam diaphragm 20 . .
  • the present application also provides a method for making a piezoelectric microphone, comprising the following steps:
  • S1 deposit a layer of piezoelectric material on the substrate, so that the piezoelectric material is fixed on the substrate material;
  • S2 Divide the first sub-diaphragm 21 and the second sub-diaphragm 22 on the piezoelectric material, and fix one end of each sub-diaphragm with the base 10 to form a fixed end, and the other end to form a free movable end.
  • the width of the end is not less than the width of the fixed end.
  • the sides where the first sub-diaphragm 21 and the second sub-diaphragm 22 are connected to each other are set as the movable ends 212 and 222, which are connected with each other.
  • the movable ends 212 and 222 are parallel and fixed on the base 10 as fixed ends.
  • the shape of the back cavity 11 determines the shape of the piezoelectric cantilever beam diaphragm 20 covering the substrate 10 . Therefore, it is necessary to ensure that the length of the movable ends 212 and 222 of the sub-diaphragms 21 and 22 is not less than the length of the fixed ends 211 and 221 .
  • the elastic stretchable member is a hollow pattern on the piezoelectric cantilever beam diaphragm.
  • a piezoelectric cantilever beam diaphragm 20 formed by a pair of first sub-diaphragms 21 and second sub-diaphragms 22 having the same shape is fixed and suspended on the substrate 10 with The octagonal shape is above the back cavity 11 to receive the external sound pressure and convert it into an electrical signal.
  • the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are connected to each other along the central axis of the octagon of the back cavity 11 through the elastic elastic member 30, so that the first sub-diaphragm 21,
  • the second sub-diaphragm 22 is connected to form the piezoelectric cantilever beam diaphragm 20, and the fixed ends 211 and 221 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are located on two opposite sides of the eight sides parallel to the central axis. on each side, and is fixedly connected with the base 10.
  • the lengths of the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are greater than the lengths of the fixed ends 211 and 221, which makes the piezoelectric cantilever beam diaphragm 20 play a role in the sound pressure. There is a larger torque under the lower, which can improve the signal-to-noise ratio.
  • a piezoelectric cantilever beam vibrating membrane 20 formed by a pair of the first sub-diaphragm 21 and the second sub-diaphragm 22 having the same shape is fixed and suspended on the substrate 10 having the same shape.
  • the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are connected to each other along the central axis of the hexagon by the elastic elastic member 30 , so that the first sub-diaphragm 21 and the second sub-diaphragm 22 are connected to each other along the central axis of the hexagon.
  • the diaphragms 22 are connected to form the piezoelectric cantilever beam diaphragm 20, and the fixed ends 211 and 221 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are located on two sides of the six sides that are parallel to and opposite to the central axis, and fixedly connected with the base 10 .
  • the lengths of the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are not less than the lengths of the fixed ends 211 and 221 , which makes the piezoelectric cantilever beam diaphragm 20 operate under the sound pressure. There is a larger moment under the action, which can improve the signal-to-noise ratio.
  • a piezoelectric cantilever beam vibrating membrane 20 formed by a pair of the first sub-diaphragm 21 and the second sub-diaphragm 22 having the same shape is fixed and suspended on the substrate 10 having the same shape.
  • Above the back cavity 11 in the shape of a cross to receive the external sound pressure and convert it into an electrical signal.
  • the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are connected to each other along the central axis of the cross through the elastic elastic member 30 , so that the first sub-diaphragm 21 and the second sub-diaphragm 22 are connected to each other by the elastic expansion member 30 .
  • 22 is connected to form a piezoelectric cantilever beam diaphragm 20, and the fixed ends 211 and 221 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are located on two sides parallel to and opposite to the central axis of the cross, and are connected to the base. 10 are fixedly connected.
  • the lengths of the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are not less than the lengths of the fixed ends 211 and 221, which makes the piezoelectric cantilever beam diaphragm 20 in the sound Under the action of pressure, there is a larger moment, which can improve the signal-to-noise ratio.
  • a piezoelectric cantilever beam vibrating membrane 20 formed by a pair of the first sub-diaphragm 21 and the second sub-diaphragm 22 having the same shape is fixed and suspended on the substrate 10 having the same shape.
  • the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are connected to each other along the central axis of the square by the elastic expansion member 30 , so that the first sub-diaphragm 21 and the second sub-diaphragm 22
  • the piezoelectric cantilever beam diaphragm 20 is formed by connection, and the fixed ends 211 and 221 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are located on the two sides parallel to and opposite to the central axis of the square, and are fixed to the base 10 connected.
  • the part of the piezoelectric cantilever beam diaphragm 20 adjacent to the base 10 except the fixed ends 211 and 221 of the first sub-diaphragm 21 and the second sub-diaphragm 22 also uses an elastic elastic member 30 to connect.
  • the lengths of the movable ends 212 and 222 of the first sub-diaphragm 21 and the second sub-diaphragm 22 are greater than the lengths of the fixed ends 211 and 221, which makes the piezoelectric cantilever beam diaphragm 20 play a role in the sound pressure. There is a larger torque under the lower, which can improve the signal-to-noise ratio.
  • the terms “comprising”, “comprising” or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus.
  • an element qualified by the phrase “comprising a" does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

L'invention concerne un microphone piézoélectrique. Le microphone piézoélectrique comprend une base ayant une cavité arrière, et une membrane vibrante à poutre en porte-à-faux piézoélectrique fixée au-dessus de la base, dans lequel la membrane vibrante à poutre en porte-à-faux piézoélectrique comprend au moins une premiere sous-membrane vibrante et une deuxième sous-membrane vibrante ; une extrémité de chaque sous-membrane vibrante est fixée à la base, de façon à former une extrémité fixe, et son autre extrémité est suspendue au-dessus de la cavité arrière, de façon à former une extrémité mobile qui est reliée à l'extrémité fixe ; et la largeur de l'extrémité mobile n'est pas inférieure à la largeur de l'extrémité fixe. Le microphone piézoélectrique comprend en outre un élément télescopique élastique, dans lequel une extrémité de l'élément télescopique élastique est reliée à l'extrémité mobile de la première sous-membrane vibrante, et son autre extrémité est reliée à la seconde sous-membrane vibrante et/ou à la base. Dans la présente invention, la largeur d'une extrémité mobile d'une poutre en porte-à-faux n'est pas inférieure à la largeur d'une extrémité fixe, de sorte qu'un moment plus important sera généré sous l'action d'une pression acoustique, améliorant ainsi le rapport signal/bruit du microphone.
PCT/CN2020/136636 2020-11-30 2020-12-16 Microphone piézoélectrique et son procédé de fabrication WO2022110349A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011377659.0 2020-11-30
CN202011377659.0A CN112584289B (zh) 2020-11-30 2020-11-30 一种压电式麦克风及其制作方法

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WO2022110349A1 true WO2022110349A1 (fr) 2022-06-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024008132A1 (fr) * 2022-07-06 2024-01-11 华为技术有限公司 Appareil à induction piézoélectrique, son procédé d'utilisation et dispositif intelligent

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US20200236471A1 (en) * 2018-06-25 2020-07-23 Goertek Inc. Microphone
JP2020136385A (ja) * 2019-02-15 2020-08-31 新日本無線株式会社 圧電素子

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JP6894719B2 (ja) * 2017-02-21 2021-06-30 新日本無線株式会社 圧電素子
CN109587612A (zh) * 2018-12-31 2019-04-05 瑞声声学科技(深圳)有限公司 压电式麦克风
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US20200236471A1 (en) * 2018-06-25 2020-07-23 Goertek Inc. Microphone
CN109587613A (zh) * 2018-12-31 2019-04-05 瑞声声学科技(深圳)有限公司 压电式麦克风
JP2020136385A (ja) * 2019-02-15 2020-08-31 新日本無線株式会社 圧電素子
CN110545511A (zh) * 2019-08-16 2019-12-06 瑞声声学科技(深圳)有限公司 压电式mems麦克风

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024008132A1 (fr) * 2022-07-06 2024-01-11 华为技术有限公司 Appareil à induction piézoélectrique, son procédé d'utilisation et dispositif intelligent

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