WO2022104686A1 - 超声波内窥镜系统及其超声换能器 - Google Patents

超声波内窥镜系统及其超声换能器 Download PDF

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Publication number
WO2022104686A1
WO2022104686A1 PCT/CN2020/130402 CN2020130402W WO2022104686A1 WO 2022104686 A1 WO2022104686 A1 WO 2022104686A1 CN 2020130402 W CN2020130402 W CN 2020130402W WO 2022104686 A1 WO2022104686 A1 WO 2022104686A1
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ultrasonic transducer
row
column
circuit board
electrodes
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English (en)
French (fr)
Inventor
马腾
黄继卿
张琪
谭清源
李永川
王丛知
肖杨
郑海荣
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Shenzhen Institute of Advanced Technology of CAS
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Shenzhen Institute of Advanced Technology of CAS
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Priority to PCT/CN2020/130402 priority Critical patent/WO2022104686A1/zh
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters

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  • the invention relates to the technical field of ultrasonic equipment, in particular to an ultrasonic endoscope system and an ultrasonic transducer thereof.
  • Endoscopic Ultrasonography System is a medical device that integrates ultrasound and endoscopy. After the endoscope enters the body cavity, tomography scan is performed on the internal organ wall or adjacent organs under the direct vision of the endoscope to obtain ultrasound images of the layers below the mucosa of the internal organ wall and surrounding adjacent organs, such as the mediastinum, pancreas, bile duct and It has great advantages in staging of gastrointestinal tumors and judging the nature of tumors originating from the intestinal wall.
  • the ultrasonic transducers of the ultrasonic endoscope system are mainly one-dimensional linear arrays, convex arrays and ring arrays.
  • the 3D image of the endoscope can be obtained by mechanical scanning of the 1D endoscopic ultrasound transducer, the endoscopic 3D imaging achieved by this method has a slow acquisition speed, poor resolution in the elevation direction, and is prone to displacement artifacts Impact.
  • the present invention provides an ultrasonic transducer to improve the imaging effect.
  • the present invention also provides an ultrasonic endoscope system.
  • the present invention provides the following technical solutions:
  • An ultrasonic transducer comprising:
  • a piezoelectric wafer for transmitting and receiving ultrasonic signals the piezoelectric wafer encloses a ring structure
  • the column circuit board has a plurality of column electrodes parallel to each other and independently arranged, and the electrode direction of the column electrodes is the axial direction of the ultrasonic transducer,
  • Each of the plurality of column electrodes has column electrode pads for welding with cables, and the plurality of column electrode pads are arranged on the side of the column circuit board close to the connection end of the ultrasonic transducer;
  • a row circuit board arranged on the other side of the piezoelectric wafer has a plurality of row electrodes parallel to each other and independently arranged, and the electrode direction of the row electrodes is the circumferential direction of the ultrasonic transducer direction, a plurality of the row electrodes all have row electrode pads for welding with cables, and a plurality of the row electrode pads are arranged on the side of the row circuit board close to the connection end of the ultrasonic transducer .
  • the column electrode pad area where the column circuit board is provided with a plurality of the column electrode pads and the row electrode pads where the row circuit board is provided with a plurality of the row electrode pads are welded. Disk region interleaving setting.
  • the positions of the plurality of the row electrode pads on the row circuit board are staggered and distributed.
  • the column circuit boards are arranged on the inner side of the piezoelectric wafer, and the row circuit boards are arranged on the outer side of the piezoelectric wafer.
  • the above ultrasonic transducer further includes a backing layer disposed on the inner side of the column circuit board.
  • the above ultrasonic transducer further includes a matching layer wrapped on the outside of the piezoelectric wafer, the column circuit board and the row circuit board.
  • the column circuit board is provided with a plurality of column electrode pad areas of the column electrode pads and the row circuit board is provided with a plurality of row electrode pads of the row electrode pads.
  • the disk area is not wrapped by the matching layer.
  • the number of the matching layers is two, which are the first matching layer and the second matching layer respectively;
  • the second matching layer is wrapped outside the first matching layer.
  • the piezoelectric wafer is made of a piezoelectric composite material.
  • the present invention also provides an ultrasonic endoscope system, comprising an ultrasonic transducer, wherein the ultrasonic transducer is the ultrasonic transducer according to any one of the above.
  • the electrode direction of the column electrodes is the axial direction of the ultrasonic transducer, therefore , after the column circuit board is arranged on one side of the piezoelectric wafer of the annular structure, a plurality of column electrodes are arranged along the circumferential array direction of the ultrasonic transducer; The electrode direction of the ultrasonic transducer is the circumferential direction of the ultrasonic transducer.
  • a plurality of row circuit boards are arranged along the elevation direction of the ultrasonic transducer. Since the plurality of column electrodes and the plurality of row electrodes are independent of each other, each of the plurality of column electrodes has a column electrode pad for welding with the cable, so that the plurality of column electrodes form an array element, and each of the plurality of row electrodes has The row electrode pads soldered to the cables make a plurality of row electrodes form a row array element. Therefore, during the working process, the size of the ultrasonic aperture in the circumferential array direction can be changed by controlling the number of column electrodes excited on the array element.
  • the number of row electrodes can change the size of the ultrasonic aperture in the elevation direction.
  • the row electrodes give electronic signals in the row direction of the piezoelectric wafer, so as to realize the operation of controlling the size of the ultrasonic aperture by two directions, and then obtain focusing fields of different depths, thereby obtaining Clear images at different depths, effectively improving the imaging effect.
  • the present invention also provides an ultrasonic endoscope system, comprising an ultrasonic transducer, and the ultrasonic transducer is any of the above-mentioned ultrasonic transducers. Since the above-mentioned ultrasonic transducer has the above-mentioned technical effect, the ultrasonic endoscope system having the above-mentioned ultrasonic transducer should also have the same technical effect, which will not be described one by one here.
  • FIG. 1 is a schematic structural diagram of an ultrasonic endoscope system according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of an ultrasonic transducer and a flexible tube portion provided by an embodiment of the present invention
  • FIG. 3 is an exploded schematic diagram of an ultrasonic transducer provided by an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a 1-3 piezoelectric composite material provided by an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a column circuit board provided by an embodiment of the present invention.
  • the invention discloses an ultrasonic transducer to improve the imaging effect.
  • the present invention also provides an ultrasonic endoscope system.
  • an embodiment of the present invention provides an ultrasonic transducer, which includes a piezoelectric wafer 102 , a column circuit board 103 and a row circuit board 104 .
  • the piezoelectric wafer 102 is used for transmitting and receiving ultrasonic signals, and the piezoelectric wafer 102 forms a ring-shaped structure;
  • the column circuit board 103 is arranged on one side of the piezoelectric wafer 102, and the column circuit board 103 has a plurality of column electrodes 1031 parallel to each other and independently arranged , the electrode direction of the column electrodes 1031 is the axial direction of the ultrasonic transducer, the plurality of column electrodes 1031 all have column electrode pads for welding with cables, and the plurality of column electrode pads are arranged on the column circuit board 103 close to One side of the connecting end of the ultrasonic transducer; the row circuit board 104 is arranged on the other side of the piezoelectric wafer 102, and the row circuit board 104 .
  • the electrode direction of the column electrodes 1031 is the axial direction of the ultrasonic transducer.
  • the circuit board 103 is arranged on one side of the piezoelectric wafer 102 of the annular structure, the plurality of column electrodes 1031 are arranged along the circumferential array direction a of the ultrasonic transducer 10; since the plurality of row electrodes 1041 on the row circuit board 104 are parallel to each other and independently arranged , the electrode direction of the row electrodes 1041 is the circumferential direction of the ultrasonic transducer.
  • each of the plurality of column electrodes 1031 and the plurality of row electrodes 1041 are independent of each other, each of the plurality of column electrodes 1031 has column electrode pads for welding with cables, so that the plurality of column electrodes 1031 form a column array element, and the plurality of row electrodes Each of the row electrodes 1041 has row electrode pads for soldering with cables, so that a plurality of row electrodes 1041 form a row array element.
  • the size of the ultrasonic aperture in the circumferential array direction a can be changed by controlling the number of the column electrodes 1031 excited on the array elements.
  • the number of row electrodes 1041 excited on the element can change the size of the ultrasonic aperture in the elevation direction b.
  • the row electrodes 1041 give the piezoelectric wafer 102 an electronic signal in the row direction, so as to realize the operation of controlling the size of the ultrasonic aperture by two directions, and then obtain Focusing fields of different depths, so as to obtain clear images of different depths, which effectively improves the imaging effect.
  • the ultrasonic transducer formed a two-dimensional torus array ultrasonic transducer.
  • the information from the affected area received by the ultrasonic transducer 10 is transmitted to the two-dimensional image generation system through the connected coaxial cable, and a two-dimensional image of the affected area is generated in real time, and a three-dimensional image can also be formed through subsequent processing.
  • tomography is performed on the internal organ wall or adjacent organs under the direct vision of the endoscope to obtain ultrasound images of the layers below the mucosa of the internal organ wall and surrounding adjacent organs.
  • the ultrasonic aperture is an area where the piezoelectric wafer 102 is deformed and vibrated.
  • the piezoelectric wafer 102 realizes the function of transmitting and receiving ultrasonic signals.
  • the cables can only be drawn out from the end face of the ultrasonic transducer 10 .
  • the electrode pads are all arranged on the side of the column circuit board 103 close to the connection end of the ultrasonic transducer, so as to facilitate the connection of the cable to the column electrode pad and the row electrode pad from the connection end of the ultrasonic transducer.
  • the connecting end of the ultrasonic transducer is the end connecting the ultrasonic transducer 10 and the flexible tube portion 11 .
  • the ultrasonic transducer 10 Since the ultrasonic transducer 10 needs to be inserted into the body from a restricted area such as the esophagus, the diameter of the entire ultrasonic transducer 10 is limited. Currently, ultrasound transducers 10 are typically less than 13 mm in diameter. Since the cables and the solder joints have a certain volume, it is necessary to weld and lead out a plurality of cables in a small space inside the ultrasonic transducer 10 (the cables correspond to a plurality of row electrode pads and a plurality of column electrode pads one-to-one). ) is very difficult. Therefore, as shown in FIG.
  • the column electrode pad area where the column circuit board 103 is provided with a plurality of column electrode pads and the row electrode pad area where the row circuit board 104 is provided with a plurality of row electrode pads are arranged alternately . That is, the row electrode pad area and the column electrode pad area are distinguished along the circumferential direction of the ultrasonic transducer, which effectively avoids the overlapping of the cables connected to the row electrode pads and the cables connected to the column electrode pads, reducing the It reduces the accumulation of solder joints, saves space, and meets the needs of wiring.
  • the positions of the plurality of column electrode pads on the column circuit board 103 are dislocated and distributed. Through the above settings, space is saved and the wiring requirements are met.
  • the positions of the plurality of row electrode pads on the row circuit board 104 are staggered and distributed. It also reduces the volume superposition of solder joints at the same horizontal position.
  • the positions of the plurality of row electrode pads on the row circuit board 104 may also be arranged at one end of the row circuit board 104 along a straight line.
  • a plurality of column electrode pads on the column circuit board 103 are arranged at one end of the column circuit board 103 along a straight line.
  • the column circuit boards 103 are arranged on the inner side of the piezoelectric wafer 102
  • the row circuit boards 104 are arranged on the outer side of the piezoelectric wafer 102 .
  • the curvature of the outer surface of the row circuit board 104 is smaller than the curvature of the inner surface of the piezoelectric wafer 102 .
  • the row circuit 1041 of the row circuit board 104 is arranged along the axis perpendicular to the ultrasonic transducer, thus reducing the bending amount of the row circuit 1041.
  • the column circuit boards 103 can also be arranged on the outer side of the piezoelectric wafer 102
  • the row circuit boards 104 can be arranged on the inner side of the piezoelectric wafer 102 .
  • the ultrasonic transducer provided by the embodiment of the present invention further includes a backing layer 101 disposed on the inner side of the column circuit board 103 .
  • the function of the backing layer 101 is to support, fix, absorb sound, reduce echo tailing, and increase the bandwidth. By arranging the backing layer 101, the detection accuracy is effectively improved.
  • the ultrasonic transducer provided by the embodiment of the present invention further includes a matching layer wrapped on the outside of the piezoelectric wafer 102 , the column circuit board 103 and the row circuit board 104 .
  • the matching layer realizes the matching and transition of the acoustic impedance, increases the transmittance between the piezoelectric wafer 102 and the measured object, and improves the sound transmission efficiency.
  • the column electrode pad area where a plurality of column electrode pads are arranged on the column circuit board 103 and the row electrode pad area where a plurality of row electrode pads are arranged on the row circuit board 104 are not wrapped by the matching layer . That is, the row electrode pad area and the column electrode pad area are exposed outside the matching layer, and the connection operation between the pad and the cable is not restricted by the matching layer.
  • the number of matching layers is two, which are the first matching layer 105 and the second matching layer 106 respectively; the second matching layer 106 is wrapped outside the first matching layer 105 .
  • the matching layer can be set as one layer, two layers or no matching layer according to the needs. Of course, more matching layers can also be set. It is not described in detail here and is within the scope of protection.
  • the matching layer realizes the matching and transition of the acoustic impedance, increases the transmittance between the piezoelectric wafer 102 and the measured object, and improves the sound transmission efficiency.
  • the piezoelectric wafer 102 is made of 1-3 piezoelectric composite materials.
  • the piezoelectric wafer 102 is made of 1-3 piezoelectric composite materials.
  • 1-3 piezoelectric composite material refers to a piezoelectric material (ceramic column) and a non-piezoelectric material (epoxy resin) combined together in a certain connection manner to form a new material with piezoelectric effect.
  • 1 of the 1-3 piezoelectric composite material means that the piezoelectric material (ceramic column) is connected in the Z direction, and 3 means that the non-piezoelectric material (epoxy) is connected in the X, Y and Z directions. All 3 directions are connected.
  • the advantage of the 1-3 piezoelectric composite material is that when heated to the glass temperature of the epoxy resin, the epoxy resin will become soft. At this time, the whole piece of material can be formed into an arc or a torus to improve the success rate.
  • the manufacturing process of the ultrasonic transducer provided by the present invention is as follows:
  • the first step making 1-3 piezoelectric composite materials
  • the second step set electrodes on both sides of the 1-3 piezoelectric composite material, and then divide the electrode surface into rows and columns;
  • the third step setting a matching layer on the outer surface of the row circuit board 104, the matching layer cannot cover the entire row circuit board 104, and the row electrode pad area is not covered by the matching layer;
  • the fourth step adhering and welding the column circuit board 103 and the column electrode 1031;
  • the fifth step toroidal forming the column circuit boards 103, 1-3 piezoelectric composite materials and the row circuit boards 104 as a whole;
  • the sixth step pouring a backing into the middle area of the annular shape to form a backing layer 101;
  • Step 7 Solder the cable wire to the pad and encapsulate it.
  • the present invention also provides an ultrasonic endoscope system, which includes an ultrasonic transducer 10, and the ultrasonic transducer 10 is any of the above-mentioned ultrasonic transducers. Since the above-mentioned ultrasonic transducer has the above-mentioned technical effect, the ultrasonic endoscope system having the above-mentioned ultrasonic transducer should also have the same technical effect, which will not be described one by one here.
  • the ultrasonic endoscope system provided by the present invention includes:
  • Ultrasonic transducer 10 as a component for transmitting and receiving ultrasonic signals
  • the flexible tube portion 11 has flexibility, and can maintain the curved shape after being bent under force;
  • the hose 12 can be bent and introduced along the pipeline to wrap the cables and functional pipelines;
  • the operating handle 13 and the left and right turning knobs 14 can control the left and right turning of the flexible tube portion 11, and the front and rear turning knobs 15 can control the forward and backward turning of the flexible tube portion 11;
  • Ultrasonic excitation system 20 for sending and receiving electrode electrical signals
  • the ultrasonic transducer 10 receives the row electrode electrical signal and the column electrode electrical signal given by the ultrasonic excitation system 20, and the row electrode electrical signal is transmitted to the piezoelectric wafer by the corresponding row electrode 1041 on the row circuit board 104.
  • the column electrode electrical signal is transmitted to the piezoelectric wafer 102 by the corresponding column electrode 1031 on the column circuit board 103, resulting in an inverse piezoelectric effect, and the piezoelectric wafer 102 is perpendicular to the electrode surfaces of the row circuit board 104 and the column circuit board 103. Vibrates and generates ultrasonic waves in both directions.
  • the outwardly propagating ultrasonic wave passes through the matching layer and reaches the object to be measured. After contacting the object to be measured, an echo is generated. The echo passes through the matching layer and reaches the piezoelectric wafer 102. At this time, a positive piezoelectric effect is generated, and the piezoelectric wafer 102.
  • the electrical signal is generated by the force, and the electrical signal is transmitted to the cable by the corresponding row electrodes 1041 on the row circuit board 104 and the corresponding column electrodes 1031 on the column circuit board 103, and then received and processed by the ultrasonic excitation system 20;
  • the backing layer 101 propagates, and the backing layer 101 absorbs this unwanted ultrasound, reducing interference.

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Abstract

本发明公开了一种超声波内窥镜系统及其超声换能器，超声换能器包括：用于发射及接收超声信号的压电晶片，压电晶片围成环形结构；设置于压电晶片一面的列电路板，列电路板上具有多个相互平行且独立设置的列电极，列电极的电极方向为超声换能器的轴向方向，多个列电极均具有用于与电缆线焊接的列电极焊盘，多个列电极焊盘均设置于列电路板靠近超声换能器的连接端的一侧；设置于压电晶片的另一面的行电路板，行电路板上具有多个相互平行且独立设置的行电极，行电极的电极方向为超声换能器的周向方向，多个行电极均具有用于与电缆线焊接的行电极焊盘，多个行电极焊盘均设置于行电路板靠近超声换能器的连接端的一侧。上述超声换能器，提高了成像效果。

Description

超声波内窥镜系统及其超声换能器 技术领域
本发明涉及超声波设备技术领域，特别涉及一种超声波内窥镜系统及其超声换能器。
背景技术
超声波内窥镜(Endoscopic Ultrasonography System，EUS)是一种集超声波与内镜检查为一身的医疗设备。当内镜进入体腔后，在内镜直视下对内脏器官壁或邻近脏器进行断层扫描，获得内脏器官壁黏膜以下各层次和周围邻近脏器的超声图像，如纵膈、胰腺、胆管及淋巴结等，它在胃肠道肿瘤的分期及判断肠壁起源肿瘤的性质方面具有极大的优势。
目前，超声波内窥镜系统的超声换能器主要是一维的线阵、凸阵以及环阵。尽管通过一维内窥超声换能器的机械扫描可以获得内窥的三维图像，但通过这种方法实现的内窥三维成像采集速度较慢，仰角方向分辨率很差，而且容易受到位移伪影的影响。
因此，如何提高成像效果，是本技术领域人员亟待解决的问题。
发明内容
有鉴于此，本发明提供了一种超声换能器，以提高成像效果。本发明还提供了一种超声波内窥镜系统。
为实现上述目的，本发明提供如下技术方案：
一种超声换能器，包括：
用于发射及接收超声信号的压电晶片，所述压电晶片围成环形结构；
设置于所述压电晶片一面的列电路板，所述列电路板上具有多个相互平行且独立设置的列电极，所述列电极的电极方向为所述超声换能器的轴向方向， 多个所述列电极均具有用于与电缆线焊接的列电极焊盘，多个所述列电极焊盘均设置于所述列电路板靠近所述超声换能器的连接端的一侧；
设置于所述压电晶片的另一面的行电路板，所述行电路板上具有多个相互平行且独立设置的行电极，所述行电极的电极方向为所述超声换能器的周向方向，多个所述行电极均具有用于与电缆线焊接的行电极焊盘，多个所述行电极焊盘均设置于所述行电路板靠近所述超声换能器的连接端的一侧。
可选地，上述超声换能器中，所述列电路板设置多个所述列电极焊盘的列电极焊盘区域与所述行电路板设置多个所述行电极焊盘的行电极焊盘区域交错设置。
可选地，上述超声换能器中，所述列电路板上的多个所述列电极焊盘的位置错位分布；
和/或，所述行电路板上的多个所述行电极焊盘的位置错位分布。
可选地，上述超声换能器中，所述列电路板设置于所述压电晶片的内侧面，所述行电路板设置于所述压电晶片的外侧面。
可选地，上述超声换能器中，还包括设置于所述列电路板内侧的背衬层。
可选地，上述超声换能器中，还包括包裹于所述压电晶片、所述列电路板及所述行电路板外侧的匹配层。
可选地，上述超声换能器中，所述列电路板设置多个所述列电极焊盘的列电极焊盘区域及所述行电路板设置多个所述行电极焊盘的行电极焊盘区域未被所述匹配层包裹。
可选地，上述超声换能器中，所述匹配层的数量为两层，分别为第一匹配层及第二匹配层；
所述第二匹配层包裹于所述第一匹配层外侧。
可选地，上述超声换能器中，所述压电晶片由-压电复合材料制作而成。
本发明还提供了一种超声波内窥镜系统，包括超声换能器，所述超声换能器为如上述任一项所述的超声换能器。
从上述的技术方案可以看出，本发明提供的超声换能器，由于列电路板上的多个列电极相互平行且独立设置，列电极的电极方向为超声换能器的轴向方 向，因此，在将列电路板设置于环形结构的压电晶片一面后，多个列电极沿超声换能器的圆周阵列方向排列；由于行电路板上的多个行电极相互平行且独立设置，行电极的电极方向为超声换能器的周向方向，因此，在将行电路板设置于环形结构的压电晶片另一面后，多个行电路板沿超声换能器的仰角(Elevtion)方向排列。由于多个列电极及多个行电极均相互独立，多个列电极均具有用于与电缆线焊接的列电极焊盘，使得多个列电极形成列阵元，多个行电极均具有用于与电缆线焊接的行电极焊盘，使得多个行电极形成行阵元。因此，在工作过程中，通过控制列阵元上激励的列电极的数量可以改变超声波孔径在圆周阵列方向的尺寸，列电极给予压电晶片列方向的电子信号，通过控制行阵元上激励的行电极的数量可以改变超声波孔径在仰角方向的尺寸，行电极给予压电晶片行方向的电子信号，从而实现由两个方向控制超声波孔径的尺寸的操作，进而获得不同深度的聚焦场，从而获得不同深度的清晰图像，有效提高了成像效果。
本发明还提供了一种超声波内窥镜系统，包括超声换能器，超声换能器为如上述任一种超声换能器。由于上述超声换能器具有上述技术效果，具有上述超声换能器的超声波内窥镜系统也应具有同样地技术效果，在此不再一一累述。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的超声波内窥镜系统的结构示意图；
图2为本发明实施例提供的超声换能器与挠管部的结构示意图；
图3为本发明实施例提供的超声换能器的爆炸示意图；
图4为本发明实施例提供的1-3压电复合材料的结构示意图；
图5为本发明实施例提供的列电路板的结构示意图。
具体实施方式
本发明公开了一种超声换能器，以提高成像效果。本发明还提供了一种超声波内窥镜系统。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1-图5所示，本发明实施例提供了一种超声换能器，包括压电晶片102、列电路板103及行电路板104。压电晶片102用于发射及接收超声信号，压电晶片102围成环形结构；列电路板103设置于压电晶片102一面，列电路板103上具有多个相互平行且独立设置的列电极1031，列电极1031的电极方向为超声换能器的轴向方向，多个列电极1031均具有用于与电缆线焊接的列电极焊盘，多个列电极焊盘均设置于列电路板103靠近超声换能器的连接端的一侧；行电路板104设置于压电晶片102的另一面，行电路板104上具有多个相互平行且独立设置的行电极1041，行电极1041的电极方向为超声换能器的周向方向，多个行电极1041均具有用于与电缆线焊接的行电极焊盘，多个行电极焊盘均设置于行电路板104靠近超声换能器的连接端的一侧。
本发明实施例提供的超声换能器，由于列电路板103上的多个列电极1031相互平行且独立设置，列电极1031的电极方向为超声换能器的轴向方向，因此，在将列电路板103设置于环形结构的压电晶片102一面后，多个列电极1031沿超声换能器10的圆周阵列方向a排列；由于行电路板104上的多个行电极1041相互平行且独立设置，行电极1041的电极方向为超声换能器的周向方向，因此，在将行电路板104设置于环形结构的压电晶片102另一面后，多个行电路板104沿超声换能器10的仰角(Elevation)方向b排列。由于多个列电极1031及多个行电极1041均相互独立，多个列电极1031均具有用于与电缆线焊接的列电极焊盘，使得多个列电极1031形成列阵元，多个行电极1041 均具有用于与电缆线焊接的行电极焊盘，使得多个行电极1041形成行阵元。因此，在工作过程中，通过控制列阵元上激励的列电极1031的数量可以改变超声波孔径在圆周阵列方向a的尺寸，列电极1031给予压电晶片102列方向的电子信号，通过控制行阵元上激励的行电极1041的数量可以改变超声波孔径在仰角方向b的尺寸，行电极1041给予压电晶片102行方向的电子信号，从而实现由两个方向控制超声波孔径的尺寸的操作，进而获得不同深度的聚焦场，从而获得不同深度的清晰图像，有效提高了成像效果。
通过上述设置，使得本发明实施例提供的超声换能器形成二维环面阵超声换能器。超声换能器10接收到的来自患处的信息通过接入的同轴电缆传到二维图像生成系统，实时产生患处的二维图像，亦可以通过后续处理形成三维图像，当内窥镜进入体腔后，在内窥镜直视下对内脏器官壁或邻近脏器进行断层扫描，获得内脏器官壁黏膜以下各层次和周围邻近脏器的超声图像。
超声波孔径为压电晶片102发生形变病产生振动的区域。压电晶片102实现了发射和接收超声信号的作用。
可以理解的是，由于内窥镜(超声换能器10)的工作环境的特殊性，电缆线只能从超声换能器10的端面引出，因此，将多个列电极焊盘及多个行电极焊盘均设置于列电路板103靠近超声换能器的连接端的一侧，方便将电缆线由超声换能器的连接端与列电极焊盘及行电极焊盘连接。
本实施例中，超声换能器的连接端即为超声换能器10与挠管部11连接的一端。
由于超声换能器10需要从食道等受限区域插入体内，因此整个超声换能器10的直径受限。目前，超声换能器10的直径通常小于13mm。由于电缆线及焊点均有一定体积，要在超声换能器10内部的狭小空间内焊接并引出多个电缆线(电缆线与多个行电极焊盘及多个列电极焊盘一一对应)是十分困难的。因此，如图3所示，本实施例中的列电路板103设置多个列电极焊盘的列电极焊盘区域与行电路板104设置多个行电极焊盘的行电极焊盘区域交错设置。即，沿超声换能器的周向方向区分行电极焊盘区域及列电极焊盘区域，有效避免了与行电极焊盘连接的电缆线和与列电极焊盘连接的电缆线相互叠加，减少 了焊点堆积情况，节省了空间，满足了排线需求。
进一步地，为了进一步减少焊点在同一水平位置的体积叠加，如图5所示，列电路板103上的多个列电极焊盘的位置错位分布。通过上述设置，节省空间，满足排线需求。
同上，行电路板104上的多个行电极焊盘的位置错位分布。同样减少焊点在同一水平位置的体积叠加。
当然，也可以将行电路板104上的多个行电极焊盘的位置沿直线排列于行电路板104的一端。或者，将列电路板103上的多个列电极焊盘沿直线排列于列电路板103的一端。
优选地，列电路板103设置于压电晶片102的内侧面，行电路板104设置于压电晶片102的外侧面。其中，行电路板104的外侧面的弯曲度小于压电晶片102的内侧面的弯曲度。通过将列电路板103设置于压电晶片102的内侧面，列电路板103的列电极1031沿平行于超声换能器的轴线设置，因此，列电极1031在其延伸方向上不需要弯曲。通过将行电路板104设置于压电晶片102的外侧面，行电路板104的行电路1041沿垂直于超声换能器的轴线设置，因此，减低了行电路1041的弯曲量。
当然，也可以将列电路板103设置于压电晶片102的外侧面，行电路板104设置于压电晶片102的内侧面。
本发明实施例提供的超声换能器，还包括设置于列电路板103内侧的背衬层101。背衬层101的作用是支撑、固定及吸声减震，减小回波拖尾，增加带宽。通过设置背衬层101，有效提高了检测准确度。
本发明实施例提供的超声换能器，还包括包裹于压电晶片102、列电路板103及行电路板104外侧的匹配层。匹配层实现了声阻抗的匹配和过渡，增大压电晶片102与被测物体之间的透射率，提高声传播效率。
为了便于焊盘与电缆线的连接，列电路板103设置多个列电极焊盘的列电极焊盘区域及行电路板104设置多个行电极焊盘的行电极焊盘区域未被匹配层包裹。即，行电极焊盘区域及列电极焊盘区域裸露在匹配层外部，焊盘与电缆线的连接操作不受匹配层的限制。
本实施例中，匹配层的数量为两层，分别为第一匹配层105及第二匹配层106；第二匹配层106包裹于第一匹配层105外侧。
匹配层可以根据需要设置一层、二层或者不要匹配层。当然，也可以设置更多层匹配层。在此不再详细说明且均在保护范围之内。匹配层实现声阻抗的匹配和过渡，增大压电晶片102与被测物体之间的透射率，提高声传播效率。
为了方便将压电晶片102围成环形解雇，压电晶片102由1-3压电复合材料制作而成。压电晶片102作为超声换能器的核心部件，采用1-3压电复合材料制作而成。本实施例中，1-3压电复合材料是指压电材料(陶瓷柱)与非压电材料(环氧树脂)按照一定的连通方式组合在一起构成一种具有压电效应的新材料。如图4所示，1-3压电复合材料的1是指压电材料(陶瓷柱)在Z方向是连通的，3是指非压电材料(环氧树脂)在X、Y和Z这3个方向都是连通的。1-3压电复合材料的优点在于，在加热至环氧树脂玻璃态温度时，环氧树脂会变软，此时再将整片材料做弧面或者环面成型可以提高成功率。
本发明提供的超声换能器制作过程如下：
第一步：制作1-3压电复合材料；
第二步：在1-3压电复合材料的两面设置电极，再将电极面分行和列划分开；
第三步：在行电路板104的外表面设置匹配层，匹配层不能将行电路板104全部覆盖，行电极焊盘区域未被匹配层覆盖；
第四步：将列电路板103与列电极1031粘连并焊接；
第五步：把列电路板103、1-3压电复合材料及行电路板104整体进行环面成形；
第六步：向环面成形的中间区域灌入背衬形成背衬层101；
第七步：向焊盘焊接电缆线并封装。
本发明还提供了一种超声波内窥镜系统，包括超声换能器10，超声换能器10为如上述任一种超声换能器。由于上述超声换能器具有上述技术效果，具有上述超声换能器的超声波内窥镜系统也应具有同样地技术效果，在此不再一一累述。
本发明提供的超声波内窥镜系统，包括：
超声换能器10，作为发射和接收超声信号部件；
挠管部11，具有挠性，受力弯曲后可保持弯曲形态；
软管12，可以顺管道弯曲导入，包裹电缆线及功能管道；
操作手柄13及左右转弯旋钮14，可以控制挠管部11左右转弯，前后转弯旋钮15，可控制挠管部11前后转弯；
超声激励系统20，用于发出及接收电极电信号；
计算机系统30。
超声波内窥镜系统的工作中，超声换能器10接收超声激励系统20给予行电极电信号及列电极电信号，行电极电信号由行电路板104上对应的行电极1041传递至压电晶片102，列电极电信号由列电路板103上对应的列电极1031传递至压电晶片102，产生逆压电效应，压电晶片102垂直于行电路板104及列电路板103的电极面发生形变振动，并在两个方向上产生超声波。向外传播的超声波穿过匹配层后达到被测物体，接触被测物后会产生回波，回波透过匹配层后到达压电晶片102，此时产生正压电效应，压电晶片102受力产生电信号，电信号由行电路板104上对应的行电极1041及列电路板103上对应的列电极1031传递至电缆线，之后由超声激励系统20接收处理；向内传播的超声波向背衬层101传播，背衬层101将此不需要的超声吸收，减少干扰。
本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (10)

  1. 一种超声换能器，其特征在于，包括：
    用于发射及接收超声信号的压电晶片(102)，所述压电晶片(102)围成环形结构；
    设置于所述压电晶片(102)一面的列电路板(103)，所述列电路板(103)上具有多个相互平行且独立设置的列电极(1031)，所述列电极(1031)的电极方向为所述超声换能器的轴向方向，多个所述列电极(1031)均具有用于与电缆线焊接的列电极焊盘，多个所述列电极焊盘均设置于所述列电路板(103)靠近所述超声换能器的连接端的一侧；
    设置于所述压电晶片(102)的另一面的行电路板(104)，所述行电路板(104)上具有多个相互平行且独立设置的行电极(1041)，所述行电极(1041)的电极方向为所述超声换能器的周向方向，多个所述行电极(1041)均具有用于与电缆线焊接的行电极焊盘，多个所述行电极焊盘均设置于所述行电路板(104)靠近所述超声换能器的连接端的一侧。
  2. 如权利要求1所述的超声换能器，其特征在于，所述列电路板(103)设置多个所述列电极焊盘的列电极焊盘区域与所述行电路板(104)设置多个所述行电极焊盘的行电极焊盘区域交错设置。
  3. 如权利要求1所述的超声换能器，其特征在于，所述列电路板(103)上的多个所述列电极焊盘的位置错位分布；
    和/或，所述行电路板(104)上的多个所述行电极焊盘的位置错位分布。
  4. 如权利要求1所述的超声换能器，其特征在于，所述列电路板(103)设置于所述压电晶片(102)的内侧面，所述行电路板(104)设置于所述压电晶片(102)的外侧面。
  5. 如权利要求4所述的超声换能器，其特征在于，还包括设置于所述列电路板(103)内侧的背衬层(101)。
  6. 如权利要求1所述的超声换能器，其特征在于，还包括包裹于所述压电晶片(102)、所述列电路板(103)及所述行电路板(104)外侧的匹配层。
  7. 如权利要求6所述的超声换能器，其特征在于，所述列电路板(103)设置多个所述列电极焊盘的列电极焊盘区域及所述行电路板(104)设置多个所述行电极焊盘的行电极焊盘区域未被所述匹配层包裹。
  8. 如权利要求6所述的超声换能器，其特征在于，所述匹配层的数量为两层，分别为第一匹配层(105)及第二匹配层(106)；
    所述第二匹配层(106)包裹于所述第一匹配层(105)外侧。
  9. 如权利要求1-8任一项所述的超声换能器，其特征在于，所述压电晶片(102)由1-3压电复合材料制作而成。
  10. 一种超声波内窥镜系统，包括超声换能器，其特征在于，所述超声换能器为如权利要求1-9任一项所述的超声换能器。
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CN110368032A (zh) * 2019-07-26 2019-10-25 深圳先进技术研究院 一种超声波内窥镜探头及超声波内窥镜系统

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