WO2022108234A1 - 세라믹 절단방법 및 장치 - Google Patents
세라믹 절단방법 및 장치 Download PDFInfo
- Publication number
- WO2022108234A1 WO2022108234A1 PCT/KR2021/016399 KR2021016399W WO2022108234A1 WO 2022108234 A1 WO2022108234 A1 WO 2022108234A1 KR 2021016399 W KR2021016399 W KR 2021016399W WO 2022108234 A1 WO2022108234 A1 WO 2022108234A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ceramic
- cutting
- cut
- controlling
- damage
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 198
- 239000000919 ceramic Substances 0.000 title claims abstract description 176
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000008646 thermal stress Effects 0.000 claims abstract description 19
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 17
- 239000002826 coolant Substances 0.000 claims description 13
- 238000009826 distribution Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 9
- 239000011226 reinforced ceramic Substances 0.000 claims 2
- 230000002787 reinforcement Effects 0.000 claims 2
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 7
- 239000005341 toughened glass Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 10
- 239000005345 chemically strengthened glass Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- -1 that is Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000003426 chemical strengthening reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000005400 gorilla glass Substances 0.000 description 1
- 239000005346 heat strengthened glass Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052752 metalloid Inorganic materials 0.000 description 1
- 150000002738 metalloids Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/003—Cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Definitions
- the present invention relates to a ceramic cutting method and apparatus, and more particularly, to a ceramic cutting method and apparatus for cutting ultra-thin glass, chemically strengthened or heat strengthened glass.
- Ceramics go through a sintering process in which metals and non-metals or metalloids combine with each other through heat treatment to form crystals, and then the formed crystals gather to form a three-dimensional network.
- a solid substance that forms a structure is
- a ceramic material (hereinafter referred to as 'ceramic') is cracked with a high-hardness wheel manufactured using a diamond, etc., which has a hardness higher than that of ceramics, and then it is broken or manufactured with a high-hardness abrasive stone and cut by grinding.
- a ceramic is heated by using a laser or a high-power beam, melted and vaporized to create a certain groove, and cut by breaking or completely removing the material.
- tempered glass used as cover grass for electronic devices such as cell phones and tablet PCs is chemically strengthened to be strong against scratches or damage, and its use is expanding.
- UTG Ultra-thin tempered glass
- 'UTG' Ultra Thin Glass
- the cut glass is reinforced one by one and used.
- Patent Document 1 Korean Patent Registration No. 10-1119289 (2012.03.15.)
- Patent Document 2 Japanese Patent Laid-Open No. 2013-112532 (2013.06.10.)
- An object of the present invention is to solve the above problems, and to provide a ceramic cutting method and apparatus capable of cutting ceramics with a surface reinforced to a reinforcing depth of 1 ⁇ m or more or thin ceramics with a thickness of 3 mm or less without cracks or damage.
- Another object of the present invention is to provide a ceramic cutting method and apparatus capable of securing straightness by compensating for errors occurring depending on the cutting position when cutting ceramics.
- the ceramic cutting device includes a beam irradiator for irradiating a beam of a wavelength absorbed by ceramic, a damage generating unit for generating minute damage to the cutting start part on the cutting path outside the ceramic, and A control unit for controlling the output, shape, beam mode, beam irradiation area and cutting speed of the beam irradiated from the beam irradiator and controlling the driving of the beam irradiator, based on the ceramic material and thickness or the reinforced depth of the ceramic
- the cutting speed is adjusted in proportion to the beam output to locally heat the ceramic to below the melting point of the ceramic, and to prevent the ceramic from being cut in any direction. It is characterized in that the ceramic is cut in a desired path by controlling the stress and generating a thermal stress above the maximum heat-resistant strength of the ceramic.
- the ceramic cutting method comprises the steps of (a) irradiating a beam having a wavelength absorbed by the ceramic in the beam irradiation unit, (b) the cutting path outside the ceramic in the damage generating unit Generating fine damage at the start of cutting of the image and (c) controlling the driving of the beam irradiation unit by controlling the output, shape, beam mode, beam irradiation area and cutting speed of the beam irradiated from the beam irradiation unit in the control unit Including, by adjusting the cutting speed in proportion to the beam output with a beam having a beam mode and a beam shape set based on the ceramic material and thickness or the reinforced depth of the ceramic, to locally heat the ceramic to below the melting point of the ceramic, It is characterized in that the ceramic is cut in a desired path by controlling the heat-affected area and thermal stress to prevent cutting in this arbitrary direction, and generating a thermal stress greater than or equal to the maximum heat-resistant strength of the ceramic
- ceramics that is, ceramics with a surface reinforced to a reinforcing depth of 1 ⁇ m or more or thin ceramics with a thickness of 3 mm or less, can be cut without cracks or damage.
- the ceramic is locally heated to below the melting point of the ceramic by controlling the cutting speed in proportion to the beam output with a beam having a beam mode and a beam shape set based on the thickness of the ceramic material and the reinforced depth of the ceramic.
- the effect that the ceramic can be cut in a desired path is obtained by controlling the heat-affected area and thermal stress to prevent the ceramic from being cut in any direction, and generating thermal stress beyond the maximum heat-resistant strength of the ceramic. .
- the effect of reducing the thermal deformation of the ceramic surface by additionally spraying a coolant on the ceramic surface to which the beam is irradiated when cutting the thin plate ceramic, and precisely cutting along a desired path is obtained.
- the cutting position currently cut by the beam irradiated during ceramic cutting is measured in real time, and the difference between the measured cutting position and the cutting line is calculated to compensate for the distortion of the cutting position in real time, thereby straightening the cutting line. The effect of being able to improve sharpness and cutting performance is obtained.
- FIG. 1 is a block diagram of a ceramic cutting device according to a preferred embodiment of the present invention.
- 3 is a view for explaining a process of compensating for distortion of the cutting position
- FIG. 4 is a flowchart illustrating step-by-step a ceramic cutting method according to a preferred embodiment of the present invention
- 5 and 6 are views illustrating reinforcing oil and UTG with reinforced surfaces damaged in the cutting process, respectively;
- FIG. 7 to 9 are views illustrating ceramics cut by the ceramic cutting method according to the first to third embodiments, respectively.
- the present invention irradiates a beam having a preset beam width to the ceramic to be cut, and generates a thermal stress inside the material above the maximum heat resistance strength of the material while heating it to below the melting point of the ceramic, thereby cutting the ceramic in a desired path without cracks or damage. do.
- the present invention heats the ceramic by controlling the output and shape of the beam irradiated to the ceramic, the beam mode, and the cutting speed.
- a ceramic whose surface has been strengthened to a reinforcing depth of 1 ⁇ m or more or a thin plate ceramic having a thickness of 3 mm or less is cut without cracks or damage.
- a tempered glass that has been thermally or chemically strengthened has a stress on its surface. Therefore, the tempered glass has a problem in that it is difficult to cut in a desired direction because it is cut in any direction by a slight mechanical damage or thermal shock such as a laser.
- the thin glass with a thickness of 3 mm or less has a weak impact strength that a thin thickness can have, it is cut in an arbitrary direction even with a slight mechanical damage or thermal shock such as a laser, and there is a problem that it is difficult to cut in a desired direction.
- tempered glass is immediately broken even if a slight groove is made with a mechanical wheel, and even if tempered glass is heated or melted with a laser, it is also damaged immediately.
- the heating temperature for heating the ceramic is low and the internal thermal stress of the ceramic is weak, damage in any direction cannot be prevented. Therefore, if the heating temperature is low, it is impossible to cut the ceramic, and if the heating temperature is too high, the ceramic may be melted or broken in any direction due to thermal shock.
- the internal thermal stress of the ceramic is appropriately adjusted, cutting in any direction can be prevented, but the cutting line can be induced from the cutting start to the area where the laser generates thermal stress. That is, stress can be generated so that it can be cut in a desired cutting path.
- any one of the output of the beam, the beam mode, the beam shape, the beam irradiation area, and the cutting speed is not optimized when cutting the ceramic, the ceramic is melted and thermally damaged or does not react at all.
- the ceramic is locally heated to below the melting point, and at this time, the thermal stress exceeds the maximum heat resistance of the ceramic.
- the ceramic can be cut in the desired path without damage to the material.
- the ceramic is heated by controlling the output and shape of the beam irradiated to the ceramic, the beam mode, the beam irradiation area, and the cutting speed to be optimized, and the ceramic is cut without cooling the heated ceramic or melting and vaporizing the ceramic. can do.
- FIG. 1 is a block diagram of a ceramic cutting device according to a preferred embodiment of the present invention.
- a ceramic cutting device and method for cutting UTG will be described, but the present invention is not necessarily limited thereto. Like UTG, it cuts very thin glass, chemically tempered glass, or heat tempered glass with a thickness of 100 ⁇ m or less. It should be noted that it can be applied to the cutting device and method to be used.
- the ceramic cutting device 10 uses a wavelength absorbed by the UTG to cut the ceramic 11 to be cut, for example, UTG without cracks or damage.
- the beam irradiation unit 20 generates a beam by adjusting the output, shape, beam mode, beam irradiation area, and cutting speed of the beam according to the control signal of the control unit 40 to generate a beam, generated from the beam generator 21 It may include a lens unit 22 for focusing and irradiating the beam toward the UTG, and a driving unit 23 for driving the lens unit 22 to move the beam along a direction to be cut.
- the beam irradiator 21 may irradiate the beam in a polygonal shape, such as a substantially circular shape, an elliptical shape, or a square shape, so that the irradiated beam is symmetrical with respect to the cutting line.
- the beam irradiator 21 may irradiate a beam having an asymmetric shape with respect to the tangent of the cutting line when cutting the curved portion or correcting the distortion of the cutting position, which will be described below.
- the damage generating unit 30 functions to create a fine initial damage to the cutting start portion S that starts the cutting operation on the cutting path W outside the UTG 11 to be cut.
- FIG. 2 is a diagram illustrating a process of cutting UTG.
- each vertex portion of the cutting path W may be formed as a rounded curved surface to correspond to each vertex portion of a display applied to an electronic device.
- the damage generating unit 30 may be provided with a mechanical wheel according to the ceramic material to be cut, or the beam generator 21 of the beam irradiation unit 20 may be used.
- the damage generating unit 30 when the damage generating unit 30 is provided with a mechanical wheel, it may form a fine initial damage, for example, point-shaped cracks or grooves in the cutting start part (S).
- the damage generation unit 30 may form a fine initial damage by heating the cutting start portion S to a temperature below the melting point when the beam generator 21 is used.
- the operation of generating initial damage to the cutting start part S using the damage generating unit 30 can be removed if the damage has already been generated in the outer part of the ceramic 11 to be cut, that is, the UTG. have.
- the control unit 40 controls the cutting speed in proportion to the beam output with a beam having a beam mode and a beam shape set based on the thickness of the ceramic 11 material to be cut or the reinforced depth of the tempered glass, that is, the ceramic 11 material to be cut. (11) can be controlled to be locally heated below the melting point of the ceramic (11). And, the control unit 40 adjusts the heat-affected area and thermal stress to prevent the ceramic 40 from being cut in any direction, and heats it while generating thermal stress above the maximum heat-resistant strength of the ceramic 11 .
- the ceramic 11 may be controlled to be cut along a desired path.
- the controller 40 may control to increase the beam irradiation area to which the beam is irradiated in proportion to the thickness of the UTG or the strengthened depth of the tempered glass.
- the controller 40 may control to heat the material in an area of 0.01 to 10000 times the UTG thickness A.
- control unit 40 may selectively apply and control one or more beam modes among a Gaussian mode using a general Gaussian distribution and a left-right symmetric mode having an output distribution symmetrical with respect to the cutting line.
- control unit 40 may cut the ceramic 11 by controlling the driving of the beam irradiation unit 20 to adjust the cutting speed in proportion to the output of the beam.
- control unit 40 may control the driving of the beam irradiation unit 20 so as to cut while heating below a temperature at which the reinforcing formed in the ceramic is released.
- the ceramic cutting device 10 further includes a measuring unit 50 for measuring the cutting position currently cut by the irradiated beam, and the control unit 40 is a measuring unit (50) to compensate the difference ( ⁇ x, ⁇ y) between the measured cutting position (P) and the cutting line (L) by calculating the difference between the measured cutting position (P) and the preset cutting line (L) in real time can be controlled
- FIG. 3 is a view for explaining a process of compensating for distortion of a cutting position.
- the beam is irradiated by correcting the cutting path by the amount of curvature in the outer direction, or in the outer direction of the cutting line L
- Straightness can be secured by using a beam mode having a relatively weak power distribution and a relatively strong power distribution in the inner direction.
- the output of the outer part of the beam is relatively weak, and the internal output of the curve is a beam mode having a relatively strong output distribution.
- the present invention measures the cutting position currently cut by the beam irradiated during ceramic cutting in real time, and compensates for the distortion of the cutting position in real time by calculating the difference between the measured cutting position and a preset cutting line. It can improve straightness and cutting performance.
- the beam irradiated from the beam irradiator 20 is It may further include a coolant spraying unit 60 that sprays a coolant to the surface of the ceramic 11 that meets.
- the coolant spraying unit 60 sprays the coolant on the surface of the ceramic 11 to which the beam is irradiated, thereby reducing thermal deformation of the surface of the ceramic 11 and making it possible to cut.
- a coolant is additionally sprayed on the surface of the ceramic 11 to which the beam is irradiated to reduce thermal deformation of the ceramic surface, and it can be precisely cut along a desired path.
- FIG. 4 is a flowchart illustrating a ceramic cutting method according to a preferred embodiment of the present invention step by step.
- step S10 of FIG. 4 the control unit 40 controls the output, shape, beam mode, Set the beam irradiation area.
- step S12 the control unit 40 controls the driving of the damage generating unit so as to create a fine initial damage to the cutting start portion (S) that starts the cutting operation on the cutting path (W) outside the UTG (11) to be cut. .
- control unit 40 is in a state in which damage is generated in the outer part of the ceramic 11 to be cut, that is, the UTG, an operation of generating initial damage to the cutting start part S using the damage generating unit 30 can be omitted.
- step S14 the control unit 40 controls the driving of the beam irradiation unit 20 to irradiate the beam according to the set output, shape, and beam mode of the beam.
- the UTG is irradiated with the beam generated by the beam irradiator 20 , and the driver 23 of the beam irradiator 20 drives the lens unit 22 to move the beam along the cutting line L .
- control unit 40 controls the driving of the beam irradiation unit 20 to adjust the cutting speed in proportion to the output of the beam irradiated to the UTG (S16).
- the coolant spraying unit 60 is driven according to a control signal from the controller to additionally spray the coolant on the surface of the ceramic 11 to which the beam is irradiated, thereby thermally deforming the surface of the UTG 11 . ) and make it possible to cut precisely in the desired path.
- control unit 40 may control the driving of the beam irradiation unit 20 so as to cut while heating below a temperature at which the reinforcing formed in the ceramic is released.
- the measuring unit 50 measures the current cutting position (S18).
- the camera module provided in the measurement unit 50 may photograph the current cutting position P, and the control unit 40 may analyze the captured image to calculate X and Y coordinates of the current cutting position. .
- control unit 40 compares the calculated current cutting position (P) with the cutting line (L) to check whether the difference ( ⁇ x, ⁇ y) between the cutting position (P) and the cutting line exceeds a preset limit range. do.
- step S18 if the difference ( ⁇ x, ⁇ y) between the cutting position (P) and the cutting line (L) exceeds the above-described limit range due to the curved surface cutting, the control unit 70 controls the generated difference ( ⁇ x, Controlled to compensate for the distortion of the cutting position by ⁇ y) (S22).
- the control unit 40 corrects the cutting path by the amount of bending in the outer direction to irradiate the beam, or the outer edge of the cutting line (L). It can be controlled to secure straightness by using a beam mode having a relatively weak power distribution in the direction and a relatively strong power distribution in the inner direction.
- control unit 40 decreases the output of the outer portion of the beam in a direction deviating from the cutting line in proportion to the amount deviating from the cutting line, that is, relatively weak the output of the outer portion of the beam, and increases the internal output of the curve with a relatively strong output distribution.
- step S24 the control unit 40 checks whether the cutting operation is completed, and repeatedly performs steps S12 to S24 until the cutting operation is completed.
- step S24 if the inspection result of step S24 is in a state where the cutting operation is completed, the control unit 40 stops and ends the driving of each device provided in the ceramic cutting device 10 .
- the present invention is the output, shape, beam mode, and beam irradiation area of the beam irradiated to ceramic, that is, tempered glass whose surface is strengthened to a reinforcing depth of 1 ⁇ m or more or thin glass with a thickness of 3 mm or less. And it can be cut without cracks or damage by irradiating below the melting point by optimizing the cutting speed.
- FIGS. 5 and 6 are views illustrating tempered glass and UTG, each of which has a damaged surface in the cutting process.
- 7 to 9 are views illustrating ceramics cut by the ceramic cutting method according to the first to third embodiments, respectively.
- the surface-strengthened tempered glass and UTG are easily broken if the beam output and shape, beam mode, beam irradiation area and cutting speed are not optimized during the cutting process by irradiating the beam.
- borosilicate glass having a thickness of about 0.05 mm was cut.
- the control unit 40 irradiates a laser beam having an infrared (infrared red) wavelength of about 750 nm to 1000 ⁇ m to the material to be cut at an output of about 400 W, and is not a general Gaussian beam, but a beam having a higher output than the central part. control to use the mod.
- the cutting speed is about 400 mm/s
- the beam shape is a shape symmetrical left and right based on the cutting line
- the irradiation area of the beam may be set to about 3 mm 2 .
- the control unit 40 irradiates a laser beam of an infrared wavelength to the material to be cut with an output of about 700 W, and controls to use a beam mode in which the output of the outer part is higher than that of the central part rather than a general Gaussian beam.
- the cutting speed is about 500 mm/s
- the beam shape is symmetrical to the left and right based on the cutting line
- the irradiation area of the beam may be set to about 10 mm 2 .
- the chemical strengthening depth (DOL, Depth of Layer) of the chemically strengthened glass is about 50 ⁇ m.
- the control unit 40 irradiates a laser beam having an ultraviolet (ultraviolet) wavelength of about 1 nm to 380 nm to the material to be cut at an output of about 50 W, and not a general Gaussian beam, but a beam mode in which the output of the outer part is higher than that of the central part.
- the cutting speed is about 200 mm/s
- the beam shape is symmetrical to the left and right based on the cutting line
- the irradiation area of the beam may be set to about 10 mm 2 .
- the present invention optimizes the output, shape, beam mode, beam irradiation area and cutting speed of the beam irradiated to ceramic, that is, tempered glass whose surface is strengthened to a tempered depth of 1 ⁇ m or more or thin glass with a thickness of 3 mm or less to be below the melting point. It is applied to ceramic cutting method and device technology that cuts without cracks or damage by irradiating with ceramic, that is, tempered glass whose surface is strengthened to a tempered depth of 1 ⁇ m or more or thin glass with a thickness of 3 mm or less to be below the melting point. It is applied to ceramic cutting method and device technology that cuts without cracks or damage by irradiating with
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
Claims (10)
- 표면이 1㎛ 이상의 강화 깊이로 강화된 세라믹이나 두께 3㎜ 이하의 박판 세라믹을 크랙이나 손상없이 절단하는 세라믹 절단장치에서,세라믹에 흡수되는 파장의 빔을 조사하는 빔 조사부,세라믹 외곽의 절단 경로 상의 절단 시작부에 미세한 손상을 생성하는 손상생성부 및상기 빔 조사부에서 조사되는 빔의 출력, 형상, 빔 모드, 빔 조사면적 및 절단속도를 조절하고 상기 빔 조사부의 구동을 제어하는 제어부를 포함하며,상기 빔은 절단선에 대해 대칭인 형상으로 형성되거나, 곡선부 절단시 또는 절단 위치의 왜곡을 보정하는 경우에는 절단선의 접선에 대해 비대칭인 형상으로 형성되고,상기 제어부는 빔의 출력에 비례해서 상기 절단속도를 조절하며,세라믹의 두께에 비례해서 빔의 조사면적을 조절하도록 제어해서,세라믹의 재료와 두께 또는 세라믹의 강화된 깊이에 기초해서 설정된 빔 모드와 빔 형상을 가진 빔으로 빔 출력에 비례해서 절단 속도를 조절하여 세라믹을 국부적으로 세라믹의 용융점 이하로 가열하고, 세라믹이 임의의 방향으로 절단되는 것을 방지하도록 열 영향을 받는 영역과 열응력을 조절하고, 세라믹의 최대 내열 강도 이상으로 열 응력을 생성시켜 세라믹을 원하는 경로대로 절단하는 것을 특징으로 하는 세라믹 절단장치.
- 제1항에 있어서,상기 손상생성부는 절단하고자 하는 세라믹의 외곽 부분에 손상이 이미 생성된 상태이면, 제거 가능한 것을 특징으로 하는 세라믹 절단장치.
- 제1항에 있어서,상기 제어부는 강화된 세라믹을 절단하는 경우, 상기 세라믹에 형성된 강화가 풀리는 온도 이하로 가열하면서 절단하도록 상기 빔 조사부의 구동을 제어하는 것을 특징으로 하는 세라믹 절단장치.
- 제1항에 있어서,두께 3mm 이하의 박판 세라믹을 절단할 경우에 상기 빔 조사부에서 조사되는 빔이 만나는 세라믹 표면에 추가로 냉각제를 분사하여 세라믹 표면의 열변형을 축소해서 절단 가능하도록, 냉각제를 분사하는 냉각제 분사부를 더 포함하는 것을 특징으로 하는 세라믹 절단장치.
- 제1항에 있어서,조사된 빔에 의해 현재 절단되는 절단 위치를 측정하는 측정부를 더 포함하고,상기 제어부는 상기 측정부에서 측정된 절단 위치가 세라믹의 절단선을 벗어나서 절단되는 경우, 절단선에서 벗어난 양에 비례해서 절단선에서 벗어난 방향으로 상대적으로 약한 출력 분포를 가지고, 반대 방향은 상대적으로 강한 출력 분포를 가지는 빔모드를 활용하거나, 빔의 조사위치를 보정해서 직진도를 확보하도록 제어하는 것을 특징으로 하는 세라믹 절단장치.
- 표면이 1㎛ 이상의 강화 깊이로 강화된 세라믹이나 두께 3㎜ 이하의 박판 세라믹을 크랙이나 손상없이 절단하는 세라믹 절단방법에서,(a) 빔 조사부에서 세라믹에 흡수되는 파장의 빔을 조사하는 단계,(b) 손상생성부에서 세라믹 외곽의 절단 경로 상의 절단 시작부에 미세한 손상을 생성하는 단계 및(c) 제어부에서 상기 빔 조사부에서 조사되는 빔의 출력, 형상, 빔 모드, 빔 조사면적 및 절단속도를 조절해서 상기 빔 조사부의 구동을 제어하는 단계를 포함하며,상기 빔은 절단선에 대해 대칭인 형상으로 형성되거나, 곡선부 절단시 또는 절단 위치의 왜곡을 보정하는 경우에는 절단선의 접선에 대해 비대칭인 형상으로 형성되고,상기 제어부는 빔의 출력에 비례해서 상기 절단속도를 조절하며,세라믹의 두께에 비례해서 빔의 조사면적을 조절하도록 제어해서세라믹의 재료와 두께 또는 세라믹의 강화된 깊이에 기초해서 설정된 빔 모드와 빔 형상을 가진 빔으로 빔 출력에 비례해서 절단 속도를 조절하여 세라믹을 국부적으로 세라믹의 용융점 이하로 가열하고, 세라믹이 임의의 방향으로 절단되는 것을 방지하도록 열 영향을 받는 영역과 열응력을 조절하고, 세라믹의 최대 내열 강도 이상으로 열 응력을 생성시켜 세라믹을 원하는 경로대로 절단하는 것을 특징으로 하는 세라믹 절단방법.
- 제6항에 있어서,상기 (b)단계는 절단하고자 하는 세라믹의 외곽 부분에 손상이 이미 생성된 상태이면 생략 가능한 것을 특징으로 하는 세라믹 절단방법.
- 제6항에 있어서,상기 (c)단계에서 제어부는 강화된 세라믹을 절단하는 경우, 상기 세라믹에 형성된 강화가 풀리는 온도 이하로 가열하면서 절단하도록 상기 빔 조사부의 구동을 제어하는 것을 특징으로 하는 세라믹 절단방법.
- 제6항에 있어서,(d) 두께 3mm 이하의 박판 세라믹을 절단할 경우, 냉각제 분사부를 이용해서 상기 빔 조사부에서 조사되는 빔이 만나는 세라믹 표면에 추가로 냉각제를 분사하여 세라믹 표면의 열변형을 축소해서 절단 가능하도록, 냉각제를 분사하는 단계를 더 포함하는 것을 특징으로 하는 세라믹 절단방법.
- 제6항에 있어서,(e) 측정부에서 세라믹에 조사된 빔에 의해 현재 절단되는 절단 위치를 측정하는 단계 및(f) 상기 제어부에서 측정된 절단 위치가 세라믹의 절단선을 벗어나서 절단되는 경우, 절단선에서 벗어난 양에 비례해서 절단선에서 벗어난 방향으로 상대적으로 약한 출력 분포를 가지고, 반대 방향은 상대적으로 강한 출력 분포를 가지는 빔 모드를 활용하거나, 빔의 조사위치를 보정해서 직진도를 확보하도록 제어하는 단계를 더 포함하는 것을 특징으로 하는 세라믹 절단방법.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21895004.6A EP4249443A1 (en) | 2020-11-17 | 2021-11-11 | Method and apparatus for cutting ceramic |
CN202180076858.4A CN116568644A (zh) | 2020-11-17 | 2021-11-11 | 陶瓷切割方法及装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020200153921A KR102241518B1 (ko) | 2020-11-17 | 2020-11-17 | 세라믹 절단방법 및 장치 |
KR10-2020-0153921 | 2020-11-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022108234A1 true WO2022108234A1 (ko) | 2022-05-27 |
Family
ID=75718691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2021/016399 WO2022108234A1 (ko) | 2020-11-17 | 2021-11-11 | 세라믹 절단방법 및 장치 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP4249443A1 (ko) |
KR (1) | KR102241518B1 (ko) |
CN (1) | CN116568644A (ko) |
WO (1) | WO2022108234A1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102241518B1 (ko) * | 2020-11-17 | 2021-04-19 | 주식회사 아이티아이 | 세라믹 절단방법 및 장치 |
KR102560763B1 (ko) * | 2023-03-16 | 2023-07-27 | 이정준 | 레이저를 이용한 절단 장치 및 방법 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101119289B1 (ko) | 2003-07-18 | 2012-03-15 | 하마마츠 포토닉스 가부시키가이샤 | 절단방법 |
JP2013112532A (ja) | 2011-11-25 | 2013-06-10 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のスクライブ方法 |
KR20150111821A (ko) * | 2014-03-26 | 2015-10-06 | 동우 화인켐 주식회사 | 강화 유리의 절단 및 면취 방법 |
KR20160059837A (ko) * | 2014-11-19 | 2016-05-27 | 주식회사 에스에프에이 | 글래스 절단 장치 및 그 방법 |
KR20170043587A (ko) * | 2014-08-20 | 2017-04-21 | 코닝 인코포레이티드 | 얇은 가요성 유리의 절단시 높은 에지 강도를 산출하기 위한 장치 및 방법 |
JP2018506489A (ja) * | 2014-11-20 | 2018-03-08 | コーニング インコーポレイテッド | フレキシブルガラス基板のフィードバック制御されたレーザ切断 |
KR20190083459A (ko) * | 2018-01-04 | 2019-07-12 | 주식회사 넵시스 | 레이저 스팟 빔을 이용한 절단 장치 |
KR102241518B1 (ko) * | 2020-11-17 | 2021-04-19 | 주식회사 아이티아이 | 세라믹 절단방법 및 장치 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104125934A (zh) * | 2012-02-28 | 2014-10-29 | 伊雷克托科学工业股份有限公司 | 用于分离强化玻璃的方法及装置及由该强化玻璃生产的物品 |
CN104428264A (zh) * | 2012-07-09 | 2015-03-18 | 旭硝子株式会社 | 强化玻璃板的切割方法 |
-
2020
- 2020-11-17 KR KR1020200153921A patent/KR102241518B1/ko active IP Right Grant
-
2021
- 2021-11-11 EP EP21895004.6A patent/EP4249443A1/en active Pending
- 2021-11-11 WO PCT/KR2021/016399 patent/WO2022108234A1/ko active Application Filing
- 2021-11-11 CN CN202180076858.4A patent/CN116568644A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101119289B1 (ko) | 2003-07-18 | 2012-03-15 | 하마마츠 포토닉스 가부시키가이샤 | 절단방법 |
JP2013112532A (ja) | 2011-11-25 | 2013-06-10 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板のスクライブ方法 |
KR20150111821A (ko) * | 2014-03-26 | 2015-10-06 | 동우 화인켐 주식회사 | 강화 유리의 절단 및 면취 방법 |
KR20170043587A (ko) * | 2014-08-20 | 2017-04-21 | 코닝 인코포레이티드 | 얇은 가요성 유리의 절단시 높은 에지 강도를 산출하기 위한 장치 및 방법 |
KR20160059837A (ko) * | 2014-11-19 | 2016-05-27 | 주식회사 에스에프에이 | 글래스 절단 장치 및 그 방법 |
JP2018506489A (ja) * | 2014-11-20 | 2018-03-08 | コーニング インコーポレイテッド | フレキシブルガラス基板のフィードバック制御されたレーザ切断 |
KR20190083459A (ko) * | 2018-01-04 | 2019-07-12 | 주식회사 넵시스 | 레이저 스팟 빔을 이용한 절단 장치 |
KR102241518B1 (ko) * | 2020-11-17 | 2021-04-19 | 주식회사 아이티아이 | 세라믹 절단방법 및 장치 |
Also Published As
Publication number | Publication date |
---|---|
CN116568644A (zh) | 2023-08-08 |
EP4249443A1 (en) | 2023-09-27 |
KR102241518B1 (ko) | 2021-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2022108234A1 (ko) | 세라믹 절단방법 및 장치 | |
WO2017188639A1 (ko) | 레이저 핀 빔을 이용한 취성 소재 가공 방법 및 장치와 이를 위한 광학계 | |
TWI426057B (zh) | The method of stripping angle of brittle material substrate | |
KR100849696B1 (ko) | 취성재료의 스크라이브 방법 및 스크라이브 장치 | |
JP5609870B2 (ja) | 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス | |
JP5864988B2 (ja) | 強化ガラス板切断方法 | |
US6252197B1 (en) | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator | |
KR100604765B1 (ko) | 레이저 스코링의 중간 균열 깊이의 제어 방법 | |
US6420678B1 (en) | Method for separating non-metallic substrates | |
US6259058B1 (en) | Apparatus for separating non-metallic substrates | |
EP1428640A1 (en) | Method for scribing substrate of brittle material and scriber | |
WO2007094160A1 (ja) | ガラス基板の面取り方法および装置 | |
TWI414383B (zh) | Angle processing device | |
TW200936290A (en) | Method for chamfering/machining brittle material substrate and chamfering/machining apparatus | |
WO2014017878A2 (ko) | 미세구조 홈을 갖는 스크라이빙 휠 | |
KR20090023678A (ko) | 절단 장치 | |
JPH09225665A (ja) | ガラス基板面取り方法及びその方法を用いた液晶パネル用ガラス基板及び液晶パネル | |
KR100647454B1 (ko) | 취성재료 기판의 스크라이브 장치 및 스크라이브 방법 | |
WO2020111411A1 (ko) | 펨토초 레이저를 이용한 초정밀 블레이드 엣지 가공방법 | |
JP6050002B2 (ja) | レーザ加工方法 | |
KR100551527B1 (ko) | 취성재료기판의 스크라이브 방법 및 스크라이브 장치 | |
WO2024019452A1 (ko) | 레이저를 이용한 미세 가공 장치 및 방법 | |
WO2020122570A1 (ko) | 취성재료로 구성된 구조물의 절단 방법 및 장치 | |
JP3751122B2 (ja) | 割断加工方法 | |
WO2016208790A1 (ko) | 고속 표면 가공 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21895004 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202347034021 Country of ref document: IN Ref document number: 202180076858.4 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2021895004 Country of ref document: EP Effective date: 20230619 |