WO2022107584A1

WO2022107584A1 - Glass substrate production method and electronic device production method

Info

Publication number: WO2022107584A1
Application number: PCT/JP2021/040280
Authority: WO
Inventors: 昌彦池田; 忠高橋; 晋吉三和; 茂嘉伊藤
Original assignee: 日本電気硝子株式会社
Priority date: 2020-11-20
Filing date: 2021-11-01
Publication date: 2022-05-27
Also published as: JPWO2022107584A1; TW202229131A

Abstract

Provided is a production method for a glass substrate G in which a production-related process C is performed on the glass substrate G as the glass substrate G is being transported to a delivery destination B, said method comprising: a first transport step 1 in which the glass substrate G is transported in a state in which a protective sheet S is in contact with main surfaces Ga, Gb of the glass substrate G; a cleaning step 2 in which, having undergone the first transport step 1, the glass substrate G is subjected to a cleaning process as the production-related process C; and a second transport step 4 in which, having undergone the cleaning step 2, the glass substrate G is transported to the delivery destination B.

Description

Manufacturing method of glass substrate and manufacturing method of electronic device

The present invention relates to a method for manufacturing a glass substrate and a method for manufacturing an electronic device, which are composed of transportation of a glass substrate and manufacturing-related processing applied to the glass substrate.

As is well known, glass substrates are used in the manufacture of various electronic devices such as liquid crystal displays, plasma displays, organic EL displays, and solar cells. This type of glass substrate is usually manufactured by a manufacturer such as a glass article manufacturing factory, then packed, and transported to a delivery destination such as an electronic device manufacturing factory.

Specific examples of the method for transporting this type of glass substrate include the method disclosed in Patent Document 1. The method disclosed in the same document is to manufacture a package as a form for transporting a glass substrate, and transport the package using at least one of a land transport means, a sea transport means, and an air transport means. (See paragraph [0024] of the same document). The package is a package in which a laminate in which a protective sheet (such as a slip sheet or a resin sheet) is interposed between each of a plurality of glass substrates is loaded on a pallet or the like and packed.

Japanese Patent Publication No. 2018-530487

By the way, according to the transportation method disclosed in Patent Document 1, the contact between the main surface of the glass substrate and the protective sheet during transportation causes adverse effects such as stains adhering to the main surface of the glass substrate after transportation. obtain.

According to the experiments conducted by the present inventors, the cleaned glass substrate was transported from the manufacturer (glass article manufacturing factory) to the delivery destination (electronic device manufacturing factory) in the form of a package, and after transportation. Dirt had adhered to the main surface of the glass substrate. Therefore, at the delivery destination, in the process of manufacturing an electronic device or the like using the glass substrate, film peeling or disconnection failure occurred due to stains on the main surface.

The term “film peeling or disconnection defect” as used herein means that when a film or wiring pattern (electrode pattern, etc.), which is a device component, is formed on the main surface of a glass substrate, the film peels or the wiring pattern is caused by dirt. It means that the wire is broken. According to the experimental results of the present inventors, the stains that cause film peeling and disconnection defects are generated by the transfer of foreign substances such as resin contained in the protective sheet to the main surface of the glass substrate during transportation. It was dirty.

From the above viewpoint, an object of the present invention is to make it possible to reduce stains on the main surface of the glass substrate after transportation when the glass substrate is transported to the delivery destination.

The first aspect of the present invention, which was devised to solve the above problems, is a method for manufacturing a glass substrate, which is a method for manufacturing a glass substrate, in which the glass substrate is subjected to manufacturing-related processing while being transported to a delivery destination. A first transport step of transporting the glass substrate with the protective sheet in contact with the main surface, a cleaning step of performing a cleaning treatment on the glass substrate that has undergone the first transport step as the manufacturing-related treatment, and the above. It is characterized by including a second transportation step of transporting the glass substrate that has undergone the cleaning step to the delivery destination.

According to such a configuration, first, in the first transportation step, for example, a glass substrate is transported from a manufacturer (glass article manufacturing factory, etc.). The transportation of the glass substrate in the first transportation step is performed, for example, in the form of a package. The package is a stack of a plurality of glass substrates having a protective sheet interposed therebetween, loaded on a pallet or the like, and packaged. The packaging is manufactured by the manufacturer. As the protective sheet, an interleaving paper, a resin sheet (including a foamed resin sheet), or the like is used. The manufacturer may or may not wash the glass substrate before manufacturing the package. In the first transportation step, at least one transportation of automobile transportation, rail transportation, air transportation and water transportation is carried out. In this case, the predetermined section after the start of the first transportation step and / or the predetermined section before the end may be transported by a robot (for example, a traveling robot or the like). After the first transportation process is completed, the glass substrate taken out by unpacking the package is subjected to a cleaning process in the cleaning process. The cleaning process is performed in a building such as a factory having a cleaning facility for cleaning the glass substrate. As a result, the dirt adhering to the main surface of the glass substrate due to the contact with the protective sheet is removed, and the glass substrate is in a clean state. After the cleaning step is completed, the clean glass substrate is transported in the second transport step. The transportation of the glass substrate in the second transportation step is performed, for example, in the form of a package or in the form of being stored in a cassette such as a wire cassette. In the form of transportation here, a protective sheet that comes into contact with the main surface of the glass substrate may or may not be used. In the second transportation step, at least one transportation of automobile transportation, rail transportation, air transportation and water transportation is carried out. In this case, the predetermined section after the start of the second transportation step and / or the predetermined section before the end may be transported by the robot. Since the glass substrate that has reached the delivery destination (electronic device manufacturing factory, etc.) in the second transportation process has a history of being once cleaned in the cleaning process, the stain on the main surface of the glass substrate is reduced. Therefore, when the delivery destination manufactures a product such as an electronic device using the glass substrate, problems such as deterioration of the product quality due to stains on the main surface of the glass substrate are less likely to occur. The above-mentioned water transportation means sea transportation, transportation by river, transportation by canal, or transportation in which these are appropriately combined.

In this method, in the cleaning step, the main surface of the glass substrate may be rubbed and cleaned.

By doing so, the dirt adhering to the main surface of the glass substrate can be reliably removed. In detail, the rubbing cleaning treatment has a higher ability to remove stains than other cleaning treatments. Therefore, even if dirt that is difficult to remove by other cleaning treatment adheres to the main surface of the glass substrate in the first transportation step, the dirt can be reliably removed with high capacity.

In the above method, an evaluation step of evaluating the stain on the main surface of the glass substrate may be provided as the manufacturing-related process between the cleaning step and the second transportation step.

By doing so, it is possible to know whether or not the cleaning process is good or not, that is, whether or not the dirt on the glass substrate is surely removed by performing the process of evaluating the dirt on the main surface of the glass substrate in the evaluation process. Therefore, the second transportation step can be performed after confirming that the dirt on the glass substrate is surely removed.

In this method, in the evaluation step, as a process of evaluating the dirt on the main surface of the glass substrate, a process of measuring the number of residual particles on the main surface of the glass substrate is performed, and particles of 1 μm or more are 1 m on the main surface. The number of glass substrates per ² may be 1000 or less in the second transportation step.

Here, if the cleanliness of the glass substrate after cleaning is insufficient, a situation occurs in which residual foreign matter is crimped onto the main surface of the glass substrate in the subsequent second transportation step, which adversely affects the formation of devices at the delivery destination. give. In the configuration here, 1000 or less clean glass substrates having particles of 1 μm or more per 1 m ² of the main surface are transported in the second transport step, so that such a problem is unlikely to occur. From this viewpoint, it is more preferable that the number of particles of 1 μm or more remaining on the main surface of the glass substrate is 500 or less, or 200 or less, per 1 m ² of the main surface.

In the above method, the total of the transportation distance in the first transportation process and the transportation distance in the second transportation process may be 100 km or more.

By doing so, even if the total transportation distance between the two transportation processes is as long as 100 km or more, the cleaning process is performed during the transportation, so that the main surface of the glass substrate that has reached the delivery destination is properly contaminated. Can be reduced.

In the above method, the transportation distance in the second transportation step may be 20 km or less.

By doing so, the transportation distance in the second transportation process is shortened to 20 km or less, so that the dirt on the main surface of the glass substrate that has reached the delivery destination can be reduced more appropriately.

In the above method, the period required for the first transportation step may be 2 days or more and 180 days or less.

Here, if the period required for the first transportation step is too long, contaminants that are difficult to clean and remove adhere to the main surface of the glass substrate when the glass substrate is stored as a laminated body, and the glass substrate in the cleaning step is adhered to. Damage due to slippage may occur. Moreover, in order to remove the contaminants in the cleaning step, it is necessary to use not only rubbing cleaning but also a more powerful cleaning method such as acid cleaning. In the configuration here, since the period is 2 days or more and 180 days or less, such a problem is unlikely to occur. From this point of view, the period is preferably 2 days or more and 90 days or less, and more preferably 2 days or more and 60 days or less.

In the above method, the period required for the second transportation step may be 90 days or less.

Here, if the period required for the second transportation process is too long, the main surface of the glass substrate is recontaminated by the protective sheet after being repacked in the packing pallet, and the electronic device or the like is used at the delivery destination using the glass substrate. In the manufacturing process, dirt on the main surface may cause film peeling or disconnection failure. Further, even in the form of being stored in a cassette such as a wire cassette, there is a possibility of contamination as well because the main surface of the glass substrate is placed while being exposed to the atmosphere. In the configuration here, since the period is 90 days or less, such a problem is unlikely to occur. From this point of view, the period is preferably 60 days or less, more preferably 30 days or less, and further preferably 10 days or less.

The second aspect of the present invention, which was devised to solve the above problems, is a method for manufacturing an electronic device, in which an element is formed so as to form a device component on a main surface of a glass substrate manufactured by the above-mentioned method. Characterized by having a process.

According to such a configuration, the glass substrate that has reached the delivery destination (for example, an electronic device manufacturing factory) through the first transportation process, the cleaning process, and the second transportation process performs an element forming process in the process of manufacturing the electronic device. Used when doing. In this case, in the element forming step, device components (film, wiring pattern, etc.) are formed on the main surface of the glass substrate, so that film peeling and disconnection failure are less likely to occur. This makes it possible to manufacture high-quality electronic devices.

According to the present invention, when the glass substrate is transported to the delivery destination, it becomes possible to reduce the stain on the main surface of the glass substrate after the transportation.

It is a flowchart which illustrates the manufacturing method of the glass substrate which concerns on embodiment of this invention. It is a side view which illustrates the packing body used in the 1st transportation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. It is a vertical sectional side view which illustrates the main part of the packing body used in the 1st transportation process in the manufacturing method of the glass substrate which concerns on embodiment of this invention. It is a schematic block diagram which embodies and exemplifies the manufacturing method of the glass substrate which concerns on embodiment of this invention. It is a schematic block diagram which embodies and exemplifies the manufacturing method of the glass substrate which concerns on embodiment of this invention. It is a side view which illustrates the main part of the cleaning apparatus used in the cleaning process in the manufacturing method of the glass substrate which concerns on embodiment of this invention.

Hereinafter, a method for manufacturing a glass substrate and a method for manufacturing an electronic device according to an embodiment of the present invention will be described with reference to the attached drawings.

<Manufacturing method of glass substrate>
FIG. 1 is a flowchart illustrating a method for manufacturing a glass substrate according to an embodiment of the present invention. As shown in the figure, the method for manufacturing a glass substrate is to perform a manufacturing-related process C on the glass substrate while the glass substrate is being transported from the manufacturer A to the delivery destination B. More specifically, the manufacturing method includes a first transportation step 1, a cleaning step 2, an evaluation step 3, and a second transportation step 4. Both the cleaning step 2 and the evaluation step 3 are steps of applying manufacturing-related processing to the glass substrate. The manufacturer A is, in the present embodiment, a glass article manufacturing factory. Further, the delivery destination B is an electronic device manufacturing factory in the present embodiment.

The first transportation step 1 is a step of transporting the glass substrate from the manufacturer A. In the present embodiment, the transportation of the glass substrate in the first transportation step 1 is performed in the form of a package. FIG. 2 is a schematic side view showing the package body 5. As shown in the figure, the packing body 5 is a packing body 5 in which a laminated body L in which a protective sheet S is interposed between each of a plurality of glass substrates G is loaded on a pallet 6 and packed. The pallet 6 has a base portion 6b having an insertion port 6a for inserting a fork or the like of a forklift, a support portion 6c for supporting the lower end portion of the laminated body L, and a backrest portion 6d for supporting the laminated body L from the back surface side. And have. Each glass substrate G of the laminated body L is held in a vertical posture (strictly speaking, an inclined posture) by a support portion 6c and a backrest portion 6d. The laminated body L is fixed to the pallet 6 by a plurality of (two in the example) binding bands 6e. Further, the laminated body L is covered with the bag body 6f, and the internal space of the bag body 6f is sealed. This prevents dust and the like from entering the internal space of the bag body 6f and adhering to the laminated body L.

The packing body 5 is manufactured by the manufacturer A. The manufacturer A performs a cleaning step and an evaluation step on each glass substrate G before manufacturing the package 5. The cleaning step and the evaluation step at the manufacturer A are substantially the same as the cleaning step 2 and the evaluation step 3 described above (details will be described later).

The thickness of the glass substrate G is, for example, 0.2 to 3.0 mm, but is not limited to this dimension. As the glass substrate G, for example, silicate glass and silica glass are used, and preferably borosilicate glass, soda lime glass, aluminosilicate glass, chemically strengthened glass, and non-alkali glass. Here, the non-alkali glass is a glass that does not substantially contain an alkaline component (alkali metal oxide).

The protective sheet S protrudes from the upper end of the glass substrate G and both ends in the width direction. As the protective sheet S, an interleaving paper or a resin sheet is used. As the interleaving paper, for example, various types of paper containing wood pulp as a main component are used. The resin contained in the wood remains on the interleaving paper. As the resin sheet, for example, a foamed resin sheet containing polyethylene as a main component, a non-foamed resin protective film, or the like is used. The resin sheet may contain an antistatic agent such as a polymer-type antistatic agent, or a surfactant such as an anionic surfactant and a nonionic surfactant.

While the package 5 is being transported in the first transportation step 1, the protective sheet S is in contact with the main surfaces Ga and Gb of the glass substrate G, as shown in FIG. Therefore, when the protective sheet S is an interleaving paper, the resin component contained in the interleaving paper may be transferred to the main surfaces Ga and Gb of the glass substrate G, and stains may adhere to the protective sheet S. When the protective sheet S is a resin sheet, the bleed-out antistatic agent or surfactant may be transferred to the main surfaces Ga and Gb of the glass substrate G and stains may adhere to the protective sheet S. It should be noted that calcium stains and stains containing organic substances may also adhere to the main surfaces Ga and Gb of the glass substrate G.

In the first transportation step 1, at least one transportation of automobile transportation, rail transportation, air transportation, and water transportation is performed. Water transport means sea transport, river transport or canal transport, or a combination of these. In the first transportation step 1 in the present embodiment, as shown in FIG. 4, automobile transportation, sea transportation, and automobile transportation are performed in this order.

After the first transportation step 1 is completed, the packing body 5 is unpacked, a plurality of glass substrates G are taken out, and the cleaning step 2 is performed on those glass substrates G. The cleaning step 2 is performed in a building such as a factory having a cleaning facility. Therefore, the first transportation step 1 is completed when the building is reached. Strictly speaking, as shown in FIG. 5, the first transportation step 1 is a step of transporting the glass substrate G from the shipping position A1 of the manufacturer A to the receiving position D1 of the building D having the cleaning facility. The shipping position A1 exists around the inside and outside of the doorway of the manufacturer A, and the receiving position D1 exists around the inside and outside of the doorway of the building D. The building D is installed between the manufacturer A and the delivery destination B.

In addition, between the first transportation step 1 and the cleaning step 2, for example, a cutting step of cutting out one or a plurality of glass substrates from the original plate using a glass substrate as a raw plate, and an end face for grinding and / or polishing the cut end face. If necessary, other processing steps such as a processing step and a surface treatment step of applying a surface treatment to the glass original plate may be provided.

FIG. 6 illustrates a cleaning device 7 for executing the cleaning step 2. The cleaning device 7 mainly includes a first cleaning unit 8, a second cleaning unit 9, a rinsing unit 10, and a drying unit 11. In addition, the cleaning device 7 includes a transport device 12 that transports the glass substrate G along a predetermined transport direction X. In the following description, one main surface Ga of the glass substrate G is referred to as a first main surface, and the other main surface Gb is referred to as a second main surface. In the present embodiment, the first main surface Ga is a guaranteed surface, and the second main surface Gb is a non-guaranteed surface. Here, the "guaranteed surface" means, for example, a surface on the side where a film-forming process such as a transparent conductive film is applied in the manufacturing process of a display.

The first cleaning unit 8 includes

rollers

8a and 8b capable of rubbing and cleaning the glass substrate G (hereinafter referred to as "cleaning rollers"). The

cleaning rollers

8a and 8b include an upper cleaning roller 8a that contacts the first main surface Ga of the glass substrate G and a lower cleaning roller 8b that contacts the second main surface Gb of the glass substrate G. In this case, the

cleaning rollers

8a and 8b are composed of brush rollers, but may be sponge rollers. Further, the

cleaning rollers

8a and 8b are not limited to the rollers, and may be composed of a disc-shaped cleaning pad or other cleaning tool made of a non-woven fabric, a sponge, or the like. The first cleaning unit 8 performs a rubbing cleaning process with the

cleaning rollers

8a and 8b while supplying cleaning liquids to the main surfaces Ga and Gb of the glass substrate G.

The second cleaning unit 9 includes

cleaning pads

9a and 9b capable of sandwiching the glass substrate G up and down. The

cleaning pads

9a and 9b include an upper cleaning pad 9a that contacts the first main surface Ga of the glass substrate G and a lower cleaning pad 9b that contacts the second main surface Gb of the glass substrate G. Each of the

cleaning pads

9a and 9b is formed in a disk shape by, for example, a foamed resin molded body, a foamed rubber molded body (foam sponge), or a felt-shaped fiber molded body (felt sponge). The second cleaning unit 9 performs a rubbing cleaning process with the

cleaning pads

9a and 9b while supplying the cleaning liquid to the main surfaces Ga and Gb of the glass substrate G.

The rinse unit 10 is for removing a liquid such as a cleaning liquid adhering to the glass substrate G that has passed through the second cleaning unit 9. The rinsing unit 10 includes an upper rinsing liquid supply unit 10a and a lower rinsing liquid supply unit 10b. The upper rinse liquid supply unit 10a supplies the rinse liquid (spray injection) from the plurality of nozzles to the first main surface Ga of the glass substrate G. The lower rinse liquid supply unit 10b supplies the rinse liquid (spray injection) from the plurality of nozzles to the second main surface Gb of the glass substrate G. As the rinsing liquid, for example, pure water is used, but the rinsing liquid is not limited to this.

The drying portion 11 is for removing the rinsing liquid adhering to the glass substrate G that has passed through the rinsing portion 10. The drying portion 11 includes an upper air knife 11a and a lower air knife 11b. The upper air knife 11a blows air onto the first main surface Ga of the glass substrate G that has passed through the rinse portion 10. The lower air knife 11b blows air onto the second main surface Gb of the glass substrate G.

The transport device 12 transports the glass substrate G from the first cleaning unit 8 to the drying unit 11. The transport device 12 is configured by, for example, a roller conveyor, but is not limited to this configuration. The transport device 12 includes a plurality of transport rollers 12a arranged at predetermined intervals. Each transport roller 12a is rotationally driven while being in contact with the second main surface Gb of the glass substrate G to transport the glass substrate G along the transport direction X.

In the cleaning step 2, first, the first cleaning unit 8 and the second cleaning unit 9 perform a rubbing cleaning process on the first main surface Ga and the second main surface Gb of the glass substrate G. After that, the rinsing portion 10 performs a rinsing cleaning treatment on the first main surface Ga and the second main surface Gb of the glass substrate G. Finally, the cleaning step 2 is completed by removing the liquid adhering to the glass substrate G by the drying unit 11.

In order to easily perform the cleaning step 2 in a short time, it is preferable that the period required for the first transportation step 1 is 2 days or more and 180 days or less. This period is more preferably 2 days or more and 90 days or less, and further preferably 2 days or more and 60 days or less.

After the cleaning step 2 is completed, the evaluation step 3 is performed on the glass substrate G that has been cleaned. In the evaluation step 3, a process of measuring and evaluating the stain on the glass substrate G is performed for a plurality of evaluation items. The items for measuring and evaluating the stains are (1) items for measuring and evaluating the stains on the main surfaces Ga and Gb visually by the tester, and (2) measuring the contact angle of water on the main surfaces Ga and Gb. And (3) items to be evaluated by measuring the number of residual particles on the main surfaces Ga and Gb. The specific contents of each item will be described below.

(1) Items for visually measuring and evaluating stains When visually inspecting stains on the main surfaces Ga and Gb of the glass substrate G, the glass substrate G is first held in a horizontal posture at a predetermined height. On the other hand, water vapor is ejected from a humidifier arranged below the glass substrate G. This water vapor adheres to the lower surface of the glass substrate G. Further, the glass substrate G is illuminated with light by a lighting device such as a halogen lamp, and the tester visually confirms the stains remaining on the main surfaces Ga and Gb of the glass substrate G. When the stains on the main surfaces Ga and Gb satisfy the predetermined criteria, the tester determines that the stains are surely removed. On the contrary, if the predetermined criteria are not met, the tester determines that the stain has not been reliably removed. In the latter case, it is preferable to perform the cleaning step 2 again.

(2) Items to be evaluated by measuring the contact angle The contact angle of water on the main surfaces Ga and Gb of the glass substrate G can be measured according to, for example, JIS R3257 (1999). The tester determines that the stain has been reliably removed when the measured value meets a predetermined criterion. On the contrary, if the predetermined criteria are not met, the tester determines that the stain has not been reliably removed. In the latter case, it is preferable to perform the cleaning step 2 again.

(3) Items to be evaluated by measuring the number of residual particles For the measurement of the number of residual particles on the main surfaces Ga and Gb of the glass substrate G, for example, a surface particle measuring machine is used and remains on the main surfaces Ga and Gb. Measure the number of particles in it. The tester determines that the stain has been reliably removed when the measured value meets a predetermined criterion. On the contrary, if the predetermined criteria are not met, the tester determines that the stain has not been reliably removed. In the latter case, it is preferable to perform the cleaning step 2 again. Here, the glass substrate G satisfying the above-mentioned predetermined criteria is a glass substrate G having 1000 or less particles of 1 μm or more per 1 m ² of the main surfaces Ga and Gb.

When the tester determines in the evaluation step 3 that the stains on the main surfaces Ga and Gb of the glass substrate G are surely removed, the second transportation step 4 is performed. The second transportation step 4 is a step of transporting the glass substrate G from the building D having the cleaning equipment to the delivery destination B. Strictly speaking, as shown in FIG. 5, the second transportation step 4 is a step of transporting the glass substrate G from the shipping position D2 of the building D having the cleaning equipment to the receiving position B1 of the delivery destination B. The shipping position D2 exists around the inside and outside of the doorway of the building D, and the receiving position B1 exists around the inside and outside of the doorway of the delivery destination B. In the present embodiment, the transportation of the glass substrate G in the second transportation step 4 is performed in a form in which a plurality of glass substrates G are housed in a cassette such as a wire cassette. Instead of this, the transportation in the second transportation step 4 may be performed in the form of a packaging body having substantially the same configuration as the packaging body 5 shown in FIG. 2, or a protective sheet S may be used. Instead, the glass substrate G may be packed using a pad made of foamed resin or the like that protects only the peripheral portion or only the four corner portions.

In the second transportation step 4, at least one transportation of automobile transportation, rail transportation, air transportation, water transportation, and transportation by a robot (traveling robot) is performed. In the second transportation step 4 in the present embodiment, as shown in FIG. 4, automobile transportation and robot transportation are performed in this order. More specifically, the automobile is transported to the vicinity of the delivery destination B, and then the robot is transported to the receiving position B1 of the delivery destination B.

In order to suppress recontamination of the glass substrate G on the main surfaces Ga and Gb in the second transportation step 4, the period required for the second transportation step 4 is preferably 90 days or less. This period is more preferably 60 days or less, further preferably 30 days or less, and even more preferably 10 days or less.

Here, the total T of the transport distance α in the first transport step 1 and the transport distance β in the second transport step 4 shown in the figure is 100 km or more, preferably 200 km or more. In this case, the transport distance β in the second transport step 4 is 20 km or less, preferably 5 km or less. Further, the transportation distance β in the second transportation step 4 is shorter than the transportation distance α in the first transportation step 1. For example, the transportation distance β in the second transportation step 4 is 1/2 to 1/100 of the transportation distance α in the first transportation step 1.

Instead of the mode of transportation shown in the figure, a robot is used in a predetermined section after the start of the first transportation step 1 (the section before the automobile transportation) and / or in the predetermined section before the end (the section after the automobile transportation). It may be transported. Further, in the first transportation step 1, instead of performing the sea transportation shown in the figure in the middle section shown in the figure, either one or both of the air transportation and the rail transportation, or both of them, and the sea transportation are used. An appropriate combination may be made. On the other hand, in the second transportation step 4, only the predetermined section after the start (the section before the automobile transportation), or the predetermined section after the start (the same section as described above) and the predetermined section before the end (the section shown in the figure). ) And may be transported by a robot. In addition, automobile transportation may be performed throughout the second transportation step 4. Further, in the second transportation step 4, automobile transportation is performed in the predetermined section after the start and the predetermined section before the end, and any one of sea transportation, air transportation, rail transportation, or any of these is appropriate in the intermediate section. You may make a combination. In the above mode of transportation, sea transportation is taken as an example of water transportation, but instead of this, transportation by river or transportation by canal may be performed.

In this case, among automobile transportation, rail transportation, air transportation, and water transportation, the vibration generated in the glass substrate G (laminated body) during transportation is the largest in automobile transportation. When the transportation distance is long, the amount of dirt adhering to the main surfaces Ga and Gb of the glass substrate G increases. Therefore, among the transportation distances of the first transportation step 1, it is preferable that the transportation distance of automobile transportation is the shortest. Further, it is preferable that the transportation distance by the robot is shorter than the transportation distance of automobile transportation.

The first transportation step 1 is, specifically, a step in which the packing body 5 is loaded on a shipping container, a truck, or the like by the manufacturer A and shipped, and then unloaded in the building D having the cleaning equipment and used for the cleaning step 2. Is. That is. The first transportation step 1 includes not only a period of transportation by the above-mentioned transportation means but also a storage period of the package 5 until it is subsequently subjected to the cleaning step 2. In this case, the storage method may be such that the package 5 unloaded from the transportation container or truck may be stored in a storage facility such as another warehouse, or the package 5 may be temporarily loaded in the transportation container or truck. It may be stored by placing it on the surface.

The second transportation step 4 is, in detail, a step from being subjected to the cleaning step 2 to being subjected to the receiving position B1 of the delivery destination B. That is, this second transportation step 4 is not only for a period involving movement by the above-mentioned transportation means, but also for a storage period until it is subsequently provided to the receiving position B1 of the delivery destination B, for example, in a cassette such as a wire cassette. It also includes the storage period in the stored form or package. In this case, the storage method is to temporarily store the product while it is loaded on at least one means of transportation such as automobile transportation, rail transportation, air transportation, water transportation, and transportation by a robot (traveling robot). You may.

Next, the operation and effect of the method for manufacturing a glass substrate according to the above embodiment will be described.

In the above embodiment, first, the glass substrate G housed in the package 5 through the cleaning step and the evaluation step in the manufacturer A comes into contact with the protective sheet S (pressure welding) while being transported in the first transport step 1. Dirt adheres to the main surfaces Ga and Gb due to (or rubbing, etc.). After the first transportation step 1 is completed, the glass substrate G is subjected to a cleaning treatment for removing stains adhering to the main surfaces Ga and Gb in the cleaning step 2. Further, the glass substrate G that has completed the cleaning step 2 is transported in the second transport step 4 after it is confirmed in the evaluation step 3 that the stains on the main surfaces Ga and Gb have been reliably removed, and then the delivery destination B. Reach the receiving position B1. In this way, while the glass substrate G is being transported from the manufacturer A to the delivery destination B, the cleaning step 2 and the evaluation step 3 are performed on the glass substrate G, so that the glass substrate G is delivered from the manufacturer A to the delivery destination. Compared with the case where it is transported to B as it is, the dirt adhering to the main surfaces Ga and Gb is significantly reduced. In this embodiment, since the cleaning step 2 and the evaluation step 3 are substantially the same as the cleaning step and the evaluation step performed by the manufacturer A, the glass substrate is stored in a cassette or the like before the start of the second transportation step 4. Before the start of the first transportation step 1, G is in a state as clean as the glass substrate G used for manufacturing the package 5. Therefore, the stains on the main surfaces Ga and Gb of the glass substrate G that have reached the receiving position of the delivery destination B through the second transport step 4 are stains generated only in the second transport step 4. As a result, even if the first transportation step 1 is a long-distance transportation, the delivery destination B can receive the glass substrate G with reduced contamination of the main surfaces Ga and Gb regardless of the fact. As a result, when the delivery destination B manufactures an electronic device using the glass substrate G, problems such as deterioration of the product quality due to stains on the main surfaces Ga and Gb of the glass substrate G occur. It becomes difficult.

In the above embodiment, since the main surfaces Ga and Gb of the glass substrate G are rubbed and cleaned in the cleaning step 2, dirt adhering to the main surfaces Ga and Gb can be reliably removed. In detail, the rubbing cleaning treatment has a higher ability to remove stains than other cleaning treatments. Therefore, even if dirt that is difficult to remove by other cleaning treatment adheres to the main surfaces Ga and Gb of the glass substrate G in the first transportation step 1, the dirt can be reliably removed with high capacity.

In the above embodiment, as the manufacturing-related process, not only the cleaning process but also the process of evaluating the stain in the evaluation step 3 is performed. Therefore, it is determined whether the cleaning process is good or bad, that is, whether the stain on the glass substrate G is surely removed. You can also do it. Therefore, after confirming that the stains on the glass substrate G are surely removed, the second transportation step 4 can be performed, and the stains on the main surfaces Ga and Gb of the glass substrate G that have reached the delivery destination B can be further removed. It can be reduced more reliably.

In the above embodiment, even when long-distance transportation in which the total of the transportation distance α in the first transportation step 1 and the transportation distance β in the second transportation step 4 is 100 km or more (preferably 200 km or more) is performed, the transportation is in progress. Since the cleaning step 2 is performed in the above step 2, dirt on the main surfaces Ga and Gb of the glass substrate G that has reached the delivery destination B can be appropriately reduced.

In the above embodiment, since the transportation distance β in the second transportation step 4 is as short as 20 km or less (preferably 5 km or less), the main surfaces Ga and Gb of the glass substrate G that have reached the delivery destination B are more appropriately contaminated. Can be reduced.

In the above embodiment, since the transportation distance β in the second transportation step 4 is shorter than the transportation distance α in the first transportation step 1, even if the transportation distance α in the first transportation step 1 is significantly longer. Regardless of that, dirt on the main surfaces Ga and Gb of the glass substrate G that has reached the delivery destination B can be reliably reduced.

<Manufacturing method of electronic devices>
The method for manufacturing an electronic device according to an embodiment of the present invention is for manufacturing an electronic device using the glass substrate G obtained by carrying out the above-mentioned method for manufacturing a glass substrate. Examples of the electronic device include various displays such as a liquid crystal display, a plasma display, and an organic EL display, and a solar cell. In the present embodiment, the method for manufacturing the electronic device is carried out at the electronic device manufacturing factory which is the delivery destination B who received the glass substrate G through the second transportation step 4 described above.

This method for manufacturing an electronic device includes an element forming step of forming a component of the electronic device on the main surfaces Ga and Gb (particularly the first main surface Ga) of the glass substrate G. In the element forming step, the first main surface Ga is subjected to a film forming process such as a transparent conductive film for forming a wiring pattern or an electrode pattern, and then an etching process or a photolithography process is performed. When this element forming step is performed, the contamination of the first main surface Ga of the glass substrate G is reduced, so that the components of the electronic device can be appropriately formed on the first main surface Ga. This makes it possible to manufacture high-quality electronic devices.

Although the method for manufacturing a glass substrate and the method for manufacturing an electronic device according to an embodiment of the present invention have been described above, the present invention is not limited to this, and various variations are possible without departing from the gist thereof. be.

In the above embodiments, the storage time for storing the glass substrate G in the form of the package 5 before starting the first transportation step 1 and the storage time for storing the glass substrate G in the cassette before starting the second transportation step 4. The storage time for storage in such a form is not taken into consideration. However, if the storage time of both of them becomes long, the contact between the glass substrate G and the protective sheet S increases the amount of dirt adhering to the main surfaces Ga and Gb of the glass substrate G, so that these storage times may be taken into consideration. preferable. In particular, the latter storage time has a great influence on the contamination of the main surfaces Ga and Gb of the glass substrate G after the transportation in the second transportation step 4. Therefore, the latter storage time is preferably 1 to 72 hours.

In the above embodiment, the manufacturer A is a glass article manufacturing factory, but the present invention is not limited to this, and the manufacturer A may be a building equipped with equipment for manufacturing the glass substrate G. Further, the delivery destination B is an electronic device manufacturing factory, but the delivery destination B is not limited to this, and the delivery destination B may be a building equipped with equipment for manufacturing devices such as electronic devices using the glass substrate G.

In the first transportation step 1 of the above embodiment, the glass substrate G is transported from the manufacturer A (glass article manufacturing factory), but the present invention is not limited to this, and the glass substrate G may be imported from overseas. In this case, in the first transportation step 1, the glass substrate G may be transported from an airport, a port, or the like.

In the above embodiment, the cleaning step 2 and the evaluation step 3 are provided as the steps for performing the manufacturing-related processing on the glass substrate G, but if the cleaning step 2 has appropriate reliability, the cleaning step 2 and the evaluation step 3 are provided. Evaluation step 3 may not be necessary.

In the above embodiment, the cleaning step 2 and the evaluation step 3 performed between the first transportation step 1 and the second transportation step 4 are substantially the same as the cleaning step and the evaluation step performed by the manufacturer A. , These may be different from each other.

In the above embodiment, the main surfaces Ga and Gb of the glass substrate G are subjected to the rubbing cleaning treatment in the cleaning step 2, but a cleaning treatment other than the rubbing cleaning treatment may be performed.

In the above embodiment, the transportation of the glass substrate G in the first transportation step 1 is performed in the form of the package 5, but the transportation may be performed in another form.

In the above embodiments, the mode of transportation in the first transportation step 1 (the mode of combination of automobile transportation, sea transportation, etc.) and the mode of transportation in the second transportation step 4 are different, but both steps 1 The mode of transportation in 4 may be the same. Further, in any of both steps 1 and 4, only one mode of transportation may be used, and further, both steps 1 and 4 may be carried out in the same mode of transportation and only one mode of transportation (for example, only automobile transportation). May be.

In the above embodiments, as the mode of transport in the first transport step 1 and the second transport step 4, a mode in which the glass substrate G is packed in a vertical position is exemplified, but the glass substrate G is placed in a flat position or tilted. It may be packed in a posture.

1 1st transportation process 2 Cleaning process 3 Evaluation process 4 2nd transportation process 5 Package 6 Pallet A Manufacturer (glass article manufacturing factory)
A1 Manufacturer's shipping position B Delivery destination (electronic device manufacturing factory)
B1 Acceptance position of delivery destination C Manufacturing-related processing D Building with cleaning equipment D1 Acceptance position of building with cleaning equipment D2 Shipping position of building with cleaning equipment G Glass substrate Ga Main surface of glass substrate (first main surface)
Main surface of Gb glass substrate (second main surface)
S Protective sheet α Transportation distance in the first transportation process β Transportation distance in the second transportation process

Claims

Regarding the manufacturing method of the glass substrate, which performs the manufacturing-related processing on the glass substrate while the glass substrate is being transported to the delivery destination.
The first transportation step of transporting the glass substrate with the protective sheet in contact with the main surface of the glass substrate,
A cleaning step of performing a cleaning treatment on the glass substrate that has undergone the first transportation step as the manufacturing-related treatment,
A method for manufacturing a glass substrate, which comprises a second transportation step of transporting the glass substrate that has undergone the cleaning step to the delivery destination.
The method for manufacturing a glass substrate according to claim 1, wherein in the cleaning step, the main surface of the glass substrate is subjected to a rubbing cleaning process.
The method for manufacturing a glass substrate according to claim 1 or 2, further comprising an evaluation step of evaluating the stain on the main surface of the glass substrate as the manufacturing-related process between the cleaning step and the second transportation step. ..
In the evaluation step, as a process of evaluating the dirt on the main surface of the glass substrate, a process of measuring the number of residual particles on the main surface of the glass substrate is performed, and 1000 particles of 1 μm or more are formed per 1 m 2 of the main surface. The method for manufacturing a glass substrate according to claim 3, wherein the following glass substrate is transported in the second transportation step.
The method for manufacturing a glass substrate according to any one of claims 1 to 4, wherein the total of the transportation distance in the first transportation step and the transportation distance in the second transportation step is 100 km or more.
The method for manufacturing a glass substrate according to any one of claims 1 to 5, wherein the transportation distance in the second transportation step is 20 km or less.
The method for manufacturing a glass substrate according to any one of claims 1 to 6, wherein the period required for the first transportation step is 2 days or more and 180 days or less.
The method for manufacturing a glass substrate according to any one of claims 1 to 7, wherein the period required for the second transportation step is 90 days or less.
A method for manufacturing an electronic device, which comprises an element forming step for forming a device component on a main surface of a glass substrate manufactured by the method according to any one of claims 1 to 8.