WO2022107321A1 - Display panel, display device, and method for manufacturing display panel - Google Patents

Display panel, display device, and method for manufacturing display panel Download PDF

Info

Publication number
WO2022107321A1
WO2022107321A1 PCT/JP2020/043442 JP2020043442W WO2022107321A1 WO 2022107321 A1 WO2022107321 A1 WO 2022107321A1 JP 2020043442 W JP2020043442 W JP 2020043442W WO 2022107321 A1 WO2022107321 A1 WO 2022107321A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
substrate
black matrix
matrix layer
light emitting
Prior art date
Application number
PCT/JP2020/043442
Other languages
French (fr)
Japanese (ja)
Inventor
勇三 中野
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2020/043442 priority Critical patent/WO2022107321A1/en
Publication of WO2022107321A1 publication Critical patent/WO2022107321A1/en

Links

Images

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • This disclosure relates to the display panel.
  • LED display device in which a plurality of LED (Light Emitting Diode) elements are arranged in a square array and video information is displayed by controlling blinking of each LED element.
  • LED Light Emitting Diode
  • LED display devices are widely used for outdoor and indoor advertisement display due to technological development and cost reduction of LED elements.
  • LED display devices have become shorter in viewing distance as the pixel pitch becomes narrower, so that they are also used for displaying images on personal computers, and are used in conference rooms and surveillance applications.
  • LED display devices often display personal computer images close to still images.
  • the SMD type is a type in which an LED element is mounted in a cavity molded of ceramic or resin, and a small LED package hardened with a sealing resin is mounted on a substrate.
  • LED display devices have been widely used as large display devices with a pixel pitch of 3 mm or more.
  • SMD type LED display devices with pixel pitches of 2.5 mm, 1.9 mm, 1.5 mm, and 1.2 mm have been introduced to the market. It has been put in.
  • LED display devices instead of individually cavityd SMD type LED elements, 4in1 type SMD type LED elements in which LED elements constituting 4 pixels are sealed in one package, or LED elements without an outer shell are directly mounted on the substrate.
  • COB Chip On Board
  • Such LED display devices have a pixel pitch of less than 1 mm and are so-called mini LEDs or micro LEDs.
  • a mask plate having a light reflecting surface and a mortar-shaped through hole formed around each of a large number of LED elements arranged vertically and horizontally is arranged inside the through hole.
  • the translucent resin is sealed in.
  • a surface condensing plate in which a convex lens made of a translucent resin is fitted in a through hole through a gap is arranged.
  • a large LED display device is configured by arranging a plurality of LED display panels in the vertical direction and the horizontal direction. At this time, in the LED display panel with high definition and high density, there are problems such as the side surfaces of the LED elements (light emitting elements) arranged on the outermost periphery of the adjacent LED display panel colliding with each other and being damaged. Is likely to occur.
  • an object of the present disclosure is to protect the side surface of the light emitting element located on the outermost periphery of each display panel in a display device in which a plurality of display panels are arranged in a matrix.
  • the display panel of the present disclosure is made of a substrate, a plurality of light emitting elements arranged apart from each other on the upper surface of the substrate, and having a light emitting surface on the opposite side of the substrate, and a fiber inserted between the plurality of light emitting elements. It comprises a black matrix layer and a pressure-sensitive adhesive that is in contact with the upper surface of the black matrix layer and is formed on the light emitting surface side of a plurality of light emitting elements and has translucency.
  • FIG. It is a top view of the display device of Embodiment 1.
  • FIG. It is sectional drawing of the display panel of Embodiment 1.
  • FIG. It is a top view of the display panel of Embodiment 1.
  • FIG. It is sectional drawing of the display panel of Embodiment 1.
  • FIG. It is a top view of the black fiber mesh which constitutes the display panel of Embodiment 1.
  • FIG. It is sectional drawing of the black fiber mesh which constitutes the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1.
  • FIG. It is a top view which shows the state which attached the ground wire to the display device of Embodiment 1.
  • FIG. It is sectional drawing of a plurality of display panels constituting the display device of Embodiment 1.
  • FIG. 1 is a front view of the display device 101 of the first embodiment.
  • the display device 101 is configured to include a plurality of display panels 11.
  • the plurality of display panels 11 are arranged in a matrix in the vertical direction and the horizontal direction to form one large screen. In the example of FIG. 1, nine display panels 11 are arranged vertically and horizontally to form a display device 101.
  • FIG. 2 is a cross-sectional view of the display panel 11 along the line AA of FIG.
  • FIG. 3 is a plan view of the display panel 11 shown in the area B of FIG.
  • FIG. 4 is a cross-sectional view of the display panel 11 in which the area C of FIG. 2 is enlarged.
  • the display panel 11 includes a substrate 3, a plurality of LED elements 2, a transparent substrate 1, a transparent adhesive 4, and a black fiber mesh 5.
  • Each LED element 2 is a light emitting element.
  • the transparent substrate 1 is a protective base material.
  • the black fiber mesh 5 is a black matrix layer.
  • 64 LED elements 2 are arranged in a matrix of 8 in the vertical direction and 8 in the horizontal direction.
  • the number of LED elements 2 constituting the display panel 11 is not limited to this.
  • the transparent substrate 1 and the transparent adhesive 4 are not shown for the purpose of making the figure easier to see.
  • the substrate 3 is an epoxy substrate containing glass fiber.
  • the plurality of LED elements 2 are SMD type LED elements, and are bonded to electrodes (not shown) exposed on the surface of the substrate 3 by solder or the like.
  • the plurality of LED elements 2 are mounted on the upper surface of the substrate 3 so as to be separated from each other, and have a light emitting surface on the upper surface which is a surface opposite to the substrate 3 side.
  • each LED element 2 includes a red LED element 2r, a green LED element 2g, a blue LED element 2b, and an epoxy-based encapsulating resin 6 for encapsulating them.
  • Each LED element 2 is molded as a rectangular chip component by the epoxy-based sealing resin 6.
  • the epoxy-based sealing resin 6 has translucency.
  • the epoxy-based sealing resin 6 covers the light emitting surface of the red LED element 2r, the green LED element 2g, and the blue LED element 2b.
  • each LED element 2 may be coated with a light release agent, a resin adhesion inhibitor, or an ultraviolet light-shielding coating.
  • the light release agent is fluorine-based or silicone-based.
  • the ultraviolet light-shielding coating is, for example, a coating in which an ultraviolet scattering agent typified by titanium oxide or an ultraviolet absorbing agent is dispersed in an acrylic resin or the like.
  • the transparent substrate 1 has translucency.
  • the transparent substrate 1 faces the light emitting surface of each LED element 2 via the transparent adhesive 4.
  • the transparent substrate 1 may be optically transparent.
  • the transparent substrate 1 may be a polycarbonate, acrylic, polyester, cycloolefin polymer, or a thin film transparent resin film having a film thickness of 0.1 mm or more and 3 mm or less, which is obtained by laminating a plurality of these.
  • Polyesters include polyethylene terephthalate, polyethylene naphthalate, liquid crystal polymers and the like. In the first embodiment, the transparent substrate 1 will be described as a thin film transparent resin film.
  • the upper surface of the transparent substrate 1 opposite to the LED element 2 may be subjected to AR (Anti Reflection) treatment or AG (Anti Glare) treatment in order to prevent external light reflection.
  • AR Anti Reflection
  • AG Anti Glare
  • the transparent adhesive 4 is arranged between the plurality of LED elements 2 and the transparent substrate 1.
  • the transparent pressure-sensitive adhesive 4 is, for example, a heat-curable type, UV-curable type, moisture-curable type, or UV moisture-curable acrylic pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, or urethane-based pressure-sensitive adhesive having translucency.
  • the black fiber mesh 5 is composed of a plurality of warp threads 5a and weft threads 5b, and has a black matrix function having an external light absorption effect.
  • the black fiber mesh 5 is arranged in a gap between adjacent LED elements 2 surrounded by a substrate 3 and a transparent adhesive 4. Further, the black fiber mesh 5 is also arranged on the outer peripheral side surface of the LED element 2 arranged on the outermost peripheral portion of the display panel 11 and in a space surrounded by the substrate 3 and the transparent adhesive 4.
  • the upper surface of the black fiber mesh 5 is located at substantially the same height as the light emitting surface of each LED element 2, and is adhered to the lower surface of the transparent adhesive 4.
  • a gap 9 is formed between the black fiber mesh 5 and the substrate 3. That is, the lower surface of the black fiber mesh 5 is not in contact with the upper surface of the substrate 3.
  • FIG. 5 is a front view showing an example of the black fiber mesh 5.
  • FIG. 6 is a cross-sectional view of the black fiber mesh 5 along the DD line of FIG.
  • the material of the black fiber mesh 5 is, for example, carbon fiber, kepler fiber, glass fiber, acrylic fiber, polyester fiber, glass fiber coated with polyvinyl chloride, or a combination of various fiber materials thereof.
  • the black fiber mesh 5 is described as being formed by knitting a plurality of warp threads 5a and weft threads 5b made of carbon fibers.
  • FIGS. 7 to 15 are cross-sectional views for explaining each step in the manufacturing method of the display panel 11.
  • an insulating coating and a light release agent coating are applied to the upper surface and the side surface of each LED element 2 will be described.
  • the LED display board 8 is prepared and set on the jig 7.
  • the LED display board 8 is composed of a board 3 and a plurality of LED elements 2 mounted in a matrix on the upper surface of the board 3 apart from each other.
  • the size of the LED element 2 is 1.0 mm in both vertical and horizontal directions, and the height is 0.6 mm.
  • the pixel pitch is 1.5 mm. That is, the gap between the adjacent LED elements 2 has a width of 0.5 mm.
  • the surface of the substrate 3 on which the LED element 2 is mounted is subjected to an insulating coating treatment so as to cover the upper surface of the substrate 3 and the solder portion of the LED element 2.
  • the insulating coating layer 20 is formed in the gap between the adjacent LED elements 2 on the upper surface of the substrate 3.
  • a light peel coating layer 22 is formed on the side surface and the upper surface of the LED element 2 on the insulating coating layer 20.
  • a mesh-like black fiber mesh 5 is fitted in the gaps between the plurality of LED elements 2.
  • the black fiber mesh 5 has a structure in which carbon fibers having a diameter of 0.5 mm are woven vertically and horizontally.
  • a gel-like transparent adhesive 4 is thinly applied to the upper surfaces of the light release coating layer 22 and the black fiber mesh 5.
  • the transparent pressure-sensitive adhesive 4 is a thermosetting type.
  • a slit coater, a bar coater, a dispenser, or the like can be used for applying the gel-like transparent adhesive 4, but the present invention is not limited to this.
  • the coating film thickness of the gel-like transparent adhesive 4 depends on the size and pixel pitch of the LED element 2.
  • the dimensions of the LED element 2 are vertical W x horizontal D mm, the height from the substrate 3 after mounting the LED element 2 is H mm, the pixel pitch is P mm, and the final thickness of the transparent adhesive 4 after curing is T'mm.
  • the coating film thickness T of the gel-like transparent adhesive 4 is as follows. It is obtained by the formula (1). However, T' ⁇ H ⁇ A.
  • the final thickness of the transparent pressure-sensitive adhesive 4 after curing is set to 0.25 mm or more and 0.5 mm or less.
  • the transparent substrate 1 is put on the gel-like transparent adhesive 4.
  • the transparent substrate 1 is made of polyethylene terephthalate (PET) and has a thickness of 0.1 mm or more and 0.3 mm or less.
  • PET polyethylene terephthalate
  • the black fiber mesh 5 is pulled up to the height of the upper surface of the LED element 2 on the transparent substrate 1 side to secure a gap 9 between the substrate 3 and the black fiber mesh 5.
  • the void 9 and the insulating coating layer 20 covering the upper surface of the substrate 3 and the solder portion of the LED element 2 formed in the process shown in FIG. 9 provide an insulating property between the LED element 2 and the black fiber mesh 5. It is secured.
  • a pressing roller 23, a vacuum pump, or the like is used to expel air bubbles that have been caught in the gel-like transparent adhesive 4.
  • the exhaust hole connected to the vacuum pump is indicated by reference numeral 24.
  • the transparent adhesive 4 is cured by heat and pressure treatment by an autoclave device.
  • the transparent adhesive 4 is cured, the LED display substrate 8, the black fiber mesh 5, and the transparent substrate 1 are integrated via the transparent adhesive 4.
  • the display panel 11 including the LED display substrate 8, the insulating coating layer 20, the light peeling coating layer 22, the black fiber mesh 5, the transparent adhesive 4, and the transparent substrate 1 is obtained.
  • the display panel 11 is removed from the jig 7.
  • protruding portion 14 a portion of the display panel 11 that protrudes from the outer periphery of the substrate 3 (hereinafter referred to as “protruding portion 14”) is cut off, and the display panel 11 is molded into a product size.
  • the jig 7 is used as a holding jig for forming the insulating coating layer 20 and the light peeling coating 22 layer on the LED display board 8, and the LED display board 8, the black fiber mesh 5, and the transparent board 1 are transparently adhered to each other. It is used as an adhesive jig for integrating with the agent 4.
  • the jig 7 is preferably a non-metal material having a small heat capacity.
  • the display panel 11 of the first embodiment can be obtained. After that, one display device 101 is obtained by arranging a plurality of display panels 11.
  • FIG. 16 is a front view showing a state in which the ground wire 25 is attached to the display device 101.
  • FIG. 17 is a cross-sectional view of a region F of the display device 101 along the line EE of FIG.
  • the black fiber mesh 5 on the outermost circumference of one display panel 11 is black on the outermost circumference of another display panel 11 adjacent to the display panel 11 due to its elastic force. It adheres to the fiber mesh 5. Therefore, the black fiber mesh 5s in the display panels 11 constituting the display device 101 are in electrical contact with each other.
  • the display device 101 has an aluminum die-cast holding housing on the substrate 3 side of each display panel 11 in order to fix the plurality of display panels 11 in a state of being arranged in a matrix. I have. At the outermost peripheral portion of any display panel 11 arranged on the outermost circumference of the display device 101, the ground wire 25 is arranged so as to be in contact with the holding housing and the warp and weft 5a and the weft 5b of the black fiber mesh 5. Not only the two display panels 11, but also the entire surface of the display device 101, an unnecessary radiation shielding effect can be obtained, and static electricity is less likely to accumulate, and an antistatic effect can be obtained.
  • FIG. 18 is a diagram showing an outline of a method of replacing the LED element 2 in the display panel 11.
  • the transparent substrate 1 is made of a film-like polyethylene terephthalate (PET) having a thickness of 0.1 mm or more and 0.3 mm or less, and a light peeling coating layer 22 is formed on the surface and side surfaces of the LED element 2. ing. Therefore, the transparent substrate 1 and the black fiber mesh 5 integrated with the transparent adhesive 4 can be integrally turned over from the end portion and peeled from the LED element 2 with the help of the light peeling coating layer 22. Is.
  • PET polyethylene terephthalate
  • the gap 9 is secured between the black fiber mesh 5 and the substrate 3 by adjusting the diameter and the number of the warp 5a and the weft 5b of the black fiber mesh 5, they are integrated by the transparent adhesive 4.
  • the transparent substrate 1 and the black fiber mesh 5 can be more easily peeled off from the LED element 2.
  • the transparent substrate 1 and the black fiber mesh 5 integrated with the transparent adhesive 4 are easily peeled off from the LED element 2 to be easily peeled off from the LED element 2. Can be exposed. Therefore, the LED element 2 that needs to be replaced and repaired can be easily replaced.
  • a light peel coating may be applied to the surface of the transparent substrate 1 with respect to the transparent adhesive 4.
  • the transparent substrate 1 is covered with the transparent adhesive 4, the transparent adhesive 4 is heat-cured, the transparent substrate 1 is temporarily fixed to the LED element 2 and the black fiber mesh 5, and then the transparent substrate 1 is transparently adhered.
  • the display panel 11 is formed by peeling from the agent 4. That is, in this modification, the display panel 11 does not have the transparent substrate 1. Therefore, the decrease in the brightness of the display light due to the transparent substrate 1 is suppressed.
  • the display panel 11 of the first embodiment includes a substrate 3, a plurality of LED elements 2 which are light emitting elements, a black fiber mesh 5 which is a black matrix layer made of fiber, and a transparent adhesive 4.
  • the plurality of LED elements 2 are arranged on the upper surface of the substrate 3 so as to be separated from each other, and have a light emitting surface on the opposite side to the substrate 3. Since the black fiber mesh 5 is fitted between the plurality of LED elements 2, even if the pixel pitch of the LED element 2 is narrow, the black fiber mesh 5 can be selected by selecting the fiber diameter and mesh pitch of the black fiber mesh 5. Can be arranged between the LED elements 2.
  • the transparent adhesive 4 is in contact with the upper surface of the black fiber mesh 5 and is formed on the light emitting surface side of the plurality of LED elements 2 to have translucency. Therefore, the upper surface of the black fiber-mesh 5 and the light emitting surface of each LED element 2 are close to the same surface, and the black fiber mesh 5 and the LED adjacent thereto are close to each other regardless of the height of the LED element 2 from the substrate 3.
  • the relative position of the element 2 with respect to the light emitting surface can be kept uniform. Therefore, the effect of absorbing external light by the black fiber mesh 5 is maximized, and the contrast of external light is improved and the visibility is improved.
  • the black fiber mesh 5 is arranged in contact with the outer peripheral side side surface of the outermost peripheral LED element 2. Therefore, in the display device 101 configured by arranging a plurality of display panels 11 in a matrix, the side surfaces of the LED elements 2 arranged on the outermost periphery of the adjacent display panels 11 are protected by the black fiber mesh 5. Problems such as damage to the LED element 2 are suppressed.
  • the display panel 11 of the first embodiment may include a transparent substrate 1 as a protective base material having translucency on the transparent adhesive 4.
  • the transparent substrate 1 functions as a protective substrate for the LED element 2.
  • the display panel 11 of the first embodiment does not have to include the transparent substrate 1. In this case, the decrease in the brightness of the display light due to the transparent substrate 1 can be avoided.
  • the black fiber mesh 5 may be arranged with a gap 9 between the display panel 11 and the upper surface of the substrate 3. This makes it possible to easily peel the black fiber mesh 5 from the LED element 2 together with the transparent adhesive 4 and the transparent substrate 1.
  • the light peeling coating layer 22 is provided on the side surface and the light emitting surface of each LED element 2, and the black fiber mesh 5 is formed on the side surface of the plurality of LED elements 2 via the light peeling coating layer 22. You may be in contact with. This makes it possible to more easily peel the black fiber mesh 5 from the LED element 2 together with the transparent adhesive 4 and the transparent substrate 1.
  • the black fiber mesh 5 made of fiber, a fine black fiber mesh 5 having a hardness that can be fitted in a minute gap between the LED elements 2 can be easily formed. Is possible.
  • the black fiber mesh 5 arranged on each display panel 11 is stretched over the entire surface of the display device 101 by arranging the display panels 11 in a matrix. Therefore, if the black fiber mesh 5 is made of conductive carbon fiber, by connecting the ground wire to the black fiber mesh 5, an unnecessary radiation shielding effect can be obtained, and static electricity is less likely to accumulate and an antistatic effect can be obtained. Be done.
  • the display device 101 of the first embodiment includes a plurality of display panels 11 of the first embodiment, and the plurality of display panels 11 are arranged to form one screen. Therefore, according to the display device 101, since the side surfaces of the LED elements 2 arranged on the outermost periphery of the adjacent display panels 11 are protected by the black fiber mesh 5, problems such as damage to the LED elements 2 are suppressed.
  • a substrate 3 in which a plurality of LED elements 2 are mounted on the same surface so as to be separated from each other is prepared, and (b) a black matrix layer is provided in the gap between the LED elements 2.
  • the black fiber mesh 5 is fitted, (c) the transparent adhesive 4 is applied on the black fiber mesh 5 and the LED element 2, (d) the transparent substrate 1 is covered on the transparent adhesive 4, and (e).
  • a gap 9 is formed between the black fiber mesh 5 and the substrate 3, and the transparent adhesive 4 is cured after the step (f) (e). ..
  • the black fiber mesh 5 by pulling the black fiber mesh 5 toward the transparent substrate 1, the black fiber mesh 5 is pressed against the transparent adhesive 4 and fixed. Therefore, the upper surface of the black fiber mesh 5 and the light emitting surface of the LED element 2 are close to the same surface, and the black fiber mesh 5 and the LED element 2 adjacent thereto are close to each other regardless of the height of the LED element 2 from the substrate 3.
  • the relative position of the light emitting surface can be kept uniform. Therefore, the effect of absorbing external light by the black fiber mesh 5 is maximized, and the contrast of external light is improved and the visibility is improved.
  • the front view of the display device 102 of the second embodiment is as shown in FIG.
  • the display device 102 includes a plurality of display panels 12.
  • the plurality of display panels 12 are arranged in a matrix in the vertical direction and the horizontal direction to form one large screen.
  • FIG. 19 and 20 are a front view and a cross-sectional view of the display panel 12 in a state before cutting off the protruding portion 14 from the outer peripheral portion of the substrate 3.
  • FIG. 20 is a cross-sectional view taken along the line GG of FIG.
  • the display panel 12 has a transparent substrate 31, a transparent adhesive 34, and a black fiber mesh 35 instead of the transparent substrate 1, the transparent adhesive 4, and the black fiber mesh 5. It is the same as the display panel 11 in other respects.
  • FIG. 21 and 22 are a front view and a cross-sectional view of the black fiber mesh 35 before excision of the protruding portion 14.
  • FIG. 22 is a cross-sectional view taken along the line HH of FIG. 21.
  • the transparent substrate 31, the transparent adhesive 34, and the black fiber mesh 35 are made of the same resin.
  • the transparent substrate 31, the transparent adhesive 34, and the black fiber mesh 35 are all made of an acrylic resin.
  • the black fiber mesh 35 is made of acrylic fiber in which carbon black is kneaded as a black colorant.
  • the transparent pressure-sensitive adhesive 34 is a UV-curable acrylic resin.
  • the thickness of the transparent pressure-sensitive adhesive 34 is, for example, 0.25 mm or more and 0.5 mm or less, similar to the transparent pressure-sensitive adhesive 4.
  • the transparent substrate 31 is an acrylic resin.
  • the thickness of the transparent substrate 31 is, for example, 0.1 mm or more and 1.0 mm or less.
  • the black fiber mesh 35 is composed of a plurality of warp threads 35a and a plurality of weft threads 35b knitted in a single layer.
  • each warp and weft 35a includes two fibers 35a1 and 35a2 arranged side by side
  • each warp and weft 35b includes two fibers 35b1 and 35b2 arranged side by side.
  • the diameter of the fibers 35a1, 35a2, 35b1, 35b2 is half the length of the gap between the two adjacent LED elements 2.
  • the size of the LED element 2 is 1.0 mm in both vertical and horizontal directions, the height is 0.6 mm, and the pixel pitch is 1.5 mm. In this case, the gap between the adjacent LED elements 2 has a width of 0.5 mm.
  • the diameter of the fibers 35a1, 35a2, 35b1, 35b2 is 0.25 mm.
  • FIGS. 23 to 27 are cross-sectional views for explaining each step in the manufacturing method of the display panel 12.
  • an insulating coating and a light release agent coating are applied to the upper surface and the side surface of each LED element 2 will be described as in the first embodiment.
  • the process up to the formation step of the insulating coating layer 20 is the same as the manufacturing method of the display panel 11 of the first embodiment.
  • the ultraviolet light-shielding coating layer 21 is formed on the side surface and the upper surface of the LED element 2 on the insulating coating layer 20.
  • the light peeling coating layer 22 is formed on the ultraviolet light-shielding coating layer 21. As a result, the configuration shown in FIG. 23 is obtained.
  • the mesh-like black fiber mesh 35 is fitted into the gaps between the plurality of LED elements 2.
  • This step is the same as the step shown in FIG. 10 of the first embodiment except that the material of the black fiber mesh 35 is different from that of the black fiber mesh 5.
  • a gel-like transparent adhesive 34 is thinly applied to the upper surfaces of the light peeling coating layer 22 and the black fiber mesh 5. This step is the same as the step shown in FIG. 11 of the first embodiment except that the transparent pressure-sensitive adhesive 34 is made of a different material from the transparent pressure-sensitive adhesive 4.
  • the transparent substrate 31 is put on the gel-like transparent adhesive 34. Then, the black fiber mesh 35 is pulled up to the height of the upper surface of the LED element 2 on the transparent substrate 1 side to secure a gap 9 between the substrate 3 and the black fiber mesh 35.
  • This step is the same as the step shown in FIG. 12 of the first embodiment except that the material of the transparent substrate 31 is different from that of the transparent substrate 1.
  • a pressing roller 23, a vacuum pump, or the like is used to expel air bubbles that have been caught in the gel-like transparent adhesive 4.
  • the exhaust hole connected to the vacuum pump is indicated by reference numeral 24.
  • the transparent adhesive 34 is cured by the UV irradiation treatment.
  • the LED display substrate 8, the black fiber mesh 35, and the transparent substrate 31 are integrated via the transparent adhesive 34.
  • the display panel 12 including the LED display substrate 8, the insulating coating layer 20, the ultraviolet light-shielding coating layer 21, the light peeling coating layer 22, the black fiber mesh 35, the transparent adhesive 34, and the transparent substrate 31 is obtained.
  • This step is the same as the step shown in FIG. 14 in the first embodiment.
  • the protruding portion 14 of the display panel 12 that protrudes from the outer periphery of the substrate 3 is cut off, and the display panel 12 is molded to the product size.
  • This step is the same as the step shown in FIG. 15 in the first embodiment.
  • FIG. 28 and 29 are a front view and a cross-sectional view of the display panel 12 showing how the protruding portion 14 is cut off.
  • FIG. 29 is a cross-sectional view taken along the line I-I of FIG. 28.
  • 30 and 31 are a front view and a cross-sectional view of the display panel 12 after the protruding portion 14 is cut off.
  • FIG. 30 is a cross-sectional view taken along the line JJ of FIG. 32 and 33 are front views and cross-sectional views of the black fiber mesh 35 after the protruding portion 14 has been cut off.
  • 33 is a cross-sectional view taken along the line KK of FIG. 32.
  • the display panel 12 of the second embodiment has the following effects in addition to the effect of the display panel 11 of the first embodiment.
  • the black fiber mesh 35 of the second embodiment is configured by singing a warp and weft 35a formed by arranging fibers 35a1 and 35a2 and a weft 35b formed by arranging fibers 35b1 and 35b2 in a single layer. Therefore, when the protruding portion 14 of the display panel 12 is cut off, the black fiber mesh 35 can be easily cut with the width of one fiber 35a1, 35a2, 35b1, 35b2. That is, it is easy to mold the display panel 12 into a product size.
  • the fibers 35a1, 35a2, 35b1, 35b2 constituting the black fiber mesh 35 of the second embodiment have a diameter half that of the black fiber mesh 5 of the first embodiment. Therefore, the gap 9 between the black fiber mesh 35 and the substrate 3 is secured to be larger by the diameter of one fiber 35a1, 35a2, 35b1, 35b2 as compared with the first embodiment. As a result, the possibility of electrical contact between the substrate 3 and the black fiber mesh 35 is reduced, and the black fiber mesh 35 can be easily peeled off from the substrate 3.
  • the black fiber mesh 35 of the second embodiment is made of a resin fiber kneaded with carbon black.
  • carbon black since carbon black has conductivity, by connecting the ground wire to the black fiber mesh 35, an unnecessary radiation shielding effect can be obtained, and static electricity is less likely to accumulate and an antistatic effect can be obtained.
  • the resin constituting the black fiber mesh 35 of the second embodiment is a resin of the same system as the transparent adhesive 34.
  • interfacial reflection at the interface between the transparent adhesive 34 and the black fiber mesh 35 is suppressed.
  • the effect of absorbing external light by the black fiber mesh 35 is enhanced, and the contrast of external light is improved and the visibility is improved.
  • the bonding force between the transparent adhesive 34 and the black fiber mesh 35 is enhanced, these can be easily and integrally peeled from the substrate 3.
  • the resin constituting the black fiber mesh 35 is a resin of the same system as the transparent substrate 31 and the transparent adhesive 34. Is desirable. As a result, interfacial reflection at the interface between the transparent substrate 31 and the transparent pressure-sensitive adhesive 34 and the interface between the transparent pressure-sensitive adhesive 34 and the black fiber mesh 35 is suppressed. As a result, the effect of absorbing external light by the black fiber mesh 35 is enhanced, and the contrast of external light is improved and the visibility is improved. Further, since the binding force of the transparent substrate 31, the transparent adhesive 34, and the black fiber mesh 35 is increased, these can be easily and integrally peeled from the substrate 3.
  • a black colorant may be added to at least one of the transparent substrate 31 and the transparent adhesive 34 so that the transmittance is about 70%.
  • the image light passes through the transparent adhesive 34 and the transparent substrate 31 only once, whereas the external light passes through the transparent substrate 31 and the transparent adhesive 34, and then the transparent adhesive 34 and the LED element 2 or the black fiber mesh 35.
  • the surface is reflected at the interface with the transparent adhesive 34 and the transparent substrate 31 is transmitted again. Therefore, the external light taken out to the outside of the display panel 12 is reduced to the square of the transmittance of the transparent substrate 31 and the transparent adhesive 34 or less. As a result, the external light contrast is improved as compared with the display panel 11 of the first embodiment.
  • the approximate value of the external light contrast improvement rate CI is calculated by the following equations (2)-(4).
  • the brightness of the video light of the default white signal output from each LED element 2 of the display panel 12 is W
  • the brightness of the video light of the default black signal is B
  • the brightness of the external light incident on the display panel 12 is A.
  • C1 is the external light contrast when there is no LED surface protection structure
  • C2 is the external light contrast when there is no LED surface protection structure.
  • RL1 is the surface reflectance of the LED element 2
  • R1 is the surface reflectance of the transparent substrate 31.
  • RL2 is the synthetic reflectance between the transparent substrate 31 and the transparent adhesive 34 and the LED element 2
  • RF is the synthetic reflectance between the transparent substrate 31 and the transparent adhesive 34 and the black fiber mesh 35.
  • X is the light emitting area ratio of the LED element 2 to the display panel 12.
  • T is the synthetic light transmittance of the transparent pressure-sensitive adhesive 34 and the transparent substrate 31.
  • the brightness W of the video light of the default white signal is 1,000 (cd / m 2 )
  • the brightness B of the video light of the default black signal is 0.1 (cd / m 2 )
  • the light is incident on the display panel 12.
  • the brightness A of the external light is 30 (cd / m 2 )
  • the surface reflectance RL1 of the LED element 2 is 10%
  • the combined reflectance RL2 between the transparent substrate 31 and the transparent adhesive 34 and the LED element 2 is 10%.
  • the synthetic reflectance RF between the transparent substrate 31 and the transparent adhesive 34 and the black fiber mesh 35 is 5%.
  • the light emitting area ratio X of the LED element 2 to the display panel 12 is about 40%.
  • the synthetic light transmittance T of the transparent pressure-sensitive adhesive 34 and the transparent substrate 31 is about 70%. Therefore, according to the equations (2) to (4), the effect CI for improving the external light contrast is about doubled, and the external light contrast is significantly improved.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The purpose of the present disclosure is to protect, in a display device configured by arranging a plurality of display panels in a matrix, protect side surfaces of light emitting elements located at the outermost periphery of each of the display panels. A display panel (11) according to the present disclosure comprises: a substrate (3); a plurality of LED elements (2) disposed apart from each other on the upper surface of the substrate (3), and each having a light emission surface on the side opposite to the substrate (3); a black fiber mesh (5) inserted between the plurality of LED elements (2); and a transparent adhesive (4) that abuts on the upper surface of the black fiber mesh (5), is formed on the light emission surface sides of the plurality of LED elements (2), and has light transmittivity.

Description

表示パネル、表示装置および表示パネルの製造方法Display panel, display device and manufacturing method of display panel
 本開示は、表示パネルに関する。 This disclosure relates to the display panel.
 複数のLED(Light Emitting Diode)素子を正方配列状に配置し、個々のLED素子に対する点滅制御により映像情報を表示するLED表示装置が知られている。 There is known an LED display device in which a plurality of LED (Light Emitting Diode) elements are arranged in a square array and video information is displayed by controlling blinking of each LED element.
 LED表示装置は、LED素子の技術発展と低コスト化により屋外および屋内の広告表示等に数多く使用されている。近年、LED表示装置は、画素ピッチの狭ピッチ化に伴い視認距離が短くなったことで、パソコンの画像表示用にも使用され、会議室および監視用途などに用いられている。特に、監視用途においてLED表示装置は、静止画に近いパソコン画像を表示することが多くなっている。 LED display devices are widely used for outdoor and indoor advertisement display due to technological development and cost reduction of LED elements. In recent years, LED display devices have become shorter in viewing distance as the pixel pitch becomes narrower, so that they are also used for displaying images on personal computers, and are used in conference rooms and surveillance applications. In particular, in surveillance applications, LED display devices often display personal computer images close to still images.
 現在、LED表示装置の主流はSMD(Surface Mount Device:表面実装部品)型である。SMD型とは、セラミックまたは樹脂などで成形されたキャビティの中にLED素子を実装し、封止樹脂で固めた小さなLEDパッケージを基板に実装したものである。 Currently, the mainstream of LED display devices is the SMD (Surface Mount Device: surface mount component) type. The SMD type is a type in which an LED element is mounted in a cavity molded of ceramic or resin, and a small LED package hardened with a sealing resin is mounted on a substrate.
 LED表示装置は、これまで画素ピッチが3mm以上の大型表示装置として数多く使用されてきた。しかし、近年では、LED素子の低コスト化と高精細化の需要を背景に、画素ピッチが2.5mm、1.9mm、1.5mm、および1.2mmなどのSMD型LED表示装置が市場に投入されている。 LED display devices have been widely used as large display devices with a pixel pitch of 3 mm or more. However, in recent years, due to the demand for lower cost and higher definition LED elements, SMD type LED display devices with pixel pitches of 2.5 mm, 1.9 mm, 1.5 mm, and 1.2 mm have been introduced to the market. It has been put in.
 また、個々にキャビティ化されたSMD型LED素子ではなく、4画素を構成するLED素子を1パッケージに封止した4in1タイプのSMD型LED素子、または外殻の無いLED素子を基板に直接実装したCOB(Chip On Board)型LED素子を採用することにより、さらなる高精細化および高密度化を図ったLED表示装置が存在する。こうしたLED表示装置は、画素ピッチが1mmを切っており、いわゆる、ミニLEDまたはマイクロLEDと呼ばれる。 Further, instead of individually cavityd SMD type LED elements, 4in1 type SMD type LED elements in which LED elements constituting 4 pixels are sealed in one package, or LED elements without an outer shell are directly mounted on the substrate. There is an LED display device that achieves higher definition and higher density by adopting a COB (Chip On Board) type LED element. Such LED display devices have a pixel pitch of less than 1 mm and are so-called mini LEDs or micro LEDs.
 例えば、特許文献1に記載のドットマトリクス発光表示体では、縦横多数に配設されたLED素子それぞれの周囲に光反射面とすり鉢状の透孔が形成されたマスク板を配置され、透孔内部に透光性樹脂が封止される。さらに、LED素子およびすり鉢状の孔の前方に、空隙を介して貫通孔に透光性樹脂からなる凸状レンズを嵌入した表面集光板が配される。これにより、ドットマトリクス発光表示体では、所望の配向特性を得て光利用効率が高まり、コントラストが向上する。 For example, in the dot matrix light emitting display body described in Patent Document 1, a mask plate having a light reflecting surface and a mortar-shaped through hole formed around each of a large number of LED elements arranged vertically and horizontally is arranged inside the through hole. The translucent resin is sealed in. Further, in front of the LED element and the mortar-shaped hole, a surface condensing plate in which a convex lens made of a translucent resin is fitted in a through hole through a gap is arranged. As a result, in the dot matrix light emitting display, the desired orientation characteristics are obtained, the light utilization efficiency is increased, and the contrast is improved.
実開平5-52882号公報Jitsukaihei No. 5-52882
 複数のLED表示パネルを縦方向および横方向に複数配置することによって、大型のLED表示装置が構成される。この際、高精細化および高密度化が進んだLED表示パネルにおいては、隣接するLED表示パネルの最外周部に配置されたLED素子(発光素子)の側面同士が衝突して破損する等の不具合が発生しやすい。 A large LED display device is configured by arranging a plurality of LED display panels in the vertical direction and the horizontal direction. At this time, in the LED display panel with high definition and high density, there are problems such as the side surfaces of the LED elements (light emitting elements) arranged on the outermost periphery of the adjacent LED display panel colliding with each other and being damaged. Is likely to occur.
 そこで、本開示は、複数の表示パネルがマトリクス状に配列して構成される表示装置において、各表示パネルの最外周に位置する発光素子の側面を保護することを目的とする。 Therefore, an object of the present disclosure is to protect the side surface of the light emitting element located on the outermost periphery of each display panel in a display device in which a plurality of display panels are arranged in a matrix.
 本開示の表示パネルは、基板と、基板の上面に互いに離間して配置され、基板と反対側に光出射面を有する複数の発光素子と、複数の発光素子の間に嵌入されるファイバー製のブラックマトリクス層と、ブラックマトリクス層の上面に接し、複数の発光素子の光出射面側に形成され、透光性を有する粘着剤と、を備える。 The display panel of the present disclosure is made of a substrate, a plurality of light emitting elements arranged apart from each other on the upper surface of the substrate, and having a light emitting surface on the opposite side of the substrate, and a fiber inserted between the plurality of light emitting elements. It comprises a black matrix layer and a pressure-sensitive adhesive that is in contact with the upper surface of the black matrix layer and is formed on the light emitting surface side of a plurality of light emitting elements and has translucency.
 本開示の技術によれば、複数の表示パネルがマトリクス状に配列して構成される表示装置において、各表示パネルの最外周に位置する発光素子の側面を保護することが可能である。本開示の目的、特徴、態様、および利点は、以下の詳細な説明と添付図面とによって、より明白となる。 According to the technique of the present disclosure, in a display device in which a plurality of display panels are arranged in a matrix, it is possible to protect the side surface of a light emitting element located on the outermost periphery of each display panel. The purposes, features, embodiments, and advantages of the present disclosure will be made clearer by the following detailed description and accompanying drawings.
実施の形態1の表示装置の平面図である。It is a top view of the display device of Embodiment 1. FIG. 実施の形態1の表示パネルの断面図である。It is sectional drawing of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの平面図である。It is a top view of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの断面図である。It is sectional drawing of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルを構成する黒色ファイバーメッシュの平面図である。It is a top view of the black fiber mesh which constitutes the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルを構成する黒色ファイバーメッシュの断面図である。It is sectional drawing of the black fiber mesh which constitutes the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 1. FIG. 実施の形態1の表示装置にアース線を付けた状態を示す平面図である。It is a top view which shows the state which attached the ground wire to the display device of Embodiment 1. FIG. 実施の形態1の表示装置を構成する複数の表示パネルの断面図である。It is sectional drawing of a plurality of display panels constituting the display device of Embodiment 1. FIG. 実施の形態1の表示パネルにおいて、黒色ファイバーメッシュがLED素子から剥離する様子を示す断面図である。It is sectional drawing which shows how the black fiber mesh is peeled off from the LED element in the display panel of Embodiment 1. FIG. 実施の形態2の表示パネルのはみ出し部切除前の状態を示す平面図である。It is a top view which shows the state before excision of the protruding part of the display panel of Embodiment 2. FIG. 実施の形態2の表示パネルのはみ出し部切除前の状態を示す断面図である。It is sectional drawing which shows the state before excision of the protruding part of the display panel of Embodiment 2. 実施の形態2の表示パネルを構成する黒色ファイバーメッシュのはみ出し部切除前の状態を示す平面図である。It is a top view which shows the state before excision of the protruding part of the black fiber mesh which constitutes the display panel of Embodiment 2. FIG. 実施の形態2の表示パネルを構成する黒色ファイバーメッシュのはみ出し部切除前の状態を示す断面図である。It is sectional drawing which shows the state before excision of the protruding part of the black fiber mesh which constitutes the display panel of Embodiment 2. FIG. 実施の形態2の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 2. 実施の形態2の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 2. 実施の形態2の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 2. 実施の形態2の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 2. 実施の形態2の表示パネルの製造工程を示す断面図である。It is sectional drawing which shows the manufacturing process of the display panel of Embodiment 2. 実施の形態2の表示パネルのはみ出し部を切除する様子を示す平面図である。It is a top view which shows the state which the protruding part of the display panel of Embodiment 2 is cut off. 実施の形態2の表示パネルのはみ出し部を切除する様子を示す断面図である。It is sectional drawing which shows the state that the protruding part of the display panel of Embodiment 2 is cut off. 実施の形態2の表示パネルのはみ出し部を切除した後の状態を示す平面図である。It is a top view which shows the state after excision of the protruding part of the display panel of Embodiment 2. FIG. 実施の形態2の表示パネルのはみ出し部を切除した後の状態を示す断面図である。It is sectional drawing which shows the state after excising the protruding part of the display panel of Embodiment 2. 実施の形態2の黒色ファイバーメッシュのはみ出し部を切除した後の状態を示す平面図である。It is a top view which shows the state after excising the protruding part of the black fiber mesh of Embodiment 2. FIG. 実施の形態2の黒色ファイバーメッシュのはみ出し部を切除した後の状態を示す断面図である。It is sectional drawing which shows the state after excising the protruding part of the black fiber mesh of Embodiment 2.
 <A.実施の形態1>
 <A-1.構成>
 図1は、実施の形態1の表示装置101の正面図である。表示装置101は、複数の表示パネル11を備えて構成される。複数の表示パネル11は、縦方向および横方向のマトリクス状に配置されて、1つの大画面を構成する。図1の例では、9個の表示パネル11が縦3個かつ横3個に配列されて表示装置101を構成している。
<A. Embodiment 1>
<A-1. Configuration>
FIG. 1 is a front view of the display device 101 of the first embodiment. The display device 101 is configured to include a plurality of display panels 11. The plurality of display panels 11 are arranged in a matrix in the vertical direction and the horizontal direction to form one large screen. In the example of FIG. 1, nine display panels 11 are arranged vertically and horizontally to form a display device 101.
 図2は、図1のA-A線に沿った表示パネル11の断面図である。図3は、図1の領域Bで示された表示パネル11の平面図である。図4は、図2の領域Cを拡大した表示パネル11の断面図である。 FIG. 2 is a cross-sectional view of the display panel 11 along the line AA of FIG. FIG. 3 is a plan view of the display panel 11 shown in the area B of FIG. FIG. 4 is a cross-sectional view of the display panel 11 in which the area C of FIG. 2 is enlarged.
 図2に示されるように、表示パネル11は、基板3、複数のLED素子2、透明基板1、透明粘着剤4、および黒色ファイバーメッシュ5を備えて構成される。各LED素子2は発光素子である。透明基板1は保護基材である。黒色ファイバーメッシュ5はブラックマトリクス層である。図2には、64個のLED素子2が縦方向に8個かつ横方向に8個のマトリクス状に配列されている。しかし、表示パネル11を構成するLED素子2の数はこれに限らない。なお、図1および図3では、図を見やすくする目的で透明基板1および透明粘着剤4の図示が省略されている。 As shown in FIG. 2, the display panel 11 includes a substrate 3, a plurality of LED elements 2, a transparent substrate 1, a transparent adhesive 4, and a black fiber mesh 5. Each LED element 2 is a light emitting element. The transparent substrate 1 is a protective base material. The black fiber mesh 5 is a black matrix layer. In FIG. 2, 64 LED elements 2 are arranged in a matrix of 8 in the vertical direction and 8 in the horizontal direction. However, the number of LED elements 2 constituting the display panel 11 is not limited to this. In addition, in FIGS. 1 and 3, the transparent substrate 1 and the transparent adhesive 4 are not shown for the purpose of making the figure easier to see.
 基板3は、ガラス繊維を含むエポキシ基板である。 The substrate 3 is an epoxy substrate containing glass fiber.
 複数のLED素子2は、SMD型LED素子であり、基板3の表面に露出した電極(図示省略)にはんだ等により接合されている。複数のLED素子2は、基板3の上面に互いに離間して実装され、基板3側とは反対側の面である上面に光出射面を有している。 The plurality of LED elements 2 are SMD type LED elements, and are bonded to electrodes (not shown) exposed on the surface of the substrate 3 by solder or the like. The plurality of LED elements 2 are mounted on the upper surface of the substrate 3 so as to be separated from each other, and have a light emitting surface on the upper surface which is a surface opposite to the substrate 3 side.
 図4に示されるように、各LED素子2は、赤色LED素子2r、緑色LED素子2g、および青色LED素子2bと、これらを封止するエポキシ系封止樹脂6とを備えて構成される。エポキシ系封止樹脂6により、各LED素子2は方形状のチップ部品として成形される。エポキシ系封止樹脂6は透光性を有する。エポキシ系封止樹脂6は、赤色LED素子2r、緑色LED素子2g、および青色LED素子2bの光出射面を覆う。 As shown in FIG. 4, each LED element 2 includes a red LED element 2r, a green LED element 2g, a blue LED element 2b, and an epoxy-based encapsulating resin 6 for encapsulating them. Each LED element 2 is molded as a rectangular chip component by the epoxy-based sealing resin 6. The epoxy-based sealing resin 6 has translucency. The epoxy-based sealing resin 6 covers the light emitting surface of the red LED element 2r, the green LED element 2g, and the blue LED element 2b.
 図2および図4には示されないが、各LED素子2の側面および上面には、軽剥離剤のコーティング、樹脂付着防止剤のコーティング、または紫外線遮光コーティングが施されていてもよい。軽剥離剤は、フッ素系またはシリコーン系である。紫外線遮光コーティングは、例えば、酸化チタンに代表される紫外線散乱剤、または紫外線吸収剤をアクリル樹脂等に分散したものである。 Although not shown in FIGS. 2 and 4, the side surface and the upper surface of each LED element 2 may be coated with a light release agent, a resin adhesion inhibitor, or an ultraviolet light-shielding coating. The light release agent is fluorine-based or silicone-based. The ultraviolet light-shielding coating is, for example, a coating in which an ultraviolet scattering agent typified by titanium oxide or an ultraviolet absorbing agent is dispersed in an acrylic resin or the like.
 透明基板1は透光性を有する。透明基板1は、透明粘着剤4を介して各LED素子2の光出射面に対向する。透明基板1は、光学的に透明であればよい。透明基板1は、ポリカーボネート、アクリル、ポリエステル、シクロオレフィンポリマー、またはこれらを複数積層した、0.1mm以上3mm以下の膜厚を有する薄膜透明樹脂フィルムであってもよい。ポリエステルは、ポリエチレンテレフタレート、ポリエチレンナフタレート、および液晶ポリマーなどを含む。実施の形態1では、透明基板1を薄膜透明樹脂フィルムとして説明する。 The transparent substrate 1 has translucency. The transparent substrate 1 faces the light emitting surface of each LED element 2 via the transparent adhesive 4. The transparent substrate 1 may be optically transparent. The transparent substrate 1 may be a polycarbonate, acrylic, polyester, cycloolefin polymer, or a thin film transparent resin film having a film thickness of 0.1 mm or more and 3 mm or less, which is obtained by laminating a plurality of these. Polyesters include polyethylene terephthalate, polyethylene naphthalate, liquid crystal polymers and the like. In the first embodiment, the transparent substrate 1 will be described as a thin film transparent resin film.
 透明基板1のLED素子2とは反対側の面である上面には、外光反射を防止するためにAR(Anti Reflection)処理、またはAG(Anti Glare)処理が施されていてもよい。 The upper surface of the transparent substrate 1 opposite to the LED element 2 may be subjected to AR (Anti Reflection) treatment or AG (Anti Glare) treatment in order to prevent external light reflection.
 透明粘着剤4は、複数のLED素子2と透明基板1との間に配置される。透明粘着剤4は、例えば、透光性を有する熱硬化型、UV硬化型、湿気硬化型、もしくはUV湿気硬化型のアクリル系粘着剤、シリコーン系粘着剤、またはウレタン系粘着剤である。 The transparent adhesive 4 is arranged between the plurality of LED elements 2 and the transparent substrate 1. The transparent pressure-sensitive adhesive 4 is, for example, a heat-curable type, UV-curable type, moisture-curable type, or UV moisture-curable acrylic pressure-sensitive adhesive, silicone-based pressure-sensitive adhesive, or urethane-based pressure-sensitive adhesive having translucency.
 黒色ファイバーメッシュ5は、図3に示されるように、複数の縦糸5aおよび横糸5bから構成され、外光吸収効果のあるブラックマトリクス機能を有している。黒色ファイバーメッシュ5は、基板3と透明粘着剤4とに囲まれた、隣り合うLED素子2同士の隙間に配置される。また、黒色ファイバーメッシュ5は、表示パネル11の最外周部に配置されているLED素子2の外周側の側面と基板3と透明粘着剤4に囲まれた空間にも配置されている。 As shown in FIG. 3, the black fiber mesh 5 is composed of a plurality of warp threads 5a and weft threads 5b, and has a black matrix function having an external light absorption effect. The black fiber mesh 5 is arranged in a gap between adjacent LED elements 2 surrounded by a substrate 3 and a transparent adhesive 4. Further, the black fiber mesh 5 is also arranged on the outer peripheral side surface of the LED element 2 arranged on the outermost peripheral portion of the display panel 11 and in a space surrounded by the substrate 3 and the transparent adhesive 4.
 黒色ファイバーメッシュ5の上面は、各LED素子2の光出射面とほぼ同じ高さに位置し、透明粘着剤4の下面に接着されている。黒色ファイバーメッシュ5と基板3との間には空隙9が形成されている。すなわち、黒色ファイバーメッシュ5の下面は基板3の上面に接していない。 The upper surface of the black fiber mesh 5 is located at substantially the same height as the light emitting surface of each LED element 2, and is adhered to the lower surface of the transparent adhesive 4. A gap 9 is formed between the black fiber mesh 5 and the substrate 3. That is, the lower surface of the black fiber mesh 5 is not in contact with the upper surface of the substrate 3.
 図5は、黒色ファイバーメッシュ5の一例を示す正面図である。図6は、図5のD-D線に沿った黒色ファイバーメッシュ5の断面図である。黒色ファイバーメッシュ5の材料は、例えばカーボンファイバー、ケプラーファイバー、ガラスファイバー、アクリルファイバー、ポリエステルファイバー、またはポリ塩化ビニルを被覆したガラスファイバー、もしくはこれらの各種ファイバー素材を組み合わせたものである。実施の形態1では、黒色ファイバーメッシュ5はカーボンファイバーからなる複数の縦糸5aおよび横糸5bを編み込んで形成されたものとして説明する。 FIG. 5 is a front view showing an example of the black fiber mesh 5. FIG. 6 is a cross-sectional view of the black fiber mesh 5 along the DD line of FIG. The material of the black fiber mesh 5 is, for example, carbon fiber, kepler fiber, glass fiber, acrylic fiber, polyester fiber, glass fiber coated with polyvinyl chloride, or a combination of various fiber materials thereof. In the first embodiment, the black fiber mesh 5 is described as being formed by knitting a plurality of warp threads 5a and weft threads 5b made of carbon fibers.
 <A-2.製造方法>
 次に、図7から図15を用いて、表示パネル11の製造方法について説明する。図7から図15は、表示パネル11の製造方法における各工程を説明するための断面図である。以下では、各LED素子2の上面および側面に絶縁コーティングおよび軽剥離剤のコーティングが施される場合について説明する。
<A-2. Manufacturing method>
Next, a method of manufacturing the display panel 11 will be described with reference to FIGS. 7 to 15. 7 to 15 are cross-sectional views for explaining each step in the manufacturing method of the display panel 11. Hereinafter, a case where an insulating coating and a light release agent coating are applied to the upper surface and the side surface of each LED element 2 will be described.
 まず、図7に示されるように、LED表示基板8を用意し、治具7にセットする。LED表示基板8は、基板3と、基板3の上面に離間してマトリクス状に実装された複数のLED素子2とで構成される。ここで、LED素子2のサイズは、縦横共に1.0mmであり、高さ0.6mmとする。また、画素ピッチは1.5mmとする。すなわち、隣り合うLED素子2の隙間は幅0.5mmである。 First, as shown in FIG. 7, the LED display board 8 is prepared and set on the jig 7. The LED display board 8 is composed of a board 3 and a plurality of LED elements 2 mounted in a matrix on the upper surface of the board 3 apart from each other. Here, the size of the LED element 2 is 1.0 mm in both vertical and horizontal directions, and the height is 0.6 mm. The pixel pitch is 1.5 mm. That is, the gap between the adjacent LED elements 2 has a width of 0.5 mm.
 その後、図8に示されるように、基板3のLED素子2が実装された面に、基板3の上面およびLED素子2のはんだ部を覆うように絶縁コーティング処理を施す。これにより、基板3の上面における隣り合うLED素子2の隙間に絶縁コーティング層20が形成される。 After that, as shown in FIG. 8, the surface of the substrate 3 on which the LED element 2 is mounted is subjected to an insulating coating treatment so as to cover the upper surface of the substrate 3 and the solder portion of the LED element 2. As a result, the insulating coating layer 20 is formed in the gap between the adjacent LED elements 2 on the upper surface of the substrate 3.
 次に、図9に示されるように、絶縁コーティング層20上、LED素子2の側面および上面に軽剥離コーティング層22を形成する。 Next, as shown in FIG. 9, a light peel coating layer 22 is formed on the side surface and the upper surface of the LED element 2 on the insulating coating layer 20.
 その後、図10に示されるように、複数のLED素子2の隙間に網目状の黒色ファイバーメッシュ5を嵌め込む。黒色ファイバーメッシュ5は、直径0.5mmのカーボンファイバーが縦横に編み込まれた構成である。 After that, as shown in FIG. 10, a mesh-like black fiber mesh 5 is fitted in the gaps between the plurality of LED elements 2. The black fiber mesh 5 has a structure in which carbon fibers having a diameter of 0.5 mm are woven vertically and horizontally.
 次に、図11に示されるように、軽剥離コーティング層22および黒色ファイバーメッシュ5の上面に、ゲル状の透明粘着剤4を薄く塗布する。ここで、透明粘着剤4は熱硬化型である。ゲル状の透明粘着剤4の塗布には、スリットコータ、バーコータ、ディスペンサ等を用いることができるが、この限りではない。ゲル状の透明粘着剤4の塗布膜厚は、LED素子2のサイズおよび画素ピッチに依存する。LED素子2の寸法を縦W×横Dmmとし、LED素子2の実装後の基板3からの高さをHmm、画素ピッチをPmm、透明粘着剤4の硬化後の最終的な厚みをT´mm、透明粘着剤4の硬化収縮率をS%、黒色ファイバーメッシュ5の体積をV、黒色ファイバーメッシュ5の平均厚みをAとすると、ゲル状の透明粘着剤4の塗布膜厚Tは、以下の式(1)により得られる。但し、T´<H<Aとする。ここでは、透明粘着剤4の硬化後の最終的な厚みを0.25mm以上0.5mm以下とする。 Next, as shown in FIG. 11, a gel-like transparent adhesive 4 is thinly applied to the upper surfaces of the light release coating layer 22 and the black fiber mesh 5. Here, the transparent pressure-sensitive adhesive 4 is a thermosetting type. A slit coater, a bar coater, a dispenser, or the like can be used for applying the gel-like transparent adhesive 4, but the present invention is not limited to this. The coating film thickness of the gel-like transparent adhesive 4 depends on the size and pixel pitch of the LED element 2. The dimensions of the LED element 2 are vertical W x horizontal D mm, the height from the substrate 3 after mounting the LED element 2 is H mm, the pixel pitch is P mm, and the final thickness of the transparent adhesive 4 after curing is T'mm. Assuming that the curing shrinkage rate of the transparent adhesive 4 is S%, the volume of the black fiber mesh 5 is V, and the average thickness of the black fiber mesh 5 is A, the coating film thickness T of the gel-like transparent adhesive 4 is as follows. It is obtained by the formula (1). However, T'<H <A. Here, the final thickness of the transparent pressure-sensitive adhesive 4 after curing is set to 0.25 mm or more and 0.5 mm or less.
Figure JPOXMLDOC01-appb-M000001
Figure JPOXMLDOC01-appb-M000001
 その後、図12に示されるように、ゲル状の透明粘着剤4の上に透明基板1を被せる。透明基板1は、ポリエチレンテレフタレート(PET)製であり、厚さ0.1mm以上0.3mm以下とする。そして、黒色ファイバーメッシュ5を透明基板1側にLED素子2の上面高さまで引き上げて、基板3と黒色ファイバーメッシュ5との間に空隙9を確保する。この空隙9と、図9に示される工程で形成された基板3の上面およびLED素子2のはんだ部を覆う絶縁コーティング層20とにより、LED素子2と黒色ファイバーメッシュ5との間の絶縁性が確保されている。 After that, as shown in FIG. 12, the transparent substrate 1 is put on the gel-like transparent adhesive 4. The transparent substrate 1 is made of polyethylene terephthalate (PET) and has a thickness of 0.1 mm or more and 0.3 mm or less. Then, the black fiber mesh 5 is pulled up to the height of the upper surface of the LED element 2 on the transparent substrate 1 side to secure a gap 9 between the substrate 3 and the black fiber mesh 5. The void 9 and the insulating coating layer 20 covering the upper surface of the substrate 3 and the solder portion of the LED element 2 formed in the process shown in FIG. 9 provide an insulating property between the LED element 2 and the black fiber mesh 5. It is secured.
 次に、図13に示されるように、押圧ローラ23および真空ポンプ等を用いて、ゲル状の透明粘着剤4に噛み込んだ気泡を追い出す。図13において、真空ポンプに繋がれる排気孔が符号24で示されている。そして、オートクレーブ装置による加熱加圧処理により透明粘着剤4を硬化する。透明粘着剤4が硬化することにより、LED表示基板8、黒色ファイバーメッシュ5および透明基板1が透明粘着剤4を介して一体化する。こうして、LED表示基板8、絶縁コーティング層20、軽剥離コーティング層22、黒色ファイバーメッシュ5、透明粘着剤4、および透明基板1からなる表示パネル11が得られる。 Next, as shown in FIG. 13, a pressing roller 23, a vacuum pump, or the like is used to expel air bubbles that have been caught in the gel-like transparent adhesive 4. In FIG. 13, the exhaust hole connected to the vacuum pump is indicated by reference numeral 24. Then, the transparent adhesive 4 is cured by heat and pressure treatment by an autoclave device. When the transparent adhesive 4 is cured, the LED display substrate 8, the black fiber mesh 5, and the transparent substrate 1 are integrated via the transparent adhesive 4. In this way, the display panel 11 including the LED display substrate 8, the insulating coating layer 20, the light peeling coating layer 22, the black fiber mesh 5, the transparent adhesive 4, and the transparent substrate 1 is obtained.
 次に、図14に示されるように、表示パネル11を治具7から取り外す。 Next, as shown in FIG. 14, the display panel 11 is removed from the jig 7.
 最後に、図15に示されるように、表示パネル11のうち基板3の外周からはみ出した部分(以下、「はみ出し部14」と称する)を切除し、表示パネル11を製品サイズに成形する。 Finally, as shown in FIG. 15, a portion of the display panel 11 that protrudes from the outer periphery of the substrate 3 (hereinafter referred to as “protruding portion 14”) is cut off, and the display panel 11 is molded into a product size.
 治具7は、LED表示基板8に絶縁コーティング層20および軽剥離コーティング22層を形成する際の保持用治具として、また、LED表示基板8、黒色ファイバーメッシュ5、および透明基板1を透明粘着剤4により一体化するための接着用治具として使用される。実施の形態1においては、透明粘着剤4の硬化に熱が用いられるため、治具7は非金属で熱容量が小さい素材が好ましい。 The jig 7 is used as a holding jig for forming the insulating coating layer 20 and the light peeling coating 22 layer on the LED display board 8, and the LED display board 8, the black fiber mesh 5, and the transparent board 1 are transparently adhered to each other. It is used as an adhesive jig for integrating with the agent 4. In the first embodiment, since heat is used to cure the transparent pressure-sensitive adhesive 4, the jig 7 is preferably a non-metal material having a small heat capacity.
 以上の製造工程により、実施の形態1の表示パネル11が得られる。その後、表示パネル11を複数配列することによって1つの表示装置101が得られる。 By the above manufacturing process, the display panel 11 of the first embodiment can be obtained. After that, one display device 101 is obtained by arranging a plurality of display panels 11.
 図16は、表示装置101にアース線25を取り付けた状態を示す正面図である。図17は、図16のE-E線に沿った表示装置101の領域Fの断面図である。図1に示されるように、表示装置101において、1つの表示パネル11の最外周の黒色ファイバーメッシュ5は、その弾性力により、当該表示パネル11に隣接する別の表示パネル11の最外周の黒色ファイバーメッシュ5と密着する。従って、表示装置101を構成する各表示パネル11における各黒色ファイバーメッシュ5は、互いに電気的に接触する。 FIG. 16 is a front view showing a state in which the ground wire 25 is attached to the display device 101. FIG. 17 is a cross-sectional view of a region F of the display device 101 along the line EE of FIG. As shown in FIG. 1, in the display device 101, the black fiber mesh 5 on the outermost circumference of one display panel 11 is black on the outermost circumference of another display panel 11 adjacent to the display panel 11 due to its elastic force. It adheres to the fiber mesh 5. Therefore, the black fiber mesh 5s in the display panels 11 constituting the display device 101 are in electrical contact with each other.
 図16および図17には図示されないが、表示装置101は、複数の表示パネル11をマトリクス状に配列した状態で固定するため、各表示パネル11の基板3側にアルミダイキャスト製の保持筺体を備えている。表示装置101の最外周に配置される任意の表示パネル11の最外周部において、保持筺体と、黒色ファイバーメッシュ5の縦糸5aおよび横糸5bに接するようにアース線25が配置されることにより、1つの表示パネル11だけでなく、表示装置101の全面に亘り、不要輻射シールド効果が得られる上に、静電気がたまりにくく帯電防止効果が得られる。 Although not shown in FIGS. 16 and 17, the display device 101 has an aluminum die-cast holding housing on the substrate 3 side of each display panel 11 in order to fix the plurality of display panels 11 in a state of being arranged in a matrix. I have. At the outermost peripheral portion of any display panel 11 arranged on the outermost circumference of the display device 101, the ground wire 25 is arranged so as to be in contact with the holding housing and the warp and weft 5a and the weft 5b of the black fiber mesh 5. Not only the two display panels 11, but also the entire surface of the display device 101, an unnecessary radiation shielding effect can be obtained, and static electricity is less likely to accumulate, and an antistatic effect can be obtained.
 <A-3.画素ユニットの交換方法>
 図18は、表示パネル11におけるLED素子2の交換方法の概略を示す図である。表示パネル11において、透明基板1は厚さ0.1mm以上0.3mm以下のフィルム状のポリエチレンテレフタレート(PET)製であり、かつ、LED素子2の表面および側面に軽剥離コーティング層22が形成されている。従って、透明粘着剤4により一体化されている透明基板1および黒色ファイバーメッシュ5を、軽剥離コーティング層22の助けを得ながら、端部より一体的にめくってLED素子2から剥離することが可能である。
<A-3. How to replace the pixel unit>
FIG. 18 is a diagram showing an outline of a method of replacing the LED element 2 in the display panel 11. In the display panel 11, the transparent substrate 1 is made of a film-like polyethylene terephthalate (PET) having a thickness of 0.1 mm or more and 0.3 mm or less, and a light peeling coating layer 22 is formed on the surface and side surfaces of the LED element 2. ing. Therefore, the transparent substrate 1 and the black fiber mesh 5 integrated with the transparent adhesive 4 can be integrally turned over from the end portion and peeled from the LED element 2 with the help of the light peeling coating layer 22. Is.
 また、黒色ファイバーメッシュ5の縦糸5aおよび横糸5bの径および本数を調整することによって、黒色ファイバーメッシュ5と基板3との間に空隙9が確保されているため、透明粘着剤4により一体化されている透明基板1および黒色ファイバーメッシュ5を、さらに容易にLED素子2から剥離することが可能である。 Further, since the gap 9 is secured between the black fiber mesh 5 and the substrate 3 by adjusting the diameter and the number of the warp 5a and the weft 5b of the black fiber mesh 5, they are integrated by the transparent adhesive 4. The transparent substrate 1 and the black fiber mesh 5 can be more easily peeled off from the LED element 2.
 このように、LED素子2の交換修理が必要となった際には、透明粘着剤4により一体化された透明基板1および黒色ファイバーメッシュ5を、LED素子2から容易に剥離し、LED素子2を暴露状態にすることができる。従って、交換修理が必要となったLED素子2を容易に交換することができる。 As described above, when the LED element 2 needs to be replaced and repaired, the transparent substrate 1 and the black fiber mesh 5 integrated with the transparent adhesive 4 are easily peeled off from the LED element 2 to be easily peeled off from the LED element 2. Can be exposed. Therefore, the LED element 2 that needs to be replaced and repaired can be easily replaced.
 <A-4.変形例>
 透明基板1の透明粘着剤4に対する面に軽剥離コーティングが施されていてもよい。この場合、透明基板1を透明粘着剤4に被せ、透明粘着剤4の熱硬化処理を施して、透明基板1をLED素子2および黒色ファイバーメッシュ5と仮固定した後に、透明基板1を透明粘着剤4から剥離して表示パネル11が形成される。すなわち、この変形例において、表示パネル11は透明基板1を有さない。従って、透明基板1による表示光の輝度低下が抑制される。
<A-4. Modification example>
A light peel coating may be applied to the surface of the transparent substrate 1 with respect to the transparent adhesive 4. In this case, the transparent substrate 1 is covered with the transparent adhesive 4, the transparent adhesive 4 is heat-cured, the transparent substrate 1 is temporarily fixed to the LED element 2 and the black fiber mesh 5, and then the transparent substrate 1 is transparently adhered. The display panel 11 is formed by peeling from the agent 4. That is, in this modification, the display panel 11 does not have the transparent substrate 1. Therefore, the decrease in the brightness of the display light due to the transparent substrate 1 is suppressed.
 <A-5.効果>
 実施の形態1の表示パネル11は、基板3、発光素子である複数のLED素子2、ファイバー製のブラックマトリクス層である黒色ファイバーメッシュ5、および透明粘着剤4を備える。複数のLED素子2は、基板3の上面に互いに離間して配置され、基板3と反対側の光出射面を有する。黒色ファイバーメッシュ5は、複数のLED素子2の間に嵌入されるため、LED素子2の画素ピッチが狭くても、黒色ファイバーメッシュ5のファイバー径およびメッシュピッチを選定することにより、黒色ファイバーメッシュ5をLED素子2間に配列することが可能である。
<A-5. Effect>
The display panel 11 of the first embodiment includes a substrate 3, a plurality of LED elements 2 which are light emitting elements, a black fiber mesh 5 which is a black matrix layer made of fiber, and a transparent adhesive 4. The plurality of LED elements 2 are arranged on the upper surface of the substrate 3 so as to be separated from each other, and have a light emitting surface on the opposite side to the substrate 3. Since the black fiber mesh 5 is fitted between the plurality of LED elements 2, even if the pixel pitch of the LED element 2 is narrow, the black fiber mesh 5 can be selected by selecting the fiber diameter and mesh pitch of the black fiber mesh 5. Can be arranged between the LED elements 2.
 また、実施の形態1の表示パネル11において、透明粘着剤4は、黒色ファイバーメッシュ5の上面に接し、複数のLED素子2の光出射面側に形成され、透光性を有する。従って、黒色ファイバ―メッシュ5の上面と各LED素子2の光出射面とが同一面に近くなり、LED素子2の基板3からの高さに関わらず、黒色ファイバーメッシュ5とこれに隣接するLED素子2の光出射面との相対位置を均一に保つことができる。従って、黒色ファイバーメッシュ5による外光吸収効果が最大限に発揮され、外光コントラストの向上および視認性の向上が実現する。 Further, in the display panel 11 of the first embodiment, the transparent adhesive 4 is in contact with the upper surface of the black fiber mesh 5 and is formed on the light emitting surface side of the plurality of LED elements 2 to have translucency. Therefore, the upper surface of the black fiber-mesh 5 and the light emitting surface of each LED element 2 are close to the same surface, and the black fiber mesh 5 and the LED adjacent thereto are close to each other regardless of the height of the LED element 2 from the substrate 3. The relative position of the element 2 with respect to the light emitting surface can be kept uniform. Therefore, the effect of absorbing external light by the black fiber mesh 5 is maximized, and the contrast of external light is improved and the visibility is improved.
 また、実施の形態1の表示パネル11において、黒色ファイバーメッシュ5は、最外周のLED素子2の外周側側面に接して配置される。従って、複数の表示パネル11をマトリクス状に配列して構成された表示装置101において、隣り合う表示パネル11の最外周に配置されたLED素子2の側面が黒色ファイバーメッシュ5によって保護されるため、LED素子2の破損等の不具合が抑制される。 Further, in the display panel 11 of the first embodiment, the black fiber mesh 5 is arranged in contact with the outer peripheral side side surface of the outermost peripheral LED element 2. Therefore, in the display device 101 configured by arranging a plurality of display panels 11 in a matrix, the side surfaces of the LED elements 2 arranged on the outermost periphery of the adjacent display panels 11 are protected by the black fiber mesh 5. Problems such as damage to the LED element 2 are suppressed.
 また、実施の形態1の表示パネル11は、透明粘着剤4上に透光性を有する保護基材としての透明基板1を備えていても良い。表示パネル11が透明基板1を備える場合、透明基板1がLED素子2の保護基材として機能する。 Further, the display panel 11 of the first embodiment may include a transparent substrate 1 as a protective base material having translucency on the transparent adhesive 4. When the display panel 11 includes the transparent substrate 1, the transparent substrate 1 functions as a protective substrate for the LED element 2.
 しかし、実施の形態1の表示パネル11は、透明基板1を備えてなくても良い。この場合、透明基板1による表示光の輝度低下が避けられる。 However, the display panel 11 of the first embodiment does not have to include the transparent substrate 1. In this case, the decrease in the brightness of the display light due to the transparent substrate 1 can be avoided.
 実施の形態1の表示パネル11において、黒色ファイバーメッシュ5は、基板3の上面との間に空隙9を有して配置されていても良い。これにより、黒色ファイバーメッシュ5を、透明粘着剤4および透明基板1と共にLED素子2から容易に剥離することが可能となる。 In the display panel 11 of the first embodiment, the black fiber mesh 5 may be arranged with a gap 9 between the display panel 11 and the upper surface of the substrate 3. This makes it possible to easily peel the black fiber mesh 5 from the LED element 2 together with the transparent adhesive 4 and the transparent substrate 1.
 実施の形態1の表示パネル11において、各LED素子2の側面および光出射面に軽剥離コーティング層22が設けられ、黒色ファイバーメッシュ5は軽剥離コーティング層22を介して複数のLED素子2の側面に接していても良い。これにより、黒色ファイバーメッシュ5を、透明粘着剤4および透明基板1と共にLED素子2からさらに容易に剥離することが可能となる。 In the display panel 11 of the first embodiment, the light peeling coating layer 22 is provided on the side surface and the light emitting surface of each LED element 2, and the black fiber mesh 5 is formed on the side surface of the plurality of LED elements 2 via the light peeling coating layer 22. You may be in contact with. This makes it possible to more easily peel the black fiber mesh 5 from the LED element 2 together with the transparent adhesive 4 and the transparent substrate 1.
 実施の形態1の表示パネル11において、黒色ファイバーメッシュ5をファイバー製とすることにより、LED素子2間の微小な間隙に嵌合できる硬さを有する微細な黒色ファイバーメッシュ5を容易に形成することが可能である。 In the display panel 11 of the first embodiment, by making the black fiber mesh 5 made of fiber, a fine black fiber mesh 5 having a hardness that can be fitted in a minute gap between the LED elements 2 can be easily formed. Is possible.
 各表示パネル11に配置された黒色ファイバーメッシュ5は、各表示パネル11をマトリクス状に配列することによって、表示装置101の全面に亘り張り巡らされる。従って、黒色ファイバーメッシュ5を導電性を有するカーボンファイバー製とすれば、黒色ファイバーメッシュ5にアース線を接続することによって、不要輻射シールド効果が得られる上に、静電気がたまりにくく帯電防止効果が得られる。 The black fiber mesh 5 arranged on each display panel 11 is stretched over the entire surface of the display device 101 by arranging the display panels 11 in a matrix. Therefore, if the black fiber mesh 5 is made of conductive carbon fiber, by connecting the ground wire to the black fiber mesh 5, an unnecessary radiation shielding effect can be obtained, and static electricity is less likely to accumulate and an antistatic effect can be obtained. Be done.
 実施の形態1の表示装置101は、実施の形態1の複数の表示パネル11を備え、複数の表示パネル11が配列して1つの画面を構成する。従って、表示装置101によれば、隣り合う表示パネル11の最外周に配置されたLED素子2の側面が黒色ファイバーメッシュ5によって保護されるため、LED素子2の破損等の不具合が抑制される。 The display device 101 of the first embodiment includes a plurality of display panels 11 of the first embodiment, and the plurality of display panels 11 are arranged to form one screen. Therefore, according to the display device 101, since the side surfaces of the LED elements 2 arranged on the outermost periphery of the adjacent display panels 11 are protected by the black fiber mesh 5, problems such as damage to the LED elements 2 are suppressed.
 実施の形態1の表示パネル11の製造方法は、(a)同一面に複数のLED素子2が互いに離間して実装された基板3を用意し、(b)LED素子2の間隙にブラックマトリクス層としての黒色ファイバーメッシュ5を嵌入し、(c)黒色ファイバーメッシュ5およびLED素子2の上に透明粘着剤4を塗布し、(d)透明粘着剤4上に透明基板1を被せ、(e)黒色ファイバーメッシュ5を引き上げて透明粘着剤4に圧着することにより、黒色ファイバーメッシュ5と基板3との間に空隙9を形成し、(f)工程(e)の後に透明粘着剤4を硬化させる。 In the method of manufacturing the display panel 11 of the first embodiment, (a) a substrate 3 in which a plurality of LED elements 2 are mounted on the same surface so as to be separated from each other is prepared, and (b) a black matrix layer is provided in the gap between the LED elements 2. The black fiber mesh 5 is fitted, (c) the transparent adhesive 4 is applied on the black fiber mesh 5 and the LED element 2, (d) the transparent substrate 1 is covered on the transparent adhesive 4, and (e). By pulling up the black fiber mesh 5 and pressing it against the transparent adhesive 4, a gap 9 is formed between the black fiber mesh 5 and the substrate 3, and the transparent adhesive 4 is cured after the step (f) (e). ..
 以上の製造方法によれば、黒色ファイバーメッシュ5を透明基板1側に引き上げることにより、黒色ファイバーメッシュ5が透明粘着剤4に押し付けられ固定される。そのため、黒色ファイバーメッシュ5の上面とLED素子2の光出射面とが同一面に近くなり、LED素子2の基板3からの高さに関わらず、黒色ファイバーメッシュ5とこれに隣接するLED素子2の光出射面との相対位置を均一に保つことができる。従って、黒色ファイバーメッシュ5による外光吸収効果が最大限に発揮され、外光コントラストの向上および視認性の向上が実現する。 According to the above manufacturing method, by pulling the black fiber mesh 5 toward the transparent substrate 1, the black fiber mesh 5 is pressed against the transparent adhesive 4 and fixed. Therefore, the upper surface of the black fiber mesh 5 and the light emitting surface of the LED element 2 are close to the same surface, and the black fiber mesh 5 and the LED element 2 adjacent thereto are close to each other regardless of the height of the LED element 2 from the substrate 3. The relative position of the light emitting surface can be kept uniform. Therefore, the effect of absorbing external light by the black fiber mesh 5 is maximized, and the contrast of external light is improved and the visibility is improved.
 <B.実施の形態2>
 <B-1.構成>
 実施の形態2の表示装置102の正面図は図1に示した通りである。表示装置102は、複数の表示パネル12を備えて構成される。複数の表示パネル12は、縦方向および横方向のマトリクス状に配置されて、1つの大画面を構成する。
<B. Embodiment 2>
<B-1. Configuration>
The front view of the display device 102 of the second embodiment is as shown in FIG. The display device 102 includes a plurality of display panels 12. The plurality of display panels 12 are arranged in a matrix in the vertical direction and the horizontal direction to form one large screen.
 図19および図20は、表示パネル12の、基板3の外周部からのはみ出し部14を切除する前の状態の正面図および断面図である。図20は、図19のG-G線に沿った断面図である。表示パネル12は、実施の形態1の表示パネル11と比較すると、透明基板1、透明粘着剤4、および黒色ファイバーメッシュ5に代えて、透明基板31、透明粘着剤34、および黒色ファイバーメッシュ35を備えており、その他の点で表示パネル11と同一である。 19 and 20 are a front view and a cross-sectional view of the display panel 12 in a state before cutting off the protruding portion 14 from the outer peripheral portion of the substrate 3. FIG. 20 is a cross-sectional view taken along the line GG of FIG. Compared with the display panel 11 of the first embodiment, the display panel 12 has a transparent substrate 31, a transparent adhesive 34, and a black fiber mesh 35 instead of the transparent substrate 1, the transparent adhesive 4, and the black fiber mesh 5. It is the same as the display panel 11 in other respects.
 図21および図22は、はみ出し部14の切除前の黒色ファイバーメッシュ35の正面図および断面図である。図22は、図21のH-H線に沿った断面図である。 21 and 22 are a front view and a cross-sectional view of the black fiber mesh 35 before excision of the protruding portion 14. FIG. 22 is a cross-sectional view taken along the line HH of FIG. 21.
 透明基板31、透明粘着剤34、および黒色ファイバーメッシュ35は、同一系統の樹脂で構成される。例えば、透明基板31、透明粘着剤34、および黒色ファイバーメッシュ35は、いずれもアクリル系の樹脂で構成される。黒色ファイバーメッシュ35は、黒色着色剤としてカーボンブラックが混錬されたアクリルファイバー製である。透明粘着剤34はUV硬化型のアクリル系樹脂である。透明粘着剤34の厚みは、透明粘着剤4と同様、例えば0.25mm以上0.5mm以下である。透明基板31はアクリル系樹脂である。透明基板31の厚みは、例えば0.1mm以上1.0mm以下である。 The transparent substrate 31, the transparent adhesive 34, and the black fiber mesh 35 are made of the same resin. For example, the transparent substrate 31, the transparent adhesive 34, and the black fiber mesh 35 are all made of an acrylic resin. The black fiber mesh 35 is made of acrylic fiber in which carbon black is kneaded as a black colorant. The transparent pressure-sensitive adhesive 34 is a UV-curable acrylic resin. The thickness of the transparent pressure-sensitive adhesive 34 is, for example, 0.25 mm or more and 0.5 mm or less, similar to the transparent pressure-sensitive adhesive 4. The transparent substrate 31 is an acrylic resin. The thickness of the transparent substrate 31 is, for example, 0.1 mm or more and 1.0 mm or less.
 黒色ファイバーメッシュ35は、複数の縦糸35aと複数の横糸35bを1重に編みこんで構成される。ここで、各縦糸35aは、並べて配置された2本のファイバー35a1,35a2を備え、各横糸35bは、並べて配置された2本のファイバー35b1,35b2を備える。ファイバー35a1,35a2,35b1,35b2の直径は、隣り合う2つのLED素子2の隙間の半分の長さである。例えば、実施の形態1と同様に、LED素子2のサイズを、縦横共に1.0mm、高さ0.6mmとし、画素ピッチを1.5mmとする。この場合、隣り合うLED素子2の隙間は幅0.5mmである。そして、ファイバー35a1,35a2,35b1,35b2の直径は、0.25mmである。 The black fiber mesh 35 is composed of a plurality of warp threads 35a and a plurality of weft threads 35b knitted in a single layer. Here, each warp and weft 35a includes two fibers 35a1 and 35a2 arranged side by side, and each warp and weft 35b includes two fibers 35b1 and 35b2 arranged side by side. The diameter of the fibers 35a1, 35a2, 35b1, 35b2 is half the length of the gap between the two adjacent LED elements 2. For example, as in the first embodiment, the size of the LED element 2 is 1.0 mm in both vertical and horizontal directions, the height is 0.6 mm, and the pixel pitch is 1.5 mm. In this case, the gap between the adjacent LED elements 2 has a width of 0.5 mm. The diameter of the fibers 35a1, 35a2, 35b1, 35b2 is 0.25 mm.
 <B-2.製造方法>
 次に、図23から図27を用いて、表示パネル12の製造方法について説明する。図23から図27は、表示パネル12の製造方法における各工程を説明するための断面図である。以下では、実施の形態1と同様、各LED素子2の上面および側面に絶縁コーティングおよび軽剥離剤のコーティングが施される場合について説明する。
<B-2. Manufacturing method>
Next, a method of manufacturing the display panel 12 will be described with reference to FIGS. 23 to 27. 23 to 27 are cross-sectional views for explaining each step in the manufacturing method of the display panel 12. Hereinafter, a case where an insulating coating and a light release agent coating are applied to the upper surface and the side surface of each LED element 2 will be described as in the first embodiment.
 絶縁コーティング層20の形成工程までは、実施の形態1の表示パネル11の製造方法と同様である。絶縁コーティング層20を形成した後、絶縁コーティング層20上、LED素子2の側面および上面に紫外線遮光コーティング層21を形成する。その後、紫外線遮光コーティング層21上に軽剥離コーティング層22を形成する。これにより、図23に示す構成が得られる。 The process up to the formation step of the insulating coating layer 20 is the same as the manufacturing method of the display panel 11 of the first embodiment. After forming the insulating coating layer 20, the ultraviolet light-shielding coating layer 21 is formed on the side surface and the upper surface of the LED element 2 on the insulating coating layer 20. After that, the light peeling coating layer 22 is formed on the ultraviolet light-shielding coating layer 21. As a result, the configuration shown in FIG. 23 is obtained.
 その後、図24に示されるように、複数のLED素子2の隙間に網目状の黒色ファイバーメッシュ35を嵌め込む。この工程は、黒色ファイバーメッシュ35が黒色ファイバーメッシュ5とは材質が異なることを除けば、実施の形態1の図10に示された工程と同様である。 After that, as shown in FIG. 24, the mesh-like black fiber mesh 35 is fitted into the gaps between the plurality of LED elements 2. This step is the same as the step shown in FIG. 10 of the first embodiment except that the material of the black fiber mesh 35 is different from that of the black fiber mesh 5.
 図25に示されるように、軽剥離コーティング層22および黒色ファイバーメッシュ5の上面に、ゲル状の透明粘着剤34を薄く塗布する。この工程は、透明粘着剤34が透明粘着剤4とは材質が異なることを除けば、実施の形態1の図11に示された工程と同様である。 As shown in FIG. 25, a gel-like transparent adhesive 34 is thinly applied to the upper surfaces of the light peeling coating layer 22 and the black fiber mesh 5. This step is the same as the step shown in FIG. 11 of the first embodiment except that the transparent pressure-sensitive adhesive 34 is made of a different material from the transparent pressure-sensitive adhesive 4.
 次に、図26に示されるように、ゲル状の透明粘着剤34の上に透明基板31を被せる。そして、黒色ファイバーメッシュ35を透明基板1側にLED素子2の上面高さまで引き上げて、基板3と黒色ファイバーメッシュ35との間に空隙9を確保する。この工程は、透明基板31の材質が透明基板1とは材質が異なることを除けば、実施の形態1の図12に示された工程と同様である。 Next, as shown in FIG. 26, the transparent substrate 31 is put on the gel-like transparent adhesive 34. Then, the black fiber mesh 35 is pulled up to the height of the upper surface of the LED element 2 on the transparent substrate 1 side to secure a gap 9 between the substrate 3 and the black fiber mesh 35. This step is the same as the step shown in FIG. 12 of the first embodiment except that the material of the transparent substrate 31 is different from that of the transparent substrate 1.
 次に、図27に示されるように、押圧ローラ23および真空ポンプ等を用いて、ゲル状の透明粘着剤4に噛み込んだ気泡を追い出す。図27において、真空ポンプに繋がれる排気孔が符号24で示されている。そして、UV照射処理により透明粘着剤34を硬化する。透明粘着剤34が硬化することにより、LED表示基板8、黒色ファイバーメッシュ35および透明基板31が透明粘着剤34を介して一体化する。こうして、LED表示基板8、絶縁コーティング層20、紫外線遮光コーティング層21、軽剥離コーティング層22、黒色ファイバーメッシュ35、透明粘着剤34、および透明基板31からなる表示パネル12が得られる。 Next, as shown in FIG. 27, a pressing roller 23, a vacuum pump, or the like is used to expel air bubbles that have been caught in the gel-like transparent adhesive 4. In FIG. 27, the exhaust hole connected to the vacuum pump is indicated by reference numeral 24. Then, the transparent adhesive 34 is cured by the UV irradiation treatment. When the transparent adhesive 34 is cured, the LED display substrate 8, the black fiber mesh 35, and the transparent substrate 31 are integrated via the transparent adhesive 34. In this way, the display panel 12 including the LED display substrate 8, the insulating coating layer 20, the ultraviolet light-shielding coating layer 21, the light peeling coating layer 22, the black fiber mesh 35, the transparent adhesive 34, and the transparent substrate 31 is obtained.
 その後、表示パネル12を治具7から取り外す。この工程は、実施の形態1において図14で示した工程と同様である。 After that, the display panel 12 is removed from the jig 7. This step is the same as the step shown in FIG. 14 in the first embodiment.
 次に、表示パネル12のうち基板3の外周からはみ出したはみ出し部14を切除し、表示パネル12を製品サイズに成形する。この工程は、実施の形態1において図15で示した工程と同様である。 Next, the protruding portion 14 of the display panel 12 that protrudes from the outer periphery of the substrate 3 is cut off, and the display panel 12 is molded to the product size. This step is the same as the step shown in FIG. 15 in the first embodiment.
 図28および図29は、はみ出し部14が切除される様子を示す表示パネル12の正面図および断面図である。図29は図28のI-I線に沿った断面図である。図30および図31は、はみ出し部14が切除された後の表示パネル12の正面図および断面図である。図30は図31のJ-J線に沿った断面図である。図32および図33は、はみ出し部14が切除された後の黒色ファイバーメッシュ35の正面図および断面図である。図33は図32のK-K線に沿った断面図である。 28 and 29 are a front view and a cross-sectional view of the display panel 12 showing how the protruding portion 14 is cut off. FIG. 29 is a cross-sectional view taken along the line I-I of FIG. 28. 30 and 31 are a front view and a cross-sectional view of the display panel 12 after the protruding portion 14 is cut off. FIG. 30 is a cross-sectional view taken along the line JJ of FIG. 32 and 33 are front views and cross-sectional views of the black fiber mesh 35 after the protruding portion 14 has been cut off. 33 is a cross-sectional view taken along the line KK of FIG. 32.
 <B-3.効果>
 実施の形態2の表示パネル12は、実施の形態1の表示パネル11の効果に加えて、以下の効果を奏する。
<B-3. Effect>
The display panel 12 of the second embodiment has the following effects in addition to the effect of the display panel 11 of the first embodiment.
 実施の形態2の黒色ファイバーメッシュ35は、ファイバー35a1,35a2を並べて構成される縦糸35aと、ファイバー35b1,35b2を並べて構成される横糸35bとを1重に編みこんで構成される。従って、表示パネル12のはみ出し部14を切除する際には、黒色ファイバーメッシュ35をファイバー35a1,35a2,35b1,35b2の1本分の幅で容易に裁断することができる。すなわち、表示パネル12の製品サイズへの成形が容易である。 The black fiber mesh 35 of the second embodiment is configured by singing a warp and weft 35a formed by arranging fibers 35a1 and 35a2 and a weft 35b formed by arranging fibers 35b1 and 35b2 in a single layer. Therefore, when the protruding portion 14 of the display panel 12 is cut off, the black fiber mesh 35 can be easily cut with the width of one fiber 35a1, 35a2, 35b1, 35b2. That is, it is easy to mold the display panel 12 into a product size.
 また、実施の形態2の黒色ファイバーメッシュ35を構成するファイバー35a1,35a2,35b1,35b2は、実施の形態1の黒色ファイバーメッシュ5に比べて直径が半分である。従って、黒色ファイバーメッシュ35と基板3との間の空隙9が、実施の形態1と比較して、ファイバー35a1,35a2,35b1,35b2の1本分の直径だけ大きく確保される。その結果、基板3と黒色ファイバーメッシュ35の電気的接触の可能性が軽減される他、黒色ファイバーメッシュ35を基板3から容易に剥離することが可能となる。 Further, the fibers 35a1, 35a2, 35b1, 35b2 constituting the black fiber mesh 35 of the second embodiment have a diameter half that of the black fiber mesh 5 of the first embodiment. Therefore, the gap 9 between the black fiber mesh 35 and the substrate 3 is secured to be larger by the diameter of one fiber 35a1, 35a2, 35b1, 35b2 as compared with the first embodiment. As a result, the possibility of electrical contact between the substrate 3 and the black fiber mesh 35 is reduced, and the black fiber mesh 35 can be easily peeled off from the substrate 3.
 実施の形態2の黒色ファイバーメッシュ35は、カーボンブラックが混錬された樹脂ファイバー製である。この場合、カーボンブラックは導電性を有するため、黒色ファイバーメッシュ35にアース線を接続することによって、不要輻射シールド効果が得られる上に、静電気がたまりにくく帯電防止効果が得られる。 The black fiber mesh 35 of the second embodiment is made of a resin fiber kneaded with carbon black. In this case, since carbon black has conductivity, by connecting the ground wire to the black fiber mesh 35, an unnecessary radiation shielding effect can be obtained, and static electricity is less likely to accumulate and an antistatic effect can be obtained.
 また、実施の形態2の黒色ファイバーメッシュ35を構成する樹脂は、透明粘着剤34と同一系統の樹脂であることが望ましい。これにより、透明粘着剤34と黒色ファイバーメッシュ35との界面における界面反射が抑制される。その結果、黒色ファイバーメッシュ35による外光吸収効果が高まり、外光コントラストの向上と視認性の向上が実現する。また、透明粘着剤34と黒色ファイバーメッシュ35との結合力が高まるため、これらを基板3から容易にかつ一体的に剥離することが可能となる。 Further, it is desirable that the resin constituting the black fiber mesh 35 of the second embodiment is a resin of the same system as the transparent adhesive 34. As a result, interfacial reflection at the interface between the transparent adhesive 34 and the black fiber mesh 35 is suppressed. As a result, the effect of absorbing external light by the black fiber mesh 35 is enhanced, and the contrast of external light is improved and the visibility is improved. Further, since the bonding force between the transparent adhesive 34 and the black fiber mesh 35 is enhanced, these can be easily and integrally peeled from the substrate 3.
 また、実施の形態2の黒色ファイバーメッシュ35が保護基材である透明基板31を備える場合、黒色ファイバーメッシュ35を構成する樹脂は、透明基板31および透明粘着剤34と同一系統の樹脂であることが望ましい。これにより、透明基板31と透明粘着剤34との界面、および透明粘着剤34と黒色ファイバーメッシュ35との界面における界面反射が抑制される。その結果、黒色ファイバーメッシュ35による外光吸収効果が高まり、外光コントラストの向上と視認性の向上が実現する。また、透明基板31、透明粘着剤34、および黒色ファイバーメッシュ35の結合力が高まるため、これらを基板3から容易にかつ一体的に剥離することが可能となる。 Further, when the black fiber mesh 35 of the second embodiment includes the transparent substrate 31 which is a protective base material, the resin constituting the black fiber mesh 35 is a resin of the same system as the transparent substrate 31 and the transparent adhesive 34. Is desirable. As a result, interfacial reflection at the interface between the transparent substrate 31 and the transparent pressure-sensitive adhesive 34 and the interface between the transparent pressure-sensitive adhesive 34 and the black fiber mesh 35 is suppressed. As a result, the effect of absorbing external light by the black fiber mesh 35 is enhanced, and the contrast of external light is improved and the visibility is improved. Further, since the binding force of the transparent substrate 31, the transparent adhesive 34, and the black fiber mesh 35 is increased, these can be easily and integrally peeled from the substrate 3.
 透明基板31と透明粘着剤34の少なくともいずれか一方には、例えば、透過率が約70%となるように黒色着色剤が添加されていてもよい。映像光は透明粘着剤34および透明基板31を1回だけ透過するのに対し、外光は透明基板31および透明粘着剤34を透過した後、透明粘着剤34とLED素子2または黒色ファイバーメッシュ35との界面で表面反射し、再度、透明粘着剤34および透明基板31を透過する。従って、再び表示パネル12の外部に取り出される外光は、透明基板31および透明粘着剤34における透過率の2乗以下に軽減される。その結果、実施の形態1の表示パネル11よりも外光コントラストが向上する。 For example, a black colorant may be added to at least one of the transparent substrate 31 and the transparent adhesive 34 so that the transmittance is about 70%. The image light passes through the transparent adhesive 34 and the transparent substrate 31 only once, whereas the external light passes through the transparent substrate 31 and the transparent adhesive 34, and then the transparent adhesive 34 and the LED element 2 or the black fiber mesh 35. The surface is reflected at the interface with the transparent adhesive 34 and the transparent substrate 31 is transmitted again. Therefore, the external light taken out to the outside of the display panel 12 is reduced to the square of the transmittance of the transparent substrate 31 and the transparent adhesive 34 or less. As a result, the external light contrast is improved as compared with the display panel 11 of the first embodiment.
 外光コントラスト向上率CIの概算値は、以下の式(2)-(4)により算出される。但し、表示パネル12の各LED素子2から出力される既定の白信号の映像光の輝度をW、既定の黒信号の映像光の輝度をB、表示パネル12に入射する外光の輝度をAとする。また、C1はLED表面保護構造がない場合の外光コントラストであり、C2はLED表面保護構造がある場合の外光コントラストである。RL1はLED素子2の表面反射率であり、R1は透明基板31の表面反射率である。RL2は透明基板31および透明粘着剤34とLED素子2との間の合成反射率であり、RFは透明基板31および透明粘着剤34と黒色ファイバーメッシュ35との間の合成反射率である。Xは表示パネル12に対するLED素子2の発光面積比である。Tは透明粘着剤34および透明基板31の合成光透過率である。 The approximate value of the external light contrast improvement rate CI is calculated by the following equations (2)-(4). However, the brightness of the video light of the default white signal output from each LED element 2 of the display panel 12 is W, the brightness of the video light of the default black signal is B, and the brightness of the external light incident on the display panel 12 is A. And. Further, C1 is the external light contrast when there is no LED surface protection structure, and C2 is the external light contrast when there is no LED surface protection structure. RL1 is the surface reflectance of the LED element 2, and R1 is the surface reflectance of the transparent substrate 31. RL2 is the synthetic reflectance between the transparent substrate 31 and the transparent adhesive 34 and the LED element 2, and RF is the synthetic reflectance between the transparent substrate 31 and the transparent adhesive 34 and the black fiber mesh 35. X is the light emitting area ratio of the LED element 2 to the display panel 12. T is the synthetic light transmittance of the transparent pressure-sensitive adhesive 34 and the transparent substrate 31.
Figure JPOXMLDOC01-appb-M000002
Figure JPOXMLDOC01-appb-M000002
 例えば、既定の白信号の映像光の輝度Wを1,000(cd/m)、既定の黒信号の映像光の輝度Bを0.1(cd/m)、表示パネル12に入射する外光の輝度Aを30(cd/m)とし、LED素子2の表面反射率RL1を10%、透明基板31および透明粘着剤34とLED素子2との間の合成反射率RL2を10%とし、透明基板31および透明粘着剤34と黒色ファイバーメッシュ35との間の合成反射率RFを5%とする。縦横1.0mmサイズのLED素子2を画素ピッチ1.5mmで実装すると、表示パネル12に対するLED素子2の発光面積比Xは約40%である。透明粘着剤34および透明基板31の合成光透過率Tは約70%である。従って、式(2)から式(4)により外光コントラストの改善効果CIは約2倍となり、外光コントラストが大幅に向上する。 For example, the brightness W of the video light of the default white signal is 1,000 (cd / m 2 ), the brightness B of the video light of the default black signal is 0.1 (cd / m 2 ), and the light is incident on the display panel 12. The brightness A of the external light is 30 (cd / m 2 ), the surface reflectance RL1 of the LED element 2 is 10%, and the combined reflectance RL2 between the transparent substrate 31 and the transparent adhesive 34 and the LED element 2 is 10%. The synthetic reflectance RF between the transparent substrate 31 and the transparent adhesive 34 and the black fiber mesh 35 is 5%. When the LED element 2 having a size of 1.0 mm in length and width is mounted with a pixel pitch of 1.5 mm, the light emitting area ratio X of the LED element 2 to the display panel 12 is about 40%. The synthetic light transmittance T of the transparent pressure-sensitive adhesive 34 and the transparent substrate 31 is about 70%. Therefore, according to the equations (2) to (4), the effect CI for improving the external light contrast is about doubled, and the external light contrast is significantly improved.
 なお、各実施の形態を自由に組み合わせたり、各実施の形態を適宜、変形、省略することが可能である。上記の説明は、すべての態様において、例示である。例示されていない無数の変形例が想定され得るものと解される。 It is possible to freely combine each embodiment, and to appropriately modify or omit each embodiment. The above description is exemplary in all embodiments. It is understood that innumerable variations not illustrated can be assumed.
 1,31 透明基板、2 LED素子、2r 赤色LED素子、2g 緑色LED素子、2b 青色LED素子、3 基板、4,34 透明粘着剤、5,35 黒色ファイバーメッシュ、6 封止樹脂、7 治具、8 LED基板、9 空隙、11,12 表示パネル、20 絶縁コーティング層、21 紫外線遮光コーティング層、22 軽剥離コーティング層、23 押圧ローラ、24 吸引口、25 アース線、101,102 表示装置。 1,31 transparent board, 2 LED element, 2r red LED element, 2g green LED element, 2b blue LED element, 3 board, 4,34 transparent adhesive, 5,35 black fiber mesh, 6 sealing resin, 7 jigs , 8 LED board, 9 voids, 11, 12 display panel, 20 insulation coating layer, 21 UV light shielding coating layer, 22 light peeling coating layer, 23 pressing roller, 24 suction port, 25 ground wire, 101, 102 display device.

Claims (13)

  1.  基板と、
     前記基板の上面に互いに離間して配置され、前記基板と反対側に光出射面を有する複数の発光素子と、
     前記複数の発光素子の間に嵌入されるファイバー製のブラックマトリクス層と、
     前記ブラックマトリクス層の上面に接し、前記複数の発光素子の前記光出射面側に形成され、透光性を有する粘着剤と、を備える、
    表示パネル。
    With the board
    A plurality of light emitting elements arranged on the upper surface of the substrate so as to be separated from each other and having a light emitting surface on the opposite side of the substrate.
    A black matrix layer made of fiber fitted between the plurality of light emitting elements, and
    A pressure-sensitive adhesive that is in contact with the upper surface of the black matrix layer, is formed on the light emitting surface side of the plurality of light emitting elements, and has translucency.
    Display panel.
  2.  前記透明粘着剤上に形成される、透光性を有する保護基材をさらに備える、
    請求項1に記載の表示パネル。
    Further comprising a translucent protective substrate formed on the transparent pressure-sensitive adhesive.
    The display panel according to claim 1.
  3.  前記ブラックマトリクス層は、前記基板の上面との間に空隙を有して配置される、
    請求項1または請求項2に記載の表示パネル。
    The black matrix layer is arranged with a gap between the black matrix layer and the upper surface of the substrate.
    The display panel according to claim 1 or 2.
  4.  前記複数の発光素子の各発光素子の側面および前記光出射面に設けられた軽剥離コーティング層をさらに備え、
     前記ブラックマトリクス層は前記軽剥離コーティング層を介して前記複数の発光素子の側面に接する、
    請求項1から請求項3のいずれか1項に記載の表示パネル。
    Further, a light peeling coating layer provided on the side surface of each light emitting element of the plurality of light emitting elements and the light emitting surface is provided.
    The black matrix layer is in contact with the side surface of the plurality of light emitting elements via the light release coating layer.
    The display panel according to any one of claims 1 to 3.
  5.  前記ブラックマトリクス層はカーボンファイバー製である、
    請求項1から請求項4のいずれか1項に記載の表示パネル。
    The black matrix layer is made of carbon fiber.
    The display panel according to any one of claims 1 to 4.
  6.  前記ブラックマトリクス層は樹脂ファイバー製である、
    請求項1から請求項4のいずれか1項に記載の表示パネル。
    The black matrix layer is made of resin fiber.
    The display panel according to any one of claims 1 to 4.
  7.  前記ブラックマトリクス層は、カーボンブラックが混錬された樹脂ファイバー製である、
    請求項6に記載の表示パネル。
    The black matrix layer is made of a resin fiber kneaded with carbon black.
    The display panel according to claim 6.
  8.  前記粘着剤は、前記ブラックマトリクス層と同一系統の樹脂からなる、
    請求項6または請求項7に記載の表示パネル。
    The pressure-sensitive adhesive is made of a resin of the same type as the black matrix layer.
    The display panel according to claim 6 or 7.
  9.  前記透明粘着剤上に形成される、透光性を有する保護基材をさらに備え、
     前記ブラックマトリクス層は樹脂ファイバー製であり、
     前記粘着剤および前記保護基材は、前記ブラックマトリクス層と同一系統の樹脂からなる、
    請求項1に記載の表示パネル。
    Further comprising a translucent protective substrate formed on the transparent pressure-sensitive adhesive.
    The black matrix layer is made of resin fiber and is made of resin fiber.
    The pressure-sensitive adhesive and the protective base material are made of a resin of the same type as the black matrix layer.
    The display panel according to claim 1.
  10.  前記ブラックマトリクス層は、複数の縦糸と複数の横糸とが1重に編み込まれた構成であり、
     各前記縦糸と各前記横糸とは、並んで配置された2本のファイバーからなる、
    請求項1から請求項9のいずれか1項に記載の表示パネル。
    The black matrix layer has a structure in which a plurality of warp threads and a plurality of weft threads are woven in a single layer.
    Each warp and weft consists of two fibers arranged side by side.
    The display panel according to any one of claims 1 to 9.
  11.  請求項1から請求項10のいずれか1項に記載の複数の表示パネルを備え、
     前記複数の表示パネルが配列して1つの画面を構成する、
    表示装置。
    The plurality of display panels according to any one of claims 1 to 10 are provided.
    The plurality of display panels are arranged to form one screen.
    Display device.
  12.  (a)同一面に複数の発光素子が互いに離間して実装された基板を用意し、
     (b)前記発光素子の間隙にファイバー製のブラックマトリクス層を嵌入し、
     (c)前記ブラックマトリクス層および前記発光素子の上に透光性を有する粘着剤を塗布し、
     (d)前記粘着剤上に透光性を有する保護基材を被せ、
     (e)前記ブラックマトリクス層を引き上げて前記粘着剤に圧着することにより、前記ブラックマトリクス層と前記基板との間に空隙を形成し、
     (f)前記工程(e)の後に前記粘着剤を硬化させる、
    表示パネルの製造方法。
    (A) Prepare a substrate on which a plurality of light emitting elements are mounted on the same surface so as to be separated from each other.
    (B) A fiber black matrix layer is fitted in the gap between the light emitting elements.
    (C) A light-transmitting pressure-sensitive adhesive is applied onto the black matrix layer and the light-emitting element.
    (D) The pressure-sensitive adhesive is covered with a translucent protective base material.
    (E) By pulling up the black matrix layer and pressing it against the pressure-sensitive adhesive, a gap is formed between the black matrix layer and the substrate.
    (F) After the step (e), the adhesive is cured.
    How to manufacture the display panel.
  13.  (g)前記工程(f)の後に前記保護基材を除去する、
    請求項12に記載の表示パネルの製造方法。
    (G) The protective substrate is removed after the step (f).
    The method for manufacturing a display panel according to claim 12.
PCT/JP2020/043442 2020-11-20 2020-11-20 Display panel, display device, and method for manufacturing display panel WO2022107321A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/043442 WO2022107321A1 (en) 2020-11-20 2020-11-20 Display panel, display device, and method for manufacturing display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/043442 WO2022107321A1 (en) 2020-11-20 2020-11-20 Display panel, display device, and method for manufacturing display panel

Publications (1)

Publication Number Publication Date
WO2022107321A1 true WO2022107321A1 (en) 2022-05-27

Family

ID=81708684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/043442 WO2022107321A1 (en) 2020-11-20 2020-11-20 Display panel, display device, and method for manufacturing display panel

Country Status (1)

Country Link
WO (1) WO2022107321A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218361A (en) * 2002-01-28 2003-07-31 Konica Corp Organic transistor element, active driving element and display medium comprising it
EP1369923A1 (en) * 2002-06-07 2003-12-10 CSEM Centre Suisse d'Electronique et de Microtechnique SA An optoelectronic device and a large-area array of optoelectronic pixels
JP2005093594A (en) * 2003-09-16 2005-04-07 Fuji Photo Film Co Ltd Light emitting device and its manufacturing method
US20050081913A1 (en) * 1999-04-30 2005-04-21 Thin Film Electronics Asa Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry
JP2009520214A (en) * 2005-11-14 2009-05-21 キリュスシェフ、イリナ Display module and tiled display manufacturing method
JP2013101396A (en) * 2009-02-09 2013-05-23 Hui Zhou Light Engine Ltd Light emitting diode optical array on mesh platform
JP2016168791A (en) * 2015-03-13 2016-09-23 三菱鉛筆株式会社 Functional film and electrophoretic display medium using the same
JP2016224466A (en) * 2008-11-18 2016-12-28 株式会社半導体エネルギー研究所 Method of manufacturing display device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050081913A1 (en) * 1999-04-30 2005-04-21 Thin Film Electronics Asa Apparatus comprising electronic and/or optoelectronic circuitry and method for realizing said circuitry
JP2003218361A (en) * 2002-01-28 2003-07-31 Konica Corp Organic transistor element, active driving element and display medium comprising it
EP1369923A1 (en) * 2002-06-07 2003-12-10 CSEM Centre Suisse d'Electronique et de Microtechnique SA An optoelectronic device and a large-area array of optoelectronic pixels
JP2005093594A (en) * 2003-09-16 2005-04-07 Fuji Photo Film Co Ltd Light emitting device and its manufacturing method
JP2009520214A (en) * 2005-11-14 2009-05-21 キリュスシェフ、イリナ Display module and tiled display manufacturing method
JP2016224466A (en) * 2008-11-18 2016-12-28 株式会社半導体エネルギー研究所 Method of manufacturing display device
JP2013101396A (en) * 2009-02-09 2013-05-23 Hui Zhou Light Engine Ltd Light emitting diode optical array on mesh platform
JP2016168791A (en) * 2015-03-13 2016-09-23 三菱鉛筆株式会社 Functional film and electrophoretic display medium using the same

Similar Documents

Publication Publication Date Title
JP4678256B2 (en) Surface light source device and color liquid crystal display device assembly
US11054871B2 (en) Display device including radiant heat blocking layer
US7119479B2 (en) Display panel device
JP6058351B2 (en) LIGHT SOURCE MODULE AND LIGHTING DEVICE HAVING THE SAME
JP5837775B2 (en) Semiconductor light emitting device
KR20130022074A (en) Light emitting module and backlight unit having the same
TW200950143A (en) Light source module, related light bar and related liquid crystal display
US20210333634A1 (en) Backlight module and display device having the backlight module
WO2018003027A1 (en) Display device and method for manufacturing display device
CN114093252A (en) Display device
US20230161194A1 (en) Light emitting device, backlight, and display panel
KR102479242B1 (en) Display device
WO2022107321A1 (en) Display panel, display device, and method for manufacturing display panel
CN111856812A (en) Surface light source module for backlight device and manufacturing method thereof
KR20130038065A (en) Light emitting device package and backlight unit having the same
CN114428421A (en) Display device
CN114488594A (en) Display device
CN215527753U (en) LED display module and LED display screen
KR20130024511A (en) Light emitting device package and lighting system
WO2021245830A1 (en) Display panel, display device, and method for manufacturing display panel
WO2012086623A1 (en) Light emitting element
JP6599128B2 (en) Display device
CN111856813A (en) Area light source module for backlight device
US11009744B2 (en) Front-lit reflective display
US20230395761A1 (en) Display apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20962483

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20962483

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP