WO2022104683A1 - Transducteur à ultrasons de type réseau et procédé de fabrication associé - Google Patents

Transducteur à ultrasons de type réseau et procédé de fabrication associé Download PDF

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Publication number
WO2022104683A1
WO2022104683A1 PCT/CN2020/130397 CN2020130397W WO2022104683A1 WO 2022104683 A1 WO2022104683 A1 WO 2022104683A1 CN 2020130397 W CN2020130397 W CN 2020130397W WO 2022104683 A1 WO2022104683 A1 WO 2022104683A1
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Prior art keywords
layer
acoustic
ultrasonic transducer
impedance matching
backing layer
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PCT/CN2020/130397
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English (en)
Chinese (zh)
Inventor
马腾
张琪
黄继卿
李永川
郑海荣
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深圳先进技术研究院
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Priority to PCT/CN2020/130397 priority Critical patent/WO2022104683A1/fr
Publication of WO2022104683A1 publication Critical patent/WO2022104683A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction

Definitions

  • the invention relates to the technical field of ultrasonic transducers, and more particularly, to an array type ultrasonic transducer and a manufacturing method thereof.
  • acoustic metamaterials are composed of sub-wavelength-scale structural units (or artificial "atoms"), which can exhibit equivalent material parameters that natural materials do not possess, such as negative mass density, Negative elastic modulus, near-zero refractive index and extreme anisotropy, etc.
  • the macroscopic physical properties of acoustic metamaterials mainly depend on the local properties of their structural units rather than the long-range interactions between them. This enables us to design macroscopic material parameters on demand at the "atomic" scale, and more easily construct spatial gradient distributions, thereby enabling anomalous manipulation of acoustic waves.
  • the performance of existing ultrasonic transducer devices has yet to be improved.
  • the present invention provides an array ultrasonic transducer and a manufacturing method thereof, which effectively solve the technical problems existing in the prior art, and the array ultrasonic transducer provided by the present invention has high performance.
  • An array type ultrasonic transducer comprising a plurality of ultrasonic transducer units arranged in an array, the ultrasonic transducer units comprising:
  • the circuit layer is exposed on one side of the backing layer
  • an acoustic artificial structure located on the side of the piezoelectric layer away from the backing layer, the acoustic artificial structure comprising: an acoustic impedance matching layer and an acoustic metasurface; wherein, the acoustic metasurface is located on the acoustic metasurface Between the impedance matching layer and the piezoelectric layer, or the acoustic metasurface is located on the side of the acoustic impedance matching layer away from the backing layer.
  • the acoustic impedance matching layer includes a first acoustic impedance matching sub-layer to an N-th acoustic impedance matching sub-layer that are sequentially superimposed along the direction from the backing layer to the piezoelectric layer, where N is greater than or equal to 1. Integer.
  • the acoustic metasurface includes a circular center portion and a first annular portion to an M-th annular portion, where M is an integer greater than or equal to 1; the first annular portion surrounds the circular center part, the i+1 th annular part surrounds the i th annular part, between the first annular part and the circular center part and between the i+1 th annular part and the i th annular part All are in the shape of annular grooves, and i is an integer greater than or equal to 1 and less than M;
  • the acoustic metasurface comprises arranging a plurality of strips side by side, at least one strip having a height different from the rest of the strips in the direction from the backing layer to the piezoelectric layer, and/ Or, in the arrangement direction of the plurality of strip-shaped parts, the width of at least one strip-shaped part is different from the width of the other strip-shaped parts, and/or the side of the strip-shaped part facing away from the backing layer is wedge-shaped, And/or, the strip part is a hollow strip part, and/or, the material of at least one strip part is different from the material of the other strip parts;
  • the side of the acoustic metasurface facing away from the backing layer is a wavy surface.
  • the material of the acoustic impedance matching layer is a polymer material or a metal material.
  • the material of the acoustic metasurface is a polymer material.
  • the piezoelectric layer body is made of piezoelectric ceramic, piezoelectric ceramic composite material, pressure point single crystal material or piezoelectric single crystal composite material.
  • the material of the backing layer includes epoxy resin, and the material of the backing layer further includes at least one of tungsten powder and alumina powder.
  • the plurality of ultrasonic transducer units are arranged in a matrix.
  • the present invention also provides a manufacturing method of an array ultrasonic transducer, wherein the array ultrasonic transducer includes a plurality of ultrasonic transducer units arranged in an array, and the fabrication method of the ultrasonic transducer unit:
  • a piezoelectric layer is formed on the side of the backing layer with the circuit layer, the piezoelectric layer includes a piezoelectric layer body, and a surface of the piezoelectric layer body on the side facing the backing layer and away from the backing layer is formed. an electrode on one side surface of the backing layer;
  • the acoustic artificial structure includes: an acoustic impedance matching layer and an acoustic metasurface grown by a forward growth process; wherein, the acoustic ultrasound The textured surface is located between the acoustic impedance matching layer and the piezoelectric layer, or the acoustic metasurface is located on the side of the acoustic impedance matching layer away from the backing layer.
  • the acoustic impedance matching layer grown by the forward growth process includes:
  • the acoustic impedance matching layer is grown by a thermal evaporation coating process or a magnetron sputtering process.
  • the technical solution provided by the present invention has at least the following advantages:
  • the invention provides an array type ultrasonic transducer and a manufacturing method thereof, comprising a plurality of ultrasonic transducer units arranged in an array, wherein the ultrasonic transducer unit comprises: a backing layer, and one side surface of the backing layer is exposed circuit layer; a piezoelectric layer located on the side of the backing layer with the circuit layer, the piezoelectric layer includes a piezoelectric layer body, and a surface located on the side of the piezoelectric layer body facing the backing layer and an electrode facing away from the side surface of the backing layer; and an acoustic artificial structure located on the side of the piezoelectric layer facing away from the backing layer, the acoustic artificial structure comprising: an acoustic impedance matching layer and an acoustic metasurface; Wherein, the acoustic metasurface is located between the acoustic impedance matching layer and the piezoelectric layer, or the acoustic metasurface is located on the side of the acoustic imped
  • the ultrasonic transducer unit provided by the present invention can solve the problem of impedance mismatch between the ultrasonic transducer unit and the target object through the acoustic impedance matching layer, improve the output bandwidth and amplitude response of the ultrasonic transducer unit, and increase the Its imaging resolution and sensitivity.
  • the ultrasonic transducer unit can correct the sound field distortion generated during the adjustment of beam control, deflection, and beam focusing through the acoustic metasurface.
  • the imaging resolution and signal-to-noise ratio of the ultrasonic transducer unit can be further improved.
  • an array ultrasonic transducer is obtained by arranging a plurality of ultrasonic transducer units in an array, thereby improving the applicable range and performance of the array ultrasonic transducer.
  • the present invention uses the forward growth process to grow the acoustic impedance matching layer, thereby improving the thickness accuracy of the acoustic impedance matching layer and further improving the performance of the array ultrasonic transducer.
  • FIG. 1 is a schematic structural diagram of an array ultrasonic transducer provided by an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of an ultrasonic transducer unit according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of another ultrasonic transducer unit provided by an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of another ultrasonic transducer unit provided by an embodiment of the present invention.
  • 5a is a schematic structural diagram of an acoustic metasurface provided by an embodiment of the present invention.
  • Figure 5b is a sectional view in the direction of AA' in Figure 5a;
  • FIG. 6 is a schematic structural diagram of another acoustic metasurface provided by an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of yet another acoustic metasurface provided by an embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of yet another acoustic metasurface provided by an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of another acoustic metasurface provided by an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of yet another acoustic metasurface provided by an embodiment of the present invention.
  • FIG. 11 is a schematic structural diagram of still another acoustic metasurface provided by an embodiment of the present invention.
  • Ultrasound transducers are key components in ultrasound equipment and can be used for ultrasound imaging, ultrasound stimulation, ultrasound therapy, acoustic manipulation, and more. The performance of existing ultrasonic transducer devices has yet to be improved.
  • the embodiments of the present invention provide an array ultrasonic transducer and a manufacturing method thereof, which effectively solve the technical problems existing in the prior art, and the array ultrasonic transducer provided by the embodiments of the present invention has high performance.
  • FIG. 1 is a schematic structural diagram of an array ultrasonic transducer provided by an embodiment of the present invention
  • FIG. 2 is a structural schematic diagram of an ultrasonic transducer unit provided by an embodiment of the present invention
  • 3 is a schematic structural diagram of another ultrasonic transducer unit provided in an embodiment of the present invention.
  • the array type ultrasonic transducer includes a plurality of ultrasonic transducer units 100 arranged in an array, and the ultrasonic transducer units include:
  • the backing layer 110 has a bare circuit layer on one surface of the backing layer 110 .
  • the backing layer 110 has a piezoelectric layer 120 on one side of the circuit layer, the piezoelectric layer 120 includes a piezoelectric layer body, and a surface of the piezoelectric layer body on the side facing the backing layer 110 and an electrode facing away from the surface of the backing layer 110 .
  • the structured surface 132 is located between the acoustic impedance matching layer 131 and the piezoelectric layer 120 (as shown in FIG. 2 ).
  • the acoustic metasurface 132 is located on the side of the acoustic impedance matching layer 131 away from the backing layer 110 (as shown in FIG. 3 ).
  • the plurality of ultrasonic transducer units provided by the present invention may be arranged in a matrix, which is not specifically limited by the present invention.
  • the ultrasonic transducer unit provided by the embodiment of the present invention can solve the problem of impedance mismatch between the ultrasonic transducer unit and the target object through the acoustic impedance matching layer, improve the output bandwidth and amplitude response of the ultrasonic transducer unit, and increase the performance of the ultrasonic transducer unit.
  • the ultrasonic transducer unit can correct the sound field distortion generated during the adjustment of beam control, deflection, and beam focusing through the acoustic metasurface.
  • the imaging resolution and signal-to-noise ratio of the ultrasonic transducer unit can be further improved.
  • an array ultrasonic transducer is obtained by arranging a plurality of ultrasonic transducer units in an array, thereby improving the applicable range and performance of the array ultrasonic transducer.
  • the embodiment of the present invention uses the forward growth process to grow the acoustic impedance matching layer, thereby improving the thickness accuracy of the acoustic impedance matching layer and further improving the performance of the array ultrasonic transducer.
  • the ultrasonic transducer unit provided by the embodiment of the present invention can also achieve sub-wavelength focusing and super-imaging effects that break through the diffraction limit through an acoustic artificial structure.
  • the acoustic impedance matching layer provided by the embodiment of the present invention is used to match the impedance between the ultrasonic transducer unit and the target object, wherein the acoustic impedance matching unit may be a single-layer structure, or the acoustic impedance matching unit may also for multiple stacked structures. As shown in FIG.
  • the acoustic impedance matching layer 131 provided by the embodiment of the present invention includes the backing layer 110 to the From the first acoustic impedance matching sub-layer 1311 to the N-th acoustic impedance matching sub-layer 131n that are sequentially stacked in the direction of the piezoelectric layer 120 , N is an integer greater than or equal to 1.
  • the acoustic metasurface provided by the embodiment of the present invention is used to change the transmission characteristics of sound waves, such as reflection and focusing at any point, perfect low-frequency sound absorption, self-bending sound beams, spiral sound waves, and asymmetric transmission of sound energy etc.
  • the embodiments of the present invention do not specifically limit the structure of the acoustic metasurface, which may be a multi-circle nested structure, a multi-layer structure, a gradient structure, or the like.
  • Fig. 5a is a schematic structural diagram of an acoustic metasurface provided by an embodiment of the present invention
  • Fig. 5a is a schematic structural diagram of an acoustic metasurface provided by an embodiment of the present invention
  • the acoustic metasurface 132 includes a circular central portion 1320 and a first annular portion 1321 to an M-th annular portion 132m, where M is an integer greater than or equal to 1.
  • the first annular portion 1321 surrounds the circular central portion 1320
  • the i+1-th annular portion surrounds the i-th annular portion
  • Both the i+1 th annular portion and the i th annular portion are in the shape of an annular groove, and i is an integer greater than or equal to 1 and less than M.
  • the depth of the groove structure between the first annular portion and the circular center portion provided by the embodiment of the present invention and the depth of the groove structure between the i+1 th annular portion and the i th annular portion are different. To make specific restrictions, it can penetrate the acoustic metasurface, which needs to be specifically designed according to the actual application.
  • the acoustic metasurface includes a plurality of strip-shaped parts 132a arranged side by side, and in the direction from the backing layer to the piezoelectric layer, the height h1 of at least one strip-shaped part 132a is the same as that of the other strip-shaped parts 132a.
  • the heights of the bar-shaped portions 132a are different (for example, they may be set in a gradient, wherein the height of each bar-shaped portion needs to be adjusted according to actual applications), and/or, as shown in FIG.
  • the plurality of bar-shaped portions are arranged in the In the direction, the width h2 of at least one strip portion 132a is different from the widths of the other strip portions (wherein the width of each strip portion needs to be adjusted according to the actual application), and/or, as shown in FIG.
  • the side of the shaped portion 132a facing away from the backing layer is wedge-shaped (wherein the wedge-shaped angle of each strip portion needs to be specifically adjusted according to practical applications).
  • the strip portion 132a is a hollow strip portion, and/or the material of at least one strip portion is different from the material of the other strip portions.
  • the side of the acoustic metasurface 132 away from the backing layer is a wavy surface, which is not specifically limited in the present invention, and a specific shape of the acoustic metasurface is designed as required.
  • the ultrasonic transducer unit transmitted in the embodiment of the present invention includes a backing layer, a piezoelectric layer, an acoustic impedance matching layer, an acoustic metasurface, etc.
  • a physical model equivalent to its structure is established.
  • the main structure of the ultrasonic transducer unit includes a piezoelectric layer, an acoustic impedance matching layer, an acoustic metasurface and a backing layer. This will be based on the microwave transmission line theory and through the Mason electromechanical equivalent circuit to model and analyze the ultrasonic transducer.
  • the mechanical vibration of each layer will be equivalent to a part of the circuit.
  • the acoustic impedance matching network theory is applied to the parameter design of the acoustic impedance matching layer, and the transmission matrix is used to calculate the acoustic wave transmission efficiency under the action of the acoustic impedance matching layer.
  • the static capacitance C0, electromechanical conversion coefficient N, longitudinal wave velocity Cp, wave number k, and acoustic impedance Zp of the piezoelectric layer material provided by the embodiment of the present invention are respectively:
  • ⁇ , A, t p , h33 respectively represent the density, area, thickness, elastic stiffness constant, piezoelectric constant and dielectric constant of the piezoelectric layer material, and then the optimal parameters are obtained by optimizing the piezoelectric layer material.
  • the embodiment of the present invention takes the acoustic impedance matching layer including the first acoustic impedance matching sub-layer to the third acoustic impedance matching sub-layer as an example, wherein Z a is the acoustic impedance of the first acoustic impedance matching sub-layer, and Z b is the second acoustic impedance matching sub-layer.
  • the acoustic impedance of the acoustic impedance matching sub-layer Z c is the acoustic impedance of the third acoustic impedance matching sub-layer, Z l is the acoustic impedance of the propagation medium between the acoustic impedance matching layer and the target object, and ta is the first acoustic impedance matching sub-layer.
  • t b is the thickness of the second acoustic impedance matching sublayer
  • t c is the thickness of the third acoustic impedance matching sublayer
  • ka is the wavenumber of the first acoustic impedance matching sublayer
  • k b is the second acoustic impedance
  • the wave number of the matching sub-layer, k c is the wave number of the third acoustic impedance matching sub-layer
  • the equivalent input impedance of each layer matching is derived through the equivalent circuit (Zin1 is the equivalent input impedance of the first acoustic impedance matching sub-layer, Zin2 is the equivalent input impedance of the second acoustic impedance matching sublayer, and Zin3 is the equivalent input impedance of the third acoustic impedance matching sublayer) respectively:
  • the material of the acoustic impedance matching layer provided by the implementation of the present invention is a polymer material (wherein the acoustic impedance matching layer of the polymer material can be prepared by the forward growth technology of thermal evaporation coating) or a metal material (wherein The acoustic impedance matching layer of metal material can be prepared by the forward growth technology of magnetron sputtering).
  • the material of the acoustic impedance matching layer provided in the embodiment of the present invention may be parylene or gold, which may also be other materials in other embodiments of the present invention, which is not specifically limited in the present invention.
  • the acoustic metasurface provided by the embodiment of the present invention may include a circular central portion, a first annular portion, and a second annular portion, wherein the principles of Kirchhoff diffraction theory and Fresnel zone plate theory are used as the principles , to establish the theoretical model of the plane Fresnel acoustic lens of the acoustic metasurface of the circular structure. It can be seen from the half-wave band method that the acoustic artificial focusing structure parameters can make the sound field of the ultrasonic transducer unit produce a focusing effect when the following formulas are satisfied:
  • F represents the designed focal length
  • ⁇ represents the wavelength of the sound wave in the transmission medium
  • the thickness h of the acoustic metasurface can be designed by the following formula:
  • the material of the acoustic metasurface provided in the embodiment of the present invention may be a polymer material, such as parylene, wherein, considering that the transmission efficiency of sound waves is also affected by the acoustic impedance of the material, Based on the theoretical calculation and finite element simulation verification of acoustic artificial structures, for example, parylene with acoustic impedance parameters closer to water is selected as the material for preparing acoustic metasurfaces.
  • high-precision photolithography micromachining technology or 3D microfabrication technology can be used. It is produced by printing technology, which ensures high production precision; this is not specifically limited in the present invention, and other materials may also be used in other embodiments of the present invention.
  • the piezoelectric layer body provided in the embodiment of the present invention is made of piezoelectric ceramic, piezoelectric ceramic composite material, pressure point single crystal material or piezoelectric single crystal composite material.
  • the backing layer of the ultrasonic transducer unit is prepared by using a material with high sound absorption performance to further reduce the size of the ultrasonic transducer unit.
  • the material of the backing layer provided in the embodiment of the present invention includes epoxy resin, And the material of the backing layer also includes at least one of tungsten powder and aluminum oxide powder. Specifically, epoxy resin, tungsten powder, and aluminum oxide powder can be formed into a mixed material.
  • an embodiment of the present invention also provides a method for manufacturing an array ultrasonic transducer, wherein the array ultrasonic transducer includes a plurality of ultrasonic transducer units arranged in an array.
  • a piezoelectric layer is formed on the side of the backing layer with the circuit layer, the piezoelectric layer includes a piezoelectric layer body, and a surface of the piezoelectric layer body on the side facing the backing layer and away from the backing layer is formed. an electrode on one side surface of the backing layer;
  • the acoustic artificial structure includes: an acoustic impedance matching layer and an acoustic metasurface grown by a forward growth process; wherein, the acoustic ultrasound The textured surface is located between the acoustic impedance matching layer and the piezoelectric layer, or the acoustic metasurface is located on the side of the acoustic impedance matching layer away from the backing layer.
  • the acoustic impedance matching layer grown by the forward growth process provided by the present invention includes:
  • the acoustic impedance matching layer is grown by a thermal evaporation coating process or a magnetron sputtering process, and a preparation process needs to be specifically selected according to the specific material of the acoustic impedance matching degree, which is not specifically limited in the present invention.
  • Embodiments of the present invention provide an array ultrasonic transducer and a manufacturing method thereof, including a plurality of ultrasonic transducer units arranged in an array, the ultrasonic transducer units comprising: a backing layer, one side of the backing layer A circuit layer is exposed on the surface; a piezoelectric layer located on the side of the backing layer with the circuit layer, the piezoelectric layer includes a piezoelectric layer body, and a piezoelectric layer located on the side of the piezoelectric layer body facing the backing layer an electrode on the surface and a surface away from the backing layer; and an acoustic artificial structure located on the side of the piezoelectric layer away from the backing layer, the acoustic artificial structure comprising: an acoustic impedance matching layer and an acoustic superstructure surface; wherein, the acoustic metasurface is located between the acoustic impedance matching layer and the piezoelectric layer, or the acoustic metasurface is located on the
  • the ultrasonic transducer unit provided by the embodiment of the present invention can solve the problem of impedance mismatch between the ultrasonic transducer unit and the target object through the acoustic impedance matching layer, and improve the output bandwidth and amplitude response of the ultrasonic transducer unit. Increase its imaging resolution and sensitivity.
  • the ultrasonic transducer unit can correct the sound field distortion generated during the adjustment of beam control, deflection, and beam focusing through the acoustic metasurface. At the same time, the imaging resolution and signal-to-noise ratio of the ultrasonic transducer unit can be further improved.
  • an array ultrasonic transducer is obtained by arranging a plurality of ultrasonic transducer units in an array, thereby improving the applicable range and performance of the array ultrasonic transducer.
  • the embodiment of the present invention uses the forward growth process to grow the acoustic impedance matching layer, thereby improving the thickness accuracy of the acoustic impedance matching layer and further improving the performance of the array ultrasonic transducer.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

Transducteur à ultrasons de type réseau et procédé de fabrication associé. Ledit transducteur comprend une pluralité d'unités de transduction ultrasonore (100) dans un agencement de réseau, et chaque unité de transduction ultrasonore (100) comprend : une couche de support (110), une couche de circuit étant exposée sur une surface d'un côté de la couche de support (110) ; une couche piézoélectrique (120) située sur le côté de la couche de support (110) comprenant la couche de circuit, la couche piézoélectrique (120) comprenant un corps de couche piézoélectrique et des électrodes situées sur une surface d'un côté du corps de couche piézoélectrique orienté vers la couche de support (110) et une surface d'un côté à l'opposé de la couche de support (110) ; une structure artificielle acoustique (130) située sur un côté de la couche piézoélectrique (120) à l'opposé de la couche de support (110), la structure artificielle acoustique (130) comprenant : une couche d'adaptation d'impédance acoustique (131) et une métasurface acoustique (132) ; la métasurface acoustique (132) étant située entre la couche d'adaptation d'impédance acoustique (131) et la couche piézoélectrique (120), ou la métasurface acoustique (132) étant située sur un côté de la couche d'adaptation d'impédance acoustique (131) à l'opposé de la couche de support (110). Les unités de transduction ultrasonore (100) peuvent résoudre le problème d'une désadaptation d'impédance entre une unité de transduction ultrasonore (100) et un objet cible au moyen des couches d'adaptation d'impédance acoustique (131), la largeur de bande de sortie et la réponse d'amplitude d'une unité de transduction ultrasonore (100) sont améliorées, et la résolution d'imagerie et la sensibilité de celle-ci sont augmentées.
PCT/CN2020/130397 2020-11-20 2020-11-20 Transducteur à ultrasons de type réseau et procédé de fabrication associé WO2022104683A1 (fr)

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Citations (6)

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Publication number Priority date Publication date Assignee Title
US20040100163A1 (en) * 2002-11-22 2004-05-27 Baumgartner Charles E. Method for making electrical connection to ultrasonic transducer through acoustic backing material
US20110198968A1 (en) * 2008-10-17 2011-08-18 Konica Minolta Medical & Graphic, Inc. Array-type ultrasonic vibrator
CN106267592A (zh) * 2016-08-18 2017-01-04 浙江大学创新技术研究院有限公司 一种具有超构表面的凹面聚焦换能器设计方法
CN108493330A (zh) * 2018-05-07 2018-09-04 中国科学院声学研究所 声学超构材料、声波振动能量收集器和电子设备
CN109192749A (zh) * 2018-07-12 2019-01-11 中国科学院微电子研究所 超声波换能器阵列及其制作和封装方法
CN111803125A (zh) * 2020-07-31 2020-10-23 中国科学院苏州生物医学工程技术研究所 微型阵列超声换能器及其制备方法、包含其的超声探头

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040100163A1 (en) * 2002-11-22 2004-05-27 Baumgartner Charles E. Method for making electrical connection to ultrasonic transducer through acoustic backing material
US20110198968A1 (en) * 2008-10-17 2011-08-18 Konica Minolta Medical & Graphic, Inc. Array-type ultrasonic vibrator
CN106267592A (zh) * 2016-08-18 2017-01-04 浙江大学创新技术研究院有限公司 一种具有超构表面的凹面聚焦换能器设计方法
CN108493330A (zh) * 2018-05-07 2018-09-04 中国科学院声学研究所 声学超构材料、声波振动能量收集器和电子设备
CN109192749A (zh) * 2018-07-12 2019-01-11 中国科学院微电子研究所 超声波换能器阵列及其制作和封装方法
CN111803125A (zh) * 2020-07-31 2020-10-23 中国科学院苏州生物医学工程技术研究所 微型阵列超声换能器及其制备方法、包含其的超声探头

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