WO2022108133A1 - Dispositif électronique comprenant une structure de dissipation de chaleur - Google Patents
Dispositif électronique comprenant une structure de dissipation de chaleur Download PDFInfo
- Publication number
- WO2022108133A1 WO2022108133A1 PCT/KR2021/014714 KR2021014714W WO2022108133A1 WO 2022108133 A1 WO2022108133 A1 WO 2022108133A1 KR 2021014714 W KR2021014714 W KR 2021014714W WO 2022108133 A1 WO2022108133 A1 WO 2022108133A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- housing
- battery
- disposed
- electronic device
- heat dissipation
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 claims abstract description 49
- 239000012790 adhesive layer Substances 0.000 claims abstract description 30
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims description 68
- 238000000034 method Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 2
- 239000000463 material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
- H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
- H04M1/0269—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel mounted in a fixed curved configuration, e.g. display curved around the edges of the telephone housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- Various embodiments of the present disclosure relate to an electronic device including a heat dissipation structure.
- a foldable electronic device having a flexible display provides a relatively larger screen than a bar-type electronic device, but when folded, the size is reduced and thus portability Since this can be improved, it is in the spotlight as an electronic device for satisfying consumer preferences.
- the foldable electronic device includes a flexible display and a plurality of housings, the plurality of housings are connected by a hinge assembly, and the housing and the flexible display may be rotated within a specified range according to a user's manipulation. Through a process of rotating the plurality of housings and the flexible display, the electronic device may be switched from a folded state to an unfolded state or from an unfolded state to a folded state.
- the attachment area of the heat dissipation diffusion sheet may not be sufficient due to the mounting area of the hinge assembly.
- the attachment area of the heat dissipation diffusion sheet is reduced, and thus the performance of the foldable electronic device may deteriorate.
- an electronic device includes: a housing; a battery disposed in the housing and including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; an adhesive layer for attaching the battery to the housing; a circuit board including at least one heating element and disposed in the housing; and a first part disposed in the housing, the first part overlapping the battery, and a second part disposed in contact with the heating element and not overlapping the battery, wherein the heat generated by the heating element may include a heat dissipation diffusion sheet for transferring the to the battery or the housing.
- an electronic device includes: a housing; a battery disposed in the housing and including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a battery mounting rib including at least one opening and formed in the housing to support the battery; an adhesive layer for attaching the battery to the housing; a circuit board including at least one heating element and disposed in the housing; and a first part disposed in the housing, the first part overlapping the battery, and a second part disposed in contact with the heating element and not overlapping the battery, wherein the heat generated by the heating element may include a heat dissipation diffusion sheet for transferring the to the battery or the housing.
- the heat dissipation performance of the heating element included in the electronic device may be improved.
- the temperature of the front and rear surfaces of the housing of the foldable electronic device may decrease due to the heat dissipation structure.
- FIG. 1A to 1C are views illustrating a foldable electronic device in a folded state according to an exemplary embodiment.
- FIG. 1A is a perspective view
- FIG. 1B is a front view
- FIG. 1C is a rear view.
- FIG. 2A to 2C are views illustrating a foldable electronic device in a 180 degree unfolded state according to an exemplary embodiment.
- FIG. 2A is a perspective view
- FIG. 2B is a front view
- FIG. 2C is a rear view.
- FIG. 3 is an exploded view of an electronic device according to an exemplary embodiment and a diagram illustrating an unfolded state.
- FIG. 4 is an exploded perspective view illustrating an internal structure of an electronic device according to an exemplary embodiment.
- 5A is a plan view illustrating a housing in which a heat dissipation structure is disposed according to various embodiments of the present disclosure
- 5B is a perspective view illustrating a state in which a heat dissipation diffusion sheet is attached to a housing according to various embodiments of the present disclosure
- 5C is a cross-sectional view schematically illustrating a heat dissipation structure of a heating element according to various embodiments of the present disclosure
- 5D is a longitudinal cross-sectional view schematically illustrating a heat dissipation structure of a heating element according to various embodiments of the present disclosure
- FIG. 6 is a perspective view illustrating a housing before attaching a heat dissipation diffusion sheet according to various embodiments of the present disclosure
- FIG. 7 is a perspective view illustrating a state in which a battery mounting rib is fastened according to various embodiments of the present disclosure
- FIG. 8 is a perspective view illustrating a housing in which a battery is mounted according to various embodiments of the present disclosure
- FIG. 9 is a plan view illustrating a housing in which a heat dissipation structure is disposed according to various other exemplary embodiments of the present invention.
- FIG. 10 is a longitudinal cross-sectional view schematically illustrating a heat dissipation structure of a heating element according to various other exemplary embodiments of the present invention.
- the electronic device may include, for example, a smartphone, a tablet personal computer (PC), a mobile phone, a video phone, and an e-book reader (e-). book reader), desktop PC (desktop personal computer), laptop PC (laptop personal computer), netbook computer (workstation), server, PDA (personal digital assistant), PMP (portable multimedia player), MP3 Players, mobile medical devices, cameras, or wearable devices (e.g. smart glasses, head-mounted-device (HMD)), electronic garments, electronic bracelets, electronic necklaces, electronic apps accessory, electronic tattoo, smart mirror, or smart watch).
- e-book reader e-book reader
- book reader desktop PC (desktop personal computer), laptop PC (laptop personal computer), netbook computer (workstation), server, PDA (personal digital assistant), PMP (portable multimedia player), MP3 Players
- mobile medical devices cameras, or wearable devices (e.g. smart glasses, head-mounted-device (HMD)), electronic garments, electronic bracelets, electronic necklaces, electronic apps accessory, electronic tattoo,
- FIG. 1A to 1C are views illustrating a foldable electronic device in a folded state according to an exemplary embodiment.
- FIG. 1A is a perspective view
- FIG. 1B is a front view
- FIG. 1C is a rear view.
- 2A to 2C are views illustrating a foldable electronic device in a 180 degree unfolded state according to an exemplary embodiment.
- FIG. 2A is a perspective view
- FIG. 2B is a front view
- FIG. 2C is a rear view.
- an electronic device 101 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment includes a folder including a first housing 211 and a second housing 212 . It may include a flexible housing 210 (or “housing”), a flexible display 220 , a hinge assembly 300 , and a cover 230 (or “back cover”). According to an embodiment, the cover 230 may include a first cover 2301 included in the first housing 211 and a second cover 2302 included in the second housing 212 .
- the first housing 211 and the second housing 212 form a space in which electronic components (eg, a printed circuit board, a battery, a processor, etc.) of the electronic device 101 can be disposed, , may form a side surface of the electronic device 101 .
- various types of components for performing various functions of the electronic device 101 may be disposed inside the first housing 211 and the second housing 212 .
- electronic components such as a front camera, a receiver, and a sensor (eg, a proximity sensor) may be disposed inside the first housing 211 and the second housing 212 .
- the above-described electronic components may be exposed on the front surface of the electronic device 101 through at least one opening 220d or a recess provided on the flexible display 220 . .
- the first housing 211 and the second housing 212 may be disposed side by side when the electronic device 101 is in an unfolded state.
- the first housing 211 rotates (or rotates) with respect to the second housing 212 , so that one surface of the first housing 211 is rotated. and one surface of the second housing 212 may be disposed to face each other.
- the first housing 211 and the second housing 212 may form a recess for accommodating the flexible display 220, and the flexible display 220 is seated in the recess. It may be supported by the first housing 211 and the second housing 212 .
- the flexible display 220 includes a first support plate ( FIG. 3 221 ) and/or a second support positioned between the flexible display 220 , the first housing 211 , and the second housing 212 . It may be supported by a plate (FIG. 3 222), and a detailed description thereof will be described later.
- the first housing 211 and the second housing 212 may be formed of a metal material and/or a non-metal material having a specified rigidity to support the flexible display 220 .
- the flexible display 220 is disposed on the first housing 211 and the second housing 212 , and when the electronic device 101 is in an unfolded state, the front surface of the electronic device 101 (eg, : plane in the +y direction of FIG. 2A) can be formed. That is, the flexible display 220 may be disposed to extend from one area of the first housing 211 to at least one area of the second housing 212 across the hinge assembly 300 . According to an embodiment, the flexible display 220 is seated in a recess formed by the first housing 211 and the second housing 212 and disposed on the first housing 211 and the second housing 212 . can be
- the flexible display 220 includes a first area 220a corresponding to at least one area of the first housing 211 , a second area 220b corresponding to at least one area of the second housing 212 , It may include a folding area 220c positioned between the first area 220a and the second area 220b and having a flexible characteristic.
- the present invention is not limited to the above-described embodiment, and according to an embodiment, the first region 220a, the second region 220b, and the folding region 220c of the flexible display 220 may all be formed to have flexible characteristics.
- the first area 220a, the folding area 220c, and the second area 220b face the same direction (eg, the +y direction of FIG.
- the folding area 220c may be bent so that the first area 220a and the second area 220b may be disposed to face each other.
- At least one area (eg, the first area 220a and the second area 220b ) of the flexible display 220 includes one surface of the first housing 211 and one surface of the second housing 212 .
- the flexible display 220 includes the first housing 211 through the support plates 221 and 222 positioned between the flexible display 220 and the first housing 211 and the second housing 212 . It may be attached to one surface of the , and one surface of the second housing 212 .
- the support plates 221 and 222 are attached to at least one area of the first housing 211 to support the first area 220a of the flexible display 220 and the first support plate 221 and the second 2 It may include a second support plate 222 attached to at least one area of the housing 212 to support the second area 220b of the flexible display 220 .
- the first support plate 221 may be attached to at least a portion of the first area 220a of the flexible display 220 to support the flexible display 220 .
- the second support plate 222 may be attached to at least a portion of the second region 220b of the flexible display 220 to support the flexible display 220 .
- the first support plate 221 and the second support plate 222 may be formed of a material having rigidity to support the flexible display 220 .
- the hinge assembly 300 connects the first housing 211 and the second housing 212 , and moves the second housing 212 with respect to the first housing 211 within a specified rotation range.
- the first housing 211 may be rotated within a specified rotation range with respect to the second housing 212 .
- a recess 211c is formed in a region where the first housing 211 and the second housing 212 are connected, so that the hinge assembly 300 is connected to the first housing 211 and the second housing. 212 may be disposed between.
- the above-described recess 211c may be formed in a groove shape having a constant curvature as an example, but is not limited thereto.
- the hinge housing 300c may be disposed between the first and second housings 211 and 212 , and the hinge assembly 300 may be assembled to the hinge housing 300c.
- the hinge housing 300c may be viewed from the outside of the electronic device 101 or covered by the foldable housing 210 depending on the state of the electronic device 101 .
- the hinge housing 300c when the electronic device 101 is in an unfolded state, the hinge housing 300c may be covered by the foldable housing 210 so that it cannot be seen from the outside of the electronic device 101 .
- the hinge housing 300c rotates the first housing 211 and the second housing 212 to the electronic device ( 101) can be seen outside.
- a detailed description of the components of the hinge assembly 300 will be described later.
- the cover 230 may be positioned at lower ends (eg, -y direction in FIG. 2A ) of the first housing 211 and the second housing 212 to form the rear surface of the electronic device 101 .
- the cover 230 may include a first cover 2301 coupled to the first housing 211 , and a second cover 2302 coupled to the second housing 212 .
- the first cover and the first housing 211 may be integrally formed, and the second cover and the second housing 212 may also be integrally formed.
- FIG. 3 is an exploded view of an electronic device according to an exemplary embodiment and a diagram illustrating an unfolded state.
- 4 is an exploded perspective view illustrating an internal structure of an electronic device according to an exemplary embodiment.
- a foldable electronic device (eg, the electronic device 101 illustrated in FIG. 2A ) according to an embodiment includes a flexible display 220 and first and second housings (eg, FIG. 1A ). It may include the first and second housings 211 and 212), the hinge assembly 300, at least one or more batteries B1 and B2, and at least one or more printed circuit boards 224 (pcb).
- the foldable housing 210 may include a first housing 211 and a second housing 212 .
- the first and second housings 211 and 212 may be physically and rotatably connected to each other by the hinge assembly 300 .
- the first housing 211 includes a first side member 211a and a first cover 2301 coupled to the first side member 211a
- the second housing 212 includes a second side member ( 212a) and a second cover 2302 coupled to the second side member 212a may be included.
- the at least one battery may include a first battery B1 disposed in the first housing 211 and a second battery B2 disposed in the second housing 212 .
- the capacity of the second battery B2 may be greater than the capacity of the first battery B1 and may be heavier.
- At least one or more printed circuit boards include a main printed circuit board (pcb), at least one or more first electronic components disposed in the first housing 211 , and at least one disposed in the second housing 212 . It may include an auxiliary circuit board (not shown) electrically connecting one or more second electronic components.
- the auxiliary printed circuit board may be a flexible printed circuit board (FPCB) passing through the hinge housing 300c.
- the hinge assembly 300 may include hinge hinge structures 300a and 300b.
- the hinge structures 300a and 300b may be disposed on the hinge housing 300c.
- the first and second hinge plates 300d and 300e may be respectively disposed on the first and second housings 211 and 212 .
- the cap (c) may be coupled to the support portion of the hinge structure.
- the hinge structures 300a and 300b provide rotation axes of the first and second housings 211 and 212 and maintain the state of the electronic device at a specific angle, for example, 0 degree, 45 degree, 90 degree or 180 degree. can provide power.
- 5A is a plan view illustrating a housing in which a heat dissipation structure is disposed according to various embodiments of the present disclosure
- 5B is a perspective view illustrating a state in which a heat dissipation diffusion sheet is attached to a housing according to various embodiments of the present disclosure
- 5C is a cross-sectional view schematically illustrating a heat dissipation structure of a heating element according to various embodiments of the present disclosure
- 5D is a longitudinal cross-sectional view schematically illustrating a heat dissipation structure of a heating element according to various embodiments of the present disclosure
- the foldable electronic device 101 may include a heat dissipation structure for transferring heat generated from a heating element, for example, an AP (AP) to a battery or a housing 211 .
- a heat dissipation structure for transferring heat generated from a heating element, for example, an AP (AP) to a battery or a housing 211 .
- the heat dissipation structure is a structure in which the attachment area of the heat dissipation diffusion sheet 41 attached to the housing 211 is enlarged, and may be related to the battery B2 mounting structure.
- the auxiliary battery B2 may be disposed in the first housing 211
- the main battery B1 may be disposed in the second housing 212 .
- a heat dissipation structure applied to the first housing (hereinafter referred to as a housing) will be described as an example.
- the auxiliary battery B2 will be referred to as a battery.
- the foldable electronic device 101 may include a housing 211 , at least one heating element 43 , a battery B2 , an adhesive layer 42 , and a heat dissipation diffusion sheet 41 . have.
- the battery B2 may be seated in the housing 211 .
- the battery B2 when viewed from the top of the housing 211 , the battery B2 has a rectangular shape and may include a pair of long sides 401 and a pair of short sides 402 .
- the battery B2 may be connected to the housing 211 by the heat dissipation diffusion sheet 41 .
- heat transferred from the heating element 45 may be transferred to the relatively low-temperature battery B2 or the housing 211 through the heat dissipation diffusion sheet 41 .
- the heating element 45 may include any one or two or more of an application processor (AP), a WiFi module, a charger IC, or a power amplifier.
- AP application processor
- the battery B2 may be seated on the heat dissipation diffusion sheet 41 attached to the housing 211 by the battery mounting rib 43 fastened to the housing 211 .
- the heat dissipation diffusion sheet 41 may be disposed in contact with the housing 211 .
- the heat dissipation diffusion sheet 41 may be attached to the housing 211 using an adhesive material.
- the heat dissipation diffusion sheet 41 may be divided into a first portion 410 and a second portion 412 depending on whether a portion overlaps with the battery B2 .
- the heat dissipation diffusion sheet 41 may include a first portion 410 disposed to overlap the battery B2 and a second portion 412 not overlapped with the battery B2 .
- the first portion 410 may be disposed between the first and second adhesive layers 420 and 422 .
- the heat dissipation diffusion sheet 41 may be made of graphite.
- the battery B2 has a first surface 40a facing a first direction and a second surface 40b facing a second direction opposite to the first direction. ) may be included.
- the second surface 40b of the battery B2 may be a surface attached to the first portion 410 of the heat dissipation diffusion sheet 41, and may be a surface attached to the first and second adhesive layers 420 and 422. have.
- the adhesive layer 42 may include first and second adhesive layers 420 and 422 .
- the adhesive layer 42 includes a first adhesive layer 420 attached to one end of the battery 403 and a second adhesive layer spaced apart from the first adhesive layer 420 and attached to the other end of the battery 404 . (422).
- each of the first and second adhesive layers 420 and 422 may have a rectangular shape.
- the first and second adhesive layers 420 and 422 may be double-sided tapes.
- the first part 410 may be disposed to be surrounded by the housing 211 , the adhesive layer 42 , and the battery B2 .
- the central portion 405 between the battery one end portion 403 and the other end portion 404 , the first portion 410 and the housing 211 may be disposed to overlap each other.
- the heat dissipation diffusion sheet 41 may be located in approximately the same layer as the first and second adhesive layers 420 and 422 .
- the first portion 410 may be attached to all of the second surface 40b of the central portion 405 of the battery.
- the generated heat is transferred to the first portion 410 of the heat dissipation diffusion sheet 41, and the heat to be transferred is relatively As a result, it may have a heat transfer path that is transferred to the low-temperature battery B2 and the housing 211 .
- the first portion of the heat dissipation diffusion sheet 41 may be in close contact with one surface of the heating element 45
- the second portion 412 may be disposed in close contact with the battery B2 and the housing 211 .
- the above-listed adhesion state may be a structure maintained.
- Reference numeral 46 may be a flexible circuit board (FPCB).
- the temperature of the heating element 45 when the foldable electronic device is in operation, the temperature of the heating element 45 is the highest, the temperature of the housing 211 is the lowest, and when the temperature of the battery B2 is medium, the heating element 45 is ) may be transferred to the battery B2 and the housing 211 through the heat dissipation diffusion sheet 41 , and then heat transferred to the battery B2 may be transferred to the housing 211 .
- FIG. 6 is a perspective view illustrating a housing before attaching a heat dissipation diffusion sheet according to various embodiments of the present disclosure
- 7 is a perspective view illustrating a state in which a battery mounting rib is fastened according to various embodiments of the present disclosure
- 8 is a perspective view illustrating a housing in which a battery is mounted according to various embodiments of the present disclosure
- the assembly process of the heat dissipation structure is as follows with reference to FIGS. 5B and 6 to 8 .
- the inner surface of the housing 211 may include a battery mounting area 211a for mounting the battery B2 and an attachment area for the heat dissipation diffusion sheet 41 .
- the battery mounting region 211a and the heat dissipation diffusion sheet attaching region 211b may be flat.
- first and second adhesive layers 420 and 422 may be attached to both ends of the battery mounting region 211a, and the heat dissipation diffusion sheet attaching region 211b and the battery
- the heat dissipation diffusion sheet 41 may be attached to portions other than both ends of the mounting region 211a.
- the heat dissipation diffusion sheet 41 may include a first portion 410 overlapping the battery B2 and a second portion 412 not overlapping the battery B2 .
- the battery mounting rib 43 for mounting the battery B2 to the housing 211 to which the heat dissipation diffusion sheet 41 is attached is to be fastened by a fastener (not shown).
- the fastened battery mounting rib 43 may cross the heat dissipation diffusion sheet 41 in a horizontal direction and be disposed on the heat dissipation diffusion sheet 41 .
- the battery mounting rib 43 may protrude in the first direction (eg, the first direction (1) shown in FIG. 5C ) and extend along the battery long side 401 .
- the battery mounting rib 43 may be disposed along the long side 401 adjacent to the second portion 412 among the long sides 401 of the battery B2 .
- the battery mounting rib 43 may be made of a rubber material or a thin metal material such as a suspension. A state in which the battery B2 is mounted after the battery mounting rib 43 is fastened to the housing 211 is illustrated in FIG. 8 .
- FIG. 9 is a plan view illustrating a housing in which a heat dissipation structure is disposed according to various other exemplary embodiments of the present invention.
- 10 is a longitudinal cross-sectional view schematically illustrating a heat dissipation structure of a heating element according to various other exemplary embodiments of the present invention.
- the heat dissipation structure disposed in the housing 211 is different from the heat dissipation structure illustrated in FIGS. 5A to 5D , only the battery mounting structure is different, and the rest of the structures are the same. Therefore, a detailed description of the same structure will be omitted to avoid overlapping description.
- the battery B2 mounting structure for mounting the battery B2 in the housing 211 may include a battery mounting rib 47 and an opening 470 .
- the battery mounting rib 47 is integrally injection-molded with the housing 211 and may support one side of the battery B2 .
- the battery mounting rib 47 may include an opening 470 .
- the opening 470 may be a hole through which the heat dissipation diffusion sheet 41 passes.
- the opening 470 may extend along a direction in which the battery mounting rib 47 extends, and may be formed adjacent to the inner surface of the housing 211 .
- the opening 470 may continuously extend along the long side of the battery B2 (eg, the long side 401 shown in FIG. 5A ), and the heat dissipation diffusion sheet 41 through which the heat dissipation diffusion sheet 41 passes. ) can be extended to a length greater than or equal to the width of
- the opening 470 is formed in the bottom portion of the battery mounting rib, has a width greater than the thickness of the heat dissipation diffusion sheet 41, and is formed with a height smaller than the protruding height of the battery mounting rib 47 .
- the heat dissipation diffusion sheet 41 has an opening 470 to be attached to the first and second regions of the housing 211 (eg, the first and second regions 410 and 412 shown in FIG. 5B ). It can be placed through.
- the heat dissipation diffusion sheet 41 may pass through the battery mounting rib 47 through the opening 470 after being attached to the second region 412 , and then may be attached to the first region 410 .
- the temperature of the front and rear surfaces of the housing of the foldable electronic device may decrease by about 1°C to about 2°C due to the heat dissipation structure.
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
La présente invention concerne, selon divers modes de réalisation, un dispositif électronique qui comprend : un boîtier ; une batterie disposée dans le boîtier et comprenant une première surface faisant face à une première direction et une seconde surface faisant face à une seconde direction opposée à la première direction ; une couche adhésive pour fixer la batterie au boîtier ; une carte de circuit imprimé comprenant au moins un élément chauffant et disposée dans le boîtier ; et une feuille de diffusion de dissipation de chaleur qui comprend une première partie disposée dans le boîtier de façon à chevaucher la batterie, et une seconde partie disposée en contact avec l'élément chauffant, mais de façon à ne pas chevaucher la batterie, et transfère, à la batterie ou au boîtier, la chaleur dégagée par l'élément chauffant. Divers autres modes de réalisation sont possibles.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020200154942A KR20220068039A (ko) | 2020-11-18 | 2020-11-18 | 방열 구조를 포함하는 전자 장치 |
KR10-2020-0154942 | 2020-11-18 |
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WO2022108133A1 true WO2022108133A1 (fr) | 2022-05-27 |
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PCT/KR2021/014714 WO2022108133A1 (fr) | 2020-11-18 | 2021-10-20 | Dispositif électronique comprenant une structure de dissipation de chaleur |
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WO (1) | WO2022108133A1 (fr) |
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KR20220092073A (ko) | 2020-12-24 | 2022-07-01 | 삼성전자주식회사 | 방열 구조를 포함하는 전자 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20110030496A (ko) * | 2008-07-04 | 2011-03-23 | 소니 주식회사 | 연료 전지 수납 구조 및 전자 기기 |
JP2015088882A (ja) * | 2013-10-30 | 2015-05-07 | 東芝ホームテクノ株式会社 | 携帯情報端末 |
JP2018014428A (ja) * | 2016-07-21 | 2018-01-25 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
KR20200019411A (ko) * | 2018-08-14 | 2020-02-24 | 삼성전자주식회사 | 배터리 접착 구조 및 이를 포함하는 전자 장치 |
KR20200033001A (ko) * | 2018-09-19 | 2020-03-27 | 삼성전자주식회사 | 일체형 접착층 및 접착 방지부를 포함하는 폴더블 전자 장치 |
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2020
- 2020-11-18 KR KR1020200154942A patent/KR20220068039A/ko unknown
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2021
- 2021-10-20 WO PCT/KR2021/014714 patent/WO2022108133A1/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20110030496A (ko) * | 2008-07-04 | 2011-03-23 | 소니 주식회사 | 연료 전지 수납 구조 및 전자 기기 |
JP2015088882A (ja) * | 2013-10-30 | 2015-05-07 | 東芝ホームテクノ株式会社 | 携帯情報端末 |
JP2018014428A (ja) * | 2016-07-21 | 2018-01-25 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
KR20200019411A (ko) * | 2018-08-14 | 2020-02-24 | 삼성전자주식회사 | 배터리 접착 구조 및 이를 포함하는 전자 장치 |
KR20200033001A (ko) * | 2018-09-19 | 2020-03-27 | 삼성전자주식회사 | 일체형 접착층 및 접착 방지부를 포함하는 폴더블 전자 장치 |
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