WO2022104907A1 - Micro-space three-dimensional morphology measurement apparatus - Google Patents

Micro-space three-dimensional morphology measurement apparatus Download PDF

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WO2022104907A1
WO2022104907A1 PCT/CN2020/133055 CN2020133055W WO2022104907A1 WO 2022104907 A1 WO2022104907 A1 WO 2022104907A1 CN 2020133055 W CN2020133055 W CN 2020133055W WO 2022104907 A1 WO2022104907 A1 WO 2022104907A1
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laser
silicon
wires
light source
wire
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PCT/CN2020/133055
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French (fr)
Chinese (zh)
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黄海阳
赵瑛璇
仇超
盛振
甘甫烷
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中国科学院上海微系统与信息技术研究所
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Publication of WO2022104907A1 publication Critical patent/WO2022104907A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures

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  • the invention relates to the technical field of micro-nano photonic devices and micro-systems, in particular to a micro-space three-dimensional topography measuring device.
  • the existing three-dimensional topography measurement devices are based on various probe measurement principles and based on the laser triangulation measurement principle. At the same time, various technologies also have certain limitations.
  • the technical problem to be solved by the present invention is to provide a small space three-dimensional topography measuring device, which has the advantages of small size, high precision, non-contact and the like.
  • the technical solution adopted by the present invention to solve the technical problem is to provide a micro-space three-dimensional topography measurement device, which includes a light source assembly and at least two sets of detection assemblies, the detection assemblies include a substrate, and a substrate is fixed on the substrate.
  • the insulating layer is provided with several silicon wires that are parallel to each other and have the same shape and size, and the distances between adjacent silicon wires are equal.
  • the potentiometer is connected to the processor; the light source assembly scans the surface of the sample to be tested line by line through the laser, and when the laser reflected by the sample to be tested is irradiated on the detection assembly, a near field occurs between the silicon wire and the substrate.
  • the resonator formed by the silicon wire and the substrate completely suppresses the amplitude of the coupling effect, and the processor calculates the position information of the reflection point on the surface of the tested sample according to the continuous signal output by the potentiometer connected to the silicon wire.
  • the distance between the adjacent silicon wires is one fifth of the wavelength of the laser light emitted by the light source assembly.
  • the thickness of the insulating layer is 15-20 nm.
  • the insulating layer is a transparent aluminum oxide isolation layer.
  • the substrate is a silver matrix in the shape of a rectangular parallelepiped.
  • the light source assembly includes a laser and a polygonal prismatic mirror, and the laser light emitted by the laser is reflected by the polygonal prismatic mirror and then irradiates the sample to be tested.
  • the laser can swing left and right through the first rotating shaft; the polygonal prism-shaped polygon mirror can rotate through the second rotating shaft.
  • the present invention has the following advantages and positive effects due to the adoption of the above technical solutions: the present invention has the advantages of small size, high precision, and non-contact.
  • FIG. 1 is a schematic structural diagram of an embodiment of the present invention
  • FIG. 2 is a schematic diagram of the principle of laser detection based on non-Hermitian coupling specific frequency in an embodiment of the present invention
  • FIG. 3 is a schematic diagram of the principle of detecting the position of a point light source in an embodiment of the present invention.
  • Embodiments of the present invention relate to a small space three-dimensional topography measurement device, as shown in FIG. 1 , including a light source assembly and at least two sets of detection assemblies.
  • the detection component includes a substrate 11, and the substrate 11 is a silver matrix in the shape of a rectangular parallelepiped.
  • An insulating layer 12 is fixed on the substrate 11 , and the insulating layer 12 is a transparent aluminum oxide isolation layer.
  • the insulating layer 12 is provided with a plurality of silicon wires 13 that are parallel to each other and have the same shape and size, and the distance between adjacent silicon wires 13 is equal, and the distance is determined according to the wavelength of the laser used. Both ends of each silicon wire 13 lead out wires to be connected to a potentiometer, and the potentiometer is connected to the processor.
  • the light source assembly includes a laser 15 and a polygonal prismatic polygonal mirror 17 , and the laser light emitted by the laser 15 is reflected by the polygonal prismatic polygonal mirror 17 and then irradiates the sample to be tested 14 .
  • the laser 15 swings left and right through the first rotating shaft 16 ; the polygonal prism-shaped polygon mirror 17 rotates through the second rotating shaft 18 .
  • the main parameters of the micro-space three-dimensional topography measuring device in this embodiment are as follows: the cross section of a single silicon wire 13 is 60*100nm, the center distance is 145nm, the material of the substrate 11 is metallic silver, and the wavelength emitted by the laser 15 is 727nm.
  • the SOI wafer first use electron beam lithography to etch silicon nanowires, then use ALD process to deposit an aluminum oxide isolation layer (15-20nm), and then use electron beam evaporation, Deposition of silver substrates.
  • the light source wavelength is 727nm and the incident angle is 50°, complete suppression can be achieved.
  • the laser light emitted by the above-mentioned light source assembly can scan the surface of the sample 14 to be tested line by line.
  • the laser reflected by the sample 14 to be tested irradiates the detection assembly, a near field occurs between the silicon wire 13 and the substrate 11 .
  • the resonator formed by the silicon wire 13 and the substrate 11 can completely suppress the amplitude of the coupling effect, and the processor calculates the position information of the reflection point on the surface of the tested sample according to the continuous signal output by the potentiometer connected to the silicon wire.
  • 1 and 2 are parallel wires made of silicon material
  • L1 is a laser parallel beam that is vertically shot to wire 1 and wire 2 in space
  • L2 is a laser parallel beam L1 is projected on the plane of wire 1 and wire 2.
  • the obtained projection line, ⁇ is the incident angle (the acute angle between the laser parallel beam L1 and the normal of the plane where the wire 1 and wire 2 are located)
  • 7 is the transparent aluminum oxide isolation layer (insulating layer) with a certain thickness
  • 8 It is a silver backing.
  • the wire 1 and the wire 2 are fixed on the transparent aluminum oxide isolation layer 7
  • the transparent aluminum oxide isolation layer 7 is fixedly connected with the silver substrate 8 .
  • 3 and 4 are lead wires fixedly connected to both ends of lead 1 and lead 2
  • 5 and 6 are potentiometers, and the potential difference at both ends of lead 1 and lead 2 can be measured through lead lead 3 and lead lead 4 respectively.
  • the silicon wire When the laser irradiates a single silicon wire, the silicon wire is illuminated, and a potential difference is generated across the silicon wire.
  • the laser parallel beam L1 of a specific wavelength eg: the wavelength range of the light source is 700-750nm
  • the distance between the wire 1 and the wire 2 and the thickness of the aluminum oxide isolation layer 7 are appropriate (eg: the wire 1 and the wire 2)
  • the two parallel wires 1 and 2 and the silver substrate 8 in this case form a resonator together , under the irradiation of the laser parallel beam L1, a near-field coupling effect will occur between the wire 1, the wire 2 and the silver substrate 8.
  • the potential difference between the two ends of wire 1 and wire 2 is related to the incident angle ⁇ .
  • the incident angle ⁇ is a certain incident angle ⁇ 0 .
  • the potential difference between the two ends of the wire 1 tends to zero, while the potential difference between the two ends of the wire 2 which is far from the light source does not change significantly.
  • the laser incident angle ⁇ 0 at this position is called the coupling incident angle.
  • the light incident angle is the coupling incident angle ⁇ 0 according to the ratio of the potential difference between the two ends of the wire 1 and the wire 2: then when the light incident angle is the coupling incident angle ⁇ 0 , the two ends of the wire 1 and the wire 2
  • the potential difference ratio reaches an extreme value. According to this principle, the value of ⁇ 0 can be accurately measured.
  • FIG. 3 a point light source position detection principle is shown in Figure 3.
  • 1a is a plurality of identical parallel wire groups made of silicon material
  • 7a is a transparent aluminum oxide isolation layer with a certain thickness ( Insulation layer)
  • 8a is a silver substrate
  • the size of the wire group 1a, the isolation layer 7a and the silver substrate 8a are appropriately set so that the adjacent wires in the wire group 1a all meet the conditions for the occurrence of the above-mentioned non-Hermitian coupling phenomenon
  • a scattered light source that emits or reflects light of a specific wavelength, with ⁇ 0 being the coupled incidence angle.
  • the position of the light source can be obtained from the positions of the two dark wires in the wire group.
  • Set the rectangular coordinate system oxy In the rectangular coordinate system oxy, the seat of point A1 is marked as (x1, y1), the seat of point A2 is marked as (x2, y2), and the seat of light source S is marked as (x3, y3), Then the coordinates (x3, y3) of the light source S point can be obtained according to the coordinates of point A1 (x1, y1), the coordinates of point A2 (x2, y2) and ⁇ 0 : It can be seen that, based on this principle, since the laser scans the surface of the sample to be measured 14 line by line, the measuring device of this embodiment can measure the three-dimensional topography of the surface of the sample to be measured 14 .

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

A micro-space three-dimensional morphology measurement apparatus comprising a light source assembly and at least two detection assemblies, wherein the detection assemblies comprise substrates (8, 11), insulating layers (7, 12) are fixedly provided on the substrates (8, 11), a plurality of silicon wires (1, 2, 13) that are mutually parallel and have a same size and shape are arranged on the insulating layers (7, 12), and the distance between adjacent silicon wires (1, 2, 13) is the same, two ends of each silicon wire (1, 2, 13) both lead out wires (3, 4) and are connected to electrical potential measurement meters (5, 6), and the electrical potential measurement meters (5, 6) are connected to processors; the light source assembly performs line-by-line scanning on a surface of a measured sample (14) by means of laser light, and when laser light reflected by the measured sample (14) shines onto the detection assemblies, a near-field coupling effect occurs between the silicon wires (1, 2, 13) and the substrates (8, 11), and causes an amplitude of a resonator formed by the silicon wires (1, 2, 13) and the substrates (8, 11) to produce to be completely suppressed, and the processors calculate position information of a reflection point of the surface of the measured sample (14) according to continuous signals output by the electrical potential measurement meters (5, 6) connected to the silicon wires (1, 2, 13).

Description

一种微小空间三维形貌测量装置A micro-space three-dimensional topography measurement device 技术领域technical field
本发明涉及微纳光子器件及微系统技术领域,特别是涉及一种微小空间三维形貌测量装置。The invention relates to the technical field of micro-nano photonic devices and micro-systems, in particular to a micro-space three-dimensional topography measuring device.
背景技术Background technique
现有的三维形貌测量装置有基于各种探针测量原理的以及基于激光三角法测量原理等等,测量装置多为宏观尺度,微型化的三维形貌测量装置在技术上还存在很多困难,同时各种技术也都存在一定的局限性。The existing three-dimensional topography measurement devices are based on various probe measurement principles and based on the laser triangulation measurement principle. At the same time, various technologies also have certain limitations.
发明内容SUMMARY OF THE INVENTION
本发明所要解决的技术问题是提供一种微小空间三维形貌测量装置,具有体积小、精度高、非接触等优点。The technical problem to be solved by the present invention is to provide a small space three-dimensional topography measuring device, which has the advantages of small size, high precision, non-contact and the like.
本发明解决其技术问题所采用的技术方案是:提供一种微小空间三维形貌测量装置,包括光源组件和至少两组探测组件,所述探测组件包括衬底,所述衬底上固设有一层绝缘层,所述绝缘层上设置有若干根相互平行且形状尺寸相同的硅导线,且相邻的硅导线之间距离相等,每根硅导线两端均引出导线与电位测量计相连,所述电位测量计与处理器相连;所述光源组件通过激光对被测样品表面进行逐行扫描,被测样品反射的激光照射到所述探测组件上时,硅导线与衬底之间发生近场耦效应,并使得硅导线与衬底形成的谐振器产生振幅完全抑制,所述处理器根据与硅导线相连的电位测量计输出的连续信号计算出被测样品表面反光点的位置信息。The technical solution adopted by the present invention to solve the technical problem is to provide a micro-space three-dimensional topography measurement device, which includes a light source assembly and at least two sets of detection assemblies, the detection assemblies include a substrate, and a substrate is fixed on the substrate. The insulating layer is provided with several silicon wires that are parallel to each other and have the same shape and size, and the distances between adjacent silicon wires are equal. The potentiometer is connected to the processor; the light source assembly scans the surface of the sample to be tested line by line through the laser, and when the laser reflected by the sample to be tested is irradiated on the detection assembly, a near field occurs between the silicon wire and the substrate The resonator formed by the silicon wire and the substrate completely suppresses the amplitude of the coupling effect, and the processor calculates the position information of the reflection point on the surface of the tested sample according to the continuous signal output by the potentiometer connected to the silicon wire.
所述相邻的硅导线之间的距离为所述光源组件发出激光的波长的五分之一。The distance between the adjacent silicon wires is one fifth of the wavelength of the laser light emitted by the light source assembly.
所述绝缘层的厚度为15-20nm。The thickness of the insulating layer is 15-20 nm.
所述绝缘层为透明氧化铝隔离层。The insulating layer is a transparent aluminum oxide isolation layer.
所述衬底为长方体形状的银基体。The substrate is a silver matrix in the shape of a rectangular parallelepiped.
所述光源组件包括激光器和多棱柱状多面反射镜,所述激光器发出的激光经过所述多棱柱状多面反射镜反射后照射到所述被测样品。The light source assembly includes a laser and a polygonal prismatic mirror, and the laser light emitted by the laser is reflected by the polygonal prismatic mirror and then irradiates the sample to be tested.
所述激光器通过第一转轴实现左右摆动;所述多棱柱状多面反射镜通过第二转轴实现转动。The laser can swing left and right through the first rotating shaft; the polygonal prism-shaped polygon mirror can rotate through the second rotating shaft.
有益效果beneficial effect
由于采用了上述的技术方案,本发明与现有技术相比,具有以下的优点和积极效果:本发明具有体积小、精度高、非接触等优点。Compared with the prior art, the present invention has the following advantages and positive effects due to the adoption of the above technical solutions: the present invention has the advantages of small size, high precision, and non-contact.
附图说明Description of drawings
图1是本发明实施方式的结构示意图;1 is a schematic structural diagram of an embodiment of the present invention;
图2是本发明实施方式中基于非厄米耦合特定频率激光探测原理示意图;2 is a schematic diagram of the principle of laser detection based on non-Hermitian coupling specific frequency in an embodiment of the present invention;
图3是本发明实施方式中点光源位置探测原理示意图。FIG. 3 is a schematic diagram of the principle of detecting the position of a point light source in an embodiment of the present invention.
具体实施方式Detailed ways
下面结合具体实施例,进一步阐述本发明。应理解,这些实施例仅用于说明本发明而不用于限制本发明的范围。此外应理解,在阅读了本发明讲授的内容之后,本领域技术人员可以对本发明作各种改动或修改,这些等价形式同样落于本申请所附权利要求书所限定的范围。The present invention will be further described below in conjunction with specific embodiments. It should be understood that these examples are only used to illustrate the present invention and not to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.
本发明的实施方式涉及一种微小空间三维形貌测量装置,如图1所示,包括光源组件和至少两组探测组件。Embodiments of the present invention relate to a small space three-dimensional topography measurement device, as shown in FIG. 1 , including a light source assembly and at least two sets of detection assemblies.
其中,探测组件包括衬底11,该衬底11为长方体形状的银基体。所述衬底11上固设有一层绝缘层12,该绝缘层12为透明氧化铝隔离层。所述绝缘层12上设置有若干根相互平行且形状尺寸相同的硅导线13,且相邻的硅导线13之间距离相等,该距离根据所用激光波长确定。每根硅导线13两端均引出导线与电位测量计相连,所述电位测量计与处理器相连。Wherein, the detection component includes a substrate 11, and the substrate 11 is a silver matrix in the shape of a rectangular parallelepiped. An insulating layer 12 is fixed on the substrate 11 , and the insulating layer 12 is a transparent aluminum oxide isolation layer. The insulating layer 12 is provided with a plurality of silicon wires 13 that are parallel to each other and have the same shape and size, and the distance between adjacent silicon wires 13 is equal, and the distance is determined according to the wavelength of the laser used. Both ends of each silicon wire 13 lead out wires to be connected to a potentiometer, and the potentiometer is connected to the processor.
光源组件包括激光器15和多棱柱状多面反射镜17,所述激光器15发出的激光经过所述多棱柱状多面反射镜17反射后照射到所述被测样品14。其中,所述激光器15通过第一转轴16实现左右摆动;所述多棱柱状多面反射镜17通过第二转轴18实现转动。The light source assembly includes a laser 15 and a polygonal prismatic polygonal mirror 17 , and the laser light emitted by the laser 15 is reflected by the polygonal prismatic polygonal mirror 17 and then irradiates the sample to be tested 14 . The laser 15 swings left and right through the first rotating shaft 16 ; the polygonal prism-shaped polygon mirror 17 rotates through the second rotating shaft 18 .
本实施方式的微小空间三维形貌测量装置的主要参数如下:单根硅导线13的截面60*100nm,中心间距145nm,基体11材料为金属银,激光器15发出的波长为727nm。采用常规的微纳米加工工艺,在SOI片上,先用电子束光刻,刻蚀出硅纳米线,然后用ALD工艺沉积一层氧化铝隔离层(15-20nm),然后再用电子束蒸发,沉积银衬底。当光源波长727nm,入射角度为50°时,可达到完全抑制。The main parameters of the micro-space three-dimensional topography measuring device in this embodiment are as follows: the cross section of a single silicon wire 13 is 60*100nm, the center distance is 145nm, the material of the substrate 11 is metallic silver, and the wavelength emitted by the laser 15 is 727nm. Using conventional micro-nano processing technology, on the SOI wafer, first use electron beam lithography to etch silicon nanowires, then use ALD process to deposit an aluminum oxide isolation layer (15-20nm), and then use electron beam evaporation, Deposition of silver substrates. When the light source wavelength is 727nm and the incident angle is 50°, complete suppression can be achieved.
工作时,通过上述光源组件发出的激光能够对被测样品14表面进行逐行扫描,被测样品14反射的激光照射到所述探测组件上时,硅导线13与衬底11之间发生近场耦效应, 并使得硅导线13与衬底11形成的谐振器产生振幅完全抑制,所述处理器根据与硅导线相连的电位测量计输出的连续信号计算出被测样品表面反光点的位置信息。During operation, the laser light emitted by the above-mentioned light source assembly can scan the surface of the sample 14 to be tested line by line. When the laser reflected by the sample 14 to be tested irradiates the detection assembly, a near field occurs between the silicon wire 13 and the substrate 11 . The resonator formed by the silicon wire 13 and the substrate 11 can completely suppress the amplitude of the coupling effect, and the processor calculates the position information of the reflection point on the surface of the tested sample according to the continuous signal output by the potentiometer connected to the silicon wire.
本实施方式的测量原理是基于非厄米耦合特定频率激光探测原理实现的。图2中,1和2是硅材料制成的相互平行的导线,L1是空间垂直射向导线1和导线2的激光平行光束,L2是激光平行光束L1向导线1和导线2所在平面上投影得到的投影线,θ是入射角(激光平行光束L1与导线1和导线2所在平面的法线之间所夹的锐角),7是具有一定厚度的透明氧化铝隔离层(绝缘层),8是银衬底。导线1和导线2固连在透明氧化铝隔离层7上,透明氧化铝隔离层7与银衬底8固连。3和4是固连在导线1和导线2两端的引出导线,5和6是电位计,可以通过引出导线3和引出导线4分别测出导线1和导线2两端的电位差。The measurement principle of this embodiment is realized based on the non-Hermitian coupling specific frequency laser detection principle. In Fig. 2, 1 and 2 are parallel wires made of silicon material, L1 is a laser parallel beam that is vertically shot to wire 1 and wire 2 in space, and L2 is a laser parallel beam L1 is projected on the plane of wire 1 and wire 2. The obtained projection line, θ is the incident angle (the acute angle between the laser parallel beam L1 and the normal of the plane where the wire 1 and wire 2 are located), 7 is the transparent aluminum oxide isolation layer (insulating layer) with a certain thickness, 8 It is a silver backing. The wire 1 and the wire 2 are fixed on the transparent aluminum oxide isolation layer 7 , and the transparent aluminum oxide isolation layer 7 is fixedly connected with the silver substrate 8 . 3 and 4 are lead wires fixedly connected to both ends of lead 1 and lead 2, 5 and 6 are potentiometers, and the potential difference at both ends of lead 1 and lead 2 can be measured through lead lead 3 and lead lead 4 respectively.
当激光照射到单根硅导线时,硅导线会被照亮,同时硅导线两端产生电位差。在图2中,对于特定波长的激光平行光束L1(如:光源波长范围700-750nm),若导线1和导线2之间的距离以及氧化铝隔离层7厚度恰当(如:导线1和导线2之间的距离为光波长五分之一,氧化铝隔离层7厚度15-20nm)时,此种情况下的两个相互平行的导线1和导线2以及银衬底8一起构成了一个谐振器,在激光平行光束L1照射下,导线1、导线2与银衬底8之间会发生近场耦效应,此时导线1和导线2的亮度以及两端的电位差会发生改变。根据耦合模理论,导线1和导线2两端的电位差与入射角θ相关,特别是,通过精心设计参数,可以实现某一入射角度θ 0下,谐振器振幅完全抑制,即距离光源较近的导线1两端电位差趋向于零,而距离光源较远的导线2两端电位差没有明显变化,将该位置的激光入射角θ 0称为耦合入射角。为了提高检测灵敏度,可以根据导线1和导线2两端的电位差比值来判断光线入射角是否为耦合入射角θ 0:则当光线入射角为耦合入射角θ 0时,导线1和导线2两端的电位差比值达到极值。根据这个原理,可以精确测出θ 0的值。 When the laser irradiates a single silicon wire, the silicon wire is illuminated, and a potential difference is generated across the silicon wire. In Figure 2, for the laser parallel beam L1 of a specific wavelength (eg: the wavelength range of the light source is 700-750nm), if the distance between the wire 1 and the wire 2 and the thickness of the aluminum oxide isolation layer 7 are appropriate (eg: the wire 1 and the wire 2) When the distance between them is one-fifth of the wavelength of light, and the thickness of the alumina isolation layer 7 is 15-20 nm), the two parallel wires 1 and 2 and the silver substrate 8 in this case form a resonator together , under the irradiation of the laser parallel beam L1, a near-field coupling effect will occur between the wire 1, the wire 2 and the silver substrate 8. At this time, the brightness of the wire 1 and the wire 2 and the potential difference between the two ends will change. According to the coupled mode theory, the potential difference between the two ends of wire 1 and wire 2 is related to the incident angle θ. In particular, by carefully designing the parameters, it can be achieved that at a certain incident angle θ 0 , the resonator amplitude is completely suppressed, that is, the resonator is close to the light source. The potential difference between the two ends of the wire 1 tends to zero, while the potential difference between the two ends of the wire 2 which is far from the light source does not change significantly. The laser incident angle θ 0 at this position is called the coupling incident angle. In order to improve the detection sensitivity, it can be judged whether the light incident angle is the coupling incident angle θ 0 according to the ratio of the potential difference between the two ends of the wire 1 and the wire 2: then when the light incident angle is the coupling incident angle θ 0 , the two ends of the wire 1 and the wire 2 The potential difference ratio reaches an extreme value. According to this principle, the value of θ 0 can be accurately measured.
基于上述原理,一种点光源位置探测原理如图3所示,图中,1a是若干根相同的由硅材料制成的相互平行的导线组,7a是具有一定厚度的透明氧化铝隔离层(绝缘层),8a是银衬底,恰当设置导线组1a、隔离层7a以及银衬底8a的尺寸,使得导线组1a中相邻导线均符合上述非厄米耦合现象发生的条件;S是能够发出或反射特定波长光的散射光源,θ 0为耦合入射角。根据上述非厄米耦合特定频率激光探测原理,S点发出的光照射到导线组1a上时,被入射角为耦合入射角θ 0照射的2根导线A1和A2呈现暗色,其两端电位差接近于零。 Based on the above principle, a point light source position detection principle is shown in Figure 3. In the figure, 1a is a plurality of identical parallel wire groups made of silicon material, and 7a is a transparent aluminum oxide isolation layer with a certain thickness ( Insulation layer), 8a is a silver substrate, the size of the wire group 1a, the isolation layer 7a and the silver substrate 8a are appropriately set so that the adjacent wires in the wire group 1a all meet the conditions for the occurrence of the above-mentioned non-Hermitian coupling phenomenon; A scattered light source that emits or reflects light of a specific wavelength, with θ 0 being the coupled incidence angle. According to the above-mentioned non-Hermitian coupling specific frequency laser detection principle, when the light emitted by point S is irradiated on the wire group 1a, the two wires A1 and A2 irradiated by the incident angle of the coupling incident angle θ 0 appear dark, and the potential difference between their two ends close to zero.
根据导线组中的2根暗导线位置可求出光源位置。设置直角坐标系oxy,在直角坐标系oxy中,A1点的座标记为(x1,y1),A2点的座标记为(x2,y2),光源S点的座标记为 (x3,y3),则可根据A1点的座标(x1,y1)、A2点的座标(x2,y2)以及θ 0求出光源S点的座标(x3,y3):
Figure PCTCN2020133055-appb-000001
由此可见,基于该原理,由于激光逐行扫描被测样品14表面,故本实施方式的测量装置能够测量出被测样品14表面三维形貌。
The position of the light source can be obtained from the positions of the two dark wires in the wire group. Set the rectangular coordinate system oxy. In the rectangular coordinate system oxy, the seat of point A1 is marked as (x1, y1), the seat of point A2 is marked as (x2, y2), and the seat of light source S is marked as (x3, y3), Then the coordinates (x3, y3) of the light source S point can be obtained according to the coordinates of point A1 (x1, y1), the coordinates of point A2 (x2, y2) and θ 0 :
Figure PCTCN2020133055-appb-000001
It can be seen that, based on this principle, since the laser scans the surface of the sample to be measured 14 line by line, the measuring device of this embodiment can measure the three-dimensional topography of the surface of the sample to be measured 14 .

Claims (7)

  1. 一种微小空间三维形貌测量装置,包括光源组件和至少两组探测组件,其特征在于,所述探测组件包括衬底,所述衬底上固设有一层绝缘层,所述绝缘层上设置有若干根相互平行且形状尺寸相同的硅导线,且相邻的硅导线之间距离相等,每根硅导线两端均引出导线与电位测量计相连,所述电位测量计与处理器相连;所述光源组件通过激光对被测样品表面进行逐行扫描,被测样品反射的激光照射到所述探测组件上时,硅导线与衬底之间发生近场耦效应,并使得硅导线与衬底形成的谐振器产生振幅完全抑制,所述处理器根据与硅导线相连的电位测量计输出的连续信号计算出被测样品表面反光点的位置信息。A micro-space three-dimensional topography measurement device, comprising a light source component and at least two sets of detection components, characterized in that the detection component includes a substrate, an insulating layer is fixed on the substrate, and an insulating layer is arranged on the insulating layer There are several silicon wires that are parallel to each other and have the same shape and size, and the distances between adjacent silicon wires are equal, and both ends of each silicon wire are led out of wires and connected to a potentiometer, and the potentiometer is connected to the processor; The light source assembly scans the surface of the sample to be tested line by line with laser light. When the laser reflected by the sample to be tested is irradiated on the detection assembly, a near-field coupling effect occurs between the silicon wire and the substrate, and the silicon wire and the substrate are connected. The resulting resonator produces a complete suppression of the amplitude, and the processor calculates the positional information of the reflective spot on the surface of the sample under test from the continuous signal output from the potentiometer connected to the silicon wire.
  2. 根据权利要求1所述的微小空间三维形貌测量装置,其特征在于,所述相邻的硅导线之间的距离为所述光源组件发出激光的波长的五分之一。The device for measuring three-dimensional topography in tiny spaces according to claim 1, wherein the distance between the adjacent silicon wires is one-fifth of the wavelength of the laser light emitted by the light source assembly.
  3. 根据权利要求1所述的微小空间三维形貌测量装置,其特征在于,所述绝缘层的厚度为15-20nm。The device for measuring three-dimensional topography in tiny spaces according to claim 1, wherein the insulating layer has a thickness of 15-20 nm.
  4. 根据权利要求1所述的微小空间三维形貌测量装置,其特征在于,所述绝缘层为透明氧化铝隔离层。The device for measuring three-dimensional topography of tiny spaces according to claim 1, wherein the insulating layer is a transparent aluminum oxide insulating layer.
  5. 根据权利要求1所述的微小空间三维形貌测量装置,其特征在于,所述衬底为长方体形状的银基体。The device for measuring three-dimensional topography in tiny spaces according to claim 1, wherein the substrate is a silver matrix in the shape of a rectangular parallelepiped.
  6. 根据权利要求1所述的微小空间三维形貌测量装置,其特征在于,所述光源组件包括激光器和多棱柱状多面反射镜,所述激光器发出的激光经过所述多棱柱状多面反射镜反射后照射到所述被测样品。The device for measuring three-dimensional topography in a small space according to claim 1, wherein the light source component comprises a laser and a polygonal prismatic polygonal mirror, and the laser light emitted by the laser is reflected by the polygonal prismatic polygonal mirror. irradiate the sample to be tested.
  7. 根据权利要求6所述的微小空间三维形貌测量装置,其特征在于,所述激光器通过第一转轴实现左右摆动;所述多棱柱状多面反射镜通过第二转轴实现转动。The device for measuring three-dimensional topography in a small space according to claim 6, wherein the laser is swung left and right through a first rotation axis; the polygonal prism-shaped polygon mirror is rotated through a second rotation axis.
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